WO2021024445A1 - Substrat de dissipation de chaleur, et procédé de fabrication de celui-ci - Google Patents

Substrat de dissipation de chaleur, et procédé de fabrication de celui-ci Download PDF

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Publication number
WO2021024445A1
WO2021024445A1 PCT/JP2019/031294 JP2019031294W WO2021024445A1 WO 2021024445 A1 WO2021024445 A1 WO 2021024445A1 JP 2019031294 W JP2019031294 W JP 2019031294W WO 2021024445 A1 WO2021024445 A1 WO 2021024445A1
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WIPO (PCT)
Prior art keywords
heat
transfer member
heat transfer
hole
exposed portion
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Application number
PCT/JP2019/031294
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English (en)
Japanese (ja)
Inventor
政邦 篠崎
光昭 戸田
金光 永井
Original Assignee
株式会社メイコー
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Application filed by 株式会社メイコー filed Critical 株式会社メイコー
Priority to PCT/JP2019/031294 priority Critical patent/WO2021024445A1/fr
Priority to JP2019566857A priority patent/JP7018967B2/ja
Publication of WO2021024445A1 publication Critical patent/WO2021024445A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a heat radiating substrate and a method for manufacturing the same.
  • the printed wiring board on which the heat generating component is mounted is generally provided with a heat radiating mechanism, for example, as disclosed as the prior art of Patent Document 1. More specifically, the prior art is configured by providing heat generating components and heat sinks on both sides of the substrate so as to sandwich a heat transfer member provided so as to penetrate the substrate. As a result, the heat generated by the heat generating component mounted on one surface of the substrate is transferred to the heat sink arranged on the other surface of the substrate via the heat transfer member and dissipated.
  • the heat transfer member forming the heat dissipation path between the heat generating component and the heat sink is formed as, for example, a metal piece made of a lump of copper, so that heat is dissipated as compared with the case where a plurality of thermal vias are formed. It is easy to secure the cross-sectional area of the path, and heat can be efficiently dissipated even when the amount of heat generated by the heat-generating component is relatively large.
  • the mounted electronic component is provided with an electrode terminal on the surface opposite to the contact surface with the substrate, and the electrode terminal is a bonding wire to the conductive pattern formed on the substrate surface. It is connected by.
  • the heat radiating substrate according to the prior art has a heat radiating path formed by embedding a cylindrical heat transfer member in a through hole provided in the wiring board. As described above, the through hole of the heat radiating substrate and the heat transfer member provided in the through hole are generally formed in a cylindrical shape, whereby the formation of the through hole itself or the heat transfer member is crimped or By press-fitting, it becomes easy to provide the through hole without a gap.
  • the heat generating component mounted on the heat radiating substrate by the heat transfer member as described above may be provided with a flat plate-shaped electrode terminal on the contact surface with the substrate.
  • the heat transfer member directly under the electrode terminal heat can be efficiently transferred from the electrode terminal having good thermal conductivity to the heat transfer member.
  • the electrode terminals formed on the mounting surface of the heat generating component are not usually formed in a circular shape, in order to provide a heat transfer member having a size in which the entire surface of the electrode terminals is in contact with each other from the viewpoint of heat dissipation efficiency, the electrodes It is necessary to embed a large-diameter heat transfer member that includes the contour of the terminal in the substrate. Therefore, in the heat radiating substrate, there is a possibility that the mounting area for forming other parts and wiring patterns may be compressed, especially around the heat transfer member.
  • the heat dissipation path may be blocked at the peripheral portion of the electrode terminal where the heat transfer member does not abut, and the heat dissipation efficiency may decrease. Occurs.
  • the present invention has been made in view of such a situation, and an object of the present invention is to press the mounting area even when a heat generating component having an electrode terminal is mounted on a contact surface with a substrate. It is an object of the present invention to provide a heat radiating substrate capable of improving heat radiating efficiency and a method for manufacturing the same.
  • the heat-dissipating substrate according to the present invention is a heat-dissipating substrate for mounting a heat-generating component having electrode terminals on the mounting surface, and is composed of a wiring board having a through hole having a circular cross section and a conductive material.
  • the through hole includes a heat transfer member that constitutes a heat dissipation path over both sides of the wiring board, and the heat transfer member is provided along the surface of the wiring board and a buried portion fitted inside the through hole.
  • the exposed portion is integrally formed with a flat plate-shaped exposed portion provided in the above, and the exposed portion has substantially the same shape as the electrode terminal of the heat generating component.
  • the method for manufacturing a heat radiating substrate according to the present invention is a method for manufacturing a heat radiating substrate for mounting a heat generating component having electrode terminals on the mounting surface, and is a hole for forming a through hole having a circular cross section in the wiring board.
  • a shape in which a forming step, a buried portion in which a heat transfer member made of a conductive material is inserted into the through hole, and a flat plate-shaped exposed portion provided along the surface of the wiring substrate are integrally formed.
  • the exposed portion is of the heat generating component, including a heat transfer member preparation step of processing the heat transfer member and a fitting step of fitting the embedded portion of the heat transfer member into the through hole. It is processed into substantially the same shape as the electrode terminal.
  • a heat radiating substrate capable of improving heat dissipation efficiency without squeezing the mounting area even when a heat generating component having electrode terminals is mounted on a contact surface with the substrate, and a method for manufacturing the same. Can be provided.
  • FIG. 1 is a cross-sectional view of the heat radiating substrate 1 according to the first embodiment of the present invention.
  • the heat radiating board 1 is a printed circuit board capable of transmitting heat from the heat generating component 2 to a surface opposite to the mounting surface to dissipate heat when the heat generating component 2 is mounted on the mounting surface of the board.
  • a substrate 10, a heat transfer member 20, and a heat sink 30 are provided.
  • the wiring board 10 includes a first outer layer wiring layer 11, a second outer layer wiring layer 12, a plurality of inner layer wiring layers 13, and an insulating layer 14. More specifically, in the wiring board 10, the first outer layer wiring layer 11 is provided on one surface on which the heat generating component 2 is mounted, and the second outer layer wiring layer 12 is provided on the other surface, and between them. A plurality of inner layer wiring layers 13 are formed on the surface. The wiring layers on which the circuit pattern is formed are insulated from each other by the insulating layer 14, and are partially connected by vias (not shown) to form an electronic circuit as the entire substrate.
  • the wiring board 10 may be a double-sided board on which the inner layer wiring layer 13 is not formed, or may be a multilayer board on which more inner layer wiring layers 13 are formed. Further, the inner layer wiring layer 13 is circuit-formed by patterning in the manufacturing process of the wiring board 10, but the illustration is omitted in the present embodiment. Then, in the wiring board 10, a through hole TH having a circular cross section is formed at a position where the heat generating component 2 is mounted, and the heat transfer member 20 is fitted in the through hole TH.
  • the heat transfer member 20 is a so-called copper inlay made of a metal having conductivity and thermal conductivity, for example, copper.
  • the heat transfer member 20 according to the present embodiment extends from the surface of the first outer layer wiring layer 11 to the second outer layer wiring layer 12 through the through hole TH, and extends on both sides of the wiring board 10 as described in detail later. It constitutes a heat dissipation path.
  • the heat generating component 2 is provided with a flat plate-shaped electrode terminal 2a on the mounting surface on the wiring board 10 side, and is provided with two terminals 2b protruding from the side surface (see FIG. 8). , It is mounted on the wiring board 10 so that the surface of the heat transfer member 20 and the electrode terminal 2a are in contact with each other.
  • the heat generating component 2 is, for example, a surface mount type known MOSFET (Metal Oxide Semiconductor Field Effect Transistor).
  • the heat generating component 2 is mounted so that the surface of the wiring board 10 is in contact with the electrode terminal 2a on the surface on which the first outer layer wiring layer 11 is formed. Therefore, the heat from the heat generating component 2 is transferred to the second outer layer wiring layer 12 side via the electrode terminal 2a and the heat transfer member 20, and is dissipated by the heat sink 30 provided in the second outer layer wiring layer 12.
  • the heat sink 30 can be attached by a heat radiating sheet 20a having thermal conductivity and adhesiveness at a position including the surface of the heat transfer member 20 in the second outer layer wiring layer 12.
  • a heat radiating sheet 20a having thermal conductivity and adhesiveness By adhering the heat radiating sheet 20a to the heat transfer member 20 and the heat sink 30, the heat transfer property from the heat transfer member 20 to the heat sink 30 can be improved and heat can be efficiently radiated.
  • a heat radiating sheet 20a having an insulating property is adopted.
  • a paste-like heat radiating paste having thermal conductivity may be applied.
  • the heat sink 30 is not essential to the present invention, and may be replaced by a heat radiating pad formed by covering the surface of the heat transfer member 20 and its periphery with a metal layer.
  • the method for manufacturing the heat dissipation substrate 1 includes, for example, a substrate preparation step, a hole forming step, a plating step, a patterning step, a heat transfer member preparation step, a fitting step, and a component mounting step.
  • FIG. 2 is a cross-sectional view showing a substrate preparation step according to the first embodiment of the present invention.
  • the first copper foil layer 11' which becomes the first outer layer wiring layer 11 in the later step
  • the second copper foil layer 12' which becomes the second outer layer wiring layer 12 in the later step
  • the wiring board 10 formed on both sides of the above is prepared.
  • the wiring board 10 is a multilayer board
  • a board including the inner layer wiring layer 13 patterned inside the insulating layer 14 is prepared.
  • FIG. 3 is a cross-sectional view showing a hole forming step according to the first embodiment of the present invention.
  • a through hole TH is provided at the mounting position of the heat generating component 2 with respect to the wiring board 10 prepared in the above-mentioned substrate preparation step.
  • the first drill D1 capable of forming a columnar through hole TH in the wiring substrate 10 is used.
  • FIG. 4 is a cross-sectional view showing a plating process according to the first embodiment of the present invention.
  • copper plating is formed on the inner side surface of the through hole TH formed in the wiring board 10 and the surfaces of the first copper foil layer 11'and the second copper foil layer 12'.
  • the first outer layer wiring layer 11 and the second outer layer wiring layer 12 are formed on both sides of the wiring board 10, and the wiring layers are connected to each other by plating on the inner side surface of the through hole TH.
  • the plating treatment on the inner surface of the through hole TH and each outer layer wiring layer is performed as necessary, and is not an essential step in the present invention.
  • FIG. 5 is a cross-sectional view showing a patterning process according to the first embodiment of the present invention.
  • the patterning step for example, by known photolithography, the first outer layer wiring layer 11 and the second outer layer wiring layer 12 of the wiring board 10 are processed into a desired circuit pattern.
  • the heat transfer member preparation step is a step of preparing the heat transfer member 20 of the heat radiating substrate 1, and proceeds separately from the series of processing on the wiring board 10 from the substrate preparation step to the patterning step described above.
  • FIG. 6 is a perspective view showing a heat transfer member 20 formed by the heat transfer member preparation step according to the first embodiment of the present invention.
  • the heat transfer member 20 is made of a metal having a shape in which a buried portion 21 formed in a columnar shape and an exposed portion 22 formed in a flat plate shape are integrally formed, for example, electrical conductivity and Copper having excellent thermal conductivity can be formed by processing it by mold molding.
  • the embedded portion 21 is a portion to be fitted inside the through hole TH of the wiring board 10 by a press-fitting method or a caulking method in a later process, and has a diameter R and a diameter R according to the dimensions of the through hole TH.
  • the height H is set.
  • the exposed portion 22 has a flat plate shape having substantially the same shape as the electrode terminal 2a of the heat generating component 2 described above when viewed in a plan view, and is a portion that will be provided along the surface of the wiring board 10 in a later step. is there.
  • FIG. 7 is a cross-sectional view showing a fitting process according to the first embodiment of the present invention.
  • the heat transfer member 20 formed in the heat transfer member preparation step is pressed against the wiring substrate 10 by the press machine P, so that the embedded portion 21 of the heat transfer member 20 is aligned with the through hole TH. Let me.
  • the press-fitting method or the caulking method can be applied.
  • the diameter R of the embedded portion 21 of the heat transfer member 20 is made slightly larger than the inner diameter of the through hole TH, and the height H of the embedded portion 21 of the heat transfer member 20 is made equal to the thickness of the wiring board 10. Then, it is a method of fixing the buried portion 21 so as to be buried in the through hole TH by the press machine P.
  • the diameter R of the buried portion 21 of the heat transfer member 20 is made smaller than the inner diameter of the through hole TH, and the height H of the buried portion 21 of the heat transfer member 20 is made higher than the thickness of the wiring substrate 10.
  • the exposed portion 22 is pressed by the press machine P to deform the embedded portion 21, and the embedded portion 21 is fixed so as to be buried in the through hole TH.
  • the heat transfer member 20 is fixed to the through hole TH by the fitting process, and the exposed portion 22 is provided along the surface of the wiring board, that is, the first outer layer wiring layer 11.
  • the first outer layer wiring layer 11 by copper plating is formed between the surface of the wiring board 10 and the exposed portion 22, a part of the first outer layer wiring layer 11 is surfaced with the exposed portion 22.
  • the contact area between the copper plating and the heat transfer member 20 increases, so that each wiring of the wiring board 10 passes through the copper plating.
  • the electrical conductivity between the layer and the heat transfer member 20 can be improved.
  • FIG. 8 is a cross-sectional view showing a component mounting process according to the first embodiment of the present invention.
  • the components related to the mounting of the heat generating component 2 on the wiring board 10 are schematically shown, and the other components such as the patterned first outer layer wiring layer 11 are not shown. ..
  • the heat generating component 2 and its electrode terminal 2a are not limited to the shapes shown in FIG. 8, and may have various variations such as square, rectangular, convex, trapezoidal, other polygonal, and more complicated shapes. is assumed.
  • the solder paste is applied to the surface of the exposed portion 22 of the heat transfer member 20, and the heat generating component 2 is arranged so as to align the electrode terminals 2a via the solder paste, and the heat transfer component 2 is arranged by a known reflow process.
  • the heat transfer member 20 and the heat generating component 2 are connected.
  • the electrode is reflowed.
  • the terminals 2a and 2b can be connected to the wiring board 10 at the same time.
  • the heat radiating substrate 1 shown in FIG. 1 on which the heat generating component 2 is mounted is completed.
  • the heat radiating board 1 is appropriately subjected to other steps common to general printed circuit boards, such as mounting other electronic components and insulating coating with a solder resist.
  • the heat radiating substrate 1 has a heat transfer shape in which the embedded portion 21 fitted in the through hole TH and the exposed portion 22 exposed on the surface of the wiring board 10 are integrally formed.
  • the member 20 is provided on the wiring board 10. Since the embedded portion 21 is formed in a columnar shape having a cross section smaller than that of the electrode terminal 2a of the heat generating component 2, other electronic components and wiring arranged around the heat generating component 2 mounted on the wiring board 10 are formed. Does not interfere with the pattern. Further, since the exposed portion 22 is formed to have substantially the same shape as the electrode terminal 2a of the heat generating component 2, the embedded portion 21 is integrally and continuously formed while receiving the maximum heat from the heat generating component 2. The heat can be transferred.
  • the heat radiating substrate 1 according to the first embodiment of the present invention even when the heat generating component 2 provided with the electrode terminal 2a is mounted on the contact surface with the substrate, the mounting area is not pressed. The heat dissipation efficiency can be improved.
  • the first outer layer wiring layer 11 formed by plating comes into surface contact with the exposed portion 22 of the heat transfer member 20 on the surface on which the heat generating component 2 of the wiring board 10 is mounted.
  • a conductive path having excellent conductivity and excellent thermal conductivity are provided. It is possible to secure a heat dissipation path.
  • a plating layer connected to each wiring layer is formed on the inner surface of the through hole TH, and the plating layer and the heat transfer member 20 are in surface contact with each other. Since the area is increased, it is possible to improve the electrical conductivity of the conductive path from the electrode terminal 2a of the heat generating component 2 to each wiring layer of the wiring board 10 via the heat transfer member 20 and the plating layer.
  • the heat radiating substrate 3 according to the second embodiment is different from the first embodiment in the shapes of the through hole TH and the heat transfer member 20 in the heat radiating substrate 1 of the first embodiment described above.
  • the parts different from those of the first embodiment will be described, and the components common to the first embodiment are designated by the same reference numerals and detailed description thereof will be omitted.
  • FIG. 9 is a cross-sectional view of the heat radiating substrate 3 according to the second embodiment of the present invention.
  • the heat radiating substrate 3 according to the present embodiment has a shape in which the through holes TH provided in the wiring board 10 continuously expand in diameter on the side of the first outer layer wiring layer 11. Further, the heat transfer member 40 fixed to the wiring board 10 is formed according to the shape of the through hole TH.
  • FIG. 10 is a side view showing the shape of the heat transfer member 40 according to the second embodiment of the present invention.
  • the embedded portion 41 fitted in the through hole TH of the wiring substrate 10 and the flat plate-shaped exposed portion 42 provided on the surface of the first outer layer wiring layer 11 are integrated.
  • copper having an excellent electrical conductivity and thermal conductivity can be formed by processing it by mold molding.
  • a cylindrical portion 41a formed in a columnar shape and an intermediate portion 41b formed in an inverted truncated cone shape are continuously formed, and in the intermediate portion 41b, the columnar portion 41a to the exposed portion 42 are formed.
  • the circular cross section is continuously expanding toward the bottom. That is, the side surface S of the intermediate portion 41b is processed into a straight line.
  • the cross-sectional shapes of the cylindrical portion 41a and the intermediate portion 41b are both circular.
  • the exposed portion 42 is formed in a flat plate shape having substantially the same shape as the electrode terminal 2a of the heat generating component 2 when viewed in a plan view, as in the first embodiment described above.
  • FIG. 11 is a cross-sectional view showing a hole forming step according to a second embodiment of the present invention.
  • the second drill D2 as a stepped drill as shown in FIG. 11 is used.
  • a through hole TH into which the heat transfer member 40 having the above-mentioned shape can be fitted can be formed by a single drilling process.
  • the heat radiating substrate 3 shown in FIG. 9 is formed by arranging the heat transfer member 40 having the above-mentioned shape with the through hole TH thus formed.
  • the heat radiating substrate 3 according to the second embodiment of the present invention since the shape of the intermediate portion 41b of the heat transfer member 40 is an inverted truncated cone shape, the through hole TH of the wiring board 10 and the heat transfer member 40 The shape of the above can be easily formed with high accuracy. Further, since the heat transfer member 40 according to the present embodiment is fitted into the through hole TH having no right-angled corners, for example, when a plating layer is formed on the inner surface of the through hole TH, for example, when a plating layer is formed. At the time of pressing, it is possible to suppress the variation in pressure for each portion on the contact surface with the plating layer. Therefore, the heat radiating substrate 3 according to the second embodiment of the present invention can improve the adhesion between the plating layer and the heat transfer member 40.
  • the heat radiating substrate 4 according to the third embodiment is different from the first embodiment in the shapes of the through hole TH and the heat transfer member 20 in the heat radiating substrate 1 of the first embodiment described above.
  • the parts different from those of the first embodiment will be described, and the components common to the first embodiment are designated by the same reference numerals and detailed description thereof will be omitted.
  • FIG. 12 is a cross-sectional view of the heat radiating substrate 4 according to the third embodiment of the present invention.
  • the heat radiating substrate 4 according to the present embodiment has a shape in which the through holes TH provided in the wiring board 10 continuously expand in diameter on the side of the first outer layer wiring layer 11. Further, the heat transfer member 50 fixed to the wiring board 10 is formed according to the shape of the through hole TH.
  • FIG. 13 is a side view showing the shape of the heat transfer member 50 according to the third embodiment of the present invention.
  • the embedded portion 51 fitted in the through hole TH of the wiring substrate 10 and the flat plate-shaped exposed portion 52 provided on the surface of the first outer layer wiring layer 11 are integrated.
  • copper having an excellent electrical conductivity and thermal conductivity can be formed by processing it by mold molding.
  • a cylindrical portion 51a formed in a cylindrical shape and an intermediate portion 51b extending from the columnar portion 51a to the exposed portion 52 in a shape along an inverted R surface are continuously formed.
  • a circular cross section continuously expands from the cylindrical portion 51a to the exposed portion 52. That is, it is processed into a shape such that the side surface S of the intermediate portion 51b is an inverted R surface.
  • the cross-sectional shapes of the cylindrical portion 51a and the intermediate portion 51b are both circular.
  • the exposed portion 52 is formed in a flat plate shape having substantially the same shape as the electrode terminal 2a of the heat generating component 2 when viewed in a plan view, as in the first embodiment described above.
  • FIG. 14 is a cross-sectional view showing a hole forming step according to a third embodiment of the present invention.
  • a third drill D3 as shown in FIG. 14 is used in order to fit the heat transfer member 50 having the above-mentioned shape into the through hole TH of the wiring board 10.
  • a through hole TH into which the heat transfer member 50 having the above-mentioned shape can be fitted can be formed by a single drilling process.
  • the heat radiating substrate 4 shown in FIG. 12 is formed by arranging the heat transfer member 50 having the above-mentioned shape with the through hole TH thus formed.
  • the heat radiating substrate 4 according to the third embodiment of the present invention has the shape of the intermediate portion 51b of the heat transfer member 50 having the side surface S along the inverted R surface, the heat radiating substrate 4 penetrates the wiring board 10.
  • the shapes of the hole TH and the heat transfer member 50 can be easily formed with high accuracy.
  • the heat transfer member 50 according to the present embodiment is fitted into the through hole TH having no right-angled corners, for example, when a plating layer is formed on the inner surface of the through hole TH, for example, when a plating layer is formed. At the time of pressing, the pressure on the contact surface with the plating layer can be made uniform so as not to vary from portion to portion. Therefore, the heat radiating substrate 4 according to the third embodiment of the present invention can further improve the adhesion between the plating layer and the heat transfer member 50.
  • the present invention is not limited to each of the above-described embodiments.
  • the thickness of the exposed portion of the heat transfer member is not limited, but the shape may be defined so that the thickness is increased according to the amount of heat generated by the heat-generating component to be mounted.
  • the first aspect of the present invention is a heat-dissipating substrate for mounting a heat-generating component having electrode terminals on the mounting surface, which comprises a wiring board having a through hole having a circular cross section and a conductive material.
  • the through hole includes a heat transfer member that constitutes a heat dissipation path over both sides of the wiring board, and the heat transfer member is provided on a buried portion fitted inside the through hole and on the surface of the wiring board.
  • the exposed portion is a heat-dissipating substrate that is integrally formed of a flat plate-shaped exposed portion provided along the line and has substantially the same shape as the electrode terminal of the heat generating component.
  • the heat radiating board according to the first aspect of the present invention is provided with a through hole at a position where a heat generating component is mounted on the wiring board, and a heat radiating path is formed by a heat transfer member fitted in the through hole.
  • the heat transfer member has a shape in which an embedded portion fitted in the through hole and an exposed portion exposed on the surface of the wiring board are integrally formed. Since the embedded portion is formed in a columnar shape having a smaller cross section than the electrode terminals of the heat generating component, it interferes with other electronic components and wiring patterns arranged around the heat generating component mounted on the wiring board. There is no.
  • the exposed portion is formed to have substantially the same shape as the electrode terminal of the heat generating component, the heat from the heat generating component is received as much as possible, and the heat is transferred to the integrally and continuously formed embedded portion. Can be done.
  • the heat radiating substrate according to the first aspect of the present invention even when a heat generating component having an electrode terminal is mounted on the contact surface with the substrate, the heat radiating efficiency can be improved without squeezing the mounting area. Can be improved.
  • the second aspect of the present invention is the heat radiating substrate in which the surface of the wiring board and the exposed portion are plated with a conductive material in the first aspect of the present invention described above.
  • the outer layer wiring layer formed by plating is configured to be in surface contact with the exposed portion of the heat transfer member on the surface of the wiring substrate on which the heat generating component is mounted. Therefore, it is possible to secure a conductive path having excellent conductivity and a heat dissipation path having excellent thermal conductivity as a path from the electrode terminal of the heat generating component to the outer layer wiring layer through the exposed portion of the heat transfer member.
  • a third aspect of the present invention is a heat radiating substrate in which the inner surface of the through hole is plated with a conductive material in the first or second aspect of the present invention described above.
  • a plating layer connected to each wiring layer is formed on the inner surface of the through hole, and the plating layer and the heat transfer member come into surface contact with each other. Since the contact area is increased, the electrical conductivity of the conductive path from the electrode terminal of the heat generating component to each wiring layer of the wiring board via the heat transfer member and the plating layer can be improved.
  • a fourth aspect of the present invention is the embodiment described in any one of the first to third aspects of the present invention, wherein the embedded portion of the heat transfer member has a cylindrical cylindrical portion and the exposed portion from the cylindrical portion. It is a heat radiating substrate including an intermediate portion whose cross section continuously expands toward the portion.
  • the heat transfer member has a circular cross-sectional shape, and from the exposed portion that receives heat from the entire surface of the electrode terminal of the heat generating component to the cylindrical portion having a relatively small diameter. Since the heat transfer member is continuously formed by the intermediate portion, the heat from the heat generating component can be smoothly transferred to the other surface without partially interrupting the heat dissipation path.
  • a fifth aspect of the present invention is the heat radiating substrate according to the fourth aspect of the present invention, wherein the intermediate portion linearly expands from the cylindrical portion to the exposed portion.
  • the shape of the intermediate portion of the heat transfer member is an inverted truncated cone shape
  • the through hole of the wiring board and the heat transfer member can be formed with high accuracy.
  • the adhesion between the plating layer and the heat transfer member can be improved.
  • a sixth aspect of the present invention is, in the fourth aspect of the present invention described above, a heat radiating substrate in which the intermediate portion expands from the cylindrical portion to the exposed portion in a shape along an inverted R surface. Is.
  • the side surface shape of the intermediate portion of the heat transfer member has a shape along the inverted R surface, it is evenly contacted with the inner side surface of the through hole. For example, when a plating layer is formed on the inner surface of the through hole, the adhesion between the plating layer and the heat transfer member can be improved.
  • a seventh aspect of the present invention is a method for manufacturing a heat radiating substrate for mounting a heat generating component having an electrode terminal on a mounting surface, which comprises a hole forming step of forming a through hole having a circular cross section on the wiring substrate.
  • a heat transfer member made of a conductive material is processed into a shape in which a buried portion inserted into the through hole and a flat plate-shaped exposed portion provided along the surface of the wiring substrate are integrally formed.
  • the heat transfer member preparation step includes a fitting step of fitting the embedded portion of the heat transfer member into the through hole, and in the heat transfer member preparation step, the exposed portion is referred to the electrode terminal of the heat generation component.
  • This is a method of manufacturing a heat transfer substrate, which is processed into substantially the same shape.
  • a through hole is formed in the wiring board, and a heat transfer member having an embedded portion and an exposed portion is fitted into the through hole.
  • a columnar embedded portion having a cross section smaller than that of the electrode terminal of the heat generating component and an exposed portion formed in substantially the same shape as the electrode terminal of the heat generating component are integrally and continuously formed. Will be done.
  • the surface of the wiring board and the exposed portion are plated with a conductive material to dissipate heat. This is a method for manufacturing a substrate.
  • the outer layer wiring layer formed by plating comes into surface contact with the exposed portion of the heat transfer member on the surface on which the heat generating component of the wiring substrate is mounted. Therefore, it is possible to secure a conductive path with excellent conductivity and a heat dissipation path with excellent thermal conductivity as a path from the electrode terminal of the heat generating component to the outer layer wiring layer via the exposed part of the heat transfer member. it can.
  • a ninth aspect of the present invention is a method for manufacturing a heat-dissipating substrate, wherein in the seventh or eighth aspect of the present invention described above, the inner surface of the through hole is plated with a conductive material before the fitting step. Is.
  • a plating layer formed on the inner surface of the through hole is connected to each wiring layer of the wiring board, and the plating layer and the heat transfer member are connected to each other.
  • a tenth aspect of the present invention is the embodiment described in any one of the seventh to ninth aspects of the present invention, wherein in the heat transfer member preparation step, the embedded portion of the heat transfer member is formed into a cylindrical cylinder.
  • This is a method for manufacturing a heat radiating substrate, which is processed into a shape including a portion and an intermediate portion whose cross section continuously expands from the cylindrical portion to the exposed portion.
  • the heat transfer member has a circular cross-sectional shape, and the diameter is relatively small from the exposed portion that receives heat from the entire surface of the electrode terminals of the heat generating component. Since the heat transfer member is continuously formed by the intermediate part up to the columnar part, the heat dissipation substrate that can smoothly transfer the heat from the heat generating part to the other surface without partially interrupting the heat dissipation path. Can be manufactured.
  • the intermediate portion is linearly expanded from the cylindrical portion to the exposed portion. It is a method of manufacturing a heat radiating substrate to be processed.
  • the shape of the intermediate portion of the heat transfer member is an inverted truncated cone shape, the through hole of the wiring board and the heat transfer member are accurately formed. For example, when a plating layer is formed on the inner surface of the through hole, the adhesion between the plating layer and the heat transfer member can be improved.
  • a twelfth aspect of the present invention is, in the tenth aspect of the present invention described above, in the heat transfer member preparation step, the shape of the intermediate portion from the cylindrical portion to the exposed portion along the inverted R surface. This is a method of manufacturing a heat dissipation substrate, which is processed into a shape that expands with.
  • the side surface shape of the intermediate portion of the heat transfer member has a shape along the inverted R surface, so that the side surface shape is even with respect to the inner side surface of the through hole. Since they are in contact with each other, for example, when a plating layer is formed on the inner surface of the through hole, the adhesion between the plating layer and the heat transfer member can be improved.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne un substrat de dissipation de chaleur 1 pour le montage d'un composant de génération de chaleur 2 ayant, sur une surface de montage de celui-ci, une borne d'électrode 2a, qui est équipé : d'un substrat de câblage 10 qui possède formé à l'intérieur de celui-ci un trou traversant TH ayant une section transversale circulaire ; et un élément de transfert de chaleur 20 qui est composé d'un matériau électroconducteur et qui constitue un trajet de dissipation de chaleur qui s'étend vers les deux surfaces du substrat de câblage 10 dans le trou traversant TH. L'élément de transfert de chaleur 20 est formé d'un seul tenant à partir : d'une partie encastrée 21 qui est ajustée à l'intérieur du trou traversant TH ; et d'une partie exposée de type plaque 22 qui est disposée le long d'une surface du substrat de câblage 10. La partie exposée 22 a une forme sensiblement identique à celle de la borne d'électrode 2a du composant de génération de chaleur 2.
PCT/JP2019/031294 2019-08-08 2019-08-08 Substrat de dissipation de chaleur, et procédé de fabrication de celui-ci WO2021024445A1 (fr)

Priority Applications (2)

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PCT/JP2019/031294 WO2021024445A1 (fr) 2019-08-08 2019-08-08 Substrat de dissipation de chaleur, et procédé de fabrication de celui-ci
JP2019566857A JP7018967B2 (ja) 2019-08-08 2019-08-08 放熱基板、及びその製造方法

Applications Claiming Priority (1)

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PCT/JP2019/031294 WO2021024445A1 (fr) 2019-08-08 2019-08-08 Substrat de dissipation de chaleur, et procédé de fabrication de celui-ci

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0786717A (ja) * 1993-09-17 1995-03-31 Fujitsu Ltd プリント配線板構造体
JP2010205992A (ja) * 2009-03-04 2010-09-16 Hitachi Kokusai Electric Inc プリント基板
JP2015133373A (ja) * 2014-01-10 2015-07-23 株式会社デンソー 回路基板および電子装置
JP2018125515A (ja) * 2017-02-03 2018-08-09 株式会社デンソー 電子装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0786717A (ja) * 1993-09-17 1995-03-31 Fujitsu Ltd プリント配線板構造体
JP2010205992A (ja) * 2009-03-04 2010-09-16 Hitachi Kokusai Electric Inc プリント基板
JP2015133373A (ja) * 2014-01-10 2015-07-23 株式会社デンソー 回路基板および電子装置
JP2018125515A (ja) * 2017-02-03 2018-08-09 株式会社デンソー 電子装置

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JP7018967B2 (ja) 2022-02-14

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