WO2020258457A1 - 柔性显示装置 - Google Patents

柔性显示装置 Download PDF

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Publication number
WO2020258457A1
WO2020258457A1 PCT/CN2019/100287 CN2019100287W WO2020258457A1 WO 2020258457 A1 WO2020258457 A1 WO 2020258457A1 CN 2019100287 W CN2019100287 W CN 2019100287W WO 2020258457 A1 WO2020258457 A1 WO 2020258457A1
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WIPO (PCT)
Prior art keywords
binding
pins
tft array
array substrate
flexible display
Prior art date
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PCT/CN2019/100287
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English (en)
French (fr)
Inventor
郑颖博
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Wuhan China Star Optoelectronics Technology Co Ltd
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Wuhan China Star Optoelectronics Technology Co Ltd
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Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Priority to US16/625,724 priority Critical patent/US11195437B2/en
Publication of WO2020258457A1 publication Critical patent/WO2020258457A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED

Definitions

  • This application relates to the field of display technology, and in particular to a flexible display device.
  • LCD Liquid Crystal Display, liquid crystal display
  • OLED Organic Light-Emitting Diode, organic light-emitting diode
  • Micro-LED Micro-Liquid For TFT (Thin Film Transistor) displays such as Crystal Display
  • COF Chip On FPC, the thin film chip is integrated on the flexible circuit board) for binding, and then realizes the transmission of driving signals to the signals in the display panel.
  • the pin spacing in the bonding area needs to be not low
  • the binding area of the display screen applied to the full-screen terminal is limited to a limited frame, such as a full-screen mobile phone screen of about 5.99 to 6.39 inches, and its COF binding
  • the fixed area is located on the short side of the phone screen, and the maximum binding width is less than or equal to 62 mm.
  • the existing flexible display device is subject to the dual restrictions of the pin pitch not less than 27 microns and the bonding area width not more than 62 mm, which will result in a limited number of pins in the bonding area.
  • the resolution of the flexible display device is further improved.
  • the present application provides a flexible display device, which can double the number of pins that can be accommodated under the limitation of the limited binding effective area width, so as to solve the problem that the existing flexible display device suffers from the pin spacing not less than
  • the dual restriction of 27 microns and the width of the binding area not higher than 62 mm will result in a limited number of pins in the binding area, which further affects the technical problem of further improvement of the resolution of the flexible display device.
  • the application provides a flexible display device, including a backlight module, a flexible display panel, a plurality of first binding pins, a plurality of second binding pins, a plurality of third binding pins, and a first flexible circuit board 2.
  • a second flexible circuit board and a driving chip, the flexible display panel further comprising a TFT array substrate and a color film substrate corresponding to the TFT array substrate;
  • a plurality of the first binding pins are arranged on the interlayer between the TFT array substrate and the color filter substrate and extend along the first direction D1 to the first side surface of the TFT array substrate and all On the first side surface of the color filter substrate, a plurality of the second binding pins are used for binding with the first flexible circuit board and are partially disposed on the lower surface of the TFT array substrate, and a plurality of third The binding pin is used for binding with the second flexible circuit board and is partially disposed on the upper surface of the color filter substrate; the flexible display panel further includes a display area and a non-display area located at the periphery of the display area, The plurality of first binding pins extend to the non-display area through the display area, and the plurality of second binding pins and the plurality of third binding pins are all arranged in the non-display area. Display area.
  • a part of the first binding pin located in the display area is electrically connected to the signal line provided in the display area.
  • the non-display area includes a non-bending area and a bending area, and the second pin and the third pin are both disposed in the bending area .
  • a part of the second binding pin located on the lower surface of the TFT array substrate and a part of the third binding pin located on the upper surface of the color filter substrate are staggered.
  • the pin pitch between the part of the second bonding pins located on the lower surface of the TFT array substrate is half of the corresponding bonding pitch, which is located at
  • the pin pitch between the third bonding pins on the upper surface of the color filter substrate is half of the corresponding bonding pitch.
  • the pin pitch of the plurality of second bonding pins and the plurality of third bonding pins is greater than or equal to 27 microns.
  • the first side surface of the TFT array substrate and the first side surface of the color filter substrate are both edging mirror surfaces, and the roughness of the edging mirror surface is 0.04 ⁇ 0.7 Between micrometers.
  • the included angle between the first side surface of the TFT array substrate and the lower surface of the TFT array substrate is a rounded corner or a 45-degree edge chamfer.
  • the included angle between the first side surface of the film substrate and the upper surface of the color filter substrate is a rounded corner or a 45-degree side chamfer.
  • the driving chip is electrically connected to the first flexible circuit board or the second flexible circuit board through an anisotropic conductive film.
  • the application also provides a flexible display device, including a backlight module, a flexible display panel, a plurality of first binding pins, a plurality of second binding pins, a plurality of third binding pins, and a first flexible circuit A board, a second flexible circuit board and a driving chip, the flexible display panel further includes a TFT array substrate and a color film substrate corresponding to the TFT array substrate;
  • a plurality of the first binding pins are arranged on the interlayer between the TFT array substrate and the color filter substrate and extend along the first direction D1 to the first side surface of the TFT array substrate and all On the first side surface of the color filter substrate, a plurality of the second binding pins are used for binding with the first flexible circuit board and are partially disposed on the lower surface of the TFT array substrate, and a plurality of third The binding pin is used for binding with the second flexible circuit board and is partially arranged on the upper surface of the color filter substrate.
  • a part of the second binding pin located on the lower surface of the TFT array substrate and a part of the third binding pin located on the upper surface of the color filter substrate are staggered.
  • the pin pitch between the part of the second bonding pins located on the lower surface of the TFT array substrate is half of the corresponding bonding pitch, which is located at
  • the pin pitch between the third bonding pins on the upper surface of the color filter substrate is half of the corresponding bonding pitch.
  • the pin pitch of the plurality of second bonding pins and the plurality of third bonding pins is greater than or equal to 27 microns.
  • the first side surface of the TFT array substrate and the first side surface of the color filter substrate are both edging mirror surfaces, and the roughness of the edging mirror surface is 0.04 ⁇ 0.7 Between micrometers.
  • the included angle between the first side surface of the TFT array substrate and the lower surface of the TFT array substrate is a rounded corner or a 45-degree edge chamfer.
  • the included angle between the first side surface of the film substrate and the upper surface of the color filter substrate is a rounded corner or a 45-degree side chamfer.
  • the driving chip is electrically connected to the first flexible circuit board or the second flexible circuit board through an anisotropic conductive film.
  • the flexible display device provided by the present application has a plurality of binding pins on the front and back of the display panel to be bound to the flexible circuit board, so that the flexible circuit board can be bound under the limitation of the limited binding effective area width.
  • the number of accommodating binding pins is doubled, which further improves the resolution of the flexible display device.
  • FIG. 1 is a schematic diagram of a planar structure of a conventional flexible display device.
  • FIG. 2 is a side view of an embodiment of the flexible display device of this application.
  • 3a to 3d are schematic plan views of some of the first binding pins in an embodiment of the flexible display device of this application.
  • This application is aimed at the existing flexible display device. Due to the dual restrictions of the pin pitch not less than 27 microns and the bonding area width not more than 62 mm, the number of pins contained in the bonding area will be limited, which further affects flexibility. This embodiment can solve the technical problem of the resolution of the display device being further improved.
  • FIG. 1 it is a schematic diagram of a plan structure of an existing flexible display device.
  • the flexible display device includes a display area 11 and a binding area 12 located below the display area 11.
  • the flexible display device also includes relatively disposed The TFT array substrate 14 and the color film substrate 13; wherein a plurality of binding pins 15 are provided in the binding area 12, and the plurality of binding pins 15 are bound to the flexible circuit board 16, and the driving chip 17 passes An anisotropic conductive adhesive film is bound on the flexible circuit board 16.
  • the multiple connecting pins provided on the upper edge of the flexible circuit board 16 and the multiple binding pins 15 form a binding structure in a one-to-one correspondence to achieve binding. In order to ensure the alignment accuracy of the binding, all of them are restricted.
  • the minimum binding distance required for the binding area 12 is not less than 27 microns; on the other hand, the binding area 12 can only be placed on a limited frame, so the binding area 12
  • the binding width W is also subject to certain restrictions. Therefore, it can be predicted that as the resolution (PPI) of the flexible display panel gets higher and higher, the binding width W of the binding area 12 needs to be wider and wider. When the resolution reaches 2K or higher, it will Faced with the problem of a significant drop in yield, which further affects the resolution of the flexible display device to further increase.
  • the flexible display device includes a display area 20 and a non-display area located at the periphery of the display area, and the non-display area includes a non-bending area 21 and a bending area 22.
  • the flexible display device also includes a backlight module 201, a first flexible substrate 202, a TFT array substrate 203, a color film substrate 204, and a second flexible substrate 205 arranged from bottom to top.
  • the first flexible substrate 202, The TFT array substrate 203, the color filter substrate 204, and the second flexible substrate 205 constitute a flexible display panel;
  • a plurality of first binding pins 206 are arranged on the interlayer between the TFT array substrate 203 and the color filter substrate 204 and respectively extend to the first side surface of the TFT array substrate 203 along the first direction D1 And the first side of the color filter substrate 204; a plurality of second binding pins 221 are used for binding with the first flexible circuit board 223 and are partially disposed on the lower surface of the TFT array substrate 203; a plurality of third The binding pin 222 is used for binding with the second flexible circuit board 224 and is partially disposed on the upper surface of the color filter substrate 204.
  • the materials of the first flexible substrate 202 and the second flexible substrate 205 are both PI (Polyimide Film, polyimide film) film layers.
  • a plurality of the first binding pins 206 extend to the non-display area through the display area 20, and a portion of the first binding pins 206 and the display area 20 are located in the display area.
  • the set signal line is electrically connected.
  • the plurality of second binding pins 221 and the plurality of third binding pins 222 are all disposed in the bending area 22 in the non-display area.
  • part of the second bonding pins 221 and the first bonding pins 206 are electrically connected to the lower surface of the TFT array substrate 203; part of the third bonding pins 222 are connected to the The first binding pin 206 is electrically connected to the upper surface of the color filter substrate 204.
  • part of the second binding pins 221 are sandwiched between the third flexible substrate 226 and the fourth flexible substrate 227, and part of the third binding pins 222 is disposed on the third flexible substrate 226, and both the third flexible substrate 226 and the fourth flexible substrate 227 are in a bent state.
  • the materials of the third flexible substrate 226 and the fourth flexible substrate 227 are both PI (Polyimide Film, polyimide film) film layers.
  • the first flexible circuit board 223 is bound to the third flexible substrate 226 through some of the second binding pins 221
  • the second flexible circuit board 224 is bound to the third flexible substrate 226 through some of the third binding pins 222.
  • the third flexible substrate 226 is bound.
  • the driving chip 225 is electrically connected to the first flexible circuit board 223 or the second flexible circuit board 224 through an anisotropic conductive film.
  • the first side surface of the TFT array substrate 203 and the first side surface of the color filter substrate 204 are both edging mirror surfaces, and the roughness of the edging mirror surface is between 0.04 and 0.7 microns. This is because after the color filter substrate 204 is flush with the TFT array substrate 203 and the slits are cut, the first side surface of the TFT array substrate 203 and the first side surface of the color filter substrate 204 are subjected to finish polishing to set To grind the mirror surface, the undesirable defects on the edge of the flexible display panel can be eliminated.
  • the included angle between the first side surface of the TFT array substrate 203 and the lower surface of the TFT array substrate 203 is a rounded corner or a 45-degree edge chamfer
  • the first side surface of the color filter substrate 204 is The included angle between the upper surfaces of the color filter substrate 204 is a rounded corner or a 45-degree side chamfer, which has the advantage of preventing subsequent sharp edges from cutting the flexible display device.
  • an adhesive layer 228 is provided on the edges of part of the second binding pins 221 and the fourth flexible substrate 227, and part of the second binding pins 221
  • the adhesive layer 228 is provided on the edge of part of the first binding pin 206; the adhesive layer is provided on the edge of part of the third binding pin 222 and the third flexible substrate 226 228.
  • the adhesive layer 228 is provided on the edges of some of the third binding pins 222 and some of the first binding pins 206.
  • the material of the adhesive layer 228 is cured glue or tape.
  • the adhesive layer 228 is arranged in the bending area 22 to meet the requirement of drawing force and isolate external chemical corrosion, thereby improving the overall reliability.
  • FIGS. 3a to 3d a schematic plan view of part of the first binding pins in an embodiment of the flexible display device of this application is as follows:
  • 3a is a schematic plan view of part of the third binding pins 222 on the upper surface of the color filter substrate 204, and the binding of some of the third binding pins 222 on the upper surface 204 of the color filter substrate The width is W1.
  • the binding width W1 is equal to the binding width W2. Because the binding area of the display screen applied to full-screen terminals is limited to a limited frame; for example, for a full-screen mobile phone screen of about 5.99 to 6.39 inches, the binding area is located on the short side of the mobile phone screen. On the side, the maximum binding width is less than or equal to 62mm. Therefore, both the binding width W1 and the binding width W2 are less than or equal to 62 mm.
  • 3c is a schematic plan view of part of the first binding pins 206 on the first side surface of the TFT array substrate 203 and the first side surface of the color filter substrate 204.
  • the first binding pin 206 is built in the interlayer between the TFT array substrate 203 and the color filter substrate 204.
  • 3d is an enlarged schematic diagram of part of the third binding pins 222 on the upper surface of the color filter substrate 204.
  • the relative positions of the part of the second binding pins 221 located on the lower surface of the TFT array substrate 203 and the part of the third binding pins 222 located on the upper surface of the color filter substrate 204 are staggered. .
  • the pad pitch (Pad Pitch) d3 between the part of the third bonding pins 222 on the upper surface of the color filter substrate 204 is half of the corresponding bonding pitch d1.
  • the pad space d4 between the part of the third binding pins 222 located on the upper surface of the color filter substrate 204 is smaller than the pin spacing d3. Since a part of the third bonding pins 222 located on the upper surface of the color filter substrate 204 is in the bonding area of the bonding process, the bonding distance d1 is at most 27 microns.
  • the bonding space (Bonding Space) d2 of the two adjacent third bonding pins 222 is 13 microns, and the bonding width (Bonding Width) w3 of each third bonding pin 222 is 14 Micrometers. Because the pin gap d4 is in the non-bonding area, it does not need to meet the requirements of the bonding process.
  • a part of the second binding pin 221 located on the bottom surface of the TFT array substrate 203 is located in the binding area of the binding process, and a portion of the second binding pin 221 located on the bottom surface of the TFT array substrate 203 is
  • the pin pitch between the fixed pins 221 is half of the corresponding bonding pitch, and the corresponding bonding pitch is at most 27 microns.
  • the flexible display device provided by the present application doubles the number of binding pins that can be accommodated under the limitation of the width of the same binding effective area, which also increases the resolution of the flexible display device. Times. On the other hand, it can effectively improve the yield of the flexible display device bonding process.
  • the beneficial effect of the present application is that the flexible display device provided by the present application has multiple binding pins on the front and back of the display panel to be bound to the flexible circuit board, so that the flexible circuit board can be bound under the limitation of the limited binding effective area width.
  • the number of accommodating binding pins is doubled, which further improves the resolution of the flexible display device.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract

一种柔性显示装置，至少包括多个绑定引脚；多个第一绑定引脚（206）设置于TFT阵列基板（203）与彩膜基板（204）之间的夹层并分别延展至TFT阵列基板（203）的第一侧面及彩膜基板（204）的第一侧面，多个第二绑定引脚（221）用于与第一柔性电路板（223）绑定且部分设置于TFT阵列基板（203）的下表面，多个第三绑定引脚（222）用于与第二柔性电路板（224）绑定且部分设置于彩膜基板（204）的上表面

Description

柔性显示装置 技术领域
本申请涉及显示技术领域，尤其涉及一种柔性显示装置。
 背景技术
目前LCD(Liquid Crystal Display，液晶显示器）显示屏、OLED(Organic Light-Emitting Diode，有机发光二极管）显示屏、Micro-LED(Micro-Liquid Crystal Display，微型液晶显示器）显示屏等TFT（Thin Film Transistor，薄膜晶体管）显示器，其各路像素驱动均需要通过TFT层内的走线连接到面板边缘形成引脚与COF（Chip On FPC，薄膜芯片集成于柔性电路板上）进行绑定的，进而实现对显示面板中的各信号传递驱动信号。当前高端的全面屏整机均追求窄边框设计，普遍采用COF方案作为主流设计；当像素分辨率逐步提升时，我们与COF连接的引脚数量也越来越多，进而要求我们设计上做相对的修改，在显示装置的绑定区域内设置相应数量的绑定引脚。然而，在目前的绑定工艺中，由于ACF胶（异向导电胶膜）要求保证一定的绑定接触面积，而自动化设备的对位存在一定公差，需要绑定区域内的引脚间距不低于27微米；另一方面，应用于全面屏类终端上的显示屏其绑定区域被限定只能放在一条有限的边框上，例如5.99~6.39英寸左右的全面屏手机屏，其COF 的绑定区域位于手机屏一侧的短边上，最大绑定宽度小于或等于62毫米。
综上所述，现有的柔性显示装置，由于受到引脚间距不低于27微米与绑定区域宽度不高于62毫米的双重限制，会导致绑定区域内容纳的引脚数量有限，进一步影响柔性显示装置的分辨率进一步提升。
 技术问题
现有的柔性显示装置，由于受到引脚间距不低于27微米与绑定区域宽度不高于62毫米的双重限制，会导致绑定区域内容纳的引脚数量有限，进一步影响柔性显示装置的分辨率进一步提升。
 技术解决方案
本申请提供一种柔性显示装置，能够在有限的绑定有效区域宽度限制下，使可容纳的引脚数量增加了一倍，以解决现有的柔性显示装置，由于受到引脚间距不低于27微米与绑定区域宽度不高于62毫米的双重限制，会导致绑定区域内容纳的引脚数量有限，进一步影响柔性显示装置的分辨率进一步提升的技术问题。
为解决上述问题，本申请提供的技术方案如下：
本申请提供一种柔性显示装置，包括背光模组、柔性显示面板、多个第一绑定引脚、多个第二绑定引脚、多个第三绑定引脚、第一柔性电路板、第二柔性电路板及驱动芯片，所述柔性显示面板还包括TFT阵列基板以及与所述TFT阵列基板对应设置的彩膜基板；
其中，多个所述第一绑定引脚设置于所述TFT阵列基板与所述彩膜基板之间的夹层并沿着第一方向D1分别延展至所述TFT阵列基板的第一侧面及所述彩膜基板的第一侧面，多个所述第二绑定引脚用于与所述第一柔性电路板绑定且部分设置于所述TFT阵列基板的下表面，多个所述第三绑定引脚用于与所述第二柔性电路板绑定且部分设置于所述彩膜基板的上表面；所述柔性显示面板还包括显示区域和位于所述显示区域外围的非显示区域，多个所述第一绑定引脚经由所述显示区域延展到所述非显示区域，多个所述第二绑定引脚以及多个所述第三绑定引脚均设置于所述非显示区域。
在本申请实施例所提供的柔性显示装置中，位于所述显示区域的部分所述第一绑定引脚与所述显示区域设置的信号线电性连接。
在本申请实施例所提供的柔性显示装置中，所述非显示区域包括非弯折区域以及弯折区域，所述第二引脚以及所述第三引脚均设置于所述弯折区域内。
在本申请实施例所提供的柔性显示装置中，位于所述TFT阵列基板的下表面的部分所述第二绑定引脚与位于所述彩膜基板的上表面的部分所述第三绑定引脚的相对位置交错设置。
在本申请实施例所提供的柔性显示装置中，位于所述TFT阵列基板的下表面的部分所述第二绑定引脚之间的引脚间距为其对应的绑定间距的一半，位于所述彩膜基板的上表面的部分所述第三绑定引脚之间的引脚间距为其对应的绑定间距的一半。
在本申请实施例所提供的柔性显示装置中，多个所述第二绑定引脚以及多个所述第三绑定引脚的引脚间距大于或等于27微米。
在本申请实施例所提供的柔性显示装置中，所述TFT阵列基板的第一侧面及所述彩膜基板的第一侧面均为磨边镜面，所述磨边镜面的粗糙度在0.04~0.7微米之间。
在本申请实施例所提供的柔性显示装置中，所述TFT阵列基板的第一侧面与所述TFT阵列基板的下表面之间的夹角为倒圆角或45度边倒角，所述彩膜基板的第一侧面与所述彩膜基板的上表面之间的夹角为倒圆角或45度边倒角。
在本申请实施例所提供的柔性显示装置中，所述驱动芯片通过各向异性导电膜与所述第一柔性电路板或所述第二柔性电路板电性连接。
本申请还提供一种柔性显示装置，包括背光模组、柔性显示面板、多个第一绑定引脚、多个第二绑定引脚、多个第三绑定引脚、第一柔性电路板、第二柔性电路板及驱动芯片，所述柔性显示面板还包括TFT阵列基板以及与所述TFT阵列基板对应设置的彩膜基板；
其中，多个所述第一绑定引脚设置于所述TFT阵列基板与所述彩膜基板之间的夹层并沿着第一方向D1分别延展至所述TFT阵列基板的第一侧面及所述彩膜基板的第一侧面，多个所述第二绑定引脚用于与所述第一柔性电路板绑定且部分设置于所述TFT阵列基板的下表面，多个所述第三绑定引脚用于与所述第二柔性电路板绑定且部分设置于所述彩膜基板的上表面。
在本申请实施例所提供的柔性显示装置中，位于所述TFT阵列基板的下表面的部分所述第二绑定引脚与位于所述彩膜基板的上表面的部分所述第三绑定引脚的相对位置交错设置。
在本申请实施例所提供的柔性显示装置中，位于所述TFT阵列基板的下表面的部分所述第二绑定引脚之间的引脚间距为其对应的绑定间距的一半，位于所述彩膜基板的上表面的部分所述第三绑定引脚之间的引脚间距为其对应的绑定间距的一半。
在本申请实施例所提供的柔性显示装置中，多个所述第二绑定引脚以及多个所述第三绑定引脚的引脚间距大于或等于27微米。
在本申请实施例所提供的柔性显示装置中，所述TFT阵列基板的第一侧面及所述彩膜基板的第一侧面均为磨边镜面，所述磨边镜面的粗糙度在0.04~0.7微米之间。
在本申请实施例所提供的柔性显示装置中，所述TFT阵列基板的第一侧面与所述TFT阵列基板的下表面之间的夹角为倒圆角或45度边倒角，所述彩膜基板的第一侧面与所述彩膜基板的上表面之间的夹角为倒圆角或45度边倒角。
在本申请实施例所提供的柔性显示装置中，所述驱动芯片通过各向异性导电膜与所述第一柔性电路板或所述第二柔性电路板电性连接。
 有益效果
本申请的有益效果为：本申请所提供的柔性显示装置，将显示面板的正面和背面分别设置多个绑定引脚与柔性电路板绑定，使在有限的绑定有效区域宽度限制下可容纳的绑定引脚数量增加了一倍，进一步提升了柔性显示装置的分辨率。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为现有柔性显示装置的平面结构示意图。
图2为本申请柔性显示装置一实施例的侧视图。
图3a~图3d为本申请柔性显示装置一实施例中部分第一绑定引脚的平面示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
本申请针对现有的柔性显示装置，由于受到引脚间距不低于27微米与绑定区域宽度不高于62毫米的双重限制，会导致绑定区域内容纳的引脚数量有限，进一步影响柔性显示装置的分辨率进一步提升的技术问题，本实施例能够解决该缺陷。
如图1所示，为现有柔性显示装置的平面结构示意图，所述柔性显示装置包括显示区域11以及位于所示显示区域11下方的绑定区域12，所述柔性显示装置还包括相对设置的TFT阵列基板14以及彩膜基板13；其中，所述绑定区域12中设置有多个绑定引脚15，多个所述绑定引脚15与柔性电路板16绑定，驱动芯片17通过异向导电胶膜绑定在所述柔性电路板16上。所述柔性电路板16上侧边缘设置的多个连接引脚与多个所述绑定引脚15一一对应构成绑定结构而实现绑定，为确保绑定的对位精度，限制了所述绑定区域12所需预留的最小绑定间距不低于27微米；另一方面，所述绑定区域12由于被限定只能放在一条有限的边框上，故所述绑定区域12的绑定宽度W也受到一定的限制。因此，可以预测随着所述柔性显示面板的分辨率（PPI）越来越高，所述绑定区域12的绑定宽度W需求越来越宽，当分辨率达到2K或更高时，会面临良率大幅下降的问题，进而影响所述柔性显示装置的分辨率进一步提升。
如图2所示，为本申请柔性显示装置一实施例的侧视图。其中，所述柔性显示装置包括显示区域20和位于所述显示区域外围的非显示区域，所述非显示区域包括非弯折区域21以及弯折区域22。
所述柔性显示装置还包括由下至上设置的背光模组201、第一柔性衬底202、TFT阵列基板203、彩膜基板204以及第二柔性衬底205，所述第一柔性衬底202、所述TFT阵列基板203、所述彩膜基板204以及所述第二柔性衬底205构成柔性显示面板；
其中，多个第一绑定引脚206设置于所述TFT阵列基板203与所述彩膜基板204之间的夹层并沿着第一方向D1分别延展至所述TFT阵列基板203的第一侧面及所述彩膜基板204的第一侧面；多个第二绑定引脚221用于与第一柔性电路板223绑定且部分设置于所述TFT阵列基板203的下表面；多个第三绑定引脚222用于与第二柔性电路板224绑定且部分设置于所述彩膜基板204的上表面。
具体地，所述第一柔性衬底202与所述弟二柔性衬底205的材料均为PI（Polyimide Film，聚酰亚胺薄膜）膜层。
具体地，多个所述第一绑定引脚206经由所述显示区域20延展到所述非显示区域，位于所述显示区域的部分所述第一绑定引脚206与所述显示区域20设置的信号线电性连接。
具体地，多个所述第二绑定引脚221以及多个所述第三绑定引脚222均设置于所述非显示区域中的所述弯折区域22。
具体地，部分所述第二绑定引脚221与所述第一绑定引脚206在所述TFT阵列基板203的下表面电性连接；部分所述第三绑定引脚222与所述第一绑定引脚206在所述彩膜基板204的上表面电性连接。
具体地，在所述弯折区域22内，部分所述第二绑定引脚221夹设于第三柔性衬底226与第四柔性衬底227之间，部分所述第三绑定引脚222设置于所述第三柔性衬底226上，所述第三柔性衬底226以及所述第四柔性衬底227均处弯折状态。所述第三柔性衬底226与所述第四柔性衬底227的材料均为PI（Polyimide Film，聚酰亚胺薄膜）膜层。
具体地，第一柔性电路板223通过部分所述第二绑定引脚221与所述第三柔性衬底226绑定，第二柔性电路板224通过部分所述第三绑定引脚222与所述第三柔性衬底226绑定。
具体地，驱动芯片225通过各向异性导电膜与所述第一柔性电路板223或所述第二柔性电路板224电性连接。
具体地，所述TFT阵列基板203的第一侧面及所述彩膜基板204的第一侧面均为磨边镜面，所述磨边镜面的粗糙度在0.04~0.7微米之间。这是因为当所述彩膜基板204与所述TFT阵列基板203齐边切割裂片之后，将所述TFT阵列基板203的第一侧面及所述彩膜基板204的第一侧面进行精抛光以设置为磨边镜面，可以消除所述柔性显示面板边缘的不良缺陷。
具体地，所述TFT阵列基板203的第一侧面与所述TFT阵列基板203的下表面之间的夹角为倒圆角或45度边倒角，所述彩膜基板204的第一侧面与所述彩膜基板204的上表面之间的夹角为倒圆角或45度边倒角，其优点是防止后续其锋利边缘割伤所述柔性显示装置。
具体地，在所述弯折区域22内，部分所述第二绑定引脚221与所述第四柔性衬底227的边缘设置有粘接层228，部分所述第二绑定引脚221与部分所述第一绑定引脚206的边缘设置有所述粘接层228；部分所述第三绑定引脚222与所述第三柔性衬底226的边缘设置有所述粘接层228，部分所述第三绑定引脚222与部分所述第一绑定引脚206的边缘设置有所述粘接层228。所述粘接层228的材料为固化胶水或胶带。在所述弯折区域22内设置有所述粘接层228可以满足拉拔力需求并隔绝外部化学侵蚀，提高整体信赖性。
如图3a~图3d所示，为本申请柔性显示装置一实施例中部分第一绑定引脚的平面示意图，具体如下：
图3a为部分所述第三绑定引脚222在所述彩膜基板204的上表面的平面示意图，部分所述第三绑定引脚222在所述彩膜基板的上表面204的绑定宽度为W1。
图3b为部分所述第二绑定引脚221在所述TFT阵列基板203的下表面的平面示意图，部分所述第二绑定引脚221在所述TFT阵列基板203的下表面的绑定宽度为W2。具体地，所述绑定宽度W1与所述绑定宽度W2相等。由于应用于全面屏类终端上的显示屏其绑定区被限定只能放在一条有限的边框上；例如5.99~6.39英寸左右的全面屏手机屏，其绑定区域位于手机屏一侧的短边上，最大绑定宽度小于或等于62mm。因此，所述绑定宽度W1与所述绑定宽度W2均小于或等于62mm。
图3c为部分所述第一绑定引脚206在所述TFT阵列基板203的第一侧面与所述彩膜基板204的第一侧面的平面示意图。其中，所述TFT阵列基板203与所述彩膜基板204之间的夹层内置部分所述第一绑定引脚206。
图3d为部分所述第三绑定引脚222在所述彩膜基板204的上表面的放大示意图。其中，位于所述TFT阵列基板203的下表面的部分所述第二绑定引脚221与位于所述彩膜基板204的上表面的部分所述第三绑定引脚222的相对位置交错设置。
具体地，位于所述彩膜基板204的上表面的部分所述第三绑定引脚222之间的引脚间距（Pad Pitch）d3为其对应的绑定间距（Bonding Pitch）d1的一半，位于所述彩膜基板204的上表面的部分所述第三绑定引脚222之间的引脚空隙（Pad Space）d4小于所述引脚间距d3。由于位于所述彩膜基板204的上表面的部分所述第三绑定引脚222处于绑定工艺的绑定区域，故所述绑定间距d1最大为27微米。此时，相邻两所述第三绑定引脚222的绑定空隙（Bonding Space）d2为13微米，每一所述第三绑定引脚222的绑定宽度（Bonding Width）w3为14微米。因为所述引脚脚空隙d4处于非绑定区，故无需满足绑定工艺的要求。
对应的，位于所述TFT阵列基板203的下表面的部分所述第二绑定引脚221处于绑定工艺的绑定区域，位于所述TFT阵列基板203的下表面的部分所述第二绑定引脚221之间的引脚间距为其对应的绑定间距的一半，且其对应的绑定间距最大为27微米。
本申请所提供的柔性显示装置与现有技术相比，在同一绑定有效区宽度的限制下，可容纳的绑定引脚数量增加了一倍，使柔性显示装置的分辨率也提高了一倍。另一方面，可有效提升柔性显示装置绑定工艺的良率。
本申请的有益效果为：本申请所提供的柔性显示装置，将显示面板的正面和背面分别设置多个绑定引脚与柔性电路板绑定，使在有限的绑定有效区域宽度限制下可容纳的绑定引脚数量增加了一倍，进一步提升了柔性显示装置的分辨率。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (16)

  1. 一种柔性显示装置，其中，包括背光模组、柔性显示面板、多个第一绑定引脚、多个第二绑定引脚、多个第三绑定引脚、第一柔性电路板、第二柔性电路板及驱动芯片，所述柔性显示面板还包括TFT阵列基板以及与所述TFT阵列基板对应设置的彩膜基板；
    其中，多个所述第一绑定引脚设置于所述TFT阵列基板与所述彩膜基板之间的夹层并沿着第一方向D1分别延展至所述TFT阵列基板的第一侧面及所述彩膜基板的第一侧面，多个所述第二绑定引脚用于与所述第一柔性电路板绑定且部分设置于所述TFT阵列基板的下表面，多个所述第三绑定引脚用于与所述第二柔性电路板绑定且部分设置于所述彩膜基板的上表面；所述柔性显示面板还包括显示区域和位于所述显示区域外围的非显示区域，多个所述第一绑定引脚经由所述显示区域延展到所述非显示区域，多个所述第二绑定引脚以及多个所述第三绑定引脚均设置于所述非显示区域。
  2. 根据权利要求1所述的柔性显示装置，其中，位于所述显示区域的部分所述第一绑定引脚与所述显示区域设置的信号线电性连接。
  3. 根据权利要求1所述的柔性显示装置，其中，所述非显示区域包括非弯折区域以及弯折区域，所述第二引脚以及所述第三引脚均设置于所述弯折区域内。
  4. 根据权利要求1所述的柔性显示装置，其中，位于所述TFT阵列基板的下表面的部分所述第二绑定引脚与位于所述彩膜基板的上表面的部分所述第三绑定引脚的相对位置交错设置。
  5. 根据权利要求4所述的柔性显示装置，其中，位于所述TFT阵列基板的下表面的部分所述第二绑定引脚之间的引脚间距为其对应的绑定间距的一半，位于所述彩膜基板的上表面的部分所述第三绑定引脚之间的引脚间距为其对应的绑定间距的一半。
  6. 根据权利要求4所述的柔性显示装置，其中，多个所述第二绑定引脚以及多个所述第三绑定引脚的引脚间距大于或等于27微米。
  7. 根据权利要求1所述的柔性显示装置，其中，所述TFT阵列基板的第一侧面及所述彩膜基板的第一侧面均为磨边镜面，所述磨边镜面的粗糙度在0.04~0.7微米之间。
  8. 根据权利要求1所述的柔性显示装置，其中，所述TFT阵列基板的第一侧面与所述TFT阵列基板的下表面之间的夹角为倒圆角或45度边倒角，所述彩膜基板的第一侧面与所述彩膜基板的上表面之间的夹角为倒圆角或45度边倒角。
  9. 根据权利要求1所述的柔性显示装置，其中，所述驱动芯片通过各向异性导电膜与所述第一柔性电路板或所述第二柔性电路板电性连接。
  10. 一种柔性显示装置，其中，包括背光模组、柔性显示面板、多个第一绑定引脚、多个第二绑定引脚、多个第三绑定引脚、第一柔性电路板、第二柔性电路板及驱动芯片，所述柔性显示面板还包括TFT阵列基板以及与所述TFT阵列基板对应设置的彩膜基板；
    其中，多个所述第一绑定引脚设置于所述TFT阵列基板与所述彩膜基板之间的夹层并沿着第一方向D1分别延展至所述TFT阵列基板的第一侧面及所述彩膜基板的第一侧面，多个所述第二绑定引脚用于与所述第一柔性电路板绑定且部分设置于所述TFT阵列基板的下表面，多个所述第三绑定引脚用于与所述第二柔性电路板绑定且部分设置于所述彩膜基板的上表面。
  11. 根据权利要求1所述的柔性显示装置，其中，位于所述TFT阵列基板的下表面的部分所述第二绑定引脚与位于所述彩膜基板的上表面的部分所述第三绑定引脚的相对位置交错设置。
  12. 根据权利要求11所述的柔性显示装置，其中，位于所述TFT阵列基板的下表面的部分所述第二绑定引脚之间的引脚间距为其对应的绑定间距的一半，位于所述彩膜基板的上表面的部分所述第三绑定引脚之间的引脚间距为其对应的绑定间距的一半。
  13. 根据权利要求11所述的柔性显示装置，其中，多个所述第二绑定引脚以及多个所述第三绑定引脚的引脚间距大于或等于27微米。
  14. 根据权利要求10所述的柔性显示装置，其中，所述TFT阵列基板的第一侧面及所述彩膜基板的第一侧面均为磨边镜面，所述磨边镜面的粗糙度在0.04~0.7微米之间。
  15. 根据权利要求10所述的柔性显示装置，其中，所述TFT阵列基板的第一侧面与所述TFT阵列基板的下表面之间的夹角为倒圆角或45度边倒角，所述彩膜基板的第一侧面与所述彩膜基板的上表面之间的夹角为倒圆角或45度边倒角。
  16. 根据权利要求10所述的柔性显示装置，其中，所述驱动芯片通过各向异性导电膜与所述第一柔性电路板或所述第二柔性电路板电性连接。
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