JPWO2021025133A1 - - Google Patents

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Publication number
JPWO2021025133A1
JPWO2021025133A1 JP2021537391A JP2021537391A JPWO2021025133A1 JP WO2021025133 A1 JPWO2021025133 A1 JP WO2021025133A1 JP 2021537391 A JP2021537391 A JP 2021537391A JP 2021537391 A JP2021537391 A JP 2021537391A JP WO2021025133 A1 JPWO2021025133 A1 JP WO2021025133A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021537391A
Other languages
Japanese (ja)
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JP7214875B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021025133A1 publication Critical patent/JPWO2021025133A1/ja
Application granted granted Critical
Publication of JP7214875B2 publication Critical patent/JP7214875B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
  • Photoreceptors In Electrophotography (AREA)
JP2021537391A 2019-08-06 2020-08-06 Photosensitive resin composition and photosensitive element Active JP7214875B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019144661 2019-08-06
JP2019144661 2019-08-06
PCT/JP2020/030256 WO2021025133A1 (en) 2019-08-06 2020-08-06 Photosensitive resin composition and photosensitive element

Publications (2)

Publication Number Publication Date
JPWO2021025133A1 true JPWO2021025133A1 (en) 2021-02-11
JP7214875B2 JP7214875B2 (en) 2023-01-30

Family

ID=74503856

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021537391A Active JP7214875B2 (en) 2019-08-06 2020-08-06 Photosensitive resin composition and photosensitive element

Country Status (5)

Country Link
JP (1) JP7214875B2 (en)
KR (1) KR20210146977A (en)
CN (1) CN114174922A (en)
TW (1) TWI770578B (en)
WO (1) WO2021025133A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024095927A1 (en) * 2022-10-31 2024-05-10 旭化成株式会社 Photosensitive resin composition, method for producing cured relief pattern using same, and method for producing polyimide film using same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05281724A (en) * 1992-03-31 1993-10-29 Dainippon Toryo Co Ltd Negative photosensitive electrodeposition coating resin composition, electrodeposition coating bath using the same, and production of resist pattern
JP2006349724A (en) * 2005-06-13 2006-12-28 Konica Minolta Medical & Graphic Inc Photosensitive composition, photosensitive lithographic printing plate material, and image forming method for lithographic printing plate material
WO2014167671A1 (en) * 2013-04-10 2014-10-16 千代田ケミカル株式会社 Photosensitive resin composition
JP2015141352A (en) * 2014-01-29 2015-08-03 日立化成デュポンマイクロシステムズ株式会社 Photosensitive resin composition and production method of patterned cured film using the same
WO2018030198A1 (en) * 2016-08-08 2018-02-15 日産化学工業株式会社 Photocurable composition and method for manufacturing semiconductor device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4221467B2 (en) 2001-04-20 2009-02-12 デュポン エムアールシー ドライフィルム株式会社 Photopolymerizable resin composition for resist
JP4449983B2 (en) 2004-08-11 2010-04-14 日立化成工業株式会社 Photosensitive resin composition and photosensitive film using the same
JP5063764B2 (en) 2005-07-22 2012-10-31 富士フイルム株式会社 Pattern forming material, pattern forming apparatus and pattern forming method
JP4883537B2 (en) 2006-08-04 2012-02-22 千代田ケミカル株式会社 Photosensitive resin composition
JP5273455B2 (en) 2008-09-22 2013-08-28 日立化成株式会社 Photosensitive resin composition, photosensitive element, resist pattern forming method, and printed wiring board manufacturing method
MY179988A (en) * 2010-12-24 2020-11-19 Asahi Kasei E Mat Corporation Photosensitive resin composition
JP5920357B2 (en) * 2011-11-01 2016-05-18 日立化成株式会社 Photosensitive resin composition, photosensitive element using the same, cured product, method for forming partition wall of image display device, method for manufacturing image display device, and image display device
EP2857899A4 (en) * 2012-05-31 2016-10-26 Hitachi Chemical Co Ltd Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing wiring board
EP2916171B1 (en) * 2014-03-03 2017-05-31 Agfa Graphics Nv A method for making a lithographic printing plate precursor
JP6661343B2 (en) * 2015-11-26 2020-03-11 富士フイルム株式会社 Transfer material, transfer material manufacturing method, laminated body, laminated body manufacturing method, capacitance type input device manufacturing method, and image display device manufacturing method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05281724A (en) * 1992-03-31 1993-10-29 Dainippon Toryo Co Ltd Negative photosensitive electrodeposition coating resin composition, electrodeposition coating bath using the same, and production of resist pattern
JP2006349724A (en) * 2005-06-13 2006-12-28 Konica Minolta Medical & Graphic Inc Photosensitive composition, photosensitive lithographic printing plate material, and image forming method for lithographic printing plate material
WO2014167671A1 (en) * 2013-04-10 2014-10-16 千代田ケミカル株式会社 Photosensitive resin composition
JP2015141352A (en) * 2014-01-29 2015-08-03 日立化成デュポンマイクロシステムズ株式会社 Photosensitive resin composition and production method of patterned cured film using the same
WO2018030198A1 (en) * 2016-08-08 2018-02-15 日産化学工業株式会社 Photocurable composition and method for manufacturing semiconductor device

Also Published As

Publication number Publication date
TW202111429A (en) 2021-03-16
TWI770578B (en) 2022-07-11
KR20210146977A (en) 2021-12-06
WO2021025133A1 (en) 2021-02-11
JP7214875B2 (en) 2023-01-30
CN114174922A (en) 2022-03-11

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