WO2021020587A1 - 円環形状のガラス板の製造方法、磁気ディスク用ガラス基板の製造方法、磁気ディスクの製造方法、円環形状のガラス板、磁気ディスク用ガラス基板、及び磁気ディスク - Google Patents

円環形状のガラス板の製造方法、磁気ディスク用ガラス基板の製造方法、磁気ディスクの製造方法、円環形状のガラス板、磁気ディスク用ガラス基板、及び磁気ディスク Download PDF

Info

Publication number
WO2021020587A1
WO2021020587A1 PCT/JP2020/029591 JP2020029591W WO2021020587A1 WO 2021020587 A1 WO2021020587 A1 WO 2021020587A1 JP 2020029591 W JP2020029591 W JP 2020029591W WO 2021020587 A1 WO2021020587 A1 WO 2021020587A1
Authority
WO
WIPO (PCT)
Prior art keywords
peripheral end
face
inner peripheral
glass plate
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/029591
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
修平 東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoya Corp
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Priority to CN202080053261.3A priority Critical patent/CN114175156B/zh
Priority to US17/631,440 priority patent/US11884582B2/en
Priority to JP2021535474A priority patent/JP7411660B2/ja
Priority to MYPI2022000478A priority patent/MY209913A/en
Publication of WO2021020587A1 publication Critical patent/WO2021020587A1/ja
Anticipated expiration legal-status Critical
Priority to US18/537,768 priority patent/US20240109807A1/en
Ceased legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/241—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material
    • G11B7/252—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers
    • G11B7/253—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers of substrates
    • G11B7/2531—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers of substrates comprising glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
    • C03B29/02—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a discontinuous way
    • C03B29/025—Glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3576—Diminishing rugosity, e.g. by grinding, polishing or smoothing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/005—Other surface treatment of glass not in the form of fibres or filaments by irradiation by atoms
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
    • C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/62—Record carriers characterised by the selection of the material
    • G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
    • G11B5/739—Magnetic recording media substrates
    • G11B5/73911—Inorganic substrates
    • G11B5/73921—Glass or ceramic substrates
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/54—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/005—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents using brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B24B7/242—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam

Definitions

  • the present invention includes a method for manufacturing a ring-shaped glass plate for manufacturing a ring-shaped glass plate before it becomes a glass substrate for a magnetic disk using laser light, and a method for manufacturing the glass plate for a magnetic disk.
  • the present invention relates to a method for manufacturing a substrate, a method for manufacturing a magnetic disk including the method for manufacturing a glass substrate for a magnetic disk, a ring-shaped glass plate, a glass substrate for a magnetic disk, and a magnetic disk made from the glass substrate for a magnetic disk.
  • hard disk devices are used for data recording in personal computers, notebook personal computers, DVD (Digital Versatile Disc) recording devices, cloud computing data centers, and the like.
  • a magnetic disk in which a magnetic layer is provided on a glass substrate for a magnetic disk, which is a ring-shaped non-magnetic material, is used.
  • the magnetic disk is incorporated into, for example, a DFH (Disk Flying Height) type magnetic head having a levitation distance of about 5 nm.
  • DFH Disk Flying Height
  • the end face of the ring-shaped glass plate which is the base of the glass substrate for the magnetic disk, which is the final product, has fine particles attached to the main surface to improve the performance of the magnetic disk. It is preferable to smooth the surface of the end face where particles are likely to be generated so as not to adversely affect the surface.
  • the annular shape is suitable for gripping the jig that grips the outer peripheral end surface of the glass substrate when forming the magnetic film on the main surface of the glass substrate. It is preferable to align the end faces of the glass plates with the target shape.
  • the glass substrate for a magnetic disk is obtained by chamfering the end face of the ring-shaped glass base plate separated from the glass plate, polishing the end face, grinding and polishing the main surface, and cleaning the glass base plate.
  • a technique has been proposed in which a glass base plate is taken out from the glass plate by using a laser beam instead of scribing and cutting with a cutter.
  • the laser beam focusing of the pulsed laser beam is directed into the glass plate at a predetermined incident angle to generate a defect line (perforation) along the laser beam focusing in the glass plate.
  • the plate and the laser beam are relatively translated and repeated to form multiple defect lines (perforations).
  • the defect lines (perforations) are separated by 2 ⁇ m.
  • a method for processing the end face of the annular glass base plate taken out from the glass plate to make the end face of the glass plate a target shape a method of chamfering the edge of the glass base plate using a laser beam. It has been known. Specifically, an ultrashort pulse laser is used to cut the edges into a desired chamfered shape, followed by processing with the ultrashort pulse laser, followed by irradiation with a CO 2 laser.
  • the end face of the obtained ring-shaped glass base plate is a part of the side surface of the cross-sectional shape of the hole forming the defect line. Remains. Therefore, in order to obtain a glass substrate for a magnetic disk having a small surface roughness not only on the main surface but also on the end face from the ring-shaped glass base plate, the end face must be polished.
  • the conventional end face polishing using a polishing brush is not preferable in terms of not only production efficiency but also production cost because the polishing time is long. Even when the end face is polished, the end face polishing using a laser beam is preferable so that the polishing time can be shortened as compared with the conventional one, or the end face polishing with a polishing brush does not need to be performed at all. In this method, polishing is performed by melting the glass on the surface of the end face with a laser beam to reduce the roughness.
  • the ring-shaped glass plate When performing, the ring-shaped glass plate cannot be placed horizontally and stably, processing unevenness occurs on the main surface, and the ring-shaped glass plate is held and held when performing double-sided grinding or double-sided polishing. Problems such as the ring-shaped glass plate popping out from the carrier may occur.
  • a ridge is likely to occur on the inner peripheral side of the main surface of the ring-shaped glass plate ( The inner peripheral end face tends to have a spherical shape that rises with respect to the main surface).
  • the present invention realizes end face polishing by melting the inner peripheral end face and the outer peripheral end face of the annular glass base plate by irradiation with a laser beam, and has a raised shape on the inner peripheral end face (inner peripheral side of the main surface). It is an object of the present invention to provide a method for manufacturing an annular glass plate, a method for manufacturing a glass substrate for a magnetic disk, and a method for manufacturing a magnetic disk, which include a process that does not cause a problem. Furthermore, the present invention provides a ring-shaped glass plate, a glass substrate for a magnetic disk, and a magnetic disk.
  • One aspect of the present invention is a method for manufacturing a ring-shaped glass plate having an outer peripheral end face and an inner peripheral end face and having a plate thickness of 0.6 mm or less.
  • the manufacturing method is By irradiating the outer peripheral end face and the inner peripheral end face of the annular glass base plate with laser light, the outer peripheral end face and the inner peripheral end face are melted to form a melting surface, and the outer peripheral end face and the inner peripheral end face are formed.
  • the surface roughness of the melted surface on the peripheral end surface is 0.1 ⁇ m or less in arithmetic mean roughness Ra, and the surface roughness of the melted surface on the inner peripheral end face is that of the melted surface on the outer peripheral end face.
  • a process of irradiating the laser beam so as to have a surface roughness larger than the surface roughness to produce an annular glass plate is provided.
  • the power density of the laser beam irradiating the inner peripheral end face is preferably 80% or less of the power density of the laser light irradiating the outer peripheral end face.
  • the inner peripheral end surface of the annular glass base plate so that the inner peripheral end surface and the outer peripheral end surface of the annular glass plate do not rise with respect to the main surfaces on both sides of the annular glass plate. And it is preferable to irradiate the outer peripheral end face with the laser beam.
  • the method for manufacturing a ring-shaped glass plate By irradiating the glass plate with a cut-out laser beam different from the laser beam, defects are intermittently formed along substantially concentric circles, and a linear portion consisting of an inner peripheral circle portion and an outer peripheral circular portion is formed so as to connect the defects.
  • a circular separation boundary line which is a defect, is formed on the main surface of the glass plate.
  • the outer portion of the inner peripheral circular portion of the glass plate is thermally expanded more than the inner portion of the inner peripheral circular portion, and the outer side of the inner peripheral circular portion is expanded. Separate the portion from the inner portion of the inner circular portion, It is preferable to remove the outer portion of the outer peripheral circle portion and the inner portion of the inner peripheral circular portion from the glass plate to obtain the ring-shaped glass base plate.
  • Another aspect of the present invention is also a method for manufacturing a ring-shaped glass plate having an outer peripheral end face and an inner peripheral end face and having a plate thickness of 0.6 mm or less.
  • the manufacturing method is By irradiating the outer peripheral end face and the inner peripheral end face of the annular glass base plate with laser light, the outer peripheral end face and the inner peripheral end face are melted to form a melting surface, and the outer peripheral end face and the inner peripheral end face are formed.
  • the surface roughness of the melted surface on the peripheral end surface is 0.1 ⁇ m or less in arithmetic average roughness Ra, and the power density of the laser light irradiating the inner peripheral end surface irradiates the outer peripheral end surface. It is 80% or less of the power density of the laser light.
  • Another aspect of the present invention is to manufacture a glass substrate for a magnetic disk by polishing at least the main surface of the ring-shaped glass plate manufactured by the method for manufacturing the ring-shaped glass plate. This is a method for manufacturing a glass substrate for a magnetic disk.
  • Another aspect of the present invention is a method for manufacturing a magnetic disk, characterized in that a magnetic film is formed on the main surface of the glass substrate for a magnetic disk manufactured by the method for manufacturing a glass substrate for a magnetic disk.
  • Yet another aspect of the present invention is a ring-shaped glass plate having an outer peripheral end face and an inner peripheral end face and having a plate thickness of 0.6 mm or less.
  • the outer peripheral end surface and the inner peripheral end surface of the ring-shaped glass plate are melting surfaces.
  • the surface roughness of the melting surface on the outer peripheral end surface and the inner peripheral end surface is 0.1 ⁇ m or less in arithmetic average roughness Ra, and the surface roughness of the melting surface on the inner peripheral end surface is the outer circumference. Greater than the surface roughness of the melted surface on the end face,
  • the melting surfaces on the inner peripheral end surface and the outer peripheral end surface do not rise with respect to the main surfaces on both sides of the annular glass plate.
  • Yet another aspect of the present invention is a glass substrate for a magnetic disk having an outer peripheral end face and an inner peripheral end face and having a plate thickness of 0.6 mm or less.
  • the outer peripheral end surface and the inner peripheral end surface of the glass substrate for a magnetic disk are melting surfaces.
  • the surface roughness of the melting surface on the outer peripheral end surface and the inner peripheral end surface is 0.1 ⁇ m or less in arithmetic average roughness Ra, and the surface roughness of the melting surface on the inner peripheral end surface is the outer circumference. Greater than the surface roughness of the melted surface on the end face,
  • the melting surfaces on the inner peripheral end surface and the outer peripheral end surface do not rise with respect to the main surfaces on both sides of the glass substrate for a magnetic disk.
  • the surface roughness of the main surface is 0.3 nm or less in arithmetic average roughness Ra.
  • Yet another aspect of the present invention is a magnetic disk characterized by having a magnetic film on the main surface of the glass substrate for a magnetic disk.
  • the end face polishing time is significantly reduced as compared with the conventional method, and the end face polishing is realized.
  • An annular glass plate having no raised shape on the peripheral end surface (inner peripheral side of the main surface) can be produced.
  • FIG. 1A It is a perspective view of an example of the glass substrate for a magnetic disk manufactured in this embodiment. It is a figure which shows an example of the cross section of the outer peripheral end face of the glass substrate for a magnetic disk shown in FIG. 1A. It is a figure explaining an example of the method of cutting out a glass base plate from a glass plate of this embodiment. It is a figure explaining an example of the method of cutting out a glass base plate from a glass plate of this embodiment. It is a figure explaining an example of the method of cutting out a glass base plate from a glass plate of this embodiment. It is a figure which concretely explains the heating of the glass plate used in the manufacturing method of the glass plate of one Embodiment.
  • the ring-shaped glass plate manufacturing method, the magnetic disk glass substrate manufacturing method, the magnetic disk manufacturing method, the ring-shaped glass plate, the magnetic disk glass substrate, and the magnetic disk of the present embodiment will be described.
  • the terms glass plate, ring-shaped glass base plate, ring-shaped glass plate, and glass substrate for magnetic disk are used.
  • the ring-shaped glass base plate is a plate taken out from the glass plate in a ring shape.
  • the ring-shaped glass plate is obtained by irradiating the inner peripheral end face and the outer peripheral end face of the ring-shaped glass base plate with laser light to polish the end faces.
  • a glass substrate for a magnetic disk is a glass substrate for a magnetic disk in which the main surface of the ring-shaped glass plate is ground, polished, and further cleaned, and if necessary, chemically strengthened.
  • the thickness of the ring-shaped glass plate manufactured by the method for manufacturing the ring-shaped glass plate of the present embodiment is 0.6 mm or less.
  • the main surface is not ground or polished, so the thickness of the glass plate and the ring-shaped glass base plate is also 0.6 mm. It is as follows.
  • the thinner the thickness of the ring-shaped glass plate the more the number of magnetic disks mounted in the hard disk drive device can be increased. Is preferable.
  • a ring-shaped glass base plate is taken out from a glass plate having a plate thickness of 0.6 mm or less along the concentric inner and outer circles.
  • the inner peripheral end face and the outer peripheral end face of the ring-shaped glass base plate are polished by irradiating a laser beam. By irradiating this laser beam, chamfered surfaces are formed on the outer peripheral end face and the inner peripheral end face.
  • a glass substrate for a magnetic disk is produced by grinding and polishing the main surface of the ring-shaped glass plate obtained by irradiation with a laser beam.
  • the outer peripheral end face and the inner peripheral end face are treated by irradiating the outer peripheral end face and the inner peripheral end face of the annular glass base plate with laser light, respectively.
  • the melted surface is formed by melting, and the surface roughness of the melted surface on the outer peripheral end face and the inner peripheral end face is 0.1 ⁇ m or less in arithmetic average roughness Ra, and the surface of the melted surface on the inner peripheral end face.
  • a ring-shaped glass plate is formed by irradiating a laser beam so that the roughness is larger than the surface roughness of the melting surface on the outer peripheral end surface.
  • the melting surface is a surface in which the glass near the surface of the end surface of the ring-shaped glass base plate is locally heated to a temperature higher than the glass transition point to be softened and cooled from the molten state. As a result, most of the fine irregularities that existed before melting disappeared on the surface.
  • the melting surface is formed on the irradiation surface of the laser beam. By irradiating the laser beam, the surface roughness of the melted surfaces on the inner peripheral end surface and the outer peripheral end surface becomes 0.1 ⁇ m or less in arithmetic average roughness Ra.
  • the processing time for additional end face polishing other than laser polishing is reduced to zero or significantly reduced compared to the conventional method, and a circle that does not have a raised shape on the inner peripheral end surface (inner peripheral side of the main surface).
  • a ring-shaped glass plate can be produced.
  • the inner peripheral end face is more likely to retain heat than the outer peripheral end face, and as a result, the spherical shape is more likely to proceed. Is assumed.
  • the surface roughness on the inner peripheral end face becomes larger than the surface roughness on the outer peripheral end face. Adjust to. As a result, it is possible to suppress the shape of the inner peripheral end surface from becoming a spherical shape while polishing the surfaces of the inner peripheral end surface and the outer peripheral end surface to a mirror surface having an arithmetic mean roughness Ra of 0.1 ⁇ m or less.
  • Each end face is a mirror surface with an arithmetic mean Ra of 0.1 ⁇ m or less.
  • the arithmetic mean roughness Ra of the melt surface on the inner peripheral end face is 0.01 to 0.1 ⁇ m, and the melt surface on the outer peripheral end face.
  • the arithmetic mean roughness Ra is preferably 0.001 to 0.05 ⁇ m.
  • a separation process for taking out the ring-shaped glass base plate from the glass plate is performed using a laser light different from the laser light used for the laser polishing process.
  • the laser light for extracting the ring-shaped glass base plate from the glass plate is referred to as cutout laser light
  • the laser light used in the laser polishing process is referred to as end face polishing laser light.
  • the separation process of the present embodiment is performed using laser light, but this separation process is an example and is not limited to the separation process using laser light. For example, it is also possible to perform cutting using a conventionally used scriber.
  • a circular separation boundary line which is a linear defect composed of a portion and an outer peripheral circular portion, is formed on the main surface of the glass plate.
  • the deviation between the center positions of the inner and outer circles is, for example, 10 ⁇ m or less.
  • the inside of the glass plate is moved by moving the cut-out laser light relative to the glass plate so that the focal position of the cut-out laser light draws a circle when viewed from the main surface of the glass plate.
  • Two circular crack start portions which are an inner peripheral circle portion and an outer peripheral circular portion, are formed.
  • the separation boundary line is formed by advancing the crack from each position of the circular crack start portion.
  • the ring-shaped glass base plate is separated from the glass plate along this separation boundary line and taken out.
  • the crack start portion is, for example, a portion where scratches, melting, deterioration, or deterioration have occurred due to irradiation with a cut-out laser beam.
  • the crack is propagated from the start of the circular crack to form a circular separation boundary line, but even if the circular separation boundary line is formed on the glass plate, the glass base plate is physically separated from the glass plate. In many cases, it cannot be taken out. Therefore, the outer portion of the glass plate is heated with respect to the circular separation boundary line to separate the glass base plate and take it out from the glass plate.
  • the two circular separation boundary lines which are the inner circumference circle portion and the outer circumference circle portion, are formed concentrically. Therefore, by heating the outer portion of the outer circumference circle portion, the outer portion of the outer circumference circle portion is formed on the outer circumference.
  • the inner part of the outer circular part and the outer part of the outer circle are separated by thermal expansion relatively larger than the inner part of the circle, and the outer part is removed. Further, by heating the outer portion of the inner peripheral circle portion, the outer portion of the inner peripheral circular portion is thermally expanded relatively larger than the inner portion of the inner peripheral circular portion, and the outer portion and the inner peripheral portion of the inner peripheral circular portion are expanded. Separate the inner part of the circle and remove the inner part. In this way, it is possible to obtain an annular glass base plate having a circular hole, which is an outer portion of the inner peripheral circular portion and corresponds to an inner portion of the outer peripheral circular portion.
  • either process may precede.
  • a separation boundary line is formed by using a laser beam different from the cut-out laser light.
  • a line may be formed.
  • Defects include scratches formed on glass, melted parts, deteriorated or deteriorated parts (hereinafter referred to as scratches, etc.), and holes with a small cross section (through holes, non-through holes) that are sharply dented from the main surface of the glass plate. Includes), and includes cracks and the like. Such defects are the core of progressive crack formation. Intermittent formation of defects means that multiple holes (including through holes and non-through holes) with a small hole cross section and scratches that are the core of crack formation are formed on the glass plate at intervals. Including opening in the vertical direction. Further, forming the separation boundary line includes forming a linearly extending defect, for example, a crack, which linearly connects the intermittently formed defects.
  • the cracks include not only actual cracks in which physical gaps are formed in the glass material, but also latent cracks in which physical gaps are not generated but form a boundary surface. Separating the glass base plate from the glass base plate removes the outer part surrounding the glass base plate so that the separated edge becomes a circular outer circumference, and forms a circular hole in the center of the glass base plate. Includes removing the inner part surrounded by the board.
  • the arithmetic average roughness Ra is 0.1 ⁇ m or less.
  • a chamfered surface is also formed at the boundary between the end surface and the main surface.
  • the melting surface formed by the irradiation of the end face polishing laser light In terms of surface roughness, the surface roughness of the inner peripheral end surface is dissolved so as to be larger than the surface roughness of the outer peripheral end surface. After that, at least one of grinding and polishing of the main surface of the ring-shaped glass plate is performed.
  • the surface roughness of the melting surface on the inner peripheral end face and the outer peripheral end face by irradiation with the end face polishing laser light is 0.1 ⁇ m or less in arithmetic average roughness Ra, and the roundness is 15 ⁇ m or less. It is preferable to form a plate because additional end face polishing other than laser polishing can be omitted, or the polishing time of the additional end face polishing can be shortened.
  • the surface roughness of the melted surfaces on the inner peripheral end surface and the outer peripheral end surface is more preferably 0.05 ⁇ m or less.
  • a plate-shaped probe thicker than the thickness of the ring-shaped glass plate is arranged so as to face the end face in the direction perpendicular to the main surface of the ring-shaped glass plate.
  • the contour line is obtained by rotating the ring-shaped glass plate in the circumferential direction, and the difference in radius between the inscribed circle and the circumscribed circle of this contour line is calculated as the roundness of the ring-shaped glass plate.
  • a roundness / cylindrical shape measuring device can be used.
  • the arithmetic mean roughness Ra is a value based on JIS B0601: 2001.
  • the surface shape of the end face of the annular glass plate, which is used to obtain the arithmetic mean roughness Ra, is measured using a laser microscope in an evaluation region of 50 ⁇ m square under the following conditions.
  • Observation magnification 3000 times, measurement pitch in the height direction (Z axis): 0.01 ⁇ m, cutoff value ⁇ s: 0.25 ⁇ m, cutoff value ⁇ c: 80 ⁇ m.
  • the resolution in the height direction is preferably 1 nm or less.
  • the observation magnification is 3000 times, but the observation magnification is appropriately selected in the range of about 1000 to 3000 times depending on the size of the measurement surface.
  • the optical system of the laser light source may be adjusted so that the focal position of the cut-out laser light is located inside in the thickness direction of the glass plate. Light energy is concentrated at the focal position and locally heated to form a crack start portion inside the glass. After this, the crack is propagated from the crack start portion toward the main surface.
  • the fractured surface formed by the cracks has a small surface roughness. Further, the circle that becomes the locus of the focal position can realize high roundness by a moving mechanism or the like capable of accurately moving the cut-out laser beam to the glass plate.
  • the arithmetic average roughness Ra of the separation surface of the ring-shaped glass base plate separated from the glass plate may be large and the roundness may be low, but the end face polishing laser beam is applied from the normal direction of the separation surface.
  • the chamfered surface is formed by irradiating the end face polishing laser light, and at the same time, the separation surface is formed by irradiating the end face polishing laser light. The surface roughness can be reduced and the accuracy of roundness can be improved.
  • the surface roughness of the melted surface can be set to 0.1 ⁇ m or less in arithmetic average roughness Ra, and the roundness can be set to 15 ⁇ m or less.
  • the roundness can be 0.1 to 15 ⁇ m according to one embodiment.
  • the roundness is preferably 10 ⁇ m or less, more preferably 7 ⁇ m or less, and even more preferably 5 ⁇ m or less.
  • FIG. 1A is a perspective view of an example of a glass substrate for a magnetic disk manufactured in the present embodiment.
  • FIG. 1B is a diagram showing an example of a cross section of an outer peripheral end surface of the glass substrate for a magnetic disk shown in FIG. 1A.
  • the glass substrate for a magnetic disk (hereinafter referred to as a glass substrate) 1 shown in FIG. 1A is a ring-shaped thin glass substrate having a circular hole at the center.
  • the size of the glass substrate for a magnetic disk is not limited, but the glass substrate for a magnetic disk is, for example, the size of a glass substrate for a magnetic disk having a nominal diameter of 2.5 inches or 3.5 inches.
  • the outer diameter (nominal value) is 95 mm to 97 mm
  • the inner diameter (nominal value) is 25 mm.
  • the outer diameter (nominal value) is 65 mm to 67 mm
  • the inner diameter (nominal value) is 20 mm.
  • the thickness of the glass substrate for a magnetic disk is, for example, 0.20 mm to 0.6 mm, preferably 0.30 mm to 0.6 mm, and preferably 0.30 mm to 0.53 mm.
  • a magnetic layer is formed on the main surface of the glass substrate 1 to form a magnetic disk.
  • the glass substrate 1 also includes a pair of main surfaces 11p and 12p, side wall surfaces 11w formed on the outer peripheral end faces, chamfered surfaces 11c and 12c interposed between the side wall surfaces 11w and the main surfaces 11p and 12p, and inner peripheral end faces. It includes a side wall surface (not shown) formed in the same manner as the outer peripheral end surface, and a chamfered surface (not shown) interposed between the side wall surface 11w and the main surfaces 11p and 12p.
  • the glass substrate 1 has a circular hole in the center.
  • the side wall surface 11w includes the center position of the glass substrate 1 in the plate thickness direction.
  • the length C of the chamfered surface 11c shown in FIG. 1B is long, but may be shorter than the length C shown in FIG. 1B.
  • the chamfered surfaces 11c and 12c are curved surfaces having rounded edges and smoothly continuous from the main surfaces 11p and 12p to the side wall surfaces 11w.
  • the chamfered surfaces 11c and 12c may also be linear chamfered surfaces in their cross-sectional shape, instead of the curved chamfered surfaces as shown in FIG. 1B.
  • FIGS. 2A, 2B and 3B are diagrams illustrating a separation process of an embodiment in which a ring-shaped glass base plate is taken out from the glass plate 20.
  • the glass plate 20 is, for example, a glass plate having a plate thickness of 0.6 mm or less, which is produced by using a floating method or a down draw method.
  • the glass block may be a glass plate press-molded using a mold.
  • the plate thickness of the glass plate 20 is thicker than the target plate thickness when the final product is a glass substrate for a magnetic disk by the amount of grinding and polishing allowance, for example, about several tens of ⁇ m.
  • the laser light source 30 is a device that emits a laser beam L1 (cut-out laser beam), and for example, a YAG laser or a solid-state laser such as an ND: YAG laser is used. Therefore, the wavelength of the laser beam L1 is, for example, in the range of 1030 nm to 1070 nm.
  • the laser light L1 is a pulse laser, and in one embodiment, the pulse width of the laser light L1 is 10 to 12 seconds or less (1 pico second or less), which is an excessive amount of glass at the focal position F of the laser light L1. It is preferable because it can suppress deterioration. Further, the light energy of the laser beam L1 can be appropriately adjusted according to the pulse width and the repetition frequency of the pulse width.
  • the optical system of the laser light source 30 is adjusted so that the focal position F of the laser beam L1 is located inside the plate thickness in the plate thickness direction of the glass plate 20.
  • the light energy is concentrated at the focal position F and is locally heated, and a crack start portion (nucleus of crack formation) due to scratches, melting, deterioration or alteration is formed. Since the focal position F moves relative to the glass plate 20 in a circular motion when viewed from the surface of the glass plate 20, the crack start portion is formed along the arc line.
  • Cracks are generated by the formation of the crack start portion, and if necessary, by heating the glass plate 20 or irradiating another laser beam or the like, the crack C is formed from each position of the crack start portion as shown in FIG. Is generated inside the glass, and crack C is propagated toward the main surface. Further, the crack C propagates to the adjacent crack start position. This makes it possible to create a circular separation boundary line. In order to produce a ring-shaped glass base plate having a circular hole in the center from the glass plate, two separation boundary lines, an outer peripheral circle portion and an inner peripheral circular portion, are formed.
  • the form shown in FIG. 3 is an example, and the focal position F does not have to be located inside the plate thickness in the plate thickness direction.
  • the focal position F may be on the main surface of the glass plate 20.
  • the distance between the defects intermittently formed on the glass plate 20 and the adjacent defects is about several ⁇ m, for example, 1 to 10 ⁇ m. After the separation boundary line is formed, the glass base plate is separated and taken out from the glass plate 20 by utilizing the thermal expansion of the glass plate due to heating.
  • FIG. 4 is a diagram specifically illustrating heating of the glass plate 20, which is a material for producing a ring-shaped glass base plate used in the method for manufacturing a circular glass plate of one embodiment.
  • FIG. 4 describes an example in which the outer portion of the glass plate 20 is removed with respect to the separation boundary line of the outer circular portion of the circular shape.
  • FIG. 5 is a diagram illustrating two separation boundary lines formed on the glass plate 20 used in the method for manufacturing a circular glass plate of one embodiment.
  • the outer portion 44 is arranged in the heating space between the heaters 50 and 52 with respect to the separation boundary line 42 formed on the glass plate 20, and the inner portion 46 is heated. Place it outside the range of space. As a result, the outer portion 44 can be heated.
  • the thermal expansion amount of the outer portion 44 can be made larger than the thermal expansion amount of the inner portion 46.
  • the outer portion 44 thermally expands outward as shown in FIG. Therefore, a gap can be surely formed at the interface between the outer portion 44 and the inner portion 46. Therefore, the separation of the outer portion 44 and the inner portion 46 can be ensured.
  • the outer portion 44 of the separation boundary line 42a (FIG. 5) of the outer peripheral circle formed on the glass plate 20 is turned into the inner portion 46 of the outer circular portion.
  • the inner portion 46 of the outer circular portion and the outer portion 44 of the outer circular portion can be separated by relatively large thermal expansion, and the inner portion 46 of the outer circular portion can be taken out.
  • the inner peripheral circular portion of the glass plate 20 is heated by heating the outer portion 44 of the separation boundary line 42b (FIG. 5) of the inner peripheral circular portion.
  • the outer portion 44 of the inner circumference portion 44 is thermally expanded relatively larger than the inner portion 46 of the inner circumference circle portion to separate the inner portion 46 of the inner circumference circle portion and the outer portion 44 of the inner circumference circle portion.
  • the outer portion 44 of the can be taken out.
  • the ring-shaped glass base plate 28 see FIG. 6) can be easily taken out from the glass plate 20 without applying a large force to the glass plate 20.
  • the focal position F shown in FIG. 2B is preferably in the range of one-third to two-thirds of the thickness of the glass plate 20 from the main surface of the glass plate 20. ..
  • the focal position F in this range, it is possible to form a separation surface whose roundness and surface roughness are close to the target values, so that it may not be necessary to perform additional end face polishing other than laser polishing. , Production efficiency can be improved.
  • the focal position F is within a range of less than one-third of the plate thickness of the glass plate 20 from the main surface of the glass plate 20.
  • the main surface of the glass plate 20 is more likely to form a residue than the separation surface and the surface roughness is lowered, but the vicinity of the focal position F is a portion removed by the chamfering treatment described later. Therefore, the focal position F is preferably within a range of less than one-third of the plate thickness of the glass plate 20 from the main surface of the glass plate 20.
  • the laser beam L1 is preferably a pulsed laser beam having a pulse width of 10 to 12 seconds or less.
  • the pulse width exceeds 10 to 12 seconds, the light energy is concentrated at the focal position F and the glass in the vicinity of the focal position F is denatured, which tends to reduce the surface roughness.
  • the surface roughness of the inner peripheral end face and the outer peripheral end face) is preferably 1 ⁇ m or less in terms of arithmetic mean roughness Ra. If Ra is more than 1 ⁇ m, the roughness may not be sufficiently reduced by the subsequent laser polishing process.
  • Laser polishing is performed on the end faces (inner peripheral end face and outer peripheral end face) of the ring-shaped glass base plate 28 (see FIG. 6) thus separated from the glass plate 20. Specifically, a chamfered surface is formed while polishing the end face with a laser light L2 (end face polishing laser light) of a type different from the laser light L1. In this case, the end face is polished by irradiating the end face while moving the ring-shaped glass base plate 28 relative to the laser beam L2.
  • a laser light L2 end face polishing laser light
  • the surface roughness of the melted surfaces on the inner peripheral end surface and the outer peripheral end surface can be made 0.1 ⁇ m or less in arithmetic average roughness Ra, and a chamfered surface can be formed at the same time. it can.
  • FIG. 6 is a diagram illustrating an example of the end face polishing process performed in the present embodiment.
  • the separation surface is irradiated with the laser beam L2 from the normal direction of the separation surface, so that a part of the glass in the vicinity of the separation surface is heated and melted by the irradiation of the laser light L2.
  • a chamfered surface is formed on the separating surface. Therefore, the surface roughness of the separation surface can be reduced and the roundness can be increased by irradiating the laser beam L2.
  • the laser beam L2 is an end face polishing laser beam.
  • the laser light L2 is an extended laser light after the laser light L2 emitted from the laser light source is made into parallel light through an optical system including a collimator and the like, and then the end face polishing laser light L2 is focused through the focusing lens 34.
  • the separation surface is irradiated with L2.
  • the ring-shaped glass base plate 28 is rotated at a constant speed with the center position of the ring-shaped glass base plate 28 as the center of rotation. In this way, the laser beam L2 irradiates the entire circumference of the separation surface of the ring-shaped glass base plate 28 while moving the laser light L2 and the separation surface relative to each other in the circumferential direction of the glass base plate 28.
  • the separation surface of the laser beam L2 is irradiated from the normal direction of the separation surface to be irradiated, but in the normal direction, in addition to the perfect normal direction (tilt angle 0 degree), the normal direction
  • the direction of inclination within the range of the inclination angle of 0 degrees ⁇ 10 degrees is also included in the tolerance range. Further, it may be tilted outside the range of the tilt angle of 0 degrees ⁇ 10 degrees and within the range of the tilt angle of 0 degrees ⁇ 45 degrees with respect to the normal direction. In the example shown in FIG.
  • the chamfered surface is formed by using the outer peripheral end surface 28a of the glass base plate 28 as a separation surface, but further, the inner circumference forming a circular hole provided in the center of the annular shaped glass base plate 28.
  • a chamfered surface is formed on the separated surface using the end surface 28b as the separated surface. Since the glass in the vicinity of the separation surface irradiated with the laser beam L2 is in a softened and melted state, the separation surface becomes a melting surface having a chamfered surface. Further, the surface roughness of the melting surfaces on the outer peripheral end surface and the inner peripheral end surface of the annular glass plate obtained from the annular glass base plate 28 can be set to 0.1 ⁇ m or less in arithmetic average roughness Ra. it can.
  • the cross-sectional intensity distribution of the laser beam L2 irradiating the outer peripheral end surface 28a and the inner peripheral end surface 28b is in a single mode. That is, the cross-sectional intensity distribution of the laser beam L2 is a Gaussian distribution.
  • the width of the ring-shaped glass base plate 28 of the laser beam L2 on the irradiation position on the outer peripheral end surface 28a and the inner peripheral end surface 28b is set in the thickness direction.
  • the thickness of the annular glass base plate 28 is Th [mm]
  • the power density of the laser beam L2 is Pd [W / mm 2 ]
  • the irradiation of the laser beam L2 is W1. It is preferable to use the condition that> Th and Pd ⁇ Th is 0.8 to 3.5 [W / mm].
  • the light flux of the laser beam L2 is irradiated so as to protrude from both sides of the annular glass base plate 28 in the thickness direction. Further, by making the widths of the outer peripheral end surface 28a and the inner peripheral end surface 28b of the laser beam L2 equal to each other, chamfering can be performed evenly on both sides of the annular glass base plate 28 in the thickness direction.
  • the shapes of the two chamfered surfaces can be made equivalent.
  • the power density Pd is a value obtained by dividing the total power P [W] of the laser beam L2 by the area of the luminous flux in the portion irradiated with the laser beam L2.
  • the power density Pd is 4 ⁇ P / W1 / W2 / ⁇ [W / mm. 2 ] ( ⁇ is the circumference ratio).
  • the width W1 and the length W2 of the luminous flux can be set by adjusting the irradiation position of the ring-shaped glass base plate 28 of the laser beam L2 by using, for example, two cylindrical lenses. Further, the width W1 can be obtained from the beam profiler, and the length W2 can be obtained from the beam shape by the beam profiler and the diameter D of the glass plate.
  • the laser is also applied to the side ends of the outer peripheral end surface 28a and the inner peripheral end surface 28b on the main surface side (both sides in the thickness direction).
  • Light L2 can be sufficiently irradiated, and a chamfered surface can be formed by softening and melting a part of the ring-shaped glass base plate 28 by heat.
  • Th / W1 which is the ratio of the width W1 of the laser beam L2 to the thickness Th of the annular glass base plate 28, is made too large (that is, Th / W1 is too close to 1), the intensity of the laser beam L2 is increased.
  • Th / W1 is preferably in the range of 0.3 to 0.9.
  • the center position of the light beam in the width direction of the laser beam L2 is set to the annular shape glass base plate. It is preferable to align it with the center position of the ring-shaped glass base plate 28 in the thickness direction of 28.
  • the shapes of the outer peripheral end surface 28a and the inner peripheral end surface 28b of the ring-shaped glass base plate 28 can be aligned with the target shape without deviating from the target shape, and a chamfered surface is formed. be able to. Moreover, the surfaces of the outer peripheral end surface 28a and the inner peripheral end surface 28b can be smoothed.
  • the chamfered surface can be formed by limiting the range of the value of Pd ⁇ Th, but the value of Pd ⁇ Th and the value of the moving speed of the laser beam L2 with respect to the annular glass base plate 28
  • a chamfered surface is efficiently formed on the outer peripheral end surface 28a and the inner peripheral end surface 28b of the annular glass base plate 28.
  • the value of Pd ⁇ Th and the value of the moving speed in more detail, not only the chamfered surface but also the surface perpendicular to the main surface of the annular glass base plate 28, that is, the side wall surface 14t is formed. can do.
  • the shapes of the outer peripheral end surface 28a and the inner peripheral end surface 28b can be aligned with respect to the target shape without variation.
  • the surfaces of the outer peripheral end surface 28a and the inner peripheral end surface 28b can be smoothed.
  • the outer peripheral end surface 28a and the inner peripheral end surface 28b of the annular-shaped glass base plate 28 before the chamfered surface is formed with respect to the main surface at least in the central portion in the thickness direction of the annular-shaped glass base plate 28. It has a vertical surface.
  • the side wall surface 11w) can be formed.
  • the outer peripheral end surface 28a and the inner peripheral end surface 28b preferably include a surface (side wall surface 11w) having a length perpendicular to the main surface of 1/10 or more of the plate thickness Th, and a chamfered surface.
  • the length of the vertical surface (side wall surface 11w) is more preferably one-fifth or more of the plate thickness Th of the ring-shaped glass base plate 28. According to one embodiment, the vertical surface (side wall surface 11w shown in FIG.
  • the surface (side wall surface 11w) perpendicular to the main surface of the ring-shaped glass base plate 28 is a surface having an allowable range of 90 degrees ⁇ 2 degrees with respect to the main surface.
  • the target shapes of the outer peripheral end surface 28a and the inner peripheral end surface 28b are along the radial direction of the main surface 12 of the chamfered surface 11c (see FIG. 1B, including the chamfered surface having a curved curved surface shape).
  • the irradiation condition Pd ⁇ Th is set so that the length is C and the ratio of C / Th to the plate thickness Th is 0.1 to 0.7.
  • C / Th can be adjusted by adjusting Pd ⁇ Th within the range of 1.2 to 2.3 [W / mm]. More preferably, C / Th is 0.25 to 0.5.
  • the length along the thickness direction of the side wall surface 11w is T [mm]
  • the plate thickness of the length T is T.
  • T / Th which is a ratio to Th
  • T / Th is 0.1 to 0.8.
  • T / Th is less than 0.1, the side wall surface 11w is not sufficiently formed, and it becomes difficult to measure the outer diameter or inner diameter of the annular glass base plate 28 and the glass substrate 1 for a magnetic disk. There is a risk that variations will occur and production control will become difficult.
  • C / Th exceeds 0.8, the chamfered surfaces 11c and 12c are not sufficiently formed, and there is a possibility that an edge is easily applied in a film forming step of forming a magnetic film in a subsequent step.
  • the light beam at the irradiation position of the laser beam L2 is performed.
  • the length W2 in the circumferential direction (in FIG. 6, the length in the circumferential direction of the shaded area on the outer peripheral end surface 28a) is lengthened to some extent, and the temperatures of the outer peripheral end surface 28a and the inner peripheral end surface 28b by heating with the laser beam L2 are gradually increased.
  • the ratio of W2 / D to the diameter D of the base plate 28 is preferably 0.03 to 0.2.
  • the luminous flux of the laser beam L2 irradiating the outer peripheral end surface 28a and the inner peripheral end surface 28b preferably has an elliptical shape.
  • the diameter of the annular glass base plate 28 becomes the outer peripheral end surface 28a and the inner peripheral end surface 28b.
  • the shape of is rounded, it increases by several tens of ⁇ m to several hundreds of ⁇ m, and when the power density Pd is further increased, the rounded range is widened and the length in the thickness direction is widened to form a spherical shape, whereby the annular glass base plate 28 The diameter of the glass decreases. That is, the diameter of the ring-shaped glass base plate 28 after the formation of the chamfered surface changes depending on the magnitude of the power density Pd.
  • the outer diameter of the ring-shaped glass base plate 28 is smaller than the target diameter of the ring-shaped glass base plate 28. Further, the spherical shape tends to vary due to excessive heating of the outer peripheral end surface 28a and the inner peripheral end surface 28b, and the diameters of the ring-shaped glass base plates 28 cannot be made uniform, which is not preferable. Therefore, the diameter of the ring-shaped glass base plate 28 formed by the irradiation of the laser beam L2 has a power density that is larger than the diameter of the ring-shaped glass base plate 28 before the irradiation of the laser light L2. It is preferable that Pd is set.
  • the moving speed of the laser beam L2 moving along the outer peripheral end surface 28a and the inner peripheral end surface 28b is preferably 0.7 to 140 mm / sec.
  • the moving speed is a moving speed relative to the outer peripheral end surface 28a and the inner peripheral end surface 28b.
  • the chamfering process is completed when the laser beam L2 rotates once around the ring-shaped glass base plate 28 from the viewpoint of processing efficiency.
  • the moving speed exceeds 140 mm / sec, it becomes difficult to take the timing to complete the machining, and it may be difficult to match the start point and the end point of the machining.
  • the moving speed is lower than 0.7 mm / sec, the shapes of the outer peripheral end surface 28a and the inner peripheral end surface 28b change due to a slight change in Pd ⁇ Th, so that it is difficult to control the shapes of the outer peripheral end surface 28a and the inner peripheral end surface 28b.
  • the moving speed is preferably 0.7 to 140 mm / sec.
  • the moving speed is more preferably 20 to 140 mm / sec.
  • the moving speed is 20 mm / sec or more, the changes in the shapes of the outer peripheral end surface 28a and the inner peripheral end surface 28b with respect to the change in Pd ⁇ Th become relatively gentle, and the productivity is improved by shortening the processing time. Therefore, the moving speed is more preferably 20 to 100 mm / sec.
  • the temperature of the annular glass base plate 28 is higher than room temperature during the end face polishing treatment by the laser light L2. At this time, it is preferably Tg-50 ° C. (Tg is the glass transition temperature of the annular glass base plate 28) or less. Further, the temperature of the ring-shaped glass base plate 28 during the chamfering treatment is more preferably in the range of 150 to 400 ° C. If the temperature of the annular glass base plate 28 is less than 150 ° C., the chamfered surface may not be sufficiently formed.
  • the ring-shaped glass base plate 28 may be deformed and it may be difficult to irradiate the outer peripheral end surface 28a and the inner peripheral end surface 28b with the laser beam L2. is there.
  • the annular glass base plate 28 is heated before the chamfered surface is formed, and the ring is formed while the chamfered surface is formed.
  • the shaped glass base plate 28 can be heated.
  • the irradiation spot diameter of the heating laser beam is not particularly limited, but it is 3/4 or more of the diameter of the ring-shaped glass base plate 28.
  • the laser beam for heating may scan the main surface, or a plurality of laser beams for heating may be used.
  • the heating laser light for example, a CO 2 laser can be used. Since the light of the CO 2 laser is generally absorbed by the glass in an amount of 99% or more, the glass plate 20 can be heated efficiently.
  • temperature control becomes difficult due to the synergistic effect with the heating by the laser beam L2, so that the outer peripheral end surface 28a and the inner peripheral end surface The variation in the shape of 28b may become large.
  • the ring-shaped glass base plate 28 when heating the ring-shaped glass base plate 28, it is preferable to heat the ring-shaped glass base plate 28 prior to the chamfering treatment by irradiation with the laser beam L2. In this case, it is preferable to appropriately keep the ring-shaped glass base plate 28 warm at the time of chamfering.
  • the inner peripheral end surface 28b and the outer peripheral end surface 28a are formed.
  • the inner peripheral end surface 28b becomes a spherical shape, and a raised shape that is raised with respect to the main surface is likely to be formed on the inner peripheral side of the main surface.
  • FIG. 7A is a diagram showing an example of the shape of the inner peripheral end surface 28b of the annular glass plate produced by the method for manufacturing a glass plate of one embodiment without a raised shape.
  • FIG. 7B is a diagram showing an example of the shape of the inner peripheral end surface 28b having a raised shape of a ring-shaped glass plate manufactured by a conventional method for manufacturing a glass plate.
  • the spherical inner peripheral end surface 28b has a spherical shape and is raised from the main surface in the thickness direction. For this reason, when grinding or polishing the main surfaces on both sides after the end face polishing treatment, the annular glass plate cannot be arranged horizontally and stably, processing unevenness occurs on the main surface, and the main surfaces on both sides When grinding or polishing the surface, problems such as the ring-shaped glass plate popping out from the holding carrier that holds the ring-shaped glass plate may occur.
  • the irradiation conditions of the laser beam L2 and the rotational operation conditions of the annular glass base plate 28 are the irradiation conditions of the laser beam L2 and the irradiation conditions of the laser beam L2 when irradiating the outer peripheral end surface so that the inner peripheral end surface does not have a raised shape.
  • the conditions are changed so as to be different from the rotational operation conditions of the ring-shaped glass base plate 28.
  • the inner peripheral end surface having no raised shape can be formed by setting various conditions, but the surface roughness of the melting surface on the inner peripheral end surface is larger than the surface roughness of the melting surface on the outer peripheral end surface.
  • the reason for this is not clear, but when the laser beam L2 is irradiated to the inner peripheral end surface 28b, the irradiation surface is concave when viewed from the irradiation direction of the laser beam L2, and compared to the case where the outer peripheral end surface 28a is irradiated. Due to the influence of irradiation in a space close to the closed space, it is assumed that the inner peripheral end surface 28b is more likely to retain heat than the outer peripheral end surface 28a, and as a result, the spherical shape is more likely to proceed. .. Specifically, if the inner peripheral end surface 28b is to have a melting surface shape equivalent to that of the outer peripheral end surface 28a, it easily becomes a spherical shape.
  • the surface roughness of the melting surface on the inner peripheral end surface 28b is calculated from the surface roughness of the melting surface on the outer peripheral end surface 28a.
  • the inventor of the present application has found that the melting surface on the inner peripheral end surface 28b can be prevented from having a spherical surface shape by adjusting the size so as to be large. Therefore, in the present embodiment, a ring-shaped glass plate is produced by irradiating the laser beam L2 so that the surface roughness of the melting surface on the inner peripheral end surface 28b is larger than the surface roughness of the melting surface on the outer peripheral end surface 28a.
  • the arithmetic mean roughness Ra on the inner peripheral end surface 28b is 0.01 ⁇ m or more larger than the arithmetic average roughness Ra on the outer peripheral end surface. By doing so, it is possible to suppress the occurrence of ridges on the inner peripheral side of the main surface.
  • the power density Pd of the laser beam L2 irradiating the inner peripheral end surface 28b is preferably 80% or less of the power density Pd of the laser light L2 irradiating the outer peripheral end surface 28a.
  • the conditions other than the power density Pd are preferably the same as in the case of irradiation of the outer peripheral end face, from the viewpoint of forming the same shape as the shape of the outer peripheral end face 28a on the inner peripheral end face 28a.
  • the inner peripheral end surface 28b tends to have a spherical shape and a raised shape is likely to occur. .. Therefore, according to one embodiment, the outer peripheral end face 28a and the inner peripheral end face 28b are melted by irradiating the outer peripheral end face 28a and the inner peripheral end face 28b of the annular glass base plate 28 with laser light L2, respectively, to form a melting surface.
  • the inner peripheral end surface and the outer peripheral end surface of the annular glass plate 28 in the annular glass base plate 28 do not rise with respect to the main surfaces on both sides of the annular glass plate. It is preferable to irradiate the peripheral end surface 28b and the outer peripheral end surface 28a with the laser beam L2.
  • the surface roughness of the melting surface of the annular glass plate formed by irradiation with the laser L2 is preferably 0.1 ⁇ m or less in arithmetic average roughness Ra, and more preferably 0. It is preferably 05 ⁇ m or less.
  • the roundness is preferably 15 ⁇ m or less.
  • the roundness is preferably 0.1 to 15 ⁇ m.
  • the roundness is preferably 10 ⁇ m or less, more preferably 7 ⁇ m or less, and even more preferably 5 ⁇ m or less.
  • a separation surface a melting surface that satisfies the requirements of the end surface of the glass substrate for a magnetic disk can be easily produced. Therefore, it is not necessary to polish the end face.
  • a CO 2 laser beam is used as an example of the laser beam L2, but it is not limited to the CO 2 laser beam as long as it has an oscillation wavelength that is absorbed by the glass.
  • a CO laser oscillation wavelength ⁇ 5 ⁇ m or ⁇ 10.6 ⁇ m
  • an Er-YAG laser oscillation wavelength ⁇ 2.94 ⁇ m
  • the wavelength is preferably 3 ⁇ m or more. Further, it is more preferable that the wavelength is 11 ⁇ m or less. If the wavelength is shorter than 3 ⁇ m, it becomes difficult for the glass to absorb the laser beam L, and the outer peripheral end surface 28a and the inner peripheral end surface 28b of the annular glass plate 28 may not be sufficiently heated.
  • the oscillation form of the laser beam L2 is not particularly limited, and may be any of continuous oscillation light (CW light), pulse oscillation light, and modulation light of continuous oscillation light.
  • CW light continuous oscillation light
  • pulse oscillation light and continuously oscillating light if the relative moving speed of the laser light L2 is high, the shape of the chamfered surface may be uneven in the moving direction.
  • the oscillation and modulation frequencies are preferably 1 kHz or higher, more preferably 5 kHz or higher, and even more preferably 10 kHz or higher.
  • the power of the laser beam L2 may be appropriately determined, but is, for example, 500 W or less.
  • the plate thickness is extremely low, 0.6 mm or less. It is effective for the thin ring-shaped glass base plate 28.
  • the thickness of the glass substrate for the magnetic disk after the grinding / polishing treatment described later is preferably less than 0.52 mm.
  • defects are intermittently formed along substantially concentric circles by irradiating the glass plate 20 having a plate thickness of 0.6 mm or less with laser light L1 (cut-out laser light), and the defects are connected.
  • a circular separation boundary line 42 which is a linear defect composed of an inner peripheral circle portion and an outer peripheral circular portion, is formed on the main surface of the glass plate 20.
  • the outer portion 44 of the inner peripheral circle portion by heating the outer portion 44 of the inner peripheral circle portion, the outer portion 44 of the inner peripheral circular portion of the glass plate 20 is thermally expanded more than the inner portion 46 of the inner peripheral circular portion, and the outer portion of the inner peripheral circular portion is expanded.
  • the 44 and the inner portion 46 of the inner peripheral circle portion are separated.
  • a laser beam of a type different from that of the laser beam L1 is formed on the separation surface of the annular glass base plate 28 obtained by removing the outer portion 44 of the outer peripheral circle portion and the inner portion 46 of the inner peripheral circular portion from the glass plate 20. Since the end faces of the outer peripheral end face 28a and the inner peripheral end face 28b are polished by irradiating L2 (end face polishing laser light), the productivity of the annular glass plate can be dramatically improved.
  • the ring-shaped glass plate 28 obtained by subjecting the end face polishing treatment to the ring-shaped glass base plate 28 is subjected to a main surface grinding / polishing treatment.
  • the ring-shaped glass plate is ground and then polished.
  • a double-sided grinding device equipped with a planetary gear mechanism is used to grind the main surface of the ring-shaped glass plate. Specifically, the main surfaces on both sides of the annular glass plate are ground while holding the outer peripheral end faces of the annular glass plate in the holding holes provided in the holding member of the double-sided grinding apparatus.
  • the double-sided grinding device has a pair of upper and lower surface plates (upper surface plate and lower surface plate), and a ring-shaped glass plate is sandwiched between the upper surface plate and the lower surface plate. Then, by moving one or both of the upper surface plate and the lower surface plate and relatively moving the annular glass plate and each surface plate while supplying coolant, the annular shape is formed. Both main surfaces of the glass plate can be ground.
  • a grinding member in which fixed abrasive grains in which diamond is fixed with a resin is formed in a sheet shape can be mounted on a surface plate to perform a grinding process. By the above grinding process, the main surface can be made into a ground surface.
  • the first polishing is applied to the main surface of the ring-shaped glass plate after grinding. Specifically, the main surfaces on both sides of the ring-shaped glass plate are polished while holding the outer peripheral end faces of the ring-shaped glass plate in the holding holes provided in the polishing carrier of the double-sided polishing device. ..
  • the purpose of the first polishing is to remove scratches and strains remaining on the main surface after the grinding process, or to adjust minute surface irregularities (microwaveness, roughness).
  • the main surface of the annular glass plate is polished while applying a polishing slurry by using a double-sided polishing device having the same configuration as the double-sided grinding device used for the above-mentioned grinding process using fixed abrasive grains.
  • a polishing slurry containing free abrasive grains is used.
  • the free abrasive grains used for the first polishing for example, abrasive grains such as cerium oxide or zirconia are used.
  • the double-sided polishing device Similar to the double-sided grinding device, the double-sided polishing device also has a ring-shaped glass plate sandwiched between a pair of upper and lower surface plates.
  • An annular flat plate polishing pad (for example, a resin polisher) is attached to the upper surface of the lower surface plate and the bottom surface of the upper surface plate as a whole. Then, by moving one or both of the upper surface plate and the lower surface plate, the annular glass plate and each surface plate are relatively moved, so that the annular glass plate is formed. Polish both main surfaces.
  • the size of the abrasive grains is preferably in the range of 0.5 to 3 ⁇ m in terms of average particle size (D50).
  • the ring-shaped glass plate may be chemically strengthened.
  • a mixed melt of potassium nitrate and sodium nitrate is used as the chemical strengthening liquid, and the annular glass plate is immersed in the chemical strengthening liquid.
  • a compressive stress layer can be formed on the surface of the ring-shaped glass plate by ion exchange.
  • the ring-shaped glass plate is subjected to the second polishing.
  • the second polishing treatment aims at mirror polishing of the main surface.
  • the surface roughness of the main surface of the ring-shaped glass plate can be set to 0.3 nm or less in arithmetic average roughness Ra.
  • the main surface can be a mirror-polished surface.
  • a double-sided polishing apparatus having the same configuration as the double-sided polishing apparatus used for the first polishing is used. Specifically, while holding the outer peripheral end surface of the annular glass plate in the holding holes provided in the polishing carrier of the double-sided polishing device, the main surfaces on both sides of the annular glass plate are polished. It is said.
  • the type and particle size of the free abrasive grains are different from those in the first polishing treatment, and the hardness of the resin polisher is different.
  • the hardness of the resin polisher is preferably smaller than that during the first polishing treatment.
  • a polishing liquid containing colloidal silica as free abrasive grains is supplied between the polishing pad of the double-sided polishing apparatus and the main surface of the ring-shaped glass plate, and the main surface of the ring-shaped glass plate is polished.
  • the size of the abrasive grains used for the second polishing is preferably in the range of 5 to 50 nm in terms of average particle size (d50).
  • the necessity of the chemical strengthening treatment may be appropriately selected in consideration of the glass composition and necessity.
  • another polishing treatment may be added, or the polishing treatment of the two main surfaces may be completed by one polishing treatment.
  • the order of each of the above processes may be changed as appropriate.
  • the main surface of the ring-shaped glass plate can be polished to obtain a glass substrate for a magnetic disk that satisfies the conditions required for the glass substrate for a magnetic disk. It is not always necessary to grind and polish the main surface of the ring-shaped glass plate, but at least one of them may be performed. For example, polishing may be performed without grinding.
  • the inner peripheral end surface and the outer peripheral end surface of the annular glass plate are polished with a polishing brush. It is preferable not to do so from the viewpoint of production efficiency.
  • the ring-shaped glass plate may be formed before the first polishing, for example, after the first grinding, before the first polishing, or before the first grinding.
  • the end face (separation surface) of the above may be subjected to an additional end face polishing process by a method different from the laser polishing process using the laser beam L2.
  • a polishing brush method of polishing with a polishing brush while supplying free abrasive grains to the end face may be used, or a polishing method using a magnetically functional fluid may be used.
  • a slurry in which abrasive grains are contained in a ferrofluid is agglomerated by a magnetic field, and the end face of an annular glass plate is thrust into the agglomerate to form a clump. This is a method of polishing the end face by relatively rotating a ring-shaped glass plate.
  • the roundness of the ring-shaped glass plate obtained by separating from the glass plate 20 and performing the end face polishing treatment by irradiating the laser beam L2 is maintained, and further.
  • the main surface of the ring-shaped glass plate can be ground or polished while maintaining the surface roughness of at least a part of the molten surface. After that, the ring-shaped glass plate whose main surface has been ground and polished is cleaned and inspected to become a glass substrate for a magnetic disk.
  • a magnetic disk can be manufactured by forming a magnetic film on the main surface of the glass substrate for a magnetic disk.
  • the ring-shaped glass plate thus produced has the following features. That is, the ring-shaped glass plate has an outer peripheral end surface and an inner peripheral end surface, and the plate thickness is 0.6 mm or less.
  • the outer peripheral end face and the inner peripheral end face of this ring-shaped glass plate are melted surfaces, and the surface roughness of the melted surfaces on the outer peripheral end face and the inner peripheral end face is 0.1 ⁇ m or less in arithmetic average roughness Ra.
  • the surface roughness of the melting surface on the inner peripheral end face is larger than the surface roughness of the melting surface on the outer peripheral end face, and the melting surfaces on the inner peripheral end face and the outer peripheral end face are relative to the main surfaces on both sides of the annular glass plate. Does not rise.
  • the glass substrate for a magnetic disk has the following features according to one embodiment. That is, the glass substrate for a magnetic disk has an outer peripheral end face and an inner peripheral end face, and has a plate thickness of 0.6 mm or less.
  • the outer peripheral end face and inner peripheral end face of this glass substrate for magnetic disk are melted surfaces, and the surface roughness of the melted surfaces on the outer peripheral end face and the inner peripheral end face is 0.1 ⁇ m or less in arithmetic average roughness Ra, and ,
  • the surface roughness of the melting surface on the inner peripheral end face is larger than the surface roughness of the melting surface on the outer peripheral end face, and the melting surfaces on the inner peripheral end face and the outer peripheral end face are raised with respect to the main surfaces on both sides of the annular glass plate.
  • the surface roughness of the main surface is 0.3 nm or less in arithmetic average roughness Ra.
  • aluminosilicate glass soda lime glass, borosilicate glass, and the like can be used.
  • aluminosilicate glass can be preferably used in that it can be chemically strengthened and that a glass substrate for a magnetic disk having excellent flatness of the main surface and strength of the substrate can be produced.
  • Amorphous aluminosilicate glass is more preferable.
  • the composition of the glass plate 20, the ring-shaped glass base plate 28, and the ring-shaped glass plate of the present embodiment is not limited, but the glass plate 20, the ring-shaped glass base plate 28 of the present embodiment is not limited.
  • the ring-shaped glass plate is preferably converted to an oxide standard and expressed in mol%, SiO 2 is 50 to 75%, Al 2 O 3 is 1 to 15%, Li 2 O, Na 2 O and A total of 5 to 35% of at least one component selected from K 2 O, a total of 0 to 20% of at least one component selected from MgO, CaO, SrO, BaO and ZnO, and ZrO 2 , Amorphous aluminosilicate having a composition having at least one component selected from TiO 2 , La 2 O 3 , Y 2 O 3 , Ta 2 O 5 , Nb 2 O 5 and HfO 2 in total of 0 to 10%. It is glass.
  • the glass plate 20, the annular glass base plate 28, and the annular glass plate of the present embodiment are preferably, for example, 57 to 75% SiO 2 and 5 Al 2 O 3 in terms of mass%. ⁇ 20%, (however, the total amount of SiO 2 and Al 2 O 3 is 74% or more), ZrO 2 , HfO 2 , Nb 2 O 5 , Ta 2 O 5 , La 2 O 3 , Y 2 O 3 and TIO 2 is more than 0% in total, 6% or less, Li 2 O is more than 1%, 9% or less, Na 2 O is 5 to 28% (however, the mass ratio Li 2 O / Na 2 O is 0.5.
  • the composition of the glass plate 20, the annular glass base plate 28, and the annular glass plate of the present embodiment contains SiO 2 , Li 2 O, Na 2 O, and MgO, CaO, SrO as essential components. It contains one or more alkaline earth metal oxides selected from the group consisting of and BaO, and the molar ratio of CaO content to the total content of MgO, CaO, SrO and BaO (CaO / (MgO + CaO + SrO + BaO)) is 0.20.
  • the glass transition temperature may be 650 ° C. or higher.
  • a glass substrate for a magnetic disk having such a composition is suitable for a glass substrate for a magnetic disk used for a magnetic disk for energy-assisted magnetic recording.
  • the glass plate 20, the ring-shaped glass base plate 28, and the ring-shaped glass plate are preferably made of glass having a glass transition point Tg of 500 ° C. or higher, which is more preferable.
  • the glass transition point Tg is 650 ° C. or higher.
  • the glass transition point Tg is preferably set to 500 ° C. or higher, more preferably 650 ° C. or higher, in consideration of the heat treatment when forming the magnetic film or the like of the magnetic disk on the substrate 1.
  • the glass plate 20, the ring-shaped glass base plate 28, and the ring-shaped glass plate are made of a material having a linear expansion coefficient of 100 ⁇ 10-7 [1 / K] or less. It is more preferable, it is more preferably composed of a material of 95 ⁇ 10-7 [1 / K] or less, and even more preferably it is composed of a material of 70 ⁇ 10-7 [1 / K] or less. Preferably, the coefficient of linear expansion is 60 ⁇ 10 -7 [1 / K] or less.
  • the lower limit of the coefficient of linear expansion of the glass plate 20, the ring-shaped glass base plate 28, and the ring-shaped glass plate is not particularly limited, but is, for example, 5 ⁇ 10-7 [1 / K] [1 / K]. is there.
  • the coefficient of linear expansion referred to here is a coefficient of linear expansion obtained by the difference in thermal expansion between 100 ° C. and 300 ° C. By using such a coefficient of linear expansion, thermal expansion can be suppressed in the heat treatment when forming a magnetic film or the like on a glass substrate for a magnetic disk, and the outer peripheral end face and the inner peripheral end face can be gripped by a film forming apparatus.
  • the thermal distortion of the glass substrate for the magnetic disk around the gripped portion can be suppressed.
  • the coefficient of linear expansion is 242 ⁇ 10-7 [1 / K] in the conventional aluminum alloy substrate, whereas the glass plate 20 of one embodiment, the ring-shaped glass base plate 28, and the circle The coefficient of linear expansion of the ring-shaped glass plate is 51 ⁇ 10 -7 [1 / K].
  • the ring-shaped glass base plate 28 used in the experiment has an outer diameter of 95 mm, an inner diameter of 25 mm, and a plate thickness of 0.6 mm.
  • the ring-shaped glass base plate 28 used for the laser polishing process was separated from the glass plate 20 by irradiating the glass plate 20 with the laser beam L1 as shown in FIG. 2A and heating the glass plate 20 shown in FIG. ..
  • the power of the laser beam L2 is 40 [W]
  • Pd ⁇ Th is 3.06 [W / mm]
  • an elliptical spot having a width of 1 mm and a length of W2 of 10 mm is formed.
  • the relative moving speed was set to 20 [mm / sec].
  • the power of the laser light L2 to irradiate the outer peripheral end surface 28a is fixed, and the ratio of the power of the laser light L2 to irradiate the inner peripheral end surface 28b to the power of the laser light L2 to irradiate the outer peripheral end surface 28a is variously changed.
  • Laser polishing was performed. Since the area of the irradiation surface on the end face of the laser beam L2 is fixed to be constant, this power ratio corresponds to the power density ratio.
  • the laser polishing process of the inner peripheral end surface 28b and the outer peripheral end surface 28a was performed separately. As a result, a rounded chamfered surface was formed on the inner peripheral end surface and the outer peripheral end surface.
  • the main surface was ground and polished to form a glass substrate for a magnetic disk, a magnetic film, and the like to produce a magnetic disk.
  • the method of grinding and polishing the main surface is as described above.
  • the ridges of the edges of the main surface of the annular glass plate after laser polishing were evaluated using a stylus type roughness meter.
  • the shape was measured by scanning the probe in the radial direction so as to include the flat middle peripheral portion on the inner peripheral side of the main surface and the raised end on the inner peripheral end surface side.
  • the ridge from the extension line of the flat portion of the middle peripheral portion of the main surface is 1 ⁇ m or more, it is determined that there is a ridge.
  • the surface roughness (arithmetic mean roughness Ra) of the inner peripheral end face and the outer peripheral end face of the ring-shaped glass plate was measured using the above-mentioned laser microscope under the above-mentioned conditions. Table 1 below shows the evaluation and measurement results in Examples and Comparative Examples.
  • the surface roughness of the melted surfaces on the outer peripheral end surface 28a and the inner peripheral end surface 28b is 0.1 ⁇ m or less in arithmetic mean roughness Ra, and the inside
  • the surface roughness of the melting surface on the peripheral end surface 28b (arithmetic mean roughness Ra) is larger than the surface roughness of the melting surface on the outer peripheral end surface 28a (arithmetic mean roughness Ra)
  • the inner circumference is formed. It can be seen that no ridge is generated on the side of the end face.
  • a ridge is formed on the inner peripheral end surface side. Do not cause.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Surface Treatment Of Glass (AREA)
PCT/JP2020/029591 2019-07-31 2020-07-31 円環形状のガラス板の製造方法、磁気ディスク用ガラス基板の製造方法、磁気ディスクの製造方法、円環形状のガラス板、磁気ディスク用ガラス基板、及び磁気ディスク Ceased WO2021020587A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN202080053261.3A CN114175156B (zh) 2019-07-31 2020-07-31 圆环形状的玻璃板的制造方法、磁盘用玻璃基板的制造方法、磁盘的制造方法、圆环形状的玻璃板、磁盘用玻璃基板以及磁盘
US17/631,440 US11884582B2 (en) 2019-07-31 2020-07-31 Method for manufacturing annular glass plate, method for manufacturing glass substrate for magnetic disk, and method for manufacturing magnetic disk
JP2021535474A JP7411660B2 (ja) 2019-07-31 2020-07-31 円環形状のガラス板の製造方法、磁気ディスク用ガラス基板の製造方法、磁気ディスクの製造方法、円環形状のガラス板、磁気ディスク用ガラス基板、及び磁気ディスク
MYPI2022000478A MY209913A (en) 2019-07-31 2020-07-31 Method for manufacturing annular glass plate, method for manufacturing glass substrate for magnetic disk, method for manufacturing magnetic disk, annular glass plate, glass substrate for magnetic disk, and magnetic disk
US18/537,768 US20240109807A1 (en) 2019-07-31 2023-12-12 Annular glass plate, method for manufacturing glass substrate for magnetic disk, glass substrate for magnetic disk, and magnetic disk

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-140594 2019-07-31
JP2019140594 2019-07-31

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US17/631,440 A-371-Of-International US11884582B2 (en) 2019-07-31 2020-07-31 Method for manufacturing annular glass plate, method for manufacturing glass substrate for magnetic disk, and method for manufacturing magnetic disk
US18/537,768 Division US20240109807A1 (en) 2019-07-31 2023-12-12 Annular glass plate, method for manufacturing glass substrate for magnetic disk, glass substrate for magnetic disk, and magnetic disk

Publications (1)

Publication Number Publication Date
WO2021020587A1 true WO2021020587A1 (ja) 2021-02-04

Family

ID=74228878

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/029591 Ceased WO2021020587A1 (ja) 2019-07-31 2020-07-31 円環形状のガラス板の製造方法、磁気ディスク用ガラス基板の製造方法、磁気ディスクの製造方法、円環形状のガラス板、磁気ディスク用ガラス基板、及び磁気ディスク

Country Status (5)

Country Link
US (2) US11884582B2 (https=)
JP (1) JP7411660B2 (https=)
CN (1) CN114175156B (https=)
MY (1) MY209913A (https=)
WO (1) WO2021020587A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021200512A1 (ja) * 2020-03-31 2021-10-07 Hoya株式会社 中間体ガラス板の製造方法、磁気ディスク用ガラス板の製造方法、および中間体ガラス板の積層体
WO2022114060A1 (ja) * 2020-11-25 2022-06-02 Hoya株式会社 ガラス板の製造方法、磁気ディスク用ガラス基板の製造方法、磁気ディスクの製造方法、及び円環形状のガラス板
WO2023171824A1 (ja) * 2022-03-11 2023-09-14 Hoya株式会社 円盤状ガラス基板の製造方法、円環状ガラス基板の製造方法、磁気ディスク用ガラス基板の製造方法、円盤状ガラス基板、円環状ガラス基板、及び磁気ディスク用ガラス基板

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6783401B2 (ja) * 2018-01-31 2020-11-11 Hoya株式会社 円盤形状のガラス素板の製造方法、及び磁気ディスク用ガラス基板の製造方法
CN113924276B (zh) * 2019-06-28 2024-10-01 Hoya株式会社 玻璃板的制造方法和磁盘的制造方法
US20240174543A1 (en) * 2022-11-30 2024-05-30 Corning Incorporated Systems and methods for fabricating ring structures
CN116002963B (zh) * 2022-12-01 2024-01-23 湖南旗滨新材料有限公司 玻璃制造方法及系统
WO2025233298A1 (fr) * 2024-05-06 2025-11-13 Saint-Gobain Sekurit France Procédé et système de rompage d'une forme intérieure dans une feuille de verre à l'état plan

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001335336A (ja) * 1999-06-22 2001-12-04 Shin Meiwa Ind Co Ltd 材料の処理方法、円盤形状材料の処理方法、ガラス材及びガラスディスク
JP2002150546A (ja) * 2000-11-06 2002-05-24 Nippon Sheet Glass Co Ltd 情報記録媒体用ガラス基板の製造方法、及び該製造方法により製造された情報記録媒体用ガラス基板、並びに情報記録媒体
JP2003160348A (ja) * 2001-11-21 2003-06-03 Nippon Sheet Glass Co Ltd 情報記録媒体用ガラス基板及びその製造方法
JP2006018998A (ja) * 2004-06-04 2006-01-19 Showa Denko Kk 磁気記録媒体の製造方法
JP2010501456A (ja) * 2006-08-21 2010-01-21 コーニング インコーポレイテッド ガラス板の残留応力低減熱エッジ仕上用プロセス及び装置
JP2010108592A (ja) * 2008-09-30 2010-05-13 Hoya Corp 磁気ディスク用ガラス基板及び磁気ディスク
JP2011104713A (ja) * 2009-11-17 2011-06-02 Asahi Glass Co Ltd ガラス基板研磨パッド用ドレス治具
JP2015181085A (ja) * 2013-03-01 2015-10-15 Hoya株式会社 磁気ディスク用ガラス基板および磁気ディスク
WO2016111158A1 (ja) * 2015-01-05 2016-07-14 日本電気硝子株式会社 ガラス板及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9697860B2 (en) 2012-09-28 2017-07-04 Hoya Corporation Magnetic-disk glass substrate, magnetic disk and method for manufacturing magnetic-disk glass substrate
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
JP5983897B1 (ja) * 2015-11-26 2016-09-06 旭硝子株式会社 磁気ディスク用ガラス基板及び磁気ディスク

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001335336A (ja) * 1999-06-22 2001-12-04 Shin Meiwa Ind Co Ltd 材料の処理方法、円盤形状材料の処理方法、ガラス材及びガラスディスク
JP2002150546A (ja) * 2000-11-06 2002-05-24 Nippon Sheet Glass Co Ltd 情報記録媒体用ガラス基板の製造方法、及び該製造方法により製造された情報記録媒体用ガラス基板、並びに情報記録媒体
JP2003160348A (ja) * 2001-11-21 2003-06-03 Nippon Sheet Glass Co Ltd 情報記録媒体用ガラス基板及びその製造方法
JP2006018998A (ja) * 2004-06-04 2006-01-19 Showa Denko Kk 磁気記録媒体の製造方法
JP2010501456A (ja) * 2006-08-21 2010-01-21 コーニング インコーポレイテッド ガラス板の残留応力低減熱エッジ仕上用プロセス及び装置
JP2010108592A (ja) * 2008-09-30 2010-05-13 Hoya Corp 磁気ディスク用ガラス基板及び磁気ディスク
JP2011104713A (ja) * 2009-11-17 2011-06-02 Asahi Glass Co Ltd ガラス基板研磨パッド用ドレス治具
JP2015181085A (ja) * 2013-03-01 2015-10-15 Hoya株式会社 磁気ディスク用ガラス基板および磁気ディスク
WO2016111158A1 (ja) * 2015-01-05 2016-07-14 日本電気硝子株式会社 ガラス板及びその製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021200512A1 (ja) * 2020-03-31 2021-10-07 Hoya株式会社 中間体ガラス板の製造方法、磁気ディスク用ガラス板の製造方法、および中間体ガラス板の積層体
US12479751B2 (en) 2020-03-31 2025-11-25 Hoya Corporation Method for producing glass plate, and laminate
WO2022114060A1 (ja) * 2020-11-25 2022-06-02 Hoya株式会社 ガラス板の製造方法、磁気ディスク用ガラス基板の製造方法、磁気ディスクの製造方法、及び円環形状のガラス板
US12595202B2 (en) 2020-11-25 2026-04-07 Hoya Corporation Method for manufacturing glass plate including processing for chamfering edge surface
WO2023171824A1 (ja) * 2022-03-11 2023-09-14 Hoya株式会社 円盤状ガラス基板の製造方法、円環状ガラス基板の製造方法、磁気ディスク用ガラス基板の製造方法、円盤状ガラス基板、円環状ガラス基板、及び磁気ディスク用ガラス基板
US12406694B2 (en) 2022-03-11 2025-09-02 Hoya Corporation Magnetic disk-use glass substrate manufacturing method, discoidal glass substrate, glass substrate, and magnetic disk-use glass substrate

Also Published As

Publication number Publication date
US11884582B2 (en) 2024-01-30
US20220274870A1 (en) 2022-09-01
JPWO2021020587A1 (https=) 2021-02-04
CN114175156B (zh) 2024-04-19
CN114175156A (zh) 2022-03-11
JP7411660B2 (ja) 2024-01-11
MY209913A (en) 2025-08-12
US20240109807A1 (en) 2024-04-04

Similar Documents

Publication Publication Date Title
JP7411660B2 (ja) 円環形状のガラス板の製造方法、磁気ディスク用ガラス基板の製造方法、磁気ディスクの製造方法、円環形状のガラス板、磁気ディスク用ガラス基板、及び磁気ディスク
JP6783401B2 (ja) 円盤形状のガラス素板の製造方法、及び磁気ディスク用ガラス基板の製造方法
JP7387927B2 (ja) ガラス板の製造方法、ガラス板の面取り方法、および磁気ディスクの製造方法
JP7458335B2 (ja) ガラス基板の製造方法及び磁気ディスクの製造方法
JP7311702B2 (ja) ガラス板および磁気ディスク
JP7366141B2 (ja) ガラス板の製造方法、磁気ディスク用ガラス基板の製造方法、および磁気ディスクの製造方法
US20240327280A1 (en) Manufacturing method for glass substrate and disc-shaped glass substrate
JP7523579B2 (ja) ガラス板の製造方法、磁気ディスク用ガラス基板の製造方法、磁気ディスクの製造方法、及び円環形状のガラス板
WO2019189480A1 (ja) ガラス基板の製造方法
JP2025069476A (ja) 円盤状ガラス基板の製造方法、円環状ガラス基板の製造方法、磁気ディスク用ガラス基板の製造方法、円盤状ガラス基板、円環状ガラス基板、及び磁気ディスク用ガラス基板

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20847868

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2021535474

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20847868

Country of ref document: EP

Kind code of ref document: A1