WO2020255535A1 - Équipement électronique et dispositif d'affichage - Google Patents

Équipement électronique et dispositif d'affichage Download PDF

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Publication number
WO2020255535A1
WO2020255535A1 PCT/JP2020/015574 JP2020015574W WO2020255535A1 WO 2020255535 A1 WO2020255535 A1 WO 2020255535A1 JP 2020015574 W JP2020015574 W JP 2020015574W WO 2020255535 A1 WO2020255535 A1 WO 2020255535A1
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WIPO (PCT)
Prior art keywords
wiring board
light emitting
light
electronic device
emitting elements
Prior art date
Application number
PCT/JP2020/015574
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English (en)
Japanese (ja)
Inventor
隆 大田
Original Assignee
株式会社ジャパンディスプレイ
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Publication date
Application filed by 株式会社ジャパンディスプレイ filed Critical 株式会社ジャパンディスプレイ
Publication of WO2020255535A1 publication Critical patent/WO2020255535A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/10—Refractors for light sources comprising photoluminescent material
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof

Definitions

  • Embodiments of the present invention relate to electronic devices and display devices.
  • electronic devices used for various types of lighting are known.
  • an electronic device that illuminates a liquid crystal display panel is known.
  • LEDs light emitting diodes
  • the present embodiment provides a display device including an electronic device and an electronic device for lighting that can be easily repaired.
  • the electronic device has a plurality of wiring board pieces and a plurality of light emitting elements mounted on the first main surfaces of the plurality of wiring board pieces, and each of the plurality of wiring board pieces has a pair of long sides facing each other.
  • the plurality of wiring board pieces are arranged so that the long sides of the two adjacent wiring board pieces face each other.
  • the display device is A display panel and an electronic device for illuminating the display panel are provided, and the electronic device includes a plurality of wiring board pieces and a plurality of light emitting elements mounted on the first main surfaces of the plurality of wiring board pieces.
  • the plurality of wiring board pieces has a pair of long sides facing each other, and the plurality of wiring board pieces have the long sides of two adjacent wiring board pieces facing each other. They are arranged like this.
  • FIG. 1 is a block diagram showing a display device according to an embodiment.
  • FIG. 2 is a diagram showing a basic configuration and an equivalent circuit of the display panel shown in FIG.
  • FIG. 3 is an exploded perspective view showing the lighting device according to the first embodiment of the above embodiment.
  • FIG. 4 is a plan view showing a part of the lighting device according to the first embodiment.
  • FIG. 5 is an enlarged plan view showing a part of the lighting device shown in FIG.
  • FIG. 6 is a cross-sectional view showing the lighting device along the line VI-VI of FIG.
  • FIG. 7 is a cross-sectional view showing the light emitting element along the line VII-VII of FIG.
  • FIG. 8 is a plan view showing a part of the lighting device according to the second embodiment of the above embodiment.
  • FIG. 1 is a block diagram showing a display device according to an embodiment.
  • FIG. 2 is a diagram showing a basic configuration and an equivalent circuit of the display panel shown in FIG.
  • FIG. 3 is an exploded
  • FIG. 9 is an enlarged plan view showing a part of the lighting device shown in FIG.
  • FIG. 10 is a cross-sectional view showing the lighting device along the line XX of FIG.
  • FIG. 11 is a plan view showing a part of the lighting device according to the first modification of the above embodiment.
  • FIG. 12 is a plan view showing a part of the lighting device according to the second modification of the above embodiment.
  • FIG. 13 is a cross-sectional view showing a part of the lighting device according to the third modification of the above embodiment.
  • FIG. 14 is an exploded perspective view showing the lighting device according to the modified example 4 of the above embodiment.
  • FIG. 1 is a block diagram showing a display device DSP according to an embodiment.
  • FIG. 1 shows a three-dimensional space defined by a first direction X, a second direction Y perpendicular to the first direction X, and a third direction Z perpendicular to each of the first direction X and the second direction Y.
  • the first direction X and the second direction Y are orthogonal to each other, but may intersect at an angle other than 90 °.
  • the third direction Z is defined as upper, and the direction opposite to the third direction Z is defined as lower.
  • the second member may be in contact with the first member and is located away from the first member. You may be.
  • the display device DSP includes a display panel PNL and a lighting device IL as an electronic device for lighting.
  • the display panel PNL has a display area DA for displaying an image.
  • the display panel PNL is a generally known transmissive or transflective liquid crystal display panel.
  • the display panel PNL is not limited to the liquid crystal display panel, and may be a display panel that requires a separate light source, such as a MEMS (Micro Electro-Mechanical System) display panel.
  • MEMS Micro Electro-Mechanical System
  • the lighting device IL is arranged facing the display panel PNL in the third direction Z.
  • the illuminating device IL is configured to emit light toward the display panel PNL to illuminate the display panel PNL.
  • the lighting device IL functions as a backlight unit.
  • the illuminating device IL is configured to illuminate at least the entire display area DA of the display panel PNL.
  • the illumination device IL has a light emitting region LA facing the entire display region DA and the third direction Z.
  • the display panel PNL is configured to display an image by selectively transmitting light from the lighting device IL.
  • FIG. 2 is a diagram showing a basic configuration and an equivalent circuit of the display panel PNL shown in FIG.
  • the display panel PNL includes a plurality of sub-pixels SP in the display area DA.
  • the plurality of sub-pixels SP are arranged in a matrix in the first direction X and the second direction Y.
  • the plurality of sub-pixel SPs constitute one pixel.
  • the three sub-pixels SP adjacent to each other in the first direction X constitute one pixel.
  • the display panel PNL includes a plurality of scanning lines G, a plurality of signal lines S, a common electrode CE, and the like in the display area DA.
  • the plurality of scanning lines G extend in the first direction X and are arranged at intervals in the second direction Y.
  • the plurality of signal lines S extend in the second direction Y and are arranged at intervals in the first direction X.
  • the scanning line G and the signal line S do not necessarily extend linearly, and a part of them may be bent.
  • the common electrode CE is arranged over a plurality of sub-pixel SPs and is shared by the plurality of sub-pixel SPs.
  • the scanning line G is connected to the scanning line drive circuit GD.
  • the signal line S is connected to the signal line drive circuit SD.
  • the common electrode CE is connected to the common electrode drive circuit CD.
  • the signal line drive circuit SD, the scanning line drive circuit GD, and the common electrode drive circuit CD are located in a non-display area NDA other than the display area DA.
  • Each sub-pixel SP includes a switching element SW, a pixel electrode PE, a common electrode CE, a liquid crystal layer LC, and the like.
  • the switching element SW is composed of, for example, a thin film transistor (TFT), and is electrically connected to the scanning line G and the signal line S.
  • the pixel electrode PE is electrically connected to the switching element SW.
  • Each of the pixel electrode PEs faces the common electrode CE, and the liquid crystal layer LC is driven by the electric field generated between the pixel electrode PE and the common electrode CE.
  • the holding capacitance CS is formed between, for example, an electrode having the same potential as the common electrode CE and an electrode having the same potential as the pixel electrode PE.
  • FIG. 3 is an exploded perspective view showing the lighting device IL according to the first embodiment.
  • the lighting device IL includes a wiring board 1, a plurality of light emitting elements 2, a driving unit 4, a protective layer 5, a light diffusing unit 6, a brightness improving unit 7, and a wavelength conversion unit 9. And have.
  • the wiring board 1, the plurality of light emitting elements 2, the protective layer 5, the wavelength conversion unit 9, the light diffusion unit 6, and the brightness improving unit 7 are laminated in the third direction Z without any gap.
  • the wiring board 1 is a printed circuit board.
  • the wiring board 1 is composed of a flexible printed circuit board (FPC).
  • the flexible printed circuit board has flexibility. Therefore, for example, when the display panel PNL is curved, the lighting device IL can easily follow the shape of the curved display panel PNL.
  • the wiring board 1 is not limited to the flexible printed circuit board, and may be composed of a printed circuit board (PCB). Since the printed circuit board has higher rigidity than the flexible printed circuit board, it is easy to mount the light emitting element 2 on the wiring board 1.
  • the wiring board 1 has a light emitting region LA.
  • the plurality of light emitting elements 2 are mounted on the first main surface SU1 of the wiring board 1.
  • the light emitting element 2 is a mini LED (mini light emitting diode).
  • the drive unit 4 is mounted on the first main surface SU1. The drive unit 4 is configured to drive a plurality of light emitting elements 2 via the wiring board 1.
  • the light emitting element 2 outputs light having a specific wavelength
  • the wavelength conversion unit 9 converts the wavelength of the light emitted from the light emitting element 2 and outputs it.
  • the wavelength conversion unit 9 as a wavelength conversion element is located between the protective layer 5 and the light diffusion unit 6.
  • the wavelength conversion unit 9 includes, for example, quantum dots as a light emitting material, absorbs incident light such as light emitted by the light emitting element 2, and can emit light having a wavelength longer than the wavelength of the absorbed light. ..
  • the light emitting element 2 is a blue LED having a main emission peak wavelength of 500 nm or less
  • the wavelength conversion unit 9 is a phosphor that absorbs the light emitted from the light emitting element 2 and emits light having a wavelength of 500 nm or more.
  • the light diffusing unit 6 is located above the plurality of light emitting elements 2.
  • the light diffusing unit 6 is configured to diffuse and emit the light emitted by the light emitting element 2.
  • the light diffusing portion 6 is a light diffusing film formed by laminating five light diffusing sheets 6a.
  • the light diffusing portion 6 may be composed of one light diffusing sheet 6a, or may be formed by laminating four or less or six or more light diffusing sheets 6a.
  • the protective layer 5 is located between the first main surface SU1 and the wavelength conversion unit 9.
  • the brightness improving unit 7 is located above the light diffusing unit 6.
  • the brightness improving unit 7 is configured to collect and emit the light incident from the light diffusing unit 6 in the third direction Z.
  • the brightness improving unit 7 is composed of two refracting prism sheets 7a arranged orthogonally.
  • the brightness improving unit 7 may be composed of a total reflection type prism sheet instead of the refraction type prism sheet 7a.
  • the total reflection type prism sheet has the features that it has a simple structure and is excellent in light utilization efficiency and vertical condensing property.
  • FIG. 4 is a plan view showing a part of the lighting device IL according to the first embodiment.
  • FIG. 4 shows the wiring board 1 and the drive unit 4 of the lighting device IL.
  • the wiring board 1 of the first embodiment is not divided into a plurality of wiring board pieces.
  • the light emitting region LA has a plurality of segment regions SA.
  • the plurality of segment regions SA are arranged in a matrix in the first direction X and the second direction Y.
  • 30 segment regions SA are arranged in the first direction X and 32 are arranged in the second direction Y.
  • a plurality of segment regions SA are shown surrounded by broken lines. It should be noted that each segment region SA is driven independently.
  • FIG. 5 is an enlarged plan view showing a part of the lighting device IL shown in FIG.
  • FIG. 5 shows the wiring board 1 and the plurality of light emitting elements 2 of the lighting device IL.
  • the segment region SA is a square having a side of 2 mm.
  • the plurality of segment regions SA are arranged in a matrix in the first direction X and the second direction Y intersecting each other, arranged at equal pitches in the first direction X, and arranged at equal pitches in the second direction Y.
  • the plurality of light emitting elements 2 are arranged in a matrix in the first direction X and the second direction Y.
  • One or more light emitting elements 2 are provided in each of the plurality of segment regions SA. In the first embodiment, four (2 ⁇ 2) light emitting elements 2 are provided in each segment region SA.
  • the number of light emitting elements 2 formed in the segment region SA can be n ⁇ m (n> 1, m> 1).
  • the plurality of light emitting elements 2 are arranged in the first direction X at the first pitch p1 and in the second direction Y at the second pitch p2.
  • the first pitch p1 referred to here is a linear distance in the first direction X from the geometric center of one light emitting element 2 to the geometric center of another light emitting element 2 adjacent to the first direction X.
  • the second pitch p2 refers to a linear distance in the second direction Y from the geometric center of one light emitting element 2 to the geometric center of another light emitting element 2 adjacent to the second direction Y. ..
  • the plurality of light emitting elements 2 are arranged at equal pitches in the first direction X and at equal pitches in the second direction Y.
  • the first pitch p1 and the second pitch p2 are 1 mm, respectively.
  • the four light emitting elements 2 provided in each segment region SA are connected in series.
  • the light emitting elements 2 provided in the segment regions SA different from each other are electrically insulated from each other.
  • the light emitting element 2 has a rectangular shape. However, the shape of the light emitting element 2 may have a shape other than a rectangle such as a square.
  • the length of one side of the light emitting element 2 which is a mini LED is, for example, more than 100 ⁇ m and less than 300 ⁇ m. The length of one side of the light emitting element 2 which is a mini LED may exceed 100 ⁇ m and may be 200 ⁇ m or less.
  • the light emitting element 2 may be a micro LED having the longest side length of 100 ⁇ m or less as an LED having a size smaller than that of the mini LED.
  • the light emitting element 2 may be an LED having the longest side length of 1 mm or less.
  • the light emitting element 2 may be an LED having a longest side length of 1000 ⁇ m or more as a general LED having a size larger than that of the mini LED.
  • the length of one side of the light emitting element 2 which is the general LED is, for example, 300 ⁇ m or more and 350 ⁇ m or less.
  • the wiring board 1 has a plurality of control wirings connected to the drive unit 4.
  • the plurality of control wirings are 32 control wirings extending in the first direction X and arranged in the second direction Y and arranging in the first direction X extending in the second direction Y. Includes 30 control wires.
  • the drive unit 4 can drive a plurality of light emitting elements 2 in an active matrix via the plurality of control wirings. Therefore, the drive unit 4 is configured to independently drive a plurality of light emitting elements 2 in units of segment regions SA via the wiring board 1.
  • the drive unit 4 can drive a plurality of light emitting elements 2 by a method called local dimming. This makes it possible to further increase the contrast ratio.
  • FIG. 6 is a cross-sectional view showing a lighting device IL along the line VI-VI of FIG.
  • FIG. 6 shows a wiring board 1, a plurality of light emitting elements 2, and a protective layer 5 in the lighting device IL.
  • the protective layer 5 is provided on the first main surface SU1 and the plurality of light emitting elements 2, and is in contact with the first main surface SU1 and the plurality of light emitting elements 2.
  • the protective layer 5 is configured to protect a plurality of light emitting elements 2.
  • the protective layer 5 is located at least in the light emitting region (LA).
  • the wiring board 1, the plurality of light emitting elements 2, and the protective layer 5 together with the driving unit (4) constitute a light source 8.
  • the light emitting element 2 is mounted on the wiring board 1 by a method called flip chip bonding.
  • flip-chip bonding a bare chip cut out from a substrate and not packaged is connected to a wiring board 1 with a conductive material CM such as solder, gold, or an anisotropic conductive film.
  • 210 is a light-transmitting substrate as a base material
  • the light emitting element 2 has pads 230 and 240 on a surface (bottom surface 220) of the substrate 210 facing the wiring substrate 1.
  • the light emitting element 2 has two pads 230 and 240. In the pads 230 and 240, one is connected to the anode of the light emitting diode from the bottom surface 220 side, and the other is connected to the cathode from the bottom surface 220 side.
  • connection electrode 1e is formed on the wiring board 1 with copper foil or the like.
  • the connection electrode 1e forms a part of the first main surface SU1.
  • the substrate 210 has a surface (top surface) 250 facing the bottom surface 220, and in flip-chip bonding, the surface 250 of the light emitting element 2 is heated and pressed. By heating and pressing from the surface 250, the pads 230 and 240 are connected to the connection electrode 1e via a conductive material CM such as solder, gold, or an anisotropic conductive film.
  • a conductive material CM such as solder, gold, or an anisotropic conductive film.
  • the wavelength conversion unit 9 is formed separately from the light emitting element 2.
  • the connection portion is not formed on the surface 250 of the substrate 210, and the wiring can be shortened.
  • the surface is connected to the wiring board with a wire, so the length is longer than the thickness of the board 210.
  • the wiring length is the distance from the bottom surface 220 of the board 210 to the wiring board 1. It becomes.
  • the protective layer 5 is configured as a light transmitting layer that transmits the wavelength of the light emitted by the light emitting element 2.
  • the protective layer 5 is made of, for example, a silicone resin.
  • the protective layer 5 is configured to transmit the light without converting the wavelength of the light emitted by the light emitting element 2 into another wavelength. In that case, the wavelength of the light transmitted through the protective layer 5 is converted to another wavelength by the wavelength conversion unit 9.
  • the configuration of the protective layer 5 is not limited to the above example.
  • the protective layer 5 may be configured as a wavelength conversion layer that converts the wavelength of the light emitted by the light emitting element 2.
  • the protective layer 5 contains, for example, quantum dots as a light emitting material, can absorb the light emitted by the light emitting element 2, and can emit light having a wavelength longer than the wavelength of the absorbed light.
  • the light source 8 can emit light having a desired hue.
  • the light emitting element 2 emits blue light
  • the quantum dots of the protective layer 5 and the wavelength conversion unit 9 emit yellow light, which is a complementary color of blue, so that the lighting device IL emits blue light and the protective layer 5 and White light, which is a composite light of yellow light whose wavelength has been converted by the wavelength conversion unit 9, can be emitted.
  • the protective layer 5 may be configured as a photosynthetic layer in which a plurality of phosphors are dispersed in a light transmitting layer.
  • the light transmitting layer is configured to transmit the wavelength of the light emitted by the light emitting element 2, and is made of, for example, a silicon resin.
  • the plurality of phosphors absorb the light emitted by the light emitting element 2 and emit light having a different wavelength.
  • the light source 8 can emit light having a desired hue.
  • the light emitting element 2 emits blue light
  • the phosphor of the protective layer 5 and the quantum dots of the wavelength conversion unit 9 emit yellow light, so that the illuminating device IL can emit white synthetic light.
  • the height h1 of the light emitting element 2 is 80 ⁇ m, and the thickness T of the protective layer 5 is 0.3 mm.
  • the lighting device IL of the first embodiment is configured as described above.
  • FIG. 7 is a cross-sectional view showing the light emitting element 2 along the line VII-VII of FIG.
  • the light emitting element 2 is a flip chip type light emitting diode element.
  • the light emitting element 2 includes a transparent substrate 210 having an insulating property.
  • the substrate 210 is, for example, a sapphire substrate.
  • a crystal layer (semiconductor layer) in which an n-type semiconductor layer 12, an active layer (light emitting layer) 13, and a p-type semiconductor layer 14 are laminated in this order is formed on the bottom surface 220 of the substrate 210.
  • the region containing P-type impurities is the p-type semiconductor layer 14, and the region containing N-type impurities is the n-type semiconductor layer 12.
  • the material of the crystal layer (semiconductor layer) is not particularly limited, but the crystal layer (semiconductor layer) may contain gallium nitride (GaN) or gallium arsenide (GaAs).
  • the light reflecting film 15 is formed of a conductive material and is electrically connected to the p-type semiconductor layer 14.
  • the p electrode 16 is electrically connected to the light reflecting film 15.
  • the n-electrode 18 is electrically connected to the n-type semiconductor layer 12.
  • the pad 230 covers the n-electrode 18 and is electrically connected to the n-electrode 18.
  • the protective layer 17 covers the n-type semiconductor layer 12, the active layer 13, the p-type semiconductor layer 14, and the light-reflecting film 15, and covers a part of the p-electrode 16.
  • the pad 240 covers the p-electrode 16 and is electrically connected to the p-electrode 16.
  • FIG. 8 is a plan view showing a part of the lighting device IL according to the second embodiment.
  • the lighting device IL further includes the support board 90, and the wiring board 1 is composed of a plurality of wiring board pieces 10. Is different from.
  • the wiring board 1 of the second embodiment is composed of eight wiring board pieces 10.
  • Each wiring board piece 10 has a pair of long side LSs facing in the second direction Y.
  • the plurality of wiring board pieces 10 are located physically independently of each other and are arranged so as to be adjacent to each other.
  • the plurality of wiring board pieces 10 are arranged in a stripe shape.
  • the plurality of wiring board pieces 10 extend in the first direction X, are arranged in the second direction Y, and are arranged in a so-called horizontal stripe shape.
  • the long side LSs face each other.
  • Each wiring board piece 10 has a plurality of segment regions SA.
  • the plurality of segment regions SA are arranged in a matrix in the first direction X and the second direction Y.
  • 30 segment regions SA of each wiring board piece 10 are arranged in the first direction X and 4 in the second direction Y.
  • 30 pieces of the plurality of segment regions SA are arranged in the first direction X, and 32 pieces are arranged in the second direction Y.
  • the plurality of segment regions SA of the plurality of wiring board pieces 10 form a light emission region LA.
  • the support board 90 may be configured to support a plurality of wiring board pieces 10, and may be composed of, for example, a flexible printed circuit board (FPC) or a printed circuit board (PCB).
  • FPC flexible printed circuit board
  • PCB printed circuit board
  • the drive unit 4 is mounted on the support board 90.
  • the support substrate 90 is composed of a printed circuit board.
  • the drive unit 4 is electrically connected to the plurality of wiring board pieces 10 via the wiring of the support board 90.
  • Each wiring board piece 10 has a plurality of control wirings connected to the drive unit 4 via the support board 90.
  • Each wiring board piece 10 has four control wirings extending in the first direction X, shared by a plurality of segment regions SA arranged in the first direction X, and arranged in the second direction Y, and a second direction Y. It includes 30 control wirings that are shared by a plurality of segment regions SA that extend in the second direction Y and are arranged in the first direction X.
  • the control wiring is drawn out to the ends of the wiring board piece 10 (here, the left and right ends of the wiring board piece 10) and is electrically connected to the support board 90.
  • the drive unit 4 can actively drive a plurality of light emitting elements 2 via the support substrate 90 and the plurality of wiring board pieces 10. Therefore, the drive unit 4 can independently drive the plurality of light emitting elements 2 in the segment region SA unit, and can drive the plurality of light emitting elements 2 by a method called local dimming, for example.
  • the light emitting element 2 is electrically connected to the drive unit 4 via the support board 90 without passing through another wiring board piece 10 from the wiring board piece 10 on which the light emitting element 2 is mounted. However, when the light emitting element 2 is electrically connected to the drive unit 4, the wiring board piece 10 on which the light emitting element 2 is mounted may be passed through another wiring board piece 10.
  • FIG. 9 is an enlarged plan view showing a part of the lighting device IL shown in FIG. FIG. 9 shows two wiring board pieces 10 and a plurality of light emitting elements 2 of the lighting device IL.
  • the segment region SA is a square having a side of 2 mm.
  • the plurality of segment regions SA of the plurality of wiring board pieces 10 are arranged in a matrix in the first direction X and the second direction Y, arranged at equal pitches in the first direction X, and arranged at equal pitches in the second direction Y.
  • the plurality of light emitting elements 2 are arranged in a matrix in the first direction X and the second direction Y.
  • One or more light emitting elements 2 are provided in each of the plurality of segment regions SA. In the first embodiment, four (2 ⁇ 2) light emitting elements 2 are provided in each segment region SA.
  • the number of light emitting elements 2 formed in the segment region SA can be n ⁇ m (n> 1, m> 1).
  • the plurality of light emitting elements 2 are arranged in the first direction X at the first pitch p1 and in the second direction Y at the second pitch p2.
  • the plurality of light emitting elements 2 are arranged at equal pitches in the first direction X and at equal pitches in the second direction Y.
  • the first pitch p1 and the second pitch p2 are 1 mm, respectively.
  • the four light emitting elements 2 provided in each segment region SA are connected in series.
  • the light emitting elements 2 provided in the segment regions SA different from each other are electrically insulated from each other.
  • FIG. 10 is a cross-sectional view showing the illumination device IL along the line XX of FIG.
  • FIG. 10 shows the support substrate 90, the two wiring board pieces 10, the two light emitting elements 2, and the protective layer 5 in the lighting device IL.
  • the support substrate 90 faces the second main surface SU2 on the side opposite to the first main surface SU1 of each wiring board piece 10.
  • Each wiring board piece 10 is physically fixed to the support board 90 and electrically connected to the support board 90.
  • the wiring board pieces 10 are arranged in the second direction Y without any gaps. It is desirable that the first main surface SU1 of the plurality of wiring board pieces 10 is located on the same plane.
  • the plurality of light emitting elements 2 are mounted on the first main surface SU1 of each wiring board piece 10.
  • the second embodiment is also different from the first embodiment in that the lighting device IL includes a plurality of protective layers.
  • the illuminating device IL further includes a plurality of protective layers 5a provided physically independently of each other, instead of the protective layer 5 integrally formed.
  • Each protective layer 5a is located between the first main surface SU1 of one wiring board piece 10 and the wavelength conversion unit (9).
  • Each protective layer 5a is provided on a plurality of light emitting elements 2 mounted on the first main surface SU1 and the first main surface SU1.
  • Each protective layer 5a is not provided on the other first main surface SU1 and the plurality of light emitting elements 2 mounted on the other first main surface SU1.
  • Each protective layer 5a is configured to protect a plurality of light emitting elements 2 mounted on the first main surface SU1.
  • Each protective layer 5a is located in all segment regions SA of the corresponding wiring board piece 10.
  • Each protective layer 5a is configured as the above-mentioned light transmitting layer, wavelength conversion layer, or photosynthetic layer.
  • the support substrate 90, the wiring substrate 1, the plurality of light emitting elements 2, and the plurality of protective layers 5a form the light source 8 together with the drive unit (4).
  • the display device DSP includes a display panel PNL and a lighting device IL as an electronic device.
  • the lighting device IL includes a plurality of wiring board pieces 10, a plurality of light emitting elements 2, a drive unit 4, and the like.
  • the light emitting element 2 is dispersedly mounted on a plurality of wiring board pieces 10.
  • the lighting device IL When assembling the lighting device IL into a module, it can be assembled using only a good wiring board piece 10. It is possible to use the wiring board piece 10 on which only the light emitting element 2 that lights well is mounted, and it is possible to avoid the use of the wiring board piece 10 on which the defective light emitting element 2 is mounted. Therefore, in the second embodiment, it is possible to obtain a lighting device IL that can be easily repaired as compared with the first embodiment and a display device DSP provided with the lighting device IL.
  • the above repair can be easily performed even after the light emitting element 2 is protected by the protective layer 5a. Further, even after the light emitting element 2 is protected by the protective layer 5a, the defective wiring board piece 10 can be replaced with a good wiring board piece 10 in units of the wiring board pieces 10. Therefore, the loss can be kept low as compared with the case where the wiring board 1 is replaced in units.
  • the plurality of wiring board pieces 10 may extend in the second direction Y, be arranged in the first direction X, and be arranged in a so-called vertical stripe shape.
  • the wiring board 1 is composed of six wiring board pieces 10.
  • the plurality of wiring board pieces 10 may be arranged in a matrix in the first direction X and the second direction Y.
  • the wiring board 1 is composed of four wiring board pieces 10.
  • the number of the wiring board pieces 10 (the number of dividing the wiring board 1) is not limited to the above 8 pieces, the above 6 pieces, and the above 4 pieces, respectively, and can be variously changed. As the number of the wiring board pieces 10 (the number of dividing the wiring board 1) is increased, for example, the number of light emitting elements 2 to be discarded can be reduced, and the loss can be suppressed low. Alternatively, as the number of the wiring board pieces 10 (the number of dividing the wiring board 1) is reduced, the arrangement of the wiring board pieces 10 and the electrical connection to the wiring board pieces 10 become simpler.
  • the lighting device IL may have the protective layer 5 integrally formed instead of the plurality of protective layers 5a.
  • the illuminating device IL may be configured without the protective layer 5 or the plurality of protective layers 5a. In other words, the light emitting element 2 does not have to be protected by the protective layer 5 or the protective layer 5a.
  • the illuminating device IL may be formed without the wavelength conversion unit 9.
  • the protective layer 5 functions as a wavelength conversion element, and the protective layer 5 alone converts the light emitted by the light emitting element 2 into light having a desired hue.
  • the amount of the wavelength conversion unit 9 it is possible to contribute to the thinning of the lighting device IL.
  • the wiring board piece 10 may have a terminal exposed to the outside from the second main surface SU2.
  • the wiring board piece 10 may be electrically connected to the support board 90 by using the terminal on the SU2 side of the second main surface.
  • the support substrate 90 may be composed of a substrate having no wiring.
  • the drive unit 4 may be electrically connected to the wiring board piece 10 (light emitting element 2) by using wiring independent of the support board 90.
  • the plurality of wiring board pieces 10 may be arranged so as to be adjacent to each other, and the lighting device IL may be configured without the support board 90.
  • the plurality of segment regions SA do not have to be arranged in a matrix, and may be located adjacent to each other.
  • the size and shape of the segment region SA is not limited to the above example.
  • the first pitch p1 and the second pitch p2 do not have to be the same (p1 ⁇ p2). Further, the first pitch p1 and the second pitch p2 may each have a length other than 1 mm.
  • the plurality of light emitting elements 2 do not have to be arranged in a matrix, and may be arranged in a predetermined pattern.
  • One, two, three, or five or more light emitting elements 2 may be provided in each segment region SA.
  • the four light emitting elements 2 provided in each segment region SA do not have to be connected in series.
  • the light emitting elements 2 provided in the segment regions SA different from each other may be electrically connected to each other.
  • the drive unit 4 does not have to be configured to independently drive a plurality of light emitting elements 2 in units of segment regions SA via the wiring board 1.
  • the drive unit 4 may turn on or off all the light emitting elements 2 at once. In that case, the number of control wirings included in each wiring board piece 10 can be reduced.
  • the embodiments and modifications of the present invention are not limited to the above-mentioned lighting device IL and display device DSP, and are applied to various electronic devices and display devices provided with any one of a plurality of electronic devices. It is possible.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Planar Illumination Modules (AREA)
  • Liquid Crystal (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

La présente invention concerne un équipement électronique dans lequel il est possible d'effectuer facilement des réparations, et un dispositif d'affichage pourvu d'un équipement électronique.　L'équipement électronique est pourvu d'une pluralité de pièces de carte de câblage et d'une pluralité d'éléments électroluminescents. Chacune de la pluralité de pièces de carte de câblage a une paire de côtés longs qui se font face. La pluralité de pièces de carte de câblage sont agencées sous forme d'une rangée de telle sorte que les côtés longs de deux pièces de carte de câblage adjacentes se font face l'une à l'autre.
PCT/JP2020/015574 2019-06-18 2020-04-06 Équipement électronique et dispositif d'affichage WO2020255535A1 (fr)

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JP2019112847A JP2020205183A (ja) 2019-06-18 2019-06-18 電子機器及び表示装置
JP2019-112847 2019-06-18

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WO2020255535A1 true WO2020255535A1 (fr) 2020-12-24

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WO2024093814A1 (fr) * 2022-11-02 2024-05-10 华为技术有限公司 Dispositif d'affichage et appareil électronique

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JP2022154597A (ja) 2021-03-30 2022-10-13 株式会社ジャパンディスプレイ 照明装置および表示装置
JP7384430B2 (ja) * 2021-06-24 2023-11-21 エイテックス株式会社 Ｌｅｄ照明装置
JP2023028364A (ja) 2021-08-19 2023-03-03 株式会社ジャパンディスプレイ 照明装置

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JP2007323857A (ja) * 2006-05-30 2007-12-13 Sony Corp バックライト装置及びカラー画像表示装置
WO2012039348A1 (fr) * 2010-09-24 2012-03-29 シャープ株式会社 Dispositif d'éclairage, dispositif d'affichage, et dispositif de réception de télévision
JP2014206641A (ja) * 2013-04-12 2014-10-30 船井電機株式会社 表示装置およびバックライト
WO2018212070A1 (fr) * 2017-05-19 2018-11-22 富士フイルム株式会社 Unité de rétroéclairage et dispositif d'affichage à cristaux liquides
JP2019086768A (ja) * 2017-11-07 2019-06-06 聚積科技股▲ふん▼有限公司 ディスプレイ用の二重の表示光源装置及び二重の表示画像の生成方法

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JP2007323857A (ja) * 2006-05-30 2007-12-13 Sony Corp バックライト装置及びカラー画像表示装置
WO2012039348A1 (fr) * 2010-09-24 2012-03-29 シャープ株式会社 Dispositif d'éclairage, dispositif d'affichage, et dispositif de réception de télévision
JP2014206641A (ja) * 2013-04-12 2014-10-30 船井電機株式会社 表示装置およびバックライト
WO2018212070A1 (fr) * 2017-05-19 2018-11-22 富士フイルム株式会社 Unité de rétroéclairage et dispositif d'affichage à cristaux liquides
JP2019086768A (ja) * 2017-11-07 2019-06-06 聚積科技股▲ふん▼有限公司 ディスプレイ用の二重の表示光源装置及び二重の表示画像の生成方法

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Publication number Priority date Publication date Assignee Title
WO2024093814A1 (fr) * 2022-11-02 2024-05-10 华为技术有限公司 Dispositif d'affichage et appareil électronique

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