WO2021025133A1 - Photosensitive resin composition and photosensitive element - Google Patents
Photosensitive resin composition and photosensitive element Download PDFInfo
- Publication number
- WO2021025133A1 WO2021025133A1 PCT/JP2020/030256 JP2020030256W WO2021025133A1 WO 2021025133 A1 WO2021025133 A1 WO 2021025133A1 JP 2020030256 W JP2020030256 W JP 2020030256W WO 2021025133 A1 WO2021025133 A1 WO 2021025133A1
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- WIPO (PCT)
- Prior art keywords
- resin composition
- photosensitive resin
- group
- mass
- compound
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 130
- 150000001875 compounds Chemical class 0.000 claims abstract description 100
- 229920000642 polymer Polymers 0.000 claims abstract description 38
- 230000002378 acidificating effect Effects 0.000 claims abstract description 22
- 125000000962 organic group Chemical group 0.000 claims abstract description 17
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 14
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 12
- 239000003999 initiator Substances 0.000 claims abstract description 12
- 125000003277 amino group Chemical group 0.000 claims abstract description 9
- 239000007787 solid Substances 0.000 claims description 20
- 125000003118 aryl group Chemical group 0.000 claims description 9
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 8
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 3
- 125000000542 sulfonic acid group Chemical group 0.000 claims description 3
- 125000004429 atom Chemical group 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 25
- 229910052802 copper Inorganic materials 0.000 abstract description 25
- 239000010949 copper Substances 0.000 abstract description 25
- 238000011161 development Methods 0.000 abstract description 24
- -1 monocarboxylic acid compound Chemical class 0.000 description 66
- 239000010408 film Substances 0.000 description 46
- 239000010410 layer Substances 0.000 description 44
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 37
- 239000000758 substrate Substances 0.000 description 35
- 238000000034 method Methods 0.000 description 31
- 238000005530 etching Methods 0.000 description 29
- 239000000975 dye Substances 0.000 description 28
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 20
- 239000000178 monomer Substances 0.000 description 20
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 18
- 239000004020 conductor Substances 0.000 description 16
- 239000000243 solution Substances 0.000 description 15
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 13
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 12
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 12
- 125000004207 3-methoxyphenyl group Chemical group [H]C1=C([H])C(*)=C([H])C(OC([H])([H])[H])=C1[H] 0.000 description 11
- NPKSPKHJBVJUKB-UHFFFAOYSA-N N-phenylglycine Chemical compound OC(=O)CNC1=CC=CC=C1 NPKSPKHJBVJUKB-UHFFFAOYSA-N 0.000 description 11
- 239000011241 protective layer Substances 0.000 description 11
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 10
- 125000002947 alkylene group Chemical group 0.000 description 10
- 239000007864 aqueous solution Substances 0.000 description 10
- 238000010030 laminating Methods 0.000 description 10
- 239000000047 product Substances 0.000 description 10
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 9
- 239000002253 acid Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 239000002585 base Substances 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- 230000035945 sensitivity Effects 0.000 description 8
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 6
- NNBFNNNWANBMTI-UHFFFAOYSA-M brilliant green Chemical compound OS([O-])(=O)=O.C1=CC(N(CC)CC)=CC=C1C(C=1C=CC=CC=1)=C1C=CC(=[N+](CC)CC)C=C1 NNBFNNNWANBMTI-UHFFFAOYSA-M 0.000 description 6
- 238000004925 denaturation Methods 0.000 description 6
- 230000036425 denaturation Effects 0.000 description 6
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- 229920001223 polyethylene glycol Polymers 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- OAZWDJGLIYNYMU-UHFFFAOYSA-N Leucocrystal Violet Chemical compound C1=CC(N(C)C)=CC=C1C(C=1C=CC(=CC=1)N(C)C)C1=CC=C(N(C)C)C=C1 OAZWDJGLIYNYMU-UHFFFAOYSA-N 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
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- 235000011187 glycerol Nutrition 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
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- 239000001294 propane Substances 0.000 description 5
- 125000004182 2-chlorophenyl group Chemical group [H]C1=C([H])C(Cl)=C(*)C([H])=C1[H] 0.000 description 4
- KFJDQPJLANOOOB-UHFFFAOYSA-N 2h-benzotriazole-4-carboxylic acid Chemical class OC(=O)C1=CC=CC2=NNN=C12 KFJDQPJLANOOOB-UHFFFAOYSA-N 0.000 description 4
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- MJVAVZPDRWSRRC-UHFFFAOYSA-N Menadione Chemical compound C1=CC=C2C(=O)C(C)=CC(=O)C2=C1 MJVAVZPDRWSRRC-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical class C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 239000003112 inhibitor Substances 0.000 description 4
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 238000010526 radical polymerization reaction Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 150000003440 styrenes Chemical class 0.000 description 4
- 150000003852 triazoles Chemical class 0.000 description 4
- JUNAPQMUUHSYOV-UHFFFAOYSA-N 2-(2h-tetrazol-5-yl)acetic acid Chemical compound OC(=O)CC=1N=NNN=1 JUNAPQMUUHSYOV-UHFFFAOYSA-N 0.000 description 3
- 125000003762 3,4-dimethoxyphenyl group Chemical group [H]C1=C([H])C(OC([H])([H])[H])=C(OC([H])([H])[H])C([H])=C1* 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 3
- XBDQKXXYIPTUBI-UHFFFAOYSA-N Propionic acid Substances CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 3
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000012964 benzotriazole Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 3
- 125000000623 heterocyclic group Chemical group 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 3
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- ROVRRJSRRSGUOL-UHFFFAOYSA-N victoria blue bo Chemical compound [Cl-].C12=CC=CC=C2C(NCC)=CC=C1C(C=1C=CC(=CC=1)N(CC)CC)=C1C=CC(=[N+](CC)CC)C=C1 ROVRRJSRRSGUOL-UHFFFAOYSA-N 0.000 description 3
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 2
- PTPLXVHPKMTVIW-FPLPWBNLSA-N (Z)-hydroxyimino-oxido-phenylazanium Chemical compound O\N=[N+](/[O-])c1ccccc1 PTPLXVHPKMTVIW-FPLPWBNLSA-N 0.000 description 2
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 2
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- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 2
- YYVYAPXYZVYDHN-UHFFFAOYSA-N 9,10-phenanthroquinone Chemical compound C1=CC=C2C(=O)C(=O)C3=CC=CC=C3C2=C1 YYVYAPXYZVYDHN-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Natural products CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
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- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
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- 125000000319 biphenyl-4-yl group Chemical group [H]C1=C([H])C([H])=C([H])C([H])=C1C1=C([H])C([H])=C([*])C([H])=C1[H] 0.000 description 2
- VYHBFRJRBHMIQZ-UHFFFAOYSA-N bis[4-(diethylamino)phenyl]methanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=C(N(CC)CC)C=C1 VYHBFRJRBHMIQZ-UHFFFAOYSA-N 0.000 description 2
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- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- VYXSBFYARXAAKO-UHFFFAOYSA-N ethyl 2-[3-(ethylamino)-6-ethylimino-2,7-dimethylxanthen-9-yl]benzoate;hydron;chloride Chemical compound [Cl-].C1=2C=C(C)C(NCC)=CC=2OC2=CC(=[NH+]CC)C(C)=CC2=C1C1=CC=CC=C1C(=O)OCC VYXSBFYARXAAKO-UHFFFAOYSA-N 0.000 description 2
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- ATOUXIOKEJWULN-UHFFFAOYSA-N 1,6-diisocyanato-2,2,4-trimethylhexane Chemical compound O=C=NCCC(C)CC(C)(C)CN=C=O ATOUXIOKEJWULN-UHFFFAOYSA-N 0.000 description 1
- LMGYOBQJBQAZKC-UHFFFAOYSA-N 1-(2-ethylphenyl)-2-hydroxy-2-phenylethanone Chemical compound CCC1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 LMGYOBQJBQAZKC-UHFFFAOYSA-N 0.000 description 1
- YXZFFTJAHVMMLF-UHFFFAOYSA-N 1-bromo-3-methylbutane Chemical compound CC(C)CCBr YXZFFTJAHVMMLF-UHFFFAOYSA-N 0.000 description 1
- YZWKKMVJZFACSU-UHFFFAOYSA-N 1-bromopentane Chemical compound CCCCCBr YZWKKMVJZFACSU-UHFFFAOYSA-N 0.000 description 1
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- 150000003536 tetrazoles Chemical class 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
Definitions
- the present invention relates to a photosensitive resin composition and a photosensitive element.
- Printed wiring boards are generally manufactured by photolithography.
- photolithography a layer made of a photosensitive resin composition is formed on a substrate, a pattern is exposed and developed on the coating film to form a resist pattern, and then a conductor pattern is formed by etching or plating. This is a method of forming a desired wiring pattern on a substrate by removing a resist pattern on the substrate.
- Patent Document 1 provides a photosensitive resin composition that is particularly sensitive to ultraviolet light and visible light, can be cured by laser drawing, and has excellent storage stability after film formation on a substrate and after drawing. The purpose is.
- Patent Document 1 describes a photosensitive resin composition containing tetrazole-or a derivative thereof, or triazole or a derivative thereof. Examples of tetrazole- or a derivative thereof include 1H-1,2,3,4-tetrazole-, 5amino-1H-tetrazole-, and 5-methyl-1H-tetrazole-, and triazole or a derivative thereof includes 1, 2,4-Triazole or 5-chlorobenzotriazole is mentioned.
- Patent Document 2 It is an object of Patent Document 2 to provide a photosensitive resin composition having excellent adhesion to a copper surface and capable of forming an extremely stable resist film that is not affected by changes over time after painting or laminating.
- Patent Document 2 describes a photosensitive resin composition containing one or more heterocyclic compounds selected from the group consisting of triazoles, tetrazole-classes and imidazoles.
- Patent Document 3 An object of Patent Document 3 is to provide a photosensitive resin composition having high sensitivity, a good resist pattern shape, strong tent film strength, and high-definition and high aspect ratio pattern. And. As a solution to this problem, Patent Document 3 describes a photosensitive resin composition containing a monocarboxylic acid compound having a molecular weight of 180 to 2,000.
- Patent Document 4 provides a photosensitive resin composition capable of subdividing the peeled pieces (reducing the size of the resist piece after peeling), having excellent plating resistance, and having excellent sensitivity, resolution and adhesion. With the goal.
- Patent Document 4 contains a binder polymer containing at least (meth) acrylic acid and hydroxyalkyl (meth) acrylic acid ester as a copolymerization component, and further, as an adhesion imparting agent, benzotriazole and a specific
- a photosensitive resin composition containing a carboxybenzotriazole derivative represented by a general formula is described.
- Patent Document 5 It is an object of Patent Document 5 to provide a photosensitive resin composition which has sufficiently excellent adhesion to a conductor layer and can form a resist which is unlikely to cause discoloration of the conductor layer. ..
- Patent Document 5 contains a binder polymer, a photopolymerizable compound having an ethylenically unsaturated group, a photopolymerization initiator, and a benzotriazole derivative represented by a specific general formula. Describes the resin composition.
- the miniaturization and high density of printed wiring boards have been progressing, and in the manufacturing process of photosensitive elements, side etching (hereinafter, also simply referred to as "side etching")
- side etching There is a demand for high-performance photosensitive elements that can reduce the amount of copper line width and provide a more uniform copper line width.
- the photosensitive element generally contains a dye so that the resist pattern formed on the copper foil after development can be visually recognized with good contrast.
- the dye has a function of changing the color of the exposed portion when the DF is exposed.
- One of the objects of the present invention is to provide a photosensitive resin composition in which the amount of side etch is reduced, the uniformity of the copper line width is excellent, the color of the dye is promoted during exposure, and the visibility of the exposed portion is excellent. To do.
- the inventors of the present application have obtained a specific structure of an alkali-soluble polymer, a compound having an ethylenically unsaturated double bond, a photopolymerization initiator, and a dye. It has been found that the above-mentioned problems can be solved by a photosensitive resin composition containing the compound, and the present invention has been completed. That is, the present invention is as follows.
- neither R 1 nor R 2 has an amino group and is independently selected from the group consisting of a hydrogen atom or an organic group having 1 to 3 carbon atoms, except that at least R 1 and R 2 are selected.
- One is the photosensitive resin composition according to item 1, which has an acidic group of pKa5 or less.
- R 1 and R 2 are both having no amino group, one of R 1 and R 2 is an organic group having 1 to 3 carbon atoms having a pKa5 following acidic group and the other represents hydrogen
- the photosensitive resin composition according to item 2 which is an atom.
- the photosensitive resin composition according to item 4 wherein the acidic group is a carboxy group.
- the dye (D) is a leuco dye.
- the compound (E) is contained in an amount of 0.001 to 0.5% by mass based on the total solid content of the photosensitive resin composition. ..
- a photosensitive resin composition according to any one of items 1 to 7, wherein the compound (E) is a solid at 25 ° C.
- a photosensitive element comprising a support and a photosensitive resin composition layer formed on the support according to any one of items 1 to 9.
- the present invention it is possible to provide a photosensitive resin composition in which the amount of side etch is reduced, the uniformity of the copper line width is excellent, the color development of the dye is promoted at the time of exposure, and the visibility of the exposed portion is excellent.
- the present embodiment the embodiment of the present invention (hereinafter, referred to as “the present embodiment”) will be described in detail for the purpose of exemplifying, but the present invention is not limited to the present embodiment.
- the upper limit value and the lower limit value of each numerical range can be arbitrarily combined.
- the photosensitive resin composition of the present embodiment comprises (A) an alkali-soluble polymer, (B) a compound having an ethylenically unsaturated double bond, (C) a photopolymerization initiator, and (D) a dye.
- (E) Contains a compound having a specific heterocyclic structure.
- the compound (E) is a compound represented by the general formula (3) described later.
- the adhesion and reaction rate between the cured resist and the copper interface are important. Since the etching solution soaks into the resist-copper interface by the etching process, a difference (side etch) between the line width of the dry film and the copper line width after etching occurs. If the interaction between the resist and the copper interface is strong, the etching solution is less likely to permeate and the amount of side etching is reduced. As a compound having a strong interaction with copper, imidazole, triazole, tetrazole, etc. are known, but if these compounds have high hydrophobicity, they remain on the substrate even after development, and there is a problem that an etching residue is generated. There is.
- the inventors have found that the etching residue can be reduced by using the compound (E) having an acidic group of pKa5 or less, which is highly soluble in an alkaline aqueous solution. Further, in order to reduce the amount of side etch, it is advantageous that the amount of swelling is small, so that the reaction rate of the resist after curing is also important. In particular, tetrazol- radically cleaves in a short wavelength region of about 200 nm, so that the reaction rate of the copper interface (resist bottom), where many of them are present, increases, the swelling rate of the resist bottom is suppressed, and contributes to low side etching. It is thought that.
- the color development of the dye is preferable from the viewpoint of visibility of the exposed portion, and when the inspection machine or the like reads the alignment marker for exposure, it is advantageous that the contrast between the exposed portion and the unexposed portion is large for easy recognition. is there. It is considered that the compound (E) having an acidic group of pKa5 or less reacted at the time of exposure stabilizes the cation of the dye, preferably leuco crystal violet (DMA), so that the color development becomes good and the exposure contrast becomes good.
- DMA leuco crystal violet
- the alkali-soluble polymer (A) is preferably obtained by polymerizing at least one of the first monomers described later. Further, the alkali-soluble polymer (A) can be obtained by copolymerizing at least one kind of the first monomer and at least one kind of the second monomer described later. preferable.
- the first monomer is a monomer containing a carboxyl group in the molecule.
- the first monomer include (meth) acrylic acid, fumaric acid, cinnamic acid, crotonic acid, itaconic acid, maleic anhydride, maleic acid semi-ester and the like.
- (meth) acrylic acid is particularly preferable.
- (meth) acrylic means acrylic and methacrylic
- (meth) acrylate” means “acrylate” and "methacrylate”.
- the copolymerization ratio of the first monomer in the alkali-soluble polymer (A) is preferably 10% by mass to 35% by mass, preferably 15% by mass to 30% by mass, based on the total mass of all the monomers. It is more preferable, and it is more preferable that it is 16% by mass to 28% by mass.
- the second monomer is a monomer that is non-acidic and has at least one polymerizable unsaturated group in the molecule.
- Examples of the second monomer include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, and isobutyl (meth) acrylate.
- methyl (meth) acrylate, n-butyl (meth) acrylate, styrene, 2-ethylhexyl (meth) acrylate, and benzyl (meth) acrylate are preferable.
- Benzyl (meth) acrylate is particularly preferable from the viewpoint of suppressing side etching.
- the copolymerization ratio of the second monomer in the (A) alkali-soluble polymer is 70% by mass to 90% by mass with respect to the total mass of all the monomers constituting the copolymer (A) the alkali-soluble polymer. %, More preferably 70% by mass to 85% by mass, and even more preferably 72% by mass to 84% by mass.
- the alkali-soluble polymer (A) preferably contains an aromatic ring in its molecular structure, and has an aromatic group in the side chain of the structure. It is more preferable to have.
- the (A) alkali-soluble polymer having an aromatic group in the side chain is a compound having an aromatic group as at least one of the above-mentioned first monomer and second monomer.
- the monomer having an aromatic group include (meth) acrylic acid aralkyl ester such as benzyl (meth) acrylate, phenoxypolyethylene glycol (meth) acrylate, styrene, silicic acid, and a polymerizable styrene derivative ( For example, methylstyrene, vinyltoluene, ester-butoxystyrene, acetoxystyrene, 4-vinylbenzoic acid, styrene dimer, styrene trimer, etc.) and the like. From the viewpoint of suppressing side etching, (meth) acrylic acid aralkyl ester and styrene are preferable, and benzyl (meth) acrylate is particularly
- the copolymerization ratio of the above-mentioned compound having an aromatic group is 20% by mass or more, 30% by mass or more, 40% by mass or more, 50% by mass or more, 60% by mass or more, and 70% by mass with respect to the total mass of all the monomers. % Or more, or 80% by mass or more is preferable. From the viewpoint of maintaining alkali solubility, the copolymerization ratio of the compound having an aromatic group is preferably 95% by mass or less, more preferably 90% by mass or less.
- the (A) alkali-soluble polymer one or more monomers selected from the above-mentioned first monomer and second monomer are added by a known polymerization method, preferably. It can be prepared by polymerization, more preferably radical polymerization.
- the acid equivalent of the alkali-soluble polymer (the acid equivalent of the entire mixture when a plurality of types of copolymers are contained) is the development resistance of the photosensitive resin layer, and the resolution and adhesion of the resist pattern. From the viewpoint of the above, it is preferably 100 or more, and from the viewpoint of developability and peelability of the photosensitive resin layer, it is preferably 600 or less.
- the acid equivalent of the alkali-soluble polymer (A) is more preferably 200 to 500, and even more preferably 250 to 450.
- the weight average molecular weight of the alkali-soluble polymer (hereinafter, may be abbreviated as "Mw”) (when a plurality of types of alkali-soluble polymers are used in combination, it means the entire Mw). It is preferably 5,000 to 500,000, more preferably 5,000 to 100,000, and even more preferably 10,000 to 65,000.
- Dispersity (Mw / Mn) which is the ratio of the weight average molecular weight to the number average molecular weight (hereinafter, may be abbreviated as “Mn”) (when a plurality of types of alkali-soluble polymers are used in combination, the total dispersion thereof.
- the degree) is preferably 1.0 to 6.0, more preferably 1.5 to 5.0, further preferably 2.0 to 5.0, and 2.5 to 5.0. It is even more preferably 4.5, and particularly preferably 3.0 to 4.2. It is preferable that the weight average molecular weight and the dispersity of the alkali-soluble polymer (A) are in the above ranges from the viewpoints of obtaining appropriate developability, high coating film strength, and uniformity of resist thickness.
- (A) When a plurality of types of alkali-soluble polymers are used in combination as the alkali-soluble polymer, (A-1) an alkali-soluble polymer having an Mw of less than 50,000, and (A-2) an alkali-soluble polymer having an Mw of 50,000 or more. Is particularly preferable.
- the Mw of the alkali-soluble polymer (A-1) is more preferably 5,000 or more and less than 50,000, further preferably 10,000 to 45,000, and 10,000 to 35,000. Is particularly preferable. It is preferable that the Mw of the alkali-soluble polymer (A-1) is in this range from the viewpoint of achieving both developability and resolvability. On the other hand, the Mw of the alkali-soluble polymer (A-2) is more preferably 50,000 to 100,000, further preferably 50,000 to 75,000, and 50,000 to 65, It is particularly preferably 000.
- the Mw of the alkali-soluble polymer (A-2) is in this range indicates the product life when the photosensitive resin composition of the present embodiment is applied to a photosensitive element (also referred to as “dry film resist”). It is preferable from the viewpoint of making it longer.
- the content ratio of the alkali-soluble polymer (A-1) component to the total solid content of the photosensitive resin composition is preferably 3% by mass or more and 30% by mass or less, and more preferably 5% by mass or more and 25% by mass or more. It is less than or equal to, more preferably 10% by mass or more and 20% by mass or less. It is preferable to set the usage ratio of the component (A-1) in the above range from the viewpoint of achieving both resolution and a small amount of side etch.
- the content ratio of the alkali-soluble polymer (A-2) component with respect to the total solid content of the photosensitive resin composition is preferably 5% by mass or more and 50% by mass or less, and more preferably 15% by mass or more and 48.
- the proportion of the alkali-soluble polymer (A) used in the photosensitive resin composition of the present embodiment is preferably 25% by mass to 85% by mass, preferably 35% by mass or more, based on the total solid content of the photosensitive resin composition. 75% by mass is more preferable. It is preferable to set the ratio of the alkali-soluble polymer used in the above range from the viewpoints of resolution, developability, developer swellability of the exposed portion, resist pattern peelability, and product life of the photosensitive element.
- the compound having an ethylenically unsaturated double bond is a compound having a polymerizable property by having an ethylenically unsaturated double bond in its structure.
- Such compounds include a compound in which (meth) acrylic acid is added to one end of polyalkylene oxide, and (meth) acrylic acid is added to one end of polyalkylene oxide, and the other end is alkyl ether or allyl. Ethereated compounds, etc.
- Group 1 compounds compounds having (meth) acryloyl groups at both ends of the alkylene oxide chain, both ends of the alkylene oxide chain in which the ethylene oxide chain and the propylene oxide chain are randomly or blocked.
- phenoxyhexaethylene glycol mono (meth) acrylate which is a (meth) acrylate of a compound in which polyethylene glycol is added to a phenyl group, and an average of 2 mol of propylene oxide are added.
- 4-Normalnonylphenoxypentaethylene glycol monopropylene glycol (meth) acrylate which is a (meth) acrylate of a compound obtained by adding polyethylene glycol to which an average of 5 mol of ethylene oxide is added to nonylphenol, ethylene having an average of 8 mol of ethylene
- 4-normalnonylphenoxyoctaethylene glycol (meth) acrylate for example, manufactured by Toa Synthetic Co., Ltd., M-114), which is an acrylate of a compound in which polyethylene glycol to which oxide is added is added to nonylphenol.
- the other compounds in the second group include tetraethylene glycol di (meth) acrylate, pentaethylene glycol di (meth) acrylate, hexaethylene glycol di (meth) acrylate, and heptaethylene glycol di (meth).
- Polyethylene glycols such as acrylates, octaethylene glycol di (meth) acrylates, nonaethylene glycol di (meth) acrylates, decaethylene glycol di (meth) acrylates, and compounds having (meth) acryloyl groups at both ends of a 12 mol ethylene oxide chain.
- polyalkylene oxide di (meth) acrylate compound containing an ethylene oxide group and a propylene oxide group in the compound for example, ethylene oxide was further added to both ends by an average of 3 mol to polypropylene glycol to which an average of 12 mol of propylene oxide was added.
- examples thereof include dimethacrylate of glycol, and dimethacrylate of glycol in which ethylene oxide is further added to both ends by an average of 15 mol each of polypropylene glycol to which an average of 18 mol of propylene oxide is added.
- examples thereof include compounds having ethylenically unsaturated double bonds at both ends of polyalkylene glycol in which alkylene oxide is added to bisphenol A.
- the compound obtained by modifying bisphenol A among the compounds of the second group it is possible to use a compound having an ethylenically unsaturated double bond at both ends of a polyalkylene glycol obtained by adding an alkylene oxide to bisphenol A in terms of resolution. And from the viewpoint of adhesion, it is preferable.
- the ethylenically unsaturated double bond in this compound is preferably contained in the compound in the form of being contained in the (meth) acryloyl group.
- alkylene oxide for example, ethylene oxide denaturation, propylene oxide denaturation, butylene oxide denaturation, pentylene oxide denaturation, hexylene oxide denaturation and the like are known.
- a compound having (meth) acryloyl groups at both ends of a polyalkylene glycol obtained by adding ethylene oxide to bisphenol A is preferable.
- Examples of such a compound include 2,2-bis (4-((meth) acryloxidiethoxy) phenyl) propane (for example, NK ester BPE-200 manufactured by Shin Nakamura Chemical Industry Co., Ltd.), 2,2-. Bis (4-((meth) acryloxitriethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxitetraethoxy) phenyl) propane, 2,2-bis (4-((meth)) Acryloxipentaethoxy) phenyl) propane (for example, NK ester BPE-500 manufactured by Shin Nakamura Chemical Industry Co., Ltd.) and the like can be mentioned.
- 2,2-bis (4-((meth) acryloxidiethoxy) phenyl) propane for example, NK ester BPE-200 manufactured by Shin Nakamura Chemical Industry Co., Ltd.
- Bis (4-(meth) acryloxitriethoxy) phenyl) propane 2,2-bis (4-((me
- di (meth) acrylate of polyalkylene glycol having an average of 2 mol of propylene oxide and an average of 6 mol of ethylene oxide added to both ends of bisphenol A, or an average of 2 mol of propylene oxide at both ends of bisphenol A.
- Ethylene oxide-modified and propylene oxide-modified compounds are also preferred, such as di (meth) acrylates of polyalkylene glycols to which an average of 15 mol of ethylene oxide has been added.
- the number of moles of ethylene oxide and propylene oxide in a compound having (meth) acryloyl groups at both ends by alkylene oxide modification of bisphenol A is determined from the viewpoint of improving resolution, adhesion, and flexibility. It is preferably 1 mol or more and 60 mol or less, more preferably 4 mol or more and 40 mol or less, and further preferably 5 mol or more and 20 mol or less.
- an alkyleneoxy group such as an ethyleneoxy group, a propyleneoxy group, or a butyleneoxy group is added to a central skeleton having 3 mol or more of groups to which an alkylene oxide group can be added in the molecule. It is obtained by (meth) acrylate-forming the obtained alcohol.
- the compound capable of forming the central skeleton include glycerin, trimethylolpropane, pentaerythritol, dipentaerythritol, and isocyanurate ring.
- trimethylolpropane ethylene oxide (EO) 3 molar modified triacrylate trimethylolpropane EO 6 molar modified triacrylate, trimethylolpropane EO 9 molar modified triacrylate, trimethylolpropane EO 12 molar modified triacrylate.
- EO ethylene oxide
- examples of such a compound include EO3 molar modified triacrylate of glycerin (for example, A-GLY-3E manufactured by Shin Nakamura Chemical Industry Co., Ltd.) and EO9 molar modified triacrylate of glycerin (for example, manufactured by Shin Nakamura Chemical Industry Co., Ltd.).
- A-GLY-9E EO6 mol of glycerin and 6 mol of propylene oxide (PO) modified triacrylate
- A-GLY-0606PE EO9 mol of glycerin PO9 mol modified triacrylate
- A-GLY-0909PE EO9 mol of glycerin PO9 mol modified triacrylate
- 4EO-modified tetraacrylate of pentaerythritol for example, SR-494 manufactured by Sartmer Japan Co., Ltd.
- 35EO-modified tetraacrylate of pentaerythritol for example, NK ester ATM-35E manufactured by Shin-Nakamura Chemical Industry Co., Ltd.
- NK ester ATM-35E manufactured by Shin-Nakamura Chemical Industry Co., Ltd.
- Isocyanurate compounds can also be mentioned as compounds having an ethylenically unsaturated double bond.
- Specific examples of such compounds include tri (meth) acrylate ethoxylated isocyanuric acid, ⁇ -caprolactone-modified tris (2- (meth) acryloxyethyl) isocyanurate, triallyl isocyanurate, and the following formulas: Examples thereof include a compound represented by (EO), a (EO) -modified isocyanurate-induced tri (meth) acrylate (an adduct of 27 mol of ethylene oxide on average) and the like.
- a compound having a urethane bond and an ethylenically unsaturated double bond for example, hexamethylene diisocyanate, tolylene diisocyanate, or a diisocyanate compound (for example, 2,2,4-trimethylhexamethylene diisocyanate) and a hydroxyl group in one molecule.
- urethane compounds of compounds having a (meth) acrylic group eg, 2-hydroxypropyl acrylate, oligopropylene glycol monomethacrylate.
- it is a reaction product of hexamethylene diisocyanate and oligopropylene glycol monomethacrylate (Blemmer PP1000, manufactured by NOF CORPORATION).
- Examples of the compound having a phthalate structure and an ethylenically unsaturated double bond include ⁇ -chloro- ⁇ -hydroxypropyl- ⁇ '-(meth) acryloyloxyethyl-o-phthalate and ⁇ -hydroxyalkyl- ⁇ '-. Examples thereof include (meth) acryloyloxyalkyl-o-phthalate.
- (B) a compound having an ethylenically unsaturated double bond may contain tricyclodecandi (meth) acrylate, (2,2-bis ⁇ 4- (methacryloxypentethoxy) cyclohexyl ⁇ propane, or the like. ..
- the photosensitive resin composition of the present embodiment contains a compound obtained by modifying bisphenol A.
- the proportion of the bisphenol A-modified compound used in the photosensitive resin composition of the present embodiment is preferably 12% by mass to 45% by mass, preferably 17% by mass, based on the total mass of the solid content of the photosensitive resin composition. -40% by mass is more preferable, and 20% by mass to 40% by mass is further preferable. It is preferable to set the usage ratio within this range from the viewpoint of obtaining a photosensitive resin composition having an excellent balance between resolution and developability.
- the ratio of the compound having an ethylenically unsaturated double bond to the total solid content mass of the photosensitive resin composition is preferably 5% by mass to 70% by mass. It is preferable that this ratio is 5% by mass or more from the viewpoint of sensitivity, resolution and adhesion, and it is more preferable that this ratio is 15% by mass or more, and further preferably 20% by mass or more. On the other hand, setting this ratio to 70% by mass or less is preferable from the viewpoint of suppressing peeling delay of the edge fuse and the cured resist, and it is more preferable to set this ratio to 60% by mass or less.
- photopolymerization initiator (C) examples include hexaarylbiimidazole compounds, N-aryl- ⁇ -amino acid compounds, quinone compounds, aromatic ketone compounds, acetophenone compounds, acylphosphine oxide compounds, benzoin compounds, and benzoin ether compounds. , Dialkyl ketal compounds, thioxanthone compounds, dialkylaminobenzoic acid ester compounds, oxime ester compounds, aclysine compounds, pyrazoline derivatives, N-aryl amino acid ester compounds, halogen compounds and the like.
- hexaarylbiimidazole compound examples include 2- (o-chlorophenyl) -4,5-diphenylbiimidazole, 2,2', 5-tris- (o-chlorophenyl) -4- (3,4-dimethoxyphenyl).
- N-aryl- ⁇ -amino acid compound examples include N-phenylglycine, N-methyl-N-phenylglycine, N-ethyl-N-phenylglycine and the like.
- N-phenylglycine has a high sensitizing effect and is preferable.
- quinone compound examples include 2-ethylanthraquinone, octaethyl anthraquinone, 1,2-benz anthraquinone, 2,3-benz anthraquinone, 2-phenylanthraquinone, 2,3-diphenyl anthraquinone, 1-chloroanthraquinone and 2-chloro.
- aromatic ketone compound examples include benzophenone, Michler's ketone [4,4'-bis (dimethylamino) benzophenone], 4,4'-bis (diethylamino) benzophenone, 4-methoxy-4'-dimethylaminobenzophenone and the like. be able to.
- acetophenone compound examples include 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropan-1-one, 1- (4).
- acylphosphine oxide compound examples include 2,4,6-trimethylbenzyldiphenylphosphine oxide, bis (2,4,6-trimethylbenzoyl) -phosphine oxide, and bis (2,6-dimethoxybenzoyl) -2. , 4,4-trimethyl-Pentylphosphon oxide and the like.
- Commercially available products of the acylphosphine oxide compound include, for example, Lucillin TPO manufactured by BASF and Irgacure-819 manufactured by Ciba Specialty Chemicals.
- benzoin compound and the benzoin ether compound examples include benzoin, benzoin ethyl ether, benzoin phenyl ether, methyl benzoin, ethyl benzoin and the like.
- dialkyl ketal compound examples include benzyl dimethyl ketal and benzyl diethyl ketal.
- thioxanthone compound examples include 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone and the like.
- dialkylaminobenzoic acid ester compound examples include ethyl dimethylaminobenzoate, ethyl diethylaminobenzoate, ethyl-p-dimethylaminobenzoate, 2-ethylhexyl-4- (dimethylamino) benzoate and the like.
- Examples of the oxime ester compound include 1-phenyl-1,2-propanedione-2-O-benzoyloxime, 1-phenyl-1,2-propanedione-2- (O-ethoxycarbonyl) oxime and the like. ..
- Examples of commercially available products of the oxime ester compound include CGI-325, Irgacure-OXE01, and Irgacure-OXE02 manufactured by Ciba Specialty Chemicals.
- 1,7-bis (9,9'-acridinyl) heptane or 9-phenylacridine is preferable in terms of sensitivity, resolution, availability and the like.
- the pyrazoline derivatives include 1-phenyl-3- (4-tert-butyl-styryl) -5- (4-tert-butyl-phenyl) -pyrazolin and 1-phenyl from the viewpoint of adhesion and rectangularity of the resist pattern.
- -3- (4-Biphenyl) -5- (4-tert-butyl-phenyl) -pyrazolin and 1-phenyl-3- (4-biphenyl) -5- (4-tert-octyl-phenyl) -pyrazolin are preferred. ..
- ester compound of N-aryl amino acid examples include methyl ester of N-phenylglycine, ethyl ester of N-phenylglycine, n-propyl ester of N-phenylglycine, isopropyl ester of N-phenylglycine, and N-phenylglycine.
- halogen compound examples include amyl bromide, isoamyl bromide, isobutylene bromide, ethylene bromide, diphenylmethyl bromide, benzyl bromide, methylene bromide, tribromomethylphenyl sulfone, carbon tetrabromide, and tris (2). , 3-Dibromopropyl) phosphate, trichloroacetamide, amyl iodide, isobutyl iodide, 1,1,1-trichloro-2,2-bis (p-chlorophenyl) ethane, chlorinated triazine compound, diallyl iodonium compound, etc. Of particular, tribromomethylphenyl sulfone is preferable.
- the ratio of the (C) photopolymerization initiator used in the photosensitive resin composition of the present embodiment is preferably 0.01% by mass to 20% by mass with respect to the total mass of the solid content of the photosensitive resin composition. More preferably, it is 0.5% by mass to 10% by mass. (C) By setting the ratio of the photopolymerization initiator used in this range, sufficient sensitivity can be obtained, light can be sufficiently transmitted to the bottom of the resist, high resolution can be obtained, and a conductor pattern can be obtained. A photosensitive resin composition having an excellent balance with the amount of side etching can be obtained.
- (C) It is preferable to use a hexaarylbisimidazole compound as the photopolymerization initiator.
- the proportion of the hexaarylbisimidazole compound used is preferably 0.1% by mass to 10% by mass, preferably 0.5% by mass to 5% by mass, based on the total mass of the solid content of the photosensitive resin composition. Is more preferable.
- the photopolymerization initiator it is particularly preferable to use an aromatic ketone compound and a hexaarylbisimidazole compound in combination.
- the ratio of the aromatic ketone compound used is preferably 0.5% by mass or less, more preferably 0.01% by mass to 0.4% by mass, based on the total mass of the solid content of the photosensitive resin composition.
- the proportion of the hexaarylbisimidazole compound used is preferably 0.1% by mass to 10% by mass, more preferably 0.5% by mass to 5% by mass, based on the total mass of the solid content of the photosensitive resin composition. ..
- the photosensitive resin composition of the present embodiment contains a dye (D). Since the exposed portion develops color when the photosensitive resin composition contains a dye, it is preferable in terms of visibility, and when an inspection machine or the like reads an alignment marker for exposure, the exposed portion and the unexposed portion are used. The larger the contrast, the easier it is to recognize and the more advantageous it is.
- the dyes having a large contrast between the exposed portion and the unexposed portion are preferably leuco dye and fluorane dye, and more preferably leuco dye.
- the leuco dye can be blended in the photosensitive resin composition of the present embodiment in order to impart suitable color development property and excellent peeling property to the resist cured film.
- Specific examples of the leuco dye include leuco crystal violet (tris [4- (dimethylamino) phenyl] methane: DMA), 3,3-bis (p-dimethylaminophenyl) -6-dimethylaminophthalide, and the like. Can be mentioned. Of these, leuco crystal violet (DMA) is preferred.
- the ratio of the dye used in the photosensitive resin composition of the present embodiment is 0.01% by mass to 2 with respect to the total solid content of the photosensitive resin composition from the viewpoint of the contrast between the exposed portion and the unexposed portion. It is preferably by mass%, more preferably 0.1% by mass to 1.5% by mass.
- the dye may include a base dye.
- the base dye include basic green 1 [CAS number (hereinafter the same): 633-03-4] (for example, Aizen Diamond Green GH, trade name, manufactured by Hodogaya Chemical Co., Ltd.), malachite green oxalate [2437.
- the ratio of the base dye used in the photosensitive resin composition of the present embodiment is preferably 0.001% by mass to 3% by mass, more preferably 0.01, based on the total solid content of the photosensitive resin composition. It is in the range of mass% to 2% by mass, and more preferably in the range of 0.01% by mass to 1.2% by mass. Good colorability can be obtained by setting the usage ratio within this range.
- the compound (E) is a compound having no amino group, an acidic group having a pKa of 5 or less, and a heterocyclic structure having four nitrogen atoms.
- Compound (E) is preferably solid at room temperature (25 ° C.).
- Compound (E) is a compound represented by the general formula (3) described below.
- neither R 1 nor R 2 has an amino group and is independently selected from the group consisting of a hydrogen atom or an organic group having 1 to 20 carbon atoms, preferably a hydrogen atom and carbon. It is independently selected from the group consisting of organic groups of numbers 1 to 10, and more preferably it is independently selected from the group consisting of hydrogen atoms and organic groups having 1 to 3 carbon atoms.
- at least one of R 1 and R 2 has an acidic group of pKa5 or less.
- the “carbon number” means the total carbon number of the organic group including the carbon number of the acidic group having pKa5 or less.
- an octadecyl group, a heptadecyl group, a hexadecyl group, a pentadecyl group, a tetradecyl group, a tridecyl group, a dodecyl group, an undecyl group, and a decyl group are used.
- an octadecyl group, a heptadecyl group, a hexadecyl group, a pentadecyl group, a tetradecyl group, a tridecyl group, a dodecyl group, an undecyl group, and a decyl group are used.
- organic group having 1 to 10 carbon atoms examples include a nonyl group, an octyl group, a heptyl group, a hexyl group, a pentyl group, and a butyl group.
- organic group having 1 to 3 carbon atoms examples include a methyl group, an ethyl group, an n-propyl group, an iso-propyl group and the like.
- the acidic group having a pKa of 5 or less include a carboxy group, a phosphoric acid group, and a sulfonic acid group. From the viewpoint of excellent color development and low side etching, the acidic group is preferably a carboxy group.
- the compound (E) is a compound represented by the general formula (3), excellent color development and low side etching can be obtained.
- one of R 1 and R 2 is an organic having 1 to 3 carbon atoms having an acidic group of pKa5 or less. It is more preferably selected independently from the group consisting of a group, the other being a hydrogen atom and an organic group having 1 to 3 carbon atoms, and one of R 1 and R 2 is a carbon having an acidic group of pKa5 or less. It is even more preferable that the number 1 to 3 is an organic group and the other is a hydrogen atom.
- Specific examples of the compound represented by the general formula (3) include 1H-tetrazole-1-carboxylic acid, 1H-tetrazole-5-carboxylic acid, 1H-tetrazole-1-acetic acid, and 1H-tetrazol-5-acetic acid.
- 1H-tetrazole-1-acetic acid and 1H-tetrazol-5-acetic acid are preferable as the compound represented by the general formula (3) from the viewpoint of excellent color development and low side etching. More preferably, 1H-tetrazol-5-acetic acid.
- the content of the compound (E) in the photosensitive resin composition is 0.001% by mass to 5% by mass with respect to the total solid content of the photosensitive resin composition from the viewpoint of excellent color development and low side etching. It may be in the range of mass%, preferably 0.001% by mass to 0.5% by mass, more preferably 0.001% by mass to 0.3% by mass, and further preferably 0.001% by mass to 0.2. It is by mass%, more preferably 0.001% by mass to 0.1% by mass.
- the lower limit of the content of the compound (E) in the photosensitive resin composition may be 0.01% by mass, or 0.02% by mass, based on the total solid content of the photosensitive resin composition. It may be 0.03% by mass.
- the photosensitive resin composition of the present embodiment may contain only the components (A) to (E) described above, or may contain other components together with these components.
- Other components that can be used here include, for example, stabilizers.
- the stabilizer is preferable from the viewpoint of improving the thermal stability and storage stability of the photosensitive resin composition, or both of them.
- Stabilizers include, for example, at least one compound selected from the group consisting of radical polymerization inhibitors, benzotriazole compounds, carboxybenzotriazole compounds, and alkylene oxide compounds having a glycidyl group. These can be used alone or in combination of two or more.
- radical polymerization inhibitor examples include p-methoxyphenol, hydroquinone, pyrogallol, naphthylamine, tert-butylcatechol, cuprous chloride, 2,6-di-tert-butyl-p-cresol, and 2,2'-methylenebis.
- benzotriazole compound examples include 1,2,3-benzotriazole, 1-chloro-1,2,3-benzotriazole, bis (N-2-ethylhexyl) aminomethylene-1,2,3-benzotriazole, and the like.
- Examples thereof include a 1: 1 mixture of butylaminomethyl) -5-carboxybenzotriazole and 1- (2-di-n-butylaminomethyl) -6-carboxybenzotriazole.
- a 1: 1 mixture of 1- (2-di-n-butylaminomethyl) -5-carboxybenzotriazole and 1- (2-di-n-butylaminomethyl) -6-carboxybenzotriazole is preferable. ..
- these can be used individually by 1 type or in combination of 2 or more types.
- carboxybenzotriazole compound examples include 4-carboxy-1,2,3-benzotriazole, 5-carboxy-1,2,3-benzotriazole, and N- (N, N-di-2-ethylhexyl) aminomethylene.
- alkylene oxide compound having a glycidyl group examples include neopentyl glycol diglycidyl ether (for example, Epolite 1500NP manufactured by Kyoeisha Chemical Co., Ltd.), nonaethylene glycol diglycidyl ether (for example, Epolite 400E manufactured by Kyoeisha Chemical Co., Ltd.), and the like.
- examples thereof include bisphenol A-propylene oxide 2 mol additive diglycidyl ether (for example, Epolite 3002 manufactured by Kyoeisha Chemical Co., Ltd.), 1,6-hexanediol diglycidyl ether (for example, Epolite 1600 manufactured by Kyoeisha Chemical Co., Ltd.), and the like. .. These can be used alone or in combination of two or more.
- the total content of the radical polymerization inhibitor, the benzotriazole compound, the carboxybenzotriazole compound, and the alkylene oxide compound having a glycidyl group in the photosensitive resin composition is preferably 0.001% by mass to 3%. It is in the range of% by mass, more preferably in the range of 0.05 to 1.5% by mass. The total content is preferably 0.001% by mass or more from the viewpoint of imparting good storage stability to the photosensitive resin composition, while 3% by mass from the viewpoint of maintaining the sensitivity of the photosensitive resin layer. % Or less is preferable.
- the photosensitive resin composition preparation solution can be prepared by adding a solvent to the above-mentioned photosensitive resin composition.
- Suitable solvents used here include ketones such as methyl ethyl ketone (MEK); alcohols such as methanol, ethanol and isopropyl alcohol. It is preferable to add a solvent to the photosensitive resin composition to prepare the preparation so that the viscosity of the photosensitive resin composition preparation is 500 mPa ⁇ sec to 4,000 mPa ⁇ sec at 25 ° C.
- the photosensitive element (also referred to as a dry film resist) in the present embodiment includes a support and a photosensitive resin composition layer formed on the support from the above-mentioned photosensitive resin composition of the present embodiment. .. If necessary, the photosensitive element of the present embodiment may have a protective layer on the surface opposite to the support of the photosensitive resin composition layer.
- a transparent base material (film base material, hereinafter also referred to as “support film”) that transmits light emitted from an exposure light source is preferable.
- a support film include polyethylene terephthalate film, polyvinyl alcohol film, polyvinyl chloride film, vinyl chloride copolymer film, polyvinylidene chloride film, vinylidene chloride copolymer film, and polymethylmethacrylate copolymer film.
- examples thereof include polystyrene films, polyacrylonitrile films, styrene copolymer films, polyamide films, and cellulose derivative films. As these films, stretched films can also be used if necessary.
- the haze of the support is preferably 0.01% to 5.0%, more preferably 0.01% to 3.5%, still more preferably 0.01% to 2.5%, and 0.01% to. 1.0% is even more preferable.
- the thinner the support the more advantageous in terms of image formation and economy, but it is necessary to maintain the strength. Considering both of these, a support having a thickness of 10 to 30 ⁇ m can be preferably used.
- the photosensitive resin composition layer in the photosensitive element of the present embodiment is a layer made of the above-mentioned photosensitive resin composition of the present embodiment.
- the solvent is preferably removed in the photosensitive resin composition layer, but the solvent remains. It doesn't matter.
- the thickness of the photosensitive resin composition layer in the photosensitive element of the present embodiment is preferably 5 to 100 ⁇ m, more preferably 5 to 50 ⁇ m. The thinner the thickness, the better the resolution, and the thicker the thickness, the better the film strength. Therefore, the thickness of the composition layer can be appropriately selected within the above range depending on the application.
- the protective layer in the photosensitive element of the present embodiment is that the adhesive force with the photosensitive resin composition layer is sufficiently smaller than the adhesive force between the support and the photosensitive resin composition layer, and the protective layer can be easily peeled off. You can do it.
- the protective layer for example, a polyethylene film, a polypropylene film or the like can be preferably used, and for example, a film having excellent peelability disclosed in JP-A-59-202457 can be used.
- the thickness of the protective layer is preferably 10 to 100 ⁇ m, more preferably 10 to 50 ⁇ m.
- the photosensitive element of the present embodiment can be manufactured by sequentially laminating a support, a photosensitive resin composition layer, and, if necessary, a protective layer.
- a method for laminating the support, the photosensitive resin composition layer, and the protective layer a known method can be adopted.
- the photosensitive resin composition of the present embodiment is prepared as the above-mentioned photosensitive resin composition preparation solution, first applied onto a support using a bar coater or a roll coater, dried, and then the mixture is applied onto the support. A photosensitive resin composition layer composed of a photosensitive resin composition is formed. Then, if necessary, the photosensitive element can be manufactured by laminating a protective layer on the formed photosensitive resin composition layer.
- a resist pattern can be formed on the substrate by using the photosensitive element as described above.
- the method for forming the resist pattern includes a laminating step of forming a photosensitive resin composition layer on a substrate using the photosensitive element of the present embodiment, an exposure step of exposing the photosensitive resin composition layer, and the photosensitive.
- a developing step of forming a resist pattern by removing an unexposed portion of the resin composition layer with a developing solution is included in the order described above.
- a photosensitive resin composition layer is formed on a substrate using a laminator.
- the protective layer is peeled off, and then the photosensitive resin composition layer is heat-bonded to the substrate surface using a laminator and laminated.
- the substrate material used include copper, stainless steel (SUS), glass, indium tin oxide (ITO), and a flexible base material on which a conductor thin film is laminated.
- Examples of the conductor thin film include ITO, copper, copper-nickel alloy, silver and the like; and examples of the material constituting the flexible substrate include polyethylene terephthalate (PET) and the like; Each can be listed.
- the above-mentioned substrate may have through holes for dealing with a multilayer substrate.
- the photosensitive element of this embodiment is suitably applicable to the manufacture of a touch panel sensor by an etching method.
- An etching method is generally used for forming wiring (conductor pattern) in a touch panel sensor.
- the touch panel sensor is required to form a wiring having a much finer size than a normal printed wiring board.
- the etching method using a photosensitive element in the prior art is adopted, the amount of side etching of the formed conductor pattern is large, so that the product yield of touch panel sensor manufacturing is limited.
- the photosensitive element of this embodiment is excellent in reducing the amount of side etching, it is possible to manufacture the touch panel sensor with a high yield.
- the photosensitive resin composition layer may be laminated on only one side of the substrate surface, or may be laminated on both sides of the substrate if necessary.
- the heating temperature at this time is preferably 40 ° C. to 160 ° C.
- the photosensitive resin composition layer is exposed using an exposure machine.
- This exposure may be performed through the support without peeling the support, or may be performed after the support has been peeled off if necessary.
- a resist film (resist pattern) having a desired pattern can be obtained after passing through the development step described later.
- the patterned exposure may be performed by either a method of exposing through a photomask or a method of maskless exposure.
- the amount of exposure is determined by the illuminance of the light source and the exposure time. The amount of exposure may be measured using a photometer.
- a photomask is not used, and the exposure is performed directly on the substrate by a drawing device.
- the light source a semiconductor laser having a wavelength of 350 nm to 410 nm, an ultrahigh pressure mercury lamp, or the like is used.
- the drawing pattern is controlled by a computer, and the exposure amount is determined by the illuminance of the exposure light source and the moving speed of the substrate.
- the photosensitive element of the present embodiment is applied to a method of exposing through a photomask in that the effect of improving the resolution and reducing the amount of side etching is maximized.
- the unexposed portion of the photosensitive resin composition layer is removed with a developing solution. If there is a support on the photosensitive resin composition layer after exposure, it is preferable to remove the support before subjecting it to the developing step.
- a developing solution composed of an alkaline aqueous solution is used to develop and remove the unexposed portion to obtain a resist image.
- the alkaline aqueous solution for example, it is preferable to use an aqueous solution of Na 2 CO 3 , K 2 CO 3, or the like.
- the alkaline aqueous solution is selected according to the characteristics of the photosensitive resin composition layer, but it is preferable to use a Na 2 CO 3 aqueous solution having a concentration of 0.2% by mass to 2% by mass.
- a surfactant, a defoaming agent, a small amount of an organic solvent for accelerating development, or the like may be mixed in the alkaline aqueous solution.
- the temperature of the developer in the developing step is preferably kept constant in the range of 18 ° C. to 40 ° C.
- a resist pattern can be obtained by the above process.
- a heating step of 100 ° C. to 300 ° C. may be further performed. By carrying out this heating step, it is possible to further improve the chemical resistance.
- an appropriate heating furnace of hot air, infrared rays, far infrared rays or the like can be used.
- the method for forming the wiring board in the present embodiment includes a laminating step of forming a photosensitive resin composition layer on a substrate using the photosensitive element of the present embodiment, and an exposure step of exposing the photosensitive resin composition layer.
- the peeling step for peeling is included in the order described above.
- the laminating step, the exposure step, and the developing step are the same as those in the above [resist pattern forming method].
- a wiring board in which the conductor pattern is formed on the substrate can be obtained by going through the following conductor pattern forming step and peeling step.
- a conductor pattern can be formed on the substrate on which the resist pattern is formed by using a known etching method or plating method on the substrate surface (for example, copper surface) exposed by the developing step.
- the side etch amount of the resist pattern obtained by using the photosensitive resin composition of the present embodiment is preferably 5.5 ⁇ m or less. More preferably, it is 5.4 ⁇ m or less. Even more preferably, it is 5.3 ⁇ m or less.
- the top width of the copper line pattern is preferably 4.2 ⁇ m or more. More preferably, it is 4.5 ⁇ m or more. Even more preferably, it is 4.8 ⁇ m or more. This is preferable because it has an advantage that fine wiring can be formed.
- the method for forming a photosensitive resin composition, a photosensitive element, and a conductor pattern in the present embodiment is extremely suitable for manufacturing, for example, a printed wiring board, a lead frame, a base material having an uneven pattern, a semiconductor package, a touch panel sensor, and the like. Can be applied to.
- the method for forming the photosensitive resin composition, the photosensitive element, and the conductor pattern in the present embodiment is particularly suitable for manufacturing a touch panel sensor.
- the touch panel sensor is manufactured by forming a lead-out wiring composed of a conductor pattern formed by the above method on a flexible base material having a sputtered copper layer. Then, a touch panel can be obtained by laminating the liquid crystal display element, the above-mentioned touch panel sensor, and glass in this order.
- the evaluation values of the various parameters described above are measured values measured according to the measurement method in the examples described later.
- ⁇ Weight average molecular weight and dispersity> The sample was measured by gel permeation chromatography (GPC), and the weight average molecular weight (Mw), number average molecular weight (Mn), and number average molecular weight (Mn) were measured using a calibration curve of polystyrene (Showa Denko Corporation Shodex STANDARD SM-105). The degree of dispersion (Mw / Mn) was calculated. Specifically, it was measured under the following conditions using gel permeation chromatography manufactured by JASCO Corporation.
- the acid equivalent means the mass (gram) of a polymer having 1 equivalent of a carboxyl group in the molecule.
- a Hiranuma automatic titrator (COM-555) manufactured by Hiranuma Sangyo Co., Ltd.
- the acid equivalent was measured by a potentiometric titration method using a 0.1 mol / L sodium hydroxide aqueous solution.
- ⁇ Manufacturing of photosensitive element> Each component shown in Table 1 was mixed, and methyl ethyl ketone (MEK) was further added to prepare a photosensitive resin composition having a solid content concentration of 61% by mass.
- Table 2 shows a description of each component shown in Table 1.
- the obtained photosensitive resin composition was uniformly applied to a support film, a polyethylene terephthalate film having a thickness of 16 ⁇ m (manufactured by Toray Industries, Inc., product name “FB40”) using a bar coater, and then adjusted to 95 ° C. It was heated and dried in a warm dryer for 5 minutes to form a photosensitive resin composition layer having a thickness of 5 ⁇ m on the support film.
- a polyethylene film having a thickness of 33 ⁇ m (manufactured by Tamapoli Co., Ltd., product name “GF-858”), which is a protective layer, is attached on the surface of the photosensitive resin composition layer opposite to the support film to make the photosensitive resin composition layer photosensitive. Obtained a sex element.
- ⁇ Substrate used for evaluation> As the evaluation substrate, a flexible substrate in which ITO and thin-film copper of 5 ⁇ m or less were vapor-deposited in this order was used on PET.
- the top width of the resist obtained after exposure and development by a parallel light exposure machine is an exposure amount with a mask design value ratio of 0 ⁇ m to +1 ⁇ m. Exposed.
- Contrast Exposed area transmittance (%) / Unexposed area transmittance (%)
- a 1 mass% Na 2 CO 3 aqueous solution at 30 ° C. is used in an alkaline developing machine (manufactured by Fuji Kiko Co., Ltd., a developing machine for dry film) for a minimum developing time.
- the unexposed portion of the photosensitive resin composition layer was dissolved and removed by spraying for twice as long as. After the development, it was washed with water to obtain a substrate having a cured film for evaluation.
- the minimum development time refers to the minimum time required for the unexposed portion of the photosensitive resin composition layer to be completely dissolved and removed.
- ⁇ Copper line width uniformity> After developing by the method described in ⁇ Development> above, the copper line was measured over a length of 100 mm, the outermost end and the innermost end of the copper line were determined, and evaluated according to the following criteria. ⁇ : Distance from the outermost end of the line to the innermost end of the line is less than 0.2 ⁇ m ⁇ : Distance from the outermost end of the line to the innermost end of the line is 0.2 ⁇ m or more and less than 0.5 ⁇ m ⁇ : From the outermost end of the line to the line Distance to the innermost end is 0.5 ⁇ m or more
- Examples 1 to 5 and Comparative Examples 1 to 5 The composition of the photosensitive resin composition used in Examples and Comparative Examples is shown in Table 1, and the details of each component name shown in Table 1 are shown in Table 2.
- the blending amount of each component in Table 1 is a mass part in terms of solid content.
- Table 1 summarizes the evaluation results of adhesion, side etch amount, copper line width uniformity, and contrast performed using each photosensitive resin composition.
- the evaluation items "side etch amount”, “copper line width uniformity” and “contrast” are well-balanced, and the respective evaluation results are also good. It was. In particular, in Examples 2 and 4, good results were obtained even though the content of the compound (E) in the photosensitive resin composition was small.
- the photosensitive resin composition of the present embodiment can be used, for example, as a dry film for wiring formation, a dye coloring aid, and an inhibitor of etching solution from penetrating between the resist and the substrate, without limitation.
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Abstract
Description
[1]
(A)アルカリ可溶性高分子、
(B)エチレン性不飽和二重結合を有する化合物、
(C)光重合開始剤、
(D)染料、及び
(E)下記一般式(3)で表される化合物:
[2]
式中、R1及びR2は、いずれもアミノ基を有さず、水素原子又は炭素数1~3の有機基からなる群から独立して選択され、ただし、R1及びR2のうち少なくとも一つは、pKa5以下の酸性基を有する、項目1に記載の感光性樹脂組成物。
[3]
式中、R1及びR2は、いずれもアミノ基を有さず、R1及びR2のうち一方は、pKa5以下の酸性基を有する炭素数1~3の有機基であり、他方は水素原子である、項目2に記載の感光性樹脂組成物。
[4]
上記酸性基が、カルボキシ基、リン酸基、又はスルホン酸基のいずれかである、項目1~3のいずれか一項に記載の感光性樹脂組成物。
[5]
上記酸性基が、カルボキシ基である、項目4に記載の感光性樹脂組成物。
[6]
上記染料(D)が、ロイコ染料である、項目1~5のいずれか一項に記載の感光性樹脂組成物。
[7]
上記化合物(E)を、上記感光性樹脂組成物の固形分の総量に対して0.001~0.5質量%含有する、項目1~6のいずれか一項に記載の感光性樹脂組成物。
[8]
上記化合物(E)が、25℃で固体である、項目1~7のいずれか一項に記載の感光性樹脂組成物。
[9]
上記アルカリ可溶性高分子(A)が、その分子構造中に芳香環を含む、項目1~8のいずれか一項に記載の感光性樹脂組成物。
[10]
支持体と、上記支持体上に形成された、項目1~9のいずれか一項に記載の感光性樹脂組成物層とを備える、感光性エレメント。 As a result of diligent studies to solve the above problems, the inventors of the present application have obtained a specific structure of an alkali-soluble polymer, a compound having an ethylenically unsaturated double bond, a photopolymerization initiator, and a dye. It has been found that the above-mentioned problems can be solved by a photosensitive resin composition containing the compound, and the present invention has been completed. That is, the present invention is as follows.
[1]
(A) Alkali-soluble polymer,
(B) A compound having an ethylenically unsaturated double bond,
(C) Photopolymerization initiator,
(D) Dye and (E) Compound represented by the following general formula (3):
[2]
In the formula, neither R 1 nor R 2 has an amino group and is independently selected from the group consisting of a hydrogen atom or an organic group having 1 to 3 carbon atoms, except that at least R 1 and R 2 are selected. One is the photosensitive resin composition according to item 1, which has an acidic group of pKa5 or less.
[3]
Wherein, R 1 and R 2 are both having no amino group, one of R 1 and R 2 is an organic group having 1 to 3 carbon atoms having a pKa5 following acidic group and the other represents hydrogen The photosensitive resin composition according to item 2, which is an atom.
[4]
The photosensitive resin composition according to any one of items 1 to 3, wherein the acidic group is any one of a carboxy group, a phosphoric acid group, and a sulfonic acid group.
[5]
The photosensitive resin composition according to item 4, wherein the acidic group is a carboxy group.
[6]
The photosensitive resin composition according to any one of items 1 to 5, wherein the dye (D) is a leuco dye.
[7]
The photosensitive resin composition according to any one of items 1 to 6, wherein the compound (E) is contained in an amount of 0.001 to 0.5% by mass based on the total solid content of the photosensitive resin composition. ..
[8]
The photosensitive resin composition according to any one of items 1 to 7, wherein the compound (E) is a solid at 25 ° C.
[9]
The photosensitive resin composition according to any one of items 1 to 8, wherein the alkali-soluble polymer (A) contains an aromatic ring in its molecular structure.
[10]
A photosensitive element comprising a support and a photosensitive resin composition layer formed on the support according to any one of items 1 to 9.
本実施形態の感光性樹脂組成物は、(A)アルカリ可溶性高分子と、(B)エチレン性不飽和二重結合を有する化合物と、(C)光重合開始剤と、(D)染料と、(E)特定の複素環構造を有する化合物とを含有する。化合物(E)は、後述する一般式(3)で表される化合物である。本実施形態の感光性樹脂組成物は、上記構成を有することによって、サイドエッチ量が低減され、銅ライン幅の均一性に優れ、露光時に染料の発色を促し、露光部の視認性に優れた感光性樹脂組成物を提供することができる。
その理由は未だ明らかではなく、本発明は理論に限定されるものではないが、発明者らは、以下のように推察している。
サイドエッチ量の低減には、硬化したレジストと銅界面との密着力及び反応率が重要である。エッチング処理により、エッチング液がレジスト-銅界面に染み込むため、ドライフィルムの線幅とエッチング後の銅ライン幅の差(サイドエッチ)が発生する。レジスト-銅界面の相互作用が強固であれば、エッチング液が染み込みにくく、サイドエッチ量が小さくなる。銅との相互作用が強い化合物としては、イミダゾール・トリアゾール・テトラゾール-などが知られているが、これらの化合物の疎水性が高いと、現像後にも基板上に残り、エッチング残を発生するという問題がある。そこで、発明者らは、アルカリ水溶液可溶性の高い、pKa5以下の酸性基を有する化合物(E)を用いることで、エッチング残を低減できることを見いだした。また、サイドエッチ量の低減には、膨潤量が小さい方が有利なため、硬化後レジストの反応率も重要である。特にテトラゾール-は、約200nmの短波長域でラジカル開裂するため、これらが多く存在する特に銅界面(レジスト底部)の反応率が上昇し、レジスト底部の膨潤率が抑えられ、低サイドエッチに寄与すると考えられる。
他方、染料の発色は、露光部の視認性の点で好ましく、検査機等が露光のための位置合わせマーカーを読み取る場合、露光部と未露光部とのコントラストが大きい方が認識し易く有利である。露光時に反応したpKa5以下の酸性基を有する化合物(E)が、染料、好ましくはロイコクリスタルバイオレット(DMA)のカチオンを安定化するために発色が良好になり、露光コントラストが良好になると考えられる。 [Photosensitive resin composition]
The photosensitive resin composition of the present embodiment comprises (A) an alkali-soluble polymer, (B) a compound having an ethylenically unsaturated double bond, (C) a photopolymerization initiator, and (D) a dye. (E) Contains a compound having a specific heterocyclic structure. The compound (E) is a compound represented by the general formula (3) described later. By having the above structure, the photosensitive resin composition of the present embodiment has a reduced amount of side etch, excellent uniformity of copper line width, promotes color development of the dye during exposure, and has excellent visibility of the exposed portion. A photosensitive resin composition can be provided.
The reason is not yet clear, and the present invention is not limited to theory, but the inventors speculate as follows.
In order to reduce the amount of side etch, the adhesion and reaction rate between the cured resist and the copper interface are important. Since the etching solution soaks into the resist-copper interface by the etching process, a difference (side etch) between the line width of the dry film and the copper line width after etching occurs. If the interaction between the resist and the copper interface is strong, the etching solution is less likely to permeate and the amount of side etching is reduced. As a compound having a strong interaction with copper, imidazole, triazole, tetrazole, etc. are known, but if these compounds have high hydrophobicity, they remain on the substrate even after development, and there is a problem that an etching residue is generated. There is. Therefore, the inventors have found that the etching residue can be reduced by using the compound (E) having an acidic group of pKa5 or less, which is highly soluble in an alkaline aqueous solution. Further, in order to reduce the amount of side etch, it is advantageous that the amount of swelling is small, so that the reaction rate of the resist after curing is also important. In particular, tetrazol- radically cleaves in a short wavelength region of about 200 nm, so that the reaction rate of the copper interface (resist bottom), where many of them are present, increases, the swelling rate of the resist bottom is suppressed, and contributes to low side etching. It is thought that.
On the other hand, the color development of the dye is preferable from the viewpoint of visibility of the exposed portion, and when the inspection machine or the like reads the alignment marker for exposure, it is advantageous that the contrast between the exposed portion and the unexposed portion is large for easy recognition. is there. It is considered that the compound (E) having an acidic group of pKa5 or less reacted at the time of exposure stabilizes the cation of the dye, preferably leuco crystal violet (DMA), so that the color development becomes good and the exposure contrast becomes good.
(A)アルカリ可溶性高分子は、後述する第一の単量体の少なくとも1種を重合することにより得られるものであることが好ましい。また、(A)アルカリ可溶性高分子は、第一の単量体の少なくとも1種と、後述する第二の単量体の少なくとも1種とを共重合することにより得られるものであることがより好ましい。 <(A) Alkali-soluble polymer>
The alkali-soluble polymer (A) is preferably obtained by polymerizing at least one of the first monomers described later. Further, the alkali-soluble polymer (A) can be obtained by copolymerizing at least one kind of the first monomer and at least one kind of the second monomer described later. preferable.
(A)アルカリ可溶性高分子の重量平均分子量及び分散度が上記の範囲にあることは、適度の現像性、高い塗膜強度、及びレジスト厚みの均一性を得られる観点で好ましい。 (A) The weight average molecular weight of the alkali-soluble polymer (hereinafter, may be abbreviated as "Mw") (when a plurality of types of alkali-soluble polymers are used in combination, it means the entire Mw). It is preferably 5,000 to 500,000, more preferably 5,000 to 100,000, and even more preferably 10,000 to 65,000. Dispersity (Mw / Mn), which is the ratio of the weight average molecular weight to the number average molecular weight (hereinafter, may be abbreviated as “Mn”) (when a plurality of types of alkali-soluble polymers are used in combination, the total dispersion thereof. The degree) is preferably 1.0 to 6.0, more preferably 1.5 to 5.0, further preferably 2.0 to 5.0, and 2.5 to 5.0. It is even more preferably 4.5, and particularly preferably 3.0 to 4.2.
It is preferable that the weight average molecular weight and the dispersity of the alkali-soluble polymer (A) are in the above ranges from the viewpoints of obtaining appropriate developability, high coating film strength, and uniformity of resist thickness.
(A-1)Mwが50,000未満であるアルカリ可溶性高分子、及び
(A-2)Mwが50,000以上であるアルカリ可溶性高分子、
を含むことが、特に好ましい。 (A) When a plurality of types of alkali-soluble polymers are used in combination as the alkali-soluble polymer,
(A-1) an alkali-soluble polymer having an Mw of less than 50,000, and (A-2) an alkali-soluble polymer having an Mw of 50,000 or more.
Is particularly preferable.
一方、上記アルカリ可溶性高分子(A-2)のMwは、50,000~100,000であることがより好ましく、50,000~75,000であることが更に好ましく、50,000~65,000であることが特に好ましい。アルカリ可溶性高分子(A-2)のMwがこの範囲にあることは、本実施形態の感光性樹脂組成物を感光性エレメント(「ドライフィルムレジスト」ともいう。)に適用する場合の製品ライフをより長いものとする観点で好ましい。 The Mw of the alkali-soluble polymer (A-1) is more preferably 5,000 or more and less than 50,000, further preferably 10,000 to 45,000, and 10,000 to 35,000. Is particularly preferable. It is preferable that the Mw of the alkali-soluble polymer (A-1) is in this range from the viewpoint of achieving both developability and resolvability.
On the other hand, the Mw of the alkali-soluble polymer (A-2) is more preferably 50,000 to 100,000, further preferably 50,000 to 75,000, and 50,000 to 65, It is particularly preferably 000. The fact that the Mw of the alkali-soluble polymer (A-2) is in this range indicates the product life when the photosensitive resin composition of the present embodiment is applied to a photosensitive element (also referred to as “dry film resist”). It is preferable from the viewpoint of making it longer.
アルカリ可溶性高分子(A-2)成分の、感光性樹脂組成物の固形分の総量に対して含有割合は、好ましくは5質量%以上50質量%以下であり、より好ましくは15質量%以上48質量%以下であり、更に好ましくは18質量%以上45質量%以下である。(A-2)成分の使用割合を上記の範囲に設定することは、本実施形態の感光性樹脂組成物を感光性エレメント(ドライフィルムレジスト)に適用する場合の製品ライフをより長いものとする観点で好ましい。 The content ratio of the alkali-soluble polymer (A-1) component to the total solid content of the photosensitive resin composition is preferably 3% by mass or more and 30% by mass or less, and more preferably 5% by mass or more and 25% by mass or more. It is less than or equal to, more preferably 10% by mass or more and 20% by mass or less. It is preferable to set the usage ratio of the component (A-1) in the above range from the viewpoint of achieving both resolution and a small amount of side etch.
The content ratio of the alkali-soluble polymer (A-2) component with respect to the total solid content of the photosensitive resin composition is preferably 5% by mass or more and 50% by mass or less, and more preferably 15% by mass or more and 48. It is 1% by mass or less, and more preferably 18% by mass or more and 45% by mass or less. Setting the usage ratio of the component (A-2) within the above range makes the product life longer when the photosensitive resin composition of the present embodiment is applied to a photosensitive element (dry film resist). Preferred from the viewpoint.
(B)エチレン性不飽和二重結合を有する化合物は、その構造中にエチレン性不飽和二重結合を有することによって重合性を有する化合物である。このような化合物としては、ポリアルキレンオキシドの片方の末端に(メタ)アクリル酸を付加した化合物、ポリアルキレンオキシドの片方の末端に(メタ)アクリル酸を付加し、他方の末端をアルキルエーテル又はアリルエーテル化した化合物、等(第1群の化合物);アルキレンオキシド鎖の両末端に(メタ)アクリロイル基を有する化合物、エチレンオキシド鎖とプロピレンオキシド鎖とがランダム又はブロックで結合したアルキレンオキシド鎖の両末端に(メタ)アクリロイル基を有する化合物、ビスフェノールAを変性した化合物、等(第2群の化合物);一分子中に3個以上の(メタ)アクリロイル基を有する化合物、等(第3群の化合物);等を挙げることができる。 <(B) Compound having an ethylenically unsaturated double bond>
(B) The compound having an ethylenically unsaturated double bond is a compound having a polymerizable property by having an ethylenically unsaturated double bond in its structure. Such compounds include a compound in which (meth) acrylic acid is added to one end of polyalkylene oxide, and (meth) acrylic acid is added to one end of polyalkylene oxide, and the other end is alkyl ether or allyl. Ethereated compounds, etc. (Group 1 compounds); compounds having (meth) acryloyl groups at both ends of the alkylene oxide chain, both ends of the alkylene oxide chain in which the ethylene oxide chain and the propylene oxide chain are randomly or blocked. Compounds having (meth) acryloyl groups, compounds modified with bisphenol A, etc. (compounds of the second group); compounds having three or more (meth) acryloyl groups in one molecule, etc. (compounds of the third group) ); Etc. can be mentioned.
ビスフェノールAにアルキレンオキシドを付加したポリアルキレングリコールの両末端にエチレン性不飽和二重結合を有する化合物等を挙げることができる。 Specific examples of the other compounds in the second group include tetraethylene glycol di (meth) acrylate, pentaethylene glycol di (meth) acrylate, hexaethylene glycol di (meth) acrylate, and heptaethylene glycol di (meth). Polyethylene glycols such as acrylates, octaethylene glycol di (meth) acrylates, nonaethylene glycol di (meth) acrylates, decaethylene glycol di (meth) acrylates, and compounds having (meth) acryloyl groups at both ends of a 12 mol ethylene oxide chain. -Le (meth) glycol; polypropylene glycol di (meth) acrylic; polybutylene glycol di (meth) acrylic and the like can be mentioned. As the polyalkylene oxide di (meth) acrylate compound containing an ethylene oxide group and a propylene oxide group in the compound, for example, ethylene oxide was further added to both ends by an average of 3 mol to polypropylene glycol to which an average of 12 mol of propylene oxide was added. Examples thereof include dimethacrylate of glycol, and dimethacrylate of glycol in which ethylene oxide is further added to both ends by an average of 15 mol each of polypropylene glycol to which an average of 18 mol of propylene oxide is added.
Examples thereof include compounds having ethylenically unsaturated double bonds at both ends of polyalkylene glycol in which alkylene oxide is added to bisphenol A.
ビスフェノールAにアルキレンオキシドを付加して変性するには、例えば、エチレンオキシド変性、プロピレンオキシド変性、ブチレンオキシド変性、ペンチレンオキシド変性、へキシレンオキシド変性等が知られている。ビスフェノールAにエチレンオキシドを付加したポリアルキレングリコールの両末端に(メタ)アクリロイル基を有する化合物が好ましい。 As the compound obtained by modifying bisphenol A among the compounds of the second group, it is possible to use a compound having an ethylenically unsaturated double bond at both ends of a polyalkylene glycol obtained by adding an alkylene oxide to bisphenol A in terms of resolution. And from the viewpoint of adhesion, it is preferable. The ethylenically unsaturated double bond in this compound is preferably contained in the compound in the form of being contained in the (meth) acryloyl group.
For denaturation of bisphenol A by adding alkylene oxide, for example, ethylene oxide denaturation, propylene oxide denaturation, butylene oxide denaturation, pentylene oxide denaturation, hexylene oxide denaturation and the like are known. A compound having (meth) acryloyl groups at both ends of a polyalkylene glycol obtained by adding ethylene oxide to bisphenol A is preferable.
より具体的には、例えば、トリメチロールプロパンのエチレンオキシド(EO)3モル変性トリアクリレート、トリメチロールプロパンのEO6モル変性トリアクリレート、トリメチロールプロパンのEO9モル変性トリアクリレート、トリメチロールプロパンのEO12モル変性トリアクリレート等を挙げることができる。このような化合物としては、例えば、グリセリンのEO3モル変性トリアクリレート(例えば新中村化学工業(株)製A-GLY-3E)、グリセリンのEO9モル変性トリアクリレート(例えば新中村化学工業(株)製A-GLY-9E)、グリセリンのEO6モル及びプロピレンオキシド(PO)6モル変性トリアクリレート(A-GLY-0606PE)、グリセリンのEO9モルPO9モル変性トリアクリレート(A-GLY-0909PE)等を挙げることができる。更にペンタエリスリトールの4EO変性テトラアクリレート(例えばサートマージャパン(株)社製SR-494)、ペンタエリスリトールの35EO変性テトラアクリレート(例えば新中村化学工業(株)社製NKエステルATM-35E)等を挙げることができる。 In the third group of compounds, an alkyleneoxy group such as an ethyleneoxy group, a propyleneoxy group, or a butyleneoxy group is added to a central skeleton having 3 mol or more of groups to which an alkylene oxide group can be added in the molecule. It is obtained by (meth) acrylate-forming the obtained alcohol. Examples of the compound capable of forming the central skeleton include glycerin, trimethylolpropane, pentaerythritol, dipentaerythritol, and isocyanurate ring.
More specifically, for example, trimethylolpropane ethylene oxide (EO) 3 molar modified triacrylate, trimethylolpropane EO 6 molar modified triacrylate, trimethylolpropane EO 9 molar modified triacrylate, trimethylolpropane EO 12 molar modified triacrylate. Acrylate and the like can be mentioned. Examples of such a compound include EO3 molar modified triacrylate of glycerin (for example, A-GLY-3E manufactured by Shin Nakamura Chemical Industry Co., Ltd.) and EO9 molar modified triacrylate of glycerin (for example, manufactured by Shin Nakamura Chemical Industry Co., Ltd.). A-GLY-9E), EO6 mol of glycerin and 6 mol of propylene oxide (PO) modified triacrylate (A-GLY-0606PE), EO9 mol of glycerin PO9 mol modified triacrylate (A-GLY-0909PE), etc. Can be done. Further, 4EO-modified tetraacrylate of pentaerythritol (for example, SR-494 manufactured by Sartmer Japan Co., Ltd.), 35EO-modified tetraacrylate of pentaerythritol (for example, NK ester ATM-35E manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) and the like are mentioned. be able to.
このような化合物の具体例としては、例えば、エトキシ化イソシアヌル酸トリ(メタ)アクリレート、ε-カプロラクトン変性トリス(2-(メタ)アクリロキシエチル)イソシアヌレート、トリアリルイソシアヌレート、下記式:
このような化合物としては市販品を用いることができ、例えば、UA-7100、A-9300-1CL(以上、新中村化学工業社製);アロニックスM-327(東亞合成社製)等を挙げることができる。 Isocyanurate compounds can also be mentioned as compounds having an ethylenically unsaturated double bond.
Specific examples of such compounds include tri (meth) acrylate ethoxylated isocyanuric acid, ε-caprolactone-modified tris (2- (meth) acryloxyethyl) isocyanurate, triallyl isocyanurate, and the following formulas:
Commercially available products can be used as such compounds, and examples thereof include UA-7100, A-9300-1CL (all manufactured by Shin-Nakamura Chemical Co., Ltd.); Aronix M-327 (manufactured by Toagosei Co., Ltd.) and the like. Can be done.
(C)光重合開始剤としては、例えば、ヘキサアリールビイミダゾール化合物、N-アリール-α-アミノ酸化合物、キノン化合物、芳香族ケトン化合物、アセトフェノン化合物、アシルフォスフィンオキサイド化合物、ベンゾイン化合物、ベンゾインエーテル化合物、ジアルキルケタール化合物、チオキサントン化合物、ジアルキルアミノ安息香酸エステル化合物、オキシムエステル化合物、アクリジン化合物、ピラゾリン誘導体、N-アリールアミノ酸のエステル化合物、ハロゲン化合物等が挙げられる。 <(C) Photopolymerization Initiator>
Examples of the photopolymerization initiator (C) include hexaarylbiimidazole compounds, N-aryl-α-amino acid compounds, quinone compounds, aromatic ketone compounds, acetophenone compounds, acylphosphine oxide compounds, benzoin compounds, and benzoin ether compounds. , Dialkyl ketal compounds, thioxanthone compounds, dialkylaminobenzoic acid ester compounds, oxime ester compounds, aclysine compounds, pyrazoline derivatives, N-aryl amino acid ester compounds, halogen compounds and the like.
アセトフェノン化合物としては、例えば、2-ヒドロキシ-2-メチル-1-フェニルプロパン-1-オン、1-(4-イソプロピルフェニル)-2-ヒドロキシ-2-メチルプロパン-1-オン、1-(4-ドデシルフェニル)-2-ヒドロキシ-2-メチルプロパン-1-オン、4-(2-ヒドロキシエトキシ)-フェニル(2-ヒドロキシ-2-プロピル)ケトン、1-ヒドロキシシクロヘキシルフェニルケトン、2-ベンジル-2-ジメチルアミノ-1-(4-モルホリノフェニル)-ブタノン-1、2-メチル-1-[4-(メチルチオ)フェニル]-2-モルフォリノ-プロパノン-1等を挙げることができる。アセトフェノン化合物の市販品としては、例えば、チバ・スペシャリティ・ケミカルズ社製のイルガキュア-907、イルガキュア-369、及びイルガキュア-379を挙げることができる。密着性の観点からは、4,4’-ビス(ジエチルアミノ)ベンゾフェノンが好ましい。 Examples of the aromatic ketone compound include benzophenone, Michler's ketone [4,4'-bis (dimethylamino) benzophenone], 4,4'-bis (diethylamino) benzophenone, 4-methoxy-4'-dimethylaminobenzophenone and the like. be able to.
Examples of the acetophenone compound include 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropan-1-one, 1- (4). -Dodecylphenyl) -2-hydroxy-2-methylpropan-1-one, 4- (2-hydroxyethoxy) -phenyl (2-hydroxy-2-propyl) ketone, 1-hydroxycyclohexylphenyl ketone, 2-benzyl- Examples thereof include 2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propanone-1. Commercially available products of the acetophenone compound include, for example, Irgacure-907, Irgacure-369, and Irgacure-379 manufactured by Ciba Specialty Chemicals. From the viewpoint of adhesion, 4,4'-bis (diethylamino) benzophenone is preferable.
ジアルキルケタール化合物としては、例えば、ベンジルジメチルケタール、ベンジルジエチルケタール等を挙げることができる。
チオキサントン化合物としては、例えば、2,4-ジエチルチオキサントン、2,4-ジイソプロピルチオキサントン、2-クロルチオキサントン等を挙げることができる。
ジアルキルアミノ安息香酸エステル化合物としては、例えば、ジメチルアミノ安息香酸エチル、ジエチルアミノ安息香酸エチル、エチル-p-ジメチルアミノベンゾエート、2-エチルヘキシル-4-(ジメチルアミノ)ベンゾエート等を挙げることができる。 Examples of the benzoin compound and the benzoin ether compound include benzoin, benzoin ethyl ether, benzoin phenyl ether, methyl benzoin, ethyl benzoin and the like.
Examples of the dialkyl ketal compound include benzyl dimethyl ketal and benzyl diethyl ketal.
Examples of the thioxanthone compound include 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone and the like.
Examples of the dialkylaminobenzoic acid ester compound include ethyl dimethylaminobenzoate, ethyl diethylaminobenzoate, ethyl-p-dimethylaminobenzoate, 2-ethylhexyl-4- (dimethylamino) benzoate and the like.
本実施形態の感光性樹脂組成物は、染料(D)を含む。感光性樹脂組成物が染料を含有することにより露光部分が発色するので視認性の点で好ましく、また、検査機等が露光のための位置合わせマーカーを読み取る場合、露光部と未露光部とのコントラストが大きい方が認識し易く有利である。本実施形態における化合物(E)と組み合せたときに、露光部と未露光部とのコントラストが大きい染料としては、好ましくはロイコ染料及びフルオラン染料であり、より好ましくはロイコ染料である。 <(D) Dye>
The photosensitive resin composition of the present embodiment contains a dye (D). Since the exposed portion develops color when the photosensitive resin composition contains a dye, it is preferable in terms of visibility, and when an inspection machine or the like reads an alignment marker for exposure, the exposed portion and the unexposed portion are used. The larger the contrast, the easier it is to recognize and the more advantageous it is. When combined with the compound (E) in the present embodiment, the dyes having a large contrast between the exposed portion and the unexposed portion are preferably leuco dye and fluorane dye, and more preferably leuco dye.
ロイコ染料の具体例としては、例えば、ロイコクリスタルバイオレット(トリス[4-(ジメチルアミノ)フェニル]メタン:DMA)、3,3-ビス(p-ジメチルアミノフェニル)-6-ジメチルアミノフタリド、等を挙げることができる。これらのうち、ロイコクリスタルバイオレット(DMA)が好ましい。 The leuco dye can be blended in the photosensitive resin composition of the present embodiment in order to impart suitable color development property and excellent peeling property to the resist cured film.
Specific examples of the leuco dye include leuco crystal violet (tris [4- (dimethylamino) phenyl] methane: DMA), 3,3-bis (p-dimethylaminophenyl) -6-dimethylaminophthalide, and the like. Can be mentioned. Of these, leuco crystal violet (DMA) is preferred.
本実施形態において、化合物(E)は、アミノ基を有さず、かつ、pKa5以下の酸性基と、窒素原子を4個有する複素環構造とを有する化合物である。化合物(E)は、常温(25℃)で固体であることが好ましい。 <(E) Compound having a specific heterocyclic structure>
In the present embodiment, the compound (E) is a compound having no amino group, an acidic group having a pKa of 5 or less, and a heterocyclic structure having four nitrogen atoms. Compound (E) is preferably solid at room temperature (25 ° C.).
本実施形態の感光性樹脂組成物は、上記に説明した(A)~(E)成分のみを含有していてもよいし、これらとともにその他の成分を含有していてもよい。ここで使用できるその他の成分としては、例えば安定化剤を挙げることができる。 <Other ingredients>
The photosensitive resin composition of the present embodiment may contain only the components (A) to (E) described above, or may contain other components together with these components. Other components that can be used here include, for example, stabilizers.
本実施形態では、上記のような感光性樹脂組成物に溶媒を添加することにより、感光性樹脂組成物調合液を調製することができる。ここで使用される好適な溶媒としては、メチルエチルケトン(MEK)等のケトン;メタノール、エタノール、イソプロピルアルコール等のアルコール等が挙げられる。感光性樹脂組成物調合液の粘度が、25℃において500mPa・sec~4,000mPa・secとなるように、感光性樹脂組成物に溶媒を添加して調合液を調製することが好ましい。 [Photosensitive resin composition formulation]
In the present embodiment, the photosensitive resin composition preparation solution can be prepared by adding a solvent to the above-mentioned photosensitive resin composition. Suitable solvents used here include ketones such as methyl ethyl ketone (MEK); alcohols such as methanol, ethanol and isopropyl alcohol. It is preferable to add a solvent to the photosensitive resin composition to prepare the preparation so that the viscosity of the photosensitive resin composition preparation is 500 mPa · sec to 4,000 mPa · sec at 25 ° C.
本実施形態における感光性エレメント(ドライフィルムレジストともいう。)は、支持体と、上述の本実施形態の感光性樹脂組成物から当該支持体上に形成された感光性樹脂組成物層とを備える。本実施形態の感光性エレメントは、必要により、前記感光性樹脂組成物層の支持体と反対側の表面に保護層を有していてもよい。 [Photosensitive element]
The photosensitive element (also referred to as a dry film resist) in the present embodiment includes a support and a photosensitive resin composition layer formed on the support from the above-mentioned photosensitive resin composition of the present embodiment. .. If necessary, the photosensitive element of the present embodiment may have a protective layer on the surface opposite to the support of the photosensitive resin composition layer.
支持体としては、露光光源から放射される光を透過する透明な基材(フィルム基材、以下「支持フィルム」ともいう。)が好ましい。このような支持フィルムとしては、例えば、ポリエチレンテレフタレートフィルム、ポリビニルアルコールフィルム、ポリ塩化ビニルフィルム、塩化ビニル共重合体フィルム、ポリ塩化ビニリデンフィルム、塩化ビニリデン共重合フィルム、ポリメタクリル酸メチル共重合体フィルム、ポリスチレンフィルム、ポリアクリロニトリルフィルム、スチレン共重合体フィルム、ポリアミドフィルム、セルロース誘導体フィルム等が挙げられる。これらのフィルムとしては、必要に応じ延伸されたものも使用可能である。
支持体のヘーズとしては、0.01%~5.0%が好ましく、0.01%~3.5%がより好ましく、0.01%~2.5%が更に好ましく、0.01%~1.0%がより更に好ましい。
支持体の厚みは、薄い方が画像形成性及び経済性の面で有利であるが、強度を維持する必要がある。これら双方を考慮すると、10~30μmの支持体を好ましく用いることができる。 [Support]
As the support, a transparent base material (film base material, hereinafter also referred to as “support film”) that transmits light emitted from an exposure light source is preferable. Examples of such a support film include polyethylene terephthalate film, polyvinyl alcohol film, polyvinyl chloride film, vinyl chloride copolymer film, polyvinylidene chloride film, vinylidene chloride copolymer film, and polymethylmethacrylate copolymer film. Examples thereof include polystyrene films, polyacrylonitrile films, styrene copolymer films, polyamide films, and cellulose derivative films. As these films, stretched films can also be used if necessary.
The haze of the support is preferably 0.01% to 5.0%, more preferably 0.01% to 3.5%, still more preferably 0.01% to 2.5%, and 0.01% to. 1.0% is even more preferable.
The thinner the support, the more advantageous in terms of image formation and economy, but it is necessary to maintain the strength. Considering both of these, a support having a thickness of 10 to 30 μm can be preferably used.
本実施形態の感光性エレメントにおける感光性樹脂組成物層は、上述した本実施形態の感光性樹脂組成物から成る層である。感光性樹脂組成物層の形成に使用する感光性樹脂組成物が溶媒を含有している場合、該溶媒は感光性樹脂組成物層においては除去されていることが好ましいが、溶媒が残存していてもかまわない。
本実施形態の感光性エレメントにおける感光性樹脂組成物層の厚みは、好ましくは5~100μmであり、より好ましくは5~50μmである。この厚みが薄いほど解像度は向上し、厚いほど膜強度が向上する。従って、該組成物層の厚みは、用途に応じて上記の範囲内で適宜選択することができる。 [Photosensitive resin composition layer]
The photosensitive resin composition layer in the photosensitive element of the present embodiment is a layer made of the above-mentioned photosensitive resin composition of the present embodiment. When the photosensitive resin composition used for forming the photosensitive resin composition layer contains a solvent, the solvent is preferably removed in the photosensitive resin composition layer, but the solvent remains. It doesn't matter.
The thickness of the photosensitive resin composition layer in the photosensitive element of the present embodiment is preferably 5 to 100 μm, more preferably 5 to 50 μm. The thinner the thickness, the better the resolution, and the thicker the thickness, the better the film strength. Therefore, the thickness of the composition layer can be appropriately selected within the above range depending on the application.
本実施形態の感光性エレメントにおける保護層の重要な特性は、感光性樹脂組成物層との密着力が、支持体と感光性樹脂組成物層との密着力よりも十分に小さく、容易に剥離できることである。保護層としては、例えば、ポリエチレンフィルム、ポリプロピレンフィルム等が好ましく使用できる他、例えば特開昭59-202457号公報に開示された剥離性の優れたフィルムを用いることができる。
保護層の厚みは、10~100μmが好ましく、10~50μmがより好ましい。 [Protective film]
An important property of the protective layer in the photosensitive element of the present embodiment is that the adhesive force with the photosensitive resin composition layer is sufficiently smaller than the adhesive force between the support and the photosensitive resin composition layer, and the protective layer can be easily peeled off. You can do it. As the protective layer, for example, a polyethylene film, a polypropylene film or the like can be preferably used, and for example, a film having excellent peelability disclosed in JP-A-59-202457 can be used.
The thickness of the protective layer is preferably 10 to 100 μm, more preferably 10 to 50 μm.
本実施形態の感光性エレメントは、支持体及び感光性樹脂組成物層、並びに必要により保護層を順次積層することにより、製造することができる。支持体、感光性樹脂組成物層、及び保護層の積層方法としては、公知の方法を採用することができる。
例えば、本実施形態の感光性樹脂組成物を前述の感光性樹脂組成物調合液として調製し、先ず、支持体上にバーコーター又はロールコーターを用いて塗布して乾燥させ、支持体上に該感光性樹脂組成物から成る感光性樹脂組成物層を形成する。次いで、必要により、形成された感光性樹脂組成物層上に保護層を積層することにより、感光性エレメントを製造することができる。 [Manufacturing method of photosensitive element]
The photosensitive element of the present embodiment can be manufactured by sequentially laminating a support, a photosensitive resin composition layer, and, if necessary, a protective layer. As a method for laminating the support, the photosensitive resin composition layer, and the protective layer, a known method can be adopted.
For example, the photosensitive resin composition of the present embodiment is prepared as the above-mentioned photosensitive resin composition preparation solution, first applied onto a support using a bar coater or a roll coater, dried, and then the mixture is applied onto the support. A photosensitive resin composition layer composed of a photosensitive resin composition is formed. Then, if necessary, the photosensitive element can be manufactured by laminating a protective layer on the formed photosensitive resin composition layer.
上記のような感光性エレメントを用いて、基板上にレジストパターンを形成することができる。レジストパターンの形成方法は、本実施形態の感光性エレメントを用いて基板の上に感光性樹脂組成物層を形成するラミネート工程、該感光性樹脂組成物層を露光する露光工程、及び該感光性樹脂組成物層の未露光部を現像液で除去することによってレジストパターンを形成する現像工程を、上記に記載の順に含む。 [Method of forming resist pattern]
A resist pattern can be formed on the substrate by using the photosensitive element as described above. The method for forming the resist pattern includes a laminating step of forming a photosensitive resin composition layer on a substrate using the photosensitive element of the present embodiment, an exposure step of exposing the photosensitive resin composition layer, and the photosensitive. A developing step of forming a resist pattern by removing an unexposed portion of the resin composition layer with a developing solution is included in the order described above.
それぞれ挙げることができる。上記の基板は、多層基板に対応するためのスルーホールを有していてもよい。 In the method for forming a resist pattern of the present embodiment, first, in the laminating step, a photosensitive resin composition layer is formed on a substrate using a laminator. Specifically, when the photosensitive element has a protective layer, the protective layer is peeled off, and then the photosensitive resin composition layer is heat-bonded to the substrate surface using a laminator and laminated. Examples of the substrate material used include copper, stainless steel (SUS), glass, indium tin oxide (ITO), and a flexible base material on which a conductor thin film is laminated. Examples of the conductor thin film include ITO, copper, copper-nickel alloy, silver and the like; and examples of the material constituting the flexible substrate include polyethylene terephthalate (PET) and the like;
Each can be listed. The above-mentioned substrate may have through holes for dealing with a multilayer substrate.
この露光をパターン状に行うことにより、後述の現像工程を経由した後、所望のパターンを有するレジスト膜(レジストパターン)を得ることができる。パターン状の露光は、フォトマスクを介して露光する方法、及びマスクレス露光の何れの方法によってもよい。フォトマスクを介して露光する場合、露光量は、光源照度及び露光時間により決定される。露光量は、光量計を用いて測定してもよい。
マスクレス露光においては、フォトマスクを使用せず、基板上に直接描画装置によって露光する。光源としては、波長350nm~410nmの半導体レーザー、超高圧水銀灯等が用いられる。マスクレス露光において、描画パターンはコンピューターによって制御され、露光量は、露光光源の照度及び基板の移動速度によって決定される。
本実施形態の感光性エレメントは、フォトマスクを介して露光する方法に適用することが、解像度を向上し、かつサイドエッチ量を低減する効果が最大限に発揮される点で、好ましい。 Next, in the exposure step, the photosensitive resin composition layer is exposed using an exposure machine. This exposure may be performed through the support without peeling the support, or may be performed after the support has been peeled off if necessary.
By performing this exposure in a pattern, a resist film (resist pattern) having a desired pattern can be obtained after passing through the development step described later. The patterned exposure may be performed by either a method of exposing through a photomask or a method of maskless exposure. When exposing through a photomask, the amount of exposure is determined by the illuminance of the light source and the exposure time. The amount of exposure may be measured using a photometer.
In maskless exposure, a photomask is not used, and the exposure is performed directly on the substrate by a drawing device. As the light source, a semiconductor laser having a wavelength of 350 nm to 410 nm, an ultrahigh pressure mercury lamp, or the like is used. In maskless exposure, the drawing pattern is controlled by a computer, and the exposure amount is determined by the illuminance of the exposure light source and the moving speed of the substrate.
It is preferable that the photosensitive element of the present embodiment is applied to a method of exposing through a photomask in that the effect of improving the resolution and reducing the amount of side etching is maximized.
現像工程においては、アルカリ水溶液から成る現像液を用いて、未露光部を現像除去し、レジスト画像を得る。アルカリ水溶液としては、例えば、Na2CO3、K2CO3等の水溶液を用いることが好ましい。アルカリ水溶液は、感光性樹脂組成物層の特性に合わせて選択されるが、0.2質量%~2質量%の濃度のNa2CO3水溶液を用いることが好ましい。該アルカリ水溶液中には、界面活性剤、消泡剤、現像を促進させるための少量の有機溶剤等を混入させてもよい。
現像工程における現像液の温度は、18℃~40℃の範囲で一定温度に保つことが好ましい。 Next, in the developing step, the unexposed portion of the photosensitive resin composition layer is removed with a developing solution. If there is a support on the photosensitive resin composition layer after exposure, it is preferable to remove the support before subjecting it to the developing step.
In the developing step, a developing solution composed of an alkaline aqueous solution is used to develop and remove the unexposed portion to obtain a resist image. As the alkaline aqueous solution, for example, it is preferable to use an aqueous solution of Na 2 CO 3 , K 2 CO 3, or the like. The alkaline aqueous solution is selected according to the characteristics of the photosensitive resin composition layer, but it is preferable to use a Na 2 CO 3 aqueous solution having a concentration of 0.2% by mass to 2% by mass. A surfactant, a defoaming agent, a small amount of an organic solvent for accelerating development, or the like may be mixed in the alkaline aqueous solution.
The temperature of the developer in the developing step is preferably kept constant in the range of 18 ° C. to 40 ° C.
本実施形態における配線板の形成方法は、本実施形態の感光性エレメントを用いて基板の上に感光性樹脂組成物層を形成するラミネート工程、該感光性樹脂組成物層を露光する露光工程、該感光性樹脂組成物層の未露光部を現像液で除去することによってレジストパターンを形成する現像工程、該レジストパターンが形成された基板をエッチング又はめっきする導体パターン形成工程、及び該レジストパターンを剥離する剥離工程を、上記に記載の順に含む。上記の方法により、基板上に所望の導線パターンが形成されて成る配線板を得ることができる。 [Method of forming a wiring board]
The method for forming the wiring board in the present embodiment includes a laminating step of forming a photosensitive resin composition layer on a substrate using the photosensitive element of the present embodiment, and an exposure step of exposing the photosensitive resin composition layer. A developing step of forming a resist pattern by removing an unexposed portion of the photosensitive resin composition layer with a developing solution, a conductor pattern forming step of etching or plating a substrate on which the resist pattern is formed, and the resist pattern. The peeling step for peeling is included in the order described above. By the above method, it is possible to obtain a wiring board in which a desired wire pattern is formed on a substrate.
導体パターン形成工程においては、レジストパターンが形成された基板上で、現像工程によって露出した基板表面(例えば銅面)に、公知のエッチング法又はめっき法を用いて導体パターンを形成することができる。 The laminating step, the exposure step, and the developing step are the same as those in the above [resist pattern forming method]. After forming the resist pattern by the above-mentioned resist pattern forming method, a wiring board in which the conductor pattern is formed on the substrate can be obtained by going through the following conductor pattern forming step and peeling step.
In the conductor pattern forming step, a conductor pattern can be formed on the substrate on which the resist pattern is formed by using a known etching method or plating method on the substrate surface (for example, copper surface) exposed by the developing step.
また、銅のラインパターンのトップ幅としては、4.2μm以上が望ましい。より好ましくは4.5μm以上である。更により好ましくは4.8μm以上である。
このことにより、ファインな配線形成が可能になる利点が得られ、好ましい。 The side etch amount of the resist pattern obtained by using the photosensitive resin composition of the present embodiment is preferably 5.5 μm or less. More preferably, it is 5.4 μm or less. Even more preferably, it is 5.3 μm or less.
The top width of the copper line pattern is preferably 4.2 μm or more. More preferably, it is 4.5 μm or more. Even more preferably, it is 4.8 μm or more.
This is preferable because it has an advantage that fine wiring can be formed.
本実施形態における感光性樹脂組成物、感光性エレメント、及び導体パターンの形成方法は、特に、タッチパネルセンサーの製造に好適である。タッチパネルセンサーは、スパッタ銅層を有するフレキシブル基材上に、上記の方法によって形成された導体パターンから成る引き出し配線を形成することにより、製造される。そして、液晶表示素子、上記のタッチパネルセンサー、及びガラスをこの順に積層することにより、タッチパネルを得ることができる。 [Touch panel sensor]
The method for forming the photosensitive resin composition, the photosensitive element, and the conductor pattern in the present embodiment is particularly suitable for manufacturing a touch panel sensor. The touch panel sensor is manufactured by forming a lead-out wiring composed of a conductor pattern formed by the above method on a flexible base material having a sputtered copper layer. Then, a touch panel can be obtained by laminating the liquid crystal display element, the above-mentioned touch panel sensor, and glass in this order.
試料をゲルパーミエーションクロマトグラフィー(GPC)により測定し、ポリスチレン(昭和電工(株)製Shodex STANDARD SM-105)の検量線を用いて、重量平均分子量(Mw)、数平均分子量(Mn)、及び分散度(Mw/Mn)を算出した。
具体的には、日本分光(株)製ゲルパーミエーションクロマトグラフィーを使用して、以下の条件で測定した。
示差屈折率計:RI-1530
ポンプ:PU-1580
デガッサー:DG-980-50
カラムオーブン:CO-1560
カラム:順にKF-8025、KF-806M×2、及びKF-807を直列に接続
溶離液:THF <Weight average molecular weight and dispersity>
The sample was measured by gel permeation chromatography (GPC), and the weight average molecular weight (Mw), number average molecular weight (Mn), and number average molecular weight (Mn) were measured using a calibration curve of polystyrene (Showa Denko Corporation Shodex STANDARD SM-105). The degree of dispersion (Mw / Mn) was calculated.
Specifically, it was measured under the following conditions using gel permeation chromatography manufactured by JASCO Corporation.
Differential refractometer: RI-1530
Pump: PU-1580
Degasser: DG-980-50
Column oven: CO-1560
Column: Connect KF-8025, KF-806M x 2, and KF-807 in series in order. Eluent: THF
酸当量とは、分子中に1当量のカルボキシル基を有する重合体の質量(グラム)を意味する。平沼産業(株)製平沼自動滴定装置(COM-555)を使用し、0.1mol/Lの水酸化ナトリウム水溶液を用いて電位差滴定法により酸当量を測定した。 <Acid equivalent>
The acid equivalent means the mass (gram) of a polymer having 1 equivalent of a carboxyl group in the molecule. Using a Hiranuma automatic titrator (COM-555) manufactured by Hiranuma Sangyo Co., Ltd., the acid equivalent was measured by a potentiometric titration method using a 0.1 mol / L sodium hydroxide aqueous solution.
アルカリ可溶性高分子のガラス転移温度は、各コモノマーのTgiとして上述の文献値を用い、上記Fox式(I)によって算出した。 <Glass transition temperature>
The glass transition temperature of the alkali-soluble polymer, using literature values described above as Tg i for each comonomer, was calculated by the Fox equation (I).
表1に示す各成分を混合し、更にメチルエチルケトン(MEK)を追加して、固形分濃度61質量%の感光性樹脂組成物を調製した。また、表1に示す各成分についての説明を表2に示す。
得られた感光性樹脂組成物を、支持フィルムである厚み16μmのポリエチレンテレフタレートフィルム(東レ(株)製、品名「FB40」)上に、バーコーターを用いて均一に塗布した後、95℃に調温した乾燥機中で5分間加熱乾燥させて、支持フィルム上に厚み5μmの感光性樹脂組成物層を形成した。
次いで、上記感光性樹脂組成物層の支持フィルムと反対側の面上に、保護層である厚み33μmのポリエチレンフィルム(タマポリ(株)製、品名「GF-858」)を貼付することにより、感光性エレメントを得た。 <Manufacturing of photosensitive element>
Each component shown in Table 1 was mixed, and methyl ethyl ketone (MEK) was further added to prepare a photosensitive resin composition having a solid content concentration of 61% by mass. In addition, Table 2 shows a description of each component shown in Table 1.
The obtained photosensitive resin composition was uniformly applied to a support film, a polyethylene terephthalate film having a thickness of 16 μm (manufactured by Toray Industries, Inc., product name “FB40”) using a bar coater, and then adjusted to 95 ° C. It was heated and dried in a warm dryer for 5 minutes to form a photosensitive resin composition layer having a thickness of 5 μm on the support film.
Next, a polyethylene film having a thickness of 33 μm (manufactured by Tamapoli Co., Ltd., product name “GF-858”), which is a protective layer, is attached on the surface of the photosensitive resin composition layer opposite to the support film to make the photosensitive resin composition layer photosensitive. Obtained a sex element.
評価用基板としては、PET上にITO及び5μm以下の薄膜銅がこの順に蒸着されたフレキシブル基材を用いた。 <Substrate used for evaluation>
As the evaluation substrate, a flexible substrate in which ITO and thin-film copper of 5 μm or less were vapor-deposited in this order was used on PET.
前記基板上に、各実施例又は比較例で得た感光性エレメントのポリエチレンフィルムを剥がしながら、ホットロールラミネーター(旭化成(株)製、AL-70)により、ロール温度105℃、エアー圧力0.35MPa、及びラミネート速度1.5m/minの条件でラミネートした。 <Laminate>
While peeling off the polyethylene film of the photosensitive element obtained in each Example or Comparative Example on the substrate, a hot roll laminator (AL-70 manufactured by Asahi Kasei Corporation) was used to roll temperature 105 ° C. and air pressure 0.35 MPa. , And the laminating speed was 1.5 m / min.
クロムガラスマスクを用いて、平行光露光機((株)オーク株式会社、HMW-801)により、露光、現像した後に得られるレジストのトップ幅が、マスク設計値比0μm~+1μmとなる露光量で露光した。 <Exposure>
With a chrome glass mask, the top width of the resist obtained after exposure and development by a parallel light exposure machine (Oak Co., Ltd., HMW-801) is an exposure amount with a mask design value ratio of 0 μm to +1 μm. Exposed.
感光性エレメントからポリエチレンフィルムを剥がし、上記の露光量にて露光後15分経過した後、スペクトロメーター(日本電色工業(株)、NF333)を用いて、ポリエトレンテレフタラート側から露光部と未露光部のコントラストを測定した。
コントラスト=露光部透過率(%)/未露光部透過率(%) <Contrast>
After peeling off the polyethylene film from the photosensitive element and 15 minutes after exposure at the above exposure amount, using a spectrometer (Nippon Denshoku Kogyo Co., Ltd., NF333), the exposed part and the exposed part are not exposed from the polyether terephthalate side. The contrast of the exposed part was measured.
Contrast = Exposed area transmittance (%) / Unexposed area transmittance (%)
露光後の感光性樹脂組成物層から支持フィルムを剥離した後、アルカリ現像機(フジ機工製、ドライフィルム用現像機)を用いて、30℃の1質量%Na2CO3水溶液を最小現像時間の2倍の時間スプレーして、感光性樹脂組成物層の未露光部分を溶解除去した。現像後、水洗処理を行うことによって、評価用硬化膜を有する基板を得た。
上記最小現像時間とは、感光性樹脂組成物層の未露光部分が完全に溶解除去されるまでに要する最小の時間をいう。 <Development>
After peeling the support film from the photosensitive resin composition layer after exposure, a 1 mass% Na 2 CO 3 aqueous solution at 30 ° C. is used in an alkaline developing machine (manufactured by Fuji Kiko Co., Ltd., a developing machine for dry film) for a minimum developing time. The unexposed portion of the photosensitive resin composition layer was dissolved and removed by spraying for twice as long as. After the development, it was washed with water to obtain a substrate having a cured film for evaluation.
The minimum development time refers to the minimum time required for the unexposed portion of the photosensitive resin composition layer to be completely dissolved and removed.
長さ30mmの独立細線を上記現像条件で測定した際にパターンが残っている最小線幅を密着力とした <Adhesion>
The minimum line width at which the pattern remains when the independent thin wire with a length of 30 mm is measured under the above development conditions is used as the adhesion force.
サイドエッチ量の評価には、上記<ラミネート>後、15分経過後のラミネート基板を用いた。
該ラミネート基板に対し、ライン/スペース=10μm/10μmのパターンを露光した後、上記<現像>に記載の方法によって現像した。
先ず、該パターンのレジストボトム幅Wbを、光学顕微鏡により測定した。
次いで、このライン/スペースパターンを有する基板につき、ディップ方式を用いて、塩酸濃度2質量%、塩化第二鉄2質量%、及び温度30℃で、70秒間(条件I)又は30秒間(条件II)エッチングした。
上記エッチング後、剥離液として濃度3質量%のNaOH水溶液を用い、温度50℃において基板上の硬化膜を剥離除去して得られた銅のラインパターンのトップ幅Wtを光学顕微鏡により測定した。
そして、下記数式:
サイドエッチ(μm)=Wb-Wt
によりサイドエッチ量を算出した。 <Amount of side etch>
For the evaluation of the amount of side etch, a laminated substrate 15 minutes after the above <lamination> was used.
A pattern of line / space = 10 μm / 10 μm was exposed on the laminated substrate, and then developed by the method described in <Development> above.
First, the resist bottom width Wb of the pattern was measured with an optical microscope.
Then, for the substrate having this line / space pattern, using a dip method, the hydrochloric acid concentration was 2% by mass, ferric chloride was 2% by mass, and the temperature was 30 ° C. for 70 seconds (condition I) or 30 seconds (condition II). ) Etched.
After the etching, a NaOH aqueous solution having a concentration of 3% by mass was used as a stripping solution, and the top width Wt of the copper line pattern obtained by stripping and removing the cured film on the substrate at a temperature of 50 ° C. was measured with an optical microscope.
And the following formula:
Side etch (μm) = Wb-Wt
The side etch amount was calculated by
上記<現像>に記載の方法によって現像した後に、銅ラインを100mmの長さに渡って測定し、銅ラインの最外端と最内端とを決定し、以下の基準で評価した。
◎:ライン最外端からライン最内端までの距離が0.2μm未満
○:ライン最外端からライン最内端までの距離が0.2μm以上0.5μm未満
△:ライン最外端からライン最内端までの距離が0.5μm以上 <Copper line width uniformity>
After developing by the method described in <Development> above, the copper line was measured over a length of 100 mm, the outermost end and the innermost end of the copper line were determined, and evaluated according to the following criteria.
⊚: Distance from the outermost end of the line to the innermost end of the line is less than 0.2 μm ○: Distance from the outermost end of the line to the innermost end of the line is 0.2 μm or more and less than 0.5 μm Δ: From the outermost end of the line to the line Distance to the innermost end is 0.5 μm or more
実施例及び比較例で用いた感光性樹脂組成物の組成を表1に、表1に記載の各成分名の詳細を表2にそれぞれ示す。表1における各成分の配合量は、いずれも固形分換算の質量部である。各感光性樹脂組成物を用いて行った、密着性、サイドエッチ量、銅ライン幅の均一性、及びコントラストの評価結果を表1にまとめる。表1中、実施例1~5のいずれも、評価項目「サイドエッチ量」、「銅ライン幅の均一性」及び「コントラスト」のバランスが良く、各々の評価結果も良好である結果が得られた。特に、実施例2及び4は、感光性樹脂組成物中の化合物(E)の含有量が少ないにも関わらず、良好な結果が得られている。 <Examples 1 to 5 and Comparative Examples 1 to 5>
The composition of the photosensitive resin composition used in Examples and Comparative Examples is shown in Table 1, and the details of each component name shown in Table 1 are shown in Table 2. The blending amount of each component in Table 1 is a mass part in terms of solid content. Table 1 summarizes the evaluation results of adhesion, side etch amount, copper line width uniformity, and contrast performed using each photosensitive resin composition. In Table 1, in each of Examples 1 to 5, the evaluation items "side etch amount", "copper line width uniformity" and "contrast" are well-balanced, and the respective evaluation results are also good. It was. In particular, in Examples 2 and 4, good results were obtained even though the content of the compound (E) in the photosensitive resin composition was small.
Claims (10)
- (A)アルカリ可溶性高分子、
(B)エチレン性不飽和二重結合を有する化合物、
(C)光重合開始剤、
(D)染料、及び
(E)下記一般式(3)で表される化合物:
(B) A compound having an ethylenically unsaturated double bond,
(C) Photopolymerization initiator,
(D) Dye and (E) Compound represented by the following general formula (3):
- 式中、R1及びR2は、いずれもアミノ基を有さず、水素原子又は炭素数1~3の有機基からなる群から独立して選択され、ただし、R1及びR2のうち少なくとも一つは、pKa5以下の酸性基を有する、請求項1に記載の感光性樹脂組成物。 In the formula, neither R 1 nor R 2 has an amino group and is independently selected from the group consisting of a hydrogen atom or an organic group having 1 to 3 carbon atoms, except that at least R 1 and R 2 are selected. One is the photosensitive resin composition according to claim 1, which has an acidic group of pKa5 or less.
- 式中、R1及びR2は、いずれもアミノ基を有さず、R1及びR2のうち一方は、pKa5以下の酸性基を有する炭素数1~3の有機基であり、他方は水素原子である、請求項2に記載の感光性樹脂組成物。 Wherein, R 1 and R 2 are both having no amino group, one of R 1 and R 2 is an organic group having 1 to 3 carbon atoms having a pKa5 following acidic group and the other represents hydrogen The photosensitive resin composition according to claim 2, which is an atom.
- 前記酸性基が、カルボキシ基、リン酸基、又はスルホン酸基のいずれかである、請求項1~3のいずれか一項に記載の感光性樹脂組成物。 The photosensitive resin composition according to any one of claims 1 to 3, wherein the acidic group is any of a carboxy group, a phosphoric acid group, and a sulfonic acid group.
- 前記酸性基が、カルボキシ基である、請求項4に記載の感光性樹脂組成物。 The photosensitive resin composition according to claim 4, wherein the acidic group is a carboxy group.
- 前記染料(D)が、ロイコ染料である、請求項1~5のいずれか一項に記載の感光性樹脂組成物。 The photosensitive resin composition according to any one of claims 1 to 5, wherein the dye (D) is a leuco dye.
- 前記化合物(E)を、前記感光性樹脂組成物の固形分の総量に対して0.001~0.5質量%含有する、請求項1~6のいずれか一項に記載の感光性樹脂組成物。 The photosensitive resin composition according to any one of claims 1 to 6, wherein the compound (E) is contained in an amount of 0.001 to 0.5% by mass based on the total solid content of the photosensitive resin composition. Stuff.
- 前記化合物(E)が、25℃で固体である、請求項1~7のいずれか一項に記載の感光性樹脂組成物。 The photosensitive resin composition according to any one of claims 1 to 7, wherein the compound (E) is solid at 25 ° C.
- 前記アルカリ可溶性高分子(A)が、その分子構造中に芳香環を含む、請求項1~8のいずれか一項に記載の感光性樹脂組成物。 The photosensitive resin composition according to any one of claims 1 to 8, wherein the alkali-soluble polymer (A) contains an aromatic ring in its molecular structure.
- 支持体と、前記支持体上に形成された、請求項1~9のいずれか一項に記載の感光性樹脂組成物層とを備える、感光性エレメント。 A photosensitive element comprising a support and a photosensitive resin composition layer formed on the support according to any one of claims 1 to 9.
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