WO2021022982A1

WO2021022982A1 - Circuit assembly and electronic device

Info

Publication number: WO2021022982A1
Application number: PCT/CN2020/102022
Authority: WO
Inventors: 史洪宾; 黎上源; 汪志强
Original assignee: 华为技术有限公司
Priority date: 2019-08-05
Filing date: 2020-07-15
Publication date: 2021-02-11
Also published as: CN110461090B; CN110461090A

Abstract

The present application provides a circuit assembly, comprising: a circuit board; a first electronic element disposed on the circuit board, an interval space being provided between the first electronic element and the circuit board; a filling material located in a first interval space of the interval space; and one or more first isolation structures located in the interval space, wherein the first isolation structure is disposed on the circuit board and/or the first electronic element, and is located between a second interval space and the first interval space of the interval space; the second interval space is a space in the interval space where the filling material is not filled; the first isolation structure is a protrusion or a groove. The present application provides a circuit assembly and an electronic device, which aim at avoiding the negative impact caused by the introduction of the filling material.

Description

Circuit components and electronic equipment

This application claims the priority of a Chinese patent application filed with the Chinese Patent Office with the application number 201910718932.2 and the application name "circuit assembly and electronic equipment" on August 5, 2019, the entire content of which is incorporated into this application by reference.

Technical field

This application relates to the field of electronic equipment, and more specifically, to a circuit assembly and electronic equipment in the field of electronic equipment.

Background technique

As electronic devices need to implement more and more functions, more and more electronic components are arranged inside electronic devices. At present, there is a common way to fix electronic components by welding and fixing multiple electronic components inside the electronic device, for example, soldering electronic components for realizing various functions on the motherboard of the electronic device. Soldering electronic components together can not only fix the position of each electronic component, but also conduct each electronic component to realize the diversified functions of the electronic device.

In pursuit of user experience, ultra-thin thickness has become one of the development trends of electronic devices. Therefore, the space available for connecting electronic components is very small. In order to ensure the stability of the connection between the electronic components, some underfill material (underfill) needs to be filled in the soldering area. This filling process can also be referred to as a dispensing process. Since the filling material is usually a fluid, various new problems will be introduced at the same time as the filling material is introduced, such as leakage of glue, explosion of glue, and damage to electronic components.

Summary of the invention

The present application provides a circuit assembly and electronic equipment, aiming to reduce the negative impact caused by the introduction of filler materials.

In a first aspect, there is provided a circuit assembly, including: a circuit board; a first electronic component arranged on the circuit board, and there is a space between the electronic institute component and the circuit board; and a filling material located in The first interval space in the interval space; one or more first isolation structures located in the interval space, and the first isolation structure is disposed on the circuit board and/or the first electronic component , Wherein the first isolation structure is located between a second interval space in the interval space and the first interval space, and the second interval space is a space in the interval space that is not filled with the filling material , The first isolation structure is a protrusion or a groove.

The circuit board may be a substrate. The circuit board may be a main board, a frame board (FB), etc.

The first electronic component may be, for example, an embedded multimedia card (EMMC), a system in package (SiP) component, an antenna in package (AiP), a system on chip (SOC) Components, double data rate (double data rate, DDR) memory, etc.

There is a space between the electronic components and the circuit board. Observe the electronic components along the thickness of the circuit board to obtain a flat pattern. Taking the surface of the electronic component facing the circuit board as the starting plane, stretch the plane pattern toward the circuit board until it touches the surface of the circuit board facing the electronic component, and the space between the electronic component and the circuit board can be obtained. The interval space includes a first interval space filled with a filling material and a second interval space not filled with a filling material.

In the embodiment of the present application, if the filling material fills the gap space, phenomena such as glue leakage, glue explosion, and damage to electronic components may occur, and the filling material is not filled at all, which is not conducive to the connection stability of the circuit assembly. Therefore, an isolation structure is provided in the interval space so that the filling material can be filled in the preset interval space, which can ensure the stable connection relationship of the circuit components, and avoid the problems of glue leakage, glue explosion, and damage to electronic components. .

In addition, the process of setting bumps is usually an additive manufacturing process, and the process of setting grooves is usually a subtractive manufacturing process. During the repair process, the connection relationship between the first electronic component and the circuit board needs to be released. The bumps are likely to fail due to heat during the repair process, so the bumps need to be fixed again during the repair process; the grooves will not disappear during the repair process, and the filling material that has been filled in the grooves will still It is easily removed due to heat, and the repair process is relatively simple.

With reference to the first aspect, in some implementations of the first aspect, the protrusion is a welding rod or an electronic component.

In the embodiments of the present application, the electronic components are usually arranged at intervals. Due to the gap between the electronic components and the electronic components, the barrier effect of the electronic components is relatively poor. However, the height of the electrode is often limited. When the height of the spacing space is high, the barrier effect of the electronic components is relatively better.

In addition, the isolation structure of the resin material will increase the process complexity. Because the soldering temperature is relatively high, for example, the soldering temperature of tin solder, silver solder, and copper solder is around 245°C, while the solidification temperature of resin materials is relatively low, generally around 150°C. Therefore, the solidification of ordinary resin materials cannot be carried out together with welding, that is, the welding process and the isolation structure forming process cannot be realized at the same time in one process step. If a special curing resin material or special solder is used to complete the curing of the resin material while the welding is heating, on the one hand, it will increase the manufacturing cost of the parts. On the other hand, the resin material will affect the shape of the solder ball during the curing process. Affect welding yield. In the two process steps, the welding process and the isolation structure forming process are performed separately. On the one hand, the forming process is increased. On the other hand, the solder balls formed by the welding process will be subjected to secondary heating, which affects the mechanical properties of the solder balls. It has been verified that the use of solder and electronic components will not affect the electrical performance of other electronic components. For example, when an antenna radiator or radio frequency chip is installed on the circuit board, the use of solder and electronic components will not affect the working state of the antenna radiator or radio frequency chip.

With reference to the first aspect, in some implementations of the first aspect, the plurality of first isolation structures include two electrodes that are not connected to each other.

In the embodiment of the present application, dividing the welding rod is beneficial to layout the circuit on the circuit board and reduce the circuit wiring complexity.

With reference to the first aspect, in some implementations of the first aspect, the one or more first isolation structures are a welding rod frame formed by a plurality of welding rods connected end to end, and the filling material is located outside the welding rod frame .

The method of processing the welding rod frame is, for example, placing another steel plate on the hollowed-out position of the steel plate to form a hollowed pattern that is connected end to end; another example is to print solder in multiple times. The method of processing the welding rod frame may also be to spray solder around the interface between the first space and the second space. The method of processing the welding rod frame may also be to place a ring-shaped solder tin plate around the interface between the first space and the second space.

In the embodiment of the present application, since the welding rod frame is connected everywhere, it is beneficial to prevent the filling material from flowing into the second space.

With reference to the first aspect, in some implementations of the first aspect, a circuit is provided on the circuit board, and the one or more first isolation structures include electronic components electrically connected to the circuit board.

In the embodiments of the present application, since the electronic components can achieve corresponding electrical functions, the existing electronic components can be fully utilized to fill the predetermined area with the filling material, and the amount of changes to the circuit components is small.

With reference to the first aspect, in some implementations of the first aspect, the one or more first isolation structures include a groove, and a bottom surface of the groove is one of a solder resist material, a conductive material, and an insulating material.

In the embodiment of the present application, grooves of different depths can be obtained according to the flow rate of the blocking filling material. When the bottom surface of the groove is made of solder resist material, the depth of the groove is relatively shallow, and when the bottom surface of the groove is made of conductive material or insulating material, the depth of the groove is relatively deep. The deeper the groove is, the more filling material can be accommodated and the better the blocking effect of the groove. However, if the depth of the groove is as deep as the conductive layer or the insulating layer, it may affect the circuit routing.

With reference to the first aspect, in some implementations of the first aspect, the graphics projected on the circuit board at the interface between the first space and the second space are rectangular, and the plurality of The first isolation structure includes four welding rods that are not connected to each other, and the four welding rods are respectively located on four sides of the rectangle.

With reference to the first aspect, in some implementations of the first aspect, the graphics projected on the circuit board at the interface between the first space and the second space are rectangular, and the plurality of The first isolation structure includes eight welding electrodes that are not connected to each other, and two welding electrodes are arranged on any one of the four sides of the rectangle.

In the embodiment of the present application, compared with 4 mutually disconnected electrodes, the barrier effect of 8 mutually disconnected electrodes is slightly worse, but it can facilitate the layout of the circuit on the circuit board. The surface where the electrode is provided is usually also provided with a circuit, and the circuit usually does not pass through the electrode. Therefore, if the circuit in the first space needs to be electrically connected to the circuit in the second space, it can be connected with the electrode by passing through the electrode. Circuit realization of the area between the electrodes.

With reference to the first aspect, in some implementations of the first aspect, the graphics projected on the circuit board at the interface between the first space and the second space are rectangular, and the plurality of The first isolation structure includes a plurality of electronic elements, and the electronic elements are arranged on any one of the four sides of the rectangle.

With reference to the first aspect, in some implementations of the first aspect, the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular, and the one or The plurality of first isolation structures are continuous and uninterrupted annular grooves that are connected end to end, and the annular grooves are located on four sides of the rectangle.

With reference to the first aspect, in some implementations of the first aspect, the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular, and the one or The plurality of first isolation structures include a plurality of electronic components and two welding electrodes that are not connected to each other, the plurality of electronic components are located on two mutually perpendicular sides of the rectangle, and the two welding electrodes are respectively located on the rectangular The remaining two sides.

With reference to the first aspect, in some implementations of the first aspect, the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular, and the one or The plurality of first isolation structures includes two unconnected grooves and two unconnected welding rods, the two welding rods are respectively located on two mutually parallel sides of the rectangle, and the two grooves are respectively Located on the remaining two sides of the rectangle.

With reference to the first aspect, in some implementations of the first aspect, the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular, and the one or The plurality of first isolation structures include two unconnected grooves and a plurality of electronic components, the plurality of electronic components are located on two mutually parallel sides of the rectangle, and the two grooves are respectively located in the On the remaining two sides of the rectangle.

With reference to the first aspect, in some implementations of the first aspect, the circuit assembly further includes: one or more second isolation structures, arranged on one side of the first isolation structure and wrapped by the filling material The second isolation structure is one or more of a welding rod, an electronic component, and a groove.

In the embodiment of the present application, by providing the first isolation structure and the second isolation structure at the same time, the stability of the barrier filling material is enhanced to ensure that the filling material does not, for example, the second interval space.

With reference to the first aspect, in some implementations of the first aspect, the graphics projected on the circuit board at the interface between the first space and the second space are rectangular, and the plurality of The first isolation structure includes four electrodes that are not connected to each other, the four electrodes are respectively located on four sides of the rectangle, the plurality of second isolation structures include four electrodes that are not connected to each other, and the second isolation The structure is located on one side of the closest first isolation structure and is parallel to the first isolation structure closest to the distance.

With reference to the first aspect, in some implementations of the first aspect, the graphics projected on the circuit board at the interface between the first space and the second space are rectangular, and the plurality of The first isolation structure includes a plurality of electronic components, the electronic components are arranged on any one of the four sides of the rectangle, the plurality of second isolation structures include a plurality of electronic components, and the second isolation structure is located at a distance One side of the closest first isolation structure and the closest first isolation structure are parallel to each other.

With reference to the first aspect, in some implementations of the first aspect, the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular, and the one or The plurality of first isolation structures and the one or more second isolation structures are all continuous and uninterrupted annular grooves that are connected end to end, and the one or more first isolation structures are located on four sides of the rectangle , The one or more second isolation structures are located on the outer periphery of the rectangle.

With reference to the first aspect, in some implementations of the first aspect, the graphics projected on the circuit board at the interface between the first space and the second space are rectangular, and the plurality of The first isolation structure includes four electrodes that are not connected to each other, the four electrodes are respectively located on four sides of the rectangle, the plurality of second isolation structures include a plurality of electronic components, and the second isolation structures are located at a distance from each other. One side of the closest first isolation structure and the closest first isolation structure are parallel to each other.

With reference to the first aspect, in some implementations of the first aspect, the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular, and the one or The plurality of first isolation structures are continuous and uninterrupted annular grooves that are connected end to end, the annular grooves are located on four sides of the rectangle, and the plurality of second isolation structures include four electrodes that are not connected to each other, The second isolation structure is located on one side of the closest first isolation structure and is parallel to the first isolation structure closest to the distance.

With reference to the first aspect, in some implementations of the first aspect, the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular, and the one or The plurality of first isolation structures are continuous and uninterrupted annular grooves that are connected end to end, the annular grooves are located on four sides of the rectangle, the plurality of second isolation structures include a plurality of electronic components, and the first The two isolation structures are located on one side of the closest first isolation structure and are parallel to the first isolation structure closest to the distance.

With reference to the first aspect, in some implementations of the first aspect, the graphics projected on the circuit board at the interface between the first space and the second space are rectangular, and the plurality of The first isolation structure includes three electrodes that are not connected to each other, the three electrodes are respectively located on three sides of the rectangle, the plurality of second isolation structures include a plurality of electronic components, and the second isolation structures are located at a distance from each other. One side of the closest first isolation structure and the closest first isolation structure are parallel to each other.

With reference to the first aspect, in some implementations of the first aspect, the circuit assembly further includes: a second electronic component located in the second space and arranged on the first electronic component.

In the embodiment of the present application, since the filling material does not fill the second space, the second electronic component will not be damaged due to thermal expansion of the filling material, or the leakage of glue can be avoided.

With reference to the first aspect, in some implementations of the first aspect, the circuit assembly further includes: a plurality of solder balls, electrically connected between the circuit board and the first electronic component, and located in the first Two compartments; a third electronic component arranged on the circuit board, the third electronic component and the first electronic device are located on both sides of the circuit board, the third electronic component is projected on the The area of the surface of the circuit board intersects or overlaps with the area of the first electronic component projected on the surface.

In the embodiment of the present application, since the filling material does not fill the second spacing space, the solder balls connecting the first electronic component and the circuit board can be prevented from being damaged due to the expansion of the filling material.

In a second aspect, there is provided an electronic device, including: a circuit board; a first electronic component arranged on the circuit board, and there is a space between the electronic institute component and the circuit board; and a filling material is located The first interval space in the interval space; one or more first isolation structures located in the interval space, and the first isolation structure is disposed on the circuit board and/or the first electronic component , Wherein the first isolation structure is located between a second interval space in the interval space and the first interval space, and the second interval space is a space in the interval space that is not filled with the filling material , The first isolation structure is a protrusion or a groove; a power source is used to supply power to the circuit board and/or electronic components.

With reference to the second aspect, in some implementations of the second aspect, the protrusion is a welding rod or an electronic component.

With reference to the second aspect, in some implementations of the second aspect, the plurality of first isolation structures include two electrodes that are not connected to each other.

With reference to the second aspect, in some implementations of the second aspect, the one or more first isolation structures are a welding rod frame formed by a plurality of welding rods connected end to end, and the filling material is located outside the welding rod frame .

With reference to the second aspect, in some implementations of the second aspect, a circuit is provided on the circuit board, and the one or more first isolation structures include electronic components electrically connected to the circuit board.

With reference to the second aspect, in some implementations of the second aspect, the one or more first isolation structures include a groove, and the bottom surface of the groove is one of a solder resist material, a conductive material, and an insulating material.

With reference to the second aspect, in some implementations of the second aspect, the graphics projected on the circuit board at the interface between the first interval space and the second interval space is a rectangle, and the plurality of The first isolation structure includes four welding rods that are not connected to each other, and the four welding rods are respectively located on four sides of the rectangle.

With reference to the second aspect, in some implementations of the second aspect, the graphics projected on the circuit board at the interface between the first interval space and the second interval space is a rectangle, and the plurality of The first isolation structure includes eight welding electrodes that are not connected to each other, and two welding electrodes are arranged on any one of the four sides of the rectangle.

With reference to the second aspect, in some implementations of the second aspect, the graphics projected on the circuit board at the interface between the first interval space and the second interval space is a rectangle, and the plurality of The first isolation structure includes a plurality of electronic elements, and the electronic elements are arranged on any one of the four sides of the rectangle.

With reference to the second aspect, in some implementations of the second aspect, the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular, and the one or The plurality of first isolation structures are continuous and uninterrupted annular grooves that are connected end to end, and the annular grooves are located on four sides of the rectangle.

With reference to the second aspect, in some implementations of the second aspect, the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular, and the one or The plurality of first isolation structures include a plurality of electronic components and two welding electrodes that are not connected to each other, the plurality of electronic components are located on two mutually perpendicular sides of the rectangle, and the two welding electrodes are respectively located on the rectangular The remaining two sides.

With reference to the second aspect, in some implementations of the second aspect, the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular, and the one or The plurality of first isolation structures includes two unconnected grooves and two unconnected welding rods, the two welding rods are respectively located on two mutually parallel sides of the rectangle, and the two grooves are respectively Located on the remaining two sides of the rectangle.

With reference to the second aspect, in some implementations of the second aspect, the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular, and the one or The plurality of first isolation structures include two unconnected grooves and a plurality of electronic components, the plurality of electronic components are located on two mutually parallel sides of the rectangle, and the two grooves are respectively located in the On the remaining two sides of the rectangle.

With reference to the second aspect, in some implementations of the second aspect, the electronic device further includes: one or more second isolation structures arranged on one side of the first isolation structure and wrapped by the filling material The second isolation structure is one or more of a welding rod, an electronic component, and a groove.

With reference to the second aspect, in some implementations of the second aspect, the graphics projected on the circuit board at the interface between the first interval space and the second interval space is a rectangle, and the plurality of The first isolation structure includes four electrodes that are not connected to each other, the four electrodes are respectively located on four sides of the rectangle, the plurality of second isolation structures include four electrodes that are not connected to each other, and the second isolation The structure is located on one side of the closest first isolation structure and is parallel to the first isolation structure closest to the distance.

With reference to the second aspect, in some implementations of the second aspect, the graphics projected on the circuit board at the interface between the first interval space and the second interval space is a rectangle, and the plurality of The first isolation structure includes a plurality of electronic components, the electronic components are arranged on any one of the four sides of the rectangle, the plurality of second isolation structures include a plurality of electronic components, and the second isolation structure is located at a distance One side of the closest first isolation structure and the closest first isolation structure are parallel to each other.

With reference to the second aspect, in some implementations of the second aspect, the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular, and the one or The plurality of first isolation structures and the one or more second isolation structures are all continuous and uninterrupted annular grooves that are connected end to end, and the one or more first isolation structures are located on four sides of the rectangle , The one or more second isolation structures are located on the outer periphery of the rectangle.

With reference to the second aspect, in some implementations of the second aspect, the graphics projected on the circuit board at the interface between the first interval space and the second interval space is a rectangle, and the plurality of The first isolation structure includes four electrodes that are not connected to each other, the four electrodes are respectively located on four sides of the rectangle, the plurality of second isolation structures include a plurality of electronic components, and the second isolation structures are located at a distance from each other. One side of the closest first isolation structure and the closest first isolation structure are parallel to each other.

With reference to the second aspect, in some implementations of the second aspect, the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular, and the one or The plurality of first isolation structures are continuous and uninterrupted annular grooves that are connected end to end, the annular grooves are located on four sides of the rectangle, and the plurality of second isolation structures include four electrodes that are not connected to each other, The second isolation structure is located on one side of the closest first isolation structure and is parallel to the first isolation structure closest to the distance.

With reference to the second aspect, in some implementations of the second aspect, the graphics projected on the circuit board at the interface between the first interval space and the second interval space is rectangular, and the one or The plurality of first isolation structures are continuous and uninterrupted annular grooves that are connected end to end, the annular grooves are located on four sides of the rectangle, the plurality of second isolation structures include a plurality of electronic components, and the first The two isolation structures are located on one side of the closest first isolation structure and are parallel to the first isolation structure closest to the distance.

With reference to the second aspect, in some implementations of the second aspect, the graphics projected on the circuit board at the interface between the first interval space and the second interval space is a rectangle, and the plurality of The first isolation structure includes three electrodes that are not connected to each other, the three electrodes are respectively located on three sides of the rectangle, the plurality of second isolation structures include a plurality of electronic components, and the second isolation structures are located at a distance from each other. One side of the closest first isolation structure and the closest first isolation structure are parallel to each other.

With reference to the second aspect, in some implementations of the second aspect, the electronic device further includes: a second electronic component located in the second compartment and arranged on the first electronic component.

With reference to the second aspect, in some implementations of the second aspect, the electronic device further includes: a plurality of solder balls, electrically connected between the circuit board and the first electronic component, and located in the first Two compartments; a third electronic component arranged on the circuit board, the third electronic component and the first electronic device are located on both sides of the circuit board, the third electronic component is projected on the The area of the surface of the circuit board intersects or overlaps with the area of the first electronic component projected on the surface.

Description of the drawings

Figure 1 is a schematic structural diagram of an electronic device.

Fig. 2 is a schematic structural diagram of a circuit assembly.

Fig. 3 is a schematic diagram of the projection of electronic components on the circuit board.

Fig. 4 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.

Fig. 5 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.

Fig. 6 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.

Fig. 7 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.

Fig. 8 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.

FIG. 9 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.

FIG. 10 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.

FIG. 11 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.

FIG. 12 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.

FIG. 13 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.

FIG. 14 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.

FIG. 15 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.

FIG. 16 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.

FIG. 17 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.

FIG. 18 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.

FIG. 19 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.

FIG. 20 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.

FIG. 21 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.

FIG. 22 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.

FIG. 23 is a schematic structural diagram of a circuit assembly provided by an embodiment of the present application.

detailed description

The technical solution in this application will be described below in conjunction with the drawings.

FIG. 1 is a schematic structural diagram of an electronic device 100 provided by an embodiment of the present application.

The electronic device 100 may be a mobile phone, a tablet computer, an e-reader, a notebook computer, a digital camera, a vehicle-mounted device, or a wearable device. In the embodiment shown in FIG. 1, the electronic device 100 is a mobile phone as an example for description.

The electronic device 100 includes a housing 10, a display screen 20 and a circuit assembly 30. The display screen 20 and the circuit assembly 30 are installed in the housing 10. Specifically, the housing 10 includes a frame and a back cover. The frame surrounds the outer circumference of the display screen 20 and surrounds the outer circumference of the back cover, and the display screen 20 is spaced apart from the back cover. The cavity formed between the display screen 20, the frame, and the back cover is used for placing the circuit component 30. The electronic device 100 also includes a power supply 40 for powering the circuit assembly 30. The power source 40 may be a lithium electronic battery, for example.

FIG. 2 is an example of the circuit component 30 of the electronic device 100 shown in FIG. 1. The circuit assembly 30 may be a printed circuit board assembly (PCBA). The circuit assembly 30 includes a printed circuit board (PCB) 301 and at least one electronic component electrically connected to the PCB. The power supply in FIG. 1 is used to supply power to the PCB 301 and/or the at least one electronic component.

The PCB 301 may be, for example, a main board, a frame board (FB), or the like. FIG. 2 shows a frame plate including a through hole 310. The PCB 301 includes a multi-layer conductive layer 3011 and an insulating layer 3013, the conductive layer 3011 and the insulating layer 3013 are stacked, and any two conductive layers 3011 include at least one insulating layer 3013. Any two conductive layers 3011 may be electrically connected through vias 3012. The conductive layer 3011 and the via hole 3012 are represented by a geometric figure filled with a diagonal cross pattern. The PCB 301 also includes soldering areas (that is, pads) that can be used for soldering. The electronic component can be electrically connected to the conductive layer 3011 of the PCB 301 by soldering on the soldering area of the PCB 301, and further, electrically connected to other PCBAs. The drum pattern in FIG. 2 is used to represent the solder balls 320.

The electronic components that are electrically connected to the PCB may be, for example, an embedded multimedia card (EMMC) 302a, a system in package (SiP) component 302b, and an antenna in package (AiP) shown in FIG. 2. 302d, system on chip (SOC) component 302f, double data rate (double data rate, DDR) memory 302g, etc. The SiP element 302b may also include universal flash storage (UFS) 302c. Among them, AiP 302d may also include a radio frequency chip (RF chip) 302e. A plurality of electronic components can be stacked and packaged to form a package on package (POP) component. As shown in FIG. 2, the SOC component 302f and the DDR memory 302g are stacked to form a POP component. It should be understood that the electronic components electrically connected to the PCB are not limited to the specific electronic components disclosed in this application.

The EMMC 302a may include multiple chips and packaging materials that package the multiple chips into one body. The geometric figures filled with a dot matrix pattern in Figure 2 are used to represent packaging materials. The EMMC 302a can be fixed on one side of the PCB 301 by welding. On the other side of the PCB 301, a POP component is fixed, that is, the POP component can be fixed on the other side of the PCB 301 by soldering. As shown in FIG. 2, the area projected by the EMMC 302a on the circuit board 301 is area A, and the area where the POP element is projected on the circuit board 301 is area B, and the area A and the area B may cross or overlap. The POP device may include, for example, a SOC device 302f and a DDR memory 302g, that is, the SOC device 302f and the DDR memory 302g may be packaged as a whole by stacking. The SOC element 302f may be electrically connected to the DDR memory 302g through solder balls 320. In order to ensure the connection strength, some filler material can be filled around the solder ball 320 between the PCB301 and the EMMC302a, and some filler material can be filled around the solder ball 320 between the PCB301 and the POP element. Sometimes in order to facilitate rework, the filling material often has a high thermal expansion coefficient, that is, the filling material easily expands when heated. The geometric figures of the horizontal line pattern in Figure 2 are used to represent the filling material. In the process of repairing the circuit assembly 30, the solder ball 320 and the filling material need to be heated to release the connection relationship between the electronic component and the PCB 301. Due to the overlap between the area A and the area B, the glue explosion is likely to occur during the repair of the circuit assembly 30. For example, when the connection relationship between PCB301 and POP components is released, the filling material filled between EMMC 302a and PCB 301 will also be heated and expand, causing glue explosion, and cutting off the connection between solder balls 320 and EMMC components .

The SiP component 302b may include a plurality of electronic components and a packaging material that encapsulates the plurality of electronic components as a whole. The plurality of electronic components may be DDR or SOC, for example. The geometry of the dot pattern in Figure 2 is used to represent the packaging material. The multiple electronic components in the packaging material can be welded and fixed on the circuit board, and the conduction between the multiple electronic components is realized through the circuit board. The SiP element 302b may further include UFS 302c. The UFS 302c can be welded and fixed on the circuit board, and the UFS 302c can be connected to other electronic components in the SiP component 302b through the circuit board. To save space, UFS 302c can be arranged in the through hole 310 of the frame plate. The SiP component 302b can be fixed on one side of the PCB 301 by soldering. In order to ensure the connection strength, some filler material can be filled around the solder ball 320 between the PCB 301 and the SiP element 302 b. Sometimes in order to make the filler material fully wrap the solder balls 320, the filler material has a low viscosity and is easy to flow. Therefore, in the process of filling the filling material between the SiP component 302b and the PCB 301, the filling material easily flows into the through hole 310 of the frame board, and glue leakage occurs, resulting in poor filling effect, pollution of the production line, and pollution of electronic components. as a result of.

AiP 302d may include an antenna radiator and a radio frequency chip 302e that provides a feed for the antenna radiator. As shown in FIG. 2, the antenna radiator is electrically connected to the PCB 301 through the integrated circuit 360, the radio frequency chip 302e is electrically connected to the PCB 301 through the integrated circuit 360, and the antenna radiator and the radio frequency chip 302e are welded and fixed on both sides of the integrated circuit 360. The AiP 302d can be fixed on one side of the PCB 301 by solder balls 320 arranged around the radio frequency chip 302e. In order to ensure the connection strength, some filler material can be filled around the solder ball 320 between PCB301 and AiP 302d. Therefore, the filler material may not only wrap the solder ball 320, but also possibly wrap the RF chip 302e. For the reworkability of electronic equipment, the thermal expansion coefficient of the filling material is relatively high. In scenarios such as changes in ambient temperature or temperature changes caused by changes in the work load of the electronic equipment itself, the filling material that expands when it rises and shrinks when it falls will squeeze And pulling the radio frequency chip 302e wrapped by the filling material, and eventually lead to cracks in the extremely low dielectric constant (ELK) material in the radio frequency chip 302e, and damage the radio frequency chip 302e.

It should be understood that the electronic device 100 may further include one or more PCBs similar to the PCB 301.

In summary, in the case of unreasonable use of filling materials, various problems will be introduced, such as leakage and explosion of glue, and avoiding damage to electronic components. For this reason, the present application provides a new circuit assembly, which can reduce the unreasonable use of filling materials.

The circuit assembly provided in the embodiment of the present application is introduced below through a common circuit assembly.

Figure 3 shows a common circuit assembly, including a circuit board and electronic components arranged on the circuit board. Circuit boards and electronic components are provided with circuits. The circuit board is electrically connected to the electronic component through the solder balls 320, so that the circuit on the circuit board and the circuit on the electronic component can be electrically connected. The drum-shaped pattern in FIG. 3 is used to represent the solder balls 320.

There is a space between the electronic components and the circuit board. Observe the electronic component along the thickness direction of the circuit board to obtain a flat pattern A. Taking the surface of the electronic component facing the circuit board as the starting plane, stretch the plane pattern A toward the circuit board until it touches the surface of the circuit board facing the electronic component, and the space between the electronic component and the circuit board can be obtained. This space is represented by a figure filled with vertical straight lines.

The solder balls that electrically connect the electronic components and the circuit board are arranged in the space. Filling materials are also arranged in the space to stabilize the connection relationship between the electronic components and the circuit board. In order to avoid the phenomenon of glue leakage and explosion, and to avoid damage to electronic components, it is necessary to fill the filling material in the set space to avoid the random flow of the filling material. Therefore, it is necessary to provide an isolation structure in the interval space so that the filling material can be filled in the preset interval space to ensure a stable connection relationship and prevent the filling material from flowing into other areas in the interval space. Avoid problems such as leakage, explosion, and damage to electronic components.

The following describes multiple possible implementations of the circuit components provided by the embodiments of the present application in conjunction with FIGS. 4 to 23. It can be understood that the embodiments shown in FIGS. 4 to 23 are only for helping those skilled in the art to better understand the technical solutions of the present application, and are not intended to limit the technical solutions of the present application. Benefiting from the guidance presented in the foregoing description and related drawings, those skilled in the art will think of many improvements and other embodiments of the present application. Therefore, it should be understood that the present application is not limited to the specific embodiments disclosed.

It should be understood that in FIGS. 4 to 18, the lower figure shows the separation space between the first electronic component and the circuit board and the components arranged in the separation space, and the upper figure shows the circuit assembly The cross-sectional view of the cross-section and the viewing direction of the cross-section are indicated by the broken line with an arrow in the figure below.

FIG. 4 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application. The circuit assembly 400 may be applied to the electronic device 100 shown in FIG. 1. The circuit assembly 400 can replace the circuit assembly 30 shown in FIG. 1. As shown in FIG. 4, the circuit assembly 400 may include a first electronic component 411 and a circuit board 412. Both the first electronic component 411 and the circuit board 412 are provided with circuits. The first electronic component 411 is electrically connected to the circuit board 412 through solder balls 420. By connecting, electrical connection between the circuit on the first electronic component 411 and the circuit on the circuit board 412 can be realized. There is a first space 413 and a second space 414 between the first electronic component 411 and the circuit board 412 that do not overlap each other. According to the figure located at the bottom of FIG. 4, the solder balls 420 are located in the second space 414. In order to stabilize the connection relationship between the first electronic component 411 and the circuit board 412, a filling material 430 is filled in the first space 413. The pattern of horizontal straight lines in FIG. 4 represents the filling material 430. In order to prevent the filling material 430 from flowing into the second separation space 414 from the first separation space 413, a first separation structure 441 is provided at the junction of the first separation space 413 and the second separation space 414, so that one part of the first separation structure 441 One side is filled with filler material 430 and provided with solder balls, while the other side of the first isolation structure 441 is not filled with filler material 430. The pattern filled with diagonal lines in FIG. 4 represents the first isolation structure 441. Taking FIG. 4 as an example, four first isolation structures 441 are provided in the space, and the four first isolation structures 441 are all welding rods, and the four welding rods are disconnected from each other. The image projected on the circuit board 412 of the interface between the first space 413 and the second space 414 is a rectangle, and the four welding rods are respectively arranged on the four sides of the rectangle. The height of the electrode should be slightly smaller than the separation distance between the first electronic component 411 and the circuit board 412. For example, the height of the welding rod is 2/3 of the separation distance between the first electronic component 411 and the circuit board 412. The first isolation structure 441 shown in FIG. 4 is disposed on the circuit board 412. It should be understood that the first isolation structure 441 may also be provided on the first electronic component 411, as shown in FIG. 5. It should be understood that the first isolation structure 441 may be provided on the first electronic component 411 and the circuit board 412 at the same time. The following will take the first isolation structure provided on the circuit board as an example for description.

In an example, the first isolation structure may be a welding rod frame formed by connecting 4 welding rods end to end. The area inside the electrode frame is the second interval space, and the area outside the electrode frame is the first interval space, that is, the filling material is located outside the electrode frame. Compared with 4 disconnected electrodes, the barrier effect of the electrode frame is better, making it more difficult for the filler material to flow into the second space. However, the use of the electrode frame increases the process complexity. In the process of preparing the welding rod, it is necessary to print solder around the interface between the first space and the second space. The common process of printing solder is to place a steel plate containing a hollow pattern on the circuit board, and the solder can leak from the hollowed-out part of the steel plate and smear the circuit board. Since the welding rod frame connected end to end cannot be hollowed out on the steel plate, new processing steps need to be added, such as placing another steel plate on the hollowed out position on the steel plate to form a hollowed out pattern end to end, or printing solder in multiple times. The method of processing the welding rod frame may also be to spray solder around the interface between the first space and the second space. The method of processing the welding rod frame may also be to place a ring-shaped solder tin plate around the interface between the first space and the second space.

FIG. 6 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application. The only difference from the circuit assembly 400 shown in FIG. 4 is that the plurality of first isolation structures 541 in FIG. 6 are 8 welding rods, and the 8 welding rods are disconnected from each other. As shown in FIG. 6, the image projected on the circuit board 512 by the interface between the first space 513 and the second space 514 is rectangular, and two welding rods are provided on each of the four sides. Compared with the 4 disconnected electrodes, the 8 disconnected electrodes have a slightly worse barrier effect, but they can facilitate the layout of the circuit on the circuit board. The surface where the electrode is provided is usually also provided with a circuit, and the circuit usually does not pass through the electrode. Therefore, if the circuit in the first space 513 needs to be electrically connected to the circuit in the second space 514, it can be passed through Circuit realization of the area between the electrode and the electrode. Taking Fig. 4 as an example, in order to realize the electrical connection between point A and point B, the circuit can be arranged according to the dotted line from point A to point B. Taking Fig. 5 as an example, in order to realize the electrical connection between point C and point D, the circuit can be arranged according to the dotted line from point C to point D. It can be seen that in the circuit assembly 500 shown in FIG. 6, due to the increase in the number of welding rods, the area between the welding rod and the welding rod where a circuit can be arranged increases, so that excessive wire can be reduced.

FIG. 7 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application. The only difference from the circuit assembly 400 shown in FIG. 4 is that the first isolation structure 641 in FIG. 7 is an electronic component 6411, and the electronic component 6411 is fixed on the circuit board 612 by solder balls 6412. Among them, the electronic component 6411 may be, for example, a resistor, an inductor, a capacitor, or the like. The electronic component 6411 can be fixed on the first electronic component 611 or the circuit board 612 through solder balls 6412. Specifically, as shown in FIG. 7, a plurality of first isolation structures 641 are provided between the circuit board and the electronic components, and the plurality of first isolation structures 641 are all electronic components 6411, so that one of the first isolation structures 641 is One side is filled with a filling material 630 and provided with solder balls, while the other side of the first isolation structure 641 is not filled with the filling material 630. As shown in FIG. 7, the image projected on the circuit board 612 of the interface between the first space 613 and the second space 614 is rectangular, and a plurality of electronic components are arranged on each of the four sides. 6411. In the case that the electronic component 6411 can realize the corresponding electrical function, the existing electronic component 6411 can be fully utilized to make the filling material 630 fill the preset area, and the amount of modification to the circuit component is less. In the case that the electronic component 6411 cannot achieve the corresponding electrical function, the electronic component 6411 can block the filling material 630 from flowing into the second space 614. Since it is installed with other electronic components, the process complexity will not increase. In some cases, for example, the electronic component 6411 located at the edge of the circuit board as an isolation structure can also protect other weak electronic components.

Further, in order to ensure that the electronic component 6411 effectively blocks the filling material 630 from entering the second space 614, various feasible methods can be adopted. For example, the spacing between electronic components 6411 can be shortened. For another example, a welding rod is used instead of the solder ball 6412 to fix the electronic component 6411.

Further, compared with the circuit assembly 400 shown in FIG. 4, when the separation distance between the first electronic component 611 and the circuit board 612 is small, since the electronic components 6411 are usually arranged at intervals, the barrier effect of the electronic components 6411 is Slightly worse. However, the height of the welding rod is often limited. When the separation distance between the first electronic component 611 and the circuit board 612 is large, the barrier effect of the electronic component 6411 is slightly better.

FIG. 8 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application. The only difference from the circuit assembly 400 shown in FIG. 4 is that the first isolation structure 841 in FIG. 8 is a groove. The surface layer of the circuit board is usually a solder resist layer or a conductive layer, the lower part of the solder resist layer is a conductive layer, and the lower part of the conductive layer is an insulating layer. Therefore, the bottom surface of the groove can be one of solder resist material, conductive material, or insulating material. As shown in FIG. 8, the image projected on the circuit board 812 of the interface between the first space 813 and the second space 814 is a rectangle, and a continuous and uninterrupted ring is arranged around the rectangle. The groove is such that the outer side of the annular groove is filled with a filler material 830 and solder balls are provided, while the outer side of the annular groove is not filled with the filler material 430. The groove can receive the excess filling material 830 during the filling process and the rework process, and prevent the filling material 830 from flowing into the second space 814. During the repair process, the connection relationship between the first electronic component and the circuit board needs to be released. Compared with the circuit assembly 400 shown in FIG. 4, the welding rod is likely to disappear due to heat during the repair process, and the welding rod needs to be processed again, and the process is complicated; the groove will not disappear during the repair process and has been filled in The filling material 830 in the groove is also easily removed due to heat, and the process is relatively simple.

In summary, the first isolation structure may be one of a welding rod, an electronic component, and a groove. In addition, the isolation structure of the resin material will increase the process complexity. Because the soldering temperature is relatively high, for example, the soldering temperature of tin solder, silver solder, and copper solder is around 245°C, while the solidification temperature of resin materials is relatively low, generally around 150°C. Therefore, the solidification of ordinary resin materials cannot be carried out together with welding, that is, the welding process and the isolation structure forming process cannot be realized at the same time in one process step. If a special curing resin material or special solder is used to complete the curing of the resin material while the welding is heating, on the one hand, it will increase the manufacturing cost of the parts. On the other hand, the resin material will affect the shape of the solder ball during the curing process. Affect welding yield. In the two process steps, the welding process and the isolation structure forming process are performed separately. On the one hand, the forming process is increased. On the other hand, the solder balls formed by the welding process will be subjected to secondary heating, which affects the mechanical properties of the solder balls. It has been verified that the use of solder and electronic components will not affect the electrical performance of other electronic components. For example, when an antenna radiator or radio frequency chip is installed on the circuit board, the use of solder and electronic components will not affect the working state of the antenna radiator or radio frequency chip.

Due to the different blocking effects that can be achieved by welding rods, electronic components, and grooves, it is possible to flexibly choose which isolation structure to use according to the actual situation. In order to help those skilled in the art to better understand, the following describes multiple possible implementations of the circuit components provided in the embodiments of the present application in conjunction with FIG. 9 to FIG. 12. It can be understood that the embodiments shown in FIG. 9 to FIG. 12 are not a limitation on the technical solution of the present application.

FIG. 9 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application. The circuit assembly 900 can be applied to the electronic device 100 shown in FIG. 1. The circuit assembly 900 can replace the circuit assembly 30 shown in FIG. 1. The circuit assembly 900 may include a first electronic component 911 and a circuit board 912. Both the first electronic component 911 and the circuit board 912 are provided with circuits. The first electronic component 911 is electrically connected to the circuit board 912 through solder balls 920, so that the An electrical connection between the circuit on the electronic component 911 and the circuit on the circuit board 912. There are a first space 913 and a second space 914 between the first electronic component 911 and the circuit board 912 that do not overlap each other, and the solder balls 920 are located in the second space 914. In order to stabilize the connection relationship between the first electronic component 911 and the circuit board 912, the filling material 930 is filled in the first space 913. The pattern filled with horizontal straight lines in FIG. 9 represents the area filled with the filling material 930. The pouring point of the filling material 930 is F point. In order to prevent the filling material 930 from flowing into the second interval space 914 from the first interval space 913, a plurality of first isolation structures 941 are provided at the junction of the first interval space 913 and the second interval space 914, which is filled with diagonal lines in FIG. The pattern of represents the first isolation structure 941. The plurality of first isolation structures 941 may include a plurality of electronic components 9411 and a plurality of welding electrodes 9412. The image projected on the circuit board 912 of the interface between the first space 913 and the second space 914 is rectangular, and a plurality of electronic components 9411 are arranged on the upper side, and on the left side. There are multiple electronic components 9411, one electrode 9412 is provided on the lower side, and one electrode 9412 is provided on the right side. Since the pouring point of the filling material 930 is point F, the hydraulic pressure of the filling material 930 near the pouring point is relatively large, and the filling material 930 easily rises to a higher height, while the hydraulic pressure far away from the pouring point is low, and the liquid height of the filling material 930 Lower. In the circuit assembly 900 shown in FIG. 9, the filling material 930 first contacts the multiple electronic components 9411 on the side above the rectangle and on the side on the left side of the rectangle. After a long period of flow, it can interact with the two electrodes 9412. contact. Since the height of the electronic component 9411 can be higher than the height of the welding rod 9412, selecting the electronic component 9411 at the pouring point can prevent the filling material 930 from flowing into the second space 914 due to rising.

FIG. 10 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application. The circuit assembly 1000 can be applied to the electronic device 100 shown in FIG. 1. The circuit assembly 1000 can replace the circuit assembly 30 shown in FIG. 1. The circuit assembly 1000 may include a first electronic component 1011 and a circuit board 1012. Both the first electronic component 1011 and the circuit board 1012 are provided with circuits. The first electronic component 1011 is electrically connected to the circuit board 1012 through solder balls 1020, so as to realize the first An electrical connection between the circuit on the electronic component 1011 and the circuit on the circuit board 1012. There are a first space 1013 and a second space 1014 between the first electronic component 1011 and the circuit board 1012 that do not overlap each other, and the solder balls 1020 are located in the second space 1014. In order to stabilize the connection relationship between the first electronic component 1011 and the circuit board 1012, a filling material 1030 is filled in the first space 1013. The pattern filled with horizontal straight lines in FIG. 10 represents the area filled with the filling material 1030. The pouring points of the filling material 1030 are G1 point and G2 point respectively. In order to prevent the filling material 1030 from flowing into the second interval space 1014 from the first interval space 1013, a plurality of first isolation structures 1041 are provided at the junction of the first interval space 1013 and the second interval space 1014, which is filled with diagonal lines in FIG. The pattern represents the first isolation structure 1041. The plurality of first isolation structures 1041 may include two welding electrodes 10411 and two grooves 10412. Wherein, the image projected on the circuit board 1012 of the interface between the first space 1013 and the second space 1014 is rectangular, and a welding rod 10411 is provided on the upper side, and on the left side is provided One groove 10412 is provided with a welding rod 10411 on the lower side, and a groove 10412 is provided on the right side. Since the pouring points of the filling material 1030 are points G1 and G2, more filling material 1030 flows out from the pouring point. Compared with the groove 10412 with a limited capacity, the blocking effect of the electrode 10411 is better. However, there is less filler material 1030 that can flow through the electrode 10411 and flow to the groove 10412, and the groove 10412 can be used to receive the excess filler material 1030. Similarly, the electrode 10411 on the upper side can be replaced with multiple electronic components 1141, and the electrode 10411 on the lower side can be replaced with multiple electronic components 1141, so as to prevent the filling material 1030 from rising too fast, The rise is too large and flows into the second compartment 1014, as shown in Figure 11.

Figures 4 to 11 show examples of arranging a layer of isolation structure according to the interface between the first compartment and the second compartment. In order to ensure that the filling material does not enter the second interval space, one or more isolation structures can be provided on the side of the first isolation structure away from the second interval space. In the present application, there is no filling material in the second space, or there is very little and negligible filling material.

Optionally, the circuit assembly includes one or more first isolation structures, and the first isolation structures are disposed on the circuit board and/or the first electronic component and located between the circuit board and the first electronic component. Between the components, any one of the one or more first isolation structures is one of a welding rod, an electronic component, and a groove; the circuit assembly further includes: one or more second isolation structures, It is arranged on one side of the first isolation structure and is wrapped by the filling material, and the second isolation structure is one or more of a welding rod, an electronic component, and a groove.

The filling material is first blocked by the second isolation structure. Since the second isolation structure may have partial barrier failure, such as the inflow of filler material from the part where the electrode is disconnected, the second isolation structure may be wrapped by the filler material, that is, there are filler materials on both sides of the second isolation structure. The small part of the filling material is blocked by the first isolation structure, and the first isolation structure is arranged at the junction of the first interval space and the second interval space. Since the total amount of the filling material that needs to be blocked by the first isolation structure is small, the second isolation structure is combined with the first isolation structure, so that no or very little filling material enters the second interval space, and the effect of isolating the filling material is better . The second isolation structure may be disposed on the circuit board or the first electronic component, and the first isolation structure may be disposed on the circuit board or the first electronic component. For example, the second isolation structure and the first isolation structure are both arranged on the circuit board; another example, the second isolation structure and the first isolation structure are both arranged on the first electronic component; another example, the second isolation structure is arranged on the circuit board Above, the first isolation structure is arranged on the first electronic component; for another example, the second isolation structure is arranged on the first electronic component, and the first isolation structure is arranged on the circuit board. In the following, the second isolation structure and the first isolation structure are both provided on the circuit board as an example for description.

FIG. 12 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application. The circuit assembly 1200 can be applied to the electronic device 100 shown in FIG. 1. The circuit assembly 1200 can replace the circuit assembly 30 shown in FIG. 1. The circuit assembly 1200 may include a first electronic component 1211 and a circuit board 1212. Both the first electronic component 1211 and the circuit board 1212 are provided with circuits. The first electronic component 1211 is electrically connected to the circuit board 1212 through solder balls 1220, thereby achieving the An electrical connection between the circuit on the electronic component 1211 and the circuit on the circuit board 1212. There are a first space 1213 and a second space 1214 between the first electronic component 1211 and the circuit board 1212 that do not overlap each other, and the solder balls 1220 are located in the second space 1214. In order to stabilize the connection relationship between the first electronic component 1211 and the circuit board 1212, a filling material 1230 is filled in the first space 1213. The pattern filled with horizontal straight lines in FIG. 12 represents the area filled with the filling material 1230. In order to prevent the filling material 1230 from flowing from the first spacing space 1213 into the second spacing space 1214, a plurality of first isolation structures 1241 and a plurality of second isolations are provided around the interface of the first spacing space 1213 and the second spacing space 1214 Structure 1242. Since the blocking effect of the second isolation structure 1242 is not good, or the components located in the second spacing space 1214 are more sensitive to the filling material 1230, a two-layer isolation structure needs to be provided. The pattern filled with diagonal lines in FIG. 12 represents the first isolation structure 1241 or the second isolation structure 1242. The first isolation structure 1241 and the second isolation structure 1242 may be welding rods. A plurality of first isolation structures are provided on the interface between the first space 1213 and the second space 1214. The image projected on the circuit board 1212 by the interface between the first space 1213 and the second space 1214 is a rectangle, and the four mutually disconnected welding rods are respectively arranged on the four sides of the rectangle. The plurality of second isolation structures 1242 may include four welding rods, and the four welding rods are disconnected from each other. The second isolation structure 1242 is located on the side of the nearest first isolation structure 1241, is arranged parallel to the nearest first isolation structure 1241, and is located outside the second spacing space 1214. By arranging a multilayer isolation structure on the outer periphery of the second separation space 1214, it can be further ensured that a small amount of filling material 1230 not blocked by the first separation structure 1241 will not enter the second separation space 1214.

FIG. 13 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application. The difference from FIG. 12 is that the plurality of first isolation structures 1341 and the plurality of second isolation structures 1342 in the circuit assembly 1300 are all electronic components. As shown in FIG. 13, the image projected on the circuit board 1312 of the interface between the first space 1313 and the second space 1314 is rectangular, and a plurality of first spaces are arranged on each of the four sides. Isolation structure 1341; A plurality of second isolation structures 1342 are provided on the outer periphery of the interface between the first separation space 1313 and the second separation space 1314. It can be seen from FIG. 13 that there may be a gap between two adjacent second isolation structures 1342, and the first isolation structure 1341 is arranged around the gap, which can effectively block the small amount that is not blocked by the second isolation structure 1342. The filling material 1330 ensures that the filling material 1330 will not enter the second space 1314. Compared with welding rods, when the electronic components can achieve the corresponding electrical functions, the existing electronic components can be fully utilized to make the filling material 1330 fill the preset area, and the amount of changes to the circuit components is less; while the electronic components cannot In the case of realizing the corresponding electrical functions, the electronic components can be installed together with other electronic components without increasing process complexity, and in some cases, other weak electronic components can also be protected. Moreover, the height of the welding rod is often limited. When the separation distance between the first circuit board and the circuit board is large, the barrier effect of the electronic components is slightly better.

Further, in order to ensure that the electronic component effectively blocks the filling material 1330 from entering the second space, various feasible methods can be adopted. For example, the spacing between electronic components can be shortened. For another example, use welding rods instead of solder balls to fix electronic components.

FIG. 14 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application. The difference from FIG. 12 is that the first isolation structure 1441 and the second isolation structure 1442 in the circuit assembly 1400 are both continuous and uninterrupted annular grooves connected end to end. The surface layer of the circuit board is usually a solder resist layer or a conductive layer, the lower part of the solder resist layer is a conductive layer, and the lower part of the conductive layer is an insulating layer. Therefore, the bottom surface of the annular groove can be one of solder resist material, conductive material, or insulating material. As shown in FIG. 14, the image projected on the circuit board 1412 of the interface between the first spacing space 1413 and the second spacing space 1414 is rectangular, and the first isolation structure 1441 is provided on the rectangular frame; The second isolation structure 1442 is provided on the outer periphery of the interface between a spacing space 1413 and the second spacing space 1414. Therefore, in the case that the second isolation structure 1442 cannot completely accept the excess filling material 1430, the first isolation structure 1441 accepts the excess filling material 1430 not accepted by the second isolation structure 1442, ensuring that the filling material 1430 will not enter The second compartment 1414. The groove can receive the excess filling material 1430 during the filling process and the rework process, so as to prevent the filling material 1430 from flowing into the second space 1414. During the repair process, the connection relationship between the first electronic component and the circuit board needs to be released. Compared with the circuit assembly 1200 shown in Figure 12, the welding rod is likely to disappear due to heat during the repair process, and the welding rod needs to be processed again. The process is complicated; and the groove will not disappear during the repair process and has been filled in The filling material 1430 in the groove is also easily removed due to heat, and the process is relatively simple.

According to the embodiments shown in FIGS. 12 to 14, the first isolation structure may be one of a welding rod, an electronic component, and a groove, and the second isolation structure may be one of a welding rod, an electronic component, and the groove. In addition, the isolation structure of the resin material will increase the process complexity. Because the soldering temperature is relatively high, for example, the soldering temperature of tin solder, silver solder, and copper solder is around 245°C, while the solidification temperature of resin materials is relatively low, generally around 150°C. Therefore, the solidification of ordinary resin materials cannot be carried out together with welding, that is, the welding process and the isolation structure forming process cannot be realized at the same time in one process step. If a special curing resin material or special solder is used to complete the curing of the resin material while the welding is heating, on the one hand, it will increase the manufacturing cost of the parts. On the other hand, the resin material will affect the shape of the solder ball during the curing process. Affect welding yield. In the two process steps, the welding process and the isolation structure forming process are performed separately. On the one hand, the forming process is increased. On the other hand, the solder balls formed by the welding process will be subjected to secondary heating, which affects the mechanical properties of the solder balls. It has been verified that the use of solder and electronic components will not affect the electrical performance of other electronic components. For example, when an antenna radiator or radio frequency chip is installed on the circuit board, the use of solder and electronic components will not affect the working state of the antenna radiator or radio frequency chip. Due to the different blocking effects that can be achieved by welding rods, electronic components, and grooves, the number and types of first isolation structures and the number and types of second isolation structures can be flexibly selected according to actual conditions. In order to help those skilled in the art to better understand, the following describes multiple possible implementation manners of the circuit components provided in the embodiments of the present application in conjunction with FIG. 15 to FIG. 18. It can be understood that the embodiments shown in FIG. 15 to FIG. 18 are not a limitation on the technical solution of the present application.

FIG. 15 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application. The circuit component 1500 may be applied to the electronic device 100 shown in FIG. 1. The circuit assembly 1500 can replace the circuit assembly 30 shown in FIG. 1. The circuit assembly 1500 may include a first electronic component 1511 and a circuit board 1512. Both the first electronic component 1511 and the circuit board 1512 are provided with circuits. The first electronic component 1511 is electrically connected to the circuit board 1512 through solder balls 1520, so as to realize the first electronic component 1511. An electrical connection between the circuit on the electronic component 1511 and the circuit on the circuit board 1512. There are a first space 1513 and a second space 1514 between the first electronic component 1511 and the circuit board 1512 that do not overlap each other, and the solder balls 1520 are located in the second space 1514. In order to stabilize the connection relationship between the first electronic component 1511 and the circuit board 1512, a filling material 1530 is filled in the first space 1513. The pattern filled with horizontal straight lines in FIG. 15 represents the area filled with the filling material 1530. In order to prevent the filling material 1530 from flowing into the second interval space 1514 from the first interval space 1513, a plurality of first isolation structures 1541 and a plurality of second isolation structures 1542 are provided at the junction of the first interval space 1513 and the second interval space 1514 . Since the blocking effect of the second isolation structure 1542 is not good, or the components located in the second spacing space 1514 are more sensitive to the filling material 1530, a two-layer isolation structure needs to be provided. The pattern filled with diagonal lines in FIG. 15 represents the first isolation structure 1541 or the second isolation structure 1542. The first isolation structure 1541 may be a welding rod. A plurality of first isolation structures are provided on the interface between the first space 1513 and the second space 1514. The image projected on the circuit board 1512 of the interface between the first space 1513 and the second space 1514 is a rectangle, and the four mutually disconnected welding rods are respectively arranged on the four sides of the rectangle. The second isolation structure 1542 may be an electronic component. The second isolation structure 1542 is located on the side of the closest first isolation structure 1541, is arranged parallel to the closest first isolation structure 1541, and is located outside the second separation space 1514. Since the filling material 1530 is usually filled from the outside to the inside, the hydraulic pressure near the second isolation structure 1542 is relatively large, and the filling material 1530 is easy to rise to a higher height. Therefore, relatively high electronic components can be selected as the second isolation structure 1542. More appropriate; as the filling material 1530 flows, the hydraulic pressure of the filling material 1530 is gradually reduced, so a relatively low height electrode can be selected as the first isolation structure 1541 to further ensure a small amount that is not blocked by the second isolation structure 1542 The filling material 1530 will not enter the second space 1514.

FIG. 16 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application. The circuit component 1600 can be applied to the electronic device 100 shown in FIG. 1. The circuit assembly 1600 can replace the circuit assembly 30 shown in FIG. 1. The circuit assembly 1600 may include a first electronic component 1611 and a circuit board 1612. Both the first electronic component 1611 and the circuit board 1612 are provided with circuits. The first electronic component 1611 is electrically connected to the circuit board 1612 through solder balls 1620, so as to realize the first An electrical connection between the circuit on the electronic component 1611 and the circuit on the circuit board 1612. There are a first space 1613 and a second space 1614 that do not overlap with each other between the first electronic component 1611 and the circuit board 1612, and the solder balls 1620 are located in the second space 1614. In order to stabilize the connection relationship between the first electronic component 1611 and the circuit board 1612, a filling material 1630 is filled in the first space 1613. The pattern filled with horizontal straight lines in FIG. 16 represents the area filled with the filling material 1630. In order to prevent the filling material 1630 from flowing from the first interval space 1613 to the second interval space 1614, a first isolation structure 1641 and a plurality of second isolation structures 1642 are provided at the junction of the first interval space 1613 and the second interval space 1614. Since the blocking effect of the second isolation structure 1642 is not good, or the components located in the second spacing space 1614 are more sensitive to the filling material 1630, a two-layer isolation structure needs to be provided. The pattern filled with diagonal lines in FIG. 16 represents the first isolation structure 1641 or the second isolation structure 1642. The first isolation structure 1641 is a continuous and uninterrupted annular groove connected end to end. The image projected on the circuit board 1612 of the interface between the first space 1613 and the second space 1614 is rectangular, and the first isolation structure 1641 is provided on the rectangular frame. Outside the contour groove, that is, outside the second spacing space, the plurality of second isolation structures 1642 are provided. The plurality of second isolation structures 1642 may be 4 welding rods, and the 4 welding rods are disconnected from each other. Any electrode is parallel to one side of the annular groove. Since the filling material 1630 is usually filled from the outside to the inside, there are more filling materials 1630 close to the outside of the space. Compared with the groove with limited capacity, it is more suitable to choose the welding rod as the second isolation structure 1642; and as the filling material 1630 flows Since there is less filling material 1630 close to the inner side of the spacing space, the groove can be used to receive the excess filling material 1630 to further ensure that the small amount of filling material 1630 not blocked by the second isolation structure 1642 will not enter the second spacing space 1614. Similarly, the second isolation structure 1642 can be replaced with electronic components. For example, each welding rod can be replaced with multiple electronic components 17421, so as to prevent the filling material 1730 from rising too fast and increasing too much. The filling material 1730 flows into the groove, thereby avoiding the situation that the first isolation structure 1741 cannot bear too much filling material, as shown in FIG. 17.

In summary, the first isolation structure may be arranged at the interface position between the first interval space and the second interval space. The second isolation structure may be a side where the first isolation structure is arranged, located outside the second interval space, and may be wrapped by a filling material. The specific setting position of the first isolation structure is related to the blocking effect that can be achieved. Similarly, the specific setting position of the second isolation structure is related to the blocking effect that can be achieved. Therefore, you can flexibly choose where to use the isolation structure according to the actual situation. Further, the type of isolation structure can be flexibly selected according to the actual situation.

In an example, a first isolation structure may be provided at a position of a part of the interface between the first interval space and the second interval space. As shown in FIG. 18, the circuit assembly 1800 may include a first electronic component 1811 and a circuit board 1812. Both the first electronic component 1811 and the circuit board 1812 are provided with circuits. The first electronic component 1811 is electrically connected to the circuit board 1812 through solder balls 1820. By connecting, electrical connection between the circuit on the first electronic component 1811 and the circuit on the circuit board 1812 can be realized. There are a first space 1813 and a second space 1814 between the first electronic component 1811 and the circuit board 1812 that do not overlap each other, and the solder balls 1820 are located in the second space 1814. In order to stabilize the connection relationship between the first electronic component 1811 and the circuit board 1812, a filling material 1830 is filled in the first space 1813. The pattern filled with horizontal straight lines in FIG. 18 represents the area filled with the filling material 1830. The pouring point of the filling material 1830 is K point. In order to prevent the filling material 1830 from flowing into the second separation space 1814 from the first separation space 1813, a plurality of first separation structures 1841 are provided at the junction of the first separation space 1813 and the second separation space 1814. The figure enclosed by the interface between the first compartment 1813 and the second compartment 1814 is a rectangle, and the first isolation structure 1841 is provided on the three sides of the rectangle located on the upper, left, and right sides. No isolation structure is provided on the lower side of the rectangle, and the first isolation structure 1841 is a welding rod. Since the pouring point of the filling material 1830 is K point, the hydraulic pressure of the filling material 1830 near the pouring point is larger, and the filling material 1830 is easy to rise to a higher height, and the hydraulic pressure far away from the pouring point is lower, and the liquid height of the filling material 1830 The second isolation structure 1842 can be provided on the side of the first isolation structure 1841 close to the casting position. The second isolation structure 1842 is an electronic element to resist the filling material 1830 with a larger increase.

A common point of the embodiments shown in FIGS. 4 to 18 is that the solder balls that electrically connect the first electronic component and the circuit board are located in the second space, so as to prevent the filling material from wrapping between the first electronic component and the circuit board. Part of the solder balls. The following describes a possible application scenario of the embodiments shown in FIGS. 4 to 18 through a specific example (as shown in FIG. 19). Benefiting from the guidance presented in the embodiment shown in FIG. 19, those skilled in the art will think of many improvements and other embodiments of the present application. Therefore, it should be understood that the present application is not limited to the specific embodiments disclosed.

FIG. 19 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application. The circuit assembly 1900 may include a first electronic component 1911, a circuit board 1912, and a second electronic component 1916. Among them, the first electronic component 1911 is an EMMC, the circuit board 1912 is a PCB, and the second electronic component 1916 is a POP component. The EMMC may include multiple chips and packaging materials that package the multiple chips into one body. The geometric figures filled with a dot matrix pattern in Fig. 19 are used to represent packaging materials. The first electronic component 1911 may be fixed to one side of the circuit board 1912 by welding. The drum pattern in Figure 19 is used to represent the solder balls 1920. On the other side of the circuit board 1912, a second electronic component 1916 is fixed. The second electronic component 1916 is a POP component, that is, the POP component can be fixed on the other side of the PCB 301 by soldering. The POP device may include, for example, a SOC device and a DDR memory, that is, the SOC device and the DDR memory may be packaged as a whole in a stacked manner. The SOC element can be electrically connected to the DDR memory through solder balls 1920. The area where the first electronic component 1911 is projected on the surface of the circuit board 1912 is area A, the area where the second electronic component 1916 is projected on the surface of the circuit board 1912 is area B, and the area A and the area B overlap or overlap. There is a space between the first electronic component 1911 and the circuit board 1912, and there is a space between the circuit board 1912 and the second electronic component 1916. In the process of repairing the POP component, it is necessary to heat the space between the circuit board 1912 and the second electronic component 1916. It is not suitable to fill the filling material 1930 in the space close to the space to be heated and on the other side of the circuit board 1912. The interval space between the first electronic component 1911 and the circuit board 1912 may be divided into a first interval space 1913 filled with a filling material 1930 and a second interval space 1914 not filled with a filling material 1930. Therefore, one or more first isolation structures 1941 may be provided at the junction of the first interval space 1913 and the second interval space 1914, and the first isolation structure 1941 may be one of a welding rod, an electronic component, and a groove. For the specific setting manner, refer to the embodiments shown in FIG. 4 to FIG. 18. When there is only the first isolation structure 1941, the blocking effect may be poor, or the components located in the second spacing space 1914 are more sensitive to the filling material 1930, it can be located on the side of the first isolation structure. A second isolation structure 1942 is provided outside the second interval space to further ensure that the filling material 1930 does not enter the second interval space. The manner of providing the second isolation structure 1942 can refer to the embodiments shown in FIGS. 12 to 18.

The following describes multiple possible implementation manners of the circuit components provided by the embodiments of the present application in conjunction with FIG. 20 to FIG. 22. It can be understood that the embodiments shown in FIG. 20 to FIG. 22 are only used to help those skilled in the art to better understand the technical solutions of the present application, and are not intended to limit the technical solutions of the present application. Benefiting from the guidance presented in the foregoing description and related drawings, those skilled in the art will think of many improvements and other embodiments of the present application. Therefore, it should be understood that the present application is not limited to the specific embodiments disclosed.

It should be understood that, in FIG. 20, the lower figure shows the separation space between the first electronic component and the circuit board and the components arranged in the separation space, and the upper figure shows a cross-sectional view of the circuit assembly , Its cross-section and the viewing direction of the cross-section are represented by a broken line with an arrow in the figure below.

FIG. 20 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application. The circuit assembly 2000 can be applied to the electronic device 100 shown in FIG. 1. The circuit assembly 2000 can replace the circuit assembly 30 shown in FIG. 1. As shown in FIG. 20, the circuit assembly 2000 may include a first electronic component 2011 and a circuit board 2012. Both the first electronic component 2011 and the circuit board 2012 are provided with circuits. The first electronic component 2011 is electrically connected to the circuit board 2012 through solder balls 2020. Connection, so that electrical connection between the circuit on the first electronic component 2011 and the circuit on the circuit board 2012 can be realized. There are a first separation space 2013 and a second separation space 2014 that do not overlap each other between the first electronic component 2011 and the circuit board 2012. According to the figure located at the bottom of FIG. 20, the difference from the embodiment shown in FIG. 4 is that the solder balls 2020 are located in the first space 2013. A second electronic component 2016 electrically connected to the first electronic component 2011 or the circuit board 2012 is usually arranged in the second space 2014. FIG. 20 shows that the second electronic component 2016 is fixed on the first electronic component 2011 by solder balls 2020. In order to stabilize the connection relationship between the first electronic component 2011 and the circuit board 2012, a filling material 2030 is filled in the first space 2013. The pattern filled with horizontal straight lines in FIG. 20 represents the area filled with the filling material 2030. In order to prevent the filling material 2030 from flowing from the first compartment 2013 into the second compartment 2014 (that is, to prevent the filling material 2030 from wrapping the second electronic component 2016, the environment or the electronic product's own heating temperature will change greatly, etc.). The material undergoes thermal expansion or contraction to damage the second electronic component 2016 or the connection relationship between the second electronic component 2016 and the first electronic component 2011), and a first compartment is provided at the junction of the first compartment 2013 and the second compartment 2014 An isolation structure 2041, such that one side of the first isolation structure 2041 is filled with a filling material 2030, and on the other side of the first isolation structure 2041, neither the filling material 2030 is filled, but also a second electronic component is provided Solder balls between 2016 and the first electronic component 2011. The pattern filled with diagonal lines in FIG. 20 represents the first isolation structure 2041. Taking FIG. 20 as an example, four first isolation structures 2041 are provided in the space, and the four first isolation structures 2041 are all welding rods, and the four welding rods are disconnected from each other. The image projected on the circuit board 2012 of the interface between the first separation space 2013 and the second separation space 2014 is a rectangle, and the four welding rods are respectively arranged on the four sides of the rectangle. The height of the electrode should be slightly smaller than the separation distance between the first electronic component 2011 and the circuit board 2012. For example, the height of the welding rod is 2/3 of the separation distance between the first electronic component 2011 and the circuit board 2012. The first isolation structure 2041 shown in FIG. 20 is disposed on the circuit board 2012. It should be understood that the first isolation structure 2041 may also be disposed on the first electronic component 2011. It should be understood that the first isolation structure 2041 may be provided on the first electronic component 2011 and the circuit board 2012 at the same time. The following will take the first isolation structure provided on the circuit board as an example for description.

One feature of the embodiment shown in FIG. 20 is that the solder balls that electrically connect the first electronic component and the circuit board are located in the first space, that is, the filler material can wrap the solder balls between the first electronic component and the circuit board, and Electronic components may be arranged in the second compartment, which is slightly different from the scenarios shown in the examples shown in FIGS. 4-19. In this scenario, the isolation structure can be set with reference to the embodiment shown in FIGS. 5 to 18 (for example, one or more first isolation structures are set with reference to FIGS. 4 to 11, and one or more first isolation structures are set with reference to FIGS. 12 to 18). One first isolation structure and one or more second isolation structures).

The following describes possible application scenarios of the embodiment shown in FIG. 20 through two specific examples (as shown in FIG. 21 and FIG. 22). Benefiting from the guidance presented in the embodiments shown in FIGS. 21 and 22, those skilled in the art will think of many improvements and other embodiments of the present application. Therefore, it should be understood that the present application is not limited to the specific embodiments disclosed.

FIG. 21 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application. The circuit assembly 2100 may include a first electronic component 2111, a circuit board 2112, and a second electronic component 2116. Among them, the first electronic component 2111 is an antenna radiator package, the circuit board 2112 is a PCB, and the second electronic component 2116 is a radio frequency chip. The antenna radiator package may include an antenna radiator and an integrated circuit 2160 electrically connected between the antenna radiator and the radio frequency chip. The antenna radiator package can be fixed on one side of the PCB by soldering. There is an interval space between the antenna radiator package and the PCB, and the radio frequency chip is arranged in the interval space and fixed on one side of the antenna radiator package by solder balls. The drum pattern in FIG. 21 is used to represent solder balls. There is a space between the antenna radiator package and the PCB, and a filling material 2130 can be filled in the space. In scenarios such as the environment or the electronic product’s own heating temperature changes greatly, the filling material will heat up, expand and cool down, which can easily damage the RF chip or the connection between the RF chip and the antenna radiator package. Therefore, the filling material 2130 and the RF The chips should be separated by a certain distance. The space between the antenna radiator package and the PCB may be divided into a first space 2113 filled with a filling material 2130 and a second space 2114 not filled with a filling material 2130. Therefore, one or more first isolation structures 2141 may be provided at the junction of the first interval space 2113 and the second interval space 2114, and the first isolation structure 2141 may be one of a welding rod, an electronic component 21411, and a groove. For specific setting methods, refer to the embodiments shown in FIGS. 4 to 11. When there is only the first isolation structure 2141, the blocking effect may be poor, or the components located in the second spacing space 2114 are more sensitive to the filling material 2130. A second isolation structure 2142 is arranged outside the second interval space to further ensure that the filling material 2130 does not enter the second interval space. For the manner of providing the second isolation structure 2142, refer to the embodiments shown in FIGS. 12 to 18.

FIG. 22 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application. The circuit assembly 2200 may include a first electronic component 2211, a circuit board 2212, and a second electronic component 2216. Among them, the first electronic component 2211 is a SiP component, the circuit board 2212 is a frame board including a through hole 2210, and the second electronic component 2216 is a UFS. The SiP component may include a plurality of electronic components 22411 and a packaging material that encapsulates the plurality of electronic components 22411 as a whole. The plurality of electronic components 22411 may be DDR or SOC, for example. The geometric figures filled with dot matrix patterns in Fig. 22 are used to represent packaging materials. The SiP element can be fixed on one side of the frame board by welding, wherein the solder balls used to connect the SiP element are arranged around the through hole 2210 of the frame board. The drum pattern in Fig. 22 is used to represent solder balls. The UFS is arranged in the through hole 2210 of the frame plate. There is an interval space between the SiP element and the frame plate, and the filling material 2230 can be filled in the interval space. The filling material 2230 can easily flow into the through hole 2210 of the frame plate, causing glue leakage. The spacing space between the SiP element and the frame plate may be divided into a first spacing space 2213 filled with a filling material 2230 and a second spacing space 2214 not filled with a filling material 2230. Therefore, one or more first isolation structures 2241 may be provided at the junction of the first interval space 2213 and the second interval space 2214, and the first isolation structure 2241 may be one of a welding rod, an electronic component 22411, and a groove. For specific setting methods, refer to the embodiments shown in FIGS. 4 to 11. When there is only the first isolation structure 2241, the blocking effect may be poor, or the components located in the second spacing space 2214 are more sensitive to the filling material 2230, it can be placed on the side of the first isolation structure, A second isolation structure 2242 is provided outside the second interval space to further ensure that the filling material 2230 does not enter the second interval space. The manner of providing the second isolation structure 2242 can refer to the embodiments shown in FIGS. 12 to 18.

FIG. 23 is a schematic structural diagram of a circuit assembly provided by an embodiment of the application. The circuit component 2300 can be applied to the electronic device 100 shown in FIG. 1. The circuit assembly 2300 can replace the circuit assembly 30 shown in FIG. 1. As shown in FIG. 23, the circuit assembly 2300 may include a circuit board 2312 and a plurality of electronic components arranged on the circuit board 2312 (

electronic components

2311a, 2311b, 2311c, 2316a as shown in FIG. 23). The circuit board 2312 shown in FIG. 23 is a frame board. The circuit board 2312 is provided with a circuit, each of the plurality of electronic components is provided with a circuit, and each electronic component is electrically connected to the circuit board 2312 through solder balls 2320. A solder ball 2320 as shown in FIG. 23 can also be arranged around each electronic component. The plurality of electronic components may include a first electronic component 2311a, a second electronic component 2311b, a third electronic component 2311c, and a fourth electronic component 2316a. The circuit assembly 2300 further includes a fifth electronic component 2316b and a sixth electronic component 2316c, The fifth electronic component 2316b is fixed on the second electronic component 2311b by solder balls 2320, and the sixth electronic component 2316c is fixed on the third electronic component 2311c by solder balls 2320.

The first electronic component 2311a may be an EMMC. The area where the first electronic component 2311a is projected on the circuit board 2312 is A, and the fourth electronic component 2316a is mounted on the other side of the circuit board 2312, and the area where the fourth electronic component 2316a is projected on the circuit board 2312 is B. A and area B overlap or overlap. The fourth electronic component 2316a may be a POP component. The POP element may include, for example, a SOC element and a DDR memory. There are a first space 2313a and a second space 2314a that do not overlap with each other between the first electronic component 2311a and the circuit board 2312. In order to stabilize the connection relationship between the first electronic component 2311a and the circuit board 2312, the filling material 2330 is filled in the first space 2313a. The pattern filled with horizontal straight lines in FIG. 23 represents the area filled with the filling material 2330. In order to prevent the filling material 2330 from flowing from the first compartment 2313a into the second compartment 2314a (that is, to prevent the filling material 2330 from damaging the connection relationship between the first electronic component 2311a and the circuit board 2312 due to thermal expansion), in the first compartment 2313a A plurality of first isolation structures 2341a are provided at the junction with the second spacing space 2314a, so that one side of the first isolation structure 2341a is filled with the filling material 2330, and the other side of the first isolation structure 2341a is not filled with the filling material Material 2330. The pattern filled with diagonal lines in FIG. 23 represents the first isolation structure 2341a. Taking FIG. 23 as an example, the plurality of first isolation structures 2341a are 4 mutually disconnected electrodes. The image projected on the circuit board 2312 of the interface between the first space 2313a and the second space 2314a is a rectangle, and the four welding rods are respectively arranged on the four sides of the rectangle. The height of the electrode should be slightly smaller than the separation distance between the first electronic component 2311a and the circuit board 2312. For example, the height of the welding rod is 2/3 of the separation distance between the first electronic component 2311a and the circuit board 2312.

It should be understood that, in combination with the embodiments shown in FIGS. 4 to 18, other types of isolation structures can be provided at the junction of the first spacer region 2313a and the second spacer region 2314a.

The second electronic component 2311b may be a SiP component. There is a third space 2313b and a fourth space 2314b between the second electronic component 2311b and the circuit board 2312 that do not overlap each other. A fifth electronic component 2316b is provided in the fourth compartment 2314b. The fifth electronic component 2316b may be UFS, for example. The fifth electronic component 2316b may be disposed in the through hole 2310 of the frame board. In order to stabilize the connection relationship between the second electronic component 2311b and the circuit board 2312, a filling material 2330 is filled in the third space 2313b. The pattern filled with horizontal straight lines in FIG. 23 represents the area filled with the filling material 2330. In order to prevent the filling material 2330 from flowing from the third compartment 2313b into the fourth compartment 2314b (ie to avoid the phenomenon of glue leakage in the process of filling the filling material 2330), at the junction of the third compartment 2313b and the fourth compartment 2314b A plurality of second isolation structures 2341b are provided, such that one side of the second isolation structure 2341b is filled with the filling material 2330, and the other side of the second isolation structure 2341b is not filled with the filling material 2330. The pattern filled with diagonal lines in FIG. 23 represents the second isolation structure 2341b. Taking FIG. 23 as an example, the plurality of second isolation structures 2341b are 4 mutually disconnected electrodes. The image projected on the circuit board 2312 of the interface between the third space 2313b and the fourth space 2314b is a rectangle, and the four welding rods are respectively arranged on the four sides of the rectangle. The height of the electrode should be slightly smaller than the separation distance between the second electronic component 2311b and the circuit board 2312. For example, the height of the welding rod is 2/3 of the separation distance between the second electronic component 2311b and the circuit board 2312.

It should be understood that, in conjunction with the embodiments shown in FIGS. 5 to 18, other types of isolation structures may be provided at the junction of the third compartment 2313b and the fourth compartment 2314b.

The third electronic component 2311c may be an antenna radiator package. There is a fifth space 2313c and a sixth space 2314c between the third electronic component 2311c and the circuit board 2312 that do not overlap each other. A sixth electronic component 2316c is provided in the sixth compartment 2314c. The sixth electronic component 2316c may be a radio frequency chip. The antenna radiator package may include an antenna radiator and an integrated circuit 2230 electrically connected between the antenna radiator and the radio frequency chip. In order to stabilize the connection relationship between the third electronic component 2311c and the circuit board 2312, a filling material 2330 is filled in the fifth space 2313c. The pattern filled with horizontal straight lines in FIG. 23 represents the area filled with the filling material 2330. In order to prevent the filling material 2330 from flowing from the fifth compartment 2313c into the sixth compartment 2314c (that is, to prevent the filling material 2330 from wrapping the sixth electronic component 2316c, and to avoid the filling material from heating up and expanding in scenarios such as the environment or the electronic product’s own heating temperature changes greatly, Cooling and shrinking to prevent the filling material from damaging the RF chip or the connection between the RF chip and the antenna radiator package. The sixth electronic component 2316c or the connection between the sixth electronic component 2316c and the third electronic component 2311c). A plurality of third isolation structures 2341c are provided at the junction of the five compartments 2313c and the sixth compartment 2314c, so that one side of the third isolation structure 2341c is filled with the filling material 2330, and the other side of the third isolation structure 2341c The filling material 2330 is not filled. The pattern filled with diagonal lines in FIG. 23 represents the third isolation structure 2341c. Taking FIG. 23 as an example, the plurality of third isolation structures 2341c are 4 mutually disconnected electrodes. The image projected on the circuit board 2312 of the interface between the fifth space 2313c and the sixth space 2314c is a rectangle, and the four welding rods are respectively arranged on the four sides of the rectangle. The height of the electrode should be slightly smaller than the separation distance between the third electronic component 2311c and the circuit board 2312. For example, the height of the welding rod is 2/3 of the separation distance between the third electronic component 2311c and the circuit board 2312.

It should be understood that, in conjunction with the embodiments shown in FIGS. 5 to 18, other types of isolation structures can be provided at the junction of the fifth compartment 2313c and the sixth compartment 2314c.

It can be seen from FIG. 23 that, according to actual requirements, isolation structures for blocking the flow of the filling material can be provided at multiple positions of the circuit assembly.

A person of ordinary skill in the art may be aware that the units and algorithm steps of the examples described in combination with the embodiments disclosed herein can be implemented by electronic hardware or a combination of computer software and electronic hardware. Whether these functions are executed by hardware or software depends on the specific application and design constraint conditions of the technical solution. Professionals and technicians can use different methods for each specific application to implement the described functions, but such implementation should not be considered beyond the scope of this application.

Those skilled in the art can clearly understand that, for the convenience and conciseness of description, the specific working process of the above-described system, device, and unit can refer to the corresponding process in the foregoing method embodiment, which will not be repeated here.

In the several embodiments provided in this application, it should be understood that the disclosed system, device, and method may be implemented in other ways. For example, the device embodiments described above are only illustrative. For example, the division of the units is only a logical function division, and there may be other divisions in actual implementation, for example, multiple units or components can be combined or It can be integrated into another system, or some features can be ignored or not implemented. In addition, the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may be in electrical, mechanical or other forms.

The units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the objectives of the solutions of the embodiments.

In addition, the functional units in each embodiment of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units may be integrated into one unit.

The above are only specific implementations of this application, but the protection scope of this application is not limited to this. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed in this application. Should be covered within the scope of protection of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims

A circuit assembly, characterized in that it comprises:

Circuit board

A first electronic component arranged on the circuit board, and there is a space between the first electronic component and the circuit board;

Filling material, located in the first interval space in the interval space;

One or more first isolation structures are located in the spacing space, and the first isolation structures are arranged on the circuit board and/or the first electronic components, wherein the first isolation structures are The second interval space in the interval space is separated from the first interval space, the second interval space is a space in the interval space that is not filled with the filling material, and the first isolation structure is convex or Groove.
The circuit assembly according to claim 1, wherein the protrusion is a welding rod or an electronic component.
The circuit assembly according to claim 1 or 2, wherein the plurality of first isolation structures comprise two welding electrodes that are not connected to each other.
The circuit assembly according to claim 1 or 2, wherein the one or more first isolation structures are a welding rod frame formed by a plurality of welding rods connected end to end, and the filling material is located outside the welding rod frame .
The circuit assembly according to any one of claims 1 to 3, wherein a circuit is provided on the circuit board, and the one or more first isolation structures include electronic components electrically connected to the circuit board .
The circuit assembly according to any one of claims 1 to 3 and 5, wherein the one or more first isolation structures comprise grooves, and the bottom surface of the grooves is made of solder resist material, conductive material, One of the insulating materials.
The circuit assembly according to any one of claims 1 to 6, wherein the circuit assembly further comprises:

One or more second isolation structures are arranged on one side of the first isolation structure and are wrapped by the filling material, and the second isolation structures are one or more of welding rods, electronic components, and grooves.
The circuit assembly according to any one of claims 1 to 7, wherein the circuit assembly further comprises:

The second electronic component is located in the second space and is arranged on the first electronic component.
The circuit assembly according to any one of claims 1 to 7, wherein the circuit assembly further comprises:

A plurality of solder balls, electrically connected between the circuit board and the first electronic component, and located in the second space;

A third electronic component arranged on the circuit board, the third electronic component and the first electronic device are respectively located on both sides of the circuit board, and the third electronic component is projected on the surface of the circuit board The area crosses or overlaps with the area where the first electronic component is projected on the surface.
An electronic device, characterized in that it comprises:

Circuit board

A first electronic component arranged on the circuit board, and there is a space between the first electronic component and the circuit board;

Filling material, located in the first interval space in the interval space;

One or more first isolation structures are located in the spacing space, and the first isolation structures are arranged on the circuit board and/or the first electronic components, wherein the first isolation structures are The second interval space in the interval space is separated from the first interval space, the second interval space is a space in the interval space that is not filled with the filling material, and the first isolation structure is convex or Groove

The power supply is used to supply power to the circuit board and/or electronic components.
The electronic device according to claim 10, wherein the protrusion is a welding rod or an electronic component.
The electronic device according to claim 10 or 11, wherein the plurality of first isolation structures comprise two welding electrodes that are not connected to each other.
The electronic device according to claim 10 or 11, wherein the one or more first isolation structures are a welding rod frame formed by a plurality of welding rods connected end to end, and the filling material is located outside the welding rod frame .
The electronic device according to any one of claims 10 to 12, wherein a circuit is provided on the circuit board, and the one or more first isolation structures include electronic components electrically connected to the circuit board .
The electronic device according to any one of claims 10 to 12, 14, wherein the one or more first isolation structures comprise grooves, and the bottom surface of the grooves is made of solder resist material, conductive material, One of the insulating materials.
The electronic device according to any one of claims 10 to 15, wherein the electronic device further comprises:

One or more second isolation structures are arranged on one side of the first isolation structure and are wrapped by the filling material, and the second isolation structures are one or more of welding rods, electronic components, and grooves.
The electronic device according to any one of claims 10 to 16, wherein the electronic device further comprises:

The second electronic component is located in the second space and is arranged on the first electronic component.
The electronic device according to any one of claims 10 to 16, wherein the electronic device further comprises:

A plurality of solder balls, electrically connected between the circuit board and the first electronic component, and located in the second space;

A third electronic component arranged on the circuit board, the third electronic component and the first electronic device are respectively located on both sides of the circuit board, and the third electronic component is projected on the surface of the circuit board The area crosses or overlaps with the area where the first electronic component is projected on the surface.