WO2019168286A1 - Douille de test et dispositif de test la comprenant - Google Patents

Douille de test et dispositif de test la comprenant Download PDF

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Publication number
WO2019168286A1
WO2019168286A1 PCT/KR2019/001859 KR2019001859W WO2019168286A1 WO 2019168286 A1 WO2019168286 A1 WO 2019168286A1 KR 2019001859 W KR2019001859 W KR 2019001859W WO 2019168286 A1 WO2019168286 A1 WO 2019168286A1
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WO
WIPO (PCT)
Prior art keywords
connector
pcb
micro
disposed
micro connector
Prior art date
Application number
PCT/KR2019/001859
Other languages
English (en)
Korean (ko)
Inventor
이승용
Original Assignee
이승용
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020180025415A external-priority patent/KR101999320B1/ko
Priority claimed from KR1020190014436A external-priority patent/KR102071479B1/ko
Application filed by 이승용 filed Critical 이승용
Publication of WO2019168286A1 publication Critical patent/WO2019168286A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer

Definitions

  • the technical idea of the present invention relates to a test apparatus, and more particularly, to a test socket including a micro connector therein and a test apparatus including the test socket.
  • Test methods using a micro-connector include a method using a pogo-pin and a male connector inserted into a female connector.
  • the method using the pogo-pin has a problem in that a defective pin frequently occurs due to long-term use and physical force.
  • the terminal part of the micro connector may be depressed and lifted, which may lead to a product quality accident.
  • inspection errors may occur due to poor contact.
  • the connectors may be damaged by misalignment between the connectors, and thus, the life of the test socket may be shortened and the quality of the product may be caused.
  • the problem to be solved by the technical idea of the present invention is a test socket that can stably perform tests by accurately connecting a micro connector of a test socket to a product's micro connector without damage to a product mounted with a micro connector as a test object. And a test apparatus including the test socket.
  • the technical idea of the present invention is disposed on a printed circuit board (PCB), the pogo pins (pogo pins) and the pogo pins that are electrically connected to the terminals of the PCB is inserted
  • a pogo pin structure having a housing block in which two rows of guide holes are formed;
  • a connector guide block disposed on the pogo pin structure and having a through hole formed in a central portion thereof;
  • a first micro connector disposed on the pogo pin structure through the through hole and electrically connected to the pogo pins, wherein the first micro connector comprises a female or a female of a second micro connector of a test article.
  • It has a male or female connector structure corresponding to a male connector structure, wherein the first micro connector or the second micro connector of the male connector structure is the second micro connector or the first micro connector of the corresponding female connector structure. It provides a test socket, which combines into a structure that is inserted into it.
  • the technical idea of the present invention in order to solve the above problems, disposed on the base printed circuit board (PCB), the pogo pins, electrically connected to the terminals of the PCB, at least four elastic members, and the pogo A pogo pin structure having two rows of guide holes into which pins are inserted and a housing block having elastic member grooves into which the elastic members are inserted;
  • a PCB connector disposed on the pogo pin structure and electrically connected to the pogo pins, the PCB connector being movable while being supported by elastic members;
  • a connector guide block disposed on the PCB connector and the pogo pin structure and having a through hole formed in a central portion thereof;
  • a first micro connector disposed on the PCB connector through the through hole and electrically connected to the terminals of the PCB connector, wherein the first micro connector comprises at least one arm of a second micro connector of a test product;
  • a male or female connector structure corresponding to the male connector structure, wherein the first micro connector or the second micro connector of the male connector structure is
  • a rubber connector disposed on a printed circuit board (PCB), and electrically connected to the terminals of the PCB;
  • An interface having a terminal pin disposed on the rubber connector and electrically connected to the rubber connector, the terminal pins being arranged in a row on both sides;
  • a connector guide block disposed on the interface and having a first through hole formed in a central portion thereof;
  • a PCB connector disposed on the interface and electrically connected to the interface, the PCB connector being exposed through the first through hole and whose outer portion is covered by the connector guide block and is movable on the interface;
  • a first micro connector electrically connected to the PCB connector and fixed on the PCB connector through the first through hole, wherein the first micro connector is a female or male of a second micro connector to be tested.
  • a test socket having a male or female connector structure corresponding to the connector structure is provided.
  • the technical idea of the present invention in order to solve the above problems, is disposed on a printed circuit board (PCB), the lower guide block having a first through hole in the central portion; A rubber connector disposed on the PCB through the first through hole and electrically connected to the terminals of the PCB; A connector guide block disposed on the lower guide block and the rubber connector and having a second through hole formed in a central portion thereof; And disposed on the rubber connector and electrically connected to the rubber connector, the second connector is exposed through the second through hole, and an outer portion thereof is covered by the guide block.
  • PCB printed circuit board
  • a PCB connector movable on the rubber connector; And a first micro connector electrically connected to the PCB connector and fixed on the PCB connector, wherein the first micro connector corresponds to a male or male connector structure of a second micro connector to be tested.
  • a test socket having a female connector structure is provided.
  • any one of the test socket of the test socket of the test socket; And a printed circuit board (PCB) having the test socket mounted thereon.
  • PCB printed circuit board
  • the test socket according to the technical concept of the present invention has a complex structure of a pogo pin structure and a first micro connector, so that a product in which a second micro connector is mounted using the pogo pin structure and the first micro connector can be easily tested.
  • test socket according to the technical concept of the present invention further includes a connector PCB to which the first micro connector is fixedly coupled and moves, such that the first micro connector moves on the pogo pin structure through the PCB connector, thereby providing a first micro connector.
  • the second micro connector can be easily and stably combined to stably perform the test, and also prevent the destruction of the micro connectors.
  • the connector PCB to which the first micro connector is fixedly coupled, moves on an interface or a rubber connector, whereby the first micro connector and the second micro connector are stably coupled so that the test can be stably performed. Can be carried out and also the destruction of the micro connectors can be prevented.
  • the test socket according to the technical concept of the present invention can improve the life of the test socket, reduce the quality defect of the product, and improve the reliability of the test.
  • FIG. 1 is a perspective view of a test socket according to an embodiment of the present invention.
  • FIG. 2A and 2B are cutaway perspective views and a cross-sectional view of a portion II ′ of the test socket of FIG. 1, and FIG. 2C is an enlarged plan view of portion A of FIG. 2A.
  • FIG. 3A is a perspective view of the test socket of FIG. 1, with the connector guide block and the first micro connector omitted
  • FIG. 3B is a cut perspective view showing a II-II 'portion of the pogo pin structure of FIG. 3A
  • FIG. 3C Is a perspective view showing an enlarged portion B of FIG. 3B.
  • FIG. 4 is an exploded perspective view of the test socket of FIG. 1.
  • FIG. 5A is a perspective view illustrating in detail the first micro connector of the test socket of FIG. 1, and FIG. 5B is a cross-sectional view illustrating the III-III ′ portion of the first micro connector of FIG. 5A, and FIG. 5C is a cross-sectional view of FIG. 5A.
  • FIG. 6A is a perspective view illustrating in detail a second micro connector to be tested
  • FIG. 6B is a cross-sectional view of the second micro connector of FIG. 6A taken along line IV-IV ′
  • FIG. 6C is a second micro connector of FIG. 6A.
  • FIG. 7 is a perspective view of a test socket according to an embodiment of the present invention.
  • 8A and 8B are cutaway perspective views and cross-sectional views cut along the line VV ′ of the test socket of FIG. 7.
  • FIG. 9 is a perspective view of the test socket of FIG. 7, with the connector guide block omitted.
  • FIG. 9 is a perspective view of the test socket of FIG. 7, with the connector guide block omitted.
  • FIG. 10 is a perspective view of the test socket of FIG. 7 omitting and showing a connector guide block, a first micro connector, and a PCB connector.
  • FIG. 10 is a perspective view of the test socket of FIG. 7 omitting and showing a connector guide block, a first micro connector, and a PCB connector.
  • FIG. 11 is an exploded perspective view of the test socket of FIG. 7.
  • FIG. 12 is a perspective view of a test socket according to an embodiment of the present invention.
  • FIG. 13A is a cross-sectional view of the VI-VI ′ portion of the test socket of FIG. 12, and FIG. 13B is a plan view of the connector guide block in the test socket of FIG. 12.
  • FIG. 14A is a perspective view of a PCB connector in the test socket of FIG. 12, and FIG. 14B is a cross-sectional view cut along the line 'VIII' of the PCB connector of FIG. 14A.
  • test socket 15 is an exploded perspective view of the test socket of FIG. 12.
  • 16 is a cross-sectional view of a test socket according to an embodiment of the present invention.
  • FIG. 17A is a cross-sectional view of a test socket according to an embodiment of the present invention
  • FIGS. 17B and 17C are bottom views of a connector guide block in the test socket of FIG. 17A.
  • FIG. 18 is an exploded perspective view of a test socket according to an embodiment of the present invention.
  • FIG. 19 is a photograph of a test apparatus including a test socket and a test PCB according to an embodiment of the present invention.
  • FIG. 1 is a perspective view of a test socket according to an embodiment of the present invention.
  • 2A and 2B are cutaway perspective views and a cross-sectional view of a portion II ′ of the test socket of FIG. 1, and
  • FIG. 2C is an enlarged plan view of portion A of FIG. 2A.
  • FIG. 3A is a perspective view of the test socket of FIG. 1, with the connector guide block and the first micro connector omitted
  • FIG. 3B is a cut perspective view showing a II-II 'portion of the pogo pin structure of FIG. 3A
  • FIG. 3C Is a perspective view showing an enlarged portion B of FIG. 3B.
  • 4 is an exploded perspective view of the test socket of FIG. 1.
  • the test socket 100 of the present exemplary embodiment may include a pogo pin structure 110, a first micro connector 120, and a connector guide block 130.
  • Pogo pin structure 110 may include a number of pogo pins 112 and a housing block 114. Pogo pins 112 may be disposed in the central portion of the housing block 114 in two rows. Each of the pogo pins 112 may be comprised of a plunger, a barrel, a spring, or the like. However, the configuration of the pogo pins 112 is not limited to the above configuration. For example, the pogo pins 112 may be comprised of a top plunger, a barrel, a spring, a bottom plunger, and the like.
  • the housing block 114 may include an upper block 114u and a lower block 114d. Two rows of guide holes Hg may be formed in each of the upper block 114u and the lower block 114d to accommodate two rows of pogo pins 112.
  • the upper block 114u and the lower block 114d may be separated from each other. Through the separation and coupling structure of the upper block 114u and the lower block 114d, each of the pogo pins 112 may be individually replaced.
  • the housing block 114 has a structure in which the upper block 114u and the lower block 114d are separated, but the structure of the housing block 114 is not limited thereto.
  • the housing block 114 may be integrally formed.
  • Pogo pins 112 may be exposed to the upper and lower surfaces of the housing block 114 through the guide holes (Hg).
  • the lower contact portions of the pogo pins 112 are electrically connected to the terminals 310 of the printed circuit board (PCB) 300, and the upper contact portions of the pogo pins 112 are first connected to the first micro connector 120. And may be electrically connected to the terminal pins (see 122 of FIG. 5A).
  • the cross-sectional area of the upper contact portion of the pogo pins 112 may be smaller than the cross-sectional area of the guide holes (Hg).
  • a gap S may exist between the side surface of the upper contact portion of the pogo pins 112 and the guide holes Hg.
  • the upper contact portion of the pogo pins 112 may move in the horizontal direction by the distance S on the upper surface of the housing block 114.
  • the first micro connector 120 disposed above may also be movable.
  • the first micro connector 120 may be mounted in a fixed form on the pogo pin structure 110. In such an embodiment, the first micro connector 120 may not move.
  • the cross-sectional area of the upper contact portion of the pogo pins 112 may be substantially the same as that of the guide holes Hg.
  • the first micro connector 120 accommodates a plurality of first terminal pins (see 122 of FIG. 5A) and the first terminal pins 122 and includes a first connector body that retains the shape of the entire first micro connector 120. 124).
  • the first micro connector 120 may have a male connector structure as shown in FIGS. 1 to 4. However, the first micro connector 120 is not limited to the male connector structure and may have a female connector structure. The structure of the first micro connector 120 will be described in more detail in the description of FIGS. 5A to 5C.
  • the first micro connector 120 may be disposed on the pogo pin structure 110.
  • the first terminal pins 122 of the first micro connector 120 may be electrically connected to the terminals 310 of the PCB 300.
  • the first micro connector 120 can move on the pogo pin structure 110.
  • the first micro connector 120 is not mounted to be fixed on the pogo pin structure 110 by solder or the like, and may be disposed on the pogo pin structure 110 in a simply raised state. Accordingly, when the first micro connector 120 is moved when coupled with the second micro connector 210 of the product under test, the first micro connector 120 and the second micro connector 210 are stably and accurately coupled. In addition, it may be easily coupled without damaging the terminal pins 122 and 212 of the micro connectors 120 and 210.
  • the product under test may be, for example, a small display module and a camera module mounted with a micro connector.
  • the type of product under test is not limited thereto.
  • all kinds of electronic devices mounted with a micro connector may be included in a product under test.
  • the movement of the first micro connector 120 will be described in more detail in the following description of the connector guide block 130.
  • the first micro connector 120 may be mounted and fixed on the pogo pin structure 110 by solder or the like. As such, when the first micro connector 120 is mounted in a fixed form, the first micro connector 120 may not move on the pogo pin structure 110.
  • the connector guide block 130 may be disposed on the pogo pin structure 110.
  • the connector guide block 130 may have a first through hole H1 in the center thereof, and may have a first groove G1 having a multi-stage structure around the first through hole H1.
  • the first micro connector 120 may be disposed on the pogo pin structure 110 through the first through hole H1 of the connector guide block 130.
  • the first through hole H1 has the first micro connector 120 positioned at the pogo pin structure 110, for example, the pogo pins 112 and the first terminal pins 122 of the first micro connector 120. You can guide them to contact.
  • the first groove G1 may guide the second micro connector 210 of the product under test to be stably coupled with the first micro connector 120.
  • the structure of the first groove G1 may be variously changed according to the structure of the connector part including the second micro connector 210 of the product under test.
  • the horizontal cross-sectional area of the first through hole H1 of the connector guide block 130 may be larger than the horizontal cross-sectional area of the first micro connector 120.
  • the horizontal cross-sectional area may be defined on a plane parallel to the upper surface of the PCB 300, for example, on a plane in a first direction (x direction) and a second direction (y direction).
  • the horizontal cross-sectional area of the first through hole H1 and the first micro connector 120 may be defined as a rectangle for convenience of comparison.
  • the horizontal cross-sectional area may include a dotted line portion instead of a curved portion.
  • the lead portions (see 122l of FIG. 5B) of the terminal pins protruding to both sides in the second direction (y direction) from the lower surface may not be included in the horizontal cross-sectional area.
  • the first through hole H1 may be larger than the first micro connector 120 in each of the first direction (x direction) and the second direction (y direction).
  • the first through hole H1 may be larger than the first micro connector 120 by twice the second distance Wy.
  • the first micro connector 120 is not fixed on the pogo pin structure 110 and may move on the pogo pin structure 110.
  • the moving range of the first micro connector 120 may be defined within the horizontal cross-sectional area of the first through hole H1 and the moving range of the pogo pins 112.
  • the first micro connector 120 may move within the horizontal cross-sectional area of the first through hole H1 in the first direction (x direction) and the second direction (y direction), as indicated by arrows M1 and M2. have.
  • the movement of the first micro connector 120 may be limited by the movement range of the pogo pins 112 in the guide hole Hg of the pogo pin structure 110 disposed below.
  • the first micro connector 120 may be mounted on the pogo pin structure 110 in a fixed form through solder or the like. In such an embodiment, the first micro connector 120 may not move on the pogo pin structure 110.
  • the horizontal cross-sectional area of the first through hole H1 may be substantially the same as the horizontal cross-sectional area of the first micro connector 120.
  • the test socket 100 of the present exemplary embodiment may have a complex structure of the pogo pin structure 110 and the first micro connector 120. Accordingly, the test socket 100 of the present embodiment can easily test a product that is a test target in which the second micro connector 210 is mounted using the first micro connector 120 while utilizing the pogo pin structure 110. have. In addition, in the test socket 100 of the present embodiment, since the first micro connector 120 moves on the pogo pin structure 110, the first micro connector 120 and the second micro connector 210 can be stably and accurately coupled. In addition, damage to the terminal pins of the micro connectors 120 and 210 can be prevented.
  • a male or male connector (hereinafter referred to as a 'product connector') is generally mounted and fixed to a product under test, and a male or female connector (hereinafter referred to as a 'socket connector') of a test socket is mounted on a test PCB. Is mounted and fixed. In testing the product, the product connector is coupled to the socket connector. If there is an error in the mounting position of the product connector and / or the socket connector, the product connector and / or socket connector may be damaged by the misalignment according to the error of the mounting position in the bonding process. In some cases, the binding may not be performed at all. This may be due to the product connector being fixed to the product and the socket connector fixed to the test PCB.
  • the first micro connector 120 corresponding to the socket connector may move in the process of coupling. Accordingly, even if there is an error in the mounting position of the second micro connector 210 corresponding to the product connector, the coupling can be performed stably and accurately, and the damage of the micro connectors 120 and 210 can also be prevented. .
  • FIG. 5A is a perspective view illustrating in detail the first micro connector of the test socket of FIG. 1, and FIG. 5B is a cross-sectional view illustrating the III-III ′ portion of the first micro connector of FIG. 5A, and FIG. 5C is a cross-sectional view of FIG. 5A.
  • the first micro connector 120 may include first terminal pins 122 and a first connector body 124.
  • a plurality of first terminal pins 122 may be disposed along both sides of the first connector body 124.
  • the first terminal pins 122 may include a contact portion 122c surrounding the protruding side of the first connector body 124 and a lead portion 122l protruding laterally from the lower surface of the first connector body 124.
  • the contact portion 122c of the first terminal pins 122 may be a portion that contacts the contact portion (see 212c of FIG. 6B) of the second terminal pins (see 212 of FIG. 6B) of the second micro connector 210. .
  • the lead portion 122l of the first terminal pins 122 may be a portion that contacts the pogo pins 112 of the pogo pin structure 110.
  • the first terminal pins 122 of the first micro connector 120 may contact two or three points of the second terminal pins 212 of the second micro connector 210. Two or three point contacts will be described in more detail in the description of FIGS. 6A-6C.
  • the first connector body 124 may receive and support the first terminal pins 122 and may maintain a shape of the entire first micro connector 120.
  • the first connector body 124 may be formed of an insulating material for insulating the first terminal pins 122 from each other. As shown in FIG. 5A, the first connector body 124 may have a shape such as an open box that has a groove in the center and is elongated in one direction.
  • the protruding portion may be coupled into a corresponding groove portion.
  • the protruding portions of the first connector body 124 are inserted into the groove portions of the second connector body (see 214 of FIG. 6A) of the second micro connector 210, and of the center of the second connector body 214.
  • the protrusion may be inserted into the groove portion of the first connector body 124.
  • rounding structures R1 and R2 may be formed on the protruding side surfaces of the first connector body 124.
  • the rounding structures R1 and R2 naturally induce insertion when the first micro connector 120 and the second micro connector 210 are coupled to each other, such that the first micro connector 120 and the second micro connector 210 are naturally connected. It is possible to facilitate the coupling, and also to prevent damage to the terminal pins 122 and 212 of the first micro connector 120 and the second micro connector 210.
  • the first micro connector 120 has a structure that is movable on the pogo pin structure 110, the first micro connector 120 and the second micro connector 210 are more easily coupled, and the terminal pins Damage to the 122 and 212 can be further reduced.
  • FIG. 6A is a perspective view illustrating in detail a second micro connector to be tested
  • FIG. 6B is a cross-sectional view of the second micro connector of FIG. 6A taken along line IV-IV ′
  • FIG. 6C is a second micro connector of FIG. 6A.
  • the second micro connector 210 may include second terminal pins 212 and a second connector body 214.
  • a plurality of second terminal pins 212 may be disposed along both grooves of the second connector body 214.
  • the second terminal pins 212 may include a contact portion 212c surrounding the groove of the second connector body 214 and a lead portion 212l extending from the contact portion 212c to the bottom surface of the second connector body 214. It may include. As described above, the contact portion 212c of the second terminal pins 212 may contact the contact portion 122c of the first terminal pins 122.
  • the lead portion 212l of the second terminal pins 212 contacts the terminals of the PCB of the product under test, and in general, the lead portion 212l is fixed to the PCB of the product by soldering, so that the second micro connector 210 may be mounted to the PCB of the product.
  • the first terminal pins 122 of the first micro connector 120 may contact two or three points of the second terminal pins 212 of the second micro connector 210.
  • the first terminal pins 122 may make two point contact with the second terminal pins 212.
  • the upper surface portions of the first terminal pins 122 may contact the bottom portions of the second terminal pins 212. Accordingly, the first terminal pins 122 may make three point contact with the second terminal pins 212.
  • the first terminal pins 122 of the first micro connector 120 make two or three point contacts with the second terminal pins 212 of the second micro connector 210, the reliability of the contact can be improved and thus As a result, the reliability of the test can be improved.
  • the first terminal pins 122 of the first micro connector 120 of FIG. 5B and FIG. 6B and the second terminal pins 212 of the second micro connector 210 are an exemplary structure.
  • the structure of the pins 122 and 212 is not limited thereto.
  • various structures capable of two or three point contact may be employed in the terminal pins of the first micro connector 120 and the second micro connector 210.
  • terminal pins having a one point contact structure may also be employed in the first micro connector 120 and the second micro connector 210.
  • the second connector body 214 may receive and support the second terminal pins 212 and may maintain a shape of the entire second micro connector 210.
  • the second connector body 214 may be formed of an insulating material for insulating the second terminal pins 212 from each other.
  • the second connector body 214 may have a shape such as an open box elongated in one direction, and an elongated protrusion may be disposed at the center thereof, and the protrusion may surround the groove. have.
  • the structure of the second connector body 214 may correspond to the structure of the first connector body 124 of the first micro connector 120.
  • the protruding portions of the first connector body 124 are inserted into the groove portions of the second connector body 214, and the protrusion of the center of the second connector body 214 is the groove portion of the first connector body 124. Can be inserted in
  • rounding structures R3 and R4 may be formed on the outer side surfaces and the central protrusion of the second connector body 214.
  • the rounding structures R3 and R4 naturally induce insertion when the first micro connector 120 and the second micro connector 210 are coupled to each other, such that the first micro connector 120 and the second micro connector 210 are naturally connected. It is possible to facilitate the coupling, and to prevent damage to the terminal pins 122 and 212 of the first micro connector 120 and the second micro connector 210.
  • the first micro connector 120 also includes the rounding structures R1 and R2, so that the first micro connector 120 and the second micro connector 210 are more easily. Can be combined.
  • the coupling ease of the first micro connector 120 and the second micro connector 210 may be further increased. .
  • FIG. 7 is a perspective view of a test socket according to an embodiment of the present invention.
  • 8A and 8B are cutaway perspective views and cross-sectional views cut along the line VV ′ of the test socket of FIG. 7.
  • FIG. 9 is a perspective view of the test socket of FIG. 7, with the connector guide block omitted.
  • FIG. 10 is a perspective view of the test socket of FIG. 7 omitting and showing a connector guide block, a first micro connector, and a PCB connector.
  • FIG. 11 is an exploded perspective view of the test socket of FIG. 7. Descriptions already described in the description of FIGS. 1 to 6C are simply described or omitted.
  • the test socket 100a of this embodiment further includes a PCB connector 140, in that the pogo pin structure 110a structure is modified to accommodate the PCB connector 140. It may be different from the test socket 100 of 1.
  • the test socket 100a of the present embodiment may include a pogo pin structure 110a, a first micro connector 120, a connector guide block 130, and a PCB connector 140.
  • the pogo pin structure 110a may include a plurality of pogo pins 112, a housing block 114a, and elastic members 116. Pogo pins 112 are as described in the description of FIGS. 1 to 4.
  • the housing block 114a may include an upper block 114ua and a lower block 114d.
  • two rows of guide holes Hg may be formed to accommodate two rows of pogo pins 112.
  • the upper block 114ua and the lower block 114d may be separated from each other. Through the separation and coupling structure of the upper block 114ua and the lower block 114d, each of the pogo pins 112 may be individually replaced.
  • elastic member holes Ge may be formed in the upper block 114ua to accommodate the elastic members 116.
  • a PCB connector guide groove Gc may be formed on the upper surface of the upper block 114ua to accommodate the PCB connector 140.
  • the two rows of guide holes Hg are disposed at the center portion of the PCB connector guide groove Gc, and the elastic member holes Ge are disposed at the outer portion of the PCB connector guide groove Gc.
  • the elastic member holes Ge may be formed to match the number of elastic members 116.
  • the pogo pin structure 110a may include six elastic members 116, and thus six elastic member holes Ge may also be disposed.
  • the number of the elastic members 116 and the elastic member holes Ge is not limited to six.
  • the number of elastic members 116 and elastic member holes Ge may be less than six or more than seven.
  • the elastic members 116 and the elastic member holes Ge may be an even number, and are arranged symmetrically with respect to the center line of the PCB connector guide groove Gc. Can be.
  • the elastic members 116 support the PCB connector 140 disposed upward, and may also impart mobility to the PCB connector 140.
  • the mobility by the elastic members 116 is not limited to the mobility in the third direction (z direction) that is perpendicular to the upper surface of the PCB 300, the first direction (x) parallel to the upper surface of the PCB 300 Direction) and mobility in the second direction (y direction).
  • the elastic members 116 may be formed of, for example, a spring.
  • the type of elastic members 116 is not limited to the spring.
  • the elastic members 116 may be formed of a rubber having good elastic force.
  • PCB connector 140 may be disposed on pogo pin structure 110a. More specifically, the PCB connector 140 may be disposed in the PCB connector guide groove Gc of the upper block 114ua.
  • the PCB connector 140 includes terminal pins 144, the terminal pins 144 being electrically connected to the pogo pins 112 of the pogo pin structure 110a to the bottom and the first micro connector 120 to the top. It may be electrically connected to the first terminal pins 122 of the.
  • the terminal pins 144 of the PCB connector 140 may be formed to penetrate the body, which is an insulating material, or may be formed on the upper and lower surfaces of the body and connected to each other through via contacts.
  • the horizontal cross-sectional area of the PCB connector 140 may be smaller than the horizontal cross-sectional area of the PCB connector guide groove Gc.
  • the horizontal cross-sectional area is as described above with respect to the horizontal cross-sectional area of the first through hole (H1) and the first micro connector 120.
  • the PCB connector guide groove Gc may be larger than the PCB connector 140 by the first gap S1 and the second gap S2 in the second direction (y direction).
  • the PCB connector guide groove Gc may be larger than the PCB connector 140 by predetermined intervals even in the first direction (x direction).
  • the PCB connector 140 can freely move to some extent within the PCB connector guide groove Gc.
  • the PCB connector 140 may move in the depth range of the PCB connector guide groove Gc in the vertical direction, that is, in the third direction (z direction), as indicated by the M3 arrow, and horizontal, as indicated by the M2 arrow.
  • the first micro connector 120 and the connector guide block 130 may be disposed on the PCB connector 140.
  • the outer portion of the connector guide block 130 may be disposed in direct contact with the upper surface of the pogo pin structure (110a). Accordingly, the PCB connector 140 may be sealed by the pogo pin structure 110a and the connector guide block 130 and may not be exposed to the outside.
  • the first micro connector 120 may be mounted on the PCB connector 140 in a fixed form through solder or the like.
  • the first terminal pins 122 of the first micro connector 120 may be electrically connected to the terminal pins 144 of the PCB connector 140.
  • the PCB connector 140 is movable, the first micro connector 120 does not need to be mounted to be movable on the PCB connector 140.
  • the PCB connector 140 is movable, when the second micro connector 210 is coupled to the first micro connector 120, the PCB connector 140 is moved to thereby move the first micro connector 120.
  • the second micro connector 210 may be aligned with each other.
  • the horizontal cross-sectional area of the first micro connector 120 may be smaller than the horizontal cross-sectional area of the first through hole H1 of the connector guide block 130.
  • the difference in the horizontal cross-sectional area of the first micro connector 120 and the first through hole H1 may correspond to the difference in the horizontal cross-sectional area of the PCB connector 140 and the PCB connector guide groove Gc.
  • the difference between the horizontal cross-sectional area of the first micro connector 120 and the first through hole H1 is greater than the difference between the horizontal cross-sectional area of the PCB connector 140 and the PCB connector guide groove Gc.
  • the PCB connector 140 when the difference in the horizontal cross-sectional area of the first micro connector 120 and the first through hole H1 is smaller than the difference in the horizontal cross-sectional area of the PCB connector 140 and the PCB connector guide groove Gc, the PCB connector 140 ) May be limited by the horizontal cross-sectional area of the first through hole H1.
  • the difference in the horizontal cross-sectional area of the PCB connector 140 and the PCB connector guide groove Gc is equal to the difference in the horizontal cross-sectional area of the first micro connector 120 and the first through hole H1. May be substantially the same.
  • the test socket 100a of the present embodiment has a complex structure of the pogo pin structure 110a and the first micro connector 120, and includes a PCB connector 140 to which the first micro connector 120 can be fixedly coupled and moved. It may further include. Accordingly, the test socket 100a of this embodiment moves the first micro connector 120 on the pogo pin structure 110a through the PCB connector 140 to thereby mount the product on which the second micro connector 210 is mounted.
  • the first micro connector 120 and the second micro connector 210 can be easily and stably coupled to perform the test stably, and also damage the terminal pins of the micro connectors 120 and 210. Can be prevented.
  • FIG. 12 is a perspective view of a test socket according to an embodiment of the present invention.
  • FIG. 13A is a cross-sectional view of the VI-VI ′ portion of the test socket of FIG. 12, and FIG. 13B is a plan view of the test socket of FIG. 12, seen from the top surface FS with respect to the connector guide block.
  • FIG. 14A is a perspective view of a PCB connector in the test socket of FIG. 12, and FIG. 14B is a cross-sectional view cut along the line 'VIII' of the PCB connector of FIG. 14A.
  • 15 is an exploded perspective view of the test socket of FIG. 12.
  • the test socket 100b includes a rubber connector 150, an interface 160, a PCB connector 140, a first micro connector 120, a connector guide block 130, And a lower guide block 170.
  • the rubber connector 150 may include a rubber body and a plurality of conductive lines formed in the rubber body.
  • the rubber connector 150 may be disposed on the PCB 300 of the test apparatus (see 1000 in FIG. 19), and the conductive lines of the rubber connector 150 may be electrically connected to the terminals 310 of the PCB 300. .
  • the lower guide block 170 may be disposed on the PCB 300.
  • the lower guide block 170 may have a first through hole H1 in the center, and may have a first groove G1 of a predetermined depth around the first through hole H1.
  • the rubber connector 150 may be disposed on the PCB 300 through the first through hole H1 of the lower guide block 170.
  • the first through hole H1 may guide the rubber connector 150 to be disposed at a position on the PCB 300, for example, a portion of the groove Gp in which the terminals 310 are located.
  • the first groove G1 may provide a space in which the interface 160 may be bent to provide a buffer function.
  • the lower guide block 170 may be omitted.
  • the interface 160 may include a plurality of terminal pins 162 disposed at both sides of the central portion and the support 164 of the outer portion.
  • the interface 160 may be disposed on the rubber connector 150 and the lower guide block 170.
  • the terminal pins 162 of the interface 160 may be electrically connected to conductive lines of the rubber connector 150 disposed below.
  • the interface 160 may include terminal pins 162, a support 164, and a support film (not shown).
  • the terminal pins 162 may be disposed along both sides of the elongated through hole formed in the center portion, and may be electrically and physically separated from each other.
  • the support part 164 may be disposed at both outer portions in the extending direction of the through hole, and may be formed of the same metal material as the terminal pins 162.
  • the interface 160 may be included in the test socket 100b and fixed through the support 164. Meanwhile, the support film is disposed on the upper and lower surfaces of the terminal pins 162 and the support part 164 to fix the terminal pins 162, but the terminal pins 162 are connected to the terminal pins 144 of the PCB connector 140.
  • the support film may be disposed such that portions of the terminal pins 162 adjacent to the through holes are exposed to the outside.
  • the terminal pins 162 may be electrically connected to the upper PCB connector 140 and the lower rubber connector 150 through the exposed portion.
  • the interface 160 may be formed to have a structure including a flexible PCB (FPCB) and terminal pins.
  • the terminal pins of the interface 160 may be formed on the top and bottom surfaces of the FPCB, and the terminal pins on the top and bottom surfaces may be paired with each other.
  • the paired two terminal pins may be electrically connected to each other via via contacts formed in the FPCB.
  • the PCB connector 140 is disposed on the interface 160 and can move on the interface 160.
  • the PCB connector 140 may include a body 142, terminal pins 144, and via contacts 146.
  • the body 142 may be formed of a material used for a general PCB.
  • the body 142 may be formed of an resin such as paper phenol, epoxy, PI, BT, Teflon, or an insulator such as ceramic.
  • the material of the body 142 is not limited to the above-mentioned materials.
  • the term PCB connector 140 may be derived from the fact that the body 142 is formed of a material used for the PCB and functions as a connector.
  • the terminal pins 144 may include upper terminal pins 144t formed on the upper surface of the body 142 and lower terminal pins 144b formed on the lower surface of the body 142.
  • the terminal pins 144 are arranged in pairs with the upper and lower terminal pins, and the two paired terminal pins may be electrically connected to each other through the via contacts 146 formed through the body 142. have. Meanwhile, SR or PSR 148 may be coated on the top and bottom surfaces of the body 142 around the terminal pins 144.
  • the first micro connector 120 includes a plurality of first terminal pins 122 and first terminal pins 122 and a first connector body 124 that retains the shape of the entire first micro connector 120. can do.
  • the first micro connector 120 may have a male connector structure as shown in FIGS. 12 to 15. However, the first micro connector 120 is not limited to the male connector structure and may have a female connector structure.
  • the test socket including the first micro connector of the female connector structure will be described in more detail in the description of FIG. 16.
  • the first micro connector 120 may be disposed on the PCB connector 140.
  • the first micro connector 120 may be coupled to be disposed on the PCB connector 140 in a fixed form.
  • the first terminal pins 122 of the first micro connector 120 are fixed to the terminal pins 144 of the corresponding PCB connector 140, that is, the upper terminal pins 144t through solder or solder, and electrically. Can be connected.
  • the PCB connector 140 can move on the interface 160 and, accordingly, the first micro connector 120 fixed to the PCB connector 140 can also move together.
  • the PCB connector 140 may not be fixed on the interface 160 by solder or the like, but may be disposed in a simply raised state on the interface 160. Accordingly, when the first micro connector 120 is coupled with the second micro connector 210 of the product under test, the PCB connector 140 and the first micro connector 120 fixed thereto are free to move, thereby providing a first The micro connector 120 and the second micro connector 210 can be coupled stably and accurately. In addition, damage to the terminal pins 122 and 212 of each of the first and second micro connectors 120 and 210 may be prevented.
  • the product under test may be, for example, a small display module and a camera module mounted with a micro connector.
  • the type of product under test is not limited thereto.
  • all kinds of electronic devices mounted with a micro connector may be included in a product under test.
  • the connector guide block 130 will be described in more detail below.
  • the connector guide block 130 may be disposed on the PCB connector 140.
  • the connector guide block 130 may have a second through hole H2 at the center thereof, and may have a second groove G2 having a multi-stage structure around the second through hole H2.
  • the first micro connector 120 may be disposed and fixed on the PCB connector 140 through the second through hole H2 of the connector guide block 130.
  • the second through hole H2 may guide the PCB connector 140 to be disposed at a proper position on the interface 160.
  • the second groove G2 may guide the second micro connector 210 of the product under test to be stably coupled with the first micro connector 120.
  • the structure of the second groove G2 may be variously changed according to the structure of the connector part including the second micro connector 210 of the product under test.
  • the horizontal cross-sectional area of the second through hole H2 of the connector guide block 130 may be larger than the horizontal cross-sectional area of the first micro connector 120.
  • the horizontal cross-sectional area may be defined on a plane parallel to the upper surface of the PCB 300, for example, on a plane in a first direction (x direction) and a second direction (y direction).
  • the horizontal cross-sectional area of the second through hole H2 and the first micro connector 120 may be defined as a rectangle for convenience of comparison.
  • a dotted line portion may be included instead of a curved portion in the horizontal cross-sectional area.
  • the lead portions of the first terminal pins 122 protruding from the lower surface to both sides of the first connector body 124 in the second direction (y direction) are excluded from the horizontal cross-sectional area. Can be.
  • the horizontal cross-sectional area of the second through hole H2 may be greater than the horizontal cross-sectional area of the first micro connector 120 in the first direction (x direction) and the second direction (y direction), respectively.
  • the horizontal cross-sectional area of the second through hole H2 is equal to the first interval Wx1 and the second interval Wx2 in the first direction (x direction), and the first interval Wy1 in the second direction (y direction).
  • the dotted square shows the outer portion of the PCB connector 140 disposed under the connector guide block 130.
  • the first micro connector 120 is fixed to the PCB connector 140, but the PCB connector 140 may move on the interface 160.
  • the moving range of the first micro connector 120 is limited within the range of the cross-sectional area of the second through hole H2
  • the moving range of the PCB connector 140 is also within the range in which the first micro connector 120 can move. May be limited. Therefore, the PCB connector 140 and the first micro connector 120 have a second through hole in the first direction (x direction) by the first interval Wx1 and the second interval Wx2, as indicated by the M1 arrow. Can move within (H2).
  • the PCB connector 140 and the first micro connector 120 have a second through hole in the second direction (y direction) by the first interval Wy1 and the second interval Wy2, as indicated by the M2 arrow. Can move within (H2).
  • the connector guide block 130 has a protrusion PS formed around the second through hole H2, and the moving range of the first micro connector 120 in the second direction (y direction) is defined by the protrusion ( PS).
  • the protrusion PS of the connector guide block 130 may be omitted, and in such a case, the moving range of the first micro connector 120 in the second direction (y direction) may be the first micro connector.
  • the distance between the first terminal pins 122 of the 120 and the side surface of the second through hole H2 may be limited.
  • the second micro connector 210 is a micro connector mounted and fixed to a product to be tested, and is separated from the product for convenience of description.
  • the second micro connector 210 may have a female connector structure.
  • the second micro connector 210 may have a male connector structure.
  • the first micro connector 120 of the test socket 100b of the present embodiment may have a male connector structure as shown in FIG. 12 and the like. have.
  • the second micro connector 210 of the product has a male connector structure
  • the second micro connector 210 may have a female connector structure like the first micro connector 120a of the test socket 100c of FIG. 16. A case in which the first micro connector has a female connector structure will be described in more detail in the description of FIG. 16.
  • the PCB 300 may correspond to a part of the PCB 300 of the test apparatus (see 1000 of FIG. 19) in which the test socket 100b is mounted.
  • the test socket 100b may be mounted and fixed to the PCB 300 through the coupling member 360, for example, a screw or a bolt.
  • the PCB connector 140 and the first micro connector 120 fixed thereto may move on the interface 160. Accordingly, when the first micro connector 120 is coupled to the second micro connector 210 of the product under test, the first micro connector 120 is freely moved and aligned with the second micro connector 210. The first micro connector 120 and the second micro connector 210 may be stably and accurately coupled, and damage to the terminal pins 122 and 212 of the micro connectors 120 and 210 may be prevented. As a result, the lifespan of the test socket 100b can be improved, the quality defect of the product can be reduced, and the reliability of the test can be improved.
  • the PCB connector 140 and the first micro connector 120 are not fixed to the interface 160 through solder or the like, when the PCB connector 140 and the first micro connector 120 have a defect, they are individually. By replacing, the replacement cost of the test socket 100b can be reduced.
  • FIG. 16 is a cross-sectional view of a test socket according to an embodiment of the present invention and may correspond to FIG. 13A. Descriptions already described in the description of FIGS. 12 to 15 are simply described or omitted.
  • the test socket 100c of the present embodiment is different from the test socket 100b of FIG. 13A in that the first micro connector 120a of the female connector structure is disposed on the PCB connector 140. Can be.
  • the first micro connector 120a of the female connector structure may also include the first terminal pins 122a and the first connector body 124a.
  • the first terminal pins 122a of the first micro connector 120a may be fixed and electrically connected to the terminal pins 144 of the corresponding PCB connector 140 through solder or the like.
  • the product under test may include the second micro connector of the male connector structure.
  • the first terminal pins 122a of the first micro connector 120a are different from the first terminal pins 122 of the first micro connector 120 of the male connector structure. 1 may hardly protrude outward from the side of the connector body 124a. Accordingly, a protrusion (see PS of FIG. 13A) covering the protrusion of the first terminal pins 122a may not exist in the second through hole H2 of the connector guide block 130a.
  • the movement range of the first micro connector 120a in the second direction (y direction) is defined by the side of the first terminal pins 122a or the first connector body 124a and the second penetration of the connector guide block 130a. It may be limited by the spacing between the sides of the hole (H2). Meanwhile, as the moving range of the first micro connector 120a is limited by the second through hole H2, the moving range of the PCB connector 140 fixed to the first micro connector 120a is also correspondingly corresponding thereto. Restrictions are as described above.
  • FIG. 17A is a cross-sectional view of a test socket according to an exemplary embodiment of the present invention
  • FIGS. 17B and 17C are bottom views of the test socket of FIG. 17A viewed from a bottom surface (BS) of a connector guide block.
  • FIG. 17A may correspond to FIG. 13A
  • FIGS. 17B and 17C show a state where the PCB connector is disposed and removed on the bottom surface of the connector guide block, respectively.
  • a connector accommodating groove PG1 is formed on a lower surface of the connector guide block 130b, and a PCB connector 140 is formed in the connector accommodating groove PG1. It may be different from the test socket 100b of FIG. 13A in that it is arranged.
  • the horizontal cross-sectional area of the connector receiving groove PG1 may be larger than the horizontal cross-sectional area of the PCB connector 140.
  • the horizontal cross-sectional area of the connector accommodating groove PG1 is equal to the first interval W'x1 and the second interval W'x2 in the first direction (x direction) and the first direction in the second direction (y direction).
  • the horizontal cross-sectional area of the PCB connector 140 may be greater than the distance W'y1 and the second distance W'y2.
  • the test socket 100d of the present embodiment may also have the first micro connector 120 fixed to the PCB connector 140, and the PCB connector 140 may move on the interface 160. That is, the PCB connector 140 may move in the first direction (x direction), as indicated by the M1 arrow, and in the second direction (y direction), as indicated by the M2 arrow. On the other hand, the PCB connector 140 may move within the range of the horizontal cross-sectional area of the connector accommodating groove PG1 or within the moving range of the first micro connector 120 within the cross-sectional area of the second through hole H2. . In addition, the moving range of the PCB connector 140 may be limited to the narrower of the two ranges.
  • a plurality of elastic member accommodation grooves PG2 may be formed in the connector accommodation groove PG1 of the connector guide block 130b.
  • An elastic member such as a spring may be disposed in the elastic member receiving groove PG2, and the PCB connector 140 may be disposed on the elastic member.
  • the elastic member is disposed between the connector guide block 130b and the PCB connector 140, so that the PCB connector 140 may move in the vertical direction (z direction) together with the horizontal movement.
  • the first micro connector 120 may be more easily and stably coupled with the second micro connector (see 210 of FIG. 15) of the product under test.
  • the test socket 100d of the present embodiment is also not limited to the structure of the male connector structure of the first micro connector 120 fixedly disposed on the PCB connector 140.
  • a first micro connector (see 120a of FIG. 16) having a female connector structure may be fixedly disposed on the PCB connector 140.
  • FIG. 18 is an exploded perspective view of a test socket according to an embodiment of the present invention.
  • the contents already described are simply described or omitted.
  • the test socket 100e of the present embodiment may be different from the test socket 100 of FIG. 15 in that it does not include an interface. More specifically, the test socket 100e of the present embodiment includes a rubber connector 150, a PCB connector 140, a first micro connector 120, a connector guide block 130, and a lower guide block 170. can do.
  • the PCB connector 140 is disposed on the rubber connector 150 and can move on the rubber connector 150.
  • the first micro connector 120 may be fixedly disposed on the PCB connector 140.
  • the degree of movement of the PCB connector 140 and the first micro connector 120 may be limited by the second through hole H2 formed in the connector guide block 130.
  • the PCB connector 140 when the PCB connector 140 is disposed in the connector receiving groove (see PG1 of FIG. 17B) on the lower surface of the connector guide block 130, it may be limited by the connector receiving groove.
  • the first micro connector 120 of the male connector structure instead of the first micro connector 120 of the male connector structure, the first micro connector of the female connector structure (see 120a of FIG. 16) may be fixedly disposed on the PCB connector 140.
  • the rubber connector 150, the first micro connector 120, the connector guide block 130, the lower guide block 170, and the second micro connector 210 are described with reference to FIGS. 12 to 17C. As described in the section.
  • FIG. 19 is a photograph of a test apparatus including a test socket and a test PCB according to an embodiment of the present invention.
  • the test apparatus 1000 may include a test socket 100 and a PCB 300.
  • the test socket 100 may be the test socket 100 of FIG. 1.
  • the present invention is not limited thereto, and the test sockets 100a to 100e of FIGS. 7, 12, 16, 17a, or 18 may be applied to the test apparatus 1000 of the present embodiment.
  • the test socket 100 may be mounted on the PCB 300.
  • the PCB 300 may be, for example, a test PCB for testing a product mounted with a micro connector, for example, a small display module or a camera module.
  • the test apparatus 1000 of the present embodiment uses the test sockets 100, 100a to 100e of FIGS. 1, 7, 12, 16, 17a, or 18 mounted on the PCB 300. By testing a product with a micro connector, the product can be tested reliably and reliably.
  • a test socket including a movable PCB connector and a test device including the test socket may include a first micro connector when the first micro connector is coupled with a second micro connector of a product under test. By moving freely through and aligned with the second micro connector, the first micro connector and the second micro connector can be stably and accurately coupled.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

L'idée technique de la présente invention concerne une douille de test et un dispositif de test comprenant la douille de test, dans laquelle un test peut être réalisé de manière stable par connexion de manière précise d'un connecteur de la douille de test à un connecteur d'un produit sur lequel est monté un microconnecteur devant faire l'objet d'un test sans dommage tout en adoptant à la fois un type à broches pogo et un procédé d'insertion. La douille de test comprend : une structure à broches pogo disposée sur une carte de circuit imprimé (PCB), et ayant des broches pogo connectées électriquement à des bornes de la PCB, et un bloc de logement ayant deux rangées de trous de guidage dans lesquels les broches pogo sont insérées ; un bloc de guidage de connecteur disposé sur la structure à broches pogo et ayant un trou traversant au niveau d'une partie centrale de celui-ci ; et un premier microconnecteur disposé sur la structure à broches pogo à travers le trou traversant et connecté électriquement aux broches pogo.
PCT/KR2019/001859 2018-03-02 2019-02-15 Douille de test et dispositif de test la comprenant WO2019168286A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2018-0025415 2018-03-02
KR1020180025415A KR101999320B1 (ko) 2018-03-02 2018-03-02 포고 핀을 포함한 테스트 소켓 및 그 테스트 소켓을 포함한 테스트 장치
KR1020190014436A KR102071479B1 (ko) 2019-02-07 2019-02-07 이동 가능한 pcb 커넥터를 포함한 테스트 소켓 및 그 테스트 소켓을 포함한 테스트 장치
KR10-2019-0014436 2019-02-07

Publications (1)

Publication Number Publication Date
WO2019168286A1 true WO2019168286A1 (fr) 2019-09-06

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PCT/KR2019/001859 WO2019168286A1 (fr) 2018-03-02 2019-02-15 Douille de test et dispositif de test la comprenant

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WO (1) WO2019168286A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112986687A (zh) * 2021-04-30 2021-06-18 成都宏明电子股份有限公司 具有表面电极的热敏电阻芯片筛选测试辅助工装

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JP2004503783A (ja) * 2000-06-16 2004-02-05 日本発条株式会社 マイクロコンタクタプローブと電気プローブユニット
US20060052011A1 (en) * 2004-09-08 2006-03-09 Advanced Interconnections Corporation Double-pogo converter socket terminal
KR101030804B1 (ko) * 2010-04-09 2011-04-27 이승룡 인터페이스와 그 제조방법, 그 인터페이스를 포함한 테스트 소켓, 및 그 테스트 소켓을 포함한 테스트 장치
KR20120075083A (ko) * 2010-12-28 2012-07-06 (주)인텍 연성회로기판 검사 장치
KR101786831B1 (ko) * 2017-09-06 2017-10-18 (주) 네스텍코리아 B to B 컨넥터 모듈 및 반도체 테스트용 멀티 컨택이 가능한 테스트 소켓

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Publication number Priority date Publication date Assignee Title
JP2004503783A (ja) * 2000-06-16 2004-02-05 日本発条株式会社 マイクロコンタクタプローブと電気プローブユニット
US20060052011A1 (en) * 2004-09-08 2006-03-09 Advanced Interconnections Corporation Double-pogo converter socket terminal
KR101030804B1 (ko) * 2010-04-09 2011-04-27 이승룡 인터페이스와 그 제조방법, 그 인터페이스를 포함한 테스트 소켓, 및 그 테스트 소켓을 포함한 테스트 장치
KR20120075083A (ko) * 2010-12-28 2012-07-06 (주)인텍 연성회로기판 검사 장치
KR101786831B1 (ko) * 2017-09-06 2017-10-18 (주) 네스텍코리아 B to B 컨넥터 모듈 및 반도체 테스트용 멀티 컨택이 가능한 테스트 소켓

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112986687A (zh) * 2021-04-30 2021-06-18 成都宏明电子股份有限公司 具有表面电极的热敏电阻芯片筛选测试辅助工装

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