WO2020086424A1 - Evaporation deposition system for replacing crucible - Google Patents

Evaporation deposition system for replacing crucible Download PDF

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Publication number
WO2020086424A1
WO2020086424A1 PCT/US2019/057136 US2019057136W WO2020086424A1 WO 2020086424 A1 WO2020086424 A1 WO 2020086424A1 US 2019057136 W US2019057136 W US 2019057136W WO 2020086424 A1 WO2020086424 A1 WO 2020086424A1
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WO
WIPO (PCT)
Prior art keywords
evaporation
chamber
connection
moving
crucible
Prior art date
Application number
PCT/US2019/057136
Other languages
French (fr)
Inventor
Young Do Kim
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to CN201980068082.4A priority Critical patent/CN112867808A/en
Publication of WO2020086424A1 publication Critical patent/WO2020086424A1/en

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/243Crucibles for source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Definitions

  • the present disclosure relates to an evaporation deposition system for replacing a crucible, and more particularly, to an evaporation deposition system for replacing a crucible by evaporating an organic material, an inorganic material, a metal, etc., to form a thin film on a surface of a substrate.
  • a vaporizer is a device that forms a thin film on a surface of a substrate such as a wafer for manufacturing a semiconductor, a substrate for manufacturing a liquid crystal display (LCD), a substrate for manufacturing an organic light emitting diode (OLED), etc., by employing a method such as chemical vapor deposition (CVD), physical vapor deposition (PVD), evaporation deposition, etc.
  • CVD chemical vapor deposition
  • PVD physical vapor deposition
  • evaporation deposition etc.
  • a process of forming a thin film on the surface of the substrate by evaporating an organic material, an inorganic material, a metal, etc. is employed in deposition of a deposition material.
  • an evaporation source, a glass substrate, a mask, an alignment device, etc. may be provided in the vacuum chamber in which the deposition process is performed.
  • evaporation material may include a deposition chamber in which the deposition substrate is vertically loaded, and a source installed inside the deposition chamber and heating and evaporating the deposition material so as to evaporate the deposition material with respect to the substrate, wherein the deposition material is evaporated to form a thin film on the substrate surface.
  • the source may include an evaporation vessel (a crucible) that accommodates the deposition material, a heater that heats the evaporation vessel, a tube coupled to the evaporation vessel, and a plurality of nozzles that protrude toward the substrate and are in communication with the tube.
  • the deposition material is limitedly accommodated within the evaporation vessel depending on capacity of the evaporation vessel, wherein since the capacity of the evaporation vessel is less than the total amount of deposition material used to form a thin film with a desired level on a large substrate, a crucible should be replaced several to several tens of times in order to deposit the thin film of deposition material to the desired level on the large substrate.
  • the source heats and evaporates the deposition material in the vacuum chamber, but the crucible replacement is performed outside the vacuum chamber, and thus it takes a lot of energy and time to take out multiple sources several to several tens of times alternately and then reload the sources after the crucible replacement.
  • an object of the present disclosure is to provide an evaporation deposition system for replacing a crucible capable of depositing a thin film on a large substrate using a minimum source, and facilitating crucible replacement.
  • an evaporation deposition system for replacing a crucible including: a vacuum chamber configured to
  • a substrate accommodates a substrate; an evaporation source configured to supply a vapor deposition material to the substrate; a plurality of moving chambers, each configured to accommodate the evaporation source and to move along a rail; and a connection chamber configured to connect the moving chambers and the vacuum chamber, wherein a front surface of each of the moving chambers is provided with a first opening through which the vapor deposition material moves into the connection chamber and a first on-off valve that opens and closes the first opening.
  • connection chamber is provided with a first entrance through which the moving chambers go in and out of the connection chamber, and a first contact member, which is selectively in contact with an outer surface of the moving chambers, may be disposed in the first entrance.
  • Connection housings may be respectively coupled to both end parts of each of the moving chambers in a moving direction, the plurality of moving chambers may be connected by the connection housings to move integrally, the connection chamber isprovided with a first entrance through which the moving chambers and the connection housings go into and out of the connection chamber, and a first contact member, which is selectively in close contact with outer surfaces of the connection housings, may be disposed in the first entrance.
  • Second openings may be respectively disposed in both end parts of each of the moving chambers in the moving direction, and each of the connection housings is provided with a second on-off valve that opens and closes the second opening.
  • the evaporation source may include a distribution pipe configured to eject the vapor deposition material through a nozzle; an evaporation crucible coupled to the distribution pipe and configured to accommodate the vapor deposition material; a support movably mounted to the rail; and an actuator installed on the support to elevate and lower the evaporation crucible, and the evaporation crucible may enter and exit through the second opening.
  • a partition wall may be disposed in each of the moving chambers between the distribution pipe and the evaporation crucible, the distribution pipe may be coupled to the evaporation crucible through a connection part passing through the partition wall, and a gate valve may be disposed in the connection part.
  • connection chamber is provided with a second entrance facing front surfaces of the moving chambers, and a second contact member, which is selectively in close contact with the front surfaces of the moving chambers, may be disposed in the second entrance.
  • Connection housings may be respectively coupled to both end parts of each of the moving chambers in a moving direction, the plurality of moving chambers may be connected by the connection housings to move integrally, the connection chamber is provided with a second entrance facing the front surfaces of the moving chambers and the connection chambers, and a second contact member, which is selectively in close contact with the front surfaces of the moving chambers and the connection housings, may be disposed in the second entrance.
  • a rear surface of each of the moving chambers is provided with a third opening, through which the evaporation crucible of the evaporation source goes in and out of each of the moving chambers and a third on-off valve that opens and closes the third opening.
  • the the vacuum chamber is provided with a fourth opening, through which the vacuum chamber communicates with the connection chambers and a fourth on-off valve that opens and closes the fourth opening.
  • the evaporation deposition system for replacing a crucible it is possible to deposit the thin film on the large substrate using the minimum source and to facilitate crucible replacement by moving the plurality of moving chambers, each accommodating an evaporation source, along the rail, and connecting the moving chamber and the vacuum chamber by the connection chamber.
  • FIGS. 1 to 3 are schematic diagrams of an evaporation deposition system for replacing a crucible according to an exemplary embodiment of the present disclosure
  • FIGS. 4 A and 4B are schematic side views of the evaporation deposition system for replacing a crucible according to an exemplary embodiment of the present disclosure
  • FIGS. 5 to 7 are schematic diagrams of an evaporation deposition system for replacing a crucible according to another exemplary embodiment of the present disclosure
  • FIGS. 8 A and 8B are schematic side views of the evaporation deposition system for replacing a crucible according to another exemplary embodiment of the present disclosure.
  • FIG. 9 is a schematic diagram of an evaporation deposition system for replacing a crucible according to yet another exemplary embodiment of the present disclosure.
  • FIGS. 1 to 3 are schematic diagrams of an evaporation deposition system for replacing a crucible according to an exemplary embodiment of the present disclosure
  • FIGS. 4A and 4B are schematic side views of the evaporation deposition system for replacing a crucible according to an exemplary embodiment of the present disclosure.
  • an evaporation deposition system 10 for replacing a crucible is characterized in that a plurality of moving chambers 300 respectively accommodating an evaporation source 200 are selectively connected to a vacuum chamber 100 accommodating a substrate 1, and the evaporation deposition system 10 includes a vacuum chamber 100, an evaporation source 200, a moving chamber 300, and a connection chamber 400.
  • the evaporation deposition system 10 for replacing a crucible according to an exemplary embodiment of the present disclosure may be automatically controlled by a controller (not shown).
  • the vacuum chamber 100 is configured to form a vacuum state therein, and a transport track 120 for transporting the substrate 1 is provided in the vacuum chamber 100. Since the transport track 120 for transporting the substrate 1 is a well known technology as disclosed in Korean Patent Laid-Open Publication No. 2018-0005285, a detailed description thereof will be omitted.
  • the substrate 1 is provided in a standing state in the vacuum chamber 100.
  • a fourth opening is disposed in a wall facing the front of the substrate 1.
  • the fourth opening is a portion communicating with the connection chamber 400, and is opened or closed by a fourth on-off valve V4.
  • the fourth opening should be understood as a part of the fourth on-off valve V4.
  • the fourth on-off valve V4 is omitted to be illustrated.
  • a mask and a frame supporting the mask are installed in the front of the substrate 1.
  • a vapor deposition material is coated as the substrate 1 moves along the transport track 120.
  • a vapor deposition material is coated as the substrate 1 moves along the transport track 120 in the state where the evaporation source 200 is stopped.
  • a surface of the substrate 1 is coated with the deposition material made of a metallic material, or the like.
  • the metallic material may be made of metal, calcium, aluminum, barium, ruthenium, magnesium, silver, or the like.
  • the vacuum chamber 100 is selectively connected to or isolated from another chamber (not shown) by a gate valve 110.
  • the gate valve 110 is opened, the substrate 1 is moved to another chamber along the transport track 120 for subsequent processes.
  • the vacuum chamber 100 forms the vacuum state by a vacuum pump.
  • the evaporation source 200 supplies the vapor deposition material to the substrate 1, and is provided in the moving chamber 300.
  • the evaporation source 200 discharges the vapor deposition material on the front of the substrate 1 that moves in a horizontal direction along the transport track 120 in the state where the moving chamber 300 is stopped.
  • the evaporation source 200 is configured to include a distribution pipe 210, an evaporation crucible 220, and a support 230.
  • FIGS. 1 to 3 illustrate a type including a pair of distribution pipes 210 and a pair of evaporation crucibles 220 as the evaporation source 200 according to an exemplary embodiment of the present disclosure.
  • the deposition material contained in any one of the pair of evaporation crucibles 220 may be provided with silver (Ag), and the deposition material contained in any one may be provided with magnesium (Mg).
  • the distribution pipe 210 is configured to discharge the vapor deposition material through a nozzle 211 and is formed long in a longitudinal direction. An internal space that is long in the longitudinal direction is formed inside the distribution pipe 210.
  • the plurality of nozzles 211 are formed in the distribution pipe 210 along the length direction.
  • the distribution pipe 210 may be formed in a multilayer structure.
  • the distribution pipe 210 may have a multilayer structure including a first layer that forms a boundary of the internal space and is in contact with the vapor deposition material, a second layer in which a heater is installed, a third layer that reflects thermal energy of the heater toward the second layer, and a fourth layer that forms an outer surface of the distribution pipe 210 and through which a refrigerant flows, etc.
  • Such a multilayer structure of the distribution pipe 210 forms a structure to maximize thermal energy efficiency of the heater. Since the multilayer structure of the distribution pipe 210 is a well known technology as disclosed in Korean Patent Publication No. 685431, and No. 928136, a detailed description thereof will be omitted.
  • the evaporation crucible 220 is configured to accommodate the deposition material (not shown), and is disposed below the distribution pipe 210.
  • the evaporation crucible 220 may have a multilayer structure.
  • the evaporation crucible 220 may have a multilayer structure including a first layer in contact with a deposition material, a second layer in which a heater is installed, and a third layer that reflects thermal energy of the heater toward the second layer, etc.
  • the distribution pipe 210 is coupled to the evaporation crucible 220 through the connection part 212.
  • the connection part 212 is formed at a lower end part of the distribution pipe 210.
  • the connection part 212 means a pipe extending from the distribution pipe 210 toward the evaporation crucible 220.
  • a first flange Pl is formed at an upper end part of the evaporation crucible 220, and a second flange P2 is formed at a lower end part of the connection part 212.
  • the connection part 212 and the evaporation crucible 220 are connected by the flange connection structure.
  • the first flange Pl and the second flange P2 may form a coupling force by clamp or bolt fastening.
  • the support 230 supports the evaporation crucible 220 and the distribution pipe 210, and is movably mounted to the rail R.
  • the support 230 may be installed with a transmission device that forms a transport force along the rail R.
  • the support 230 is provided with an actuator 231 that elevates the evaporation crucible 220.
  • the actuator 231 is configured to form a force for elevating the evaporation crucible 220 and is provided as a hydraulic cylinder or a linear actuator.
  • a seating panel 232 is coupled to the upper end of the load of the actuator 231.
  • the evaporation crucible 220 is elevated by the actuator 231 in a state where the crucible is seated on the upper surface of the seating panel 232.
  • the seating panel 232 may be manufactured in the form of a plate.
  • FIG. 4B an upper surface of the first flange Pl is in close contact with a lower surface of the second flange P2.
  • the moving chamber 300 is configured to accommodate the evaporation source 200, and moves or stops along the rail R from the outside of the vacuum chamber 100.
  • the rail R for transporting the moving chamber 300 is provided on an outer bottom surface of the vacuum chamber 100.
  • the moving chamber 300 is movably mounted to the rail R through the support 230. Since the moving chamber 300 is mounted on the rail R, the moving chamber 300 is spaced apart from the bottom surface.
  • a partition wall 310 is disposed between the distribution pipe 210 and the evaporation crucible 220.
  • the partition wall 310 partitions the internal space of the moving chamber 300 up and down to block movement of gas between an upper space of the distribution pipe 210 and a lower space of the evaporation crucible 220.
  • the distribution pipe 210 is coupled to the evaporation crucible 220 through the connection part 212 passing through the partition wall 310. Therefore, the movement of gas between the upper space and the lower space based on the partition wall 310 is possible only through the distribution pipe 210.
  • the connection part 212 is provided with a gate valve (GV) to block the movement of gas. Therefore, when the gate valve GV is closed, the movement of gas between the upper space and the lower space based on the partition wall 310 is completely blocked.
  • GV gate valve
  • the support 230 may be installed with a transmission device that forms a transport force along the rail R.
  • the moving chamber 300 forms the vacuum state by a vacuum pump.
  • connection housings 300A are respectively coupled to both end parts of the moving chamber 300 in a moving direction, and the plurality of moving chambers 300 are connected by the connection housing 300Ato move integrally along the rail R.
  • the moving chamber 300 and the connection housing 300 A are manufactured in the form of a rectangular parallelepiped. Further, the moving chamber 300 and the connection housing 300 A form the same width in a width direction of the rail R. Therefore, as illustrated in FIG. 1, the moving chamber 300 and the connection housing 300A form a long rectangular parallelepiped shape along the length direction of the rail R in a coupled state.
  • the connection housing 300A may be manufactured integrally with the moving chamber 300.
  • connection chamber 400 is configured to connect the moving chamber 300 and the vacuum chamber 100, and is coupled to an outer wall surface of the vacuum chamber 100.
  • the vacuum chamber 100 and the connection chamber 400 are connected through the fourth opening when the fourth on-off valve V4 is opened.
  • the connection chamber 400 forms the vacuum state by the vacuum pump.
  • the rail R for transporting the moving chamber 300 is provided on an outer bottom surface of the vacuum chamber 100. As illustrated in FIG. 4, the rail R is formed to pass through an inner portion of the connection chamber 400. That is, the rail R is also disposed on an inner bottom surface of the connection chamber 400.
  • connection chamber 400 may be provided with a first entrance through which the moving chamber 300 goes into and out of.
  • the rail R is formed to pass through the inner portion of the connection chamber 400.
  • the first entrances are disposed respectively in both walls of the connection chamber 400 through which the rail R passes.
  • the reference numeral is not given to the first opening, the first opening should be understood as a part of the first contact member Dl.
  • the first entrance forms a rectangle shape, spaced apart from top and bottom surfaces of the moving chamber 300, the front surface (a surface facing the substrate 1), and the rear surface (a surface opposite to the front surface) of the moving chamber 300, respectively.
  • the upper part of the first entrance is not illustrated in FIG. 4, it may be understood that an upper part and a lower part of the first entrance are symmetrical based on the partition wall 310 approximately.
  • a first contact member Dl selectively in close contact with an outer surface of the connection housing 300A is formed at the first entrance. As illustrated in FIG. 4A, the first contact member Dl is configured to selectively seal the connection chamber 400, and is in close contact with an outer surface of the connection housing 300 A in a state where the moving chamber 300 is stopped. When the connection housing 300A is manufactured integrally with the moving chamber 300, the first contact member Dl is in close contact with the outer surface of the moving chamber 300.
  • the first contact member Dl is spaced apart from the outer surface of the moving chamber 300 and the connection housing 300A when the moving chamber 300 moves. It should be understood in FIGS. 1 and 3 that the first contact member Dl is in close contact with the outer surface of the connection housing 300 A in the state where the moving chamber 300 is stopped. It should be understood in FIG. 2 that the first contact member Dl is spaced apart from the outer surface of the connection housing 300 A in the process of moving the moving chamber 300.
  • the first contact member Dl is configured to include a side contact member Dl A and an upper and lower contact member D1B.
  • the side contact member Dl A is configured to be in close contact with both sides of the connection housing 300A, and is provided on the left and right of the first entrance, respectively.
  • FIG. 4 A illustrates a state in which the pair of side contact members Dl A are in close contact with left and right sides of the connection housing 300 A, respectively.
  • FIG. 4B illustrates a state in which the pair of side contact members Dl A are space apart from left and right sides of the connection housing 300 A, respectively.
  • the side contact member Dl A is manufactured in the form of a plate that is long in the longitudinal direction.
  • a packing for blocking a gap between the side contact member Dl A and the connection housing 300 A, and a packing for blocking a gap between the side contact member Dl A and the connection chamber 400 are mounted, respectively.
  • the pair of side contact members Dl A are in close contact with or spaced apart from the side surfaces of the connection housing 300Aby actuators 231, respectively.
  • the upper and lower contact member D1B is configured to be in close contact with upper and lower surfaces of the connection housing 300A, and is provided on the upper and lower sides of the first entrance, respectively.
  • FIG. 4A illustrates a state where the upper and lower contact member D1B are in close contact with the bottom of the connection housing 300A.
  • FIG. 4B illustrates a state where the upper and lower contact member D1B are spaced apart from the bottom of the connection housing 300A.
  • the upper and lower contact member D1B provided on the upper side of the first entrance is not illustrated in FIG. 4, the upper and lower contact member D1B may be understood as the same structure as the upper and lower contact member D1B provided on the lower side of the first entrance.
  • the rail R is not disposed at the point where the upper and lower contact member D1B is provided.
  • the upper and lower contact member D1B is manufactured in the form of a plate that is long in the horizontal direction.
  • a packing for blocking a gap between the upper and lower contact member D1B and the connection housing 300A, and a packing for blocking a gap between the upper and lower contact member D1B and the connection chamber 400 are mounted, respectively.
  • the pair of upper and lower contact members D1B are in close contact with or spaced apart from the upper and lower surfaces of the connection housing 300A by the actuator 231, respectively.
  • a first opening through which the vapor deposition material moves into the connection chamber 400 is disposed on the front of the moving chamber 300.
  • the first opening is a portion communicating with the connection chamber 400, and is opened or closed by a first on-off valve V 1.
  • the first opening should be understood as a part of the first on-off valve VI .
  • the first on-off valve VI is omitted to be illustrated.
  • Second openings are formed at both end parts of the moving chamber 300 in a moving direction, respectively.
  • the second opening is a portion that the evaporation crucible 220 enters and exits when the evaporation crucible 220 is replaced.
  • the connection housing 300A is provided with a second on-off valve V2 that opens and closes the second opening.
  • the connection housings 300 A are coupled to both end parts of the moving chamber 300 in a moving direction, respectively. Therefore, the internal space of the moving chamber 300 is connected to or isolated from an outer space by the second on-off valve V2.
  • FIGS. 1 to 3 for easy understanding of the state of use, the left moving chamber 300 is referred to as the first moving chamber 300, and the evaporation source 200 provided in the first moving chamber 300 is referred to as the first evaporation source 200. Further, in FIGS. 1 to 3, the right moving chamber 300 is referred to as a second moving chamber 300, and the evaporation source
  • a second evaporation source 200 provided in the second moving chamber 300 is referred to as a second evaporation source 200.
  • connection housing 300A of the first moving chamber 300 is referred to as a first connection housing 300 A
  • second connection housing 300A is referred to as a second connection housing 300A
  • the evaporation deposition system 10 for replacing a crucible may be automatically controlled by a controller (not shown).
  • the moving chamber 300 moves or stops along the rail R from the outside of the vacuum chamber 100.
  • the plurality of moving chambers 300 are connected by the connection housing 300 A to move integrally along the rail R.
  • the first contact member Dl is spaced apart from the outer surface of the moving chamber 300 and the connection housing 300 A when the moving chamber 300 moves.
  • the first opening, the second opening, and the fourth opening are closed.
  • the first contact member Dl is in close contact with the outer surfaces of the connection housings 300 A on both sides of the first moving chamber 300 in the state where the moving chamber 300 is stopped.
  • the vacuum chamber 100 is operated so that an inside of the connection chamber 400 is in the vacuum state.
  • the first on-off valve VI of the first moving chamber 300 and the fourth on-off valve V4 are opened.
  • the deposition material charged in the evaporation crucible 220 is heated by the heater, and the vapor deposition material is discharged toward the substrate 1 from the nozzle 211 of the distribution pipe 210.
  • the substrate is coated with the vapor deposition material while the substrate 1 moves along the transport track 120.
  • the first on-off valve VI of the first moving chamber 300, the gate valve GV of the first evaporation source 200, and the fourth on-off valve V4 are closed. Then, the first contact member Dl is spaced apart from the outer surfaces of connection housings 300A on both sides of the first moving chamber 300.
  • the moving chamber 300 moves along the rail R from the outside of the vacuum chamber 100.
  • the first contact member As illustrated in FIGS. 3 and 4A, the first contact member
  • connection chamber 400 is in close contact with the outer surfaces of the connection housings 300A on both sides of the second moving chamber 300 in the state where the moving chamber 300 is stopped.
  • the vacuum chamber 100 is operated so that an inside of the connection chamber 400 is in the vacuum state.
  • the first on-off valve VI of the second moving chamber 300 and the fourth on-off valve V4 are opened.
  • the deposition material charged in the evaporation crucible 220 is heated by the heater, and the vapor deposition material is discharged toward the substrate 1 from the nozzle 211 of the distribution pipe 210.
  • the substrate 1 is coated with the vapor deposition material while the substrate 1 moves along the transport track 120.
  • the second on-off valve V2 of the first connection housing 300A is opened, and the evaporation crucible 220 of the first evaporation source 200 is replaced.
  • the gate valve GV is closed, the movement of gas between the upper space and the lower space based on the partition wall 310 is completely blocked.
  • an inflow of external air is blocked in the upper space of the partition wall 310.
  • the second on-off valve V2 of the first connection housing 300A is closed. Then, the vacuum chamber 100 is operated so that the inside of the first moving chamber 300 is in the vacuum state again.
  • FIG. 9 is a schematic diagram of an evaporation deposition system for replacing a crucible according to yet another exemplary embodiment of the present disclosure.
  • the vacuum chamber 100 is provided on both sides based on the rail R.
  • the connection chamber 400 connects both vacuum chambers 100.
  • the pair of evaporation sources 200 are provided in the moving chamber 300 to discharge the vapor deposition material toward both vacuum chambers 100.
  • FIGS. 5 to 7 are schematic diagrams of the evaporation deposition system for replacing a crucible according to another exemplary embodiment of the present disclosure
  • FIGS. 8A and 8B are schematic side views of the evaporation deposition system for replacing a crucible according to another exemplary embodiment of the present disclosure.
  • an evaporation deposition system 20 for replacing a crucible is characterized in that a plurality of moving chambers 300 respectively accommodating an evaporation source 200 are selectively connected to a vacuum chamber 100 accommodating a substrate 1, and the evaporation deposition system 20 includes a vacuum chamber 100, an evaporation source 200, a moving chamber 300, and a connection chamber 400.
  • the evaporation deposition system 20 for replacing a crucible according to another exemplary embodiment of the present disclosure may be
  • the vacuum chamber 100 is configured to form the vacuum state therein, and a transport track 120 for transporting the substrate 1 is provided in the vacuum chamber 100. Since the transport track 120 for transporting the substrate 1 is a well known technology as disclosed in Korean Patent Laid-Open Publication No. 2018-0005285, a detailed description thereof will be omitted.
  • the substrate 1 is provided in a standing state in the vacuum chamber 100.
  • a fourth opening is formed in a wall facing the front of the substrate 1.
  • the fourth opening is a portion communicating with the connection chamber 400, and is opened or closed by a fourth opening and closing valve V4.
  • the fourth opening should be understood as a part of the fourth on-off valve V4.
  • the fourth on-off valve V4 is omitted to be illustrated.
  • a mask and a frame supporting the mask are installed in the front of the substrate 1.
  • the substrate 1 is coated with the vapor deposition material as the substrate 1 moves along the transport track 120 in the state where the evaporation source 200 is stopped.
  • a surface of the substrate 1 is coated with the deposition material made of a metallic material, or the like.
  • the metallic material may be made of metal, calcium, aluminum, barium, ruthenium, magnesium, silver, or the like.
  • the vacuum chamber 100 is selectively connected to or isolated from another chamber (not shown) by a gate valve 110.
  • the gate valve 110 is opened, the substrate 1 is moved to another chamber along the transport track 120 for subsequent processes.
  • the vacuum chamber 100 forms the vacuum state by a vacuum pump.
  • the evaporation source 200 supplies the vapor deposition material to the substrate 1, and is provided in the moving chamber 300.
  • the evaporation source 200 discharges the vapor deposition material on the front of the substrate 1 that moves horizontally along the transport track 120 while the moving chamber 300 is stopped.
  • the evaporation source 200 comprises a distribution pipe 210, an evaporation crucible 220, and a support 230.
  • FIGS. 5 to 7 illustrate a type including a pair of distribution pipes 210 and a pair of evaporation crucibles 220 as the evaporation source 200 according to another exemplary
  • the deposition material contained in any one of the pair of evaporation crucibles 220 may be provided with silver (Ag), and the deposition material contained in another one may be provided with magnesium (Mg).
  • the distribution pipe 210 is configured to discharge the vapor deposition material through a nozzle 211 and is formed long in the longitudinal direction.
  • An internal space that is long in a longitudinal direction is formed inside the distribution pipe 210.
  • the plurality of nozzles 211 are formed in the distribution pipe 210 along the length direction.
  • the distribution pipe 210 may be formed in a multilayer structure.
  • the distribution pipe 210 may have a multilayer structure including a first layer that forms a boundary of the internal space and is in contact with the vapor deposition material, a second layer in which a heater is installed, a third layer that reflects thermal energy of the heater toward the second layer, and a fourth layer that forms an outer surface of the distribution pipe 210 and through which a refrigerant flows, etc.
  • Such a multilayer structure of the distribution pipe 210 forms a structure to maximize thermal energy efficiency of the heater. Since the multilayer structure of the distribution pipe 210 is a well known technology as disclosed in Korean Patent Publication No. 685431, and No. 928136, a detailed description thereof will be omitted.
  • the evaporation crucible 220 is configured to accommodate the deposition material (not shown), and is disposed below the distribution pipe 210.
  • the evaporation crucible 220 may have a multilayer structure.
  • the evaporation crucible 220 may have a multilayer structure including a first layer in contact with a deposition material, a second layer in which a heater is installed, and a third layer that reflects thermal energy of the heater toward the second layer, etc.
  • the distribution pipe 210 is coupled to the evaporation crucible 220 through the connection part 212.
  • the connection part 212 is formed at a lower end part of the distribution pipe 210.
  • the connection part 212 means a pipe extending from the distribution pipe 210 toward the evaporation crucible 220.
  • a first flange Pl is formed at an upper end part of the evaporation crucible 220, and a second flange P2 is formed at a lower end part of the connection part 212.
  • the connection part 212 and the evaporation crucible 220 are connected by the flange connection structure.
  • the first flange Pl and the second flange P2 may form a coupling force by clamp or bolt fastening.
  • the support 230 supports the evaporation crucible 220 and the distribution pipe 210, and is movably mounted to the rail R.
  • the support 230 may be installed with a transmission device that forms a transport force along the rail (R).
  • the support 230 is provided with an actuator 231 that elevates the evaporation crucible 220.
  • the actuator 231 is configured to form a force for elevating the evaporation crucible 220 and is provided as a hydraulic cylinder or a linear actuator.
  • a seating panel 232 is coupled to the upper end of the load of the actuator 231.
  • the evaporation crucible 220 is elevated by the actuator 231 in a state where the crucible is seated on the upper surface of the seating panel 232.
  • the seating panel 232 may be manufactured in the form of a plate.
  • the moving chamber 300 is configured to accommodate the evaporation source 200, and moves or stops along the rail R from the outside of the vacuum chamber 100.
  • the rail (R) for transporting the moving chamber 300 is provided on an outer bottom surface of the vacuum chamber 100.
  • the moving chamber 300 is movably mounted to the rail R through the support 230. Since the moving chamber 300 is mounted on the rail R, the moving chamber 300 is spaced apart from the bottom surface.
  • a partition wall 310 is disposed between the distribution pipe 210 and the evaporation crucible 220.
  • the partition wall 310 partitions the internal space of the moving chamber 300 up and down to block movement of gas between an upper space of the distribution pipe 210 and a lower space of the evaporation crucible 220.
  • the distribution pipe 210 is coupled to the evaporation crucible 220 through the connection part 212 passing through the partition wall 310. Therefore, the movement of gas between the upper space and the lower space based on the partition wall 310 is possible only through the distribution pipe 210.
  • the connection part 212 is provided with a gate valve (GV) to block the gas movement. Therefore, when the gate valve GV is closed, the movement of gas between the upper space and the lower space based on the partition wall 310 is completely blocked.
  • GV gate valve
  • the support 230 may be installed with a transmission device that forms a transport force along the rail R.
  • the moving chamber 300 forms the vacuum state by a vacuum pump.
  • connection housings 300A are respectively coupled to both end parts of the moving chamber 300 in a moving direction, and the plurality of moving chambers
  • connection housing 300A are connected by the connection housing 300Ato move integrally along the rail R.
  • the moving chamber 300 and the connection housing 300 A are manufactured in the form of a rectangular parallelepiped. Further, the moving chamber 300 and the connection housing 300 A form the same width in a width direction of the rail R. Therefore, as illustrated in FIG. 5, the moving chamber 300 and the connection housing 300A form a long rectangular parallelepiped shape along the length direction of the rail R in a coupled state.
  • the connection housing 300A may be manufactured integrally with the moving chamber 300.
  • connection chamber 400 is configured to connect the moving chamber 300 and the vacuum chamber 100, and is coupled to an outer wall surface of the vacuum chamber 100.
  • the vacuum chamber 100 and the connection chamber 400 are connected through the fourth opening when the fourth on-off valve V4 is opened.
  • the connection chamber 400 forms the vacuum state by a vacuum pump.
  • connection chamber 400 is provided with a second entrance facing the front of the moving chamber 300.
  • the second opening should be understood as a part of the second contact member D2.
  • a second contact member D2 selectively in close contact with the front of the moving chamber 300 and the connection housing 300A is formed at the second entrance. As illustrated in FIG. 8A, the second contact member D2 is configured to selectively seal the connection chamber 400, and is in close contact with the front of the moving chamber 300 and the connection housing 300A in a state where the moving chamber 300 is stopped. When the connection housing 300A is manufactured integrally with the moving chamber 300, the second contact member D2 is in close contact with the front of the moving chamber 300.
  • the second contact member D2 is spaced apart from the front of the moving chamber 300 and the connection housing 300A when the moving chamber 300 moves.
  • the second contact member D2 is in close contact with the front of the moving chamber 300 and the connection housing 300 A in the state where the moving chamber 300 is stopped. It should be understood in FIG. 6 that the second contact member D2 is spaced apart from the front of the moving chamber 300 and the connection housing 300Ain the process of moving the moving chamber 300.
  • the second entrance is formed in a rectangular shape
  • the second contact member D2 is formed in a square pipe shape.
  • the second contact member D2 is in close contact with or spaced apart from the front of the moving chamber 300 and the connection housing 300 A by the actuator 231.
  • the front surface of the moving chamber 300 is provided with a first opening through which the vapor deposition material moves into the connection chamber 400.
  • the first opening is a portion communicating with the connection chamber 400, and is opened or closed by a first on-off valve VI .
  • the first opening should be understood as a part of the first on-off valve VI .
  • the first on- off valve VI is omitted to be illustrated.
  • a third opening is disposed on the rear of the moving chamber 300.
  • the third opening is a portion that the evaporation crucible 220 enters and exits when the evaporation crucible 220 is replaced, and is opened or closed by the third on-off V3.
  • the third opening should be understood as a part of the third on-off valve V3.
  • the state of use of the evaporation deposition system 20 for replacing a crucible is described.
  • the left moving chamber 300 is referred to as the first moving chamber 300
  • the evaporation source 200 provided in the first moving chamber 300 is referred to as the first evaporation source 200.
  • the right moving chamber 300 is referred to as a second moving chamber 300
  • the evaporation source 200 provided in the second moving chamber 300 is referred to as a second evaporation source 200.
  • connection housing 300A of the first moving chamber 300 is referred to as a first connection housing 300 A
  • second connection housing 300A the left connection housing 300A of the second moving chamber 300
  • the evaporation deposition system 20 for replacing a crucible may be automatically controlled by a controller (not shown).
  • the moving chamber 300 moves or stops along the rail R from the outside of the vacuum chamber 100.
  • the plurality of moving chambers 300 are connected by the connection housing 300 A to move integrally along the rail R.
  • the second contact member D2 is spaced apart from the outer surface of the moving chamber 300 and the connection housing 300 A when the moving chamber 300 moves.
  • the second contact member D2 is in close contact with the front of the moving chamber 300 and the connection housing 300Ain the state where the moving chamber 300 is stopped.
  • the vacuum chamber 100 is operated so that an inside of the connection chamber 400 is in the vacuum state.
  • the first on- ofif valve VI of the first moving chamber 300 and the fourth on-off valve V4 are opened.
  • the deposition material charged in the evaporation crucible 220 is heated by the heater, and the vapor deposition material is discharged toward the substrate 1 from the nozzle 211 of the distribution pipe 210.
  • the substrate is coated with the vapor deposition material while the substrate 1 moves along the transport track 120.
  • the first on-off valve VI of the first moving chamber 300, the gate valve GV of the first evaporating source 200, and the fourth on-off valve V4 are closed. Then, the second contact member D2 is spaced apart from the front of the first moving chamber 300 and the connection housings 300 A.
  • the moving chamber 300 moves along the rail R from the outside of the vacuum chamber 100.
  • the second contact member D2 is in close contact with the front of the second moving chamber 300 and the connection housing 300A in the state where the moving chamber 300 is stopped.
  • the vacuum chamber 100 is operated so that an inside of the connection chamber 400 is in the vacuum state.
  • the first on-off valve VI of the second moving chamber 300 and the fourth on- off valve V4 are opened.
  • the deposition material charged in the evaporation crucible 220 is heated by the heater, and the vapor deposition material is discharged toward the substrate 1 from the nozzle
  • the substrate 1 is coated with the vapor deposition material while the substrate 1 moves along the transport track 120.
  • the third on-off valve V3 of the first moving chamber 300 is opened, and the evaporation crucible 220 of the first evaporation source 200 is replaced.
  • the gate valve GV in the state where the gate valve GV is closed, the movement of gas between the upper space and the lower space based on the partition wall 310 is completely blocked.
  • an inflow of external air is blocked in the upper space based on the partition wall 310.
  • the third on-off valve V3 of the first moving chamber 300 is closed. Then, the vacuum chamber 100 is operated so that the inside of the first moving chamber 300 is in the vacuum state again.

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Abstract

Disclosed herein is an evaporation deposition system for replacing a crucible including:a vacuum chamber configured to accommodate a substrate; an evaporation source configured to supply a vapor deposition material to the substrate; a plurality of moving chambers, each configured to move along a rail and to accomodate the evaporation source; and a connection chamber configured to connect the moving chambers and the vacuum chamber, wherein a front surface of each of the moving chambers is provided with a a first opening, through which the vapor deposition material moves into the connection chamber, and a first on-off valve that opens and closes the first opening.

Description

EVAPORATION DEPOSITION SYSTEM FOR REPLACING CRUCIBLE
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is based upon and claims the benefit of priority from Korean Patent Applications No. 2018-0127647 filed on October 24, 2018, the entire contents of which are incorporated herein by reference.
TECHNICAL FIELD
[0002] The present disclosure relates to an evaporation deposition system for replacing a crucible, and more particularly, to an evaporation deposition system for replacing a crucible by evaporating an organic material, an inorganic material, a metal, etc., to form a thin film on a surface of a substrate.
BACKGROUND
[0003] A vaporizer is a device that forms a thin film on a surface of a substrate such as a wafer for manufacturing a semiconductor, a substrate for manufacturing a liquid crystal display (LCD), a substrate for manufacturing an organic light emitting diode (OLED), etc., by employing a method such as chemical vapor deposition (CVD), physical vapor deposition (PVD), evaporation deposition, etc.
[0004] In addition, in the case of the substrate for manufacturing the OLED, a process of forming a thin film on the surface of the substrate by evaporating an organic material, an inorganic material, a metal, etc., is employed in deposition of a deposition material. In the vacuum chamber in which the deposition process is performed, an evaporation source, a glass substrate, a mask, an alignment device, etc., may be provided.
[0005] An OLED vaporizer that forms a thin film by evaporating the deposition material
(evaporation material) may include a deposition chamber in which the deposition substrate is vertically loaded, and a source installed inside the deposition chamber and heating and evaporating the deposition material so as to evaporate the deposition material with respect to the substrate, wherein the deposition material is evaporated to form a thin film on the substrate surface. [0006] Further, the source may include an evaporation vessel (a crucible) that accommodates the deposition material, a heater that heats the evaporation vessel, a tube coupled to the evaporation vessel, and a plurality of nozzles that protrude toward the substrate and are in communication with the tube.
[0007] There are various problems in depositing deposition materials on the OLED substrate. As an example, the deposition material is limitedly accommodated within the evaporation vessel depending on capacity of the evaporation vessel, wherein since the capacity of the evaporation vessel is less than the total amount of deposition material used to form a thin film with a desired level on a large substrate, a crucible should be replaced several to several tens of times in order to deposit the thin film of deposition material to the desired level on the large substrate.
[0008] The source heats and evaporates the deposition material in the vacuum chamber, but the crucible replacement is performed outside the vacuum chamber, and thus it takes a lot of energy and time to take out multiple sources several to several tens of times alternately and then reload the sources after the crucible replacement.
SUMMARY
[0009] In view of the above, an object of the present disclosure is to provide an evaporation deposition system for replacing a crucible capable of depositing a thin film on a large substrate using a minimum source, and facilitating crucible replacement.
[0010] According to one embodiment of the present disclosure, provided is an evaporation deposition system for replacing a crucible including: a vacuum chamber configured to
accommodate a substrate; an evaporation source configured to supply a vapor deposition material to the substrate; a plurality of moving chambers, each configured to accommodate the evaporation source and to move along a rail; and a connection chamber configured to connect the moving chambers and the vacuum chamber, wherein a front surface of each of the moving chambers is provided with a first opening through which the vapor deposition material moves into the connection chamber and a first on-off valve that opens and closes the first opening.
[0011] The connection chamber is provided with a first entrance through which the moving chambers go in and out of the connection chamber, and a first contact member, which is selectively in contact with an outer surface of the moving chambers, may be disposed in the first entrance.
[0012] Connection housings may be respectively coupled to both end parts of each of the moving chambers in a moving direction, the plurality of moving chambers may be connected by the connection housings to move integrally, the connection chamber isprovided with a first entrance through which the moving chambers and the connection housings go into and out of the connection chamber, and a first contact member, which is selectively in close contact with outer surfaces of the connection housings, may be disposed in the first entrance.
[0013] Second openings may be respectively disposed in both end parts of each of the moving chambers in the moving direction, and each of the connection housings is provided with a second on-off valve that opens and closes the second opening.
[0014] The evaporation source may include a distribution pipe configured to eject the vapor deposition material through a nozzle; an evaporation crucible coupled to the distribution pipe and configured to accommodate the vapor deposition material; a support movably mounted to the rail; and an actuator installed on the support to elevate and lower the evaporation crucible, and the evaporation crucible may enter and exit through the second opening.
[0015] In the moving chamber, a partition wall may be disposed in each of the moving chambers between the distribution pipe and the evaporation crucible, the distribution pipe may be coupled to the evaporation crucible through a connection part passing through the partition wall, and a gate valve may be disposed in the connection part.
[0016] The connection chamber is provided with a second entrance facing front surfaces of the moving chambers, and a second contact member, which is selectively in close contact with the front surfaces of the moving chambers, may be disposed in the second entrance.
[0017] Connection housings may be respectively coupled to both end parts of each of the moving chambers in a moving direction, the plurality of moving chambers may be connected by the connection housings to move integrally, the connection chamber is provided with a second entrance facing the front surfaces of the moving chambers and the connection chambers, and a second contact member, which is selectively in close contact with the front surfaces of the moving chambers and the connection housings, may be disposed in the second entrance.
[0018] A rear surface of each of the moving chambers is provided with a third opening, through which the evaporation crucible of the evaporation source goes in and out of each of the moving chambers and a third on-off valve that opens and closes the third opening.
[0019] The the vacuum chamber is provided with a fourth opening, through which the vacuum chamber communicates with the connection chambers and a fourth on-off valve that opens and closes the fourth opening.
[0020] According to the evaporation deposition system for replacing a crucible according to exemplary embodiments of the present disclosure, it is possible to deposit the thin film on the large substrate using the minimum source and to facilitate crucible replacement by moving the plurality of moving chambers, each accommodating an evaporation source, along the rail, and connecting the moving chamber and the vacuum chamber by the connection chamber.
BRIEF DESCRIPTION OF THE DRAWINGS
[0021] FIGS. 1 to 3 are schematic diagrams of an evaporation deposition system for replacing a crucible according to an exemplary embodiment of the present disclosure;
[0022] FIGS. 4 A and 4B are schematic side views of the evaporation deposition system for replacing a crucible according to an exemplary embodiment of the present disclosure;
[0023] FIGS. 5 to 7 are schematic diagrams of an evaporation deposition system for replacing a crucible according to another exemplary embodiment of the present disclosure;
[0024] FIGS. 8 A and 8B are schematic side views of the evaporation deposition system for replacing a crucible according to another exemplary embodiment of the present disclosure; and [0025] FIG. 9 is a schematic diagram of an evaporation deposition system for replacing a crucible according to yet another exemplary embodiment of the present disclosure.
DETAILED DESCRIPTION
[0026] Hereinafter, exemplary embodiments of the present disclosure will be specifically described with reference to the accompanying drawings in order to describe the present disclosure in more detail. Like reference numerals denote like elements throughout the specification.
[0027] FIGS. 1 to 3 are schematic diagrams of an evaporation deposition system for replacing a crucible according to an exemplary embodiment of the present disclosure, and FIGS. 4A and 4B are schematic side views of the evaporation deposition system for replacing a crucible according to an exemplary embodiment of the present disclosure.
[0028] As illustrated in FIGS. 1 to 4, an evaporation deposition system 10 for replacing a crucible according to an exemplary embodiment of the present disclosure is characterized in that a plurality of moving chambers 300 respectively accommodating an evaporation source 200 are selectively connected to a vacuum chamber 100 accommodating a substrate 1, and the evaporation deposition system 10 includes a vacuum chamber 100, an evaporation source 200, a moving chamber 300, and a connection chamber 400. The evaporation deposition system 10 for replacing a crucible according to an exemplary embodiment of the present disclosure may be automatically controlled by a controller (not shown).
[0029] As illustrated in FIGS. 1 to 3, the vacuum chamber 100 is configured to form a vacuum state therein, and a transport track 120 for transporting the substrate 1 is provided in the vacuum chamber 100. Since the transport track 120 for transporting the substrate 1 is a well known technology as disclosed in Korean Patent Laid-Open Publication No. 2018-0005285, a detailed description thereof will be omitted.
[0030] As shown in FIGS. 1 to 3, the substrate 1 is provided in a standing state in the vacuum chamber 100. In the vacuum chamber 100, a fourth opening is disposed in a wall facing the front of the substrate 1. The fourth opening is a portion communicating with the connection chamber 400, and is opened or closed by a fourth on-off valve V4. Although the reference numeral is not given to the fourth opening, the fourth opening should be understood as a part of the fourth on-off valve V4. In FIG. 4, the fourth on-off valve V4 is omitted to be illustrated.
[0031] Although not illustrated, a mask and a frame supporting the mask are installed in the front of the substrate 1. In the evaporation deposition system 10 for replacing a crucible according to the exemplary embodiment of the present disclosure, a vapor deposition material is coated as the substrate 1 moves along the transport track 120. Yet further, additionally or alternatively, in the evaporation deposition system 10 for replacing a crucible according to the exemplary embodiment of the present disclosure, a vapor deposition material is coated as the substrate 1 moves along the transport track 120 in the state where the evaporation source 200 is stopped.
[0032] A surface of the substrate 1 is coated with the deposition material made of a metallic material, or the like. The metallic material may be made of metal, calcium, aluminum, barium, ruthenium, magnesium, silver, or the like.
[0033] As illustrated in FIGS. 1 to 3, the vacuum chamber 100 is selectively connected to or isolated from another chamber (not shown) by a gate valve 110. When the deposition of the deposition material is completed, the gate valve 110 is opened, the substrate 1 is moved to another chamber along the transport track 120 for subsequent processes. Although not illustrated, the vacuum chamber 100 forms the vacuum state by a vacuum pump.
[0034] The evaporation source 200 supplies the vapor deposition material to the substrate 1, and is provided in the moving chamber 300. The evaporation source 200 discharges the vapor deposition material on the front of the substrate 1 that moves in a horizontal direction along the transport track 120 in the state where the moving chamber 300 is stopped. The evaporation source 200 is configured to include a distribution pipe 210, an evaporation crucible 220, and a support 230.
[0035] FIGS. 1 to 3 illustrate a type including a pair of distribution pipes 210 and a pair of evaporation crucibles 220 as the evaporation source 200 according to an exemplary embodiment of the present disclosure. For example, the deposition material contained in any one of the pair of evaporation crucibles 220 may be provided with silver (Ag), and the deposition material contained in any one may be provided with magnesium (Mg).
[0036] As illustrated in FIG. 4, the distribution pipe 210 is configured to discharge the vapor deposition material through a nozzle 211 and is formed long in a longitudinal direction. An internal space that is long in the longitudinal direction is formed inside the distribution pipe 210.
The plurality of nozzles 211 are formed in the distribution pipe 210 along the length direction.
[0037] Although not illustrated in detail, the distribution pipe 210 may be formed in a multilayer structure. For example, the distribution pipe 210 may have a multilayer structure including a first layer that forms a boundary of the internal space and is in contact with the vapor deposition material, a second layer in which a heater is installed, a third layer that reflects thermal energy of the heater toward the second layer, and a fourth layer that forms an outer surface of the distribution pipe 210 and through which a refrigerant flows, etc.
[0038] Such a multilayer structure of the distribution pipe 210 forms a structure to maximize thermal energy efficiency of the heater. Since the multilayer structure of the distribution pipe 210 is a well known technology as disclosed in Korean Patent Publication No. 685431, and No. 928136, a detailed description thereof will be omitted.
[0039] As illustrated in FIG. 4, the evaporation crucible 220 is configured to accommodate the deposition material (not shown), and is disposed below the distribution pipe 210. Although not illustrated in detail, the evaporation crucible 220 may have a multilayer structure. For example, the evaporation crucible 220 may have a multilayer structure including a first layer in contact with a deposition material, a second layer in which a heater is installed, and a third layer that reflects thermal energy of the heater toward the second layer, etc.
[0040] The distribution pipe 210 is coupled to the evaporation crucible 220 through the connection part 212. The connection part 212 is formed at a lower end part of the distribution pipe 210. The connection part 212 means a pipe extending from the distribution pipe 210 toward the evaporation crucible 220. A first flange Pl is formed at an upper end part of the evaporation crucible 220, and a second flange P2 is formed at a lower end part of the connection part 212. The connection part 212 and the evaporation crucible 220 are connected by the flange connection structure. Although not illustrated, the first flange Pl and the second flange P2 may form a coupling force by clamp or bolt fastening.
[0041] As illustrated in FIGS. 1 to 4, the support 230 supports the evaporation crucible 220 and the distribution pipe 210, and is movably mounted to the rail R. Referring to Korean Patent Laid- Open Publication No. 2018-0005285, the support 230 may be installed with a transmission device that forms a transport force along the rail R.
[0042] As illustrated in FIG. 4, the support 230 is provided with an actuator 231 that elevates the evaporation crucible 220. The actuator 231 is configured to form a force for elevating the evaporation crucible 220 and is provided as a hydraulic cylinder or a linear actuator. The actuator
231 forms a structure in which a load is elevated by hydraulic pressure or a driving force of a motor.
A seating panel 232 is coupled to the upper end of the load of the actuator 231. The evaporation crucible 220 is elevated by the actuator 231 in a state where the crucible is seated on the upper surface of the seating panel 232. The seating panel 232 may be manufactured in the form of a plate. When the evaporation crucible 220 is elevated by the actuator 231 in the state illustrated in
FIG. 4B, an upper surface of the first flange Pl is in close contact with a lower surface of the second flange P2.
[0043] As illustrated in FIGS. 1 to 4, the moving chamber 300 is configured to accommodate the evaporation source 200, and moves or stops along the rail R from the outside of the vacuum chamber 100. The rail R for transporting the moving chamber 300 is provided on an outer bottom surface of the vacuum chamber 100. The moving chamber 300 is movably mounted to the rail R through the support 230. Since the moving chamber 300 is mounted on the rail R, the moving chamber 300 is spaced apart from the bottom surface.
[0044] As illustrated in FIG. 4, in the moving chamber 300, a partition wall 310 is disposed between the distribution pipe 210 and the evaporation crucible 220. The partition wall 310 partitions the internal space of the moving chamber 300 up and down to block movement of gas between an upper space of the distribution pipe 210 and a lower space of the evaporation crucible 220. The distribution pipe 210 is coupled to the evaporation crucible 220 through the connection part 212 passing through the partition wall 310. Therefore, the movement of gas between the upper space and the lower space based on the partition wall 310 is possible only through the distribution pipe 210. The connection part 212 is provided with a gate valve (GV) to block the movement of gas. Therefore, when the gate valve GV is closed, the movement of gas between the upper space and the lower space based on the partition wall 310 is completely blocked.
[0045] As described above, the support 230 may be installed with a transmission device that forms a transport force along the rail R. Although not illustrated, the moving chamber 300 forms the vacuum state by a vacuum pump.
[0046] As illustrated in FIGS. 1 to 3, connection housings 300A are respectively coupled to both end parts of the moving chamber 300 in a moving direction, and the plurality of moving chambers 300 are connected by the connection housing 300Ato move integrally along the rail R. The moving chamber 300 and the connection housing 300 A are manufactured in the form of a rectangular parallelepiped. Further, the moving chamber 300 and the connection housing 300 A form the same width in a width direction of the rail R. Therefore, as illustrated in FIG. 1, the moving chamber 300 and the connection housing 300A form a long rectangular parallelepiped shape along the length direction of the rail R in a coupled state. Although not illustrated, the connection housing 300A may be manufactured integrally with the moving chamber 300. [0047] As illustrated in FIGS. 1 to 3, the connection chamber 400 is configured to connect the moving chamber 300 and the vacuum chamber 100, and is coupled to an outer wall surface of the vacuum chamber 100. The vacuum chamber 100 and the connection chamber 400 are connected through the fourth opening when the fourth on-off valve V4 is opened. Although not illustrated, the connection chamber 400 forms the vacuum state by the vacuum pump.
[0048] As described above, the rail R for transporting the moving chamber 300 is provided on an outer bottom surface of the vacuum chamber 100. As illustrated in FIG. 4, the rail R is formed to pass through an inner portion of the connection chamber 400. That is, the rail R is also disposed on an inner bottom surface of the connection chamber 400.
[0049] As illustrated in FIGS. 1 to 4, the connection chamber 400 may be provided with a first entrance through which the moving chamber 300 goes into and out of. As described above, the rail R is formed to pass through the inner portion of the connection chamber 400. Thus, the first entrances are disposed respectively in both walls of the connection chamber 400 through which the rail R passes. Although the reference numeral is not given to the first opening, the first opening should be understood as a part of the first contact member Dl.
[0050] As illustrated in FIG. 4, the first entrance forms a rectangle shape, spaced apart from top and bottom surfaces of the moving chamber 300, the front surface (a surface facing the substrate 1), and the rear surface (a surface opposite to the front surface) of the moving chamber 300, respectively. Although the upper part of the first entrance is not illustrated in FIG. 4, it may be understood that an upper part and a lower part of the first entrance are symmetrical based on the partition wall 310 approximately.
[0051] A first contact member Dl selectively in close contact with an outer surface of the connection housing 300A is formed at the first entrance. As illustrated in FIG. 4A, the first contact member Dl is configured to selectively seal the connection chamber 400, and is in close contact with an outer surface of the connection housing 300 A in a state where the moving chamber 300 is stopped. When the connection housing 300A is manufactured integrally with the moving chamber 300, the first contact member Dl is in close contact with the outer surface of the moving chamber 300.
[0052] As illustrated in FIG. 4B, the first contact member Dl is spaced apart from the outer surface of the moving chamber 300 and the connection housing 300A when the moving chamber 300 moves. It should be understood in FIGS. 1 and 3 that the first contact member Dl is in close contact with the outer surface of the connection housing 300 A in the state where the moving chamber 300 is stopped. It should be understood in FIG. 2 that the first contact member Dl is spaced apart from the outer surface of the connection housing 300 A in the process of moving the moving chamber 300. The first contact member Dl is configured to include a side contact member Dl A and an upper and lower contact member D1B.
[0053] The side contact member Dl A is configured to be in close contact with both sides of the connection housing 300A, and is provided on the left and right of the first entrance, respectively. FIG. 4 A illustrates a state in which the pair of side contact members Dl A are in close contact with left and right sides of the connection housing 300 A, respectively. FIG. 4B illustrates a state in which the pair of side contact members Dl A are space apart from left and right sides of the connection housing 300 A, respectively.
[0054] The side contact member Dl A is manufactured in the form of a plate that is long in the longitudinal direction. In the side contact member Dl A, a packing for blocking a gap between the side contact member Dl A and the connection housing 300 A, and a packing for blocking a gap between the side contact member Dl A and the connection chamber 400 are mounted, respectively. Although not illustrated, the pair of side contact members Dl A are in close contact with or spaced apart from the side surfaces of the connection housing 300Aby actuators 231, respectively.
[0055] The upper and lower contact member D1B is configured to be in close contact with upper and lower surfaces of the connection housing 300A, and is provided on the upper and lower sides of the first entrance, respectively. FIG. 4A illustrates a state where the upper and lower contact member D1B are in close contact with the bottom of the connection housing 300A. FIG. 4B illustrates a state where the upper and lower contact member D1B are spaced apart from the bottom of the connection housing 300A. Although the upper and lower contact member D1B provided on the upper side of the first entrance is not illustrated in FIG. 4, the upper and lower contact member D1B may be understood as the same structure as the upper and lower contact member D1B provided on the lower side of the first entrance. The rail R is not disposed at the point where the upper and lower contact member D1B is provided. [0056] The upper and lower contact member D1B is manufactured in the form of a plate that is long in the horizontal direction. In the upper and lower contact member D1B, a packing for blocking a gap between the upper and lower contact member D1B and the connection housing 300A, and a packing for blocking a gap between the upper and lower contact member D1B and the connection chamber 400 are mounted, respectively. Although not illustrated, the pair of upper and lower contact members D1B are in close contact with or spaced apart from the upper and lower surfaces of the connection housing 300A by the actuator 231, respectively.
[0057] As illustrated in FIGS. 1 to 3, a first opening through which the vapor deposition material moves into the connection chamber 400 is disposed on the front of the moving chamber 300. The first opening is a portion communicating with the connection chamber 400, and is opened or closed by a first on-off valve V 1. Although the reference numeral is not given to the first opening, the first opening should be understood as a part of the first on-off valve VI . In FIG. 4, the first on-off valve VI is omitted to be illustrated.
[0058] Second openings are formed at both end parts of the moving chamber 300 in a moving direction, respectively. The second opening is a portion that the evaporation crucible 220 enters and exits when the evaporation crucible 220 is replaced. The connection housing 300A is provided with a second on-off valve V2 that opens and closes the second opening. As described above, the connection housings 300 A are coupled to both end parts of the moving chamber 300 in a moving direction, respectively. Therefore, the internal space of the moving chamber 300 is connected to or isolated from an outer space by the second on-off valve V2.
[0059] Hereinafter, the state of use of the evaporation deposition system 10 for replacing a crucible according to an exemplary embodiment of the present disclosure is described. Hereinafter, in
FIGS. 1 to 3, for easy understanding of the state of use, the left moving chamber 300 is referred to as the first moving chamber 300, and the evaporation source 200 provided in the first moving chamber 300 is referred to as the first evaporation source 200. Further, in FIGS. 1 to 3, the right moving chamber 300 is referred to as a second moving chamber 300, and the evaporation source
200 provided in the second moving chamber 300 is referred to as a second evaporation source 200.
In addition, in FIGS. 1 to 3, the left connection housing 300A of the first moving chamber 300 is referred to as a first connection housing 300 A, and the right connection housing 300 A of the second moving chamber 300 is referred to as a second connection housing 300A.
[0060] The evaporation deposition system 10 for replacing a crucible according to an exemplary embodiment of the present disclosure may be automatically controlled by a controller (not shown).
[0061] As illustrated in FIGS. 1 to 3, the moving chamber 300 moves or stops along the rail R from the outside of the vacuum chamber 100. The plurality of moving chambers 300 are connected by the connection housing 300 A to move integrally along the rail R. As illustrated in FIGS. 2 and 4B, the first contact member Dl is spaced apart from the outer surface of the moving chamber 300 and the connection housing 300 A when the moving chamber 300 moves. When the moving chamber 300 moves, the first opening, the second opening, and the fourth opening are closed.
[0062] As illustrated in FIGS. 1 and 4A, the first contact member Dl is in close contact with the outer surfaces of the connection housings 300 A on both sides of the first moving chamber 300 in the state where the moving chamber 300 is stopped. When the first contact member Dl seals the connection chamber 400, the vacuum chamber 100 is operated so that an inside of the connection chamber 400 is in the vacuum state. When the inside of the connection chamber 400 is in the vacuum state, the first on-off valve VI of the first moving chamber 300 and the fourth on-off valve V4 are opened.
[0063] In this state, the deposition material charged in the evaporation crucible 220 is heated by the heater, and the vapor deposition material is discharged toward the substrate 1 from the nozzle 211 of the distribution pipe 210. In the state where the first evaporation source 200 is stopped, the substrate is coated with the vapor deposition material while the substrate 1 moves along the transport track 120. When the deposition material charged in the evaporation crucible 220 is exhausted, the first on-off valve VI of the first moving chamber 300, the gate valve GV of the first evaporation source 200, and the fourth on-off valve V4 are closed. Then, the first contact member Dl is spaced apart from the outer surfaces of connection housings 300A on both sides of the first moving chamber 300.
[0064] As illustrated in FIGS. 2 to 3, the moving chamber 300 moves along the rail R from the outside of the vacuum chamber 100. As illustrated in FIGS. 3 and 4A, the first contact member
Dl is in close contact with the outer surfaces of the connection housings 300A on both sides of the second moving chamber 300 in the state where the moving chamber 300 is stopped. When the first contact member Dl seals the connection chamber 400, the vacuum chamber 100 is operated so that an inside of the connection chamber 400 is in the vacuum state. When the inside of the connection chamber 400 is in the vacuum state, the first on-off valve VI of the second moving chamber 300 and the fourth on-off valve V4 are opened.
[0065] In this state, the deposition material charged in the evaporation crucible 220 is heated by the heater, and the vapor deposition material is discharged toward the substrate 1 from the nozzle 211 of the distribution pipe 210. In the state where the second evaporation source 200 is stopped, the substrate 1 is coated with the vapor deposition material while the substrate 1 moves along the transport track 120.
[0066] Here, the second on-off valve V2 of the first connection housing 300Ais opened, and the evaporation crucible 220 of the first evaporation source 200 is replaced. As described above, in the state where the gate valve GV is closed, the movement of gas between the upper space and the lower space based on the partition wall 310 is completely blocked. Thus, in the process of replacing the evaporation crucible 220, an inflow of external air is blocked in the upper space of the partition wall 310. When the evaporation crucible 220 is replaced, the second on-off valve V2 of the first connection housing 300A is closed. Then, the vacuum chamber 100 is operated so that the inside of the first moving chamber 300 is in the vacuum state again.
[0067] When the deposition material charged in the evaporation crucible 220 of the second evaporation source 200 is exhausted, the first on-off valve VI of the second moving chamber 300, the gate valve GV of the second evaporation source 200, and the fourth on-off valve V4 are closed. Then, the first contact member Dl is spaced apart from the outer surfaces of the connection housings 300A on both sides of the second moving chamber 300. As illustrated in FIGS. 1 and 2, the moving chamber 300 moves along the rail R from the outside of the vacuum chamber 100. Thereafter, the above-described process is repeated.
[0068] FIG. 9 is a schematic diagram of an evaporation deposition system for replacing a crucible according to yet another exemplary embodiment of the present disclosure.
[0069] As illustrated in FIG. 9, in the evaporation deposition system 30 for replacing a crucible according to yet another exemplary embodiment of the present disclosure, the vacuum chamber 100 is provided on both sides based on the rail R. The connection chamber 400 connects both vacuum chambers 100. The pair of evaporation sources 200 are provided in the moving chamber 300 to discharge the vapor deposition material toward both vacuum chambers 100.
[0070] FIGS. 5 to 7 are schematic diagrams of the evaporation deposition system for replacing a crucible according to another exemplary embodiment of the present disclosure, and FIGS. 8A and 8B are schematic side views of the evaporation deposition system for replacing a crucible according to another exemplary embodiment of the present disclosure.
[0071] As shown in FIGS. 5 to 8, an evaporation deposition system 20 for replacing a crucible according to another exemplary embodiment of the present disclosure is characterized in that a plurality of moving chambers 300 respectively accommodating an evaporation source 200 are selectively connected to a vacuum chamber 100 accommodating a substrate 1, and the evaporation deposition system 20 includes a vacuum chamber 100, an evaporation source 200, a moving chamber 300, and a connection chamber 400. The evaporation deposition system 20 for replacing a crucible according to another exemplary embodiment of the present disclosure may be
automatically controlled by a controller (not shown).
[0072] As illustrated in FIGS. 5 to 7, the vacuum chamber 100 is configured to form the vacuum state therein, and a transport track 120 for transporting the substrate 1 is provided in the vacuum chamber 100. Since the transport track 120 for transporting the substrate 1 is a well known technology as disclosed in Korean Patent Laid-Open Publication No. 2018-0005285, a detailed description thereof will be omitted.
[0073] As shown in FIGS. 5 to 7, the substrate 1 is provided in a standing state in the vacuum chamber 100. In the vacuum chamber 100, a fourth opening is formed in a wall facing the front of the substrate 1. The fourth opening is a portion communicating with the connection chamber 400, and is opened or closed by a fourth opening and closing valve V4. Although the reference numeral is not given to the fourth opening, the fourth opening should be understood as a part of the fourth on-off valve V4. In FIG. 8, the fourth on-off valve V4 is omitted to be illustrated.
[0074] Although not illustrated, a mask and a frame supporting the mask are installed in the front of the substrate 1. In the evaporation deposition system 20 for replacing a crucible according to another exemplary embodiment of the present disclosure, the substrate 1 is coated with the vapor deposition material as the substrate 1 moves along the transport track 120 in the state where the evaporation source 200 is stopped.
[0075] A surface of the substrate 1 is coated with the deposition material made of a metallic material, or the like. The metallic material may be made of metal, calcium, aluminum, barium, ruthenium, magnesium, silver, or the like.
[0076] As illustrated in FIGS. 5 to 7, the vacuum chamber 100 is selectively connected to or isolated from another chamber (not shown) by a gate valve 110. When the deposition of the deposition material is completed, the gate valve 110 is opened, the substrate 1 is moved to another chamber along the transport track 120 for subsequent processes. Although not illustrated, the vacuum chamber 100 forms the vacuum state by a vacuum pump.
[0077] The evaporation source 200 supplies the vapor deposition material to the substrate 1, and is provided in the moving chamber 300. The evaporation source 200 discharges the vapor deposition material on the front of the substrate 1 that moves horizontally along the transport track 120 while the moving chamber 300 is stopped. The evaporation source 200 comprises a distribution pipe 210, an evaporation crucible 220, and a support 230.
[0078] FIGS. 5 to 7 illustrate a type including a pair of distribution pipes 210 and a pair of evaporation crucibles 220 as the evaporation source 200 according to another exemplary
embodiment of the present disclosure. For example, the deposition material contained in any one of the pair of evaporation crucibles 220 may be provided with silver (Ag), and the deposition material contained in another one may be provided with magnesium (Mg).
[0079] As illustrated in FIG. 8, the distribution pipe 210 is configured to discharge the vapor deposition material through a nozzle 211 and is formed long in the longitudinal direction. An internal space that is long in a longitudinal direction is formed inside the distribution pipe 210.
The plurality of nozzles 211 are formed in the distribution pipe 210 along the length direction.
[0080] Although not illustrated in detail, the distribution pipe 210 may be formed in a multilayer structure. For example, the distribution pipe 210 may have a multilayer structure including a first layer that forms a boundary of the internal space and is in contact with the vapor deposition material, a second layer in which a heater is installed, a third layer that reflects thermal energy of the heater toward the second layer, and a fourth layer that forms an outer surface of the distribution pipe 210 and through which a refrigerant flows, etc. [0081] Such a multilayer structure of the distribution pipe 210 forms a structure to maximize thermal energy efficiency of the heater. Since the multilayer structure of the distribution pipe 210 is a well known technology as disclosed in Korean Patent Publication No. 685431, and No. 928136, a detailed description thereof will be omitted.
[0082] As illustrated in FIG. 8, the evaporation crucible 220 is configured to accommodate the deposition material (not shown), and is disposed below the distribution pipe 210. Although not illustrated in detail, the evaporation crucible 220 may have a multilayer structure. For example, the evaporation crucible 220 may have a multilayer structure including a first layer in contact with a deposition material, a second layer in which a heater is installed, and a third layer that reflects thermal energy of the heater toward the second layer, etc.
[0083] The distribution pipe 210 is coupled to the evaporation crucible 220 through the connection part 212. The connection part 212 is formed at a lower end part of the distribution pipe 210. The connection part 212 means a pipe extending from the distribution pipe 210 toward the evaporation crucible 220. A first flange Pl is formed at an upper end part of the evaporation crucible 220, and a second flange P2 is formed at a lower end part of the connection part 212. The connection part 212 and the evaporation crucible 220 are connected by the flange connection structure. Although not illustrated, the first flange Pl and the second flange P2 may form a coupling force by clamp or bolt fastening.
[0084] As illustrated in FIGS. 5 to 8, the support 230 supports the evaporation crucible 220 and the distribution pipe 210, and is movably mounted to the rail R. Referring to Korean Patent Laid- Open Publication No. 2018-0005285, the support 230 may be installed with a transmission device that forms a transport force along the rail (R).
[0085] As illustrated in FIG. 8, the support 230 is provided with an actuator 231 that elevates the evaporation crucible 220. The actuator 231 is configured to form a force for elevating the evaporation crucible 220 and is provided as a hydraulic cylinder or a linear actuator. The actuator
231 forms a structure in which a load is elevated by hydraulic pressure or a driving force of a motor.
A seating panel 232 is coupled to the upper end of the load of the actuator 231. The evaporation crucible 220 is elevated by the actuator 231 in a state where the crucible is seated on the upper surface of the seating panel 232. The seating panel 232 may be manufactured in the form of a plate. When the evaporation crucible 220 is elevated by the actuator 231 in the state illustrated in FIG. 8B, an upper surface of the first flange Pl is in close contact with a lower surface of the second flange P2.
[0086] As illustrated in FIGS. 5 to 8, the moving chamber 300 is configured to accommodate the evaporation source 200, and moves or stops along the rail R from the outside of the vacuum chamber 100. The rail (R) for transporting the moving chamber 300 is provided on an outer bottom surface of the vacuum chamber 100. The moving chamber 300 is movably mounted to the rail R through the support 230. Since the moving chamber 300 is mounted on the rail R, the moving chamber 300 is spaced apart from the bottom surface.
[0087] As illustrated in FIG. 8, in the moving chamber 300, a partition wall 310 is disposed between the distribution pipe 210 and the evaporation crucible 220. The partition wall 310 partitions the internal space of the moving chamber 300 up and down to block movement of gas between an upper space of the distribution pipe 210 and a lower space of the evaporation crucible 220. The distribution pipe 210 is coupled to the evaporation crucible 220 through the connection part 212 passing through the partition wall 310. Therefore, the movement of gas between the upper space and the lower space based on the partition wall 310 is possible only through the distribution pipe 210. The connection part 212 is provided with a gate valve (GV) to block the gas movement. Therefore, when the gate valve GV is closed, the movement of gas between the upper space and the lower space based on the partition wall 310 is completely blocked.
[0088] As described above, the support 230 may be installed with a transmission device that forms a transport force along the rail R. Although not illustrated, the moving chamber 300 forms the vacuum state by a vacuum pump.
[0089] As illustrated in FIGS. 5 to 7, connection housings 300A are respectively coupled to both end parts of the moving chamber 300 in a moving direction, and the plurality of moving chambers
300 are connected by the connection housing 300Ato move integrally along the rail R. The moving chamber 300 and the connection housing 300 A are manufactured in the form of a rectangular parallelepiped. Further, the moving chamber 300 and the connection housing 300 A form the same width in a width direction of the rail R. Therefore, as illustrated in FIG. 5, the moving chamber 300 and the connection housing 300A form a long rectangular parallelepiped shape along the length direction of the rail R in a coupled state. Although not illustrated, the connection housing 300A may be manufactured integrally with the moving chamber 300.
[0090] As illustrated in FIGS. 5 to 7, the connection chamber 400 is configured to connect the moving chamber 300 and the vacuum chamber 100, and is coupled to an outer wall surface of the vacuum chamber 100. The vacuum chamber 100 and the connection chamber 400 are connected through the fourth opening when the fourth on-off valve V4 is opened. Although not illustrated, the connection chamber 400 forms the vacuum state by a vacuum pump.
[0091] As illustrated in FIGS. 5 to 8, the connection chamber 400 is provided with a second entrance facing the front of the moving chamber 300. Although the reference numeral is not given to the second opening, the second opening should be understood as a part of the second contact member D2.
[0092] A second contact member D2 selectively in close contact with the front of the moving chamber 300 and the connection housing 300A is formed at the second entrance. As illustrated in FIG. 8A, the second contact member D2 is configured to selectively seal the connection chamber 400, and is in close contact with the front of the moving chamber 300 and the connection housing 300A in a state where the moving chamber 300 is stopped. When the connection housing 300A is manufactured integrally with the moving chamber 300, the second contact member D2 is in close contact with the front of the moving chamber 300.
[0093] As illustrated in FIG. 8B, the second contact member D2 is spaced apart from the front of the moving chamber 300 and the connection housing 300A when the moving chamber 300 moves.
It should be understood in FIGS. 5 and 7 that the second contact member D2 is in close contact with the front of the moving chamber 300 and the connection housing 300 A in the state where the moving chamber 300 is stopped. It should be understood in FIG. 6 that the second contact member D2 is spaced apart from the front of the moving chamber 300 and the connection housing 300Ain the process of moving the moving chamber 300.
[0094] Although not illustrated in detail, the second entrance is formed in a rectangular shape, and the second contact member D2 is formed in a square pipe shape. In the second contact member
D2, a packing for blocking a gap between the second contact member D2 and the connection housing 300, and a packing for blocking a gap between the second contact member D2 and the connection chamber 400 are mounted, respectively. Although not illustrated, the second contact member D2 is in close contact with or spaced apart from the front of the moving chamber 300 and the connection housing 300 A by the actuator 231.
[0095] As illustrated in FIGS. 5 to 7, the front surface of the moving chamber 300 is provided with a first opening through which the vapor deposition material moves into the connection chamber 400. The first opening is a portion communicating with the connection chamber 400, and is opened or closed by a first on-off valve VI . Although the reference numeral is not given to the first opening, the first opening should be understood as a part of the first on-off valve VI . In FIG. 8, the first on- off valve VI is omitted to be illustrated.
[0096] As illustrated in FIGS. 5 and 8, a third opening is disposed on the rear of the moving chamber 300. The third opening is a portion that the evaporation crucible 220 enters and exits when the evaporation crucible 220 is replaced, and is opened or closed by the third on-off V3.
Although the reference numeral is not given to the third opening, the third opening should be understood as a part of the third on-off valve V3.
[0097] Hereinafter, the state of use of the evaporation deposition system 20 for replacing a crucible according to another exemplary embodiment of the present disclosure is described. Hereinafter, in FIGS. 5 to 7, for easy understanding of the state of use, the left moving chamber 300 is referred to as the first moving chamber 300, and the evaporation source 200 provided in the first moving chamber 300 is referred to as the first evaporation source 200. Further, in FIGS. 5 to 7, the right moving chamber 300 is referred to as a second moving chamber 300, and the evaporation source 200 provided in the second moving chamber 300 is referred to as a second evaporation source 200.
In addition, in FIGS. 5 to 7, the left connection housing 300A of the first moving chamber 300 is referred to as a first connection housing 300 A, and the right connection housing 300 A of the second moving chamber 300 is referred to as a second connection housing 300A.
[0098] The evaporation deposition system 20 for replacing a crucible according to another exemplary embodiment of the present disclosure may be automatically controlled by a controller (not shown).
[0099] As illustrated in FIGS. 5 to 7, the moving chamber 300 moves or stops along the rail R from the outside of the vacuum chamber 100. The plurality of moving chambers 300 are connected by the connection housing 300 A to move integrally along the rail R. As illustrated in FIGS. 6 and 8B, the second contact member D2 is spaced apart from the outer surface of the moving chamber 300 and the connection housing 300 A when the moving chamber 300 moves. When the moving chamber 300 moves, the first opening, the third opening, and the fourth opening are closed.
[00100] As illustrated in FIGS. 5 and 8 A, the second contact member D2 is in close contact with the front of the moving chamber 300 and the connection housing 300Ain the state where the moving chamber 300 is stopped. When the second contact member D2 seals the connection chamber 400, the vacuum chamber 100 is operated so that an inside of the connection chamber 400 is in the vacuum state. When the inside of the connection chamber 400 is in the vacuum state, the first on- ofif valve VI of the first moving chamber 300 and the fourth on-off valve V4 are opened.
[00101] In this state, the deposition material charged in the evaporation crucible 220 is heated by the heater, and the vapor deposition material is discharged toward the substrate 1 from the nozzle 211 of the distribution pipe 210. In the state where the first evaporation source 200 is stopped, the substrate is coated with the vapor deposition material while the substrate 1 moves along the transport track 120. When the deposition material charged in the evaporation crucible 220 is exhausted, the first on-off valve VI of the first moving chamber 300, the gate valve GV of the first evaporating source 200, and the fourth on-off valve V4 are closed. Then, the second contact member D2 is spaced apart from the front of the first moving chamber 300 and the connection housings 300 A.
[00102] As illustrated in FIGS. 6 to 7, the moving chamber 300 moves along the rail R from the outside of the vacuum chamber 100. As illustrated in FIGS. 7 and 8 A, the second contact member D2 is in close contact with the front of the second moving chamber 300 and the connection housing 300A in the state where the moving chamber 300 is stopped. When the second contact member D2 seals the connection chamber 400, the vacuum chamber 100 is operated so that an inside of the connection chamber 400 is in the vacuum state. When the inside of the connection chamber 400 is in the vacuum state, the first on-off valve VI of the second moving chamber 300 and the fourth on- off valve V4 are opened.
[00103] In this state, the deposition material charged in the evaporation crucible 220 is heated by the heater, and the vapor deposition material is discharged toward the substrate 1 from the nozzle
Figure imgf000023_0001
the substrate 1 is coated with the vapor deposition material while the substrate 1 moves along the transport track 120.
[00104] Here, the third on-off valve V3 of the first moving chamber 300 is opened, and the evaporation crucible 220 of the first evaporation source 200 is replaced. As described above, in the state where the gate valve GV is closed, the movement of gas between the upper space and the lower space based on the partition wall 310 is completely blocked. Thus, in the process of replacing the evaporation crucible 220, an inflow of external air is blocked in the upper space based on the partition wall 310. When the evaporation crucible 220 is replaced, the third on-off valve V3 of the first moving chamber 300 is closed. Then, the vacuum chamber 100 is operated so that the inside of the first moving chamber 300 is in the vacuum state again.
[00105] When the deposition material charged in the evaporation crucible 220 of the second evaporation source 200 is exhausted, the first on-off valve VI of the second moving chamber 300, the gate valve GV of the second evaporation source 200, and the fourth on-off valve V4 are closed. Then, the second contact member D2 is spaced apart from the front of the second moving chamber 300 and the connection housings 300A. As illustrated in FIGS. 5 and 6, the moving chamber 300 moves along the rail R from the outside of the vacuum chamber 100. Thereafter, the above- described process is repeated.
[00106] Although the exemplary embodiments of the present disclosure have been described illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope of the disclosure as defined by the appended claims. Accordingly, such modifications, additions and substitutions should also be understood to fall within the scope of the present disclosure.
21

Claims

WHAT IS CLAIMED IS:
1. An evaporation deposition system for replacing a crucible, comprising:
a vacuum chamber configured to accommodate a substrate;
an evaporation source configured to supply a vapor deposition material to the substrate; a plurality of moving chambers, each configured to move along a rail and to accomodate the evaporation source; and
a connection chamber configured to connect the moving chambers and the vacuum chamber, wherein a front surface of each of the moving chambers is provided with a first opening, through which the vapor deposition material moves into the connection chamber, and a first on-off valve that opens and closes the first opening.
2. The evaporation deposition system of claim 1,
wherein the connection chamber is provided with a first entrance through which the moving chambers go in and out of the connection chamber , and
wherein a first contact member, which is selectively in close contact with outer surfaces of the moving chambers, is disposed in the first entrance.
3. The evaporation deposition system of any of claims 1 to 2, wherein:
connection housings are respectively coupled to both end parts of each of the moving chambers in a moving direction,
the plurality of moving chambers are connected by the connection housings to move integrally,
the connection chamber is provided with a first entrance through which the moving chambers and the connection housings go in and out of the connection chamber, and
a first contact member, which is selectively in close contact with outer surfaces of the connection housings, is disposed in the first entrance.
4. The evaporation deposition system of claim 3,
wherein second openings are respectively disposed in both end parts of each of the moving chambers in the moving direction, and
wherein each of the connection housings is provided with a second on-off valve that opens and closes the second opening.
5. The evaporation deposition system of claim 4, wherein the evaporation source comprises:
a distribution pipe configured to eject the vapor deposition material through a nozzle;
an evaporation crucible coupled to the distribution pipe and configured to accommodate the vapor deposition material;
a support movably mounted on the rail; and
an actuator installed on the support to elevate and lower the evaporation crucible, and wherein the evaporation crucible enters and exits through the second opening.
6. The evaporation deposition system of claim 5, wherein:
a partition wall is disposed in each of the moving chambers between the distribution pipe and the evaporation crucible,
the distribution pipe is coupled to the evaporation crucible through a connection part passing through the partition wall, and
a gate valve is disposed in the connection part.
7. The evaporation deposition system of any of claims 1 to 6,
wherein the connection chamber is provided with a second entrance facing front surfaces of the moving chambers, and
wherein a second contact member, which is selectively in close contact with the front surfaces of the moving chambers is disposed in the second entrance.
8. The evaporation deposition system of any of claims 1 to 7, wherein: connection housings are respectively coupled to both end parts of each of the moving chambers in a moving direction,
the plurality of moving chambers are connected by the connection housings to move integrally,
the connectioin chamber is provided with a second entrance facing the front surfaces of the moving chambers and connection chambers, and
a second contact member, which is selectively in close contact with the front surfaces of the moving chambers and the connection housings, is disposed in the second entrance.
9. The evaporation deposition system of any of claims 1 to 8, wherein a rear surface of each of the moving chambers is provided with a a third opening, through which the evaporation crucible of the evaporation source goes in and out of each of the moving chambers, and a third on- off valve that opens and closes the third opening.
10. The evaporation deposition system of any of claims 1 to 9, wherein the vacuum chamber is provided with a fourth opening, through which the vacuum chamber communicates with the connection chambers and a fourth on-off valve that opens and closes the fourth opening.
PCT/US2019/057136 2018-10-24 2019-10-21 Evaporation deposition system for replacing crucible WO2020086424A1 (en)

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