CN113366646A - 显示屏模组及其制作方法及电子设备 - Google Patents
显示屏模组及其制作方法及电子设备 Download PDFInfo
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- CN113366646A CN113366646A CN201980079785.7A CN201980079785A CN113366646A CN 113366646 A CN113366646 A CN 113366646A CN 201980079785 A CN201980079785 A CN 201980079785A CN 113366646 A CN113366646 A CN 113366646A
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- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 239000010410 layer Substances 0.000 claims abstract description 262
- 239000012044 organic layer Substances 0.000 claims abstract description 117
- 239000010409 thin film Substances 0.000 claims abstract description 43
- 238000005538 encapsulation Methods 0.000 claims abstract description 17
- 239000011368 organic material Substances 0.000 claims abstract description 17
- 238000005452 bending Methods 0.000 claims description 22
- 239000010406 cathode material Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 12
- 238000004806 packaging method and process Methods 0.000 abstract description 15
- 239000000853 adhesive Substances 0.000 abstract description 6
- 230000001070 adhesive effect Effects 0.000 abstract description 6
- 230000001965 increasing effect Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 238000004020 luminiscence type Methods 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000004926 polymethyl methacrylate Substances 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 238000010329 laser etching Methods 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 229910004205 SiNX Inorganic materials 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
- H10K59/80521—Cathodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
本申请实施例提供一种显示屏模组100,显示屏模组100包括层叠设置的薄膜晶体管层10、像素限定层20、发光单元30和封装层40,像素限定层20包括开口区21以及非开口区22,像素限定层20在非开口区22设置有凹槽23,发光单元30与开口区21对应,并电连接薄膜晶体管层10,封装层40包括有机层41,部分有机层41嵌入非开口区22的凹槽23内。像素限定层20和有机层41均为有机材材质,有机层41作为封装层40的一部分,利用部分有机层41嵌入非开口区22的凹槽23内,可有效增强封装层40与像素限定层20的附着力,从而稳固封装发光单元30,增加整体结构强度和抗冲击能力,从而保证显示屏模组100的使用寿命与使用稳定性。
Description
PCT国内申请,说明书已公开。
Claims (22)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2019/088155 WO2020232702A1 (zh) | 2019-05-23 | 2019-05-23 | 显示屏模组及其制作方法及电子设备 |
Publications (1)
Publication Number | Publication Date |
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CN113366646A true CN113366646A (zh) | 2021-09-07 |
Family
ID=73459328
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201980079785.7A Pending CN113366646A (zh) | 2019-05-23 | 2019-05-23 | 显示屏模组及其制作方法及电子设备 |
Country Status (2)
Country | Link |
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CN (1) | CN113366646A (zh) |
WO (1) | WO2020232702A1 (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106057121A (zh) * | 2015-04-14 | 2016-10-26 | 三星显示有限公司 | 有机发光二极管显示器 |
CN106449702A (zh) * | 2016-09-20 | 2017-02-22 | 上海天马微电子有限公司 | 一种有机发光显示面板以及制作方法 |
CN108922902A (zh) * | 2018-07-03 | 2018-11-30 | 云谷(固安)科技有限公司 | 显示屏及显示装置 |
CN109166825A (zh) * | 2018-08-01 | 2019-01-08 | 云谷(固安)科技有限公司 | 显示面板及具有其的显示装置 |
CN109728042A (zh) * | 2018-12-14 | 2019-05-07 | 云谷(固安)科技有限公司 | 一种显示装置及其制备方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102283856B1 (ko) * | 2013-11-22 | 2021-08-03 | 삼성디스플레이 주식회사 | 유기 발광 표시장치 및 그의 제조방법 |
CN108538901A (zh) * | 2018-05-14 | 2018-09-14 | 云谷(固安)科技有限公司 | 显示面板及其制作方法和显示装置 |
CN109378328B (zh) * | 2018-09-28 | 2021-07-09 | 广州国显科技有限公司 | Oled显示面板及oled显示装置 |
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2019
- 2019-05-23 CN CN201980079785.7A patent/CN113366646A/zh active Pending
- 2019-05-23 WO PCT/CN2019/088155 patent/WO2020232702A1/zh active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106057121A (zh) * | 2015-04-14 | 2016-10-26 | 三星显示有限公司 | 有机发光二极管显示器 |
CN106449702A (zh) * | 2016-09-20 | 2017-02-22 | 上海天马微电子有限公司 | 一种有机发光显示面板以及制作方法 |
CN108922902A (zh) * | 2018-07-03 | 2018-11-30 | 云谷(固安)科技有限公司 | 显示屏及显示装置 |
CN109166825A (zh) * | 2018-08-01 | 2019-01-08 | 云谷(固安)科技有限公司 | 显示面板及具有其的显示装置 |
CN109728042A (zh) * | 2018-12-14 | 2019-05-07 | 云谷(固安)科技有限公司 | 一种显示装置及其制备方法 |
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WO2020232702A1 (zh) | 2020-11-26 |
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