WO2016141705A1 - 阵列基板及其制造方法和显示装置 - Google Patents

阵列基板及其制造方法和显示装置 Download PDF

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WO2016141705A1
WO2016141705A1 PCT/CN2015/089834 CN2015089834W WO2016141705A1 WO 2016141705 A1 WO2016141705 A1 WO 2016141705A1 CN 2015089834 W CN2015089834 W CN 2015089834W WO 2016141705 A1 WO2016141705 A1 WO 2016141705A1
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gate
array substrate
extending direction
data line
thin film
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French (fr)
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程鸿飞
先建波
李文波
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京东方科技集团股份有限公司
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Priority to US14/912,224 priority Critical patent/US10234737B2/en
Publication of WO2016141705A1 publication Critical patent/WO2016141705A1/zh

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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136286Wiring, e.g. gate line, drain line
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1343Electrodes
    • G02F1/134309Electrodes characterised by their geometrical arrangement
    • GPHYSICS
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    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
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    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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    • G02F1/1343Electrodes
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    • G02F1/134363Electrodes characterised by their geometrical arrangement for applying an electric field parallel to the substrate, i.e. in-plane switching [IPS]
    • GPHYSICS
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    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/1368Active matrix addressed cells in which the switching element is a three-electrode device
    • HELECTRICITY
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    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/417Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
    • H01L29/41725Source or drain electrodes for field effect devices
    • H01L29/41733Source or drain electrodes for field effect devices for thin film transistors with insulated gate
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1337Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
    • G02F1/13378Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers by treatment of the surface, e.g. embossing, rubbing or light irradiation
    • G02F1/133784Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers by treatment of the surface, e.g. embossing, rubbing or light irradiation by rubbing
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1343Electrodes
    • G02F1/134309Electrodes characterised by their geometrical arrangement
    • G02F1/134318Electrodes characterised by their geometrical arrangement having a patterned common electrode
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136286Wiring, e.g. gate line, drain line
    • G02F1/136295Materials; Compositions; Manufacture processes
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/40Arrangements for improving the aperture ratio
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312Gate electrodes for field effect devices
    • H01L29/42316Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42384Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor

Definitions

  • the source of the thin film transistor is the connection portion or a part of the connection portion.
  • the invention also provides a method for manufacturing an array substrate, comprising the following steps:
  • the angle between the extending direction of the gate line of the array substrate and the extending direction of the data line segment 30 is ⁇ , 60° ⁇ ⁇ ⁇ 87°
  • the extending direction of the side of the protruding structure close to the pixel electrode The angle with the extending direction of the gate line is ⁇ , 20° ⁇ ⁇ ⁇ 70°, so that the array substrate can obtain an optimized viewing angle direction, a high aperture ratio, and a good display quality.
  • the embodiment provides an array substrate including a plurality of gate lines (eg, Gi-1, Gi, Gi+1) and a plurality of data lines (eg, Dj-) disposed at intersections.
  • Dj, Dj+1 and pixel cells defined by adjacent gate lines and adjacent data lines, each data line comprising a plurality of data line segments 30, each data line segment 30 corresponding to one pixel unit, and the same
  • the two adjacent data line segments 30 of the data line are connected by a connecting portion 30a; the angle between the extending direction of the gate line and the extending direction of the data line segment 30 is ⁇ ; wherein 60° ⁇ ⁇ ⁇ 87°;
  • the gate of the thin film transistor is a bump structure 10 of a gate line, and an angle between an extending direction of a side of the bump structure adjacent to the pixel electrode and an extending direction of the gate line is ⁇ , wherein 20° ⁇ ⁇ ⁇ 70 °.
  • Step 4 on the substrate 1 that completes the above steps, depositing an active layer film of a thin film transistor by a chemical vapor deposition, plasma assisted chemical vapor deposition or sputtering, and forming an active layer of the thin film transistor by a patterning process Graphics.
  • the material of the active layer 20 may be amorphous silicon, polycrystalline silicon, microcrystalline silicon or an oxide semiconductor.
  • Step 7 On the substrate 1 which has completed the above steps, a transparent conductive metal oxide film is deposited by sputtering. Then, a pattern of the common electrode 60 is formed by a patterning process such that the common electrode 60 is disposed above the pixel electrode 50 and insulated from the pixel electrode 50, and the common electrode 60 has a slit, the slit The extending direction is parallel to the extending direction of the data line.

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  • Physics & Mathematics (AREA)
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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
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Abstract

一种阵列基板及其制造方法和显示装置,所述阵列基板包括交叉设置的多条栅线(Gi-1,Gi,Gi+1)和多条数据线(Di-1,Di,Di+1),以及由相邻栅线(Gi-1,Gi,Gi+1)和相邻数据线(Di-1,Di,Di+1)限定的像素单元,所述像素单元包括薄膜晶体管和像素电极(50),每条数据线(Di-1,Di,Di+1)包括多个数据线线段(30),每一数据线线段(30)对应一个像素单元,且同一数据线(Di-1,Di,Di+1)的两相邻的数据线线段(30)通过连接部(30a)连接;所述栅线(Gi-1,Gi,Gi+1)的延伸方向与所述数据线线段(30)的延伸方向的夹角为α,其中,60°≤α≤87°;所述薄膜晶体管的栅极为栅线(Gi-1,Gi,Gi+1)的凸起结构(10),所述凸起结构(10)的靠近像素电极(50)的一侧边(10a)的延伸方向与所述栅线(Gi-1,Gi,Gi+1)的延伸方向的夹角为β,其中,20°≤β≤70°。该阵列基板可以得到一个优化的视角方向、较高的开口率和较好的显示质量。

Description

阵列基板及其制造方法和显示装置 技术领域
本发明属于显示技术领域,具体涉及一种阵列基板及其制造方法和显示装置。
背景技术
液晶显示技术广泛应用于电视、手机以及公共信息显示。液晶显示模式可以分成扭曲向列相(TN,twisted nematic)模式,垂直取向(VA,vertical aligned)模式和水平电场(horizontal electrical field)模式。其中,水平电场模式包括面内开关(IPS,in-plane switching)模式和边缘场开关模式(FFS,Fringe field switching),除VA模式以外,TN和水平电场模式的液晶显示面板都需要摩擦工艺,以使液晶分子具有一个初始的排列方向。液晶显示面板的优化视角方向与摩擦方向有密切关系。
对于FFS模式,液晶显示面板包括阵列基板和彩膜基板,阵列基板包括多条栅线、多条数据线和多个像素单元,栅线与数据线垂直交叉,相邻的栅线与数据线限定出像素单元,像素单元包括:薄膜晶体管、像素电极、公共电极;其中,公共电极位于像素电极上方,且公共电极上形成有狭缝,像素电极和公共电极之间设置有绝缘层,数据线上的数据电压通过薄膜晶体管写入像素电极,整块公共电极覆盖所有的像素单元。FFS模式的液晶显示面板需要摩擦工艺,使液晶分子具有一个初始的排列方向,现有技术中FFS的摩擦取向的方向与数据线的延伸方向具有大约7°的夹角,而由于数据线和栅线是垂直交叉设置的,因此在沿数据线的延伸方向观看显示面板,并不能得到一个优化的视角方向。
发明内容
本发明所要解决的技术问题包括,针对现有的阵列基板存在的上述问题,提供一种视角优化、开口率较高以及较好显示质量 的阵列基板及其制造方法和显示装置。
本发明提供一种阵列基板,其包括交叉设置的多条栅线和多条数据线,以及由相邻栅线和相邻数据线限定的像素单元,所述像素单元包括薄膜晶体管和像素电极,每条数据线包括多个数据线线段,每一数据线线段对应一个像素单元,且同一数据线的两相邻的数据线线段通过连接部连接;所述栅线的延伸方向与所述数据线线段的延伸方向的夹角为α,其中,60°≤α≤87°;所述薄膜晶体管的栅极为栅线的凸起结构,所述凸起结构的靠近所述像素电极的一侧边的延伸方向与所述栅线的延伸方向的夹角为β,其中,20°≤β≤70°。
优选的是,70°≤α≤85°,30°≤β≤50°。
优选的是,所述像素电极为板状电极,其包括第一边、第二边、第三边、第四边和第五边;其中,所述第一边和所述第二边平行于所述栅线的延伸方向;所述第三边和所述第四边平行于所述数据线线段的延伸方向;所述第五边平行于所述凸起结构的靠近像素电极的一侧边的延伸方向。
优选的是,所述阵列基板还包括公共电极,所述公共电极设置于所述像素电极上方,且与所述像素电极绝缘;所述公共电极具有狭缝,所述狭缝的延伸方向平行于所述数据线线段的延伸方向。
优选的是,所述薄膜晶体管的源极为所述连接部,或者为所述连接部的一部分。
优选的是,同一条数据线的对应不同像素单元的数据线线段的延伸方向相互平行。
优选的是,所述连接部的形状为曲线线段。
优选的是,所述栅线的突起结构的另一侧边位于以该凸起结构作为栅极的薄膜晶体管所在的像素单元的外侧。
优选的是,所述栅线的凸起结构的顶边与以该凸起结构作为栅极的薄膜晶体管所在的像素单元对应的数据线线段交叠。
优选的是,所述薄膜晶体管的漏极与所述像素电极通过钝化 层过孔连接或直接搭接。
本发明还提供一种显示装置,所述显示装置包括阵列基板和与该阵列基板对盒设置的对盒基板,所述阵列基板为上述的阵列基板。
本发明还提供一种阵列基板的制造方法,包括以下步骤:
S1:在衬底上形成薄膜晶体管的栅极、栅线和公共电极线,使得所述栅极为所述栅线的凸起结构;
S2:在完成步骤S1的衬底上形成栅极绝缘层;
S3:在完成步骤S2的衬底上形成所述薄膜晶体管的有源层;
S4:在完成步骤S3的衬底上形成所述薄膜晶体管的源极、漏极和数据线,使得所述栅线的延伸方向与所述数据线的延伸方向的夹角为α,其中,60°≤α≤87°;
S5:在完成步骤S4的衬底上形成钝化层,并形成贯穿所述薄膜晶体管的漏极上方的钝化层的过孔;以及
S6:在完成步骤S5的衬底上形成像素电极,使得所述像素电极通过所述过孔与所述漏极连接,并且所述凸起结构的靠近所述像素电极的一侧边的延伸方向与所述栅线的延伸方向的夹角为β,其中,20°≤β≤70°。
优选的是,在所述制造方法,70°≤α≤85°,30°≤β≤50°。
本发明还提供另一种阵列基板的制造方法,包括以下步骤:
A1:在衬底上形成薄膜晶体管的栅极、栅线和公共电极线,使得所述栅极为所述栅线的凸起结构;
A2:在完成步骤A1的衬底上形成栅极绝缘层;
A3:在完成步骤A2的衬底上形成像素电极,使得所述凸起结构的靠近所述像素电极的一侧边的延伸方向与所述栅线的延伸方向的夹角为β,其中,20°≤β≤70°;
A4:在完成步骤A3的衬底上形成所述薄膜晶体管的有源层;
A5:在完成步骤A4的衬底上形成所述薄膜晶体管的源极、漏极和数据线,使得所述漏极与所述像素电极直接搭接,所述栅 线的延伸方向与所述数据线的延伸方向的夹角为α,其中,60°≤α≤87°;
A6:在完成步骤A5的衬底上形成钝化层;以及
A7:在完成步骤A6的衬底上形成公共电极,使得所述公共电极设置于所述像素电极上方,且与所述像素电极绝缘,所述公共电极具有狭缝,所述狭缝的延伸方向平行于所述数据线的延伸方向。
优选的是,在所述制造方法,70°≤α≤85°,30°≤β≤50°。
本发明具有如下有益效果:
在本发明提供的阵列基板中,每条数据线包括多个数据线线段,每一数据线线段对应一个像素单元,且同一数据线的两相邻的数据线线段通过连接部连接;所述栅线的延伸方向与所述数据线线段的延伸方向的夹角为α,其中,60°≤α≤87°;所述薄膜晶体管的栅极为栅线的凸起结构,所述凸起结构的靠近所述像素电极的一侧边的延伸方向与所述栅线的延伸方向的夹角为β,其中,20°≤β≤70°。在本发明中,栅线被设置为与数据线不垂直,以便与显示面板的摩擦取向的方向相适应,从而在沿着数据线方向的延伸方向观看显示面板时,该阵列基板可以得到一个优化的视角方向、较高的开口率和较好的显示质量。
附图说明
图1为本发明实施例1的阵列基板的示意图;
图2为图1中一个像素单元的示意图;
图3为本发明实施例1的夹角α和β的示意图;
图4为图2中的像素单元的A1-A2方向的截面图;
图5为本发明实施例2的阵列基板的示意图;
图6为图5中一个像素单元的示意图;以及
图7为图6中的像素单元的A1-A2方向的截面图。
其中附图标记为:
1:衬底;
Gi:第i行栅线;Gi+1:第i+1行栅线;Gi-1:第i-1行栅线;
Dj-1:第j-1列数据线;Dj:第j列数据线;Dj+1:第j+1列数据线;
CLi-1:第i-1行公共电极线;CLi:第i行公共电极线;CLi+1:第i+1行公共电极线;
15:栅极绝缘层;
25:钝化层;
10:栅线的凸起结构;10a:栅线的凸起结构的一侧边;10b:栅线的凸起结构的另一侧边;10c:栅线的凸起结构的顶边;
20:有源层;
30:数据线线段;31:源极;32:漏极;
30a:连接部;
40:钝化层过孔;
50:像素电极;50a:第一边;50b:第二边;50c:第三边;50d:第四边;50e:第五边;
60:公共电极;60a:狭缝。
具体实施方式
为使本领域技术人员更好地理解本发明的技术方案,下面结合附图和具体实施方式对本发明作进一步详细描述。
实施例1:
如图1-4所示,本实施例提供一种阵列基板,该阵列基板包括交叉设置的多条栅线(例如Gi-1、Gi、Gi+1)和多条数据线(例如Dj-1、Dj、Dj+1),以及由相邻栅线和相邻数据线限定的像素单元,每条数据线包括多个数据线线段30,每一数据线线段30对应一个像素单元,且同一数据线的两相邻的数据线线段30通过 连接部30a连接;所述栅线的延伸方向与所述数据线线段30的延伸方向的夹角为α;其中,60°≤α≤87°;所述薄膜晶体管的栅极为栅线的凸起结构10,所述凸起结构10的靠近像素电极的一侧边的延伸方向与所述栅线的延伸方向的夹角为β,其中,20°≤β≤70°。
由于本实施例阵列基板的栅线的延伸方向和数据线线段30的延伸方向的夹角为α,60°≤α≤87°,所述凸起结构的靠近像素电极的一侧边的延伸方向与所述栅线的延伸方向的夹角为β,20°≤β≤70°,因此该阵列基板可以得到一个优化的视角方向、较高的开口率和较好的显示质量。
本实施例所提供的阵列基板可应用于TN模式的显示装置中。
具体的,如图2和图3所示,以由第i行栅线Gi、i+1行栅线Gi+1、第j列数据线Dj、第j+1列数据线Dj+1限定的像素单元Pij为例,其中,与栅线Gi平行的是公共电极线CLi,像素单元Pij包括薄膜晶体管、像素电极50,与该像素电极对应的数据线线段30,数据线线段30的延伸方向与栅线Gi的延伸方向的夹角为α,薄膜晶体管的栅极为栅线Gi的凸起结构10,所述凸起结构10的靠近像素电极50的一侧边10a的延伸方向与所述栅线Gi的延伸方向的夹角为β。
其中,60°≤α≤87°,20°≤β≤70°。进一步优选地,70°≤α≤85°,30°≤β≤50°。
其中,本实施例的像素电极50为板状电极,其包括第一边50a、第二边50b、第三边50c、第四边50d和第五边50e;其中,所述第一边50a和所述第二边50b平行于所述栅线Gi的延伸方向;所述第三边50c和所述第四边50d平行于所述数据线线段30的延伸方向;所述第五边50e平行于所述凸起结构10的靠近像素电极50的一侧边10a的延伸方向。所述栅线的凸起结构10的另一侧边10b位于以该凸起结构10作为栅极的薄膜晶体管所在的像素单元的外侧。所述栅线的凸起结构10的顶边10c与以该凸起结构作为栅极的薄膜晶体管所在的像素单元对应的数据线线段交叠。此时, 不仅可以保证阵列基板较大的开口率,而且还充分利用了像素区的空间。
如图2和图4所示,在薄膜晶体管源极31和漏极32所在层与像素电极50所在层之间设置有钝化层25,像素电极50通过贯穿钝化层25的过孔40与薄膜晶体管的漏极32连接。薄膜晶体管的源极31为所述数据线Dj的连接部30a,或者薄膜晶体管的源极31为所述连接部30a的一部分,特别的是,本实施例中所述数据线Dj的连接部30a的形状为曲线段。需要说明的是,像素电极50也可以设置在栅极绝缘层15上,像素电极50与薄膜晶体管的漏极32也可以采用直接搭接的方式连接。
本实施例中,同一条数据线的对应不同像素单元的数据线线段30的延伸方向相互平行。
相应的,本实施例还针对上述阵列基板提供了一种阵列基板的制备方法,其包括如下步骤:
步骤一、在衬底1上采用溅射的方法沉积一层栅极金属层薄膜,通过构图工艺形成薄膜晶体管栅极、栅线和公共电极线的图形,使得所述栅极为所述栅线的凸起结构。
需要说明的是,衬底1既可以指没有形成任何膜层的衬底,如白玻璃,也可以指形成有其他膜层或者图案的衬底,例如形成有缓冲层的衬底。构图工艺通常包括光刻胶涂敷、曝光、显影、刻蚀、光刻胶剥离等工艺。
其中,所述栅极金属层薄膜的材料可以为钼(Mo)、钼铌合金(MoNb)、铝(Al)、铝钕合金(AlNd)、钛(Ti)和铜(Cu)中的一种或它们中多种材料形成的单层或多层复合叠层,优选为Mo、Al或含Mo、Al的合金组成的单层或多层复合膜。
步骤二、在完成上述步骤的衬底1上,采用化学气相沉积、等离子辅助化学气相淀积或溅射等制备方法,形成栅极绝缘层15。
其中,所述栅极绝缘层15的材料可以为硅的氧化物(SiOx)、硅的氮化物(SiNx)、铪的氧化物(HfOx)、硅的氮氧化物(SiON)、铝的氧化物(AlOx)等中的一种或它们中两种材料组成的多层复 合膜。
步骤三、在完成上述步骤的衬底1上,通过化学气相沉积、等离子辅助化学气相淀积或溅射等制备方法沉积薄膜晶体管的有源层薄膜,通过构图工艺形成薄膜晶体管的有源层20的图形。
其中,有源层20的材料可以为非晶硅、多晶硅、微晶硅或者氧化物半导体。
步骤四、在完成上述步骤的衬底1上,采用溅射的方法形成源漏金属层薄膜,并通过构图工艺形成薄膜晶体管源极31、漏极32和数据线的图形,使得所述栅线的延伸方向与所述数据线的延伸方向的夹角为α,其中,60°≤α≤87°。
其中,所述源漏金属层薄膜的材料可以是钼(Mo)、钼铌合金(MoNb)、铝(Al)、铝钕合金(AlNd)、钛(Ti)和铜(Cu)中的一种或多种材料形成的,优选为Mo、Al或含Mo、Al的合金材料。
步骤五、在完成上述步骤的衬底1上,采用化学气相沉积、等离子辅助化学气相淀积、或溅射等制备方法,形成钝化层25,并形成贯穿薄膜晶体管的漏极上方的钝化层25的过孔40。
其中,钝化层的材料为硅的氧化物(SiOx)、硅的氮化物(SiNx)、铪的氧化物(HfOx)、硅的氮氧化物(SiON)、铝的氧化物(AlOx)等中的一种或它们中两种材料组成的多层复合膜。
步骤六,在完成上述步骤的衬底1上,采用溅射的方法沉积透明导电金属氧化物膜。然后,通过构图工艺,形成像素电极50的图形,使得像素电极50通过钝化层25的过孔40与漏极32连接,并且所述凸起结构的靠近所述像素电极50的一侧边的延伸方向与所述栅线的延伸方向的夹角为β,其中,20°≤β≤70°。
其中,透明导电金属氧化物膜的材料为ITO(氧化铟锡)、IZO(氧化铟锌)、IGZO(氧化铟镓锌)或InGaSnO(氧化铟镓锡)。
至此完成阵列基板的制备。
实施例2:
如图5至图7所示,本实施例提供一种阵列基板,该阵列基板包括交叉设置的多条栅线(例如Gi-1、Gi、Gi+1)和多条数据线(例如Dj-1、Dj、Dj+1),以及由相邻栅线和相邻数据线限定的像素单元,每条数据线包括多个数据线线段30,每一数据线线段30对应一个像素单元,且同一数据线的两相邻的数据线线段30通过连接部30a连接;所述栅线的延伸方向与所述数据线线段30的延伸方向的夹角为α;其中,60°≤α≤87°;所述薄膜晶体管的栅极为栅线的凸起结构10,所述凸起结构的靠近像素电极的一侧边的延伸方向与所述栅线的延伸方向的夹角为β,其中,20°≤β≤70°。
由于本实施例阵列基板的栅线的延伸方向和数据线线段30的延伸方向的夹角为α,60°≤α≤87°,所述凸起结构的靠近像素电极的一侧边的延伸方向与所述栅线的延伸方向的夹角为β,20°≤β≤70°,因此该阵列基板可以得到一个优化的视角方向、较高的开口率和较好的显示质量。
本实施例所提供的阵列基板可应用于FFS模式的显示装置中。
具体的,如图5和图6所示,以由第i行栅线Gi、i+1行栅线Gi+1、第j列数据线Dj、第j+1列数据线Dj+1限定的像素单元Pij为例,其中,与栅线Gi平行的是公共电极线CLi,像素单元Pij包括薄膜晶体管、像素电极50,与该像素电极对应的数据线线段30,数据线线段30的延伸方向与栅线Gi的延伸方向的夹角则为α,薄膜晶体管的栅极为栅线Gi的凸起结构10,所述凸起结构10的靠近像素电极50的一侧边10a的延伸方向与所述栅线Gi的延伸方向的夹角为β。
其中,60°≤α≤87°,20°≤β≤70°。进一步优选地,70°≤α≤85°,30°≤β≤50°。
其中,本实施例的像素电极50为板状电极,其包括第一边50a、第二边50b、第三边50c、第四边50d和第五边50e;其中, 所述第一边50a和所述第二边50b平行于所述栅线Gi的延伸方向;所述第三边50c和所述第四边50d平行于所述数据线线段30的延伸方向;所述第五边50e平行于所述凸起结构10的靠近像素电极50的一侧边10a的延伸方向。所述栅线的凸起结构10的另一侧边10b位于以该凸起结构10作为栅极的薄膜晶体管所在的像素单元的外侧。所述栅线的凸起结构10的顶边10c与以该凸起结构10作为栅极的薄膜晶体管所在的像素单元对应的数据线线段交叠。此时,不仅可以保证阵列基板较大的开口率,而且还充分利用了像素区的空间。
其中,如图7所示,像素电极50和薄膜晶体管的漏极32采用直接搭接的方式连接。薄膜晶体管的源极31为所述数据线Dj的连接部30a,或者薄膜晶体管的源极31为所述连接部30a的一部分,特别的是,本实施例中所述数据线Dj的连接部30a的形状为曲线线段。
其中,本实施例中同一条数据线的对应不同像素单元的数据线线段30的延伸方向相互平行。
其中,阵列基板还包括公共电极60,公共电极60设于所述像素电极50上方,且与所述像素电极50绝缘;所述公共电极60具有狭缝60a,所述狭缝60a的延伸方向平行于所述数据线线段30的延伸方向。需要说明的是,狭缝60a的延伸方向应当理解为狭缝主体的中间线的延伸方向,狭缝主体不包括狭缝60a两端的部分,狭缝60a的端部的形状与狭缝主体部分相比可能会有些变化,以便更好控制液晶分子的排列。
相应的,本实施例还针对上述阵列基板提供了一种阵列基板的制备方法,其包括如下步骤:
步骤一、在衬底1上采用溅射的方法沉积一层栅极金属层薄膜,通过构图工艺形成包括薄膜晶体管栅极、栅线和公共电极线的图形,使得所述栅极为所述栅线的凸起结构。
需要说明的是,衬底1既可以指没有形成任何膜层的衬底,如白玻璃,也可以指形成有其他膜层或者图案的衬底,例如形成 有缓冲层的衬底。构图工艺通常包括光刻胶涂敷、曝光、显影、刻蚀、光刻胶剥离等工艺。
其中,所述栅极金属层薄膜的材料可以为钼(Mo)、钼铌合金(MoNb)、铝(Al)、铝钕合金(AlNd)、钛(Ti)和铜(Cu)中的一种或它们中多种材料形成的单层或多层复合叠层,优选为Mo、Al或含Mo、Al的合金组成的单层或多层复合膜。
步骤二、在完成上述步骤的衬底1上,采用化学气相沉积、等离子辅助化学气相淀积或溅射等制备方法,形成栅极绝缘层15。
其中,所述栅极绝缘层15的材料可以为硅的氧化物(SiOx)、硅的氮化物(SiNx)、铪的氧化物(HfOx)、硅的氮氧化物(SiON)、铝的氧化物(AlOx)等中的一种或它们中两种材料组成的多层复合膜。
步骤三,在完成上述步骤的衬底1上,采用溅射的方法沉积透明导电金属氧化物膜。然后,通过构图工艺,形成像素电极50的图形,使得所述凸起结构的靠近所述像素电极50的一侧边的延伸方向与所述栅线的延伸方向的夹角为β,其中,20°≤β≤70°。
其中,透明导电金属氧化物膜的材料为ITO(氧化铟锡)、IZO(氧化铟锌)、IGZO(氧化铟镓锌)或InGaSnO(氧化铟镓锡)。
步骤四、在完成上述步骤的衬底1上,通过化学气相沉积、等离子辅助化学气相淀积或溅射等制备方法沉积薄膜晶体管的有源层薄膜,通过构图工艺形成薄膜晶体管的有源层的图形。
其中,有源层20的材料可以为非晶硅、多晶硅、微晶硅或者氧化物半导体。
步骤五、在完成上述步骤的衬底1上,采用溅射的方法形成源漏金属层薄膜,并通过构图工艺形成薄膜晶体管源极31、漏极32和数据线的图形,使得薄膜晶体管的漏极32与像素电极直接搭接,所述栅线的延伸方向与所述数据线的延伸方向的夹角为α,其中,60°≤α≤87°。
其中,所述源漏金属层薄膜的材料可以是钼(Mo)、钼铌合 金(MoNb)、铝(Al)、铝钕合金(AlNd)、钛(Ti)和铜(Cu)中的一种或多种材料形成的,优选为Mo、Al或含Mo、Al的合金材料。
步骤六、在完成上述步骤的衬底1上,采用化学气相沉积、等离子辅助化学气相淀积、或溅射等制备方法,形成钝化层25。
其中,钝化层的材料为硅的氧化物(SiOx)、硅的氮化物(SiNx)、铪的氧化物(HfOx)、硅的氮氧化物(SiON)、铝的氧化物(AlOx)等中的一种或它们中两种材料组成的多层复合膜。
步骤七、在完成上述步骤的衬底1上,采用溅射的方法沉积透明导电金属氧化物膜。然后,通过构图工艺,形成公共电极60的图形,使得所述公共电极60设置于所述像素电极50上方,且与所述像素电极50绝缘,所述公共电极60具有狭缝,所述狭缝的延伸方向平行于所述数据线的延伸方向。
其中,透明导电金属氧化物膜的材料为ITO(氧化铟锡)、IZO(氧化铟锌)、IGZO(氧化铟镓锌)或InGaSnO(氧化铟镓锡)。
至此完成阵列基板的制备。
实施例3:
本实施例提供一种显示装置,其包括上述阵列基板以及与阵列基板对盒设置的对盒基板。其中,当阵列基板采用实施例1所述的阵列基板时,该显示装置为TN模式的显示装置,此时对盒基板上还设置有公共电极。当阵列基板采用实施例2所述的阵列基板时,该显示装置为FFS模式的显示装置。
其中,显示装置可以为液晶显示装置或者电致发光显示装置,例如液晶面板、电子纸、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
本实施例中的显示装置具有优化的视角方向、较高的开口率和较好的显示质量。
可以理解的是,以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式,然而本发明并不局限于此。对于本领域内的普通技术人员而言,在不脱离本发明的精神和实质的情况下,可以做出各种变型和改进,这些变型和改进也视为本发明的保护范围。

Claims (15)

  1. 一种阵列基板,其包括交叉设置的多条栅线和多条数据线,以及由相邻栅线和相邻数据线限定的像素单元,所述像素单元包括薄膜晶体管和像素电极,其中,每条数据线包括多个数据线线段,每一数据线线段对应一个像素单元,且同一数据线的两相邻的数据线线段通过连接部连接;所述栅线的延伸方向与所述数据线线段的延伸方向的夹角为α,其中,60°≤α≤87°;所述薄膜晶体管的栅极为栅线的凸起结构,所述凸起结构的靠近所述像素电极的一侧边的延伸方向与所述栅线的延伸方向的夹角为β,其中,20°≤β≤70°。
  2. 根据权利要求1所述的阵列基板,其中,70°≤α≤85°,30°≤β≤50°。
  3. 根据权利要求1所述的阵列基板,其中,所述像素电极为板状电极,其包括第一边、第二边、第三边、第四边和第五边;其中,所述第一边和所述第二边平行于所述栅线的延伸方向;所述第三边和所述第四边平行于所述数据线线段的延伸方向;所述第五边平行于所述凸起结构的靠近所述像素电极的一侧边的延伸方向。
  4. 根据权利要求1所述的阵列基板,其中,所述阵列基板还包括公共电极,所述公共电极设置于所述像素电极上方,且与所述像素电极绝缘;所述公共电极具有狭缝,所述狭缝的延伸方向平行于所述数据线线段的延伸方向。
  5. 根据权利要求1所述的阵列基板,其中,所述薄膜晶体管的源极为所述连接部,或者为所述连接部的一部分。
  6. 根据权利要求1所述的阵列基板,其中,同一条数据线的 对应不同像素单元的数据线线段的延伸方向相互平行。
  7. 根据权利要求1所述的阵列基板,其中,所述连接部的形状为曲线线段。
  8. 根据权利要求1所述的阵列基板,其中,所述栅线的凸起结构的另一侧边位于以该凸起结构作为栅极的薄膜晶体管所在的像素单元的外侧。
  9. 根据权利要求1所述的阵列基板,其中,所述栅线的凸起结构的顶边与以该凸起结构作为栅极的薄膜晶体管所在的所述像素单元对应的数据线线段交叠。
  10. 根据权利要求1所述的阵列基板,其中,所述薄膜晶体管的漏极与所述像素电极通过钝化层过孔连接或直接搭接。
  11. 一种显示装置,包括阵列基板和与该阵列基板对盒设置的对盒基板,其中,所述阵列基板为根据权利要求1-10任意一项所述的阵列基板。
  12. 一种阵列基板的制造方法,包括以下步骤:
    S1:在衬底上形成薄膜晶体管的栅极、栅线和公共电极线,使得所述栅极为所述栅线的凸起结构;
    S2:在完成步骤S1的衬底上形成栅极绝缘层;
    S3:在完成步骤S2的衬底上形成所述薄膜晶体管的有源层;
    S4:在完成步骤S3的衬底上形成所述薄膜晶体管的源极、漏极和数据线,使得所述栅线的延伸方向与所述数据线的延伸方向的夹角为α,其中,60°≤α≤87°;
    S5:在完成步骤S4的衬底上形成钝化层,并形成贯穿所述薄膜晶体管的漏极上方的钝化层的过孔;以及
    S6:在完成步骤S5的衬底上形成像素电极,使得所述像素电极通过所述过孔与所述漏极连接,并且所述凸起结构的靠近所述像素电极的一侧边的延伸方向与所述栅线的延伸方向的夹角为β,其中,20°≤β≤70°。
  13. 根据权利要求12所述的制造方法,其中,70°≤α≤85°,30°≤β≤50°。
  14. 一种阵列基板的制造方法,包括以下步骤:
    A1:在衬底上形成薄膜晶体管的栅极、栅线和公共电极线,使得所述栅极为所述栅线的凸起结构;
    A2:在完成步骤A1的衬底上形成栅极绝缘层;
    A3:在完成步骤A2的衬底上形成像素电极,使得所述凸起结构的靠近所述像素电极的一侧边的延伸方向与所述栅线的延伸方向的夹角为β,其中,20°≤β≤70°;
    A4:在完成步骤A3的衬底上形成所述薄膜晶体管的有源层;
    A5:在完成步骤A4的衬底上形成所述薄膜晶体管的源极、漏极和数据线,使得所述漏极与所述像素电极直接搭接,所述栅线的延伸方向与所述数据线的延伸方向的夹角为α,其中,60°≤α≤87°;
    A6:在完成步骤A5的衬底上形成钝化层;以及
    A7:在完成步骤A6的衬底上形成公共电极,使得所述公共电极设置于所述像素电极上方,且与所述像素电极绝缘,所述公共电极具有狭缝,所述狭缝的延伸方向平行于所述数据线的延伸方向。
  15. 根据权利要求14所述的制造方法,其中,70°≤α≤85°,30°≤β≤50°。
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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104216129B (zh) * 2014-09-12 2017-08-11 上海天马微电子有限公司 一种显示面板和显示装置
CN104637958B (zh) * 2015-03-11 2017-10-17 京东方科技集团股份有限公司 阵列基板及显示装置
CN112034656B (zh) * 2020-09-11 2022-08-26 合肥鑫晟光电科技有限公司 阵列基板和显示装置
CN114355641B (zh) * 2021-12-31 2024-01-26 惠科股份有限公司 阵列基板、显示面板以及显示装置
CN114694519B (zh) * 2022-04-24 2023-10-20 湖北长江新型显示产业创新中心有限公司 面板拼接系统和面板拼接方法
CN115032842B (zh) * 2022-07-01 2023-11-28 武汉华星光电技术有限公司 显示面板及显示终端

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040156005A1 (en) * 2001-02-26 2004-08-12 Yun-Bok Lee Array substrate for in-plane switching mode liquid crystal display device and manufacturing method thereof
CN1577019A (zh) * 2003-06-26 2005-02-09 三星电子株式会社 薄膜晶体管显示板及包含该显示板的液晶显示器
CN1580923A (zh) * 2003-07-31 2005-02-16 三星电子株式会社 多区域液晶显示器
CN101093329A (zh) * 2006-06-21 2007-12-26 Lg.菲利浦Lcd株式会社 用于共平面开关模式液晶显示器的阵列基板及其制造方法
US20100066933A1 (en) * 2008-09-17 2010-03-18 Samsung Electronics Co., Ltd. Display plate and liquid crystal display device having the same
CN102945827A (zh) * 2012-11-14 2013-02-27 京东方科技集团股份有限公司 一种阵列基板及其制作方法
CN104122714A (zh) * 2013-07-11 2014-10-29 深超光电(深圳)有限公司 一种液晶显示器的阵列基板
CN104637958A (zh) * 2015-03-11 2015-05-20 京东方科技集团股份有限公司 阵列基板及显示装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4968119A (en) * 1989-01-10 1990-11-06 David Sarnoff Research Center, Inc. High-density liquid-crystal active dot-matrix display structure
KR970004883B1 (ko) * 1992-04-03 1997-04-08 삼성전자 주식회사 액정표시패널
JP3507117B2 (ja) * 1993-02-26 2004-03-15 キヤノン株式会社 Tft基板及び該基板を有する液晶表示装置
US6791647B1 (en) * 1999-02-24 2004-09-14 Lg Philips Lcd Co., Ltd. Multi-domain liquid crystal display device
KR100710282B1 (ko) * 2000-12-29 2007-04-23 엘지.필립스 엘시디 주식회사 박막트랜지스터 및 그 제조방법
KR20040105934A (ko) * 2003-06-10 2004-12-17 삼성전자주식회사 다중 도메인 액정 표시 장치 및 그에 사용되는 표시판
US7202928B2 (en) * 2003-10-16 2007-04-10 Lg. Philips Lcd Co., Ltd Array substrate for in-plane switching mode liquid crystal display device and method of fabricating the same
KR101309139B1 (ko) * 2003-12-29 2013-09-17 엘지디스플레이 주식회사 어레이 기판 및 이를 포함하는 액정표시장치
KR100789091B1 (ko) * 2004-06-30 2007-12-26 엘지.필립스 엘시디 주식회사 횡전계 방식 액정 표시 장치 및 그 제조 방법
TWI248684B (en) * 2004-11-26 2006-02-01 Innolux Display Corp Liquid crystal display device
KR20120066950A (ko) * 2010-12-15 2012-06-25 삼성전자주식회사 식각액, 이를 이용한 표시 장치 및 그 제조 방법
JP5900818B2 (ja) * 2011-03-29 2016-04-06 Nltテクノロジー株式会社 液晶表示装置
JP6061266B2 (ja) 2012-10-19 2017-01-18 Nltテクノロジー株式会社 液晶表示装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040156005A1 (en) * 2001-02-26 2004-08-12 Yun-Bok Lee Array substrate for in-plane switching mode liquid crystal display device and manufacturing method thereof
CN1577019A (zh) * 2003-06-26 2005-02-09 三星电子株式会社 薄膜晶体管显示板及包含该显示板的液晶显示器
CN1580923A (zh) * 2003-07-31 2005-02-16 三星电子株式会社 多区域液晶显示器
CN101093329A (zh) * 2006-06-21 2007-12-26 Lg.菲利浦Lcd株式会社 用于共平面开关模式液晶显示器的阵列基板及其制造方法
US20100066933A1 (en) * 2008-09-17 2010-03-18 Samsung Electronics Co., Ltd. Display plate and liquid crystal display device having the same
CN102945827A (zh) * 2012-11-14 2013-02-27 京东方科技集团股份有限公司 一种阵列基板及其制作方法
CN104122714A (zh) * 2013-07-11 2014-10-29 深超光电(深圳)有限公司 一种液晶显示器的阵列基板
CN104637958A (zh) * 2015-03-11 2015-05-20 京东方科技集团股份有限公司 阵列基板及显示装置

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