WO2021060960A1 - Composition adhésive pour bande de découpage en dés et bande de découpage en dés comprenant celle-ci - Google Patents

Composition adhésive pour bande de découpage en dés et bande de découpage en dés comprenant celle-ci Download PDF

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Publication number
WO2021060960A1
WO2021060960A1 PCT/KR2020/095102 KR2020095102W WO2021060960A1 WO 2021060960 A1 WO2021060960 A1 WO 2021060960A1 KR 2020095102 W KR2020095102 W KR 2020095102W WO 2021060960 A1 WO2021060960 A1 WO 2021060960A1
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WIPO (PCT)
Prior art keywords
dicing tape
film
adhesive composition
weight
adhesive
Prior art date
Application number
PCT/KR2020/095102
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English (en)
Korean (ko)
Inventor
김다애
한지호
이광주
김은영
장미
Original Assignee
주식회사 엘지화학
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020200096318A external-priority patent/KR102426261B1/ko
Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to US17/598,114 priority Critical patent/US11932784B2/en
Priority to JP2021545907A priority patent/JP7233800B2/ja
Priority to CN202080011879.3A priority patent/CN113366074B/zh
Publication of WO2021060960A1 publication Critical patent/WO2021060960A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1535—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the present invention claims the benefit of the filing date of Korean Patent Application No. 10-2019-0119119 filed with the Korean Intellectual Property Office on September 26, 2019, all of which are included in the present invention.
  • the present invention relates to an adhesive composition for a dicing tape and a dicing tape comprising the same.
  • the manufacturing process of a semiconductor chip includes a process of forming a fine pattern on a wafer and a process of polishing and packaging a wafer to meet the specifications of a final device.
  • the packaging process includes a wafer inspection process for inspecting defects in semiconductor chips; A dicing process of cutting the wafer and separating it into individual chips; A die bonding process of attaching the separated chip to a circuit film or a mounting plate of a lead frame; A wire bonding process of connecting a chip pad provided on a semiconductor chip to a circuit pattern of a circuit film or lead frame by an electrical connection means such as a wire; A molding process of covering the outside with an encapsulant to protect the internal circuit and other components of the semiconductor chip; A trim process of cutting the dam bar connecting the lead and the lead; A forming process of bending the lead into a desired shape; And a finished product inspection process for inspecting defects in the finished package.
  • the wafer is cut to a predetermined thickness using a diamond wheel or the like.
  • a dicing tape is laminated on the rear surface of the wafer under appropriate conditions, and then the process is performed.
  • a die bonding film adheresive film
  • the dicing process is a process of manufacturing a plurality of individual chips separated from each other by grinding the rear surface of a semiconductor wafer and cutting the semiconductor wafer along a dicing line between the chips.
  • the semiconductor chip is first cut with a blade, and then, it is proposed in a manufacturing process including an inspending process.
  • the cut semiconductor wafer is expanded, and the substrate film of the semiconductor wafer is irradiated with ultraviolet rays to pick up a plurality of individual chips.
  • the technical problem to be achieved by the present invention is a dicing tape comprising an adhesive composition for a dicing tape and the adhesive composition for a dicing tape that can prevent pickup from dropping due to an oxygen inhibition phenomenon occurring in the dicing process. Is to provide.
  • An exemplary embodiment of the present invention provides an adhesive composition for a dicing tape comprising an adhesive binder, a singlet oxygen scavenger, a photosensitizer, and a photoinitiator according to an aspect of the present invention.
  • An exemplary embodiment of the present invention is provided with a dicing tape including a base film and an adhesive layer formed on at least one surface of the base film, wherein the adhesive layer includes an adhesive composition for the dicing tape.
  • the adhesive composition for a dicing tape according to an exemplary embodiment of the present invention further includes a singlet oxygen scavenger and a photosensitizer, so that when irradiated with ultraviolet rays, the photosensitizer converts oxygen in the atmosphere into singlet oxygen, and the singlet oxygen scavenger By reacting with the singlet oxygen, it is possible to alleviate the phenomenon of oxygen inhibition.
  • the dicing tape according to an exemplary embodiment of the present invention may improve pickup deterioration by including the adhesive composition for dicing tape in the adhesive layer.
  • the unit "parts by weight” may mean a ratio of weight between each component.
  • (meth)acrylate is used as a collective term for acrylate and methacrylate.
  • weight average molecular weight and “number average molecular weight” of a compound can be calculated using the molecular weight and molecular weight distribution of the compound. Specifically, tetrahydrofuran (THF) and a compound were added to a 1 ml glass bottle to prepare a sample sample having a compound concentration of 1 wt%, and a standard sample (polystyrene, polystyrene) and a sample sample were filtered (pore size). Is filtered through (0.45 ⁇ m), and injected into a GPC injector, the elution time of the sample sample is compared with the calibration curve of the standard sample to obtain the molecular weight and molecular weight distribution of the compound. In this case, an Infinity II 1260 (Agilient) can be used as a measuring device, and the flow rate can be set to 1.00 mL/min, and the column temperature can be set to 40.0 °C.
  • THF tetrahydrofuran
  • Glass Temperature can be measured using Differential Scanning Analysis (DSC), and specifically DSC (Differential Scanning Calorimeter, DSCQ2000, TA instrument Korea) ), the sample is heated at a heating rate of 5°C/min in the temperature range of -60°C to 150°C.
  • the glass transition temperature can be obtained by measuring the midpoint.
  • a die lift phenomenon occurs in which the periphery of the cut chip is lifted, and oxygen is trapped in the excited portion. Thereafter, radicals generated in the process of irradiation with ultraviolet (UV) rays react with trapped oxygen to form peroxyl radicals, and oxygen inhibition occurs at the periphery of the chip.
  • UV ultraviolet
  • the surface where the oxygen suppression phenomenon has occurred remains in a state of high adhesion, and when the chips are picked up, adhesion between the films occurs, resulting in a problem of deterioration of the pick-up of the chips.
  • An exemplary embodiment of the present invention provides an adhesive composition for a dicing tape comprising an adhesive binder, a singlet oxygen scavenger, a photosensitizer, and a photoinitiator.
  • the present invention further comprises a singlet oxygen scavenger and a photosensitizer in the adhesive composition for a dicing tape, whereby the photosensitizer converts oxygen in the atmosphere into singlet oxygen when irradiated with ultraviolet rays (UV), and the singlet
  • UV ultraviolet rays
  • the oxygen scavenger may react with the converted oxygen to remove oxygen that reacts with the radical. Therefore, it is possible to alleviate the phenomenon of oxygen inhibition.
  • the adhesive binder is -28 °C to -58 °C, -29 °C to -57 °C, -30 °C to -56 °C, -30 °C to -55 °C, -31 °C to- Including a (meth)acrylate-based resin having a glass transition temperature of 54°C, -32°C to -53°C, -33°C to -52°C, -34°C to -51°C, or -35°C to -50°C
  • the adhesive strength of the adhesive composition can be adjusted, and the concentration at which oxygen in the atmosphere generates singlet oxygen can be adjusted by the photosensitive agent included in the adhesive composition.
  • the (meth)acrylate-based resin may include a copolymer of a (meth)acrylic acid ester-based monomer and a crosslinkable functional group-containing monomer.
  • a copolymer of a (meth)acrylic acid ester-based monomer and a crosslinkable functional group-containing monomer By including the copolymerization of the (meth) acrylate-based resin from the above, it is possible to implement the basic physical properties of the adhesive layer.
  • the (meth)acrylic acid ester monomer may be an alkyl (meth)acrylate, and more specifically, as a monomer having an alkyl group having 1 to 12 carbon atoms, pentyl (meth)acrylate , n-butyl (meth)acrylate, ethyl (meth)acrylate, methyl (meth)acrylate, hexyl (meth)acrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate, 2- Ethylhexyl (meth)acrylate, dodecyl (meth)acrylate, or decyl (meth)acrylate, or a mixture of two or more kinds thereof.
  • the (meth)acrylic acid ester-based monomer from the above, it is possible to implement the basic physical properties of the adhesive layer.
  • the crosslinkable functional group-containing monomer may be one or more mixtures of a hydroxy group-containing monomer, a carboxyl group-containing monomer, or a nitrogen-containing monomer.
  • the hydroxyl group-containing compound is 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 2-hydroxyethylene glycol (meth)acrylate, or 2-hydroxypropylene glycol (meth)acrylate.
  • the hydroxyl group-containing monomer it is possible to implement the basic physical properties of the adhesive layer.
  • the carboxyl group-containing compound is (meth)acrylic acid, 2-(meth)acryloyloxyacetic acid, 3-(meth)acryloyloxypropyl acid, and 4-(meth)acrylo.
  • the nitrogen-containing monomer may be (meth)acrylonitrile, N-vinyl pyrrolidone, or N-vinyl caprolactam.
  • the (meth)acrylate-based resin may further include vinyl acetate, styrene, or acrylonitrile, etc., from the viewpoint of improving other functionalities such as compatibility.
  • the (meth)acrylate-based resin may further include vinyl acetate, styrene, or acrylonitrile, thereby improving other functionality such as compatibility.
  • the singlet oxygen scavenger is dimethyl anthracene (DMA), dibutyl anthracene (DBA), triethylsilylethynyl-pentacene (triethylsilylethynyl-pentacene), di It may be one selected from the group consisting of phenyl furan (diphenyl furan, DPF) and combinations thereof.
  • DMA dimethyl anthracene
  • DBA dibutyl anthracene
  • triethylsilylethynyl-pentacene triethylsilylethynyl-pentacene
  • di It may be one selected from the group consisting of phenyl furan (diphenyl furan, DPF) and combinations thereof.
  • the content of the singlet oxygen scavenger is 0.5 parts by weight or more and 20.0 parts by weight or less, 1.0 parts by weight or more and 19 parts by weight or less, 2 parts by weight or more and 18 parts by weight based on 100 parts by weight of the adhesive binder.
  • 3 parts by weight or more and 17 parts by weight or less, or 5 parts by weight or more and 16 parts by weight or less may be used.
  • the photosensitizer is an anthracenes compound, a phenanthrene compound, a chrysense compound, a benzpyrenes compound, a fluoranthene compound Compounds, rubrenes-based compounds, pyrenes-based compounds, xanthones-based compounds, indanthrenes-based compounds, thioxanthen-9-ones-based compounds, and these It may be one selected from the group consisting of combinations.
  • the photosensitizer may use isopropyl thioxanthone.
  • the photosensitizer By selecting the photosensitizer from the above, it is possible to control the reaction efficiency with the oxygen trapping agent by controlling the rate at which the photosensitizer converts oxygen in the atmosphere into singlet oxygen during ultraviolet irradiation.
  • the photosensitive agent When the concrete is irradiated with ultraviolet sensitizer is converted received energy in the excited state (excited state) is, the photosensitive agent is a singlet oxygen (1 O 2) to transfer energy to triplet oxygen (3 O 2). Thereafter, the oxygen scavenger may react with singlet oxygen to reduce an oxygen suppression phenomenon. The smaller the energy difference between the photosensitizer and the photoinitiator, the easier energy is transferred, so that the reaction proceeds efficiently.
  • the content of the photosensitizer is 0.1 parts by weight or more and 1.0 parts by weight or less, 0.2 parts by weight or more and 0.9 parts by weight or less, 0.3 parts by weight or more and 0.8 parts by weight or less, 0.4 parts by weight based on 100 parts by weight of the adhesive binder. It may be greater than or equal to 0.7 parts by weight or greater than or equal to 0.5 parts by weight and less than or equal to 0.6 parts by weight.
  • the reaction efficiency with the oxygen trapping agent can be controlled by adjusting the ratio at which the photosensitizer converts oxygen in the atmosphere into singlet oxygen during ultraviolet irradiation.
  • the photoinitiator is not limited, and a commonly known photoinitiator may be used.
  • the amount of the photoinitiator used may be determined in consideration of the physical properties and characteristics of the adhesive layer to be manufactured and the type and characteristics of the adhesive binder to be used.
  • the content of the photoinitiator is 0.1 parts by weight or more and 20 parts by weight or less, 1 part by weight or more and 19 parts by weight or less, 2 parts by weight or more and 18 parts by weight or less, 3 parts by weight based on 100 parts by weight of the adhesive binder. More than 17 parts by weight, 4 parts by weight or more 16 parts by weight or less, 5 parts by weight or more and 15 parts by weight or less, 6 parts by weight or more and 14 parts by weight or less, 7 parts by weight or more and 13 parts by weight or less, 8 parts by weight or more and 12 parts by weight or less It may be less than or equal to 9 parts by weight or more and 11 parts by weight or less.
  • the photoinitiator is benzoin and its alkyl ethers, acetophenones, anthraquinones, thioxanthones, ketals, benzophenones, ⁇ -aminoacetophenones, acylphosphine It may include one selected from the group consisting of oxides, oxime esters, and combinations thereof.
  • the adhesive composition for dicing tape may further include one selected from the group consisting of a curing agent, a solvent, and a mixture thereof.
  • a curing agent e.g., a curing agent for dicing tape
  • a solvent e.g., a solvent for dicing tape
  • the adhesive composition for dicing tape may further include one selected from the group consisting of a curing agent, a solvent, and a mixture thereof.
  • the curing agent may include at least one selected from the group consisting of an isocyanate compound, an aziridine compound, an epoxy compound, and a metal chelate compound.
  • the amount of the curing agent used may be determined in consideration of the physical properties and properties of the adhesive layer to be prepared and the type and characteristics of the adhesive binder used, and the composition for forming a dicing film adhesive layer according to the embodiment May contain 0.1 to 10 parts by weight of the curing agent relative to 100 parts by weight of the adhesive binder.
  • the solvent may be an organic solvent
  • the organic solvent may include one selected from the group consisting of alcohols, ethers, acetates, ketones, and combinations thereof.
  • An exemplary embodiment of the present invention includes a base film and an adhesive layer provided on at least one side of the base film, wherein the adhesive layer is a dicing tape comprising the adhesive composition for a dicing tape according to the embodiment described above. I can.
  • the dicing tape according to an exemplary embodiment of the present invention may improve pickup deterioration by including the adhesive composition for dicing tape in the adhesive layer.
  • the type of the base film is not particularly limited, and a plastic film or metal foil known in this field may be used.
  • the base film is a polyolefin film, a polyester film, a polycarbonate film, a polyvinyl chloride film, a polytetrafluoroethylene film, a polybutene film, a polybutadiene film, a vinyl chloride copolymer film, an ethylene-vinyl acetate copolymer film , An ethylene-propylene copolymer film, and an ethylene-alkyl acrylate copolymer film.
  • the base film is low density polyethylene, linear polyethylene, medium density polyethylene, high density polyethylene, ultra low density polyethylene, random copolymer of polypropylene, block copolymer of polypropylene, homopolypropylene, polymethylpentene, Ethylene-vinyl acetate copolymer, ethylene-methacrylic acid copolymer, ethylene-methyl methacrylate copolymer, ethylene-ionomer copolymer, ethylene-vinyl alcohol copolymer, polybutene, styrene copolymer, or two types thereof
  • the above mixture can be mentioned.
  • the meaning of the base film in which a mixture of two or more polymers is included is a film having a structure in which two or more layers of films each containing the aforementioned polymers are stacked or a single layer containing two or more of the aforementioned polymers includes all films. .
  • the thickness of the base film is not particularly limited, and is usually formed to a thickness of 10 ⁇ m to 200 ⁇ m, preferably 50 ⁇ m to 180 ⁇ m. If the thickness is less than 10 ⁇ m, there is a concern that control of the cut depth in the dicing process may become unstable, and if it exceeds 200 ⁇ m, a large amount of burrs may be generated in the dicing process, or the elongation may decrease. There is a fear that the expanding process may not be performed accurately.
  • a conventional physical or chemical treatment such as mat treatment, corona discharge treatment, primer treatment or crosslinking treatment may be applied to the base film as needed.
  • the thickness of the adhesive layer may be 0.5 ⁇ m to 50 ⁇ m or 5 ⁇ m to 30 ⁇ m.
  • the contents of the adhesive composition for a dicing tape included in the adhesive layer includes all the above-described contents with respect to the embodiment.
  • the dicing tape further includes a singlet oxygen scavenger in the adhesive layer, thereby inducing reduction of peroxyl radicals to mitigate oxygen inhibition.
  • the reduction rate of the adhesive strength after ultraviolet (UV) irradiation compared to the initial adhesive strength of the adhesive layer may be 20% to 80%.
  • the dicing tape further includes a singlet oxygen scavenger in the adhesive layer, thereby inducing the reduction of peroxyl radicals to mitigate oxygen inhibition, through which the adhesion
  • the reduction rate of adhesion after ultraviolet (UV) irradiation under oxygen exposure conditions compared to the initial adhesion of the layer may be 20% to 80%.
  • High molecular weight acrylic resin (Tg 20°C, weight average molecular weight 850,000) 90g and epoxy resin (novolac type epoxy resin, softening point 94°C) 30g, phenolic resin (phenol novolac resin, softening point 94°C) as a curing agent for epoxy resin ) 20 g, medium temperature initiation curing accelerator (2-methyl imidazole) 0.1 g, high temperature initiation curing accelerator (2-phenyl-4-methyl-imidazole) 0.5 g, silica (average particle diameter 75 mm) 20 g as a filler Methyl ethyl ketone was stirred and mixed.
  • a polymer resin Mw 700,000
  • the pressure-sensitive adhesive composition was applied to PET having a thickness of 38 ⁇ m subjected to release treatment, and dried at 110° C. for 3 minutes to form a pressure-sensitive adhesive layer having a thickness of 10 ⁇ m.
  • the formed pressure-sensitive adhesive layer was laminated on a 90um polyolefin base film and then aged to prepare a dicing tape.
  • a dicing die-bonding film was prepared in the same manner as in Example 1, except that about 9.3 g of dimethyl anthracene and 0.43 g of isopropyl thioxanthone were used to prepare the dicing tape.
  • a dicing die bonding film was prepared in the same manner as in Example 1, except that about 18.32 g of dimethyl anthracene and about 0.42 g of isopropyl thioxanthone were used when preparing the dicing tape.
  • TCI triethylsilylethynyl-pentacene
  • TCI triethylsilylethynyl-pentacene
  • a dicing die bonding film was prepared in the same manner as in Example 1, except that about 18.32 g of dimethyl anthracene and 0.42 g of an anthracene-based photosensitive agent were used when preparing the dicing tape.
  • a dicing die bonding film was prepared in the same manner as in Example 1, except that dimethyl anthracene and isopropyl thioxanthone were not used when preparing the dicing tape.
  • a dicing die bonding film was prepared in the same manner as in Example 1, except that about 0.3 g of dimethyl anthracene and about 0.30 g of isopropyl thioxanthone were used when preparing the dicing tape.
  • a dicing die bonding film was prepared in the same manner as in Example 1, except that 1.1 g of triethylsilylethynyl-pentacene (TCI) and isopropyl thioxanthone were not used instead of dimethyl anthracene when preparing the dicing tape. .
  • TCI triethylsilylethynyl-pentacene
  • isopropyl thioxanthone were not used instead of dimethyl anthracene when preparing the dicing tape.
  • a dicing die bonding film was prepared in the same manner as in Example 1, except that about 25 g of dimethyl anthracene and about 0.43 g of isopropyl thioxanthone were used when preparing the dicing tape.
  • a dicing die bonding film was prepared in the same manner as in Example 1, except that about 18.3 g of dimethyl anthracene and about 0.42 g of a naphthalene-based photosensitive agent were used when preparing the dicing tape.
  • the dicing die-bonding films prepared in Examples and Comparative Examples were cut to have a width of 25 mm to prepare a sample for measuring adhesion.
  • the die-bonding surface was mounted on a mirror wafer (8 inches, 35 um in thickness) at a temperature of 70°C, and the chip size was 13.3mm x 9.1 Dicing was performed under the following conditions so as to be mm.
  • the diced sample was irradiated with ultraviolet rays having an amount of light of 150 mJ/cm 2 (irradiance 70 mW/cm 2 ) to the substrate surface of the dicing tape, and then the dicing tape was peeled off and laminated again. Thereafter, a pickup measurement sample was prepared in which expansion was performed using a low temperature chamber and a heat shrinking device.
  • the prepared sample was picked up using SPA-400 (SHINKAWA) according to the following criteria, and the results are shown in Tables 1 and 2.
  • the pick-up criterion is to measure the height of the needle pins at which all individual chips are picked up at the time of evaluation.
  • X was evaluated, and a 100% pickup needle pin height, which is the height of the pin at the time of 100% pickup, was additionally measured.
  • Blade rotation speed 45,000 rpm
  • Needle plunge up height 0.2mm
  • Oxygen exposure conditions UV After investigation adhesiveness ( gf / inch ) 413 403 405 405 351
  • Oxygen exposure conditions UV After investigation Adhesion reduction rate ( % ) 16 16 14 17 23

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

La présente invention concerne une composition adhésive pour une bande de découpage en dés, qui permet d'empêcher une réduction de la récupération, provoquée par l'inhibition de l'oxygène se produisant dans un procédé de découpage en dés, et une bande de découpage en dés comprenant celle-ci. L'invention concerne plus précisément une composition adhésive pour une bande de découpage en dés, la composition comprenant un liant adhésif, un piégeur d'oxygène singulet, un photosensibilisateur et un photoinitiateur, et une bande de découpage en dés comprenant celle-ci.
PCT/KR2020/095102 2019-09-26 2020-08-13 Composition adhésive pour bande de découpage en dés et bande de découpage en dés comprenant celle-ci WO2021060960A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US17/598,114 US11932784B2 (en) 2019-09-26 2020-08-13 Adhesive composition for dicing tape and dicing tape comprising the same
JP2021545907A JP7233800B2 (ja) 2019-09-26 2020-08-13 ダイシングテープ用粘着組成物およびこれを含むダイシングテープ
CN202080011879.3A CN113366074B (zh) 2019-09-26 2020-08-13 用于切割胶带的粘合剂组合物和包含其的切割胶带

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2019-0119119 2019-09-26
KR20190119119 2019-09-26
KR1020200096318A KR102426261B1 (ko) 2019-09-26 2020-07-31 다이싱 테이프용 점착조성물 및 이를 포함하는 다이싱 테이프
KR10-2020-0096318 2020-07-31

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WO2021060960A1 true WO2021060960A1 (fr) 2021-04-01

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070038984A (ko) * 2004-07-01 2007-04-11 데구사 게엠베하 불포화 무정형 폴리에스테르 및 반응성 희석제로 이루어진방사선 경화성 조성물
KR20120118600A (ko) * 2011-04-19 2012-10-29 삼성디스플레이 주식회사 감광성 조성물 및 이를 이용한 표시장치용 기판의 제조 방법
KR101236151B1 (ko) * 2006-03-21 2013-02-22 프로메러스, 엘엘씨 칩 적층, 칩 및 웨이퍼 본딩에 유용한 방법 및 재료
KR101722137B1 (ko) * 2014-01-03 2017-03-31 주식회사 엘지화학 다이싱 필름 및 다이싱 다이본딩 필름
WO2019043056A1 (fr) * 2017-08-31 2019-03-07 Dentsply Detrey Gmbh Composition dentaire comprenant un support particulaire contenant un co-initiateur

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070038984A (ko) * 2004-07-01 2007-04-11 데구사 게엠베하 불포화 무정형 폴리에스테르 및 반응성 희석제로 이루어진방사선 경화성 조성물
KR101236151B1 (ko) * 2006-03-21 2013-02-22 프로메러스, 엘엘씨 칩 적층, 칩 및 웨이퍼 본딩에 유용한 방법 및 재료
KR20120118600A (ko) * 2011-04-19 2012-10-29 삼성디스플레이 주식회사 감광성 조성물 및 이를 이용한 표시장치용 기판의 제조 방법
KR101722137B1 (ko) * 2014-01-03 2017-03-31 주식회사 엘지화학 다이싱 필름 및 다이싱 다이본딩 필름
WO2019043056A1 (fr) * 2017-08-31 2019-03-07 Dentsply Detrey Gmbh Composition dentaire comprenant un support particulaire contenant un co-initiateur

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