WO2021014703A1 - Mounting board manufacturing system, mounting board manufacturing method, and consistency assessment device - Google Patents

Abstract

This mounting board manufacturing system has a consistency assessment unit, a component mounting device, and a mounted component inspection device. The consistency assessment unit confirms whether production data given in advance and inspection data are consistent with each other. The production data is used when mounting a component on a board, and the inspection data is used when inspecting the mounted state of the component. The component mounting device mounts the component on the board on the basis of production data for which consistency has been confirmed by the consistency assessment unit to be satisfactory. The mounted component inspection device inspects the mounted state of the component mounted on the board by the component mounting device, the inspection being performed on the basis of inspection data for which consistency has been confirmed to be satisfactory.

Description

Mounting board manufacturing system, mounting board manufacturing method, and consistency judgment device

The present disclosure relates to a mounting board manufacturing system and a mounting board manufacturing method for manufacturing a mounting board by mounting components on a board, and a device (consistency judgment device) for judging the consistency of data used in the mounting board manufacturing system.

A mounting board manufacturing system that mounts electronic components on a board to manufacture a mounting board is configured by connecting a plurality of component mounting devices such as a solder printing device, a component mounting device, and a reflow device. In a mounting board manufacturing system having such a configuration, it is important to prevent mounting defects due to component mounting position deviation in the component mounting device. For the purpose of preventing such mounting defects, a position correction technique is used in which component mounting misalignment information indicating component misalignment on a component mounting board is fed back to the previous process. In the position correction based on such feedback, the inspection device actually measures and obtains the component mounting position after the component is mounted, and sends the component mounting deviation to the component mounting device in the previous process. Then, the component mounting device corrects the mounting position based on the component mounting deviation information (see, for example, Patent Document 1). Patent Document 1 discloses a configuration in which an X-ray inspection device capable of measuring the positions of electrodes and bumps of parts on a substrate after mounting parts is arranged.

Japanese Unexamined Patent Publication No. 2018-82096

Various mounting board manufacturing systems have a configuration in which such component mounting misalignment information is fed back to the previous process from the beginning of equipment planning. On the other hand, there are many so-called retrofit-type mounting board manufacturing systems in which a feedback function is added later to existing equipment that does not have a feedback function. When the feedback function is retrofitted in this way, it is important that the mounting data as the production data used by the component mounting device in the component mounting operation and the inspection data used by the inspection device for mounting position deviation measurement are consistent. ..

That is, production data and inspection data are created individually for each device. Therefore, the recognition mark or component position coordinate indicated by the production data used by the component mounting device in the component mounting operation may not always exactly match the recognition mark or component position coordinate indicated by the inspection data used by the inspection device. In such a case, correct position correction is not performed even if the mounting position deviation measurement result by the inspection device is fed back to the component mounting device. As described above, when the feedback function is retrofitted in the mounting board manufacturing system in the prior art, the feedback position correction may not function effectively due to the consistency between the production data and the inspection data.

The present disclosure discloses a mounting board manufacturing system and mounting board manufacturing capable of ensuring consistency between production data and inspection data and allowing hoodback position correction to function correctly even when a feedback function is retrofitted in the mounting board manufacturing system. A method and a consistency determination device are provided.

The mounting board manufacturing system according to one aspect of the present disclosure includes a consistency determination unit, a component mounting device, and a mounted component inspection device. The consistency determination unit confirms the quality of the consistency between the production data given in advance and the inspection data given in advance. This production data is used when mounting the component on the board, and this inspection data is used when inspecting the mounting state of the component on the board. The component mounting device manufactures a mounting board by mounting components on a board based on production data confirmed by the consistency determination unit to have good consistency. The mounted component inspection device inspects the mounted state of the components mounted on the board by the component mounting device based on the inspection data confirmed to have good consistency.

In the mounting board manufacturing method according to one aspect of the present disclosure, a mounting board in which components are mounted on the board is manufactured. In this mounting board manufacturing method, it is confirmed whether or not the production data given in advance and the inspection data given in advance are consistent. This production data is used in a component mounting device that mounts components on a board. This inspection data is used in the mounted parts inspection device that inspects the mounted state of the parts mounted on the board by the component mounting device. Then, using the production data confirmed to have good consistency, the components are mounted on the board by the component mounting device. Further, using the inspection data confirmed to have good consistency, the mounted parts inspection device inspects the mounted state of the parts mounted on the board.

The consistency determination device according to one aspect of the present disclosure confirms the quality of the consistency between the production data given in advance and the inspection data given in advance. This production data is used in a component mounting device that mounts components on a board. This inspection data is used in the mounted parts inspection device that inspects the mounted state of the parts mounted on the board by the component mounting device.

According to the present disclosure, even when the feedback function is retrofitted in the mounting board manufacturing system, the hoodback position correction can function correctly by ensuring the consistency between the production data and the inspection data.

Configuration explanatory view of the mounting board manufacturing line included in the mounting board manufacturing system according to the embodiment of the present disclosure. Configuration explanatory view of the mounting board manufacturing system according to the embodiment of the present disclosure. Configuration explanatory view of the component mounting device included in the mounting board manufacturing line shown in FIG. Configuration explanatory view of the mounted component inspection device included in the mounting board manufacturing line shown in FIG. A block diagram showing the configuration of the control system of the mounting board manufacturing system shown in FIG. The figure which shows an example of the production data in the mounting board manufacturing system which concerns on embodiment of this disclosure. The figure which shows the production data table which represented the correspondence relationship between the recognition mark and the mounting point shown in FIG. 5A, and the coordinates of these recognition mark and the mounting point on the design data in a table format. The figure which shows an example of the inspection data in the mounting board manufacturing system which concerns on embodiment of this disclosure. A diagram showing an inspection data table showing the correspondence between the recognition mark and the mounting point and the coordinates shown in FIG. 6A in a table format. Explanatory drawing of quality determination of consistency between coordinate values of production data and inspection data in mounting board manufacturing system which concerns on embodiment of this disclosure, and repetition pattern In the mounting substrate manufacturing system according to the embodiment of the present disclosure, a diagram showing an example of good / bad determination of consistency when the substrate to be produced is an aggregate of a plurality of small substrates formed in the same pattern. A flowchart showing a production start process in the mounting board manufacturing method according to the embodiment of the present disclosure. A flowchart showing a data consistency determination process in the mounting board manufacturing method according to the embodiment of the present disclosure.

Next, an embodiment of the present disclosure will be described with reference to the drawings. First, the configuration of the mounting board manufacturing line L in the mounting board manufacturing system according to the present embodiment will be described with reference to FIG. The mounting board manufacturing line L has a function of manufacturing a mounting board in which components are mounted on the board. The mounting board manufacturing line L has a configuration in which a plurality of component mounting devices MM located upstream (left side in FIG. 1) and one mounted component inspection device MI located downstream of the component mounting device MM are arranged in series. Has. Here, three component mounting devices MM are exemplified. The plurality of component mounting devices MM and the component mounting device MM are arranged along the X axis. The Y-axis orthogonal to the X-axis indicates the depth of each device. The Z axis is along the vertical direction.

The component mounting device MM is numbered in order from the upstream as (# 1), (# 2), (# 3), so that each of the component mounting device MM can be identified. In the following description, when it is not necessary to distinguish a plurality of component mounting device MMs from each other, the numbers are omitted and they are collectively referred to as component mounting device MMs.

FIG. 2 shows the configuration of the mounting board manufacturing system 1 according to the embodiment of the present disclosure. The component mounting devices MM (# 1), MM (# 2), MM (# 3) and the mounted component inspection device MI are connected to each other by the communication network 4. As a result, data can be exchanged between the component mounting devices MM (# 1), MM (# 2), MM (# 3) and the mounted component inspection device MI. Further, the component mounting devices MM (# 1), MM (# 2), MM (# 3) and the mounted component inspection device MI are connected to the information management device 5, which is a higher-level system, via the communication network 4. As a result, data can be exchanged between the component mounting devices MM (# 1), MM (# 2), MM (# 3), the mounted component inspection device MI, and the information management device 5.

With this configuration, the inspection result obtained by the mounted component inspection device MI is fed back to a plurality of upstream component mounting devices MM, and the component mounting operation in each of the component mounting device MM is corrected. That is, the inspection results acquired by the mounted component inspection device MI are the component mounting device MM (# 1), the component mounting device MM (# 2), and the component mounting device MM (# 3), as indicated by arrows e, f, and g. ) Are transmitted to each. Then, in the component mounting device MM (# 1), the component mounting device MM (# 2), and the component mounting device MM (# 3), each of them is based on the position of the component obtained by the inspection result by the mounted component inspection device MI. The component mounting device MM corrects the operation of mounting the component on the substrate 3.

As shown in FIG. 1, these mounting devices are provided with an in-device conveyor that connects these devices in series and conveys the substrate 3. The mounting board manufacturing line L includes a conveyor 2 configured by arranging in-device conveyors of each mounting device in series. The substrate 3 carried in from the upstream (arrow a) is sequentially transferred to each mounting device by the conveyor 2, and the substrate 3 on which the predetermined work has been performed is carried out downstream (arrow b) along the conveyor 2. In this way, the conveyor 2 is provided along the X-axis, and the substrate 3 is conveyed along the X-axis. The conveyor 2 sequentially carries the board 3 into a plurality of mounting devices including the component mounting device MM and the mounted component inspection device MI, and each mounting device is used for mounting a predetermined component on the board 3. Do the work.

Next, the schematic configuration and functions of the component mounting device MM and the mounted component inspection device MI will be described with reference to FIGS. 3A and 3B. First, the component mounting device MM will be described with reference to FIG. 3A. The component mounting device MM has a mounting head 11 arranged above the substrate 3 conveyed by the conveyor 2. The mounting head 11 has a suction nozzle (not shown) for holding the component. The mounting head 11 is movable by the head moving mechanism 10, and the mounting head 11 is provided with a substrate recognition camera 12 that moves integrally with the mounting head 11.

The mounting head 11 is mounted on the head elevating mechanism 102 mounted on the XY table 101. The XY table 101 and the head elevating mechanism 102 constitute the head moving mechanism 10. By driving the XY table 101, the mounting head 11 moves horizontally in a plane defined by the X-axis and the Y-axis. Further, by driving the head elevating mechanism 102, the mounting head 11 moves up and down with respect to the substrate 3. The substrate 3 is positioned and held in advance by the conveyor 2.

Parts supply units 13 such as tape feeders having a function of supplying parts are arranged on both sides of the conveyor 2 on the Y-axis. When the mounting head 11 executes the component mounting operation, the head moving mechanism 10 is driven, and the mounting head 11 takes out the components from each of the component supply units 13 and positions them on the conveyor 2 as shown by arrows c and d. The components are transferred and mounted on the held substrate 3. That is, the component mounting device MM executes the component mounting operation of mounting the component on the board.

In this component mounting operation, the board recognition camera 12 moves together with the mounting head 11. Then, the substrate recognition camera 12 photographs at least a part of the substrate 3 for position recognition of the substrate recognition mark provided on the substrate 3. The substrate recognition marks are, for example, the recognition marks Ma and Mb shown in FIG. 5A, which will be described later, and are designated in advance in the production data 21 shown in FIG. 5A. Then, referring to this position recognition result, the mounting head 11 mounts the component at the corrected mounting position of the substrate 3. That is, the component mounting device MM recognizes the board recognition mark specified in the production data 21 and mounts the component on the board 3.

Next, the mounted parts inspection device MI will be described with reference to FIG. 3B. The on-board component inspection device MI has an inspection head 15 arranged above the substrate 3 conveyed by the conveyor 2. The inspection head 15 has a function of inspecting the substrate 3 after mounting the components. The inspection head 15 includes a camera, a lighting device, a three-dimensional measuring device, and the like, and inspects the mounted state of the components on the post-mounting board sent from the component mounting device MM.

In the inspection of the mounted state, the inspection head 15 recognizes the board recognition mark provided on the board 3 and measures the position of the component. The substrate recognition marks are, for example, the recognition marks Ma and Mb shown in FIG. 6A, which will be described later, and are designated in advance in the inspection data 22 shown in FIG. 6A. That is, the mounted component inspection device MI has a function of inspecting the mounted state of the components mounted on the substrate 3 by the component mounting device MM. The inspection head 15 is movable in the directions along the X-axis and the Y-axis by the inspection head moving mechanism 14, and the mounted state of the component can be inspected at an arbitrary position on the substrate 3.

Next, the configuration of the control system of the mounting board manufacturing system 1 will be described with reference to FIG. The mounting board manufacturing system 1 has an information management device 5 included in a higher-level system of the mounting board manufacturing line L. The information management device 5 includes a storage unit 20. The storage unit 20 stores data and information used for various operations and processes executed on the mounting board manufacturing line L.

That is, the storage unit 20 stores the production data 21a, the production data 21b, and the production data 21c used for each of the board types A, B, and C in the component mounting device MM in the production of the mounting board, respectively. Further, the storage unit 20 stores the inspection data 22a, the inspection data 22b, and the inspection data 22c used for each of the substrate types A, B, and C in the mounted component inspection device MI, respectively. As described above, the mounted component inspection device MI inspects the mounted state of the components mounted on the substrate 3 by the component mounting device MM. Further, the storage unit 20 stores the inspection information 23 that summarizes the inspection results by the mounted component inspection device MI for each individual substrate. The production data 21a to 21c may be collectively referred to as the production data 21 as described above. Further, the inspection data 22a to 22c may also be collectively referred to as inspection data 22.

The production data 21a, production data 21b, and production data 21c are created mainly based on CAD (Computer Aided Design) data, which is design data of the mounting board, for use in the component mounting device MM, and are stored in the information management device 5. Has been done. On the other hand, the inspection data 22a, the inspection data 22b, and the inspection data 22c are created by using an image obtained by imaging the actual mounting board determined to be a non-defective product among the actually produced storage units 20. To.

That is, these two types of data are created individually and provided to the information management device 5 in advance. Therefore, even when the same substrate type is targeted, the production data 21a, production data 21b, and production data 21c do not always exactly match the inspection data 22a, inspection data 22b, and inspection data 22c in detail. In some cases, the data is not consistent with each other.

Therefore, when the component mounting operation with feedback correction is executed by using the production data 21a, the production data 21b, the production data 21c and the inspection data 22a, the inspection data 22b, and the inspection data 22c for which such consistency is not ensured as they are, A good feedback effect may not be obtained, and the mounting accuracy may decrease.

In order to suppress such inconvenience, in the mounting board manufacturing system 1, the information management device 5 has a consistency determination unit 24 and a data correction unit 25. The consistency determination unit 24 determines the consistency between the production data 21a and the inspection data 22a provided to the information management device 5, the consistency between the production data 21b and the inspection data 22b, and the consistency between the production data 21c and the inspection data 22c. Check the quality of.

Specifically, the consistency determination unit 24 has a function of confirming the quality of the consistency between the board recognition mark specified in the production data 21 and the board recognition mark specified in the inspection data 22. Alternatively, the consistency determination unit 24 has a function of confirming the quality of consistency between the mounting position (mounting point) of the component included in the production data 21 and the mounting position (mounting point) of the component included in the inspection data 22. .. The consistency determination unit 24 may have both of these functions.

In the above configuration, the consistency determination unit 24 confirms whether the production data 21 and the inspection data 22 are consistent. The production data 21 is used in the component mounting device MM that mounts the component on the substrate 3. The inspection data 22 is used in the mounted component inspection device MI that inspects the mounted state of the component mounted on the board 3 by the component mounting device MM. Therefore, the consistency determination unit 24 functions as a consistency determination device for determining the consistency of these data. In the present embodiment, as the consistency determination device, an example incorporated in the information management device 5 of the mounting board manufacturing system 1 as in the consistency determination unit 24 in FIG. 4 is shown, but the consistency in the present disclosure is shown. The determination device is not limited to this configuration.

That is, the consistency determination device may be configured by an external device having a data processing function such as a personal computer. That is, the consistency determination device may have a function of confirming the quality of the consistency between the production data 21 and the inspection data 22. Even the consistency determination device having such a simplified configuration has the same functions and effects as the consistency determination unit 24 shown in FIG. 4 in the present embodiment. The storage unit 20 is composed of a storage device such as one or more RAMs (random access memory) or a hard disk. The display unit 26 is composed of a display panel and a display device. The input unit 27 is composed of a touch panel, buttons, a keyboard, and the like. The consistency determination unit 24 and the data correction unit 25 are composed of a CPU (Central Processing Unit) and the like. These may be configured by another circuit or LSI (large-scale integrated circuit), or may be integrally configured.

The data correction unit 25 has a function of correcting either the production data 21 or the inspection data 22 so that the two are consistent when it is determined that the above-mentioned consistency is poor. The consistency determination and data correction processing are executed by using the display unit 26 which is a display panel provided in the information management device 5, the display function of the input unit 27 which is an input unit, and the input function. In this data correction, a method of correcting the production data 21 determined to be inconsistent so as to be consistent with the inspection data 22 is adopted. This is because the production data 21 is a digital value given by CAD data and can be easily modified.

Then, in the mounting board manufacturing line L, the mounting board is manufactured using the production data 21 (production data 21a, production data 21b, production data 21c, etc.) whose consistency is confirmed by the above-mentioned consistency determination unit 24. , Inspection data 22 (inspection data 22a, inspection data 22b, inspection data 22c, etc.) is used to inspect the mounting board.

Next, the control system of the component mounting device MM and the mounted component inspection device MI will be described. As shown in FIG. 2, the component mounting device MM and the mounted component inspection device MI are connected to the information management device 5 via the communication network 4 as described above. Therefore, various data stored in the storage unit 20 shown in FIG. 4 are downloaded to the component mounting device MM and the mounted component inspection device MI via the communication network 4 as needed.

As shown in FIG. 4, the component mounting device MM has a control unit 30 and a display / input unit 33. The control unit 30 has a function of controlling the operation of the component mounting device MM and various processes. The control unit 30 includes a storage unit 31 and a mounting processing unit 32. The storage unit 31 stores various programs and production data 21 for producing a mounting board. In the example shown here, the production data 21a for the substrate type A is stored.

The mounting processing unit 32 controls the head moving mechanism 10 and the mounting head 11 shown in FIG. 3A based on the program and the production data 21 stored in the storage unit 31. As a result, the mounting processing unit 32 causes the component mounting device MM to execute the component mounting process. The display / input unit 33 has a function of performing various displays such as notifications and command input necessary for the operation of the component mounting device MM. The control unit 30 and the mounting processing unit 32 are composed of a CPU and the like. These may be configured by another circuit or LSI, or may be configured integrally. The storage unit 31 is composed of a storage device such as one or more RAMs (random access memory) or a hard disk. The display / input unit 33 includes a display panel, a display device, a touch panel, buttons, a keyboard, and the like.

The mounted parts inspection device MI has a control unit 40 and a display / input unit 43. The control unit 40 has a function of controlling the operation of the mounted component inspection device MI and various processes. The control unit 40 includes a storage unit 41 and an inspection processing unit 42. Various programs and inspection data 22 for inspecting mounted parts are stored in the storage unit 41. In the example shown here, the inspection data 22a for the substrate type A and the inspection information 41a indicating the inspection result of inspecting the substrate are stored.

The inspection processing unit 42 controls the inspection head moving mechanism 14 and the inspection head 15 shown in FIG. 3B based on the program and the inspection data 22 stored in the inspection information 41a. As a result, the inspection processing unit 42 causes the mounted component inspection device MI to execute the mounted component inspection. The display / input unit 43 has a function of performing various displays such as notifications and command input necessary for the operation of the mounted component inspection device MI. The control unit 40 and the inspection processing unit 42 are composed of a CPU and the like. These may be configured by another circuit or LSI, or may be configured integrally. The storage unit 41 is composed of a storage device such as one or more RAMs (random access memory) or a hard disk. The display / input unit 43 includes a display panel, a display device, a touch panel, buttons, a keyboard, and the like.

Next, the production data 21 (21a) used in the component mounting operation by the component mounting device MM will be described with reference to FIGS. 5A and 5B. FIG. 5A shows the production data 21a as an example of the production data 21 of the substrate 3. In FIG. 5A, mounting points M1, M2, M3, and M4 on which the components P1, P2, P3, and P4 are mounted are set on the substrate 3.

In the component mounting device MM, in order to specify the positions of the mounting points M1, M2, M3, and M4, among the patterns formed at the predetermined positions of the substrate 3, a pair of patterns located diagonally opposite to each other is used. , Used as a pair of board recognition marks for position identification. In the example of FIG. 5A, the predetermined positions are the corner positions at the four corners, and the substrate recognition marks are shown as recognition marks Ma and Mb.

In FIG. 5A, as an example, a pair of circular patterns located at the upper left corner and the lower right corner are used as substrate recognition marks. In the example shown here, a pair of patterns (here, triangular patterns 3a and 3b) are formed on the upper right corner and the lower left corner on the substrate 3, and these patterns can also be used as the substrate recognition mark.

The production data 21a shown in FIG. 5A includes the recognition marks Ma and Mb on the substrate 3 and the coordinate values of the components P1 to P4 mounted on the substrate 3. That is, as shown in FIG. 5A, the recognition marks Ma and Mb correspond to the coordinates (MaXm, MaYm) and (MbXm, MbYm) on the X-axis and Y-axis along the lower side and the left side of the substrate 3, respectively. There is. Similarly, the mounting points M1, M2, M3, and M4 of the parts P1, P2, P3, and P4 correspond to (A1Xm, A1Ym), (A2Xm, A2Ym), (A3Xm, A3Ym), and (A4Xm, A4Ym), respectively. ing.

FIG. 5B is a production data table showing the correspondence between the recognition marks Ma, Mb and the mounting points M1, M2, M3, M4 and the coordinates of these recognition marks and the mounting points on the design data. The component mounting device MM executes the component mounting operation based on this production data table. In this production data table, the X coordinate 28b and the Y coordinate 28c are shown in association with each name 28a indicating the classification of the recognition marks Ma and Mb and the parts P1, P2, P3 and P4.

6A and 6B show inspection data used in the mounted part inspection by the mounted part inspection device MI. FIG. 6A shows the inspection data 22a as an example of the inspection data 22 of the substrate 3. FIG. 6A shows a state in which the components P1, P2, P3, and P4 are mounted on the mounting points M1, M2, M3, and M4, respectively, on the substrate 3.

In the mounted component inspection device MI, in order to specify the positions of the mounting points M1, M2, M3, and M4, a pair of patterns formed at predetermined positions on the substrate 3 are located diagonally opposite to each other. Is used as a pair of board recognition marks for position identification. In the example of FIG. 6A, the predetermined positions are the corner positions at the four corners, and the substrate recognition marks are shown as recognition marks Ma and Mb.

In FIG. 6A, as an example, a pair of circular patterns located at the upper left corner and the lower right corner are used as the substrate recognition marks. In the example shown here, a pair of patterns (here, triangular patterns 3a and 3b) are formed on the upper right corner and the lower left corner on the substrate 3, and these patterns can also be used as the substrate recognition mark.

The inspection data 22a shown in FIG. 6A includes the recognition marks Ma and Mb on the substrate 3 and the coordinate values of the components P1 to P4 mounted on the substrate 3. That is, as shown in FIG. 6A, the recognition marks Ma and Mb correspond to the coordinates (MaXc, MaYc) and (MbXc, MbYc) on the X-axis and Y-axis along the lower side and the left side of the substrate 3, respectively. .. Similarly, the mounting points M1, M2, M3, and M4 of the parts P1, P2, P3, and P4 correspond to (A1Xc, A1Yc), (A2Xc, A2Yc), (A3Xc, A3Yc), and (A4Xc, A4Yc), respectively. ing.

FIG. 6B is an inspection data table showing the correspondence between the recognition marks Ma and Mb and the mounting points M1, M2, M3 and M4 and the measured coordinates. The mounted component inspection device MI executes the mounted component inspection based on this inspection data table. In this inspection data table, the X coordinate 29b and the Y coordinate 29c are shown in association with each name 29a indicating the classification of the recognition marks Ma and Mb and the parts P1, P2, P3 and P4.

That is, in the mounting board manufacturing system 1, the mounting board manufacturing line L manufactures a mounting board by mounting components on the board 3. The mounting board manufacturing line L includes a component mounting device MM for mounting components on the board 3 based on the above-mentioned production data 21, and a component mounting device MM for mounting the components mounted on the board 3 based on the above-mentioned inspection data 22. It includes an on-board component inspection device MI that inspects the condition.

Coordinates of recognition marks Ma, Mb (MaXc, MaYc), (MbXc, MbYc), coordinates of mounting points M1, M2, M3, M4 (A1Xc, A1Yc), (A2Xc, A2Yc), (A3Xc, A3Yc) in the inspection data 22a. ) And (A4Xc, A4Yc) are coordinate data acquired from the result of imaging the actual product selected from the non-defective mounting substrate. Therefore, these coordinate values do not always match the corresponding coordinate values in the production data 21 created based on the design data.

In the feedback position correction method, the mounting position accuracy is improved by detecting the mounting position deviation in the mounted component inspection device after mounting the component and feeding back the detected position deviation error to the component mounting device. Therefore, in the feedback position correction method, it is essential that the consistency between the inspection data used in the mounted component inspection device and the production data used in the component mounting device is ensured.

Based on such a problem, the integrity determination method executed by the consistency determination unit 24 will be described with reference to FIGS. 7A and 7B. The determination condition (A) of FIG. 7A shows the quality determination of the consistency of the recognition mark Ma as an example of the substrate recognition mark. In this case, it is determined that the consistency of the recognition mark Ma is good if both the following conditions (1) and (2) are satisfied. Such a determination is also made for the recognition mark Mb.
Condition (1): The absolute value of the difference between the X coordinate (MaXm) of the recognition mark Ma in the production data 21 and the X coordinate (MaXc) of the recognition mark Ma in the inspection data 22 is the threshold value TH (MaXc) on the preset X axis. 1X) or less.
Condition (2): The absolute value of the difference between the Y coordinate (MaYm) of the recognition mark Ma in the inspection data 22 and the Y coordinate (MaYc) of the recognition mark Ma in the inspection data 22 is the threshold value TH (MaYc) on the preset Y axis. 1Y) or less.

The determination condition (B) of FIG. 7A shows the quality determination of the consistency of the mounting point M1 as an example of the mounting point of the component. In this case, it is determined that the consistency of the mounting point M1 is good if both the following conditions (3) and (4) are satisfied. Such a determination is made in the same manner for other mounting points.
Condition (3): The absolute value of the difference between the X coordinate (A1Xm) of the mounting point M1 in the production data 21 and the X coordinate (A1Xc) of the mounting point M1 in the inspection data 22 is the threshold value TH (A1Xc) on the preset X axis. 2X) or less.
Condition (4): The absolute value of the difference between the Y coordinate (A1Ym) of the mounting point M1 in the inspection data 22 and the Y coordinate (A1Yc) of the mounting point M1 in the inspection data 22 is the threshold value TH (A1Yc) on the preset Y axis. 2Y) or less.

FIG. 7B shows an example of determining whether the consistency is good or bad when the substrate 3 to be produced is an aggregate of a plurality of small substrates 3s formed in the same pattern. In this example, the substrate 3 has four rows of small substrates 3s along the X-axis and three rows along the Y-axis. The quality determination of consistency will be described with such a substrate 3. The arrangement position of each of the small substrates 3s is specified by the matrix coordinates [I, J]. I represents the column number in the direction along the X axis, and J represents the row number in the direction along the Y axis. The consistency determination unit 24 determines whether or not the designated order of work processing on the substrate 3 is consistent between the production data 21 and the inspection data 22. That is, the consistency determination unit 24 determines whether or not the designated order (repetition pattern) in which the plurality of small substrates 3s are repeatedly processed on the same substrate 3 is consistent between the production data 21 and the inspection data 22. To do. Specifically, the consistency determination unit 24 determines whether or not the consistency between the designated order of the small substrates 3s included in the production data 21 and the designated order of the small substrates 3s included in the inspection data 22 is good or bad.

In the example shown in FIG. 7B, the numbers attached to the upper matrix indicate the designated order according to the production data 21, and the numbers attached to the lower matrix indicate the designated order according to the inspection data 22. For example, in the upper matrix, the matrix coordinates of the small substrate 3s of the designated order 4 and in the lower matrix, the matrix coordinates of the small substrate 3s of the designated order 10 are [4,3]. In the quality judgment of the consistency of the designated order in such a case, first, the designated order of the small substrate specified by the matrix coordinates [I, J] in the production data 21 and the same matrix coordinates [I, J] in the inspection data 22. Compare with the specified order of the small substrates specified in. If the designated order of all the small substrates 3s is the same for the production data 21 and the inspection data 22, it is determined that the designated order is consistent (good), and if the designated order is not the same, the designated order is matched. Judged as having no sex (defective). In the example shown in FIG. 7B, the designated order is different except for the small substrate 3s having the matrix coordinates [1,3] and the small substrate 3s having the matrix coordinates [4,1]. Therefore, in this example, it is determined that the specified order is inconsistent.

The mounting board manufacturing system 1 according to the present embodiment is configured as described above. Hereinafter, a mounting board manufacturing method for manufacturing a mounting board on which components are mounted on the board 3 by the mounting board manufacturing system 1 will be described.

In this mounting board manufacturing method, first, the quality of the consistency between the production data 21 and the inspection data 22 is confirmed. As described above, the production data 21 is used in the component mounting device MM to mount the component on the substrate 3. The inspection data 22 is used in the mounted component inspection device MI in order to inspect the mounted state of the component mounted on the substrate 3 by the component mounting device MM. The confirmation of the quality of the consistency is executed by the function of the consistency determination unit 24 of the information management device 5.

Next, using the production data 21 and the inspection data 22 confirmed to have good consistency, the parts are mounted on the board 3 by the component mounting device MM, and the components mounted on the board 3 are mounted by the mounted component inspection device MI. Inspect the condition. By this inspection, the position of the component mounted on the substrate 3 is detected. The position of the detected component on the board 3 is fed back to the component mounting device MM, and the component mounting device MM performs an operation of mounting the component on the board 3 based on the position of the component measured by the mounted component inspection device MI. to correct.

In the component recognition in the feedback correction described above, the component mounting device MM recognizes the board recognition mark specified in the production data 21 and mounts the component on the board 3, and the mounted component inspection device MI is designated by the inspection data 22. The position of the component on the board 3 is measured by recognizing the board recognition mark. The consistency between the production data 21 and the inspection data 22 is confirmed by confirming the consistency between the board recognition mark designated by the production data 21 and the board recognition mark designated by the inspection data 22. Further, the consistency between the production data 21 and the inspection data 22 is confirmed by confirming the consistency between the mounting position of the component included in the production data 21 and the mounting position of the component included in the inspection data 22.

Further, as shown in FIG. 7B, when the substrate 3 is an aggregate of a plurality of small substrates 3s formed in the same pattern, the consistency between the production data 21 and the inspection data 22 is determined by the production data 21 and the inspection. It is confirmed by confirming the consistency of the designated order in the work process of the small substrate 3s included in the data 22. The consistency of the designated order in the work processing of the small substrate 3s is the consistency of the repetition pattern when a plurality of small substrates 3s are repeatedly targeted for work.

Next, the production start process in the mounting board manufacturing method executed in the mounting board manufacturing system 1 will be described with reference to FIG. The process shown in FIG. 8 is executed by the information management device 5. Note that FIG. 8 shows an example in which the substrate 3 is a multi-layered substrate having a repeating pattern in which a plurality of small substrates 3s are combined. First, prior to the start of production, a pre-production check process is executed (ST1). Specifically, it is checked whether or not there is a factor that hinders the normal execution of production in the state of each device constituting the mounting board manufacturing line L. This check item includes the quality of consistency of the above-mentioned production data 21 and inspection data 22 in addition to the normal inspection items such as confirmation of model switching work accompanying switching to a production type and inspection of safety confirmation items. ing.

If it is determined that there is no abnormality in all the items in the above-mentioned pre-production check process, a pass judgment is made in the pass / fail judgment for the substrate 3 of the product type to be produced (ST2). Then, a production start command is issued for the substrate 3 for which the acceptance is determined without any abnormality (ST3).

On the other hand, with respect to the failed substrate 3 determined to have an abnormality in ST2, it is determined whether or not it corresponds to the mismatch of the repeating patterns (ST4). That is, by the determination method shown in FIG. 7B, it is determined whether or not the production data 21 and the inspection data 22 have the same designated order in the repetition pattern. If it is determined that the repeating patterns do not match, the warning process 1 is executed (ST5). Specifically, the display unit 26 (see FIG. 4) indicates that the designated order of the repetition pattern does not match between the production data 21 and the inspection data 22.

If it does not correspond to the mismatch of the repetition pattern in ST4, it is judged whether or not it corresponds to the mismatch of the recognition mark (ST6). That is, according to the determination condition (1) of FIG. 7A, it is determined whether or not the absolute value of the position error between the recognition marks in the corresponding relationship is equal to or less than the preset determination threshold value. When it is determined that the absolute value of the position error exceeds the determination threshold value, the warning process 2 is executed (ST7). Specifically, the display unit 26 displays that the recognition mark does not match between the production data 21 and the inspection data 22.

If it does not correspond to the mismatch of the recognition marks in ST6, it is determined whether or not it corresponds to the mismatch of the coordinate data (ST8). That is, according to the determination condition (2) of FIG. 7A, it is determined whether or not the absolute value of the position error between the corresponding mounting points is equal to or less than the preset determination threshold value. When it is determined that the absolute value of the position error exceeds the determination threshold value, the warning process 3 is executed (ST9). Specifically, the display unit 26 displays that the coordinate data of the mounting points does not match between the production data 21 and the inspection data 22. If the coordinate data does not match in ST6, the warning process 4 is executed, and the display unit 26 displays that an error exists other than the above-mentioned consistency. As a result, the production start process is completed.

In the above-mentioned production start processing, the production on the mounting board production line L becomes possible only when the production start command is issued in ST3, and the production targeting the board 3 becomes possible. On the other hand, when the warning process 1 (ST5), the warning process 2 (ST7), the warning process 3 (ST9), and the warning process 4 (ST10) are executed, the data correction process by the above-mentioned data correction unit 25, etc. Measures are implemented.

Next, the consistency determination action executed in ST1 in FIG. 8 will be described with reference to FIG. The following processing is executed by the consistency determination unit 24. First, when the processing is started, the production data 21 and the inspection data 22 corresponding to the substrate 3 of the type to be produced are acquired from the storage unit 20 (see FIG. 4) of the information management device 5 (ST11). Next, coordinate data is acquired from the acquired production data 21 and inspection data 22 (see FIGS. 5A to 6B), and a matching determination of the coordinate data is executed (see FIG. 7A) (ST12). Next, it is determined whether or not all the coordinate data match based on the determination result in ST12 (ST13).

When it is determined that all the coordinate data match, the matching determination of the repeating pattern shown in FIG. 7B is executed (ST14). That is, it is determined whether or not the repetition pattern of the work process when the substrate 3 is an aggregate of a plurality of small substrates 3s formed in the same pattern matches the production data 21 and the inspection data 22 (ST16). ..

If the repeating patterns match, the determination result indicating that the consistency of the repeating pattern for the substrate type is acceptable is stored in the storage unit 20 (ST17). On the other hand, when the repeating patterns do not match in ST16, the determination result indicating that the repeating patterns do not match for the substrate type is stored in the storage unit 20 (ST18).

Next, in the above-mentioned ST13, the processing when it is determined that the coordinate data is not all the same and the coordinate data that does not match exists will be described. In this case, it is determined whether or not only the recognition mark coordinates do not match (ST15). Here, when only the recognition mark coordinates do not match and the coordinates of other mounting points and the like do match, the determination result indicating that the recognition marks do not match is stored in the storage unit 20 (ST19).

On the other hand, when a mismatch is found not only in the recognition mark but also in the coordinate data of the mounting point in ST15, the determination result indicating that the coordinate data of the mounting point does not match is stored in the storage unit 20 (ST20). Then, after saving the determination results for all of (ST17) to (ST20), the process returns to (ST2) of the main flow shown in FIG. 8 and the processing of FIG. 8 is executed according to the consistency determination results in each case. ..

As described above, the mounting board manufacturing system shown in the present embodiment includes a consistency determination unit 24, a component mounting device MM, and a mounted component inspection device MI. The consistency determination unit 24 confirms the quality of the consistency between the production data 21 given in advance and the inspection data 22 given in advance. The production data 21 is used when mounting the component on the substrate 3, and the inspection data 22 is used when inspecting the mounting state of the component on the substrate 3. The component mounting device MM manufactures a mounting board by mounting components on the board 3 based on the production data 21 confirmed by the consistency determination unit 24 to have good consistency. The mounted component inspection device MI inspects the mounted state of the components mounted on the board 3 by the component mounting device MM based on the inspection data 22 confirmed to have good consistency.

Further, in the mounting board manufacturing method according to the present embodiment, a mounting board in which components are mounted on the board 3 is manufactured. In this mounting board manufacturing method, the consistency determination unit 24 confirms the quality of the consistency between the production data 21 given in advance and the inspection data 22 given in advance. The production data 21 is used in the component mounting device MM that mounts the component on the substrate 3. The inspection data 22 is used in the mounted component inspection device MI that inspects the mounted state of the component mounted on the substrate 3 by the component mounting device MM. Then, using the production data 21 confirmed to have good consistency, the components are mounted on the substrate 3 by the component mounting device MM. Further, using the inspection data 22 confirmed to have good consistency, the mounted component inspection device MI inspects the mounted state of the components mounted on the substrate 3.

Further, the consistency determination device (consistency determination unit 24) according to the present embodiment confirms whether the consistency between the production data 21 given in advance and the inspection data 22 given in advance is good or bad. The production data 21 is used in the component mounting device MM that mounts the component on the substrate 3. The inspection data 22 is used in the mounted component inspection device MI that inspects the mounted state of the component mounted on the substrate 3 by the component mounting device MM.

With the above configuration, even when the feedback function is retrofitted in the mounting board manufacturing system, the hoodback position correction is ensured to ensure the consistency between the mounted data included in the actually applied production data 21 and the inspection data 22. Can work properly. In particular, even when the data creation history and data accuracy of the provided production data 21 and the inspection data 22 are different, the hoodback position correction can function correctly.

The mounting board manufacturing system, the mounting board manufacturing method, and the consistency determination device of the present disclosure ensure the consistency between the production data and the inspection data and correct the hoodback position even when the feedback function is retrofitted in the mounting board manufacturing system. Can work properly. Therefore, the present disclosure is useful in the field of manufacturing a mounting board by mounting components on a board.

1 Mounting board manufacturing system 2 Conveyor 3 Board 3a, 3b Triangular pattern 3s Small board 4 Communication network 5 Information management device 10 Head movement mechanism 11 Mounting head 12 Board recognition camera 13 Parts supply unit 14 Inspection head movement mechanism 15 Inspection heads 21 and 21a , 21b, 21c Production data 22, 22a, 22b, 22c Inspection data 23, 41a Inspection information 24 Consistency judgment unit 25 Data correction unit 26 Display unit 27 Input unit 28a, 29a Name 28b, 29b X coordinate 28c, 29c Y coordinate 30 , 40 Control unit 20, 31, 41 Storage unit 32 Mounting processing unit 33, 43 Display / input unit 42 Inspection processing unit 101 XY table 102 Head lifting mechanism L Mounting board manufacturing line MM Parts mounting device MI Mounting parts inspection device Ma, Mb Recognition mark

Claims (18)

1. It is configured to confirm the consistency between the pre-given production data used when mounting the component on the board and the pre-given inspection data used when inspecting the mounting state of the component on the board. Consistency judgment unit and
   A component mounting device configured to mount a component on a board based on production data confirmed to have good consistency by the consistency determining unit to manufacture a mounting board.
   The component mounting device includes a mounted component inspection device configured to inspect the mounted state of the component mounted on the board on the board based on inspection data confirmed to have good consistency. ,
   Mounting board manufacturing system.
2. The consistency determination unit is given in advance by confirming the consistency between the substrate recognition mark designated by the production data given in advance and the substrate recognition mark designated by the inspection data given in advance. After confirming the consistency between the production data and the inspection data given in advance,
   The component mounting device recognizes the board recognition mark specified in the production data whose consistency has been confirmed to be good, and mounts the component on the board.
   The mounted component inspection device recognizes the substrate recognition mark specified by the inspection data confirmed to have good consistency and measures the position of the component on the substrate.
   The mounting board manufacturing system according to claim 1.
3. The mounted component inspection device measures the position of the component on the substrate and measures the position of the component.
   The component mounting device is configured to correct the operation of mounting the component on the substrate based on the position of the component measured by the mounted component inspection device.
   The mounting board manufacturing system according to claim 1.
4. The consistency determination unit is given in advance by confirming the consistency between the substrate recognition mark designated by the production data given in advance and the substrate recognition mark designated by the inspection data given in advance. After confirming the consistency between the production data and the inspection data given in advance,
   The component mounting device recognizes the board recognition mark specified in the production data whose consistency has been confirmed to be good, and mounts the component on the board.
   The mounted component inspection device recognizes the substrate recognition mark specified by the inspection data confirmed to have good consistency and measures the position of the component on the substrate.
   The mounting board manufacturing system according to claim 3.
5. The consistency determination unit confirms the consistency between the mounting position of the component included in the production data given in advance and the mounting position of the component included in the inspection data given in advance. Confirming the quality of the consistency between the production data given in advance and the inspection data given in advance.
   The mounting board manufacturing system according to any one of claims 1 to 4.
6. The substrate targeted by the production data given in advance, the substrate targeted by the inspection data given in advance, the production data confirmed to be consistent, and the consistency confirmed to be good. The substrate targeted by the inspection data is an aggregate of a plurality of small substrates formed in the same pattern.
   The consistency determination unit confirms the consistency between the designated order of the small substrates included in the production data given in advance and the designated order of the small substrates included in the inspection data given in advance. , Confirming the quality of the consistency between the production data given in advance and the inspection data given in advance.
   The mounting board manufacturing system according to any one of claims 1 to 5.
7. A data correction unit is further provided for correcting either one of the production data and the inspection data whose consistency is determined to be poor by the consistency determination unit so that the consistency becomes good.
   The mounting board manufacturing system according to any one of claims 1 to 6.
8. The production data given in advance is created based on the design data of the mounting board.
   The inspection data given in advance is created by using the actual mounting board.
   The data correction unit corrects the production data among the production data and the inspection data whose consistency is determined to be poor by the consistency determination unit so as to be consistent with the inspection data.
   The mounting board manufacturing system according to claim 7.
9. It is a mounting board manufacturing method for manufacturing a mounting board in which components are mounted on the board.
   Used in a pre-given production data used in a component mounting device for mounting a component on a board, and in a mounted component inspection device for inspecting the mounted state of the component mounted on the board by the component mounting device. Check the consistency with the inspection data given in advance,
   Using the production data confirmed to have good consistency, the component is mounted on the board by the component mounting device.
   Using the inspection data confirmed to have good consistency, the mounted component inspection device inspects the mounted state of the component mounted on the board.
   Mounting board manufacturing method.
10. By confirming the consistency between the board recognition mark specified by the production data given in advance and the board recognition mark specified by the inspection data given in advance, the production data given in advance and the production data given in advance are given. After confirming the consistency with the inspection data,
    The component mounting device recognizes the board recognition mark specified in the production data whose consistency has been confirmed to be good, and mounts the component on the board.
    The mounted component inspection device recognizes the board recognition mark specified by the inspection data confirmed to have good consistency, and measures the position of the component on the substrate.
    The mounting substrate manufacturing method according to claim 9.
11. Based on the position of the component on the board measured by the mounted component inspection device, the component mounting device corrects the operation of mounting the component on the board.
    The mounting substrate manufacturing method according to claim 9.
12. By confirming the consistency between the board recognition mark specified by the production data given in advance and the board recognition mark specified by the inspection data given in advance, the production data given in advance and the production data given in advance are given. After confirming the consistency with the inspection data,
    The component mounting device recognizes the board recognition mark specified in the production data whose consistency has been confirmed to be good, and mounts the component on the board.
    The mounted component inspection device recognizes the board recognition mark specified by the inspection data confirmed to have good consistency, and measures the position of the component on the board.
    The mounting substrate manufacturing method according to claim 11.
13. By confirming the consistency between the mounting position of the component included in the production data given in advance and the mounting position of the component included in the inspection data given in advance, the production data given in advance can be obtained. Confirming the quality of the consistency with the inspection data given in advance,
    The mounting substrate manufacturing method according to any one of claims 9 to 12.
14. The substrate targeted by the production data given in advance, the substrate targeted by the inspection data given in advance, the production data confirmed to be consistent, and the consistency confirmed to be good. The substrate targeted by the inspection data is an aggregate of a plurality of small substrates formed in the same pattern.
    By confirming the consistency between the designated order of the small substrates included in the production data given in advance and the designated order of the small substrates included in the inspection data given in advance, the production given in advance. Confirming the quality of the consistency between the data and the inspection data given in advance,
    The mounting substrate manufacturing method according to any one of claims 9 to 13.
15. Used in a component mounting device that mounts a component on a board, and is used in a mounted component inspection device that inspects a pre-given production data and a mounted state of the component mounted on the board by the component mounting device. Confirm the consistency with the inspection data given in advance,
    Consistency judgment device.
16. By confirming the consistency between the board recognition mark specified by the production data given in advance and the board recognition mark specified by the inspection data given in advance, the production data given in advance and the production data given in advance are given. Confirm the quality of the consistency with the inspection data obtained,
    The consistency determination device according to claim 15.
17. By confirming the consistency between the mounting position of the component included in the production data given in advance and the mounting position of the component included in the inspection data given in advance, the production data given in advance can be obtained. Confirming the quality of the consistency with the inspection data given in advance,
    The consistency determination device according to claim 15 or 16.
18. The substrate is an aggregate of a plurality of small substrates formed in the same pattern.
    The consistency determination unit confirms the consistency between the designated order of the small substrates included in the production data given in advance and the designated order of the small substrates included in the inspection data given in advance. Confirming the quality of the consistency between the production data given in advance and the inspection data given in advance.
    The consistency determination device according to any one of claims 15 to 17.

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