WO2021018061A1 - 一种屏蔽罩和电子设备 - Google Patents

一种屏蔽罩和电子设备 Download PDF

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Publication number
WO2021018061A1
WO2021018061A1 PCT/CN2020/104652 CN2020104652W WO2021018061A1 WO 2021018061 A1 WO2021018061 A1 WO 2021018061A1 CN 2020104652 W CN2020104652 W CN 2020104652W WO 2021018061 A1 WO2021018061 A1 WO 2021018061A1
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Prior art keywords
shielding
cover
shielding cover
film
frame
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PCT/CN2020/104652
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English (en)
French (fr)
Inventor
丁东庆
李明川
杨秀娟
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华为技术有限公司
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Publication of WO2021018061A1 publication Critical patent/WO2021018061A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • This application relates to the technical field of electronic equipment, and in particular to a shielding cover and electronic equipment.
  • the shielding structure can prevent the internal circuit of the shielding structure from radiating electromagnetic waves and the external electromagnetic waves of the shielding structure from entering the inside, so as to achieve the effect of not affecting other surrounding circuits and not being affected by the surrounding circuits.
  • FIG. 1 is a shielding cover in the prior art.
  • the shielding cover includes a shielding frame 01 and a shielding cover 02.
  • the shielding frame 01 has a first surface 001 and a second surface 002 facing away from the first surface 001.
  • the shield frame 01 encloses a cavity 03 that penetrates the first surface 001 and the second surface 002.
  • the first surface 001 of the shield frame 01 is soldered to the circuit board 04, and the electronic devices on the circuit board 04 05 is housed in the cavity 03, and the shielding cover 02 is snapped onto the second surface 002 of the shielding frame 01 to cover the electronic device 05 in the cavity 03.
  • the internal space of the shielding case is The height is limited, which limits the height of the electronic devices that can be laid out inside the shield.
  • the embodiments of the present application provide a shielding case and electronic equipment, which can increase the height of the internal space of the shielding case, so that electronic devices with a larger height can be arranged inside the shielding case.
  • the embodiments of the present application provide a shielding cover, including a shielding frame, a shielding cover, and a shielding film;
  • the shielding frame has a first end and a second end opposite to each other, and the shielding frame is surrounded by an end surface penetrating the first end and a second end.
  • the cavities on the end surfaces of the two ends, the shielding cover is used to detachably cover the end surface of the first end, and the shielding cover is provided with an opening corresponding to the cavity, the shielding film covers the opening on the outer surface of the shielding cover, and the shielding film is The edge of the shielding cover at the opening is fixedly connected.
  • the shielding cover provided by the embodiment of the present application includes a shielding frame, a shielding cover, and a shielding film
  • the shielding frame has a first end and a second end opposite to each other, and the shielding frame is surrounded by a void that penetrates the end surface of the first end and the end surface of the second end. Cavity, the shielding cover is used to detachably cover the end surface of the first end. Therefore, when the shielding cover is used, the end surface of the second end of the shielding frame can be fixed on the circuit board, and the electronic components on the circuit board can be accommodated in the cavity Then, the shielding cover is covered on the end surface of the first end of the shielding frame to cover the electronic device in the cavity, so as to shield the electronic device.
  • the shielding cover has an opening corresponding to the cavity
  • the shielding film covers the opening on the outer surface of the shielding cover, and the shielding film is fixedly connected to the edge of the shielding cover at the opening. Therefore, when the height of the shielding cover is constant, The height of the inner space of the shielding case is affected by the thickness of the shielding film. The thinner the shielding film, the greater the height of the inner space of the shielding case.
  • the thickness of the shielding film in the embodiment of the application is It can be designed to be thinner, so that the height of the inner space of the shield can be increased, so that electronic devices with a larger height can be arranged inside the shield.
  • the shielding film includes an insulating substrate and a metal layer formed on the insulating substrate. Since the material price of the metal layer is usually high, and in the embodiment of the present application, the shielding film uses an insulating substrate as the base film to form the metal layer. The thickness of the metal layer can be set very thin, and the metal layer uses less material. Therefore, the material cost of the shielding film can be reduced.
  • the material of the insulating substrate is polyimide or polyester film
  • the material of the metal layer is copper.
  • Polyimide and polyester films have high toughness, high temperature resistance, friction resistance, and can improve the structural strength of the insulating substrate. Copper has better electrical conductivity and can improve the shielding effect of the metal layer.
  • the shielding film is a metal film.
  • the shielding film of this structure has a simple structure and is easy to manufacture.
  • the material of the shielding film is copper. Copper has better electrical conductivity and can improve the shielding effect of the shielding film.
  • connection between the shielding film and the edge of the shielding cover at the opening
  • the connection is fixed by welding.
  • the fixed connection is made by welding, and the connection stability is better.
  • the shielding film and the edge of the shielding cover at the opening are fixedly connected by laser spot welding.
  • the laser spot welding method does not need to fill the solder, the welding speed is high, the joint is reliable, the deformation of the workpiece is small, and the shape is beautiful.
  • connection is fixed by conductive glue.
  • conductive glue used for fixed connection, no heating is required, and the operation is simple and convenient.
  • the outer surface of the shielding cover is provided at a position corresponding to the opening The sink, the shielding film is located in the sink. In this way, the appearance of the shielding cover can be prevented from being affected by the shielding film protruding from the outer surface of the shielding cover.
  • the outer surface of the shielding film is flush with the outer surface of the shielding cover. In this way, the appearance of the shielding cover can be prevented from being affected by the projection of the shielding film on the outer surface of the shielding cover, and at the same time, the shielding cover can have a larger internal space, so that the inside of the shielding cover can be equipped with electronic devices with a larger height. .
  • the shielding cover in combination with any one of the first aspect to the ninth optional implementation of the first aspect, in the tenth optional implementation of the first aspect, includes a top wall and a surrounding A side wall is provided around the edge of the inner surface, the inner surface of the top wall and the inner surface of the side wall enclose a clamping groove, and the first end of the shielding frame can be clamped in the clamping groove.
  • the shielding cover can be detachably connected to the first end of the shielding frame by buckling, and the installation and disassembly operation between the two components connected by buckling is simple and efficient, which can improve the shielding cover and the shielding frame. The efficiency between installation and removal.
  • an embodiment of the present application provides an electronic device, including a circuit board, an electronic device, and a shielding cover.
  • the electronic device is connected to the circuit board.
  • the shielding cover is a shielding cover as described in any of the above technical solutions.
  • the end surface of the second end of the frame is fixed on the circuit board, the electronic device is located in the cavity of the shield frame, and the shield cover of the shield can detachably covers the end surface of the first end of the shield frame.
  • the shielding case used in the electronic device of the embodiment of the present application is the same as the shielding case described in any of the above technical solutions, the two can solve the same technical problem and achieve the same expected effect.
  • Fig. 1 is a schematic structural diagram of a shielding cover provided by the prior art
  • Fig. 2 is a schematic structural diagram of an electronic device provided by the prior art
  • FIG. 3 is a schematic structural diagram of a shielding cover provided by an embodiment of the application.
  • FIG. 4 is a schematic structural diagram of a first electronic device provided by an embodiment of this application.
  • FIG. 5 is a schematic structural diagram of a second type of electronic device provided by an embodiment of this application.
  • Fig. 6 is a schematic structural diagram of a third electronic device provided by an embodiment of the application.
  • FIG. 4 An embodiment of the application provides an electronic device, as shown in FIG. 4, FIG. 5 or FIG. 6, comprising a circuit board 2, an electronic device 3 and a shielding cover 1.
  • the electronic device 3 is connected to the circuit board 2.
  • FIG. 3 is this application
  • the embodiment provides a shielding case 1.
  • the shielding case 1 includes a shielding frame 11, a shielding cover 12, and a shielding film 13.
  • the shielding frame 11 has a first end 100 and a second end 200 opposite to each other.
  • the cavity 14 of the end face of one end 100 and the end face of the second end 200 is shown in FIG. 4, FIG. 5 or FIG. 6.
  • the end face of the second end 200 of the shield frame 11 is fixed on the circuit board 2, and the electronic device 3 is located In the cavity 14, the shield cover 12 is detachably covered on the end surface of the first end 100 of the shield frame 11, and the shield cover 12 is provided with an opening 15 at a position corresponding to the cavity 14, and the shield film 13 covers the outer surface of the shield cover 12. And the shielding film 13 is fixedly connected to the edge of the shielding cover 12 at the opening 15.
  • the shield frame 11 refers to a frame structure with a shielding effect. In order to make the shield frame 11 have a shielding effect, the shield frame 11 should be partially or completely made of conductive materials such as metal and graphite.
  • the shielding cover 12 refers to a cover structure with a shielding effect. In order to make the shielding cover 12 have a shielding effect, the shielding cover 12 should be partially or entirely made of conductive materials such as metal and graphite.
  • the shielding film 13 refers to a film structure with a shielding effect. In order for the shielding film 13 to have a shielding effect, the shielding film 13 should be partially or entirely made of conductive materials such as metal and graphite.
  • the shielding frame 11, the shielding cover 12, and the shielding film 13 may be electrically conductive or insulated from each other, which is not specifically limited here.
  • the shielding case 1 is applied to the electronic device 3, and the shielding frame 11, the shielding cover 12 and the shielding film 13 are insulated, in order to make the shielding case 1 play a shielding role, the shielding frame 11, the shielding cover 12 and the shielding film 13 Should be connected to the ground on the circuit board 2.
  • the shielding cover 12 and the shielding film 13 are mutually conductive, in order to make the shielding case 1 play a shielding role, only the second end of the shielding frame 11 200 (that is, one end of the shield frame 11 connected to the circuit board 2) can be connected to the ground on the circuit board 2, so the grounding structure is simple and easy to implement.
  • the shielding cover 1 in order for the shielding cover 1 to be applied to the electronic device 3, the internal shielding frame 11, the shielding cover 12 and the shielding film 13 are mutually conductive.
  • the shielding cover 12 When the shielding cover 12 is detachably covered on the first part of the shielding frame 11 When the end surface of one end 100 is in contact, the shield cover 12 and the end surface of the first end 100 of the shield frame 11 are in contact and conduction, and the shield cover 12 and the shield film 13 are conductive through conductive glue, solder or direct contact.
  • the outer surface of the shield cover 12 refers to the surface of the shield cover 12 away from the cavity 14 when the shield cover 12 is detachably covered on the end surface of the first end 100 of the shield frame 11.
  • the shielding cover 1 provided by the embodiment of the present application includes a shielding frame 11, a shielding cover 12, and a shielding film 13; the shielding frame 11 has a first end 100 and a second end 200 opposite to each other, and the shielding frame 11 encloses There is a cavity 14 penetrating the end surface of the first end 100 and the end surface of the second end 200, and the shielding cover 12 is used to detachably cover the end surface of the first end 100.
  • FIG. 4 FIG. 5 or FIG.
  • the end surface of the second end 200 of the shield frame 11 is first fixed on the circuit board 2, and the electronic components 3 on the circuit board 2 are contained in the cavity 14, and then the shield cover 12 is covered on the shield frame 11.
  • the electronic device 3 is covered in the cavity 14 to shield the electronic device 3.
  • the shielding cover 12 is provided with an opening 15 at a position corresponding to the cavity 14, the shielding film 13 covers the opening 15 of the outer surface of the shielding cover 12, and the shielding film 13 is fixedly connected to the edge of the shielding cover 12 at the opening 15, so
  • the height of the shielding case 1 is constant, the height of the internal space of the shielding case 1 is affected by the thickness of the shielding film 13.
  • the wall thickness of the middle shielding cover 12, the thickness of the shielding film 13 in the embodiment of the present application can be designed to be thin, so that the height of the inner space of the shielding case 1 can be increased, so that the inside of the shielding case 1 can be arranged with a larger height of electronics Device 3.
  • the shielding case 1 used in the electronic device of the embodiment of the present application is the same as the shielding case 1 described in the above embodiment, the two can solve the same technical problems and achieve the same expected effects.
  • the shielding film 13 includes an insulating substrate 131 and a metal layer 132 formed on the insulating substrate 131. Since the material price of the metal layer 132 is relatively high, and in the embodiment of the present application, the shielding film 13 uses the insulating substrate 131 as the base film to form the metal layer 132. The thickness of the metal layer 132 can be set very thin. With less materials, the material cost of the shielding film 13 can be reduced.
  • the metal layer 132 may be located on the side of the insulating substrate 131 away from the opening 15 or on the side of the insulating substrate 131 close to the opening 15, which is not specifically limited here.
  • the metal layer 132 is located on the side of the insulating substrate 131 close to the opening 15, so that the metal layer 132 and The edges of the shielding cover 12 at the opening 15 are opposite or in direct contact, which facilitates the conductive connection of the metal layer 132 to the edges of the shielding cover 12 at the opening 15 through solder, conductive glue or direct contact.
  • the material of the insulating substrate 131 is polyimide or polyester film
  • the material of the metal layer 132 is copper.
  • Polyimide and polyester films have high toughness, high temperature resistance and friction resistance, and can improve the structural strength of the insulating substrate 131. Copper has better conductivity and can improve the shielding effect of the metal layer 132.
  • the shielding film 13 is a metal film.
  • the shielding film 13 of this structure has a simple structure and is easy to manufacture.
  • the material of the shielding film 13 may be copper, aluminum, stainless steel, etc., which is not specifically limited herein. In some embodiments, the material of the shielding film 13 is copper. Copper has better electrical conductivity and can improve the shielding effect of the shielding film 13.
  • the shielding film 13 and the edge of the shielding cover 12 at the opening 15 are fixedly connected by welding. After the welding method is fixed, the structural stability is good, and the shielding film 13 and the edge of the shielding cover 12 at the opening 15 Can conduct electricity between.
  • the shielding film 13 is a metal film
  • the shielding film 13 and the edge of the shielding cover 12 at the opening 15 can be fixedly connected by laser spot welding.
  • the laser spot welding method does not require solder filling, the welding speed is high, and the connection is reliable. , The deformation of the workpiece is small, and the shape is beautiful.
  • the shielding film 13 includes an insulating substrate 131 and a metal layer 132 formed on the insulating substrate 131, the shielding film 13 and the edge of the shielding cover 12 at the opening 15 can be fixedly connected by reflow soldering.
  • the shielding film 13 and the edge of the shielding cover 12 at the opening 15 are fixedly connected by conductive glue.
  • conductive glue used for the fixed connection, heating is not required, the operation is simple, convenient, and the risk is low, and the shielding film 13 and the edge of the shielding cover 12 at the opening 15 can also be electrically conductive.
  • the outer surface of the shielding cover 12 is provided with a sink groove 16 at a position corresponding to the opening 15, and the shielding film 13 is located in the sink groove 16. In this way, it can be avoided that the shielding film 13 protrudes from the outer surface of the shielding cover 12 to affect the appearance of the shielding cover 12.
  • the depth of the sink groove 16 may be equal to or greater than the thickness of the shielding film 13, which is not specifically limited here.
  • the outer surface of the shielding film 13 is flush with the outer surface of the shielding cover 12.
  • the depth of the sink groove 16 is equal to the thickness of the shielding film 13, which can prevent the shielding film 13 from protruding from the outer surface of the shielding cover 12 and affecting the appearance of the shielding cover 12.
  • the shielding cover 1 can be made to have a larger height inside. Space, so that the inside of the shielding case 1 can be arranged with a relatively large height of electronic devices 3.
  • the shielding cover 12 and the first end 100 of the shielding frame 11 can be detachably connected through a screw thread or a clamping structure, which is not specifically limited here.
  • the shielding cover 12 includes a top wall 121 and a side wall 122 arranged around the edge of the inner surface of the top wall 121.
  • the inner surface of the top wall 121 and the side wall 122 The inner surface of the shield frame 11 encloses a slot, and the first end 100 of the shield frame 11 can be clipped into the slot.
  • the shielding cover 12 can be detachably connected to the first end 100 of the shielding frame 11 in a snap-fitting manner.
  • the installation and disassembly operations between the two components connected by the snap-fitting manner are simple and efficient, thereby improving the shielding cover. Installation and removal efficiency between 12 and shield frame 11.
  • the inner surface of the top wall 121 refers to the surface of the top wall 121 close to the cavity 14 when the shield cover 12 is detachably covered on the end surface of the first end 100 of the shield frame 11; the inner surface of the side wall 122 It refers to the surface of the side wall 122 that is in contact with the inner surface of the top wall 121.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

本申请实施例提供一种屏蔽罩和电子设备，涉及电子设备技术领域，能够提高屏蔽罩的内部空间高度，以使屏蔽罩的内部可以布局具有较大高度的电子器件。该屏蔽罩包括屏蔽框、屏蔽盖和屏蔽膜；屏蔽框具有相对的第一端和第二端，屏蔽框围成有贯穿第一端的端面和第二端的端面的空腔，屏蔽盖用于可拆卸覆盖第一端的端面，且屏蔽盖上对应空腔的位置设有开口，屏蔽膜覆盖于屏蔽盖的外表面的开口处，且屏蔽膜与开口处的屏蔽盖边沿固定连接。本申请实施例提供的屏蔽罩用于电路板上的电子器件。

Description

一种屏蔽罩和电子设备
本申请要求于2019年07月29日提交国家知识产权局、申请号为201910699642.8、发明名称为“一种终端屏蔽罩和终端”的中国专利申请，以及于2019年8月27日提交国家知识产权局、申请号为201921415762.2、发明名称为“一种屏蔽罩和电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子设备技术领域，尤其涉及一种屏蔽罩和电子设备。
背景技术
手机及其他电子设备的电路板上，不同功能单元的电子器件之间若无屏蔽结构，则高频、低频电路之间由于电磁辐射会产生相互干扰，影响电子设备的正常运行。增加屏蔽结构后，可以防止屏蔽结构内部电路向外辐射电磁波及屏蔽结构外部电磁波进入其内部，从而达到不影响周围其他电路且不受周围电路影响的效果。
图1为现有技术中的一种屏蔽罩，如图1所示，屏蔽罩包括屏蔽框01和屏蔽盖02，屏蔽框01具有第一表面001以及背离该第一表面001的第二表面002，屏蔽框01围成有贯穿第一表面001和第二表面002的空腔03，如图2所示，屏蔽框01的第一表面001焊接于电路板04上，电路板04上的电子器件05容纳于空腔03内，屏蔽盖02扣合于屏蔽框01的第二表面002，以将电子器件05罩设于空腔03内，当屏蔽罩的总高度一定时，屏蔽罩内部空间的高度有限，从而限制了屏蔽罩内部可布局的电子器件的高度。
发明内容
本申请的实施例提供一种屏蔽罩和电子设备，能够提高屏蔽罩的内部空间高度，以使屏蔽罩的内部可以布局具有较大高度的电子器件。
为达到上述目的，本申请的实施例采用如下技术方案：
第一方面，本申请实施例提供一种屏蔽罩，包括屏蔽框、屏蔽盖和屏蔽膜；屏蔽框具有相对的第一端和第二端，屏蔽框围成有贯穿第一端的端面和第二端的端面的空腔，屏蔽盖用于可拆卸覆盖第一端的端面，且屏蔽盖上对应空腔的位置设有开口，屏蔽膜覆盖于屏蔽盖的外表面的开口处，且屏蔽膜与开口处的屏蔽盖边沿固定连接。
由于本申请实施例提供的屏蔽罩包括屏蔽框、屏蔽盖和屏蔽膜，屏蔽框具有相对的第一端和第二端，屏蔽框围成有贯穿第一端的端面和第二端的端面的空腔，屏蔽盖用于可拆卸覆盖第一端的端面，因此，在使用屏蔽罩时，可以将屏蔽框的第二端的端面固定于电路板上，并将电路板上的电子器件容纳于空腔内，然后将屏蔽盖覆盖于屏蔽框的第一端的端面上，以将电子器件罩设于空腔内，从而对电子器件起到屏蔽作用。又由于屏蔽盖上对应空腔的位置设有开口，屏蔽膜覆盖于屏蔽盖的外表面的开口处，且屏蔽膜与开口处的屏蔽盖边沿固定连接，因此，当屏蔽罩的高度一定时，屏蔽罩内部空间的高度受屏蔽膜的厚度的影响，屏蔽膜越薄，屏蔽罩内部空间的高度越大，相比于现有技术中屏蔽盖的壁厚，本申请实施例中屏蔽膜的厚度可以设计得较薄，因此 能够提高屏蔽罩的内部空间的高度，使屏蔽罩的内部可以布局具有较大高度的电子器件。
结合第一方面，在第一方面的第一种可选实现方式中，屏蔽膜包括绝缘基材和形成于绝缘基材上的金属层。由于金属层的材料价格通常较高，而在本申请实施例中，屏蔽膜采用绝缘基材作为基膜来成型金属层，金属层的厚度可以设置得非常薄，金属层的用料较少，因此可以降低屏蔽膜的用料成本。
结合第一方面的第一种可选实现方式，在第一方面的第二种可选实现方式中，绝缘基材的材料为聚酰亚胺或聚酯薄膜，金属层的材料为铜。聚酰亚胺和聚酯薄膜的韧性较高，且耐高温，耐摩擦，能够提高绝缘基材的结构强度。铜的导电性能较优，能够提高金属层的屏蔽效果。
结合第一方面，在第一方面的第三种可选实现方式中，屏蔽膜为金属膜。此结构的屏蔽膜结构简单，容易制作。
结合第一方面的第三种可选实现方式，在第一方面的第四种可选实现方式中，屏蔽膜的材料为铜。铜的导电性能较优，能够提高屏蔽膜的屏蔽效果。
结合第一方面至第一方面的第四种可选实现方式中任一种可选实现方式，在第一方面的第五种可选实现方式中，屏蔽膜与开口处的屏蔽盖边沿之间通过焊接方式固定连接。通过焊接方式进行固定连接，连接的稳定性较好。
结合第一方面的第三种或第四种可选实现方式，在第一方面的第六种可选实现方式中，屏蔽膜与开口处的屏蔽盖边沿之间通过激光点焊方式固定连接。激光点焊方式不需要填充焊料，焊接速度高，接点可靠，工件变形小，成型美观。
结合第一方面至第一方面的第四种可选实现方式中任一种可选实现方式，在第一方面的第七种可选实现方式中，屏蔽膜与开口处的屏蔽盖边沿之间通过导电胶固定连接。在采用导电胶进行固定连接时，无需加热，操作简单，方便。
结合第一方面至第一方面的第七种可选实现方式中任一种可选实现方式，在第一方面的第八种可选实现方式中，屏蔽盖的外表面对应开口的位置设有沉槽，屏蔽膜位于该沉槽内。这样，可以避免屏蔽膜因凸出屏蔽盖的外表面而影响屏蔽盖的外观。
结合第一方面的第八种可选实现方式，在第一方面的第九种可选实现方式中，屏蔽膜的外表面与屏蔽盖的外表面平齐。这样，可以避免屏蔽膜因凸出屏蔽盖的外表面而影响屏蔽盖的外观，同时，可以使屏蔽罩具有较大高度的内部空间，从而使屏蔽罩的内部可以布局具有较大高度的电子器件。
结合第一方面至第一方面的第九种可选实现方式中任一种可选实现方式，在第一方面的第十种可选实现方式中，屏蔽盖包括顶壁和围绕该顶壁的内表面的边沿一周设置的侧壁，顶壁的内表面与侧壁的内表面围成卡槽，屏蔽框的第一端能够卡接于卡槽内。这样，屏蔽盖可以采用扣合方式可拆卸连接于屏蔽框的第一端，采用扣合方式连接的两个部件之间的安装拆卸操作简单，效率较高，由此能够提高屏蔽盖与屏蔽框之间的安装和拆卸效率。
第二方面，本申请实施例提供一种电子设备，包括电路板、电子器件和屏蔽罩，电子器件连接于电路板上，屏蔽罩为如上任一技术方案所述的屏蔽罩，屏蔽罩的屏蔽框的第二端的端面固定于电路板上，电子器件位于屏蔽框的空腔内，屏蔽罩的屏蔽盖 可拆卸覆盖于屏蔽框的第一端的端面上。
由于在本申请实施例的电子设备中使用的屏蔽罩与如上任一技术方案所述的屏蔽罩相同，因此二者能够解决相同的技术问题，并达到相同的预期效果。
附图说明
图1为现有技术提供的一种屏蔽罩的结构示意图；
图2为现有技术提供的一种电子设备的结构示意图；
图3为本申请实施例提供的一种屏蔽罩的结构示意图；
图4为本申请实施例提供的第一种电子设备的结构示意图；
图5为本申请实施例提供的第二种电子设备的结构示意图；
图6为本申请实施例提供的第三种电子设备的结构示意图。
具体实施方式
本申请实施例提供一种电子设备，如图4、图5或图6所示，包括电路板2、电子器件3和屏蔽罩1，电子器件3连接于电路板2上，图3为本申请实施例提供的一种屏蔽罩1，屏蔽罩1包括屏蔽框11、屏蔽盖12和屏蔽膜13；屏蔽框11具有相对的第一端100和第二端200，屏蔽框11围成有贯穿第一端100的端面和第二端200的端面的空腔14，如图4、图5或图6所示，屏蔽框11的第二端200的端面固定于电路板2上，电子器件3位于空腔14内，屏蔽盖12可拆卸覆盖于屏蔽框11的第一端100的端面，且屏蔽盖12上对应空腔14的位置设有开口15，屏蔽膜13覆盖于屏蔽盖12的外表面的开口15处，且屏蔽膜13与开口15处的屏蔽盖12边沿固定连接。
在上述实施例中，屏蔽框11是指具有屏蔽作用的框体结构，为了使屏蔽框11具有屏蔽作用，屏蔽框11应部分或者全部由金属、石墨等导电材料制作。屏蔽盖12是指具有屏蔽作用的盖体结构，为了使屏蔽盖12具有屏蔽作用，屏蔽盖12应部分或者全部由金属、石墨等导电材料制作。屏蔽膜13是指具有屏蔽作用的膜结构，为了使屏蔽膜13具有屏蔽作用，屏蔽膜13应部分或者全部由金属、石墨等导电材料制作。
当屏蔽罩1应用于电路板2上的电子器件3时，屏蔽框11、屏蔽盖12和屏蔽膜13三者之间可以相互导电，也可以相互绝缘，在此不做具体限定。当屏蔽罩1应用于电子器件3，且屏蔽框11、屏蔽盖12和屏蔽膜13三者之间绝缘时，为了使屏蔽罩1起到屏蔽作用，屏蔽框11、屏蔽盖12和屏蔽膜13应分别连接电路板2上的地。当屏蔽罩1应用于电子器件3，且屏蔽框11、屏蔽盖12和屏蔽膜13三者之间相互导电时，为了使屏蔽罩1起到屏蔽作用，只需将屏蔽框11的第二端200(也即是屏蔽框11连接电路板2的一端)与电路板2上的地连接即可，因此接地结构简单，容易实现。具体的，为了使屏蔽罩1在应用于电子器件3时，其内部的屏蔽框11、屏蔽盖12和屏蔽膜13三者之间相互导电，当屏蔽盖12可拆卸覆盖于屏蔽框11的第一端100的端面时，屏蔽盖12与屏蔽框11的第一端100的端面之间接触导电，屏蔽盖12与屏蔽膜13之间通过导电胶、焊料或者直接接触导电。
需要说明的是，屏蔽盖12的外表面是指当屏蔽盖12可拆卸覆盖于屏蔽框11的第一端100的端面上时，屏蔽盖12远离空腔14的表面。
如图3所示，由于本申请实施例提供的屏蔽罩1包括屏蔽框11、屏蔽盖12和屏蔽膜13；屏蔽框11具有相对的第一端100和第二端200，屏蔽框11围成有贯穿第一 端100的端面和第二端200的端面的空腔14，屏蔽盖12用于可拆卸覆盖第一端100的端面，在使用屏蔽罩1时，如图4、图5或图6所示，首先将屏蔽框11的第二端200的端面固定于电路板2上，并将电路板2上的电子器件3容纳于空腔14内，然后将屏蔽盖12覆盖于屏蔽框11的第一端100的端面上，以将电子器件3罩设于空腔14内，从而对电子器件3起到屏蔽作用。又由于屏蔽盖12上对应空腔14的位置设有开口15，屏蔽膜13覆盖于屏蔽盖12的外表面的开口15处，且屏蔽膜13与开口15处的屏蔽盖12边沿固定连接，因此，当屏蔽罩1的高度一定时，屏蔽罩1内部空间的高度受屏蔽膜13的厚度的影响，屏蔽膜13的厚度越小，屏蔽罩1内部空间的高度越大，相比于现有技术中屏蔽盖12的壁厚，本申请实施例中屏蔽膜13的厚度可以设计得较薄，因此能够提高屏蔽罩1的内部空间的高度，使屏蔽罩1的内部可以布局具有较大高度的电子器件3。
由于在本申请实施例的电子设备中使用的屏蔽罩1与如上实施例所述的屏蔽罩1相同，因此二者能够解决相同的技术问题，并达到相同的预期效果。
在一些实施例中，如图5所示，屏蔽膜13包括绝缘基材131和形成于绝缘基材131上的金属层132。由于金属层132的材料价格较高，而在本申请实施例中，屏蔽膜13采用绝缘基材131作为基膜来成型金属层132，金属层132的厚度可以设置得非常薄，金属层132的用料较少，因此可以降低屏蔽膜13的用料成本。
在上述实施例中，金属层132可以位于绝缘基材131远离开口15的一侧，也可以位于绝缘基材131靠近开口15的一侧，在此不做具体限定。但是，为了实现屏蔽膜13与屏蔽盖12之间的导电连接，在一些实施例中，如图5所示，金属层132位于绝缘基材131靠近开口15的一侧，这样，金属层132与开口15处的屏蔽盖12边沿相对或者直接接触，便于通过焊料、导电胶或者直接接触将金属层132导电连接于开口15处的屏蔽盖12边沿。
在一些实施例中，绝缘基材131的材料为聚酰亚胺或聚酯薄膜，金属层132的材料为铜。聚酰亚胺和聚酯薄膜的韧性较高，且耐高温，耐摩擦，能够提高绝缘基材131的结构强度。铜的导电性能较优，能够提高金属层132的屏蔽效果。
在另一些实施例中，如图6所示，屏蔽膜13为金属膜。此结构的屏蔽膜13结构简单，容易制作。
在上述实施例中，屏蔽膜13的材料可以为铜、铝、不锈钢等，在此不做具体限定。在一些实施例中，屏蔽膜13的材料为铜。铜的导电性能较优，能够提高屏蔽膜13的屏蔽效果。
在一些实施例中，屏蔽膜13与开口15处的屏蔽盖12边沿之间通过焊接方式固定连接，焊接方式固定后的结构稳定性好，且使屏蔽膜13与开口15处的屏蔽盖12边沿之间能够导电。具体的，当屏蔽膜13为金属膜时，屏蔽膜13与开口15处的屏蔽盖12边沿之间可以采用激光点焊方式固定连接，激光点焊方式不需要填充焊料，焊接速度高，接点可靠，工件变形小，成型美观。当屏蔽膜13包括绝缘基材131和形成于绝缘基材131上的金属层132时，屏蔽膜13与开口15处的屏蔽盖12边沿之间可以采用回流焊方式固定连接。
在另一些实施例中，屏蔽膜13与开口15处的屏蔽盖12边沿之间通过导电胶固定 连接。在采用导电胶进行固定连接时，无需加热，操作简单，方便，危险性较低，同样能够使屏蔽膜13与开口15处的屏蔽盖12边沿之间进行导电。
在一些实施例中，如图5或图6所示，屏蔽盖12的外表面对应开口15的位置设有沉槽16，屏蔽膜13位于该沉槽16内。这样，可以避免屏蔽膜13因凸出屏蔽盖12的外表面而影响屏蔽盖12的外观。
在上述实施例中，沉槽16的深度可以与屏蔽膜13的厚度相等，也可以大于屏蔽膜13的厚度，在此不做具体限定。在一些实施例中，如图6所示，屏蔽膜13的外表面与屏蔽盖12的外表面平齐。这样，沉槽16的深度与屏蔽膜13的厚度相等，可以避免屏蔽膜13因凸出屏蔽盖12的外表面而影响屏蔽盖12的外观，同时，可以使屏蔽罩1具有较大高度的内部空间，从而使屏蔽罩1的内部可以布局具有较大高度的电子器件3。
屏蔽盖12与屏蔽框11的第一端100之间可以通过螺纹或者卡接结构可拆卸连接，在此不做具体限定。在一些实施例中，如图5或图6所示，屏蔽盖12包括顶壁121和围绕该顶壁121的内表面的边沿一周设置的侧壁122，顶壁121的内表面与侧壁122的内表面围成卡槽，屏蔽框11的第一端100能够卡接于卡槽内。这样，屏蔽盖12可以采用扣合方式可拆卸连接于屏蔽框11的第一端100，采用扣合方式连接的两个部件之间的安装拆卸操作简单，效率较高，由此能够提高屏蔽盖12与屏蔽框11之间的安装和拆卸效率。
需要说明的是，顶壁121的内表面是指当屏蔽盖12可拆卸覆盖于屏蔽框11的第一端100的端面上时，顶壁121靠近空腔14的表面；侧壁122的内表面是指侧壁122上与顶壁121的内表面相接的表面。
在本说明书的描述中，具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
最后应说明的是：以上实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围。

Claims (10)

  1. 一种屏蔽罩，其特征在于，包括屏蔽框、屏蔽盖和屏蔽膜；
    所述屏蔽框具有相对的第一端和第二端，所述屏蔽框围成有贯穿所述第一端的端面和所述第二端的端面的空腔，所述屏蔽盖用于可拆卸覆盖所述第一端的端面，且所述屏蔽盖上对应所述空腔的位置设有开口，所述屏蔽膜覆盖于所述屏蔽盖的外表面的所述开口处，且所述屏蔽膜与所述开口处的所述屏蔽盖边沿固定连接。
  2. 根据权利要求1所述的屏蔽罩，其特征在于，所述屏蔽膜包括绝缘基材和形成于所述绝缘基材上的金属层。
  3. 根据权利要求2所述的屏蔽罩，其特征在于，所述绝缘基材的材料为聚酰亚胺或聚酯薄膜，所述金属层的材料为铜。
  4. 根据权利要求1所述的屏蔽罩，其特征在于，所述屏蔽膜为金属膜。
  5. 根据权利要求4所述的屏蔽罩，其特征在于，所述屏蔽膜的材料为铜。
  6. 根据权利要求1～5中任一项所述的屏蔽罩，其特征在于，所述屏蔽膜与所述开口处的所述屏蔽盖边沿之间通过焊接方式固定连接。
  7. 根据权利要求1～6中任一项所述的屏蔽罩，其特征在于，所述屏蔽盖的外表面对应所述开口的位置设有沉槽，所述屏蔽膜位于所述沉槽内。
  8. 根据权利要求7所述的屏蔽罩，其特征在于，所述屏蔽膜的外表面与所述屏蔽盖的外表面平齐。
  9. 根据权利要求1～8中任一项所述的屏蔽罩，其特征在于，所述屏蔽盖包括顶壁和围绕所述顶壁的内表面的边沿一周设置的侧壁，所述顶壁的内表面与所述侧壁的内表面围成卡槽，所述屏蔽框的第一端能够卡接于所述卡槽内。
  10. 一种电子设备，其特征在于，包括电路板、电子器件和屏蔽罩，所述电子器件连接于所述电路板上，所述屏蔽罩为权利要求1～9中任一项所述的屏蔽罩，所述屏蔽罩的屏蔽框的第二端的端面固定于所述电路板上，所述电子器件位于所述屏蔽框的空腔内，所述屏蔽罩的屏蔽盖可拆卸覆盖于所述屏蔽框的第一端的端面上。
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CN202435781U (zh) * 2011-12-27 2012-09-12 华为终端有限公司 终端及其电磁屏蔽罩
US20140071634A1 (en) * 2012-09-07 2014-03-13 David A. PAKULA Electronic Device Subassemblies
CN104427841A (zh) * 2013-09-09 2015-03-18 联想(北京)有限公司 屏蔽装置
CN107787176A (zh) * 2017-10-19 2018-03-09 广东欧珀移动通信有限公司 屏蔽罩、电路板组件及移动终端

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CN202435781U (zh) * 2011-12-27 2012-09-12 华为终端有限公司 终端及其电磁屏蔽罩
US20140071634A1 (en) * 2012-09-07 2014-03-13 David A. PAKULA Electronic Device Subassemblies
CN104427841A (zh) * 2013-09-09 2015-03-18 联想(北京)有限公司 屏蔽装置
CN107787176A (zh) * 2017-10-19 2018-03-09 广东欧珀移动通信有限公司 屏蔽罩、电路板组件及移动终端

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