WO2020259552A1 - 均热板和折叠终端 - Google Patents

均热板和折叠终端 Download PDF

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Publication number
WO2020259552A1
WO2020259552A1 PCT/CN2020/097990 CN2020097990W WO2020259552A1 WO 2020259552 A1 WO2020259552 A1 WO 2020259552A1 CN 2020097990 W CN2020097990 W CN 2020097990W WO 2020259552 A1 WO2020259552 A1 WO 2020259552A1
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WIPO (PCT)
Prior art keywords
heat
cavity
heat equalizing
connecting part
plate
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Ceased
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PCT/CN2020/097990
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English (en)
French (fr)
Inventor
俞涵如
靳林芳
施健
袁志
周阿龙
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Publication of WO2020259552A1 publication Critical patent/WO2020259552A1/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps

Definitions

  • This application relates to the field of heat transfer devices, and more specifically, to a soaking plate and a folding terminal.
  • folding terminals have received more and more attention.
  • the folding terminal can meet the user's experience requirements for large screens.
  • the folding terminal also has the advantages of being easy to carry.
  • the heat dissipation of the folding terminal is an important issue that cannot be ignored.
  • the next-generation terminal pursues the ultimate experience and performance improvement, and the heat generated by the terminal will also increase.
  • the heat tends to be concentrated on one side of the device. If rapid heat dissipation cannot be achieved , It will cause partial overheating of the device, which will seriously affect the performance and user experience of the device.
  • the embodiments of the present application provide a soaking plate and a folding terminal to solve the problem that the heat dissipation device cannot satisfy both flexible bending and high thermal conductivity.
  • a heat equalizing plate including: a first equalizing part, including a first cavity and a first capillary layer disposed in the first cavity, wherein the first cavity includes a An upper cover plate and a first lower cover plate; the second heat equalizing part includes a second cavity and a second capillary layer arranged in the second cavity, wherein the second cavity includes a second upper cover Plate and a second lower cover plate; a connecting part, the connecting part is arranged between the first heat equalizing part and the second heat equalizing part, and is connected to the first heat equalizing part and the second heat equalizing part Connection, wherein the connection part is provided with a plurality of through holes penetrating along the height direction of the connection part, so that the heat equalizing plate can be bent at the connection part.
  • the heat equalizing plate provided by the embodiment of the present application, by providing a plurality of through holes at the connecting position, the bending ability of the connecting position can be improved, so that it can still have a good performance even when it is repeatedly bent multiple times.
  • the connection performance ensures the thermal conductivity of the soaking plate.
  • the connecting portion includes: a third cavity, the third cavity being in communication with the first cavity and the second cavity; A three capillary layer, the third capillary layer is arranged inside the third cavity and connected to the first capillary layer and the second capillary layer.
  • the material of the connecting part is any of the following materials: metal material, rubber, polyimide PI.
  • connection part is provided with a third cavity connected to the first cavity and the second cavity respectively, and a third capillary layer is provided in the third cavity, so that the connection The part can have good thermal conductivity.
  • a flexible material is selected to make the connecting part, and at the same time, the connecting part has good bending performance.
  • the connecting portion has a single-layer structure.
  • the connecting part is configured as a single-layer structure, so that the connecting part has better bending performance than the double-layer or multi-layer structure, thereby improving the heating plate The overall bending ability.
  • the connecting portion is connected to the first upper cover plate of the first heat equalizing portion and the second upper cover of the second heat equalizing portion
  • the cover plate is integrally formed; or, the connecting part is integrally formed with the first lower cover plate of the first heat equalization part and the second lower cover plate of the second heat equalization part.
  • the material of the connecting portion is any of the following materials: metal material, graphite or graphene.
  • connection part by selecting metal, graphite or graphene as the material of the connection part, the connection part can be made to have high thermal conductivity. It should be understood that when the structure of the connection part is different, different materials can be selected to make the connection part. For example, when the connection part has a single-layer structure or a double-layer structure, that is, no cavity and capillary layer, a high thermal conductivity material can be selected. And a material with good bending ability is used as the material of the connection part.
  • the edge of the side surface of the connecting portion is zigzag or corrugated.
  • the side edge of the connecting part is set in a zigzag or corrugated shape to reduce the stress on the side edge during the bending process, so that after multiple bending, It still has good mechanical properties.
  • the connecting portion is arranged along the length direction or the width direction of the heat equalizing plate.
  • a heat equalizing plate comprising: a first heat equalizing part, including a first cavity and a first capillary layer disposed in the first cavity, wherein the first cavity includes a first The upper cover and the first lower cover; the second heat equalizing part includes a second cavity and a second capillary layer arranged in the second cavity, wherein the second cavity includes a second upper cover And a second lower cover plate; a connecting portion, the connecting portion is disposed between the first heat equalizing portion and the second equalizing portion, and connected to the first equalizing portion and the second equalizing portion , Wherein the connecting part is made of a thermally conductive flexible material, so that the heat equalizing plate can bend at the connecting part.
  • the connecting portion is provided with a plurality of through holes penetrating along the height direction of the connecting portion.
  • the heat equalizing plate provided by the embodiment of the present application, by providing a plurality of through holes at the connecting position, the bending ability of the connecting position can be improved, so that it can still have a good performance even when it is repeatedly bent multiple times.
  • the connection performance ensures the thermal conductivity of the soaking plate.
  • the thickness of the connecting portion is smaller than the thickness of the first heat equalizing portion and/or the second heat equalizing portion.
  • the connecting portion when the flexible material is rubber, PI or metal, the connecting portion includes: a third cavity, and the third cavity is A cavity is in communication with the second cavity; a third capillary layer, the third capillary layer is arranged inside the third cavity and connected with the first capillary layer and the second capillary layer.
  • connection part is provided with a third cavity connected to the first cavity and the second cavity respectively, and a third capillary layer is provided in the third cavity, so that the connection The part can have good thermal conductivity.
  • a flexible material is selected to make the connecting part, and at the same time, the connecting part has good bending performance.
  • the connecting portion has a single-layer structure.
  • the material of the connecting part is any of the following materials: metal material, graphite or graphene.
  • connection part by selecting metal, graphite or graphene as the material of the connection part, the connection part can be made to have high thermal conductivity. It should be understood that when the structure of the connection part is different, different materials can be selected to make the connection part. For example, when the connection part has a single-layer structure or a double-layer structure, that is, no cavity and capillary layer, a high thermal conductivity material can be selected. And a material with good bending ability is used as the material of the connection part.
  • the edge of the side surface of the connecting portion is zigzag or corrugated.
  • the side edge of the connecting part is set in a zigzag or corrugated shape to reduce the stress on the side edge during the bending process, so that after multiple bending, It still has good mechanical properties.
  • the connecting portion is arranged along the length direction or the width direction of the heat equalizing plate.
  • a foldable terminal in a third aspect, includes the heat spreader as described in any one of the implementations of the first aspect.
  • a foldable terminal is provided, and the foldable terminal includes the heat equalizing plate according to any one of the implementation manners of the second aspect.
  • the relative position of the heat equalizing plate in the foldable terminal described in any implementation of the first aspect or the second aspect may be: the first equalizing part and the second equalizing part are respectively disposed on the foldable terminal The non-bending part and the connecting part are arranged at the position corresponding to the hinge of the folding terminal.
  • the first heat equalizing part and the second heat equalizing part may be fixed on the inner side of the non-bending part of the screen by means of glue, or fixed on the middle frame of the folding terminal.
  • the heat equalizing plate provided by the embodiment of the present application has a specific structure and material at the connecting part, so that the connecting part of the equalizing plate has high thermal conductivity while also having good bending ability, thereby improving the heat equalizing plate Overall performance.
  • Fig. 1 is a schematic diagram of the overall structure of a soaking plate provided by an embodiment of the present application.
  • FIG. 2 is a schematic cross-sectional structure diagram of a soaking plate provided by an embodiment of the application.
  • Fig. 3 shows a schematic structural diagram of a relative position of a heat spreader in a terminal provided by an embodiment of the present application.
  • Fig. 4 shows a schematic structural diagram of a heat equalizing plate provided with a through hole in the connection part according to an embodiment of the present application.
  • FIG. 5 shows a schematic structural diagram of the shape of the through hole of the connection part of the heat spreading plate provided by the embodiment of the present application.
  • Fig. 6 shows a schematic structural diagram of a heat spreading plate with a single-layer structure provided by an embodiment of the present application.
  • FIG. 7 shows a schematic structural diagram of a heat equalizing plate with a double-layer structure connected part provided by an embodiment of the present application.
  • FIG. 8 shows a schematic structural diagram of a heat equalizing plate provided with a cavity in the connection part according to an embodiment of the present application.
  • Fig. 9 shows a schematic cross-sectional structure view taken along a direction perpendicular to the paper surface at position B-B in Fig. 8.
  • Fig. 10(a) shows a schematic structural diagram of the shape of the capillary layer of the connecting part provided by an embodiment of the present application.
  • FIG. 10(b) shows a schematic structural diagram of another capillary layer shape of the connecting part provided by an embodiment of the present application.
  • Fig. 11 shows a schematic diagram of a heat dissipation path of a heat equalizing plate provided with a cavity in the connection part according to an embodiment of the present application.
  • Fig. 12 shows a schematic diagram of the heat dissipation path in a cross-sectional view taken along a direction perpendicular to the paper surface at a position C-C in Fig. 11.
  • Fig. 13 shows a schematic diagram of the overall structure of another heat spreading plate provided by an embodiment of the present application.
  • FIG. 14 shows a schematic diagram of a cross-sectional structure of another heat spreading plate provided by an embodiment of the present application.
  • FIG. 15 shows a schematic diagram of the overall structure of yet another heat spreader provided by an embodiment of the present application.
  • FIG. 16 shows a schematic cross-sectional structure diagram of another heat spreader provided by an embodiment of the present application at the position D-D in FIG. 16 along a direction perpendicular to the paper surface.
  • Fig. 17 shows a schematic cross-sectional structure view of another heat spreader provided by an embodiment of the present application at the position D-D in Fig. 16 along a direction perpendicular to the paper surface.
  • FIG. 18 shows a schematic diagram of another heat dissipation path of a heat spreader provided by an embodiment of the present application.
  • FIG. 19 shows a schematic diagram of a heat dissipation path shown in a cross-sectional structure perpendicular to the paper surface at positions E-E in FIG. 19.
  • Fig. 20(a) shows a schematic structural diagram of a side edge shape of a heat spreader provided by an embodiment of the present application.
  • Fig. 20(b) shows a schematic structural diagram of another side edge shape of a heat spreading plate provided in an embodiment of the present application.
  • FIG. 21 shows a schematic diagram of the overall structure of another heat spreader provided by an embodiment of the present application.
  • folding terminals In response to consumers' pursuit of large-screen experience, folding terminals have become an important trend in the development of next-generation terminal devices, and research on folding terminal devices has also received more and more attention.
  • the heat dissipation of the folding terminal is an important aspect that cannot be ignored in the research process of the folding terminal.
  • the heat dissipation performance is an important factor that affects whether the terminal can have good performance.
  • the heating element such as the chip is often arranged on one side of the folding terminal. At this time, if the heat dissipation element is arranged on this side, the heat cannot be sufficiently diffused.
  • a better implementation is to provide heat dissipation elements on both sides of the foldable terminal to transfer the heat generated by the heat source on one side to the other side, thereby reducing local overheating, improving the performance of the terminal device and the consumer experience.
  • the embodiment of the present application provides a heat spreading plate that can be applied to the folding terminal .
  • the soaking plate usually also called the soaking plate, or super-conducting plate, or thermal conducting plate.
  • the soaking plate is composed of an upper cover plate, a lower cover plate, capillary structure and working fluid.
  • the upper cover and the lower cover of the soaking plate can be welded and sealed to form a closed cavity.
  • a capillary layer with a capillary structure can be arranged inside the cavity, and a certain amount of workmanship can be filled in the capillary layer. Quality, thus forming a phase change cycle system.
  • the working fluid filled in the capillary layer that is, the cooling liquid, may be water, for example.
  • the heat dissipation process of the soaking plate is the two-phase heat dissipation process in which the working fluid undergoes a gas-liquid two-phase change.
  • the soaking plate usually uses copper or copper alloy as the upper and lower cover plates, and copper powder, copper woven mesh, wire bundles, etc. as the internal capillary structure to obtain the best heat dissipation performance.
  • copper has greater hardness and rigidity, it is not easy to deform during bending, or even if it deforms, it will produce creases or even break after deformation, resulting in blockage of the entire channel and failure of the heat plate. Therefore, the commonly used heat spreader cannot meet the folding requirements of the foldable terminal for its heat dissipation device, and cannot transmit the heat generated on one side of the foldable terminal to the other side, thereby affecting the heat dissipation performance of the foldable terminal.
  • an embodiment of the present application provides a heat spreading plate that can meet bending and heat dissipation requirements, wherein the heat spreading plate provided in the embodiment of the present application can be applied to a folding terminal.
  • Fig. 1 shows a schematic diagram of the overall structure of a soaking plate provided by an embodiment of the present application.
  • the heat equalizing plate shown in FIG. 1 includes a first equalizing part 100, a second equalizing part 200 and a connecting part 300.
  • the connecting part 300 is a bendable part.
  • Fig. 2 shows a schematic structural diagram of a cross-section of a heat spreader provided by an embodiment of the present application.
  • the heat equalizing plate includes a first equalizing part 100, a second equalizing part 200 and a connecting part 300.
  • the first heat equalizing part 100 includes a first cavity 130 and a first capillary layer 140.
  • the first cavity 130 includes a first upper cover 110 and a first lower cover 120; the first capillary layer 140 is disposed in the first cavity 130.
  • the first capillary layer 140 and the first upper cover 110 and the first lower cover 120 may be arranged in parallel.
  • the first upper cover plate 110 of the first heat equalizing part 100 may further include a plurality of supporting columns 150, and a plurality of supporting columns 150 are formed spaced apart and communicated with the first cavity 130.
  • a smaller cavity channel which can be a heat dissipation channel.
  • the first capillary layer 140 in the first cavity 130 may be closely attached to the first upper cover 110 or the first lower cover 120 of the first heat equalizing part 100; or, the first The capillary layer 140 is in close contact with the first upper cover 110 and the first lower cover 120 of the first heat equalizing part at the same time.
  • the first capillary layer 140 is also filled with a working fluid (not shown in FIG. 2).
  • the working fluid may be deionized water, for example, and the heat dissipation of the soaking plate can be realized by the gas-liquid two-phase change of the working fluid.
  • the specific heat dissipation principle and heat dissipation path will be introduced below.
  • the first upper cover 110 and the first lower cover 120 of the first heat equalization part 100 and the second upper cover 210 and the second lower cover 220 of the second heat equalization part 200 can be adopted Made of metal material or flexible material.
  • the metal material may include, for example, copper, aluminum or copper alloy, aluminum alloy, etc.
  • the flexible material may include, for example, polyimide PI, rubber, or other polymer materials.
  • the materials of the first upper cover plate 110 and the first lower cover plate 120, and the second upper cover plate 210 and the second lower cover plate 220 are metallic materials, the first upper cover plate 110 and the second lower cover plate 220 can be welded together.
  • the first lower cover 120 is sealed to form the first cavity 130, and the second upper cover 210 and the second lower cover 220 are sealed to form the second cavity 230; when the first upper cover 110 and the first lower cover
  • the materials of 120 and the second upper cover 210 and the second lower cover 220 are flexible materials
  • the first upper cover 110 and the first lower cover 120 can be sealed to form the first cavity 130 by means of glue.
  • the second upper cover 210 and the second lower cover 220 are sealed to form a second cavity 230.
  • the structure of the second heat equalization part 200 may be similar to the structure of the first heat equalization part 100, and the structure of the second heat equalization part 100 can be referred to the description of the structure of the first heat equalization part 100 mentioned above. In order to avoid repetition, it will not be repeated here.
  • connection part 300 is arranged between the first heat equalization part 100 and the second heat equalization part 200, and is connected to the first heat equalization part 100 and the second heat equalization part 200.
  • the connecting portion 300 is provided with at least one through hole 310 along the height direction of the connecting portion 300.
  • the height direction of the connection part 300 may be a direction along the thickness of the heat equalizing plate.
  • connection part 300 compared with the structure of the connection part without through holes, the existence of multiple through holes 310 can improve the bending ability of the connection part 300, making it difficult to break when repeatedly bending, thereby ensuring its good thermal conductivity.
  • the connecting portion 300 may be a single-layer structure or a double-layer structure; or, it may also be a cavity structure (as shown in FIG. 8 or FIG. 9), for example, a third cavity 340 and a third capillary layer 350 are provided.
  • the third cavity 340 can be connected to the first cavity 130 and the second cavity 230
  • the third capillary layer 350 can be connected to the first capillary layer 140 and the second capillary layer 240.
  • connection part 300 may be integrally formed with the first heat equalization part 100 and the second heat equalization part 200; alternatively, the connection part 300 and the first heat equalization part 100 and the second heat equalization part 200 may be welded or interference fit.
  • the heat equalizing part 200 is connected; or, when the connecting part 300 is a single-layer or double-layer structure made of graphite or graphene, the connecting part 300 can also be attached to and fixed to the first through the adhesion of graphite or graphene itself.
  • the upper cover 110 and the second upper cover 210 are attached.
  • connection part 300 and the first heat equalization part 100 and the second heat equalization part 200 may be made of the same material, for example, both are made of metal materials; or, the connection part 300 may be made of the same material as the first heat equalization part 100.
  • the second soaking part 200 are made of different materials, for example, the first soaking part 100 and the second soaking part 200 are made of metal materials, and the connecting part 300 is made of graphite or graphene that can be bent and conduct heat Made of materials.
  • the bending ability of the connecting part 300 can be improved by providing the through hole 310 in the connecting part 300.
  • the thermal equalizing plate is applied to a folding terminal, it is beneficial to improve its overall performance.
  • Fig. 3 shows a schematic structural diagram of a relative position of a heat spreader in a terminal provided by an embodiment of the present application.
  • the first heat equalizing part 100 and the second heat equalizing part 200 of the heat equalizing plate may be arranged on the non-bending part of the folding terminal and arranged near the heat source, and the connecting part 300 may be arranged on the shaft part of the folding terminal.
  • the heat source may be a heating device in the terminal, such as a chip device, and the chip may be an application processor, a power management chip, etc.
  • the upper surfaces of the first heat equalizing part 100 and the second heat equalizing part 200 of the heat equalizing plate may be fixed under the screen of the folding terminal by means of glue, for example; or, the first heat equalizing part 100 and the second heat equalizing part
  • the lower surface of 200 can be fixed to the folding terminal, for example, the middle frame of the folding terminal, by means of glue, welding, etc.; or, the first heat equalizing part 100 and the second heat equalizing part 200 can be glued together with The middle frame and screen of the folding terminal are glued and fixed.
  • the connecting part 300 may not be fixed, so that the connecting part 300 can be bent freely.
  • the heat spreader can be matched with other heat sink components, such as heat pipes, graphite sheets, etc., to improve the heat dissipation capacity of the terminal.
  • a heat pipe is arranged between the heat equalizing plate and the heat source, and the heat pipe conducts the heat radiated from the heat source to the equalizing plate.
  • a metal cover can also be provided outside the heat source, the metal cover is buckled on the printed circuit board, and the metal cover covers the heat source.
  • the heat equalizing plate is in direct contact with the metal cover, the heat generated by the heat source is conducted to the equalizing plate through the metal cover.
  • the heat dissipation function of the soaking plate is mainly realized by the gas-liquid two-phase change of the working fluid.
  • the heat dissipation process of the soaking plate includes four main steps: conduction, evaporation, convection, and condensation.
  • the heat dissipation principle is: the heat generated by the heat source enters the plate through heat conduction, and the working fluid close to the heat source absorbs the heat and quickly vaporizes while taking away a large amount of heat; the steam in the plate diffuses from the high pressure zone to the low pressure zone (ie, low temperature zone), and When the steam contacts the inner wall with a lower temperature, it will quickly condense into a liquid state and release heat energy; the working fluid condensed into a liquid state returns to the heat source under the action of the capillary force generated by the fine structure, thus completing a heat conduction cycle to form a A two-way circulation system in which working fluid vapor and liquid coexist.
  • the internal vaporization of the soaking plate continues, and the internal pressure will maintain a balance as the temperature changes.
  • the soaking plate has a large coverage area and flexible layout, and its size can be designed according to the actual size and distribution of the heat source, so as to flexibly cover the heat source and realize heat dissipation for multiple heat sources at the same time.
  • the heat dissipation path of the terminal can be as follows: the heat is first conducted from the heat source to the middle frame, and then from the middle frame to the equalizing plate.
  • the hot plate is sequentially transferred from the first heat equalizing part and the connecting part to the second heat equalizing part, so that the heat is distributed as evenly as possible on the heat equalizing plate. Since the bent part of the middle frame often has a large thermal resistance, it is difficult for heat to be transferred to the other side of the middle frame through the bent part, and most of the heat needs to pass through the heat equalizing plate to achieve the temperature equalization effect.
  • FIG. 4 shows a schematic diagram of the overall structure of a heat equalizing plate provided with through holes in the connection part according to an embodiment of the present application.
  • the through hole 310 on the connecting portion 300 may have various shapes, and is not limited to the shape shown in FIG. 4.
  • the shape of the through hole 310 may also be various shapes shown in FIG. 5, such as polygons such as diamonds and rectangles; or circular, elliptical; or polygons with sharp corners rounded. This application is not limited to this.
  • the density, shape, gap, etc. of the through holes 310 on the connecting portion 300 can be flexibly set according to the third capillary layer 350.
  • the third capillary layer 350 For example, when the third cavity 340 of the connecting part 300 is provided with the third capillary layer 350, the edge of the through hole needs to be sealed. At this time, the density of the through hole can be appropriately reduced, and the capillary between each through hole Leave enough space for the structure and the steam passage; when the third capillary layer is not provided in the third cavity of the connecting part, at this time, the density of the through holes can be appropriately increased to achieve better bending performance.
  • Fig. 6 shows a schematic structural diagram of a heat spreading plate with a single-layer structure provided by an embodiment of the present application.
  • FIG. 6 may be a schematic cross-sectional structure view taken along the direction perpendicular to the paper surface at the position A-A in FIG. 4.
  • the connecting portion 300 in FIG. 4 is correspondingly a single-layer structure.
  • the material of the connecting part 300 may be a thermally conductive material such as metal, graphite or graphene.
  • the first heat equalizing part 100 and the second heat equalizing part 200 can pass through
  • the thermal conductivity of the material (metal or graphene) of the connecting part 300 itself performs heat transfer, thereby achieving a heat equalization effect.
  • the single-layer structure can be integrally formed with the upper cover plate 110 of the first heat equalization part 100 and the upper cover plate 210 of the second heat equalization part; or, the connection part 300 and the upper cover plate of the first heat equalization part 100 110 and the upper cover plate 210 of the second heat equalizing part are connected by welding or interference fit; or, when the connecting part 300 is a single-layer structure made of graphite or graphene, the connecting part 300 may also be connected by graphite Or the graphene itself has the adhesiveness and is attached and fixed on the first upper cover 110 and the second upper cover 210.
  • FIG. 7 shows a cross-sectional view of a schematic structure of a double-layered heat spreading plate provided by an embodiment of the present application.
  • the double-layer structure of the connecting portion 300 includes an upper structure 320 and a lower structure 330, wherein both the upper structure 320 and the lower structure 330 include through holes, and the through holes of the upper structure 320 correspond to the through holes of the lower structure 330 one by one.
  • a through hole 310 penetrating in the height direction of the connecting portion 300 is formed.
  • the material of the connecting part 300 may be a thermally conductive material such as metal, graphite or graphene.
  • the first heat equalizing part 100 and the second heat equalizing part 200 can pass through
  • the thermal conductivity of the material (metal or graphene) of the connecting part 300 itself performs heat transfer, thereby achieving a heat equalization effect.
  • the connecting part 300 and the upper cover plate 110 of the first heat equalizing part 100 and the upper cover plate 210 of the second heat equalizing part can be connected by welding or interference fit; or, when the connecting part 300 In the case of a two-layer structure made of graphite or graphene, the connecting portion 300 may also be adhered and fixed on the first upper cover plate 110 and the second upper cover plate 210 through the adhesion of the graphite or graphene itself.
  • the through holes of the upper structure 320 and the through holes of the lower structure 330 have the same shape and size, and the positions correspond to each other.
  • the through holes of the upper structure 320 and the through holes of the lower structure 330 have the shape There may be multiple shapes, for example, rhombus, circular, corrugated, or other polygonal shapes with rounded corners, which is not limited in this application.
  • the connecting part 300 when the connecting part 300 only adopts a single-layer structure, the bending ability of the connecting part 300 can be improved, and the soaking due to the sealing and welding of the double-layer cover plate can be avoided.
  • the problem of reduced bending of the plate makes it difficult to break after repeated bending, thereby ensuring good thermal conductivity.
  • FIG. 8 shows a schematic diagram of the overall structure of a heat equalizing plate when the connection part is provided with a cavity provided by an embodiment of the present application.
  • Fig. 9 shows a schematic cross-sectional structure diagram of the heat spreading plate at the position B-B in Fig. 8 along the direction perpendicular to the paper surface.
  • the connecting part 300 includes a third cavity 340 and a third capillary layer 350, and the third cavity 340 can communicate with the first heat equalizing part 100 and the second heat equalizing part 200, for example, the three are integrally formed;
  • the third capillary layer 350 may be connected to the first capillary layer 140 and the second capillary layer 240, so that the working fluid can flow between the first capillary layer 140 and the second capillary layer 240 via the third capillary layer 350, thereby in the first capillary layer Heat is transferred between the heat equalization part 100 and the second heat equalization part 200 to achieve a heat equalization effect.
  • the material of the connecting part 300 may be a metal material, a polymer material, or the like.
  • the connecting part 300 and the first heat equalizing part 100 and the second heat equalizing part 200 can be connected by welding or interference fit; when the connecting part 300 is made of polymer material When manufactured, the connecting part 300 can be connected to the first heat equalizing part 100 and the second heat equalizing part 200 by means of glue.
  • the connecting part 300 includes the third cavity 340 and the third capillary layer 350
  • the heat transfer between the first heat equalizing part 100 and the second heat equalizing part 200 may be performed through the capillary layer.
  • the first heat equalizing part 100 and the second heat equalizing part 200 can be mainly caused by the gas-liquid two-phase change of the working fluid in the first capillary layer 140, the second capillary layer 240, and the third capillary layer 350. Achieve uniform temperature.
  • the connecting portion 300 when the connecting portion 300 is provided with the third cavity 340 and the third capillary layer 350, the third capillary layer 350 can be flexibly set as required, and its shape may be as shown in FIG. 10(a) and FIG. 10(b), for example. shape.
  • the third capillary layer 350 may be configured in a corrugated shape, so that the third capillary layer 350 has a certain amount of stretching, so as to reduce the stress it receives during bending, thereby improving the overall bending ability of the heat spreader.
  • the shape of the capillary layer of the connecting part of the heat spreading plate provided in the present application is not limited to the two shapes shown in FIG. 10(a) and FIG. 10(b), but can also have a variety of specific shapes. Not limited.
  • the stress that the third capillary layer 350 receives during repeated bending can be reduced, so as to ensure that the equalizing plate has high thermal conductivity while at the same time. Also has good bending performance.
  • the density, shape, gap, etc. of the through holes 310 on the connection part 300 can be flexibly set according to the third capillary layer 350.
  • the edge of the through hole 310 needs to be edge-sealed.
  • the through hole density can be appropriately reduced. Leave enough space for the capillary structure and steam passage; when the third capillary layer 350 is not provided in the third cavity 340 of the connecting part 300, at this time, the density of the through holes can be appropriately increased to achieve better bending performance.
  • Fig. 11 shows a schematic diagram of a heat dissipation path of a heat equalizing plate provided with a cavity in the connection part.
  • Fig. 12 shows the heat dissipation path in the schematic cross-sectional structure of the heat spreader at the position C-C in Fig. 11 along the direction perpendicular to the paper surface.
  • the connecting part 300 is provided with a third capillary layer 350 connected to the first capillary layer 140 and the second capillary layer 240, when the heat source generates heat, the heat is first transferred to the first capillary layer.
  • Capillary layer 140 the working fluid in the first capillary layer 140 undergoes a two-phase change of heat absorption, and transfers heat to other lower temperature locations through the third capillary layer 350 and the second capillary layer 240, such as transferring heat to the second capillary layer.
  • Two soaking parts 200 to achieve soaking effect.
  • the heat generated by the heat source can also be transferred to the second heat equalization part 200 via the first upper cover 110, the connection part 300 and the second upper cover 210.
  • the heat transfer path can refer to the path indicated by the arrow shown in FIG. 12. It should be understood that the arrows shown in FIG. 12 are used to indicate several possible heat dissipation paths of the heat spreader, and do not indicate all heat dissipation paths.
  • the material of the connecting part 300 is a thermally conductive material
  • the heat generated by the heat source can also pass through The first lower cover 120 and the lower layer 330 of the connecting part 300 are transferred to the second heat equalizing part 200.
  • the heat equalizing plate provided in this embodiment includes a connecting part provided with a through hole and a heat equalizing part respectively connected to the connecting part. Since the connection part adopts a mesh structure with through holes 310, the stress on the connection part during bending can be reduced, so that the heat spreading plate has better bending ability while realizing heat conduction.
  • FIG. 13 shows a schematic structural diagram of another heat spreader provided by an embodiment of the present application.
  • the connecting portion 300 of the equalizing plate provided in this embodiment is not provided with a through hole 310, but the material of the connecting portion 300 is changed.
  • connection part 300 may be a flexible material such as polymer material, graphene or graphite, so that the connection part 300 can have good bending performance.
  • the material of the connection part 300 is different from the materials of the first and second heat equalization parts 100 and 200.
  • the material of the connection part 300 is a polymer material, such as rubber, PI, etc.
  • the material of the first soaking part 100 and the second soaking part 200 is a metal material, such as copper or copper alloy.
  • the material of the connecting part 300 is the same as the material of the first heat equalizing part 100 and the second heat equalizing part 200, and the three are all flexible materials, such as polymer materials.
  • both graphene and artificial graphite are materials with good thermal conductivity, and the use of graphite or graphene as the material of the connection part can make the connection part have good bending ability and meet the thermal conductivity.
  • some parameters of the thermal conductive film made of graphene and graphite are shown in the following table.
  • the connecting portion 300 of the heat spreader provided in this embodiment may be a single-layer structure, a double-layer structure, or a cavity structure.
  • connection part 300 when the connection part 300 has a single-layer structure or a double-layer structure, the material of the connection part may be graphite or graphene.
  • the first heat equalizing part 100 and the second heat equalizing part 200 can transfer heat through the thermal conductivity of the material of the connecting part 300 itself, so as to achieve a heat equalizing effect.
  • the connecting part 300 when the connecting part 300 has a cavity structure and is provided with a capillary layer, the material of the connecting part may be a metal or a polymer material, such as copper alloy, rubber, PI, and the like.
  • the heat transfer between the first heat equalizing part 100 and the second heat equalizing part 200 is performed through the capillary layer provided inside.
  • the connecting part 300 since the connecting part 300 is provided with the third cavity 340 and the third capillary layer 350 located in the third cavity 340, the first heat equalizing part 100 and the second heat equalizing part 200 mainly rely on the first The gas-liquid two-phase change of the working fluid in the capillary layer 140, the second capillary layer 240 and the third capillary layer 350 achieves uniform temperature.
  • FIG. 14 shows a schematic structural diagram of a heat spreader provided by an embodiment of the present application.
  • the heat spreader structure shown in FIG. 14 is a structure in which the connecting part 300 is provided with a cavity, that is, the connecting part 300 includes a third cavity 340 and a third capillary layer 350.
  • connection part 300 is a metal material or a polymer material.
  • the connecting part 300 may be a structure provided with a cavity.
  • the connecting portion 300 includes an upper structure 320 and a lower structure 330, wherein the lower structure 330 may include a third cavity 340 communicating with the first cavity 130 and the second cavity 230, and the third cavity 340
  • a third capillary layer 350 may be provided in the middle, and the third capillary layer 350 may be connected to the first capillary layer 140 and the second capillary layer 240 to form a heat dissipation path in the two-phase heat dissipation process.
  • the connecting part 300 and the first heat equalizing part 100 and the second heat equalizing part 200 can be connected by welding or interference fit; when the connecting part 300 is made of high When made of molecular materials, the connecting part 300 can be connected to the first heat equalizing part 100 and the second heat equalizing part 200 by means of glue.
  • FIG. 15 shows a schematic diagram of the overall structure of a soaking plate provided by an embodiment of the present application.
  • the heat equalizing plate structure shown in FIG. 15 is a structure in which the connection part does not contain the third capillary layer 350.
  • the first heat equalizing part 100 and the second heat equalizing part 200 can be made of metal materials, that is, the first heat equalizing part 100 and the second heat equalizing part 200 can be used as non-bending parts.
  • the bent connecting portion 300 may be overlapped with a flexible material to ensure that the connecting portion has better elastic bending performance.
  • the flexible material may be graphite or graphene, for example.
  • FIG. 16 is a cross-sectional view of a schematic structure of a heat spreader provided by an embodiment of the application.
  • the cross-sectional view can be regarded as a schematic diagram of the cross-sectional structure at the position D-D in FIG. 15 along the direction perpendicular to the paper surface.
  • the connecting portion 300 of the heat spreader shown in FIG. 16 is a single-layer structure that does not include a cavity and a capillary structure.
  • the connecting portion 300 of the heat equalizing plate shown in FIG. 15 is correspondingly a single-layer structure.
  • the material of the single-layer structure of the connection part 300 may be graphite or graphene.
  • the connecting part 300 may be connected to the first soaking part 100 and the second soaking part 200 through the viscosity of graphite or graphene itself.
  • the first heat equalizing part 100 and the second heat equalizing part 200 can transfer heat through the thermal conductivity of the material (graphite or graphene) of the connecting part 300, so as to achieve a heat equalizing effect.
  • FIG. 17 is a cross-sectional view of a schematic structure of a heat spreading plate provided by an embodiment of the application.
  • the cross-sectional view can be regarded as a schematic diagram of the cross-sectional structure at the position D-D in FIG. 15 along a direction perpendicular to the paper surface.
  • the material of the double-layer structure of the connection part 300 may be graphite or graphene.
  • the connecting part 300 may be connected to the first soaking part 100 and the second soaking part 200 through the viscosity of graphite or graphene itself.
  • the first heat equalizing part 100 and the second heat equalizing part 200 can transfer heat through the thermal conductivity of the material (graphite or graphene) of the connecting part 300, so as to achieve a heat equalizing effect.
  • the connecting part 300 when the connecting part 300 only adopts a single-layer structure, the bending ability of the connecting part 300 can be improved, and the soaking due to the sealing and welding of the double-layer cover plate can be avoided. The problem of reduced bending of the plate makes it difficult to break after repeated bending, thereby ensuring good thermal conductivity.
  • the heat dissipation path when the connecting part 300 includes a cavity structure will be described in more detail below in conjunction with FIGS. 18 and 19.
  • Figure 18 shows a schematic diagram of the heat dissipation path of the heat equalizing plate.
  • Fig. 19 is a schematic view of the heat dissipation path shown in the cross-sectional structure diagram at the position E-E in Fig. 18 along the direction perpendicular to the paper surface.
  • the first soaking part 100, the second soaking part 200 and the connecting part 300 mainly rely on the gas-liquid two-phase change of the working fluid to achieve temperature uniformity.
  • the connecting part 300 is provided with a third capillary layer 350 connected to the first capillary layer 140 and the second capillary layer 240, when the heat source generates heat, the heat is first transferred to the first capillary layer 140.
  • the working fluid in the first capillary layer 140 undergoes a two-phase change of heat absorption, and transfers the heat to other lower temperature locations through the third capillary layer 350 and the second capillary layer 240, such as transferring heat to the second Heat the part 200, so as to realize the soaking effect.
  • the material of the connection part 300 is a thermally conductive material
  • the heat generated by the heat source can also be transferred to the second heat equalization part 200 via the first upper cover 110, the connection part 300 and the second upper cover 210.
  • the heat transfer path can refer to the path indicated by the arrow shown in FIG. 19. It should be understood that the arrows shown in FIG.
  • the connecting part 300 is a heat conductive material
  • the heat generated by the heat source can also pass The first lower cover 120 and the lower layer 330 of the connecting part 300 are transferred to the second heat equalizing part 200.
  • the side edge 380 of the connecting part 300 can be set in various shapes to improve the bending performance of the connecting part.
  • Fig. 20(a) and Fig. 20(b) respectively show the shapes that the side edge of the connecting portion can take.
  • the edge shape of the connecting portion may be, for example, a zigzag shape (as shown in FIG. 20(a)), a corrugated shape (as shown in FIG. 20(b)), or a shape provided with notches at random intervals.
  • the heat equalizing plate provided by the embodiment of the present application can be set in different shapes according to the requirements of the folding terminal to which it is applied.
  • the connecting portion 300 can be arranged along the length direction or the width direction of the equalizing plate; or, the connecting portion
  • the first heat equalizing part 100 and the second heat equalizing part 200 connected by 300 are two parts with the same shape, that is, the entire heat equalizing plate has a symmetrical shape with the middle axis of the connecting part 300 as the axis of symmetry; or, the connecting part
  • the shapes of the first heat equalizing portion 100 and the second equalizing portion 200 connected by 300 are different (as shown in FIG.
  • the connecting portion 300 is different from the first equalizing portion 100 and/or the second equalizing portion 200 equal width.
  • the shape of the soaking plate can be flexibly designed according to the position of the heat source and the layout of the main board, and the size of the upper and lower cover plates can also be flexibly adjusted according to actual needs.
  • the embodiment of the present application also provides a folding terminal, which includes the heat equalizing plate provided in the embodiment of the present application as a heat dissipation element.
  • the heat spreading plate provided by the embodiments of the present application can satisfy high thermal conductivity while meeting good bending performance, thereby also improving the heat dissipation performance and the bending performance at the rotating shaft of the folding terminal using the heat spreading plate , Provide users with a good experience.

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Abstract

本申请提供了一种均热板，涉及散热装置领域。该均热板包括：第一均热部分，包括第一腔体和设置于所述第一腔体内的第一毛细层，其中，所述第一腔体包括第一上盖板和第一下盖板；第二均热部分，包括第二腔体和设置于所述第二腔体内的第二毛细层，其中，所述第二腔体包括第二上盖板和第二下盖板；连接部分，所述连接部分设置在所述第一均热部分和所述第二均热部分之间，且与所述第一均热部分和第二均热部分连接，其中，所述连接部分设置有多个沿所述连接部分的高度方向贯通的通孔。通过本申请提供的均热板，能够在保证其具有高导热性能的基础上，同时具备良好弯折性能，适用于需要反复弯折的折叠终端。

Description

均热板和折叠终端
本申请要求在2019年6月25日提交中国国家知识产权局、申请号为201910553518.0的中国专利申请的优先权，发明名称为“均热板和折叠终端”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及传热装置领域，更具体地，涉及一种均热板和折叠终端。
背景技术
随着智能终端设备的发展，折叠终端受到了越来越多的关注。一方面，折叠终端可以满足用户对大屏的体验需求，另一方面，折叠终端也具有易于携带等优点。然而，在折叠终端研究过程中，需要突破多个关键领域的技术壁垒，其中，折叠终端的散热是其中不可忽视的重要问题。下一代终端追求极致体验和性能的提升，由此终端产生的热量也会越来越多，另外，按照一般的折叠终端的芯片布局，热量往往会集中在设备的一侧，若不能实现迅速散热，则会导致设备局部过热，严重影响设备的性能和用户体验。
因此，如何实现折叠终端设备的迅速散热，是亟待解决的问题。
发明内容
本申请实施例提供一种均热板和折叠终端，以解决散热装置无法同时满足柔性弯折和高导热能力的问题。
第一方面，提供了一种均热板，包括：第一均热部分，包括第一腔体和设置于所述第一腔体内的第一毛细层，其中，所述第一腔体包括第一上盖板和第一下盖板；第二均热部分，包括第二腔体和设置于所述第二腔体内的第二毛细层，其中，所述第二腔体包括第二上盖板和第二下盖板；连接部分，所述连接部分设置在所述第一均热部分和所述第二均热部分之间，且与所述第一均热部分和第二均热部分连接，其中，所述连接部分设置有多个沿所述连接部分的高度方向贯通的通孔，使得所述均热板能够在所述连接部分发生弯折。
根据本申请实施例的提供的均热板，通过在连接位置设置有多个通孔，可以提高该连接位置的弯折能力，使其在反复多次弯折的情况下，仍能具有良好的连接性能，进而保证均热板的导热性能。
结合第一方面，在第一方面的某些实现方式中，所述连接部分包括：第三腔体，所述第三腔体与所述第一腔体和所述第二腔体连通；第三毛细层，所述第三毛细层设置在所述第三腔体内部且与所述第一毛细层和所述第二毛细层连接。
结合第一方面，在第一方面的某些实现方式中，所述连接部分的材料为以下任意材料：金属材料、橡胶、聚酰亚胺PI。
根据本申请实施例提供的均热板，通过在连接部分设置与第一腔体和第二腔体分别连通的第三腔体，以及在第三腔体中设置第三毛细层，使得该连接部分可以具有良好的导热能力，此外，选取柔性材料制作该连接部分，同时让该连接部分具备良好的弯折性能。
结合第一方面，在第一方面的某些实现方式中，所述连接部分为单层结构。
根据本申请实施例提供的均热板，通过将连接部分设置为单层结构，使得该连接部分相较于双层或者多层结构来说，具有更好的弯折性能，从而提升均热板整体的弯折能力。
结合第一方面，在第一方面的某些实现方式中，所述连接部分与所述第一均热部分的所述第一上盖板和所述第二均热部分的所述第二上盖板一体成型；或者，所述连接部分与所述第一均热部分的所述第一下盖板和所述第二均热部分的所述第二下盖板一体成型。
结合第一方面，在第一方面的某些实现方式中，所述连接部分的材料为以下任意材料：金属材料、石墨或者石墨烯。
根据本申请实施例提供的均热板，通过选择金属、石墨或者石墨烯作为连接部分的材料，能够使得该连接部分具有高导热性。应理解，当连接部分的结构不同时，可以选择不同的材料制作该连接部分，例如，当连接部分为单层结构或者双层结构，也即无空腔和毛细层时，可以选择高导热材料并且具有良好弯折能力材料作为该连接部分的材料。
结合第一方面，在第一方面的某些实现方式中，所述连接部分的侧面的边缘为锯齿形或者波纹形。
根据本申请实施例提供的均热板，将连接部分的侧面边缘设置为锯齿形或者波纹形可以减小该侧面边缘在弯折过程中所受到的应力，进而使其在多次弯折之后，仍能具有良好的力学性能。
结合第一方面，在第一方面的某些实现方式中，所述连接部分沿所述均热板的长度方向或者宽度方向设置。
第二方面，提供一种均热板，包括：第一均热部分，包括第一腔体和设置于所述第一腔体内的第一毛细层，其中，所述第一腔体包括第一上盖板和第一下盖板；第二均热部分，包括第二腔体和设置于所述第二腔体内的第二毛细层，其中，所述第二腔体包括第二上盖板和第二下盖板；连接部分，所述连接部分设置在所述第一均热部分和所述第二均热部分之间，且与所述第一均热部分和第二均热部分连接，其中，所述连接部分由导热的柔性材料制成，使得所述均热板能够在所述连接部分发生弯折。
结合第二方面，在第二方面的某些实现方式中，所述连接部分设置有多个沿所述连接部分的高度方向贯通的通孔。
根据本申请实施例的提供的均热板，通过在连接位置设置有多个通孔，可以提高该连接位置的弯折能力，使其在反复多次弯折的情况下，仍能具有良好的连接性能，进而保证均热板的导热性能。
结合第二方面，在第二方面的某些实现方式中，所述连接部分的厚度小于所述第一均热部分和/或所述第二均热部分的厚度。
结合第二方面，在第二方面的某些实现方式中，当所述柔性材料为橡胶、PI或者金属时，所述连接部分包括：第三腔体，所述第三腔体与所述第一腔体和所述第二腔体连通；第三毛细层，所述第三毛细层设置在所述第三腔体内部且与所述第一毛细层和所述第二毛细层连接。
根据本申请实施例提供的均热板，通过在连接部分设置与第一腔体和第二腔体分别连通的第三腔体，以及在第三腔体中设置第三毛细层，使得该连接部分可以具有良好的导热能力，此外，选取柔性材料制作该连接部分，同时让该连接部分具备良好的弯折性能。
结合第二方面，在第二方面的某些实现方式中，所述连接部分为单层结构。
结合第二方面，在第二方面的某些实现方式中，所述连接部分的材料为以下任意材料：金属材料、石墨或者石墨烯。
根据本申请实施例提供的均热板，通过选择金属、石墨或者石墨烯作为连接部分的材料，能够使得该连接部分具有高导热性。应理解，当连接部分的结构不同时，可以选择不同的材料制作该连接部分，例如，当连接部分为单层结构或者双层结构，也即无空腔和毛细层时，可以选择高导热材料并且具有良好弯折能力材料作为该连接部分的材料。
结合第二方面，在第二方面的某些实现方式中，所述连接部分的侧面的边缘为锯齿形或者波纹形。
根据本申请实施例提供的均热板，将连接部分的侧面边缘设置为锯齿形或者波纹形可以减小该侧面边缘在弯折过程中所受到的应力，进而使其在多次弯折之后，仍能具有良好的力学性能。
结合第二方面，在第二方面的某些实现方式中，所述连接部分沿所述均热板的长度方向或者宽度方向设置。
第三方面，提供了一种折叠终端，所述折叠终端包括上述第一方面中任一种实现方式所述的均热板。
第四方面，提供了一种折叠终端，所述折叠终端包括上述第二方面中任一种实现方式所述的均热板。
应理解，上述第一方面或者第二方面的任一实现方式中所述的均热板在折叠终端中的相对位置可以是：第一均热部分和第二均热部分分别设置于折叠终端的非弯折部分，连接部分设置于折叠终端转轴对应的位置。其中，第一均热部分和第二均热部分例如可以通过粘胶的方式固定在非弯折部分屏幕的内侧，或者，固定在折叠终端中框上。
本申请实施例提供的均热板，通过在连接部分设置特定的结构和材料，使得该均热板的连接部分在实现高导热性能的同时也具有良好的弯折能力，从而提高均热板的整体性能。
附图说明
图1是本申请实施例提供的一种均热板的整体结构示意图。
图2为本申请实施例提供的一种均热板的截面结构示意图。
图3示出了本申请实施例提供的一种均热板在终端中的相对位置的示意性结构图。
图4示出了本申请实施例提供的一种连接部分设置有通孔的均热板的示意性结构图。
图5示出了本申请实施例提供的一种均热板的连接部分的通孔的形状的示意性结构图。
图6示出了本申请实施例提供的一种连接部分为单层结构的均热板的示意性结构图。
图7示出了本申请实施例提供的一种连接部分为双层结构的均热板的示意性结构图。
图8示出了本申请实施例提供的一种连接部分设置有腔体的均热板的示意性结构图。
图9示出了在图8的B-B位置沿垂直于纸面方向的截面结构示意图。
图10(a)示出了本申请实施例提供的一种连接部分毛细层形状的示意性结构图。
图10(b)示出了本申请实施例提供的另一种连接部分毛细层形状的示意性结构图。
图11示出了本申请实施例提供的一种连接部分设置有腔体的均热板的散热路径的示意图。
图12示出了在图11的C-C位置沿垂直于纸面方向的截面图中的散热路径的示意图。
图13示出了本申请实施例提供的另一种均热板的整体结构示意图。
图14示出了本申请实施例提供的另一种均热板的截面截面结构示意图。
图15示出了本申请实施例提供的又一种均热板的整体结构示意图。
图16示出了本申请实施例提供的又一种均热板在图16的D-D位置沿垂直于纸面方向的截面结构示意图。
图17示出了本申请实施例提供的又一种均热板在图16的D-D位置沿垂直于纸面方向的截面结构示意图。
图18示出了本申请实施例提供的又一种均热板的散热路径示意图。
图19示出了在图19的E-E位置沿垂直于纸面方向的截面结构所示的散热路径示意图。
图20(a)示出了本申请实施例提供的一种均热板侧面边缘形状的示意性结构图。
图20(b)示出了本申请实施例提供的另一种均热板侧面边缘形状的示意性结构图。
图21示出了本申请实施例提供的又一种均热板整体结构示意图。
具体实施方式
下面将结合附图，对本申请中的技术方案进行描述。
针对目前消费者对大屏体验的追求，折叠终端已成为下一代终端设备发展的重要趋势，折叠终端设备的研究也受到了越来越多的关注。其中，折叠终端的散热是折叠终端研究过程中不可忽视的重要方面。散热性能是影响终端能否具有良好使用性能的重要因素。对于折叠终端来说，其芯片等发热元件往往设置于该折叠终端的一侧，此时，若将散热元件布置于该侧，则无法使使热量充分扩散。较好的实现方式是在折叠终端的两侧均设置有散热元件，以实现将一侧热源产生的热量传递至另一侧，从而降低局部过热，提升终端设备的性能以及消费者的使用体验。
为实现折叠终端的良好散热性能，并使折叠终端的散热元件能够在具有良好散热性能的同时，也具备良好的弯折性能，本申请实施例提供了一种可以应用于折叠终端的均热板。
为便于理解，首先对均热板进行简单地介绍。
均热板，通常也可以叫均温板、或超导热板、热导板。均热板由上盖板、下盖板、毛细结构和工质等组成。具体地，均热板的上盖板和下盖板可以以焊接密封的方式组成一个密闭的腔体，该腔体内部可以布置具有毛细结构的毛细层，并在毛细层中填充一定量的工质，从而形成一个相变循环系统。其中，毛细层中填充的工质，也即冷却液，例如可以是水。均热板的散热过程也即利用工质发生气液两相变化的两相散热过程。
应理解，均热板通常采用铜或铜合金作为上下盖板，铜粉、铜编织网、丝束等作为内部毛细结构以获得最佳的散热性能。由于铜具有较大的硬度和刚度，在弯折时不易发生形变，或者即使发生形变也会在形变之后产生折痕甚至折断，从而导致整个通道堵塞、均热板失效。因此，通常所用的均热板无法满足折叠终端对其散热装置提出的折叠需求，无法实现将折叠终端一侧产生的热量传递至另外一侧，进而影响折叠终端的散热性能。
针对现有技术中散热方式存在的问题，本申请实施例提供了一种能够满足弯折以及散热需求均热板，其中，本申请实施例提供的均热板可以适用于折叠终端。
图1示出了本申请实施例提供的一种均热板的整体结构示意图。
图1示出的均热板包括第一均热部分100、第二均热部分200和连接部分300。其中，连接部分300为可弯折部分。
下面结合附图对本申请实施例提供的均热板的结构进行具体的介绍。
图2示出了本申请实施例提供的一种均热板截面的示意性结构图。该均热板包括第一均热部分100、第二均热部分200和连接部分300。
第一均热部分100：包括第一腔体130和第一毛细层140。其中，该第一腔体130包括第一上盖板110、第一下盖板120；第一毛细层140设置于第一腔体130内。其中，该第一毛细层140与第一上盖板110和第一下盖板120可以平行设置。
在一种实现方式中，第一均热部分100的第一上盖板110中还可以包括多个支撑柱150，支撑柱150之间形成间隔分布的且与第一腔体130连通的多个较小的腔体通道，该腔体通道可以是散热通道。
在一种实现方式中，第一腔体130中的第一毛细层140可以与第一均热部分100的第一上盖板110或者第一下盖板120紧密贴合；或者，该第一毛细层140与第一均热部分的第一上盖板110和第一下盖板120同时紧密贴合。
此外，第一毛细层140内还填充有工质(图2未示出)，该工质例如可以是去离子水，通过工质的气液两相变化可以实现均热板的散热。其具体散热原理以及散热路径将在下文进行介绍。
在一种实现方式中，第一均热部分100的第一上盖板110和第一下盖板120以及第二均热部分200的第二上盖板210和第二下盖板220可以采用金属材料或者柔性材料制成。其中，金属材料例如可以包括：铜、铝或者铜合金、铝合金等；柔性材料例如可以包括：聚酰亚胺PI、橡胶或者其他高分子材料等。其中，当第一上盖板110和第一下盖板120以及第二上盖板210和第二下盖板220的材料为金属材料时，可以通过焊接的方式使得第一上盖板110和第一下盖板120密封形成第一腔体130，以及使得第二上盖板210和第二下盖板220密封形成第二腔体230；当第一上盖板110和第一下盖板120以及第二上盖板210和第二下盖板220的材料为柔性材料时，可以通过粘胶的方式使得第一上盖板110和第一下盖板120密封形成第一腔体130，以及使得第二上盖板210和第二下盖板220密封形成第二腔体230。
应理解，第二均热部分200的结构可以与第一均热部分100的结构类似，其结构可以参见上述第一均热部分100的结构介绍，为避免重复，此处不再赘述。
连接部分300：设置于第一均热部分100和第二均热部分200之间，且与第一均热部分100和第二均热部分200互相连接。该连接部分300上设置有沿该连接部分300高度方向上的至少一个通孔310。其中，连接部分300的高度方向可以是沿均热板的厚度的方向。
应理解，相较于没有通孔的连接部分结构，多个通孔310的存在可以提高连接部分300的弯折能力，使其在反复弯折时不易折断，进而保证其良好的导热性。
示例性的，连接部分300可以是单层结构、双层结构；或者，也可以是腔体结构(如图8或者图9所示)，例如设置有第三腔体340和第三毛细层350，其中，该第三腔体340可以与第一腔体130、第二腔体230连通，该第三毛细层350可以与第一毛细层140、第二毛细层240连接。
示例性的，连接部分300可以与第一均热部分100、第二均热部分200一体成型；或者，通过焊接或者过盈配合的方式，使得连接部分300和第一均热部分100、第二均热部 分200连接；或者，当连接部分300为由石墨或者石墨烯制成的单层或双层结构时，该连接部分300也可以通过石墨或者石墨烯本身具有的粘性贴合并固定在第一上盖板110和第二上盖板210上。
示例性的，连接部分300与第一均热部分100和第二均热部分200可以采用相同的材料制成，例如均采用金属材料制成；或者，连接部分300可以与第一均热部分100和第二均热部分200采用不同的材料制成，例如，第一均热部分100和第二均热部分200采用金属材料制成，连接部分300采用石墨或者石墨烯等可弯折且导热的材料制成。
根据本申请实施例提供的均热板，通过在连接部分300设置通孔310可以提高连接部分300的弯折能力，当将该均热板应用于折叠终端时，有利于提高其整体性能。
为便于理解，以下结合附图，对本申请实施例提供的均热板在应用时的安装位置、散热原理、散热路径分别进行介绍。
图3示出了本申请实施例提供的一种均热板在终端中的相对位置的示意性结构图。
示例性的，均热板的第一均热部分100和第二均热部分200可以设置于折叠终端的非弯折部分，且设置于热源附近，连接部分300可以设置于折叠终端的转轴部分。该热源可以为终端中的发热器件，例如芯片器件，芯片可以为应用处理器、电源管理芯片等。均热板的第一均热部分100和第二均热部分200的上表面例如可以通过粘胶的方式固定在折叠终端的屏幕的下方；或者，第一均热部分100和第二均热部分200的下表面例如可以通过粘胶、焊接等方式固定在折叠终端，例如折叠终端的中框上；或者，第一均热部分100和第二均热部分200例如可以通过粘胶的方式同时与折叠终端的中框和屏幕贴合并固定。其中，连接部分300可以不固定，使得连接部分300可以自由弯折。
均热板可以和其他散热器件，例如热管、石墨片等配合以提高终端的散热能力。例如，在均热板和热源之间设置有热管，热管将热源辐射出的热量传导到均热板。
在热源外侧还可以设置有金属盖，所述金属盖扣合在印刷电路板上，所述金属盖覆盖住所述热源。当均热板与所述金属盖直接接触时，热源产生的热量通过金属盖传导到均热板。
应理解，均热板的散热功能主要是通过工质的气液两相变化实现的。均热板的散热过程包括了传导、蒸发、对流、凝结四个主要步骤。其散热原理为：热源产生的热量通过热传导进入板内，靠近热源位置的工质吸收热量后迅速汽化，同时带走大量热量；板内蒸汽由高压区扩散至低压区(即低温区)，且当蒸汽接触到温度较低的内壁时，会迅速凝结成液态并释放出热能；凝结成液态的工质在微细结构产生的毛细力的作用下返回热源处，由此完成一次热传导循环，形成一个工质汽液两相并存的双向循环系统。均热板内部汽化持续进行，随着温度的变化其内部压力会随之维持平衡。均热板的尺寸覆盖范围大、布局灵活，可以根据热源的实际尺寸和分布情况设计其尺寸规格，从而灵活的覆盖热源，实现同时为多个热源散热。
具体而言，当均热板在终端中的相对位置如图3所示时，该终端的散热路径可以是：热量首先从热源传导至中框，再由中框传导至均热板，在均热板上依次由第一均热部分、连接部分传至第二均热部分，使热量在均热板上尽可能均匀的分布。由于中框的折弯部分往往热阻很大，所以热量很难通过折弯部分传至中框的另一边，大部分的热量需要通过均热板实现均温效果。
为便于理解，以下结合附图，对本申请实施例提供的均热板进行更具体的介绍。
图4示出了本申请实施例提供的一种连接部分设置有通孔的均热板的整体结构示意图。
应理解，该连接部分300上的通孔310可以有多种形状，而并不仅限于图4示出的形状。例如，该通孔310的形状还可以是图5中示出的各个形状，如菱形、矩形等多边形；或者圆形、椭圆形；或者，尖角位置做圆角处理的多边形等。本申请对此并不限定。
此外，连接部分300上的通孔310的密度、形状、间隙等可以根据第三毛细层350做灵活设置。例如，当连接部分300的第三腔体340内设置有第三毛细层350时，通孔的边缘需要做封边处理，此时，可以适当减少通孔密度，在各个通孔之间为毛细结构和蒸汽通道留出足够的空间；当连接部分的第三腔体内未设置有第三毛细层时，此时，可以适当增大通孔的密度，以达到更好的弯折性能。
图6示出了本申请实施例提供的一种连接部分为单层结构的均热板的示意性结构图。
其中，图6可以是在图4的A-A位置沿垂直于纸面方向的截面结构示意图。此时，图4中的连接部分300相应地为单层结构。
作为一个示例，当连接部分300为单层结构时，该连接部分300的材料可以是金属、石墨或者石墨烯等导热材料，此时，第一均热部分100和第二均热部分200可以通过连接部分300材料(金属或者石墨烯)本身的导热性能进行热量传递，从而实现均热效果。
其中，该单层结构可以与第一均热部分100的上盖板110以及与第二均热部分的上盖板210一体成型；或者，连接部分300与第一均热部分100的上盖板110以及与第二均热部分的上盖板210通过焊接连接或者过盈配合连接；或者，当连接部分300为由石墨或者石墨烯制成的单层结构时，该连接部分300也可以通过石墨或者石墨烯本身具有的粘性贴合并固定在第一上盖板110和第二上盖板210上。
图7示出了本申请实施例提供的一种连接部分为双层结构的均热板的示意性结构的截面图。
其中，连接部分300的双层结构包括上层结构320和下层结构330，其中，上层结构320和下层结构330均包括通孔，且上层结构320的通孔与下层结构330的通孔一一对应，形成沿连接部分300高度方向贯通的通孔310。
作为一个示例，当连接部分300为双层结构时，该连接部分300的材料可以是金属、石墨或者石墨烯等导热材料，此时，第一均热部分100和第二均热部分200可以通过连接部分300材料(金属或者石墨烯)本身的导热性能进行热量传递，从而实现均热效果。
在一种实现方式中，连接部分300与第一均热部分100的上盖板110以及与第二均热部分的上盖板210可以通过焊接连接或者过盈配合连接；或者，当连接部分300为由石墨或者石墨烯制成的双层结构时，该连接部分300也可以通过石墨或者石墨烯本身具有的粘性贴合并固定在第一上盖板110和第二上盖板210上。
在一种实现方式中，上层结构320的通孔和下层结构330的通孔具有相同的形状及尺寸，且位置一一对应，其中，上层结构320的通孔和下层结构330的通孔的形状可以有多种，例如，菱形、圆形、波纹状或者做圆角处理后的其他多边形形状，本申请对此并不限定。
应理解，相较于采用双层结构的连接部分，当连接部分300仅采用单层结构时，可以提高该连接部分300的弯折能力，避免了因双层盖板密封焊接带来的均热板弯折性下降的问题，使其在反复弯折后不易折断，进而保证良好的导热能力。
图8示出了本申请实施例提供的一种连接部分设置有腔体时的均热板的整体结构示意图。
图9示出了在图8的B-B位置沿垂直于纸面方向的均热板的截面结构示意图。
作为一个示例，连接部分300包括第三腔体340和第三毛细层350，该第三腔体340可以与第一均热部分100和第二均热部分200连通，例如，三者一体成型；第三毛细层350可以与第一毛细层140和第二毛细层240连接，使得工质可以经由第三毛细层350在第一毛细层140和第二毛细层240之间流动，从而在第一均热部分100和第二均热部分200之间进行热量传递，实现均热效果。
在一种实现方式中，该连接部分300的材料可以是金属材料、高分子材料等。其中，当连接部分300由金属材料制成时，该连接部分300与第一均热部分100和第二均热部分200可以通过焊接或者过盈配合的方式连接；当连接部分300由高分子材料制成时，该连接部分300可以通过粘胶的方式与第一均热部分100和第二均热部分200连接。
应理解，当连接部分300包括第三腔体340以及第三毛细层350时，第一均热部分100和第二均热部分200之间的热量传递可以通过毛细层进行。具体地，第一均热部分100和第二均热部分200之间可以主要是靠第一毛细层140、第二毛细层240和第三毛细层350内的工质的气液两相变化来实现均温的。
此外，当连接部分300设置有第三腔体340和第三毛细层350时，第三毛细层350可以根据需要灵活设置，其形状例如可以是图10(a)图10(b)所示的形状。
示例性的，第三毛细层350可以设置为波纹形，使得该第三毛细层350具有一定的拉伸量，以降低其在弯折时受到的应力，从而提高均热板整体的弯折能力。应理解，本申请提供的均热板连接部分的毛细层的形状不仅限于图10(a)和图10(b)示出的两种形状，还可以有多种具体形状，本申请对此并不限定。
根据本实施例提供的均热板，通过将第三毛细层350设置为波纹形，可以减小第三毛细层350在反复弯折时受到的应力，保证均热板在具有高导热性能的同时也具备良好的弯折性能。
在一种实现方式中，连接部分300上的通孔310的密度、形状、间隙等可以根据第三毛细层350做灵活设置。例如，当连接部分300的第三腔体340内设置有第三毛细层350时，通孔310的边缘需要做封边处理，此时，可以适当减少通孔密度，在各个通孔之间为毛细结构和蒸汽通道留出足够的空间；当连接部分300的第三腔体340内未设置有第三毛细层350时，此时，可以适当增大通孔的密度，以达到更好的弯折性能。
以下结合附图，对连接部分设置有腔体时的均热板的散热路径进行简单介绍。
图11示出了连接部分设置有腔体的均热板的散热路径的示意图。
图12示出了在图11中C-C位置沿垂直于纸面方向的均热板的截面结构示意图中的散热路径。
其中，假设热源位于第一均热部分100下方，由于连接部分300设置有第三毛细层350与第一毛细层140和第二毛细层240连接，当热源产生热量时，热量首先传递至第一毛细层140，第一毛细层140中的工质吸收热量发生两相变化，并经由第三毛细层350和第二毛细层240将热量传递至其他温度较低的位置，如将热量传递至第二均热部分200，从而实现均热效果。此外，当连接部分300的材料为导热材料时，热源产生的热量还可以经由第一上盖板110、连接部分300和第二上盖板210传递至第二均热部分200。其中， 热量传递的路径可以参见图12所示箭头表示的路径。应理解，图12所示的箭头用于表示均热板几种可能的散热路径，并不表示全部的散热路径，例如，当连接部分300的材料为导热材料时，热源产生的热量还可以通过第一下盖板120、连接部分300的下层330传递至第二均热部分200。
本实施例提供的均热板，包括了设置有通孔的连接部分和分别与该连接部分相连接的均热部分。由于连接部分采用了具有通孔310的网状结构，可以使连接部分在折弯时所受的应力减小，使均热板在实现导热的同时具有更好的折弯能力。
图13示出了本申请实施例提供的另一种均热板的示意性结构图。
与上述均热板不同的是，本实施例提供的均热板的连接部分300不设置通孔310，而是改变了连接部分300的材料。
其中，连接部分300的材料可以是高分子材料、石墨烯或者石墨等柔性材料，使得连接部分300能够具有良好的弯折性能。
在一种实现方式中，连接部分300的材料与第一均热部分100、第二均热部分200的材料不同，具体地，连接部分300的材料为高分子材料，如橡胶、PI等，而第一均热部分100和第二均热部分200的材料为金属材料，如铜或者铜合金等。
在一种实现方式中，连接部分300的材料与第一均热部分100、第二均热部分200的材料相同，三者均为柔性材料，如高分子材料。
应理解，石墨烯和人工石墨均为导热性良好的材料，采用石墨或者石墨烯作为连接部分的材料能够使该连接部分既具有良好的弯折能力，同时也能满足导热性。其中，采用石墨烯和石墨制作的导热膜的部分参数如下表所示。
Figure PCTCN2020097990-appb-000001
示例性的，本实施例提供的均热板的连接部分300可以为单层结构或者双层结构或者腔体结构。
作为一个示例，当连接部分300为单层结构或者双层结构时，该连接部分的材料可以是石墨或者石墨烯。此时，第一均热部分100和第二均热部分200可以通过连接部分300材料本身的导热性能进行热量传递，从而实现均热效果。
作为另一个示例，当连接部分300为腔体结构且设置有毛细层时，该连接部分的材料可以是金属或者高分子材料，如铜合金、橡胶、PI等。此时，第一均热部分100和第二均热部分200之间的热量传递是通过内部设置的毛细层进行的。换句话说，由于连接部分300设置有第三空腔340以及位于第三空腔340内的第三毛细层350，因此，第一均热部分100和第二均热部分200主要是靠第一毛细层140、第二毛细层240和第三毛细层350内的工质的气液两相变化来实现均温的。
图14示出了本申请实施例提供的一种均热板的示意性结构图。
可以看出，图14示出的均热板结构为连接部分300设置有腔体的结构，也即连接部分300包括第三腔体340和第三毛细层350。
在一种实现方式中，连接部分300的材料为金属材料或者高分子材料。该连接部分 300可以为设置有腔体的结构。
示例性的，连接部分300包括上层结构320和下层结构330，其中，下层结构330中可以包括与第一腔体130和第二腔体230连通的第三腔体340，该第三腔体340中可以设置有第三毛细层350，且该第三毛细层350可以与第一毛细层140以及第二毛细层240连接，以形成两相散热过程中的散热通路。
示例性的，当连接部分300由金属材料制成时，该连接部分300与第一均热部分100和第二均热部分200可以通过焊接或者过盈配合的方式连接；当连接部分300由高分子材料制成时，该连接部分300可以通过粘胶的方式与第一均热部分100和第二均热部分200连接。
图15示出了本申请实施例提供的一种均热板的整体结构示意图。
其中，图15示出的均热板结构为连接部分不含第三毛细层350的结构。在一种实现方式中，第一均热部分100和第二均热部分200可以采用金属材料，也即第一均热部分100和第二均热部分200可以作为非弯折部分，而在需要弯折的连接部分300可以采用柔性材料搭接，以保证该连接部分具有较好的弹性弯折性能，该柔性材料例如可以是石墨或者石墨烯。
图16为本申请实施例提供的一种均热板的示意性结构的截面图。其中，该截面图可以看作在图15的D-D位置沿垂直于纸面方向的截面结构示意图。
可以看出，图16所述的均热板的连接部分300为不包含空腔及毛细结构的单层结构。此时，图15示出的均热板的连接部分300相应地为单层结构。
其中，连接部分300的单层结构的材料可以是石墨或者石墨烯。
示例性的，当连接部分300的材料为石墨或者石墨烯时，该连接部分300可以通过石墨或者石墨烯本身具有的粘性与第一均热部分100和第二均热部分200连接。
此时，第一均热部分100和第二均热部分200可以通过连接部分300材料(石墨或者石墨烯)本身的导热性能进行热量传递，从而实现均热效果。
图17为本申请实施例提供的一种均热板的示意性结构的截面图。其中，该截面图可以看作是在图15的D-D位置沿垂直于纸面方向的截面结构示意图。
其中，连接部分300的双层结构的材料可以是石墨或者石墨烯。
示例性的，当连接部分300的材料为石墨或者石墨烯时，该连接部分300可以通过石墨或者石墨烯本身具有的粘性与第一均热部分100和第二均热部分200连接。
此时，第一均热部分100和第二均热部分200可以通过连接部分300材料(石墨或者石墨烯)本身的导热性能进行热量传递，从而实现均热效果。应理解，相较于采用双层结构的连接部分，当连接部分300仅采用单层结构时，可以提高该连接部分300的弯折能力，避免了因双层盖板密封焊接带来的均热板弯折性下降的问题，使其在反复弯折后不易折断，进而保证良好的导热能力。
以下结合图18和图19对连接部分300包括腔体结构时的散热路径进行更详细的介绍。
图18示出了均热板的散热路径示意图。
图19为在图18的E-E位置沿垂直于纸面方向的截面结构示意图所示的散热路径。
其中，第一均热部分100和第二均热部分200以及连接部分300主要靠工质的气液两相变化来实现均温。假设热源位于第一均热部分100下方，由于连接部分300设置有第三 毛细层350与第一毛细层140和第二毛细层240连接，当热源产生热量时，热量首先传递至第一毛细层140，第一毛细层140中的工质吸收热量发生两相变化，并经由第三毛细层350和第二毛细层240将热量传递至其他温度较低的位置，如将热量传递至第二均热部分200，从而实现均热效果。此外，当连接部分300的材料为导热材料时，热源产生的热量还可以经由第一上盖板110、连接部分300和第二上盖板210传递至第二均热部分200。其中，热量传递的路径可以参见图19所示箭头表示的路径。应理解，图19所示的箭头用于表示均热板几种可能的散热路径，并不表示全部的散热路径，例如，当连接部分300的材料为导热材料时，热源产生的热量还可以通过第一下盖板120、连接部分300的下层330传递至第二均热部分200。
此外，在本申请提供的均热板中，其连接部分300的侧面边缘380可以设置为多种形状，以提高该连接部分的弯折性能。图20(a)和图20(b)分别示出了连接部分侧面边缘可以采用的形状。
示例性的，该连接部分的边缘形状例如可以是：锯齿状(如图20(a)所示)、波纹状(如图20(b)所示)或者任意间隔设置有缺口的形状等。
应理解，本申请实施例提供的均热板可以根据其应用的折叠终端的需求而设置为不同的形状，具体地，连接部分300可以沿均热板长度方向或者宽度方向设置；或者，连接部分300所连接的第一均热部分100和第二均热部分200为形状相同的两部分，也即，整个均热板是以连接部分300的中间轴线为对称轴的对称形状；或者，连接部分300所连接的第一均热部分100和第二均热部分200的形状不相同(如图21所示)；或者，连接部分300不与第一均热部分100和/或第二均热部分200等宽。在实际应用中，往往存在一些局部结构避让的需求，因此，均热板的形状可以根据热源位置、主板布局等灵活设计，上下盖板的尺寸也可以根据实际需求灵活调整。
本申请实施例还提供了一种折叠终端，该折叠终端包括本申请实施例提供的均热板作为散热元件。
应理解，本申请实施例提供的均热板可以在满足高导热性能的同时，满足良好的弯折性能，进而也提高了应用该均热板的折叠终端的散热性能和转轴处的弯折性能，为用户提供了良好的使用体验。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (18)

  1. 一种均热板，其特征在于，包括：
    第一均热部分，包括第一腔体和设置于所述第一腔体内的第一毛细层，其中，所述第一腔体包括第一上盖板和第一下盖板；
    第二均热部分，包括第二腔体和设置于所述第二腔体内的第二毛细层，其中，所述第二腔体包括第二上盖板和第二下盖板；
    连接部分，所述连接部分设置在所述第一均热部分和所述第二均热部分之间，且与所述第一均热部分和第二均热部分连接，其中，
    所述连接部分设置有多个沿所述连接部分的高度方向贯通的通孔，使得所述均热板能够在所述连接部分发生弯折。
  2. 根据权利要求1所述的均热板，其特征在于，所述连接部分包括：
    第三腔体，所述第三腔体与所述第一腔体和所述第二腔体连通；
    第三毛细层，所述第三毛细层设置在所述第三腔体内部且与所述第一毛细层和所述第二毛细层连接。
  3. 根据权利要求2所述的均热板，其特征在于，所述连接部分采用柔性导热材料。
  4. 根据权利要求1-3中任一项所述的均热板，其特征在于，所述连接部分为单层结构。
  5. 根据权利要求4所述的均热板，其特征在于，所述连接部分与所述第一均热部分的所述第一上盖板和所述第二均热部分的所述第二上盖板一体成型；或者，
    所述连接部分与所述第一均热部分的所述第一下盖板和所述第二均热部分的所述第二下盖板一体成型。
  6. 根据权利要求4或5所述的均热板，其特征在于，所述连接部分的材料为以下材料的一种或多种：
    金属材料、石墨或者石墨烯。
  7. 根据权利要求1-6中任一项所述的均热板，其特征在于，所述连接部分的侧面的边缘为锯齿形或者波纹形。
  8. 根据权利要求1-7中任一项所述的均热板，其特征在于，所述连接部分沿所述均热板的长度方向或者宽度方向设置。
  9. 一种均热板，其特征在于，包括：
    第一均热部分，包括第一腔体和设置于所述第一腔体内的第一毛细层，其中，所述第一腔体包括第一上盖板和第一下盖板；
    第二均热部分，包括第二腔体和设置于所述第二腔体内的第二毛细层，其中，所述第二腔体包括第二上盖板和第二下盖板；
    连接部分，所述连接部分设置在所述第一均热部分和所述第二均热部分之间，且与所述第一均热部分和第二均热部分连接，其中，所述连接部分由导热的柔性材料制成，使得所述均热板能够在所述连接部分发生弯折。
  10. 根据权利要求9所述的均热板，其特征在于，所述连接部分设置有多个沿所述连接部分的高度方向贯通的通孔。
  11. 根据权利要求9或10所述的均热板，其特征在于，所述连接部分的厚度小于或 等于所述第一均热部分和/或所述第二均热部分的厚度。
  12. 根据权利要求9-11中任一项所述的均热板，其特征在于，当所述柔性材料为橡胶、PI或者金属时，所述连接部分包括：
    第三腔体，所述第三腔体与所述第一腔体和所述第二腔体连通；
    第三毛细层，所述第三毛细层设置在所述第三腔体内部且与所述第一毛细层和所述第二毛细层连接。
  13. 根据权利要求9-11中任一项所述的均热板，其特征在于，所述连接部分为单层结构。
  14. 根据权利要求13所述的均热板，其特征在于，所述连接部分的材料为以下材料中的一种或多种：
    金属材料、石墨或者石墨烯。
  15. 根据权利要求9-14中任一项所述的均热板，其特征在于，所述连接部分的侧面的边缘为锯齿形或者波纹形。
  16. 根据权利要求9-15中任一项所述的均热板，其特征在于，所述连接部分沿所述均热板的长度方向或者宽度方向设置。
  17. 一种折叠终端，其特征在于，所述折叠终端包括如权利要求1至8中任一项所述的均热板。
  18. 一种折叠终端，其特征在于，所述折叠终端包括如权利要求9至16中任一项所述的均热板。
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