WO2021022940A1 - 终端设备 - Google Patents

终端设备 Download PDF

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Publication number
WO2021022940A1
WO2021022940A1 PCT/CN2020/098852 CN2020098852W WO2021022940A1 WO 2021022940 A1 WO2021022940 A1 WO 2021022940A1 CN 2020098852 W CN2020098852 W CN 2020098852W WO 2021022940 A1 WO2021022940 A1 WO 2021022940A1
Authority
WO
WIPO (PCT)
Prior art keywords
millimeter wave
terminal device
fpc
screen
radiator
Prior art date
Application number
PCT/CN2020/098852
Other languages
English (en)
French (fr)
Inventor
王义金
简宪静
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2021022940A1 publication Critical patent/WO2021022940A1/zh
Priority to US17/591,153 priority Critical patent/US20220158330A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/364—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith using a particular conducting material, e.g. superconductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/14—Reflecting surfaces; Equivalent structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/10—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/08—Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a rectilinear path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/20—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements characterised by the operating wavebands
    • H01Q5/22—RF wavebands combined with non-RF wavebands, e.g. infrared or optical
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/06—Details
    • H01Q9/065—Microstrip dipole antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q25/00—Antennas or antenna systems providing at least two radiating patterns

Definitions

  • the embodiments of the present disclosure relate to the field of terminal technology, and in particular to a terminal device.
  • wireless communication technology With the development of wireless communication technology, the application scenarios of the wireless communication system are becoming more and more abundant, and the requirements for the antenna, one of the key components of the wireless communication system, are getting higher and higher.
  • antennas need to have conformality, concealment, and security in order to integrate into wireless products such as cars, smart wearables, and smart homes.
  • transmission rate of wireless communication systems becomes more and more Higher communication capacity, higher and higher carrier frequency, and higher and higher carrier frequency bring greater and greater path loss.
  • phased antenna array technology needs to be adopted, and thus more and more antennas need to be integrated in a limited space.
  • the current mainstream millimeter wave antenna design scheme is mainly to adopt the technology and process of package antenna (Antenna in package, AIP), namely package antenna module (AIP module) 10, the millimeter wave array antenna 11, radio frequency integrated circuit (Radio Frequency Integrated Circuit, RFIC) and Power Management Integrated Circuit (PMIC) are integrated in one module.
  • AIP package antenna module
  • RFIC Radio Frequency Integrated Circuit
  • PMIC Power Management Integrated Circuit
  • the embodiments of the present disclosure provide a terminal device, which solves the problem that the antenna module occupies more space inside the terminal device in the related art and reduces the antenna performance of the terminal device.
  • a terminal device including: a screen and a main board, wherein the edge of the screen has a clearance area, and the terminal device further includes: a first radio frequency integrated circuit RFIC and at least one antenna unit; the antenna At least part of the unit is arranged in the clearance area; the antenna unit is connected to the first RFIC; the first RFIC is arranged on the first flexible circuit board FPC of the screen, and the first FPC is also A screen integrated circuit IC and a touch IC are provided, and the first FPC is connected to the main board through a first BTB connector.
  • RFIC radio frequency integrated circuit
  • the terminal device further includes: a first radio frequency integrated circuit RFIC and at least one antenna unit; the antenna At least part of the unit is arranged in the clearance area; the antenna unit is connected to the first RFIC; the first RFIC is arranged on the first flexible circuit board FPC of the screen, and the first FPC is also A screen integrated circuit IC and a touch IC are provided, and the first FPC is connected to the
  • At least part of the antenna unit is arranged in the clear space area of the terminal screen, which saves the space required by the antenna unit, avoids occupying the space of the existing antenna, and improves the antenna performance of the terminal device.
  • FIG. 1 is a schematic diagram of the structure of an AIP module in related technologies
  • Figure 2a is one of the schematic structural diagrams of the terminal device provided by the embodiments of the disclosure.
  • FIG. 2b is one of the schematic diagrams of the position of the clearance area on the screen provided by the embodiment of the disclosure.
  • FIG. 2c is the second schematic diagram of the position of the clearance area on the screen provided by the embodiment of the disclosure.
  • Fig. 3 is an enlarged schematic diagram of area A in Fig. 2;
  • Fig. 4 is an enlarged schematic diagram of area B in Fig. 3;
  • FIG. 5 is a schematic structural diagram of a millimeter wave antenna and a signal reflection area provided by an embodiment of the disclosure
  • Fig. 6 is the second structural diagram of a terminal device provided by an embodiment of the present disclosure.
  • the terminal device may be a mobile phone, a tablet computer, a notebook computer, an Ultra-Mobile Personal Computer (UMPC), a netbook, or a Personal Digital Assistant (PDA), etc., the embodiment of the present disclosure
  • UMPC Ultra-Mobile Personal Computer
  • PDA Personal Digital Assistant
  • an embodiment of the present disclosure provides a terminal device 20, including: a screen 21 and a motherboard (not shown in the figure), the edge of the screen 21 has a clear area 231, the terminal device 20 further includes: a first RFIC 24 And at least one antenna unit 25; at least part of the antenna unit 25 is arranged in the clearance area 231; the antenna unit 25 is connected to the first RFIC 24.
  • the above-mentioned antenna unit 25 may be a millimeter wave antenna unit, and the following description will be made by taking the antenna unit 25 as a millimeter wave antenna unit as an example.
  • the first RFIC 24 is arranged on the first flexible printed circuit (FPC) 22 of the screen 21, and the first FPC 22 is used to carry the integrated circuit (IC) 221 and the touch screen.
  • the FPC is connected to the main board through a first board-to-board (Board To Board, BTB) connector 223.
  • Figure 2a shows a scene where the headroom 231 is located at the bottom area of the screen 21. It is understood that the first end can also be located at other positions on the screen. As shown in Figure 2b, the headroom 231 can be located at the top area of the screen 21. 2101, the side area 2102 of the screen 21 or the corner area 2103 of the screen 21, the embodiment of the present disclosure does not specifically limit the position of the clearance area 231.
  • the aforementioned first FPC 22 is an existing FPC in the terminal device 20, and the first FPC 22 is used for signal transmission between the screen 21 and the main board.
  • FIG. 2 only shows an application where the number of millimeter wave antenna units 25 is four.
  • the number of millimeter wave antenna units 25 can also be other numbers. Those skilled in the art can adjust the millimeter wave antenna unit 25 according to actual product requirements. Quantity.
  • the first RFIC 24 is set on the first FPC 22, and the connection between the first RFIC 24 and the main board is realized through the existing first FPC 22 and the first BTB connector 223 of the terminal device 20,
  • the millimeter wave antenna unit 25 is connected to the first RFIC 24.
  • the millimeter wave antenna unit is set in the clearance area of the terminal screen, and the RFIC connected to the millimeter wave antenna unit is set on the FPC in the terminal equipment related technology, and the terminal screen related technology is shared
  • the FPC and BTB connectors of the FPC can not only realize the signal transmission between the millimeter wave antenna unit and the motherboard, but also save the space required by the millimeter wave antenna unit, avoid occupying the space of the existing antenna, and improve the antenna performance of the terminal device.
  • the aforementioned clearance area 231 is a reserved area on the glass substrate of the screen 21.
  • the screen 21 includes: a cover 21a, a touch layer 21b and a glass substrate 21c.
  • the area of the glass substrate 21c It is slightly larger than the touch layer 21b, and a clearance area 231 is formed on the edge of the glass substrate 21c.
  • the cover 21a can be a glass cover or a plastic cover.
  • the area without any metal components in the clearance area 231 has only glass or plastic medium. Selecting the area without metal components to install at least part of the millimeter wave antenna unit 25 can avoid affecting the communication of the millimeter wave antenna.
  • FIG. 3 is an enlarged schematic diagram of area A in FIG. 2
  • FIG. 4 is a schematic diagram of a method of area B in FIG.
  • the millimeter wave antenna unit 25 includes: a millimeter wave antenna 251, a millimeter wave signal source 252, and a feeding structure 253;
  • the millimeter wave antenna 251 is arranged in the clearance area 231.
  • Millimeter wave antennas are used to transmit and receive millimeter waves. Due to the short wavelength of millimeter waves, the size of millimeter wave antennas can be made small. However, the width of the screen clearance area in the current mainstream full-screen terminal equipment is usually about 1 mm, so it can The millimeter wave antenna 251 is arranged in the clearance area 231, specifically on the glass substrate in the clearance area 231.
  • the dielectric constant of the glass material is relatively high, the size of the millimeter wave antenna can be further reduced.
  • the millimeter wave signal source 252 is arranged in the first RFIC 24, and the first RFIC 24 controls the millimeter wave signal source 252, and then controls the millimeter wave antenna 251 to transmit millimeter wave signals;
  • the millimeter wave antenna 251 is connected to the millimeter wave signal source 252 through the feeding structure 233.
  • each component of the millimeter wave antenna unit 25 is shown in FIG. 4.
  • the millimeter wave signal source 252 is set in the first RFIC 24 , Rather than in area B in Figure 3.
  • the feeding structure 253 is arranged on the first FPC 22.
  • the feeding structure 253 is a transmission line designed on the first FPC 22, and the millimeter wave antenna 251 is connected to the millimeter wave signal source 252 through the transmission line on the first FPC 22.
  • the millimeter wave antenna 251 includes a first radiator 2511 and a second radiator 2512.
  • the first radiator 2511 is connected to the millimeter wave signal source 252 through a feeding structure 253, and the second radiator 2512 is grounded.
  • the millimeter wave antenna 251 is a dipole antenna, that is, the first radiator 2511 and the second radiator 2512 are symmetrically arranged.
  • FIG. 4 shows a scene where the shapes of the first radiator 2511 and the second radiator 2512 are elliptical, and the first radiator 2511 and the second radiator 2512 may also have other shapes. The personnel can adjust the shapes of the first radiator 2511 and the second radiator 2512 according to actual product requirements.
  • the second radiator 2512 is formed by a part of the ground wire 211 in the indium tin oxide (ITO) circuit of the screen extending into the clearance area 231.
  • ITO indium tin oxide
  • the above ITO circuit refers to the ITO circuit of the touch layer in the screen, and the ground wire 211 protects the ITO wire used for static electricity of the touch screen.
  • a part of the ground wire 211 in the ITO circuit serves as the second radiator 2512, and there is no need to provide a feeder ground wire, which reduces the number of feeder wires of the millimeter wave antenna 251.
  • the second radiator 2512 also has light transmittance, which will not affect the normal display of the screen.
  • the first radiator 2511 extends to the link area 26 between the screen and the FPC, and is connected to the power feeding structure.
  • the above-mentioned link area 26 may also be referred to as a bonding area, which is a bonding area between the screen and the FPC.
  • a bonding area which is a bonding area between the screen and the FPC.
  • the bonding area is a hot pressing position.
  • the first radiator 2511 is designed on a different layer from the ITO ground of the screen via the bonding area, that is, the first radiator 2511 and the ground are not conductive.
  • the first radiator 2511 is an ITO radiator, and the first radiator 2511 is made by using an ITO wiring process to make the first radiator 2511 light-transmissive and avoid affecting the normal display of the screen.
  • the housing of the terminal device includes a signal reflection area 201. After the signal emitted by the millimeter wave antenna 251 is reflected by the signal reflection area 201, the direction of the signal is the same as the direction of the screen.
  • the above-mentioned signal reflection area 201 can be realized by arranging a part of the metal area in the housing of the terminal device.
  • the reflection effect of the metal surface on the signal is used to make the maximum radiation direction of the millimeter wave antenna 251 to be the same as that of the screen, thereby increasing the antenna gain and Wireless communication performance.
  • the housing of the terminal device includes a front shell or a middle frame, and the signal reflection area 201 is located in the front shell or the middle frame, and the front shell or the middle frame serves as a reflector of the millimeter wave antenna 251.
  • an embodiment of the present disclosure provides another terminal device 30.
  • the difference between the terminal device 30 and the terminal device 20 in FIG. 2 is that the terminal device 30 also includes a second FPC 31 and a second RFIC 32.
  • the first FPC 22 is set at the first end of the screen 21 in the length direction
  • the first FPC 22 carries the screen IC 221 and the touch IC 222
  • the second FPC 31 is set at the second end of the screen 21 in the length direction
  • the second FPC 31 is set with the second RFIC 32
  • the second FPC 31 is connected to the main board through a second BTB connector 33
  • the second end has a clearance area 232
  • a millimeter wave antenna unit 25 is provided at both the first end and the second end.
  • the wave antenna unit 25 is connected to the first RFIC, and the millimeter wave antenna unit 25 at the second end is connected to the second RFIC 32.
  • a millimeter wave antenna unit 25 is also provided at the second end of the screen 21, and a second FPC 31, a second RFIC 32, and a second BTB connector 33 are added correspondingly.
  • a second FPC 31, a second RFIC 32, and a second BTB connector 33 are added correspondingly.
  • the terminal device 30 when the terminal device 30 is used, if the millimeter wave antenna at the first end is blocked, the terminal device 30 can automatically switch to use the millimeter wave antenna at the second end to increase the spatial coverage of the millimeter wave antenna, such as increasing the cumulative distribution function (Cumulative Distribution Function). Distribution Function) indicator.
  • Cumulative Distribution Function Distribution Function
  • the above-mentioned automatic switching of the millimeter wave antenna may be implemented by an antenna switching method in the related art, which is not specifically limited in the embodiment of the present disclosure.
  • the millimeter wave antenna unit is provided at both the first end and the second end of the terminal screen, and at least part of the millimeter wave antenna unit is set in the clearance area of the terminal screen and connected to the millimeter wave antenna unit.
  • the RFIC is set on the FPC of the terminal device and shares the FPC and BTB connectors of the terminal screen. While realizing the signal transmission between the millimeter wave antenna unit and the motherboard, it saves the space required for the millimeter wave antenna unit and avoids occupying the existing antenna Space to improve the antenna performance of terminal equipment.
  • the other end can be automatically switched to use, which improves the spatial coverage of the millimeter wave antenna and enhances the antenna performance of the terminal device.

Abstract

本公开实施例提供一种终端设备，包括：屏幕和主板，屏幕的边缘具有净空区，终端设备还包括：第一射频集成电路RFIC和至少一个天线单元；天线单元的至少部分设置在净空区内；天线单元与第一RFIC连接，第一RFIC设置在屏幕的第一FPC上，该第一FPC通过第一BTB连接器与主板连接。

Description

终端设备
相关申请的交叉引用
本申请主张在2019年8月5日在中国提交的中国专利申请号No.201910716728.7的优先权，其全部内容通过引用包含于此。
技术领域
本公开实施例涉及终端技术领域，特别涉及一种终端设备。
背景技术
随着无线通信技术的发展，无线通信系统的应用场景越来越丰富，对无线通信系统关键部件之一的天线的要求越来越高。一方面，在一些应用场景中，天线需要具有共形性，隐蔽性，安全性以便集成汽车，智能穿戴，智能家居等无线产品上，另一方面，随着无线通信系统的传输速率越来越高，通信容量越来越大，载波频率越来越高，而载波频率越来越高带来的路径损耗越来越大，需要阵列天线提高增益克服路径损耗的影响，而为了高增益同时又能波束扫描或者波束赋形(beamforming)，需要采用相控阵列天线(phased antenna array)技术，从而需要在有限的空间内集成越来越多的天线。
参见图1，目前主流毫米波天线的设计方案主要是采用封装天线(Antenna in package，AIP)的技术与工艺，即封装天线模块(AIP module)10，把毫米波的阵列天线11、射频集成电路(Radio Frequency Integrated Circuit，RFIC)以及电源管理集成电路(Power Management Integrated Circuit，PMIC)集成在一个模块内。在实际应用中，将该模块置入终端设备内部，会占据已有天线的空间，导致终端设备的天线性能下降。
发明内容
本公开实施例提供一种终端设备，解决相关技术中天线模块占据终端设备内部较多空间，降低终端设备的天线性能的问题。
依据本公开实施例提供一种终端设备，包括：屏幕和主板，其中，所述 屏幕的边缘具有净空区，所述终端设备还包括：第一射频集成电路RFIC和至少一个天线单元；所述天线单元的至少部分设置在所述净空区内；所述天线单元与所述第一RFIC连接；所述第一RFIC设置在所述屏幕的第一柔性电路板FPC上，所述第一FPC上还设置有屏幕集成电路IC和触控IC，所述第一FPC通过第一BTB连接器与所述主板连接。
本公开实施例中，将天线单元的至少部分设置在终端屏幕的净空区内，节省天线单元所需空间，避免占据已有天线的空间，提高终端设备的天线性能。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对本公开实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为相关技术中AIP模块的结构示意图；
图2a为本公开实施例提供的终端设备的结构示意图之一；
图2b为本公开实施例提供的净空区在屏幕中的位置示意图之一；
图2c为本公开实施例提供的净空区在屏幕中的位置示意图之二；
图3为图2中区域A的放大示意图；
图4为图3中区域B的放大示意图；
图5为本公开实施例提供的毫米波天线与信号反射区的结构示意图；
图6本公开实施例提供的终端设备的结构示意图之二。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
本公开实施例中，终端设备可以为手机、平板电脑、笔记本电脑、超级 移动个人计算机(Ultra-Mobile Personal Computer，UMPC)、上网本或者个人数字助理(Personal Digital Assistant，PDA)等，本公开实施例对终端设备的具体类型不做限定。
参见图2a，本公开实施例提供一种终端设备20，包括：屏幕21和主板(图中未示出)，该屏幕21的边缘具有净空区231，该终端设备20还包括：第一RFIC 24和至少一个天线单元25；天线单元25的至少部分设置在净空区231内；天线单元25与第一RFIC 24连接。
上述天线单元25可以是毫米波天线单元，以下均以天线单元25为毫米波天线单元为例进行描述。
继续参见图2a，第一RFIC 24设置在屏幕21的第一柔性电路板(Flexible Printed Circuit，FPC)22上，同时该第一FPC 22用于承载屏幕集成电路(Integrated Circuit，IC)221和触控IC 222，FPC通过第一板对板(Board To Board，BTB)连接器223与主板连接。
图2a示出的净空区231位于该屏幕21的底端区域的场景，可以理解的是该第一端也可以屏幕的其他位置，如图2b所示，净空区231可以位置屏幕21的顶部区域2101、屏幕21的侧边区域2102或者屏幕21的拐角区域2103，本公开实施例对净空区231的位置不做具体限定。
上述第一FPC 22为终端设备20中已有的FPC，该第一FPC 22用于屏幕21与主板之间的信号传输。
图2仅示出了毫米波天线单元25的数量为4个的应用，该毫米波天线单元25的数量也可以为其他数量，本领域技术人员能够根据实际产品需求调整该毫米波天线单元25的数量。
在本公开实施例中，将第一RFIC 24设置在第一FPC 22上，通过终端设备20已有的第一FPC 22以及第一BTB连接器223实现第一RFIC 24与主板之间的连接，毫米波天线单元25与第一RFIC 24连接。
本公开实施例中，将毫米波天线单元的至少部分设置在终端屏幕的净空区内，并将与毫米波天线单元连接的RFIC设置在终端设备相关技术中的FPC上，共用终端屏幕相关技术中的FPC与BTB连接器，在实现毫米波天线单元与主板之间的信号传输的同时，节省毫米波天线单元所需空间，避免占据 已有天线的空间，提高终端设备的天线性能。
上述净空区231为屏幕21的玻璃基板上的预留区域，参见图2c，屏幕21包括：盖板21a、触控层21b和玻璃基板21c，在屏幕21的加工过程中，玻璃基板21c的面积会稍大于触控层21b，进而在玻璃基板21c的边缘形成净空区231。盖板21a可以是玻璃盖板，也可以是塑胶盖板。
净空区231中没有任何金属成分的区域，仅有玻璃或者塑胶介质，选取该没有金属成分的区域设置至少部分毫米波天线单元25可以避免对毫米波天线的通信产生影响。
参见图3和图4，其中图3为图2中区域A的放大示意图，图4为图3中区域B的方法示意图。
毫米波天线单元25包括：毫米波天线251、毫米波信号源252和馈电结构253；
其中，毫米波天线251设置在净空区231内。毫米波天线用于发射和接收毫米波，由于毫米波波长短，毫米波天线的尺寸可以做的很小，而目前主流的全面屏终端设备中屏幕的净空区宽度通常在1毫米左右，因此可以将毫米波天线251设置在净空区231内，具体设置在净空区231内的玻璃基板上。
需要说明的是，由于玻璃材质的介电常数较高，因此可以进一步缩小毫米波天线的尺寸。
毫米波信号源252设置在第一RFIC 24内，由第一RFIC 24控制毫米波信号源252，进而控制毫米波天线251发射毫米波信号；
毫米波天线251通过馈电结构233与毫米波信号源252连接。
可以理解的是，为了清楚显示毫米波天线单元25的结构组成，将毫米波天线单元25的各组成部分均在图4中显示，在实际产品中，毫米波信号源252设置在第一RFIC 24内，而不是在图3中的区域B内。
进一步地，该馈电结构253设置在第一FPC 22上。馈电结构253为在第一FPC 22上设计的传输线，通过该第一FPC 22上的传输线将毫米波天线251与毫米波信号源252连接。
继续参见图4，毫米波天线251包括第一辐射体2511和第二辐射体2512，第一辐射体2511通过馈电结构253与毫米波信号源252连接，第二辐射体 2512接地。
可选地，毫米波天线251为偶极子天线，即第一辐射体2511和第二辐射体2512对称设置。
需要说明的是，图4示出了第一辐射体2511和第二辐射体2512的形状为椭圆形的场景，该第一辐射体2511和第二辐射体2512也可以为其他形状，本领域技术人员可以根据实际产品需求对第一辐射体2511和第二辐射体2512的形状进行调整。
继续参见图4，第二辐射体2512是由屏幕的氧化铟锡(Indium tin oxide，ITO)线路中的部分地线211延伸至净空区231内形成。
上述ITO线路指的是屏幕中触控层的ITO线路，地线211保护触摸屏静电所用的ITO走线。这样，由ITO线路中的部分地线211充当第二辐射体2512，无需再设置馈地线，减少了毫米波天线251的馈线数量。此外，由于ITO材料具有透光性，第二辐射体2512也具有透光性，不会影响到屏幕的正常显示。
进一步地，参见图5，第一辐射体2511延伸至屏幕与FPC的链接区域26，与馈电结构连接。
上述链接区域26也可称为bonding区域，该区域为屏幕与FPC的接合区域，例如采用热压工艺将屏幕与FPC连接时，该bonding区域为热压位。
第一辐射体2511经由bonding区与屏幕的ITO地线设计在不同层，即第一辐射体2511和地线不导通。
进一步地，第一辐射体2511为ITO辐射体，采用ITO走线工艺制作第一辐射体2511，使第一辐射体2511具有透光性，避免影响屏幕的正常显示。
继续参见图5，终端设备的壳体包括信号反射区201，毫米波天线251发出的信号经信号反射区201反射后，信号的方向与屏幕的朝向相同。
上述信号反射区201可以通过在终端设备壳体中设置部分金属区域实现，利用金属面对信号的反射作用，使毫米波天线251的最大辐射方向朝与屏幕的朝向相同，从而提高天线增益，提升无线通信性能。
可选地，终端设备的壳体包括前壳或中框，该信号反射区域201位于所述前壳或所述中框，通过前壳或中框充当毫米波天线251的反射器。
进一步地，信号反射区201与毫米波天线251之间具有间隔，避免天线 短接。
参见图6，本公开实施例提供另一种终端设备30，该终端设备30与图2中终端设备20的区别在于：该终端设备30还包括第二FPC 31和第二RFIC 32，第一FPC 22设置在屏幕21的长度方向的第一端，第一FPC 22上承载屏幕IC221和触控IC 222，第二FPC 31设置在屏幕21长度方向的第二端，第二FPC 31上设置第二RFIC 32，该第二FPC 31通过第二BTB连接器33与主板连接；该第二端具有净空区232，在第一端和第二端均设置毫米波天线单元25，位于第一端的毫米波天线单元25与第一RFIC连接，位于第二端的毫米波天线单元25与第二RFIC 32连接。
在本公开实施例中，在屏幕21的第二端也设置毫米波天线单元25，并相应增加第二FPC 31、第二RFIC 32和第二BTB连接器33，各部件之间的连接方式与结构可以参照图2中终端设备20相应部件的描述，在此不再赘述。
这样，在使用终端设备30时，若第一端的毫米波天线被遮挡，终端设备30可以自动切换使用第二端的毫米波天线，提升毫米波天线的空间覆盖范围，例如提高累积分布函数(Cumulative Distribution Function)指标。
上述自动切换毫米波天线可以通过相关技术中的天线切换方法实现，本公开实施例对此不做具体限定。
本公开实施例中，在终端屏幕的第一端和第二端均设置毫米波天线单元，将毫米波天线单元的至少部分设置在终端屏幕的净空区内，并将与毫米波天线单元连接的RFIC设置在终端设备的FPC上，共用终端屏幕的FPC与BTB连接器，在实现毫米波天线单元与主板之间的信号传输的同时，节省毫米波天线单元所需空间，避免占据已有天线的空间，提高终端设备的天线性能。
进一步地，当其中一端毫米波天线工作受到影响时，可以自动切换使用另一端，提升毫米波天线的空间覆盖范围，增强终端设备的天线性能。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何在本申请揭露的技术范围内的变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (11)

  1. 一种终端设备，包括：屏幕和主板，其中，所述屏幕的边缘具有净空区，所述终端设备还包括：第一射频集成电路RFIC和至少一个天线单元；
    所述天线单元的至少部分设置在所述净空区内；
    所述天线单元与所述第一RFIC连接；
    所述第一RFIC设置在所述屏幕的第一柔性电路板FPC上，所述第一FPC上还设置有屏幕集成电路IC和触控IC，所述第一FPC通过第一BTB连接器与所述主板连接。
  2. 根据权利要求1所述的终端设备，其中，所述天线单元为毫米波天线单元。
  3. 根据权利要求2所述的终端设备，其中，
    所述净空区为所述屏幕的预留区域；
    所述毫米波天线单元包括：毫米波天线和馈电结构；
    所述第一RFIC内设置毫米波信号源；
    所述毫米波天线设置在所述净空区内；
    所述毫米波天线通过所述馈电结构与所述毫米波信号源连接。
  4. 根据权利要求3所述的终端设备，其中，所述馈电结构设置在所述第一FPC上。
  5. 根据权利要求4所述的终端设备，其中，所述毫米波天线包括：第一辐射体和第二辐射体，所述第一辐射体通过所述馈电结构与所述毫米波信号源连接，所述第二辐射体接地。
  6. 根据权利要求5所述的终端设备，其中，所述第一辐射体和所述第二辐射体对称设置。
  7. 根据权利要求5所述的终端设备，其中，所述第一辐射体为氧化铟锡ITO辐射体。
  8. 根据权利要求5所述的终端设备，其中，所述第二辐射体由所述屏幕的ITO线路中的部分地线延伸至所述净空区内形成。
  9. 根据权利要求3所述的终端设备，其中，所述终端设备的壳体包括： 信号反射区，所述毫米波天线发出的信号经所述信号反射区反射后，所述反射后的信号方向与所述屏幕的朝向相同。
  10. 根据权利要求9所述的终端设备，其中，所述壳体包括：前壳或中框，所述信号反射区位于所述前壳或所述中框。
  11. 根据权利要求2所述的终端设备，其中，所述终端设备还包括第二FPC和第二RFIC，所述第一FPC设置在所述屏幕长度方向的第一端，所述第二FPC设置在所述屏幕长度方向的第二端，所述第二FPC上设置所述第二RFIC，所述第二FPC通过第二BTB连接器与所述主板连接，在所述第一端和所述第二端均设置所述毫米波天线单元，位于所述第一端的毫米波天线单元与所述第一RFIC连接，位于所述第二端的毫米波天线单元与所述第二RFIC连接。
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