WO2021065436A1 - 発光装置、および受光装置 - Google Patents

発光装置、および受光装置 Download PDF

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Publication number
WO2021065436A1
WO2021065436A1 PCT/JP2020/034658 JP2020034658W WO2021065436A1 WO 2021065436 A1 WO2021065436 A1 WO 2021065436A1 JP 2020034658 W JP2020034658 W JP 2020034658W WO 2021065436 A1 WO2021065436 A1 WO 2021065436A1
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WO
WIPO (PCT)
Prior art keywords
light
light emitting
light receiving
substrate
support surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/034658
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English (en)
French (fr)
Japanese (ja)
Inventor
宙 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koito Manufacturing Co Ltd
Original Assignee
Koito Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koito Manufacturing Co Ltd filed Critical Koito Manufacturing Co Ltd
Priority to JP2021550549A priority Critical patent/JPWO2021065436A1/ja
Publication of WO2021065436A1 publication Critical patent/WO2021065436A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means

Definitions

  • This disclosure relates to a light emitting device and a light receiving device.
  • Patent Document 1 discloses a LiDAR (Light Detecting and Ringing) device mounted on a vehicle.
  • the LiDAR device includes a light emitting element and a light receiving element.
  • the light emitting element emits the detected light in a predetermined direction outside the vehicle.
  • the light receiving element detects the return light generated by the reflection of the detection light on an object located in the direction, and outputs a detection signal corresponding to the amount of the return light.
  • the LiDAR apparatus can calculate the distance to the object that generated the return light based on the time from the emission of the detection light to the detection of the return light.
  • the light emitting element and the light receiving element are supported by the support surface of the substrate.
  • the detection light emitted from the light emitting element travels along the normal direction of the support surface.
  • the return light travels along the normal direction of the support surface and is incident on the light receiving element.
  • a light emitting device having a light emitting surface and A substrate having a support surface for supporting the light emitting element and Is equipped with The light emitting element is supported by the substrate so that the light emitting surface extends along the support surface.
  • the substrate is formed with a deflection surface that directs the traveling direction of the light emitted from the light emitting surface toward the direction along the support surface.
  • the traveling direction of the light emitted from the light emitting element can be determined while suppressing the increase in size of the light emitting device. It is possible to meet the desire to follow the support side of. Further, since the light emitting surface of the light emitting element extends along the supporting surface of the substrate, a general surface mounter for mounting components on the main surface of the circuit board when mounting the light emitting element on the substrate is used. Can be used. Therefore, it is possible to automate the highly accurate alignment of the light emitting surface and the deflection surface.
  • a light receiving device having a light receiving surface and A substrate having a support surface for supporting the light receiving element and Is equipped with The light receiving element is supported by the substrate so that the light receiving surface extends along the support surface.
  • a deflection surface that directs the traveling direction of light incident along the support surface toward the light receiving surface is formed on the substrate.
  • the traveling direction of the light incident on the light receiving element can be set in the substrate while suppressing the increase in size of the light receiving device. It can meet the desire to follow the support side. Further, since the light receiving surface of the light receiving element extends along the support surface of the substrate, a general surface mounter for mounting components on the main surface of the circuit board when mounting the light receiving element on the substrate is used. Can be used. Therefore, highly accurate alignment of the light receiving surface and the deflection surface can be automated.
  • direction along the support surface of the substrate means to include all directions closer to the direction parallel to the support surface than the normal direction of the support surface of the substrate.
  • the term “light” means an electromagnetic wave having an arbitrary wavelength capable of detecting desired information.
  • “light” is a concept that includes not only visible light but also ultraviolet light, infrared light, millimeter wave, and microwave.
  • the light emitting device is illustrated. A part of the light emitting device of FIG. 1 is illustrated. The cross section seen from the direction of the arrow along the lines III-III in FIG. 2 is illustrated. The light receiving device according to one embodiment is illustrated. A part of the light receiving device of FIG. 4 is illustrated. The cross section seen from the direction of the arrow along the line VI-VI in FIG. 5 is illustrated. The light receiving device according to another embodiment is illustrated.
  • FIG. 1 illustrates the light emitting device 1 according to the embodiment.
  • FIG. 2 is an enlarged example of a part of the light emitting device 1.
  • FIG. 3 illustrates a cross section seen from the direction of the arrow along lines III-III in FIG.
  • the light emitting device 1 includes a light emitting element 11. As illustrated in FIGS. 2 and 3, the light emitting element 11 has a light emitting surface 11a that emits light L1. Examples of the light emitting element 11 include semiconductor elements such as a light emitting diode, a laser diode, and an EL element.
  • the light emitting device 1 includes a substrate 12.
  • the substrate 12 has a support surface 12a.
  • the light emitting element 11 is supported by the substrate 12 so that the light emitting surface 11a extends along the support surface 12a.
  • the light emitting element 11 is mounted on the substrate 12 so that the light emitting surface 11a faces the support surface 12a.
  • the arrow P indicates the direction parallel to the support surface 12a.
  • the arrow N represents the normal direction of the support surface 12a.
  • a deflection surface 12b is formed on the substrate 12.
  • the shape and arrangement of the deflection surface 12b are defined so that the traveling direction of the light L1 emitted from the light emitting surface 11a of the light emitting element 11 is directed toward the direction along the support surface 12a.
  • the substrate 12 itself that supports the light emitting element 11 has a function as an optical system, the light L1 emitted from the light emitting element 11 is suppressed while suppressing the increase in size of the light emitting device 1. It is possible to meet the desire to make the traveling direction of the substrate 12 along the support surface 12a of the substrate 12. Further, since the light emitting surface 11a of the light emitting element 11 extends along the support surface 12a of the substrate 12, it is common for mounting components on the main surface of the circuit board when the light emitting element 11 is attached to the substrate 12. Surface mounter can be used. Therefore, highly accurate alignment of the light emitting surface 11a and the deflection surface 12b can be automated.
  • the substrate 12 can be formed of a semiconductor material such as silicon.
  • the deflection surface 12b can be formed by a semiconductor process. Examples of semiconductor processes include etching (at least one of isotropic and anisotropic), CVD method, PVD method and the like. By appropriately combining these well-known methods, a deflection surface 12b having a desired shape can be formed at a desired position on the substrate 12.
  • the deflection surface 12b having a fine and complicated shape can be accurately formed. Further, particularly when the light emitting element 11 is a semiconductor element manufactured by a semiconductor process, it is easy to integrate the forming process of the deflection surface 12b during the manufacturing process.
  • the surface of the deflection surface 12b can be mirror-finished or metal-plated.
  • the support surface 12a of the substrate 12 can support the circuit 13.
  • the circuit 13 may include a circuit that drives the light emitting element 11.
  • the deflection surface 12b is formed on a part of the circuit board on which the light emitting element 11 is mounted. As a result, the increase in size of the light emitting device 1 can be further suppressed.
  • FIG. 4 illustrates the light receiving device 2 according to the embodiment.
  • FIG. 5 shows an enlarged example of a part of the light receiving device 2.
  • FIG. 6 illustrates a cross section seen from the direction of the arrow along the line VI-VI in FIG.
  • the light receiving device 2 includes a light receiving element 21. As illustrated in FIGS. 5 and 6, the light receiving element 21 has a light receiving surface 21a on which the light L2 is incident. The light receiving element 21 is configured to output a signal corresponding to the amount of light L2 incident on the light receiving surface 21a. Examples of the light receiving element 21 include semiconductor elements such as photodiodes, phototransistors, and photoresistors.
  • the light receiving device 2 includes a substrate 22.
  • the substrate 22 has a support surface 22a.
  • the light receiving element 21 is supported by the substrate 22 so that the light receiving surface 21a extends along the support surface 22a.
  • the light receiving element 21 is mounted on the substrate 22 so that the light receiving surface 21a faces the support surface 22a.
  • the arrow P indicates the direction parallel to the support surface 22a.
  • the arrow N represents the normal direction of the support surface 22a.
  • a deflection surface 22b is formed on the substrate 22.
  • the shape and arrangement of the deflection surface 22b are defined so that the traveling direction of the light L2 incident along the support surface 22a of the substrate 22 is directed toward the light receiving surface 21a of the light receiving element 21.
  • the substrate 22 itself that supports the light receiving element 21 has a function as an optical system, the light L2 incident on the light receiving element 21 is suppressed while suppressing the increase in size of the light receiving device 2. It is possible to meet the desire to make the traveling direction along the support surface 22a of the substrate 22. Further, since the light receiving surface 21a of the light receiving element 21 extends along the support surface 22a of the substrate 22, it is common for mounting components on the main surface of the circuit board when the light receiving element 21 is attached to the substrate 22. Surface mounter can be used. Therefore, highly accurate alignment of the light receiving surface 21a and the deflection surface 22b can be automated.
  • the substrate 22 can be formed of a semiconductor material such as silicon.
  • the deflection surface 22b can be formed by a semiconductor process. Examples of semiconductor processes include etching (at least one of isotropic and anisotropic), CVD method, PVD method and the like. By appropriately combining these well-known methods, a deflection surface 22b having a desired shape can be formed at a desired position on the substrate 22.
  • the deflection surface 22b having a fine and complicated shape can be accurately formed. Further, particularly when the light receiving element 21 is a semiconductor element manufactured by a semiconductor process, it is easy to integrate the process of forming the deflection surface 22b during the manufacturing process.
  • the surface of the deflection surface 22b can be mirror-finished or metal-plated.
  • the support surface 22a of the substrate 22 can support the circuit 23.
  • the circuit 23 may include a circuit that processes the signal output from the light receiving element 21.
  • the deflection surface 22b is formed on a part of the circuit board on which the light receiving element 21 is mounted. As a result, the increase in size of the light receiving device 2 can be further suppressed.
  • FIG. 7 shows another example of the configuration of the light receiving device 2.
  • the light receiving element 21 is mounted on the substrate 22 so that the light receiving surface 21a does not face the support surface 22a.
  • the recess 21c is formed on the surface of the light receiving element 21 facing the support surface 22a of the substrate 22.
  • the recess 21c may be formed by mechanical processing or may be formed by chemical processing such as etching.
  • the depth of the recess 21c is set so that the light L2 incident on the bottom of the recess 21c can be detected. According to such a configuration, it is possible to divert a light receiving element having a general configuration in which the light receiving surface is mounted so as not to face the support surface of the substrate.
  • the light emitting device 1 and the light receiving device 2 can form a part of an optical sensor.
  • An optical sensor is a device for detecting desired information using light.
  • the optical sensor can be mounted on a moving body, for example, and used to detect information outside the moving body. Examples of moving bodies include vehicles, railroads, flying bodies, aircraft, ships and the like.
  • the moving body on which the optical sensor is mounted does not have to require a driver.
  • the optical sensor can form, for example, a part of a LiDAR sensor.
  • infrared light having a diameter of 905 nm can be used as the light L1 emitted from the light emitting device 1.
  • the light that the light L1 is reflected by the object and returns is detected by the light receiving device 2 as the light L2.
  • the LiDAR sensor can acquire the distance to the object associated with the light L2, for example, based on the time from emitting the light L1 in a certain direction to detecting the light L2. Further, by accumulating such distance data in association with the detection direction, it is possible to acquire information relating to the shape of the object associated with the light L2. In addition to or instead of this, it is possible to acquire information related to attributes such as the material of the object associated with the light L2 based on the difference in the waveforms of the light L1 and the light L2.
  • the optical sensor can form, for example, a part of a millimeter wave radar.
  • the light L1 for example, a millimeter wave of 24 GHz, 26 GHz, 76 GHz, or 79 GHz can be used.
  • the millimeter wave radar can acquire the distance to the object associated with the light L2 based on the time from the emission of the light L1 in a certain direction to the detection of the light L2 (reflected wave), for example. Further, by accumulating such distance data in association with the detection position, it is possible to acquire information related to the movement of the object associated with the light L2.
  • the above embodiment is merely an example for facilitating the understanding of the present disclosure.
  • the configuration according to the above embodiment may be appropriately changed or improved without departing from the gist of the present disclosure.
  • a single light emitting element 11 is supported on a single substrate 12.
  • a plurality of light emitting elements 11 may be supported on a single substrate 12.
  • a deflection surface 12b is formed for each light emitting element 11.
  • a single light receiving element 21 is supported on a single substrate 22.
  • a plurality of light receiving elements 21 may be supported on a single substrate 22.
  • a deflection surface 22b is formed for each light receiving element 21.
  • the light emitting element 11 and the light receiving element 21 may be supported on a common substrate.
  • the deflection surface 12b and the deflection surface 22b are formed on the common substrate.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Optical Radar Systems And Details Thereof (AREA)
PCT/JP2020/034658 2019-10-02 2020-09-14 発光装置、および受光装置 Ceased WO2021065436A1 (ja)

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JP2021550549A JPWO2021065436A1 (https=) 2019-10-02 2020-09-14

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JP2019-182170 2019-10-02
JP2019182170 2019-10-02

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0582810A (ja) * 1991-09-19 1993-04-02 Fujitsu Ltd 光電変換装置
JPH11274523A (ja) * 1998-02-20 1999-10-08 Samsung Electronics Co Ltd 一体型の光送受信モジュ―ル
JP2003222765A (ja) * 2002-01-29 2003-08-08 Kyocera Corp 光モジュール
US20130330035A1 (en) * 2012-06-07 2013-12-12 Samsung Electronics Co., Ltd. Semiconductor Package and Semiconductor Device Including the Same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07199006A (ja) * 1994-01-11 1995-08-04 Hitachi Ltd 光サブアセンブリ及び光モジュール
JP2001194559A (ja) * 2000-01-12 2001-07-19 Sumitomo Electric Ind Ltd 光素子モジュールおよび光素子モジュールの製造方法
JP3921940B2 (ja) * 2000-12-07 2007-05-30 住友電気工業株式会社 光送受信モジュール
US7271461B2 (en) * 2004-02-27 2007-09-18 Banpil Photonics Stackable optoelectronics chip-to-chip interconnects and method of manufacturing
JP5278366B2 (ja) * 2010-04-06 2013-09-04 住友ベークライト株式会社 光導波路構造体および電子機器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0582810A (ja) * 1991-09-19 1993-04-02 Fujitsu Ltd 光電変換装置
JPH11274523A (ja) * 1998-02-20 1999-10-08 Samsung Electronics Co Ltd 一体型の光送受信モジュ―ル
JP2003222765A (ja) * 2002-01-29 2003-08-08 Kyocera Corp 光モジュール
US20130330035A1 (en) * 2012-06-07 2013-12-12 Samsung Electronics Co., Ltd. Semiconductor Package and Semiconductor Device Including the Same

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