WO2020259092A1 - 摄像模组及终端设备 - Google Patents

摄像模组及终端设备 Download PDF

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Publication number
WO2020259092A1
WO2020259092A1 PCT/CN2020/089081 CN2020089081W WO2020259092A1 WO 2020259092 A1 WO2020259092 A1 WO 2020259092A1 CN 2020089081 W CN2020089081 W CN 2020089081W WO 2020259092 A1 WO2020259092 A1 WO 2020259092A1
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WIPO (PCT)
Prior art keywords
camera module
housing
circuit board
photosensitive
lens assembly
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PCT/CN2020/089081
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English (en)
French (fr)
Inventor
周耀敏
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维沃移动通信有限公司
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Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2020259092A1 publication Critical patent/WO2020259092A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the present disclosure relates to the technical field of communication equipment, and in particular to a camera module and terminal equipment.
  • terminal equipment has more and more functions, among which the more prominent performance is: the current terminal equipment has more and more powerful shooting functions.
  • More and more terminal devices are equipped with at least two cameras. The increase in the number of cameras will result in more and more cramped space in the housing of the terminal device. How to reduce the space occupied by the camera in the housing is the main design direction of current terminal equipment.
  • the lens of each camera is mounted on the corresponding lens mount, and then the lens mount is fixed on the base, and the base is mounted on the circuit board.
  • the lens includes a lens barrel and a lens assembly fixed in the lens barrel. So as to realize the cooperation of each lens with the corresponding photosensitive chip on the circuit board. To facilitate assembly, there is a gap between two adjacent lens mounts and two adjacent lenses. The above structure will lead to a larger space occupied by all cameras.
  • the present disclosure discloses a camera module and terminal equipment to solve the problem that the camera in the related art occupies a relatively large space in the housing of the terminal equipment.
  • a camera module includes a housing, at least two photosensitive chips, a lens assembly and a circuit board.
  • the housing is an integrated structure, the at least two photosensitive chips are mounted on the circuit board, and the housing is fixed on the circuit On the board, the housing is covered on the at least two photosensitive chips, the housing is provided with shooting windows corresponding to the photosensitive chips one-to-one, the lens assembly is installed in the housing, and the The lens assembly is fixedly connected to the housing, the lens assembly covers all the photosensitive chips, and the lens assembly includes light distribution areas corresponding to the photosensitive chips one to one, and the light distribution areas are located correspondingly Between the photosensitive chip and the shooting window.
  • a terminal device includes the aforementioned camera module.
  • the camera module disclosed in the present disclosure improves the structure of the camera module in the related art.
  • the lens assembly is fixed in the housing, and the housing is directly mounted on the circuit board, so as to realize the control of each photosensitive chip mounted on the circuit board. Covering, the lens assembly covers all the photosensitive chips, and distributes light to the photosensitive chip through the corresponding light distribution area, and finally enables the camera module to replace at least two cameras configured on the terminal device in the related technology.
  • each photosensitive chip shares the lens assembly and the housing, and at the same time, the lens barrel, the lens mount, and the base in the related technology are formed into an integrated housing, which can avoid the need to leave between two adjacent lenses in the related technology. There is a problem of installation gap, which can reduce the space occupied by the camera module.
  • FIG. 1 is a cross-sectional view of a camera module disclosed in an embodiment of the disclosure.
  • an embodiment of the present disclosure discloses a camera module.
  • the disclosed camera module includes a housing 100, at least two photosensitive chips 200, a lens assembly 300 and a circuit board 400.
  • the housing 100 is an integral structure, and the housing 100 is fixed on the circuit board 400. Generally, the housing 100 can be fixed on the circuit board 400 by means of adhesive fixation or clip fixation.
  • the photosensitive chip 200 is a photosensitive component of the camera module, and the photosensitive chip 200 can sense light to realize framing and shooting.
  • the at least two photosensitive chips 200 are mounted on the circuit board 400.
  • the photosensitive chip 200 can be soldered or adhered to the circuit board 400.
  • the photosensitive chip 200 is attached to the circuit board 400 and fixedly connected to the circuit board 400.
  • the housing 100 is covered on the at least two photosensitive chips 200, and the housing 100 is provided with a shooting window 110 corresponding to the photosensitive chip 200 one-to-one.
  • the ambient light can be injected into the inside of the housing 100 through the shooting window 110, and then can be exposed to light.
  • the chip 200 senses. Specifically, each photosensitive chip 200 can sense light through the corresponding shooting window 110.
  • Other parts of the housing 100 are opaque, so as to prevent stray light from entering the housing 100 and causing interference.
  • the lens assembly 300 is installed in the housing 100, and the housing 100 is fixedly connected to the lens assembly 300.
  • the lens assembly 300 may include at least two lenses that are stacked and distributed. Specifically, each lens can be fixedly connected to the inner wall of the housing 100 by bonding or clamping.
  • the lens assembly 300 covers the at least two photosensitive chips 200.
  • the lens assembly 300 includes a light distribution area corresponding to the photosensitive chip 200 one-to-one, and the light distribution area is located on the corresponding photosensitive chip 200 and Between the photographing windows 110, the light projected on the photosensitive chip 200 is distributed.
  • each photosensitive chip 200 can sense the light passing through the corresponding shooting window 110 and the light distribution area for framing and shooting.
  • the camera module disclosed in the embodiments of the present disclosure improves the structure of the camera module in the related art.
  • the lens assembly 300 is fixed in the housing 100, and the housing 100 is directly mounted on the circuit board 400, so as to realize the installation on the circuit board.
  • the cover of each photosensitive chip 200 on 400, the lens assembly 300 covers all the photosensitive chips 200, and the photosensitive chip 200 is distributed through the corresponding light distribution area, so that the camera module can replace the terminal in the related technology.
  • each photosensitive chip 200 shares the lens assembly 300 and the housing 100, and at the same time, the lens barrel, the lens mount, and the base in the related art are formed into an integrated housing 100, which can avoid two adjacent lenses in the related art. There needs to be an installation gap between them, which can reduce the space occupied by the camera module.
  • the camera module disclosed in the embodiment of the present disclosure may further include a filter 600.
  • the filter 600 is supported on the circuit board 400 through a supporting block 500, and the filter 600 is located on the photosensitive Between the chip 200 and the lens assembly 300, the photosensitive chip 200 is located between the circuit board 400 and the filter 600.
  • the support block 500 is fixed on the circuit board 400 by bonding.
  • the filter 600 may be fixedly connected to the supporting block 500.
  • the inner wall of the housing 100 may be provided with a positioning portion 120, and the filter 600 may be positioned between the support block 500 and the positioning portion 120.
  • the positioning portion 120 It can be positioned and matched with the side of the filter 600 away from the support block 500, so as to realize the cooperation with the support block 500 to position the filter 600.
  • the above structure can improve the stability of the installation of the filter 600, and at the same time facilitate the maintenance of the position of the filter 600 during the assembly process.
  • the positioning portion 120 may have various structures. Please refer to FIG. 1 again.
  • the positioning portion 120 may be a ring-shaped positioning plate, and the ring-shaped positioning plate can be positioned and matched with the edge of the filter 600 to achieve a full
  • the azimuth positioning can in turn make the force of the filter 600 more balanced.
  • the number of filters 600 may be equal to the number of photosensitive chips 200, and each photosensitive chip 200 is arranged opposite to the corresponding filter 600.
  • the number of the optical filter 600 may be one, and the optical filter 600 may cover each photosensitive chip 200 to distribute light for each photosensitive chip 200 at the same time.
  • the filter 600 is a filter structure with a larger area, which can reduce the installation workload.
  • a supporting block 500 may be provided between two adjacent photosensitive chips 200.
  • the supporting block 500 can also play a role of isolation, thereby facilitating the photosensitive chip. 200 installation to avoid mutual interference.
  • the housing 100 may be an integral structure, and generally, the housing 100 may be an integral injection molded part.
  • the camera module disclosed in the embodiments of the present disclosure includes at least two photosensitive chips 200.
  • the number of photosensitive chips 200 may be only two or more than two.
  • the embodiments of the present disclosure do not limit the specific number of photosensitive chips 200. .
  • the circuit board 400 is a basic component of the camera module.
  • the circuit board 400 can provide an installation basis for other components of the camera module.
  • the circuit board 400 can also supply power to the photosensitive chip 200.
  • the circuit board 400 may be a rigid circuit board or a flexible circuit board.
  • the camera module disclosed in the embodiment of the present disclosure may further include a reinforcing plate, and the reinforcing plate may be disposed on the surface of the circuit board 400 away from the photosensitive chip 200.
  • the reinforcing plate may be fixed on the circuit board 400 by pasting.
  • the reinforcing plate plays a role in reinforcing the strength of the flexible circuit board.
  • the reinforcing plate can be a metal reinforcing plate, and the metal reinforcing plate can play a good heat dissipation effect.
  • the reinforcing plate may be a stainless steel reinforcing plate.
  • the embodiment of the present disclosure discloses a terminal device, and the disclosed terminal device includes the camera module described in the above embodiment.
  • the terminal devices disclosed in the embodiments of the present disclosure may be terminal devices such as mobile phones, tablet computers, e-book readers, game consoles, wearable devices (such as smart watches), etc.
  • the embodiments of the present disclosure do not limit the specific types of terminal devices.

Abstract

本公开提供一种摄像模组，所公开的摄像模组包括外壳、至少两个感光芯片、镜片组件和电路板，外壳为一体式结构，至少两个感光芯片安装在电路板上，外壳固定在电路板上，外壳罩设在至少两个感光芯片上，外壳开设有与感光芯片一一对应的拍摄视窗，镜片组件安装在外壳之内，且镜片组件与外壳固定相连，镜片组件覆盖在所有的感光芯片上，且镜片组件包括与感光芯片一一对应的配光区域，配光区域位于相对应的感光芯片与拍摄视窗之间。本公开还提供一种终端设备。

Description

摄像模组及终端设备
相关申请的交叉引用
本申请主张在2019年6月26日在中国提交的中国专利申请号No.201910561496.2的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及通讯设备技术领域，尤其涉及一种摄像模组及终端设备。
背景技术
随着用户需求的提升，终端设备的功能越来越多，其中较为突出的表现为：当前的终端设备的拍摄功能越来越强大。越来越多的终端设备配置有至少两个摄像头。摄像头数量的增多，会导致终端设备的壳体内的空间越来越局促。如何减小摄像头在壳体内的占用空间，是当前终端设备的主要设计方向。
相关技术中的终端设备内，各摄像头的镜头安装在各自对应的镜头座上，然后镜头座固定在底座上，底座安装在电路板上，镜头包括镜头筒和固定在镜头筒内的镜片组件，从而实现各镜头与电路板上相应的感光芯片的配合。为了方便装配，相邻的两个镜头座以及相邻的两个镜头之间均留有间隙。上述结构会导致所有的摄像头的整体占用空间较大。
发明内容
本公开公开一种摄像模组及终端设备，以解决相关技术中的摄像头在终端设备的壳体内占据较大的空间的问题。
为了解决上述问题，本公开采用下述技术方案：
一种摄像模组，包括外壳、至少两个感光芯片、镜片组件和电路板，所述外壳为一体式结构，所述至少两个感光芯片安装在所述电路板上，所述外壳固定在电路板上，所述外壳罩设在所述至少两个感光芯片上，所述外壳开设有与所述感光芯片一一对应的拍摄视窗，所述镜片组件安装在所述外壳之内， 且所述镜片组件与所述外壳固定相连，所述镜片组件覆盖在所有的所述感光芯片上，且所述镜片组件包括与所述感光芯片一一对应的配光区域，所述配光区域位于相对应的所述感光芯片与所述拍摄视窗之间。
一种终端设备，包括上文所述的摄像模组。
本公开采用的技术方案能够达到以下有益效果：
本公开公开的摄像模组对相关技术中的摄像模组的结构进行了改进，将镜片组件固定在外壳内，外壳直接安装在电路板上，从而实现对安装在电路板上的各个感光芯片的罩设，镜片组件覆盖在所有的感光芯片上，并通过相应的配光区域对感光芯片进行配光，最终使得摄像模组能够代替相关技术中的终端设备上配置的至少两个摄像头。上述结构中，各感光芯片共用镜片组件和外壳，同时将相关技术中的镜头筒、镜头座和底座形成为一体式结构的外壳，这能够避免相关技术中相邻的两个镜头之间需要留有安装间隙的问题，进而能够减小摄像模组的占用空间。
附图说明
此处所说明的附图用来提供对本公开的进一步理解，构成本公开的一部分，本公开的示意性实施例及其说明用于解释本公开，并不构成对本公开的不当限定。在附图中：
图1为本公开实施例公开的摄像模组的剖视图。
附图标记说明：
100-外壳、110-拍摄视窗、120-定位部、200-感光芯片、300-镜片组件、400-电路板、500-支撑块、600-滤光片。
具体实施方式
为使本公开的目的、技术方案和优点更加清楚，下面将结合本公开具体实施例及相应的附图对本公开技术方案进行清楚、完整地描述。显然，所描述的实施例仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
以下结合附图，详细说明本公开各个实施例公开的技术方案。
请参考图1，本公开实施例公开一种摄像模组，所公开的摄像模组包括外壳100、至少两个感光芯片200、镜片组件300和电路板400。
外壳100为一体式结构件，外壳100固定在电路板400上。通常情况下，外壳100可以通过粘接固定或卡接固定的方式固定在电路板400上。
感光芯片200为摄像模组的感光部件，感光芯片200能够感应光线进而实现取景拍摄。所述的至少两个感光芯片200安装在电路板400上。通常情况下，感光芯片200可以焊接或粘接在电路板400上。为了实现更稳定地安装，感光芯片200贴附在电路板400上，并与电路板400固定连接。
外壳100罩设在所述的至少两个感光芯片200上，外壳100开设有与感光芯片200一一对应的拍摄视窗110，环境光线可以通过拍摄视窗110射入外壳100的内部，进而能够被感光芯片200感应。具体的，各感光芯片200可以通过相对应的拍摄视窗110进行光线的感应。外壳100的其它部位不透光，从而能够避免杂散光射入外壳100内而造成干扰。
镜片组件300安装在外壳100之内，外壳100与镜片组件300固定相连。通常情况下，镜片组件300可以包括至少两个叠置分布的镜片。具体的，各镜片可以通过粘接或卡接的方式与外壳100的内壁固定相连。
在本公开实施例中，镜片组件300覆盖在所述的至少两个感光芯片200上，镜片组件300包括与感光芯片200一一对应的配光区域，配光区域位于相对应的感光芯片200与拍摄视窗110之间，从而对投射到感光芯片200上的光线进行配光。在具体的工作过程中，各感光芯片200能够感应通过相对应的拍摄视窗110和配光区域的光线后进行取景拍摄。
本公开实施例公开的摄像模组对相关技术中的摄像模组的结构进行了改进，将镜片组件300固定在外壳100内，外壳100直接安装在电路板400上，从而实现对安装在电路板400上的各个感光芯片200的罩设，镜片组件300覆盖在所有的感光芯片200上，并通过相应的配光区域对感光芯片200进行配光，最终使得摄像模组能够代替相关技术中的终端设备上配置的至少两个摄像头。上述结构中，各感光芯片200共用镜片组件300和外壳100，同时将相关技术中的镜头筒、镜头座和底座形成为一体式结构的外壳100，这能够避 免相关技术中相邻的两个镜头之间需要留有安装间隙的问题，进而能够减小摄像模组的占用空间。
为了提高感光效果，在可选的方案中，本公开实施例公开的摄像模组还可以包括滤光片600，滤光片600通过支撑块500支撑于电路板400上，滤光片600位于感光芯片200与镜片组件300之间，感光芯片200位于电路板400与滤光片600之间。通常情况下，支撑块500通过粘接的方式固定在电路板400上。滤光片600可以与支撑块500固定连接。
在可选的方案中，外壳100的内壁可以设置有定位部120，滤光片600可以定位于支撑块500与定位部120之间，在外壳100固定在电路板400的过程中，定位部120可以与滤光片600背离支撑块500的一侧定位配合，从而实现与支撑块500配合以定位滤光片600。上述结构能够提高对滤光片600安装的稳定性，同时有利于组装过程中滤光片600位置的保持。
在本公开实施例中，定位部120的结构可以有多种，请再次参考图1，定位部120可以为环状定位片，环状定位片与滤光片600的边缘定位配合，从而实现全方位的定位，进而能够使得滤光片600的受力较为均衡。
具体的，滤光片600的数量可以与感光芯片200的数量相等，各感光芯片200与相对应的滤光片600相对设置。在可选的方案中，滤光片600的数量可以为一个，滤光片600可以覆盖在各感光芯片200上，进而同时为各感光芯片200进行配光。此种情况下，滤光片600为面积较大的一块滤光结构件，能够减少安装工作量。
为了提高支撑效果，在可选的方案中，相邻的两个感光芯片200之间均可以设置有支撑块500，此种情况下，支撑块500还能起到隔离的作用，进而方便感光芯片200的安装，避免相互干扰。
如上文所述，外壳100可以为一体式结构，通常情况下，外壳100可以为一体式注塑件。
本公开实施例公开的摄像模组包括至少两个感光芯片200，具体的，感光芯片200的数量可以仅为两个，也可以多于两个，本公开实施例不限制感光芯片200的具体数量。
在本公开实施例中，电路板400为摄像模组的基础构件，电路板400能 够为摄像模组的其它组成构件提供安装基础，与此同时，电路板400还能够为感光芯片200供电。电路板400可以为硬质电路板，也可以为柔性电路板。
在电路板400为柔性电路板的前提下，本公开实施例公开的摄像模组还可以包括补强板，补强板可以设置在电路板400背离感光芯片200的表面上。具体的，补强板可以通过粘贴的方式固定在电路板400上。补强板起到补强柔性电路板强度的作用。在可选的方案中，补强板可选为金属补强板，金属材质的补强板能发挥良好的散热作用。具体的，补强板可以为不锈钢补强板。
基于本公开实施例公开的摄像模组，本公开实施例公开一种终端设备，所公开的终端设备包括上文实施例所述的摄像模组。
本公开实施例公开的终端设备可以是手机、平板电脑、电子书阅读器、游戏机、可穿戴设备(例如智能手表)等终端设备，本公开实施例不限制终端设备的具体种类。
本公开上文实施例中重点描述的是各个实施例之间的不同，各个实施例之间不同的优化特征只要不矛盾，均可以组合形成更优的实施例，考虑到行文简洁，在此则不再赘述。
以上所述仅为本公开的实施例而已，并不用于限制本公开。对于本领域技术人员来说，本公开可以有各种更改和变化。凡在本公开的精神和原理之内所作的任何修改、等同替换、改进等，均应包含在本公开的权利要求范围之内。

Claims (10)

  1. 一种摄像模组，包括外壳、至少两个感光芯片、镜片组件和电路板，所述外壳为一体式结构，所述至少两个感光芯片安装在所述电路板上，所述外壳固定在电路板上，所述外壳罩设在所述至少两个感光芯片上，所述外壳开设有与所述感光芯片一一对应的拍摄视窗，所述镜片组件安装在所述外壳之内，且所述镜片组件与所述外壳固定相连，所述镜片组件覆盖在所有的所述感光芯片上，且所述镜片组件包括与所述感光芯片一一对应的配光区域，所述配光区域位于相对应的所述感光芯片与所述拍摄视窗之间。
  2. 根据权利要求1所述的摄像模组，还包括滤光片，所述滤光片通过支撑块支撑于所述电路板上，所述滤光片位于所述感光芯片与所述镜片组件之间，所述支撑块固定在所述电路板上。
  3. 根据权利要求2所述的摄像模组，其中，所述外壳的内壁设置有定位部，所述滤光片定位于所述支撑块与所述定位部之间。
  4. 根据权利要求3所述的摄像模组，其中，所述定位部为环状定位片，所述环状定位片与所述滤光片的边缘定位配合。
  5. 根据权利要求2所述的摄像模组，其中，所述滤光片的数量为一个，所述滤光片覆盖在所有的所述感光芯片上。
  6. 根据权利要求2所述的摄像模组，其中，相邻的两个所述感光芯片之间均设置有所述支撑块。
  7. 根据权利要求1所述的摄像模组，其中，所述外壳为一体式注塑件。
  8. 根据权利要求1所述的摄像模组，其中，所述感光芯片的数量为两个。
  9. 根据权利要求1所述的摄像模组，其中，所述电路板为柔性电路板，所述摄像模组还包括补强板，所述补强板设置在所述电路板背离所述感光芯片的表面上。
  10. 一种终端设备，包括权利要求1-9中任一项所述的摄像模组。
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