WO2021065081A1 - 真空蒸着装置用の蒸着源 - Google Patents
真空蒸着装置用の蒸着源 Download PDFInfo
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- WO2021065081A1 WO2021065081A1 PCT/JP2020/022080 JP2020022080W WO2021065081A1 WO 2021065081 A1 WO2021065081 A1 WO 2021065081A1 JP 2020022080 W JP2020022080 W JP 2020022080W WO 2021065081 A1 WO2021065081 A1 WO 2021065081A1
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- vapor deposition
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- discharge opening
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
Definitions
- the present invention relates to a vapor deposition source for a vacuum vapor deposition apparatus for vapor deposition on a film-forming object in a vacuum chamber.
- a predetermined thin film such as a predetermined metal film or oxide film is applied to one surface or both surfaces in a vacuum atmosphere. It is known that a single film or a multi-layer film is formed, or an electronic component or an optical component is subjected to etching or heat treatment.
- a vacuum processing apparatus that performs a film forming process as such a vacuum process is known in Patent Document 1, for example.
- This product is provided with a vacuum chamber capable of forming a vacuum atmosphere, and in the vacuum chamber, a feeding roller for feeding a sheet-shaped base material, a winding roller for winding a film-forming base material, and a feeding roller
- a guide roller is provided to convey the drawn sheet-shaped base material.
- a vapor deposition source is also provided on the bottom surface of the vacuum chamber so as to face a portion of a sheet-like base material that is horizontally conveyed between a pair of guide rollers.
- the vapor deposition source includes a rectangular parallelepiped storage box for storing the vapor deposition material, and a slit-shaped discharge opening is provided on the surface of the storage box facing the sheet-like base material portion (that is, the upper surface in the vertical direction). (So-called line source). Then, after filling the accommodation box with the vapor-deposited material, the vapor-deposited material in the storage box is heated by a heating means in a vacuum atmosphere to sublimate or vaporize, and the sublimated or vaporized material is subjected to the pressure difference from the inside of the vacuum chamber. A predetermined thin film is vapor-deposited by discharging from the discharge opening and adhering to and depositing on a sheet-like base material (so-called depot-up type film formation).
- the above-mentioned conventional example is used for so-called depot-down type film formation due to its structure. Is not available (in other words, the deposition direction with respect to the film formation object cannot be substantially changed). Therefore, when attempting to form a double-sided film, a thin film is formed on one surface of a sheet-like base material while being horizontally conveyed between a pair of guide rollers above the vapor deposition source, and then the front and back surfaces are inverted. Again, the sheet-like base material is transferred above the vapor deposition source to form a thin film on the other surface. As a result, a mechanism for inverting the front and back of the sheet-shaped base material and an additional transfer roller are required, which leads to complication and cost increase of the vacuum vapor deposition apparatus.
- the vapor deposition source for the vacuum vapor deposition apparatus of the present invention for vapor deposition on a film-deposited object in a vacuum chamber is installed in a posture in which the longitudinal direction coincides with the vertical direction, and the vapor deposition material.
- the main cylinder having a pit to be filled with, and the sub-cylinder having a discharge opening projected from the main cylinder located above the thin-film deposition material filled in the pit, and at least the pit to be filled.
- the vapor-deposited material in the pit is heated by a heating means to sublimate or vaporize the vapor-deposited material in a state where the upper opening of the pit is closed by a lid in a vacuum atmosphere, and the lid is opened. It is characterized in that the sublimated or vaporized vaporized material is transferred to the sub-cylinder while maintaining its vapor pressure and discharged from the discharge opening.
- the discharge opening is oriented upward in the vertical direction and the discharge opening is horizontal in the main cylinder.
- the sub-cylinder is attached in a posture facing the direction or a posture in which the discharge opening faces downward in the vertical direction.
- the crucible portion is filled with a vapor-deposited material selected according to the thin film to be formed on the film-forming object with the lid open in the atmospheric atmosphere from above in the vertical direction.
- the opening on the upper surface of the crucible is closed with a lid, and the heating means is operated in a vacuum atmosphere to heat the vapor-deposited material in the crucible.
- the vapor-deposited material is vaporizable
- the vapor-deposited material in the hollow portion is liquefied
- the vapor-deposited material filled in the hollow portion is the vapor-deposited material. It begins to vaporize from the upper layer according to the vapor pressure curve it has.
- the pressure in the pit partial pressure of the vapor-deposited material
- the pressure in the pit rises to the vapor pressure corresponding to the predetermined temperature, shifts to a thermal equilibrium state in which vaporization is suppressed by the vapor pressure-controlled rate, and is filled in the pit.
- At least the upper layer portion of the vaporized material is completely liquefied (at this time, when the heating means is a heating element such as a sheath heater, the heater output becomes stable when the thermal equilibrium state is reached).
- the heating means is a heating element such as a sheath heater
- the heater output becomes stable when the thermal equilibrium state is reached.
- the lid is opened in this state, the vaporized vaporized material is transferred (diffused) to the sub-cylinder while maintaining its vapor pressure so that the difference in partial pressure with the sub-cylinder existing in the vacuum atmosphere becomes an equilibrium state. Is released into the vacuum atmosphere through the discharge opening.
- the portion where the vaporized material is heated to sublimate or vaporize (main cylinder) and the portion where the sublimated or vaporized vaporized material is transferred and released (secondary cylinder) are separated (the sublimb). That is, it is a gas transfer type vapor deposition source), and a configuration that can change the phase of the discharge opening provided in the sub-cylinder is adopted, so the vapor deposition direction for the film-deposited object such as the so-called depot-up type or depot-down type can be arbitrarily set. It can be used and has excellent versatility.
- the lid since the upper surface opening of the crucible is closed by the lid, the lid may not be opened under the condition that the internal atmosphere of the main cylinder and the sub cylinder cannot maintain the equilibrium state in the crucible. This makes it possible to prevent the deposition material from accumulating inside the main cylinder and the sub cylinder, and the vapor pressure can be controlled only by the heating means for heating the crucible.
- the discharge opening is usually composed of a slit-shaped one that is long in one direction, but the main cylinder If the vapor-deposited material transferred from the to the sub-cylinder is unevenly discharged from the discharge opening, it is not possible to form a film with good film thickness distribution in the width direction on the film-forming object facing the discharge opening. ..
- the vapor deposition source is configured so that the vapor-deposited material is uniformly discharged from the slit-shaped discharge opening. There is a need.
- a distribution plate having a distribution hole formed in the sub-cylinder body it is preferable to insert a distribution plate having a distribution hole formed in the sub-cylinder body to guide the sublimated or vaporized vaporized material transferred to the sub-cylinder body to the discharge opening.
- the vapor-deposited material can be uniformly discharged from the slit-shaped discharge opening, and moreover, for example, the type of the vapor-deposited material. If the above is changed, it may be replaced with a distribution plate having a different shape of the distribution hole and an opening area, and the versatility is excellent.
- the heating means further includes a heating element such as a sheath heater provided in the sub-cylinder.
- a heating element such as a sheath heater provided in the sub-cylinder.
- FIG. 2 is a cross-sectional view taken along the line II-II of FIG.
- A) is an enlarged cross-sectional view showing the vapor deposition source of the present embodiment
- (b) is a cross-sectional view taken along the line IIIb-IIIb of (a).
- the film-forming object is a sheet-shaped base material Sw and the sheet-shaped base material Sw is run in a vacuum atmosphere to form a film on both sides of the sheet-shaped base material Sw.
- An embodiment of a vapor deposition source for a vacuum vapor deposition apparatus of the present invention will be described as an example.
- the can roller is housed in the vacuum chamber Vc in a posture in which the axial direction of the can roller as the transport roller coincides with the horizontal direction, and the axial direction is the X-axis direction, and the X-axis is in the same horizontal plane.
- the direction orthogonal to is the Y-axis direction
- the X-axis and the vertical direction orthogonal to the Y-axis are the Z-axis directions
- the directions such as up and down are based on FIG. 1 shown in the installation posture of the vacuum vapor deposition apparatus.
- the vacuum vapor deposition apparatus DM including the vapor deposition sources ES 1 and ES 2 of the present embodiment includes a central vacuum processing chamber Ms and the first and second transport chambers Ts1 and Ts2.
- the vacuum chamber Vc is provided.
- a vacuum pump unit composed of a turbo molecular pump, a rotary pump, etc. is connected to the vacuum processing chamber Ms and the respective transport chambers Ts1 and Ts2 via an exhaust pipe to form a vacuum atmosphere. You can do it.
- the vacuum processing chamber Ms has an O-ring of a first chamber portion 1 as a chamber body having a rectangular parallelepiped contour and opening side wall surfaces in the Y-axis direction facing each other, and openings 11 and 12 of the first chamber portion 1.
- a support plate 2 1, 2 2 first and second as sealably respectively cover the partition wall via a vacuum seal Sv etc., are defined in the expansion chamber Ec below.
- the first and second supporting plate 2 1, 2 2 of the upper and lower surfaces of the predetermined position, the first screw hole Sh 1 is bored penetrating in the Y-axis direction, the first chamber portion 1 of the supporting plate 2 of the first and second in the opening 11, 12, 2 2 when the mounted, the first wall portion of the chamber portion 1 corresponding to the first screw hole Sh 1, the second screw Hole Sh 2 is bored.
- each of the first and second screw holes Sh 1 fastened to Sh 2 volts Fb 1, by fastening the Fb 2, a state where the vacuum seal Sv is pressed into the support plate 2 1, 2 2 wall portion and the first and second located around the first chamber portion 1 of the opening 11, 12 Both can be fixed with.
- the first and second supporting plate 2 On the side oriented to each other of the first and second supporting plate 2 1, 2 2, the support frame 3 of the first and second, 3 2 respectively attached, the first and second supporting plate 2 1, upright posture 2 2 in the Z-axis direction is to be maintained.
- the lower surface of the first supporting frame 3 1, the slider 31 which moves slidably is provided in the rail member Rl was laid on the floor F, whereas the Y-axis direction from the first chamber portion 1 of the opening 11 (FIG. 2 It is movable between the retracted position (middle, left side) and the closed position that closes the opening 11 of the first chamber portion 1 (see FIG. 2).
- the X-axis direction both sides of the first chamber portion 1 has a rectangular parallelepiped contour, Y-axis direction while the second chamber portion of the sidewall surface as the opened chamber body 4 1, 4 2 are respectively provided continuously, the transfer chamber Ts1, Ts2 has been made a second chamber portion 4 1, 4 2 and the support plate 2 of the first and second, 2 2 and de image.
- the first and second supporting plate 2 1, 2 2 of the upper and lower surfaces of the predetermined position, the first screw hole Sh penetrating in the Y-axis direction 1 is bored, and the second chamber portion 4 1, 4 first to the second openings 11, 12 and the second supporting plate 2 1, 2 2 when the mounted, corresponding to the first screw hole Sh 1 the second chamber portions 4 1, 4 2 wall portion, the second screw hole Sh 2 is bored.
- the load lock valve so as to cover the portion of the sheet substrate Sw passing through the gap 5 is provided so that the sheet-shaped base material Sw can be consistently conveyed in a vacuum atmosphere and the vacuum processing chamber Ms and both transfer chambers Ts1 and Ts2 can be isolated. Since a known load lock valve 5 can be used as the load lock valve 5 used in this type of vacuum processing apparatus, detailed description thereof will be omitted here.
- the first transport chamber Ts1 located on one side in the X-axis direction (left side in FIG. 1) is provided with a feeding roller Wr around which a sheet-shaped base material Sw before film formation is wound.
- the rotation shaft Wa of the feeding roller Wr is pivotally supported by the second support plate 22 and is rotationally driven by a motor M1 provided outside the vacuum chamber Vc.
- the second transport chamber Ts2 is provided with a take-up roller Ur that winds up the film-formed sheet-like base material Sw.
- the rotation shaft Ua of the take-up roller Ur is also pivotally supported by the second support plate 22 and is rotationally driven by a motor M2 provided outside the vacuum chamber Vc.
- a guide roller Gr as a transport roller for guiding the transport of the sheet-shaped base material Sw is appropriately provided, and the rotation shaft Ga of the guide roller Gr is also the first. It is pivotally supported by the support plate 2 2 of 2.
- the vacuum processing chamber Ms is provided with a guide roller Gr and a can roller Cr so that the sheet-shaped base material Sw is cooled while being conveyed around the can roller Cr.
- the rotation axes Ga and Ca of the guide roller Gr and the can roller Cr are also pivotally supported by the second support plate 22 so that the can roller Cr is rotationally driven by the motor M3 provided outside the vacuum chamber Vc. It has become.
- the two vapor deposition sources ES 1 and ES 2 of the present embodiment are used. It is provided.
- each of the vapor deposition sources ES 1 and ES 2 has the same configuration and includes a main cylinder 6 and a sub cylinder 7.
- expansion chambers Ec are continuously provided on the outer surface of the first support plate 21 in the Y-axis direction according to the position and number of the vapor deposition sources ES 1 and ES 2 to be installed.
- a material filling chamber Fs having an opening / closing door Ed1 arranged downward in the Z-axis direction is provided above the expansion chamber Ec.
- the material filling chamber Fs is connected to a vacuum pump unit composed of a turbo molecular pump, a rotary pump, etc. and a vent valve via an exhaust pipe (communicate to the vacuum chamber Vc).
- a vacuum atmosphere separate from the expansion chamber Ec can be formed (note that the expansion chamber Ec may also be configured to be evacuated by a vacuum pump unit separate from the vacuum chamber Vc).
- the vapor-deposited material Em When filling the crucible portion 61, which will be described later, with the vapor-deposited material Em, the vapor-deposited material Em is charged inside the material filling chamber Fs in a state where the inside is open to the atmosphere, and then the material filling chamber Fs is evacuated to the inside.
- the opening / closing door Ed1 and the opening / closing door Ed2 for the main cylinder 6 described later are opened.
- the vapor deposition material Em can be filled in the crucible portion 61, which will be described later, without opening the vacuum chamber Vc to the atmosphere.
- a material automatic transfer mechanism having a known structure may be provided to charge the vapor-deposited material Em. Then, in the expansion chamber Ec, the main cylinders 6 of the vapor deposition sources ES 1 and ES 2 are arranged in a posture having a cylindrical contour and whose longitudinal direction coincides with the Z-axis direction.
- the main cylinder 6 has a bottomed tubular contour, and a crucible portion 61 in which the solid vapor deposition material Em is filled at a predetermined filling rate is provided at the lower portion in the Z-axis direction.
- the vapor deposition material Em is appropriately selected according to the composition of the thin film to be deposited (deposited) on the sheet-shaped base material Sw, and for example, a metal material such as aluminum, lithium, indium and an alloy thereof or an organic material is used. Be done.
- An opening / closing door Ed2 is provided in the upper opening of the main cylinder 6, and when the opening / closing door Ed2 having a known structure is closed, the inside of the main cylinder 6 can be sealed.
- the crucible portion 61 is also provided with a lid 62 that rotatably closes the upper surface opening 61a.
- an actuator 63 is provided in the main cylinder 6, and the lid 62 is erected in the Z-axis direction by the actuator 63, and the upper surface opening 61a is closed (see FIG. 3).
- the lid body 62 is swung between the two, and the lid body 62 is pressed toward the pit 61 in the horizontal posture so that the contact surface pressure between the lid 62 and the pit 61 can be secured.
- the branch pipe portion 64 is inserted into a through hole 21 provided in the first support plate 21 and its tip protrudes to the vacuum processing chamber Ms.
- the height position of the branch pipe portion 64 in the Z-axis direction is set so as to be located at least above the upper layer portion of the thin-film deposition material Em filled in the crucible portion 61.
- a sheath heater 8a (heating body) as a heating means is also provided in the main cylinder 6, and by energizing the sheath heater 8a from a power source (not shown), not only the vapor deposition material Em in the crucible portion 61 but also the main cylinder The inner surface of the body 6 and the lid 62 can be heated over the entire surface thereof.
- the sub-cylinder body 7 located in the vacuum processing chamber Ms has a cylindrical contour having mounting flanges 71 and 72 corresponding to the mounting flanges 64a at both ends, and is fixed so as to be longer than the width of the sheet-shaped base material Sw. It has been dimensioned. Then, with the mounting flange 64a and one mounting flange 71 in the Y-axis direction in contact with each other, the sub-cylinder body 7 can be detached from the main cylinder body 6 by fastening the two with bolts Bo as fastening means. It is attached to and is positioned and supported by the holder Hd.
- Holder Hd is provided with a proximal block Hd1 fixed to the first supporting plate 2 1 inner wall, and two struts Hd2 which is cantilevered at the proximal block Hd1 extending in the Y-axis direction, each strut Support blocks Hd3 are provided in the portion Hd2 at predetermined intervals in the Y-axis direction.
- the support block Hd3 is configured to support the sub-cylinder body 7 by point contact (that is, it is positioned but no surface pressure other than its own weight is applied), and heat conduction due to contact is minimized. (See FIG. 3 (b)).
- the point contact refers to a design concept in which the support area is set so that permanent deformation does not occur due to the surface pressure due to its own weight.
- the contact area is determined and the thermal resistance is maximized.
- the support block may be made of ceramic having low conductivity.
- the main cylinder 6 is provided with a reflector (not shown) around the sub-cylinder 7 to increase the resistance value not only for contact heat conduction but also for radiant heat conduction, so that the heat loss is smaller. It is more desirable to have a configuration.
- the method of fixing the sub-cylinder body 7 to the main cylinder body 6 is not limited to the above, and for example, a clamp or the like can be used.
- the phase of the discharge opening 75 which will be described later, can be arbitrarily changed.
- the discharge opening 75 in the vapor deposition source ES 1 located on the first transport chamber Ts1 side, the discharge opening 75 is oriented upward in the Z-axis direction, and in the vapor deposition source ES 2 located on the second transport chamber Ts2 side. , The discharge opening 75 is oriented downward in the Z-axis direction (see FIG. 1).
- a lid plate 73 that closes the inside of the sub-cylinder body 7 is mounted on the other mounting flange 72 in the Y-axis direction, and the lid plate 73 holds the distribution plate 76 described later.
- the internal atmosphere of the main cylinder 6 and the sub-cylinder 7 communicate with each other, and the communication port between the internal atmosphere and the outside does not exist other than the discharge opening 75 described later.
- the lid plate 73 can be detachably attached by fastening the lid plate 73 and the other mounting flange 72 in the Y-axis direction with a bolt Bo as a fastening means. ing.
- a ridge 74 having a racetrack-like contour separated from one mounting flange 71 in the Y-axis direction is provided, and the Y-axis is surrounded by the ridge 74.
- a slit-shaped discharge opening 75 that is long in the direction is opened.
- the discharge opening 75 faces the portion of the sheet-shaped base material Sw conveyed in the vacuum processing chamber Ms.
- a distribution hole 76a is formed in the sub-cylinder body 7 through which the sublimated or vaporized vaporized material Em transferred from the main cylinder body 6 to the sub-cylinder body 7 passes when guided to the discharge opening 75.
- a plate 76 is inserted.
- the distribution plate 76 has a length extending over substantially the entire length of the sub-cylinder body 7 in the Y-axis direction across the discharge opening 75 and a width wider than the discharge opening 75 (length in the X-axis direction).
- the distribution hole 76a is composed of a single elongated hole formed so as to be located directly below the discharge opening 75, and is provided on the other side in the Y-axis direction from the main cylinder 6 side so that the opening area is continuously increased.
- the amount of increase in the opening area is appropriately set in consideration of the film thickness distribution in the Y-axis direction (width direction of the sheet-shaped base material Sw) when the film is formed on the sheet-shaped base material Sw.
- a single elongated hole forming the distribution hole 76a will be described as an example, but if the film thickness distribution when the film is formed on the sheet-shaped base material Sw can be made substantially uniform, the film thickness distribution will be described.
- the present invention is not limited to this, and for example, a plurality of holes having different areas may be opened and configured.
- the case where the distribution plate 76 is used will be described as an example, but the discharge opening 75 is provided from the main cylinder 6 side to the other side in the Y-axis direction so that the opening area is continuously increased. , The distribution plate 76 can be omitted.
- a sheath heater 8b (heating body) as a heating means is provided in the sub-cylinder body 7, and by energizing the sheath heater 8b from a power source (not shown), the inner surface of the sub-cylinder body 7 and the surface of the distribution plate 76 are covered. It is possible to heat the entire surface.
- the sheath heater 8b is provided in the sub-cylinder body 7, but when the vapor deposition material Em in the crucible portion 61 is heated, the main cylinder body 6 and the sub-cylinder body 7 are sufficiently heated by radiation or heat transfer. If possible, this can be omitted.
- the sheet-shaped base material Sw is charged in the material filling chamber Fs, and the opening / closing door Ed1 , Ed2 is opened, and the lid 62 is in an upright position by the actuator 63, and the thin-film deposition material Em is filled in the crucible portions 61 of each of the thin-film deposition sources ES 1 and ES 2 at a predetermined filling rate.
- a sheet-shaped base material Sw is wound around the feeding roller Wr in one of the transport chambers Tc1 of the vacuum chamber Vc, and the tip portion thereof is wound around the guide rollers Gr and the can roller Cr in the vacuum processing chamber Ms. After being wound on each, they are guided to the other transport chamber Tc2 and attached to the take-up roller Ur via the guide roller Gr. In this state, the vacuum processing chamber Ms and both transport chambers Ts1 and Ts2 are evacuated to a predetermined pressure. It is in a standby state.
- the lid 62 After filling the vapor deposition material Em, the lid 62 is placed in a horizontal position and the opening / closing doors Ed1 and Ed2 are closed, respectively. Then, when the inside of each expansion chamber Ec reaches a predetermined pressure, the sheath heaters 8a and 8b are energized to heat the main cylinder 6 and the sub cylinder 7 of the vapor deposition sources ES 1 and ES 2 including the crucible portion 61. ..
- the vapor deposition material Em is a vaporizable material
- the vapor deposition material Em in the pit 61 is liquefied, and the vapor deposition material filled in the pit 61 is filled.
- Em begins to vaporize from the upper layer according to the vapor pressure curve of the vapor deposition material Em.
- the pressure inside the pit 61 (partial pressure of the vapor-deposited material Em) rises to the vapor pressure corresponding to the predetermined temperature, shifts to a thermal equilibrium state in which vaporization is suppressed by the vapor pressure rate-determining rate, and the pit 61.
- the vaporized material Em filled in 61 is liquefied (the energizing current (heater output) of the sheath heater 8a is stable).
- the motors M1 to M3 are rotationally driven to run the sheet-shaped base material Sw at a constant speed, and the lid 62 is put into an upright posture by the actuator 63.
- the vaporized vaporized vaporized material Em passes through the main cylinder 6 while maintaining its vapor pressure so that the difference in partial pressure with the sub-cylinder 7 existing in the vacuum processing chamber Ms in the vacuum atmosphere becomes an equilibrium state. It is transferred (diffused) to the cylinder 7, guided to the discharge opening 75 by the distribution plate 76, and discharged from the discharge opening 75 into the vacuum atmosphere.
- the discharge opening 75 since the discharge opening 75 is directed upward, a film is formed on one surface of the sheet-like base material Sw by depot-up.
- the sheet-shaped base material Sw is once cooled while being conveyed around the can roller Cr, and then, in the vapor deposition source ES 2 , since the discharge opening 75 is directed downward, the sheet-shaped base material Sw is deposited down. A film is formed on the other surface of the.
- the sheet-like base material Sw formed on both sides is conveyed to another transfer chamber Ts2 and wound by a take-up roller Ur, and after the other transfer chamber Tc2 is opened to the atmosphere, the sheet has been subjected to film formation treatment. The shape of the base material Sw is recovered.
- the operator of the distribution plate 76 After recovering the sheet-shaped base material Sw that has been film-deposited (that is, after the end of production), the operator of the distribution plate 76 due to the change of the type of the vapor-deposited material Em for the next production. replacement, cleaning or sheath heater 8a of the auxiliary tubular body 7, when carrying out the maintenance such 8b exchange, remove all of the fastening bolt Fb 1 for fastening the first support plate 2 1 and the first chamber 1 from each other.
- the vacuum chamber Vc was opened to the atmosphere, via the slider 31, moves the supporting frame 3 1 while the X-axis direction (see FIG. 5).
- the sub-cylinder body 7 can be taken out in a wide space away from the vacuum processing chamber Ms, and maintenance workability can be improved.
- the portion where the vaporized material Em is heated to sublimate or vaporize (main cylinder 6) and the portion where the sublimated or vaporized vaporized material Em is transferred and released (sub-cylinder 7) are separated (the sub-cylinder 7). That is, the gas transfer (diffusion) type vapor deposition sources ES 1 and ES 2 ) and the phase of the discharge opening 75 provided in the sub-cylinder 7 can be changed.
- the vapor deposition direction with respect to the base material Sw can be arbitrarily set, and the versatility is excellent.
- the distribution plate 76 fixed to the lid plate 73 is inserted into the sub-cylinder body 7, the shape of the distribution hole 76a formed in the distribution plate 76, the opening area, and the like can be appropriately set to form a slit shape.
- the vapor deposition material Em can be discharged uniformly from the discharge opening 75 of the above, and the type of the vapor deposition material Em is changed, for example, the distribution plate 76 having a different shape of the distribution hole 76a and the opening area is replaced. It suffices, and it becomes excellent in versatility.
- the heating element (heating source) 8b is inside the sub-cylinder body 7, the heat efficiency is improved as compared with the heat transfer method via the wall surface of the sub-cylinder body 7 as described above, and the configuration is industrially advantageous.
- the heating element 8b a known heating element other than the sheath heater can be used.
- the present invention is not limited to those of the above embodiments, and various modifications can be made as long as the gist of the present invention is not deviated.
- the object to be deposited is a sheet-shaped base material Sw, but the present invention is not limited to this, and the vapor deposition sources ES 1 and ES 2 of the present invention can also be used for film formation on a rectangular substrate.
- the discharge opening 75 may be oriented upward in the vertical direction, the discharge opening 75 may be oriented horizontally, or the discharge opening 75 may be oriented downward in the vertical direction.
- the crucible portion 61 is kept vertical in the Z-axis direction due to its physical characteristics. This is to suppress fluctuations in the filling efficiency and the area of the vapor-deposited material Em at the gas-liquid interface during vapor deposition.
- the Y-axis axis of the sub-cylinder body 7 is aligned on the XX plane. It may be set to, and the discharge opening 75 may be rotated around the Y axis to face the position facing the can roller Cr (in this case, the axis of the Z axis of the main cylinder 6 should be kept vertical).
- the axis of the sub-cylinder 7 is inclined so that the discharge opening 75 is aligned with the can roller Cr. It should be set as follows.
- the vapor deposition source ES 1 is located on the side opposite to the film-forming surface of the sheet-shaped base material Sw.
- the cooling rollers and cooling panels may be arranged so as to face each of the emission openings 75 of ES 2.
- DM vacuum vapor deposition equipment, Ec ... expansion chamber, Em ... vapor deposition material, ES 1 , ES 2 ... vapor deposition source, Sw ... sheet-like substrate (deposition object), Vc ... vacuum chamber, 6 ... main cylinder, 61 ... Crucible, 61a ... Top opening, 62 ... Lid, 7 ... Sub-cylinder, 75 ... Discharge opening, 76 ... Distribution plate, 76a ... Distribution hole, 8a ... Sheath heater (heating means), 8b ... Sheath heater (heating element) ).
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Abstract
Description
の分岐管部64が突設され、開閉扉Ed2を閉じた状態では、主筒体6の内部雰囲気は、分岐管部64のみが連通する対象となっている。分岐管部64は、第1の支持プレート21に設けた透孔21に挿通してその先端が真空処理室Msまで突出している。分岐管部64のZ軸方向の高さ位置は、少なくとも坩堝部61内に充填される蒸着材料Emの上層部分より上方に位置するように設定されている。主筒体6内にはまた、加熱手段としてのシースヒータ8a(発熱体)が設けられ、シースヒータ8aに図外の電源から通電することで、坩堝部61内の蒸着材料Emだけでなく、主筒体6内の内面や蓋体62をその全面に亘って加熱できるようにしている。
Claims (3)
- 真空チャンバ内で成膜対象物に対して蒸着するための真空蒸着装置用の蒸着源において、
長手方向が鉛直方向に合致する姿勢で設置され、蒸着材料が充填される坩堝部を有する主筒体と、坩堝部内に充填される蒸着材料より上方に位置する主筒体の部分に突設され、放出開口を有する副筒体と、少なくとも坩堝部に充填される蒸着材料の加熱を可能とする加熱手段とを備え、
副筒体が放出開口の位相を変えて主筒体に着脱自在に取り付けでき、
坩堝部の上面開口を開閉自在に閉塞する蓋体が設けられ、
真空雰囲気中にて坩堝部の上面開口を蓋体で閉塞した状態で加熱手段により坩堝部内の蒸着材料を加熱して蒸着材料を昇華または気化させ、蓋体を開放したときに、昇華または気化した蒸着材料がその蒸気圧を保ちつつ副筒体に移送されて放出開口から放出されるように構成したことを特徴とする真空蒸着装置用の蒸着源。 - 請求項1記載の真空蒸着装置用の蒸着源であって、前記放出開口が一方向に長手のスリット孔で構成されるものにおいて、
前記副筒体内に、副筒体に移送された昇華または気化した蒸着材料を放出開口に導く分布孔が形成された分布板が挿設されることを特徴とする真空蒸着装置用の蒸着源。 - 前記加熱手段が前記副筒体内に設けられる発熱体を更に備えることを特徴とする請求項1または請求項2記載の真空蒸着装置用の蒸着源。
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