WO2021052061A1 - 一种导热pcb的制作方法及pcb - Google Patents

一种导热pcb的制作方法及pcb Download PDF

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Publication number
WO2021052061A1
WO2021052061A1 PCT/CN2020/108353 CN2020108353W WO2021052061A1 WO 2021052061 A1 WO2021052061 A1 WO 2021052061A1 CN 2020108353 W CN2020108353 W CN 2020108353W WO 2021052061 A1 WO2021052061 A1 WO 2021052061A1
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thermal conductor
manufacturing
accommodating groove
conductor
motherboard
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PCT/CN2020/108353
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English (en)
French (fr)
Inventor
肖璐
吴泓宇
纪成光
陈正清
刘梦茹
王洪府
王小平
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生益电子股份有限公司
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Publication of WO2021052061A1 publication Critical patent/WO2021052061A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components

Definitions

  • the invention relates to the technical field of PCB (Printed Circuit Board, printed circuit board), and in particular to a method for manufacturing a thermally conductive PCB and the PCB.
  • PCB Print Circuit Board, printed circuit board
  • the current mainstream PCB local heat dissipation technology mainly includes embedded metal block technology, which uses the high thermal conductivity of copper, aluminum and other metals to dissipate the heat generated by the high-power devices on the PCB surface in time, thereby reducing the temperature of the devices and equipment. Improve service life and electrical performance.
  • the embedded metal block technology is usually applied to the products formed by pressing the core board + the core board, as shown in Figure 1.
  • the specific implementation method is: firstly, the corresponding positions of the multiple core boards 1 and the bonding sheets 2 are opened. For the window, the core plate 1 and the bonding sheet 2 are stacked in order, and the metal block 3 is placed in the through groove formed at the opening position, and finally pressed at a high temperature.
  • the specific implementation method is as follows: first open the corresponding positions of the copper foil 4, the core board 1 and the bonding sheet 2 respectively, and then stack the copper foil 4, the core board 1 and the bonding sheet 2 in order , And put the metal block 3 in the through groove formed at the window opening position, and finally press the metal block 3 at high temperature.
  • the window opening position of the copper foil 4 is prone to wrinkles after high-temperature pressing.
  • Conventional buffer materials such as aluminum sheets, release films, etc.
  • the purpose of the present invention is to provide a method for manufacturing a thermally conductive PCB and the PCB, which overcomes the defects of the prior art that the copper foil is easy to wrinkle and the wiring density is limited.
  • the present invention adopts the following technical solutions:
  • a manufacturing method of thermally conductive PCB includes:
  • the thermal conductor is placed in the thermal conductor accommodating groove and bonded with the micro-mucosal film, and the thermal conductor is fixedly connected to the mother board through a resin; the thermal conductor includes a ceramic layer and is formed on the substrate through a seed layer. Conductive layers on the two outer surfaces of the ceramic layer; the thickness of the heat conductor is the same as the thickness of the mother board, and the cross-sectional standard size of the heat conductor is smaller than the cross-sectional standard size of the heat conductor accommodating groove;
  • An outer layer pattern is made on the surface of the heat conductor and/or the other area of the motherboard except the area where the heat conductor is embedded.
  • the manufacturing method of the thermally conductive PCB further includes the manufacturing steps of the thermal conductor:
  • the upper and lower outer surfaces of a large ceramic sheet with a specified thickness are respectively copper-plated with a seed layer to form a large copper-clad ceramic sheet; the large copper-clad ceramic sheet is divided into a number of small copper-clad ceramic sheets of specified specifications to obtain the ⁇ Said heat conductor.
  • the manufacturing step of the heat conductor further includes: roughening the surface and/or side surface of the small copper-clad ceramic sheet.
  • the placing the thermal conductor in the thermal conductor accommodating groove and adhering it with the micro-adhesive film, and fixing the thermal conductor and the motherboard through a resin includes:
  • the resin is cured.
  • the placing the thermal conductor in the thermal conductor accommodating groove and adhering it with the micro-adhesive film, and fixing the thermal conductor and the motherboard through a resin includes:
  • the resin is cured.
  • thermally conductive PCB screen printing or glue dispensing is used to fill the gap between the thermal conductor and the thermal conductor accommodating groove with resin.
  • the method for making the outer layer graphics is: using a pattern transfer method to simultaneously make the outer layer graphics on the surface of the heat conductor and the other area of the motherboard except the area where the heat conductor is embedded.
  • the method for making the outer layer graphics is: for the surface of the heat conductor and the other area of the motherboard except the area where the heat conductor is embedded, one of them is protected first, and then the other is protected. Make an outer layer pattern on one surface.
  • the manufacturing method of the thermally conductive PCB further includes: drilling holes at the four corners of the thermal conductor accommodating groove, so that the arc-shaped inner wall formed after the drilling is tangent to the corresponding right angle of the thermal conductor.
  • a PCB manufactured according to any one of the above-mentioned manufacturing methods is provided.
  • the thermal conductor accommodating groove is formed after the pressing process, so that the outer copper foil does not need to be windowed before the mother board is pressed, so that the outer copper foil can maintain good flatness during the pressing process Degree, there will be no wrinkling phenomenon.
  • the application of micro-adhesive film can not only pre-fix the heat conductor to prevent displacement of the heat conductor during the resin filling process, but also prevent a large amount of excess resin from remaining on the first plate surface.
  • copper-clad ceramic sheets are used as the heat conductor, and the conductive layer on the surface of the heat conductor can also be patterned, which improves the overall wiring density of the PCB.
  • Fig. 1 is a schematic diagram of the first existing method for manufacturing a thermally conductive PCB.
  • Fig. 2 is a schematic diagram of a second existing method for manufacturing a thermally conductive PCB.
  • FIG. 3 is a flow chart of a manufacturing method of a thermally conductive PCB provided by Embodiment 1 of the present invention.
  • FIG. 4 is a schematic diagram of a manufacturing method of a thermally conductive PCB provided by Embodiment 1 of the present invention.
  • Fig. 5 is a flow chart of a manufacturing method of a thermally conductive PCB provided by the second embodiment of the present invention.
  • Fig. 6 is a schematic diagram of a manufacturing method of a thermally conductive PCB provided in the second embodiment of the present invention.
  • the manufacturing method of the thermally conductive PCB provided by the embodiment of the present invention includes:
  • Step 101 Fabricate a thermal conductor 8 of a specified specification.
  • the thermal conductor 8 includes a ceramic layer, a seed layer formed on the outer surface of the ceramic layer, and a conductive layer formed on the outer surface of the seed layer.
  • the heat conductor 8 is used to realize the heat dissipation function, and its specific manufacturing method is as follows: firstly form a seed layer on the upper and lower surfaces of a large ceramic sheet with a certain thickness and then plate a conductive layer, such as a copper layer, to form a large copper-clad ceramic sheet; The large copper-clad ceramic sheet is divided into several small copper-clad ceramic sheets of specified specifications; then, the surface and/or side surface of the small copper-clad ceramic sheet is roughened to obtain the required thermal conductor 8 of the specified specification.
  • the heat conductor 8 may also be a metal structure, such as copper, aluminum, and the like.
  • Step 102 Make a mother board 5.
  • the manufacturing method of the motherboard 5 is not specifically limited, and may include:
  • the first type is to laminate multiple core boards and bonding sheets in the order of core board-bonding sheet ... core board-bonding sheet-core board.
  • the second type is to press the copper foil, the core board and the bonding sheet one by one in the order of the copper foil-the bonding sheet-the core board... the bonding sheet-the core board-the bonding sheet-the copper foil Synthesized.
  • the third type is to laminate the copper foil, the sub-board and the bonding sheet layer by layer according to the stacking order of the copper foil-the bonding sheet-the daughter board-the bonding sheet-the copper foil.
  • via holes can be drilled on the motherboard 5 as signal vias.
  • Step 103 Fabricate a thermal conductor accommodating groove 6 at a designated position on the motherboard 5.
  • the heat conductor accommodating groove 6 is a through groove for accommodating the heat conductor 8.
  • the thickness of the heat conductor 8 is the same as the thickness of the motherboard 5.
  • the gap will be filled with resin 9 for connecting the heat conductor 8 and the motherboard 5 into one body, so it is necessary to set
  • the standard size of the cross section of the fixed heat conductor accommodating groove 6 is slightly larger than the standard size of the cross section of the heat conductor 8.
  • the heat conductor accommodating groove 6 is usually made by mechanical milling, and due to the limitation of the diameter of the milling cutter, it is impossible to make a right angle. Therefore, the four corners of the heat conductor accommodating groove 6 can be drilled separately, so that the drilling forms a circular arc The inner wall of the shape is tangent to the corresponding right angle of the heat conductor 8 to ensure that the heat conductor 8 whose four corners are at right angles can be completely placed in the heat conductor accommodating groove 6.
  • the motherboard 5 can be electroplated before the heat conductor accommodating groove 6 is made; if the groove side wall is required to be metalized, the mother board 5 can be metalized after the heat conductor accommodating groove 6 is made. Plate 5 undergoes a plating operation.
  • Step 104 Adhere a layer of micro-mucosa 7 on the first surface of the mother board 5.
  • the micro-adhesive film 7 has a certain adhesion performance, and its function is to pre-fix the heat conductor 8 placed in the heat conductor accommodating groove 6 and protect the first board surface to prevent subsequent resin 9 In the filling process, a large amount of excess resin 9 remains on the first plate surface and is difficult to remove.
  • the micro-mucosa 7 may have a thin film structure, a substrate, or a thin film structure on the substrate.
  • the coverage area of the micro-mucosa 7 on the first board surface may be the entire board surface or a part of the area including the corresponding area of the thermal conductor accommodating groove 6 to save material cost.
  • Step 105 Put the thermal conductor 8 in the thermal conductor accommodating groove 6 so that the thermal conductor 8 is bonded to the micro-mucosa 7 at the bottom of the thermal conductor accommodating groove 6 to form a pre-fixation.
  • Step 106 Fill the gap between the thermal conductor 8 and the thermal conductor accommodating groove 6 with a resin 9 and then cure the resin 9.
  • screen printing or glue dispensing can be used to fill the gap with resin 9.
  • the thermal conductor 8 and the motherboard 5 form a whole.
  • Step 107 Remove the micromucosa 7.
  • the notch position on the first plate surface of the mother board 5 will not remain excessive due to the adhesion of the micro-mucosa 7, but the notch position on the second plate surface of the mother board 5 is not A small amount of excess resin 9 may remain due to the shielding. Therefore, after the micro-mucosa 7 is removed, the excess resin 9 remaining on the second board surface can be removed according to the actual situation. It should be noted that when the micromucosa 7 is a substrate, the removal operation of the micromucosa 7 is more convenient.
  • Step 108 After the entire plate is electroplated, an outer layer pattern is made on the surface of the heat conductor 8 and other plate surfaces.
  • the outer layer pattern on the surface of the heat conductor 8 it is necessary to remove the conductive layer in the non-patterned area and the seed layer under the part of the conductive layer at the same time. Different seed layers may require different removal methods, otherwise they cannot be effectively removed; other boards
  • the outer layer pattern of the surface is usually made by etching to remove the ineffective copper layer, and the etching solution cannot remove some seed layers.
  • the outer layer patterns on the surface of the heat conductor 8 and other board surfaces can be made at the same time to improve the production efficiency; if the seed layer cannot be removed by conventional etching, it can be The outer layer patterns on the surface of the heat conductor 8 and the other board surfaces are separately made to avoid mutual influence between the two.
  • Step 109 Perform the remaining conventional process production normally, such as solder mask, surface treatment, shape, electrical test, final inspection, etc., and finally form a finished PCB with embedded thermal conductor 8.
  • the PCB manufacturing method provided in this embodiment first makes a mother board 5 with a heat conductor accommodating groove 6, and then puts a copper-clad ceramic sheet as a heat conductor 8 into the heat conductor accommodating groove 6 and passes through the bottom of the groove.
  • the micro-adhesive film 7 is pre-fixed, and then the resin 9 is filled and cured in the gap between the thermal conductor 8 and the thermal conductor accommodating groove 6 to realize the fixed connection between the thermal conductor 8 and the motherboard 5.
  • the thermal conductor accommodating groove 6 is made after the pressing process, there is no need to open the outer layer of copper foil before pressing and forming the mother board 5, so that the outer layer of copper foil can be pressed during the pressing process. Maintain good flatness and no wrinkles.
  • the application of the micro-adhesive film 7 can not only pre-fix the thermal conductor 8 to prevent displacement of the thermal conductor 8 during the resin 9 filling process, but also prevent a large amount of excess resin 9 from remaining on the first board surface.
  • copper-clad ceramic sheets are used as the heat conductor 8, and the conductive layer on the surface of the heat conductor 8 can also be patterned, which improves the overall wiring density of the PCB.
  • the manufacturing method of the thermally conductive PCB provided by the embodiment of the present invention includes:
  • Step 201 Fabricate a thermal conductor 8 with a specified specification.
  • the thermal conductor 8 includes a ceramic layer, a seed layer formed on the outer surface of the ceramic layer, and a conductive layer formed on the outer surface of the seed layer.
  • Step 202 Make a mother board 5.
  • Step 203 Fabricate a thermal conductor accommodating groove 6 at a designated position on the motherboard 5.
  • Step 204 Adhere a layer of micro-mucosa 7 on the first surface of the mother board 5.
  • Step 205 pre-fill a specified amount of resin 9 in the heat conductor accommodating groove 6, and then put the heat conductor 8 in the heat conductor accommodating groove 6 until the heat conductor 8 and the micro-mucosa 7 on the bottom of the heat conductor accommodating groove 6 Bonding; during the placement of the thermal conductor 8, the resin 9 will flow to fill the gap between the thermal conductor 8 and the thermal conductor accommodating groove 6, or slightly out of the thermal conductor accommodating groove 6 on the second plate surface notch.
  • Step 206 Curing the resin 9 at a certain temperature, so that the heat conductor 8 and the motherboard 5 are fixedly connected as a whole.
  • Step 207 Remove the micromucosa 7.
  • the excess resin 9 remaining on the second board surface can be removed according to the actual situation.
  • Step 208 After the entire plate is electroplated, an outer layer pattern is made on the surface of the heat conductor 8 and other plate surfaces.
  • Step 209 Perform the remaining conventional process production normally, such as solder mask, surface treatment, shape, electrical measurement, final inspection, etc., and finally form a finished PCB with embedded thermal conductor 8.
  • step 205 the other steps except step 205 are the same as in the first embodiment, and will not be repeated here.
  • the second embodiment uses the method in which the resin 9 is first filled in the groove and then the thermal conductor 8 is put in, so that the resin 9 is in the thermal conductor. 8 Automatically flow during the insertion process to fill the gaps.
  • This embodiment provides a PCB, which is manufactured according to the manufacturing method described in the first or second embodiment. Since the embedded heat conductor 8 includes a ceramic layer and a conductive layer formed on the outer surface through a seed layer, the outer layer pattern can be made on the surface of the heat conductor 8 at the same time, which improves the wiring density of PCB products.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

本发明涉及PCB技术领域，公开了一种导热PCB的制作方法及PCB。制作方法包括：先制作母板，再在母板上制作导热体容置槽；在母板上黏附微粘膜；将导热体置于导热体容置槽中并与微粘膜粘接，通过树脂将导热体与母板固定连接；导热体包括陶瓷层以及导电层；去除微粘膜后整板电镀；在导热体的表面和/或其他板面制作外层图形。本发明中导热体容置槽在压合工序后制作，因而在压合前无需对外层的铜箔开窗处理，使得外层铜箔在压合过程中能够保持良好的平整度，不会出现起皱现象；微粘膜不仅可对导热体进行预固定，还能防止板面残留大量多余树脂；采用覆铜陶瓷片作为导热体，导热体表面的导电层也能够制作图形，提升了PCB的整体布线密度。

Description

一种导热PCB的制作方法及PCB
本申请要求于2019年09月19日提交中国专利局、申请号为201910888367.4、申请名称为“一种导热PCB的制作方法及PCB”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及PCB(Printed Circuit Board，印制线路板)技术领域，尤其涉及一种导热PCB的制作方法及PCB。
背景技术
当前主流的PCB局部散热技术主要有内嵌金属块技术，利用铜、铝等金属的高导热性能，把PCB表面的高功率器件工作时产生的热量及时散发出去，从而降低器件和设备的温度、提高使用寿命和电气性能。
其中，内嵌金属块技术通常应用于芯板+芯板压合形成的产品中，如图1所示，具体实现方法为：先将多张芯板1和粘结片2的对应位置分别开窗，再将芯板1与粘结片2按序叠放，并于开窗位置形成的通槽内放入金属块3，最后高温压合。
然而，在将内嵌金属块技术应用于高密度互连板(High Density Interconnector，简称HDI板)产品时，会存在一些缺陷。如图2所示，具体实现方法为：先将铜箔4、芯板1和粘结片2的对应位置分别开窗，再将铜箔4、芯板1与粘结片2按序叠放，并于开窗位置形成的通槽内放入金属块3，最后高温压合。在该制作工艺中，由于位于外层的铜箔4在压合前预先进行了开窗处理，因此在高温压合后铜箔4的开窗位置极易出现起皱现象，同时压合工序中所采用的常规缓冲材料(如铝片、离型膜等)会加剧起皱程度，而且金属块3的外层表面无法实现线路制作，限制了整体布线密度的提高。
发明内容
本发明的目的在于提供一种导热PCB的制作方法及PCB，克服现有技术存在的铜箔易起皱以及布线密度受限的缺陷。
为达此目的，本发明采用以下技术方案：
一种导热PCB的制作方法，包括：
先制作母板，再在所述母板上制作导热体容置槽；
在所述母板的第一板面黏附微粘膜，所述微粘膜覆盖所述导热体容置槽于所述第一板面的槽口；
将导热体置于所述导热体容置槽中并与所述微粘膜粘接，通过树脂将所述导热体与所述母板固定连接；所述导热体包括陶瓷层以及通过种子层形成于所述陶瓷层的两外表面的导电层；所述导热体的厚度与所述母板的厚度相同，所述导热体的横截面标准尺寸小于所述导热体容置槽的横截面标准尺寸；
去除所述微粘膜后，进行整板电镀；
在所述导热体的表面和/或所述母板的除内嵌导热体区域以外的其他区域板面制作外层图形。
可选的，所述导热PCB的制作方法还包括所述导热体的制作步骤：
在具有指定厚度的大片陶瓷片的上下外表面分别通过种子层镀铜，形成大覆铜陶瓷片；将所述大覆铜陶瓷片分割成若干个指定规格的小覆铜陶瓷片，从而获得所述导热体。
可选的，所述导热体的制作步骤中还包括：对所述小覆铜陶瓷片的表面和/或侧面进行粗化处理。
可选的，所述将导热体置于所述导热体容置槽中并与所述微粘膜粘接，通过树脂将所述导热体与所述母板固定连接，包括：
先将所述导热体放入所述导热体容置槽内，直至所述导热体与位于所述导热体容置槽底部的所述微粘膜粘接，形成预固定；
再在所述导热体与所述导热体容置槽之间的缝隙内填充树脂；
在预设温度下，将所述树脂固化。
可选的，所述将导热体置于所述导热体容置槽中并与所述微粘膜粘接，通过树脂将所述导热体与所述母板固定连接，包括：
先在所述导热体容置槽内填充指定量的所述树脂；
再将所述导热体放入所述导热体容置槽内，直至所述导热体与位于所述导热体容置槽底部的所述微粘膜粘接；在所述导热体的放入过程中，所述树脂自动流动以填充所述导热体与所述导热体容置槽之间的缝隙；
在预设温度下，将所述树脂固化。
可选的，所述导热PCB的制作方法中，采用丝印或者点胶方式，在所述 导热体与所述导热体容置槽之间的缝隙内填充树脂。
可选的，所述外层图形的制作方法为：采用图形转移法，在所述导热体表面和所述母板的除内嵌导热体区域以外的其他区域板面，同时制作外层图形。
可选的，所述外层图形的制作方法为：对于所述导热体表面和所述母板的除内嵌导热体区域以外的其他区域板面，先对其中之一进行保护，再在另一个表面制作外层图形。
可选的，所述导热PCB的制作方法还包括：在所述导热体容置槽的四角位置分别钻孔，使得钻孔后形成的圆弧形内壁与所述导热体的对应直角相切。
一种PCB，按照如上任一所述的制作方法制成。
与现有技术相比，本发明的有益效果为：
本发明实施例在压合工序后制作导热体容置槽，因而在压合制成母板前无需对外层的铜箔进行开窗处理，使得外层铜箔在压合过程中能够保持良好的平整度，不会出现起皱现象。同时，微粘膜的应用，不仅可对导热体进行预固定，以杜绝导热体在树脂填充过程中产生位移，还能防止第一板面残留大量多余树脂。此外，采用覆铜陶瓷片作为导热体，导热体表面的导电层也能够制作图形，提升了PCB的整体布线密度。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图。
图1为现有的第一种导热PCB的制作方法示意图。
图2为现有的第二种导热PCB的制作方法示意图。
图3为本发明实施例一提供的导热PCB的制作方法流程图。
图4为本发明实施例一提供的导热PCB的制作方法示意图。
图5为本发明实施例二提供的导热PCB的制作方法流程图。
图6为本发明实施例二提供的导热PCB的制作方法示意图。
具体实施方式
为使得本发明的发明目的、特征、优点能够更加的明显和易懂，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，下面所描述的实施例仅仅是本发明一部分实施例，而非全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
实施例一
请参阅图3所示的导热PCB的制作方法流程图和图4所示的导热PCB的制作方法示意图，本发明实施例提供的导热PCB的制作方法，包括:
步骤101、制作指定规格的导热体8，该导热体8包括陶瓷层、形成于陶瓷层外表面的种子层，以及形成于种子层外表面的导电层。
导热体8用于实现散热功能，其具体制作方法为：先在具有一定厚度的大片陶瓷片的上下表面分别先形成种子层再镀导电层，例如铜层，形成大覆铜陶瓷片；再将大覆铜陶瓷片分割成若干个指定规格的小覆铜陶瓷片；然后，对小覆铜陶瓷片的表面和/或侧面进行粗化处理，从而获得所需的指定规格的导热体8。具体的，该导热体8也可以是金属结构，例如铜、铝等。
步骤102、制作母板5。
该母板5的制作方式具体不限制，可以包括：
第一种，按照芯板--粘结片…芯板--粘结片--芯板的叠板顺序，将多张芯板和粘结片压合制成。
第二种，按照铜箔--粘结片--芯板…粘结片--芯板--粘结片--铜箔的顺序，将铜箔、芯板和粘结片逐层叠加压合制成。
第三种，按照铜箔--粘结片--子板--粘结片--铜箔的叠板顺序，将铜箔、子板和粘结片逐层叠加压合制成。
在完成母板5制作后，可于母板5上钻导通孔，以作为信号过孔。
步骤103、在母板5上的指定位置制作导热体容置槽6。
导热体容置槽6为通槽，用于容纳导热体8。导热体8的厚度与母板5的板厚相同。为保证导热体8能够放入导热体容置槽6且与槽壁之间形成有一定缝隙，该缝隙内将填充用以将导热体8与母板5连接成一体的树脂9，因此需 设定导热体容置槽6的横截面标准尺寸略大于导热体8的横截面标准尺寸。
由于导热体容置槽6通常采用机械铣的方式制成，受到铣刀直径的限制，无法制作直角，因此可在导热体容置槽6的四角位置分别钻孔，使得钻孔形成的圆弧形内壁与导热体8的对应直角相切，以保证四角为直角的导热体8能够完全放至导热体容置槽6内。
进一步的，若不需要槽侧壁金属化，可在制作导热体容置槽6之前对母板5进行电镀操作；若需要槽侧壁金属化，可在制作导热体容置槽6之后对母板5进行电镀操作。
步骤104、在母板5的第一板面黏附一层微粘膜7。
本实施例中，微粘膜7具有一定的黏附性能，其作用在于：对放入导热体容置槽6内的导热体8进行预固定，并对第一板面进行保护，防止在后续的树脂9填充工序中大量多余的树脂9残留在第一板面而难以去除。微粘膜7可以为具有薄膜结构，也可以是基板，也可以是基板上的薄膜结构。
为此，微粘膜7于第一板面的覆盖区域，可以为整个板面，也可以为包括导热体容置槽6对应区域的部分区域，以节省材料成本。
步骤105、在导热体容置槽6内放入导热体8，使得导热体8与导热体容置槽6底部的微粘膜7粘接，形成预固定。
步骤106、在导热体8与导热体容置槽6的缝隙内填充树脂9，之后将树脂9固化。
具体的，可采用丝印或者点胶方式，在缝隙内填充树脂9。
在一定温度下，树脂9固化后导热体8与母板5形成一个整体。
步骤107、去除微粘膜7。
由于在树脂9填充时，因母板5的第一板面的槽口位置因黏附有微粘膜7而不会残留多余树脂9，但母板5的第二板面的槽口位置因未被遮挡而可能会残留少量多余树脂9，因此在去除微粘膜7后，可根据实际情况去除第二板面残留的多余树脂9。需要说明的是，在微粘膜7为基板时，微粘膜7的去除操作更为便利。
步骤108、进行整板电镀后，在导热体8表面和其他板面进行外层图形制作。
通常情况下，在制作覆铜陶瓷片时，无法在陶瓷片的表面直接电镀形成导电层，需要先在陶瓷片的表面形成种子层(如钛、镍)，再在种子层的表面电镀形成导电层。
在导热体8表面制作外层图形时，需要同时去除非图形区域的导电层以及该部分导电层下层的种子层，而对于不同的种子层可能需要不同的去除方法，否则无法有效去除；其他板面的外层图形通常采用蚀刻去除无效铜层的方式制成，该蚀刻药水无法去除某些种子层。因此，本步骤中，若种子层可通过常规蚀刻方式去除，则可同时制作导热体8表面和其他板面的外层图形，以提高制作效率；若种子层不可通过常规蚀刻方式去除，则可分别单独制作导热体8表面和其他板面的外层图形，以避免两者相互影响。
步骤109、正常进行剩余常规流程制作，例如阻焊、表面处理、外形、电测、终检等，最终形成内嵌导热体8的PCB成品。
综上，本实施例所提供的PCB制作方法，先制成具有导热体容置槽6的母板5，再将覆铜陶瓷片作为导热体8放入导热体容置槽6并通过槽底的微粘膜7进行预固定，之后在导热体8与导热体容置槽6之间的缝隙里填充树脂9并固化，以实现导热体8与母板5的固定连接。此过程中，由于导热体容置槽6在压合工序后制作，因而在压合制成母板5前无需对外层的铜箔进行开窗处理，使得外层铜箔在压合过程中能够保持良好的平整度，不会出现起皱现象。同时，微粘膜7的应用，不仅可对导热体8进行预固定，以杜绝导热体8在树脂9填充过程中产生位移，还能防止第一板面残留大量多余树脂9。而且，采用覆铜陶瓷片作为导热体8，导热体8表面的导电层也能够制作图形，提升了PCB的整体布线密度。
实施例二
请参阅图5所示的导热PCB的制作方法流程图和图6所示的导热PCB的制作方法示意图，本发明实施例提供的导热PCB的制作方法，包括:
步骤201、制作指定规格的导热体8，该导热体8包括陶瓷层、形成于陶瓷层外表面的种子层，以及形成于种子层外表面的导电层。
步骤202、制作母板5。
步骤203、在母板5上的指定位置制作导热体容置槽6。
步骤204、在母板5的第一板面黏附一层微粘膜7。
步骤205、在导热体容置槽6内预先填充指定量的树脂9，再将导热体容置槽6内放入导热体8，直至导热体8与导热体容置槽6底部的微粘膜7粘接；在导热体8的放置过程中，树脂9会流动以填满导热体8与导热体容置槽6之间的缝隙，或者轻微冒出导热体容置槽6于第二板面的槽口。
步骤206、在一定温度下，将树脂9固化，从而使得导热体8与母板5固定连接为一个整体。
步骤207、去除微粘膜7。
在去除微粘膜7后，可根据实际情况去除第二板面残留的多余树脂9。
步骤208、进行整板电镀后，在导热体8表面和其他板面进行外层图形制作。
步骤209、正常进行剩余常规流程制作，例如阻焊、表面处理、外形、电测、终检等，最终形成内嵌导热体8的PCB成品。
上述流程中，除步骤205以外的其他步骤与实施例一相同，此处不再赘述。
与本实施例一中先放入导热体8再在缝隙内填充树脂9的方式不同，本实施例二采用先在槽内填充树脂9再放入导热体8的方式，使得树脂9在导热体8放入过程中自动流动以填充缝隙。
实施例三
本实施例提供了一种PCB，该PCB按照上述实施例一或二所述的制作方法制成。由于内嵌的导热体8包括陶瓷层以及通过种子层形成于外表面的导电层，因而可同时在导热体8的表面进行外层图形制作，提升了PCB产品的布线密度。
以上所述，以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。

Claims (12)

  1. 一种导热PCB的制作方法，其特征在于，包括：
    先制作母板，再在所述母板上制作导热体容置槽；
    在所述母板的第一板面黏附微粘膜，所述微粘膜覆盖所述导热体容置槽于所述第一板面的槽口；
    将所述导热体置于所述导热体容置槽中并与所述微粘膜粘接，通过树脂将所述导热体与所述母板固定连接；所述导热体的厚度与所述母板的厚度相同，所述导热体的横截面标准尺寸小于所述导热体容置槽的横截面标准尺寸；
    去除所述微粘膜后，进行整板电镀；
    在所述导热体的表面和/或所述母板的除内嵌导热体区域以外的其他区域板面制作外层图形。
  2. 根据权利要求1所述的方法，其特征在于，所述导热体包括陶瓷层以及通过种子层形成于所述陶瓷层的两外表面的导电层。
  3. 根据权利要求2所述的导热PCB的制作方法，其特征在于，还包括所述导热体的制作步骤：
    在具有指定厚度的大片陶瓷片的上下外表面分别通过种子层镀铜，形成大覆铜陶瓷片；将所述大覆铜陶瓷片分割成若干个指定规格的小覆铜陶瓷片，从而获得所述导热体。
  4. 根据权利要求3所述的导热PCB的制作方法，其特征在于，所述导热体的制作步骤中还包括：对所述小覆铜陶瓷片的表面和/或侧面进行粗化处理。
  5. 根据权利要求1-4任意一项所述的导热PCB的制作方法，其特征在于，所述将导热体置于所述导热体容置槽中并与所述微粘膜粘接，通过树脂将所述导热体与所述母板固定连接，包括：
    先将所述导热体放入所述导热体容置槽内，直至所述导热体与位于所述导热体容置槽底部的所述微粘膜粘接，形成预固定；
    再在所述导热体与所述导热体容置槽之间的缝隙内填充树脂；
    在预设温度下，将所述树脂固化。
  6. 根据权利要求1-5任意一项所述的导热PCB的制作方法，其特征在于，所述将导热体置于所述导热体容置槽中并与所述微粘膜粘接，通过树脂将所述导热体与所述母板固定连接，包括：
    先在所述导热体容置槽内填充指定量的所述树脂；
    再将所述导热体放入所述导热体容置槽内，直至所述导热体与位于所述导热体容置槽底部的所述微粘膜粘接；在所述导热体的放入过程中，所述树脂自动流动以填充所述导热体与所述导热体容置槽之间的缝隙；
    在预设温度下，将所述树脂固化。
  7. 根据权利要求5所述的导热PCB的制作方法，其特征在于，所述PCB制作方法中，采用丝印或者点胶方式，在所述导热体与所述导热体容置槽之间的缝隙内填充树脂。
  8. 根据权利要求1-7任意一项所述的导热PCB的制作方法，其特征在于，所述外层图形的制作方法为：采用图形转移法，在所述导热体表面和所述母板的除内嵌导热体区域以外的其他区域板面，同时制作外层图形。
  9. 根据权利要求1-8任意一项所述的导热PCB的制作方法，其特征在于，所述外层图形的制作方法为：对于所述导热体表面和所述母板的除内嵌导热体区域以外的其他区域板面，先对其中之一进行保护，再在另一个表面制作外层图形。
  10. 根据权利要求1-9任意一项所述的导热PCB的制作方法，其特征在于，所述PCB制作方法还包括：在所述导热体容置槽的四角位置分别钻孔，使得钻孔后形成的圆弧形内壁与所述导热体的对应直角相切。
  11. 根据权利要求1-10任意一项所述的导热PCB的制作方法，其特征在于，所述微粘膜包括基板。
  12. 一种PCB，其特征在于，所述PCB按照如权利要求1至11任一所述的制作方法制成。
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