WO2020258161A1 - 印刷电路板及其制造方法 - Google Patents

印刷电路板及其制造方法 Download PDF

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Publication number
WO2020258161A1
WO2020258161A1 PCT/CN2019/093285 CN2019093285W WO2020258161A1 WO 2020258161 A1 WO2020258161 A1 WO 2020258161A1 CN 2019093285 W CN2019093285 W CN 2019093285W WO 2020258161 A1 WO2020258161 A1 WO 2020258161A1
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Prior art keywords
fiber
insulating layer
circuit board
printed circuit
substrate
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PCT/CN2019/093285
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English (en)
French (fr)
Inventor
王宏远
王和志
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AAC Technologies Holdings Shenzhen Co Ltd
AAC Technologies Holdings Nanjing Co Ltd
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AAC Acoustic Technologies Shenzhen Co Ltd
AAC Technologies Holdings Nanjing Co Ltd
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Priority to PCT/CN2019/093285 priority Critical patent/WO2020258161A1/zh
Priority to CN201920992069.5U priority patent/CN210537014U/zh
Publication of WO2020258161A1 publication Critical patent/WO2020258161A1/zh
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Definitions

  • the invention relates to the field of printed circuit board manufacturing, in particular to a printed circuit board and a manufacturing method thereof.
  • Printed circuit board also known as printed circuit board, referred to as printed circuit board, often uses the English abbreviation PCB (Printed circuit board), which uses an insulating board as a substrate, cut into a certain size, with at least one conductive pattern attached to it, and holes (such as component holes, fastening holes, metalized holes, etc.) to replace the previous device electronics
  • PCB Printed circuit board
  • the existing hard copper clad substrates are all made of fiber fabric reinforced resin.
  • the fiber content at the intersection and non-intersection points of the transverse and longitudinal weaves of the fibers is different, resulting in the dielectric constant and the dielectric constant at different positions of the substrate.
  • the difference in loss is large, resulting in uneven dielectric properties of the substrate.
  • the fiber buckling at the weaving point leads to the decrease of the mechanical properties of the material. It is difficult to impregnate the fiber at the fiber fabric weaving and the fiber overlap area, and the fabric wettability is poor. Thin substrate.
  • the purpose of the present invention is to provide a printed circuit board and a manufacturing method thereof, which can solve the non-uniform dielectric properties and material mechanical properties of the hard copper-clad substrate made of material fiber fabric reinforced resin in the prior art Reduction and poor fabric wettability problems.
  • a printed circuit board including a substrate and a metal layer covering the surface of the substrate, the substrate including at least one first insulating layer, and the first insulating layer including at least one single layer
  • the unidirectional fiber-reinforced composite material layer includes reinforced fiber materials with uniform fiber arrangement directions.
  • the reinforcing fiber material is one of glass fiber, quartz fiber or organic fiber.
  • the unidirectional fiber reinforced composite material layer further includes a resin body that wraps the reinforcing fiber material, and the resin in the resin body is polyphenylene ether, cyanate ester, epoxy resin, benzo At least one or a mixed resin of two or more of oxazine, hydrocarbon resin or bismaleimide.
  • the resin body further contains a filler
  • the resin body is made by mixing a mixed resin and a filler together
  • the filler contains at least silica and/or titanium dioxide.
  • the substrate further includes a second insulating layer sandwiched between two adjacent layers of the first insulating layer, the second insulating layer is a fiber fabric, Fiber mat, non-woven fabric or unidirectional fiber reinforced composite material layer.
  • the second insulating layer is a unidirectional fiber reinforced composite material layer, and the angle between the second insulating layer and the first insulating layer of the adjacent layer in the fiber direction is 0 to 90 degrees.
  • volume content fraction of the fibers of the first insulating layer and/or the second insulating layer is 20%-85%.
  • the present invention also provides a manufacturing method of a printed circuit board, which at least includes the following steps:
  • step S20 the following steps are further included:
  • step S20 is replaced with the following steps:
  • the substrate uses unidirectional non-woven reinforced fiber material as the reinforcement, which avoids the dielectric constant and dielectric constant at the fiber woven and non-woven points that exist in the prior art when the fiber fabric is used as the substrate reinforcement. Problems such as large electrical loss deviation, poor dielectric uniformity of the substrate, and poor stability of materials in high-frequency environments.
  • the fibers in the unidirectional fiber-reinforced composite material layer have no buckling and excellent mechanical properties; and after the unidirectional fiber is expanded, it is easy to impregnate, which improves the uniformity and performance of the substrate, and can prepare ultra-thin thickness less than 20 ⁇ m Substrate.
  • FIG. 1 is a schematic front view of a printed circuit board provided by Embodiment 1 of the present invention.
  • FIG. 2 is a schematic top view of a first insulating layer of the printed circuit board shown in FIG. 1;
  • FIG. 3 is a schematic side view of a first insulating layer of the printed circuit board shown in FIG. 1;
  • Embodiment 4 is a schematic front view of a printed circuit board provided by Embodiment 2 of the present invention.
  • FIG. 5 is a schematic top view of a second insulating layer of the printed circuit board shown in FIG. 4;
  • FIG. 6 is a schematic front view of a printed circuit board provided by Embodiment 3 of the present invention.
  • FIG. 7 is a schematic top view of a second insulating layer of the printed circuit board shown in FIG. 6;
  • FIG. 8 is a schematic front view of a printed circuit board provided by the fourth embodiment of the present invention.
  • FIG. 9 is a schematic top view of a second insulating layer of the printed circuit board shown in FIG. 8.
  • FIGS. 1 to 3 show a printed circuit board of this embodiment, which includes a substrate 1 and a metal layer 2 covering the surface of the substrate 1.
  • the substrate 1 includes two first insulating layers 11 stacked one above the other.
  • the first insulating layer 11 is a unidirectional fiber-reinforced composite material layer.
  • the unidirectional fiber-reinforced composite material layer includes reinforced fiber materials with consistent fiber directions. 111 and a resin body 112 wrapping the reinforcing fiber material.
  • the above-mentioned first insulating layer 11 includes multiple fiber layers arranged up and down, and the fiber yarns of at least one fiber layer are arranged in parallel in the multiple fiber layers.
  • the aforementioned reinforcing fiber material is one of glass fiber, quartz fiber or organic fiber.
  • the resin body 112 includes resin and filler, and the resin is polyphenylene ether, cyanate ester, epoxy resin, benzo At least one or a mixed resin of two or more of oxazine, hydrocarbon resin or bismaleimide.
  • the filler contains at least silica and/or titanium dioxide.
  • the resin body 112 of this embodiment is made by mixing mixed resin and filler together.
  • This embodiment also provides a method for manufacturing the above-mentioned printed circuit board, including the following steps:
  • the substrate 1 of the printed circuit board of this embodiment uses unidirectional non-woven reinforcing fiber material 111 as the reinforcement, which avoids the fiber weaving and non-woven points that exist in the prior art using fiber fabric as the substrate reinforcement.
  • the dielectric constant and dielectric loss have large deviations, the substrate dielectric uniformity is poor, and the material has poor stability in high-frequency environments.
  • the fibers in the unidirectional fiber-reinforced composite material layer have no buckling and excellent mechanical properties; and after the unidirectional fiber is expanded, it is easy to impregnate, which improves the uniformity and performance of the substrate, and can prepare ultra-thin thickness less than 20 ⁇ m Substrate.
  • the substrate 1 of this embodiment includes an even-numbered first insulating layer 11 and a second insulating layer 12 sandwiched between two adjacent first insulating layers 11.
  • the second insulating layer 12 is also a unidirectional fiber-reinforced composite material layer, but the angle between the fiber direction of the reinforcing fiber material 121 in the second insulating layer 12 and the fiber direction of the reinforcing fiber material 111 of the first insulating layer 11 It is 90 degrees, and two adjacent first insulating layers 11 are respectively located on the upper and lower surfaces of the second insulating layer 12.
  • the fiber directions of the reinforcing fiber materials 111 in the two adjacent first insulating layers 11 are the same.
  • the substrate 1 of this embodiment includes two first insulating layers 11 and a second insulating layer 12a.
  • the second insulating layer 12a is a fiber fabric reinforced composite material layer, and the volume content of fibers in the second insulating layer 12a is 20%-85%.
  • the two first insulating layers 11 are respectively located on the upper and lower surfaces of the second insulating layer 12a.
  • the fiber directions of the reinforcing fiber materials 111 in the two first insulating layers 11 are the same.
  • the second insulating layer 12b is a fiber felt (or non-woven fabric) reinforced composite material layer.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
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Abstract

本发明提供了一种印刷电路板及其制造方法。本发明的印刷电路板，其基板使用单向非编织增强纤维材料作为增强体，避免了现有技术中使用纤维织物作为基板增强体所存在的纤维编织点和非编织点处介电常数和介电损耗偏差大，基板介电均一性差，材料在高频环境下稳定性差等问题。同时，单向纤维增强复合材料层中的纤维无屈曲，材料力学性能优异；并且，单向纤维经扩线后，浸渍容易，提升了基板均匀性和性能，可制备厚度小于20μm以下的超薄基板。

Description

印刷电路板及其制造方法 技术领域
本发明涉及印刷电路板制造领域，尤其涉及一种印刷电路板及其制造方法。
 背景技术
印刷电路板，又称印刷线路板，简称印制板，常使用英文缩写PCB（Printed circuit board），其以绝缘板为基板，切成一定尺寸，其上至少附有一个导电图形，并布有孔（如元件孔、紧固孔、金属化孔等），用来代替以往装置电子元器件的底盘，并实现电子元器件之间的相互连接。
现有的硬质覆铜基板均是采用材料纤维织物增强树脂制得，然而，纤维横向和纵向编织的交叉点和非交叉点处纤维含量不同，导致了基板不同位置的介电常数和介电损耗差异较大，导致基板介电性能不均匀。此外，编织点处的纤维屈曲，导致材料力学性能降低，纤维织物编织处，纤维交叠处纤维浸渍树脂难度大，织物浸润性差，导致基板中纤维存在干纱问题，影响基板性能，难以制备超薄基板。
因此，有必要提供一种新型的印刷电路板。
 技术问题
本发明的目的在于提供一种印刷电路板及其制造方法，其可以解决现有技术中采用材料纤维织物增强树脂制得的硬质覆铜基板所存在的板介电性能不均匀、材料力学性能降低以及织物浸润性差的问题。
 技术解决方案
本发明的技术方案如下：一种印刷电路板，包括基板以及覆盖于所述基板表面上的金属层，所述基板包括至少一层第一绝缘层，所述第一绝缘层包括至少一层单向纤维增强复合材料层，所述单向纤维增强复合材料层包含有纤维排布方向一致的增强纤维材料。
进一步的，所述增强纤维材料为玻纤维、石英纤维或有机纤维中的一种。
进一步的，所述单向纤维增强复合材料层还包括包裹所述增强纤维材料的树脂体，所述树脂体中的树脂为聚苯醚、氰酸酯、环氧树脂、苯并
Figure 5641
嗪、碳氢树脂或双马来酰亚胺中的至少一种或两种以上的混合树脂。
进一步的，所述树脂体还包含有填料，所述树脂体由混合树脂与填料共同混合后制成，所述填料至少包含有二氧化硅和/或二氧化钛。
进一步的，所述第一绝缘层的数量为偶数，所述基板还包括夹设于相邻两层所述第一绝缘层之间的第二绝缘层，所述第二绝缘层为纤维织物、纤维毡、无纺布或单向纤维增强的复合材料层。
进一步的，所述第二绝缘层为单向纤维增强复合材料层，所述第二绝缘层与相邻层的所述第一绝缘层之间纤维方向的夹角为0~90度。
进一步的，所述第一绝缘层和/或第二绝缘层的纤维的体积含量分数为20%~85%。
本发明为解决上述技术问题，还提供了一种印刷电路板的制造方法，其至少包括以下步骤：
S10、将纤维排布方向一致的增强纤维材料浸渍树脂，烘干后制得第一绝缘层预浸料；
S20、将金属层以及第一绝缘层铺层，然后按照既定工艺进行热压固化，得到覆铜板；
S30、将所述覆铜板按照设计的电路经过曝光、显影、刻蚀以及表面处理，制得所述印刷电路板。
进一步的，所述步骤S20之前还包括以下步骤：
将纤维织物、纤维毡、无纺布或纤维排布方向一致的增强纤维材料浸渍树脂，烘干后制得第二绝缘层预浸料；
所述步骤S20替换为以下步骤：
将铜箔、第一绝缘层以及第二绝缘层铺层，然后按照既定工艺进行热压固化，得到覆铜板。
 有益效果
本发明的印刷电路板，其基板使用单向非编织增强纤维材料作为增强体，避免了现有技术中使用纤维织物作为基板增强体所存在的纤维编织点和非编织点处介电常数和介电损耗偏差大，基板介电均一性差，材料在高频环境下稳定性差等问题。同时，单向纤维增强复合材料层中的纤维无屈曲，材料力学性能优异；并且，单向纤维经扩线后，浸渍容易，提升了基板均匀性和性能，可制备厚度小于20μm以下的超薄基板。
 附图说明
图1为本发明实施例一提供的一种印刷电路板的主视示意图；
图2为图1所示印刷电路板的第一绝缘层的俯视示意图；
图3为图1所示印刷电路板的第一绝缘层的侧视示意图；
图4为本发明实施例二提供的一种印刷电路板的主视示意图；
图5为图4所示印刷电路板的第二绝缘层的俯视示意图；
图6为本发明实施例三提供的一种印刷电路板的主视示意图；
图7为图6所示印刷电路板的第二绝缘层的俯视示意图；
图8为本发明实施例四提供的一种印刷电路板的主视示意图；
图9为图8所示印刷电路板的第二绝缘层的俯视示意图。
 本发明的实施方式
下面结合附图和实施方式对本发明作进一步说明。
实施例一：
请参见图1至图3，示出了本实施例的一种印刷电路板，包括基板1以及覆盖于所述基板1表面上的金属层2。其中，基板1包括两层上下叠置的第一绝缘层11，该第一绝缘层11为单向纤维增强复合材料层，所述单向纤维增强复合材料层包含有纤维方向一致的增强纤维材料111以及包裹该增强纤维材料的树脂体112。于本实施例中，两层第一绝缘层11的纤维方向夹角为0度；第一绝缘层11的体积含量分数为20%~85%；金属层2为铜层，其厚度为8-50μm，金属层2与基板1接触面粗糙度为Rs=100nm~2μm。
上述第一绝缘层11中包含有多层上下排布的纤维层，所述多层纤维层中至少有一层纤维层的纤维纱线平行排列。
上述增强纤维材料为玻纤维、石英纤维或有机纤维中的一种。所述树脂体112包含树脂以及填料，树脂为聚苯醚、氰酸酯、环氧树脂、苯并
Figure 5641
嗪、碳氢树脂或双马来酰亚胺中的至少一种或两种以上的混合树脂。填料至少包含有二氧化硅和/或二氧化钛。本实施例的树脂体112由混合树脂与填料共同混合后制成。
本实施例还提供了一种上述印刷电路板的制造方法，包括以下步骤：
S10、将纤维排布方向一致的增强纤维材料111浸渍树脂，烘干后制得第一绝缘层11预浸料；
S20、将两层铜箔（即金属层2）以及两层第一绝缘层11铺层，然后按照既定工艺进行热压固化，得到覆铜板；
S30、将所述覆铜板按照设计的电路经过曝光、显影、刻蚀以及表面处理，制得所述印刷电路板。
可见，本实施例的印刷电路板，其基板1使用单向非编织增强纤维材料111作为增强体，避免了现有技术中使用纤维织物作为基板增强体所存在的纤维编织点和非编织点处介电常数和介电损耗偏差大，基板介电均一性差，材料在高频环境下稳定性差等问题。
同时，单向纤维增强复合材料层中的纤维无屈曲，材料力学性能优异；并且，单向纤维经扩线后，浸渍容易，提升了基板均匀性和性能，可制备厚度小于20μm以下的超薄基板。
实施例二：
请参见图4及图5，本实施例与实施例一的不同之处在于:
本实施例的基板1包括偶数层的第一绝缘层11以及夹设于相邻两层所述第一绝缘层11之间的第二绝缘层12。所述第二绝缘层12也是单向纤维增强的复合材料层，但第二绝缘层12的中的增强纤维材料121的纤维方向与第一绝缘层11的增强纤维材料111的纤维方向的夹角为90度，相邻两层第一绝缘层11分别位于第二绝缘层12的上、下表面。所述相邻的两层第一绝缘层11中的增强纤维材料111的纤维方向相同。
实施例三：
请参见图6及图7，本实施例与实施例一的不同之处在于:
本实施例的基板1包括两层第一绝缘层11以及一层第二绝缘层12a。所述第二绝缘层12a为纤维织物增强复合材料层，第二绝缘层12a的纤维的体积含量分数为20%~85%。并且，两层第一绝缘层11分别位于第二绝缘层12a的上、下表面。所述的两层第一绝缘层11中的增强纤维材料111的纤维方向相同。
本实施例的印刷电路板的制造方法，包括以下步骤：
S10、将纤维排布方向一致的增强纤维材料111浸渍树脂，烘干后制得第一绝缘层11预浸料；
S11、将纤维织物增强纤维材料121a浸渍树脂，烘干后制得第二绝缘层12a预浸料；
S20、将金属层2、第一绝缘层11、第二绝缘层12铺层，然后按照既定工艺进行热压固化，得到覆铜板；
S30、将所述覆铜板按照设计的电路经过曝光、显影、刻蚀以及表面处理，制得所述印刷电路板。
实施例四：
请参见图8及图9，本实施例与实施例三的不同之处在于:
所述第二绝缘层12b为纤维毡（或无纺布）增强复合材料层。
以上所述的仅是本发明的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出改进，但这些均属于本发明的保护范围。

Claims (10)

  1. 一种印刷电路板，包括基板以及覆盖于所述基板表面上的金属层，其特征在于，所述基板包括至少一层第一绝缘层，所述第一绝缘层包括至少一层单向纤维增强复合材料层，所述单向纤维增强复合材料层包含有纤维排布方向一致的增强纤维材料。
  2. 根据权利要求1所述的印刷电路板，其特征在于：所述增强纤维材料为玻纤维、石英纤维或有机纤维中的一种。
  3. 根据权利要求1所述的印刷电路板，其特征在于：所述单向纤维增强复合材料层还包括包裹所述增强纤维材料的树脂体，所述树脂体中的树脂为聚苯醚、氰酸酯、环氧树脂、苯并
    Figure 5641
    嗪、碳氢树脂或双马来酰亚胺中的至少一种或两种以上的混合树脂。
  4. 根据权利要求3所述的印刷电路板，其特征在于：所述树脂体还包含有填料，所述树脂体由混合树脂与填料共同混合后制成，所述填料至少包含有二氧化硅和/或二氧化钛。
  5. 根据权利要求1所述的印刷电路板，其特征在于：所述基板包括至少两层所述第一绝缘层，相邻两层所述第一绝缘层之间纤维方向的夹角为0度。
  6. 根据权利要求5所述的印刷电路板，其特征在于：所述第一绝缘层的数量为偶数，所述基板还包括夹设于相邻两层所述第一绝缘层之间的第二绝缘层，所述第二绝缘层为纤维织物、纤维毡、无纺布或单向纤维增强复合材料层。
  7. 根据权利要求6所述的印刷电路板，其特征在于，所述第二绝缘层为单向纤维增强复合材料层，所述第二绝缘层与相邻层的所述第一绝缘层之间纤维方向的夹角为0~90度。
  8. 根据权利要求5所述的印刷电路板，其特征在于：所述第一绝缘层和/或第二绝缘层的纤维的体积含量分数为20%~85%。
  9. 一种如权利要求1-8中任一项所述印刷电路板的制造方法，其特征在于：至少包括以下步骤：
    S10、将纤维排布方向一致的增强纤维材料浸渍树脂，烘干后制得第一绝缘层预浸料；
    S20、将金属层以及第一绝缘层铺层，然后按照既定工艺进行热压固化，得到覆铜板；
    S30、将所述覆铜板按照设计的电路经过曝光、显影、刻蚀以及表面处理，制得所述印刷电路板。
  10. 如权利要求9所述的印刷电路板的制造方法，其特征在于：所述步骤S20之前还包括以下步骤：
    将纤维织物、纤维毡、无纺布或纤维排布方向一致的增强纤维材料浸渍树脂，烘干后制得第二绝缘层预浸料；
    所述步骤S20替换为以下步骤：
    将铜箔、第一绝缘层以及第二绝缘层铺层，然后按照既定工艺进行热压固化，得到覆铜板。
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1714608A (zh) * 2003-01-16 2005-12-28 富士通株式会社 多层布线基板及其制造方法、纤维强化树脂基板制造方法
CN101543150A (zh) * 2006-11-10 2009-09-23 日本电气株式会社 多层布线基板
CN206790781U (zh) * 2017-04-29 2017-12-22 江苏联鑫电子工业有限公司 印刷线路板用覆铜复合板
CN109496076A (zh) * 2018-12-19 2019-03-19 咸阳天华电子科技有限公司 一种单向纤维电路板的制造工艺

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1714608A (zh) * 2003-01-16 2005-12-28 富士通株式会社 多层布线基板及其制造方法、纤维强化树脂基板制造方法
CN101543150A (zh) * 2006-11-10 2009-09-23 日本电气株式会社 多层布线基板
CN206790781U (zh) * 2017-04-29 2017-12-22 江苏联鑫电子工业有限公司 印刷线路板用覆铜复合板
CN109496076A (zh) * 2018-12-19 2019-03-19 咸阳天华电子科技有限公司 一种单向纤维电路板的制造工艺

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