WO2021057475A1 - 一种电镀阳极及使用该电镀阳极的电镀方法 - Google Patents

一种电镀阳极及使用该电镀阳极的电镀方法 Download PDF

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Publication number
WO2021057475A1
WO2021057475A1 PCT/CN2020/114157 CN2020114157W WO2021057475A1 WO 2021057475 A1 WO2021057475 A1 WO 2021057475A1 CN 2020114157 W CN2020114157 W CN 2020114157W WO 2021057475 A1 WO2021057475 A1 WO 2021057475A1
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Prior art keywords
electroplating
anode
cathode
electric field
morphology
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PCT/CN2020/114157
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English (en)
French (fr)
Inventor
张宇明
张睿桓
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张宇明
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Publication date
Application filed by 张宇明 filed Critical 张宇明
Priority to EP20867446.5A priority Critical patent/EP4043619A4/en
Priority to JP2022519992A priority patent/JP2022550788A/ja
Publication of WO2021057475A1 publication Critical patent/WO2021057475A1/zh
Priority to US17/657,123 priority patent/US20220235484A1/en

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

Definitions

  • This application relates to the electroplating technology of printed circuit boards, such as an electroplating anode and an electroplating method using the electroplating anode.
  • the characteristics of the most challenging printed circuit boards in related technologies and processes are as follows: 1. Board thickness, up to 10 cm, or thicker. 2. Board size, up to 120 cm ⁇ 120 cm, or larger. 3. The hole aspect ratio can reach 15:1, even more than 20:1. 4. Densely arranged hole arrays and sparsely distributed sporadic holes exist at the same time; the aspect ratio of the holes varies widely. High-end printed circuit board manufacturers and their customers have requirements or expectations for the above-mentioned printed circuit board quality: 1. In the hole, the thickness of the copper deposit reaches the required thickness; at the same time, the thickness of the copper deposit on the surface is not too thick. 2. In the through hole, the copper deposition realizes the "X" shape, and even fills the copper. 3. On the surface, the copper deposits are evenly distributed.
  • the thickness of the copper deposit reaches the required thickness
  • the thickness of the copper deposit is not too thick
  • the copper deposition realizes the "X" shape, and even fills the copper; on the surface, the copper deposition is evenly distributed.
  • the embodiments of the present application provide an electroplating anode and an electroplating method using the electroplating anode, so as to achieve uniform electroplating on the surface of the cathode or enhanced local electroplating on the cathode surface.
  • the embodiments of the present application provide an electroplating anode.
  • the electroplating anode and the cathode to be electroplated form an electric field to form an electroplating layer on the surface of the cathode.
  • the cathode has uneven topography, and the electroplating anode includes A conductive plate, the shape of the conductive plate conforms to the shape of the cathode, the protruding part of the conductive plate corresponds to the recessed part of the cathode, and the recessed part of the conductive plate corresponds to the shape of the cathode.
  • the protruding part of the cathode corresponds.
  • embodiments of the present application provide an electroplating anode.
  • the electroplating anode and the cathode to be electroplated form an electric field to form an electroplating layer on the surface of the cathode.
  • the cathode has uneven topography, and the electroplating anode includes :
  • a plurality of conductive units each of the conductive units includes a needle bar and a needle set at one end of the needle bar, the end of the needle bar provided with the needle is the electroplating end of the conductive unit, and the conductive unit passes The end of the needle shaft away from the needle head is fixed on the insulating back plate; a plurality of the conductive units are arranged in an array, and any two of the conductive units are electrically insulated.
  • the embodiments of the present application provide an electroplating method using the electroplating anode described in the first aspect.
  • the electroplating anode and the cathode to be electroplated form an electric field to form an electroplating layer on the surface of the cathode, and the shape of the cathode
  • the electroplating anode includes a conductive plate, the shape of the conductive plate conforms to the shape of the cathode, and the convex part of the conductive plate corresponds to the concave part of the cathode.
  • the recessed part in the conductive plate corresponds to the protruding part in the cathode;
  • the electroplating method includes:
  • the mold substrate is prepared according to the anode shape; the shape of one side of the mold substrate is conformal to the shape of the cathode, and the convex part of the mold substrate corresponds to the concave part of the cathode.
  • the recessed part of the mold substrate corresponds to the protruding part of the cathode;
  • a plating signal is applied to the plating anode.
  • embodiments of the present application provide an electroplating method using the electroplating anode described in the second aspect.
  • the electroplating anode and the cathode to be electroplated form an electric field to form an electroplating layer on the surface of the cathode, and the shape of the cathode
  • the electroplating anode includes an insulating back plate and a plurality of conductive units, each of the conductive units includes a needle bar and a needle set at one end of the needle bar, and the end of the needle bar provided with the needle is The electroplating end of the conductive unit, the conductive unit is fixed on the insulating back plate through the needle bar; a plurality of the conductive units are arranged in an array, and any two of the conductive units are electrically insulated;
  • the electroplating method includes:
  • each of the needles Control the distance between each of the needles and the insulating back plate according to the anode morphology, and control the application of a separate electroplating signal to each of the conductive units according to the current distribution of the anode surface; or, control all of the The needles have the same distance from the insulating back plate, and each of the conductive units is controlled to apply a separate electroplating signal according to the current distribution of the anode surface; or, each of the needles is controlled according to the anode shape
  • the distance from the insulating backplane simultaneously applies the same electroplating signal to all the conductive units.
  • the present application provides an electroplating device, including a first electroplating anode, a second electroplating anode, and a cathode;
  • the first electroplating anode and the second electroplating anode both adopt the electroplating anode according to claim 5,
  • the cathode includes a first surface and a second surface, and the first electroplating anode and the second electrode of the cathode
  • the topography of one surface is conformal
  • the topography of the second electroplating anode and the second surface of the cathode are conformal
  • the first electroplating anode is opposite to the first surface of the cathode and forms with the cathode
  • An electric field is used to form an electroplating layer on the first surface of the cathode
  • the second electroplating anode is opposite to the second surface of the cathode and forms an electric field with the cathode to form electroplating on the second surface of the cathode.
  • Floor is used to form an electroplating layer on the first surface of the cathode
  • the second electroplating anode is opposite to the second surface of the cathode and forms
  • 1A is a schematic structural diagram of an electroplating anode provided by an embodiment of the application.
  • 1B is a schematic structural diagram of another electroplating anode provided by an embodiment of the application.
  • 1C is a schematic structural diagram of another electroplating anode provided by an embodiment of the application.
  • FIG. 2 is a schematic structural diagram of another electroplating anode provided by an embodiment of the application.
  • FIG. 3 is a schematic top view of the structure of the electroplating anode shown in FIG. 2;
  • FIG. 4 is a schematic structural diagram of yet another electroplating anode provided by an embodiment of the application.
  • FIG. 5 is a schematic structural diagram of yet another electroplating anode provided by an embodiment of the application.
  • Fig. 6 is a top view of a part of the structure of the electroplating anode shown in Fig. 5;
  • FIG. 7 is a schematic structural diagram of yet another electroplating anode provided by an embodiment of this application.
  • FIG. 8 is a schematic structural diagram of yet another electroplating anode provided by an embodiment of this application.
  • FIG. 9 is a schematic structural diagram of yet another electroplating anode provided by an embodiment of the application.
  • FIG. 10 is a schematic structural diagram of yet another electroplating anode provided by an embodiment of the application.
  • FIG. 11 is a schematic structural diagram of yet another electroplating anode provided by an embodiment of the application.
  • FIG. 12 is a schematic structural diagram of yet another electroplating anode provided by an embodiment of the application.
  • FIG. 13 is a schematic structural diagram of yet another electroplating anode provided by an embodiment of the application.
  • FIG. 14 is a schematic structural diagram of yet another electroplating anode provided by an embodiment of the application.
  • 15 is a schematic structural diagram of yet another electroplating anode provided by an embodiment of the application.
  • 16 is a flowchart of an electroplating method using electroplating anodes according to an embodiment of the application.
  • FIG. 17 is a schematic diagram of manufacturing an electroplating anode provided by an embodiment of the application.
  • FIG. 18 is a flowchart of detailed steps included in step S130 in FIG. 16;
  • 19 is a schematic diagram of the production of another electroplating anode provided by an embodiment of the application.
  • FIG. 21 is a flowchart of yet another electroplating method using electroplating anodes according to an embodiment of the application.
  • FIG. 22 is a flowchart of yet another electroplating method using electroplating anodes according to an embodiment of the application.
  • FIG. 23 is a production flow chart of an electroplating anode provided by an embodiment of the application.
  • FIG. 24 is a schematic diagram of manufacturing another electroplating anode provided by an embodiment of the application.
  • FIG. 25 is a schematic structural diagram of an electroplating apparatus provided by an embodiment of the application.
  • the cathode to be electroplated may be, for example, a printed circuit board, and the shape of the cathode may be, for example, the shape of one side surface or both sides of the printed circuit board.
  • the general application concept is to change the anode morphology or electroplating signals of multiple parts in the electroplating anode according to the cathode morphology, so as to make the cathode surface electroplating uniform or to strengthen the local electroplating on the cathode surface.
  • the anode morphology (the morphology of the electroplating anode) is the morphology of the conductive plate or the morphology of the needles of multiple conductive units.
  • the current distribution on the anode surface (the electroplating anode) The surface current distribution) is the surface current distribution of the conductive plate or the surface current distribution of the needles of a plurality of conductive units.
  • FIG 1A is a schematic structural diagram of an electroplating anode provided by an embodiment of the application.
  • the electroplating anode 1 and the cathode 2 to be electroplated form an electric field to form an electroplating layer on the surface of the cathode 2 (the cathode 2 in Figure 1A The surface is uneven on one side as an example.)
  • the cathode 2 has uneven appearance.
  • the electroplating anode 1 includes a conductive plate.
  • the appearance of the conductive plate is conformal or nearly conformal to the appearance of the cathode 2, and the conductive plate is convex
  • the part corresponding to the recessed part of the cathode 2, and the recessed part of the conductive plate corresponds to the protruding part of the cathode 2.
  • FIG. 1A only exemplarily shows the case where the shape of the conductive plate is composed of continuous straight broken lines. In practical applications, the shape of the conductive plate can be set reasonably according to actual production needs, which is not limited in this application.
  • the electroplating anode 1 further includes a cathode surface topography detector 17, an electric field distribution simulation optimizer 16, an electric field distribution controller 15, and an electroplating signal controller 13; the input of the electric field distribution simulation optimizer 16 The terminal is electrically connected to the cathode surface topography detector 17, the output terminal of the electric field distribution simulation optimizer 16 is electrically connected to the electric field distribution controller 15, and the electric field distribution controller 15 is electrically connected to the electroplating signal controller 13. 13 is electrically connected to the conductive plate, and the electroplating signal controller 13 is configured to apply electroplating signals to the conductive plate;
  • the electric field distribution simulation optimizer 16 is set to obtain the initial cathode morphology information from the cathode surface morphology detector 17 before the start of electroplating, and use the initial cathode morphology information, the initial anode morphology, and the initial anode surface current.
  • the distribution is a model to simulate the electric field between the electroplating anode 1 and the cathode 2 and the electroplating material deposition on the cathode 2.
  • the electroplating anode is solved by an optimization algorithm 1 (that is, the shape of the conductive plate in Figure 1A, once the shape of the conductive plate is formed, it cannot be changed) and the optimized anode surface current distribution, and the optimized anode surface current distribution information is transferred to the electric field distribution control
  • the electric field distribution controller 15 controls the electroplating signal output from the electroplating signal controller 13 to the conductive plate; during the electroplating process, the electric field distribution simulation optimizer 16 is set to obtain the real-time cathode morphology from the cathode surface morphology detector 17.
  • the electric field between the electroplating anode 1 and the cathode 2 and the deposition of the electroplating material on the cathode 2 are simulated, according to the settings
  • the optimization goal is to obtain a more optimized anode surface current distribution through the optimization algorithm, and transmit the optimized anode surface current distribution information to the electric field distribution controller 15, and the electric field distribution controller 15 controls the electroplating signal controller 13 to output to the conductive plate
  • the electric field distribution simulation optimizer 16 repeats the above steps until the topography of the cathode 2 reaches the optimization target or the difference with the optimization target reaches the preset value.
  • the cathode surface topography detector 17 can scan the topography information of the cathode 2 through non-contact methods such as X-rays, gamma rays, ultrasound, light, or electromagnetic waves. Furthermore, a three-dimensional image of the cathode 2 is obtained.
  • the electroplating anode 1 further includes: an electric field distribution simulation optimizer 16, an electric field distribution controller 15, and an electroplating signal controller 13;
  • the electric field distribution controller 15 is electrically connected to the electroplating signal controller 13 and the electric field distribution simulation optimizer 16, respectively, and the electroplating signal controller 13 is electrically connected to the conductive plate;
  • the electroplating signal controller 13 is set to apply electroplating signals to the conductive plate; the electric field distribution simulation optimizer 16 is set to input the initial cathode morphology information, initial anode morphology and initial The current distribution on the anode surface is used as a model to simulate the electric field between the electroplating anode 1 and the cathode 2 and the deposition of electroplating material on the cathode 2, according to the set optimization target, that is, the specific distribution of the electroplated material on the cathode 2 And thickness, the morphology of the electroplating anode 1 (that is, the morphology of the conductive plate in Figure 1A, once the morphology of the conductive plate is formed, it cannot be changed) and the optimized anode surface current distribution are solved by an optimization algorithm.
  • the optimized anode surface current distribution information is transmitted to the electric field distribution controller 15, and the electric field distribution controller 15 controls the electroplating signal controller 13 to output electroplating signals to the conductive plate.
  • the electroplating anode 1 further includes: an electric field distribution simulation optimizer 16, an electric field distribution controller 15, and an electroplating signal controller 13;
  • the electric field distribution controller 15 is electrically connected to the electroplating signal controller 13 and the electric field distribution simulation optimizer 16, respectively, and the electroplating signal controller 13 is electrically connected to the conductive plate;
  • the electroplating signal controller 13 is set to apply electroplating signals to the conductive plate; the electric field distribution simulation optimizer 16 is set to input the initial cathode morphology information, initial anode morphology and initial The current distribution on the anode surface is used as a model to simulate the electric field between the electroplating anode 1 and the cathode 2 and the deposition of electroplating material on the cathode 2, according to the set optimization target, that is, the specific distribution of the electroplated material on the cathode 2 And thickness, the morphology of the electroplating anode 1 (that is, the morphology of the conductive plate in Figure 1A, once formed, it cannot be changed) and the optimized anode surface current distribution are obtained by solving the optimization algorithm
  • the optimized cathode morphology is closer to the optimization target, and the optimized anode surface current distribution information is transmitted to the electric field distribution controller 15, and the electric field distribution controller 15 controls the electroplating signal control The electroplating signal output by the device 13 to the conductive plate
  • the current distribution of the anode surface and the current distribution of the anode surface are used as models.
  • the electric field between the electroplating anode 1 and the cathode 2 and the deposition of the electroplating material on the cathode 2 are simulated.
  • the optimization algorithm is adopted
  • the solution obtains a more optimized anode surface current distribution, and at the same time obtains the optimized cathode morphology that is closer to the optimization target, and transmits the optimized anode surface current distribution information to the electric field distribution controller 15.
  • the electric field distribution controller 15 controls the electroplating signal output from the electroplating signal controller 13 to the conductive plate.
  • the electric field distribution simulation optimizer 16 repeats the above steps until the shape of the cathode 2 reaches the The optimization target or the difference between the optimization target and the optimization target reaches a preset value.
  • the morphology of the anode is changed according to the morphology of the cathode, so that the morphology of the electroplating anode and the cathode is conformal or approximately conformal, that is, the protruding part of the electroplating anode corresponds to the recessed part of the cathode, and the electroplating anode is recessed The part corresponding to the protruding part of the cathode.
  • the electric field formed by each part of the cathode and the electroplating anode is consistent or tends to be consistent, so that the surface of the cathode is electroplated uniformly, or the local electroplating of the cathode surface is strengthened.
  • FIG. 2 is a schematic structural diagram of another electroplating anode provided by an embodiment of the application
  • FIG. 3 is a schematic top view of the structure of the electroplating anode shown in FIG. 2, referring to FIGS. 2 and 3, the electroplating anode 1 and the cathode 2 to be electroplated An electric field is formed to form an electroplated layer on the surface of the cathode 2, and the topography of the cathode 2 is uneven.
  • the electroplating anode 1 includes an insulating back plate 12 and a plurality of conductive units 11. Each conductive unit 11 includes a needle bar 111 and a needle 112 arranged at one end of the needle bar 111.
  • the end of the needle bar 111 provided with the needle 112 is the electroplating end of the conductive unit 11.
  • An electric field is formed between the needle 112 of the conductive unit 11 and the cathode 2 to deposit metal ions in the electroplating solution on the surface of the cathode to form the electroplating of the cathode 2.
  • a copper layer can be electroplated on a printed circuit board.
  • the conductive unit 11 is fixed on the insulating back plate 12 through a needle bar 111.
  • a plurality of conductive units 11 are arranged in an array, and any two conductive units 11 are electrically insulated.
  • the electroplating anode is discretized into a plurality of conductive units that do not contact each other, that is, a continuous large surface is discretized into small dots, so that the distance between the needle of the conductive unit and the cathode can be changed.
  • Anode morphology by changing the size or pattern of the electroplating signal applied to the conductive unit to change the electroplating signal of each "small spot" in the electroplating anode, so as to change the anode morphology and each of the electroplating anodes according to the morphology of the cathode At least one of the electroplating signals of "small spots" to make the cathode surface evenly electroplated or to strengthen the local electroplating on the cathode surface.
  • the electroplating signal can be, for example, current, voltage, or power, and can be direct current or pulse current.
  • the electric field distribution in the hole or the current distribution on the inner wall surface of the hole can be accurately controlled, and the thickness of the plating on the inner wall surface of the hole can be controlled, or the hole can be filled with electroplating Material (e.g. copper).
  • electroplating Material e.g. copper
  • the size of the plate surface of the electroplating anode is 120 cm ⁇ 120 cm, and the surface electric field distribution or surface current distribution of the plate can be accurately controlled; the uniform distribution of the surface plating is realized, and the thickness of the surface plating is controllable.
  • the shape of the vertical projection of the needle 112 on the insulating back plate 12 is a regular hexagon.
  • the multiple needles 112 are arranged in an array.
  • the needles 112 are arranged in a row in sequence, and the needles 112 of two adjacent rows are arranged in a staggered manner.
  • the shape of the vertical projection of the needle 112 on the insulating back plate 12 may also be a square, rectangular, circular, or elliptical shape, which is not limited in the embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of another electroplating anode provided by an embodiment of the application.
  • the electroplating anode 1 includes two insulating back plates 12, and a needle rod 111 is fixed on the two insulating back plates 12.
  • the two insulating back plates 12 increase the firmness between the insulating back plate 12 and the needle bar 111, so that the needle bar 111 is not easy to shake, so as to more accurately control the position of the needle 112 and the electric field between the needle 112 and the cathode 2 , In order to improve the electroplating effect of the cathode 2.
  • FIG. 5 is a schematic structural diagram of another electroplating anode provided by an embodiment of the application.
  • the surface of the needle 112 facing away from the insulating back plate 12 is a convex curved surface.
  • the convex curved surface is convex in a direction away from the insulating back plate 12.
  • the needle 112 with a convex curved surface increases the surface area of the electroplating anode.
  • the surface of the needle 112 facing away from the insulating back plate 12 may also have other shapes.
  • Fig. 6 is a top view of the partial structure of the electroplating anode shown in Fig. 5.
  • the electroplating anode 1 further includes an insulating thread 114 and an insulating nut 113.
  • the insulating nut 113 is fixed on the insulating back plate 12, and the insulating thread 114 surrounds
  • the needle rod 111, the insulating thread 114 and the insulating nut 113 are threadedly butted.
  • the insulating thread 114 in the insulating nut 113 can be rotated to control the distance between each needle 112 and the insulating back plate 12, and further control the distance between each needle 112 and the cathode 2.
  • the electroplating anode 1 may further include a terminal 115, which is located at the end of the needle bar 111 away from the needle 112.
  • the needle bar 111 and the needle 112 of the conductive unit 11 can be electrically connected to the needle bar 111.
  • the connected terminal 115 is electrically connected to the feeder line.
  • FIG. 7 is a schematic structural diagram of yet another electroplating anode provided by an embodiment of the application.
  • the surface of the needle 112 facing away from the insulating back plate 12 is flat. Since the shape of the needle 112 is a plane, the needle 112 and the cathode 2 form a local uniform electric field, thus reducing the difficulty of setting the conductive unit 11 and reducing the cost.
  • FIG. 8 is a schematic structural diagram of another electroplating anode provided by an embodiment of the application.
  • the electroplating anode 1 further includes a plating signal controller 13 and a plurality of feeders 132.
  • a conductive unit 11 is connected to each other through a feeder 132.
  • the electroplating signal controller 13 is electrically connected, and the electroplating signal controller 13 is configured to apply electroplating signals to the conductive unit 11.
  • the electroplating anode 1 further includes a driver controller 14 and a plurality of drivers 141, the electric field distribution controller 15 is electrically connected to the driver controller 14, and the driver controller 14 and the plurality of drivers 141 Electrically connected, each driver 141 is connected to the end of the corresponding needle bar 111 away from the needle 112.
  • the electric field distribution controller 15 controls the driving signal output from the driver controller 14 to the driver 141.
  • Each driver 141 is set to control the distance between the needle 112 and the insulating back plate 12, thereby adjusting the shape of the electroplating anode, thereby controlling the needle 112 The distance from the cathode 2.
  • the electroplating anode 1 includes two insulating back plates 12, and a needle bar 111 is fixed on the two insulating back plates 12.
  • the needle bar 111 can move in a direction perpendicular to the insulating back plate 12, but not Move in other directions.
  • the part where the feed line 132 is electrically connected to the conductive unit 11 is located between the two insulating back plates 12.
  • the part where the feeder line 132 is electrically connected to the conductive unit 11 is located between the two insulated backplanes 12, and the two insulated backplanes 12 can be used to protect the feeder line 132.
  • the part where the feeder line 132 is electrically connected to the conductive unit 11 is located between the two insulating back plates 12, and the part where the feeder line 132 is electrically connected to the conductive unit 11 uses the space between the two insulating back plates 12 and does not occupy The space outside the two insulating back plates 12 increases the space utilization rate and improves the integration degree of the components in the electroplating anode 1.
  • the electroplating anode 1 may also include only one insulating back plate 12, and the needle bar 111 is fixed on the insulating back plate 12.
  • the needle bar 111 can move in a direction perpendicular to the insulating back plate 12, but cannot move in other directions. .
  • the electroplating anode 1 further includes a cathode surface topography detector 17, an electric field distribution simulation optimizer 16 and an electric field distribution controller 15.
  • the input end of the electric field distribution simulation optimizer 16 is electrically connected to the cathode surface topography detector 17, the output end of the electric field distribution simulation optimizer 16 is electrically connected to the electric field distribution controller 15, and the electric field distribution controller 15 is also connected to the electroplating signal controller 13 Electrically connected, the electric field distribution controller 15 is also electrically connected to the driver controller 14.
  • the electric field distribution simulation optimizer 16 is set to obtain the initial cathode morphology information from the cathode surface morphology detector 17.
  • the initial cathode morphology information, the initial anode morphology, and the initial anode surface current distribution are The model simulates the electric field between the electroplating anode and the cathode and the deposition of the electroplating material on the cathode.
  • the optimized algorithm is solved
  • the anode morphology and the optimized anode surface current distribution, and the optimized anode morphology and the optimized anode surface current distribution information are transmitted to the electric field distribution controller 15, and the electric field distribution controller 15 controls the electroplating signal controller 13 to output to the conduction
  • the electric field distribution controller 15 controls the driver controller 14 to send different control signals to each driver 141.
  • the control signal includes different extension or retraction distances of each needle bar 111 to adjust the anode shape.
  • the electric field distribution simulation optimizer 16 is set to obtain real-time cathode morphology information from the cathode surface morphology detector 17, taking the real-time cathode morphology information, the current anode morphology, and the current anode surface current distribution as The model simulates the electric field between the electroplating anode and the cathode and the deposition of the electroplating material on the cathode.
  • the optimization algorithm is used to obtain a more optimized anode morphology and a more optimized anode surface current distribution, which will be optimized
  • the information of the anode morphology and the optimized anode surface current distribution are transmitted to the electric field distribution controller 15, which controls the electroplating signal controller 13 to output the electroplating signal to the conductive unit 11, and the electric field distribution controller 15 controls the driver control
  • the device 14 transmits different control signals to each driver 141.
  • the control signal includes different extension or retraction distances of each needle bar 111 to adjust the anode shape.
  • the electric field distribution simulation optimizer 16 repeats the above steps , Until the cathode morphology reaches the optimization target or the difference with the optimization target reaches the preset value.
  • the better anode morphology and the feed size, mode and distribution result obtained by the electroplating simulation software to solve the set target, and the real-time Adjust the anode shape and feed size, mode and distribution the system working in this way is called "intelligent adaptive adjustable anode".
  • FIG. 9 is a schematic structural diagram of another electroplating anode provided by an embodiment of the application.
  • the electroplating anode 1 further includes an electric field distribution simulation optimizer 16, an electric field distribution controller 15 and an electroplating signal controller 13.
  • the electric field distribution simulation optimizer 16 is electrically connected to the electric field distribution controller 15, the electric field distribution controller 15 is also electrically connected to the electroplating signal controller 13, and the electric field distribution controller 15 is also electrically connected to the driver controller 14.
  • the electric field distribution simulation optimizer 16 uses the inputted initial cathode 2 morphology information, initial anode morphology and initial anode surface current distribution as a model to determine the electric field between the electroplating anode and the cathode and the electroplating on the cathode.
  • the material deposition is simulated.
  • the optimized anode morphology and the optimized anode surface current distribution are obtained through the optimization algorithm, and the cost is obtained at the same time.
  • the secondary optimized cathode morphology is closer to the optimization target, and the optimized anode morphology and the optimized anode surface current distribution information are transferred to the electric field distribution controller 15, and the electric field distribution controller 15 controls the output of the electroplating signal controller 13 To the electroplating signal of the conductive unit 11, the electric field distribution controller 15 controls the driver controller 14 to transmit different control signals to each driver 141.
  • the control signal includes different extension or retraction distances of each needle bar 111 to adjust the anode shape. appearance.
  • the electric field distribution simulation optimizer 16 models the cathode morphology, the current anode morphology, and the current anode surface current distribution that are closer to the optimization target after the last optimization.
  • the electroplating material deposition is simulated.
  • a more optimized anode morphology and an optimized anode surface current distribution are obtained through optimization algorithms, and at the same time, the optimized cathode morphology that is closer to the optimization target is obtained after this optimization, and
  • the optimized anode morphology and the optimized anode surface current distribution information are transmitted to the electric field distribution controller 15.
  • the electric field distribution controller 15 controls the electroplating signal controller 13 to output the electroplating signal to the conductive unit 11, and the electric field distribution controller 15 controls
  • the driver controller 14 transmits different control signals to each driver 141.
  • the control signal includes different extension or retraction distances of each needle bar 111 to adjust the anode shape.
  • the electric field distribution simulation optimizer 16 repeats the above Step until the cathode morphology reaches the optimization target or the difference between the optimization target and the optimization target reaches a preset value.
  • the anode morphology and power supply size, mode and distribution result are obtained based on the initial cathode morphology and the electroplating simulation software to solve the set target, so as to adjust the anode morphology and power supply size.
  • Mode and distribution the system working in this way is called "intelligent adjustable anode".
  • the needle bar 111 and the needle 112 of the conductive unit 11 are made of titanium alloy or made of titanium alloy coated with a conductive layer on the surface.
  • the needle bars 111 are vertically inserted into the holes of the insulating back plate 12 to form an array. All the needles 112 are on the same side of the insulating back plate 12.
  • each needle bar 111 is connected to a driver 141, and the driver 141 drives the needle bar 111 to move linearly, thereby determining the relative distance of the needle 112 from the insulating back plate 12.
  • All the drivers 141 are controlled by a driver controller 14, and the driver controller 14 transmits different control signals to each driver 141, including different extension or retraction distances of each needle bar 111.
  • Each needle 112 feeds an electroplating signal through the needle bar 111 and a feeder line 132, and all the feeders 132 are connected to the electroplating signal controller 13, and the electroplating signal controller 13 determines each needle 112 to feed the electroplating signal.
  • the driver controller 14 and the plating signal controller 13 are controlled by the electric field distribution controller 15.
  • FIG. 10 is a schematic structural diagram of another electroplating anode provided by an embodiment of the application. Referring to FIG. 10, the distances between all the needles 112 and the insulating back plate 12 are equal.
  • the electroplating anode 1 also includes a electroplating signal controller 13 and a plurality of feeders 132. One conductive unit 11 is electrically connected to the electroplating signal controller 13 through one feeder 132.
  • the electroplating signal controller 13 is configured to apply electroplating signals to the conductive unit 11.
  • the distance between the needle 112 and the insulating back plate 12 is the same, that is, the end faces of each needle 112 form a large plane, and the plating signals (such as surface current density) of the end faces of the needle 112 are different.
  • the electroplating anode 1 further includes a cathode surface topography detector 17, an electric field distribution simulation optimizer 16 and an electric field distribution controller 15.
  • the input end of the electric field distribution simulation optimizer 16 is electrically connected to the cathode surface topography detector 17, the output end of the electric field distribution simulation optimizer 16 is electrically connected to the electric field distribution controller 15, and the electric field distribution controller 15 is also connected to the electroplating signal controller 13 Electric connection.
  • the electric field distribution simulation optimizer 16 is set to obtain the initial cathode morphology information from the cathode surface morphology detector 17, using the initial cathode morphology information, anode morphology, and initial anode surface current distribution as a model , Simulate the electric field between the electroplating anode and the cathode and the deposition of the electroplating material on the cathode.
  • the optimized anode surface current distribution is obtained through an optimization algorithm, and will be optimized
  • the subsequent anode surface current distribution information is transmitted to the electric field distribution controller 15, and the electric field distribution controller 15 controls the electroplating signal controller 13 to output electroplating signals to the conductive unit 11.
  • the electric field distribution simulation optimizer 16 is set to obtain real-time cathode morphology information from the cathode surface morphology detector 17, using the real-time cathode morphology information, anode morphology and current anode surface current distribution as a model , To simulate the electric field between the electroplating anode and the cathode and the deposition of the electroplating material on the cathode.
  • the optimization algorithm is used to obtain a more optimized anode surface current distribution, and the optimized anode surface current distribution information is transferred to
  • the electric field distribution controller 15 controls the electroplating signal controller 13 to output the electroplating signal to the conductive unit 11; during the electroplating process, the electric field distribution simulation optimizer 16 repeats the above steps until the cathode morphology reaches the optimization target or optimization.
  • the target difference reaches the preset value.
  • FIG. 11 is a schematic structural diagram of another electroplating anode provided by an embodiment of the application. The distances between all the needles 112 and the insulating back plate 12 are equal.
  • the electroplating anode 1 also includes an electric field distribution simulation optimizer 16, Electric field distribution controller 15 and plating signal controller 13.
  • the electric field distribution controller 15 is electrically connected to the electroplating signal controller 13 and the electric field distribution simulation optimizer 16.
  • the electric field distribution simulation optimizer 16 uses the inputted initial cathode 2 morphology information, anode morphology, and initial anode surface current distribution as a model to perform the electric field between the electroplating anode and the cathode and the deposition of the electroplating material on the cathode.
  • the optimized anode surface current distribution is solved by the optimization algorithm, and the cathode morphology that is closer to the optimization target after this optimization is obtained at the same time, and will be optimized
  • the subsequent anode surface current distribution information is transmitted to the electric field distribution controller 15, and the electric field distribution controller 15 controls the electroplating signal controller 13 to output electroplating signals to the conductive unit 11.
  • the electric field distribution simulation optimizer 16 is set to model the cathode morphology, anode morphology, and current anode surface current distribution that are closer to the optimization target after the last optimization.
  • the electroplating material deposition is simulated.
  • a more optimized anode surface current distribution is obtained through optimization algorithm, and at the same time, the optimized cathode morphology that is closer to the optimization target is obtained, and the optimized anode surface is obtained.
  • the current distribution information is transmitted to the electric field distribution controller 15, and the electric field distribution controller 15 controls the electroplating signal controller 13 to output the electroplating signal to the conductive unit 11.
  • the electric field distribution simulation optimizer 16 repeats the above steps until the cathode morphology reaches The optimization target or the difference between the optimization target and the optimization target reaches a preset value. .
  • FIG. 12 is a schematic structural diagram of another electroplating anode provided by an embodiment of the application. Referring to FIG. 12, the conductive unit 11 is embedded and fixed in the insulating back plate 12.
  • a groove is provided on one side surface of the insulating back plate 12, and the needles 12 of all the conductive units 11 are fixed in the groove, and the needles 12 of all the conductive units 11 have the same distance from the insulating back plate 12 .
  • One end of the needle bar 111 of the conductive unit 11 is electrically connected to the needle 112, and the other end of the needle bar 111 of the conductive unit 11 is exposed from the other side surface of the insulating back plate 12.
  • the electroplating anode in the implementation of the present application may also include the electroplating signal controller 13, the electric field distribution controller 15, the electric field distribution simulation optimizer 16, or the cathode surface topography detector 17, which is not limited in the embodiment of the present application. .
  • FIG. 13 is a schematic structural diagram of another electroplating anode provided by an embodiment of the application.
  • the electroplating anode 1 further includes a plurality of drivers 141, and each driver 141 is connected to the end of the corresponding needle bar 111 away from the needle 112.
  • Each driver 141 is configured to control the distance between the needle 112 and the insulating back plate 12, and thus the distance between the needle 112 and the cathode 2 can be controlled.
  • the distance between each needle 112 and the insulating back plate 12 is different, and the electroplating signal (for example, the surface current density) of the end surface of the needle 112 is the same.
  • the electroplating anode 1 further includes a feeder plate 191, and all the conductive units 11 are electrically connected to the feeder plate 191.
  • the feeder board 191 provides the same plating signal to all the needles 112, so that the plating signal (for example, the surface current density) of the end faces of all the needles 112 is the same.
  • the electroplating anode 1 further includes a cathode surface topography detector 17, an electric field distribution simulation optimizer 16 and an electric field distribution controller 15.
  • the input end of the electric field distribution simulation optimizer 16 is electrically connected to the cathode surface profile detector 17, the output end of the electric field distribution simulation optimizer 16 is electrically connected to the electric field distribution controller 15, and the electric field distribution controller 15 is also electrically connected to the driver controller 14.
  • Connection, in the initial stage of electroplating the electric field distribution simulation optimizer 16 is set to obtain the initial cathode morphology information from the cathode surface morphology detector 17 to use the initial cathode morphology information, the initial anode morphology and the anode surface current
  • the distribution is a model.
  • the optimized anode morphology is solved by the optimization algorithm, and the optimized anode morphology information is transmitted to the electric field distribution controller 15.
  • the distribution controller 15 controls the driver controller 14 to transmit different control signals to each driver 141, and the control signals include different extension or retraction distances of each needle bar 111.
  • the electric field distribution simulation optimizer 16 is set to obtain real-time cathode morphology information from the cathode surface morphology detector 17 to obtain real-time cathode morphology information, anode surface current distribution, and current anode morphology.
  • a more optimized anode morphology is obtained through optimization algorithms, and the optimized anode morphology information is transmitted to the electric field distribution controller 15, and the electric field distribution controller 15 controls the driver controller 14 to Each driver 141 transmits different control signals.
  • the control signals include different extension or retraction distances of each needle bar 111.
  • the electric field distribution simulation optimizer 16 repeats the above steps to adjust the anode shape in real time until the cathode The topography reaches the optimization goal or the difference with the optimization goal reaches the preset value.
  • FIG. 14 is a schematic structural diagram of another electroplating anode provided by an embodiment of the application. The same parts as in FIG. 13 will not be repeated here.
  • the electroplating anode 1 also includes an electric field distribution simulation optimizer 16 and an electric field distribution control ⁇ 15.
  • the electric field distribution simulation optimizer 16 is electrically connected to the electric field distribution controller 15, and the electric field distribution controller 15 is also electrically connected to the driver controller 14.
  • the electric field distribution simulation optimizer 16 is set to use the initial shape information of the cathode 2 and the anode
  • the surface current distribution and the initial anode morphology are models.
  • the optimized anode morphology is solved by the optimization algorithm, and at the same time, the optimized anode morphology is obtained closer to the optimization target.
  • the cathode morphology of the cathode and the optimized anode morphology information is transferred to the electric field distribution controller 15.
  • the electric field distribution controller 15 controls the driver controller 14, and the driver controller 14 transmits different control signals to each driver 141. Including the different extension or retraction distance of each needle bar 111.
  • the electric field distribution simulation optimizer 16 is set as the model of the cathode morphology, anode surface current distribution and the current anode morphology that are closer to the optimization target after the last optimization.
  • the optimization algorithm is used to solve the model. Obtain a more optimized anode morphology, and at the same time obtain the optimized cathode morphology that is closer to the optimization target, and transmit the optimized anode morphology information to the electric field distribution controller 15, and the electric field distribution controller 15 controls the driver control
  • the driver controller 14 transmits different control signals to each driver 141.
  • the control signals include different extension or retraction distances of each needle bar 111.
  • the electric field distribution simulation optimizer 16 repeats the above steps , Real-time adjustment of the anode morphology, until the cathode morphology reaches the optimization target or the difference between the optimization target and the preset value.
  • the distance between each needle 112 and the insulating back plate 12 is different, and the electroplating signal (for example, the surface current density) of the end surface of the needle 112 is the same.
  • the electroplating anode 1 further includes a mold substrate 192, an adhesive layer 193, and a feeder plate 191.
  • the adhesive layer 193 is located on the mold substrate 192.
  • the shape of the mold base plate 192 facing the insulating back plate 12 is conformal or nearly conformal to the shape of the cathode 2, and the protruding part of the mold base plate 192 corresponds to the recessed part of the cathode 2.
  • the recessed part of the mold substrate 192 corresponds to the protruding part of the cathode 2.
  • the mold substrate 192 may be a polymer mold, for example.
  • the power feeding plate 191 is electrically connected to the plurality of conductive units 11 in contact.
  • the distance between each needle 112 and the insulating back plate 12 is different, and the electroplating signal (for example, the surface current density) of the end surface of the needle 112 is the same.
  • the adhesive layer 193 is a polymer binder or curing agent to fix the conductive unit 11.
  • the polymer binder or curing agent is insoluble in the electrolyte, but soluble in some solvents that are non-electrolyte components.
  • the mold substrate 192 and the back plate 12 are insoluble, which makes it possible to separate the mold substrate 192 from the back plate 12 and the conductive unit 11 if these solvents are used, so that the back plate 12 and the conductive unit 11 can be used repeatedly.
  • the electroplating anode 1 includes two insulating back plates 12, and the needle bar 111 is fixed on the two insulating back plates 12 through the end away from the needle.
  • the power feeding plate 191 is located between the two insulating back plates 12.
  • the power feeding plate 191 is located between the two insulating back plates 12, and the two insulating back plates 12 can be used to protect the power feeding plate 191.
  • the feed plate 191 is located between the two insulating back plates 12.
  • the feed plate 191 uses the space between the two insulating back plates 12 and does not occupy the space outside the two insulating back plates 12, thereby increasing The space utilization rate improves the integration degree of the components in the electroplating anode 1.
  • the electroplating anode 1 shown in FIG. 15 uses a mold substrate 192, an adhesive layer 193, and a feeder plate 191, so the shape of the electroplated anode 1 cannot be changed after it is formed, and the feeder plate 191 is provided for all the needles 112
  • the same electroplating signal makes the electroplating signal (for example, the surface current density) of all the end faces of the needle 112 the same at the same time.
  • the electroplating anode shown in FIG. 15 further includes: an electric field distribution simulation optimizer, an electric field distribution controller, and an electroplating signal controller;
  • the electric field distribution controller is electrically connected to the electroplating signal controller and the electric field distribution simulation optimizer, respectively, and the electroplating signal controller is electrically connected to the conductive unit;
  • the electroplating signal controller is set to apply electroplating signals to the conductive unit;
  • the electric field distribution simulation optimizer is set to input initial cathode morphology information, initial anode morphology, and initial anode surface before electroplating starts.
  • the current distribution is a model to simulate the electric field between the electroplating anode and the cathode and the deposition of electroplating substances on the cathode.
  • the optimization algorithm is used
  • the morphology of the mold substrate (the morphology of the electroplating anode) and the optimized anode surface current distribution are obtained by solving, and the optimized anode surface current distribution information is transferred to the electric field distribution controller, and the electric field distribution controller Controlling the electroplating signal output from the electroplating signal controller to the conductive unit.
  • the electroplating anode shown in FIG. 15 further includes: an electric field distribution simulation optimizer, an electric field distribution controller, and an electroplating signal controller;
  • the electric field distribution controller is electrically connected to the electroplating signal controller and the electric field distribution simulation optimizer, respectively, and the electroplating signal controller is electrically connected to the conductive unit;
  • the electroplating signal controller is set to apply electroplating signals to the conductive unit;
  • the electric field distribution simulation optimizer is set to input initial cathode morphology information, initial anode morphology, and initial anode surface before electroplating starts.
  • the current distribution is a model to simulate the electric field between the electroplating anode and the cathode and the deposition of electroplating substances on the cathode.
  • the optimization algorithm is used
  • the morphology of the mold substrate (the morphology of the electroplating anode) and the optimized anode surface current distribution are obtained by solving, and at the same time, the optimized cathode morphology that is closer to the optimization target is obtained, and the optimized
  • the anode surface current distribution information is transmitted to the electric field distribution controller, and the electric field distribution controller controls the electroplating signal output from the electroplating signal controller to the conductive unit; during the electroplating process, the electric field distribution simulation optimizer is set For the last optimized cathode morphology, the morphology of the electroplating anode and the current distribution of the current anode surface as a model that is closer to the optimization target, the electric field between the electroplating anode and the cathode and the current distribution on the cathode are modeled.
  • the electroplating material deposition is simulated.
  • the optimization algorithm is used to obtain a more optimized anode surface current distribution.
  • the optimized cathode morphology that is closer to the optimization target is obtained, and will be optimized.
  • the electric field distribution controller controls the electroplating signal output from the electroplating signal controller to the conductive unit.
  • the electric field distribution simulation optimizer The above steps are repeated until the topography of the cathode reaches the optimization target or the difference from the optimization target reaches a preset value.
  • FIG. 16 is a flow chart of an electroplating method using electroplating anodes according to an embodiment of the application.
  • the electroplating anode 1 and the cathode 2 to be electroplated form an electric field to form an electric field.
  • An electroplating layer is formed on the surface of the cathode 2.
  • the shape of the cathode 2 is uneven.
  • the electroplating anode 1 includes a conductive plate or a conductive mesh.
  • the shape of the conductive plate is conformal or approximately conformal to the shape of the cathode 2, and the conductive plate is convex.
  • the exposed part corresponds to the recessed part of the cathode 2, and the recessed part of the conductive plate corresponds to the protruding part of the cathode 2.
  • the electroplating method includes step S110 to step S140.
  • step S110 the morphology of the electroplating anode 1 is obtained according to the target morphology of the cathode 2.
  • the electric field distribution simulation optimizer uses the initial cathode morphology information, initial anode morphology, and initial anode current distribution as a model, according to the set optimization target (target morphology), that is, the specific distribution of the electroplated material on the cathode surface and The thickness is solved by the optimization algorithm to obtain the optimized electroplating anode morphology.
  • step S120 a mold substrate 192 is prepared according to the shape of the electroplating anode 1.
  • the topography of one side of the mold substrate 192 is conformal or nearly conformal to the topography of the cathode 2
  • the convex part of the mold substrate 192 corresponds to the concave part of the cathode 2
  • the concave part of the mold substrate 192 The part corresponds to the protruding part of the cathode 2.
  • step S130 the electroplating anode 1 is prepared according to the mold substrate 192.
  • step S140 a plating signal is applied to the plating anode 1.
  • the embodiment of the present application provides an electroplating method using an electroplating anode, which is used to form the electroplating anode shown in FIG. 1A, and the formed electroplating anode is used to realize electroplating of the cathode.
  • step S140 the electroplating signal applied to the electroplating anode 1 may be constant or changeable.
  • the following description of the electroplating anode shown in FIGS. 1B and 1C will be described in this application.
  • the electroplating anode 1 further includes a cathode surface topography detector 17, an electric field distribution simulation optimizer 16, an electric field distribution controller 15, and an electroplating signal controller 13; the input of the electric field distribution simulation optimizer 16 The terminal is electrically connected to the cathode surface topography detector 17, the output terminal of the electric field distribution simulation optimizer 16 is electrically connected to the electric field distribution controller 15, and the electric field distribution controller 15 is electrically connected to the electroplating signal controller 13. 13 is electrically connected to the conductive plate, and the electroplating signal controller 13 is configured to apply electroplating signals to the conductive plate;
  • the obtaining of the anode topography (corresponding to step S110) and the obtaining of the electroplating signal (corresponding to step S140) according to the target topography of the cathode includes:
  • the electric field distribution simulation optimizer 16 obtains the initial cathode morphology information from the cathode surface morphology detector 17 before the start of electroplating, and uses the initial cathode morphology information, the initial anode morphology, and the initial anode surface current distribution as The model simulates the electric field between the electroplating anode 1 and the cathode 2 and the deposition of the electroplating material on the cathode 2.
  • the electroplating anode 1 is obtained by the optimization algorithm.
  • the morphology that is, the morphology of the conductive plate in Figure 1A, once the conductive plate is formed, it cannot be changed
  • the optimized anode surface current distribution, and the optimized anode surface current distribution information is transferred to the electric field distribution controller 15.
  • the electric field distribution controller 15 controls the electroplating signal that the electroplating signal controller 13 outputs to the conductive plate; during the electroplating process, the electric field distribution simulation optimizer 16 is set to obtain real-time cathode topography information from the cathode surface topography detector 17 , Using real-time cathode morphology information, the morphology of the conductive plate and the current distribution of the current anode surface as a model to simulate the electric field between the electroplating anode 1 and the cathode 2 and the deposition of the electroplating material on the cathode 2, and optimize according to the settings The goal is to obtain a more optimized anode surface current distribution through the optimization algorithm, and transfer the optimized anode surface current distribution information to the electric field distribution controller 15, and the electric field distribution controller 15 controls the electroplating signal controller 13 to output to the conductive plate Electroplating signal; during the electroplating process, the electric field distribution simulation optimizer 16 repeats the above steps until the topography of the cathode 2 reaches the optimization target or
  • the electroplating anode 1 includes an electric field distribution simulation optimizer 16, an electric field distribution controller 15, and an electroplating signal controller 13;
  • the electric field distribution controller 15 is electrically connected to the electroplating signal controller 13 and the electric field distribution simulation optimizer 16, the electroplating signal controller 13 is electrically connected to the conductive plate; the electroplating signal controller 13 Configured to apply electroplating signals to the conductive plate;
  • the obtaining of the anode topography (corresponding to step S110) and the obtaining of the electroplating signal (corresponding to step S140) according to the target topography of the cathode includes:
  • the electric field distribution simulation optimizer 16 uses the inputted target topography information of the cathode, the initial anode topography, and the initial anode surface current distribution as a model to calculate the electric field between the electroplating anode 1 and the cathode 2. And the electroplating material deposition on the cathode 2 is simulated.
  • the set optimization target that is, the specific distribution and thickness of the electroplated material on the cathode 2 surface, the morphology of the electroplating anode 1 (ie, the conductive The topography of the plate, once the topography of the conductive plate in this embodiment is formed, it cannot be changed) and the optimized anode surface current distribution, and the optimized anode surface current distribution information is transmitted to the electric field distribution controller 15 ,
  • the electric field distribution controller 15 controls the electroplating signal that the electroplating signal controller 13 outputs to the conductive plate.
  • the optimization is performed only once before the start of electroplating to obtain the optimized electroplating signal. After that, during the electroplating process, the electroplating signal keeps the optimized electroplating signal unchanged.
  • the electroplating anode 1 includes: an electric field distribution simulation optimizer 16, an electric field distribution controller 15, and an electroplating signal controller 13;
  • the electric field distribution controller 15 is electrically connected to the electroplating signal controller 13 and the electric field distribution simulation optimizer 16, the electroplating signal controller 13 is electrically connected to the conductive plate; the electroplating signal controller 13 Configured to apply electroplating signals to the conductive plate;
  • the obtaining of the anode topography (corresponding to step S110) and the obtaining of the electroplating signal (corresponding to step S140) according to the target topography of the cathode includes:
  • the electric field distribution simulation optimizer 16 uses the inputted initial cathode morphology information, initial anode morphology, and initial anode surface current distribution as a model before the start of electroplating.
  • the electric field and the deposition of the electroplating material on the cathode 2 are simulated.
  • the set optimization target that is, the specific distribution and thickness of the electroplated material on the surface of the cathode 2
  • the morphology of the electroplating anode 1 is obtained by an optimization algorithm (i.e., Figure 1A Once the shape of the conductive plate is formed in this embodiment, it cannot be changed) and the optimized anode surface current distribution.
  • the optimized cathode morphology that is closer to the optimization target is obtained.
  • the optimized anode surface current distribution information is transferred to the electric field distribution controller 15, and the electric field distribution controller 15 controls the electroplating signal controller 13 to output the electroplating signal to the conductive plate; in the electroplating process
  • the electric field distribution simulation optimizer 16 is closer to the optimized target cathode morphology after the last optimization, the morphology of the electroplating anode 1 (ie the morphology of the conductive plate), and the current distribution of the anode surface current as a model,
  • the electric field between the electroplating anode 1 and the cathode 2 and the deposition of electroplating material on the cathode 2 are simulated.
  • the optimization algorithm is used to obtain a more optimized anode surface current distribution, and at the same time, the The secondary optimized cathode morphology that is closer to the optimization target, and the optimized anode surface current distribution information is transmitted to the electric field distribution controller 15, and the electric field distribution controller 15 controls the electroplating signal controller 13 to output to
  • the electric field distribution simulation optimizer 16 repeats the above steps until the topography of the cathode 2 reaches the optimization target or the difference with the optimization target reaches a predetermined value. Set value.
  • the electroplating signal is optimized in real time.
  • FIG. 17 is a schematic diagram of manufacturing an electroplating anode according to an embodiment of the application.
  • preparing the electroplating anode 1 according to the mold substrate 192 includes:
  • a conductive layer is coated or deposited on the mold substrate 192 to form the electroplating anode 1.
  • the optimized anode morphology is obtained by the electric field distribution simulation optimizer 16; according to the optimized anode morphology, the mold substrate 192 is prepared.
  • the mold substrate 192 may be a polymer mold, for example.
  • the electroplating anode 1 is formed by directly coating or depositing an insoluble conductive layer or a soluble conductive layer on the surface of the polymer mold.
  • FIG. 18 is a flowchart of the detailed steps included in step S130 in FIG. 16, and FIG. 19 is a schematic diagram of the production of another electroplating anode provided by an embodiment of this application.
  • the electroplating anode 1 is prepared according to the mold substrate 192 (That is, step S130) includes step S1321 to step S1322.
  • step S132 a planar conductive plate 102 is provided.
  • planar conductive plate 102 may be plate-shaped or mesh-shaped.
  • step S1322 the side of the mold substrate 192 and the cathode 2 that is conformal or nearly conformal is used to press the planar conductive plate 102 to deform the planar conductive plate 102 and conform to or approximately conform to the cathode 2, and remove The substrate 192 is molded to form the electroplating anode 1.
  • the mold substrate 192 may be a rigid mold.
  • Figure 20 is a flowchart of another electroplating method using electroplating anodes provided by an embodiment of the application. Based on the electroplating anode shown in Figures 2 to 15, refer to Figure 20, and Figures 2 to 15, where the electroplating anode 1 and the waiting The electroplated cathode 2 forms an electric field to form an electroplated layer on the surface of the cathode 2. The shape of the cathode 2 is uneven.
  • the electroplating anode 1 includes an insulating back plate 12 and a plurality of conductive units 11, and each conductive unit 11 includes a needle bar 111 and a set The needle 112 at one end of the needle bar 111, the end of the needle bar 111 provided with the needle 112 is the electroplating end of the conductive unit 11, and the conductive unit 11 is fixed on the insulating back plate 12 through the needle bar 111.
  • a plurality of conductive units 11 are arranged in an array, and any two conductive units 11 are electrically insulated.
  • the electroplating method includes step S210 to step S220.
  • step S210 the anode morphology and anode surface current distribution are obtained according to the target morphology of the cathode 2.
  • step S220 the distance between each needle 112 and the insulating back plate 12 is controlled according to the anode shape, and a separate electroplating signal is applied to each conductive unit 11 according to the anode surface current distribution; or, all the needles 112 are controlled to
  • the insulating backplanes 12 have the same distance, and each conductive unit 11 is controlled to apply a separate electroplating signal according to the anode surface current distribution; or, the distance between each needle 112 and the insulating backplane 12 is controlled according to the anode shape, Control to apply the same plating signal to all conductive units 11.
  • the anode morphology and anode surface current distribution can be obtained by the electric field distribution simulation optimizer 16.
  • the distance between each needle 112 and the insulating back plate 12 can be controlled according to the anode shape, and the individual electroplating signal applied to each conductive unit 11 can be controlled according to the anode surface current distribution.
  • all the needles 112 can be controlled to have the same distance from the insulating back plate 12, and a separate electroplating signal can be applied to each conductive unit 11 according to the current distribution of the anode surface.
  • each needle 112 and the insulating back plate 12 is controlled according to the shape of the anode, and the same electroplating signal is applied to all conductive units 11.
  • the embodiment of the present application provides an electroplating method using an electroplating anode, which is used to form the electroplating anode shown in FIGS. 2 to 15 and realize the electroplating of the cathode by using the formed electroplating anode.
  • FIG. 21 is a flowchart of another electroplating method using electroplating anode provided by an embodiment of the application.
  • the electroplating anode 1 includes a cathode surface topography detector 17 and Electric field distribution simulation optimizer 16.
  • the target morphology of the cathode 2 that is, the optimization target, that is, the specific distribution and thickness of the electroplated material on the cathode surface
  • obtaining the anode morphology and anode surface current includes steps S2111 to S2112.
  • step S2111 the cathode surface topography detector 17 detects the topography information of the cathode 2 in real time.
  • step S2112 the electric field distribution simulation optimizer 16 uses the real-time detection of the cathode morphology, the current anode morphology and the current anode surface current distribution as a model, and obtains the optimized anode morphology and current distribution in real time according to the target morphology information of the cathode 2. Optimized anode surface current distribution.
  • FIG. 22 is a flowchart of another electroplating method using electroplating anode provided by an embodiment of the application.
  • the electroplating anode 1 further includes an electric field distribution simulation optimizer 16.
  • the target morphology of the cathode 2 that is, the optimization target, that is, the specific distribution and thickness of the electroplated material on the cathode surface
  • obtaining the anode morphology and the anode surface current distribution includes step S2121.
  • step S2121 the electric field distribution simulation optimizer 16 uses the cathode morphology or the initial cathode morphology, the current anode morphology, and the current anode surface current distribution that are close to the optimization target after the last optimization as a model, and according to the target morphology of the cathode 2, Obtain optimized anode morphology and optimized anode surface current distribution.
  • the electroplating anode 1 includes a plurality of drivers 141, and each driver 141 is connected to the end of the corresponding needle bar 111 away from the needle 112, and each The driver 141 is configured to control the distance between the needle 112 and the insulating back plate 12.
  • controlling the distance between each needle 112 and the insulating back plate 12 according to the anode shape includes:
  • each driver 141 drives the conductive unit 11 connected to the driver 141 to move, so as to control the distance between each needle 112 and the insulating back plate 12.
  • the electroplating anode 1 further includes an insulating thread 114 and an insulating nut 113, the insulating nut 113 is fixed to the insulating back plate 12, the insulating thread 114 surrounds the needle rod 111, and the insulating thread 114 Thread butt with insulating nut 113.
  • controlling the distance between each needle 112 and the insulating back plate 12 according to the anode shape includes:
  • the insulating thread 114 in the insulating nut 113 is rotated to control the distance between each needle 112 and the insulating back plate 12.
  • FIG. 23 is a production flow chart of an electroplating anode provided by an embodiment of the application.
  • FIG. 24 is a production schematic diagram of another electroplating anode (see FIG. 15) provided by an embodiment of the application. Referring to FIG. 23, in step S220 , According to the anode shape to control the distance between each needle 112 and the insulating back plate 12, including step S2261 to step S2263.
  • a mold substrate 192 is prepared according to the anode morphology.
  • step S2262 the mold substrate 192 is used to press an end of the plurality of needle bars 111 opposite to the needle 112, so that the needles 112 of the plurality of conductive units 11 together present an anode shape.
  • step S2263 an adhesive or curing agent is filled between the mold substrate 192 and the insulating back plate 12, and the adhesive or curing agent is cured to form an adhesive layer 193.
  • step S2261 to step S2263 is shown in FIG. 15.
  • the electroplating process using the electroplating anode has been described in the foregoing embodiment of the present application, and will not be repeated here.
  • FIG. 25 is a schematic structural diagram of an electroplating apparatus provided by an embodiment of the application.
  • the electroplating apparatus includes two electroplating anodes 1 and a cathode 2, and the cathode 2 includes a first surface 21 and a second surface 22.
  • the two electroplating anodes 1 are respectively a first electroplating anode D1 and a second electroplating anode D2.
  • the first electroplating anode D1 is opposite to the first surface 21 of the cathode 2 and conforms to or approximately conformal to the topography of the first surface 21 of the cathode 2.
  • the first electroplating anode D1 and the cathode 2 form an electric field to form an electric field on the cathode 2
  • the first surface 21 forms a plating layer.
  • the second electroplating anode D2 is opposite to the second surface 22 of the cathode 2 and conforms to or approximately conformal to the shape of the second surface 22 of the cathode 2.
  • the second electroplating anode D2 and the cathode 2 form an electric field to form an electric field on the cathode 2
  • the second surface 22 forms a plating layer.
  • the first surface 21 and the second surface 22 of the cathode 2 to be electroplated can be electroplated simultaneously using the first electroplating anode D1 and the second electroplating anode D2.
  • the first surface 21 of the cathode 2 may be electroplated using the first electroplating anode D1 first, and then the second surface 22 of the cathode 2 may be electroplated using the second electroplating anode D2.
  • the second surface 22 of the cathode 2 may be electroplated using the second electroplating anode D2 first, and then the first surface 21 of the cathode 2 may be electroplated using the first electroplating anode D1.
  • the electroplating anode 1 (including the first electroplating anode D1 and the second electroplating anode D2) can adopt the electroplating anode in any of the above-mentioned embodiments.
  • the electroplating method of the electroplating anode 1 can adopt the electroplating method in any of the above-mentioned embodiments.

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Abstract

本申请实施例提供一种电镀阳极及使用该电镀阳极的电镀方法，所述电镀阳极与待电镀的阴极形成电场以在所述阴极的表面形成电镀层，所述阴极的形貌凹凸不平，所述电镀阳极包括一个导电板，所述导电板的形貌与所述阴极的形貌保形，所述导电板中凸出的部分与所述阴极中凹陷的部分对应，所述导电板中凹陷的部分与所述阴极中凸出的部分对应，或者，所述电镀阳极包括:绝缘背板；多个导电单元，每个所述导电单元包括针杆和设置于所述针杆一端的针头，所述针杆设置有所述针头的一端为所述导电单元的电镀端，所述导电单元通过所述针杆固定于所述绝缘背板上；多个所述导电单元阵列排布，且任意两个所述导电单元电绝缘；形成电镀阳极和待电镀阴极间的电场均匀分布，或者局部区域的电场增强或者减弱。

Description

一种电镀阳极及使用该电镀阳极的电镀方法
本申请要求在2019年9月29日提交中国专利局、申请号为201910935348.2的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请涉及印刷电路板电镀技术，例如一种电镀阳极及使用该电镀阳极的电镀方法。
背景技术
目前对相关技术中的制造技术和工艺，最具有挑战性的印刷电路板的特点如下：1.板厚度，达10厘米，或更厚。2.板面尺寸，达120厘米×120厘米，或更大。3.孔深宽比，达15:1，甚至20:1以上。4.密集排布的孔阵列和稀疏分布的零星孔同时存在；孔的深宽比，变化多样。高端印刷电路板制造商及其客户对上述印刷电路板质量要求或期望：1.在孔内，铜沉积的厚度达到所要求的厚度；同时在表面，铜沉积的厚度没有过厚。2.通孔内，铜的沉积实现“X”形状，甚至填满铜。3.在表面，铜的沉积分布均匀。
相关技术中各种制造技术和工艺的比较：
Figure PCTCN2020114157-appb-000001
Figure PCTCN2020114157-appb-000002
总之，制备上述厚的印刷电路板，挑战在于，相关技术无法同时达到以下性能要求：
1.在孔内，铜沉积的厚度达到所要求的厚度；
2.同时在表面，铜沉积的厚度没有过厚；
3.通孔内，铜的沉积实现“X”形状，甚至填满铜；在表面，铜的沉积分布均匀。
发明内容
本申请实施例提供一种电镀阳极及使用该电镀阳极的电镀方法，以实现阴极表面电镀均匀，或者阴极表面局域电镀加强。
第一方面，本申请实施例提供一种电镀阳极，所述电镀阳极与待电镀的阴极形成电场以在所述阴极的表面形成电镀层，所述阴极的形貌凹凸不平，所述电镀阳极包括一个导电板，所述导电板的形貌与所述阴极的形貌保形，所述导电板中凸出的部分与所述阴极中凹陷的部分对应，所述导电板中凹陷的部分与所述阴极中凸出的部分对应。
第二方面，本申请实施例提供一种电镀阳极，所述电镀阳极与待电镀的阴极形成电场以在所述阴极的表面形成电镀层，所述阴极的形貌凹凸不平，所述 电镀阳极包括:
绝缘背板；
多个导电单元，每个所述导电单元包括针杆和设置于所述针杆一端的针头，所述针杆设置有所述针头的一端为所述导电单元的电镀端，所述导电单元通过所述针杆远离所述针头的一端固定于所述绝缘背板上；多个所述导电单元阵列排布，且任意两个所述导电单元电绝缘。
第三方面，本申请实施例提供一种使用第一方面所述电镀阳极的电镀方法，所述电镀阳极与待电镀的阴极形成电场以在所述阴极的表面形成电镀层，所述阴极的形貌凹凸不平，所述电镀阳极包括一个导电板，所述导电板的形貌与所述阴极的形貌保形，所述导电板中凸出的部分与所述阴极中凹陷的部分对应，所述导电板中凹陷的部分与所述阴极中凸出的部分对应；
所述电镀方法包括：
根据所述阴极的目标形貌获取阳极形貌；
根据所述阳极形貌制备模具基板；所述模具基板一侧的形貌与所述阴极的形貌保形，所述模具基板中凸出的部分与所述阴极中凹陷的部分对应，所述模具基板中凹陷的部分与所述阴极中凸出的部分对应；
根据所述模具基板制备所述电镀阳极；
为所述电镀阳极施加电镀信号。
第四方面，本申请实施例提供一种使用第二方面所述电镀阳极的电镀方法，所述电镀阳极与待电镀的阴极形成电场以在所述阴极的表面形成电镀层，所述阴极的形貌凹凸不平，所述电镀阳极包括绝缘背板和多个导电单元，每个所述导电单元包括针杆和设置于所述针杆一端的针头，所述针杆设置有所述针头的一端为所述导电单元的电镀端，所述导电单元通过所述针杆固定于所述绝缘背板上；多个所述导电单元阵列排布，且任意两个所述导电单元电绝缘；
所述电镀方法包括：
根据所述阴极的形貌获取阳极形貌和阳极表面电流分布；
根据所述阳极形貌控制每个所述针头与所述绝缘背板之间的距离，根据所述阳极表面电流分布控制为每个所述导电单元施加单独的电镀信号；或者，控制所有的所述针头与所述绝缘背板之间具有相同的距离，根据所述阳极表面电流分布控制为每个所述导电单元施加单独的电镀信号；或者，根据所述阳极形貌控制每个所述针头与所述绝缘背板之间的距离，同时为所有所述导电单元施加相同的电镀信号。
第五方面，本申请提供了一种电镀装置，包括第一电镀阳极、第二电镀阳极及阴极；
其中，所述第一电镀阳极及所述第二电镀阳极均采用权利要求5所述的电镀阳极，所述阴极包括第一表面和第二表面，所述第一电镀阳极与所述阴极的第一表面的形貌保形，所述第二电镀阳极与所述阴极的第二表面的形貌保形，所述第一电镀阳极与所述阴极的第一表面相对，且与所述阴极形成电场，以在所述阴极的第一表面形成电镀层，所述第二电镀阳极与所述阴极的第二表面相对，且与所述阴极形成电场，以在所述阴极的第二表面形成电镀层。
附图说明
图1A为本申请一实施例提供的一种电镀阳极的结构示意图；
图1B为本申请一实施例提供的另一种电镀阳极的结构示意图；
图1C为本申请一实施例提供的又一种电镀阳极的结构示意图；
图2为本申请一实施例提供的又一种电镀阳极的结构示意图；
图3为图2中所示电镀阳极的俯视结构示意图；
图4为本申请一实施例提供的又一种电镀阳极的结构示意图；
图5为本申请一实施例提供的又一种电镀阳极的结构示意图；
图6为图5中所示电镀阳极的部分结构俯视图；
图7为本申请一实施例提供的又一种电镀阳极的结构示意图；
图8为本申请一实施例提供的又一种电镀阳极的结构示意图；
图9为本申请一实施例提供的又一种电镀阳极的结构示意图；
图10为本申请一实施例提供的又一种电镀阳极的结构示意图；
图11为本申请一实施例提供的又一种电镀阳极的结构示意图；
图12为本申请一实施例提供的又一种电镀阳极的结构示意图；
图13为本申请一实施例提供的又一种电镀阳极的结构示意图；
图14为本申请一实施例提供的又一种电镀阳极的结构示意图；
图15为本申请一实施例提供的又一种电镀阳极的结构示意图；
图16为本申请一实施例提供的一种使用电镀阳极的电镀方法流程图；
图17为本申请一实施例提供的一种电镀阳极的制作示意图；
图18为图16中步骤S130包括的详细步骤的流程图；
图19为本申请一实施例提供的另一种电镀阳极的制作示意图；
图20为本申请一实施例提供的另一种使用电镀阳极的电镀方法流程图；
图21为本申请一实施例提供的又一种使用电镀阳极的电镀方法流程图；
图22为本申请一实施例提供的又一种使用电镀阳极的电镀方法流程图；
图23为本申请一实施例提供的一种电镀阳极的制作流程图；
图24为本申请一实施例提供的又一种电镀阳极的制作示意图；
图25为本申请一实施例提供的一种电镀装置的结构示意图。
具体实施方式
研究人员发现，相关技术中，通常使用平面的板状或者网状的电镀阳极与待电镀的阴极形成电场，以在阴极表面形成需要电镀的金属。由于阴极的形貌凹凸不平，阴极中凸出的部分和电镀阳极形成的电场与阴极中凹陷的部分和电镀阳极形成的电场不同，导致阴极表面电镀不均匀。其中，需要电镀的阴极例如可以为印制电路板，阴极的形貌例如可以为印制电路板一侧表面的形貌或者两侧表面的形貌。
为了避免上述情况，本申请在一个总的申请构思下，提出了多种实施方式。 该总的申请构思为：根据阴极的形貌改变阳极形貌或者电镀阳极中多个部分的电镀信号，以使阴极表面电镀均匀，或使阴极表面局域电镀加强。
需要说明的是，本申请实施例中，阳极形貌(电镀阳极的形貌)为导电板的形貌或者多个导电单元的针头共同呈现的形貌，同样的，阳极表面电流分布(电镀阳极表面电流分布)为导电板的表面电流分布或者多个导电单元的针头的表面电流分布。
图1A为本申请一实施例提供的一种电镀阳极的结构示意图，参考图1A，电镀阳极1与待电镀的阴极2形成电场以在阴极2的表面形成电镀层(图1A中以阴极2的一侧表面凹凸不平为例进行示意)，阴极2的形貌凹凸不平，电镀阳极1包括一个导电板，导电板的形貌与阴极2的形貌保形或者近似保形，导电板中凸出的部分与阴极2中凹陷的部分对应，导电板中凹陷的部分与阴极2中凸出的部分对应。图1A仅示例性给出了导电板的形貌由连续的直折线构成的情况，在实际应用中，可以根据实际生产需要，合理设置导电板的形貌，本申请对此不进行限定。
在一实施例中，参见图1B，电镀阳极1还包括阴极表面形貌检测器17、电场分布仿真优化器16、电场分布控制器15以及电镀信号控制器13；电场分布仿真优化器16的输入端与阴极表面形貌检测器17电连接，电场分布仿真优化器16的输出端与电场分布控制器15电连接，电场分布控制器15与电镀信号控制器13电连接，所述电镀信号控制器13与所述导电板电连接，所述电镀信号控制器13设置为为所述导电板施加电镀信号；
电场分布仿真优化器16设置为在电镀开始之前，从阴极表面形貌检测器17获取初始的阴极的形貌信息，并以初始的阴极的形貌信息、初始的阳极形貌以及初始阳极表面电流分布为模型，对电镀阳极1和阴极2间的电场以及阴极2上电镀物质沉积进行仿真，根据设置的优化目标，即阴极表面电镀物的特定分布和厚度，通过优化算法求解得到所述电镀阳极1的形貌(即图1A中导电板的 形貌，该导电板形貌一旦形成，将不可以改变)和优化的阳极表面电流分布，并将优化后阳极表面电流分布信息传递至电场分布控制器15，电场分布控制器15控制电镀信号控制器13输出至导电板的电镀信号；在电镀过程中，电场分布仿真优化器16设置为从阴极表面形貌检测器17获取实时的阴极的形貌信息，以实时的阴极的形貌信息、所述导电板的形貌以及当前阳极表面电流分布为模型，对电镀阳极1和阴极2间的电场以及阴极2上电镀物质沉积进行仿真，根据设置的优化目标，通过优化算法求解得到更为优化的阳极表面电流分布，并将优化后的阳极表面电流分布信息传递至电场分布控制器15，电场分布控制器15控制电镀信号控制器13输出至导电板的电镀信号；电镀过程中，电场分布仿真优化器16重复上述步骤，直到阴极2的形貌达到优化目标或与优化目标的差值达到预设值。
需要说明的是，本申请实施例中，阴极表面形貌检测器17，可以通过X射线、γ射线、超声、光、或者电磁波等非接触式的方式，对阴极2的形貌信息进行扫描，进而得到阴极2的三维图像。
在一实施例中，参见图1C,电镀阳极1还包括：电场分布仿真优化器16、电场分布控制器15以及电镀信号控制器13；
所述电场分布控制器15分别与所述电镀信号控制器13以及所述电场分布仿真优化器16电连接，所述电镀信号控制器13与所述导电板电连接；
所述电镀信号控制器13设置为为所述导电板施加电镀信号；所述电场分布仿真优化器16设置为在电镀开始之前，以输入的初始的阴极的形貌信息、初始阳极形貌和初始阳极表面电流分布为模型，对所述电镀阳极1和所述阴极2间的电场以及所述阴极2上电镀物质沉积进行仿真，根据设置的优化目标，即所述阴极2表面电镀物的特定分布和厚度，通过优化算法求解得到所述电镀阳极1的形貌(即图1A中导电板的形貌，该导电板形貌一旦形成，将不可以改变)和优化的阳极表面电流分布，并将所述优化的阳极表面电流分布信息传递至所述电场分布控制器15，所述电场分布控制器15控制所述电镀信号控制器13输出至所述导电板的电镀信号。
在一实施例中，参见图1C，电镀阳极1还包括：电场分布仿真优化器16、电场分布控制器15以及电镀信号控制器13；
所述电场分布控制器15分别与所述电镀信号控制器13以及所述电场分布仿真优化器16电连接，所述电镀信号控制器13与所述导电板电连接；
所述电镀信号控制器13设置为为所述导电板施加电镀信号；所述电场分布仿真优化器16设置为在电镀开始之前，以输入的初始的阴极的形貌信息、初始阳极形貌和初始阳极表面电流分布为模型，对所述电镀阳极1和所述阴极2间的电场以及所述阴极2上电镀物质沉积进行仿真，根据设置的优化目标，即所述阴极2表面电镀物的特定分布和厚度，通过优化算法求解得到所述电镀阳极1的形貌(即图1A中导电板的形貌，该导电板形貌一旦形成，将不可以改变)和优化的阳极表面电流分布，同时得到本次优化后的更接近所述优化目标的阴极形貌，并将所述优化的阳极表面电流分布信息传递至所述电场分布控制器15，所述电场分布控制器15控制所述电镀信号控制器13输出至所述导电板的电镀信号；在电镀过程中，所述电场分布仿真优化器16设置为根据上一次优化后的更接近所述优化目标阴极形貌，以所述导电板的形貌和当前的阳极表面电流分布为模型，对所述电镀阳极1和所述阴极2间的电场以及所述阴极2上电镀物质沉积进行仿真，根据设置的所述优化目标，通过所述优化算法求解得到更为优化阳极表面电流分布，同时得到本次优化后的更接近所述优化目标的阴极形貌，并将优化后的阳极表面电流分布信息传递至所述电场分布控制器15，所述电场分布控制器15控制所述电镀信号控制器13输出至所述导电板的电镀信号，电镀过程中，所述电场分布仿真优化器16重复上述步骤，直到所述阴极2的形貌达到所述优化目标或与所述优化目标的差值达到预设值。
本申请实施例中，根据阴极的形貌改变阳极形貌，使电镀阳极与阴极的形貌保形或者近似保形，即电镀阳极凸出的部分与阴极中凹陷的部分对应，电镀阳极中凹陷的部分与阴极中凸出的部分对应。从而使阴极中各个部分与电镀阳极形成的电场相一致或者趋向一致，从而使阴极表面电镀均匀，或使阴极表面 局域电镀加强。
图2为本申请一实施例提供的又一种电镀阳极的结构示意图，图3为图2中所示电镀阳极的俯视结构示意图，参考图2和图3，电镀阳极1与待电镀的阴极2形成电场以在阴极2的表面形成电镀层，阴极2的形貌凹凸不平。电镀阳极1包括绝缘背板12和多个导电单元11。每个导电单元11包括针杆111和设置于针杆111一端的针头112。针杆111设置有针头112的一端为导电单元11的电镀端。导电单元11的针头112与阴极2之间形成电场，以将电镀液中的金属离子在阴极表面沉积形成对阴极2的电镀。例如可以在印制电路板上电镀形成铜层。导电单元11通过针杆111固定于绝缘背板12上。多个导电单元11阵列排布，且任意两个导电单元11电绝缘。
本申请实施例中，电镀阳极被离散化为多个互不接触的导电单元，即，连续的大的面被离散成小的点面，从而可以通过改变导电单元的针头到阴极的距离以改变阳极形貌，通过改变导电单元上施加的电镀信号的大小或者模式以改变电镀阳极中每个“小的点面”的电镀信号，以根据阴极的形貌改变阳极形貌和电镀阳极中每个“小的点面”的电镀信号中的至少之一，以使阴极表面电镀均匀，或使阴极表面局域电镀加强。其中，电镀信号例如可以为电流、电压或者功率，可以为直流电流或脉冲电流。
本申请实施例至少能够实现：
1、深宽比达15:1甚至20:1以上的孔内，实现孔内电场分布或者孔内壁表面电流分布可精确控制，实现孔内壁表面电镀物厚度可控，或者实现孔内填满电镀物(例如铜)。
2、电镀阳极的板面尺寸达120厘米×120厘米，板的表面电场分布或者表面电流分布可精确控制；实现表面电镀物分布均匀，实现表面电镀物厚度可控。
3.快速电镀。
在一实施例中，参考图3，针头112在绝缘背板12的垂直投影的形状为正 六边形。多个针头112阵列排布。多个针头112依次排列为一行，且相邻两行针头112之间错位排列。在其他实施方式中，针头112在绝缘背板12的垂直投影的形状还可以为正方形、长方形、圆形或者椭圆形等形状，本申请实施例对此不作限定。
图4为本申请一实施例提供的又一种电镀阳极的结构示意图，参考图4，电镀阳极1包括两个绝缘背板12，针杆111固定于两个绝缘背板12上。两个绝缘背板12增加了绝缘背板12与针杆111之间的牢固性，使针杆111不容易晃动，从而更精确地控制针头112的位置，以及针头112与阴极2之间的电场，以提高阴极2的电镀效果。
图5为本申请一实施例提供的又一种电镀阳极的结构示意图，参考图5，针头112背离绝缘背板12一侧的表面为凸曲面。凸曲面沿着背离绝缘背板12的方向凸起。本申请实施例中，凸曲面的针头112具增加了电镀阳极的表面积。在其他实施方式中，针头112背离绝缘背板12一侧的表面还可以为其他形状。
图6为图5中所示电镀阳极的部分结构俯视图，参考图5和图6，电镀阳极1还包括绝缘螺纹114和绝缘螺母113，绝缘螺母113固定于绝缘背板12上，绝缘螺纹114包围针杆111，绝缘螺纹114与绝缘螺母113螺纹对接。本申请实施例中，可以通过旋转绝缘螺母113中的绝缘螺纹114，以控制每个针头112与绝缘背板12之间的距离，进而控制每个针头112与阴极2之间的距离。
在一实施例中，参考图5，电镀阳极1还可以包括接线柱115，接线柱115位于针杆111远离针头112的一端，导电单元11的针杆111以及针头112可以通过与针杆111电连接的接线柱115与馈电线电连接。
图7为本申请一实施例提供的又一种电镀阳极的结构示意图，参考图7，针头112背离绝缘背板12一侧的表面为平面。由于针头112的形状为平面，针头112与阴极2形成的是局域均匀的电场，因此降低导电单元11的设置难度，降低成本。
图8为本申请一实施例提供的又一种电镀阳极的结构示意图，参考图8，电镀阳极1还包括电镀信号控制器13和多条馈电线132，一个导电单元11通过一条馈电线132与电镀信号控制器13电连接，电镀信号控制器13设置为为导电单元11施加电镀信号。
在一实施例中，参考图8和图9，电镀阳极1还包括驱动器控制器14和多个驱动器141，电场分布控制器15与驱动器控制器14电连接，驱动器控制器14和多个驱动器141电连接，每个驱动器141与对应针杆111远离针头112的一端相连接。电场分布控制器15控制驱动器控制器14输出至驱动器141的驱动信号，每个驱动器141设置为控制针头112与绝缘背板12之间的距离，进而调整电镀阳极的形貌，进而可以控制针头112与阴极2之间的距离。
在一实施例中，参考图8，电镀阳极1包括两个绝缘背板12，针杆111固定于两个绝缘背板12上，针杆111可沿垂直于绝缘背板12的方向移动，不可沿其他方向移动。馈电线132与导电单元11电连接的部分位于两个绝缘背板12之间。本申请实施例中，一方面，馈电线132与导电单元11电连接的部分位于两个绝缘背板12之间，可以使用两个绝缘背板12保护馈电线132。另一方面，馈电线132与导电单元11电连接的部分位于两个绝缘背板12之间，馈电线132与导电单元11电连接的部分利用两个绝缘背板12之间的空间，不占用两个绝缘背板12之外的空间，从而增加了空间利用率，提高了电镀阳极1中部件的集成度。
在一实施例中，电镀阳极1也可以仅包括一个绝缘背板12，针杆111固定于绝缘背板12上，针杆111可沿垂直于绝缘背板12的方向移动，不可沿其他方向移动。
在一实施例中，参考图8，电镀阳极1还包括阴极表面形貌检测器17、电场分布仿真优化器16和电场分布控制器15。电场分布仿真优化器16的输入端与阴极表面形貌检测器17电连接，电场分布仿真优化器16的输出端与电场分布控制器15电连接，电场分布控制器15还与电镀信号控制器13电连接，电场 分布控制器15还与驱动器控制器14电连接。在电镀初始阶段，电场分布仿真优化器16设置为从阴极表面形貌检测器17获取初始的阴极的形貌信息，以初始的阴极的形貌信息、初始阳极形貌以及初始阳极表面电流分布为模型，对电镀阳极和阴极间的电场以及阴极上电镀物质沉积进行仿真，根据设置的优化目标(阴极的目标形貌)，即阴极表面电镀物的特定分布和厚度，通过优化算法求解得到优化的阳极形貌和优化的阳极表面电流分布，并将优化后的阳极形貌和优化后的阳极表面电流分布信息传递至电场分布控制器15，电场分布控制器15控制电镀信号控制器13输出至导电单元11的电镀信号，电场分布控制器15控制驱动器控制器14向每个驱动器141传送不同的控制信号，控制信号包括每个针杆111不同的伸出或缩进距离，以调整阳极形貌。在电镀过程中，电场分布仿真优化器16设置为从阴极表面形貌检测器17获取实时的阴极的形貌信息，以实时的阴极的形貌信息、当前阳极形貌以及当前阳极表面电流分布为模型，对电镀阳极和阴极间的电场以及阴极上电镀物质沉积进行仿真，根据设置的优化目标，通过优化算法求解得到更为优化的阳极形貌和更为优化的阳极表面电流分布，并将优化后的阳极形貌和优化后的阳极表面电流分布信息传递至电场分布控制器15，电场分布控制器15控制电镀信号控制器13输出至导电单元11的电镀信号，电场分布控制器15控制驱动器控制器14，向每个驱动器141传送不同的控制信号，控制信号包括每个针杆111不同的伸出或缩进距离，以调整阳极形貌，电镀过程中，电场分布仿真优化器16重复上述步骤，直到阴极形貌达到优化目标或与优化目标的差值达到预设值。本申请实施例中，根据实时采集的阴极表面电镀物即时厚度及分布，根据电镀仿真软件对设定目标求解而得的较优的阳极形貌及馈电大小、模式及分布的结果，而实时调整阳极形貌和馈电大小、模式及分布，以这种方式工作的系统称之为“智能自适应可调节阳极”。
图9为本申请一实施例提供的又一种电镀阳极的结构示意图，参考图9，电镀阳极1还包括电场分布仿真优化器16、电场分布控制器15和电镀信号控制器13。电场分布仿真优化器16与电场分布控制器15电连接，电场分布控制器15 还与电镀信号控制器13电连接，电场分布控制器15还与驱动器控制器14电连接。在电镀的初始阶段，电场分布仿真优化器16以输入的初始的阴极2的形貌信息、初始的阳极形貌和初始阳极表面电流分布为模型，对电镀阳极和阴极间的电场以及阴极上电镀物质沉积进行仿真，根据设置的优化目标(阴极的目标形貌)，即阴极表面电镀物的特定分布和厚度，通过优化算法求解得到优化的阳极形貌和优化的阳极表面电流分布，同时得到本次优化后的更接近优化目标的阴极形貌，并将优化后的阳极形貌和优化后的阳极表面电流分布信息传递至电场分布控制器15，电场分布控制器15控制电镀信号控制器13输出至导电单元11的电镀信号，电场分布控制器15控制驱动器控制器14向每个驱动器141传送不同的控制信号，控制信号包括每个针杆111不同的伸出或缩进距离，以调整阳极形貌。在电镀过程中，电场分布仿真优化器16以上一次优化后的更接近优化目标的阴极形貌、当前的阳极形貌和当前的阳极表面电流分布为模型，对电镀阳极和阴极间的电场以及阴极上电镀物质沉积进行仿真，根据设置的优化目标，通过优化算法求解得到更为优化的阳极形貌和优化的阳极表面电流分布，同时得到本次优化后的更接近优化目标的阴极形貌，并将优化后的阳极形貌和优化后的阳极表面电流分布信息传递至电场分布控制器15，电场分布控制器15控制电镀信号控制器13输出至导电单元11的电镀信号，电场分布控制器15控制驱动器控制器14向每个驱动器141传送不同的控制信号，控制信号包括每个针杆111不同的伸出或缩进距离，以调整阳极形貌，电镀过程中，电场分布仿真优化器16重复上述步骤，直到阴极形貌达到优化目标或与优化目标的差值达到预设值。本申请实施例中，根据阴极初始形貌，根据电镀仿真软件对设定目标求解而得的较优的阳极形貌及馈电大小、模式及分布的结果，从而调整阳极形貌及馈电大小、模式及分布，以这种方式工作的系统称之为“智能可调节阳极”。
示例性地，参考图8和图9，导电单元11的针杆111和针头112由钛合金制作或者由钛合金表面包覆导电层制作。针杆111垂直插在绝缘背板12的孔里， 组成阵列。所有针头112在绝缘背板12的同一侧。在绝缘背板12的另一侧，每个针杆111与一个驱动器141连接，驱动器141驱动针杆111线性运动，从而决定针头112离绝缘背板12的相对距离。所有驱动器141由一个驱动器控制器14控制，驱动器控制器14向每个驱动器141传送不同的控制信号，包括每个针杆111不同的伸出或缩进距离。每个针头112通过针杆111及馈电线132馈入电镀信号，所有馈电线132连接到电镀信号控制器13，电镀信号控制器13决定每个针头112馈入电镀信号。驱动器控制器14和电镀信号控制器13由电场分布控制器15控制。
图10为本申请一实施例提供的又一种电镀阳极的结构示意图，参考图10，所有的针头112与绝缘背板12之间的距离相等。电镀阳极1还包括电镀信号控制器13和多条馈电线132，一个导电单元11通过一条馈电线132与电镀信号控制器13电连接，电镀信号控制器13设置为为导电单元11施加电镀信号。本申请实施例中，针头112离绝缘背板12的距离相同，即各个针头112端面组成一个大的平面，针头112端面的电镀信号(例如表面电流密度)各不相同。
示例性地，参考图10，电镀阳极1还包括阴极表面形貌检测器17、电场分布仿真优化器16和电场分布控制器15。电场分布仿真优化器16的输入端与阴极表面形貌检测器17电连接，电场分布仿真优化器16的输出端与电场分布控制器15电连接，电场分布控制器15还与电镀信号控制器13电连接。在电镀的初始阶段，电场分布仿真优化器16设置为从阴极表面形貌检测器17获取初始的阴极形貌信息，以初始的阴极的形貌信息、阳极形貌以及初始阳极表面电流分布为模型，对电镀阳极和阴极间的电场以及阴极上电镀物质沉积进行仿真，根据设置的优化目标，即阴极表面电镀物的特定分布和厚度，通过优化算法求解得到优化的阳极表面电流分布，并将优化后的阳极表面电流分布信息传递至电场分布控制器15，电场分布控制器15控制电镀信号控制器13输出至导电单元11的电镀信号。在电镀过程中，电场分布仿真优化器16设置为从阴极表面形貌检测器17获取实时的阴极的形貌信息，以实时的阴极的形貌信息、阳极形 貌和当前阳极表面电流分布为模型，对电镀阳极和阴极间的电场以及阴极上电镀物质沉积进行仿真，根据设置的优化目标，通过优化算法求解得到更为优化的阳极表面电流分布，并将优化后的阳极表面电流分布信息传递至电场分布控制器15，电场分布控制器15控制电镀信号控制器13输出至导电单元11的电镀信号；电镀过程中，电场分布仿真优化器16重复上述步骤，直到阴极形貌达到优化目标或与优化目标的差值达到预设值。
图11为本申请一实施例提供的又一种电镀阳极的结构示意图，所有的针头112与绝缘背板12之间的距离相等，参考图11，电镀阳极1还包括电场分布仿真优化器16、电场分布控制器15和电镀信号控制器13。电场分布控制器15与电镀信号控制器13以及电场分布仿真优化器16电连接。在电镀初始阶段，电场分布仿真优化器16以输入的初始的阴极2的形貌信息、阳极形貌和初始阳极表面电流分布为模型，对电镀阳极和阴极间的电场以及阴极上电镀物质沉积进行仿真，根据设置的优化目标，即阴极表面电镀物的特定分布和厚度，通过优化算法求解得到优化的阳极表面电流分布，同时得到本次优化后的更接近优化目标的阴极形貌，并将优化后的阳极表面电流分布信息传递至电场分布控制器15，电场分布控制器15控制电镀信号控制器13输出至导电单元11的电镀信号。在电镀过程中，电场分布仿真优化器16设置为以上一次优化后的更接近优化目标的阴极形貌、阳极形貌和当前的阳极表面电流分布为模型，对电镀阳极和阴极间的电场以及阴极上电镀物质沉积进行仿真，根据设置的优化目标，通过优化算法求解得到更为优化的阳极表面电流分布，同时得到本次优化后的更接近优化目标的阴极形貌，并将优化后的阳极表面电流分布信息传递至电场分布控制器15，电场分布控制器15控制电镀信号控制器13输出至导电单元11的电镀信号；电镀过程中，电场分布仿真优化器16重复上述步骤，直到阴极形貌达到优化目标或与优化目标的差值达到预设值。。
图12为本申请一实施例提供的又一种电镀阳极的结构示意图，参考图12，导电单元11镶嵌固定于绝缘背板12中。
示例性地，参考图12，绝缘背板12的一侧表面设置有凹槽，所有导电单元11的针头12固定于凹槽中，所有导电单元11的针头12与绝缘背板12具有相同的距离。导电单元11的针杆111的一端与针头112电连接，导电单元11的针杆111的另一端由绝缘背板12的另一侧表面露出。需要说明的是，本申请实施中的电镀阳极还可以包括电镀信号控制器13、电场分布控制器15、电场分布仿真优化器16或者阴极表面形貌检测器17，本申请实施例对此不作限定。
图13为本申请一实施例提供的又一种电镀阳极的结构示意图，参考图13，电镀阳极1还包括多个驱动器141，每个驱动器141与对应针杆111远离针头112的一端相连接，每个驱动器141设置为控制针头112与绝缘背板12之间的距离，进而可以控制针头112与阴极2之间的距离。本申请实施例中，各个针头112离绝缘背板12的距离不同，针头112端面的电镀信号(例如表面电流密度)相同。
示例性地，参考图13，电镀阳极1还包括馈电板191，所有的导电单元11与馈电板191电连接。通过馈电板191为所有的针头112提供相同的电镀信号，使所有针头112端面的电镀信号(例如表面电流密度)相同。
示例性地，参考图13，电镀阳极1还包括阴极表面形貌检测器17、电场分布仿真优化器16和电场分布控制器15。电场分布仿真优化器16的输入端与阴极表面形貌检测器17电连接，电场分布仿真优化器16的输出端与电场分布控制器15电连接，电场分布控制器15还与驱动器控制器14电连接，在电镀初始阶段，电场分布仿真优化器16设置为从阴极表面形貌检测器17获取的初始的阴极的形貌信息，以初始的阴极的形貌信息、初始阳极形貌以及阳极表面电流分布为模型，根据设置的优化目标，即阴极表面电镀物的特定分布和厚度，通过优化算法求解得到优化的阳极形貌，并将优化后的阳极形貌信息传递至电场分布控制器15，电场分布控制器15控制驱动器控制器14向每个驱动器141传送不同的控制信号，控制信号包括每个针杆111不同的伸出或缩进距离。在电镀过程中，电场分布仿真优化器16设置为从阴极表面形貌检测器17获取的实 时的阴极的形貌信息，以实时的阴极的形貌信息、阳极表面电流分布以及当前的阳极形貌为模型，根据设置的优化目标，通过优化算法求解得到更为优化的阳极形貌，并将优化后的阳极形貌信息传递至电场分布控制器15，电场分布控制器15控制驱动器控制器14向每个驱动器141传送不同的控制信号，控制信号包括每个针杆111不同的伸出或缩进距离，在电镀过程中，电场分布仿真优化器16重复上述步骤，实时调整阳极形貌，直到阴极形貌达到优化目标或与优化目标的差值达到预设值。
图14为本申请一实施例提供的又一种电镀阳极的结构示意图，与图13相同之处在此不再赘述，参考图14，电镀阳极1还包括电场分布仿真优化器16和电场分布控制器15。电场分布仿真优化器16与所述电场分布控制器15电连接，电场分布控制器15还与驱动器控制器14电连接，电场分布仿真优化器16设置为以初始的阴极2的形貌信息、阳极表面电流分布和初始阳极形貌为模型，根据设置的优化目标，即阴极表面电镀物的特定分布和厚度，通过优化算法求解得到优化的阳极形貌，同时得到本次优化后的更接近优化目标的阴极形貌，并将优化后的阳极形貌信息传递至电场分布控制器15，电场分布控制器15控制驱动器控制器14，驱动器控制器14向每个驱动器141传送不同的控制信号，控制信号包括每个针杆111不同的伸出或缩进距离。在电镀过程中，电场分布仿真优化器16设置为以上一次优化后的更接近优化目标的阴极形貌、阳极表面电流分布以及当前的阳极形貌为模型，根据设置的优化目标，通过优化算法求解得到更为优化的阳极形貌，同时得到本次优化后的更接近优化目标的阴极形貌，并将优化后的阳极形貌信息传递至电场分布控制器15，电场分布控制器15控制驱动器控制器14控制，驱动器控制器14向每个驱动器141传送不同的控制信号，控制信号包括每个针杆111不同的伸出或缩进距离，在电镀过程中，电场分布仿真优化器16重复上述步骤，实时调整阳极形貌，直到阴极形貌达到优化目标或与优化目标的差值达到预设值。本申请实施例中，各个针头112离绝缘背板12的距离不同，针头112端面的电镀信号(例如表面电流密度)相同。
图15为本申请一实施例提供的又一种电镀阳极的结构示意图，参考图15，电镀阳极1还包括模具基板192、粘结层193和馈电板191，粘结层193位于模具基板192与绝缘背板12之间，模具基板192朝向绝缘背板12一侧的形貌与阴极2的形貌保形或近似保形，模具基板192中凸出的部分与阴极2中凹陷的部分对应，模具基板192中凹陷的部分与阴极2中凸出的部分对应。模具基板192例如可以为聚合物模具。馈电板191与多个导电单元11接触电连接。本申请实施例中，各个针头112离绝缘背板12的距离不同，针头112端面的电镀信号(例如表面电流密度)相同。粘结层193为聚合物粘结剂或固化剂以固定导电单元11，聚合物粘结剂或固化剂不溶于电解液，但可溶于非电解液成分的一些溶剂，在这些溶剂中模具基板192和背板12不溶，这使得如果使用这些溶剂，可使得模具基板192与背板12和导电单元11脱开，从而可反复使用背板12和导电单元11。
在一实施例中，参考图15，电镀阳极1包括两个绝缘背板12，针杆111通过远离针头的一端固定于两个绝缘背板12上。馈电板191位于两个绝缘背板12之间。本申请实施例中，一方面，馈电板191位于两个绝缘背板12之间，可以使用两个绝缘背板12保护馈电板191。另一方面，馈电板191位于两个绝缘背板12之间，馈电板191利用两个绝缘背板12之间的空间，不占用两个绝缘背板12之外的空间，从而增加了空间利用率，提高了电镀阳极1中部件的集成度。
图15所述的电镀阳极1由于采用了模具基板192、粘结层193和馈电板191，所以电镀阳极1的形貌形成之后，不可以改变，且馈电板191为所有的针头112提供相同的电镀信号，使同一时间所有针头112端面的电镀信号(例如表面电流密度)相同。
在一实施例中，图15所述电镀阳极还包括：电场分布仿真优化器、电场分布控制器以及电镀信号控制器；
所述电场分布控制器分别与所述电镀信号控制器以及所述电场分布仿真优化器电连接，所述电镀信号控制器与所述导电单元电连接；
所述电镀信号控制器设置为为所述导电单元施加电镀信号；所述电场分布仿真优化器设置为在电镀开始之前，以输入的初始的阴极的形貌信息、初始阳极形貌和初始阳极表面电流分布为模型，对所述电镀阳极和所述阴极间的电场以及所述阴极上电镀物质沉积进行仿真，根据设置的优化目标，即所述阴极表面电镀物的特定分布和厚度，通过优化算法求解得到模具基板的形貌(所述电镀阳极的形貌)和优化的阳极表面电流分布，并将所述优化的阳极表面电流分布信息传递至所述电场分布控制器，所述电场分布控制器控制所述电镀信号控制器输出至所述导电单元的电镀信号。
在一实施例中，图15所述的电镀阳极还包括：电场分布仿真优化器、电场分布控制器以及电镀信号控制器；
所述电场分布控制器分别与所述电镀信号控制器以及所述电场分布仿真优化器电连接，所述电镀信号控制器与所述导电单元电连接；
所述电镀信号控制器设置为为所述导电单元施加电镀信号；所述电场分布仿真优化器设置为在电镀开始之前，以输入的初始的阴极的形貌信息、初始阳极形貌和初始阳极表面电流分布为模型，对所述电镀阳极和所述阴极间的电场以及所述阴极上电镀物质沉积进行仿真，根据设置的优化目标，即所述阴极表面电镀物的特定分布和厚度，通过优化算法求解得到所述模具基板的形貌(所述电镀阳极的形貌)和优化的阳极表面电流分布，同时得到本次优化后的更接近所述优化目标的阴极形貌，并将所述优化的阳极表面电流分布信息传递至所述电场分布控制器，所述电场分布控制器控制所述电镀信号控制器输出至所述导电单元的电镀信号；在电镀过程中，所述电场分布仿真优化器设置为以上一次优化后的更接近所述优化目标阴极形貌、所述电镀阳极的形貌和当前的阳极表面电流分布为模型，对所述电镀阳极和所述阴极间的电场以及所述阴极上电镀物质沉积进行仿真，根据设置的所述优化目标，通过所述优化算法求解得到更为优化阳极表面电流分布，同时得到本次优化后的更接近所述优化目标的阴极形貌，并将优化后的阳极表面电流分布信息传递至所述电场分布控制器，所 述电场分布控制器控制所述电镀信号控制器输出至所述导电单元的电镀信号，电镀过程中，所述电场分布仿真优化器重复上述步骤，直到所述阴极形貌达到所述优化目标或与所述优化目标的差值达到预设值。
图16为本申请一实施例提供的一种使用电镀阳极的电镀方法流程图，基于图1A所示的电镀阳极，参考图16，以及图1A，电镀阳极1与待电镀的阴极2形成电场以在阴极2的表面形成电镀层，阴极2的形貌凹凸不平，电镀阳极1包括一个导电板或导电网，导电板的形貌与阴极2的形貌保形或者近似保形，导电板中凸出的部分与阴极2中凹陷的部分对应，导电板中凹陷的部分与阴极2中凸出的部分对应。电镀方法包括步骤S110至步骤S140。
在步骤S110中，根据阴极2的目标形貌获取电镀阳极1的形貌。
示例性地，电场分布仿真优化器以初始的阴极的形貌信息、初始阳极形貌和初始阳极电流分布为模型，根据设置的优化目标(目标形貌)，即阴极表面电镀物的特定分布和厚度，通过优化算法求解得到优化的电镀阳极形貌。
在步骤S120中，根据电镀阳极1的形貌制备模具基板192。
其中，模具基板192一侧的形貌与阴极2的形貌保形或者近似保形，模具基板192中该侧凸出的部分与阴极2中凹陷的部分对应，模具基板192中该侧凹陷的部分与阴极2中凸出的部分对应。
在步骤S130中，根据模具基板192制备电镀阳极1。
在步骤S140中，为电镀阳极1施加电镀信号。
本申请实施例提供一种使用电镀阳极的电镀方法，用于形成图1A所示的电镀阳极，并利用形成的电镀阳极实现对阴极的电镀。
需要说明的是，步骤S140中，为电镀阳极1施加的电镀信号可以是不变的，也可以是变化的，下面本申请结合图1B及1C所示的电镀阳极的进行介绍。
在一实施例中，参见图1B，电镀阳极1还包括阴极表面形貌检测器17、电 场分布仿真优化器16、电场分布控制器15以及电镀信号控制器13；电场分布仿真优化器16的输入端与阴极表面形貌检测器17电连接，电场分布仿真优化器16的输出端与电场分布控制器15电连接，电场分布控制器15与电镀信号控制器13电连接，所述电镀信号控制器13与所述导电板电连接，所述电镀信号控制器13设置为为所述导电板施加电镀信号；
所述根据所述阴极的目标形貌获取阳极形貌(对应于步骤S110)以及所述电镀信号的获取(对应于步骤S140)，包括：
电场分布仿真优化器16在电镀开始之前，从阴极表面形貌检测器17获取初始的阴极的形貌信息，并以初始的阴极的形貌信息、初始的阳极形貌以及初始阳极表面电流分布为模型，对电镀阳极1和阴极2间的电场以及阴极2上电镀物质沉积进行仿真，根据设置的优化目标，即阴极2表面电镀物的特定分布和厚度，通过优化算法求解得到所述电镀阳极1的形貌(即图1A中导电板的形貌，该导电板形貌一旦形成，将不可以改变)和优化的阳极表面电流分布，并将优化后阳极表面电流分布信息传递至电场分布控制器15，电场分布控制器15控制电镀信号控制器13输出至导电板的电镀信号；在电镀过程中，电场分布仿真优化器16设置为从阴极表面形貌检测器17获取实时的阴极的形貌信息，以实时的阴极的形貌信息、所述导电板的形貌以及当前阳极表面电流分布为模型，对电镀阳极1和阴极2间的电场以及阴极2上电镀物质沉积进行仿真，根据设置的优化目标，通过优化算法求解得到更为优化的阳极表面电流分布，并将优化后的阳极表面电流分布信息传递至电场分布控制器15，电场分布控制器15控制电镀信号控制器13输出至导电板的电镀信号；电镀过程中，电场分布仿真优化器16重复上述步骤，直到阴极2的形貌达到优化目标或与优化目标的差值达到预设值。本实施方式中，在电镀过程中，对电镀信号进行实时优化。
在一实施例中，参见图1C，所述电镀阳极1包括电场分布仿真优化器16、电场分布控制器15以及电镀信号控制器13；
所述电场分布控制器15分别与所述电镀信号控制器13以及所述电场分布仿真优化器16电连接，所述电镀信号控制器13与所述导电板电连接；所述电镀信号控制器13设置为为所述导电板施加电镀信号；
所述根据所述阴极的目标形貌获取阳极形貌(对应于步骤S110)以及所述电镀信号的获取(对应于步骤S140)，包括：
所述电场分布仿真优化器16在电镀开始之前，以输入的阴极的目标形貌信息、初始阳极形貌和初始阳极表面电流分布为模型，对所述电镀阳极1和所述阴极2间的电场以及所述阴极2上电镀物质沉积进行仿真，根据设置的优化目标，即所述阴极2表面电镀物的特定分布和厚度，通过优化算法求解得到所述电镀阳极1形貌(即图1A中导电板的形貌，本实施例中该导电板形貌一旦形成，将不可以改变)和优化的阳极表面电流分布，并将所述优化的阳极表面电流分布信息传递至所述电场分布控制器15，所述电场分布控制器15控制所述电镀信号控制器13输出至所述导电板的电镀信号。本实施方式中，仅在电镀开始之前进行一次优化，得到优化后的电镀信号，此后，在电镀过程中，电镀信号保持该优化后的电镀信号不变。
在一实施例中，参见图1C，所述电镀阳极1包括：电场分布仿真优化器16、电场分布控制器15以及电镀信号控制器13；
所述电场分布控制器15分别与所述电镀信号控制器13以及所述电场分布仿真优化器16电连接，所述电镀信号控制器13与所述导电板电连接；所述电镀信号控制器13设置为为所述导电板施加电镀信号；
所述根据所述阴极的目标形貌获取阳极形貌(对应于步骤S110)以及所述电镀信号的获取(对应于步骤S140)，包括：
所述电场分布仿真优化器16在电镀开始之前，以输入的初始的阴极的形貌信息、初始阳极形貌和初始阳极表面电流分布为模型，对所述电镀阳极1和所述阴极2间的电场以及所述阴极2上电镀物质沉积进行仿真，根据设置的优化 目标，即所述阴极2表面电镀物的特定分布和厚度，通过优化算法求解得到所述电镀阳极1的形貌(即图1A中导电板的形貌，本实施例中该导电板形貌一旦形成，将不可以改变)和优化的阳极表面电流分布，同时得到本次优化后的更接近优化目标的阴极形貌，并将所述优化的阳极表面电流分布信息传递至所述电场分布控制器15，所述电场分布控制器15控制所述电镀信号控制器13输出至所述导电板的所述电镀信号；在电镀过程中，所述电场分布仿真优化器16以上一次优化后的更接近优化目标阴极形貌、所述电镀阳极1的形貌(即导电板的形貌)和当前的阳极表面电流分布为模型，对所述电镀阳极1和所述阴极2间的电场以及所述阴极2上电镀物质沉积进行仿真，根据设置的所述优化目标，通过所述优化算法求解得到更为优化阳极表面电流分布，同时得到本次优化后的更接近优化目标的阴极形貌，并将优化后的阳极表面电流分布信息传递至所述电场分布控制器15，所述电场分布控制器15控制所述电镀信号控制器13输出至所述导电板的所述电镀信号，电镀过程中，所述电场分布仿真优化器16重复上述步骤，直到所述阴极2的形貌达到所述优化目标或与所述优化目标的差值达到预设值。本实施方式中，在电镀过程中，对电镀信号进行实时优化。
图17为本申请一实施例提供的一种电镀阳极的制作示意图，参考图17，根据模具基板192制备电镀阳极1(即步骤S130)包括：
在模具基板192上涂覆或沉积导电层以形成电镀阳极1。
示例性地，由电场分布仿真优化器16得到优化的阳极形貌；根据优化的阳极形貌，制备模具基板192。模具基板192例如可以为聚合物模具。在该聚合物模具表面直接涂敷或沉积不溶性导电层或者可溶性导电层形成电镀阳极1。
图18为图16中步骤S130包括的详细步骤的流程图，图19为本申请一实施例提供的另一种电镀阳极的制作示意图，参考图18和图19，根据模具基板192制备电镀阳极1(即步骤S130)包括步骤S1321至步骤S1322。
在步骤S1321中，提供一平面状的导电板102。
其中，平面状的导电板102可以为板状或者网状。
在步骤S1322中，利用模具基板192与阴极2保形或近似保形的一侧按压平面状的导电板102，以使平面状的导电板102变形并与阴极2保形或者近似保形，去除模具基板192以形成电镀阳极1。
示例性地，模具基板192可以为刚性模具。
图20为本申请一实施例提供的另一种使用电镀阳极的电镀方法流程图，基于图2-图15所示的电镀阳极，参考图20，以及图2-图15，电镀阳极1与待电镀的阴极2形成电场以在阴极2的表面形成电镀层，阴极2的形貌凹凸不平，电镀阳极1包括绝缘背板12和多个导电单元11，每个导电单元11包括针杆111和设置于针杆111一端的针头112，针杆111设置有针头112的一端为导电单元11的电镀端，导电单元11通过针杆111固定于绝缘背板12上。多个导电单元11阵列排布，且任意两个导电单元11电绝缘。电镀方法包括步骤S210至步骤S220。
在步骤S210中，根据阴极2的目标形貌获取阳极形貌和阳极表面电流分布。
在步骤S220中，根据阳极形貌控制每个针头112与绝缘背板12之间的距离，根据阳极表面电流分布控制为每个导电单元11施加单独的电镀信号；或者，控制所有的针头112与绝缘背板12之间具有相同的距离，根据阳极表面电流分布控制为每个导电单元11施加单独的电镀信号；或者，根据阳极形貌控制每个针头112与绝缘背板12之间的距离，控制为所有导电单元11施加相同的电镀信号。
其中，阳极形貌和阳极表面电流分布可以由电场分布仿真优化器16得到。
示例性地，结合参考图8和图9，可以根据阳极形貌控制每个针头112与绝缘背板12之间的距离，根据阳极表面电流分布控制为每个导电单元11施加的单独电镀信号。
示例性地，结合参考图10和图11，可以控制所有的针头112与绝缘背板 12之间具有相同的距离，根据阳极表面电流分布控制为每个导电单元11施加单独的电镀信号。
示例性地，结合参考图13、图14和图15，根据阳极形貌控制每个针头112与绝缘背板12之间的距离，控制为所有导电单元11施加相同的电镀信号。
本申请实施例提供一种使用电镀阳极的电镀方法，用于形成图2-图15所示的电镀阳极，并利用形成的电镀阳极实现对阴极的电镀。
图21为本申请一实施例提供的又一种使用电镀阳极的电镀方法流程图，参考图8、图10、图13、图20和图21，电镀阳极1包括阴极表面形貌检测器17和电场分布仿真优化器16。根据阴极2的目标形貌，即优化目标，也即阴极表面电镀物的特定分布和厚度，获取阳极形貌和阳极表面电流(即步骤S210)包括步骤S2111至步骤S2112。
在步骤S2111中，阴极表面形貌检测器17实时检测阴极2的形貌信息。
在步骤S2112中，电场分布仿真优化器16以实时检测的阴极形貌、及当前阳极形貌和当前阳极表面电流分布为模型，根据阴极2的目标形貌信息，实时获取优化的阳极形貌和优化的阳极表面电流分布。
图22为本申请一实施例提供的又一种使用电镀阳极的电镀方法流程图，参考图9、图11、图14、图20和图22，电镀阳极1还包括电场分布仿真优化器16。根据阴极2的目标形貌，即优化目标，也即阴极表面电镀物的特定分布和厚度，获取阳极形貌和阳极表面电流分布(即步骤S210)包括步骤S2121。
在步骤S2121中，电场分布仿真优化器16以上一次优化后的接近优化目标的阴极形貌或初始阴极形貌、当前阳极形貌和当前阳极表面电流分布为模型，根据阴极2的目标形貌，获取优化的阳极形貌和优化的阳极表面电流分布。
在一实施例中，参考图8、图9、图13、图14和图20，电镀阳极1包括多个驱动器141，每个驱动器141与对应针杆111远离针头112的一端相连接，每个驱动器141设置为控制针头112与绝缘背板12之间的距离。步骤S220中， 根据阳极形貌控制每个针头112与绝缘背板12之间的距离，包括：
根据阳极形貌使每个驱动器141驱动与该驱动器141连接的导电单元11运动，以控制每个针头112与绝缘背板12之间的距离。
在一实施例中，参考图5、图7和图20，电镀阳极1还包括绝缘螺纹114和绝缘螺母113，绝缘螺母113固定于绝缘背板12，绝缘螺纹114包围针杆111，绝缘螺纹114与绝缘螺母113螺纹对接。步骤S220中，根据阳极形貌控制每个针头112与绝缘背板12之间的距离，包括：
根据阳极形貌，旋转在绝缘螺母113中的绝缘螺纹114，以控制每个针头112与绝缘背板12之间的距离。
图23为本申请一实施例提供的一种电镀阳极的制作流程图，图24为本申请一实施例提供的又一种电镀阳极(参见图15)的制作示意图，参考图23，步骤S220中，根据阳极形貌控制每个针头112与绝缘背板12之间的距离，包括步骤S2261至步骤S2263。
在步骤S2261中，根据阳极形貌制备模具基板192。
在步骤S2262中，使用模具基板192按压多个针杆111与针头112相对的一端，以使多个导电单元11的针头112共同呈现阳极形貌。
在步骤S2263中，在模具基板192与绝缘背板12之间填充粘结剂或者固化剂，并固化粘结剂或者固化剂形成粘结层193。
根据步骤S2261至步骤S2263制作的电镀阳极，参见图15所示，使用该电镀阳极的电镀过程，在本申请上述实施例中已经说明，在此不再进行赘述。
图25为本申请一实施例提供的一种电镀装置的结构示意图，参考图25，该电镀装置包括两个电镀阳极1及阴极2，阴极2包括第一表面21和第二表面22。两个电镀阳极1分别为第一电镀阳极D1和第二电镀阳极D2。第一电镀阳极D1与阴极2的第一表面21相对，并与阴极2的第一表面21的形貌保形或者近似 保形，第一电镀阳极D1与阴极2形成电场，以在阴极2的第一表面21形成电镀层。第二电镀阳极D2与阴极2的第二表面22相对，并与阴极2的第二表面22的形貌保形或者近似保形，第二电镀阳极D2与阴极2形成电场，以在阴极2的第二表面22形成电镀层。可以使用第一电镀阳极D1与第二电镀阳极D2同时对待电镀的阴极2的第一表面21以及第二表面22电镀。或者，也可以先使用第一电镀阳极D1对阴极2的第一表面21电镀，然后再使用第二电镀阳极D2对阴极2的第二表面22电镀。或者，也可以先使用第二电镀阳极D2对阴极2的第二表面22电镀，然后再使用第一电镀阳极D1对阴极2的第一表面21电镀。其中，电镀阳极1(包括第一电镀阳极D1和第二电镀阳极D2)可以采用上述任一实施例中的电镀阳极。电镀阳极1的电镀方法可以采用上述任一实施例中的电镀方法。

Claims (36)

  1. 一种电镀阳极，所述电镀阳极与待电镀的阴极形成电场以在所述阴极的表面形成电镀层，所述阴极的形貌凹凸不平，所述电镀阳极包括一个导电板，所述导电板的形貌与所述阴极的形貌保形，所述导电板中凸出的部分与所述阴极中凹陷的部分对应，所述导电板中凹陷的部分与所述阴极中凸出的部分对应。
  2. 根据权利要求1所述的电镀阳极，还包括：阴极表面形貌检测器、电场分布仿真优化器、电场分布控制器以及电镀信号控制器；
    所述电场分布仿真优化器的输入端与所述阴极表面形貌检测器电连接，所述电场分布仿真优化器的输出端与所述电场分布控制器电连接，所述电场分布控制器与所述电镀信号控制器电连接，所述电镀信号控制器与所述导电板电连接，所述电镀信号控制器设置为为所述导电板施加电镀信号；
    所述电场分布仿真优化器设置为在电镀开始之前，从所述阴极表面形貌检测器获取初始的阴极的形貌信息，并以初始的阴极的形貌信息、初始的阳极形貌以及初始阳极表面电流分布为模型，对所述电镀阳极和所述阴极间的电场以及所述阴极上电镀物质沉积进行仿真，根据设置的优化目标，即阴极表面电镀物的特定分布和厚度，通过优化算法求解得到所述导电板的形貌和优化的阳极表面电流分布，并将优化后阳极表面电流分布信息传递至所述电场分布控制器，所述电场分布控制器控制所述电镀信号控制器输出至所述导电板的电镀信号；在电镀过程中，所述电场分布仿真优化器设置为从所述阴极表面形貌检测器获取实时的阴极的形貌信息，以实时的阴极的形貌信息、所述导电板的形貌以及当前阳极表面电流分布为模型，对所述电镀阳极和所述阴极间的电场以及所述阴极上电镀物质沉积进行仿真，根据设置的所述优化目标，通过优化算法求解得到更为优化的阳极表面电流分布，并将优化后的阳极表面电流分布信息传递至所述电场分布控制器，所述电场分布控制器控制所述电镀信号控制器输出至所述导电板的电镀信号；电镀过程中，所述电场分布仿真优化器重复上述步骤，直到所述阴极的形貌达到所述优化目标或与所述优化目标的差值达到预设值。
  3. 根据权利要求1所述的电镀阳极，还包括：电场分布仿真优化器、电场分布控制器以及电镀信号控制器；
    所述电场分布控制器分别与所述电镀信号控制器以及所述电场分布仿真优化器电连接，所述电镀信号控制器与所述导电板电连接；
    所述电镀信号控制器设置为为所述导电板施加电镀信号；所述电场分布仿真优化器设置为在电镀开始之前，以输入的初始的阴极的形貌信息、初始阳极形貌和初始阳极表面电流分布为模型，对所述电镀阳极和所述阴极间的电场以及所述阴极上电镀物质沉积进行仿真，根据设置的优化目标，即所述阴极表面电镀物的特定分布和厚度，通过优化算法求解得到所述导电板的形貌和优化的阳极表面电流分布，并将所述优化的阳极表面电流分布信息传递至所述电场分布控制器，所述电场分布控制器控制所述电镀信号控制器输出至所述导电板的电镀信号。
  4. 根据权利要求1所述的电镀阳极，还包括：电场分布仿真优化器、电场分布控制器以及电镀信号控制器；
    所述电场分布控制器分别与所述电镀信号控制器以及所述电场分布仿真优化器电连接，所述电镀信号控制器与所述导电板电连接；
    所述电镀信号控制器设置为为所述导电板施加电镀信号；所述电场分布仿真优化器设置为在电镀开始之前，以输入的初始的阴极的形貌信息、初始阳极形貌和初始阳极表面电流分布为模型，对所述电镀阳极和所述阴极间的电场以及所述阴极上电镀物质沉积进行仿真，根据设置的优化目标，即所述阴极表面电镀物的特定分布和厚度，通过优化算法求解得到所述导电板的形貌和优化的阳极表面电流分布，同时得到本次优化后的更接近所述优化目标的阴极形貌，并将所述优化的阳极表面电流分布信息传递至所述电场分布控制器，所述电场分布控制器控制所述电镀信号控制器输出至所述导电板的电镀信号；在电镀过程中，所述电场分布仿真优化器设置为根据上一次优化后的更接近所述优化目标阴极形貌，以所述导电板的形貌和当前的阳极表面电流分布为模型，对所述 电镀阳极和所述阴极间的电场以及所述阴极上电镀物质沉积进行仿真，根据设置的所述优化目标，通过所述优化算法求解得到更为优化阳极表面电流分布，同时得到本次优化后的更接近所述优化目标的阴极形貌，并将优化后的阳极表面电流分布信息传递至所述电场分布控制器，所述电场分布控制器控制所述电镀信号控制器输出至所述导电板的电镀信号，电镀过程中，所述电场分布仿真优化器重复上述步骤，直到所述阴极形貌达到所述优化目标或与所述优化目标的差值达到预设值。
  5. 一种电镀阳极，所述电镀阳极与待电镀的阴极形成电场以在所述阴极的表面形成电镀层，所述阴极的形貌凹凸不平，所述电镀阳极包括:
    绝缘背板；
    多个导电单元，每个所述导电单元包括针杆和设置于所述针杆一端的针头，所述针杆设置有所述针头的一端为所述导电单元的电镀端，所述导电单元通过所述针杆固定于所述绝缘背板上；多个所述导电单元阵列排布，且任意两个所述导电单元电绝缘。
  6. 根据权利要求5所述的电镀阳极，其中，所述针头背离所述绝缘背板一侧的表面为凸曲面，所述凸曲面沿着背离所述绝缘背板的方向凸起。
  7. 根据权利要求5所述的电镀阳极，其中，所述针头背离所述绝缘背板一侧的表面为平面。
  8. 根据权利要求5所述的电镀阳极，其中，所述针头在所述绝缘背板的垂直投影的形状为正六边形。
  9. 根据权利要求5所述的电镀阳极，包括两个所述绝缘背板，所述针杆固定于两个所述绝缘背板上。
  10. 根据权利要求5所述的电镀阳极，还包括电镀信号控制器和多条馈电线，一个所述导电单元通过一条所述馈电线与所述电镀信号控制器电连接，所述电镀信号控制器设置为为所述导电单元施加电镀信号。
  11. 根据权利要求10所述的电镀阳极，包括两个所述绝缘背板，所述针杆 固定于两个所述绝缘背板上；
    所述馈电线与所述导电单元电连接的部分位于两个所述绝缘背板之间。
  12. 根据权利要求10所述的电镀阳极，还包括驱动器控制器和多个驱动器，所述驱动器控制器和多个所述驱动器电连接，每个所述驱动器与对应针杆远离所述针头的一端相连接，每个所述驱动器设置为控制所述针头与所述绝缘背板之间的距离。
  13. 根据权利要求12所述的电镀阳极，还包括：阴极表面形貌检测器、电场分布仿真优化器和电场分布控制器；所述电场分布仿真优化器的输入端与所述阴极表面形貌检测器电连接，所述电场分布仿真优化器的输出端与所述电场分布控制器电连接，所述电场分布控制器与所述电镀信号控制器电连接，所述所述电场分布控制器还与所述驱动器控制器电连接；
    所述电场分布仿真优化器设置为在电镀初始阶段，从所述阴极表面形貌检测器获取初始的阴极的形貌信息，以所述初始的阴极的形貌信息、初始阳极形貌以及初始阳极表面电流分布为模型，对所述电镀阳极和所述阴极间的电场以及所述阴极上电镀物质沉积进行仿真，根据设置的优化目标，即阴极表面电镀物的特定分布和厚度，通过优化算法求解得到优化的阳极形貌和优化的阳极表面电流分布，并将优化后的阳极形貌和优化后的阳极表面电流分布信息传递至所述电场分布控制器，所述电场分布控制器控制所述电镀信号控制器输出至所述导电单元的电镀信号，所述电场分布控制器控制所述驱动器控制器向每个所述驱动器传送不同的控制信号，所述控制信号包括每个针杆不同的伸出或缩进距离，以调整阳极形貌；在电镀过程中，所述电场分布仿真优化器设置为从所述阴极表面形貌检测器获取实时的阴极的形貌信息，以所述实时的阴极的形貌信息、当前阳极形貌以及当前阳极表面电流分布为模型，对所述电镀阳极和所述阴极间的电场以及所述阴极上电镀物质沉积进行仿真，根据设置的所述优化目标，通过优化算法求解得到更为优化的阳极形貌和更为优化的阳极表面电流分布，并将优化后的阳极形貌和优化后的阳极表面电流分布信息传递至所述电 场分布控制器，所述电场分布控制器控制所述电镀信号控制器输出至所述导电单元的电镀信号，所述电场分布控制器控制所述驱动器控制器，向每个所述驱动器传送不同的控制信号，所述控制信号包括每个针杆不同的伸出或缩进距离，以调整阳极形貌，电镀过程中，所述电场分布仿真优化器重复上述步骤，直到阴极形貌达到所述优化目标或与所述优化目标的差值达到预设值。
  14. 根据权利要求12所述的电镀阳极，还包括：电场分布仿真优化器、电场分布控制器；所述电场分布仿真优化器与所述电场分布控制器电连接，所述电场分布控制器与所述电镀信号控制器电连接，所述所述电场分布控制器还与所述驱动器控制器电连接；
    所述电场分布仿真优化器在电镀的初始阶段，以输入的初始的阴极的形貌信息、初始的阳极形貌和初始阳极表面电流分布为模型，对所述电镀阳极和所述阴极间的电场以及所述阴极上电镀物质沉积进行仿真，根据设置的优化目标，即阴极表面电镀物的特定分布和厚度，通过优化算法求解得到优化的阳极形貌和优化的阳极表面电流分布，同时得到本次优化后的更接近优化目标的阴极形貌，并将优化后的阳极形貌和优化后的阳极表面电流分布信息传递至所述电场分布控制器，所述电场分布控制器控制所述电镀信号控制器输出至所述导电单元的电镀信号，所述电场分布控制器控制所述驱动器控制器向每个所述驱动器传送不同的控制信号，所述控制信号包括每个针杆不同的伸出或缩进距离，以调整阳极形貌；在电镀过程中，所述电场分布仿真优化器设置为以上一次优化后的更接近优化目标的阴极形貌、当前的阳极形貌和当前的阳极表面电流分布为模型，对所述电镀阳极和所述阴极间的电场以及所述阴极上电镀物质沉积进行仿真，根据设置的所述优化目标，通过优化算法求解得到更为优化的阳极形貌和优化的阳极表面电流分布，同时得到本次优化后的更接近优化目标的阴极形貌，并将优化后的阳极形貌和优化后的阳极表面电流分布信息传递至所述电场分布控制器，所述电场分布控制器控制所述电镀信号控制器输出至所述导电单元的电镀信号，所述电场分布控制器控制所述驱动器控制器向每个所述驱动 器传送不同的控制信号，所述控制信号包括每个针杆不同的伸出或缩进距离，以调整阳极形貌，电镀过程中，所述电场分布仿真优化器重复上述步骤，直到阴极形貌达到所述优化目标或与所述优化目标的差值达到预设值。
  15. 根据权利要求10所述的电镀阳极，还包括阴极表面形貌检测器、电场分布仿真优化器和电场分布控制器；所述电场分布仿真优化器的输入端与所述阴极表面形貌检测器电连接，所述电场分布仿真优化器的输出端与所述电场分布控制器电连接，所述电场分布控制器与所述电镀信号控制器电连接；
    所述电场分布仿真优化器设置为在电镀初始阶段，从所述阴极表面形貌检测器获取初始的阴极的形貌信息，并以初始的阴极的形貌信息、阳极形貌以及初始阳极表面电流分布为模型，对所述电镀阳极和所述阴极间的电场以及所述阴极上电镀物质沉积进行仿真，根据设置的优化目标，即所述阴极表面电镀物的特定分布和厚度，通过优化算法求解得到优化的阳极表面电流分布，并将所述优化后阳极表面电流分布信息传递至所述电场分布控制器，所述电场分布控制器控制所述电镀信号控制器输出至所述导电单元的电镀信号；在电镀过程中，所述电场分布仿真优化器设置为从所述阴极表面形貌检测器获取实时的阴极的形貌信息，以实时的阴极的形貌信息、阳极形貌以及当前阳极表面电流分布为模型，对所述电镀阳极和所述阴极间的电场以及所述阴极上电镀物质沉积进行仿真，根据设置的所述优化目标，通过所述优化算法求解得到更为优化的阳极表面电流分布，并将优化后的阳极表面电流分布信息传递至所述电场分布控制器，所述电场分布控制器所述控制电镀信号控制器输出至所述导电单元的电镀信号；电镀过程中，所述电场分布仿真优化器重复上述步骤，直到所述阴极的形貌达到所述优化目标或与所述优化目标的差值达到预设值。
  16. 根据权利要求10所述的电镀阳极，还包括电场分布仿真优化器以及电场分布控制器；
    所述电场分布控制器，分别与所述电镀信号控制器以及所述电场分布仿真优化器电连接；
    所述电场分布仿真优化器设置为在电镀的初始阶段，以输入的初始的阴极的形貌信息、阳极形貌和初始阳极表面电流分布为模型，对所述电镀阳极和所述阴极间的电场以及所述阴极上电镀物质沉积进行仿真，根据设置的优化目标，即所述阴极表面电镀物的特定分布和厚度，通过优化算法求解得到优化的阳极表面电流分布，同时得到本次优化后的更接近优化目标的阴极形貌，并将所述优化的阳极表面电流分布信息传递至所述电场分布控制器，所述电场分布控制器控制所述电镀信号控制器输出至所述导电单元的电镀信号；在电镀过程中，所述电场分布仿真优化器设置为以上一次优化后的更接近优化目标的阴极形貌、阳极形貌和当前的阳极表面电流分布为模型，对所述电镀阳极和所述阴极间的电场以及所述阴极上电镀物质沉积进行仿真，根据设置的所述优化目标，通过所述优化算法求解得到更为优化的阳极表面电流分布，同时得到本次优化后的更接近优化目标的阴极形貌，并将优化后的阳极表面电流分布信息传递至所述电场分布控制器，所述电场分布控制器控制所述电镀信号控制器输出至所述导电单元的电镀信号，电镀过程中，所述电场分布仿真优化器重复上述步骤，直到所述阴极形貌达到所述优化目标或与所述优化目标的差值达到预设值。
  17. 根据权利要求12所述的电镀阳极，还包括：阴极表面形貌检测器、电场分布仿真优化器和电场分布控制器；所述电场分布仿真优化器的输入端与所述阴极表面形貌检测器电连接，所述电场分布仿真优化器的输出端与所述电场分布控制器电连接，所述所述电场分布控制器还与所述驱动器控制器电连接；
    所述电场分布仿真优化器设置为在电镀的初始阶段，从所述阴极表面形貌检测器获取的初始的阴极的形貌信息，以所述初始的阴极的形貌信息、初始阳极形貌以及阳极表面电流分布为模型，根据设置的优化目标，即阴极表面电镀物的特定分布和厚度，通过优化算法求解得到优化的阳极形貌，并将所述优化后的阳极形貌信息传递至所述电场分布控制器，所述电场分布控制器控制所述驱动器控制器向每个所述驱动器传送不同的控制信号，所述控制信号包括每个针杆不同的伸出或缩进距离；在电镀过程中，所述电场分布仿真优化器设置为 从所述阴极表面形貌检测器获取的实时的阴极的形貌信息，以所述实时的阴极的形貌信息、所述阳极表面电流分布以及当前的阳极形貌为模型，根据设置的所述优化目标，通过优化算法求解得到更为优化的阳极形貌，并将优化后的阳极形貌信息传递至所述电场分布控制器，所述电场分布控制器控制所述驱动器控制器向每个所述驱动器传送不同的控制信号，所述控制信号包括每个针杆不同的伸出或缩进距离，在电镀过程中，所述电场分布仿真优化器重复上述步骤，实时调整阳极形貌，直到阴极形貌达到所述优化目标或与所述优化目标的差值达到预设值。
  18. 根据权利要求12所述的电镀阳极，还包括：电场分布仿真优化器和电场分布控制器，所述电场分布仿真优化器与所述电场分布控制器电连接，所述所述电场分布控制器还与所述驱动器控制器电连接；
    所述电场分布仿真优化器设置为以初始的阴极的形貌信息、阳极表面电流分布和初始阳极形貌为模型，根据设置的优化目标，即阴极表面电镀物的特定分布和厚度，通过优化算法求解得到优化的阳极形貌，同时得到本次优化后的更接近优化目标的阴极形貌，并将优化后的阳极形貌信息传递至所述电场分布控制器，所述电场分布控制器控制所述驱动器控制器向每个所述驱动器传送不同的控制信号，所述控制信号包括每个针杆不同的伸出或缩进距离；在电镀过程中，电场分布仿真优化器设置为以上一次优化后的更接近优化目标的阴极形貌、所述阳极表面电流分布以及当前的阳极形貌为模型，根据设置的所述优化目标，通过优化算法求解得到更为优化的阳极形貌，同时得到本次优化后的更接近优化目标的阴极形貌，并将优化后的阳极形貌信息传递至所述电场分布控制器，所述电场分布控制器控制所述驱动器控制器向每个所述驱动器传送不同的控制信号，所述控制信号包括每个针杆不同的伸出或缩进距离，在电镀过程中，所述电场分布仿真优化器重复上述步骤，实时调整阳极形貌，直到阴极形貌达到所述优化目标或与所述优化目标的差值达到预设值。
  19. 根据权利要求5所述的电镀阳极，还包括绝缘螺纹和绝缘螺母，所述 绝缘螺母固定于所述绝缘背板上，所述绝缘螺纹包围所述针杆，所述绝缘螺纹与所述绝缘螺母螺纹对接。
  20. 根据权利要求5所述的电镀阳极，还包括模具基板、粘结层和馈电板，所述粘结层位于所述模具基板与所述绝缘背板之间，所述模具基板朝向所述绝缘背板一侧的形貌与所述阴极的形貌保形，所述模具基板中凸出的部分与所述阴极中凹陷的部分对应，所述模具基板中凹陷的部分与所述阴极中凸出的部分对应；所述馈电板与多个所述导电单元接触且电连接。
  21. 根据权利要求20所述的电镀阳极，包括两个所述绝缘背板，所述针杆固定于两个所述绝缘背板上；
    所述馈电板位于两个所述绝缘背板之间。
  22. 根据权利要求20所述的电镀阳极，还包括：电场分布仿真优化器、电场分布控制器以及电镀信号控制器；
    所述电场分布控制器分别与所述电镀信号控制器以及所述电场分布仿真优化器电连接，所述电镀信号控制器与所述导电单元电连接；
    所述电镀信号控制器设置为为所述导电单元施加电镀信号；所述电场分布仿真优化器设置为在电镀开始之前，以输入的初始的阴极的形貌信息、初始阳极形貌和初始阳极表面电流分布为模型，对所述电镀阳极和所述阴极间的电场以及所述阴极上电镀物质沉积进行仿真，根据设置的优化目标，即所述阴极表面电镀物的特定分布和厚度，通过优化算法求解得到模具基板的形貌(所述电镀阳极的形貌)和优化的阳极表面电流分布，并将所述优化的阳极表面电流分布信息传递至所述电场分布控制器，所述电场分布控制器控制所述电镀信号控制器输出至所述导电单元的电镀信号。
  23. 根据权利要求20所述的电镀阳极，还包括：电场分布仿真优化器、电场分布控制器以及电镀信号控制器；
    所述电场分布控制器分别与所述电镀信号控制器以及所述电场分布仿真优化器电连接，所述电镀信号控制器与所述导电单元电连接；
    所述电镀信号控制器设置为为所述导电单元施加电镀信号；所述电场分布仿真优化器设置为在电镀开始之前，以输入的初始的阴极的形貌信息、初始阳极形貌和初始阳极表面电流分布为模型，对所述电镀阳极和所述阴极间的电场以及所述阴极上电镀物质沉积进行仿真，根据设置的优化目标，即所述阴极表面电镀物的特定分布和厚度，通过优化算法求解得到所述模具基板的形貌(所述电镀阳极的形貌)和优化的阳极表面电流分布，同时得到本次优化后的更接近所述优化目标的阴极形貌，并将所述优化的阳极表面电流分布信息传递至所述电场分布控制器，所述电场分布控制器控制所述电镀信号控制器输出至所述导电单元的电镀信号；在电镀过程中，所述电场分布仿真优化器设置为以上一次优化后的更接近所述优化目标阴极形貌、所述电镀阳极的形貌和当前的阳极表面电流分布为模型，对所述电镀阳极和所述阴极间的电场以及所述阴极上电镀物质沉积进行仿真，根据设置的所述优化目标，通过所述优化算法求解得到更为优化阳极表面电流分布，同时得到本次优化后的更接近所述优化目标的阴极形貌，并将优化后的阳极表面电流分布信息传递至所述电场分布控制器，所述电场分布控制器控制所述电镀信号控制器输出至所述导电单元的电镀信号，电镀过程中，所述电场分布仿真优化器重复上述步骤，直到所述阴极形貌达到所述优化目标或与所述优化目标的差值达到预设值。
  24. 一种使用权利要求1所述电镀阳极的电镀方法，所述电镀阳极与待电镀的阴极形成电场以在所述阴极的表面形成电镀层，所述阴极的形貌凹凸不平，所述电镀阳极包括一个导电板，所述导电板的形貌与所述阴极的形貌保形，所述导电板中凸出的部分与所述阴极中凹陷的部分对应，所述导电板中凹陷的部分与所述阴极中凸出的部分对应；
    所述电镀方法包括：
    根据所述阴极的目标形貌获取阳极形貌，所述阴极的目标形貌即为优化目标；
    根据所述阳极形貌制备模具基板；所述模具基板一侧的形貌与所述阴极的 形貌保形，所述模具基板的所述一侧中凸出的部分与所述阴极中凹陷的部分对应，所述模具基板的所述一侧中凹陷的部分与所述阴极中凸出的部分对应；
    根据所述模具基板制备所述电镀阳极；
    为所述电镀阳极施加电镀信号。
  25. 根据权利要求24所述的电镀方法，其中，根据所述模具基板制备所述电镀阳极包括：
    在所述模具基板上涂覆或沉积导电层以形成所述电镀阳极。
  26. 根据权利要求24所述的电镀方法，其中，根据所述模具基板制备所述电镀阳极包括：
    提供一平面状的导电板；
    利用所述模具基板与所述阴极保形的一侧按压平面状的导电板，以使所述平面状的导电板变形并与所述阴极保形，去除所述模具基板以形成所述电镀阳极。
  27. 根据权利要求24所述的电镀阳极，还包括：阴极表面形貌检测器、电场分布仿真优化器、电场分布控制器以及电镀信号控制器；
    所述电场分布仿真优化器的输入端与所述阴极表面形貌检测器电连接，所述电场分布仿真优化器的输出端与所述电场分布控制器电连接，所述电场分布控制器与所述电镀信号控制器电连接，所述电镀信号控制器与所述导电板电连接，所述电镀信号控制器设置为为所述导电板施加电镀信号；
    所述根据所述阴极的目标形貌获取阳极形貌以及所述电镀信号的获取，包括：
    所述电场分布仿真优化器设置为在电镀开始之前，从所述阴极表面形貌检测器获取初始的阴极的形貌信息，并以初始的阴极的形貌信息、初始的阳极形貌以及初始阳极表面电流分布为模型，对所述电镀阳极和所述阴极间的电场以及所述阴极上电镀物质沉积进行仿真，根据设置的优化目标，即阴极表面电镀物的特定分布和厚度，通过优化算法求解得到所述导电板的形貌和优化的阳极 表面电流分布，并将优化后阳极表面电流分布信息传递至所述电场分布控制器，所述电场分布控制器控制所述电镀信号控制器输出至所述导电板的电镀信号；在电镀过程中，所述电场分布仿真优化器设置为从所述阴极表面形貌检测器获取实时的阴极的形貌信息，以实时的阴极的形貌信息、所述导电板的形貌以及当前阳极表面电流分布为模型，对所述电镀阳极和所述阴极间的电场以及所述阴极上电镀物质沉积进行仿真，根据设置的所述优化目标，通过优化算法求解得到更为优化的阳极表面电流分布，并将优化后的阳极表面电流分布信息传递至所述电场分布控制器，所述电场分布控制器控制所述电镀信号控制器输出至所述导电板的电镀信号；电镀过程中，所述电场分布仿真优化器重复上述步骤，直到所述阴极的形貌达到所述优化目标或与所述优化目标的差值达到预设值。
  28. 根据权利要求24所述的电镀方法，其中，所述电镀阳极还包括电场分布仿真优化器、电场分布控制器以及电镀信号控制器；
    所述电场分布控制器分别与所述电镀信号控制器以及所述电场分布仿真优化器电连接，所述电镀信号控制器与所述导电板电连接，所述电镀信号控制器设置为为所述导电板施加电镀信号；
    所述根据所述阴极的目标形貌获取阳极形貌以及所述电镀信号的获取，包括：
    所述电场分布仿真优化器在电镀开始之前，以输入的阴极的目标形貌信息、初始阳极形貌和初始阳极表面电流分布为模型，对所述电镀阳极和所述阴极间的电场以及所述阴极上电镀物质沉积进行仿真，根据设置的优化目标，即所述阴极表面电镀物的特定分布和厚度，通过优化算法求解得到所述导电板的形貌和优化的阳极表面电流分布，并将所述优化的阳极表面电流分布信息传递至所述电场分布控制器，所述电场分布控制器控制所述电镀信号控制器输出至所述导电板的电镀信号。
  29. 根据权利要求24所述的电镀方法，其中，所述电镀阳极还包括：电场分布仿真优化器、电场分布控制器以及电镀信号控制器；
    所述电场分布控制器分别与所述电镀信号控制器以及所述电场分布仿真优化器电连接，所述电镀信号控制器与所述导电板电连接，所述电镀信号控制器设置为为所述导电板施加电镀信号；
    所述根据所述阴极的目标形貌获取阳极形貌以及所述电镀信号的获取，包括：
    所述电场分布仿真优化器在电镀开始之前，以输入的初始的阴极的形貌信息、初始阳极形貌和初始阳极表面电流分布为模型，对所述电镀阳极和所述阴极间的电场以及所述阴极上电镀物质沉积进行仿真，根据设置的优化目标，即所述阴极表面电镀物的特定分布和厚度，通过优化算法求解得到所述导电板的形貌和优化的阳极表面电流分布，同时得到本次优化后的更接近优化目标的阴极形貌，并将所述优化的阳极表面电流分布信息传递至所述电场分布控制器，所述电场分布控制器控制所述电镀信号控制器输出至所述导电板的所述电镀信号；在电镀过程中，所述电场分布仿真优化器以上一次优化后的更接近优化目标阴极形貌、所述导电板的形貌和当前的阳极表面电流分布为模型，对所述电镀阳极和所述阴极间的电场以及所述阴极上电镀物质沉积进行仿真，根据设置的所述优化目标，通过所述优化算法求解得到更为优化阳极表面电流分布，同时得到本次优化后的更接近优化目标的阴极形貌，并将优化后的阳极表面电流分布信息传递至所述电场分布控制器，所述电场分布控制器控制所述电镀信号控制器输出至所述导电板的所述电镀信号，电镀过程中，所述电场分布仿真优化器重复上述步骤，直到所述阴极形貌达到所述优化目标或与所述优化目标的差值达到预设值。
  30. 一种使用权利要求5所述电镀阳极的电镀方法，所述电镀阳极与待电镀的阴极形成电场以在所述阴极的表面形成电镀层，所述阴极的形貌凹凸不平，所述电镀阳极包括绝缘背板和多个导电单元，每个所述导电单元包括针杆和设置于所述针杆一端的针头，所述针杆设置有所述针头的一端为所述导电单元的电镀端，所述导电单元通过所述针杆固定于所述绝缘背板上；多个所述导电单 元阵列排布，且任意两个所述导电单元电绝缘；
    所述电镀方法包括：
    根据所述阴极的目标形貌获取阳极形貌和阳极表面电流分布；
    根据所述阳极形貌控制每个所述针头与所述绝缘背板之间的距离，根据所述阳极表面电流分布控制为每个所述导电单元施加的单独电镀信号；或者，控制所有的所述针头与所述绝缘背板之间具有相同的距离，根据所述阳极表面电流分布控制为每个所述导电单元施加单独的电镀信号；或者，根据所述阳极形貌控制每个所述针头与所述绝缘背板之间的距离，控制为所有所述导电单元施加相同的电镀信号。
  31. 根据权利要求20所述的电镀方法，其中，所述电镀阳极包括阴极表面形貌检测器和电场分布仿真优化器；
    根据所述阴极的目标形貌获取阳极形貌和阳极表面电流分布包括：
    所述阴极表面形貌检测器实时检测所述阴极的形貌信息；
    所述电场分布仿真优化器以实时检测的所述阴极的形貌信息、当前阳极形貌及当前阳极表面电流分布为模型，根据所述阴极的目标形貌，实时获取优化的阳极形貌和优化的阳极表面电流分布。
  32. 根据权利要求30所述的电镀方法，其中，所述电镀阳极还包括电场分布仿真优化器；
    根据所述阴极的目标形貌获取阳极形貌和阳极表面电流分布包括：
    所述电场分布仿真优化器以上一次优化后的接近优化目标的阴极形貌或初始阴极形貌、及当前阳极形貌和当前阳极表面电流分布为模型，根据所述阴极的目标形貌，获取优化的阳极形貌和优化的阳极表面电流分布。
  33. 根据权利要求30所述的电镀方法，其中，所述电镀阳极包括多个驱动器，每个所述驱动器与对应针杆远离所述针头的一端相连接，所述每个驱动器设置为控制所述针头与所述绝缘背板之间的距离；
    根据所述阳极形貌控制每个所述针头与所述绝缘背板之间的距离包括：
    根据所述阳极形貌使每个所述驱动器驱动与所述驱动器连接的导电单元运动，以控制每个所述针头与所述绝缘背板之间的距离。
  34. 根据权利要求30所述的电镀方法，其中，所述电镀阳极还包括绝缘螺纹和绝缘螺母，所述绝缘螺母固定于所述绝缘背板上，所述绝缘螺纹包围所述针杆，所述绝缘螺纹与所述绝缘螺母螺纹对接；
    根据所述阳极形貌控制每个所述针头与所述绝缘背板之间的距离包括：
    根据所述阳极形貌，旋转在所述绝缘螺母中的所述绝缘螺纹，以控制每个所述针头与所述绝缘背板之间的距离。
  35. 根据权利要求30所述的电镀方法，其中，根据所述阳极形貌控制每个所述针头与所述绝缘背板之间的距离，包括：
    根据所述阳极形貌制备模具基板；
    使用所述模具基板按压多个所述针杆与所述针头相对的一端，以使多个所述导电单元的针头共同呈现所述阳极形貌；
    在所述模具基板与所述绝缘背板之间填充粘结剂或者固化剂，并固化所述粘结剂或者固化剂形成粘结层。
  36. 一种电镀装置，包括第一电镀阳极、第二电镀阳极及阴极；
    其中，所述第一电镀阳极及所述第二电镀阳极均采用权利要求5所述的电镀阳极，所述阴极包括第一表面和第二表面，所述第一电镀阳极与所述阴极的第一表面的形貌保形，所述第二电镀阳极与所述阴极的第二表面的形貌保形，所述第一电镀阳极与所述阴极的第一表面相对，且与所述阴极形成电场，以在所述阴极的第一表面形成电镀层，所述第二电镀阳极与所述阴极的第二表面相对，且与所述阴极形成电场，以在所述阴极的第二表面形成电镀层。
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