WO2021022982A1 - Ensemble circuit et dispositif électronique - Google Patents

Ensemble circuit et dispositif électronique Download PDF

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Publication number
WO2021022982A1
WO2021022982A1 PCT/CN2020/102022 CN2020102022W WO2021022982A1 WO 2021022982 A1 WO2021022982 A1 WO 2021022982A1 CN 2020102022 W CN2020102022 W CN 2020102022W WO 2021022982 A1 WO2021022982 A1 WO 2021022982A1
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WO
WIPO (PCT)
Prior art keywords
space
circuit board
electronic component
filling material
isolation structure
Prior art date
Application number
PCT/CN2020/102022
Other languages
English (en)
Chinese (zh)
Inventor
史洪宾
黎上源
汪志强
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2021022982A1 publication Critical patent/WO2021022982A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly

Definitions

  • This application relates to the field of electronic equipment, and more specifically, to a circuit assembly and electronic equipment in the field of electronic equipment.
  • soldering electronic components can not only fix the position of each electronic component, but also conduct each electronic component to realize the diversified functions of the electronic device.
  • underfill material underfill
  • This filling process can also be referred to as a dispensing process. Since the filling material is usually a fluid, various new problems will be introduced at the same time as the filling material is introduced, such as leakage of glue, explosion of glue, and damage to electronic components.
  • the present application provides a circuit assembly and electronic equipment, aiming to reduce the negative impact caused by the introduction of filler materials.
  • a circuit assembly including: a circuit board; a first electronic component arranged on the circuit board, and there is a space between the electronic institute component and the circuit board; and a filling material located in The first interval space in the interval space; one or more first isolation structures located in the interval space, and the first isolation structure is disposed on the circuit board and/or the first electronic component , Wherein the first isolation structure is located between a second interval space in the interval space and the first interval space, and the second interval space is a space in the interval space that is not filled with the filling material ,
  • the first isolation structure is a protrusion or a groove.
  • the circuit board may be a substrate.
  • the circuit board may be a main board, a frame board (FB), etc.
  • the first electronic component may be, for example, an embedded multimedia card (EMMC), a system in package (SiP) component, an antenna in package (AiP), a system on chip (SOC) Components, double data rate (double data rate, DDR) memory, etc.
  • EMMC embedded multimedia card
  • SiP system in package
  • AuP antenna in package
  • SOC system on chip
  • the interval space includes a first interval space filled with a filling material and a second interval space not filled with a filling material.
  • an isolation structure is provided in the interval space so that the filling material can be filled in the preset interval space, which can ensure the stable connection relationship of the circuit components, and avoid the problems of glue leakage, glue explosion, and damage to electronic components. .
  • the process of setting bumps is usually an additive manufacturing process
  • the process of setting grooves is usually a subtractive manufacturing process.
  • the connection relationship between the first electronic component and the circuit board needs to be released.
  • the bumps are likely to fail due to heat during the repair process, so the bumps need to be fixed again during the repair process; the grooves will not disappear during the repair process, and the filling material that has been filled in the grooves will still It is easily removed due to heat, and the repair process is relatively simple.
  • the protrusion is a welding rod or an electronic component.
  • the electronic components are usually arranged at intervals. Due to the gap between the electronic components and the electronic components, the barrier effect of the electronic components is relatively poor. However, the height of the electrode is often limited. When the height of the spacing space is high, the barrier effect of the electronic components is relatively better.
  • the isolation structure of the resin material will increase the process complexity. Because the soldering temperature is relatively high, for example, the soldering temperature of tin solder, silver solder, and copper solder is around 245°C, while the solidification temperature of resin materials is relatively low, generally around 150°C. Therefore, the solidification of ordinary resin materials cannot be carried out together with welding, that is, the welding process and the isolation structure forming process cannot be realized at the same time in one process step. If a special curing resin material or special solder is used to complete the curing of the resin material while the welding is heating, on the one hand, it will increase the manufacturing cost of the parts. On the other hand, the resin material will affect the shape of the solder ball during the curing process. Affect welding yield.
  • the welding process and the isolation structure forming process are performed separately.
  • the forming process is increased.
  • the solder balls formed by the welding process will be subjected to secondary heating, which affects the mechanical properties of the solder balls. It has been verified that the use of solder and electronic components will not affect the electrical performance of other electronic components. For example, when an antenna radiator or radio frequency chip is installed on the circuit board, the use of solder and electronic components will not affect the working state of the antenna radiator or radio frequency chip.
  • the plurality of first isolation structures include two electrodes that are not connected to each other.
  • dividing the welding rod is beneficial to layout the circuit on the circuit board and reduce the circuit wiring complexity.
  • the one or more first isolation structures are a welding rod frame formed by a plurality of welding rods connected end to end, and the filling material is located outside the welding rod frame .
  • the method of processing the welding rod frame is, for example, placing another steel plate on the hollowed-out position of the steel plate to form a hollowed pattern that is connected end to end; another example is to print solder in multiple times.
  • the method of processing the welding rod frame may also be to spray solder around the interface between the first space and the second space.
  • the method of processing the welding rod frame may also be to place a ring-shaped solder tin plate around the interface between the first space and the second space.
  • a circuit is provided on the circuit board, and the one or more first isolation structures include electronic components electrically connected to the circuit board.
  • the existing electronic components can be fully utilized to fill the predetermined area with the filling material, and the amount of changes to the circuit components is small.
  • the one or more first isolation structures include a groove, and a bottom surface of the groove is one of a solder resist material, a conductive material, and an insulating material.
  • grooves of different depths can be obtained according to the flow rate of the blocking filling material.
  • the depth of the groove is relatively shallow, and when the bottom surface of the groove is made of conductive material or insulating material, the depth of the groove is relatively deep. The deeper the groove is, the more filling material can be accommodated and the better the blocking effect of the groove. However, if the depth of the groove is as deep as the conductive layer or the insulating layer, it may affect the circuit routing.
  • the graphics projected on the circuit board at the interface between the first space and the second space are rectangular, and the plurality of The first isolation structure includes four welding rods that are not connected to each other, and the four welding rods are respectively located on four sides of the rectangle.
  • the graphics projected on the circuit board at the interface between the first space and the second space are rectangular, and the plurality of The first isolation structure includes eight welding electrodes that are not connected to each other, and two welding electrodes are arranged on any one of the four sides of the rectangle.
  • the barrier effect of 8 mutually disconnected electrodes is slightly worse, but it can facilitate the layout of the circuit on the circuit board.
  • the surface where the electrode is provided is usually also provided with a circuit, and the circuit usually does not pass through the electrode. Therefore, if the circuit in the first space needs to be electrically connected to the circuit in the second space, it can be connected with the electrode by passing through the electrode. Circuit realization of the area between the electrodes.
  • the graphics projected on the circuit board at the interface between the first space and the second space are rectangular, and the plurality of The first isolation structure includes a plurality of electronic elements, and the electronic elements are arranged on any one of the four sides of the rectangle.
  • the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular, and the one or The plurality of first isolation structures are continuous and uninterrupted annular grooves that are connected end to end, and the annular grooves are located on four sides of the rectangle.
  • the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular
  • the one or The plurality of first isolation structures include a plurality of electronic components and two welding electrodes that are not connected to each other, the plurality of electronic components are located on two mutually perpendicular sides of the rectangle, and the two welding electrodes are respectively located on the rectangular The remaining two sides.
  • the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular
  • the one or The plurality of first isolation structures includes two unconnected grooves and two unconnected welding rods, the two welding rods are respectively located on two mutually parallel sides of the rectangle, and the two grooves are respectively Located on the remaining two sides of the rectangle.
  • the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular
  • the one or The plurality of first isolation structures include two unconnected grooves and a plurality of electronic components, the plurality of electronic components are located on two mutually parallel sides of the rectangle, and the two grooves are respectively located in the On the remaining two sides of the rectangle.
  • the circuit assembly further includes: one or more second isolation structures, arranged on one side of the first isolation structure and wrapped by the filling material
  • the second isolation structure is one or more of a welding rod, an electronic component, and a groove.
  • the stability of the barrier filling material is enhanced to ensure that the filling material does not, for example, the second interval space.
  • the graphics projected on the circuit board at the interface between the first space and the second space are rectangular, and the plurality of The first isolation structure includes four electrodes that are not connected to each other, the four electrodes are respectively located on four sides of the rectangle, the plurality of second isolation structures include four electrodes that are not connected to each other, and the second isolation The structure is located on one side of the closest first isolation structure and is parallel to the first isolation structure closest to the distance.
  • the graphics projected on the circuit board at the interface between the first space and the second space are rectangular
  • the plurality of The first isolation structure includes a plurality of electronic components
  • the electronic components are arranged on any one of the four sides of the rectangle
  • the plurality of second isolation structures include a plurality of electronic components
  • the second isolation structure is located at a distance One side of the closest first isolation structure and the closest first isolation structure are parallel to each other.
  • the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular, and the one or The plurality of first isolation structures and the one or more second isolation structures are all continuous and uninterrupted annular grooves that are connected end to end, and the one or more first isolation structures are located on four sides of the rectangle , The one or more second isolation structures are located on the outer periphery of the rectangle.
  • the graphics projected on the circuit board at the interface between the first space and the second space are rectangular
  • the plurality of The first isolation structure includes four electrodes that are not connected to each other, the four electrodes are respectively located on four sides of the rectangle
  • the plurality of second isolation structures include a plurality of electronic components
  • the second isolation structures are located at a distance from each other.
  • One side of the closest first isolation structure and the closest first isolation structure are parallel to each other.
  • the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular, and the one or The plurality of first isolation structures are continuous and uninterrupted annular grooves that are connected end to end, the annular grooves are located on four sides of the rectangle, and the plurality of second isolation structures include four electrodes that are not connected to each other, The second isolation structure is located on one side of the closest first isolation structure and is parallel to the first isolation structure closest to the distance.
  • the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular, and the one or The plurality of first isolation structures are continuous and uninterrupted annular grooves that are connected end to end, the annular grooves are located on four sides of the rectangle, the plurality of second isolation structures include a plurality of electronic components, and the first The two isolation structures are located on one side of the closest first isolation structure and are parallel to the first isolation structure closest to the distance.
  • the graphics projected on the circuit board at the interface between the first space and the second space are rectangular
  • the plurality of The first isolation structure includes three electrodes that are not connected to each other, the three electrodes are respectively located on three sides of the rectangle
  • the plurality of second isolation structures include a plurality of electronic components
  • the second isolation structures are located at a distance from each other.
  • One side of the closest first isolation structure and the closest first isolation structure are parallel to each other.
  • the circuit assembly further includes: a second electronic component located in the second space and arranged on the first electronic component.
  • the second electronic component since the filling material does not fill the second space, the second electronic component will not be damaged due to thermal expansion of the filling material, or the leakage of glue can be avoided.
  • the circuit assembly further includes: a plurality of solder balls, electrically connected between the circuit board and the first electronic component, and located in the first Two compartments; a third electronic component arranged on the circuit board, the third electronic component and the first electronic device are located on both sides of the circuit board, the third electronic component is projected on the The area of the surface of the circuit board intersects or overlaps with the area of the first electronic component projected on the surface.
  • the solder balls connecting the first electronic component and the circuit board can be prevented from being damaged due to the expansion of the filling material.
  • an electronic device including: a circuit board; a first electronic component arranged on the circuit board, and there is a space between the electronic institute component and the circuit board; and a filling material is located The first interval space in the interval space; one or more first isolation structures located in the interval space, and the first isolation structure is disposed on the circuit board and/or the first electronic component , Wherein the first isolation structure is located between a second interval space in the interval space and the first interval space, and the second interval space is a space in the interval space that is not filled with the filling material ,
  • the first isolation structure is a protrusion or a groove; a power source is used to supply power to the circuit board and/or electronic components.
  • the protrusion is a welding rod or an electronic component.
  • the plurality of first isolation structures include two electrodes that are not connected to each other.
  • the one or more first isolation structures are a welding rod frame formed by a plurality of welding rods connected end to end, and the filling material is located outside the welding rod frame .
  • a circuit is provided on the circuit board, and the one or more first isolation structures include electronic components electrically connected to the circuit board.
  • the one or more first isolation structures include a groove, and the bottom surface of the groove is one of a solder resist material, a conductive material, and an insulating material.
  • the graphics projected on the circuit board at the interface between the first interval space and the second interval space is a rectangle
  • the plurality of The first isolation structure includes four welding rods that are not connected to each other, and the four welding rods are respectively located on four sides of the rectangle.
  • the graphics projected on the circuit board at the interface between the first interval space and the second interval space is a rectangle
  • the plurality of The first isolation structure includes eight welding electrodes that are not connected to each other, and two welding electrodes are arranged on any one of the four sides of the rectangle.
  • the graphics projected on the circuit board at the interface between the first interval space and the second interval space is a rectangle
  • the plurality of The first isolation structure includes a plurality of electronic elements, and the electronic elements are arranged on any one of the four sides of the rectangle.
  • the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular, and the one or The plurality of first isolation structures are continuous and uninterrupted annular grooves that are connected end to end, and the annular grooves are located on four sides of the rectangle.
  • the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular
  • the one or The plurality of first isolation structures include a plurality of electronic components and two welding electrodes that are not connected to each other, the plurality of electronic components are located on two mutually perpendicular sides of the rectangle, and the two welding electrodes are respectively located on the rectangular The remaining two sides.
  • the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular
  • the one or The plurality of first isolation structures includes two unconnected grooves and two unconnected welding rods, the two welding rods are respectively located on two mutually parallel sides of the rectangle, and the two grooves are respectively Located on the remaining two sides of the rectangle.
  • the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular
  • the one or The plurality of first isolation structures include two unconnected grooves and a plurality of electronic components, the plurality of electronic components are located on two mutually parallel sides of the rectangle, and the two grooves are respectively located in the On the remaining two sides of the rectangle.
  • the electronic device further includes: one or more second isolation structures arranged on one side of the first isolation structure and wrapped by the filling material
  • the second isolation structure is one or more of a welding rod, an electronic component, and a groove.
  • the graphics projected on the circuit board at the interface between the first interval space and the second interval space is a rectangle
  • the plurality of The first isolation structure includes four electrodes that are not connected to each other, the four electrodes are respectively located on four sides of the rectangle
  • the plurality of second isolation structures include four electrodes that are not connected to each other
  • the second isolation The structure is located on one side of the closest first isolation structure and is parallel to the first isolation structure closest to the distance.
  • the graphics projected on the circuit board at the interface between the first interval space and the second interval space is a rectangle
  • the plurality of The first isolation structure includes a plurality of electronic components
  • the electronic components are arranged on any one of the four sides of the rectangle
  • the plurality of second isolation structures include a plurality of electronic components
  • the second isolation structure is located at a distance One side of the closest first isolation structure and the closest first isolation structure are parallel to each other.
  • the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular, and the one or The plurality of first isolation structures and the one or more second isolation structures are all continuous and uninterrupted annular grooves that are connected end to end, and the one or more first isolation structures are located on four sides of the rectangle , The one or more second isolation structures are located on the outer periphery of the rectangle.
  • the graphics projected on the circuit board at the interface between the first interval space and the second interval space is a rectangle
  • the plurality of The first isolation structure includes four electrodes that are not connected to each other, the four electrodes are respectively located on four sides of the rectangle
  • the plurality of second isolation structures include a plurality of electronic components
  • the second isolation structures are located at a distance from each other.
  • One side of the closest first isolation structure and the closest first isolation structure are parallel to each other.
  • the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular, and the one or The plurality of first isolation structures are continuous and uninterrupted annular grooves that are connected end to end, the annular grooves are located on four sides of the rectangle, and the plurality of second isolation structures include four electrodes that are not connected to each other, The second isolation structure is located on one side of the closest first isolation structure and is parallel to the first isolation structure closest to the distance.
  • the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular, and the one or The plurality of first isolation structures are continuous and uninterrupted annular grooves that are connected end to end, the annular grooves are located on four sides of the rectangle, the plurality of second isolation structures include a plurality of electronic components, and the first The two isolation structures are located on one side of the closest first isolation structure and are parallel to the first isolation structure closest to the distance.
  • the graphics projected on the circuit board at the interface between the first interval space and the second interval space is a rectangle
  • the plurality of The first isolation structure includes three electrodes that are not connected to each other, the three electrodes are respectively located on three sides of the rectangle
  • the plurality of second isolation structures include a plurality of electronic components
  • the second isolation structures are located at a distance from each other.
  • One side of the closest first isolation structure and the closest first isolation structure are parallel to each other.
  • the electronic device further includes: a second electronic component located in the second compartment and arranged on the first electronic component.
  • the electronic device further includes: a plurality of solder balls, electrically connected between the circuit board and the first electronic component, and located in the first Two compartments; a third electronic component arranged on the circuit board, the third electronic component and the first electronic device are located on both sides of the circuit board, the third electronic component is projected on the The area of the surface of the circuit board intersects or overlaps with the area of the first electronic component projected on the surface.
  • Figure 1 is a schematic structural diagram of an electronic device.
  • Fig. 2 is a schematic structural diagram of a circuit assembly.
  • Fig. 3 is a schematic diagram of the projection of electronic components on the circuit board.
  • Fig. 4 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.
  • Fig. 5 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.
  • Fig. 6 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.
  • Fig. 7 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.
  • Fig. 8 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.
  • FIG. 12 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.
  • FIG. 13 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.
  • FIG. 14 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.
  • FIG. 15 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.
  • FIG. 16 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.
  • FIG. 17 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.
  • FIG. 18 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.
  • FIG. 19 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.
  • FIG. 20 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.
  • FIG. 21 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.
  • FIG. 22 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.
  • FIG. 23 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.
  • FIG. 1 is a schematic structural diagram of an electronic device 100 provided by an embodiment of the present application.
  • the electronic device 100 may be a mobile phone, a tablet computer, an e-reader, a notebook computer, a digital camera, a vehicle-mounted device, or a wearable device.
  • the electronic device 100 is a mobile phone as an example for description.
  • the electronic device 100 includes a housing 10, a display screen 20 and a circuit assembly 30.
  • the display screen 20 and the circuit assembly 30 are installed in the housing 10.
  • the housing 10 includes a frame and a back cover.
  • the frame surrounds the outer circumference of the display screen 20 and surrounds the outer circumference of the back cover, and the display screen 20 is spaced apart from the back cover.
  • the cavity formed between the display screen 20, the frame, and the back cover is used for placing the circuit component 30.
  • the electronic device 100 also includes a power supply 40 for powering the circuit assembly 30.
  • the power source 40 may be a lithium electronic battery, for example.
  • FIG. 2 is an example of the circuit component 30 of the electronic device 100 shown in FIG. 1.
  • the circuit assembly 30 may be a printed circuit board assembly (PCBA).
  • the circuit assembly 30 includes a printed circuit board (PCB) 301 and at least one electronic component electrically connected to the PCB.
  • the power supply in FIG. 1 is used to supply power to the PCB 301 and/or the at least one electronic component.
  • the PCB 301 may be, for example, a main board, a frame board (FB), or the like.
  • FIG. 2 shows a frame plate including a through hole 310.
  • the PCB 301 includes a multi-layer conductive layer 3011 and an insulating layer 3013, the conductive layer 3011 and the insulating layer 3013 are stacked, and any two conductive layers 3011 include at least one insulating layer 3013. Any two conductive layers 3011 may be electrically connected through vias 3012.
  • the conductive layer 3011 and the via hole 3012 are represented by a geometric figure filled with a diagonal cross pattern.
  • the PCB 301 also includes soldering areas (that is, pads) that can be used for soldering.
  • the electronic component can be electrically connected to the conductive layer 3011 of the PCB 301 by soldering on the soldering area of the PCB 301, and further, electrically connected to other PCBAs.
  • the drum pattern in FIG. 2 is used to represent the solder balls 320.
  • the electronic components that are electrically connected to the PCB may be, for example, an embedded multimedia card (EMMC) 302a, a system in package (SiP) component 302b, and an antenna in package (AiP) shown in FIG. 2.
  • EMMC embedded multimedia card
  • SiP system in package
  • AiP antenna in package
  • the SiP element 302b may also include universal flash storage (UFS) 302c.
  • UFS universal flash storage
  • AiP 302d may also include a radio frequency chip (RF chip) 302e.
  • RF chip radio frequency chip
  • the EMMC 302a may include multiple chips and packaging materials that package the multiple chips into one body.
  • the geometric figures filled with a dot matrix pattern in Figure 2 are used to represent packaging materials.
  • the EMMC 302a can be fixed on one side of the PCB 301 by welding.
  • a POP component is fixed, that is, the POP component can be fixed on the other side of the PCB 301 by soldering.
  • the area projected by the EMMC 302a on the circuit board 301 is area A
  • the area where the POP element is projected on the circuit board 301 is area B
  • the area A and the area B may cross or overlap.
  • the POP device may include, for example, a SOC device 302f and a DDR memory 302g, that is, the SOC device 302f and the DDR memory 302g may be packaged as a whole by stacking.
  • the SOC element 302f may be electrically connected to the DDR memory 302g through solder balls 320.
  • some filler material can be filled around the solder ball 320 between the PCB301 and the EMMC302a, and some filler material can be filled around the solder ball 320 between the PCB301 and the POP element.
  • the filling material often has a high thermal expansion coefficient, that is, the filling material easily expands when heated.
  • the geometric figures of the horizontal line pattern in Figure 2 are used to represent the filling material.
  • the solder ball 320 and the filling material need to be heated to release the connection relationship between the electronic component and the PCB 301. Due to the overlap between the area A and the area B, the glue explosion is likely to occur during the repair of the circuit assembly 30.
  • the filling material filled between EMMC 302a and PCB 301 will also be heated and expand, causing glue explosion, and cutting off the connection between solder balls 320 and EMMC components .
  • the SiP component 302b may include a plurality of electronic components and a packaging material that encapsulates the plurality of electronic components as a whole.
  • the plurality of electronic components may be DDR or SOC, for example.
  • the geometry of the dot pattern in Figure 2 is used to represent the packaging material.
  • the multiple electronic components in the packaging material can be welded and fixed on the circuit board, and the conduction between the multiple electronic components is realized through the circuit board.
  • the SiP element 302b may further include UFS 302c.
  • the UFS 302c can be welded and fixed on the circuit board, and the UFS 302c can be connected to other electronic components in the SiP component 302b through the circuit board. To save space, UFS 302c can be arranged in the through hole 310 of the frame plate.
  • the SiP component 302b can be fixed on one side of the PCB 301 by soldering.
  • some filler material can be filled around the solder ball 320 between the PCB 301 and the SiP element 302 b.
  • the filler material has a low viscosity and is easy to flow. Therefore, in the process of filling the filling material between the SiP component 302b and the PCB 301, the filling material easily flows into the through hole 310 of the frame board, and glue leakage occurs, resulting in poor filling effect, pollution of the production line, and pollution of electronic components. as a result of.
  • AiP 302d may include an antenna radiator and a radio frequency chip 302e that provides a feed for the antenna radiator. As shown in FIG. 2, the antenna radiator is electrically connected to the PCB 301 through the integrated circuit 360, the radio frequency chip 302e is electrically connected to the PCB 301 through the integrated circuit 360, and the antenna radiator and the radio frequency chip 302e are welded and fixed on both sides of the integrated circuit 360.
  • the AiP 302d can be fixed on one side of the PCB 301 by solder balls 320 arranged around the radio frequency chip 302e. In order to ensure the connection strength, some filler material can be filled around the solder ball 320 between PCB301 and AiP 302d.
  • the filler material may not only wrap the solder ball 320, but also possibly wrap the RF chip 302e.
  • the thermal expansion coefficient of the filling material is relatively high. In scenarios such as changes in ambient temperature or temperature changes caused by changes in the work load of the electronic equipment itself, the filling material that expands when it rises and shrinks when it falls will squeeze And pulling the radio frequency chip 302e wrapped by the filling material, and eventually lead to cracks in the extremely low dielectric constant (ELK) material in the radio frequency chip 302e, and damage the radio frequency chip 302e.
  • ELK extremely low dielectric constant
  • the electronic device 100 may further include one or more PCBs similar to the PCB 301.
  • circuit assembly provided in the embodiment of the present application is introduced below through a common circuit assembly.
  • Figure 3 shows a common circuit assembly, including a circuit board and electronic components arranged on the circuit board. Circuit boards and electronic components are provided with circuits. The circuit board is electrically connected to the electronic component through the solder balls 320, so that the circuit on the circuit board and the circuit on the electronic component can be electrically connected.
  • the drum-shaped pattern in FIG. 3 is used to represent the solder balls 320.
  • the solder balls that electrically connect the electronic components and the circuit board are arranged in the space.
  • Filling materials are also arranged in the space to stabilize the connection relationship between the electronic components and the circuit board.
  • FIGS. 4 to 18 the lower figure shows the separation space between the first electronic component and the circuit board and the components arranged in the separation space, and the upper figure shows the circuit assembly
  • the cross-sectional view of the cross-section and the viewing direction of the cross-section are indicated by the broken line with an arrow in the figure below.
  • FIG. 4 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application.
  • the circuit assembly 400 may be applied to the electronic device 100 shown in FIG. 1.
  • the circuit assembly 400 can replace the circuit assembly 30 shown in FIG. 1.
  • the circuit assembly 400 may include a first electronic component 411 and a circuit board 412. Both the first electronic component 411 and the circuit board 412 are provided with circuits.
  • the first electronic component 411 is electrically connected to the circuit board 412 through solder balls 420. By connecting, electrical connection between the circuit on the first electronic component 411 and the circuit on the circuit board 412 can be realized.
  • the solder balls 420 are located in the second space 414.
  • a filling material 430 is filled in the first space 413.
  • the pattern of horizontal straight lines in FIG. 4 represents the filling material 430.
  • a first separation structure 441 is provided at the junction of the first separation space 413 and the second separation space 414, so that one part of the first separation structure 441 One side is filled with filler material 430 and provided with solder balls, while the other side of the first isolation structure 441 is not filled with filler material 430.
  • the pattern filled with diagonal lines in FIG. 4 represents the first isolation structure 441.
  • four first isolation structures 441 are provided in the space, and the four first isolation structures 441 are all welding rods, and the four welding rods are disconnected from each other.
  • the image projected on the circuit board 412 of the interface between the first space 413 and the second space 414 is a rectangle, and the four welding rods are respectively arranged on the four sides of the rectangle.
  • the height of the electrode should be slightly smaller than the separation distance between the first electronic component 411 and the circuit board 412.
  • the height of the welding rod is 2/3 of the separation distance between the first electronic component 411 and the circuit board 412.
  • the first isolation structure 441 shown in FIG. 4 is disposed on the circuit board 412.
  • first isolation structure 441 may also be provided on the first electronic component 411, as shown in FIG. 5. It should be understood that the first isolation structure 441 may be provided on the first electronic component 411 and the circuit board 412 at the same time. The following will take the first isolation structure provided on the circuit board as an example for description.
  • the first isolation structure may be a welding rod frame formed by connecting 4 welding rods end to end.
  • the area inside the electrode frame is the second interval space
  • the area outside the electrode frame is the first interval space, that is, the filling material is located outside the electrode frame.
  • the barrier effect of the electrode frame is better, making it more difficult for the filler material to flow into the second space.
  • the use of the electrode frame increases the process complexity. In the process of preparing the welding rod, it is necessary to print solder around the interface between the first space and the second space.
  • the common process of printing solder is to place a steel plate containing a hollow pattern on the circuit board, and the solder can leak from the hollowed-out part of the steel plate and smear the circuit board. Since the welding rod frame connected end to end cannot be hollowed out on the steel plate, new processing steps need to be added, such as placing another steel plate on the hollowed out position on the steel plate to form a hollowed out pattern end to end, or printing solder in multiple times.
  • the method of processing the welding rod frame may also be to spray solder around the interface between the first space and the second space.
  • the method of processing the welding rod frame may also be to place a ring-shaped solder tin plate around the interface between the first space and the second space.
  • FIG. 6 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application.
  • the plurality of first isolation structures 541 in FIG. 6 are 8 welding rods, and the 8 welding rods are disconnected from each other.
  • the image projected on the circuit board 512 by the interface between the first space 513 and the second space 514 is rectangular, and two welding rods are provided on each of the four sides.
  • the 8 disconnected electrodes have a slightly worse barrier effect, but they can facilitate the layout of the circuit on the circuit board.
  • the surface where the electrode is provided is usually also provided with a circuit, and the circuit usually does not pass through the electrode.
  • the circuit in the first space 513 needs to be electrically connected to the circuit in the second space 514, it can be passed through Circuit realization of the area between the electrode and the electrode.
  • the circuit can be arranged according to the dotted line from point A to point B.
  • the circuit can be arranged according to the dotted line from point C to point D. It can be seen that in the circuit assembly 500 shown in FIG. 6, due to the increase in the number of welding rods, the area between the welding rod and the welding rod where a circuit can be arranged increases, so that excessive wire can be reduced.
  • FIG. 7 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application.
  • the first isolation structure 641 in FIG. 7 is an electronic component 6411, and the electronic component 6411 is fixed on the circuit board 612 by solder balls 6412.
  • the electronic component 6411 may be, for example, a resistor, an inductor, a capacitor, or the like.
  • the electronic component 6411 can be fixed on the first electronic component 611 or the circuit board 612 through solder balls 6412. Specifically, as shown in FIG.
  • a plurality of first isolation structures 641 are provided between the circuit board and the electronic components, and the plurality of first isolation structures 641 are all electronic components 6411, so that one of the first isolation structures 641 is One side is filled with a filling material 630 and provided with solder balls, while the other side of the first isolation structure 641 is not filled with the filling material 630.
  • the image projected on the circuit board 612 of the interface between the first space 613 and the second space 614 is rectangular, and a plurality of electronic components are arranged on each of the four sides. 6411.
  • the existing electronic component 6411 can be fully utilized to make the filling material 630 fill the preset area, and the amount of modification to the circuit component is less.
  • the electronic component 6411 cannot achieve the corresponding electrical function, the electronic component 6411 can block the filling material 630 from flowing into the second space 614. Since it is installed with other electronic components, the process complexity will not increase. In some cases, for example, the electronic component 6411 located at the edge of the circuit board as an isolation structure can also protect other weak electronic components.
  • the spacing between electronic components 6411 can be shortened.
  • a welding rod is used instead of the solder ball 6412 to fix the electronic component 6411.
  • the separation distance between the first electronic component 611 and the circuit board 612 is small, since the electronic components 6411 are usually arranged at intervals, the barrier effect of the electronic components 6411 is Slightly worse. However, the height of the welding rod is often limited. When the separation distance between the first electronic component 611 and the circuit board 612 is large, the barrier effect of the electronic component 6411 is slightly better.
  • FIG. 8 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application.
  • the only difference from the circuit assembly 400 shown in FIG. 4 is that the first isolation structure 841 in FIG. 8 is a groove.
  • the surface layer of the circuit board is usually a solder resist layer or a conductive layer, the lower part of the solder resist layer is a conductive layer, and the lower part of the conductive layer is an insulating layer. Therefore, the bottom surface of the groove can be one of solder resist material, conductive material, or insulating material.
  • the image projected on the circuit board 812 of the interface between the first space 813 and the second space 814 is a rectangle, and a continuous and uninterrupted ring is arranged around the rectangle.
  • the groove is such that the outer side of the annular groove is filled with a filler material 830 and solder balls are provided, while the outer side of the annular groove is not filled with the filler material 430.
  • the groove can receive the excess filling material 830 during the filling process and the rework process, and prevent the filling material 830 from flowing into the second space 814. During the repair process, the connection relationship between the first electronic component and the circuit board needs to be released. Compared with the circuit assembly 400 shown in FIG.
  • the welding rod is likely to disappear due to heat during the repair process, and the welding rod needs to be processed again, and the process is complicated; the groove will not disappear during the repair process and has been filled in The filling material 830 in the groove is also easily removed due to heat, and the process is relatively simple.
  • the first isolation structure may be one of a welding rod, an electronic component, and a groove.
  • the isolation structure of the resin material will increase the process complexity. Because the soldering temperature is relatively high, for example, the soldering temperature of tin solder, silver solder, and copper solder is around 245°C, while the solidification temperature of resin materials is relatively low, generally around 150°C. Therefore, the solidification of ordinary resin materials cannot be carried out together with welding, that is, the welding process and the isolation structure forming process cannot be realized at the same time in one process step. If a special curing resin material or special solder is used to complete the curing of the resin material while the welding is heating, on the one hand, it will increase the manufacturing cost of the parts.
  • the resin material will affect the shape of the solder ball during the curing process. Affect welding yield. In the two process steps, the welding process and the isolation structure forming process are performed separately. On the one hand, the forming process is increased. On the other hand, the solder balls formed by the welding process will be subjected to secondary heating, which affects the mechanical properties of the solder balls. It has been verified that the use of solder and electronic components will not affect the electrical performance of other electronic components. For example, when an antenna radiator or radio frequency chip is installed on the circuit board, the use of solder and electronic components will not affect the working state of the antenna radiator or radio frequency chip.
  • FIG. 9 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application.
  • the circuit assembly 900 can be applied to the electronic device 100 shown in FIG. 1.
  • the circuit assembly 900 can replace the circuit assembly 30 shown in FIG. 1.
  • the circuit assembly 900 may include a first electronic component 911 and a circuit board 912. Both the first electronic component 911 and the circuit board 912 are provided with circuits.
  • the first electronic component 911 is electrically connected to the circuit board 912 through solder balls 920, so that the An electrical connection between the circuit on the electronic component 911 and the circuit on the circuit board 912.
  • the filling material 930 is filled in the first space 913.
  • the pattern filled with horizontal straight lines in FIG. 9 represents the area filled with the filling material 930.
  • the pouring point of the filling material 930 is F point.
  • a plurality of first isolation structures 941 are provided at the junction of the first interval space 913 and the second interval space 914, which is filled with diagonal lines in FIG.
  • the pattern of represents the first isolation structure 941.
  • the plurality of first isolation structures 941 may include a plurality of electronic components 9411 and a plurality of welding electrodes 9412.
  • the image projected on the circuit board 912 of the interface between the first space 913 and the second space 914 is rectangular, and a plurality of electronic components 9411 are arranged on the upper side, and on the left side. There are multiple electronic components 9411, one electrode 9412 is provided on the lower side, and one electrode 9412 is provided on the right side. Since the pouring point of the filling material 930 is point F, the hydraulic pressure of the filling material 930 near the pouring point is relatively large, and the filling material 930 easily rises to a higher height, while the hydraulic pressure far away from the pouring point is low, and the liquid height of the filling material 930 Lower. In the circuit assembly 900 shown in FIG.
  • the filling material 930 first contacts the multiple electronic components 9411 on the side above the rectangle and on the side on the left side of the rectangle. After a long period of flow, it can interact with the two electrodes 9412. contact. Since the height of the electronic component 9411 can be higher than the height of the welding rod 9412, selecting the electronic component 9411 at the pouring point can prevent the filling material 930 from flowing into the second space 914 due to rising.
  • FIG. 10 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application.
  • the circuit assembly 1000 can be applied to the electronic device 100 shown in FIG. 1.
  • the circuit assembly 1000 can replace the circuit assembly 30 shown in FIG. 1.
  • the circuit assembly 1000 may include a first electronic component 1011 and a circuit board 1012. Both the first electronic component 1011 and the circuit board 1012 are provided with circuits.
  • the first electronic component 1011 is electrically connected to the circuit board 1012 through solder balls 1020, so as to realize the first An electrical connection between the circuit on the electronic component 1011 and the circuit on the circuit board 1012.
  • a filling material 1030 is filled in the first space 1013.
  • the pattern filled with horizontal straight lines in FIG. 10 represents the area filled with the filling material 1030.
  • the pouring points of the filling material 1030 are G1 point and G2 point respectively.
  • a plurality of first isolation structures 1041 are provided at the junction of the first interval space 1013 and the second interval space 1014, which is filled with diagonal lines in FIG.
  • the pattern represents the first isolation structure 1041.
  • the plurality of first isolation structures 1041 may include two welding electrodes 10411 and two grooves 10412. Wherein, the image projected on the circuit board 1012 of the interface between the first space 1013 and the second space 1014 is rectangular, and a welding rod 10411 is provided on the upper side, and on the left side is provided One groove 10412 is provided with a welding rod 10411 on the lower side, and a groove 10412 is provided on the right side.
  • the pouring points of the filling material 1030 are points G1 and G2, more filling material 1030 flows out from the pouring point.
  • the blocking effect of the electrode 10411 is better.
  • the electrode 10411 on the upper side can be replaced with multiple electronic components 1141
  • the electrode 10411 on the lower side can be replaced with multiple electronic components 1141, so as to prevent the filling material 1030 from rising too fast, The rise is too large and flows into the second compartment 1014, as shown in Figure 11.
  • Figures 4 to 11 show examples of arranging a layer of isolation structure according to the interface between the first compartment and the second compartment.
  • one or more isolation structures can be provided on the side of the first isolation structure away from the second interval space. In the present application, there is no filling material in the second space, or there is very little and negligible filling material.
  • the circuit assembly includes one or more first isolation structures, and the first isolation structures are disposed on the circuit board and/or the first electronic component and located between the circuit board and the first electronic component. Between the components, any one of the one or more first isolation structures is one of a welding rod, an electronic component, and a groove; the circuit assembly further includes: one or more second isolation structures, It is arranged on one side of the first isolation structure and is wrapped by the filling material, and the second isolation structure is one or more of a welding rod, an electronic component, and a groove.
  • the filling material is first blocked by the second isolation structure. Since the second isolation structure may have partial barrier failure, such as the inflow of filler material from the part where the electrode is disconnected, the second isolation structure may be wrapped by the filler material, that is, there are filler materials on both sides of the second isolation structure. The small part of the filling material is blocked by the first isolation structure, and the first isolation structure is arranged at the junction of the first interval space and the second interval space. Since the total amount of the filling material that needs to be blocked by the first isolation structure is small, the second isolation structure is combined with the first isolation structure, so that no or very little filling material enters the second interval space, and the effect of isolating the filling material is better .
  • the second isolation structure may be disposed on the circuit board or the first electronic component, and the first isolation structure may be disposed on the circuit board or the first electronic component.
  • the second isolation structure and the first isolation structure are both arranged on the circuit board; another example, the second isolation structure and the first isolation structure are both arranged on the first electronic component; another example, the second isolation structure is arranged on the circuit board
  • the first isolation structure is arranged on the first electronic component; for another example, the second isolation structure is arranged on the first electronic component, and the first isolation structure is arranged on the circuit board.
  • the second isolation structure and the first isolation structure are both provided on the circuit board as an example for description.
  • FIG. 12 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application.
  • the circuit assembly 1200 can be applied to the electronic device 100 shown in FIG. 1.
  • the circuit assembly 1200 can replace the circuit assembly 30 shown in FIG. 1.
  • the circuit assembly 1200 may include a first electronic component 1211 and a circuit board 1212. Both the first electronic component 1211 and the circuit board 1212 are provided with circuits.
  • the first electronic component 1211 is electrically connected to the circuit board 1212 through solder balls 1220, thereby achieving the An electrical connection between the circuit on the electronic component 1211 and the circuit on the circuit board 1212.
  • first space 1213 and a second space 1214 between the first electronic component 1211 and the circuit board 1212 that do not overlap each other, and the solder balls 1220 are located in the second space 1214.
  • a filling material 1230 is filled in the first space 1213.
  • the pattern filled with horizontal straight lines in FIG. 12 represents the area filled with the filling material 1230.
  • a plurality of first isolation structures 1241 and a plurality of second isolations are provided around the interface of the first spacing space 1213 and the second spacing space 1214 Structure 1242.
  • the pattern filled with diagonal lines in FIG. 12 represents the first isolation structure 1241 or the second isolation structure 1242.
  • the first isolation structure 1241 and the second isolation structure 1242 may be welding rods.
  • a plurality of first isolation structures are provided on the interface between the first space 1213 and the second space 1214.
  • the image projected on the circuit board 1212 by the interface between the first space 1213 and the second space 1214 is a rectangle, and the four mutually disconnected welding rods are respectively arranged on the four sides of the rectangle.
  • the plurality of second isolation structures 1242 may include four welding rods, and the four welding rods are disconnected from each other.
  • the second isolation structure 1242 is located on the side of the nearest first isolation structure 1241, is arranged parallel to the nearest first isolation structure 1241, and is located outside the second spacing space 1214.
  • FIG. 13 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application.
  • the plurality of first isolation structures 1341 and the plurality of second isolation structures 1342 in the circuit assembly 1300 are all electronic components.
  • the image projected on the circuit board 1312 of the interface between the first space 1313 and the second space 1314 is rectangular, and a plurality of first spaces are arranged on each of the four sides.
  • a plurality of second isolation structures 1342 are provided on the outer periphery of the interface between the first separation space 1313 and the second separation space 1314. It can be seen from FIG.
  • the filling material 1330 ensures that the filling material 1330 will not enter the second space 1314.
  • the existing electronic components can be fully utilized to make the filling material 1330 fill the preset area, and the amount of changes to the circuit components is less; while the electronic components cannot
  • the electronic components can be installed together with other electronic components without increasing process complexity, and in some cases, other weak electronic components can also be protected.
  • the height of the welding rod is often limited. When the separation distance between the first circuit board and the circuit board is large, the barrier effect of the electronic components is slightly better.
  • the spacing between electronic components can be shortened.
  • FIG. 14 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application. The difference from FIG. 12 is that the first isolation structure 1441 and the second isolation structure 1442 in the circuit assembly 1400 are both continuous and uninterrupted annular grooves connected end to end.
  • the surface layer of the circuit board is usually a solder resist layer or a conductive layer, the lower part of the solder resist layer is a conductive layer, and the lower part of the conductive layer is an insulating layer. Therefore, the bottom surface of the annular groove can be one of solder resist material, conductive material, or insulating material. As shown in FIG.
  • the image projected on the circuit board 1412 of the interface between the first spacing space 1413 and the second spacing space 1414 is rectangular, and the first isolation structure 1441 is provided on the rectangular frame;
  • the second isolation structure 1442 is provided on the outer periphery of the interface between a spacing space 1413 and the second spacing space 1414. Therefore, in the case that the second isolation structure 1442 cannot completely accept the excess filling material 1430, the first isolation structure 1441 accepts the excess filling material 1430 not accepted by the second isolation structure 1442, ensuring that the filling material 1430 will not enter The second compartment 1414.
  • the groove can receive the excess filling material 1430 during the filling process and the rework process, so as to prevent the filling material 1430 from flowing into the second space 1414.
  • the connection relationship between the first electronic component and the circuit board needs to be released.
  • the welding rod is likely to disappear due to heat during the repair process, and the welding rod needs to be processed again.
  • the process is complicated; and the groove will not disappear during the repair process and has been filled in
  • the filling material 1430 in the groove is also easily removed due to heat, and the process is relatively simple.
  • the first isolation structure may be one of a welding rod, an electronic component, and a groove
  • the second isolation structure may be one of a welding rod, an electronic component, and the groove.
  • the isolation structure of the resin material will increase the process complexity. Because the soldering temperature is relatively high, for example, the soldering temperature of tin solder, silver solder, and copper solder is around 245°C, while the solidification temperature of resin materials is relatively low, generally around 150°C. Therefore, the solidification of ordinary resin materials cannot be carried out together with welding, that is, the welding process and the isolation structure forming process cannot be realized at the same time in one process step.
  • a special curing resin material or special solder is used to complete the curing of the resin material while the welding is heating, on the one hand, it will increase the manufacturing cost of the parts.
  • the resin material will affect the shape of the solder ball during the curing process. Affect welding yield.
  • the welding process and the isolation structure forming process are performed separately.
  • the forming process is increased.
  • the solder balls formed by the welding process will be subjected to secondary heating, which affects the mechanical properties of the solder balls. It has been verified that the use of solder and electronic components will not affect the electrical performance of other electronic components.
  • FIG. 15 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application.
  • the circuit component 1500 may be applied to the electronic device 100 shown in FIG. 1.
  • the circuit assembly 1500 can replace the circuit assembly 30 shown in FIG. 1.
  • the circuit assembly 1500 may include a first electronic component 1511 and a circuit board 1512. Both the first electronic component 1511 and the circuit board 1512 are provided with circuits.
  • the first electronic component 1511 is electrically connected to the circuit board 1512 through solder balls 1520, so as to realize the first electronic component 1511.
  • a filling material 1530 is filled in the first space 1513.
  • the pattern filled with horizontal straight lines in FIG. 15 represents the area filled with the filling material 1530.
  • a plurality of first isolation structures 1541 and a plurality of second isolation structures 1542 are provided at the junction of the first interval space 1513 and the second interval space 1514 .
  • the pattern filled with diagonal lines in FIG. 15 represents the first isolation structure 1541 or the second isolation structure 1542.
  • the first isolation structure 1541 may be a welding rod.
  • a plurality of first isolation structures are provided on the interface between the first space 1513 and the second space 1514.
  • the image projected on the circuit board 1512 of the interface between the first space 1513 and the second space 1514 is a rectangle, and the four mutually disconnected welding rods are respectively arranged on the four sides of the rectangle.
  • the second isolation structure 1542 may be an electronic component.
  • the second isolation structure 1542 is located on the side of the closest first isolation structure 1541, is arranged parallel to the closest first isolation structure 1541, and is located outside the second separation space 1514. Since the filling material 1530 is usually filled from the outside to the inside, the hydraulic pressure near the second isolation structure 1542 is relatively large, and the filling material 1530 is easy to rise to a higher height. Therefore, relatively high electronic components can be selected as the second isolation structure 1542. More appropriate; as the filling material 1530 flows, the hydraulic pressure of the filling material 1530 is gradually reduced, so a relatively low height electrode can be selected as the first isolation structure 1541 to further ensure a small amount that is not blocked by the second isolation structure 1542 The filling material 1530 will not enter the second space 1514.
  • FIG. 16 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application.
  • the circuit component 1600 can be applied to the electronic device 100 shown in FIG. 1.
  • the circuit assembly 1600 can replace the circuit assembly 30 shown in FIG. 1.
  • the circuit assembly 1600 may include a first electronic component 1611 and a circuit board 1612. Both the first electronic component 1611 and the circuit board 1612 are provided with circuits.
  • the first electronic component 1611 is electrically connected to the circuit board 1612 through solder balls 1620, so as to realize the first An electrical connection between the circuit on the electronic component 1611 and the circuit on the circuit board 1612.
  • first space 1613 and a second space 1614 that do not overlap with each other between the first electronic component 1611 and the circuit board 1612, and the solder balls 1620 are located in the second space 1614.
  • a filling material 1630 is filled in the first space 1613.
  • the pattern filled with horizontal straight lines in FIG. 16 represents the area filled with the filling material 1630.
  • a first isolation structure 1641 and a plurality of second isolation structures 1642 are provided at the junction of the first interval space 1613 and the second interval space 1614.
  • the pattern filled with diagonal lines in FIG. 16 represents the first isolation structure 1641 or the second isolation structure 1642.
  • the first isolation structure 1641 is a continuous and uninterrupted annular groove connected end to end.
  • the image projected on the circuit board 1612 of the interface between the first space 1613 and the second space 1614 is rectangular, and the first isolation structure 1641 is provided on the rectangular frame.
  • the plurality of second isolation structures 1642 are provided outside the contour groove, that is, outside the second spacing space.
  • the plurality of second isolation structures 1642 may be 4 welding rods, and the 4 welding rods are disconnected from each other.
  • any electrode is parallel to one side of the annular groove. Since the filling material 1630 is usually filled from the outside to the inside, there are more filling materials 1630 close to the outside of the space. Compared with the groove with limited capacity, it is more suitable to choose the welding rod as the second isolation structure 1642; and as the filling material 1630 flows Since there is less filling material 1630 close to the inner side of the spacing space, the groove can be used to receive the excess filling material 1630 to further ensure that the small amount of filling material 1630 not blocked by the second isolation structure 1642 will not enter the second spacing space 1614. Similarly, the second isolation structure 1642 can be replaced with electronic components.
  • each welding rod can be replaced with multiple electronic components 17421, so as to prevent the filling material 1730 from rising too fast and increasing too much.
  • the filling material 1730 flows into the groove, thereby avoiding the situation that the first isolation structure 1741 cannot bear too much filling material, as shown in FIG. 17.
  • the first isolation structure may be arranged at the interface position between the first interval space and the second interval space.
  • the second isolation structure may be a side where the first isolation structure is arranged, located outside the second interval space, and may be wrapped by a filling material.
  • the specific setting position of the first isolation structure is related to the blocking effect that can be achieved.
  • the specific setting position of the second isolation structure is related to the blocking effect that can be achieved. Therefore, you can flexibly choose where to use the isolation structure according to the actual situation. Further, the type of isolation structure can be flexibly selected according to the actual situation.
  • a first isolation structure may be provided at a position of a part of the interface between the first interval space and the second interval space.
  • the circuit assembly 1800 may include a first electronic component 1811 and a circuit board 1812. Both the first electronic component 1811 and the circuit board 1812 are provided with circuits.
  • the first electronic component 1811 is electrically connected to the circuit board 1812 through solder balls 1820. By connecting, electrical connection between the circuit on the first electronic component 1811 and the circuit on the circuit board 1812 can be realized.
  • a filling material 1830 is filled in the first space 1813.
  • the pattern filled with horizontal straight lines in FIG. 18 represents the area filled with the filling material 1830.
  • the pouring point of the filling material 1830 is K point.
  • a plurality of first separation structures 1841 are provided at the junction of the first separation space 1813 and the second separation space 1814.
  • the figure enclosed by the interface between the first compartment 1813 and the second compartment 1814 is a rectangle, and the first isolation structure 1841 is provided on the three sides of the rectangle located on the upper, left, and right sides.
  • the second isolation structure 1842 can be provided on the side of the first isolation structure 1841 close to the casting position.
  • the second isolation structure 1842 is an electronic element to resist the filling material 1830 with a larger increase.
  • a common point of the embodiments shown in FIGS. 4 to 18 is that the solder balls that electrically connect the first electronic component and the circuit board are located in the second space, so as to prevent the filling material from wrapping between the first electronic component and the circuit board. Part of the solder balls.
  • the following describes a possible application scenario of the embodiments shown in FIGS. 4 to 18 through a specific example (as shown in FIG. 19). Benefiting from the guidance presented in the embodiment shown in FIG. 19, those skilled in the art will think of many improvements and other embodiments of the present application. Therefore, it should be understood that the present application is not limited to the specific embodiments disclosed.
  • FIG. 19 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application.
  • the circuit assembly 1900 may include a first electronic component 1911, a circuit board 1912, and a second electronic component 1916.
  • the first electronic component 1911 is an EMMC
  • the circuit board 1912 is a PCB
  • the second electronic component 1916 is a POP component.
  • the EMMC may include multiple chips and packaging materials that package the multiple chips into one body.
  • the geometric figures filled with a dot matrix pattern in Fig. 19 are used to represent packaging materials.
  • the first electronic component 1911 may be fixed to one side of the circuit board 1912 by welding.
  • the drum pattern in Figure 19 is used to represent the solder balls 1920.
  • a second electronic component 1916 is fixed.
  • the second electronic component 1916 is a POP component, that is, the POP component can be fixed on the other side of the PCB 301 by soldering.
  • the POP device may include, for example, a SOC device and a DDR memory, that is, the SOC device and the DDR memory may be packaged as a whole in a stacked manner.
  • the SOC element can be electrically connected to the DDR memory through solder balls 1920.
  • the area where the first electronic component 1911 is projected on the surface of the circuit board 1912 is area A
  • the area where the second electronic component 1916 is projected on the surface of the circuit board 1912 is area B
  • the area A and the area B overlap or overlap.
  • the interval space between the first electronic component 1911 and the circuit board 1912 may be divided into a first interval space 1913 filled with a filling material 1930 and a second interval space 1914 not filled with a filling material 1930.
  • one or more first isolation structures 1941 may be provided at the junction of the first interval space 1913 and the second interval space 1914, and the first isolation structure 1941 may be one of a welding rod, an electronic component, and a groove.
  • the first isolation structure 1941 may be one of a welding rod, an electronic component, and a groove.
  • the blocking effect may be poor, or the components located in the second spacing space 1914 are more sensitive to the filling material 1930, it can be located on the side of the first isolation structure.
  • a second isolation structure 1942 is provided outside the second interval space to further ensure that the filling material 1930 does not enter the second interval space.
  • the manner of providing the second isolation structure 1942 can refer to the embodiments shown in FIGS. 12 to 18.
  • FIG. 20 the lower figure shows the separation space between the first electronic component and the circuit board and the components arranged in the separation space
  • the upper figure shows a cross-sectional view of the circuit assembly
  • Its cross-section and the viewing direction of the cross-section are represented by a broken line with an arrow in the figure below.
  • FIG. 20 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application.
  • the circuit assembly 2000 can be applied to the electronic device 100 shown in FIG. 1.
  • the circuit assembly 2000 can replace the circuit assembly 30 shown in FIG. 1.
  • the circuit assembly 2000 may include a first electronic component 2011 and a circuit board 2012. Both the first electronic component 2011 and the circuit board 2012 are provided with circuits.
  • the first electronic component 2011 is electrically connected to the circuit board 2012 through solder balls 2020. Connection, so that electrical connection between the circuit on the first electronic component 2011 and the circuit on the circuit board 2012 can be realized.
  • FIG. 20 shows that the second electronic component 2016 is fixed on the first electronic component 2011 by solder balls 2020.
  • a filling material 2030 is filled in the first space 2013.
  • the pattern filled with horizontal straight lines in FIG. 20 represents the area filled with the filling material 2030.
  • the material undergoes thermal expansion or contraction to damage the second electronic component 2016 or the connection relationship between the second electronic component 2016 and the first electronic component 2011), and a first compartment is provided at the junction of the first compartment 2013 and the second compartment 2014
  • An isolation structure 2041 such that one side of the first isolation structure 2041 is filled with a filling material 2030, and on the other side of the first isolation structure 2041, neither the filling material 2030 is filled, but also a second electronic component is provided Solder balls between 2016 and the first electronic component 2011.
  • the pattern filled with diagonal lines in FIG. 20 represents the first isolation structure 2041. Taking FIG. 20 as an example, four first isolation structures 2041 are provided in the space, and the four first isolation structures 2041 are all welding rods, and the four welding rods are disconnected from each other.
  • the image projected on the circuit board 2012 of the interface between the first separation space 2013 and the second separation space 2014 is a rectangle, and the four welding rods are respectively arranged on the four sides of the rectangle.
  • the height of the electrode should be slightly smaller than the separation distance between the first electronic component 2011 and the circuit board 2012.
  • the height of the welding rod is 2/3 of the separation distance between the first electronic component 2011 and the circuit board 2012.
  • the first isolation structure 2041 shown in FIG. 20 is disposed on the circuit board 2012. It should be understood that the first isolation structure 2041 may also be disposed on the first electronic component 2011. It should be understood that the first isolation structure 2041 may be provided on the first electronic component 2011 and the circuit board 2012 at the same time. The following will take the first isolation structure provided on the circuit board as an example for description.
  • the isolation structure can be set with reference to the embodiment shown in FIGS. 5 to 18 (for example, one or more first isolation structures are set with reference to FIGS. 4 to 11, and one or more first isolation structures are set with reference to FIGS. 12 to 18).
  • One first isolation structure and one or more second isolation structures are set with reference to FIGS. 5 to 18 (for example, one or more first isolation structures are set with reference to FIGS. 4 to 11, and one or more first isolation structures are set with reference to FIGS. 12 to 18).
  • FIG. 21 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application.
  • the circuit assembly 2100 may include a first electronic component 2111, a circuit board 2112, and a second electronic component 2116.
  • the first electronic component 2111 is an antenna radiator package
  • the circuit board 2112 is a PCB
  • the second electronic component 2116 is a radio frequency chip.
  • the antenna radiator package may include an antenna radiator and an integrated circuit 2160 electrically connected between the antenna radiator and the radio frequency chip.
  • the antenna radiator package can be fixed on one side of the PCB by soldering.
  • There is an interval space between the antenna radiator package and the PCB, and the radio frequency chip is arranged in the interval space and fixed on one side of the antenna radiator package by solder balls.
  • the space between the antenna radiator package and the PCB may be divided into a first space 2113 filled with a filling material 2130 and a second space 2114 not filled with a filling material 2130.
  • one or more first isolation structures 2141 may be provided at the junction of the first interval space 2113 and the second interval space 2114, and the first isolation structure 2141 may be one of a welding rod, an electronic component 21411, and a groove.
  • the first isolation structure 2141 may be one of a welding rod, an electronic component 21411, and a groove.
  • the blocking effect may be poor, or the components located in the second spacing space 2114 are more sensitive to the filling material 2130.
  • a second isolation structure 2142 is arranged outside the second interval space to further ensure that the filling material 2130 does not enter the second interval space.
  • the manner of providing the second isolation structure 2142 refer to the embodiments shown in FIGS. 12 to 18.
  • FIG. 22 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application.
  • the circuit assembly 2200 may include a first electronic component 2211, a circuit board 2212, and a second electronic component 2216.
  • the first electronic component 2211 is a SiP component
  • the circuit board 2212 is a frame board including a through hole 2210
  • the second electronic component 2216 is a UFS.
  • the SiP component may include a plurality of electronic components 22411 and a packaging material that encapsulates the plurality of electronic components 22411 as a whole.
  • the plurality of electronic components 22411 may be DDR or SOC, for example.
  • the geometric figures filled with dot matrix patterns in Fig. 22 are used to represent packaging materials.
  • the SiP element can be fixed on one side of the frame board by welding, wherein the solder balls used to connect the SiP element are arranged around the through hole 2210 of the frame board.
  • the drum pattern in Fig. 22 is used to represent solder balls.
  • the UFS is arranged in the through hole 2210 of the frame plate. There is an interval space between the SiP element and the frame plate, and the filling material 2230 can be filled in the interval space. The filling material 2230 can easily flow into the through hole 2210 of the frame plate, causing glue leakage.
  • the spacing space between the SiP element and the frame plate may be divided into a first spacing space 2213 filled with a filling material 2230 and a second spacing space 2214 not filled with a filling material 2230.
  • one or more first isolation structures 2241 may be provided at the junction of the first interval space 2213 and the second interval space 2214, and the first isolation structure 2241 may be one of a welding rod, an electronic component 22411, and a groove.
  • the first isolation structure 2241 may be one of a welding rod, an electronic component 22411, and a groove.
  • the blocking effect may be poor, or the components located in the second spacing space 2214 are more sensitive to the filling material 2230, it can be placed on the side of the first isolation structure,
  • a second isolation structure 2242 is provided outside the second interval space to further ensure that the filling material 2230 does not enter the second interval space.
  • the manner of providing the second isolation structure 2242 can refer to the embodiments shown in FIGS. 12 to 18.
  • FIG. 23 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application.
  • the circuit component 2300 can be applied to the electronic device 100 shown in FIG. 1.
  • the circuit assembly 2300 can replace the circuit assembly 30 shown in FIG. 1.
  • the circuit assembly 2300 may include a circuit board 2312 and a plurality of electronic components arranged on the circuit board 2312 (electronic components 2311a, 2311b, 2311c, 2316a as shown in FIG. 23).
  • the circuit board 2312 shown in FIG. 23 is a frame board.
  • the circuit board 2312 is provided with a circuit, each of the plurality of electronic components is provided with a circuit, and each electronic component is electrically connected to the circuit board 2312 through solder balls 2320.
  • a solder ball 2320 as shown in FIG. 23 can also be arranged around each electronic component.
  • the plurality of electronic components may include a first electronic component 2311a, a second electronic component 2311b, a third electronic component 2311c, and a fourth electronic component 2316a.
  • the circuit assembly 2300 further includes a fifth electronic component 2316b and a sixth electronic component 2316c, The fifth electronic component 2316b is fixed on the second electronic component 2311b by solder balls 2320, and the sixth electronic component 2316c is fixed on the third electronic component 2311c by solder balls 2320.
  • the first electronic component 2311a may be an EMMC.
  • the area where the first electronic component 2311a is projected on the circuit board 2312 is A, and the fourth electronic component 2316a is mounted on the other side of the circuit board 2312, and the area where the fourth electronic component 2316a is projected on the circuit board 2312 is B.
  • a and area B overlap or overlap.
  • the fourth electronic component 2316a may be a POP component.
  • the POP element may include, for example, a SOC element and a DDR memory.
  • the filling material 2330 is filled in the first space 2313a.
  • the pattern filled with horizontal straight lines in FIG. 23 represents the area filled with the filling material 2330.
  • in the first compartment 2313a A plurality of first isolation structures 2341a are provided at the junction with the second spacing space 2314a, so that one side of the first isolation structure 2341a is filled with the filling material 2330, and the other side of the first isolation structure 2341a is not filled with the filling material Material 2330.
  • the pattern filled with diagonal lines in FIG. 23 represents the first isolation structure 2341a.
  • the plurality of first isolation structures 2341a are 4 mutually disconnected electrodes.
  • the image projected on the circuit board 2312 of the interface between the first space 2313a and the second space 2314a is a rectangle, and the four welding rods are respectively arranged on the four sides of the rectangle.
  • the height of the electrode should be slightly smaller than the separation distance between the first electronic component 2311a and the circuit board 2312.
  • the height of the welding rod is 2/3 of the separation distance between the first electronic component 2311a and the circuit board 2312.
  • the second electronic component 2311b may be a SiP component. There is a third space 2313b and a fourth space 2314b between the second electronic component 2311b and the circuit board 2312 that do not overlap each other. A fifth electronic component 2316b is provided in the fourth compartment 2314b. The fifth electronic component 2316b may be UFS, for example. The fifth electronic component 2316b may be disposed in the through hole 2310 of the frame board. In order to stabilize the connection relationship between the second electronic component 2311b and the circuit board 2312, a filling material 2330 is filled in the third space 2313b. The pattern filled with horizontal straight lines in FIG. 23 represents the area filled with the filling material 2330.
  • a plurality of second isolation structures 2341b are provided, such that one side of the second isolation structure 2341b is filled with the filling material 2330, and the other side of the second isolation structure 2341b is not filled with the filling material 2330.
  • the pattern filled with diagonal lines in FIG. 23 represents the second isolation structure 2341b. Taking FIG. 23 as an example, the plurality of second isolation structures 2341b are 4 mutually disconnected electrodes.
  • the image projected on the circuit board 2312 of the interface between the third space 2313b and the fourth space 2314b is a rectangle, and the four welding rods are respectively arranged on the four sides of the rectangle.
  • the height of the electrode should be slightly smaller than the separation distance between the second electronic component 2311b and the circuit board 2312.
  • the height of the welding rod is 2/3 of the separation distance between the second electronic component 2311b and the circuit board 2312.
  • the third electronic component 2311c may be an antenna radiator package. There is a fifth space 2313c and a sixth space 2314c between the third electronic component 2311c and the circuit board 2312 that do not overlap each other. A sixth electronic component 2316c is provided in the sixth compartment 2314c. The sixth electronic component 2316c may be a radio frequency chip.
  • the antenna radiator package may include an antenna radiator and an integrated circuit 2230 electrically connected between the antenna radiator and the radio frequency chip.
  • a filling material 2330 is filled in the fifth space 2313c.
  • the pattern filled with horizontal straight lines in FIG. 23 represents the area filled with the filling material 2330.
  • a plurality of third isolation structures 2341c are provided at the junction of the five compartments 2313c and the sixth compartment 2314c, so that one side of the third isolation structure 2341c is filled with the filling material 2330, and the other side of the third isolation structure 2341c The filling material 2330 is not filled.
  • the pattern filled with diagonal lines in FIG. 23 represents the third isolation structure 2341c.
  • the plurality of third isolation structures 2341c are 4 mutually disconnected electrodes.
  • the image projected on the circuit board 2312 of the interface between the fifth space 2313c and the sixth space 2314c is a rectangle, and the four welding rods are respectively arranged on the four sides of the rectangle.
  • the height of the electrode should be slightly smaller than the separation distance between the third electronic component 2311c and the circuit board 2312.
  • the height of the welding rod is 2/3 of the separation distance between the third electronic component 2311c and the circuit board 2312.
  • isolation structures for blocking the flow of the filling material can be provided at multiple positions of the circuit assembly.
  • the disclosed system, device, and method may be implemented in other ways.
  • the device embodiments described above are only illustrative.
  • the division of the units is only a logical function division, and there may be other divisions in actual implementation, for example, multiple units or components can be combined or It can be integrated into another system, or some features can be ignored or not implemented.
  • the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may be in electrical, mechanical or other forms.
  • the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the objectives of the solutions of the embodiments.
  • each unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units may be integrated into one unit.

Abstract

La présente invention concerne un ensemble circuit, comprenant : une carte de circuit imprimé ; un premier élément électronique disposé sur la carte de circuit imprimé, un espace d'intervalle étant prévu entre le premier élément électronique et la carte de circuit imprimé ; un matériau de remplissage situé dans un premier espace d'intervalle de l'espace d'intervalle ; et une ou plusieurs premières structures d'isolation situées dans l'espace d'intervalle, la première structure d'isolation étant disposée sur la carte de circuit et/ou le premier élément électronique, et étant située entre un second espace d'intervalle et le premier espace d'intervalle de l'espace d'intervalle ; le second espace d'intervalle étant un espace dans l'espace d'intervalle où le matériau de remplissage n'est pas rempli ; la première structure d'isolation étant une saillie ou une rainure. La présente invention concerne un ensemble circuit et un dispositif électronique, qui visent à éviter l'impact négatif provoqué par l'introduction du matériau de remplissage.
PCT/CN2020/102022 2019-08-05 2020-07-15 Ensemble circuit et dispositif électronique WO2021022982A1 (fr)

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CN110461090B (zh) * 2019-08-05 2021-07-16 华为技术有限公司 电路组件以及电子设备
CN113207241B (zh) * 2021-04-19 2022-10-21 厦门强力巨彩光电科技有限公司 Npm贴片机led面区块交叉程序制作方法
CN114786336B (zh) * 2022-04-22 2024-04-30 维沃移动通信(重庆)有限公司 设有电子元件的电路板、电路板的制造方法及电子设备

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