WO2020206994A1 - 背板以及显示装置 - Google Patents

背板以及显示装置 Download PDF

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Publication number
WO2020206994A1
WO2020206994A1 PCT/CN2019/114844 CN2019114844W WO2020206994A1 WO 2020206994 A1 WO2020206994 A1 WO 2020206994A1 CN 2019114844 W CN2019114844 W CN 2019114844W WO 2020206994 A1 WO2020206994 A1 WO 2020206994A1
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WO
WIPO (PCT)
Prior art keywords
external electronic
electronic component
binding
area
length
Prior art date
Application number
PCT/CN2019/114844
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English (en)
French (fr)
Inventor
林涛
李素华
柴东亚
李兵
Original Assignee
云谷（固安）科技有限公司
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Application filed by 云谷（固安）科技有限公司 filed Critical 云谷（固安）科技有限公司
Publication of WO2020206994A1 publication Critical patent/WO2020206994A1/zh
Priority to US17/315,248 priority Critical patent/US20210265454A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/861—Repairing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • This application relates to the field of display technology, and in particular to a manufacturing method of a backplane, a display device, and a display device.
  • OLED Organic Light Emitting Devices
  • the backplane of an organic electroluminescent display usually includes a display area (AA) and an outer lead bonding (OLB) area.
  • the display area and the peripheral circuit pressing area are generally electrically connected through metal terminal bonding.
  • the voltage and control signals required to drive the display area come from an external drive chip.
  • the drive chip generally needs to be connected to the peripheral circuit voltage through a chip on film (COF) or a chip on film (PI, COP). ⁇ .
  • embodiments of the present application provide a backplane, a display device, and a manufacturing method of the display device, so as to reduce the cost of scrapping when the backplane of the display device has defective binding products.
  • a backplane includes a display area, a first binding area, and a second binding area.
  • the first binding area is detachably arranged on a side of the second binding area away from the display area. Both the first binding zone and the second binding zone can be bound with external electronic components.
  • the first binding area can be disassembled to make the second binding area cooperate with external electronic components, so that the display device can be repaired in the module stage, and the scrap cost is reduced.
  • the embodiment of the present invention also discloses a display device, which includes the above-mentioned backplane, the external electronic components and the outer frame;
  • the external electronic component includes a first external electronic component provided with a driving element, and a first groove and a second groove that can accommodate the driving element are provided on the outer frame.
  • the embodiment of the present invention also discloses a display device, including the above-mentioned backplane, the external element and the outer frame;
  • the external element includes a first external electronic component provided with a driving element, and a third groove capable of accommodating the driving element is provided on the outer frame.
  • the first binding area of the backplane when the first binding area of the backplane is defective, the first binding area can be detached to bind external electronic components to the second binding area, so that the second binding area can be Effectively bind the peripheral circuit and the backplane to achieve effective binding, effectively solving the problem of high scrap cost when defective products appear when there is only one binding area.
  • Fig. 1 is a schematic top view of a backplane of an embodiment of the present application
  • Figure 2 is an A-A cross-sectional view of the back plate of an embodiment of the present application.
  • FIG. 3 is a schematic diagram of metal terminals connected in parallel according to an embodiment of the present application.
  • FIG. 4 is a schematic diagram of metal terminals connected in series according to an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of a display device provided with a first binding area and a second binding area according to an embodiment of the present application;
  • FIG. 6 is a schematic structural diagram of a display device provided with only a second binding area according to an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a display device provided with a first binding area and a second binding area according to an embodiment of the present application
  • FIG. 8 is a schematic structural diagram of a display device provided with only a second binding area according to an embodiment of the present application.
  • FIG. 9 is a flowchart of a manufacturing method of a display device according to an embodiment of the present application.
  • FIG. 1 is a schematic top view of a backplane of an embodiment of the application.
  • the backplane includes a display area 3, a first binding area 1 and a second binding area 2; the first binding area 1 is detachable It is arranged on the side of the second binding area 2 away from the display area 3; the first binding area 1 and the second binding area 2 can be bound with external electronic components.
  • the external electronic components refer to electronic components independent of the backplane.
  • the display area 3 is a display component, which may specifically include structures such as a substrate, a light emitting device, and an encapsulation layer.
  • the substrate may include a flexible substrate or a rigid substrate, wherein the flexible substrate may be made of a flexible material.
  • the flexible material may be polyimide PI (Polyimide) polymer, polycarbonate PC (Polycarbonate) resin, also known as PC plastic or polyethylene terephthalate (PET) plastic.
  • the rigid substrate can be made of organic glass.
  • the light-emitting device may be one of AMOLED devices, Micro-LED devices, quantum dot devices and the like.
  • the first binding zone 1 and the second binding zone 2 are binding components, which may include one or more layers.
  • the display area 3, the first binding area 1 and the second binding area 2 are all components of the backplane.
  • the display area 3, the first binding area 1 and the second binding area 2 may be arranged in parallel.
  • the first binding area 1 is arranged on a side of the second binding area 2 away from the display area 3.
  • the first binding zone 1 is set to be detachable, that is, the first binding zone 1 can be disassembled, or the first binding zone 1 may not be used and not disassembled.
  • the operation of the first binding zone 1 can be selected according to needs.
  • the first binding zone 1 and the second binding zone 2 are two binding zones with the same structure and function, and can be used interchangeably. Both the first binding area 1 and the second binding area 2 can be bound with external electronic components. The first binding area 1 and the second binding area 2 are bound to external electronic components in an alternative manner. The first binding zone 1 is preferentially bound with external electronic components, and the spare second binding zone 2 can be bound with external electronic components. When the module manufacturing process is bad and the first bonding area 1 is damaged, the second bonding area 2 is bound with external electronic components to prevent the first bonding area 1 from tearing off when the module manufacturing process is bad. , Causing damage to the binding site, resulting in damage to the backplane, affecting the function of the backplane, and causing product scrapping.
  • the damaged first binding area 1 can be disassembled, so that the backplane can be repaired and the cost of scrapping can be reduced. At this time, since the first binding area 1 no longer affects the binding function, the first binding area 1 may continue to be stored in the backplane, which is not limited in this application.
  • the external electronic component can be bound to the first binding zone 1 or the second binding zone 2, where the external electronic component can be a component independent of the backplane, specifically it can be a flip chip film, a flexible circuit board, a driver IC etc.
  • the backplane includes external electronic components of the first binding zone 1 and the second binding zone 2.
  • a first protective layer 4 is provided on the second binding area 2.
  • the first protective layer 4 is an independent structural component, and can also be other components already provided in the backplane.
  • the first protective layer 4 may be metal, organic material or inorganic material, which is not limited in this application.
  • the backplane further includes an encapsulation layer.
  • An encapsulation layer covers the display area 3, and an encapsulation protective film is arranged on the encapsulation layer.
  • the encapsulation layer is used to encapsulate the devices in the display area 3, such as encapsulating AMOLED.
  • an encapsulation protective film is provided to protect the encapsulation layer.
  • the second binding area 2 is provided with the same protective film, that is, the first protective layer 4 is an encapsulation protective film, so that the same process is used to protect the second binding area 2 and the process is simplified .
  • both the first binding area 1 and the second binding area 2 include a metal terminal 6 and a second protective layer 7 arranged around the metal terminal.
  • Both the first binding area 1 and the second binding area 2 include a plurality of metal terminals 6.
  • the metal terminals are bound with external electronic components, and each metal terminal corresponds to an electrical signal on the external electronic components.
  • a second protective layer 7 is arranged around each metal terminal to isolate the metal terminals and avoid signal crosstalk.
  • both the first binding area 1 and the second binding area 2 include metal terminals, and the metal terminals of the first binding area 1 and the metal terminals of the second binding area 2 exist One-to-one correspondence.
  • the metal terminal 6 of the first binding area 1 and the corresponding metal terminal 6 of the second binding area 2 are directly connected to the same terminal of the circuit element 5 in the backplane, that is, the first binding area 1 and the second binding area Zone 2 can be used interchangeably.
  • the first binding area 1 includes a plurality of insulated and separated metal terminals;
  • the second binding area 2 includes a plurality of insulated and separated metal terminals.
  • the metal terminals of the first binding area 1 and the metal terminals of the second binding area 2 correspond one to one.
  • the circuit element 5 may be a circuit element 5 on the backplane for transmitting data signals, or a circuit element 5 on the backplane for transmitting scan signals, or a pixel circuit.
  • the electrical signals on the external electronic components are transmitted to the circuit on the backplane through the bonded metal terminals 6 Element 5.
  • external electronic components such as data signals on the drive chip are transmitted to the circuit elements 5 on the AMOLED panel, such as pixel circuits, through the bound metal terminals 6, to control the pixels to emit light.
  • FIG 3 of this embodiment schematically shows the connection relationship between the three metal terminals of the first binding area 1 and the three metal terminals of the second binding area 2 and the circuit element 5 on the backplane.
  • the number of metal terminals in the first binding zone 1 and the second binding zone 2 is set according to actual needs, which is not limited in this application.
  • FIG. 4 there is a one-to-one correspondence between the metal terminals of the first bonding area 1 and the metal terminals of the second bonding area 2, and the metal terminals 6 of the first bonding area 1 are The corresponding metal terminals 6 of the second bonding area 2 are connected in series to the same terminal of the circuit element 5 in the backplane.
  • the electrical signals on the external electronic components pass through the metal terminals 6 of the first binding zone, and then pass through the metal terminals 6 of the second binding zone, and are transmitted to the backplane ⁇ circuit element5.
  • the electrical signal on the external electronic component is directly transmitted to the circuit element 5 in the backplane through the metal terminal 6 of the second binding zone.
  • Both sides of the first binding area 1 and the second binding area 2 can be provided with alignment marks such as "cross", and square marks can be provided on both sides of the external electronic components.
  • FIG. 4 of the present embodiment schematically shows the connection relationship between the three metal terminals 6 of the first binding area 1 and the three metal terminals 6 of the second binding area 2 and the terminals of the circuit element 5 on the backplane .
  • the number of metal terminals in the first binding zone 1 and the second binding zone 2 in the actual product is set according to actual needs, which is not limited in this application.
  • the embodiment of the present application also provides a display device 10.
  • the display device includes the backplane 11 described in any of the above embodiments, the first external electronic component 13 provided with the driving element 12, the second external electronic component 14 and the outer frame 15.
  • the outer frame 15 is provided with a first groove 16 and a second groove 17 for accommodating the driving element 12;
  • the back plate 11 is also provided with a first fixing portion 18 and a second fixing portion 19 for fixing the second external electronic component 14.
  • the second groove 17 is arranged on the side of the first groove 16 close to the first fixing portion 18; the second fixing portion 19 is arranged on The side of the first fixing portion 18 away from the second external electronic component 14.
  • the driving element 12 is accommodated in the first groove 16, and the second external electronic component 14 is fixed to the first fixing portion 18.
  • the second external electronic component 14 is fixed to the first fixing portion 18 by a snap connection.
  • the length of the first external electronic component 13 is the first length
  • the length of the second external electronic component 14 is the third length.
  • the driving element 12 is accommodated in the second groove 17, and the second external electronic component 14 is fixed to The second fixed part 19.
  • the second external electronic component 14 is fixed to the second fixing portion 19 by a snap connection.
  • the length of the first external electronic component 13 is the second length
  • the length of the second external electronic component 14 is the fourth length.
  • the distance between the first groove 16 and the second groove 17 is one
  • the distance between the first fixing portion 18 and the second fixing portion 19 is two
  • the distance between the first binding zone 1 and the second binding zone 2 Are equally spaced.
  • the driving element 12 of the first external electronic component 13 can still be accommodated in the second groove 17, and the second external The electronic component 14 can still be fixed to the second fixing portion 19. That is, the first length is equal to the second length, and the third length is equal to the fourth length. The lengths of the first external electronic component 13 and the second external electronic component 14 do not need to be changed to achieve the first binding zone 1 or the second binding The binding of zone 2.
  • the driving element 12 may be used to electrically drive the electronic element 5 on the backplane, for example, it may be a driving IC chip.
  • the first external electronic component 13 may be a COF or a COP, and the driving element 12 may be a driving IC chip provided on the COF or the COP.
  • the second external electronic component 14 may be a flexible circuit board, and the second external electronic component 14 is electrically connected to the first external electronic component 13.
  • the first external electronic component 13 and the second external electronic component 14 may constitute an external electronic component, that is, a peripheral circuit.
  • the first external electronic component 13 and the backplane 11 are bonded and connected through the first bonding area 1 or the second bonding area 2, that is, the peripheral circuit is electrically connected to the backplane 11.
  • the second external electronic component 14 is connected and fixed to the back plate 11 through the first fixing portion 18 or the second fixing portion 19.
  • the backplane 11 and the peripheral circuit are located in the outer frame 15.
  • the outer frame 15 protects the back plate 11, the driving element 12, the first external electronic component 13 and the second external electronic component 14 located inside.
  • the driving element 12 generally has a relatively large thickness, and the outer frame 15 needs to be provided with a receiving groove. Since the backplane 11 of the present application is provided with two binding areas, correspondingly, the first groove 16 and the second groove 17 are provided on the outer frame 15 for accommodating the driving elements 12 in the two binding modes.
  • the back plate 11 is also provided with a first fixing portion 18 and a second fixing portion 19 for fixing the second external electronic component 14 in two binding situations.
  • the second fixing portion 19 is located at the end of the second external electronic component 14 away from the first external electronic component 13, so that the first external electronic component 13 and the second external electronic component 14 do not need to be changed in length to achieve the first binding.
  • the binding and interchangeability of the fixed area 1 or the second binding area 2 makes the design of the display device more dexterous and compact.
  • the first binding area 1 when there is only the second binding area 2 on the backplane 11, the first binding area 1 may be disassembled, and the driving element 12 is accommodated in the second groove 17 on the outer frame, and the second outer The electronic component 14 is fixed to the second fixing portion 19, at this time the first external electronic component 13 has the second length, and the second external electronic component 14 has the fourth length.
  • the backplane 11 has the first binding zone 1 and the second binding zone 2, that is, when the first binding zone 1 is preferentially bound, and the second binding zone 2 is not used for binding
  • the driving element 12 is accommodated in the first binding zone 1.
  • the length of the first external electronic component 13 is the first length
  • the length of the second external electronic component 14 is the third length.
  • the second length is equal to the first length
  • the fourth length is equal to the third length.
  • the embodiment of the present application also provides a display device 20.
  • the display device 20 includes the backplane 21 described in any of the above embodiments, the first external electronic component 23 provided with the driving element 22, the second external electronic component 24 and the outer frame 25.
  • the outer frame 25 is provided with a third groove 26 for accommodating the driving element 22, and the back plate 21 is provided with a first fixing portion 27 for fixing the second external electronic component 24.
  • the back plate 21 is provided with a first binding area 1 and a second binding area 2, the driving element 22 is accommodated in the third groove 26, and the second external electronic component 24 is fixed to the first fixing portion 27.
  • the length of the first external electronic component 23 is the fifth length
  • the length of the second external electronic component 24 is the seventh length.
  • the display device 20 includes a back plate 21, a first external electronic component 23 provided with a driving element 22, a second external electronic component 24 and an outer frame 25.
  • the outer frame 25 is provided with a third groove 26 for accommodating the driving element 22, and the back plate 21 is provided with a first fixing portion 27 for fixing the second external electronic component 24. Only the second binding area 2 is provided on the back plate 21, the driving elements 22 are all accommodated in the third groove 26, and the second external electronic components 24 are all fixed to the first fixing portion 27.
  • the first external electronic component 23 has the sixth length
  • the second external electronic component 24 has the eighth length.
  • the seventh length and the eighth length are equal; the difference between the sixth length and the fifth length is equal to the distance d between the first binding zone 1 and the second binding zone 2, that is, the two types of binding
  • the length difference of the first external electronic component 23 in a fixed manner is equal to the distance d between the first binding area 1 and the second binding area 2.
  • the sixth length of the first external electronic component 23 is longer than when the first binding zone 1 and the second binding zone 2 are provided on the backplane 21
  • the fifth length d of the first external electronic component 23 is long.
  • the length of the first external electronic component 23 is increased.
  • the driving element 22 is accommodated in the same third groove 26, and the second external electronic component 24 can use the first fixing portion 27, which is beneficial to simplify the device.
  • the above-mentioned display device may be a digital device such as a mobile phone, a tablet, a palmtop computer, an AR display, a VR display, a car display, etc., which is not limited by the present invention.
  • An embodiment of the application also provides a method for manufacturing a display device.
  • the display device is the display device described in any of the above embodiments, and includes a display area, a first binding area, a second binding area, and external electronic components.
  • the first binding area is detachably arranged on a side of the second binding area away from the display area, and both the first binding area and the second binding area can be bound to external electronic components It is determined that the first binding area is bound to the external electronic component.
  • the manufacturing method of the display device is shown in FIG. 9 and includes:
  • the first binding area and the external electronic component are bound first, and then a binding test is performed to determine whether the binding is good.
  • the second binding zone needs to be used.
  • the first binding zone may be disassembled or not.
  • the disassembly method can be laser cutting or etching cutting, which is not limited in this application, and the process can be selected as required.
  • a first protection layer is provided on the second binding area.
  • step S3 Between step S3 and step S4, further steps are included:
  • a first protective layer is provided on the second bonding area. Since the first protective layer is provided on the second binding area, when the second binding area is needed, the first protective layer needs to be cut first to expose the second binding area, and then the exposed second binding area The metal terminals are bound to external electronic components.
  • the cutting method here includes laser cutting, etching cutting, etc. This application does not limit this, and the process can be selected according to needs.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本申请提供了一种背板、显示装置和显示装置的制作方法，所述背板包括显示区、第一绑定区和第二绑定区，所述第一绑定区可拆卸设置于所述第二绑定区的远离所述显示区的一侧，所述第一绑定区和所述第二绑定区均可与外部电子部件绑定。通过设置两个绑定区，当出现模组制程不良品时，拆卸第一绑定区，使第二绑定区与外部电子部件配合，实现显示装置在模组阶段可修复，降低产品报废成本。

Description

背板以及显示装置
相关申请的交叉引用
本申请要求于2019年4月12日提交中国专利局，申请号为201910296084.0，申请名称为“背板、显示装置及显示装置的制备方法”的中国专利申请的优先权,在此将其全文引入作为参考。
技术领域
本申请涉及显示技术领域，尤其涉及一种背板、显示装置及显示装置的制备方法。
背景技术
当今，随着多媒体技术的发展和信息社会的来临，对电子设备的要求越来越高。其中，有机电致发光显示器(Organic Light Emitting Devices，OLED)具有自主发光、低电压直流驱动、全固化、视角宽、颜色丰富等一系列的优点，与液晶显示器相比，有机电致发光显示器不需要背光源，视角大，功率低，其响应速度可达液晶显示器的1000倍，其制造成本却低于同等分辨率的液晶显示器。因此，有机电致发光显示器具有广阔的应用前景，被看作极赋竞争力的未来平板显示技术之一。
有机电致发光显示器的背板通常包括显示区(active area，AA)和外围电路压合区(outer lead bonding，OLB)。显示区与外围电路压合区一般通过金属端子绑定进行电性连接。驱动显示区工作所需要的电压以及控制信号都来自于外接的驱动芯片，驱动芯片一般需要经过覆晶薄膜(Chip On Film,COF)或者膜上芯片(Chip On PI,COP)连接至外围电路压合区。
实际生产中，存在绑定不良造成增大报废成本的问题。
发明内容
为解决上述技术问题，本申请实施例提供了一种背板、显示装置及显示装置的制作方法，以降低显示装置的背板出现绑定不良品时的报废成本。
为实现上述目的，本发明实施例提供了如下技术方案：
一种背板，包括显示区、第一绑定区和第二绑定区，所述第一绑定区可拆卸设置于所述第二绑定区的远离所述显示区的一侧，所述第一绑定区和所述第二绑定区均可与外部电子部件绑定。当背板出现模组制程不良时，可以拆卸第一绑定区，使第二绑定区与外部电子部件配合，实现显示装置在模组阶段产品可修复，降低报废成本。
本发明实施例还公开了一种显示装置，包括如上述的背板、所述外部电子部件和外框；
所述外部电子部件包括设置有驱动元件的第一外部电子部件，所述外框上设置有可容纳所述驱动元件的第一凹槽和第二凹槽。
本发明实施例还公开了一种显示装置，包括如上述的背板、所述外部元件和外框；
所述外部元件包括设置有驱动元件的第一外部电子部件，所述外框上设置有可容纳所述驱动元件的第三凹槽。
本申请的背板以及显示装置，当背板的第一绑定区出现不良时，可拆卸第一绑定区，把外部电子部件绑定至第二绑定区，使第二绑定区能够有效绑定外围电路与背板，实现有效绑定，有效解决当只有一个绑定区的情况下出现不良品时报废成本过高的问题。
附图说明
图1是本申请一实施例的背板的俯视示意图；
图2是本申请一实施例的背板的A-A截面图；
图3是本申请一实施例的金属端子并联示意图；
图4是本申请一实施例的金属端子串联示意图；
图5是本申请一实施例的设置有第一绑定区和第二绑定区的显示装置的结构示意图；
图6是本申请一实施例的仅设置有第二绑定区的显示装置的结构示意图；
图7是本申请一实施例的设置有第一绑定区和第二绑定区的显示装置的结构示意图；
图8是本申请一实施例的仅设置有第二绑定区的显示装置的结构示意图；
图9是本申请一实施例的显示装置的制备方法流程图。
具体实施方式
这里将详细地对示例性实施例进行说明，其示例表示在附图中。下面的描述涉及附图 时，除非另有表示，不同附图中的相同数字表示相同或相似的要素。以下示例性实施例中所描述的实施方式并不代表与本申请相一致的所有实施方式。相反，它们仅是与如所附权利要求书中所详述的、本申请的一些方面相一致的装置的例子。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
当进行模组绑定测试出现柔性OLED模组制程不良品或COF/COP绑定制程级原材不良时，由于撕除COF/COP会使背板处的金属端子同时被剥离，将使产品报废从而造成产品报废成本过高。针对这一OLED背板存在的问题，即当需要维修绑定制程不良品时，出现金属端子损坏，进而造成产品报废成本高的问题，下面结合附图，对本申请实施例中的显示面板及其制备方法进行详细说明。在不冲突的情况下，下述的实施例及实施方式中的特征可以相互补充或相互组合。
本申请实施例提供了一种背板。本申请的背板可以用于AMOLED面板、Micro-LED面板、量子点面板等，以下仅以AMOLED面板为例进行说明。参考图1，图1为本申请一实施例的背板的俯视示意图，所述背板包括显示区3、第一绑定区1和第二绑定区2；第一绑定区1可拆卸设置于第二绑定区2的远离显示区3的一侧；第一绑定区1和第二绑定区2均可与外部电子部件绑定。所述外部电子部件指的是独立于背板以外的电子部件。
需要说明的是，显示区3为显示部件，具体可以包括基板、发光器件、封装层等结构。所述基板可以包括柔性基板或者刚性基板，其中柔性基板可以采用柔性材料制成。所述柔性材料可以为聚酰亚胺PI(Polyimide)聚合物，聚碳酸酯PC(Polycarbonate)树脂，也称为PC塑料或聚对苯二甲酸类PET(Polyethylene terephthalate)塑料等。刚性基板可以采用有机玻璃材质制成。所述发光器件可以为AMOLED器件、Micro-LED器件、量子点器件等中的一个。所述第一绑定区1和第二绑定区2为绑定部件，可包括一层或多层结构。显示区3、第一绑定区1和第二绑定区2均为背板的组成部件。
显示区3、第一绑定区1和第二绑定区2可以为并行排布。第一绑定区1设置于第二绑定区2的远离显示区3的一侧。第一绑定区1设置为可拆卸，即可以拆卸第一绑定区1，也可以不使用且也不拆卸第一绑定区1，可以根据需要选择对第一绑定区1的操作。
第一绑定区1和第二绑定区2是结构及功能均相同的两个绑定区，可以互相换用。第 一绑定区1和第二绑定区2均可与外部电子部件绑定。第一绑定区1和第二绑定区2采用择一的方式与外部电子部件绑定。第一绑定区1优先与外部电子部件绑定，备用的第二绑定区2可以与外部电子部件绑定。当出现模组制程不良情况，导致第一绑定区1损坏时，第二绑定区2与外部电子部件绑定，以防止当出现模组制程不良情况，撕除第一绑定区1时，造成绑定处损坏，从而导致背板损伤，影响背板功能，进而造成产品报废。由于备用的第二绑定区2与外部电子部件绑定，对于已损坏的第一绑定区1，可进行拆卸处理，从而实现背板可修复，降低报废成本。此时，由于第一绑定区1不再影响绑定功能，第一绑定区1也可以继续留存于背板中，本申请对此不进行限定。
外部电子部件可与第一绑定区1或第二绑定区2绑定，此处的外部电子部件可以为独立于背板以外的一个部件，具体可以为覆晶薄膜、柔性电路板、驱动IC等。
在一实施例中，如图2所示，背板包括第一绑定区1和第二绑定区2外部电子部件。为了保护第二绑定区2，防止第二绑定区2被划伤、腐蚀，第二绑定区2上设置第一保护层4。第一保护层4为独立的结构件，也可以为背板中已设置的其他部件。第一保护层4可以为金属，也可以为有机材料或者无机材料，本申请对此不进行限定。
在一实施例中，背板还包括封装层。封装层覆盖所述显示区3，封装层上设置有封装保护膜。封装层用于对显示区3器件进行封装，如对AMOLED进行封装。为了便于封装完成后必需的后续绑定等操作，设置封装保护膜对封装层进行保护。为了进一步地保护第二绑定区2，第二绑定区2设置相同的保护膜，即第一保护层4为封装保护膜，从而实现使用相同的工艺保护第二绑定区2，简化工艺。
在一实施例中，如图2所示，第一绑定区1和第二绑定区2均包括金属端子6和设置在金属端子周围的第二保护层7。第一绑定区1和第二绑定区2均包括多个金属端子6。金属端子与外部电子部件绑定，每个金属端子对应外部电子部件上的一条电信号。每个金属端子周围设置有第二保护层7，使金属端子绝缘分隔，避免信号串扰。
在一实施例中，如图3所示，第一绑定区1和第二绑定区2均包括金属端子，第一绑定区1的金属端子和第二绑定区2的金属端子存在一一对应的关系。所述第一绑定区1的金属端子6和第二绑定区2的对应金属端子6直接连接至背板内的电路元件5的同一端子，即第一绑定区1和第二绑定区2可以相互替换使用。在一个实施例中，所述第一绑定区1 包括多个绝缘分隔的金属端子；所述第二绑定区2包括多个绝缘分隔的金属端子。具体地，第一绑定区1的金属端子和第二绑定区2的金属端子一一对应。在一个实施例中，所述电路元件5可以为背板上的用于传输数据信号的电路元件5，也可以为背板上的用于传输扫描信号的电路元件5，也可以为像素电路。第一绑定区1或者第二绑定区2的金属端子与外部电子部件上的金属端子绑定后，外部电子部件上的电信号通过绑定的金属端子6，传输到背板上的电路元件5。具体就AMOLED面板来说，外部电子部件比如驱动芯片上的数据信号，通过绑定的金属端子6，传输至AMOLED面板上的电路元件5比如像素电路，控制像素发光。本实施例的图3示意性地示出第一绑定区1的三个金属端子和第二绑定区2的三个金属端子的与背板上的电路元件5的连接关系，实际产品中第一绑定区1和第二绑定区2的金属端子数量根据实际需要进行设定，本申请对此不进行限定。
在另一实施例中，如图4所示，第一绑定区1的金属端子和第二绑定区2的金属端子存在一一对应的关系，第一绑定区1的金属端子6与第二绑定区2的对应金属端子6串联连接至背板内的电路元件5的同一端子。当第一绑定区1与外部电子部件进行绑定时，外部电子部件上的电信号通过第一绑定区的金属端子6，然后经过第二绑定区的金属端子6，传输至背板内的电路元件5。当第二绑定区2与外部电子部件进行绑定时，外部电子部件上的电信号通过第二绑定区的金属端子6直接传输至背板内的电路元件5。第一绑定区1和第二绑定区2上的两侧均可以设置如“十”字对位标记，外部电子部件上的两侧可以设置方块标记。当第一绑定区域1或第二绑定区域2与外部电子部件进行配合绑定时，控制对位标记的相对位置，当“十”字标记恰好位于方块标记的正中间时(也就是如第一绑定区域1上的“十”字与外部电子部件上阵列分布的方块相互重合时)，第一绑定区域1或第二绑定区域2的金属端子6与外部电子部件的金属端子相互对位，实现对位偏差的调整。本实施例的图4示意性地示出了第一绑定区1的三个金属端子6和第二绑定区2的三个金属端子6与背板上的电路元件5的端子的连接关系。实际产品中第一绑定区1和第二绑定区2的金属端子数量根据实际需要进行设定，本申请对此不进行限定。
本申请实施例还提供一种显示装置10。如图5所示，所述显示装置包括如上任一实施例所述的背板11、设置有驱动元件12的第一外部电子部件13、第二外部电子部件14和外框15。外框15上设置有容纳驱动元件12的第一凹槽16和第二凹槽17；背板11上 还设置有固定第二外部电子部件14的第一固定部18和第二固定部19。
在一个实施例中，如图5所示，所述第二凹槽17设置于所述第一凹槽16的靠近所述第一固定部18的一侧；所述第二固定部19设置于所述第一固定部18的远离第二外部电子部件14的一侧。背板11上设置有第一绑定区1和第二绑定区2时，驱动元件12收容于第一凹槽16，第二外部电子部件14固定于第一固定部18。具体地，所述第二外部电子部件14通过卡接方式固定于所述第一固定部18。此时第一外部电子部件13的长度为第一长度，第二外部电子部件14的长度为第三长度。
在本申请的另一实施例中，如图6所示，背板11上仅设置有第二绑定区2时，驱动元件12收容于第二凹槽17，第二外部电子部件14固定于第二固定部19。具体地，所述第二外部电子部件14通过卡接方式固定于所述第二固定部19。此时第一外部电子部件13的长度为第二长度，第二外部电子部件14的长度为第四长度。第一凹槽16和第二凹槽17之间的距离一，第一固定部18和第二固定部19之间的距离二，以及第一绑定区1与第二绑定区2之间的间距相等。
上述实施例中，当第一绑定区1损坏被去掉，第二绑定区2被绑定时，第一外部电子部件13的驱动元件12仍可以收容于第二凹槽17，第二外部电子部件14仍可以固定于第二固定部19。即第一长度等于第二长度，第三长度等于第四长度，第一外部电子部件13和第二外部电子部件14的长度无需改变，即可实现对第一绑定区1或第二绑定区2的绑定。
上述实施例中，驱动元件12可以用于对背板上的电子元件5进行电性驱动，例如可以为驱动IC芯片。第一外部电子部件13可以设置为COF，也可以为COP，驱动元件12为设置于COF或者COP上的驱动IC芯片。第二外部电子部件14可以为柔性电路板，第二外部电子部件14与第一外部电子部件13电连接。第一外部电子部件13与第二外部电子部件14可以构成外部电子部件即外围电路。第一外部电子部件13与背板11通过第一绑定区1或第二绑定区2绑定连接，即外围电路与背板11电连接。第二外部电子部件14通过第一固定部18或者第二固定部19与背板11连接固定。
上述实施例中，背板11与外围电路位于外框15之内。外框15保护位于内部的背板11、驱动元件12、第一外部电子部件13和第二外部电子部件14。驱动元件12一般厚度 较大，需在外框15上设置容纳槽。由于本申请的背板11设置有两个绑定区，则对应在外框15上设置第一凹槽16和第二凹槽17用于容纳分别在两种绑定方式下的驱动元件12。背板11上还设置有固定两种绑定情况下的第二外部电子部件14的第一固定部18和第二固定部19。第二固定部19位于第二外部电子部件14的远离第一外部电子部件13的端部，从而无需改变第一外部电子部件13和第二外部电子部件14的长度，即可实现对第一绑定区1或第二绑定区2的绑定互换，使显示装置设计更为灵巧、紧凑。
上述实施例中，背板11上仅具有第二绑定区2时，第一绑定区1可以是已被拆卸，驱动元件12收容于位于外框上的第二凹槽17，第二外部电子部件14固定于第二固定部19，此时第一外部电子部件13为第二长度，第二外部电子部件14的长度为第四长度。背板11上具有第一绑定区1和第二绑定区2时，即优先绑定第一绑定区1时，第二绑定区2不用于绑定，则驱动元件12收容于第一凹槽16，第二外部电子部件14固定于第一固定部18，此时第一外部电子部件13的长度为第一长度，第二外部电子部件14的长度为第三长度。第二长度和第一长度相等，第四长度与第三长度相等。在两种绑定情况下使用相同规格的第一外部电子部件和第二外部电子部件，可以使装置灵活性、适用性更好，且可以降低使用成本。
本申请实施例还提供一显示装置20。如图7所示，该显示装置20包括如上任一实施例所述的背板21、设置有驱动元件22的第一外部电子部件23、第二外部电子部件24和外框25。外框25上设置有容纳驱动元件22的第三凹槽26，背板21上设置有固定第二外部电子部件24的第一固定部27。背板21上设置有第一绑定区1和第二绑定区2，驱动元件22收容于第三凹槽26，第二外部电子部件24固定于第一固定部27。此时，第一外部电子部件23的长度为第五长度，第二外部电子部件24的长度为第七长度。
本申请的另一实施例中，如图8所示，该显示装置20包括背板21、设置有驱动元件22的第一外部电子部件23、第二外部电子部件24和外框25。外框25上设置有容纳驱动元件22的第三凹槽26，背板21上设置有固定第二外部电子部件24的第一固定部27。背板21上仅设置有第二绑定区2，驱动元件22均收容于第三凹槽26，第二外部电子部件24均固定于第一固定部27。此时，第一外部电子部件23为第六长度，第二外部电子部件24的长度为第八长度。
在上述两个实施例中，第七长度和第八长度相等；第六长度和第五长度的差值等于第一绑定区1与第二绑定区2的距离d，也即两种绑定方式下的第一外部电子部件23的长度差等于第一绑定区1与第二绑定区2的距离d。当背板21上仅设置有第二绑定区2时，第一外部电子部件23的第六长度要比在背板21上设置有第一绑定区1和第二绑定区2时的第一外部电子部件23的第五长度长d。增加第一外部电子部件23的长度，两种绑定方式下，驱动元件22收容于同一第三凹槽26，并且第二外部电子部件24都可以使用第一固定部27，有利于简化装置。
上述显示装置可以为手机、平板、掌上电脑、AR显示器、VR显示器、车载显示器等数码设备，本发明对此不进行限制。
本申请实施例还提供一种显示装置的制备方法，所述显示装置为上述任一实施例所述的显示装置，包括显示区、第一绑定区、第二绑定区、外部电子部件。所述第一绑定区可拆卸设置于所述第二绑定区的远离所述显示区的一侧，所述第一绑定区和所述第二绑定区均可与外部电子部件绑定，所述第一绑定区和所述外部电子部件绑定。显示装置的制备方法如图9所示，包括：
S1，绑定所述第一绑定区与所述外部电子部件；
S2，测定所述第一绑定区与所述外部电子部件的绑定是否良好；
S3，当绑定不良好时，切割所述第一绑定区；
S4，绑定所述第二绑定区与所述外部电子部件。
本实施例中，第一绑定区和外部电子部件首先进行绑定，其次进行绑定测试，判断绑定是否良好。当绑定不良好时，则需要使用第二绑定区，此时可以拆卸第一绑定区，也可以不拆卸第一绑定区。拆卸方式可以选择激光切割的方式，也可以选择刻蚀切割的方式，本申请对此不进行限定，根据需要进行工艺选择即可。
在本实施例中，当拆卸出有问题的第一绑定区后，则背板中仅设置有第二绑定区，第二绑定区与外部电子部件绑定，可使外部电子部件上的信号传输进入背板。
进一步的，第二绑定区上设置有第一保护层。
在步骤S3和步骤S4之间，还包括步骤：
S30，切割所述第一保护层以显露所述第二绑定区。
在本实施例中，为了保护暂时不用的第二绑定区上的金属端子免受氧化、腐蚀，第二绑定区上设置第一保护层。由于第二绑定区上设置有第一保护层，故需要使用第二绑定区时，需要先切割第一保护层，使第二绑定区显露出来，再将显露的第二绑定区的金属端子与外部电子部件绑定。此处的切割方法包括激光切割、刻蚀方式切割等，本申请对此不进行限制，根据需要进行工艺选择即可。
需要指出的是，在附图中，为了图示的清晰可能夸大了层和区域的尺寸。而且可以理解，当元件或层被称为在另一元件或层“上”时，它可以直接在其他元件上，或者可以存在中间的层。另外，可以理解，当元件或层被称为在另一元件或层“下”时，它可以直接在其他元件下，或者可以存在一个以上的中间的层或元件。另外，还可以理解，当层或元件被称为在两层或两个元件“之间”时，它可以为两层或两个元件之间唯一的层，或还可以存在一个以上的中间层或元件。通篇相似的参考标记指示相似的元件。
本领域技术人员在考虑说明书及实践这里公开的公开后，将容易想到本发明的其它实施方案。本发明旨在涵盖本发明的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本发明的一般性原理并包括本发明未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本发明的真正范围和精神由下面的权利要求指出。
应当理解的是，本发明并不局限于上面已经描述并在附图中示出的精确结构，并且可以在不脱离其范围进行各种修改和改变。本发明的范围仅由所附的权利要求来限制。

Claims (20)

  1. 一种背板，包括显示区、第一绑定区和第二绑定区；
    所述第一绑定区可拆卸设置于所述第二绑定区的远离所述显示区的一侧；
    所述第一绑定区和所述第二绑定区均可与外部电子部件绑定。
  2. 根据权利要求1所述的背板，其中，所述第二绑定区上设置有第一保护层。
  3. 根据权利要求2所述的背板，其中，所述背板还包括封装层；
    所述封装层覆盖所述显示区，所述封装层上设置有封装保护膜；
    所述第一保护层为所述封装保护膜。
  4. 根据权利要求1所述的背板，其中，所述第一绑定区和所述第二绑定区均包括金属端子和设置在所述金属端子周围的第二保护层。
  5. 根据权利要求4所述的背板，其中，所述第一绑定区的所述金属端子和第二绑定区的对应所述金属端子直接连接至背板内的电路元件的同一端子。
  6. 根据权利要求4所述的背板，其中，所述第一绑定区的所述金属端子和第二绑定区的对应所述金属端子串联连接至背板内的电路元件的同一端子。
  7. 根据权利要求4所述的背板，其中，所述第一绑定区包括多个绝缘分隔的金属端子；所述第二绑定区包括多个绝缘分隔的金属端子。
  8. 根据权利要求4所述的背板，其中，第一绑定区的多个绝缘分隔的金属端子和第二绑定区的多个绝缘分隔的金属端子一一对应。
  9. 一种显示装置，包括如权利要求1～8任一项所述的背板、所述外部电子部件和外框；
    所述外部电子部件包括设置有驱动元件的第一外部电子部件，所述外框上设置有可容纳所述驱动元件的第一凹槽和第二凹槽。
  10. 根据权利要求9所述的显示装置，其中，所述第一外部电子部件绑定于所述第一绑定区；
    所述驱动元件收容于所述第一凹槽。
  11. 根据权利要求9所述的显示装置，其中，所述第一外部电子部件绑定于所述第二绑定区；
    所述驱动元件收容于所述第二凹槽。
  12. 根据权利要求10所述的显示装置，其中，所述外部电子部件还包括第二外部电子部件；
    所述第二外部电子部件与所述第一外部电子部件的远离所述背板的一端电连接；
    所述背板上还设置有可固定所述第二外部电子部件的第一固定部和第二固定部；
    所述第二外部电子部件固定于所述第一固定部。
  13. 根据权利要求11所述的显示装置，其中，所述外部电子部件还包括第二外部电子部件；
    所述第二外部电子部件与所述第一外部电子部件的远离所述背板的一端电连接；
    所述背板上还设置有可固定所述第二外部电子部件的第一固定部和第二固定部；
    所述第二外部电子部件固定于所述第二固定部。
  14. 根据权利要求12所述显示装置，其中，所述第二外部电子部件通过卡接方式固定于所述第一固定部。
  15. 根据权利要求13所述显示装置，其中，所述第二外部电子部件通过卡接方式固定于所述第二固定部。
  16. 根据权利要求9所述显示装置，其中，
    所述第一外部电子部件绑定于所述第一绑定区，所述第一外部电子部件的长度为第一长度；或者
    所述第一外部电子部件绑定于所述第二绑定区，所述第一外部电子部件的长度为第二长度；
    所述第一长度等于所述第二长度；
    所述第一凹槽与所述第二凹槽的间距等于所述第一绑定区与所述第二绑定区的间距。
  17. 根据权利要求9所述的显示装置，其中，
    所述第二外部电子部件固定于所述第一连接部固定部，所述第二外部电子部件的长度为第三长度；或者
    所述第二外部电子部件固定于所述第二连接部固定部，所述第二外部电子部件的长度为第四长度；
    所述第三长度等于所述第四长度；
    所述第一固定部与所述第二固定部的间距等于所述第一绑定区与所述第二绑定区的间距。
  18. 一种显示装置，包括如权利要求1～8任一项所述的背板、所述外部元件和外框；
    所述外部元件包括设置有驱动元件的第一外部电子部件，所述外框上设置有可容纳所述驱动元件的第三凹槽。
  19. 根据权利要求18所述显示装置，其中，
    所述背板上仅设置有第二绑定区，所述驱动元件收容于所述第三凹槽，所述第一外部电子部件的长度为第五长度；或者
    所述背板上设置有第一绑定区和第二绑定区，所述驱动元件收容于所述第三凹槽，所述第一外部电子部件的长度为第六长度；
    所述第五长度小于所述第六长度，且所述第六长度和所述第五长度的差等于所述第一绑定区与所述第二绑定区的距离。
  20. 根据权利要求18所述显示装置，其中，所述外部元件还包括第二外部电子部件；
    所述第二外部电子部件与所述第一外部电子部件的远离所述背板的一端相连；
    所述背板上还设置有固定所述第二外部电子部件的第一固定部；
    所述第二外部电子部件固定于所述第一固定部。
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