WO2021010583A1 - Interface ayant une structure de courbure, ensemble interface et prise de test contenant ladite interface, et procédé de fabrication de ladite interface - Google Patents

Interface ayant une structure de courbure, ensemble interface et prise de test contenant ladite interface, et procédé de fabrication de ladite interface Download PDF

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Publication number
WO2021010583A1
WO2021010583A1 PCT/KR2020/006275 KR2020006275W WO2021010583A1 WO 2021010583 A1 WO2021010583 A1 WO 2021010583A1 KR 2020006275 W KR2020006275 W KR 2020006275W WO 2021010583 A1 WO2021010583 A1 WO 2021010583A1
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WO
WIPO (PCT)
Prior art keywords
interface
terminal pins
support tape
connection
adapter
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Application number
PCT/KR2020/006275
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English (en)
Korean (ko)
Inventor
이승용
Original Assignee
이승용
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from KR1020190085253A external-priority patent/KR102070302B1/ko
Priority claimed from KR1020200008751A external-priority patent/KR102176707B1/ko
Application filed by 이승용 filed Critical 이승용
Publication of WO2021010583A1 publication Critical patent/WO2021010583A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/771—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

Definitions

  • the technical idea of the present invention relates to a test socket, in particular, when testing a test object, an interface for connecting terminal pins of a test object and terminal pins of a test PCB, and a test socket including the interface.
  • a problem to be solved by the technical idea of the present invention is to provide an interface that enables a test object to be reliably and quickly tested, an interface assembly and a test socket including the interface, and a method of manufacturing the interface.
  • the technical idea of the present invention includes two partial interfaces, and a connection body connecting the two partial interfaces, and each of the two partial interfaces has upper terminal pins in a first direction.
  • Upper contact portions arranged in a line along the line;
  • a lower contact portion disposed under the upper contact portion and in which lower terminal pins are arranged in a line along the first direction;
  • Connection lines connecting each of the upper terminal pins to each of the corresponding lower terminal pins are provided, and each of the connection lines is bent twice in the same direction through two bending portions to form an upper line, a side line, and a lower line.
  • a support tape for fixing and supporting the upper terminal pins, lower terminal pins, and connection lines, and exposing at least a portion of each of the upper terminal pins and at least a portion of each of the lower terminal pins, wherein the upper terminal pins
  • Each provides an interface of a bending structure, integrally connected to each of the corresponding connection lines and each of the lower connection lines.
  • the technical idea of the present invention is, in order to solve the above problem, an upper layer in which a first open line is formed along a first direction in a central portion, a second layer disposed below the upper layer and in a central portion along the first direction.
  • An FPCB flexible PCB having a lower layer on which an open line is formed, and two side layers spaced apart from each other in a second direction perpendicular to the first direction and integrally connecting the upper layer and the lower layer, and in which connection wires are disposed.
  • the interface of the bending structure in order to solve the above problems, the interface of the bending structure; And an adapter that maintains the structure of the interface and is inserted into and coupled to the inner space of the interface, wherein the interface has one of the aforementioned two interface structures. Provides.
  • the interface of the bending structure In order to solve the above problem, the interface of the bending structure; An adapter that maintains the structure of the interface and is inserted into and coupled to the inner space of the interface; And a guide block in which a guide groove for guiding the test object is formed on the upper part, and the interface and the adapter are coupled to the lower part, wherein the interface has a test socket having any one of the two interface structures described above. to provide.
  • the technical idea of the present invention is, in order to solve the above problem, forming an interface disk including an interface body portion and a dummy portion; Attaching a support tape to the interface body portion; Half-etching a portion set in the interface original plate; Removing the dummy portion from the interface disk; And forming an interface by coupling the adapter to the interface body portion and performing two bending times.
  • the interface of the bending structure according to the technical idea of the present invention and the test socket including the interface are directly connected to the lower terminal pins corresponding to the upper terminal pins through connection lines, so that the test object can be reliably tested, and Also, contaminants that accumulate through repeated tests may not be affected at all. Accordingly, it can contribute to high-speed and reliable testing of the test object.
  • FIG. 1 is a perspective view of an interface of a bending structure according to an embodiment of the present invention.
  • FIG. 2A to 2H are plan views and side views illustrating a process of manufacturing the interface of the bending structure of FIG. 1.
  • 3A to 3E are perspective views illustrating in detail a structure of a bending portion of a connection line in the interface of the bending structure of FIG. 1.
  • 4A and 4B are side views of an interface of a bending structure according to exemplary embodiments of the present invention.
  • 5A to 8C are side views, and a conceptual diagram of an adapter, an interface and an interface assembly in which the adapter is combined, according to exemplary embodiments of the present invention.
  • FIG 9A to 10D are perspective views of adapters according to embodiments of the present invention.
  • 11 to 15B are plan views of support tapes attached to the interface of FIG. 1.
  • 16A to 17D are perspective views of an interface assembly in which an interface and an adapter are coupled according to an embodiment of the present invention.
  • 18A to 18C are perspective views and cross-sectional views of an interface of a bending structure according to an embodiment of the present invention.
  • 19A and 19B are perspective and cross-sectional views of a test socket including an interface of a bending structure according to an embodiment of the present invention.
  • 20A to 20D are perspective views, cross-sectional views, and enlarged views of a test socket including an interface of a bending structure according to an embodiment of the present invention.
  • 21A to 21C are perspective, cross-sectional, and exploded perspective views of a test socket including an interface of a bending structure according to an embodiment of the present invention.
  • FIG. 1 is a perspective view of an interface of a bending structure according to an embodiment of the present invention.
  • the interface 100 (hereinafter, simply referred to as'interface') of the bending structure of the present embodiment includes a first partial interface 100-1, a second partial interface 100-2, and a connection body 140. ), and a support tape 150.
  • the first partial interface 100-1 and the second partial interface 100-2 may have a structure symmetrical around the open area H0 formed at the center. Accordingly, only the first partial interface 100-1 will be described for convenience of description.
  • the first partial interface 100-1 may include an upper contact part 110, a lower contact part 120, and a connection part 130.
  • a plurality of upper terminal pins 112 may be disposed in the upper contact part 110 along the first direction (x direction).
  • the lower contact part 120 is located under the upper contact part 110, and a plurality of lower terminal pins 122 may be disposed in the lower contact part 120 along the first direction (x direction).
  • the connection part 130 includes a plurality of connection lines 132, and each of the connection lines 132 may connect each of the upper terminal pins 112 to each other by corresponding lower terminal pins 122.
  • each of the upper terminal pins 112 may form one metal line integrally with each of the corresponding connection lines 132 and each of the lower terminal pins 122.
  • the first partial interface 100-1 is composed of a plurality of metal lines, and each of the metal lines is the upper terminal pin 112 corresponding to the upper contact part 110 and the lower contact part 120. It can be seen that it is divided into a lower terminal pin 122 and a connection line 132 corresponding to the connection part 130.
  • the upper terminal pins 112, the lower terminal pins 122, and the connection lines 132 may be formed of a metal such as beryllium-copper or stainless steel (SUS).
  • the materials of the upper terminal pins 112, the lower terminal pins 122, and the connection lines 132 are not limited to the above-described materials.
  • the upper terminal pins 112, the lower terminal pins 122, and the connection lines 132 may be plated with nickel and gold.
  • the end portions of the upper terminal pins 112 may have a convex shape in the center portion, unlike portions connected by the connection lines 132. Further, end portions of the lower terminal pins 122 may have a bent shape protruding downward with a step difference.
  • connection lines 132 may be bent twice in the same direction through the two bent portions 134 to have a'C'-shaped bending structure.
  • the'c'-shaped bending structure is not exactly limited to the'c', and may include all similar bending structures.
  • the'c'-shaped bending structure may include a bending structure that narrows toward the entrance or a bending structure that widens.
  • the bending portion may have a round shape without having a specific angle.
  • the entire side portion connecting the upper portion and the lower portion may have a round shape.
  • each of the connection lines 132 is an upper line integrally connected to the upper terminal pin 112 (see 132u in FIG. 2H), and a lower line integrally connected to the lower terminal pin 122 (See 132d of FIG. 2H), and a side line between the two bent portions 134 (see 132s of FIG. 2H) may be provided.
  • the bending portion 134 may have a thickness or width that is thinner than that of other portions.
  • connection body 140 may couple the first partial interface 100-1 and the second partial interface 100-2.
  • the connection body 140 is disposed on an upper layer of the interface 100, for example, an upper contact part 110 and an upper line 132u of the connection part 130, and the first partial interface 100-1 and It may have a structure protruding from the second partial interface 100-2 in both directions in the first direction (x direction).
  • an open area H0 is formed in the connection body 140, and as described above, the first partial interface 100-1 and the second partial interface 100-2 are based on the open area H0. It can have a symmetrical structure. More specifically, the upper terminal pins 112 of the first partial interface 100-1 and the second partial interface 100-2 extend in the second direction (y direction) and protrude into the open area H0 Can have In addition, as the upper terminal pins 112 of the first partial interface 100-1 and the second partial interface 100-2 are disposed in a structure symmetrical to each other in the open area HO, the first partial interface 100 An open line Hl extending in the first direction (x direction) may be formed between the upper terminal pins 112 of -1) and the upper terminal pins 112 of the second partial interface 100-2. have.
  • connection body 140 is formed of the same material as the first partial interface 100-1, but may be electrically separated from the first partial interface 100-1 and the second partial interface 100-2.
  • a coupling hole H1 is formed in the connection body 140, and the interface 100 may be coupled to an adapter (see 200 in FIG. 2F) through the coupling hole H1.
  • the support tape 150 fixes and supports the first partial interface 100-1, the second partial interface 100-2, and the connection body 140, and further, the upper terminal pins 112, respectively, the lower terminal
  • Each of the pins 122 and each of the connection lines 132 may be kept spaced apart from each other in the first direction (x direction).
  • the support tape 150 includes a first partial interface 100-1 and a second partial interface 100-2, and an upper support tape 150u and a first partial interface 100-covering the upper surface of the connection body 140. 1) and a second partial interface 100-2, and a lower support tape 150d covering a lower surface of the connection body 140.
  • An open area corresponding to the open area H0 of the connection body 140 may be formed at a central portion of the support tape 150. Accordingly, at least a portion of each of the upper terminal pins 112 may be exposed from the support tape 150 through the open area.
  • the interface 100 of the present embodiment may have a structure in which the first partial interface 100-1 and the second partial interface 100-2 each having a'C'-shaped bending structure are coupled to each other through the connection body 140. have.
  • the interface 100 of the present exemplary embodiment may have a structure in which the upper terminal pins 112 are directly connected to the corresponding lower terminal pins 122 through the connection lines 132. Accordingly, the interface 100 of the present exemplary embodiment allows a test object to be reliably tested, and may not be affected at all even for contaminants accumulated through repetition of the test. As a result, the interface 100 of the present embodiment can contribute to high-speed and reliable testing of a test object.
  • the interface 100 of the present embodiment may be included in a test socket (see 1000a in FIG. 19A).
  • a test socket see 1000a in FIG. 19A.
  • the terminal pins of the test object are the upper terminals of the interface 100.
  • the pins 112 are connected, and the terminal pins of the test PCB 3000 may be connected to the lower terminal pins 122.
  • the upper terminal pins 112 may be directly connected to the corresponding lower terminal pins 122 through the connection lines 132. Therefore, the test socket 1000a including the interface 100 of the present embodiment can minimize an error due to contact failure, and also, due to a structure directly connected, electricity due to the intervention of foreign substances There is no fear of enemy blocking.
  • FIG. 2A to 2H are plan views and side views illustrating a process of manufacturing the interface of the bending structure of FIG. 1.
  • an interface original plate 100a is formed.
  • the interface disk 100a may largely include an interface body portion and a dummy portion D.
  • the interface body portion may include a first partial interface 100-1a, a second partial interface 100-2a, and a connection body 140. Since the first partial interface 100-1a and the second partial interface 100-2a have a symmetric structure, only the first partial interface 100-1a will be described. The same applies to the following.
  • the first partial interface 100-1a may include an upper contact part 110, a lower contact part 120, and a connection part 130.
  • the upper contact part 110 includes a plurality of upper terminal pins 112
  • the lower contact part 120 includes a plurality of lower terminal pins 122
  • the connection part 130 includes a plurality of connection lines 132.
  • each of the upper terminal pins 112 may constitute one metal line with each of the connection lines 132 corresponding thereto, and each of the lower terminal pins 122.
  • the bending portion 134 ′ is indicated by a dotted line on the connection lines 132, but the bending portion may not be formed on the connection lines 132 yet.
  • a separate structure may not be formed in the end portions 112t of the upper terminal pins 112.
  • connection body 140 may connect the first partial interface 100-1a and the second partial interface 100-2a.
  • the connection body 140 is disposed at the central portion of the interface disk 100a, and protrudes from both the first and second partial interfaces 100-1a and 100-2a in the first direction (x direction). It can have a structure.
  • An open area H0 may be formed in a central portion of the connection body 140, and coupling holes H1 may be formed in an outer portion.
  • the dummy portion D may include a first dummy portion D1 and a second dummy portion D2.
  • the first dummy part D1 has a structure extending in the first direction (x direction) and is connected to the lower terminal pins 122 to support the lower terminal pins 122.
  • the second dummy part D2 has a structure extending in the second direction (y direction) from the connection body 140, and the outermost connection line 132 of the connection part 130 and the outermost lower part of the lower contact part 120 It may be disposed adjacent to the terminal pin 122. As shown in FIG. 2A, two first dummy portions D1 and four second dummy portions D2 may be disposed on the interface disk 100a.
  • the interface disk 100a is formed in a form in which the metal lines are separated from each other in the first direction (x direction) through a mold, and the interface main body part and the dummy part (D) to facilitate cutting of the dummy part (D).
  • This connected boundary portion can be formed thinly through the mold.
  • the boundary portion between the interface body portion and the dummy portion D may be thinly formed through half etching instead of a mold, or thinly formed by applying both a mold and half etching.
  • a support tape 150 is attached to the interface disk 100a.
  • the support tape 150 may include an upper support tape 150u covering an upper surface of the interface disk 100a and a lower support tape 150d covering a lower surface of the interface disk 100a.
  • the support tape 150 may include an open area corresponding to the open area H0. Meanwhile, the lower supporting tape 150d covers the ends of the upper terminal pins 112 and the lower terminal pins 122, but the upper supporting tape 150u may expose the ends.
  • portions corresponding to the bending portions 134 ′ of the connection lines 132 are removed. Removal of the portion of the support tape 150 corresponding to the bent portion 134 ′ may be performed on both the upper support tape 150u and the lower support tape 150d. However, depending on the embodiment, it may be performed only on any one.
  • the end portions 122t of the lower terminal pins 122 may be bent to have a step difference.
  • the shape of the end portions 122t of the lower terminal pins 122 on the right side of FIG. 2C is enlarged and illustrated.
  • the end portions 122t of the lower terminal pins 122 are bent so as to protrude upward, and may have a bending structure protruding downward when a bending process is performed by the bending unit later.
  • the bending structure of the end portions 122t of the lower terminal pins 122 may smoothly contact the terminal pins 3100 of the test PCB 3000 in the future.
  • the end portions 122t of the lower terminal pins 122 may have a structure different from the illustrated shape.
  • the lower support tape 150d is attached only to the lower surface, and the upper surface may be exposed without the upper support tape 150u attached. This is because the top surfaces of the end portions 122t of the lower terminal pins 122 are in contact with the terminal pins 3100 of the test PCB 3000. In addition, if the bottom surface of the end portions 122t of the lower terminal pins 122 is exposed, there may be a risk of being bent or damaged in a subsequent process. Accordingly, by covering the lower surface of the end portions 122t of the lower terminal pins 122 with the lower support tape 150d, it is possible to protect the end portions 122t of the lower terminal pins 122 and provide a support force.
  • the bending portion 134 is half-etched to form a thin bent portion 134.
  • the reason why the bent part 134 is formed thin through half-etching is that bending is difficult due to the repulsive force of the material itself, and it may be difficult to maintain the shape as it is even after bending when the bent part 134 is not thin.
  • the end portions 112t of the upper terminal pins 112 are also half-etched, so that the center may be formed in a convex structure.
  • the end portions 112t of the upper terminal pins 112 may have a convex structure.
  • the structure of the end portions 112t of the upper terminal pins 112 is not limited to the convex structure.
  • half-etching may be performed on the end portions 112t of the upper terminal pins 112 before half-etching the bent portion 134.
  • the end portions 112t of the upper terminal pins 112 may not be half-etched, and thus, may have substantially the same shape as other portions of the upper terminal pins 112.
  • the adapter 200 is coupled to the interface body 100f, and the connection lines 132 are first bent vertically downward through the bending part 134 adjacent to the upper contact part 110.
  • the adapter 200 may have a shape similar to a rectangle in cross section, and a coupling protrusion 203 may be formed on the upper surface.
  • the adapter 200 may be coupled to the coupling hole H1 formed in the connection body 140 through the coupling protrusion 203.
  • the connection lines 132 are secondarily bent in the horizontal direction through the bending portion 134 adjacent to the lower contact portion 120.
  • the first bending and the second bending may be performed in the same direction.
  • the first partial interface 100-1e of FIG. 2E is first bent counterclockwise to make the state of the first partial interface 100-1f of FIG. 2F, and the first partial interface 100-1e of FIG. A structure of the first partial interface 100-1 as shown in FIG.
  • the second partial interface 100-2e of FIG. 2E is first bent in a clockwise direction to make the second partial interface 100-2f of FIG. 2F, and the second partial interface 100-2e of FIG.
  • a second partial interface 100-2 structure may be formed.
  • FIG. 2G shows a structure in which the interface 100 and the adapter 200 are combined
  • FIG. 2H shows only the interface 100 after removing the adapter 200.
  • the structure of the interface 100 in FIGS. 2G and 2H may be substantially the same.
  • each of the connection lines 132 may be divided into an upper line 132u on an upper surface, a side line 132s on a side, and a lower line 132d on a lower surface.
  • the interface 100 may configure the test socket while being coupled to the adapter 200.
  • an interface assembly a structure in which the interface 100 and the adapter 200 are combined
  • 3A to 3E are perspective views illustrating in detail a structure of a bending portion of a connection line in the interface of the bending structure of FIG. 1.
  • the bent portion 134a may have a groove shape that is formed by half-etching the connection line 132 to have a thickness thinner than that of other portions of the connection line 132.
  • the shape of the groove of the bent portion 134a is expressed as a shape having a horizontal bottom surface and a vertical side surface thereof, but the shape of the groove of the bending portion 134a is not limited thereto.
  • the groove of the bent portion 134a may have an obtuse slope or a rounded shape on the lower surface of the side surface.
  • the groove of the bent portion 134a may have a shape in which the entire side and the lower surface are rounded.
  • the bent portion 134b has a groove shape that is thinner than the other portions of the connection line 132 through half etching, but at least a portion of the bottom portion is removed. It may include a first through portion (Hb1) is formed.
  • the bending portion 134c may have a structure including a second through portion Hb2 formed to completely penetrate a portion of the side surface of the connection line 132. Since the second through portion Hb2 is formed in the bent portion 134c, the bent portion 134c may have a narrower width than other portions of the connection line 132.
  • the bending portion 134d may have a structure in which minute grooves gm are formed in the connection line 132.
  • the fine grooves gm may be disposed along the width direction of the connection line 132. Since the fine grooves gm are formed in the bent part 134d, the bent part 134d may be thinner than other portions of the connection line 132 in the fine grooves gm.
  • the bending portion 134e may have a structure in which a third through hole Hb3 is formed in the connection line 132.
  • the third through hole Hb3 is formed on both sides of the connection line 132 and may have a'V' shape when viewed from the top. Since the third through hole Hb3 is formed in the bending portion 134e, the bending portion 134e may have a width narrower than that of other portions of the connection line 132.
  • the structure of the five bending portions has been described so far, but the structure of the bending portion is not limited thereto.
  • the bending portion may be formed in a variety of structures capable of facilitating bending of the connection line 132 and maintaining its shape after bending.
  • 4A and 4B are side views of an interface of a bending structure according to exemplary embodiments of the present invention.
  • the interface 100g of this embodiment is similar to the interface 100 of FIG. 1, but in the structure of the end portion 122t1 of the lower terminal pin 122, the interface 100 of FIG. can be different. Specifically, in the interface 100g of the present embodiment, the end portion 122t1 of the lower terminal pin 122 does not have a bending structure that protrudes with a step difference downward, but extends horizontally from the connection line 132 as it is. Can have In the interface 100g of the present embodiment, the end portions 112t of the upper terminal pins 112 may have a convex structure in the center as shown in FIG. 2D. This is not limited thereto, and a convex structure may not be formed at the end portions 112t of the upper terminal pins 112.
  • the lower terminal pin 122 may have a structure extending from the connection line 132 in a straight line, but the whole of the connection line 132 is gradually inclined downward. As described above, since the lower terminal pin 122 has a structure that is gradually inclined downward, it can be smoothly contacted with the terminal pins 3100 of the test PCB 3000 in the future.
  • the interface 100h of this embodiment is similar to the interface 100 of FIG. 1, but in the structure of the end portion 122t2 of the lower terminal pin 122, the interface 100 of FIG. can be different. Specifically, in the interface 100g of the present embodiment, a portion of the end portion 122t2 of the lower terminal pin 122 may have a'V'-shaped bending structure. Since the end portion 122t1 of the lower terminal pin 122 has a'V'-shaped bending structure, it may be smoothly contacted with the terminal pins 3100 of the test PCB 3000 in the future.
  • an end portion of the lower terminal pin 122 may be formed in various structures capable of smoothly contacting the terminal pins 3100 of the test PCB 3000.
  • 5A to 8C are side views, and a conceptual diagram of an adapter, an interface and an interface assembly in which the adapter is combined, according to exemplary embodiments of the present invention.
  • the adapter 200 may include a body 201 and a coupling protrusion 203 formed on an upper surface of the body.
  • the coupling protrusion 203 may be disposed at a portion corresponding to the coupling hole H1 of the interface 100.
  • the body 201 of the adapter 200 may have a structure extending in a first direction (x direction) corresponding to the shape of the interface 100. Further, a cross section of the body 201 perpendicular to the first direction (x direction) may have a rectangular shape. However, as shown in FIG. 5A, the cross section of the body 201 is not exactly rectangular, and inclined portions may exist at portions corresponding to both vertices of the lower surface. However, depending on the embodiment, the cross section of the body 201 may have a substantially rectangular shape. In addition, the cross section of the body 201 may have a shape rounded at a portion corresponding to a vertex.
  • a first insertion groove G1 may be formed on the upper surface of the body 201.
  • the first insertion groove G1 may extend along a first direction (x direction) in which the upper terminal pins 112 are disposed.
  • the upper buffer 210 may be filled in the portion of the first insertion groove G1.
  • the upper buffer 210 may be formed of, for example, a material having elasticity such as silicone rubber.
  • the first insertion groove G1 may be formed in a portion of the interface 100 corresponding to a position where the upper terminal pins 112 are disposed.
  • the upper terminal pins 112 may move up and down in the first insertion groove G1. Therefore, when the terminal pins to be tested contact the upper terminal pins 112, the upper terminal pins 112 themselves move up and down in the first insertion groove G1 and are buffered, thereby inducing the contact smoothly and stably. can do.
  • FIG. 5B shows the structure of the interface assembly 500 in which the interface 100 is coupled to the adapter 200, the structure of the interface assembly 500 before the interface 100 is separated from the adapter 200 in FIG. 2G It can be seen that it is substantially the same as
  • the structure of the adapter 200a and the interface assembly 500a of the present embodiment is in that a second insertion groove G2 is further formed on the lower surface of the body 201a of the adapter 200a.
  • a second insertion groove G2 may be formed on a lower surface of the body 201a.
  • the second insertion groove G2 may extend along a first direction (x direction) in which the lower terminal pins 122 are disposed.
  • the lower buffer 220 may be filled in the second insertion groove G2.
  • the lower buffer 220 may also be formed of a material having elasticity such as silicone rubber.
  • the second insertion groove G2 may be formed in a portion of the interface 100 corresponding to a position where the lower terminal pins 122 are disposed.
  • the second insertion groove G2 and the lower buffer 220 act as a buffer through elasticity to facilitate contact and It can be induced stably.
  • the second insertion groove G2 is formed on the lower surface of the body 201a, and the lower buffer 220 may not be filled in the second insertion groove G2.
  • the contact can be smoothly and stably induced by a buffering action.
  • the structure of the adapter 200b and the interface assembly 500b of the present embodiment is in that a separate insertion groove is not formed in the body 201b of the adapter 200b, and FIGS. It may be different from the adapter 200 and interface assembly 500 of 5B, or the adapter 200a and interface assembly 500a of FIGS. 6A and 6B.
  • the body 201b may be formed of an elastic material.
  • the body 201b may be formed of silicone rubber. In this way, since the body 201b itself is formed of an elastic material, an insertion groove or a buffer material for buffering is unnecessary.
  • the structure of the adapter 200c and the interface assembly 500c of the present embodiment is in that a first insertion groove G1 is formed on the upper surface of the body 201c of the adapter 200c. , May be similar to the adapter 200 and interface assembly 500 of FIGS. 5A and 5B. However, in the adapter 200c and the interface assembly 500c according to the present embodiment, in that the buffer is not filled in the first insertion groove G1 and a U-shaped protrusion Pu is formed in the center portion, FIGS. 5A and 5A It may be different from the adapter 200 and the interface assembly 500 of 5b.
  • the U-shaped protrusion Pu may extend in a first direction (x direction) in which the first insertion groove G1 extends.
  • end portions of the upper terminal pins 112 of the interface 100 may be located on the upper surface of the U-shaped protrusion Pu. Accordingly, when the terminal pins of the test object, for example, the terminal pins of the micro connector 2001, contact the upper terminal pins 112, the upper terminal pins 112 are bent with elasticity like a dotted line and are buffered, thereby making contact. It can be guided smoothly and stably.
  • FIGS. 10A to 10C are perspective views of adapters according to exemplary embodiments of the present invention, in which FIG. 9A is a perspective view as viewed from an upper side of the adapter, FIG. 9B is a perspective view as viewed from a lower side of the adapter, and FIGS. 10A to 10C are All are perspective views from the top of the adapter.
  • the adapter 200d of this embodiment includes a body 201, a coupling protrusion 203 formed on the upper surface 201t of the body, and a lower insertion groove Gd of the lower surface 201b of the body. ) May include a lower buffer 220 inserted in.
  • the number of coupling protrusions 203 may be formed on the upper surface 201t of the body 201.
  • the number of coupling protrusions 203 is not limited to four.
  • the coupling protrusions 203 may be arranged as many as the number of coupling holes H1 in a portion corresponding to the coupling hole H1 of the interface 100. Accordingly, when the number of coupling holes H1 of the interface 100 is not four, the coupling protrusions 203 may also be formed in a number corresponding thereto.
  • the body 201 of the adapter 200d may have a structure extending in a first direction (x direction) corresponding to the shape of the interface 100. Also, a cross section of the body 201 perpendicular to the first direction (x direction) may have a rectangular shape.
  • the third direction (z direction) A protruding stopper 201p may be formed on the lower surface 201b of the body 201, as shown in FIG. 9B, while extending in the second direction (y direction) at both ends of the first direction (x direction), the third direction (z direction) A protruding stopper 201p may be formed. As can be seen in FIG. 16B, a portion of the connection portion 130 of the interface 100g and the lower contact portion 120 may be disposed between both starters 201p.
  • the interface assembly including the interface 100 (see 500d in FIG. 16A) is included in the test socket to test the test object, from the top. It is possible to prevent the applied pressure from being directly transmitted to the lower terminal pins 122 and the connection portion 130 connected thereto. Accordingly, a problem in which the lower terminal pins 122 of the interface 100 and portions of the connection unit 130 are excessively bent and deformed may be solved.
  • a lower insertion groove Gd may be formed in the lower surface 201b of the body 201, and a lower buffer 220 may be inserted and disposed in the lower insertion groove Gd.
  • the lower insertion grooves Gd may be formed in two portions corresponding to the lower contact portions 120 of the first partial interface 100-1g and the second partial interface 100-2g.
  • two lower buffers 220 may also be disposed corresponding to the two lower insertion grooves Gd.
  • the lower buffer 220 may be omitted.
  • the lower insertion groove Gd may have a shape extending in a first direction (x direction), and the lower buffer material 220 may also have a shape extending in a first direction (x direction).
  • the lower buffer material 220 may have a cylindrical, elliptical, or polygonal column shape extending in one direction.
  • the lower buffer 220 has a length corresponding to the length of the lower insertion groove Gd in the first direction (x direction), and may have a diameter or width corresponding to the width of the lower insertion groove Gd.
  • the lower buffer 220 may be formed of a material having elasticity such as silicone rubber.
  • the adapter 200e of this embodiment has an upper insertion groove Guc formed on the upper surface 201t of the body 201, and an upper buffer 210 is formed in the upper insertion groove Guc. It may be different from the adapter 200d of FIG. 9A in that it is disposed. Specifically, in the adapter 200e of this embodiment, an upper insertion groove Guc may be formed in a central portion of the upper surface 201t of the body 201. Two upper insertion grooves Guc may be formed in two corresponding to the upper contact portion 110 of the first partial interface 100-1g and the second partial interface 100-2g. In addition, two upper buffers 210 may be disposed corresponding to the two upper insertion grooves Guc.
  • the upper buffer 210 may be omitted.
  • the structure of the upper insertion groove Guc and the shape and material of the upper buffer 210 are as described for the lower insertion groove Gd and the lower buffer 220.
  • the upper buffer 210 acts as a buffer through elasticity, so that the contact can be smoothly and stably induced.
  • the adapter 200f of the present embodiment may be different from the adapter 200d of FIG. 9A in that two coupling protrusions 203 are formed on the upper surface 201t of the body 201.
  • the coupling protrusion 203 is formed only at one of two vertices in the second direction (y direction) among the four vertices of the upper surface 201t of the body 201 Can be.
  • the structure in which the coupling protrusion 203 is formed in either direction in the second direction (y direction) is, as can be seen in FIG.
  • the first partial interface 100-1g ') and the connection part 130 of the second partial interface 100-2g' have different lengths, and accordingly, the position of the upper contact part 110 is skewed in the second direction (y direction), and the interface 100g'
  • the structure of the interface (100g') when the test socket including the interface (100g') is combined with the micro-connector to be tested, is adopted to secure a mating margin corresponding to the structure of the micro-connector. I can.
  • the adapter 200g of this embodiment has two coupling protrusions 203 formed on the upper surface 201t of the body 201, and the upper buffer 210 in the upper insertion groove Gue. ) May be different from the adapter 200d of FIG. 9A in that it is disposed.
  • two coupling protrusions 203 may be formed on the upper surface 201t of the body 201 like the adapter 200f of FIG. 10B.
  • an upper insertion groove (Gue) in a portion opposite to the portion in which the two engaging projections 203 are formed in the second direction (y direction) Can be formed.
  • the upper insertion groove (Gue) in the structure of the interface (100g') in which the position of the upper contact portion (110) is skewed, the upper portion of the first partial interface (100-1g') and the second partial interface (100-2g') It may be formed at two positions corresponding to the contact portion 110.
  • two upper buffers 210 may be disposed corresponding to the two upper insertion grooves Gue. Depending on the embodiment, the upper buffer 210 may be omitted.
  • two upper insertion grooves Guc are formed in the center portion in the second direction (y direction), and two upper insertion grooves Guc
  • a plurality of partition walls 230 may be formed along the first direction (x direction) therebetween.
  • two upper buffers 210 may be disposed.
  • the upper buffer 210 may be omitted.
  • the barrier ribs 230 may function to separate the upper terminal pins 112 of the upper contact portion 110 of the interface 100g” from each other, as can be seen from the interface assembly 500h of FIG. 17D. A problem in which the upper terminal pins 112 are bent left and right due to an unintended force through the barrier ribs 230 can be fundamentally blocked from contacting each other.
  • the upper support tape 150u exposes the bending portion 134 of the connection portion 130 of the first partial interface 100-1 and the second partial interface 100-2, and further, the first partial interface
  • the upper contact portion 110 and the lower contact portion 120 of the (100-1) and the second partial interface 100-2 may be exposed.
  • the lower support tape 150d has a second length L2 that is longer than the first length L1 in the second direction (y direction). Except for that, it may have substantially the same structure as the upper support tape 150u.
  • the lower support tape 150d has a lower surface of the first partial interface 100-1, the second partial interface 100-2, and the connection body 140, as shown in FIGS. 12A and 12B. It has a covering structure, and an open region Hdc and a coupling hole H1" may be formed in the lower support tape 150d corresponding to the open region H0 and the coupling hole H1 formed in the connection body 140.
  • an open line Hdl extending in a first direction (x direction) may be formed on the lower support tape 150d to correspond to the bent portion 134 of the connection portion 132.
  • the lower support tape 150d has a second length L2 that is longer than the first length L1 in a second direction (y direction) from a portion corresponding to the connection body 140, so that the first partial interface and the The lower surface of the lower contact part 120 of the second partial interface 100-2 may be completely covered. Accordingly, as shown in FIG. 12B, the lower support tape 150d is bent of the upper contact portion 110 and the connection portion 130 of the first and second partial interfaces 100-1 and 100-2. The portion 134 may be exposed, but the lower contact portion 120 of the first partial interface 100-1 and the second partial interface 100-2 may not be exposed.
  • 12b is a plan view viewed from the lower support tape 150d side.
  • the lower support tape 150d1 is the lower support tape of FIG. 12A, except that the lower support tape 150d1 has a fine protrusion P1 in the open area Hdc1. It may have substantially the same structure as (150d). Specifically, the lower support tape 150d1 protrudes from the open area Hdc1 to a central portion in the second direction (y direction) and is disposed along the first direction (x direction), as shown in FIG. 13A, It may include a plurality of fine protrusions P1 separated from each other. In addition, as can be seen in FIG. 13B, each of the fine protrusions P1 may cover each of the corresponding upper terminal pins 112 of the upper contact portion 110 of the interface 100.
  • the lower support tape 150d1 exposes only the bending portion 134 of the connection portion 130 of the first partial interface 100-1 and the second partial interface 100-2, and the first partial interface 100 -1) and the upper contact portion 110 and the lower contact portion 120 of the second partial interface 100-2 may not be exposed.
  • These fine protrusions P1 support the upper contact part 110 and may contribute to strengthening the elastic force of the upper contact part 110.
  • FIG. 13B is a plan view as viewed from the upper support tape 150u, where the lower support tape 150d1 is exposed between the lower terminal pins 122, and the fine protrusion P1 is exposed between the upper terminal pins 112 Can be.
  • the lower support tape 150d2 is the lower support tape of FIG. 12A, except that the lower support tape 150d2 has an integral protrusion P2 in the open area Hdc2. It may have substantially the same structure as (150d). Specifically, the lower support tape 150d2, as shown in FIG. 14A, protrudes from the open area Hdc2 to the central portion of the second direction (y direction) and extends along the first direction (x direction). It may include a protrusion P2. In addition, as can be seen in FIG. 14B, the integral protrusion P1 may cover the entire corresponding upper terminal pins 112 of the upper contact portion 110 of the interface 100.
  • the lower support tape 150d2 exposes only the bending portion 134 of the connection portion 130 of the first partial interface 100-1 and the second partial interface 100-2, and the first partial interface 100 -1) and the upper contact portion 110 and the lower contact portion 120 of the second partial interface 100-2 may not be exposed.
  • the integral protrusion P2 supports the upper contact part 110 and may contribute to strengthening the elastic force of the upper contact part 110.
  • FIG. 14B is a plan view as viewed from the upper support tape 150u, where the lower support tape 150d2 is exposed between the lower terminal pins 122, and the integral protrusion P2 is exposed between the upper terminal pins 112 Can be.
  • the lower support tape 150d3 has a first fine protrusion P1 in the open area Hdc1, and in a second direction (y direction) As such, it may be different from the structure of the lower support tape 150d1 of FIG. 13A in that it has the second fine protrusions P2 at both ends.
  • the lower support tape 150d3 includes a first fine protrusion P1 in the open area Hdc1 and a second fine protrusion P2 at both ends, as shown in FIG. 15A. I can.
  • the first fine protrusion P1 is as described for the fine protrusion P1 of the lower support tape 150d1 of FIG. 13A.
  • the second minute protrusions P2 are disposed along the first direction (x direction) at both ends in the second direction (y direction), and may have a structure separated from each other.
  • the lower support tape 150d3 includes a second fine protrusion P2, so that a second length longer than the first length L1 in the second direction (y direction) from the portion corresponding to the connection body 140 ( L2). Accordingly, as can be seen in FIG. 15B, each of the second minute protrusions P2 may cover a lower surface of each of the corresponding lower terminal pins 122 of the lower contact portion 120 of the interface 100.
  • the second minute protrusions P2 support the lower contact part 120 and may contribute to reinforcing the elastic force of the lower contact part 120.
  • FIG. 15B is a plan view as viewed from the upper support tape 150u, in which the first fine protrusion P1 of the lower support tape 150d3 is exposed between the upper terminal pins 112 and the second fine protrusion P2 May be exposed between the lower terminal pins 122.
  • FIGS. 9A to 10C are perspective views of an interface assembly in which an interface and an adapter are combined according to an embodiment of the present invention, and the adapters correspond to the adapters of FIGS. 9A to 10C. Contents already described in the description of FIGS. 9A to 10C will be briefly described or omitted.
  • the interface assembly 500d may include an interface 100g and an adapter 200d of FIG. 9A.
  • the interface 100g may be the interface 100g of FIG. 4A.
  • the interface 100g is not limited to the interface 100g of FIG. 4A.
  • the interface 100g may be coupled to the adapter 200d by coupling the connection body 140 to the coupling protrusion 203 of the adapter 200d through the coupling hole H1.
  • the support tape 150 is omitted from the interface 100g and is not shown, and the same applies to FIGS. 17A to 17D.
  • the lower contact portion 120 of the interface 100g and the portion of the connection portion 130 connected thereto may be disposed between the two stoppers 201p of the body 201.
  • the lower contact portion 120 of the interface 100g may be disposed on the lower buffer 220 disposed on the lower surface of the body 201.
  • the lower buffer 220 acts as a buffer through elasticity, so that the contact can be smoothly and stably induced.
  • the interface assembly 500e of the present embodiment may be different from the interface assembly 500d of FIG. 16A in that it includes the adapter 200e of FIG. 10A.
  • the upper contact portion 110 of the interface 100g may be disposed on the upper buffer 210 inserted into the upper insertion groove Guc.
  • the upper buffer 210 can induce the contact smoothly and stably by acting as a buffer through elasticity.
  • the interface assembly 500f of FIG. 16A includes an interface 100g' having a one-sided structure and an adapter 200f of FIG. 10B corresponding thereto. May be different from Specifically, in the interface assembly 500f of the present embodiment, the interface 100g' is formed of the first partial interface 100-1g' and the second partial interface 100-2g' in a second direction (y direction).
  • the length of the connection part 130 on the upper surface of the adapter 200f may be different.
  • the connecting portion 130 of the first partial interface 100-1g' may be longer than the length of the connecting portion 130 of the second partial interface 100-2g'. Accordingly, the upper contact portion 110 may be arranged to be biased toward the second partial interface 100-2g' in the second direction (y direction).
  • the interface 100g' has a structure in which the two coupling protrusions 203 of the adapter 200f are inserted into the two coupling holes H1 of the connection body 140. , It can be coupled to the adapter (200f). Two coupling protrusions 203 may be formed only on the side of the first partial interface 100-1g'.
  • the interface assembly 500g of this embodiment may be different from the interface assembly 500f of FIG. 17B in that it includes the adapter 200g of FIG. 10C.
  • an upper insertion groove (Gue) is formed on the upper surface of the body 201 in the adapter (200g), and the upper buffer material ( 210) can be inserted.
  • the upper insertion groove Gue may be skewed toward the second partial interface 100-2g' in the second direction (y direction). Accordingly, the upper contact portion 110 of the skewed interface 100g' may be disposed on the upper buffer 210.
  • the interface (100g) has a structure in which the two coupling protrusions 203 of the adapter 200h are inserted into the two coupling holes H1 formed in the central portion of the connection body 140, and into the adapter 200h. Can be combined.
  • the FPCB body 101 may be formed of an insulating material having flexibility.
  • the FPCB body 101 may be formed of insulating plastic such as polyimide (PI), polyester (Poly-Ester: PET), glass epoxy (GE), or the like.
  • PI polyimide
  • GE glass epoxy
  • a plurality of connection wires 135 may be disposed inside the FPCB body 101.
  • the connection wiring 135 may be disposed on the top or bottom surface of the FPCB body 101, not inside.
  • the FPCB (Flexible PCB) body 101 includes an upper layer 101u, a lower layer 101d, and a side layer 101s, and as can be seen through FIG. 18C, it may have a rectangular ring shape when viewed from the side. .
  • An open area Huc may be formed in a central portion of the upper layer 101u, and an upper protrusion Pu3 may be formed in the center of the second direction (y direction) in the open area Huc.
  • the two upper protrusions Pu3 are spaced apart from each other with an open line Hul extending in the first direction (x direction). There is no separate open area in the lower layer 101d, and only the lower protrusion Pl3 protruding toward the center in the second direction (y direction) may be formed.
  • a plurality of upper terminal pins 112 constituting the upper contact part 110 may be disposed on the upper protrusion Pu3 along the first direction (x direction).
  • a plurality of lower terminal pins 122 constituting the lower contact portion 120 may be disposed on the lower protrusion Pl3 along the first direction (x direction).
  • each of the upper terminal pins 112 is connected to a corresponding connection wiring 135 through a via contact 115, and each of the lower terminal pins 122 corresponds through a via contact 125. It may be connected to the connecting wiring 135. Accordingly, each of the upper terminal pins 112 may be connected to each of the corresponding lower terminal pins 122 through the via contacts 115 and 125.
  • the interface 100-F of the present embodiment may be similar in function or effect as compared to the interface 100 of FIG. 1. That is, in the interface 100-F of the present embodiment, since the upper terminal pins 112 are directly connected to the corresponding lower terminal pins 122 through the via contacts 115 and 125 and the connection wiring 135, contact failure is prevented. The resulting error can be minimized. In addition, based on such a structure that is directly connected, there is no fear of electrical interruption due to the intervention of foreign substances except in the case of disconnection.
  • FIG. 19A and 19B are perspective and cross-sectional views of a test socket including an interface of a bending structure according to an embodiment of the present invention
  • FIG. 19B is a cross-sectional view taken along line II-II' of FIG. 19A.
  • the test socket 1000a of the present embodiment may include an interface 100, an adapter 200a, and a guide block 300a.
  • the test socket 1000a of the present embodiment may be, for example, a test socket for testing an electronic product including a micro connector.
  • the test object of the test socket 1000a according to the present embodiment is not limited to electronic products including micro connectors.
  • the interface 100 may be any one of the interfaces 100, 100g, and 100h of FIGS. 1, 4A, and 4B.
  • the interface 100 of the test socket 1000a of the present embodiment is not limited to the aforementioned interfaces.
  • an interface (100g interface) included in the interface assemblies 500f and 500h of FIG. 17B or 17D may also be used.
  • the adapter 200a may be the adapter 200a of FIG. 6A.
  • the adapter 200a is not limited to the adapter 200a of FIG. 6A.
  • the adapter 200a may be an adapter 200, 200b, 200c, 200d, 200e, 200f, 200g, 200h of FIGS. 5a, 7a, 8a, 9a, 10a, 10b, 10c, or 10d.
  • the guide block 300a may include a lower guide block 320 and an upper guide block 340. It goes without saying that the guide block 300a is not limited to the illustrated structure and may have various structures. In addition, according to an embodiment, the guide block 300a may have a structure of a single guide block rather than a structure in which two guide blocks are combined.
  • the upper guide block 340 is disposed above the lower guide block 320, a test hole Ht is formed in the center, and a guide groove Gg1 for guiding a test object is formed around the test hole Ht.
  • the test hole Ht may be formed in a line shape along the first direction (x direction) in the center portion of the upper guide block 340.
  • the location of the test hole Ht may correspond to the location of the upper contact portion 110 of the interface 100. Accordingly, as shown through FIG. 19A, the upper terminal pins 112 of the upper contact part 110 may be exposed through the test hole Ht.
  • the guide block 300a may be coupled to the test PCB 3000.
  • the lower terminal pins 122 of the interface 100 may be connected to the terminal pins of the test PCB 3000.
  • FIG. 20A to 20D are perspective, cross-sectional, and enlarged views of a test socket including an interface of a bending structure according to an embodiment of the present invention
  • FIG. 20B is a cross-sectional view taken along line III-III' of FIG. 20A
  • 20C is an enlarged view showing an enlarged portion A of FIG. 20A
  • FIG. 20D is an enlarged view showing an enlarged portion B of FIG. 20B.
  • the test socket 1000b according to the present embodiment may be different from the test socket 1000a of FIG. 19A in that it further includes the first micro connector 400.
  • the test socket 1000b of the present embodiment may include an interface 100, an adapter 200a, a guide block 300b, and a first micro connector 400.
  • the interface 100 and the adapter 200a are as described in the description of FIGS. 19A and 19B.
  • the guide block 300b may be similar to the guide block 300a of the test socket 1000a of FIG. 19A. That is, the guide block 300b includes the lower guide block 320 and the upper guide block 340a, and an interface assembly may be coupled to the inner side of the lower guide block 320. However, a side protrusion Ps may be further formed in the test hole Ht of the upper guide block 340a to define a lower test hole Ht'. The side protrusion Ps may function to prevent the first micro-connector 400 from being separated from the test socket 1000b.
  • the horizontal cross-sectional area of the lower test hole Ht' of the upper guide block 340a may be larger than the horizontal cross-sectional area of the first micro connector 400.
  • the horizontal cross-sectional area may be defined on a plane in the first direction (x direction) and the second direction (y direction).
  • the horizontal cross-sectional area of the lower test hole Ht' and the first micro connector 400 may be defined as a rectangle for convenience of comparison.
  • a dotted line portion may be included instead of a curved portion in the horizontal cross-sectional area.
  • the lead portions of the terminal pins 403 protruding from both sides in the second direction (y direction) from the lower surface may be excluded from the horizontal cross-sectional area. That is, the horizontal cross-sectional area may be defined by the side surface of the body 401 of the first micro connector 400.
  • the lower test hole Ht' may be larger than the first microconnector 400 in each of the first direction (x direction) and the second direction (y direction).
  • the first micro-connector 400 when the first micro-connector 400 is located in the center of the lower test hole Ht', it is twice the first distance Wx in the first direction (x direction), and the second direction (y direction). ), the lower test hole Ht' may be larger than the first micro connector 400 by twice the second interval Wy.
  • the first micro connector 400 is not fixed to the interface 100 and can move on the interface 100.
  • the moving range of the first micro connector 400 may be limited within the range of the horizontal cross-sectional area of the lower test hole Ht'. Accordingly, the first micro connector 400 may move in the lower test hole Ht' by twice the first interval Wx in the first direction (x direction), as indicated by the M2 arrow. In addition, the first micro connector 400 may move within the lower test hole Ht' by twice the second interval Wy in the second direction (y direction), as indicated by the M1 arrow.
  • the electronic product to be tested may be, for example, a small display module mounted with a micro connector and a camera module.
  • the types of electronic products to be tested are not limited thereto.
  • all kinds of electronic devices mounted with a micro connector may be included in an electronic product to be tested.
  • the first micro connector 400 having a male connector structure is disposed on the interface 100, but is not limited thereto, and One micro connector 400 may be disposed on the interface 100.
  • the electronic product to be tested includes a micro connector having a female connector structure
  • the electronic product May include a micro connector of a male connector structure
  • FIG. 21A to 21C are perspective views, cross-sectional views, and exploded perspective views of a test socket including an interface of a bending structure according to an embodiment of the present invention
  • FIG. 21B is a cross-sectional view showing a portion IV-IV' of FIG. 21A. to be.
  • the test socket 1000c may include an interface 100-F, an adapter 200i, and a guide block 300c.
  • the interface 100-F may be the interface 100-F of FIG. 18A. Accordingly, the interface 100 -F may have a structure in which upper terminal pins 112 and lower terminal pins 122 are disposed on the FPCB body 101.
  • a coupling groove Gj may be formed at a lower portion of the guide block 300c, and a guide groove Gg2 may be formed at an upper portion of the guide block 300c.
  • the interface assembly may be inserted into the coupling groove Gj to be coupled.
  • the guide groove Gg2 may guide the test object when testing the test object.
  • a support film Ls1 may exist at the bottom of the guide groove Gg2.
  • the support membrane Ls1 may support the test object.
  • the coupling hole Ht2 may be formed in the center portion of the support layer Ls1.
  • a test object for example, a micro connector of an electronic product including a micro connector may be connected to the interface 100-F. That is, the terminal pins of the micro connector may contact the upper terminal pins 112 of the interface 100 through the coupling hole Ht2.
  • the guide block 300c may be coupled to the test PCB 3000.
  • the lower terminal pins 122 of the interface 100 may be connected to the terminal pins 3100 of the test PCB 3000.
  • the interface of the bending structure according to the technical idea of the present invention and the test socket including the interface are directly connected to the lower terminal pins corresponding to the upper terminal pins through connection lines, so that the test object can be reliably tested, and Contaminants that accumulate through repeated tests may not be affected at all. Accordingly, it is possible to reliably test the test object at high speed.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

Une idée technique de la présente invention concerne une interface qui permet à un objet de test d'être testé de manière fiable et rapide, un ensemble interface et une prise de test contenant ladite interface, et un procédé de fabrication de ladite interface. L'interface contient des broches de borne supérieure connectées directement à des broches de borne inférieure correspondantes par l'intermédiaire de lignes de connexion de sorte qu'un objet de test puisse être testé de manière fiable sans jamais être perturbé par des contaminants, etc. accumulés par des tests répétitifs. Par conséquent, la présente invention peut contribuer à tester rapidement et de manière fiable un objet à tester.
PCT/KR2020/006275 2019-07-15 2020-05-13 Interface ayant une structure de courbure, ensemble interface et prise de test contenant ladite interface, et procédé de fabrication de ladite interface WO2021010583A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2019-0085253 2019-07-15
KR1020190085253A KR102070302B1 (ko) 2019-07-15 2019-07-15 벤딩 구조의 인터페이스, 그 인터페이스를 포함하는 인터페이스 어셈블리 및 테스트 소켓, 및 그 인터페이스 제조 방법
KR1020200008751A KR102176707B1 (ko) 2020-01-22 2020-01-22 벤딩 구조의 인터페이스, 및 그 인터페이스를 포함하는 인터페이스 어셈블리
KR10-2020-0008751 2020-01-22

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WO2021010583A1 true WO2021010583A1 (fr) 2021-01-21

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