WO2021031250A1 - 覆铜层压板、印刷电路板及印刷电路板的制造方法 - Google Patents

覆铜层压板、印刷电路板及印刷电路板的制造方法 Download PDF

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Publication number
WO2021031250A1
WO2021031250A1 PCT/CN2019/104827 CN2019104827W WO2021031250A1 WO 2021031250 A1 WO2021031250 A1 WO 2021031250A1 CN 2019104827 W CN2019104827 W CN 2019104827W WO 2021031250 A1 WO2021031250 A1 WO 2021031250A1
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WO
WIPO (PCT)
Prior art keywords
insulating layer
fiber
clad laminate
copper
resin
Prior art date
Application number
PCT/CN2019/104827
Other languages
English (en)
French (fr)
Inventor
王宏远
王和志
Original Assignee
瑞声声学科技(深圳)有限公司
瑞声科技（南京）有限公司
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Publication date
Application filed by 瑞声声学科技(深圳)有限公司, 瑞声科技（南京）有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Publication of WO2021031250A1 publication Critical patent/WO2021031250A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B19/00—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica
    • B32B19/04—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica next to another layer of the same or of a different material
    • B32B19/041—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B19/00—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica
    • B32B19/06—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
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    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
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    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
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    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/08—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer the fibres or filaments of a layer being of different substances, e.g. conjugate fibres, mixture of different fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/05—5 or more layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
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    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
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    • B32B2264/102—Oxide or hydroxide
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    • B32B2264/10—Inorganic particles
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    • B32B2264/1022—Titania
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    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
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    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
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    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
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    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement

Definitions

  • the invention relates to the technical field of copper-clad laminates, in particular to a copper-clad laminate and a printed circuit board.
  • the printed circuit board is made of a copper-clad laminate
  • the copper-clad laminate includes a resin substrate and a copper foil attached to the resin substrate;
  • the resin substrate is made of a mixture of resin and fiber materials.
  • the fiber material in the fiber material has different contents at the cross points and non-cross points in the transverse and longitudinal weaving of the fibers, resulting in uneven fiber distribution in the resin substrate, resulting in large differences in dielectric properties at different positions. , It affects the dielectric uniformity of the material and limits its application to a certain extent.
  • the purpose of the present invention is to provide a copper clad laminate and printed circuit board with excellent dielectric properties.
  • the present invention provides a copper clad laminate, which includes an insulating substrate and a copper foil layer covering the surface of the insulating substrate; the insulating substrate includes at least one first insulating layer, the first insulating The layer is a blend of a surface fiber felt made of fibers and a resin or a blend of a non-woven reinforced composite material and a resin; the copper foil layer is attached to the outside of the first insulating layer surface.
  • the fiber volume content of the first insulating layer accounts for 20%-85% of the total volume of the first insulating layer.
  • the fiber is any one of glass fiber, quartz fiber and organic fiber.
  • the first insulating layer includes two layers and arranged at intervals; the insulating substrate further includes a second insulating layer sandwiched between the two first insulating layers, and the copper foil layer is attached to The first insulating layer is away from the side of the second insulating layer; the second insulating layer is made of fiber reinforced composite material.
  • the volume fraction of the fiber volume content of the second insulating layer in the total volume of the second insulating layer is equal to the volume fraction of the fiber volume content of the first insulating layer in the total volume of the first insulating layer, so The fiber volume content of the first insulating layer accounts for 20%-85% of the total volume of the first insulating layer.
  • the resin is a blend formed by a resin matrix and a filler;
  • the resin matrix is polyphenylene ether, cyanate ester, epoxy resin, benzo Any one or more of oxazine, hydrocarbon resin, bismaleimide, polytetrafluoroethylene, polyester and polyimide;
  • the filler includes at least one of organic microspheres, silica and titanium dioxide One kind.
  • the particle size of the filler is 0.1 ⁇ m to 5 ⁇ m.
  • the present invention also provides a printed circuit board, characterized in that the printed circuit board is made of the copper clad laminate of the present invention.
  • the present invention also provides a manufacturing method of the printed circuit board of the present invention, which at least includes the following steps:
  • Step S10 impregnating the surface fiber felt or non-woven fabric with resin and drying to obtain the first insulating layer prepreg;
  • Step S20 Lay the copper foil layer and the first insulating layer, and then perform heat and pressure curing according to a predetermined process to obtain a copper clad laminate;
  • step S30 the copper clad laminate is exposed, developed, etched and surface treated according to the designed circuit to obtain the printed circuit board.
  • the copper clad laminate of the present invention includes an insulating substrate and a copper foil layer covering the surface of the insulating substrate;
  • the insulating substrate includes at least one first insulating layer, and the first insulating layer is made of A blend of surface fiber felt and resin made of fibers or a blend of non-woven reinforced composite material and resin;
  • the copper foil layer is attached to the outer surface of the first insulating layer.
  • the fiber distribution of the first insulating layer is uniform, which effectively improves the dielectric performance of the insulating substrate, thereby making the copper clad laminate excellent in dielectric performance.
  • the printed circuit board of the present invention adopts the above-mentioned copper clad laminate, so that its dielectric properties can be effectively optimized.
  • FIG. 1 is a schematic diagram of the structure of a copper clad laminate according to the first embodiment of the present invention
  • FIG. 2 is a schematic diagram of fiber distribution of the first insulating layer of the copper clad laminate of the present invention
  • FIG. 3 is a schematic flow chart of a manufacturing method of a printed circuit board according to the first embodiment of the present invention.
  • FIG. 4 is a schematic diagram of the structure of the copper clad laminate in the second embodiment of the present invention.
  • the present invention provides a copper clad laminate 100, which includes an insulating substrate 1 and a copper foil layer 2.
  • the insulating substrate 1, the insulating substrate 1 includes a first insulating layer 11; the first insulating layer 11 is a blend of surface fiber felt made of fibers and resin together or a non-woven fabric reinforced composite material and A blend of resins together.
  • the resin is a blend formed by a resin matrix and a filler.
  • the fiber is any one of glass fiber, quartz fiber and organic fiber, which can be specifically selected according to actual requirements.
  • the fiber volume fraction of the first insulating layer 11 is too low, the prepared composite material has poor mechanical properties, low dielectric constant and water absorption; and the fiber volume fraction of the first insulating layer 11 is too high, which is easy to As a result, the surface of the material becomes uneven due to the lack of resin, resulting in defects such as wrinkles and fiber lines on the copper-clad surface. Therefore, in order to ensure the mechanical properties, dielectric properties and water absorption properties of the first insulating layer 11, the fiber volume content of the first insulating layer 11 is preferably 20%-85% of the total volume of the first insulating layer. .
  • the relationship between the fiber volume content of the first insulating layer 11 and the performance of the first insulating layer 11 in the first embodiment conforms to the following table 1, please also refer to the following table 1.
  • the dielectric constant of the first insulating layer 11 under the frequency condition of 1 GHz is 3.28, and the bending strength is 221Mpa, the water absorption rate at room temperature is 0.06%;
  • the dielectric constant of the first insulating layer 11 under the frequency condition of 1 GHz is 3.62, and the bending strength is 293Mpa,
  • the water absorption rate under normal temperature conditions is 0.08%;
  • the dielectric constant of the first insulating layer 11 under the frequency condition of 1 GHz is 4.31, and the bending strength is 437Mpa, the water absorption rate under normal temperature conditions is 0.14%;
  • the dielectric constant of the first insulating layer 11 under the frequency condition of 1 GHz is 5.62, and the bending strength is 690 Mpa,
  • the water absorption rate under normal temperature conditions is 0.23%.
  • the resin matrix is polyphenylene ether, cyanate ester, epoxy resin, benzo
  • the filler includes at least one of organic microspheres, silica and titanium dioxide; wherein the silica and the titanium dioxide are used as inorganic fillers, and the addition of the inorganic filler can effectively adjust the dielectric of the resin Constant, improve its thermodynamic properties, and improve the flame retardancy of the substrate to a certain extent; as an organic filler, the organic microspheres can improve the interface strength between the filler and the resin matrix, so that the filler is in the resin The distribution of the resin is more uniform, thereby avoiding the problem of easy settlement of the filler, thereby ensuring the stability of the material properties of the resin.
  • the filler is in the form of particles, and the particle size of its particles also directly affects its stability after being mixed with the resin matrix. By reducing the particle size of the filler, the filler and the resin can be effectively improved. The mixing stability of the matrix.
  • the particle size of the filler is 0.1 ⁇ m to 5 ⁇ m.
  • the copper foil layer 2 covers the surface of the insulating substrate 1, and more specifically, the copper foil layer 2 is attached to the outer surface of the first insulating layer 11.
  • the copper foil layer 2 is any one of rolled copper or electrolytic copper; further, the thickness of the copper foil layer 2 is 8-50 ⁇ m.
  • the roughness Rz of the contact surface between the copper foil layer 2 and the first insulating layer 11 is 1.2 ⁇ m to 6 ⁇ m, which effectively increases the smoothness of the contact surface, making the copper foil layer 2 and The bonding between the first insulating layers 11 is more reliable, avoiding obvious fiber lines on the surface of the copper clad laminate 100, and improving the overall reliability of the copper clad laminate 100.
  • the first insulating layer 11 is a blend formed by the surface fiber felt and resin; the schematic diagram of the fiber distribution of the first insulating layer 11 is shown in FIG.
  • the fiber mat is a structure made of randomly distributed multilayer fibers. The structure has no obvious voids, so that the fibers of the surface fiber mat are evenly distributed, which improves the uniformity of the dielectric properties of the woven and non-woven points, and effectively improves the
  • the dielectric properties of the insulating substrate 1 make the copper clad laminate 100 excellent in dielectric properties; moreover, due to the uniform fiber distribution of the surface fiber mat, the problem of large differences in transverse and longitudinal mechanical properties and vertical The problem of low mechanical strength in the direction of the fibers effectively improves the mechanical properties of the insulating substrate 1 to improve the mechanical properties of the copper clad laminate 100.
  • the surface fiber mat is a sheet-like product made of continuous strands or chopped strands that are non-directionally combined by chemical bonding or mechanical action. It only needs chopped fibers to be made without Weaving, the manufacturing process is simple, the cost is low, and the manufacturing cost of the insulating substrate 1 is effectively reduced, so that the cost of the copper clad laminate 100 is low; in addition, the surface fiber felt can be fabricated according to actual needs.
  • the area density is controlled below 10 g/m 2 so that the resin can better infiltrate the surface fiber mat, which reduces the difficulty of manufacturing the insulating substrate 1 and provides conditions for preparing an ultra-thin composite substrate.
  • the structure of the first insulating layer 11 is not limited to this, it can also be a blend formed by the non-woven fabric reinforced composite material and the resin, because the non-woven fabric reinforced composite material is The textile short fibers or filaments are oriented or randomly arranged to form a fiber network structure. The fibers inside are evenly distributed, which can also effectively improve the dielectric properties of the insulating substrate 1, thereby making the copper clad laminate 100 medium Excellent electrical performance.
  • the insulating substrate may be a single-layer structure composed of one layer of the first insulating layer; or it may be composed of multiple layers of the first insulating layer. ⁇ multi-layer structure.
  • the present invention also provides a printed circuit board (not shown), which is made of the copper clad laminate according to the present invention.
  • the manufacturing method of the printed circuit board includes the following steps:
  • step S10 the surface fiber felt or non-woven fabric is impregnated with resin and dried to prepare a first insulating layer prepreg.
  • Step S20 Lay the copper foil layer and the first insulating layer, and then perform thermo-press curing according to a predetermined process to obtain a copper clad laminate.
  • step S30 the copper clad laminate is exposed, developed, etched and surface treated according to the designed circuit to obtain the printed circuit board.
  • the printed circuit board produced also has better dielectric properties and mechanical properties.
  • the insulating substrate can be additionally provided with a second insulating layer.
  • the copper clad laminate 100' in the second embodiment it includes an insulating substrate 1 'And copper foil 2'.
  • the insulating substrate 1' includes a first insulating layer 11' and a second insulating layer 12', and the insulating substrate 1'is a multilayer composed of the first insulating layer 11' and the second insulating layer 12' Composite structure.
  • the first insulating layer 11' includes two layers and is arranged at intervals; the second insulating layer 12' is sandwiched between the two first insulating layers 11', and the copper foil layer 2' It is attached to the side of the first insulating layer 11' away from the second insulating layer 12'.
  • the structure and performance of the first insulating layer 11' of the second embodiment are the same as those of the first insulating layer, and the same parts will not be repeated here.
  • the following mainly describes the composition and performance of the second insulating layer 12' of the second embodiment.
  • the second insulating layer 12' is made of fiber-reinforced composite material.
  • the fiber-reinforced material includes at least one of a fiber fabric reinforced material made of fibers and a non-woven fabric reinforced material, which can be used according to actual needs. Make specific choices.
  • the volume fraction of the fiber volume content of the second insulation layer 12' in the total volume of the second insulation layer 12' is equal to the volume fraction of the fiber volume content of the first insulation layer 11' in the first insulation layer 11' the volume fraction of the total volume, wherein the fiber volume content of the first insulating layer 11' accounts for 20%-85% of the total volume of the first insulating layer 11', then the second insulating layer 12' The fiber volume content accounts for 20%-85% of the total volume of the second insulating layer.
  • the second insulating layer 12' is mainly used to adjust the thickness of the copper-clad laminate 100', so that the copper-clad laminate 100' meets the thickness requirements of different application scenarios, and
  • the specific thickness of the second insulating layer 12' can be specifically set according to different application scenarios.
  • the copper clad laminate of the present invention includes an insulating substrate and a copper foil layer covering the surface of the insulating substrate; the insulating substrate includes at least one first insulating layer, and the first insulating layer is made of A blend of surface fiber felt and resin made of fibers or a blend of non-woven reinforced composite material and resin; the copper foil layer is attached to the outer surface of the first insulating layer.
  • the fiber distribution of the first insulating layer is uniform, which effectively improves the dielectric performance of the insulating substrate, so that the copper clad laminate has excellent dielectric performance.
  • the printed circuit board of the present invention adopts the above-mentioned copper clad laminate, so that its dielectric properties can be effectively optimized.

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Abstract

本发明提供了一种覆铜层压板，其包括绝缘基板以及覆盖于绝缘基板表面的铜箔层；绝缘基板包括至少一层第一绝缘层，第一绝缘层为由纤维制成的表面纤维毡与树脂共同形成的共混物或无纺布增强复合材料与树脂共同形成的共混物；铜箔层贴设于第一绝缘层的外表面。本发明还提供了一种印刷电路板，其包括由本发明的覆铜层压板制得。本发明还提供了一种印刷电路板的制作方法。与相关技术相比，本发明的覆铜层压板及印刷电路板介电性能优。

Description

覆铜层压板、印刷电路板及印刷电路板的制造方法 技术领域
本发明涉及覆铜层压板技术领域，尤其涉及一种覆铜层压板及印刷电路板。
 背景技术
近年来，随着电子信息技术的发展，电子设备安装的小型化、高密度化，信息的大容量化、高速化，对印刷电路板的耐热性、吸水性、耐化学性、机械性能、尺寸稳定性和介电性能等综合性能提出了更高的要求。
相关技术中，印刷电路板由覆铜层压板制成，而所述覆铜层压板包括树脂基板和贴设于所述树脂基板的铜箔；所述树脂基板为树脂和纤维材料混合制成。
 技术问题
然而，相关技术中，由于所述纤维材料内的纤维横向和纵向编制交叉点和非交叉点处含量不同，使得所述树脂基板内的纤维分布不均匀，导致不同位置的介电性能差异较大，影响材料介电均匀性，一定程度上限制其应用。
因此，实有必要提供一种新的覆铜层压板及印刷电路板解决上述技术问题。
 技术解决方案
本发明的目的在于提供一种介电性能优的覆铜层压板及印刷电路板。
为达到上述目的，本发明提供一种覆铜层压板，其包括绝缘基板以及覆盖于所述绝缘基板表面的铜箔层；所述绝缘基板包括至少一层第一绝缘层，所述第一绝缘层为由纤维制成的表面纤维毡与树脂共同形成的共混物或无纺布增强复合材料与树脂共同形成的共混物；所述铜箔层贴设于所述第一绝缘层的外表面。
优选的，所述第一绝缘层的纤维体积含量占所述第一绝缘层总体积的20%-85%。
优选的，所述纤维为玻璃纤维、石英纤维和有机纤维中的任意一种。
优选的，所述第一绝缘层包括两层且相互间隔设置；所述绝缘基板还包括夹设于两层所述第一绝缘层之间的第二绝缘层，所述铜箔层贴设于所述第一绝缘层远离所述第二绝缘层的一侧；所述第二绝缘层为纤维增强复合材料制成。
优选的，所述第二绝缘层的纤维体积含量占所述第二绝缘层总体积的体积分数等于所述第一绝缘层的纤维体积含量占所述第一绝缘层总体积的体积分数，所述第一绝缘层的纤维体积含量占所述第一绝缘层总体积的20%-85%。
优选的，所述树脂为树脂基体与填料共同形成的共混物；所述树脂基体为聚苯醚、氰酸酯、环氧树脂、苯并
Figure 5641
嗪、碳氢树脂、双马来酰亚胺、聚四氟乙烯、聚酯和聚酰亚胺中的任意一种或多种；所述填料包括有机微球、二氧化硅和二氧化钛中的至少一种。
优选的，所述填料的粒径为0.1微米至5微米。
本发明还提供一种印刷电路板，其特征在于，所述印刷电路板由本发明所述的覆铜层压板制得。
本发明还提供一种本发明所述的印刷电路板的制造方法，至少包括以下步骤：
步骤S10，将表面纤维毡或无纺布浸渍树脂，烘干后制得第一绝缘层预浸料；
步骤S20，将铜箔层和第一绝缘层铺层，然后按照既定工艺进行热压固化，得到覆铜层压板；
步骤S30，将所述覆铜层压板按照设计的电路经曝光、显影、刻蚀以及表面处理后制得所述印刷电路板。
 有益效果
与相关技术相比，本发明的覆铜层压板包括绝缘基板以及覆盖于所述绝缘基板表面的铜箔层；所述绝缘基板包括至少一层第一绝缘层，所述第一绝缘层为由纤维制成的表面纤维毡与树脂共同形成的共混物或无纺布增强复合材料与树脂共同形成的共混物；所述铜箔层贴设于所述第一绝缘层的外表面。上述结构中，所述第一绝缘层的纤维分布均匀，有效提高所述绝缘基板的介电性能，从而使得所述覆铜层压板的介电性能优。本发明的印刷电路板采用了上述的覆铜层压板，使得其介电性能得到有效的优化。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：
图1为本发明实施例一的覆铜层压板的结构示意图；
图2为本发明覆铜层压板的第一绝缘层的纤维分布示意图；
图3为本发明实施例一的印刷电路板的制造方法的流程示意图；
图4为本发明实施例二的覆铜层压板的结构示意图。
 本发明的实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
实施例一
请同时参阅图1-2所示，本发明提供一种覆铜层压板100，其包括绝缘基板1和铜箔层2。
所述绝缘基板1，所述绝缘基板1包括第一绝缘层11；所述第一绝缘层11为由纤维制成的表面纤维毡与树脂共同形成的共混物或无纺布增强复合材料与树脂共同形成的共混物。
其中，更具体的，所述树脂为树脂基体与填料共同形成的共混物。
所述纤维为玻璃纤维、石英纤维和有机纤维中的任意一种，其可以根据实际使用的需求进行具体的选择。
进一步的，若所述第一绝缘层11的纤维体积分数过低，则制备的复合材料力学性能差，介电常数和吸水率低；而第一绝缘层11的纤维体积分数含量过高，容易导致材料表面因缺少树脂变得不平整，导致覆铜后表面存在褶皱、纤维纹路等缺陷。因此，为了保证所述第一绝缘层11的力学性能、介电性能及吸水性能，所述第一绝缘层11的纤维体积含量优选为占所述第一绝缘层总体积的20%-85%。
本实施例一的第一绝缘层11的纤维体积含量与第一绝缘层11性能之间的关系符合下表一所示，请同时参阅下表一：
[根据细则26改正13.11.2019]　
表一、不同纤维体积分数的第一绝缘层的综合性能表
Figure 1

当所述第一绝缘层11的纤维体积含量占所述第一绝缘层11总体积的20%时，所述第一绝缘层11在1GHz的频率条件下的介电常数为3.28，弯曲强度为221Mpa，在常温条件下的吸水率为0.06%；
当所述第一绝缘层11的纤维体积含量占第一绝缘层11总体积的30%时，所述第一绝缘层11在1GHz的频率条件下的介电常数为3.62，弯曲强度为293Mpa，在常温条件下的吸水率为0.08%；
当所述第一绝缘层11的纤维体积含量占所述第一绝缘层11总体积的50%时，所述第一绝缘层11在1GHz的频率条件下的介电常数为4.31，弯曲强度为437Mpa，在常温条件下的吸水率为0.14%；
当所述第一绝缘层11的纤维体积含量占第一绝缘层11总体积的85%时，所述第一绝缘层11在1GHz的频率条件下的介电常数为5.62，弯曲强度为690Mpa，在常温条件下的吸水率为0.23%。
所述树脂基体为聚苯醚、氰酸酯、环氧树脂、苯并
Figure 5641
嗪、碳氢树脂、双马来酰亚胺、聚四氟乙烯、聚酯和聚酰亚胺中的任意一种或多种形成的共混物；在本实施方式中，所述树脂基体为聚苯醚，当然，其也可以根据实际使用的需求进行具体的选择。
所述填料包括有机微球、二氧化硅和二氧化钛中的至少一种；其中，所述二氧化硅和所述二氧化钛作为无机填料，该无机填料的加入，能够有效地调整所述树脂的介电常数、提高其热力学性能，并在一定程度上改善基板的阻燃性；所述有机微球作为有机填料，能够提高所述填料与所述树脂基体的界面强度，使得所述填料在所述树脂中的分布更加均匀，从而避免了所述填料的容易发生沉降的问题，从而保证所述树脂的材料性能的稳定性。所述填料呈颗粒状，其颗粒的粒径大小也直接影响其与所述树脂基体混合之后的稳定性，通过减小所述填料的粒径大小，能够有效地提高所述填料与所述树脂基体的混合稳定性，在此，作为一个优选的实施方案，所述填料的粒径为0.1微米至5微米。
所述铜箔层2，所述铜箔层2覆盖于所述绝缘基板1表面，更具体的，所述铜箔层2贴设于所述第一绝缘层11的外表面。
在本实施方式中，所述铜箔层2为压延铜或电解铜中的任意一种；进一步的，所述铜箔层2的厚度为8微米至50微米。
更一步的，所述铜箔层2与所述第一绝缘层11之间的接触面的粗糙度Rz为1.2微米至6微米，有效增加接触面的光滑程度，使得所述铜箔层2与所述第一绝缘层11之间的贴合更加可靠，避免了覆铜板层压板100表面上出现明显的纤维纹路，提高了所述覆铜层压板100整体的可靠性。
作为一种优选的实施方案，所述第一绝缘层11为所述表面纤维毡与树脂共同形成的共混物；如图2所示的第一绝缘层11的纤维分布示意图，由于所述表面纤维毡为多层纤维随机分布制得的结构，该结构无明显空洞，使得所述表面纤维毡的纤维的分布均匀，改善了编织点和非编织点出介电性能的均匀性，有效提高所述绝缘基板1的介电性能，从而使得所述覆铜层压板100的介电性能优；而且，由于所述表面纤维毡的纤维的分布均匀，避免了横纵向力学性能差异大的问题以及垂直于纤维的方向的力学强度低的问题，有效地提高了所述绝缘基板1的力学性能，以提高所述覆铜层压板100的力学性能。
同时，所述表面纤维毡为由连续原丝或短切原丝不定向地通过化学粘结剂或机械作用结合在一起制成的薄片状制品，其只需要短切纤维即可制得，且无需编织，制作工艺简单，成本较低，有效降低所述绝缘基板1的制作成本，从而使得所述覆铜层压板100的成本低；另外，可根据实际使用的需求，将所述表面纤维毡的面密度控制在10g/m 2以下，使得所述树脂能够更好地浸润所述表面纤维毡，降低了所述绝缘基板1的制作难度，为制备出超薄复材基板提供了条件。
当然，所述第一绝缘层11的结构形式不限于此，其也可以为所述无纺布增强复合材料和所述树脂共同形成的共混物，由于所述无纺布增强复合材料是将纺织短纤维或者长丝进行定向或随机排列，形成纤网结构，其内部的纤维分布均匀，也可有效地提高所述绝缘基板1的介电性能，从而使得所述覆铜层压板100的介电性能优。
需要说明的是，绝缘基板具体的结构形式是不限，所述绝缘基板可以为一层所述第一绝缘层构成的单层结构；也可以为由多层的所述第一绝缘层叠合构成的多层结构。
本发明还提供一种印刷电路板（未图示），其由本发明所述的覆铜层压板制得。
请参阅图3所示，所述印刷电路板的制作方法包括以下步骤：
步骤S10，将表面纤维毡或无纺布浸渍树脂，烘干后制得第一绝缘层预浸料。
步骤S20，将铜箔层和第一绝缘层铺层，然后按照既定工艺进行热压固化，得到覆铜层压板。
步骤S30，将所述覆铜层压板按照设计的电路经曝光、显影、刻蚀以及表面处理后制得所述印刷电路板。
由于所述覆铜层压板具有较优的介电性能及力学性能，使得制成的所述印刷电路板也具有较优的介电性能及力学性能。
实施例二
请参阅图4所示，为了满足实际应用中不同厚度产品的需求，绝缘基板还可以增设第二绝缘层，比如，在本实施方式二中的覆铜层压板100’中，其包括绝缘基板1’和铜箔2’。
所述绝缘基板1’包括第一绝缘层11’和第二绝缘层12’，所述绝缘基板1’为所述第一绝缘层11’与所述第二绝缘层12’共同构成的多层复合结构。
具体的，所述第一绝缘层11’包括两层且相互间隔设置；所述第二绝缘层12’夹设于两层所述第一绝缘层11’之间，所述铜箔层2’贴设于所述第一绝缘层11’远离所述第二绝缘层12’的一侧。
实施例二的第一绝缘层11’与实施例一的第一绝缘层的构成及性能是相同的，对于相同的部分在此不再赘述。下面主要描述实施例二的第二绝缘层12’的构成及性能。
所述第二绝缘层12’为纤维增强复合材料制成，所述纤维增强材料包括由纤维制成的纤维织物增强材料和无纺布增强材料中的至少一种，其可以根据实际使用的需求进行具体的选择。
更优的，所述第二绝缘层12’的纤维体积含量占所述第二绝缘层12’总体积的体积分数等于所述第一绝缘层11’的纤维体积含量占所述第一绝缘层11’总体积的体积分数，其中，所述第一绝缘层11’的纤维体积含量占所述第一绝缘层11’总体积的20%-85%，则所述第二绝缘层12’的纤维体积含量占所述第二绝缘层总体积的20%-85%。
需要说明的是，所述第二绝缘层12’主要用于调整所述覆铜层压板100’的厚度，以使得所述覆铜层压板100’满足不同的应用场景对其厚度的要求，而所述第二绝缘层12’具体的厚度可以根据不同的应用场景进行具体设置。
与相关技术相比，本发明的覆铜层压板包括绝缘基板以及覆盖于所述绝缘基板表面的铜箔层；所述绝缘基板包括至少一层第一绝缘层，所述第一绝缘层为由纤维制成的表面纤维毡与树脂共同形成的共混物或无纺布增强复合材料与树脂共同形成的共混物；所述铜箔层贴设于所述第一绝缘层的外表面。上述结构中，所述第一绝缘层的纤维分布均匀，有效提高所述绝缘基板的介电性能，从而使得所述覆铜层压板的介电性能优。本发明的印刷电路板采用了上述的覆铜层压板，使得其介电性能得到有效的优化。
以上所述的仅是本发明的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出改进，但这些均属于本发明的保护范围。

Claims (9)

  1. 一种覆铜层压板，其包括绝缘基板以及覆盖于所述绝缘基板表面的铜箔层，其特征在于，
    所述绝缘基板包括至少一层第一绝缘层，所述第一绝缘层为由纤维制成的表面纤维毡与树脂共同形成的共混物或无纺布增强复合材料与树脂共同形成的共混物；所述铜箔层贴设于所述第一绝缘层的外表面。
  2. 根据权利要求1所述的覆铜层压板，其特征在于，所述第一绝缘层的纤维体积含量占所述第一绝缘层总体积的20%-85%。
  3. 根据权利要求2所述的覆铜层压板，其特征在于，所述纤维为玻璃纤维、石英纤维和有机纤维中的任意一种。
  4. 根据权利要求1所述的覆铜层压板，其特征在于，所述第一绝缘层包括两层且相互间隔设置；所述绝缘基板还包括夹设于两层所述第一绝缘层之间的第二绝缘层，所述铜箔层贴设于所述第一绝缘层远离所述第二绝缘层的一侧；所述第二绝缘层为纤维增强复合材料制成。
  5. 根据权利要求4所述的覆铜层压板，其特征在于，所述第二绝缘层的纤维体积含量占所述第二绝缘层总体积的体积分数等于所述第一绝缘层的纤维体积含量占所述第一绝缘层总体积的体积分数，所述第一绝缘层的纤维体积含量占所述第一绝缘层总体积的20%-85%。
  6. 根据权利要求1所述的覆铜层压板，其特征在于，所述树脂为树脂基体与填料共同形成的共混物；所述树脂基体为聚苯醚、氰酸酯、环氧树脂、苯并
    Figure 5641
    嗪、碳氢树脂、双马来酰亚胺、聚四氟乙烯、聚酯和聚酰亚胺中的任意一种或多种；所述填料包括有机微球、二氧化硅和二氧化钛中的至少一种。
  7. 根据权利要求6所述的覆铜层压板，其特征在于，所述填料的粒径为0.1微米至5微米。
  8. 一种印刷电路板，其特征在于，所述印刷电路板由权利要求1-8任一项所述的覆铜层压板制得。
  9. 一种如权利要求8所述的印刷电路板的制造方法，其特征在于，至少包括以下步骤：
    步骤S10，将表面纤维毡或无纺布浸渍树脂，烘干后制得第一绝缘层预浸料；
    步骤S20，将铜箔层和第一绝缘层铺层，然后按照既定工艺进行热压固化，得到覆铜层压板；
    步骤S30，将所述覆铜层压板按照设计的电路经曝光、显影、刻蚀以及表面处理后制得所述印刷电路板。
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