WO2020217264A1 - 熱可塑性合成樹脂製立体エンブレムの製造方法及び製造装置 - Google Patents
熱可塑性合成樹脂製立体エンブレムの製造方法及び製造装置 Download PDFInfo
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- WO2020217264A1 WO2020217264A1 PCT/JP2019/016911 JP2019016911W WO2020217264A1 WO 2020217264 A1 WO2020217264 A1 WO 2020217264A1 JP 2019016911 W JP2019016911 W JP 2019016911W WO 2020217264 A1 WO2020217264 A1 WO 2020217264A1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/04—Dielectric heating, e.g. high-frequency welding, i.e. radio frequency welding of plastic materials having dielectric properties, e.g. PVC
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/12—Dielectric heating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/14—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles in several steps
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/14—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles in several steps
- B29C43/146—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles in several steps for making multilayered articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C43/40—Moulds for making articles of definite length, i.e. discrete articles with means for cutting the article
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/74—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area
- B29C65/743—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area using the same tool for both joining and severing, said tool being monobloc or formed by several parts mounted together and forming a monobloc
- B29C65/7441—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area using the same tool for both joining and severing, said tool being monobloc or formed by several parts mounted together and forming a monobloc for making welds and cuts of other than simple rectilinear form
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/43—Joining a relatively small portion of the surface of said articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C66/723—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
- B29C66/7232—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered comprising a non-plastics layer
- B29C66/72321—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered comprising a non-plastics layer consisting of metals or their alloys
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
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- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C66/8141—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the surface geometry of the part of the pressing elements, e.g. welding jaws or clamps, coming into contact with the parts to be joined
- B29C66/81427—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the surface geometry of the part of the pressing elements, e.g. welding jaws or clamps, coming into contact with the parts to be joined comprising a single ridge, e.g. for making a weakening line; comprising a single tooth
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- B29C66/8141—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the surface geometry of the part of the pressing elements, e.g. welding jaws or clamps, coming into contact with the parts to be joined
- B29C66/81431—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the surface geometry of the part of the pressing elements, e.g. welding jaws or clamps, coming into contact with the parts to be joined comprising a single cavity, e.g. a groove
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
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Definitions
- the present invention relates to a manufacturing apparatus and a manufacturing method for a three-dimensional emblem made of a thermoplastic synthetic resin to be attached to an adherend such as a car, a motorcycle, a boat, a home appliance, a game machine, clothing, a bag, and a hat.
- thermoplastic synthetic resins such as emblems, appliqués, and stickers manufactured by high-frequency dielectric heating have been proposed (see, for example, Patent Document 1).
- the three-dimensional emblem is formed by placing an upper layer material including a metal-deposited laminated film and a lower layer material including a thermoplastic synthetic resin sheet or a foamed resin sheet (hereinafter referred to as "three-dimensional emblem material") between an engraving mold and a flat plate mold. While sandwiching, high-frequency dielectric heating is applied to soften and shape the lower layer material, while welding the upper layer material and the lower layer material.
- the metal vapor deposition layer may cause a whitening phenomenon, and the surface of the three-dimensional emblem may be burnt.
- An object of the present invention is to provide an apparatus and a method capable of manufacturing a bulky three-dimensional emblem made of a thermoplastic synthetic resin including a metal-deposited laminated film.
- the apparatus for manufacturing a three-dimensional emblem made of a thermoplastic synthetic resin of the present invention A slide jig that allows the electrode flat plate mold and the electrode convex mold to slide in a horizontal plane, An electrode concave mold that can be approached and separated from the slide jig in the vertical direction and is arranged at a position that can face the electrode flat mold and the electrode convex mold.
- High-frequency dielectric heating is performed by continuously oscillating a high frequency between the electrode concave mold and the electrode flat plate mold of the slide jig or the electrode convex mold while facing each other.
- the electrode flat plate mold has one or a plurality of recesses formed on a surface facing the electrode concave mold mold, and the lower layer material is formed in the recesses of the electrode flat plate mold and the electrode concave mold mold. When it was sandwiched between them and high-frequency dielectric heating was performed, a part of the lower layer material invaded and the shaped lower layer material was held in the electrode flat plate mold.
- the recess of the electrode flat plate mold is formed with a retaining member for the lower layer material that has penetrated into the inside.
- the recess of the electrode flat plate mold can have a wedge shape with an enlarged diameter inside.
- the method for manufacturing the three-dimensional emblem of the present invention is: A slide jig that allows the electrode flat plate mold and the electrode convex mold to slide in a horizontal plane, An electrode concave mold that can be approached and separated from the slide jig in the vertical direction and is arranged at a position that can face the electrode flat mold and the electrode convex mold.
- High-frequency dielectric heating is performed by continuously oscillating a high frequency between the electrode concave mold and the electrode flat plate mold of the slide jig or the electrode convex mold while facing each other.
- High-frequency oscillator to make Using a three-dimensional emblem manufacturing device made of thermoplastic synthetic resin A method for producing a three-dimensional emblem made of a thermoplastic synthetic resin obtained by welding and integrating an upper layer material including a metal-deposited laminated film and a lower layer material including a thermoplastic synthetic resin sheet by high-frequency dielectric heating. It is a lower layer shaping step in which the lower layer material is arranged between the electrode flat plate mold and the electrode concave mold, and the electrode flat plate mold and the electrode concave mold are brought close to each other to perform high-frequency dielectric heating. A lower layer shaping step in which the shaped lower layer material is held by the electrode flat plate mold and the electrode flat plate mold and the electrode concave mold are separated from each other.
- the electrode convex mold is slid so as to face the electrode concave mold, the upper layer material is arranged between the electrode convex mold and the electrode concave mold, and the electrode convex is formed.
- the upper layer molding step of molding the upper layer material by bringing the mold mold and the electrode concave mold close to each other and performing high-frequency dielectric heating the molded upper layer material is held in the electrode concave mold and said.
- An upper layer forming step that separates the convex electrode mold and the concave electrode mold, and In the slide jig, the electrode flat plate mold holding the lower layer material is slid so as to face the electrode concave mold mold holding the upper layer material, and the electrode flat plate mold and the electrode concave mold mold are brought close to each other.
- the electrode flat plate mold and the electrode concave mold mold are brought close to each other.
- the electrode flat plate mold has one or a plurality of recesses formed on the surface facing the electrode concave mold, and a part of the lower layer material penetrates into the recesses in the lower layer shaping step. It is desirable to hold the lower layer material in the electrode flat plate mold.
- the lower layer shaping step it is desirable to hold the lower layer material in the electrode plate mold by attaching the lower layer material to the electrode plate mold with an adhesive tape.
- the upper layer material and the lower layer material are individually shaped and molded, and then integrated by welding. Therefore, in the shaping of the lower layer material, a high current can be applied during high-frequency dielectric heating, so that the shaping can be performed even if the thickness exceeds 2 mm. Since shaping can be performed only with the lower layer material, it is possible to prevent whitening of the upper layer material due to overcurrent in high-frequency dielectric heating.
- the slide jig slides the shaped lower layer material while holding it in the electrode flat plate mold to face the electrode concave mold.
- the mold to be used can be replaced with an electrode convex mold.
- the upper layer material can be molded by the sliding electrode convex mold and the electrode concave mold.
- the slide jig slides the electrode flat plate mold so as to face the electrode concave mold while holding the molded upper layer material in the electrode concave mold.
- the lower layer material held in the electrode flat plate mold and the upper layer material held in the electrode concave mold can be opposed to each other and integrated by welding. Since the lower layer material and the upper layer material are held while being mounted on the mold after shaping and molding, respectively, by aligning the molds with each other, the shaped lower layer material and the molded upper layer material are formed. Can be integrated without misalignment.
- FIG. 1 is a plan view showing an embodiment of a slide jig.
- FIG. 2 is a plan view of the electrode flat plate mold (a) and a cross-sectional view taken along the line AA.
- FIG. 3 is an enlarged cross-sectional view of (a) a recess of FIG. 2 along the line BB, and (b) an enlarged cross-sectional view of a recess having a different shape.
- FIG. 4 is a plan view (a) of the electrode convex mold and a cross-sectional view taken along the line CC (b).
- FIG. 5 is a plan view of the concave electrode mold (a) and a cross-sectional view taken along the line DD.
- FIG. 6 is an explanatory diagram showing a lower layer shaping step.
- FIG. 7 is a plan view showing a state in which the mold of the slide jig is slid after the lower layer shaping step.
- FIG. 8 is an explanatory view showing the upper layer forming step.
- FIG. 9 is a plan view showing a state in which the mold of the slide jig is slid after the upper layer forming step.
- FIG. 10 is an explanatory diagram showing a welding step.
- FIG. 11 is a plan view of the fusing blade mold (a) and a cross-sectional view taken along the line (b) EE.
- FIG. 12 is an explanatory diagram showing a fusing step.
- FIG. 13 is a cross-sectional view of (a) a high-frequency fused three-dimensional emblem and (b) a Thomson kiss-cut or laser-kiss-cut three-dimensional emblem.
- FIG. 14 is a plan view of the three-dimensional emblem.
- the apparatus for manufacturing the three-dimensional emblem 40 made of the thermoplastic synthetic resin of the present invention and the manufacturing method thereof will be described with reference to the drawings.
- the thickness of each layer of the three-dimensional emblem 40, the unevenness of the mold, the thickness, and the like are emphasized for explanation.
- the size, shape, pattern, etc. of the three-dimensional emblem 40 are also examples, and can be changed as appropriate.
- a slide jig 10 in which two molds 11 and 14 are slidably arranged and a mold 20 facing each other by sliding the molds 11 and 14 are provided.
- the lower layer material 44 and the upper layer material 46 are sandwiched between the opposing molds and separately subjected to high-frequency dielectric heating, and the lower layer material 44 and the upper layer material 46 are welded and integrated.
- the three-dimensional emblem 40 manufacturing apparatus includes a device provided with a high-frequency dielectric oscillator, a table on which the mold is placed, and an elevating mechanism for the mold, and slide jigs 10 and molds 11 and 14 shown in FIGS. 1 to 4. It is configured by mounting the mold 20 shown in FIG. As shown in FIGS. 6 and 8, the mold 20 is arranged so as to face the molds 11 and 14 of the slide jig 10.
- a manufacturing apparatus in which the slide jig 10 is arranged on the lower side and the mold 20 is arranged so that the engraving surface faces downward will be described.
- the slide jig 10 is configured by slidably arranging two molds 11 and 14 on the inner window of the rectangular frame 16.
- One mold is an electrode flat plate mold 11, and as shown in FIG. 2, the upper surface is formed flat.
- the other mold is an electrode convex mold 14 as shown in FIG. 4, and a design 15 having a pattern attached to the three-dimensional emblem 40 is projected.
- the electrode flat plate mold 11 has one or a plurality of recesses 12 formed on the upper surface thereof.
- the recess 12 is formed at a position where it overlaps with the lower layer material 44, which will be described later, and is formed at a position other than the pattern portion 42 of the three-dimensional emblem 40, that is, at a position facing an unnecessary portion to be removed in a later step.
- a plurality of recesses 12 are formed in the vicinity of the peripheral edge of the electrode flat plate mold 11.
- the recess 12 penetrates a part 44a of the lower layer material 44 in the lower layer shaping step described later, and holds the lower layer material 44 in the electrode flat plate mold 11.
- the recess 12 has a structure in which the invading lower layer material 44a is entangled and does not easily separate. For example, as shown in FIG. 3A, a configuration in which a screw 12a with a head is fitted in a cylindrical recess 12 can be exemplified.
- FIG. 3B shows a devised shape of the recess 12, in which the recess 12 has a wedge shape (tapered shape) having an enlarged diameter inside, and the invading lower layer material 44a spreads inside the recess 12. Therefore, it is prevented from being easily separated.
- the recess 12 may be roughened or grooved.
- the electrode convex mold 14 is a convex mold in which a pattern 15 having a pattern of a three-dimensional emblem 40 is projected on the upper surface.
- the pattern exemplifies a stylized version of the English character "WAIV”.
- the electrode flat plate mold 11 and the electrode convex mold 14 are attached to the frame body 16 by being screwed to sliders 18 and 18 slidably provided on the left and right inside of the frame body 16, for example, and a slide jig. Consists of 10.
- the length of the left and right vertical frames 17 and 17 of the frame body 16 is such that the two molds 11 and 14 slide in the direction of the arrow in FIG. 1 and can be positioned at the same position in the center of the length direction, that is, the gold. It is desirable that the length is the length of three molds. As a result, the molds 11 and 14 can be positioned simply by sliding the molds 11 and 14 in the direction of the arrow and bringing them into contact with the horizontal frames 19 and 19.
- the electrode flat plate mold 11 can be positioned at the center of the slide jig 10 by bringing the electrode convex mold 14 into contact with the horizontal frame 19 on the lower side in the drawing. Further, by sliding the electrode flat plate mold 11 so as to abut against the horizontal frame 19 on the upper side in the drawing, the electrode convex mold mold 14 can be positioned at the center of the slide jig 10. After positioning, the molds 11 and 14 may be fixed by using a magnet or the like so as not to shift.
- the mold arranged to face the slide jig 10 is the electrode concave mold 20 shown in FIG. 5, and the inverted design 21 of the design 15 formed on the electrode convex mold 14 (FIG. 4) is engraved. It is a mold that has been made.
- the inverted symbol 21 is a symbol obtained by reversing the design of the English character "WAIV".
- the slide jig 10 and the electrode concave mold 20 are placed on a manufacturing apparatus, connected to a high-frequency oscillator, and arranged so as to be relatively close to each other and separated from each other.
- the slide jig 10 is a mold located at the center in the length direction, the electrode flat plate mold 11 in FIG. 1, and the one-point chain wire F of the electrode convex mold 14 in FIG. Connect to a high frequency oscillator so that high frequencies are continuously oscillated in the range indicated by. Further, a high frequency oscillator is connected to the electrode concave mold 20 on the back side where the inverted symbol 21 is not formed.
- the slide jig 10 is placed on a table or the like with the molds 11 and 14 facing upward, and the electrode concave mold 20 has the inverted symbol 21 facing downward and the slide jig. It can be attached to an actuator such as a cylinder so as to be arranged at the center in the length direction of the 10 so that the slide jig 10 can be approached and separated by the operation of the actuator.
- an actuator such as a cylinder so as to be arranged at the center in the length direction of the 10 so that the slide jig 10 can be approached and separated by the operation of the actuator.
- the lower layer material 44 and the upper layer material 46 which are the constituent materials of the three-dimensional emblem 40, are arranged in order, shaped and molded by high-frequency dielectric heating, and further, both materials 44 and 46. Weld.
- a soft sheet of a thermoplastic synthetic resin or a foamed resin sheet can be used, and a thermoplastic synthetic resin such as soft polyvinyl chloride (PVC) can be exemplified.
- PVC soft polyvinyl chloride
- the lower layer material 44 is subjected to high-frequency dielectric heating separately from the upper layer material 46, a thicker thermoplastic synthetic resin sheet or foamed resin sheet than before can be adopted.
- the thickness of the lower layer material 44 can be more than 2 mm, which is difficult to shape by the conventional method.
- the lower layer material 44 is preferably about 2.3 mm to 6 mm, but the present invention can be applied to a material thicker than this.
- the upper layer material 46 is a laminated film including a thermoplastic synthetic resin film that can be molded by high-frequency dielectric heating, a metal vapor deposition layer, and the like.
- the thermoplastic synthetic resin film include soft thermoplastic synthetic resins such as polyvinyl chloride and polyurethane.
- the upper layer material 46 can be, for example, a metal-deposited laminated film in which a thermoplastic synthetic resin film on the upper surface side is metal-deposited.
- the upper layer material 46 may be configured such that an adhesive layer, a dye transfer prevention film, or an adhesive layer is interposed on the lower surface of the metal vapor deposition layer, and a thermoplastic synthetic resin film is further laminated, if necessary. ..
- an ethylene-vinyl alcohol copolymer (EVOH) film can be exemplified, and the dye such as clothes to which the three-dimensional emblem 40 is attached is prevented from being transferred to the surface side of the three-dimensional emblem 40. To do.
- EVOH ethylene-vinyl alcohol copolymer
- the upper surface of the upper layer material 46 can be printed with a desired pattern and a desired color by using transparent color ink, matte ink, gloss ink, or the like. Furthermore, by screen-printing UV-curable transparent UV ink or the like on top of these prints, a fine line pattern is added, giving a high-class feel like molding embroidery, profoundness, precision, depth of color, and metallic feel. Furthermore, it is possible to express fine irregularities and the like.
- the manufacturing apparatus and manufacturing method of the three-dimensional emblem 40 of the present invention are particularly suitable for manufacturing the three-dimensional emblem 40 using the upper layer material 46 including the metal vapor deposition layer. Is.
- ⁇ Lower layer shaping step> This is a step of shaping the lower layer material 44 having the above configuration by high-frequency dielectric heating. Specifically, the electrode concave mold 20 is separated (raised) from the slide jig 10, and the lower layer material 44 is placed on the electrode flat plate mold 11. The lower layer material 44 is arranged so that the unnecessary portion removed in the subsequent step faces the recess 12.
- the slide jig 10 slides the molds 11 and 14 so that the electrode flat plate mold 11 is located at the center in the length direction.
- the electrode concave mold 20 is brought closer (lowered) to the electrode flat plate mold 11 as shown in FIG. 6A, and the lower layer material 44 is sandwiched between the molds 11 and 20.
- the lower layer material 44 is shaped as the insulator heats and melts to soften as a whole. Since the shaping of the lower layer material 44 is performed separately from the upper layer material 46 which is easily whitened, the output of the high frequency oscillator can be increased. Therefore, it is possible to shape the thick lower layer material 44.
- the lower layer material 44 facing the recess 12 softens and a part of 44a invades the recess 12 as shown in FIG.
- the screw 12a is arranged as a retaining member in the recess 12 as shown in FIG. 3A
- the softened lower layer material 44a is entangled with the head of the screw 12a.
- the recess 12 is formed in a wedge shape as shown in FIG. 3B
- the invading lower layer material 44a spreads inside the recess 12.
- the lower layer material 44 is configured so as not to be easily detached from the recess 12, and the shaped lower layer material 44 is held by the electrode flat plate mold 11.
- the lower layer material 44 shaped as shown in FIG. 6B was held by the electrode flat plate mold 11 without being displaced. It remains in the state (the underlying material 44 shaped in FIG. 7 is shown).
- the upper layer material 46 is molded by high-frequency dielectric heating. Specifically, the upper layer material 46 is placed on the electrode convex mold 14 while keeping the electrode concave mold 20 separated (raised) from the slide jig 10.
- the slide jig 10 slides the molds 11 and 14 so that the electrode convex mold 14 is located at the center in the length direction.
- the electrode concave mold 20 is brought closer (lowered) to the electrode convex mold 14, and the upper layer material 46 is sandwiched between the molds 14 and 20.
- Perform high frequency dielectric heating As a result, the upper layer material 46 is formed along the symbols 15 and 21 of the molds 14 and 20 while the insulator is heated and melted and softened as a whole.
- the upper layer material 46 has a thickness of, for example, about 0.2 mm to 0.7 mm, high-frequency dielectric heating of the upper layer material 46 can be performed with an appropriate current, and whitening of the metal vapor deposition layer in the upper layer material 46 can be performed. Be prevented.
- the electrode concave mold 20 is separated (raised) as shown in FIG. 8 (b). At this time, it is desirable to attach the upper layer material 46 to the electrode concave mold 20 with an adhesive tape or the like so that the molded upper layer material 46 does not come off from the electrode concave mold 20.
- the shaped lower layer material 44 and the molded upper layer material 46 are closely integrated. Specifically, while the electrode concave mold 20 is separated (raised) from the slide jig 10, the slide jig 10 has a long electrode flat plate mold 11 in which the lower layer material 44 is held as shown in FIG. Slide the molds 11 and 14 so that they are located in the center in the longitudinal direction. From this state, while operating the high-frequency oscillator, as shown in FIG. 10A, the electrode concave mold 20 holding the upper layer material 46 approaches (descends) the electrode flat plate mold 11 holding the lower layer material 44.
- a part 44a of the lower layer material 44 penetrates into the recess 12, so that the lower layer material 44 is held by the electrode flat plate mold 11 without being displaced, and the upper layer material 46 is held by an adhesive tape or the like. It is held by the electrode concave mold 20 without being displaced. Therefore, the lower layer material 44 and the upper layer material 46 can be aligned without shifting by simply moving the electrode flat plate mold 11 to the center in the length direction of the slide jig 10 and bringing the electrode concave mold mold 20 closer to each other. Welding integration can be performed. As described above, since the positioning work of the lower layer material 44 and the upper layer material 46 can be simplified as much as possible, there is an advantage that the manufacturing efficiency can be improved and the work load can be reduced.
- the electrode concave mold 20 is separated (raised).
- the three-dimensional emblem material 41 in which the lower layer material 44 and the upper layer material 46 are closely integrated remains in the electrode flat plate mold 11.
- ⁇ Release step> When the welding step is completed, the three-dimensional emblem material 41 is cooled and cured, and then peeled off from the electrode flat plate mold 11. As a result, as shown in FIG. 3, the lower layer material 44a that has penetrated into the recess 12 is pulled out from the recess 12, and the three-dimensional emblem material 41 is separated from the electrode flat plate mold 11.
- the released three-dimensional emblem material 41 has an unnecessary portion formed in addition to the pattern portion 42, the unnecessary portion is removed by finishing. Further, in order to attach the three-dimensional emblem 40 to various products as needed, a double-sided tape 48 or a hot melt film and a release paper 49 are placed on the back surface. If the unnecessary portion is removed, the pattern portion 42 shifts when the release paper 49 is removed depending on the design, so an application film is attached to the surface.
- the application film can be exemplified by a polyester film or a sheet in which an acrylic adhesive is applied to paper, but the application film is not limited thereto.
- the unnecessary portion can be removed, for example, by using an engraving die 30 having only a fusing blade 31 that follows the outer peripheral shape of the three-dimensional emblem 40 as shown in FIG.
- the engraving die 30 is placed on a table or the like with the fusing blade 31 facing up.
- the three-dimensional emblem material 41 is fitted into the fusing blade 31 so that the lower layer material 44 faces upward, and the double-sided tape 48 or the hot melt film and the release paper 49 are placed on the lower layer material 44.
- the upper flat plate electrode 32 whose surface is covered with the insulating cloth 33 is brought close to each other, and high frequency is oscillated while pressing to perform dielectric heating, so that the three-dimensional emblem material 41 is shown in FIGS. 13 (a) and 14 (14).
- the fusing blade 31 can be fused at high frequency along the outer peripheral shape by the fusing blade 31.
- the upper layer material 46 extends so as to reach the release paper 49 on the bottom surface, and the entire pattern portion 42 is covered with the upper layer material 46, which is excellent in aesthetics.
- the three-dimensional emblem material 41 is fluctuated, but the release paper 49 remains unfused.
- FIG. 13B is a cross-sectional view of the three-dimensional emblem 40 obtained by Thomson kiss cut or laser kiss cut. According to these kiss cuts, the side surface 42a of the pattern portion 42 of the upper layer material 46 is cut. Therefore, as described above, the cut surface is finished more beautifully by high-frequency fusing in which the upper layer material 46 reaches the bottom surface.
- the application film may be attached to the obtained three-dimensional emblem 40 as needed.
- a high current can be applied during high-frequency dielectric heating, so that a thick lower layer material 44 can be adopted. It is possible to obtain a bulky three-dimensional emblem 40 having a three-dimensional effect and a high-class feeling. For example, when a material having a thickness of 2.3 mm to 6 mm is used as the lower layer material 44, a three-dimensional emblem 40 having a thickness of 2.5 mm to 6.2 mm can be manufactured.
- the lower layer material 44 and the upper layer material 46 are held by the molds 11 and 20, respectively, they can be aligned by simply sliding the molds 11 and 14, increasing the manufacturing efficiency and reducing the work load. ..
- the slide jig 10 is not limited to the illustrated embodiment, and a two-table slide type high frequency welder or a rotary type high frequency welder may be adopted.
- the lower layer material 44 is held in the electrode flat plate mold 11 by allowing a part 44a to penetrate into the recess 12, but the holding method is not limited to this, and the lower layer material 44 is attached with, for example, an adhesive tape. It doesn't matter.
- the layer structure, material, thickness, etc. of the lower layer material 44 and the upper layer material 46 are examples, and it should be understood that changes such as inserting an intermediate layer or the like are possible.
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Abstract
Description
電極平板金型と電極凸型金型を水平面内でスライド可能に具えるスライド治具と、
前記スライド治具に対して上下方向に接近離間可能であって、前記電極平板金型及び前記電極凸型金型に対向可能な位置に配置された電極凹型金型と、
前記電極凹型金型と、前記スライド治具の前記電極平板金型又は前記電極凸型金型を対向させた状態で、対向する金型間に高周波を連続して発振させることで、高周波誘電加熱させる高周波発振器と、
を具え、
金属蒸着積層フィルムを含む上層材料と熱可塑性合成樹脂シートを含む下層材料を高周波誘電加熱により溶着一体化して得られる熱可塑性合成樹脂製の立体エンブレムの製造装置であって、
前記電極平板金型には、前記電極凹型金型と対向する面に1又は複数の凹みが形成されており、前記凹みには、前記下層材料を前記電極平板金型と前記電極凹型金型の間に挟み、高周波誘電加熱を行なったときに、前記下層材料の一部が侵入して、賦形された前記下層材料が前記電極平板金型に保持するようにした。
電極平板金型と電極凸型金型を水平面内でスライド可能に具えるスライド治具と、
前記スライド治具に対して上下方向に接近離間可能であって、前記電極平板金型及び前記電極凸型金型に対向可能な位置に配置された電極凹型金型と、
前記電極凹型金型と、前記スライド治具の前記電極平板金型又は前記電極凸型金型を対向させた状態で、対向する金型間に高周波を連続して発振させることで、高周波誘電加熱させる高周波発振器と、
を具える熱可塑性合成樹脂製の立体エンブレムの製造装置を用い、
金属蒸着積層フィルムを含む上層材料と熱可塑性合成樹脂シートを含む下層材料を高周波誘電加熱により溶着一体化して得られる熱可塑性合成樹脂製の立体エンブレムを製造する方法であって、
前記電極平板金型と前記電極凹型金型の間に前記下層材料を配置し、前記電極平板金型と前記電極凹型金型を接近させて高周波誘電加熱を行なう下層賦形ステップであって、賦形された前記下層材料を前記電極平板金型に保持させ、前記電極平板金型と前記電極凹型金型を離間させる下層賦形ステップと、
前記スライド治具は、前記電極凸型金型を前記電極凹型金型と対向するようスライドさせ、前記電極凸型金型と前記電極凹型金型の間に前記上層材料を配置し、前記電極凸型金型と前記電極凹型金型を接近させて高周波誘電加熱を行なうことにより前記上層材料を成形する上層成形ステップであって、成形された前記上層材料を前記電極凹型金型に保持させ、前記電極凸型金型と前記電極凹型金型を離間させる上層成形ステップと、
前記スライド治具は、前記下層材料を保持した前記電極平板金型を、前記上層材料を保持した前記電極凹型金型と対向するようスライドさせ、前記電極平板金型と前記電極凹型金型を接近させて、前記下層材料と前記上層材料を重ねて押圧しつつ、高周波誘電加熱を行なうことにより、前記下層材料と前記上層材料を溶着させ、前記電極平板金型と前記電極凹型金型を離間させる溶着ステップと、
を含む。
上記構成の下層材料44を高周波誘電加熱により賦形するステップである。具体的には、電極凹型金型20をスライド治具10から離間(上昇)させ、電極平板金型11に下層材料44を載置する。下層材料44は、後工程にて除去される不要部分が凹み12と対向するよう配置する。
次に、上層材料46を高周波誘電加熱により成形する。具体的には、電極凹型金型20をスライド治具10から離間(上昇)させたまま、電極凸型金型14に上層材料46を載置する。
続いて、賦形された下層材料44と成形された上層材料46を密着一体化させる。具体的には、電極凹型金型20をスライド治具10から離間(上昇)させたまま、スライド治具10は、図9に示すように下層材料44が保持された電極平板金型11が長さ方向中央に位置するように金型11,14をスライドさせる。この状態から高周波発振器を作動させつつ、図10(a)に示すように、上層材料46が保持された電極凹型金型20を、下層材料44が保持された電極平板金型11に接近(下降)させ、金型11,20で下層材料44と上層材料46を密着させながら、高周波誘電加熱を行なう。これにより、下層材料44と上層材料46は、絶縁体が再度発熱溶融して密着一体化する。また、この高周波誘電加熱により、下層材料44と上層材料46の形状が確かなものになる。
溶着ステップが完了すると、立体エンブレム材料41が冷却されて硬化した後、電極平板金型11から引き剥がす。これにより、図3に示すように凹み12に侵入していた下層材料44aが凹み12から引き出され、立体エンブレム材料41は電極平板金型11から離脱する。
離型された立体エンブレム材料41は、模様部分42以外に不要部分が形成されているから、仕上げ加工により不要部分を除去する。また、必要に応じて立体エンブレム40を種々の製品に装着するために、裏面に両面テープ48又はホットメルトフィルムと、離型紙49を載置する。なお、不要部分を除去すると、図柄によっては離型紙49を外したときに、模様部分42がずれてしまうため、表面にアプリケーションフィルムを貼着する。アプリケーションフィルムは、ポリエステルフィルムや紙にアクリル系粘着剤を塗布したシートを例示することができるが、これに限定されるものではない。
11 電極平板金型
12 凹み
12a ビス
14 電極凸型金型
20 電極凹型金型
40 立体エンブレム
44 下層材料
44a 凹みに侵入した下層材料
46 上層材料
Claims (6)
- 電極平板金型と電極凸型金型を水平面内でスライド可能に具えるスライド治具と、
前記スライド治具に対して上下方向に接近離間可能であって、前記電極平板金型及び前記電極凸型金型に対向可能な位置に配置された電極凹型金型と、
前記電極凹型金型と、前記スライド治具の前記電極平板金型又は前記電極凸型金型を対向させた状態で、対向する金型間に高周波を連続して発振させることで、高周波誘電加熱させる高周波発振器と、
を具え、
金属蒸着積層フィルムを含む上層材料と熱可塑性合成樹脂シートを含む下層材料を高周波誘電加熱により溶着一体化して得られる熱可塑性合成樹脂製の立体エンブレムの製造装置であって、
前記電極平板金型には、前記電極凹型金型と対向する面に1又は複数の凹みが形成されており、前記凹みには、前記下層材料を前記電極平板金型と前記電極凹型金型の間に挟み、高周波誘電加熱を行なったときに、前記下層材料の一部が侵入して、賦形された前記下層材料が前記電極平板金型に保持される、
熱可塑性合成樹脂製の立体エンブレムの製造装置。 - 前記電極平板金型の前記凹みには、内部に侵入した前記下層材料の抜止め部材が形成されている、
請求項1に記載の熱可塑性合成樹脂製の立体エンブレムの製造装置。 - 前記電極平板金型の前記凹みは、内部が拡径したくさび形状である、
請求項1に記載の熱可塑性合成樹脂製の立体エンブレムの製造装置。 - 電極平板金型と電極凸型金型を水平面内でスライド可能に具えるスライド治具と、
前記スライド治具に対して上下方向に接近離間可能であって、前記電極平板金型及び前記電極凸型金型に対向可能な位置に配置された電極凹型金型と、
前記電極凹型金型と、前記スライド治具の前記電極平板金型又は前記電極凸型金型を対向させた状態で、対向する金型間に高周波を連続して発振させることで、高周波誘電加熱させる高周波発振器と、
を具える熱可塑性合成樹脂製の立体エンブレムの製造装置を用い、
金属蒸着積層フィルムを含む上層材料と熱可塑性合成樹脂シートを含む下層材料を高周波誘電加熱により溶着一体化して得られる熱可塑性合成樹脂製の立体エンブレムを製造する方法であって、
前記電極平板金型と前記電極凹型金型の間に前記下層材料を配置し、前記電極平板金型と前記電極凹型金型を接近させて高周波誘電加熱を行なう下層賦形ステップであって、賦形された前記下層材料を前記電極平板金型に保持させ、前記電極平板金型と前記電極凹型金型を離間させる下層賦形ステップと、
前記スライド治具は、前記電極凸型金型を前記電極凹型金型と対向するようスライドさせ、前記電極凸型金型と前記電極凹型金型の間に前記上層材料を配置し、前記電極凸型金型と前記電極凹型金型を接近させて高周波誘電加熱を行なうことにより前記上層材料を成形する上層成形ステップであって、成形された前記上層材料を前記電極凹型金型に保持させ、前記電極凸型金型と前記電極凹型金型を離間させる上層成形ステップと、
前記スライド治具は、前記下層材料を保持した前記電極平板金型を、前記上層材料を保持した前記電極凹型金型と対向するようスライドさせ、前記電極平板金型と前記電極凹型金型を接近させて、前記下層材料と前記上層材料を重ねて押圧しつつ、高周波誘電加熱を行なうことにより、前記下層材料と前記上層材料を溶着させ、前記電極平板金型と前記電極凹型金型を離間させる溶着ステップと、
を含む熱可塑性合成樹脂製の立体エンブレムの製造方法。 - 前記電極平板金型には、前記電極凹型金型と対向する面に1又は複数の凹みが形成されており、前記下層賦形ステップにて前記凹みに前記下層材料の一部が侵入し、前記電極平板金型に前記下層材料を保持する、
請求項4に記載の熱可塑性合成樹脂製の立体エンブレムの製造方法。 - 前記下層賦形ステップは、前記電極平板金型に前記下層材料を粘着テープで貼着することにより、前記電極平板金型に前記下層材料を保持する、
請求項4に記載の熱可塑性合成樹脂製の立体エンブレムの製造方法。
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