WO2020232702A1 - 显示屏模组及其制作方法及电子设备 - Google Patents

显示屏模组及其制作方法及电子设备 Download PDF

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Publication number
WO2020232702A1
WO2020232702A1 PCT/CN2019/088155 CN2019088155W WO2020232702A1 WO 2020232702 A1 WO2020232702 A1 WO 2020232702A1 CN 2019088155 W CN2019088155 W CN 2019088155W WO 2020232702 A1 WO2020232702 A1 WO 2020232702A1
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WIPO (PCT)
Prior art keywords
layer
groove
display screen
screen module
pixel defining
Prior art date
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Ceased
Application number
PCT/CN2019/088155
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English (en)
French (fr)
Inventor
许志高
洪定洋
沈贺文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Royole Technologies Co Ltd
Original Assignee
Shenzhen Royole Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Shenzhen Royole Technologies Co Ltd filed Critical Shenzhen Royole Technologies Co Ltd
Priority to CN201980079785.7A priority Critical patent/CN113366646A/zh
Priority to PCT/CN2019/088155 priority patent/WO2020232702A1/zh
Publication of WO2020232702A1 publication Critical patent/WO2020232702A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • H10K59/80521—Cathodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers

Definitions

  • This application relates to the technical field of display screens, in particular to a display screen module, a manufacturing method thereof, and electronic equipment.
  • An embodiment of the present application provides a display screen module.
  • the display screen module includes a thin film transistor layer, a pixel defining layer, a light-emitting unit, and an encapsulation layer that are stacked, and the pixel defining layer includes an opening area and a non-opening area.
  • the pixel defining layer is provided with a groove in a non-opening area, the light-emitting unit corresponds to the opening area and is electrically connected to the thin film transistor layer, the encapsulation layer includes an organic layer, and part of the organic layer is embedded in the non-opening area. In the groove of the opening area.
  • An embodiment of the present application also provides an electronic device, which includes the above-mentioned display screen module.
  • An embodiment of the present application also provides a method for manufacturing a display screen module, which includes:
  • the part to be processed including a thin film transistor layer and a to be processed organic layer covering the thin film transistor layer;
  • An organic layer covering the light-emitting unit is formed, and part of the organic layer is embedded in the groove of the non-open area.
  • grooves are provided in the non-opening area through the pixel defining layer, and the encapsulation layer includes an organic layer, the pixel defining layer and the The organic layer is made of organic material.
  • the organic layer is used as a part of the encapsulation layer.
  • Part of the organic layer is embedded in the groove of the non-opening area, which can effectively enhance the adhesion of the encapsulation layer and the pixel defining layer. Focusing on the light-emitting unit to stably encapsulate the overall structural strength and impact resistance, thereby ensuring the service life and stability of the display module. .
  • FIG. 1 is a first structural diagram of a display screen module provided by an embodiment of the present application
  • Fig. 2 is an enlarged schematic diagram 1 of A in Fig. 1;
  • FIG. 3 is a second structural diagram of a display screen module provided by an embodiment of the present application.
  • Fig. 4 is an enlarged schematic diagram of B in Fig. 1;
  • FIG. 5 is a third structural diagram of a display screen module provided by an embodiment of the present application.
  • FIG. 6 is a fourth structural diagram of a display screen module provided by an embodiment of the present application.
  • FIG. 7 is a fifth structural diagram of a display screen module provided by an embodiment of the present application.
  • FIG. 8 is a sixth structural diagram of a display screen module provided by an embodiment of the present application.
  • Fig. 9 is an enlarged schematic diagram 2 of A in Fig. 1;
  • Fig. 10 is an enlarged schematic diagram 1 of C in Fig. 5;
  • Fig. 11 is an enlarged schematic diagram 2 of C in Fig. 5;
  • FIG. 12 is a seventh structural diagram of a display screen module provided by an embodiment of the present application.
  • FIG. 13 is an eighth structural diagram of a display screen module provided by an embodiment of the present application.
  • FIG. 14 is a first production flowchart of a display screen module provided by an embodiment of the present application.
  • FIG. 15 is a schematic diagram of manufacturing a display screen module provided by an embodiment of the present application.
  • FIG. 16 is a schematic diagram of manufacturing a display screen module provided by an embodiment of the present application.
  • FIG. 17 is a second production flowchart of the display screen module provided by the embodiment of the present application.
  • FIG. 19 is a fourth flow chart of manufacturing the display screen module provided by the embodiment of the present application.
  • FIG. 20 is a fifth flow chart of making a display screen module provided by an embodiment of the present application.
  • FIG. 21 is a sixth production flowchart of the display screen module provided by the embodiment of the present application.
  • FIG. 22 is a seventh flow chart of manufacturing a display screen module provided by an embodiment of the present application.
  • FIG. 23 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • the display screen module 100 includes a thin film transistor layer 10, a pixel defining layer 20, a light-emitting unit 30, and an encapsulation layer 40 that are stacked.
  • the pixel defining layer 20 includes an opening area 21 and a non-opening area 22, and the pixel defining layer 20 is provided with a groove 23 in the non-opening area 22.
  • the light emitting unit 30 corresponds to the opening area 21 and is electrically connected to the thin film transistor layer 10.
  • the encapsulation layer 40 includes an organic layer 41, and part of the organic layer 41 is embedded in the groove 23 of the non-opening area 22 Inside.
  • the light-emitting unit 30 includes a first electrode layer 31, an organic electroluminescent layer 32, and a second electrode layer 33 stacked in sequence, and the first electrode layer 31 is close to the thin film relative to the second electrode layer 33.
  • Transistor layer 10 The organic electroluminescent layer 32 can be driven to emit light through the first electrode layer 31 and the second electrode layer 33.
  • a groove 23 is provided in the non-opening area 22 through the pixel defining layer 20, and the encapsulation layer 40 includes an organic layer 41. Both the pixel defining layer 20 and the organic layer 41 are made of organic materials. As a part of the encapsulation layer 40, the layer 41 uses part of the organic layer 41 to be embedded in the groove 23 of the non-open area 22, which can effectively enhance the adhesion between the encapsulation layer 40 and the pixel defining layer 20, thereby stabilizing The light-emitting unit 30 is packaged to increase the overall structural strength and impact resistance, thereby ensuring the service life and use stability of the display module 100.
  • the pixel defining layer 20 is provided with a through hole 25 in the opening area 21, and the light-emitting unit 30 is electrically connected to the thin film transistor layer 10 through the through hole 25.
  • the display screen module 100 includes a cathode layer 50 laminated between the pixel defining layer 20 and the organic layer 41. The portion of the cathode layer 50 facing the through hole 25 forms the second electrode layer 33 of the light emitting unit 30. Part of the organic layer 41 is embedded in the groove 23 of the non-opening area 22, thereby effectively increasing the contact area and adhesion between the organic layer 41 and the pixel defining layer 20, thereby restricting the cathode layer 50 and The organic electroluminescent layer 32 is peeled off. Wherein, the organic layer 41 is provided with a protruding portion 411, and the protruding portion 411 is embedded in the groove 23 and is in contact with the inner wall of the groove 23.
  • the cathode layer 50 covers the pixel defining layer 20 except for the groove 23, and the cathode layer 50 faces the groove 23.
  • a hollow hole 451 is provided, and the protruding portion 411 passes through the hollow hole 451 to be inserted into the groove 23.
  • the hollow hole 451 is formed at the position where the cathode layer 50 faces the groove 23, so as to prevent the cathode layer 50 from sinking into the groove 23 to limit the protrusion 411 and the groove 23.
  • the protruding portion 411 can completely contact the side wall or the bottom wall of the groove 23, which is beneficial to increase the contact area of the pixel defining layer 20 and the organic layer 41. Adhesion.
  • the cathode layer 50 includes a first portion 51 that covers the pixel defining layer 20 except for the groove 23, and sinks into the groove 23 The second part 52 at the bottom.
  • the first part 51 and the second part 52 of the cathode layer 50 form a slit 53 at the side wall of the groove 23, so as to prevent the cathode layer 50 from covering the side wall of the groove 23.
  • the protruding portion 411 may contact the side wall of the groove 23 through the slit 53, thereby increasing the contact area and adhesion between the protruding portion 411 and the side wall of the groove 23.
  • the display screen module 100 is an organic light-emitting screen (OLED screen) module.
  • the display screen module 100 has the characteristics of self-luminescence, wide viewing angle, and high contrast. Set the backlight structure.
  • the pixel defining layer 20 is provided with a plurality of the opening regions 21 arranged in an array.
  • the display screen module 100 includes a plurality of the light-emitting units 30, and the plurality of the light-emitting units 30 are arranged in an array.
  • the plurality of light emitting units 30 respectively correspond to the plurality of opening regions 21 in a one-to-one manner.
  • the plurality of light-emitting units 30 form images through different light-emitting combinations.
  • the light emitting unit 30 is embedded in the through hole 25.
  • the thin film transistor layer 10 is provided with thin film transistors 11.
  • the thin film transistor 11 is electrically connected to the light emitting unit 30.
  • the light-emitting unit 30 can be driven to emit light through the thin film transistor 11 to realize an active light-emitting mode.
  • the pixel defining layer 20 separates a plurality of the light emitting units 30.
  • the pixel defining layer 20 is made of organic material, and the material of the pixel defining layer 20 may include any one or a combination of polyimide, polymethyl methacrylate, or organosilane.
  • the encapsulation layer 40 is laminated with the pixel defining layer 20, and the encapsulation layer 40 can encapsulate the light emitting unit 30.
  • the material of the organic layer 41 may be any one or a combination of polyimide, polymethyl methacrylate, or organosilane.
  • the organic layer 41 and the pixel defining layer 20 are both organic materials, so that the interface compatibility between the organic layer 41 and the pixel defining layer 20 is good, so that the protrusion 411 and the pixel defining layer 20 20 is firmly bonded, thereby enhancing the encapsulation effect of the encapsulation layer 40 on the light-emitting unit 30, and avoids the electrode layer of the light-emitting unit 30 and the organic electroluminescent layer 32 from being impacted and separated.
  • the materials of the pixel defining layer 20 and the organic layer 41 can be set according to actual needs, and are not limited to the above examples.
  • the protrusion 411 can pass through the groove 23 and abut the thin film transistor layer 10, and the protrusion 411 and the groove
  • the increase in the contact area of the inner wall of 23 is beneficial to improve the adhesion between the organic layer 41 and the pixel defining layer 20.
  • the groove 23 does not penetrate the pixel defining layer 20.
  • the pixel defining layer 20 is provided with a plurality of grooves 23.
  • the plurality of grooves 23 are arranged in an array. Each of the grooves 23 is located between two adjacent through holes 25.
  • the organic layer 41 is provided with a plurality of the protrusions 411, and the plurality of protrusions 411 respectively correspond to the plurality of grooves 23, and the plurality of protrusions 411 are respectively embedded in the plurality of In the groove 23, the bonding strength of the organic layer 41 and the pixel defining layer 20 is obviously increased, and the impact resistance and the reliability of the display screen module 100 are improved.
  • the organic layer 41 is attached to the light-emitting unit 30.
  • the organic layer 41 is attached to the second electrode layer 33 of the light-emitting unit 30 to limit the separation of the second electrode layer 33 from the organic electroluminescent layer 32, thereby improving the display module Reliability of 100.
  • the encapsulation layer 40 further includes a first inorganic layer 42, an organic transition layer 43 and a second inorganic layer 44. The first inorganic layer 42, the organic transition layer 43, the second inorganic layer 44, and the organic layer 41 are sequentially stacked to form an organic-inorganic composite thin-film packaging structure.
  • the thin-film packaging structure can be used for the light-emitting unit 30 for protection to prevent external water vapor, oxygen or dust from attacking the light-emitting unit 30.
  • the material of the first inorganic layer 42 and the second inorganic layer 44 may be SiNx, SiON or SiO, of course, they may also be other inorganic materials, which can be set according to actual needs.
  • the organic layer 41 is isolated from the light-emitting unit 30, and the encapsulation layer 40 further includes an inorganic layer laminated between the organic layer 41 and the light-emitting unit 30.
  • Layer 45 the material of the inorganic layer 45 may be SiNx, SiON or SiO.
  • the inorganic layer 45 covers the light-emitting unit 30 and separates the light-emitting unit 30 from the organic layer 41.
  • the first inorganic layer 42, the organic transition layer 43, the second inorganic layer 44, the organic layer 41, and the inorganic layer 45 are sequentially stacked to form an organic-inorganic composite film packaging structure.
  • the inorganic layer 45 has better water and oxygen barrier properties.
  • the inorganic layer 45 can block the water vapor entering the organic layer 41 from attacking the light emitting unit 30.
  • the inorganic layer 45 covers the pixel defining layer 20 except for the groove 23.
  • the inorganic layer 45 is provided with a hollow hole 451 facing the groove 23, and the protrusion 411 passes through
  • the hollow hole 451 is embedded in the groove 23, which can prevent the inorganic layer 45 from contacting the side wall of the groove 23 and reduce the contact area between the protrusion 411 and the side wall of the groove 23, thereby The contact between the protrusion 411 and the side wall of the groove 23 is ensured.
  • the groove 23 has a first inclined side wall 231, and the first inclined side wall 231 is disposed at an angle with the normal direction of the light emitting unit 30, and the protrusion 411 Contradict the first inclined side wall 231.
  • the pixel defining layer 20 has a bottom surface 24 adjacent to the thin film transistor layer 10.
  • the bottom surface 24 is substantially perpendicular to the normal direction of the light-emitting unit 30.
  • the groove 23 penetrates the pixel defining layer 20, and the first inclined sidewall 231 is connected to the bottom surface 24.
  • the first inclined side wall 231 and the bottom surface 24 are arranged at an acute angle.
  • the protrusion 411 is adapted to the groove 23, and the contact between the organic layer 41 and the pixel defining layer 20 is increased by the protrusion 411 contacting the first inclined sidewall 231 Area, thereby increasing the adhesion between the organic layer 41 and the pixel defining layer 20, better stabilizing the light-emitting unit 30, and preventing the light-emitting unit 30 from being impacted and peeling off.
  • the through hole 25 has a second inclined side wall 251, and the second inclined side wall 251 is arranged at an angle with the normal direction of the light emitting unit 30.
  • the through hole 25 penetrates the pixel defining layer 20, and the second inclined side arm is connected to the bottom surface 24.
  • the second inclined side wall 251 is arranged at an acute angle with the bottom surface 24.
  • the light emitting unit 30 is adapted to the through hole 25, and the light emitting unit 30 is in contact with the second inclined side wall 251 to increase the contact area between the light emitting unit 30 and the pixel defining layer 20 Therefore, the adhesion between the light-emitting unit 30 and the pixel defining layer 20 is increased, and the light-emitting unit 30 is better stabilized.
  • the first inclined sidewall 231 and the bottom surface 24 are arranged at an obtuse angle.
  • the included angle between the first inclined side wall 231 and the bottom surface 24 is greater than 90°, so that the groove 23 forms a dovetail structure, and the protrusion 411 is matched with the groove 23, so The groove 23 can fix the protrusion 411 so as to restrict the protrusion 411 from escaping from the groove 23.
  • the included angle between the first inclined side wall 231 and the bottom surface 24 is greater than the included angle between the second inclined side wall 251 and the bottom surface 24.
  • the angle between the first inclined side wall 231 and the bottom surface 24 is greater than 60° and less than 90°; the angle between the second inclined side wall 251 and the bottom surface 24 is 30° ⁇ 60°, so that the first inclined side wall 231 is close to the normal direction of the light emitting unit 30 relative to the second inclined side wall 251.
  • the angle between the second inclined side wall 251 and the bottom surface 24 is 30°-60°, which can prevent a part of the cathode layer 50 from being broken at the side wall of the through hole 25, thereby ensuring that the first part 51 is Continuity.
  • the included angle between the first inclined side wall 231 and the bottom surface 24 is greater than 60° and less than 90°, the first part 51 and the second part 52 of the cathode layer 50 are in the concave
  • a slit 53 is formed at the side wall of the groove 23 to prevent the cathode layer 50 from covering the side wall of the groove 23, and the protrusion 411 can contact the first inclined side wall 231 through the slit 53, thereby The contact area and adhesion between the protruding portion 411 and the first inclined side wall 231 are increased.
  • the display screen module 100 includes two oppositely arranged display parts 60 and a bending part 70 fixedly connected to the two display parts 60, one of the display parts 60
  • the bending portion 70 can be folded or unfolded relative to the other display portion 60, and the two display portions 60 and the bending portion 70 are both provided with the thin film transistor layer 10, the pixel defining layer 20, The light emitting unit 30 and the encapsulation layer 40.
  • the display screen module 100 is a flexible display screen module 100, that is, the display screen module 100 has a foldable structure.
  • the bending portion 70 can be bent and deformed, so that one display portion 60 can be folded or unfolded relative to the other display portion 60 via the bending portion 70.
  • Each of the display portions 60 is provided with a first display area 61, and the bending portion 70 is provided with a second display area 71.
  • the second display area 71 is connected between the two first display areas 61, so that the first display area 61 and the two second display areas 71 form a continuous display area, so that the display screen
  • the module 100 can provide a large display area.
  • the organic layer 41 is provided with a plurality of the protrusions 411, and the pixel defining layer 20 is provided with a plurality of the grooves 23 that cooperate with the plurality of protrusions 411.
  • the plurality of protrusions 411 constitute a first protrusion array and a second protrusion array.
  • the plurality of grooves 23 constitute a first groove array 91 and a second groove array 92.
  • the first groove array 91 and the second groove array 92 are both rectangular arrays.
  • the two first groove arrays 91 are respectively disposed on the two display parts 60, and the second groove array 92 is disposed on the bending part 70.
  • the first groove array 91 of each display portion 60 is matched with the first protrusion array of the organic layer 41
  • the second groove array 92 of the bending portion 70 is matched with the organic layer 41.
  • the second protrusion array is matched.
  • the array density of the second groove array 92 is greater than the array density of the first groove array 91.
  • the bending portion 70 is a transitional connection portion that transitionally connects the two display portions 60, and the display screen module 100 realizes a folding function through the bending and deformation of the bending portion 70.
  • the bending portion 70 needs to withstand greater bending stress.
  • the array density of the second groove array 92 is greater than the array density of the first groove array 91, so that the number of grooves 23 of the bending portion 70 is increased, and a part of the organic layer 41 is embedded in the curve.
  • the contact area between the organic layer 41 and the pixel defining layer 20 in the bent portion 70 is increased, thereby increasing the stability of the organic light emitting structure of the bent portion 70 and improving the bending resistance.
  • the opening size of the grooves in the second groove array 92 is larger than the opening size of the grooves in the first groove array 91, so that the boundary between the organic layer 41 and the pixels in the bent portion 70 can also be increased.
  • the contact area of the layer 20 is larger than the opening size of the grooves in the first groove array 91, so that the boundary between the organic layer 41 and the pixels in the bent portion 70 can also be increased.
  • an embodiment of the present application also provides a manufacturing method of a display screen module, which is used for manufacturing the above-mentioned display screen module.
  • the manufacturing method of the display screen module includes steps 101 to 104:
  • the workpiece 300 includes a thin film transistor layer 10 and an organic layer 41 to be processed covering the thin film transistor layer 10.
  • the workpiece 300 to be processed includes a substrate 81.
  • the substrate 81 is provided with a plurality of pixel regions arranged in an array.
  • the thin film transistor layer 10 is formed on the substrate 81.
  • the thin film transistor layer 10 includes a plurality of thin film transistors 11 and an insulating layer 82.
  • the plurality of thin film transistors 11 are respectively disposed in the plurality of pixel regions of the substrate 81.
  • the plurality of thin film transistors 11 may be electrically connected to the plurality of light-emitting units 30 in subsequent steps to drive the plurality of light-emitting units 30 to emit light to form an image.
  • the insulating layer 82 covers a plurality of the thin film transistors 11.
  • the workpiece 300 further includes a planarization layer 83 formed on the insulating layer 82.
  • the planarization layer 83 covers the insulating layer 82, and the planarization layer 83 can provide a flat surface, so that structures such as the pixel defining layer 20 and the light emitting unit 30 can be formed on the planarization layer 83.
  • the organic layer 41 to be processed is formed on the planarization layer 83.
  • the organic layer 41 to be processed is used to process the pixel defining layer 20 in a subsequent step.
  • the organic layer 41 to be processed is made of organic material, and the material of the organic layer 41 to be processed may be any one or a combination of polyimide, polymethyl methacrylate, or organosilane.
  • the organic layer 41 to be processed is processed to obtain a pixel defining layer 20 having an opening area 21 and a non-aperture area 22, wherein the pixel defining layer 20 is formed with ⁇ 23 ⁇ Slot 23.
  • the pixel defining layer 20 has a plurality of the opening regions 21 arranged in an array.
  • the pixel defining layer 20 is formed with through holes 25 in the opening area 21, and the pixel defining layer 20 is formed with a plurality of the through holes 25 arranged in an array.
  • the non-open area 22 is a part of the pixel defining layer 20 excluding the open area 21.
  • the groove 23 is formed on the side of the pixel defining layer 20 away from the thin film transistor 11.
  • the pixel defining layer 20 is formed with a plurality of the grooves 23.
  • the plurality of grooves 23 are arranged in an array.
  • the groove 23 may penetrate the pixel defining layer 20. In other embodiments, the groove 23 does not penetrate the pixel defining layer 20.
  • a first electrode layer 31, an organic electroluminescence layer 32, and a second electrode layer 33 may be formed on the pixel defining layer 20 by an evaporation process.
  • the layer 32 and the second electrode layer 33 are stacked in sequence, and the first electrode layer 31, the organic electroluminescence layer 32 and the second electrode layer 33 constitute a light emitting unit 30.
  • the light emitting unit 30 is embedded in the through hole 25 and is electrically connected to the thin film transistor 11 through the through hole 25.
  • the number of the light-emitting unit 30 is multiple, and the multiple light-emitting units 30 are respectively embedded in the multiple through holes 25.
  • the first electrode layer 31 is an anode, the first electrode layer 31 is electrically connected to the thin film transistor 11; the second electrode layer 33 is a cathode. In other embodiments, the first electrode layer 31 is a cathode, and the second electrode layer 33 is an anode.
  • the pixel defining layer 20 and the organic layer 41 are made of organic materials.
  • the organic layer 41 is used as a part of the encapsulation layer 40, and a part of the organic layer 41 is used to embed the
  • the groove 23 in the non-opening area 22 can effectively enhance the adhesion between the encapsulation layer 40 and the pixel defining layer 20, thereby stably encapsulating the light-emitting unit 30, increasing the overall structural strength and impact resistance, thereby ensuring display The service life and stability of the screen module 100.
  • step 104 includes step 1041 to step 1042:
  • the organic material is used to process the organic layer 41 in subsequent steps.
  • the organic material may be any one or a combination of polyimide, polymethyl methacrylate or organosilane.
  • the organic material is deposited to form the organic layer 41, and part of the organic material is deposited in the groove 23 to form a protrusion 411 that contacts the inner wall of the groove 23.
  • the organic material may be deposited on the pixel defining layer 20 by evaporation to form the organic layer 41.
  • the protrusion 411 of the organic layer 41 is embedded in the groove 23 of the pixel defining layer 20 and is in contact with the inner wall of the groove 23, thereby increasing the contact between the organic layer 41 and the pixel defining layer 20
  • the area further enhances the adhesion between the organic layer 41 and the pixel defining layer 20 to limit the separation of the layer structure of the light-emitting unit 30.
  • the organic layer 41 may be in contact with the pixel defining layer 20 and the light emitting unit 30.
  • the organic layer 41 is isolated from the pixel defining layer 20 and the light emitting unit 30.
  • forming the light-emitting unit 30 disposed corresponding to the opening region 21 and electrically connected to the thin film transistor layer 10 includes steps 1031 to 1033:
  • the cathode material is deposited to form a cathode layer 50 laminated on the pixel defining layer 20, and the shielding portion blocks the cathode material from being deposited into the groove 23, so that the cathode layer 50 covers the pixel The portion of the defining layer 20 excluding the groove 23.
  • the cathode material may be deposited on the pixel defining layer 20 by evaporation.
  • the shielding portion can shield the groove 23, thereby preventing the cathode material from being deposited into the groove 23, so as to prevent the cathode material from occupying the space on the side wall of the groove 23, thereby
  • the sidewall of the groove 23 may be in complete contact with a part of the organic layer 41, which is beneficial to increase the contact area between the pixel defining layer 20 and the organic layer 41.
  • processing the organic layer 41 to be processed includes steps 1021 to 1024:
  • the second mask has a first opening and a second opening arranged side by side.
  • the groove 23 may be approximately the same shape as the through hole 25, the shape of the first opening and the second opening are approximately the same, and both the first opening and the second opening are funnels. ⁇ Shaped openings.
  • the first opening and the second opening are patterns with a preset configuration. The patterns of the first opening and the second opening can be etched on the organic material to be processed by laser etching technology.
  • the through hole 25 and the groove 23 can be processed through the same mask, which can avoid multiple mask manufacturing processes, which is beneficial to reduce processing steps and improve processing efficiency.
  • the first opening and the second opening have other shapes.
  • steps 1035 to 1036 includes steps 1035 to 1036:
  • the cathode material is deposited to form a cathode layer 50 laminated on the pixel defining layer 20, and the cathode layer 50 includes a first portion 51 covering the pixel defining layer 20 except for the groove 23, and sinking to The second portion 52 at the bottom of the groove 23 and the portion of the first portion 51 corresponding to the opening area 21 constitute a part of the light emitting unit 30.
  • the cathode layer 50 includes a plurality of the second portions 52.
  • the plurality of second parts 52 are respectively disposed in the plurality of grooves 23.
  • Processing the organic layer 41 to be processed includes steps 1025 to 1027:
  • the first opening is a pattern with a preset configuration, and the pattern of the first opening can be etched on the organic layer 41 to be processed by laser etching technology to form a
  • the first opening has a groove 23 of the same shape.
  • the included angle between the first inclined side wall 231 and the bottom surface 24 is greater than 60° and less than 90°.
  • step 1036 the first part 51 and the second part 52 of the cathode layer 50 form a slit 53 at the first inclined sidewall 231 of the groove 23, so that the cathode layer 50 is in the first
  • the inclined side wall 231 is discontinuous, so as to prevent the cathode layer 50 from covering the side wall of the groove 23, and the protrusion 411 can contact the first inclined side wall 231 through the slit 53, thereby increasing The contact area and adhesion force between the protruding portion 411 and the first inclined side wall 231.
  • Processing the organic layer 41 to be processed also includes step 1028 to step 1030:
  • a second mask is also provided, the second mask has a second opening, and the second opening is a funnel-shaped opening.
  • the through hole 25 has a second inclined side wall 251.
  • the second inclined sidewall 251 is arranged at an angle with the normal direction of the organic layer 41 to be processed, and the included angle between the second inclined sidewall 251 and the normal direction of the organic layer 41 to be processed is greater than the The included angle between the first inclined sidewall 231 and the normal direction of the organic layer 41 to be processed.
  • the second opening is a pattern with a preset configuration, and the pattern of the second opening can be etched on the organic layer 41 to be processed by laser etching technology to form
  • the second opening has a through hole 25 of the same shape.
  • the angle between the second inclined side wall 251 and the bottom surface 24 is 30°-60°, which can prevent part of the cathode layer 50 from breaking at the sidewall of the through hole 25, thereby ensuring the cathode layer 50 Continuity.
  • an embodiment of the present application further provides an electronic device 400, and the electronic device 400 includes the display screen module 100 as described above.
  • the electronic device may be a smart phone, a smart watch, a tablet computer, a notebook computer or a wearable smart device, etc.
  • grooves are provided in the non-opening area through the pixel defining layer, and the encapsulation layer includes an organic layer, the pixel defining layer and the The organic layer is made of organic material.
  • the organic layer is used as a part of the encapsulation layer.
  • Part of the organic layer is embedded in the groove of the non-opening area, which can effectively enhance the adhesion of the encapsulation layer and the pixel defining layer. Focusing on the light-emitting unit to stably encapsulate the overall structural strength and impact resistance, thereby ensuring the service life and stability of the display module.

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本申请实施例提供一种显示屏模组 100，显示屏模组 100包括层叠设置的薄膜晶体管层 10、像素限定层 20、发光单元 30和封装层 40，像素限定层 20包括开口区 21以及非开口区 22，像素限定层 20在非开口区 22设置有凹槽 23，发光单元 30与开口区 21对应，并电连接薄膜晶体管层 10，封装层 40包括有机层 41，部分有机层 41嵌入非开口区 22的凹槽 23内。像素限定层 20和有机层 41均为有机材材质，有机层 41作为封装层 40的一部分，利用部分有机层 41嵌入非开口区 22的凹槽 23内，可有效增强封装层 40与像素限定层 20的附着力，从而稳固封装发光单元30，增加整体结构强度和抗冲击能力，从而保证显示屏模组 100的使用寿命与使用稳定性。

Description

显示屏模组及其制作方法及电子设备 技术领域
本申请涉及显示屏技术领域，具体涉及一种显示屏模组及其制作方法及电子设备。
背景技术
随着科技的发展，显示屏被应用在更多的场景中，对显示屏模组的显示性能、抗冲击性能和可弯曲性能提出了更高的要求。但由于材料及结构限制，显示屏模组的发光单元的层结构的抗冲击性能较差，显示屏模组受到外力冲击时，被击中的区域容易出现黑斑、亮斑、彩斑等显示不良的情况，从而严重影响了显示屏模组的使用寿命与使用稳定性。
发明内容
本申请实施例提供一种显示屏模组，所述显示屏模组包括层叠设置的薄膜晶体管层、像素限定层、发光单元和封装层，所述像素限定层包括开口区以及非开口区，所述像素限定层在非开口区设置有凹槽，所述发光单元与所述开口区对应，并电连接所述薄膜晶体管层，所述封装层包括有机层，部分所述有机层嵌入所述非开口区的凹槽内。
本申请实施例还提供一种电子设备，所述电子设备包括如上所述的显示屏模组。
本申请实施例还提供一种显示屏模组的制作方法，所述显示屏模组的制作方法包括：
提供待加工件，所述待加工件包括薄膜晶体管层以及覆盖所述薄膜晶体管层的待加工有机层；
加工所述待加工有机层，以获得具有开口区以及非开口区的像素限定层，其中，所述像素限定层在所述非开口区形成有凹槽；
形成对应所述开口区设置并电连接所述薄膜晶体管层的发光单元；
形成覆盖所述发光单元的有机层，部分所述有机层嵌入所述非开口区的凹槽内。
本申请实施例提供的显示屏模组及其制作方法及电子设备，通过所述像素限定层在非开口区设置有凹槽，以及所述封装层包括有机层，所述像素限定层和所述有机层均为有机材材质，所述有机层作为封装层的一部分，利用部分所述有机层嵌入所述非开口区的凹槽内，可有效增强所述封装层与所述像素限定层的附着力，从而稳固封装所述发光单元，增加整体结构强度和抗冲击能力，从而保证显示屏模组的使用寿命与使用稳定性。。
附图说明
为了更清楚地说明本申请实施例的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的显示屏模组的结构示意图一；
图2是图1中A处的放大示意图一；
图3是本申请实施例提供的显示屏模组的结构示意图二；
图4是图1中B处的放大示意图；
图5是本申请实施例提供的显示屏模组的结构示意图三；
图6是本申请实施例提供的显示屏模组的结构示意图四；
图7是本申请实施例提供的显示屏模组的结构示意图五；
图8是本申请实施例提供的显示屏模组的结构示意图六；
图9是图1中A处的放大示意图二；
图10是图5中C处的放大示意图一；
图11是图5中C处的放大示意图二；
图12是本申请实施例提供的显示屏模组的结构示意图七；
图13是本申请实施例提供的显示屏模组的结构示意图八；
图14是本申请实施例提供的显示屏模组的制作流程图一；
图15是本申请实施例提供的显示屏模组的制作示意图；
图16是本申请实施例提供的显示屏模组的制作示意图；
图17是本申请实施例提供的显示屏模组的制作流程图二；
图18是本申请实施例提供的显示屏模组的制作流程图三；
图19是本申请实施例提供的显示屏模组的制作流程图四；
图20是本申请实施例提供的显示屏模组的制作流程图五；
图21是本申请实施例提供的显示屏模组的制作流程图六；
图22是本申请实施例提供的显示屏模组的制作流程图七；
图23是本申请实施例提供的电子设备的结构示意图。
具体实施方式
请参阅图1，本申请实施例提供一种显示屏模组100，所述显示屏模组100包括层叠设置的薄膜晶体管层10、像素限定层20、发光单元30和封装层40。所述像素限定层20包括开口区21以及非开口区22，所述像素限定层20在非开口区22设置有凹槽23。所述发光单元30与所述开口区21对应，并电连接所述薄膜晶体管层10，所述封装层40包括有机层41，部分所述有机层41嵌入所述非开口区22的凹槽23内。其中，所述发光单元30包括依次层叠设置的第一电极层31、有机电致发光层32和第二电极层33，所述第一电极层31相对所述第二电极层33靠近所述薄膜晶体管层10。可以通过所述第一电极层31和所述第二电极层33驱动所述有机电致发光层32发光。
通过所述像素限定层20在非开口区22设置有凹槽23，以及所述封装层40包括有机层41，所述像素限定层20和所述有机层41均为有机材材质，所述有机层41作为封装层40的一部分，利用部分所述有机层41嵌入所述非开口区22的凹槽23内，可有效增强所述封装层40与所述像素限定层20的附着力，从而稳固封装所述发光单元30，增加整体结构强度和抗冲击能力，从而保证显示屏模组100的使用寿命与使用稳定性。
本实施方式中，所述像素限定层20在所述开口区21设有通孔25，所述发光单元30经所述通孔25电连接所述薄膜晶体管层10。所述显示屏模组100包括层叠于所述像素限定层20和所述有机层41之间的阴极层50。所述阴极层50正对所述通孔25的部分形成所述发光单元30的第二电极层33。部分所述有机层41嵌入所述非开口区22的凹槽23内，从而有效增加所述有机层41与所述像素限定层20的接触面积和附着力，从而可以限制所述阴极层50与所述有机电致发光层32相剥离。其中，所述有机层41设有凸出部411，所述凸出部411嵌设于所述凹槽23内，并与所述凹槽23的内壁相接触。
请参阅图1和图2，第一实施方式中，所述阴极层50覆盖所述像素限定层20除所述凹槽23之外的部分，所述阴极层50正对所述凹槽23处设有镂空孔451，所述凸出部411穿过所述镂空孔451以嵌入所述凹槽23。本实施方式中，通过所述阴极层50正对所述凹槽23处形成镂空孔451，可避免所述阴极层50下沉至所述凹槽23内而限制所述凸出部411与所述凹槽23内壁的接触面积，所述凸出部411可以与所述凹槽23的侧壁或底壁完全接触，有利于增加所述像素限定层20与所述有机层41的接触面积和附着力。
请参阅图3和图4，第二实施方式中，所述阴极层50包括覆盖所述像素限定层20中除所述凹槽23之外的第一部分51，以及下沉至所述凹槽23底部的第二部分52。本实施方式中，所述阴极层50的第一部分51以及第二部分52在所述凹槽23侧壁处形成断缝53，从而避免所述阴极层50覆盖所述凹槽23侧壁，所述凸出部411可以经所述断缝53接触所述凹槽23侧壁，从而增加所述凸出部411与所述凹槽23侧壁的接触面积和附着力。
本实施方式中，所述显示屏模组100为有机发光屏(OLED屏)模组，所述显示屏模组100具有自发光性、广视角、对比度高等特性，所述显示屏模组100无需设置背光结构。所述像素限定层20设有呈阵列排布的多个所述开口区21。所述显示屏模组100包括多个所述发光单元30，多个所述发光单元30呈阵列排布。多个所述发光单元30分别与多个所述开口区21一一对应。多个所述发光单元30通过不同的发光组合方式形成图像。
请参阅图5，所述发光单元30嵌设于所述通孔25内。所述薄膜晶体管层10设有薄膜晶体管11。所述薄膜晶体管11电连接所述发光单元30。可通过所述薄膜晶体管11驱动所述发光单元30发光，实现主动发光方式。
所述像素限定层20将多个所述发光单元30分隔开。所述像素限定层20为有机材质，所述像素限定层20的材质可以包括聚酰亚胺、聚甲基丙烯酸甲酯类或有机硅烷等中的任意一种或几种的组合。所述封装层40与所述像素限定层20相层叠，所述封装层40可对所述发光单元30进行封装。所述有机层41的材质可以是聚酰亚胺、聚甲基丙烯酸甲酯类或有机硅烷等中的任意一种或几种的组合。所述有机层41和所述像素限定层20均为有机材质，从而所述有机层41和所述像素限定层20的界面相容性良好，使得所述凸出部411与所述像素限定层20牢固结合，进而增强所述封装层40对所述发光单元30的封装效果，避免发光单元30的电极层与有机电致发光层32受到冲击而分离。在其他实施方式中，所述像素限定层20和所述有机层41的材质可以根据实际需要设置，并不局限于上述举例。
所述凹槽23贯穿所述像素限定层20，则所述凸出部411可以穿过所述凹槽23并抵触于所述薄膜晶体管层10，且所述凸出部411与所述凹槽23的内壁的接触面积增大，有利于提高所述有机层41与所述像素限定层20的附着力。当然，在其他实施方式中，所述凹槽23未贯穿所述像素限定层20。
请参阅图1和图6，所述像素限定层20设有多个所述凹槽23。多个所述凹槽23呈阵列排布。每一所述凹槽23位于相邻的两个所述通孔25之间。所述有机层41设有多个所述凸出部411，多个所述凸出部411分别与多个所述凹槽23一一对应，多个所述凸出部411分别嵌入多个所述凹槽23内，从而明显增加所述有机层41与所述像素限定层20的结合强度，提高所述显示屏模组100的抗冲击能力和使用可靠性。
请参阅图7，一种实施方式中，所述有机层41贴合所述发光单元30。本实施方式中，所述有机层41贴合所述发光单元30的第二电极层33，以限制所述第二电极层33与所述有机电致发光层32剥离，从而提高显示屏模组100的使用可靠性。所述封装层40还包括第一无机层42、有机过渡层43和第二无机层44。所述第一无机层42、所述有机过渡层43、所述第二无机层44和所述有机层41依次层叠，形成有机-无机复合薄膜封装结构，上述薄膜封装结构可以对所述发光单元30进行保护，阻挡外部的水汽、氧气或灰尘侵袭所述发光单元30。所述第一无机层42和所述第二无机层44的材质可以是SiNx或SiON或SiO，当然也可以是其他无机材质，可根据实际需要进行设置。
请参阅图8，另一种实施方式中，所述有机层41与所述发光单元30相隔离，所述封装层40还包括层叠于所述有机层41和所述发光单元30之间的无机层45。本实施方式中，所述无机层45的材质可以是SiNx或SiON或SiO。所述无机层45覆盖所述发光单元30，并将所述发光单元30与所述有机层41分隔开。所述第一无机层42、所述有机过渡层43、所述第二无机层44、所述有机层41和所述无机层45依次层叠，形成有机-无机复合薄膜封装结构。与所述有机层41相比，所述无机层45具有更好的水氧阻隔性能。所述无机层45可以阻挡进入所述有机层41的水汽侵袭所述发光单元30。
所述无机层45覆盖所述像素限定层20除所述凹槽23之外的部分，所述无机层45正对所述凹槽23处设有镂空孔451，所述凸出部411穿过所述镂空孔451以嵌入所述凹槽23，可避免所述无机层45与所述凹槽23侧壁接触而减少所述凸出部411与所述凹槽23侧壁的接触面积，从而保证所述凸出部411与所述凹槽23侧壁的接触。
请参阅图9，进一步地，所述凹槽23具有第一倾斜侧壁231，所述第一倾斜侧壁231与所述发光单元30的法线方向呈夹角设置，所述凸出部411抵触所述第一倾斜侧壁231。
本实施方式中，所述像素限定层20具有邻近所述薄膜晶体管层10的底面24。所述底面24与发光单元30的法线方向大致相垂直。所述凹槽23贯穿所述像素限定层20，所述第一倾斜侧壁231连接于所述底面24。所述第一倾斜侧壁231与所述底面24呈锐角设置。所述凸出部411与所述凹槽23相适配，通过所述凸出部411与所述第一倾斜侧壁231相接触，增加所述有机层41和所述像素限定层20的接触面积，从而增大所述有机层41和所述像素限定层20之间的附着力，更好地稳固所述发光单元30，避免所述发光单元30受到冲击而出现剥离现象。
请参阅图10，所述通孔25具有第二倾斜侧壁251，所述第二倾斜侧壁251与所述发光单元30的法线方向呈夹角设置。所述通孔25贯穿所述像素限定层20，所述第二倾斜侧臂连接于所述底面24。所述第二倾斜侧壁251与所述底面24呈锐角设置。所述发光单元30与所述通孔25相适配，通过所述发光单元30与所述第二倾斜侧壁251相接触，以增加所述发光单元30与所述像素限定层20的接触面积，从而增大所述发光单元30与所述像素限定层20之间的附着力，更好地稳固所述发光单元30。
请参阅图11，在其他实施方式中，所述第一倾斜侧壁231与所述底面24呈钝角设置。所述第一倾斜侧壁231与所述底面24的夹角大于90°，以使得所述凹槽23形成燕尾槽结构，通过所述凸出部411与所述凹槽23相适配，所述凹槽23可以对所述凸出部411起到卡固作用，从而限制所述凸出部411脱离所述凹槽23。
进一步地，所述第一倾斜侧壁231与所述底面24的夹角大于所述第二倾斜侧壁251与所述底面24的夹角。
本实施方式中，所述第一倾斜侧壁231与所述底面24的夹角大于60°，并小于90°；所述第二倾斜侧壁251与所述底面24的夹角为30°～60°，使得所述第一倾斜侧壁231相对所述第二倾斜侧壁251靠近所述发光单元30的法线方向。
所述第二倾斜侧壁251与所述底面24的夹角为30°～60°，可以防止部分所述阴极层50对应所述通孔25侧壁处断裂，从而保证所述第一部分51的连续性。
请参阅图12，由于所述第一倾斜侧壁231与所述底面24的夹角大于60°，并小于90°，使得所述阴极层50的第一部分51以及第二部分52在所述凹槽23侧壁处形成断缝53，从而避免所述阴极层50覆盖所述凹槽23侧壁，所述凸出部411可以经所述断缝53接触所述第一倾斜侧壁231，从而增加所述凸出部411与所述第一倾斜侧壁231的接触面积和附着力。
请参阅图1和图13，进一步地，所述显示屏模组100包括相对设置的两个显示部60和固定连接两个所述显示部60的弯折部70，一所述显示部60经所述弯折部70可相对另一所述显示部60折叠或展开，两个所述显示部60和所述弯折部70均设有所述薄膜晶体管层10、所述像素限定层20、所述发光单元30和所述封装层40。
本实施方式中，所述显示屏模组100为柔性显示屏模组100，即所述显示屏模组100为可折叠结构。所述弯折部70可弯曲变形，使得一所述显示部60可经所述弯折部70相对另一所述显示部60折叠或展开。每一所述显示部60设有第一显示区61，所述弯折部70设有第二显示区71。所述第二显示区71连接在两个所述第一显示区61之间，使得所述第一显示区61和两个所述第二显示区71形成连续的显示区，从而所述显示屏模组100可以提供大面积的显示区域。
所述有机层41设有多个所述凸出部411，所述像素限定层20设有与多个所述凸出部411配合的多个所述凹槽23。多个所述凸出部411构成第一凸起阵列和第二凸起阵列。多个凹槽23构成第一凹槽阵列91和第二凹槽阵列92。所述第一凹槽阵列91和所述第二凹槽阵列92均呈矩形阵列。两个所述第一凹槽阵列91分别设置于两个所述显示部60上，所述第二凹槽阵列92设置于所述弯折部70上。每一所述显示部60的第一凹槽阵列91与所述有机层41的第一凸起阵列相适配，所述弯折部70的第二凹槽阵列92与所述有机层41的第二凸起阵列相适配。
请参阅图13，进一步地，所述第二凹槽阵列92的阵列密度大于所述第一凹槽阵列91的阵列密度。
本实施方式中，所述弯折部70为过渡连接两个所述显示部60的过渡连接部分，所述显示屏模组100通过所述弯折部70弯曲变形来实现折叠功能。与所述显示部60相比，所述弯折部70需要承受较大的弯折应力。通过所述第二凹槽阵列92的阵列密度大于所述第一凹槽阵列91的阵列密度，使得所述弯折部70的凹槽23数量增加，通过部分所述有机层41嵌入所述弯折部70的凹槽23内，增加弯折部70中有机层41与像素限定层20的接触面积，从而增加所述弯折部70的有机发光结构的稳固性，提高耐弯折性能。在其他实施方式中，所述第二凹槽阵列92中的凹槽开口尺寸大于所述第一凹槽阵列91中凹槽开口尺寸，从而也可以增加弯折部70中有机层41与像素限定层20的接触面积。
请参阅图14，本申请实施例还提供一种显示屏模组的制作方法，所述显示屏模组的制作方法用于上述显示屏模组的制作。所述显示屏模组的制作方法包括步骤101至步骤104：
101：请参阅图15，提供待加工件300，所述待加工件300包括薄膜晶体管层10以及覆盖所述薄膜晶体管层10的待加工有机层41。
在步骤101中，所述待加工件300包括基板81。所述基板81设有阵列排布的多个像素区域。所述薄膜晶体管层10形成于所述基板81上。所述薄膜晶体管层10包括多个薄膜晶体管11和绝缘层82。多个所述薄膜晶体管11分别设置于所述基板81的多个所述像素区域内。多个所述薄膜晶体管11可在后续步骤中电连接多个发光单元30，以分别驱动多个所述发光单元30发光形成图像。所述绝缘层82覆 盖多个所述薄膜晶体管11。所述待加工件300还包括形成于所述绝缘层82上的平坦化层83。所述平坦化层83覆盖所述绝缘层82，所述平坦化层83可提供平坦的表面，以便于在所述平坦化层83上形成像素限定层20和发光单元30等结构。所述待加工有机层41形成于所述平坦化层83上。所述待加工有机层41用于在后续步骤中加工形成像素限定层20。所述待加工有机层41为有机材质，所述待加工有机层41的材质可以是聚酰亚胺、聚甲基丙烯酸甲酯类或有机硅烷等中的任意一种或几种的组合。
102：请参阅图16，加工所述待加工有机层41，以获得具有开口区21以及非开口区22的像素限定层20，其中，所述像素限定层20在所述非开口区22形成有凹槽23。
在步骤102中，所述像素限定层20具有呈阵列排布的多个所述开口区21。所述像素限定层20在所述开口区21形成有通孔25，则所述像素限定层20形成有呈阵列排布的多个所述通孔25。所述非开口区22为所述像素限定层20除所述开口区21之外的部分。所述凹槽23形成于所述像素限定层20背离所述薄膜晶体管11一侧。所述像素限定层20形成有多个所述凹槽23。多个所述凹槽23呈阵列排布。所述凹槽23可以贯穿所述像素限定层20。在其他实施方式中，所述凹槽23未贯穿所述像素限定层20。
103：形成对应所述开口区21设置并电连接所述薄膜晶体管层10的发光单元30。
在步骤103中，可以通过蒸镀工艺在像素限定层20上形成第一电极层31、有机电致发光层32和第二电极层33，所述第一电极层31、所述有机电致发光层32和所述第二电极层33依次层叠设置，所述第一电极层31、所述有机电致发光层32和所述第二电极层33构成发光单元30。所述发光单元30嵌设于所述通孔25内，并经所述通孔25电连接所述薄膜晶体管11。所述发光单元30的数目为多个，多个所述发光单元30分别嵌设于多个所述通孔25内。本实施方式中，所述第一电极层31为阳极，所述第一电极层31电连接所述薄膜晶体管11；所述第二电极层33为阴极。在其他实施方式中，所述第一电极层31为阴极，所述第二电极层33为阳极。
104：形成覆盖所述发光单元30的有机层41，部分所述有机层41嵌入所述非开口区22的凹槽23内。
在步骤104中，请参阅图1，所述像素限定层20和所述有机层41均为有机材材质，所述有机层41作为封装层40的一部分，利用部分所述有机层41嵌入所述非开口区22的凹槽23内，可有效增强所述封装层40与所述像素限定层20的附着力，从而稳固封装所述发光单元30，增加整体结构强度和抗冲击能力，从而保证显示屏模组100的使用寿命与使用稳定性。
请参阅图17，所述步骤104包括步骤1041至步骤1042：
1041：提供有机材料。
在步骤1041中，所述有机材料用于在后续步骤中加工形成有机层41。所述有机材料可以是聚酰亚胺、聚甲基丙烯酸甲酯类或有机硅烷等中的任意一种或几种的组合。
1042：所述有机材料沉积形成所述有机层41，部分所述有机材料沉积在所述凹槽23内，以形成接触所述凹槽23内壁的凸出部411。
在步骤1042中，可以通过蒸镀方式将所述有机材料沉积于所述像素限定层20上形成所述有机层41。所述有机层41的凸出部411嵌入所述像素限定层20的凹槽23内，并与所述凹槽23内壁相接触，从而增加所述有机层41和所述像素限定层20的接触面积，进一步增强所述有机层41与所述像素限定层20的附着力，以限制所述发光单元30的层结构发生分离。一种实施方式中，所述有机层41可以与所述像素限定层20和所述发光单元30相接触。另一种实施方式中，所述有机层41与所述像素限定层20及所述发光单元30相隔离。
请参阅图18，第一实施方式中，“形成对应所述开口区21设置并电连接所述薄膜晶体管层10的发光单元30”包括步骤1031至步骤1033：
1031：提供阴极材料和第一掩模，所述第一掩模具有遮蔽部。
1032：利用所述第一掩模覆盖所述像素限定层20，所述遮蔽部遮蔽所述凹槽23。
1033：所述阴极材料沉积形成层叠于所述像素限定层20的阴极层50，所述遮蔽部阻挡所述阴极材料沉积至所述凹槽23内，以使所述阴极层50覆盖所述像素限定层20除所述凹槽23之外的部分。
本实施方式中，可以通过蒸镀方式将会所述阴极材料沉积于所述像素限定层20上。所述遮蔽部可以对所述凹槽23起到遮蔽作用，进而阻挡所述阴极材料沉积至所述凹槽23内，从而避免所述阴极材料 占用所述凹槽23侧壁的空间，从而所述凹槽23侧壁可以与部分所述有机层41完全接触，有利于增加所述像素限定层20与所述有机层41的接触面积。
请参阅图19，进一步地，“加工所述待加工有机层41”包括步骤1021至步骤1024：
1021：提供第二掩模。
1022：所述第二掩模具有并排设置第一开孔和第二开孔。
1023：利用所述第二掩模覆盖所述待加工有机层41。
1024：加工所述待加工有机层41对应所述第一开孔及所述第二开孔的部分，以获得通孔25和凹槽23，其中所述通孔25形成于所述像素限定层20的开口区21。
本实施方式中，由于所述阴极材料未沉积在所述凹槽23内，不必考虑所述阴极层50是否需要在所述凹槽23侧壁上形成断缝53，从而可以降低对所述凹槽23的结构要求。所述凹槽23可以与所述通孔25形状大致相同，所述第一开孔和所述第二开孔的形状大致相同，所述第一开孔和所述第二开孔均呈漏斗状开孔。所述第一开孔和所述第二开孔为预设配置的图案，可以通过激光刻蚀技术将所述第一开孔及所述第二开孔的图案刻蚀在所述待加工有机层41上，以获得所述通孔25和所述凹槽23，其中所述通孔25的形状与所述第一开孔的形状大致相同，所述凹槽23的形状与所述第二开孔的形状大致相同。所述通孔25和所述凹槽23可以通过同一掩模加工完成，可以避免多道掩模制程，有利于减少加工工序，提高加工效率。当然，在其他实施方式中，所述第一开孔和所述第二开孔呈其他形状。
请参阅图20，第二实施方式中，“形成对应所述开口区21设置并电连接所述薄膜晶体管层10的发光单元30”包括步骤1035至步骤1036：
1035：提供阴极材料。
1036：所述阴极材料沉积形成层叠于所述像素限定层20的阴极层50，所述阴极层50包括覆盖所述像素限定层20除所述凹槽23之外第一部分51，以及下沉至所述凹槽23底部的第二部分52，所述第一部分51对应所述开口区21的部分构成所述发光单元30的一部分。
本实施方式中，所述阴极层50包括多个所述第二部分52。多个所述第二部分52分别设置于多个所述凹槽23内。
请参阅图21，“加工所述待加工有机层41”包括步骤1025至步骤1027：
1025：提供第一掩模，所述第一掩模具有第一开孔，所述第一开孔为漏斗形开孔。
1026：利用所述第一掩模覆盖所述待加工有机层41。
1027：加工所述待加工有机层41对应所述第一开孔的部分，以获得凹槽23，所述凹槽23具有第一倾斜侧壁231，所述第一倾斜侧壁231与所述待加工有机层41的法线方向呈夹角设置。
在步骤1027中，所述第一开孔为预设配置的图案，可以通过激光刻蚀技术将所述第一开孔的图案刻蚀在所述待加工有机层41上，形成具有与所述第一开孔具有相同形状的凹槽23。所述第一倾斜侧壁231与所述底面24的夹角大于60°，并小于90°。在步骤1036中，所述阴极层50的第一部分51以及第二部分52在所述凹槽23的第一倾斜侧壁231处形成断缝53，从而实现所述阴极层50在所述第一倾斜侧壁231处不连续，从而避免所述阴极层50覆盖所述凹槽23侧壁，所述凸出部411可以经所述断缝53接触所述第一倾斜侧壁231，从而增加所述凸出部411与所述第一倾斜侧壁231的接触面积和附着力。
请参阅图22，“加工所述待加工有机层41”还包括步骤1028至步骤1030：
1028：还提供第二掩模，所述第二掩模具有第二开孔，所述第二开孔为漏斗形开孔。
1029：还利用所述第二掩模覆盖所述待加工有机层41；
1030：加工所述待加工有机层41对应所述第二开孔的部分，以获得具有与所述凹槽23并排的通孔25，所述通孔25具有第二倾斜侧壁251，所述第二倾斜侧壁251与所述待加工有机层41的法线方向呈夹角设置，且所述第二倾斜侧壁251与所述待加工有机层41的法线方向的夹角大于所述第一倾斜侧壁231与所述待加工有机层41的法线方向的夹角。
在步骤1028中，所述第二开孔为预设配置的图案，可以通过激光刻蚀技术将所述第二开孔的图案刻蚀在所述待加工有机层41上，形成具有与所述第二开孔具有相同形状的通孔25。所述第二倾斜侧壁251与所述底面24的夹角为30°～60°，可以防止部分所述阴极层50对应所述通孔25侧壁处断裂，从而保证所述阴极层50的连续性。
请参阅图23，本申请实施例还提供一种电子设备400，所述电子设备400包括如上所述的显示屏模组100。所述电子设备可以是智能手机、智能手表、平板电脑、笔记本电脑或可穿戴智能设备等。
本申请实施例提供的显示屏模组及其制作方法及电子设备，通过所述像素限定层在非开口区设置有凹槽，以及所述封装层包括有机层，所述像素限定层和所述有机层均为有机材材质，所述有机层作为封装层的一部分，利用部分所述有机层嵌入所述非开口区的凹槽内，可有效增强所述封装层与所述像素限定层的附着力，从而稳固封装所述发光单元，增加整体结构强度和抗冲击能力，从而保证显示屏模组的使用寿命与使用稳定性。
综上所述，虽然本申请已以较佳实施例揭露如上，但该较佳实施例并非用以限制本申请，该领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的防护范围以权利要求界定的范围为准。

Claims (22)

  1. 一种显示屏模组，其特征在于，所述显示屏模组包括层叠设置的薄膜晶体管层、像素限定层、发光单元和封装层，所述像素限定层包括开口区以及非开口区，所述像素限定层在非开口区设置有凹槽，所述发光单元与所述开口区对应，并电连接所述薄膜晶体管层，所述封装层包括有机层，部分所述有机层嵌入所述非开口区的凹槽内。
  2. 如权利要求1所述的显示屏模组，其特征在于，所述有机层设有嵌入至所述非开口区的凹槽内的凸出部，所述凸出部与所述凹槽的内壁相接触。
  3. 如权利要求2所述的显示屏模组，其特征在于，所述凹槽具有第一倾斜侧壁，所述第一倾斜侧壁与所述发光单元的法线方向呈夹角设置，所述凸出部抵触所述第一倾斜侧壁。
  4. 如权利要求1所述的显示屏模组，其特征在于，所述凹槽贯穿所述像素限定层。
  5. 如权利要求1所述的显示屏模组，其特征在于，所述像素限定层覆盖所述薄膜晶体管层，所述像素限定层在所述开口区设有通孔，所述发光单元通过所述通孔电连接所述薄膜晶体管层。
  6. 如权利要求5所述的显示屏模组，其特征在于，所述通孔具有第二倾斜侧壁，所述第二倾斜侧壁与所述发光单元的法线方向呈夹角设置，所述发光单元与所述第二倾斜侧壁相接触。
  7. 如权利要求1所述的显示屏模组，其特征在于，所述显示屏模组包括层叠于所述像素限定层和所述有机层之间的阴极层，所述阴极层包括覆盖所述像素限定层中除所述凹槽之外的第一部分。
  8. 如权利要求7所述的显示屏模组，其特征在于，所述阴极层还包括下沉至所述凹槽底部的第二部分，所述阴极层的第一部分以及第二部分在所述凹槽侧壁处形成断缝。
  9. 如权利要求2～8任意一项所述的显示屏模组，其特征在于，所述有机层与所述发光单元相隔离，所述封装层还包括层叠于所述有机层和所述发光单元之间的无机层。
  10. 如权利要求9所述的显示屏模组，其特征在于，所述无机层覆盖所述像素限定层除所述凹槽之外的部分，所述无机层正对所述凹槽处设有镂空孔，所述凸出部穿过所述镂空孔以嵌入所述凹槽。
  11. 如权利要求2～8任意一项所述的显示屏模组，其特征在于，所述显示屏模组包括相对设置的两个显示部和固定连接两个所述显示部的弯折部，一所述显示部经所述弯折部可相对另一所述显示部折叠或展开，两个所述显示部和所述弯折部均设有所述薄膜晶体管层、所述像素限定层、所述发光单元和所述封装层。
  12. 如权利要求11所述的显示屏模组，其特征在于，所述有机层设有多个所述凸出部，所述像素限定层设有与多个所述凸出部配合的多个所述凹槽，多个凹槽构成第一凹槽阵列和第二凹槽阵列，所述第一凹槽阵列设置于所述显示部上，所述第二凹槽阵列设置于所述弯折部上。
  13. 如权利要求12所述的显示屏模组，其特征在于，所述第二凹槽阵列的阵列密度大于所述第一凹槽阵列的阵列密度。
  14. 如权利要求1～8任意一项所述的显示屏模组，其特征在于，所述像素限定层设有呈阵列排布的多个所述通孔，所述显示屏模组包括分别对应多个所述通孔设置的多个所述发光单元，所述凹槽设置于相邻的两个所述通孔之间。
  15. 一种电子设备，其特征在于，所述电子设备包括如权利要求1～14任意一项所述的显示屏模组。
  16. 一种显示屏模组的制作方法，其特征在于，所述显示屏模组的制作方法包括：
    提供待加工件，所述待加工件包括薄膜晶体管层以及覆盖所述薄膜晶体管层的待加工有机层；
    加工所述待加工有机层，以获得具有开口区以及非开口区的像素限定层，其中，所述像素限定层在所述非开口区形成有凹槽；
    形成对应所述开口区设置并电连接所述薄膜晶体管层的发光单元；
    形成覆盖所述发光单元的有机层，部分所述有机层嵌入所述非开口区的凹槽内。
  17. 如权利要求16所述的显示屏模组的制作方法，其特征在于，“形成对应所述开口区设置并电连接所述薄膜晶体管层的发光单元”包括：
    提供第一掩模，所述第一掩模具有遮蔽部；
    利用所述第一掩模覆盖所述像素限定层，所述遮蔽部遮蔽所述凹槽；
    提供阴极材料；
    所述阴极材料沉积形成层叠于所述像素限定层的阴极层，所述遮蔽部阻挡所述阴极材料沉积至所述凹槽内，以使所述阴极层覆盖所述像素限定层除所述凹槽之外的部分。
  18. 如权利要求17所述的显示屏模组的制作方法，其特征在于，“加工所述待加工有机层”包括：
    提供第二掩模；
    所述第二掩模具有并排设置第一开孔和第二开孔；
    利用所述第二掩模覆盖所述待加工有机层；
    加工所述待加工有机层对应所述第一开孔及所述第二开孔的部分，以获得通孔和凹槽，其中所述通孔形成于所述像素限定层的开口区。
  19. 如权利要求16所述的显示屏模组的制作方法，其特征在于，“形成对应所述开口区设置并电连接所述薄膜晶体管层的发光单元”包括：
    提供阴极材料；
    所述阴极材料沉积形成层叠于所述像素限定层的阴极层，所述阴极层包括覆盖所述像素限定层除所述凹槽之外第一部分，以及下沉至所述凹槽底部的第二部分，所述第一部分对应所述开口区的部分构成所述发光单元的一部分。
  20. 如权利要求19所述的显示屏模组的制作方法，其特征在于，“加工所述待加工有机层”包括：
    提供第一掩模，所述第一掩模具有第一开孔，所述第一开孔为漏斗形开孔；
    利用所述第一掩模覆盖所述待加工有机层；
    加工所述待加工有机层对应所述第一开孔的部分，以获得凹槽，所述凹槽具有第一倾斜侧壁，所述第一倾斜侧壁与所述待加工有机层的法线方向呈夹角设置，
    “所述阴极材料沉积形成层叠于所述像素限定层的阴极层”中，所述阴极层的第一部分以及第二部分在所述凹槽侧壁处形成断缝。
  21. 如权利要求20所述的显示屏模组的制作方法，其特征在于，“加工所述待加工有机层”还包括：还提供第二掩模，所述第二掩模具有第二开孔，所述第二开孔为漏斗形开孔；
    还利用所述第二掩模覆盖所述待加工有机层；
    加工所述待加工有机层对应所述第二开孔的部分，以获得具有与所述凹槽并排的通孔，所述通孔具有第二倾斜侧壁，所述第二倾斜侧壁与所述待加工有机层的法线方向呈夹角设置，且所述第二倾斜侧壁与所述待加工有机层的法线方向的夹角大于所述第一倾斜侧壁与所述待加工有机层的法线方向的夹角。
  22. 如权利要求16所述的显示屏模组的制作方法，其特征在于，“形成覆盖所述发光单元的有机层”包括：
    提供有机材料；
    所述有机材料沉积形成所述有机层，部分所述有机材料沉积在所述凹槽内，以形成接触所述凹槽内壁的凸出部。
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