WO2021008634A1 - 叠瓦组件的制造方法及叠瓦组件 - Google Patents

叠瓦组件的制造方法及叠瓦组件 Download PDF

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Publication number
WO2021008634A1
WO2021008634A1 PCT/CN2020/118132 CN2020118132W WO2021008634A1 WO 2021008634 A1 WO2021008634 A1 WO 2021008634A1 CN 2020118132 W CN2020118132 W CN 2020118132W WO 2021008634 A1 WO2021008634 A1 WO 2021008634A1
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Prior art keywords
adhesive
conductive
bus bar
solar cell
sheet
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PCT/CN2020/118132
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English (en)
French (fr)
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WO2021008634A4 (zh
Inventor
丁二亮
孙俊
尹丙伟
陈登运
李岩
石刚
谢毅
刘汉元
Original Assignee
成都晔凡科技有限公司
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Publication date
Application filed by 成都晔凡科技有限公司 filed Critical 成都晔凡科技有限公司
Priority to AU2020314513A priority Critical patent/AU2020314513B2/en
Priority to JP2021540367A priority patent/JP7239713B2/ja
Priority to EP20840082.0A priority patent/EP4095932A4/en
Priority to KR1020217007231A priority patent/KR102531377B1/ko
Priority to US17/281,119 priority patent/US20210343887A1/en
Publication of WO2021008634A1 publication Critical patent/WO2021008634A1/zh
Publication of WO2021008634A4 publication Critical patent/WO2021008634A4/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0508—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module the interconnection means having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/22—Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
    • H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
    • H01L31/0201—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules comprising specially adapted module bus-bar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/043—Mechanically stacked PV cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
    • H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83908—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector involving monitoring, e.g. feedback loop
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the invention relates to the field of energy, in particular to a manufacturing method of a shingle assembly and a shingle assembly.
  • shingled modules use the electrical principle of low current and low loss (the power loss of photovoltaic modules is proportional to the square of the operating current) to greatly reduce the power loss of the modules. Secondly, it generates electricity by making full use of the inter-chip spacing area of the battery assembly, and the energy density per unit area is high.
  • conductive adhesives with elastomer properties are currently used instead of conventional photovoltaic metal ribbons for modules. Because the photovoltaic metal ribbons exhibit higher series resistance in the entire cell, the current loop of the conductive adhesive has a much shorter stroke than welding. The method of ribbons finally makes the shingled modules become highly efficient modules.
  • the reliability of outdoor applications is better than the performance of conventional photovoltaic modules, because the shingled modules avoid the stress damage to the battery and battery interconnection position and other confluence areas by the metal soldering strip .
  • the failure probability of conventional components using metal ribbon interconnection package is much higher than that of crystalline silicon battery chip package after using elastomer conductive adhesive to interconnect and cut. Shingled components.
  • the current mainstream technology of shingle assembly uses conductive adhesive to interconnect the cut cells, and the conductive adhesive is mainly composed of a conductive phase and an adhesive phase.
  • the conductive phase is mainly composed of precious metals, such as pure silver particles or silver-coated copper, silver-coated nickel, silver-coated glass and other particles, and is used to conduct electricity between solar cells. Its particle shape and distribution meet the optimal electrical conductivity As a benchmark, currently more flake or ball-like combination silver powder with D50 ⁇ 10um level is mostly used.
  • the adhesive phase is mainly composed of high-molecular resin polymers with weather resistance, and acrylic resin, silicone resin, epoxy resin, polyurethane, etc. are usually selected according to the adhesive strength and weather resistance stability.
  • conductive adhesive manufacturers will complete the design of conductive phase and bonding phase formula to ensure The performance stability of shingled components in the initial environmental corrosion test and long-term outdoor practical application.
  • the battery components connected by conductive glue after being packaged, they are subject to environmental erosion during actual outdoor use, such as high and low temperature alternating thermal expansion and contraction resulting in relative displacement between the conductive glue.
  • the most serious cause is the virtual connection or even open circuit of the current.
  • the main reason is generally the weak connection ability between the materials after the combination.
  • the weak connection ability is mainly manifested in that the conductive adhesive operation in the process requires a process operation window. In the actual production process, this window is relatively narrow and is very susceptible to environmental factors, such as the temperature and humidity of the workplace, and the time spent in the air after applying the glue. Length and so on will make the conductive glue lose its activity.
  • the conductive adhesive is mainly composed of polymer resin and a large amount of precious metal powder, which is costly and damages the ecological environment to a certain extent (the production and processing of precious metals pollute the environment).
  • the conductive adhesive is a paste, which has a certain degree of fluidity during the sizing or lamination process, and it is very easy to overflow the glue and cause the short circuit of the positive and negative electrodes of the shingled interconnected battery string.
  • most shingled components made by conductive adhesive bonding have the characteristics of weak interconnection strength, high environmental requirements for the manufacturing process, easy short-circuiting when the process is used, high cost of use, and low production efficiency. .
  • the existing shingle assembly requires welding ribbons to be arranged at both ends of the battery string, and then typesetting and confluence welding are performed.
  • the method of stacking and then typesetting is less efficient and costly, and the separation of the stacking process and the typesetting process makes it difficult to change the layout, and the solder ribbon will cause the power loss of the cell and affect the conversion efficiency .
  • the purpose of the present invention is to provide a method for manufacturing a shingle assembly and the shingle assembly.
  • the method provided by the present invention can combine the typesetting process and the lamination process into one, and directly laminate and typeset the solar cells on the bottom side packaging material. This method has low cost, high efficiency and easy operation.
  • the bus bar can play the role of confluence
  • the adhesive can play the role of fixing
  • This arrangement can avoid the installation of welding tape and A series of problems that may arise from conductive adhesives.
  • a method of manufacturing a shingle assembly comprising a bottom-side packaging structure, a top-side packaging structure, and one fixed to the bottom-side packaging structure and the top-side packaging structure.
  • the method includes the following steps:
  • the solar cells and the conductive sheets are arranged in a shingle manner on the top surface of the bottom-side packaging structure into a plurality of battery strings along the second direction, so that the conductive sheets are located at the ends of the battery strings, and each solar cell sheet
  • the conductive connection is realized through the contact between the main grid lines, the conductive sheet is in contact with the main grid line of the adjacent solar cell sheet, and each solar cell sheet and the conductive sheet are connected by an adhesive And fixed with respect to each other, each of the battery strings is arranged in a first direction perpendicular to the second direction to form a battery sheet array;
  • a first bus bar and a second bus bar are provided on the top side of the cell array, or a first bus bar and a second bus bar are provided on the bottom side of the cell array, so that the first bus bar and The bus bars of the solar cells at the head end of each battery string are in electrical contact, the second bus bar is in electrical contact with the conductive sheet of each battery string, and the two bus bars are continuous Strip structure and capable of collecting current from the cell array and deriving the current outward;
  • the combined structure of the top-side packaging structure, the cell array and the bottom-side packaging structure is laminated.
  • the method further includes the following steps:
  • a first conductive bonding structure is provided on the top surface of the solar cell sheet at the head end of each battery string, so that the first conductive bonding structure and the main grid line of the solar cell sheet at the head end are directly contact;
  • a second conductive bonding structure is provided on the top surface of each conductive sheet
  • the corresponding conductive adhesive structures of adjacent battery strings are spaced apart in the first direction
  • the top-side package structure includes a top plate, and the first bus bar and the second bus bar are applied on the bottom surface of the top plate, so that the first bus bar and the second bus bar It is aligned with each corresponding conductive adhesive structure in a direction perpendicular to the battery sheet array, so that the bus bar can simultaneously contact the corresponding conductive adhesive structures of all the battery strings.
  • the top-side packaging structure further includes a top-side flexible film disposed between the top plate and the battery sheet array, and the method further includes: disposing and The hole corresponding to the conductive adhesive structure enables the conductive adhesive structure to pass through the hole and contact the bus bar.
  • the step of applying the first conductive bonding structure and the second conductive bonding structure occurs after the top-side flexible film is disposed on the solar cell array, and then the first conductive bonding structure and the second conductive bonding structure are applied.
  • the step of the second conductive bonding structure is: applying a conductive bonding material on the top side conductive film, so that the conductive bonding flows through the holes to the top surface of the cell array, where Condensed into a first conductive bonding structure and a second conductive bonding structure.
  • the conductive adhesive structure is applied by one of dispensing, painting, spraying, and printing.
  • the first bus bar and the second bus bar are arranged on the cell array, wherein the first bus bar is arranged on the solar cells at the head ends of all the battery strings On the top surface of the sheet and connect the main grid lines of each solar cell sheet it contacts.
  • the connection method can be a conductive adhesive structure or welding.
  • the second bus bar is arranged on the top surface of each conductive sheet and Connecting each of the conductive sheets, the connection method can be a conductive bonding structure or welding.
  • the method includes a step of applying an adhesive
  • the step of applying an adhesive includes: applying an adhesive on each of the solar cell sheet and the conductive sheet to serve as the When the solar cells are arranged in a battery string, the adhesive is located between each pair of adjacent solar cells and conductive sheets.
  • the method further includes the steps of: detecting the quality of the adhesive applied by a camera when applying the adhesive, and rejecting solar cells that are not properly applied with the adhesive according to the detection result.
  • the detecting step is performed at the same time as the step of applying the adhesive, and the detecting step can perform closed-loop feedback on the step of applying the adhesive.
  • the method includes the following steps:
  • the whole solar cell sheet is split into multiple solar cell sheets.
  • the method includes the following steps:
  • An adhesive is applied on each of the solar cells.
  • heat and/or pressure are applied to the overlapping parts between the solar cell sheets during the process of laminating the solar cell sheets into a cell string, so as to cure the adhesive there.
  • the bottom-side packaging structure includes a bottom plate and a bottom-side flexible film located between the bottom plate and the cell array, and the method further includes arranging solar cells on the bottom. Before the side encapsulation structure, an adhesive is applied on the top surface of the bottom side flexible film.
  • the step of applying the adhesive includes: applying a plurality of sets of dot adhesives on the top surface of the bottom side flexible film, so that each set of the dot adhesives corresponds to For one battery string, each group of the dot-shaped adhesives includes one or more rows of dot-shaped structures, and the dot-shaped adhesives are all arranged in sequence along the second direction and used to connect to the battery string. The bonding of the bottom surface of each of the solar cells.
  • the method includes a step of applying an adhesive after arranging the solar cells into a battery string on the bottom side packaging structure, and the step of applying the adhesive includes: A strip of adhesive is applied to each of the battery strings along the second direction so that the strip of adhesive spans the battery string.
  • the steps of arranging the solar cells into a cell string and arranging the cell strings into a cell array are completed by electrostatic or vacuum adsorption methods.
  • the quality of the laminated sheets is detected by a camera, and the detection result is fed back to the monitoring platform in real time.
  • the manufacturing system further includes a control device that is associated with the detection mechanism so as to be able to control the lamination operation mechanism based on the detection result of the detection mechanism.
  • EL electroluminescence or PL photoluminescence is used to perform defect detection on the laminate. If the detection fails, the defect detection is performed again after the laminate is repaired.
  • the method includes the steps of providing a top-side packaging structure and a bottom-side packaging structure, and the step of providing the top-side packaging structure includes:
  • the step of setting the top-side packaging structure includes:
  • the adhesive is not conductive.
  • the method does not include the step of arranging the welding ribbon.
  • a shingle assembly includes a bottom-side encapsulation structure, a transparent top-side encapsulation structure, and a shingle assembly disposed between the bottom-side encapsulation structure and the top-side encapsulation structure.
  • a battery sheet array the battery sheet array includes at least two battery strings, each of the battery strings is sequentially arranged along a first direction to form the battery sheet array,
  • each battery string includes a plurality of solar cells and a conductive sheet at the end of the plurality of cells, and the plurality of solar cells and the one conductive sheet extend along the direction perpendicular to the first direction.
  • the second direction is arranged in a shingled manner and fixed with respect to each other by an adhesive, wherein each solar cell sheet is electrically connected through the contact between the main grid lines, and the conductive sheet is connected to the adjacent Of the solar cell’s busbar contact,
  • the shingle assembly is provided with a first bus bar and a second bus bar that are located on the top side or the bottom side of the cell array, wherein the first bus bar is configured to be connected to each of the battery strings
  • the main grid lines of the solar cell sheet at the head end are in electrical contact
  • the second bus bar is configured to be in electrical contact with the conductive sheet of each battery string
  • the two bus bars are both continuous strip structures and parallel
  • the current can be collected from the cell array and the current can be exported.
  • the top surface of the solar cell sheet at the head end of each battery string is provided with a conductive adhesive structure directly in contact with its main grid line, and a second conductive sheet is provided on the top surface of the conductive sheet.
  • Conductive bonding structure, corresponding conductive bonding structures of adjacent battery strings are spaced apart in the first direction
  • the top-side packaging structure includes a top plate, and the bus bar is formed on the top plate The bottom surface is aligned with the corresponding conductive adhesive structure in a direction perpendicular to the battery sheet array, so that the bus bar simultaneously contacts the corresponding conductive adhesive structure of all the battery strings.
  • the top-side packaging structure further includes a top-side flexible film arranged between the top plate and the cell array, and the top-side flexible film is provided with a conductive adhesive structure corresponding to the The conductive adhesive structure can contact the bus bar through the hole.
  • each segment in the conductive adhesive structure is a dot-shaped structure or a strip-shaped structure extending along the first direction.
  • the bus bar is formed on the cell array, the first bus bar connects the main grid lines at the head end of each battery string, and the second bus bar connects each The conductive sheets of the battery string are connected.
  • the top-side packaging structure is not conductive.
  • the adhesive is disposed between each pair of adjacent solar cell sheets in each battery string.
  • the adhesive is disposed between each of the solar cell sheets and the bottom side packaging structure, so that all the solar cells are fixed relative to the bottom side packaging structure .
  • the bottom-side packaging structure includes a bottom plate and a bottom-side flexible film located between the bottom plate and the cell array, and the adhesive is applied to the top surface of the bottom-side flexible film on.
  • the adhesive is a plurality of sets of dot adhesives pre-arranged on the top surface of the bottom flexible film, and each set of dot adhesives corresponds to one of the For battery strings, each group of the dot-shaped adhesives includes one or more rows of dot-shaped adhesives, and the dot-shaped adhesives are all arranged in sequence along the second direction and used to connect to the battery string. The bottom surface of each of the solar cells is joined.
  • each of the battery strings is provided with one adhesive, and the adhesive has a strip structure extending along the second direction and spans the battery string.
  • the bottom-side packaging structure includes a bottom plate and a flexible film located between the bottom plate and the battery sheet array, and the flexible film is an EVA monolithic film structure, a POE monolithic film structure, or silicone A whole film structure
  • the top-side packaging structure includes a top plate and a flexible film located between the top plate and the cell array, the flexible film is an EVA whole film structure, a POE whole film structure or a silica gel whole film structure Membrane structure.
  • the adhesive is not conductive.
  • the shingle assembly is not provided with welding ribbons.
  • the typesetting process and the lamination process can be combined into one, and the solar cells can be laminated and typeset directly on the bottom side packaging material.
  • This method has low cost, high efficiency and easy operation.
  • the bus bar can play the role of confluence
  • the adhesive can play the role of fixing
  • no additional welding tape and conductive glue are needed, and this arrangement can avoid the power loss of the cell.
  • It can also avoid a series of problems that may arise due to the provision of conductive glue.
  • Fig. 1 is an exploded schematic diagram of a shingled assembly in a manufacturing process according to a first embodiment of the present invention
  • Figure 2A is a cross-sectional view taken along line A-A in Figure 1
  • Figure 2B is a cross-sectional view taken along line B-B in Figure 1;
  • Fig. 3 is an exploded schematic view of the shingled assembly in the manufacturing process according to the second embodiment of the present invention.
  • FIG. 4 is an exploded schematic diagram of the shingled assembly in the manufacturing process according to the third embodiment of the present invention.
  • Fig. 5 is an exploded schematic view of the shingled assembly in the manufacturing process according to the fourth embodiment of the present invention.
  • the present invention provides a shingle assembly and a method for manufacturing the shingle assembly.
  • Figures 1 to 5 show several preferred embodiments of the present invention. The respective embodiments will be described separately below in conjunction with the drawings.
  • Figures 1, 2A, and 2B show the shingle assembly 1 according to the first embodiment of the present invention. It can be understood that the shingle assembly 1 shown in Fig. 1 is in the process of being manufactured so that the components are disassembled. After its complete processing, it should be an integral package structure. As shown in FIG. 1, the shingle assembly 1 includes a bottom encapsulation structure 145, a transparent top encapsulation structure 123, and a solar cell array 11 that can be fixed between the bottom encapsulation structure 145 and the top encapsulation structure 123.
  • the cell array 11 can be roughly understood as an array of solar cells 112.
  • the solar cells 112 are arranged in a shingle manner into cell strings, and a plurality of cell strings are then arranged into the cell array 11.
  • the top-side conductive structure includes a top plate 12 and a top-side flexible film 13 between the top plate 12 and the cell array 11, and the bottom-side conductive structure includes a bottom plate 15 and a bottom-side flexible film between the bottom plate 15 and the cell array 11 14.
  • the top plate 12 and the bottom plate 15 can be rigid plates such as tempered glass, for example, the top plate 12 can also be a polymer back plate, and the top side flexible film 13 and the bottom side flexible film 14 can be flexible film structures made of EVA, POE or silicone. .
  • each battery string includes a plurality of solar cell sheets 112 arranged in a shingled manner along the second direction D2 and a conductive sheet 113 at the end of the plurality of solar cell sheets 112.
  • the top surface of the solar cell sheet 112 is provided with
  • the positive electrode 17 is provided with a back electrode 18 on the bottom surface, and the conductive sheet 113 is made of conductive material.
  • each solar cell 112 in the battery string is arranged in the manner shown in FIGS. 2A and 2B, for two adjacent solar cell 112, the back electrode 18 of the previous solar cell 112 and the next solar cell 112 If the positive electrode 17 of the sheet 112 is in contact, the positive electrode 17 of the solar cell 112 at the head end of the battery string is exposed, and the back electrode 18 of the last solar cell 112 of the battery string is exposed.
  • a bus bar simultaneously contacts the exposed positive electrode 17 and the back electrode 18 of the battery string.
  • the conductive sheet 113 is provided at the end of the battery string so that the bus bar 121 is arranged on the top surface of the battery string and can also contact the back electrode 18.
  • the conductive sheet 113 can be configured in a structure similar to the shape of the ordinary solar cell 112. Similarly, if the shingles are arranged at the end of the battery string, the conductive sheet 113 can contact the back electrode 18 of the last solar cell 112 of the battery string. If the bus bar 121 conductively contacts the top surface of the conductive sheet 113, it is actually The back electrode 18 of the last solar cell 112 is in conductive contact. In this embodiment, the conductive sheet 113 and the bus bar 121 are electrically connected through the conductive adhesive structure 16.
  • the first conductive adhesive structure 16a is arranged on the top surface of the solar cell 112 at the head end of the battery string and directly contacts the positive electrode 17 of the solar cell 112, and the second conductive adhesive structure 16b is arranged on On the top surface of the conductive sheet 113.
  • the corresponding conductive adhesive structures of adjacent battery strings are spaced apart in the first direction D1.
  • Each segment of the first conductive adhesive structure 16a and the second conductive adhesive structure 16b may be a dot structure or a strip structure extending in the first direction D1.
  • the solar cells 112 are electrically conductively connected through the direct contact of the busbars. However, in other embodiments not shown, the solar cells 112 can also be electrically conductive through conductive glue. contact.
  • the bus bar is formed on the bottom surface of the top plate 12, and its position is schematically shown by dotted lines on the top plate 12 in the figure.
  • the bus bar includes a first bus bar 121a and a second bus bar 121b.
  • the first bus bar 121a is aligned with the first conductive adhesive structure 16a in a direction perpendicular to the cell array 11, and the second bus bar 121b is perpendicular to the cell sheet.
  • the direction of the array 11 is aligned with the second conductive bonding structure 16b, so that the bus bars can contact the corresponding conductive bonding structures of all battery strings at the same time.
  • top side flexible film 13 is provided with holes 131 corresponding to the first conductive bonding structure 16a and the second conductive bonding structure 16b, and the conductive bonding structure can pass through the holes 131 to contact the bus bar.
  • each solar cell 112 is fixed to each other by an adhesive disposed between each solar cell 112.
  • an adhesive may be applied to each solar cell 112 to bond the solar cell 112 and another solar cell 112 when they are shingled together.
  • a transparent adhesive may be provided on each battery string, and the adhesive may have a strip structure extending in the second direction D2 and span the battery string.
  • the adhesive may only have a bonding effect and not have a conductive effect.
  • the adhesive can already fix each solar cell 112 relative to each other, and after lamination, the top-side packaging structure 123, the bottom-side packaging structure 145, and the solar cell 112 can also be fixed as a whole.
  • the shingle assembly 1 of the embodiment may not be provided with welding tape.
  • This embodiment also provides a method for preparing the shingle assembly 1 shown in FIG. 1, which includes a step of typesetting a laminate, a step of arranging a bus bar, a step of laminating, and the like.
  • the solar cell 112 and the conductive sheet 113 are arranged on the top surface of the bottom flexible film 14 in a shingled manner along the second direction D2 into a plurality of battery strings, so that the conductive sheet 113 is located on the top surface of the battery string.
  • each solar cell 112 is electrically connected through the direct contact between the main grid lines.
  • the conductive plate 113 is in direct contact with the main grid line of the adjacent solar cell 112, and each battery string is perpendicular to the second
  • the first direction D1 of the direction D2 is arranged to form the solar cell array 11, and each solar cell 112 and the conductive sheet 113 are fixed to each other by an adhesive.
  • the lamination process can be realized by electrostatically or vacuuming the solar cell 112 on the bottom flexible film 14.
  • the typesetting step and the lamination step are combined into one, and the laminates are directly laminated on the bottom side packaging material and the cells are fixed relative to each other.
  • the typesetting is completed at the same time as the laminates. .
  • This method has low cost, high efficiency and easy operation.
  • the step of applying adhesive may include: applying adhesive on each solar cell 112 and conductive sheet 113, so that when the solar cell 112 is arranged in a battery string, the adhesive is located in each pair of adjacent solar cells. Between the cell 112 and the conductive sheet 113. Further, when the adhesive is applied, the quality of the applied adhesive is detected by a camera, and the solar cell 112 that is not correctly applied with the adhesive is eliminated according to the detection result. More preferably, the detection step is performed simultaneously with the step of applying the adhesive, and the detection step can perform closed-loop feedback on the step of applying the adhesive.
  • the step of applying the bus bar includes: arranging the first bus bar 121a and the second bus bar 121b on the top side of the cell array 11, or arranging the first bus bar 121a and the second bus bar 121b on the bottom side of the cell array 11, So that the first bus bar 121a is in electrical contact with the main grid lines of the solar cell 112 at the head end of each battery string, and the second bus bar 121b is in electrical contact with the conductive sheet 113 of each battery string. Both bus bars are continuous bars.
  • the shape structure is capable of collecting current from the cell array 11 and deriving the current outward.
  • the bus bar in this embodiment is applied on the bottom surface of the top side flexible film 13, and the method in this embodiment also includes a conductive adhesive structure.
  • the step of arranging the conductive bonding structure is: setting the first conductive bonding structure 16a on the top surface of the solar cell 112 at the head end of each battery string, so that the first conductive bonding structure 16a and the solar cell 112 at the head end
  • the main grid line in this embodiment, the positive electrode 17
  • a second conductive bonding structure 16b is also provided on the top surface of each conductive sheet 113, wherein the corresponding conductive bonding of adjacent battery strings
  • the structures are spaced apart in the first direction D1.
  • the top-side packaging structure 123 includes a top plate 12 and a top-side flexible film 13, and two bus bars 121 are respectively applied on both sides of the bottom surface of the top plate 12, so that the two bus bars are positioned perpendicular to the cell array 11 The direction is aligned with the corresponding conductive adhesive structure, so that the bus bar can contact the corresponding conductive adhesive structure of all battery strings at the same time.
  • the above method further includes: providing a hole 131 corresponding to the conductive adhesive structure on the top side flexible film 13 so that the conductive adhesive structure can pass through the hole 131 to contact the bus bar.
  • the step of applying the first conductive adhesive structure 16a and the second conductive adhesive structure 16b occurs after the top side flexible film 13 is arranged on the cell array 11, and then the first conductive adhesive structure 16a and the second conductive adhesive structure 16a are applied.
  • the step of bonding the structure 16b is: applying conductive bonding material on both sides of the top side conductive film, so that the conductive bonding flows through the holes 131 to the top surface of the cell array 11 and condenses into the first The conductive adhesive structure 16a and the second conductive adhesive structure 16b.
  • the conductive adhesive structure can be applied by one of dispensing, painting, spraying, and printing.
  • the small pieces of the solar cell 112 are formed by splitting the entire solar cell, and the step of applying the adhesive can be set before or after the split.
  • the entire solar cell sheet can be laser grooved and the adhesive applied first, and then the entire solar cell sheet can be split into multiple solar cell sheets 112; or, the entire solar cell sheet can be laser grooved, and then the The whole solar cell sheet is divided into a plurality of solar cell sheets 112, and then an adhesive is applied to each solar cell sheet 112.
  • the step of lamination of the solar cells 112 and the step of applying the adhesive can be carried out at the same time.
  • the overlapping parts between the solar cells 112 are applied.
  • a detection device such as a camera, detects the quality of the stack, and feeds back the detection result to the monitoring platform in real time.
  • the manufacturing system further includes a control device, which is associated with the mechanism used for detection and can perform closed-loop control of the mechanism used for detection.
  • the final manufacturing process includes the lamination step.
  • the lamination step can press the top-side packaging structure 123, the cell array 11 and the bottom-side packaging structure 145 together.
  • EL electroluminescence or PL photoluminescence is used to perform defect detection on the laminate. If the detection fails, the defect detection is performed again after the repair of the laminate is completed.
  • the above-mentioned various processes have realized the packaging and fixing of the shingled assembly 1 and the conductive connection between the solar cells 112 and the current can be drawn out, the above-mentioned method does not need to provide the step of applying the welding tape.
  • Fig. 3 shows the shingle assembly 2 according to the second embodiment of the present invention.
  • Fig. 3 shows the shingle assembly 2 according to the second embodiment of the present invention.
  • no repeated description or related description will be simplified.
  • the shingle assembly 2 includes a cell array 21, a top side packaging structure 223 and a bottom side packaging structure 245.
  • the top side packaging structure 223 includes a top plate 22 and a top side flexible film 23.
  • the bottom side packaging structure 245 includes a bottom plate 25 and a bottom side flexible film. twenty four.
  • the bus bars are all arranged on the cell array 21.
  • the first bus bar 26a is arranged on the top surface of the solar cells at the head end of all the battery strings and connects the positive electrodes of the solar cells that it contacts.
  • the connection method can be a conductive bonding structure or welding.
  • the second The bus bar 26b is arranged on the top surface of each conductive sheet and connects each conductive sheet.
  • the connection method may be a conductive adhesive structure or welding.
  • the top plate 22 itself can be made of non-conductive transparent or opaque material, and there is no need to provide a conductive mechanism similar to a bus bar on the top plate 22.
  • Fig. 4 shows a shingle assembly 3 according to a third embodiment of the present invention.
  • Fig. 4 shows a shingle assembly 3 according to a third embodiment of the present invention.
  • parts in this embodiment that are the same as or similar to the first embodiment, no repeated description or related description will be simplified.
  • the shingle assembly 3 includes a top-side packaging structure 323, a bottom-side packaging structure, and a cell array 31.
  • the top-side packaging structure 323 includes a top plate 32 and a top-side flexible film 33
  • the bottom-side packaging structure includes a bottom plate 35 and a bottom-side flexible film 34.
  • the bottom surface of the top plate 32 is provided with a first bus bar 321a and a second bus bar 132b
  • the top side flexible film 33 is provided with a hole 331, the first conductive bonding structure 36a and the second conductive bonding structure on the cell array 31
  • the structure 36b can make conductive contact with the corresponding bus bar through the hole 331.
  • the adhesive 341 is applied on the top surface of the bottom flexible film 34.
  • each solar cell can be bonded
  • the agent 341 is fixed with respect to the bottom side flexible film 34, thereby fixing each solar cell sheet with respect to each other.
  • the adhesive 341 is a plurality of groups of dotted adhesives 341 pre-arranged on the top surface of the bottom side flexible film 34, and each group of dotted adhesives 341 corresponds to one
  • each group of dotted adhesives 341 includes one or more rows, and the adhesives 341 are arranged in the second direction and used to respectively join the bottom surface of the solar cell of each of the battery strings.
  • the method of manufacturing the adhesive 341 includes a step of applying the adhesive 341 on the top surface of the bottom flexible film 34 before arranging the solar cell sheets on the bottom encapsulation structure.
  • the step of applying the adhesive 341 includes: applying multiple sets of dot-shaped adhesives 341 on the top surface of the bottom flexible film 34, so that each group of dot-shaped adhesives 341 corresponds to a battery string, and each group of dot-shaped adhesives 341 corresponds to a battery string.
  • the adhesive 341 includes one or more rows of dot-shaped structures, and the dot-shaped adhesives 341 are all arranged in the second direction in sequence and used to be respectively bonded to the bottom surface of each solar cell in the battery string.
  • Fig. 5 shows a shingle assembly according to a fourth embodiment of the present invention.
  • Fig. 5 shows a shingle assembly according to a fourth embodiment of the present invention.
  • parts in this embodiment that are the same as or similar to those in the first embodiment, repeated descriptions or related descriptions will not be repeated or simplified.
  • the shingle assembly 4 includes a cell array 41, a top side packaging structure 423, and a bottom side packaging structure 445.
  • the top side packaging structure 423 includes a top plate 42 and a top side flexible film 43.
  • the bottom side packaging structure 445 includes a bottom plate 45 and a bottom side flexible film. 44.
  • both the first bus bar 46a and the second bus bar 46b are arranged on the cell array 41.
  • the first bus bar 46a is arranged on the top surface of the solar cell at the head end of all the battery strings and connects the positive electrode of each solar cell that it contacts.
  • the connection method may be a conductive bonding structure or welding.
  • the second The bus bar 46b is arranged on the top surface of each conductive sheet and connects the conductive sheets.
  • the connection method may be a conductive adhesive structure or welding.
  • the top plate 42 itself can be made of a non-conductive transparent or opaque material, and it is not necessary to provide a conductive mechanism similar to a bus bar on the top plate 42.
  • the adhesive 441 is applied on the top surface of the bottom flexible film 44.
  • each solar cell can be bonded
  • the agent 441 is fixed with respect to the bottom side flexible film 44, thereby fixing each solar cell sheet with respect to each other.
  • the adhesive 441 is a plurality of groups of dot-shaped adhesives 441 pre-arranged on the top surface of the bottom flexible film 44, and each group of dot-shaped adhesives 441 corresponds to one
  • each group of dot-shaped adhesives 441 includes one or more rows, and the adhesives 441 are arranged in the second direction in sequence and used for bonding with the bottom surface of the solar cell of each of the battery strings.
  • the above several implementations give some examples of the method and structure of the present invention.
  • the method provided by the present invention can combine the typesetting process and the lamination process into one, and directly laminate and typeset the solar cells on the bottom side packaging material. This method has lower cost, higher efficiency and easy operation.
  • the bus bar can play the role of confluence
  • the adhesive can play the role of fixing
  • no additional welding tape and conductive glue are needed. This arrangement can avoid the power of the cell. Loss can also avoid a series of problems that may occur due to the installation of conductive glue.

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Abstract

本发明涉及一种制造叠瓦组件的方法和叠瓦组件。方法包括如下步骤：将太阳能电池片和导电片在底侧封装结构的顶表面上沿第二方向以叠瓦方式排列成多个电池串，使导电片位于电池串的末端，各个电池串沿垂直于第二方向的第一方向排布而形成电池片阵列；在电池片阵列的顶侧或底侧设置第一汇流条和第二汇流条，以使得第一汇流条与各个电池串的首端的太阳能电池片的主栅线电接触，第二汇流条与各个电池串的导电片电接触；对顶侧封装结构、电池片阵列和底侧封装结构的组合结构进行层压。本发明提供的方法，能够将排版工序和叠片工序合二为一，直接在底侧封装材料上将电池片叠片并排版，这样的方式成本较低、效率较高，易于操作。

Description

叠瓦组件的制造方法及叠瓦组件 技术领域
本发明涉及能源领域，尤其涉及一种叠瓦组件的制造方法和叠瓦组件。
背景技术
随着全球煤炭、石油、天然气等常规化石能源消耗速度加快，生态环境不断恶化，特别是温室气体排放导致日益严峻的全球气候变化，人类社会的可持续发展已经受到严重威胁。世界各国纷纷制定各自的能源发展战略，以应对常规化石能源资源的有限性和开发利用带来的环境问题。太阳能凭借其可靠性、安全性、广泛性、长寿性、环保性、资源充足性的特点已成为最重要的可再生能源之一，有望成为未来全球电力供应的主要支柱。
在新一轮能源变革过程中，我国光伏产业已成长为具有国际竞争优势的战略新兴产业。然而，光伏产业发展仍面临诸多问题与挑战，转换效率与可靠性是制约光伏产业发展的最大技术障碍，而成本控制与规模化又在经济上形成制约。光伏组件作为光伏发电的核心部件，提高其转换效率发展高效组件是必然趋势。目前市场上涌现各种各样的高效组件，如叠瓦、半片、多主栅、双面组件等。随着光伏组件的应用场所和应用地区越来越广泛，对其可靠性要求越来越高，尤其是在一些恶劣或极端天气多发地区需要采用高效、高可靠性的光伏组件。
在大力推广和使用太阳能绿色能源的背景下，叠瓦组件利用小电流低损耗的电学原理(光伏组件功率损耗与工作电流的平方成正比例关系)从而使得组件功率损耗大大降低。其次通过充分利用电池组件中片间距区域来进行发电，单位面积内能量密度高。另外目前使用了具有弹性体特性的导电胶粘剂替代了常规组件用光伏金属焊带，由于光伏金属焊带在整片电池中表现出较高的串联电阻而导电胶粘剂电 流回路的行程要远小于采用焊带的方式，从而最终使得叠瓦组件成为高效组件，同时户外应用可靠性较常规光伏组件性能表现更加优异，因为叠瓦组件避免了金属焊带对电池与电池互联位置及其他汇流区域的应力损伤。尤其是在高低温交变的动态(风、雪等自然界的载荷作用)环境下，采用金属焊带互联封装的常规组件失效概率远超过采用弹性体的导电胶粘剂互联切割后的晶硅电池小片封装的叠瓦组件。
当前叠瓦组件的主流工艺使用导电胶粘剂互联切割后的电池片，导电胶主要由导电相和粘接相构成。其中导电相主要由贵金属组成，如纯银颗粒或银包铜、银包镍、银包玻璃等颗粒并用于在太阳能电池片之间起导电作用，其颗粒形状和分布以满足最优的电传导为基准，目前更多采用D50＜10um级的片状或类球型组合银粉居多。粘接相主要有具有耐候性的高分子树脂类聚合物构成，通常根据粘接强度和耐候稳定性选择丙烯酸树脂、有机硅树脂、环氧树脂、聚氨酯等。为了使导电胶粘接达到较低的接触电阻和较低的体积电阻率及高粘接并且保持长期优良的耐候特性，一般导电胶厂家会通过导电相和粘接相配方的设计完成，从而保证叠瓦组件在初始阶段环境侵蚀测试和长期户外实际应用下性能的稳定性。
而对于通过导电胶来实现连接的电池组件，在被封装之后，在户外实际使用时受到环境侵蚀，例如高低温交变热胀冷缩产生导电胶之间的相对位移。最为严重就是导致出现电流虚接甚至断路，主要原因一般都是因为材料组合后相互间连接能力弱。连接能力弱主要表现在制程中导电胶作业需要一个工艺操作窗口，实际生产过程中这个窗口相对较窄，非常容易受到环境因素的影响，比如作业场所的温湿度，涂胶后滞留空气中的时间长短等等都会让导电胶水失去活性。同时对于点胶、喷胶或印刷工艺下受胶水自身特性变化容易出现施胶不均缺失现象，对产品可靠性会有较大隐患。其次导电胶主要由高分子树脂和大量贵金属粉体所构成，成本高昂且一定程度上破坏生态环境(贵金属的生产和加工对环境污染较大)。再者导电胶属于膏状物，在施 胶或叠片过程中具备一定的流动性，非常容易溢胶造成叠瓦互联电池串正负极短路。
也就是说，对于大多数采用导电胶粘接方式而制成的叠瓦组件，存在相互连接强度弱特点，制程对环境要求高，工艺使用易溢胶短路，使用成本高昂，生产效率低等问题。
并且，现有的叠瓦组件需要在电池串的两端设置焊带，之后进行排版、汇流焊接。在这样的传统方案中，先叠串后排版的方式效率较低、成本较高，且叠片工序与排版工序分离造成版型更改困难，并且，焊带会导致电池片功率损失，影响转换效率。
因而需要提供一种制造叠瓦组件的方法和叠瓦组件，以至少部分地解决上述问题。
发明内容
本发明的目的在于，提供一种叠瓦组件的制造方法及叠瓦组件。本发明提供的方法，能够将排版工序和叠片工序合二为一，直接在底侧封装材料上将电池片叠片并排版，这样的方式成本较低、效率较高，易于操作。
另一方面，本发明所提供的叠瓦组件中，汇流条能够起到汇流作用，粘结剂能够起到固定作用，无需额外使用焊带和导电胶，这样的设置能够避免由于设置焊带和导电胶而可能产生的一系列问题。
根据本发明的一个方面，提供了一种制造叠瓦组件的方法，所述叠瓦组件包括底侧封装结构、顶侧封装结构和固定在所述底侧封装结构和所述顶侧封装结构之间的电池片阵列，所述方法包括如下步骤：
将太阳能电池片和导电片在底侧封装结构的顶表面上沿第二方向以叠瓦方式排列成多个电池串，使所述导电片位于所述电池串的末端，各个所述太阳能电池片之间通过主栅线之间的接触而实现导电连接，所述导电片和与其相邻的太阳能电池片的主栅线接触，各个所述太阳能电池片和所述导电片之间通过粘结剂而相对于彼此固定，各个所述电池串沿垂直于第二方向的第一方向排布而形成电池片阵列；
在所述电池片阵列的顶侧设置第一汇流条和第二汇流条，或者在所述电池片阵列的底侧设置第一汇流条和第二汇流条，以使得所述第一汇流条与各个所述电池串的首端的所述太阳能电池片的主栅线电接触，所述第二汇流条与各个所述电池串的所述导电片电接触，所述两个汇流条均为连续的条状结构并能够从所述电池片阵列收集电流并将电流向外导出；
对所述顶侧封装结构、所述电池片阵列和所述底侧封装结构的组合结构进行层压。
在一种实施方式中，所述方法还包括如下步骤：
在每一个所述电池串的首端的所述太阳能电池片的顶表面上设置第一导电粘结结构，以使所述第一导电粘结结构和所述首端的太阳能电池片的主栅线直接接触；
在每一个所述导电片的顶表面上设置第二导电粘结结构，
其中，相邻的电池串的对应的导电粘结结构在第一方向上间隔开，
并且，所述顶侧封装结构包括顶板，所述第一汇流条和所述第二汇流条被施加在所述顶板的底表面上，并使得所述第一汇流条和所述第二汇流条在垂直于所述电池片阵列的方向上与和各个对应的导电粘结结构对齐，以使得所述汇流条能够同时接触所有所述电池串的对应的导电粘结结构。
在一种实施方式中，所述顶侧封装结构还包括设置在所述顶板和所述电池片阵列之间的顶侧柔性膜，所述方法还包括：在所述顶侧柔性膜上设置与所述导电粘结结构对应的孔，以使所述导电粘结结构能够透过所述孔而与所述汇流条接触。
在一种实施方式中，施加第一导电粘结结构和第二导电粘结结构的步骤发生于在所述电池片阵列上设置所述顶侧柔性膜之后，施加第一导电粘结结构和第二导电粘结结构的步骤为：在所述顶侧导电膜上施加导电粘结材料，以使所述导电粘结透过所述孔而流至所述电池片阵列的顶表面上并在此凝结为第一导电粘结结构和第二导电粘结结构。
在一种实施方式中，通过点胶、涂抹、喷涂、印刷中的其中一种方式施加所述导电粘结结构。
在一种实施方式中，所述第一汇流条和所述第二汇流条设置在所述电池片阵列上，其中所述第一汇流条设置在所有所述电池串的首端的所述太阳能电池片的顶表面上并将其接触的各个太阳能电池片的主栅线连接起来，连接方式可以是导电粘结结构或者焊接，所述第二汇流条设置在各个所述导电片的顶表面上并将各个所述导电片连接起来，连接方式可以是导电粘结结构或者焊接。
在一种实施方式中，所述方法包括施加粘结剂的步骤，所述施加粘结剂的步骤包括：在每一个所述太阳能电池片和所述导电片上施加粘结剂，以当所述太阳能电池片排列成电池串时所述粘结剂位于每一对相邻的太阳能电池片和导电片之间。
在一种实施方式中，所述方法还包括如下步骤：在施加粘结剂时通过相机检测施加粘结剂的质量，并根据检测结果剔除未正确施加粘结剂的太阳能电池片。
在一种实施方式中，所述检测步骤对施加粘结剂的步骤同时进行且所述检测步骤能够对施加粘结剂的步骤进行闭环反馈。
在一种实施方式中，所述方法包括如下步骤：
设置太阳能电池片整片；
在所述太阳能电池片整片上激光刻槽并施加粘结剂；
将所述太阳能电池片整片裂片为多个太阳能电池片。
在一种实施方式中，所述方法包括如下步骤：
设置太阳能电池片整片；
在所述太阳能电池片整片上激光刻槽；
将所述太阳能电池片整片裂片为多个太阳能电池片；
在每一个所述太阳能电池片上施加粘结剂。
在一种实施方式中，在将所述太阳能电池片叠片成电池串的过程中对所述太阳能电池片之间的重叠部位施加热和/或压力，从而使此处的粘结剂固化。
在一种实施方式中，所述底侧封装结构包括底板和位于所述底板和所述电池片阵列之间的底侧柔性膜，所述方法还包括在将太阳能电池片排布在所述底侧封装结构之前在所述底侧柔性膜的顶表面上施加粘结剂的步骤。
在一种实施方式中，所述施加粘结剂的步骤包括：在所述底侧柔性膜的顶表面上施加多组点状粘结剂，使每一组所述点状粘结剂对应于一个所述电池串，每一组所述点状粘结剂均包括一排或多排点状结构，所述点状粘结剂均沿所述第二方向依次排列并用于分别和该电池串中的每一个所述太阳能电池片的底表面的接合。
在一种实施方式中，所述方法包括在将所述太阳能电池片在所述底侧封装结构上排列成电池串之后的施加粘结剂的步骤，所述施加粘结剂的步骤包括：在每一个所述电池串上沿第二方向施加条状粘结剂以使所述条状粘结剂跨越在该电池串上。
在一种实施方式中，将所述太阳能电池片排列成电池串以及将电池串排列成电池片阵列的步骤通过静电或真空吸附的方法完成。
在一种实施方式中，在将所述太阳能电池片排列成电池串的过程中通过相机检测叠片质量，并将检测结果实时地反馈至监控平台。
在一种实施方式中，制造系统中还包括控制装置，所述控制装置和所述检测机构相关联从而能够基于所述检测机构的检测结果对叠片作业机构进行控制。
在一种实施方式中，在层压步骤前采用EL电致发光或PL光致发光对待层压件进行缺陷检测，若检测不合格，则将待层压件修复完成之后重新进行缺陷检测。
在一种实施方式中，所述方法包括设置顶侧封装结构和底侧封装结构的步骤，所述设置顶侧封装结构的步骤包括：
设置底板；
使用EVA、POE或硅胶设置位于所述底板和所述电池片阵列之间的柔性膜；所述设置顶侧封装结构的步骤包括：
使用EVA、POE或硅胶设置位于所述顶板和所述电池片阵列之 间的柔性膜；
设置顶板。
在一种实施方式中，所述粘结剂不具导电性。
在一种实施方式中，所述方法不包括设置焊带的步骤。
根据本发明的另一个方面，提供了一种叠瓦组件，所述叠瓦组件包括底侧封装结构、透明的顶侧封装结构和设置在所述底侧封装结构和顶侧封装结构之间的电池片阵列，所述电池片阵列包括至少两个电池串，各个所述电池串沿第一方向依次排列成所述电池片阵列，
其特征在于，每一个电池串包括多个太阳能电池片和位于所述多个电池片末端的一个导电片，所述多个太阳能电池片和所述一个导电片沿垂直于所述第一方向的第二方向以叠瓦方式依次排列并通过粘结剂相对于彼此固定，其中，各个所述太阳能电池片之间通过主栅线之间的接触而实现导电连接，所述导电片和与其相邻的太阳能电池片的主栅线接触，
其中，所述叠瓦组件设置有共同位于所述电池片阵列的顶侧或底侧的第一汇流条和第二汇流条，其中，所述第一汇流条构造为与各个所述电池串的首端的所述太阳能电池片的主栅线电接触，所述第二汇流条构造为与各个所述电池串的所述导电片电接触，所述两个汇流条均为连续的条状结构并能够从所述电池片阵列收集电流并将电流向外导出。
在一种实施方式中，每一个所述电池串的首端的太阳能电池片的顶表面上设置有和其主栅线直接接触的导电粘结结构，所述导电片的顶表面上设置有第二导电粘结结构，相邻的所述电池串的对应的导电粘结结构在所述第一方向上间隔开，并且，所述顶侧封装结构包括顶板，所述汇流条形成在所述顶板的底表面上并在垂直于所述电池片阵列的方向上和对应的所述导电粘结结构对齐，以使得所述汇流条同时接触所有所述电池串的对应的所述导电粘结结构。
在一种实施方式中，所述顶侧封装结构还包括设置在所述顶板和所述电池片阵列之间的顶侧柔性膜，所述顶侧柔性膜上设置与所述导 电粘结结构对应的孔，所述导电粘结结构能够透过所述孔而与所述汇流条接触。
在一种实施方式中，所述导电粘结结构中的每一段为点状结构或沿所述第一方向延伸的条状结构。
在一种实施方式中，所述汇流条形成在所述电池片阵列上，所述第一汇流条将各个所述电池串首端的所述主栅线连接起来，所述第二汇流条将各个所述电池串的所述导电片连接起来。
在一种实施方式中，所述顶侧封装结构不具导电性。
在一种实施方式中，所述粘结剂设置在每一个所述电池串的每一对相邻的两个太阳能电池片之间。
在一种实施方式中，所述粘结剂设置在每一个所述太阳能电池片和所述底侧封装结构之间，以使所有的所述太阳能电池片均相对于所述底侧封装结构固定。
在一种实施方式中，所述底侧封装结构包括底板和位于所述底板和所述电池片阵列之间的底侧柔性膜，所述粘结剂施加在所述底侧柔性膜的顶表面上。
在一种实施方式中，所述粘结剂为预先设置在所述底侧柔性膜的顶表面上的多组点状粘结剂，每一组所述点状粘结剂对应于一个所述电池串，每一组所述点状粘结剂均包括一排或者多排点状粘结剂，所述点状粘结剂均沿所述第二方向依次排列并用于分别和该电池串中的每一个所述太阳能电池片的底表面接合。
在一种实施方式中，每一个所述电池串上设置有一个所述粘结剂，所述粘结剂为沿所述第二方向延伸的条状结构并跨越在所述电池串上。
在一种实施方式中，所述底侧封装结构包括底板和位于所述底板和所述电池片阵列之间的柔性膜，所述柔性膜为EVA整片膜结构、POE整片膜结构或硅胶整片膜结构，所述顶侧封装结构包括顶板和位于所述顶板和所述电池片阵列之间的柔性膜，所述柔性膜为EVA整片膜结构、POE整片膜结构或硅胶整片膜结构。
在一种实施方式中，所述粘结剂不具导电性。
在一种实施方式中，所述叠瓦组件不设置焊带。
根据本发明提供的方法，能够将排版工序和叠片工序合二为一，直接在底侧封装材料上将电池片叠片并排版，这样的方式成本较低、效率较高，易于操作。另一方面，本发明所提供的叠瓦组件中，汇流条能够起到汇流作用，粘结剂能够起到固定作用，无需额外使用焊带和导电胶，这样的设置能够避免电池片的功率损失，也能够避免由于设置导电胶而可能产生的一系列问题。
附图说明
为了更好地理解本发明的上述及其他目的、特征、优点和功能，可以参考附图中所示的优选实施方式。附图中相同的附图标记指代相同的部件。本领域技术人员应该理解，附图旨在示意性地阐明本发明的优选实施方式，对本发明的范围没有任何限制作用，图中各个部件并非按比例绘制。
图1为根据本发明的第一实施方式的制程中的叠瓦组件的分解示意图；
图2A为沿图1中的A-A线剖开的剖视图，图2B为沿着图1中的B-B剖开的剖视图；
图3为根据本发明的第二实施方式的制程中的叠瓦组件的分解示意图；
图4为根据本发明的第三实施方式的制程中的叠瓦组件的分解示意图；
图5为根据本发明的第四实施方式的制程中的叠瓦组件的分解示意图。
具体实施方式
现在参考附图，详细描述本发明的具体实施方式。这里所描述的仅仅是根据本发明的优选实施方式，本领域技术人员可以在所述优选 实施方式的基础上想到能够实现本发明的其他方式，所述其他方式同样落入本发明的范围。
本发明提供了一种叠瓦组件和制造该叠瓦组件的方法，图1至图5示出了本发明的几个优选实施方式。下面将结合附图对各个实施方式分别进行描述。
第一实施方式
图1、图2A和图2B示出了根据本发明的第一实施方式的叠瓦组件1，可以理解，图1中所示的叠瓦组件1处于制成中因而各部件是分解的，在其完全加工完成之后应为一个整体的封装结构。如图1所示，叠瓦组件1包括底侧封装结构145、透明的顶侧封装结构123和能够固定在底侧封装结构145和顶侧封装结构123之间的电池片阵列11。
其中，电池片阵列11大致可以理解为是太阳能电池片112的阵列，太阳能电池片112以叠瓦方式排列成电池串，多个电池串再排列成电池片阵列11。顶侧导电结构又包括顶板12和位于顶板12和电池片阵列11之间的顶侧柔性膜13，底侧导电结构又包括底板15和位于底板15和电池片阵列11之间的底侧柔性膜14。顶板12和底板15例如可以为诸如钢化玻璃的刚性板，顶板12也可以是高分子背板，顶侧柔性膜13和底侧柔性膜14可以为由EVA、POE或硅胶制成的柔性膜结构。
具体地，每一个电池串包括沿第二方向D2以叠瓦方式排列的多个太阳能电池片112和位于多个太阳能电池片112末端的一个导电片113，太阳能电池片112的顶表面上设置有正电极17，底表面上设置有背电极18，导电片113由导电材质制成。
例如，若电池串中的各个太阳能电池片112以图2A和图2B所示的方式排列，对于相邻的两个太阳能电池片112，前一个太阳能电池片112的背电极18与后一个太阳能电池片112的正电极17接触，那么该电池串首端的太阳能电池片112的正电极17是暴露在外的，而该电池串的最后一个太阳能电池片112的背电极18暴露在外，为 了形成回路，需要有汇流条同时接触该电池串暴露在外的正电极17和背电极18。在电池串的末端设置导电片113是为了将汇流条121设置在电池串的顶表面上也能够接触背电极18，具体地，导电片113可以构造成与普通太阳能电池片112形状相仿的结构并同样叠瓦排列在电池串的末端，那么导电片113便能够接触到电池串的最后一个太阳能电池片112的背电极18，汇流条121若导电接触了导电片113的顶表面，实际上也是和最后一个太阳能电池片112的背电极18导电接触。在本实施方式中，导电片113和汇流条121之间通过导电粘结结构16实现导电连接。
转回图1，第一导电粘结结构16a设置在电池串的首端的太阳能电池片112的顶表面上并和该太阳能电池片112的正电极17直接接触，第二导电粘结结构16b设置在导电片113的顶表面上。相邻的电池串的对应的导电粘结结构在第一方向D1上间隔开。第一导电粘结结构16a和第二导电粘结结构16b中的每一段可以为点状结构或在第一方向D1上延伸的条状结构。在本实施方式中，各个太阳能电池片112之间是通过主栅线的直接接触而实现导电连接的，但在其他未示出的实施方式中，也可以通过导电胶而将太阳能电池片112导电接触。
汇流条形成在顶板12的底表面上，其位置在图顶板12上由虚线示意性地示出。汇流条包括第一汇流条121a和第二汇流条121b，第一汇流条121a在垂直于电池片阵列11的方向上与第一导电粘结结构16a对齐，第二汇流条121b在垂直于电池片阵列11的方向上与第二导电粘结结构16b对齐，以使得汇流条能够同时接触所有电池串的对应的导电粘结结构。
进一步地，顶侧柔性膜13上设置有与第一导电粘结结构16a和第二导电粘结结构16b对应的孔131，导电粘结结构能够穿过孔131而与汇流条接触。
在本实施方式中，通过设置在各个太阳能电池片112之间的粘结剂而实现将各个太阳能电池片112相对于彼此固定。例如，粘结剂可以施加在每一个太阳能电池片112上，以当该太阳能电池片112和另 一太阳能电池片112叠瓦相连时粘结剂将二者粘合。或者，每一个电池串上可以设置一个透明的粘结剂，粘结剂可以为沿第二方向D2延伸的条状结构并跨越在该电池串上。优选地，粘结剂可以仅具有粘结作用而不具导电作用。
可以看到，由于粘结剂已经可以将各个太阳能电池片112相对于彼此固定，且在层压之后顶侧封装结构123、底侧封装结构145和太阳能电池片112也能够固定为一体，因而本实施方式的叠瓦组件1上可以不设置焊带。
本实施方式还提供了制备图1中所示的叠瓦组件1的方法，该方法包括排版叠片步骤、设置汇流条的步骤以及层压步骤等。
在排版叠片步骤中，将太阳能电池片112和导电片113在底侧柔性膜14的顶表面上沿第二方向D2以叠瓦方式排列成多个电池串，使导电片113位于电池串的末端，各个太阳能电池片112之间通过主栅线之间的直接接触而实现导电连接，导电片113和与其相邻的太阳能电池片112的主栅线直接接触，各个电池串沿垂直于第二方向D2的第一方向D1排布而形成电池片阵列11，各个太阳能电池片112和导电片113之间通过粘结剂而相对于彼此固定。该叠片过程可以通过将太阳能电池片112静电吸附或真空吸附在底侧柔性膜14上而实现。
可以看到，在该步骤中，将排版步骤和叠片步骤合二为一，直接在底侧封装材料上进行叠片并将各个电池片相对于彼此固定，在叠片的同时即完成了排版。这样的方式成本较低、效率较高，易于操作。
其中，施加粘结剂的步骤可以包括：在每一个太阳能电池片112和导电片113上施加粘结剂，以当太阳能电池片112排列成电池串时粘结剂位于每一对相邻的太阳能电池片112和导电片113之间。进一步地，在施加粘结剂时通过相机检测施加粘结剂的质量，并根据检测结果剔除未正确施加粘结剂的太阳能电池片112。更优选地，检测步骤对施加粘结剂的步骤同时进行且检测步骤能够对施加粘结剂的步骤进行闭环反馈。
施加汇流条的步骤包括：在电池片阵列11的顶侧设置第一汇流 条121a和第二汇流条121b，或者在电池片阵列11的底侧设置第一汇流条121a和第二汇流条121b，以使得第一汇流条121a与各个电池串的首端的太阳能电池片112的主栅线电接触，第二汇流条121b与各个电池串的导电片113电接触，两个汇流条均为连续的条状结构并能够从电池片阵列11收集电流并将电流向外导出。
具体地，结合图1所示的叠瓦组件1，本实施方式中的汇流条是施加在顶侧柔性膜13的底表面上的，且本实施方式中的方法还包括设置导电粘结结构的步骤。设置导电粘结结构的步骤为：在每一个电池串的首端的太阳能电池片112的顶表面上设置第一导电粘结结构16a，以使第一导电粘结结构16a和首端的太阳能电池片112的主栅线(本实施方式中为正电极17)直接接触；在每一个导电片113的顶表面上也设置第二导电粘结结构16b，其中，相邻的电池串的对应的导电粘结结构在第一方向D1上间隔开。
并且，顶侧封装结构123包括顶板12和顶侧柔性膜13，两个汇流条121分别被施加在顶板12的底表面的两侧上，并使得两个汇流条在垂直于电池片阵列11的方向上与和相应的导电粘结结构对齐，以使得汇流条能够同时接触所有电池串的对应的导电粘结结构。
进一步地，上述方法还包括：在顶侧柔性膜13上设置与导电粘结结构对应的孔131，以使导电粘结结构能够透过孔131而与汇流条接触。
优选地，施加第一导电粘结结构16a和第二导电粘结结构16b的步骤发生于在电池片方阵11上设置顶侧柔性膜13之后，施加第一导电粘结结构16a和第二导电粘结结构16b的步骤为：在顶侧导电膜的两侧上施加导电粘结材料，以使导电粘结透过孔131而流至电池片阵列11的顶表面上并在此凝结为第一导电粘结结构16a和第二导电粘结结构16b。进一步地，可以通过点胶、涂抹、喷涂、印刷中的其中一种方式施加导电粘结结构。
通常，太阳能电池片112小片是由太阳能电池片整片裂片而成的，施加粘结剂的步骤可以设置在裂片前或裂片后。例如，可以先在太阳 能电池片整片上激光刻槽并施加粘结剂，再将太阳能电池片整片裂片为多个太阳能电池片112；或者，可以在太阳能电池片整片上激光刻槽，随后将太阳能电池片整片裂片为多个太阳能电池片112，再在每一个太阳能电池片112上施加粘结剂。
优选地，可以将太阳能电池片112的叠片步骤和施加粘结剂的步骤同时进行，例如，在将太阳能电池片112叠片成电池串的过程中对太阳能电池片112之间的重叠部位施加热和/或压力，或采用风干、紫外线固化或湿气的方式使此处的粘结剂固化。
同样优选地，在将太阳能电池片112排列成电池串的过程中通过检测装置、例如相机检测叠片质量，并将检测结果实时地反馈至监控平台。更优选地，制造系统中还包括控制装置，控制装置和用于检测的机构相关联并能够对用于检测的机构进行闭环控制。
制造工序的最后包括层压步骤。层压步骤能够将顶侧封装结构123、电池片阵列11和底侧封装结构145压合在一起。在层压步骤前采用EL电致发光或PL光致发光对待层压件进行缺陷检测，若检测不合格，则将待层压件修复完成之后重新进行缺陷检测。
由于上述各项工序已经实现了将叠瓦组件1封装固定且太阳能电池片112之间可以导电连接并将电流导出，因而上述方法无需设置施加焊带的步骤。
第二实施方式
图3示出了根据本发明的第二实施方式的叠瓦组件2，对于本实施方式中与第一实施方式相同或相似的部分，不再进行重复描述或简化相关描述。
叠瓦组件2包括电池片阵列21、顶侧封装结构223和底侧封装结构245，顶侧封装结构223包括顶板22和顶侧柔性膜23，底侧封装结构245包括底板25和底侧柔性膜24。
在本实施方式中，汇流条均设置在电池片阵列21上。其中，第一汇流条26a设置在所有电池串的首端的太阳能电池片的顶表面上并将其接触的各个太阳能电池片的正电极连接起来，连接方式可以是导 电粘结结构或者焊接，第二汇流条26b设置在各个导电片的顶表面上并将各个导电片连接起来，连接方式可以是导电粘结结构或者焊接。
顶板22自身可以由不导电的透明或者不透明材质制成且顶板22上不必设置类似于汇流条的导电机构。
第三实施方式
图4示出了根据本发明的第三实施方式的叠瓦组件3，对于本实施方式中与第一实施方式相同或相似的部分，不再进行重复描述或简化相关描述。
叠瓦组件3包括顶侧封装结构323、底侧封装结构和电池片阵列31。顶侧封装结构323包括顶板32和顶侧柔性膜33，底侧封装结构包括底板35和底侧柔性膜34。顶板32的下表面上设置有第一汇流条321a和第二汇流条132b，顶侧柔性膜33上设置有孔331，电池片阵列31上的第一导电粘结结构36a和第二导电粘结结构36b能够通过孔331而与对应的汇流条导电接触。
在本实施方式中，粘结剂341施加在底侧柔性膜34的顶表面上，当将太阳能电池片在底侧柔性膜34的上表面上叠片时，各个太阳能电池片便能够通过粘结剂341相对于底侧柔性膜34固定，从而使得各个太阳能电池片相对于彼此固定。
优选地，从图4中可以看到，粘结剂341为预先设置在底侧柔性膜34的顶表面上的多组点状粘结剂341，每一组点状粘结剂341对应于一个电池串，每一组点状粘结剂341包括一排或者多排，粘结剂341均沿第二方向依次排列并用于分别和该电池串中的每一个的太阳能电池片的底表面接合。
对应地，制造粘结剂341的方法包括在将太阳能电池片排布在底侧封装结构之前在底侧柔性膜34的顶表面上施加粘结剂341的步骤。施加粘结剂341的步骤包括：在底侧柔性膜34的顶表面上施加多组点状粘结剂341，使每一组点状粘结剂341对应于一个电池串，每一组点状粘结剂341均包括一排或者多排点状结构，点状粘结剂341均沿第二方向依次排列并用于分别和该电池串中的每一个太阳能电池 片的底表面接合。
第四实施方式
图5示出了根据本发明的第四实施方式的叠瓦组件，对于本实施方式中与第一实施方式相同或相似的部分，不再进行重复描述或简化相关描述。
叠瓦组件4包括电池片阵列41、顶侧封装结构423和底侧封装结构445，顶侧封装结构423包括顶板42和顶侧柔性膜43，底侧封装结构445包括底板45和底侧柔性膜44。
在本实施方式中，第一汇流条46a和第二汇流条46b均设置在电池片阵列41上。其中，第一汇流条46a设置在所有电池串的首端的太阳能电池片的顶表面上并将其接触的各个太阳能电池片的正电极连接起来，连接方式可以是导电粘结结构或者焊接，第二汇流条46b设置在各个导电片的顶表面上并将各个导电片连接起来，连接方式可以是导电粘结结构或者焊接。
顶板42自身可以由不导电的透明或者不透明材质制成且顶板42上不必设置类似于汇流条的导电机构。
在本实施方式中，粘结剂441施加在底侧柔性膜44的顶表面上，当将太阳能电池片在底侧柔性膜44的上表面上叠片时，各个太阳能电池片便能够通过粘结剂441相对于底侧柔性膜44固定，从而使得各个太阳能电池片相对于彼此固定。
优选地，从图4中可以看到，粘结剂441为预先设置在底侧柔性膜44的顶表面上的多组点状粘结剂441，每一组点状粘结剂441对应于一个电池串，每一组点状粘结剂441包括一排或者多排，粘结剂441均沿第二方向依次排列并用于分别和该电池串中的每一个的太阳能电池片的底表面接合。
上述几种实施方式给出了一些本发明的方法和结构的示例。本发明提供的方法，能够将排版工序和叠片工序合二为一，直接在底侧封装材料上将电池片叠片并排版，这样的方式成本较低、效率较高，易 于操作。另一方面，在本发明所提供的叠瓦组件中，汇流条能够起到汇流作用，粘结剂能够起到固定作用，无需额外使用焊带和导电胶，这样的设置能够避免电池片的功率损失，也能够避免由于设置导电胶而可能产生的一系列问题。
本发明的多种实施方式的以上描述出于描述的目的提供给相关领域的一个普通技术人员。不意图将本发明排他或局限于单个公开的实施方式。如上所述，以上教导的领域中的普通技术人员将明白本发明的多种替代和变型。因此，虽然具体描述了一些替代实施方式，本领域普通技术人员将明白或相对容易地开发其他实施方式。本发明旨在包括这里描述的本发明的所有替代、改型和变型，以及落入以上描述的本发明的精神和范围内的其他实施方式。
附图标记：
叠瓦组件1、2、3、4
电池片阵列11、21、31、41
顶侧封装结构123、223、323、423
顶侧封装结构145、245、345、445
顶板12、22、32、42
顶侧柔性膜13、23、33、43
底板15、25、35、45
底侧柔性膜14、24、34、44
第一汇流条121a、26a、321a、46a
第二汇流条121b、26b、321b、46b
第一导电粘结结构16a、36a
第二导电粘结结构16b、36b
孔131、331
粘结剂341、441
太阳能电池片112
导电片113
正电极17
背电极18
第一方向D1
第二方向D2

Claims (36)

  1. 一种制造叠瓦组件的方法，所述叠瓦组件包括底侧封装结构、顶侧封装结构和固定在所述底侧封装结构和所述顶侧封装结构之间的电池片阵列，其特征在于，所述方法包括如下步骤：
    将太阳能电池片和导电片在底侧封装结构的顶表面上沿第二方向以叠瓦方式排列成多个电池串，使所述导电片位于所述电池串的末端，各个所述太阳能电池片之间通过主栅线之间的接触而实现导电连接，所述导电片和与其相邻的太阳能电池片的主栅线接触，各个所述太阳能电池片和所述导电片之间通过粘结剂而相对于彼此固定，各个所述电池串沿垂直于第二方向的第一方向排布而形成电池片阵列；
    在所述电池片阵列的顶侧设置第一汇流条和第二汇流条，或者在所述电池片阵列的底侧设置第一汇流条和第二汇流条，以使得所述第一汇流条与各个所述电池串的首端的所述太阳能电池片的主栅线电接触，所述第二汇流条与各个所述电池串的所述导电片电接触，所述两个汇流条均为连续的条状结构并能够从所述电池片阵列收集电流并将电流向外导出；
    对所述顶侧封装结构、所述电池片阵列和所述底侧封装结构的组合结构进行层压。
  2. 根据权利要求1所述的方法，其特征在于，所述方法还包括如下步骤：
    在每一个所述电池串的首端的所述太阳能电池片的顶表面上设置第一导电粘结结构，以使所述第一导电粘结结构和所述首端的太阳能电池片的主栅线直接接触；
    在每一个所述导电片的顶表面上设置第二导电粘结结构，
    其中，相邻的电池串的对应的导电粘结结构在第一方向上间隔开，
    并且，所述顶侧封装结构包括顶板，所述第一汇流条和所述第二汇流条被施加在所述顶板的底表面上，并使得所述第一汇流条和所述第二汇流条在垂直于所述电池片阵列的方向上与和各个对应的导电 粘结结构对齐，以使得所述汇流条能够同时接触所有所述电池串的对应的导电粘结结构。
  3. 根据权利要求2所述的方法，其特征在于，所述顶侧封装结构还包括设置在所述顶板和所述电池片阵列之间的顶侧柔性膜，所述方法还包括：在所述顶侧柔性膜上设置与所述导电粘结结构对应的孔，以使所述导电粘结结构能够透过所述孔而与所述汇流条接触。
  4. 根据权利要求3所述的方法，其特征在于，施加第一导电粘结结构和第二导电粘结结构的步骤发生于在所述电池片阵列上设置所述顶侧柔性膜之后，施加第一导电粘结结构和第二导电粘结结构的步骤为：在所述顶侧导电膜上施加导电粘结材料，以使所述导电粘结透过所述孔而流至所述电池片阵列的顶表面上并在此凝结为第一导电粘结结构和第二导电粘结结构。
  5. 根据权利要求2所述的方法，其特征在于，通过点胶、涂抹、喷涂、印刷中的其中一种方式施加所述导电粘结结构。
  6. 根据权利要求1所述的方法，其特征在于，所述第一汇流条和所述第二汇流条设置在所述电池片阵列上，其中所述第一汇流条设置在所有所述电池串的首端的所述太阳能电池片的顶表面上并将其接触的各个太阳能电池片的主栅线连接起来，连接方式可以是导电粘结结构或者焊接，所述第二汇流条设置在各个所述导电片的顶表面上并将各个所述导电片连接起来，连接方式可以是导电粘结结构或者焊接。
  7. 根据权利要求1所述的方法，其特征在于，所述方法包括施加粘结剂的步骤，所述施加粘结剂的步骤包括：在每一个所述太阳能电池片和所述导电片上施加粘结剂，以当所述太阳能电池片排列成电池串时所述粘结剂位于每一对相邻的太阳能电池片和导电片之间。
  8. 根据权利要求7所述的方法，其特征在于，所述方法还包括如下步骤：在施加粘结剂时通过相机检测施加粘结剂的质量，并根据检测结果剔除未正确施加粘结剂的太阳能电池片。
  9. 根据权利要求8所述的方法，其特征在于，所述检测步骤对施加粘结剂的步骤同时进行且所述检测步骤能够对施加粘结剂的步骤 进行闭环反馈。
  10. 根据权利要求7所述的方法，其特征在于，所述方法包括如下步骤：
    设置太阳能电池片整片；
    在所述太阳能电池片整片上激光刻槽并施加粘结剂；
    将所述太阳能电池片整片裂片为多个太阳能电池片。
  11. 根据权利要求7所述的方法，其特征在于，所述方法包括如下步骤：
    设置太阳能电池片整片；
    在所述太阳能电池片整片上激光刻槽；
    将所述太阳能电池片整片裂片为多个太阳能电池片；
    在每一个所述太阳能电池片上施加粘结剂。
  12. 根据权利要求7所述的方法，其特征在于，在将所述太阳能电池片叠片成电池串的过程中对所述太阳能电池片之间的重叠部位施加热和/或压力，从而使此处的粘结剂固化。
  13. 根据权利要求1所述的方法，其特征在于，所述底侧封装结构包括底板和位于所述底板和所述电池片阵列之间的底侧柔性膜，所述方法还包括在将太阳能电池片排布在所述底侧封装结构之前在所述底侧柔性膜的顶表面上施加粘结剂的步骤。
  14. 根据权利要求13所述的方法，其特征在于，所述施加粘结剂的步骤包括：在所述底侧柔性膜的顶表面上施加多组点状粘结剂，使每一组所述点状粘结剂对应于一个所述电池串，每一组所述点状粘结剂均包括一排或多排点状结构，所述点状粘结剂均沿所述第二方向依次排列并用于分别和该电池串中的每一个所述太阳能电池片的底表面的接合。
  15. 根据权利要求1所述的方法，其特征在于，所述方法包括在将所述太阳能电池片在所述底侧封装结构上排列成电池串之后的施加粘结剂的步骤，所述施加粘结剂的步骤包括：在每一个所述电池串上沿第二方向施加条状粘结剂以使所述条状粘结剂跨越在该电池串 上。
  16. 根据权利要求1所述的方法，其特征在于，将所述太阳能电池片排列成电池串以及将电池串排列成电池片阵列的步骤通过静电或真空吸附的方法完成。
  17. 根据权利要求1所述的方法，其特征在于，在将所述太阳能电池片排列成电池串的过程中通过相机检测叠片质量，并将检测结果实时地反馈至监控平台。
  18. 根据权利要求17所述的方法，其特征在于，制造系统中还包括控制装置，所述控制装置和所述检测机构相关联从而能够基于所述检测机构的检测结果对叠片作业机构进行控制。
  19. 根据权利要求1所述的方法，其特征在于，在层压步骤前采用EL电致发光或PL光致发光对待层压件进行缺陷检测，若检测不合格，则将待层压件修复完成之后重新进行缺陷检测。
  20. 根据权利要求1所述的方法，其特征在于，所述方法包括设置顶侧封装结构和底侧封装结构的步骤，所述设置底侧封装结构的步骤包括：
    设置底板；
    使用EVA、POE或硅胶设置位于所述刚性板和所述电池片阵列之间的柔性膜，所述设置顶侧封装结构的步骤包括：
    使用EVA、POE或硅胶设置位于所述顶板和所述电池片阵列之间的柔性膜；
    设置顶板。
  21. 根据权利要求1-20中任意一项所述的方法，其特征在于，所述粘结剂不具导电性。
  22. 根据权利要求1-20中任意一项所述的方法，其特征在于，所述方法不包括设置焊带的步骤。
  23. 一种叠瓦组件，所述叠瓦组件包括底侧封装结构、透明的顶侧封装结构和设置在所述底侧封装结构和顶侧封装结构之间的电池片阵列，所述电池片阵列包括至少两个电池串，各个所述电池串沿第 一方向依次排列成所述电池片阵列，
    其特征在于，每一个电池串包括多个太阳能电池片和位于所述多个电池片末端的一个导电片，所述多个太阳能电池片和所述一个导电片沿垂直于所述第一方向的第二方向以叠瓦方式依次排列并通过粘结剂相对于彼此固定，其中，各个所述太阳能电池片之间通过主栅线之间的接触而实现导电连接，所述导电片和与其相邻的太阳能电池片的主栅线接触，
    其中，所述叠瓦组件设置有共同位于所述电池片阵列的顶侧或底侧的第一汇流条和第二汇流条，其中，所述第一汇流条构造为与各个所述电池串的首端的所述太阳能电池片的主栅线电接触，所述第二汇流条构造为与各个所述电池串的所述导电片电接触，所述两个汇流条均为连续的条状结构并能够从所述电池片阵列收集电流并将电流向外导出。
  24. 根据权利要求23所述的叠瓦组件，其特征在于，每一个所述电池串的首端的太阳能电池片的顶表面上设置有和其主栅线直接接触的第一导电粘结结构，所述导电片的顶表面上设置有第二导电粘结结构，相邻的所述电池串的对应的导电粘结结构在所述第一方向上间隔开，并且，所述顶侧封装结构包括顶板，所述汇流条形成在所述顶板的底表面上并在垂直于所述电池片阵列的方向上和各个对应的所述导电粘结结构对齐，以使得所述汇流条同时接触所有所述电池串的对应的所述导电粘结结构。
  25. 根据权利要求24所述的叠瓦组件，其特征在于，所述顶侧封装结构还包括设置在所述顶板和所述电池片阵列之间的顶侧柔性膜，所述顶侧柔性膜上设置与所述导电粘结结构对应的孔，所述导电粘结结构能够透过所述孔而与所述汇流条接触。
  26. 根据权利要求24所述的叠瓦组件，其特征在于，所述导电粘结结构中的每一段为点状结构或沿所述第一方向延伸的条状结构。
  27. 根据权利要求23所述的叠瓦组件，其特征在于，所述汇流条形成在所述电池片阵列上，所述第一汇流条将各个所述电池串首端的 所述主栅线连接起来，所述第二汇流条将各个所述电池串的所述导电片连接起来。
  28. 根据权利要求27所述的叠瓦组件，其特征在于，所述顶侧封装结构不具导电性。
  29. 根据权利要求23所述的叠瓦组件，其特征在于，所述粘结剂设置在每一个所述电池串的每一对相邻的两个太阳能电池片之间。
  30. 根据权利要求23所述的叠瓦组件，其特征在于，所述粘结剂设置在每一个所述太阳能电池片和所述底侧封装结构之间，以使所有的所述太阳能电池片均相对于所述底侧封装结构固定。
  31. 根据权利要求30所述的叠瓦组件，其特征在于，所述底侧封装结构包括底板和位于所述底板和所述电池片阵列之间的底侧柔性膜，所述粘结剂施加在所述底侧柔性膜的顶表面上。
  32. 根据权利要求31所述的叠瓦组件，其特征在于，所述粘结剂为预先设置在所述底侧柔性膜的顶表面上的多组点状粘结剂，每一组所述点状粘结剂对应于一个所述电池串，每一组所述点状粘结剂均包括一排或者多排点状粘结剂，所述点状粘结剂均沿所述第二方向依次排列并用于分别和该电池串中的每一个所述太阳能电池片的底表面接合。
  33. 根据权利要求23所述的叠瓦组件，其特征在于，每一个所述电池串上设置有一个所述粘结剂，所述粘结剂为沿所述第二方向延伸的条状结构并跨越在所述电池串上。
  34. 根据权利要求23所述的叠瓦组件，其特征在于，所述底侧封装结构包括底板和位于所述底板和所述电池片阵列之间的柔性膜，所述柔性膜为EVA整片膜结构、POE整片膜结构或硅胶整片膜结构，所述顶侧封装结构包括顶板和位于所述顶板和所述电池片阵列之间的柔性膜，所述柔性膜为EVA整片膜结构、POE整片膜结构或硅胶整片膜结构。
  35. 根据权利要求23-34中任意一项所述的叠瓦组件，其特征在于，所述粘结剂不具导电性。
  36. 根据权利要求23-34中任意一项所述的叠瓦组件，其特征在于，所述叠瓦组件不设置焊带。
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