WO2021068400A1 - 一种超长多层板钻孔定位制作方法 - Google Patents
一种超长多层板钻孔定位制作方法 Download PDFInfo
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- WO2021068400A1 WO2021068400A1 PCT/CN2019/124061 CN2019124061W WO2021068400A1 WO 2021068400 A1 WO2021068400 A1 WO 2021068400A1 CN 2019124061 W CN2019124061 W CN 2019124061W WO 2021068400 A1 WO2021068400 A1 WO 2021068400A1
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- WO
- WIPO (PCT)
- Prior art keywords
- drilling
- ultra
- positioning
- long
- positioning target
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Definitions
- Multilayer circuit boards are the product of the development of electronic technology in the direction of high speed, multi-function and large capacity. With the continuous development of electronic technology, especially the extensive and in-depth application of large-scale and very large-scale integrated circuits, multilayer circuit boards are rapidly developing in the direction of high density, high precision, and high-level digitalization.
- step S1 it further includes: pasting a film on the core board and performing exposure processing to obtain an inner layer pattern, the inner layer pattern including an inner layer circuit pattern and a positioning target hole pattern; and then sequentially etching the core board And the film removal treatment, the inner layer circuit is made from the inner circuit pattern, and the positioning target hole is made from the positioning target hole pattern.
- the positioning target holes 3, 4, 5, and 6 are correspondingly arranged on the long side edge of the super long board.
- step S4 after the first drill hole is drilled on the ultra-long multilayer board using section A drill tape data, the ultra-long multilayer board is sequentially subjected to copper immersion and full plate electroplating, and the first metalized drill hole.
- a manufacturing method for drilling and positioning an ultra-long multilayer board which is characterized in that it comprises the following steps:
- step S5 is to sequentially fabricate the outer circuit and the solder resist layer on the ultra-long multilayer board, and then perform surface treatment.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (10)
- 一种超长多层板钻孔定位制作方法,其特征在于,包括以下步骤:S1.内层资料设计,在内层菲林上设计1、2、3、4、5、6、7、8一共八个定位靶孔图形;S2.层压完成后,使用X-Ray打靶时钻出相应的8个定位靶孔;S3.钻孔资料制作,整体钻带拆解为2段钻带,分别为A段钻带与B段钻带,A段钻带使用1、2、3、5号定位靶孔定位,B段钻带使用4、6、7、8号定位靶孔定位;S4.钻孔时先导入A段钻带资料完成生产,再导入B段钻带资料更换定位靶孔完成B段的生产制作。
- 根据权利要求1所述的超长多层板钻孔定位制作方法,其特征在于,步骤S1中,定位靶孔1与定位靶孔7错开4-7mm。起到防呆作用
- 根据权利要求1所述的超长多层板钻孔定位制作方法,其特征在于,所述定位靶孔3、4、5、6对应设置在超长板的长边板边。
- 根据权利要求1所述的超长多层板钻孔定位制作方法,其特征在于,所述定位靶孔1、2、7、8对应设置在超长板的短边板边。
- 根据权利要求1所述的超长多层板钻孔定位制作方法,其特征在于,所述定位靶孔3、4、5、6对称设置在超长板长边的中间区域。
- 根据权利要求1所述的超长多层板钻孔定位制作方法,其特征在于,所述定位靶孔1、2、7、8对称设置在超长板短边的两侧区域。
- 根据权利要求1所述的超长多层板钻孔定位制作方法,其特征在于,所述步骤S1前还包括:在芯板上贴膜并进行曝光处理,制得内层图形,所述内层图形包括内层线路图形、定位靶孔图形;然后对芯板依次进行蚀刻和退膜处理,由内层线路图形制得内层线路,由定位靶孔图形制得定位靶孔。
- 根据权利要求1所述的超长多层板钻孔定位制作方法,其特征在于,还包括步骤S5,依次在超长多层板上制作外层线路和阻焊层,然后进行表面处理。
- 根据权利要求1所述的超长多层板钻孔定位制作方法,其特征在于,所述步骤S4中,在超长多层板上使用A段钻带资料钻第一钻孔后,对超长多层板依次进行沉铜和全板电镀处理,第一金属化钻孔。
- 根据权利要求1所述的超长多层板钻孔定位制作方法,其特征在于,所述步骤S4中,在超长多层板上使用B段钻带资料钻第一钻孔后,对超长多层板依次进行沉铜和全板电镀处理,第二金属化钻孔。
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CN201910957520.4 | 2019-10-10 | ||
CN201910957520.4A CN110785012A (zh) | 2019-10-10 | 2019-10-10 | 一种超长多层板钻孔定位制作方法 |
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WO2021068400A1 true WO2021068400A1 (zh) | 2021-04-15 |
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WO (1) | WO2021068400A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113891563A (zh) * | 2021-10-22 | 2022-01-04 | 奥士康精密电路(惠州)有限公司 | 一种改善钻孔质量的高效处理方法 |
CN114828396A (zh) * | 2022-03-28 | 2022-07-29 | 诚亿电子(嘉兴)有限公司 | 一种超长高频铝基天线pcb板及其制备工艺 |
CN115003034A (zh) * | 2022-06-27 | 2022-09-02 | 昆山镭崴光电科技有限公司 | 一种hdi电路板的盲孔埋孔激光钻孔技术方法 |
Families Citing this family (1)
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CN112752445B (zh) * | 2020-12-15 | 2022-04-15 | 胜宏科技(惠州)股份有限公司 | 一种高纵横比线路板的钻孔方法 |
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CN105228348A (zh) * | 2015-08-19 | 2016-01-06 | 深圳市迅捷兴电路技术有限公司 | 超长电路板钻孔加工方法 |
CN108430159A (zh) * | 2018-02-27 | 2018-08-21 | 深圳崇达多层线路板有限公司 | 一种超大尺寸印制板激光钻孔方法 |
CN109548292A (zh) * | 2018-12-12 | 2019-03-29 | 东莞市若美电子科技有限公司 | 超长尺寸高多层pcb钻孔生产工艺 |
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US5710063A (en) * | 1996-06-06 | 1998-01-20 | Sun Microsystems, Inc. | Method for improving the alignment of holes with other elements on a printed circuit board |
CN103079353B (zh) * | 2012-12-27 | 2015-10-14 | 深圳市博敏电子有限公司 | 一种提高超长高频线路板孔位加工精度的方法 |
CN104333979B (zh) * | 2014-10-21 | 2017-04-26 | 深圳崇达多层线路板有限公司 | 一种在多层板上进行二次钻孔的方法 |
CN108513444A (zh) * | 2018-06-29 | 2018-09-07 | 深圳市金百泽电子科技股份有限公司 | 一种超长板图形制作方法 |
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2019
- 2019-10-10 CN CN201910957520.4A patent/CN110785012A/zh active Pending
- 2019-12-09 WO PCT/CN2019/124061 patent/WO2021068400A1/zh active Application Filing
Patent Citations (3)
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CN105228348A (zh) * | 2015-08-19 | 2016-01-06 | 深圳市迅捷兴电路技术有限公司 | 超长电路板钻孔加工方法 |
CN108430159A (zh) * | 2018-02-27 | 2018-08-21 | 深圳崇达多层线路板有限公司 | 一种超大尺寸印制板激光钻孔方法 |
CN109548292A (zh) * | 2018-12-12 | 2019-03-29 | 东莞市若美电子科技有限公司 | 超长尺寸高多层pcb钻孔生产工艺 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113891563A (zh) * | 2021-10-22 | 2022-01-04 | 奥士康精密电路(惠州)有限公司 | 一种改善钻孔质量的高效处理方法 |
CN113891563B (zh) * | 2021-10-22 | 2024-03-22 | 奥士康科技股份有限公司 | 一种改善钻孔质量的高效处理方法 |
CN114828396A (zh) * | 2022-03-28 | 2022-07-29 | 诚亿电子(嘉兴)有限公司 | 一种超长高频铝基天线pcb板及其制备工艺 |
CN115003034A (zh) * | 2022-06-27 | 2022-09-02 | 昆山镭崴光电科技有限公司 | 一种hdi电路板的盲孔埋孔激光钻孔技术方法 |
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