WO2020255535A1

WO2020255535A1 - Electronic equipment and display device

Info

Publication number: WO2020255535A1
Application number: PCT/JP2020/015574
Authority: WO
Inventors: 隆大田
Original assignee: 株式会社ジャパンディスプレイ
Priority date: 2019-06-18
Filing date: 2020-04-06
Publication date: 2020-12-24
Also published as: JP2020205183A

Abstract

The present invention provides electronic equipment in which it is possible to perform repairs easily, and a display device provided with electronic equipment.　The electronic equipment is provided with a plurality of wiring board pieces and a plurality of light-emitting elements. Each of the plurality of wiring board pieces has a pair of long sides that face each other. The plurality of wiring board pieces are arranged in a row such that the long sides of two adjacent wiring board pieces face each other.

Description

Electronic devices and display devices

Embodiments of the present invention relate to electronic devices and display devices.

Generally, electronic devices used for various types of lighting are known. For example, an electronic device that illuminates a liquid crystal display panel is known.

In an electronic device for lighting in which a plurality of LEDs (light emitting diodes) are arranged two-dimensionally, it is required that all the LEDs have no defects. If the LED is defective, the LED will be in a non-lighting state, and a blind point region or an region where the brightness level is undesirably low will occur.

Japanese Unexamined Patent Publication No. 2008-96765

The present embodiment provides a display device including an electronic device and an electronic device for lighting that can be easily repaired.

The electronic device according to the embodiment
It has a plurality of wiring board pieces and a plurality of light emitting elements mounted on the first main surfaces of the plurality of wiring board pieces, and each of the plurality of wiring board pieces has a pair of long sides facing each other. The plurality of wiring board pieces are arranged so that the long sides of the two adjacent wiring board pieces face each other.

Moreover, the display device according to one embodiment is
A display panel and an electronic device for illuminating the display panel are provided, and the electronic device includes a plurality of wiring board pieces and a plurality of light emitting elements mounted on the first main surfaces of the plurality of wiring board pieces. Each of the plurality of wiring board pieces has a pair of long sides facing each other, and the plurality of wiring board pieces have the long sides of two adjacent wiring board pieces facing each other. They are arranged like this.

FIG. 1 is a block diagram showing a display device according to an embodiment. FIG. 2 is a diagram showing a basic configuration and an equivalent circuit of the display panel shown in FIG. FIG. 3 is an exploded perspective view showing the lighting device according to the first embodiment of the above embodiment. FIG. 4 is a plan view showing a part of the lighting device according to the first embodiment. FIG. 5 is an enlarged plan view showing a part of the lighting device shown in FIG. FIG. 6 is a cross-sectional view showing the lighting device along the line VI-VI of FIG. FIG. 7 is a cross-sectional view showing the light emitting element along the line VII-VII of FIG. FIG. 8 is a plan view showing a part of the lighting device according to the second embodiment of the above embodiment. FIG. 9 is an enlarged plan view showing a part of the lighting device shown in FIG. FIG. 10 is a cross-sectional view showing the lighting device along the line XX of FIG. FIG. 11 is a plan view showing a part of the lighting device according to the first modification of the above embodiment. FIG. 12 is a plan view showing a part of the lighting device according to the second modification of the above embodiment. FIG. 13 is a cross-sectional view showing a part of the lighting device according to the third modification of the above embodiment. FIG. 14 is an exploded perspective view showing the lighting device according to the modified example 4 of the above embodiment.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. It should be noted that the disclosure is merely an example, and those skilled in the art can easily conceive of appropriate changes while maintaining the gist of the invention are naturally included in the scope of the present invention. Further, in order to clarify the explanation, the drawings may schematically represent the width, thickness, shape, etc. of each part as compared with the actual embodiment, but this is just an example, and the interpretation of the present invention is used. It is not limited. Further, in this specification and each figure, the same elements as those described above with respect to the above-mentioned figures may be designated by the same reference numerals, and detailed description thereof may be omitted as appropriate.

FIG. 1 is a block diagram showing a display device DSP according to an embodiment. FIG. 1 shows a three-dimensional space defined by a first direction X, a second direction Y perpendicular to the first direction X, and a third direction Z perpendicular to each of the first direction X and the second direction Y. ing. The first direction X and the second direction Y are orthogonal to each other, but may intersect at an angle other than 90 °. Further, in the present embodiment, the third direction Z is defined as upper, and the direction opposite to the third direction Z is defined as lower. In the case of "the second member above the first member" and "the second member below the first member", the second member may be in contact with the first member and is located away from the first member. You may be. Further, it is assumed that there is an observation position for observing the display device DSP on the tip side of the arrow in the third direction Z, and from this observation position toward the XY plane defined by the first direction X and the second direction Y. Seeing is called plan view.

As shown in FIG. 1, the display device DSP includes a display panel PNL and a lighting device IL as an electronic device for lighting. In the present embodiment, the display panel PNL has a display area DA for displaying an image. The display panel PNL is a generally known transmissive or transflective liquid crystal display panel. However, the display panel PNL is not limited to the liquid crystal display panel, and may be a display panel that requires a separate light source, such as a MEMS (Micro Electro-Mechanical System) display panel.

The lighting device IL is arranged facing the display panel PNL in the third direction Z. The illuminating device IL is configured to emit light toward the display panel PNL to illuminate the display panel PNL. In the present embodiment, the lighting device IL functions as a backlight unit. The illuminating device IL is configured to illuminate at least the entire display area DA of the display panel PNL. For example, the illumination device IL has a light emitting region LA facing the entire display region DA and the third direction Z. The display panel PNL is configured to display an image by selectively transmitting light from the lighting device IL.

FIG. 2 is a diagram showing a basic configuration and an equivalent circuit of the display panel PNL shown in FIG.
As shown in FIG. 2, the display panel PNL includes a plurality of sub-pixels SP in the display area DA. The plurality of sub-pixels SP are arranged in a matrix in the first direction X and the second direction Y. The plurality of sub-pixel SPs constitute one pixel. In the present embodiment, the three sub-pixels SP adjacent to each other in the first direction X constitute one pixel. Further, the display panel PNL includes a plurality of scanning lines G, a plurality of signal lines S, a common electrode CE, and the like in the display area DA. The plurality of scanning lines G extend in the first direction X and are arranged at intervals in the second direction Y. The plurality of signal lines S extend in the second direction Y and are arranged at intervals in the first direction X. The scanning line G and the signal line S do not necessarily extend linearly, and a part of them may be bent. The common electrode CE is arranged over a plurality of sub-pixel SPs and is shared by the plurality of sub-pixel SPs.

The scanning line G is connected to the scanning line drive circuit GD. The signal line S is connected to the signal line drive circuit SD. The common electrode CE is connected to the common electrode drive circuit CD. The signal line drive circuit SD, the scanning line drive circuit GD, and the common electrode drive circuit CD are located in a non-display area NDA other than the display area DA.

Each sub-pixel SP includes a switching element SW, a pixel electrode PE, a common electrode CE, a liquid crystal layer LC, and the like. The switching element SW is composed of, for example, a thin film transistor (TFT), and is electrically connected to the scanning line G and the signal line S. The pixel electrode PE is electrically connected to the switching element SW. Each of the pixel electrode PEs faces the common electrode CE, and the liquid crystal layer LC is driven by the electric field generated between the pixel electrode PE and the common electrode CE. The holding capacitance CS is formed between, for example, an electrode having the same potential as the common electrode CE and an electrode having the same potential as the pixel electrode PE.

(Example 1)
Next, the lighting device IL according to the first embodiment of the present embodiment will be described. FIG. 3 is an exploded perspective view showing the lighting device IL according to the first embodiment.

As shown in FIG. 3, the lighting device IL includes a wiring board 1, a plurality of light emitting elements 2, a driving unit 4, a protective layer 5, a light diffusing unit 6, a brightness improving unit 7, and a wavelength conversion unit 9. And have. The wiring board 1, the plurality of light emitting elements 2, the protective layer 5, the wavelength conversion unit 9, the light diffusion unit 6, and the brightness improving unit 7 are laminated in the third direction Z without any gap.

The wiring board 1 is a printed circuit board. In the present embodiment, the wiring board 1 is composed of a flexible printed circuit board (FPC). The flexible printed circuit board has flexibility. Therefore, for example, when the display panel PNL is curved, the lighting device IL can easily follow the shape of the curved display panel PNL.
However, the wiring board 1 is not limited to the flexible printed circuit board, and may be composed of a printed circuit board (PCB). Since the printed circuit board has higher rigidity than the flexible printed circuit board, it is easy to mount the light emitting element 2 on the wiring board 1.
The wiring board 1 has a light emitting region LA.

The plurality of light emitting elements 2 are mounted on the first main surface SU1 of the wiring board 1. In the present embodiment, the light emitting element 2 is a mini LED (mini light emitting diode). On the outside of the light emitting region LA, the drive unit 4 is mounted on the first main surface SU1. The drive unit 4 is configured to drive a plurality of light emitting elements 2 via the wiring board 1.

The light emitting element 2 outputs light having a specific wavelength, and the wavelength conversion unit 9 converts the wavelength of the light emitted from the light emitting element 2 and outputs it. The wavelength conversion unit 9 as a wavelength conversion element is located between the protective layer 5 and the light diffusion unit 6. The wavelength conversion unit 9 includes, for example, quantum dots as a light emitting material, absorbs incident light such as light emitted by the light emitting element 2, and can emit light having a wavelength longer than the wavelength of the absorbed light. .. For example, the light emitting element 2 is a blue LED having a main emission peak wavelength of 500 nm or less, and the wavelength conversion unit 9 is a phosphor that absorbs the light emitted from the light emitting element 2 and emits light having a wavelength of 500 nm or more.

The light diffusing unit 6 is located above the plurality of light emitting elements 2. The light diffusing unit 6 is configured to diffuse and emit the light emitted by the light emitting element 2. In the present embodiment, the light diffusing portion 6 is a light diffusing film formed by laminating five light diffusing sheets 6a. However, the light diffusing portion 6 (light diffusing film) may be composed of one light diffusing sheet 6a, or may be formed by laminating four or less or six or more light diffusing sheets 6a.

The protective layer 5 is located between the first main surface SU1 and the wavelength conversion unit 9.

The brightness improving unit 7 is located above the light diffusing unit 6. The brightness improving unit 7 is configured to collect and emit the light incident from the light diffusing unit 6 in the third direction Z. In the present embodiment, the brightness improving unit 7 is composed of two refracting prism sheets 7a arranged orthogonally. However, the brightness improving unit 7 may be composed of a total reflection type prism sheet instead of the refraction type prism sheet 7a. The total reflection type prism sheet has the features that it has a simple structure and is excellent in light utilization efficiency and vertical condensing property.

FIG. 4 is a plan view showing a part of the lighting device IL according to the first embodiment. FIG. 4 shows the wiring board 1 and the drive unit 4 of the lighting device IL.
As shown in FIG. 4, unlike the second embodiment described later, the wiring board 1 of the first embodiment is not divided into a plurality of wiring board pieces. The light emitting region LA has a plurality of segment regions SA. In the first embodiment, the plurality of segment regions SA are arranged in a matrix in the first direction X and the second direction Y. In one example, 30 segment regions SA are arranged in the first direction X and 32 are arranged in the second direction Y. In FIG. 4, a plurality of segment regions SA are shown surrounded by broken lines. It should be noted that each segment region SA is driven independently.

FIG. 5 is an enlarged plan view showing a part of the lighting device IL shown in FIG. FIG. 5 shows the wiring board 1 and the plurality of light emitting elements 2 of the lighting device IL.
As shown in FIG. 5, the segment region SA is a square having a side of 2 mm. The plurality of segment regions SA are arranged in a matrix in the first direction X and the second direction Y intersecting each other, arranged at equal pitches in the first direction X, and arranged at equal pitches in the second direction Y. The plurality of light emitting elements 2 are arranged in a matrix in the first direction X and the second direction Y. One or more light emitting elements 2 are provided in each of the plurality of segment regions SA. In the first embodiment, four (2 × 2) light emitting elements 2 are provided in each segment region SA. The number of light emitting elements 2 formed in the segment region SA can be n × m (n> 1, m> 1).

The plurality of light emitting elements 2 are arranged in the first direction X at the first pitch p1 and in the second direction Y at the second pitch p2. The first pitch p1 referred to here is a linear distance in the first direction X from the geometric center of one light emitting element 2 to the geometric center of another light emitting element 2 adjacent to the first direction X. To tell. Further, the second pitch p2 refers to a linear distance in the second direction Y from the geometric center of one light emitting element 2 to the geometric center of another light emitting element 2 adjacent to the second direction Y. .. In the first embodiment, the plurality of light emitting elements 2 are arranged at equal pitches in the first direction X and at equal pitches in the second direction Y. Further, the first pitch p1 and the second pitch p2 are the same (p1 = p2). In the first embodiment, the first pitch p1 and the second pitch p2 are 1 mm, respectively.

The four light emitting elements 2 provided in each segment region SA are connected in series. The light emitting elements 2 provided in the segment regions SA different from each other are electrically insulated from each other.

In a plan view, the light emitting element 2 has a rectangular shape. However, the shape of the light emitting element 2 may have a shape other than a rectangle such as a square. In a plan view, the length of one side of the light emitting element 2 which is a mini LED is, for example, more than 100 μm and less than 300 μm. The length of one side of the light emitting element 2 which is a mini LED may exceed 100 μm and may be 200 μm or less.

The light emitting element 2 may be a micro LED having the longest side length of 100 μm or less as an LED having a size smaller than that of the mini LED. Alternatively, the light emitting element 2 may be an LED having the longest side length of 1 mm or less. Alternatively, the light emitting element 2 may be an LED having a longest side length of 1000 μm or more as a general LED having a size larger than that of the mini LED. The length of one side of the light emitting element 2 which is the general LED is, for example, 300 μm or more and 350 μm or less.

The wiring board 1 has a plurality of control wirings connected to the drive unit 4. In the light emission region LA, the plurality of control wirings are 32 control wirings extending in the first direction X and arranged in the second direction Y and arranging in the first direction X extending in the second direction Y. Includes 30 control wires. The drive unit 4 can drive a plurality of light emitting elements 2 in an active matrix via the plurality of control wirings. Therefore, the drive unit 4 is configured to independently drive a plurality of light emitting elements 2 in units of segment regions SA via the wiring board 1. For example, the drive unit 4 can drive a plurality of light emitting elements 2 by a method called local dimming. This makes it possible to further increase the contrast ratio.

FIG. 6 is a cross-sectional view showing a lighting device IL along the line VI-VI of FIG. FIG. 6 shows a wiring board 1, a plurality of light emitting elements 2, and a protective layer 5 in the lighting device IL.
As shown in FIG. 6, the protective layer 5 is provided on the first main surface SU1 and the plurality of light emitting elements 2, and is in contact with the first main surface SU1 and the plurality of light emitting elements 2. The protective layer 5 is configured to protect a plurality of light emitting elements 2. The protective layer 5 is located at least in the light emitting region (LA). The wiring board 1, the plurality of light emitting elements 2, and the protective layer 5 together with the driving unit (4) constitute a light source 8.

The light emitting element 2 is mounted on the wiring board 1 by a method called flip chip bonding. In flip-chip bonding, a bare chip cut out from a substrate and not packaged is connected to a wiring board 1 with a conductive material CM such as solder, gold, or an anisotropic conductive film. In the figure, 210 is a light-transmitting substrate as a base material, and the light emitting element 2 has

pads

230 and 240 on a surface (bottom surface 220) of the substrate 210 facing the wiring substrate 1. As will be described later, the light emitting element 2 has two

pads

230 and 240. In the

pads

230 and 240, one is connected to the anode of the light emitting diode from the bottom surface 220 side, and the other is connected to the cathode from the bottom surface 220 side.

A connection electrode 1e is formed on the wiring board 1 with copper foil or the like. The connection electrode 1e forms a part of the first main surface SU1. The substrate 210 has a surface (top surface) 250 facing the bottom surface 220, and in flip-chip bonding, the surface 250 of the light emitting element 2 is heated and pressed. By heating and pressing from the surface 250, the

pads

230 and 240 are connected to the connection electrode 1e via a conductive material CM such as solder, gold, or an anisotropic conductive film.

Since the surface 250 of the substrate 210 is heated and pressed, it is difficult to provide a fluorescent substance or the like on the surface 250. Therefore, after the light emitting element 2 is mounted on the wiring board 1, the wavelength conversion unit 9 is formed separately from the light emitting element 2. Further, unlike wire bonding, the connection portion is not formed on the surface 250 of the substrate 210, and the wiring can be shortened. In wire bonding, the surface is connected to the wiring board with a wire, so the length is longer than the thickness of the board 210. In flip chip bonding, the wiring length is the distance from the bottom surface 220 of the board 210 to the wiring board 1. It becomes.

In the first embodiment, the protective layer 5 is configured as a light transmitting layer that transmits the wavelength of the light emitted by the light emitting element 2. The protective layer 5 is made of, for example, a silicone resin. The protective layer 5 is configured to transmit the light without converting the wavelength of the light emitted by the light emitting element 2 into another wavelength. In that case, the wavelength of the light transmitted through the protective layer 5 is converted to another wavelength by the wavelength conversion unit 9.

However, the configuration of the protective layer 5 is not limited to the above example.
For example, the protective layer 5 may be configured as a wavelength conversion layer that converts the wavelength of the light emitted by the light emitting element 2. The protective layer 5 contains, for example, quantum dots as a light emitting material, can absorb the light emitted by the light emitting element 2, and can emit light having a wavelength longer than the wavelength of the absorbed light. In this case as well, the light source 8 can emit light having a desired hue. In one example, the light emitting element 2 emits blue light, and the quantum dots of the protective layer 5 and the wavelength conversion unit 9 emit yellow light, which is a complementary color of blue, so that the lighting device IL emits blue light and the protective layer 5 and White light, which is a composite light of yellow light whose wavelength has been converted by the wavelength conversion unit 9, can be emitted.

Alternatively, the protective layer 5 may be configured as a photosynthetic layer in which a plurality of phosphors are dispersed in a light transmitting layer. The light transmitting layer is configured to transmit the wavelength of the light emitted by the light emitting element 2, and is made of, for example, a silicon resin. The plurality of phosphors absorb the light emitted by the light emitting element 2 and emit light having a different wavelength. In this case as well, the light source 8 can emit light having a desired hue. For example, the light emitting element 2 emits blue light, and the phosphor of the protective layer 5 and the quantum dots of the wavelength conversion unit 9 emit yellow light, so that the illuminating device IL can emit white synthetic light.

In the first embodiment, the height h1 of the light emitting element 2 is 80 μm, and the thickness T of the protective layer 5 is 0.3 mm. The lighting device IL of the first embodiment is configured as described above.

Here, an example of the structure of the light emitting element 2 will be described. FIG. 7 is a cross-sectional view showing the light emitting element 2 along the line VII-VII of FIG.
As shown in FIG. 7, the light emitting element 2 is a flip chip type light emitting diode element. The light emitting element 2 includes a transparent substrate 210 having an insulating property. The substrate 210 is, for example, a sapphire substrate. A crystal layer (semiconductor layer) in which an n-type semiconductor layer 12, an active layer (light emitting layer) 13, and a p-type semiconductor layer 14 are laminated in this order is formed on the bottom surface 220 of the substrate 210. In the crystal layer (semiconductor layer), the region containing P-type impurities is the p-type semiconductor layer 14, and the region containing N-type impurities is the n-type semiconductor layer 12. The material of the crystal layer (semiconductor layer) is not particularly limited, but the crystal layer (semiconductor layer) may contain gallium nitride (GaN) or gallium arsenide (GaAs).

The light reflecting film 15 is formed of a conductive material and is electrically connected to the p-type semiconductor layer 14. The p electrode 16 is electrically connected to the light reflecting film 15. The n-electrode 18 is electrically connected to the n-type semiconductor layer 12. The pad 230 covers the n-electrode 18 and is electrically connected to the n-electrode 18. The protective layer 17 covers the n-type semiconductor layer 12, the active layer 13, the p-type semiconductor layer 14, and the light-reflecting film 15, and covers a part of the p-electrode 16. The pad 240 covers the p-electrode 16 and is electrically connected to the p-electrode 16.

(Example 2)
Next, the lighting device IL according to the second embodiment of the present embodiment will be described. FIG. 8 is a plan view showing a part of the lighting device IL according to the second embodiment.
As shown in FIG. 8, in the second embodiment, the lighting device IL further includes the support board 90, and the wiring board 1 is composed of a plurality of wiring board pieces 10. Is different from.

The wiring board 1 of the second embodiment is composed of eight wiring board pieces 10. Each wiring board piece 10 has a pair of long side LSs facing in the second direction Y. The plurality of wiring board pieces 10 are located physically independently of each other and are arranged so as to be adjacent to each other. The plurality of wiring board pieces 10 are arranged in a stripe shape. In the second embodiment, the plurality of wiring board pieces 10 extend in the first direction X, are arranged in the second direction Y, and are arranged in a so-called horizontal stripe shape. In the two wiring board pieces 10 adjacent to each other in the second direction Y, the long side LSs face each other.

Each wiring board piece 10 has a plurality of segment regions SA. In the second embodiment, the plurality of segment regions SA are arranged in a matrix in the first direction X and the second direction Y. In one example, 30 segment regions SA of each wiring board piece 10 are arranged in the first direction X and 4 in the second direction Y. Looking at the unit of the wiring board 1, 30 pieces of the plurality of segment regions SA are arranged in the first direction X, and 32 pieces are arranged in the second direction Y. The plurality of segment regions SA of the plurality of wiring board pieces 10 form a light emission region LA.

A plurality of wiring board pieces 10 are physically fixed to the support board 90. The support board 90 may be configured to support a plurality of wiring board pieces 10, and may be composed of, for example, a flexible printed circuit board (FPC) or a printed circuit board (PCB). When the support board 90 is composed of a printed circuit board, it is easier to fix the wiring board piece 10 to the support board 90.

The drive unit 4 is mounted on the support board 90. In the second embodiment, the support substrate 90 is composed of a printed circuit board. The drive unit 4 is electrically connected to the plurality of wiring board pieces 10 via the wiring of the support board 90.

Each wiring board piece 10 has a plurality of control wirings connected to the drive unit 4 via the support board 90. Each wiring board piece 10 has four control wirings extending in the first direction X, shared by a plurality of segment regions SA arranged in the first direction X, and arranged in the second direction Y, and a second direction Y. It includes 30 control wirings that are shared by a plurality of segment regions SA that extend in the second direction Y and are arranged in the first direction X. The control wiring is drawn out to the ends of the wiring board piece 10 (here, the left and right ends of the wiring board piece 10) and is electrically connected to the support board 90.

Also in the second embodiment, the drive unit 4 can actively drive a plurality of light emitting elements 2 via the support substrate 90 and the plurality of wiring board pieces 10. Therefore, the drive unit 4 can independently drive the plurality of light emitting elements 2 in the segment region SA unit, and can drive the plurality of light emitting elements 2 by a method called local dimming, for example.

The light emitting element 2 is electrically connected to the drive unit 4 via the support board 90 without passing through another wiring board piece 10 from the wiring board piece 10 on which the light emitting element 2 is mounted. However, when the light emitting element 2 is electrically connected to the drive unit 4, the wiring board piece 10 on which the light emitting element 2 is mounted may be passed through another wiring board piece 10.

FIG. 9 is an enlarged plan view showing a part of the lighting device IL shown in FIG. FIG. 9 shows two wiring board pieces 10 and a plurality of light emitting elements 2 of the lighting device IL.
As shown in FIG. 9, the segment region SA is a square having a side of 2 mm. The plurality of segment regions SA of the plurality of wiring board pieces 10 are arranged in a matrix in the first direction X and the second direction Y, arranged at equal pitches in the first direction X, and arranged at equal pitches in the second direction Y. Has been done. The plurality of light emitting elements 2 are arranged in a matrix in the first direction X and the second direction Y. One or more light emitting elements 2 are provided in each of the plurality of segment regions SA. In the first embodiment, four (2 × 2) light emitting elements 2 are provided in each segment region SA. The number of light emitting elements 2 formed in the segment region SA can be n × m (n> 1, m> 1).

The plurality of light emitting elements 2 are arranged in the first direction X at the first pitch p1 and in the second direction Y at the second pitch p2. In the second embodiment, the plurality of light emitting elements 2 are arranged at equal pitches in the first direction X and at equal pitches in the second direction Y. Further, the first pitch p1 and the second pitch p2 are the same (p1 = p2). In the second embodiment, the first pitch p1 and the second pitch p2 are 1 mm, respectively.

FIG. 10 is a cross-sectional view showing the illumination device IL along the line XX of FIG. FIG. 10 shows the support substrate 90, the two wiring board pieces 10, the two light emitting elements 2, and the protective layer 5 in the lighting device IL.
As shown in FIG. 10, the support substrate 90 faces the second main surface SU2 on the side opposite to the first main surface SU1 of each wiring board piece 10. Each wiring board piece 10 is physically fixed to the support board 90 and electrically connected to the support board 90. The wiring board pieces 10 are arranged in the second direction Y without any gaps. It is desirable that the first main surface SU1 of the plurality of wiring board pieces 10 is located on the same plane. The plurality of light emitting elements 2 are mounted on the first main surface SU1 of each wiring board piece 10.

The second embodiment is also different from the first embodiment in that the lighting device IL includes a plurality of protective layers. The illuminating device IL further includes a plurality of protective layers 5a provided physically independently of each other, instead of the protective layer 5 integrally formed.
Each protective layer 5a is located between the first main surface SU1 of one wiring board piece 10 and the wavelength conversion unit (9). Each protective layer 5a is provided on a plurality of light emitting elements 2 mounted on the first main surface SU1 and the first main surface SU1. Each protective layer 5a is not provided on the other first main surface SU1 and the plurality of light emitting elements 2 mounted on the other first main surface SU1. Each protective layer 5a is configured to protect a plurality of light emitting elements 2 mounted on the first main surface SU1. Each protective layer 5a is located in all segment regions SA of the corresponding wiring board piece 10.

Each protective layer 5a is configured as the above-mentioned light transmitting layer, wavelength conversion layer, or photosynthetic layer. The support substrate 90, the wiring substrate 1, the plurality of light emitting elements 2, and the plurality of protective layers 5a form the light source 8 together with the drive unit (4).

According to the display device DSP according to the embodiment configured as described above, the display device DSP includes a display panel PNL and a lighting device IL as an electronic device. The lighting device IL includes a plurality of wiring board pieces 10, a plurality of light emitting elements 2, a drive unit 4, and the like.

In the second embodiment, the light emitting element 2 is dispersedly mounted on a plurality of wiring board pieces 10. When assembling the lighting device IL into a module, it can be assembled using only a good wiring board piece 10. It is possible to use the wiring board piece 10 on which only the light emitting element 2 that lights well is mounted, and it is possible to avoid the use of the wiring board piece 10 on which the defective light emitting element 2 is mounted. Therefore, in the second embodiment, it is possible to obtain a lighting device IL that can be easily repaired as compared with the first embodiment and a display device DSP provided with the lighting device IL.

For example, the above repair can be easily performed even after the light emitting element 2 is protected by the protective layer 5a. Further, even after the light emitting element 2 is protected by the protective layer 5a, the defective wiring board piece 10 can be replaced with a good wiring board piece 10 in units of the wiring board pieces 10. Therefore, the loss can be kept low as compared with the case where the wiring board 1 is replaced in units.

Although the embodiment of the present invention has been described, the above embodiment is presented as an example and is not intended to limit the scope of the invention. The above-mentioned novel embodiment can be implemented in various other embodiments, and various omissions, replacements, and changes can be made without departing from the gist of the invention. The above-described embodiments and modifications thereof are included in the scope and gist of the invention, and are also included in the scope of the invention described in the claims and the equivalent scope thereof.

For example, as shown in FIG. 11, the plurality of wiring board pieces 10 may extend in the second direction Y, be arranged in the first direction X, and be arranged in a so-called vertical stripe shape. In the example shown in FIG. 11, the wiring board 1 is composed of six wiring board pieces 10.
Alternatively, as shown in FIG. 12, the plurality of wiring board pieces 10 may be arranged in a matrix in the first direction X and the second direction Y. In the example shown in FIG. 12, the wiring board 1 is composed of four wiring board pieces 10.

The number of the wiring board pieces 10 (the number of dividing the wiring board 1) is not limited to the above 8 pieces, the above 6 pieces, and the above 4 pieces, respectively, and can be variously changed. As the number of the wiring board pieces 10 (the number of dividing the wiring board 1) is increased, for example, the number of light emitting elements 2 to be discarded can be reduced, and the loss can be suppressed low. Alternatively, as the number of the wiring board pieces 10 (the number of dividing the wiring board 1) is reduced, the arrangement of the wiring board pieces 10 and the electrical connection to the wiring board pieces 10 become simpler.

As shown in FIG. 13, the lighting device IL may have the protective layer 5 integrally formed instead of the plurality of protective layers 5a. Alternatively, unlike the examples shown in FIGS. 10 and 13, the illuminating device IL may be configured without the protective layer 5 or the plurality of protective layers 5a. In other words, the light emitting element 2 does not have to be protected by the protective layer 5 or the protective layer 5a.

As shown in FIG. 14, the illuminating device IL may be formed without the wavelength conversion unit 9. In that case, the protective layer 5 functions as a wavelength conversion element, and the protective layer 5 alone converts the light emitted by the light emitting element 2 into light having a desired hue. By the amount of the wavelength conversion unit 9, it is possible to contribute to the thinning of the lighting device IL.

The wiring board piece 10 may have a terminal exposed to the outside from the second main surface SU2. The wiring board piece 10 may be electrically connected to the support board 90 by using the terminal on the SU2 side of the second main surface.

Alternatively, the support substrate 90 may be composed of a substrate having no wiring. In this case, the drive unit 4 may be electrically connected to the wiring board piece 10 (light emitting element 2) by using wiring independent of the support board 90.
Alternatively, the plurality of wiring board pieces 10 may be arranged so as to be adjacent to each other, and the lighting device IL may be configured without the support board 90.

The plurality of segment regions SA do not have to be arranged in a matrix, and may be located adjacent to each other. The size and shape of the segment region SA is not limited to the above example.
The first pitch p1 and the second pitch p2 do not have to be the same (p1 ≠ p2). Further, the first pitch p1 and the second pitch p2 may each have a length other than 1 mm.

The plurality of light emitting elements 2 do not have to be arranged in a matrix, and may be arranged in a predetermined pattern. One, two, three, or five or more light emitting elements 2 may be provided in each segment region SA. The four light emitting elements 2 provided in each segment region SA do not have to be connected in series. The light emitting elements 2 provided in the segment regions SA different from each other may be electrically connected to each other.

The drive unit 4 does not have to be configured to independently drive a plurality of light emitting elements 2 in units of segment regions SA via the wiring board 1. For example, the drive unit 4 may turn on or off all the light emitting elements 2 at once. In that case, the number of control wirings included in each wiring board piece 10 can be reduced.

The embodiments and modifications of the present invention are not limited to the above-mentioned lighting device IL and display device DSP, and are applied to various electronic devices and display devices provided with any one of a plurality of electronic devices. It is possible.

Claims

With multiple wiring board pieces,
A plurality of light emitting elements mounted on the first main surface of each of the plurality of wiring board pieces, and
Have,
Each of the plurality of wiring board pieces has a pair of long sides facing each other.
An electronic device in which the plurality of wiring board pieces are arranged so that the long sides of two adjacent wiring board pieces face each other.
Each of the wiring board pieces has a plurality of segment regions composed of n × m of the light emitting elements.
n> 1
m> 1.
The electronic device according to claim 1.
A plurality of the light emitting elements connected in series are provided in each of the segment regions.
The electronic device according to claim 2.
The electronic device according to claim 3, which is driven independently for each segment area.
The electronic device according to claim 2, which is driven independently for each segment area.
The electronic device according to claim 1, wherein the plurality of wiring board pieces are arranged in a stripe shape.
The plurality of segment regions of the plurality of wiring board pieces are arranged in a matrix in the first direction and the second direction intersecting each other, arranged at equal pitches in the first direction, and at equal pitches in the second direction. The electronic device according to claim 1, which is arranged side by side.
The electronic device according to claim 1, wherein the light emitting element is a mini light emitting diode.
The electron according to claim 1, further comprising a support substrate of each wiring board piece facing a second main surface opposite to the first main surface and to which the plurality of wiring board pieces are fixed. machine.
The electronic device according to claim 1, further comprising a light diffusing unit that is located above the plurality of light emitting elements and is configured to diffuse and emit the light emitted by the plurality of light emitting elements.
It also has multiple protective layers that are physically independent of each other.
Each of the protective layers is located between the first main surface of the wiring board piece and the light diffusing portion, and is mounted on the first main surface and the first main surface of the one. The first main surface is provided on the plurality of light emitting elements and is not provided on the other first main surface and the plurality of light emitting elements mounted on the other first main surface. To protect the plurality of light emitting elements mounted on the surface,
Each said protective layer
It is configured as a light transmitting layer that transmits the wavelength of light emitted by the light emitting element, or
It is configured as a wavelength conversion layer that converts the wavelength of the light emitted by the light emitting element, or
A light transmitting layer that transmits the wavelength of the light emitted by the light emitting element is configured as a photosynthetic layer in which a plurality of phosphors that absorb the light emitted by the light emitting element and emit light of another wavelength are dispersed. , The electronic device according to claim 10.
The electronic device according to claim 11, further comprising a brightness improving unit located above the light diffusing unit and configured to collect and emit light incident from the light diffusing unit.
The electronic device according to claim 10, further comprising a brightness improving unit located above the light diffusing unit and configured to collect and emit light incident from the light diffusing unit.
Display panel and
An electronic device that illuminates the display panel,
The electronic device is
With multiple wiring board pieces,
It has a plurality of light emitting elements mounted on the first main surface of each of the plurality of wiring board pieces.
Each of the plurality of wiring board pieces has a pair of long sides facing each other.
A display device in which the plurality of wiring board pieces are arranged so that the long sides of two adjacent wiring board pieces face each other.