WO2021041037A1 - Ensembles protecteurs d'affichage ayant des trous d'interconnexion - Google Patents

Ensembles protecteurs d'affichage ayant des trous d'interconnexion Download PDF

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Publication number
WO2021041037A1
WO2021041037A1 PCT/US2020/045923 US2020045923W WO2021041037A1 WO 2021041037 A1 WO2021041037 A1 WO 2021041037A1 US 2020045923 W US2020045923 W US 2020045923W WO 2021041037 A1 WO2021041037 A1 WO 2021041037A1
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WO
WIPO (PCT)
Prior art keywords
glass
based substrate
vias
electronic device
disposed
Prior art date
Application number
PCT/US2020/045923
Other languages
English (en)
Inventor
Eric Louis Null
Prashanth Abraham Vanniamparambil
Original Assignee
Corning Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Incorporated filed Critical Corning Incorporated
Publication of WO2021041037A1 publication Critical patent/WO2021041037A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1696—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being a printing or scanning device
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
    • H04M1/185—Improving the rigidity of the casing or resistance to shocks

Definitions

  • the present specification generally relates to display protector assemblies.
  • the present disclosure is related to display protector assemblies capable of functioning with an electronic device having a fingerprint sensor underneath a display layer and cover glass of the electronic device.
  • a display of an electronic device such as a mobile phone and a tablet, may be implemented by a plurality of layers.
  • the display of the electronic device may include a cover glass that is disposed on a digital display panel (e.g., a liquid crystal display (LCD) panel), one or more indium-tin-oxide (1TO) layers, one or more adhesive layers, and a capacitive sensor network.
  • a digital display panel e.g., a liquid crystal display (LCD) panel
  • 1TO indium-tin-oxide
  • a user of the electronic device may decide to attach a display protector to the cover glass of the electronic device.
  • Example display protectors include 3D glass screen protectors, 2.5D glass screen protectors, and 2D glass screen protectors.
  • the electronic device may include various sensors configured to obtain biometric information or other identifying indicia of a user in order to perform user authentication functions.
  • the electronic device may include an ultrasonic fingerprint sensor located underneath the cover glass the digital display panel of the electronic device.
  • the ultrasonic fingerprint sensor may transmit ultrasonic signals (e.g., acoustic signals) in order to scan a user’s finger and generate a 3D image of the user’s finger/fingerprint. Subsequently, the electronic device may activate or enable certain functions based on the generated 3D image (i.e., if the generated 3D image matches a 3D image profile associated with the electronic device, the electronic device may unlock and make certain applications available to the user).
  • the working distance of these fingerprint sensors may be limited (e.g., 800 microns), and the additional material of a display protector may cause undesirable signal reflection and/or absorption, therefore making the integration of a mechanically robust display protector with these electronic devices difficult.
  • a screen protector in one embodiment, includes a glass-based substrate and an acoustic waveguide disposed within the glass-based substrate.
  • the acoustic waveguide includes a plurality of vias extending through the glass-based substrate and a polymer disposed within each via of a set of the plurality of vias.
  • an electronic device in another embodiment, includes an acoustic fingerprint sensor operable to emit an acoustic signal at a signal frequency.
  • the electronic device also includes an electronic display disposed on the acoustic fingerprint sensor and a cover glass disposed on the electronic display.
  • the electronic device also includes a screen protector assembly disposed on the cover glass.
  • the screen protector assembly includes a glass-based substrate that includes an acoustic waveguide, which further includes a plurality of vias extending through the glass-based substrate and a polymer disposed within a set of the plurality of vias.
  • a screen protector comprises: a glass-based substrate; and an acoustic waveguide disposed within the glass- based substrate.
  • the acoustic waveguide comprises: a plurality of vias, each via extending at least partially through the glass-based substrate; and a polymer disposed within each via of a set of the plurality of vias.
  • the screen protector of aspect (1) is provided, wherein the polymer is transparent in a visible spectrum.
  • the screen protector of aspect (1) or (2) is provided, wherein the plurality of vias includes at least one of a through-glass via and a blind via.
  • the screen protector of any of aspects (1) to (3) is provided, further comprising an adhesive layer, wherein the glass-based substrate is disposed on the adhesive layer.
  • the screen protector of any of aspects (1) to (3) is provided, further comprising: a film layer; and an adhesive layer, wherein the film layer is disposed on the adhesive layer, and wherein the glass-based substrate is disposed on the film layer.
  • the screen protector of any of aspects (1) to (3) or (5) is provided, wherein each via of the plurality of vias extends through at least one of the film layer and the adhesive layer.
  • the screen protector of any of aspects (1) to (6) is provided, wherein the glass-based substrate has a thickness of at least 0.2 millimeters.
  • the screen protector of any of aspects (1) to (7) is provided, wherein a reflection coefficient at an interface of the plurality of vias and the glass-based substrate is less than a reflection coefficient at an interface of the glass-based substrate and one of an adhesive layer of the screen protector and a film layer of the screen protector at a defined frequency.
  • the screen protector of aspect (8) is provided, wherein the defined frequency is in a range of 1 MHz to 100 MHz, including endpoints.
  • the screen protector of aspect (8) or (9) is provided, wherein the defined frequency is in a range of 5 MHz to 25 MHz, including endpoints.
  • an electronic device comprising: an acoustic fingerprint sensor operable to emit an acoustic signal at a signal frequency; an electronic display disposed on the acoustic fingerprint sensor; a cover glass disposed on the electronic display; and a screen protector assembly disposed on the cover glass.
  • the screen protector assembly comprises: a glass-based substrate comprising an acoustic waveguide, wherein the acoustic waveguide comprises a plurality of vias, each via extending at least partially through the glass-based substrate, and a polymer disposed within a set of the plurality of vias.
  • the electronic device of aspect (11) is provided, wherein the acoustic waveguide is aligned with the acoustic fingerprint sensor.
  • the electronic device of aspect (11) or (12) is provided, wherein the plurality of vias includes at least one of a through-glass via and a blind via.
  • the electronic device of any of aspects (11) to (13) is provided, wherein a reflection coefficient at an interface of the plurality of vias and the glass- based substrate is less than a reflection coefficient at an interface of the glass-based substrate and one of an adhesive layer of the screen protector assembly and a film layer of the screen protector assembly at a defined frequency.
  • the electronic device of aspect (14) is provided, wherein the defined frequency is in a range of 1 MHz to 100 MHz, including endpoints.
  • the electronic device of aspect (14) or (15) is provided, wherein the defined frequency is in a range of 5 MHz to 25 MHz, including endpoints.
  • the electronic device of any of aspects (11) to (16) is provided, wherein the polymer is transparent in a visible spectrum.
  • the electronic device of any of aspects (11) to (17) wherein the screen protector assembly further comprises an adhesive layer, and wherein the glass-based substrate is disposed on the adhesive layer.
  • the electronic device of any of aspects (11) to (17) is provided, further comprising: a film layer, wherein the glass-based substrate is disposed on the film layer; and an adhesive layer, wherein the film layer is disposed on the adhesive layer; wherein the plurality of vias extends through at least one of the film layer and the adhesive layer.
  • the electronic device of any of aspects (11) to (19) is provided, wherein the glass-based substrate has a thickness of at least 0.2 millimeters.
  • FIG. 1A schematically depicts a perspective view of an example display protector assembly according to one or more embodiments described and illustrated herein;
  • FIG. IB schematically depicts a cross-sectional view of the example display protector of FIG. 1 A according to one or more embodiments described and illustrated herein;
  • FIG. 2A schematically depicts a perspective view of an example electronic device with a sensor disposed under a display panel and a cover glass of the electronic device according to one or more embodiments described and illustrated herein;
  • FIG. 2B schematically depicts an exploded cross-sectional view of FIG. 2A according to one or more embodiments described and illustrated herein;
  • FIG. 3A schematically depicts an exploded view of an example electronic device and an example display protector assembly with an acoustic waveguide according to one or more embodiments described and illustrated herein;
  • FIG. 3B schematically depicts a cross-sectional view of the acoustic waveguide depicted in FIG. 3A according to one or more embodiments described and illustrated herein;
  • FIG. 4A schematically depicts a perspective view of a plurality of vias of an example display protector assembly according to one or more embodiments described and illustrated herein;
  • FIG. 4B schematically depicts a top-down view of a plurality of vias of an example display protector assembly according to one or more embodiments described and illustrated herein;
  • FIG. 4C schematically depicts a cross-sectional view of an example via depicted in FIG. 4B according to one or more embodiments described and illustrated herein;
  • FIG. 4D schematically depicts another cross-sectional view of an example through- glass-via of FIG. 4B according to one or more embodiments described and illustrated herein;
  • FIG. 4E schematically depicts yet another cross-sectional view of an example through-glass-via of FIG. 4B according to one or more embodiments described and illustrated herein;
  • FIG. 4F schematically depicts yet another cross-sectional view of an example through-glass-via of FIG. 4B according to one or more embodiments described and illustrated herein;
  • FIG. 4G schematically depicts yet another cross-sectional view of an example through-glass-via of FIG. 4B according to one or more embodiments described and illustrated herein;
  • FIG. 4H schematically depicts a cross-sectional view of an example blind via of FIG. 4B according to one or more embodiments described and illustrated herein;
  • FIG. 5A schematically depicts an exploded view of another example electronic device and another example display protector assembly with an acoustic waveguide according to one or more embodiments described and illustrated herein;
  • FIG. 5B schematically depicts a cross-sectional view of the acoustic waveguide depicted in FIG. 5A according to one or more embodiments described and illustrated herein;
  • FIG. 6 depicts a flow diagram of an illustrative method of forming an acoustic waveguide according to one or more embodiments shown and described herein.
  • embodiments of the present disclosure are generally related to display protector assemblies for electronic devices having acoustic waveguides that transmit ultrasonic signals.
  • the display protector assemblies may be disposed on various electronic devices including, but not limited to, a mobile device (e.g., a smartphone, tablet, laptop, PDA, or other similar mobile devices).
  • a mobile device e.g., a smartphone, tablet, laptop, PDA, or other similar mobile devices.
  • the phrase “disposed on” can describe a spatial or functional relationship between two or more elements. Unless explicitly described as being “direct,” the relationship can be a direct relationship where no other intervening elements are present between the first and second elements, but can also be an indirect relationship where one or more intervening elements are present (either spatially or functionally) between the first and second elements.
  • the display protector assemblies described herein comprise acoustic waveguides that include vias (e.g., through-holes and blind-holes) extending at least partially through a glass-based substrate of the display protector assembly.
  • the vias may extend through at least one of a film layer and an adhesive layer of the display protector assembly.
  • Each of the vias may include a polymer disposed therein.
  • the reflection coefficient within a display protector assembly having the acoustic waveguides is less than a reflection coefficient outside of the acoustic waveguide in the ultrasonic frequency spectrum and, as such, the display protector assembly can effectively transmit ultrasonic signals originating from a sensor of the electronic device.
  • the acoustic waveguides enable the glass-based substrate to have a sufficient thickness to prevent impact forces from damaging an electronic device located beneath the display protector assembly.
  • Embodiments of the present disclosure are further directed to laser forming, laser etching, and polymer depositing processes that result in a glass-based substrate having vias with a polymer disposed therein.
  • the display protector assembly 10 includes a glass-based substrate 12, a film layer 14, and an adhesive layer 16.
  • the glass-based substrate 12 includes a lower surface 12A and an upper surface 12B;
  • the film layer 14 includes a lower surface 14A and an upper surface 14B;
  • the adhesive layer 16 includes a lower surface 16A and an upper surface 16B.
  • the electronic device 20 may include a cover glass 22 onto which the display protector assembly 10 is attached.
  • the electronic device 20 may include other components, a display panel (e.g., a liquid crystal display (LCD) panel, an organic light- emitting diode (OLED) panel, etc.), one or more indium-tin-oxide (1TO) layers, one or more adhesive layers, a capacitive sensor network, one or more processing circuits, and one or more nontransitory computer-readable mediums, such as a random-access memory and/or read-only memory.
  • a display panel e.g., a liquid crystal display (LCD) panel, an organic light- emitting diode (OLED) panel, etc.
  • LCD liquid crystal display
  • OLED organic light- emitting diode
  • 1TO indium-tin-oxide
  • adhesive layers e.g., a capacitive sensor network
  • processing circuits e.g., a capacitive sensor network
  • nontransitory computer-readable mediums such as a random-access memory and/or read-only memory.
  • glass-based refers to an article that includes or is wholly made of glass, such as a glass or glass-ceramic material.
  • the glass-based substrate 12 may include, but is not limited to, a fused silica material, a float glass material, a glass-ceramic material, a tempered glass material, alkali containing glass (e.g., an alkali aluminosilicate glass material), alkali-free glass (e.g., alkali-free alkaline aluminoborosilicate glass), a ceramic material, or other similar glass-based materials.
  • alkali containing glass e.g., an alkali aluminosilicate glass material
  • alkali-free glass e.g., alkali-free alkaline aluminoborosilicate glass
  • ceramic material or other similar glass-based materials.
  • the glass-based substrate 12 may be an alkali aluminosilicate glass composition that comprises from about 60 mol % to about 70 mol % SiCh; from about 6 mol % to about 14 mol % AI2O3; from 0 mol % to about 15 mol % B2O3; from 0 mol % to about 15 mol % LEO; from 0 mol % to about 20 mol % Na 2 0; from 0 mol % to about 10 mol % K2O; from 0 mol % to about 8 mol % MgO; from 0 mol % to about 10 mol % CaO; from 0 mol % to about 5 mol % ZrCh; from 0 mol % to about 1 mol % SnCL; from 0 mol % to about 1 mol % CeCh; less than about 50 ppm AS2O3; and less than about 50 ppm Sb 2 03; wherein
  • the alkali aluminosilicate glass composition comprises at least about 50 mol % SiCkand at least about 11 mol % Na 2 0, and the compressive stress is at least about 900 MPa.
  • the glass-based substrate 12 further comprises AI2O3 and at least one of B2O3, K2O, MgO and ZnO, wherein -340+27.1.Al 2 O 3 -28.7.B 2 O 3 +15.6.Na 2 O-61.4.K 2 O+8.1. (MgO+ZnO) > 0 mol %.
  • the glass comprises from about 7 mol % to about 26 mol % AI2O3; from 0 mol % to about 9 mol % B2O3; from about 11 mol % to about 25 mol % Na 2 0; from 0 mol % to about 2.5 mol % K2O; from 0 mol % to about 8.5 mol % MgO; and from 0 mol % to about 1.5 mol % CaO.
  • the glass-based substrate 12 may have a thickness between 0.2 and 1.0 millimeters, including endpoints (e.g., 0.3 millimeters), but it should be understood that the glass-based substrate 12 may have any suitable thickness.
  • the glass-based thickness may be between 0.2 and 0.3 millimeters, between 0.2 and 0.4 millimeters, between 0.2 and 0.5 millimeters, between 0.2 and 0.6 millimeters, between 0.2 and 0.7 millimeters, between 0.2 and 0.8 millimeters, between 0.2 and 0.9 millimeters, and between 0.2 and 1.0 millimeters.
  • the glass-based substrate 12 may be chemically or thermally strengthened.
  • the glass-based substrate 12 may be chemically strengthened using an ion exchange process.
  • ions in a surface layer of the glass-based substrate 12 are replaced by, or exchanged with, larger ions in a bath solution (e.g., a salt bath) having the same valence or oxidation state.
  • a bath solution e.g., a salt bath
  • parameters for the ion exchange process including, but not limited to, bath composition and temperature, immersion time, the number of immersions of the glass in a salt bath (or baths), use of multiple salt baths, additional steps such as annealing, washing, and the like, are generally determined by the composition of the glass- based substrate 12 and the desired depth of layer and compressive stress of the glass-based substrate 12 as a result of the strengthening operation.
  • ions in the surface layer of the glass-based substrate 12 and the larger ions in the bath may be monovalent alkali metal cations, such as Li + (when present in the glass-based substrate 12), Na + , K + , Rb + , and Cs + .
  • monovalent cations in the surface layer may be replaced with monovalent cations other than alkali metal cations, such as Ag + or the like.
  • the lower surface 12A of the glass-based substrate 12 is disposed on and bonded to the upper surface 14B of the film layer 14, which may be an anti splinter film and/or a decorative film.
  • the film layer 14 is configured to prevent the dispersion of glass splinters and/or other particles in the event that the glass- based substrate 12 is broken.
  • Illustrative example materials for the film layer 14 include, but are not limited to, a polycarbonate material, polyethylene terephthalate (PET) material, polypropylene material, polyester material, and/or acrylic material.
  • the film layer 14 may have a thickness that is less than or equal to 0.1 millimeters (e.g., 0.08 millimeters). In some embodiments, the film layer 14 may be disposed on at least a portion of the lower surface 12A (e.g., in some embodiments, the film layer 14 is disposed entirely on the lower surface 12A except for a portion of the lower surface 12A that is located above a sensor). It should be understood that other thicknesses of the film layer 14 may be provided. In some embodiments, the film layer 14 may be removed from the display protector assembly 10 (i.e., the film layer 14 may be an optional component of the display protector assembly 10).
  • the adhesive layer 16 bonds the film layer 14 and the glass-based substrate 12 of the display protector assembly 10 to the cover glass 22 of the electronic device 20.
  • the adhesive layer 16 comprises a plurality of optically clear layers that are transparent in the visible spectrum.
  • the adhesive layer 16 may include a first layer comprising a high-adhesion material, a second layer comprising a PET material, and a third layer comprising a low-adhesion silicon layer.
  • the adhesive layer 16 may include other polymer-based materials, acrylic-based materials, and/or other similar bonding materials.
  • the adhesive layer 16 may be applied as a liquid optically clear adhesive and may subsequently be cured.
  • the adhesive layer 16 may have a thickness that is between 0.05 and 0.45 millimeters, including endpoints (e.g., 0.4 millimeters), such as between 0.05 and 0.1 millimeters, 0.05 and 0.15 millimeters, 0.05 and 0.2 millimeters, 0.05 and 0.25 millimeters, 0.05 and 0.3 millimeters, 0.05 and 0.35 millimeters, 0.05 and 0.40 millimeters, and 0.05 and 0.45 millimeters. It should be understood that other thicknesses of the adhesive layer 16 may be provided.
  • the cover glass 22 of the electronic device 20 is disposed on the display panel, one or more 1TO layers, one or more adhesive layers, and a capacitive sensor network of the electronic device 20.
  • Example non-limiting materials for the cover glass 22 of the electronic device 20 include a silica-based glass material, a tempered glass material, a glass substrate, or other similar glass material.
  • the cover glass 22 comprises an alkali aluminosilicate glass composition.
  • the alkali aluminosilicate glass composition comprises from about 60 mol % to about 70 mol % SiCk; from about 6 mol % to about 14 mol % AI2O3; from 0 mol % to about 15 mol % B2O3; from 0 mol % to about 15 mol % LEO; from 0 mol % to about 20 mol % Na 2 0; from 0 mol % to about 10 mol % K2O; from 0 mol % to about 8 mol % MgO; from 0 mol % to about 10 mol % CaO; from 0 mol % to about 5 mol % ZrCh; from 0 mol % to about 1 mol % SnCh; from 0 mol % to about 1 mol % CeCh; less than about 50 ppm AS2O3; and less than about 50 ppm Sb2(3 ⁇ 4; wherein 12 mol %
  • the alkali aluminosilicate glass composition comprises at least about 50 mol % S1O2 and at least about 11 mol % Na 2 0, and the compressive stress is at least about 900 MPa.
  • the cover glass 22 further comprises AI2O3 and at least one of B2O3, K2O, MgO and ZnO, wherein -340+27.1.AI2O3-28.7.B2O3+I5.6. Na 2 0- 61.4.K. 2 0+8.1.(Mg0+Zn0) > 0 mol %.
  • the glass comprises from about 7 mol % to about 26 mol % AI2O3; from 0 mol % to about 9 mol % B2O3; from about 11 mol % to about 25 mol % Na 2 0; from 0 mol % to about 2.5 mol % K2O; from 0 mol % to about 8.5 mol % MgO; and from 0 mol % to about 1.5 mol % CaO.
  • FIGS. 2A and 2B a perspective view and cross-sectional view along 2B-2B, respectively, of an example electronic device 20 with a sensor 24 disposed under the cover glass 22 and a display layer 23 of the electronic device 20 are schematically depicted.
  • the display layer 23 may be implemented by, for example, an LCD panel or an OLED panel.
  • the sensor 24 may be configured to obtain biometric information or other identifying indicia of a user in order for the electronic device 20 to perform user authentication functions.
  • the senor 24 may be an acoustic fingerprint sensor that is configured to transmit ultrasonic signals (e.g., acoustic signals) to scan a user’s finger to generate a 3D image of the user’s finger/fingerprint. Subsequently, the electronic device 20 may activate or enable, using a processor of the electronic device 20 (not shown), certain functions based on the generated 3D image (i.e., if the generated 3D image matches a 3D image profile associated with the electronic device 20, the electronic device 20 may unlock and make certain applications available to the user).
  • ultrasonic signals e.g., acoustic signals
  • the electronic device 20 may activate or enable, using a processor of the electronic device 20 (not shown), certain functions based on the generated 3D image (i.e., if the generated 3D image matches a 3D image profile associated with the electronic device 20, the electronic device 20 may unlock and make certain applications available to the user).
  • the sensor 24 must transmit ultrasonic signals through multiple layers of the electronic device 20 (e.g., the cover glass 22, the display layer 23, etc.) and the display protector assembly 10 (e.g., the glass-based substrate 12, the film layer 14, and the adhesive layer 16).
  • the sensor 24 also has a limited and finite working distance (e.g., 800 microns). Accordingly, a thickness of the glass-based substrate 12 of the display protector assembly 10 may need to be decreased in order to ensure that the sensor 24 can sufficiently transmit ultrasonic signals through the electronic device 20 and the display protector assembly 10. Reducing the thickness of the glass-based substrate 12, however, may reduce the mechanical robustness of the display protector assembly 10 and therefore make the electronic device 20 more susceptible to damage from impact forces and/or dynamic loading.
  • the display protector assembly 10 can reduce acoustic reflections and thereby improving transmission originating from the sensor 24 of the electronic device 20 despite the thickness of the display protector assembly 10 increasing the working distance between a user’s fingerprint and the sensor 24. Furthermore and as described below in further detail, the acoustic waveguide enables the glass-based substrate 12 to have a sufficient thickness to prevent impact forces from damaging the electronic device 20.
  • the glass-based substrate 12 may include an acoustic waveguide 28 that reduces the acoustic impedance mismatch between the sensor 24 and a user’s finger, thereby improving the ultrasonic transmission through the display protector assembly 10, as described below in further detail.
  • the acoustic waveguide 28 enables the glass-based substrate 12 to have a sufficient thickness for protecting the electronic device 20 from impact forces and/or dynamic loading, as described below in further detail.
  • the acoustic waveguide 28 includes a plurality of vias 30 extending through at least a portion of the thickness of the glass-based substrate 12.
  • the plurality of vias 30 may be arranged in an array or randomly arranged.
  • the acoustic waveguide 28 may include a polymer 32 disposed within at least some vias of the plurality of vias 30, as schematically depicted in the cross-sectional view of the via 30 along 3B-3B in FIG. 3B.
  • the plurality of vias 30 may be a through-glass-via, wherein the via 30 extends through a thickness of the glass-based substrate 12 from the lower surface 12A of the glass-based substrate 12 to the upper surface 12B of the glass-based substrate 12.
  • the through-glass-via extends through a thickness of the glass-based substrate 12 and at least one of the film layer 14 (i.e., the upper surface 14B and the lower surface 14A) and the adhesive layer 16 (i.e., the upper surface 16B and the lower surface 16A).
  • the plurality of vias 30 may be blind vias.
  • a blind via extends only partially through the thickness of the glass-based substrate 12 from the lower surface 12A to the upper surface 12B but not all the way to the upper surface 12B.
  • a blind via extends only partially through the thickness of the glass-based substrate 12 from the upper surface 12B to the lower surface 12A but not all the way to the lower surface 12A.
  • the plurality of vias 30 may have an opening diameter (D), for example, of about 10 microns to about 300 microns, including about 15 microns , about 20 microns, about 25 microns, about 30, 35 microns , about 40 microns , about 50 microns , about 60 microns , about 70 microns , about 80 microns , about 90 microns , about 100 microns , about 110 microns , about 30 microns , about 130 microns , about 140 microns , about 150 microns, about 160 microns , about 170 microns , about 180 microns , about 190 microns , about 200 microns , about 210 microns , about 220 microns , about 230 microns , about 240 microns , about 250 microns , about 260 microns , about 270 microns , about 280 microns , about 290 microns , or
  • the opening diameter (D) refers to a diameter of the opening of the via 30 at one of the lower surfaces 12A, 14A, 16A and the upper surfaces 12B, 14B, 16B.
  • the opening diameter (D) of the plurality of vias 30 may be determined by finding a diameter of a least-squares best fit circle to the edges of the entrance to the plurality of vias 30 as imaged by an optical microscope.
  • a pitch (P) of the plurality of vias 30, which is the center-to-center spacing between adjacent vias 30, may be any dimension, such as, without limitation, about 10 microns to about 2,000 microns, including about 10 microns, about 50 microns, about 100 microns, about 250 microns, about 1,000 microns, about 2,000 microns, or any value or range between any two of these values (including endpoints).
  • the pitch (P) may vary between the plurality of vias 30 (i.e., the pitch (P) between a first via and a second via may be different from a pitch (P) between the first via and a third via).
  • the pitch (P) may be a range, such as about 10 microns to about 100 microns, about 25 microns to about 500 microns, about 10 microns to about 1,000 microns, or about 250 microns to about 2,000 microns, or any value or range between any two of these values (including endpoints).
  • the plurality of vias 30 may have various cross-sectional geometries.
  • the plurality of vias 30 may have a cross-sectional “hourglass” shape.
  • the plurality of vias 30 may have a cross-sectional rectangular shape. While specific reference has been made herein to plurality of vias 30 with different cross-sectional geometries, it should be understood that the plurality of vias 30 may include a variety of other cross-sectional geometries and, as such, the embodiments described herein are not limited to any particular cross-sectional geometry of the plurality of vias 30.
  • each via 30 of the plurality of vias 30 is depicted as having a circular cross section in the plane of the glass-based substrate 12, it should be understood that the vias 30 may have other planar cross-sectional geometries.
  • the vias 30 may have various other cross sectional geometries in the plane of the glass-based substrate 12, including, without limitation, elliptical cross sections, square cross sections, rectangular cross sections, triangular cross sections, and the like.
  • FIGS. 4C-4H schematically depict various illustrative vias within the glass-based substrate 12 (and, in some embodiments, the film layer 14 and the adhesive layer 16) in isolation.
  • FIGS. 4C-4G each depict through-glass-vias, and FIG. 4H depicts a blind via. It should be understood that the portions of the description provided herein may be particularly directed to a specific one of FIGS. 4C-4H, but are generally applicable to any of the various embodiments depicted with respect to FIGS. 4C-4H, unless specifically stated otherwise.
  • FIG. 4C depicts a cross-sectional side view of an illustrative via 30 according to an embodiment.
  • the via 30 may generally be a through-glass-via because it extends an entire distance through the glass-based substrate 12.
  • the via 30 may have a first region 33 located above a plane (X) and below a first opening 40, and the via may have a second region 34 that is located below the plane (X) and above a second opening 50.
  • the first region 33 includes a first left interior edge 36-1 and a first right interior edge 36-2 (collectively referred to as first interior edges 36), and the second region 34 includes a second left interior edge 38-1 and a second right interior edge 38-2 (collectively referred to as second interior edges 38).
  • the via 30' by virtue of being a blind via, does not contain the second opening 50. Rather, the via 30' only contains the first opening 40.
  • the vias 30 may have various cross-sectional shapes and/or geometric characteristics.
  • the cross-sectional shapes and/or geometric characteristics may be selectively implemented to optimize the transmission of ultrasonic signals generated by the sensor 24.
  • the cross-sectional shapes and/or geometric characteristics of the vias 30 may be based on, for example, a precision of a laser used to form damage tracks in the glass-based substrate 12 (described below in further detail with reference to FIG. 6).
  • the first region 33 and the second region 34 of the via 30 may be asymmetrical about the plane (X). Furthermore, the first opening 40 and the second opening 50 may have a same diameter (D). As another non limiting example and as depicted in FIG. 4E, the first region 33 and the second region 34 of the via 30 may be symmetrical about the plane (X), and the first opening 40 and the second opening 50 may have a same diameter (D). As yet another non-limiting example and as depicted in FIG.
  • the first region 33 and the second region 34 may be asymmetrical about the plane (X), the first opening 40 may have a first diameter (Di), and the second opening 50 may have a second diameter (D2), wherein the second diameter is greater than the first diameter.
  • the first region 33 and the second region 34 may be asymmetrical about the plane (X), the first opening 40 may have a first diameter (Di), and the second opening 50 may have a second diameter (D2), wherein the first diameter is greater than the second diameter.
  • FIGS. 4A-4H illustrate the plurality of vias 30 extending through the glass- based substrate 12, as noted hereinabove, the plurality of vias 30 may also extend through at least a portion of the film layer 14 and the adhesive layer 16.
  • the plurality of vias 30 may be filled with the polymer 32.
  • the polymer 32 may be a polymer that is transparent in the visible spectrum (i.e., wavelengths of 380-740 nanometers, including endpoints).
  • the polymer 32 may include a liquid silicone rubber (LSR), a liquid optically clear adhesive (LOCA), a cyanoacrylate material, a polyurethane material, a polycarbonate material, an acrylic material, and any other suitable transparent polymer in the visible spectrum.
  • LSR liquid silicone rubber
  • LOCA liquid optically clear adhesive
  • At least a set of the plurality of vias 30 are entirely filled with the polymer 32.
  • each of the plurality of vias 30 may be completely filled with the polymer 32.
  • at least a set of the plurality of vias 30 are not entirely filled with the polymer 32 and include a material that enables the transmission of ultrasonic signals, such as a second polymer (not shown), which may be any polymer that is substantially resistant to abrasions induced by, for example, a user’s finger.
  • a first portion of each via of the plurality of vias 30 may be filled with the polymer 32, and a remaining portion of each via of the plurality of vias 30 may be filled with the second polymer 32 (e.g., 90% of each respective via 30 is filled with the polymer 32, while the remaining 10% of the respective via 30 is filled with the second polymer).
  • the through-glass-vias of the plurality of vias 30 may be completely filled with the polymer 32, and the blind vias of the plurality of vias 30 may not be completely filled with the polymer 32 (e.g., 95% of the respective blind via is filled with the polymer 32, while the remaining 5% of the blind via is filled with the second polymer).
  • the blind vias of the plurality of vias 30 may be completely filled with the polymer 32, and the through-glass-vias of the plurality of vias 30 may not be completely filled with the polymer 32 (e.g., 99% of the respective through-glass via is filled with the polymer 32, while the remaining 1% of the through-glass via is filled with the second polymer).
  • At least a portion of the plurality of vias 30 do not include the polymer 32 and include another material that generally enables the transmission of ultrasonic signals.
  • a first portion of the plurality of vias 30 is filled only with the second polymer, and a remaining portion of the plurality of vias 30 is filled with the polymer 32 or both the second polymer and the polymer 32.
  • a reflection coefficient at an interface between the glass-based substrate 12 and the via 30 (e.g., (Ri) is less than a reflection coefficient at an interface between the glass-based substrate 12 and one of the adhesive layer 16 and the film layer 14 (R2) at a defined frequency range (e.g., 1 MHz to 100 MHz (including endpoints), or 5 MHz to 25 MHz (including endpoints)).
  • a defined frequency range e.g., 1 MHz to 100 MHz (including endpoints), or 5 MHz to 25 MHz (including endpoints)
  • ultrasonic waves may be reflected as they travel from the air, which has a low acoustic impedance, to one of the adhesive layer 16, the film layer 14, and/or the glass-based substrate 12, which may have a much higher acoustic impedance as compared to air.
  • the reflection coefficient (R) can be determined when the acoustic impedances of each material (Zi and Z2) are known. The reflection coefficient (R) is determined using the following relation:
  • a first impedance mismatch is the impedance mismatch between the acoustic impedance outside of the plurality of vias 30 (i.e., the acoustic impedance of the portion of the glass-based substrate 12 without the plurality of vias 30 (Z12), which may be 14.5 MRayl in one non-limiting illustrative example) and the acoustic impedance of a region proximate to the lower surface 12A of the glass-based substrate 12 (i.e., the acoustic impedance of the film layer 14 and/or the adhesive layer 16 (Z 14/10) which may be less than 4 MRayl and is 2.9 MRayl in one non-limiting illustrative example).
  • a second impedance mismatch (I2) is the impedance mismatch between the acoustic impedance within the plurality of vias 30 (i.e., the acoustic impedance of the polymer 32 (Z32), which may be less than 5 MRayl and is 3.5 MRayl in one non-limiting illustrative example) and the acoustic impedance of the region proximate to an edge of the via 30, which may be proximate to the lower surface 12A of the glass-based substrate 12 (Zn /i e), a lower surface of the film layer 14, or a lower surface of the adhesive layer 16.
  • the first impedance mismatch (li) is greater than the second impedance mismatch (I2).
  • proximate means near or adjacent.
  • the reflection coefficient which is directly proportional to the amount of acoustic impedance mismatch, within the plurality of vias 30 (Ri) is less than a reflection coefficient outside of the plurality of vias 30 (R2) at the defined frequency range.
  • the plurality of vias 30 can more effectively transmit ultrasonic signals originating from the sensor 24 due to the overall reduced reflections in the glass-based substrate 12.
  • the ultrasonic signal generated by the sensor 24 is transmitted to the user’s finger with reduced and/or minimal ultrasonic signal reflections. Accordingly, the acoustic waveguide 28 improves the efficiency of the user authentication functions executed by the electronic device 20.
  • the minimized acoustic impedance mismatch between the acoustic waveguide 28 and the region proximate to the lower surface 12A of the glass-based substrate 12 enables the glass-based substrate 12 to have a suitable thickness for preventing impact forces and/or dynamic loading from damaging the electronic device 20.
  • the thickness of the glass-based substrate 12 does not need to be reduced; rather, the acoustic waveguide 28 enables the glass-based substrate 12 to have a thickness that is suitable for preventing damage to the electronic device 20 caused by impact forces and/or dynamic loading in addition to improving the transmission of ultrasonic signals.
  • the acoustic waveguide 28 may be implemented by a single via with the polymer 32 disposed therein, as described below in further detail.
  • the single via with the polymer 32 disposed therein reduces the acoustic mismatch, thereby enabling the display protector assembly 10 to effectively transmit ultrasonic signals originating from the sensor 24 of the electronic device 20.
  • the single via with the polymer 32 disposed therein enables the glass-based substrate 12 to have a sufficient thickness to prevent impact forces from damaging the electronic device 20.
  • the acoustic waveguide 28 may include a single via 90.
  • the single via 90 reduces the acoustic impedance mismatch between the sensor 24 and a user’s finger, thereby improving the ultrasonic transmission through the display protector assembly 10.
  • the acoustic waveguide 28 enables the glass-based substrate 12 to have a sufficient thickness for protecting the electronic device 20 from impact forces and/or dynamic loading.
  • the single via 90 extends through the glass-based substrate 12, and the single via 90 includes the polymer 32 disposed therein. Furthermore, the single via 90 may also extend through at least a portion of the film layer 14 and the adhesive layer 16. The single via 90 may be aligned with the sensor 24 of the electronic device 20. In some embodiments, the single via 90 may be a blind via or a through-glass-via. In some embodiments, the single via 90 may have an opening diameter that corresponds to a width of the sensor 24.
  • the acoustic impedance mismatch between the single via 90 and the region proximate to the lower surface 12A of the glass-based material is reduced at a defined frequency range (e.g., 1 MHz to 100 MHz (including endpoints), or 5 MHz to 25 MHz (including endpoints)).
  • a defined frequency range e.g., 1 MHz to 100 MHz (including endpoints), or 5 MHz to 25 MHz (including endpoints)
  • the ultrasonic signal generated by the sensor 24 is transmitted to the user’s finger with reduced and/or minimal ultrasonic signal reflections.
  • the minimized acoustic impedance mismatch between the acoustic waveguide 28 and the region proximate to the lower surface 12A of the glass-based substrate 12 enables the glass-based substrate 12 to have a suitable thickness for preventing impact forces and/or dynamic loading from damaging the electronic device 20.
  • FIG. 6 depicts an illustrative method of forming the glass-based substrate 12 that includes the acoustic waveguide 28.
  • the glass-based substrate 12 is provided.
  • one or more laser damage regions or pilot holes may be formed in the glass-based substrate 12.
  • the laser damage region creates a damaged area within the glass-based substrate 12 that etches at a faster etch rate than non-damaged regions upon application of an etching solution.
  • the one or more damage tracks may be formed via a line -focused laser, such as that described in U.S. Patent Publication No. 2015/0166395, which is hereby incorporated by reference in its entirety.
  • the present disclosure is not limited to such a laser, and the one or more damage tracks may be formed with other lasers without departing from the scope of the present disclosure.
  • the energy density of the laser (e.g., the energy delivered to the glass- based substrate 12) may be chosen such that it is above a damage threshold along at least a portion of the glass-based substrate 12 (e.g., along an entire width of the glass-based substrate 12 if a through-glass-via is desired) and along an entire axis of the laser.
  • forming the one or more damage tracks may include forming a first set of damage tracks on the upper surface 12B of the glass-based substrate 12.
  • Other techniques for forming one or more damage tracks on the glass-based substrate 12 should generally be understood and are intended to be included within the scope of the present disclosure.
  • Forming the damage tracks may include any forming technique, and the present disclosure is not limited to any particular technique.
  • Illustrative forming techniques may include, but are not limited to, mechanical drilling, etching, laser ablation, laser assisted processes, laser damage and etching processes, abrasive blasting, abrasive water jet machining, focused electro-thermal energy, or any other suitable forming technique.
  • the glass-based substrate 12 is placed in an etchant bath (e.g., a first etchant bath) and etched at a particular etch rate (e.g., a first etch rate) to remove the laser damaged region and/or enlarge the pilot hole to create at least a portion of a via.
  • the first etchant bath may be, for example, an acid etchant or a base etchant.
  • acid etchants include, but are not limited to, etchants that contain an amount of nitric acid (HNO3), etchants that contain hydrofluoric acid (HF), and/or the like.
  • base etchants include, but are not limited to, etchants that are alkaline, such as sodium hydroxide (NaOH), potassium hydroxide (KOH), ammonium hydroxide (NH 4 OH), and/or the like.
  • the first etchant bath may be a stagnant (e.g., unagitated) bath of about 9.8% (w/w) aqueous hydrofluoric acid solution.
  • a stagnant bath e.g., unagitated
  • etchant baths now known or later developed may also be used without departing from the scope of the present disclosure.
  • the first etch rate is similarly not limited by this disclosure, and may be any etch rate.
  • the first etch rate may be about 2.8 nanometers per minute (nm/min) to about 3.2 nm/min, including about 2.8 nm/min, about 2.9 nm/min, about 3.0 nm/min, about 3.1 nm/min, about 3.2 nm/min, or any value or range between any two of these values (including endpoints).
  • the first etch rate may be about 3 nm/min.
  • step 615 may create a first tapered region of a via, as described in greater detail herein.
  • the glass-based substrate 12 may be removed from the bath at step 620.
  • the particular amount of time may be, for example, about 5 minutes to about 120 minutes, including about 5 minutes, about 15 minutes, about 30 minutes, about 60 minutes, about 120 minutes, or any value or range between any two of these values (including endpoints).
  • the particular amount of time may be about 75 minutes. In other embodiments, the particular amount of time may be about 14 minutes. Other periods of time are contemplated without departing from the scope of the present disclosure.
  • the particular amount of the glass-based substrate 12 that is removed may be, for example, about 10 microns of material to about 300 microns of material as measured from one of the upper surface 12B and the lower surface 12A, including about 10 microns of material, about 50 microns of material, about 100 microns of material, about 150 microns of material, about 200 microns of material, about 300 microns of material, or any value or range between any two of these values (including endpoints). In particular embodiments, about 50 microns or about 300 microns of material as measured from one of the upper surface 12B and the lower surface 12A may be removed.
  • the glass-based substrate 12 may be rinsed of the etchant material.
  • the glass-based substrate 12 may be rinsed with a solution containing hydrochloric acid (HC1), such as, for example, a 0.5M HC1 solution.
  • HC1 hydrochloric acid
  • the glass-based substrate 12 may be rinsed with deionized water.
  • the glass-based substrate 12 may be rinsed with a first rinse and subsequently rinsed with a second rinse. For example, the glass-based substrate 12 may be rinsed with the 0.5M HC1 solution and then subsequently rinsed with the deionized water solution.
  • the glass-based substrate 12 may be rinsed for a particular period of time to ensure all etchant material has been removed (e.g., about 10 minutes).
  • the glass-based substrate 12 may be rinsed in the 0.5M HC1 solution for 10 minutes and subsequently rinsed with deionized water for 10 minutes.
  • the glass-based substrate 12 is placed in an etchant bath (e.g., a second etchant bath) and etched at a particular etch rate (e.g., a second etch rate).
  • the second etchant bath may be, for example, an acid etchant or a base etchant.
  • the second etchant bath may generally have a concentration that is different from the first etchant bath.
  • the first etchant bath as described above may have a greater concentration of an acid etchant or a base etchant than the second etchant bath.
  • the first etchant bath may have a lower concentration of an acid etchant or a base etchant than the second etchant bath.
  • the etchant bath may have one or more other characteristics not specifically described herein.
  • the etchant bath may be maintained at a particular temperature. One such illustrative temperature is about 85°C.
  • the glass-based substrate 12 may be removed from the bath at step 635.
  • the particular amount of the glass-based substrate 12 that is removed may be, for example, about 65 microns of material as measured from one of the upper surface 12B and the lower surface 12A.
  • the glass-based substrate 12 may be rinsed to remove the etchant material.
  • the glass-based substrate 12 may be rinsed with deionized water.
  • the resulting glass-based substrate 12 may include at least one symmetrical via having one or more geometric characteristics.
  • a removable sealant material (not shown), which may be a protective tape in a non-limiting example embodiment, is applied to one surface (lower surface 12A or upper surface 12B) of the glass-based substrate 12.
  • the removable sealant material is applied to either the lower surface 12A or the upper surface 12B if each of the plurality of vias 30 are through-glass vias.
  • the polymer 32 is deposited into the plurality of vias 30.
  • the polymer 32 may be deposited into the plurality of vias 30 using any suitable technique, such as liquid deposition, printing, immersion, vacuum polymer deposition, chemical vapor deposition (e.g., low-pressure chemical vapor deposition, plasma-enhanced chemical vapor deposition, plasma-assisted chemical vapor deposition, etc.), sputter deposition, evaporated deposition, and/or the like. It should be understood that other techniques may be utilized for depositing the polymer 32.
  • the polymer 32 may be cured using, for example, an ultraviolet (UV) light or a white light.
  • UV ultraviolet
  • the present disclosure is not limited to any technique for curing the polymer 32 and, therefore, the polymer 32 may be cured utilizing any suitable technique. It should be understood that in some embodiments, the polymer 32 may not require curing.
  • excess polymer 32 is removed (i.e., polymer 32 that spills onto one of the lower surface 12A and the upper surface 12B).
  • the glass-based substrate 12 may be placed in an acetone bath having a first temperature (e.g., between 40°C and 55°C, including endpoints) for a first period of time.
  • the first period of time may be between 8 minutes and 15 minutes, including endpoints.
  • the glass-based substrate 12 may be placed in a methanol bath for a second period of time (e.g., between 2 minutes and 5 minutes, including endpoints).
  • the glass-based substrate 12 may be rinsed in deionized water, and the glass- based substrate 12 may be dried by applying nitrogen gas to the glass-based substrate 12. It should be understood that other techniques including, but not limited to, grinding and polishing may be utilized for removing the excess polymer 32. Further, while this step is illustrated as occurring after step 655, in other embodiments, the excess polymer 32 may be removed prior to curing the polymer 32.
  • the removable sealant material is removed from one of the lower surface 12A or upper surface 12B.
  • the protective tape may be removed from one of the surfaces of the glass-based substrate 12.
  • the plurality of vias 30 may extend through the glass-based substrate 12 and at least one of the film layer 14 and the adhesive layer 16, as described above.
  • forming the acoustic waveguide 28 such that the plurality of vias 30 extend through the glass- based substrate 12 and at least one of the film layer 14 and the adhesive layer 16 is similar to the method described in FIG. 6.
  • the energy density of the laser may be chosen such that it is above a damage threshold along at least a portion of the glass-based substrate 12 and at least one of the film layer 14 and the adhesive layer 16.
  • the damage tracks in the glass-based substrate 12 and at least one of the film layer 14 and the adhesive layer 16 may be formed using any suitable forming technique and the present disclosure is not limited to any particular technique.
  • step 630, step 635, and step 640 may be optional steps in various embodiments.
  • step 640, step 635, and step 640 may be optional steps in various embodiments.
  • the one or more steps of the illustrative method described in FIG. 6 may be performed in various orders, and the illustrative method is not limited to the particular order described herein.
  • the overall reflection coefficient of the display protector assembly 10 decreases in the ultrasonic frequency spectrum. As such, the display protector assembly 10 can effectively transmit ultrasonic signals originating from the sensor 24 of the electronic device 20. Meanwhile, the acoustic waveguide 28 enables the glass-based substrate 12 to maintain a sufficient thickness for preventing impact forces from damaging the electronic device 20.
  • the acoustic waveguide 28 may be formed utilizing other methods.
  • the acoustic waveguide 28 may be formed using various suitable mechanical methods when the acoustic waveguide 28 includes the single via 90 described above with reference to FIGS. 5A and 5B.
  • the acoustic waveguide 28 may be formed using various suitable mechanical methods when the acoustic waveguide 28 includes the plurality of vias 30.

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Abstract

L'invention concerne des ensembles de protection d'écran. Dans un mode de réalisation, un protecteur d'écran est décrit et comprend un substrat à base de verre et un guide d'ondes acoustiques disposé à l'intérieur du substrat à base de verre. Le guide d'ondes acoustiques comprend une pluralité de trous d'interconnexion, chaque trou d'interconnexion s'étendant au moins partiellement à travers le substrat à base de verre, et un polymère disposé à l'intérieur de chaque trou d'interconnexion d'un ensemble de la pluralité de trous d'interconnexion.
PCT/US2020/045923 2019-08-30 2020-08-12 Ensembles protecteurs d'affichage ayant des trous d'interconnexion WO2021041037A1 (fr)

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Cited By (1)

* Cited by examiner, † Cited by third party
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CN115504679A (zh) * 2022-09-22 2022-12-23 四川艾宇光科技有限公司 一种2.5d玻璃盖板抛光方法

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Publication number Priority date Publication date Assignee Title
EP2611120A2 (fr) * 2011-12-26 2013-07-03 Samsung Display Co., Ltd. Panneau transparent pour dispositif mobile, son procédé de fabrication et dispositif mobile utilisant celui-ci
US20150166395A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Method for Rapid Laser Drilling of Holes in Glass and Products Made Therefrom
US20150261261A1 (en) * 2014-03-14 2015-09-17 Corning Incorporated Sensor embedded in glass and process for making same
WO2016014660A1 (fr) * 2014-07-25 2016-01-28 Qualcomm Technologies, Inc. Capteur de champ électrique à haute résolution dans un verre de couverture
WO2017062798A1 (fr) * 2015-10-09 2017-04-13 Corning Incorporated Substrat de capteur en verre avec trous traversants et procédé pour le former
WO2018131839A1 (fr) * 2017-01-13 2018-07-19 Samsung Electronics Co., Ltd. Dispositif électronique comprenant un capteur biométrique

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EP2611120A2 (fr) * 2011-12-26 2013-07-03 Samsung Display Co., Ltd. Panneau transparent pour dispositif mobile, son procédé de fabrication et dispositif mobile utilisant celui-ci
US20150166395A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Method for Rapid Laser Drilling of Holes in Glass and Products Made Therefrom
US20150261261A1 (en) * 2014-03-14 2015-09-17 Corning Incorporated Sensor embedded in glass and process for making same
WO2016014660A1 (fr) * 2014-07-25 2016-01-28 Qualcomm Technologies, Inc. Capteur de champ électrique à haute résolution dans un verre de couverture
WO2017062798A1 (fr) * 2015-10-09 2017-04-13 Corning Incorporated Substrat de capteur en verre avec trous traversants et procédé pour le former
WO2018131839A1 (fr) * 2017-01-13 2018-07-19 Samsung Electronics Co., Ltd. Dispositif électronique comprenant un capteur biométrique

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CN115504679A (zh) * 2022-09-22 2022-12-23 四川艾宇光科技有限公司 一种2.5d玻璃盖板抛光方法

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