WO2021036177A1 - 一种触控显示面板及其制备方法和触控显示装置 - Google Patents

一种触控显示面板及其制备方法和触控显示装置 Download PDF

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WO2021036177A1
WO2021036177A1 PCT/CN2020/071653 CN2020071653W WO2021036177A1 WO 2021036177 A1 WO2021036177 A1 WO 2021036177A1 CN 2020071653 W CN2020071653 W CN 2020071653W WO 2021036177 A1 WO2021036177 A1 WO 2021036177A1
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layer
touch
electrode layer
touch electrode
pixel definition
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PCT/CN2020/071653
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English (en)
French (fr)
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谢铭
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武汉华星光电半导体显示技术有限公司
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Priority to US16/638,141 priority Critical patent/US11301069B2/en
Publication of WO2021036177A1 publication Critical patent/WO2021036177A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment

Definitions

  • the present invention relates to the technical field of display panels, in particular to a touch display panel, a preparation method thereof, and a touch display device.
  • touch display devices have been more and more sought after by people. They not only save space and are convenient to carry, but also users can directly operate and use with fingers or stylus. Comfortable and very convenient.
  • various technical fields have been widely used, such as personal digital processing (PDA), touch-sensitive mobile phones, portable notebook computers, etc., which are common in the market.
  • PDA personal digital processing
  • touch-sensitive mobile phones touch-sensitive mobile phones
  • portable notebook computers etc.
  • AMOLED Active Matrix Organic Light-Emitting Display
  • AMOLED is an emerging flat panel display, because it has many advantages such as active light emission, high contrast, fast response speed, light and thin, etc., it is known as a substitute for liquid crystal display.
  • a new generation of displays At present, the combination of touch technology and AMOLED display technology has attracted a lot of attention. It is foreseeable that touch-sensitive AMOLED displays will become the mainstream of the market.
  • the flexible touch AMOLED display has the advantages of being rolled, folded and worn.
  • the touch circuit in the touch display panel is arranged on the film packaging layer, which results in a thicker thickness of the entire display panel, poor bending resistance, and low product yield.
  • An object of the present invention is to provide a touch display panel, which can solve the problem of thicker display panels in the prior art.
  • the present invention provides a touch display panel, which includes a substrate layer, a light-emitting layer, a thin film encapsulation layer, a polarizer, and a cover plate arranged in sequence; the light-emitting layer includes a flat layer and a first pixel definition layer arranged in sequence. Layer, the first touch electrode layer.
  • the light-emitting layer further includes a second pixel definition layer and a second touch electrode layer arranged in sequence; the second pixel definition layer is arranged on the first touch electrode layer, The second touch electrode layer is disposed on the second pixel defining layer; wherein the first touch electrode layer and the second touch electrode layer are not connected to each other, forming an in-cell touch circuit.
  • the light-emitting layer further includes a third pixel definition layer, and the third pixel definition layer is disposed between the second touch electrode layer and the thin film encapsulation layer.
  • the material used in the first pixel definition layer includes polyimide.
  • the first touch electrode layer is in the shape of a diamond grid.
  • the material used for the first touch electrode layer includes one of titanium, aluminum, or silver nanowire.
  • the thickness of the first pixel definition layer ranges from 0.4 to 0.6 um.
  • the thickness of the first touch electrode layer ranges from 0.6 to 0.8 um.
  • the present invention also provides a method for preparing the display panel involved in the present invention, which includes the following steps:
  • Step S1 providing a substrate layer, and preparing a flat layer on the substrate layer;
  • Step S2 deposit a first pixel definition layer on the flat layer
  • Step S3 deposit a first touch electrode layer on the first pixel definition layer
  • Step S4 deposit a second pixel definition layer on the first touch electrode layer
  • Step S5 Deposit a second touch electrode layer on the second pixel definition layer, wherein the first touch electrode layer and the second touch electrode layer are not connected to each other, forming an in-cell touch circuit ;
  • Step S6 depositing a third pixel definition layer on the second touch electrode layer to form a light-emitting layer
  • Step S7 Prepare the film encapsulation layer, the polarizer and the cover plate in sequence.
  • the present invention also provides a touch display device, which includes a body on which the touch display panel related to the present invention is arranged.
  • the present invention provides a touch display panel, a manufacturing method thereof, and a touch display device.
  • the touch circuit is set in the definition layer to reduce the thickness of the display panel; and the process is simple, which reduces the operating procedures and saves the process cost. It also enhances the bending resistance of the product, and obtains the performance of a lightweight and high-strength flexible device, which can be used in industrial production and The design of the folding screen can be optimized.
  • FIG. 1 is a schematic structural diagram of a touch display panel provided by Embodiment 1 of the present invention.
  • Embodiment 2 is a flowchart of a method for manufacturing the touch display panel provided by Embodiment 1 of the present invention
  • step S1 of the manufacturing method provided by the embodiment 1 of the present invention is a schematic diagram of the structure of the touch display panel in step S1 of the manufacturing method provided by the embodiment 1 of the present invention
  • step S2 is a schematic diagram of the structure of the touch display panel in step S2 of the manufacturing method provided by the embodiment 1 of the present invention
  • FIG. 5 is a schematic diagram of the structure of the touch display panel in step S3 of the manufacturing method provided in the embodiment 1 of the present invention.
  • FIG. 6 is a schematic diagram of the structure of the touch display panel in step S4 in the manufacturing method provided by the embodiment 1 of the present invention.
  • FIG. 7 is a schematic diagram of the structure of the touch display panel in step S5 in the manufacturing method provided in the embodiment 1 of the present invention.
  • FIG. 8 is a schematic diagram of the structure of the touch display panel in step S6 in the manufacturing method provided by the embodiment 1 of the present invention.
  • FIG. 9 is a schematic diagram of the structure of the touch display panel in step S7 of the manufacturing method provided in the embodiment 1 of the present invention.
  • FIG. 1 shows a schematic diagram of the structure of the touch display panel provided by this embodiment.
  • the touch display panel includes a substrate layer 1 arranged in sequence and arranged on the substrate layer.
  • the light-emitting layer 2 includes a flat layer 21 arranged in sequence, a first pixel defining layer 22 arranged on the flat layer 21, a first touch electrode layer 23 arranged on the first pixel defining layer 22, and a first touch electrode layer 23 arranged on the first pixel defining layer 22.
  • the first touch electrode layer 23 and the second touch electrode layer 25 are in the shape of a diamond grid.
  • the first touch electrode layer 23 and the second touch electrode layer 25 are not connected to each other, forming an in-cell touch circuit.
  • the first touch electrode layer 23 is energized
  • the second touch electrode layer 25 is not energized, and electrodes are formed between the first touch electrode layer 23 and the second touch electrode layer 25 and remain constant.
  • the two capacitors form a difference, and the signal is transmitted to the chip to form an image location.
  • the thicknesses of the first pixel defining layer 22, the second pixel defining layer 24, and the third pixel defining layer 26 are all 0.4-0.6um, and the first touch electrode layer 23 and the second touch electrode The thickness of layer 25 ranges from 0.6 to 0.8um.
  • the material used for the first pixel definition layer 22, the second pixel definition layer 24, and the third pixel definition layer 26 is polyimide.
  • the materials used for the first touch electrode layer 23 and the second touch electrode layer 25 include one of titanium, aluminum, or silver nanowire.
  • FIG. 2 shows a flowchart of the method for manufacturing the touch display panel provided by this embodiment, including the following step:
  • Step S1 Provide a substrate layer 1, and prepare a flat layer 21 on the substrate layer 1;
  • FIG. 3 is a schematic structural diagram of the touch display panel in step S1 of the manufacturing method provided by this embodiment.
  • Step S2 deposit a first pixel definition layer 22 on the flat layer 21;
  • FIG. 4 is a schematic structural diagram of the touch display panel in step S2 of the manufacturing method provided by this embodiment.
  • the material of the first pixel definition layer 22 is polyimide, and the thickness of the first pixel definition layer 22 ranges from 0.4 to 0.6 um.
  • Step S3 deposit a first touch electrode layer 23 on the first pixel definition layer 22;
  • FIG. 5 is a schematic diagram of the structure of the touch display panel in step S3 of the manufacturing method provided by this embodiment.
  • the material used for the first touch electrode layer 23 includes one of titanium, aluminum, or silver nanowire, and the thickness of the first touch electrode layer 23 ranges from 0.6 to 0.8 um.
  • Step S4 deposit a second pixel definition layer 24 on the first touch electrode layer 23;
  • FIG. 6 is a schematic structural diagram of the touch display panel in step S4 of the manufacturing method provided by this embodiment.
  • the material used for the second pixel definition layer 24 is polyimide, and the thickness of the second pixel definition layer 24 ranges from 0.4 to 0.6 um.
  • Step S5 deposit a second touch electrode layer 25 on the second pixel definition layer 24, wherein the first touch electrode layer 23 and the second touch electrode layer 25 are not connected to each other, forming an in-cell touch circuit;
  • FIG. 7 is a schematic structural diagram of the touch display panel in step S5 of the manufacturing method provided by this embodiment.
  • the material used for the second touch electrode layer 25 includes one of titanium, aluminum, or silver nanowire, and the thickness of the second touch electrode layer 25 is in the range of 0.6-0.8 um.
  • the second touch electrode layer 25 When the first touch electrode layer 23 is energized, the second touch electrode layer 25 is not energized, and electrodes are formed between the first touch electrode layer 23 and the second touch electrode layer 25 and remain constant. After the display device is controlled, the two capacitors form a difference, and the signal is transmitted to the chip to form an image location.
  • Step S6 depositing a third pixel definition layer 26 on the second touch electrode layer 25 to form the light-emitting layer 2;
  • FIG. 8 is a schematic structural diagram of the touch display panel in step S6 of the manufacturing method provided by this embodiment.
  • the material used for the third pixel defining layer 26 is polyimide, and the thickness of the third pixel defining layer 26 ranges from 0.4 to 0.6 um.
  • Step S7 Prepare the thin film encapsulation layer 3, the polarizer 4 and the cover plate 5 in sequence.
  • FIG. 9 is a schematic structural diagram of the touch display panel in step S7 of the manufacturing method provided by this embodiment.
  • This embodiment also provides a touch display device, which includes a body on which the touch display panel involved in this embodiment is disposed.
  • the present invention provides a touch display panel and a preparation method thereof, and a touch display device.
  • the circuit reduces the thickness of the display panel; and the process is simple, which reduces the operating procedures and saves the process cost. It also enhances the bending resistance of the product, and obtains the performance of light-weight and high-strength flexible devices, which can be used in industrial production and can optimize the design of folding screens. .

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Abstract

本发明提供一种触控显示面板及其制备方法和触控显示装置，触控显示面板包括依次设置的基板层、发光层、薄膜封装层、偏光片和盖板；所述发光层包括依次设置的平坦层、第一像素定义层、第一触控电极层。

Description

一种触控显示面板及其制备方法和触控显示装置
本申请要求于2019年08月29日提交中国专利局、申请号为201910810193.X、发明名称为“一种触控显示面板及其制备方法和触控显示装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及显示面板技术领域，特别涉及一种触控显示面板及其制备方法和触控显示装置。
 背景技术
随着触控技术和显示技术的发展，触控显示装置已越来越多的受到人们的追捧，其不但可节省空间，方便携带，而且用户通过手指或者触控笔等就能直接操作，使用舒适，非常便捷。目前，已广泛应用各个技术领域，例如市场常见的个人数字处理（PDA）、触控类手机、手提式笔记型电脑等等。
有缘矩阵有机发光显示器（Active Matrix Organic Light-Emitting Display，AMOLED）是一种新兴的平板显示器，因为它有主动发光、对比度高、响应速度快、轻薄等诸多优点，被誉为可以取代液晶显示器的新一代显示器。目前，触控技术和AMOLED显示技术的结合已经引起人们高度关注。可以预见的是，触控式AMOLED显示器将成为市场主流。柔性触控式AMOLED显示器更是具有被卷曲、折叠设置穿戴等优点。
现有技术中，触控显示面板中触控电路设置于薄膜封装层上，致使整个显示面板的厚度较厚，并且抗弯折性能差，产品良率不高。
因此，确有必要来开发一种新型的触控显示面板，以克服现有技术的缺陷。
 技术问题
本发明的一个目的是提供一种触控显示面板，其能够解决现有技术中显示面板厚度较厚的问题。
 技术解决方案
为实现上述目的，本发明提供一种触控显示面板，包括依次设置的基板层、发光层、薄膜封装层、偏光片和盖板；所述发光层包括依次设置的平坦层、第一像素定义层、第一触控电极层。
进一步的，在其他实施方式中，其中所述发光层还包括依次设置第二像素定义层和第二触控电极层；所述第二像素定义层设置于所述第一触控电极层上，所述第二触控电极层设置于所述第二像素定义层上；其中所述第一触控电极层与所述第二触控电极层互不相接，形成内嵌式触控电路。
进一步的，在其他实施方式中，其中所述发光层还包括第三像素定义层，所述第三像素定义层设置于所述第二触控电极层和所述薄膜封装层之间。
进一步的，在其他实施方式中，其中所述第一像素定义层采用的材料包括聚酰亚胺。
进一步的，在其他实施方式中，其中所述第一触控电极层呈菱形网格状。
进一步的，在其他实施方式中，其中所述第一触控电极层采用的材料包括钛、铝或银钠米线中的一种。
进一步的，在其他实施方式中，其中所述第一像素定义层的厚度范围为0.4-0.6um。
进一步的，在其他实施方式中，其中所述第一触控电极层的厚度范围为0.6-0.8um。
为实现上述目的，本发明还提供一种制备本发明涉及的所述显示面板的方法，包括以下步骤：
步骤S1：提供一基板层，在所述基板层上制备平坦层；
步骤S2：在所述平坦层上沉积第一像素定义层；
步骤S3：在所述第一像素定义层上沉积第一触控电极层；
步骤S4：在所述第一触控电极层上沉积第二像素定义层；
步骤S5：在所述第二像素定义层上沉积第二触控电极层，其中所述第一触控电极层与所述第二触控电极层互不相接，形成内嵌式触控电路；
步骤S6：在所述第二触控电极层上沉积第三像素定义层，形成发光层；
步骤S7；依次制备薄膜封装层、偏光片和盖板。
为实现上述目的，本发明还提供一种触控显示装置，其包括本体，所述本体上设置有本发明涉及的所述触控显示面板。
 有益效果
相对于现有技术，本发明的有益效果在于：本发明提供一种触控显示面板及其制备方法和触控显示装置，不需要将触控电路单独设置于薄膜封装层上，只需在像素定义层中设置触控电路，降低显示面板的厚度；并且工艺简单，减少了操作工序节约了工艺成本，也使产品抗弯折性能增强，得到轻质高强的柔性器件性能，可用于工业生产并且可优化折叠屏的设计。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例1提供的触控显示面板的结构示意图；
图2为本发明实施例1提供的触控显示面板的制备方法的流程图；
图3为本发明实施例1提供的制备方法中步骤S1时触控显示面板的结构示意图；
图4为本发明实施例1提供的制备方法中步骤S2时触控显示面板的结构示意图；
图5为本发明实施例1提供的制备方法中步骤S3时触控显示面板的结构示意图；
图6为本发明实施例1提供的制备方法中步骤S4时触控显示面板的结构示意图；
图7为本发明实施例1提供的制备方法中步骤S5时触控显示面板的结构示意图；
图8为本发明实施例1提供的制备方法中步骤S6时触控显示面板的结构示意图；
图9为本发明实施例1提供的制备方法中步骤S7时触控显示面板的结构示意图。
 本发明的实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
这里所公开的具体结构和功能细节仅仅是代表性的，并且是用于描述本发明的示例性实施例的目的。但是本发明可以通过许多替换形式来具体实现，并且不应当被解释成仅仅受限于这里所阐述的实施例。
实施例1
本实施例提供一种触控显示面板，请参阅图1，图1所示为本实施例提供的触控显示面板的结构示意图，触控显示面板包括依次设置的基板层1、设置于基板层1上的发光层2、设置于发光层2上的薄膜封装层3、设置于薄膜封装层3上的偏光片4和设置于偏光层4上的盖板5。
其中发光层2包括依次设置的平坦层21、设置于平坦层21上的第一像素定义层22、设置于第一像素定义层22上的第一触控电极层23、设置于第一触控电极层23上的第二像素定义层24、设置于第二像素定义层24上的第二触控电极层25和设置于第二触控电极层25上的第三像素定义层26。
其中第一触控电极层23和第二触控电极层25呈菱形网格状。
其中第一触控电极层23与第二触控电极层25互不相接，形成内嵌式触控电路。当给第一触控电极层23通电时，第二触控电极层25不通电，第一触控电极层23与第二触控电极层25之间就会形成电极且保持恒定，当手指触控显示器件后两电容形成差值，信号传导到芯片形成图像定位。
在本实施例中，第一像素定义层22、第二像素定义层24和第三像素定义层26的厚度范围均为0.4-0.6um，第一触控电极层23和的第二触控电极层25厚度范围均为0.6-0.8um。
其中第一像素定义层22、第二像素定义层24和第三像素定义层26采用的材料为聚酰亚胺。
其中第一触控电极层23和的第二触控电极层25采用的材料包括钛、铝或银钠米线中的一种。
本实施例中，不需要将触控电路单独设置于薄膜封装层上，只需在像素定义层中设置触控电路，能够降低显示面板的厚度。
本实施例还提供一种本实施例涉及的所述触控显示面板的制备方法，请参阅图2，图2所示为本实施例提供的触控显示面板的制备方法的流程图，包括以下步骤：
步骤S1：提供一基板层1，在基板层1上制备平坦层21；
请参阅图3，图3所示为本实施例提供的制备方法中步骤S1时触控显示面板的结构示意图。
步骤S2：在平坦层21上沉积第一像素定义层22；
请参阅图4，图4所示为本实施例提供的制备方法中步骤S2时触控显示面板的结构示意图。
其中第一像素定义层22采用的材料为聚酰亚胺，第一像素定义层22的厚度范围均为0.4-0.6um。
步骤S3：在第一像素定义层22上沉积第一触控电极层23；
请参阅图5，图5所示为本实施例提供的制备方法中步骤S3时触控显示面板的结构示意图。
其中第一触控电极层23采用的材料包括钛、铝或银钠米线中的一种，第一触控电极层23的厚度范围均为0.6-0.8um。
步骤S4：在第一触控电极层23上沉积第二像素定义层24；
请参阅图6，图6所示为本实施例提供的制备方法中步骤S4时触控显示面板的结构示意图。
其中第二像素定义层24采用的材料为聚酰亚胺，第二像素定义层24的厚度范围均为0.4-0.6um。
步骤S5：在第二像素定义层24上沉积第二触控电极层25，其中第一触控电极层23与第二触控电极层25互不相接，形成内嵌式触控电路；
请参阅图7，图7所示为本实施例提供的制备方法中步骤S5时触控显示面板的结构示意图。
其中第二触控电极层25采用的材料包括钛、铝或银钠米线中的一种，第二触控电极层25的厚度范围均为0.6-0.8um。
当给第一触控电极层23通电时，第二触控电极层25不通电，第一触控电极层23与第二触控电极层25之间就会形成电极且保持恒定，当手指触控显示器件后两电容形成差值，信号传导到芯片形成图像定位。
步骤S6：在第二触控电极层25上沉积第三像素定义层26，形成发光层2；
请参阅图8，图8所示为本实施例提供的制备方法中步骤S6时触控显示面板的结构示意图。
其中第三像素定义层26采用的材料为聚酰亚胺，第三像素定义层26的厚度范围均为0.4-0.6um。
步骤S7；依次制备薄膜封装层3、偏光片4和盖板5。
请参阅图9，图9所示为本实施例提供的制备方法中步骤S7时触控显示面板的结构示意图。
在本实施例中，不需要将触控电路单独设置于薄膜封装层上，只需在像素定义层中设置触控电路，降低显示面板的厚度；并且工艺简单，减少了操作工序节约了工艺成本，也使产品抗弯折性能增强，得到轻质高强的柔性器件性能，可用于工业生产并且可优化折叠屏的设计。
本实施例还提供一种触控显示装置，其包括本体，所述本体上设置有本实施例涉及的所述触控显示面板。
本发明的有益效果在于：本发明提供一种触控显示面板及其制备方法和触控显示装置，不需要将触控电路单独设置于薄膜封装层上，只需在像素定义层中设置触控电路，降低显示面板的厚度；并且工艺简单，减少了操作工序节约了工艺成本，也使产品抗弯折性能增强，得到轻质高强的柔性器件性能，可用于工业生产并且可优化折叠屏的设计。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (20)

  1. 一种触控显示面板，其中，包括依次设置的基板层、发光层、薄膜封装层、偏光片和盖板；所述发光层包括依次设置的平坦层、第一像素定义层、第一触控电极层。
  2. 根据权利要求1所述的触控显示面板，其中，所述发光层还包括依次设置第二像素定义层和第二触控电极层；所述第二像素定义层设置于所述第一触控电极层上，所述第二触控电极层设置于所述第二像素定义层上；其中所述第一触控电极层与所述第二触控电极层互不相接，形成内嵌式触控电路。
  3. 根据权利要求1所述的触控显示面板，其中，所述发光层还包括第三像素定义层，所述第三像素定义层设置于所述第二触控电极层和所述薄膜封装层之间。
  4. 根据权利要求1所述的触控显示面板，其中，所述第一触控电极层呈菱形网格状。
  5. 根据权利要求1所述的触控显示面板，其中，所述第一像素定义层采用的材料包括聚酰亚胺。
  6. 根据权利要求1所述的触控显示面板，其中，所述第一触控电极层采用的材料包括钛铝合金或银钠米线中的一种。
  7. 根据权利要求1所述的触控显示面板，其中，所述第一像素定义层的厚度范围为0.4-0.6um。
  8. 根据权利要求1所述的触控显示面板，其中，所述第一触控电极层的厚度范围为0.2-0.4um。
  9. 一种制备根据权利要求1所述的触控显示面板的方法，其中，包括以下步骤：
    步骤S1：提供一基板层，在所述基板层上制备平坦层；
    步骤S2：在所述平坦层上沉积第一像素定义层；
    步骤S3：在所述第一像素定义层上沉积第一触控电极层；
    步骤S4：在所述第一触控电极层上沉积第二像素定义层；
    步骤S5：在所述第二像素定义层上沉积第二触控电极层，其中所述第一触控电极层与所述第二触控电极层互不相接，形成内嵌式触控电路；
    步骤S6：在所述第二触控电极层上沉积第三像素定义层，形成发光层；
    步骤S7；依次制备薄膜封装层、偏光片和盖板。
  10. 根据权利要求9所述的制备方法，其中，所述发光层还包括依次设置第二像素定义层和第二触控电极层；所述第二像素定义层设置于所述第一触控电极层上，所述第二触控电极层设置于所述第二像素定义层上；其中所述第一触控电极层与所述第二触控电极层互不相接，形成内嵌式触控电路。
  11. 根据权利要求9所述的制备方法，其中，所述发光层还包括第三像素定义层，所述第三像素定义层设置于所述第二触控电极层和所述薄膜封装层之间。
  12. 根据权利要求9所述的制备方法，其中，所述第一触控电极层呈菱形网格状。
  13. 根据权利要求9所述的制备方法，其中，所述第一像素定义层采用的材料包括聚酰亚胺。
  14. 根据权利要求9所述的制备方法，其中，所述第一触控电极层采用的材料包括钛铝合金或银钠米线中的一种。
  15. 根据权利要求9所述的制备方法，其中，所述第一像素定义层的厚度范围为0.4-0.6um。
  16. 根据权利要求9所述的制备方法，其中，所述第一触控电极层的厚度范围为0.2-0.4um。
  17. 一种触控显示装置，其中，其包括本体，所述本体上设置有根据权利要求1所述的触控显示面板。
  18. 根据权利要求17所述的触控显示装置，其中，所述发光层还包括依次设置第二像素定义层和第二触控电极层；所述第二像素定义层设置于所述第一触控电极层上，所述第二触控电极层设置于所述第二像素定义层上；其中所述第一触控电极层与所述第二触控电极层互不相接，形成内嵌式触控电路。
  19. 根据权利要求17所述的触控显示装置，其中，所述发光层还包括第三像素定义层，所述第三像素定义层设置于所述第二触控电极层和所述薄膜封装层之间。
  20. 根据权利要求17所述的触控显示装置，其中，所述第一触控电极层呈菱形网格状。
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