WO2020199251A1 - 背光模组及其制备方法 - Google Patents

背光模组及其制备方法 Download PDF

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Publication number
WO2020199251A1
WO2020199251A1 PCT/CN2019/083041 CN2019083041W WO2020199251A1 WO 2020199251 A1 WO2020199251 A1 WO 2020199251A1 CN 2019083041 W CN2019083041 W CN 2019083041W WO 2020199251 A1 WO2020199251 A1 WO 2020199251A1
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Prior art keywords
backlight module
layer
metal plating
height
driving chip
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Application number
PCT/CN2019/083041
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English (en)
French (fr)
Inventor
林悦霞
熊充
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Publication of WO2020199251A1 publication Critical patent/WO2020199251A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means

Definitions

  • This application relates to the field of display technology, in particular to a backlight module and a preparation method thereof.
  • Mini Light-Emitting Diode can be ultra-thin, multi-zoned and at the same time using small-size chips, which can be comparable to organic light-emitting diodes (Organic LEDs) in reality.
  • Light Emitting Diode (OLED) products are more competitive than OLED in terms of material cost and are favored by the backlight display industry.
  • Mini-LED light boards are used in large-size TV (Television, referred to as TV) backlights, they need to be spliced together from many small-area light boards, and the yellowing degree of different PCB light boards is inconsistent. Will have a great impact on the backlight display effect.
  • the surface of the encapsulant is relatively soft, which may easily cause abrasion and scratches during the assembly of the light board.
  • the prior art LED display backlight module has the problem of yellowing of the PCB lamp board, the backlight display effect is not up to standard, and the packaging rubber is worn and scratched.
  • the backlight module provided by the present application solves the problems of the yellowing phenomenon of the lamp plate of the printed circuit board, the low backlight display effect, and the abrasion and scratching of the packaging rubber.
  • a backlight module comprising: a printed circuit board and a paint layer arranged on the printed circuit board;
  • a plurality of driving chips are arranged on the paint layer at intervals;
  • An encapsulation glue layer which is arranged on the paint layer and wraps the drive chip
  • a plurality of metal plating blocks are arranged on the encapsulation adhesive layer at intervals, and the projection positions of the metal plating blocks on the lacquer layer and the projection positions of the driving chip on the lacquer layer are mutually staggered;
  • the glass plate is laid on the plurality of metal plating blocks.
  • ⁇ is equal to 1/2 times of the light emitting angle of the backlight module
  • h1 is the height of the encapsulant layer
  • h2 is the height of the metal plating block
  • h0 is the height of the driving chip.
  • the light-emitting angle of the backlight module ranges from 120 degrees to 180 degrees.
  • the height of the encapsulant layer, the height of the metal plating block, and the height of the driving chip satisfy the relationship h1>h0>h2.
  • the spacing x of the metal plating block x a+2 ⁇ L2;
  • p is the pitch of the driving chip
  • a is the width of the driving chip
  • the height of the driving chip and the width of the driving chip satisfy the relationship a>h0.
  • the material of the metal plating block includes silver, aluminum or chromium.
  • the material of the encapsulant layer is a transparent material
  • the transparent material includes phenylene polyimide or biphenyl polyimide.
  • the application also provides a backlight module, which includes: a printed circuit board and a paint layer arranged on the printed circuit board;
  • a plurality of driving chips are arranged on the paint layer at intervals;
  • An encapsulation glue layer which is arranged on the paint layer and wraps the drive chip, and the material of the encapsulation glue layer is a transparent material;
  • a plurality of metal plating blocks are arranged on the encapsulation adhesive layer at intervals, and the projection positions of the metal plating blocks on the lacquer layer and the projection positions of the drive chip on the lacquer layer are mutually staggered, wherein,
  • the material of the metal plated block includes silver, aluminum or chromium;
  • the glass plate is laid on the plurality of metal plating blocks.
  • the transparent material includes phenylene type polyimide or biphenyl type polyimide.
  • ⁇ is equal to 1/2 times of the light emitting angle of the backlight module
  • h1 is the height of the encapsulant layer
  • h2 is the height of the metal plating block
  • h0 is the height of the driving chip.
  • the light-emitting angle of the backlight module ranges from 120 degrees to 180 degrees.
  • the height of the encapsulant layer, the height of the metal plating block, and the height of the driving chip satisfy the relationship h1>h0>h2.
  • the spacing x of the metal plating block x a+2 ⁇ L2;
  • p is the pitch of the driving chip
  • a is the width of the driving chip
  • the height of the driving chip and the width of the driving chip satisfy the relationship a>h0.
  • the present application also provides a method for preparing a backlight module, which includes:
  • a printed circuit board is provided, the printed circuit board is coated with a lacquer layer, a plurality of drive chips are arranged on the lacquer layer at intervals, and a packaging glue layer is provided on the multiple drive chips, and the packaging glue layer Package the driving chip;
  • the glass plate formed with the plurality of metal plating blocks and the printed circuit board formed with the encapsulating glue layer are aligned and attached, wherein the projection position of the metal plating block on the paint layer is the same as the driving chip
  • the projection positions on the paint layer are staggered.
  • the photolithography of the metal plating layer to form a plurality of metal plating blocks specifically includes:
  • the height of the packaging glue layer the height of the metal plated block and the height of the driving chip, the width of the driving chip, the pitch of the driving chip and the light emitting angle of the backlight module, the The width of the metal plated block and the distance between the metal plated block;
  • the mask is placed above the metal plating layer, and the metal plating layer is photoetched to form a plurality of metal plating blocks.
  • the beneficial effect of the present application is that, while ensuring that the backlight module is at a certain light mixing distance, by arranging a glass plate with a metal coating on the mold assembly of the packaged printed circuit board, the problem of the yellowing of the printed circuit board is solved. Problems such as the phenomenon of degradation, low backlight display effect, abrasion and scratches on the packaging adhesive layer.
  • FIG. 1 is a first cross-sectional structure diagram of a backlight module provided by the implementation of this application.
  • Fig. 2 is a cross-sectional structure diagram of a prior art backlight module.
  • Figure 3 is a second cross-sectional structure diagram provided by an embodiment of the application.
  • 4a to 4d are flowcharts of the manufacturing method of the backlight module provided by the application embodiment.
  • this figure is a first cross-sectional structure diagram of a backlight module provided by an embodiment of the application.
  • the present application provides a backlight module, the backlight module including: a printed circuit A board 101 and a paint layer 102 provided on the printed circuit board 101;
  • a plurality of driving chips 103, the driving chips 103 are arranged on the paint layer 102 at intervals;
  • the encapsulation adhesive layer 104 is arranged on the S paint layer 102 and wraps the drive chip 103; the encapsulation adhesive layer 104 covers the printed circuit board 101 and the drive chip 103, and is used for the printed circuit board 101 and drive
  • the chip 103 is protected to prevent the driving chip 103 from being damaged by external forces and the external environment during subsequent production, transportation, and use.
  • a plurality of metal plating blocks 105 are arranged on the encapsulation adhesive layer 104 at intervals, and the projection position of the metal plating blocks 105 on the paint layer 102 and the projection of the drive chip 103 on the paint layer 102 Staggered position
  • the glass plate 106 is laid on the plurality of metal plating blocks 105.
  • the material of the encapsulant layer 104 is a transparent material, and the transparent material includes Kapton or Upilex S.
  • the metal plated block 105 is a metal with high reflectivity, and the material of the metal plated block 105 includes silver (Ag), aluminum (Al) or chromium (Cr); optionally, the metal plated block 105 may be aluminum foil, Polished aluminum, polished silver or pure chrome.
  • the glass plate 106 adopts high light-transmitting materials, which can be a new type of heat-insulating float glass, and adopts a unique body addition formula and process.
  • the compound formula is added during the glass melting process.
  • the composite material has high light transmittance and high heat insulation performance, and the heat insulation effect is 40% higher than that of traditional heat insulation glass. While the glass plate 106 blocks more than 90% of the near-infrared rays that generate heat, the visible light transmittance can be maintained at more than 70%, and the light-to-heat ratio is greater than 1.36.
  • the prior art backlight module only includes a printed circuit board 201, a lacquer layer 202, a driving chip 203 and a packaging glue layer 204.
  • the light emitted by the driving chip 203 will be reflected inside the encapsulant layer 204. Because the light is totally reflected in the encapsulant layer 204 many times, the totally reflected light irradiates the lacquer layer 202 many times, so that the lacquer layer 202 yellows, and for the entire backlight module, it affects the light mixing distance of the backlight module, and the light energy loss is serious, thereby affecting the backlight brightness of the entire backlight module.
  • the backlight module provided by the present application is different from the backlight module of the prior art in that: in the backlight module, a glass with a metal plated block is arranged above the mold assembly with a packaged printed circuit board.
  • the plate prevents total reflection of light to a certain extent, thereby reducing the rate of yellowing of the paint layer and improving the brightness of the backlight module.
  • the surface of the backlight module is made tougher, and the compression and wear resistance of the backlight module is improved, which has great significance for the backlight module in large-size products.
  • FIG. 3 is a detailed structural diagram provided by an embodiment of the application.
  • the backlight module includes: a printed circuit board 301 and a paint layer 302 disposed on the printed circuit board 301, a plurality of driving chips 303, a packaging glue layer 304, a plurality of metal plating blocks 305 and laying The glass plate 306 on the plurality of metal plating blocks 305.
  • L2 is the distance between the projection position of the metal plating block 305 on the paint layer 302 and the projection position of the drive chip 303 on the paint layer 302, and ⁇ is equal to the backlight
  • the light emitting angle of the module is 1/2 times
  • h1 is the height of the encapsulation layer 304
  • h2 is the height of the metal plated block 305
  • h0 is the height of the drive chip 303
  • L1 is the metal plated block
  • the width of 305, p is the pitch of the driving chip 303, and a is the width of the driving chip 303.
  • width L1 of the metal plated block 305 and the width a of the driving chip 303 are the widths of the backlight module in the longitudinal section.
  • the light emitting angle of the backlight module ranges from 120 degrees to 180 degrees; optionally, the light emitting angle of the backlight module is 120 degrees, that is, ⁇ is 120 degrees. 1/2 times the degree, which is 60 degrees.
  • the height h1 of the packaging glue layer, the height h2 of the metal plated block and the height h0 of the driving chip satisfy the relationship h1>h0>h2.
  • the height h0 of the driving chip and the width a of the driving chip satisfy the relationship a>h0.
  • Figs. 4a to 4d are the preparation method of the backlight module provided by the embodiment of the application.
  • the preparation method includes:
  • a printed circuit board 401 is provided.
  • the printed circuit board 401 is coated with a paint layer 402, and a plurality of driving chips 403 are arranged on the paint layer 402 at intervals.
  • a packaging glue layer 404 is provided, and the packaging glue layer 404 wraps the driving chip 404.
  • a glass plate 406 is provided, and a metal plating layer 4051 is formed on the glass plate 406 by magnetron sputtering;
  • the metal plating layer 4051 is photoetched to form a plurality of metal plating blocks 405;
  • the glass plate 406 formed with the plurality of metal plating blocks 405 and the printed circuit board 401 formed with the encapsulating glue layer 404 are aligned and attached, wherein the metal plating blocks 405 are in the The projection position on the paint layer 402 and the projection position of the drive chip 403 on the paint layer 402 are staggered.
  • the photolithography of the metal plating layer 4051 to form a plurality of metal plating blocks 405 specifically includes:
  • the height of the packaging glue layer the height of the metal plated block and the height of the driving chip, the width of the driving chip, the pitch of the driving chip and the light emitting angle of the backlight module, the The width of the metal plated block and the distance between the metal plated block;
  • the mask is placed above the metal plating layer, and the metal plating layer is photoetched to form a plurality of metal plating blocks.
  • the beneficial effect is that, while ensuring that the backlight module is at a certain light mixing distance, by arranging a glass plate with a metal coating on the mold assembly with the packaged printed circuit board, the yellowing phenomenon of the light board of the printed circuit board is solved, Problems such as low backlight display effect, abrasion and scratching of the packaging adhesive layer.

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Abstract

一种背光模组，包括：印刷线路板（101）以及设置于印刷线路板（101）上的漆层（102）；多个驱动芯片（103），驱动芯片（103）间隔设置于漆层（102）上；封装胶层（104），设置于漆层（102）上并包裹驱动芯片（103）；多个金属镀块（105），间隔设置于封装胶层（104）上，且金属镀块（105）在漆层（102）上的投影位置与驱动芯片（103）在漆层（102）上的投影位置相互交错；玻璃板（106），铺设于多个金属镀块（105）上。

Description

背光模组及其制备方法 技术领域
本申请涉及显示技术领域，尤其涉及一种背光模组及其制备方法。
 背景技术
目前，小间距发光二极管显示屏（Mini Light-Emitting Diode，简称Mini-LED）因其可实现超薄，多分区同时又是利用小尺寸芯片产品，能够在现实效果上媲美有机发光二极管（Organic Light Emitting Diode，OLED）产品，且在材料成本上又能够较OLED更有竞争优势而备受背光显示行业青睐。
市面上Mini-LED在作为背光使用时，是将倒装芯片固晶于印刷线路板（Print Circuit Board，简称PCB）。为保护芯片不在后续的生产、运输和使用过程中受到外力和外部环境损坏，通常会在PCB表面上涂敷一层白漆用于反射光线，但由于倒装芯片固化在PCB版上需要径过高温回流焊接，而白漆在高温下容易发生黄化导致发射率降低，从而使光线能量损失严重，影响该显示面板的混光距离（Opotical distance，简称OD），进而影响背光亮度，影响背光显示效果。
而且目前受制程设备和工艺的限制，Mini-LED灯板应用于大尺寸电视（Television，简称TV）背光时需要由许多块小面积灯板拼接而成，不同PCB灯板发黄程度不一致的现象会对背光显示效果造成很大影响。另外，封装胶表面较软，组装灯板的过程中容易造成磨损刮伤等不良问题。
 技术问题
现有技术的LED显示屏背光模组存在PCB灯板发生黄化问题、背光显示效果不达标、封装胶磨损刮伤问题。
 技术解决方案
本申请提供的背光模组，解决了印刷电路板的灯板黄化现象、背光显示效果低、封装胶磨损刮伤等问题。
本申请提供的技术方案如下：
一种背光模组，所述背光模组包括：印刷线路板以及设置于所述印刷线路板上的漆层；
多个驱动芯片，所述驱动芯片间隔设置于所述漆层上；
封装胶层，设置于所述漆层上并包裹所述驱动芯片；
多个金属镀块，间隔设置于所述封装胶层上，且所述金属镀块在所述漆层上的投影位置与所述驱动芯片在所述漆层上的投影位置相互交错；
玻璃板，铺设于所述多个金属镀块上。
在本申请所提供的背光模组中，所述金属镀块在所述漆层上的投影位置与所述驱动芯片在所述漆层上的投影位置之间的间距L2=tanθ×（h1+h2-h0）；
其中，θ等于所述背光模组的发光角度的1/2倍，h1为所述封装胶层的高度，h2为所述金属镀块的高度，h0为所述驱动芯片的高度。
在本申请所提供的背光模组中，所述背光模组的发光角度范围为120度至180度。
在本申请所提供的背光模组中，所述封装胶层的高度、所述金属镀块的高度与所述驱动芯片的高度，满足关系h1>h0>h2。
在本申请所提供的背光模组中，所述金属镀块的宽度L1=p-2×L2；
所述金属镀块的间距x=a+2×L2；
其中，p为所述驱动芯片的间距，a为所述驱动芯片的宽度。
在本申请所提供的背光模组中，所述驱动芯片的高度与所述驱动芯片的宽度，满足关系a>h0。
在本申请所提供的背光模组中，所述金属镀块的材料包括银、铝或者铬。
在本申请所提供的背光模组中，所述封装胶层的材料为透明材料，所述透明材料包括均苯型聚酰亚胺或者联苯型聚酰亚胺。
本申请还提供一种背光模组，所述背光模组包括：印刷线路板以及设置于所述印刷线路板上的漆层；
多个驱动芯片，所述驱动芯片间隔设置于所述漆层上；
封装胶层，设置于所述漆层上并包裹所述驱动芯片，所述封装胶层的材料为透明材料；
多个金属镀块，间隔设置于所述封装胶层上，且所述金属镀块在所述漆层上的投影位置与所述驱动芯片在所述漆层上的投影位置相互交错，其中，所述金属镀块的材料包括银、铝或者铬；
玻璃板，铺设于所述多个金属镀块上。
在本申请所提供的背光模组中，所述透明材料包括均苯型聚酰亚胺或者联苯型聚酰亚胺。
在本申请所提供的背光模组中，所述金属镀块在所述漆层上的投影位置与所述驱动芯片在所述漆层上的投影位置之间的间距L2=tanθ×（h1+h2-h0）；
其中，θ等于所述背光模组的发光角度的1/2倍，h1为所述封装胶层的高度，h2为所述金属镀块的高度，h0为所述驱动芯片的高度。
在本申请所提供的背光模组中，所述背光模组的发光角度的范围为120度至180度。
在本申请所提供的背光模组中，所述封装胶层的高度、所述金属镀块的高度与所述驱动芯片的高度，满足关系h1>h0>h2。
在本申请所提供的背光模组中，所述金属镀块的宽度L1=p-2×L2；
所述金属镀块的间距x=a+2×L2；
其中，p为所述驱动芯片的间距，a为所述驱动芯片的宽度。
在本申请所提供的背光模组中，所述驱动芯片的高度与所述驱动芯片的宽度，满足关系a>h0。
本申请还提供一种背光模组制备方法，所述制备方法包括：
提供一印刷线路板，所述印刷线路板上涂覆有漆层，所述漆层上间隔设置有多个驱动芯片，所述多个驱动芯片上设有封装胶层，且所述封装胶层包裹所述驱动芯片；
提供一玻璃板，并通过磁控溅射在所述玻璃板上形成金属镀层；
对所述金属镀层光刻，形成多个金属镀块；
将形成有所述多个金属镀块的玻璃板与形成有所述封装胶层的印刷线路板对位贴合，其中所述金属镀块在所述漆层上的投影位置与所述驱动芯片在所述漆层上的投影位置相互交错。
在本申请所提供的背光模组制备方法中，所述对所述金属镀层光刻，形成多个金属镀块，具体包括：
根据所述封装胶层的高度、所述金属镀块的高度与所述驱动芯片的高度、所述驱动芯片的宽度、所述驱动芯片的间距与所述背光模组的发光角度，确定所述金属镀块的宽度与所述金属镀块的间距；
根据所述金属镀块的宽度与所述金属镀块的间距，设计掩模板；
将所述掩模板置于所述金属镀层上方，对所述金属镀层光刻，形成多个金属镀块。
 有益效果
本申请的有益效果为：在保证背光模组在一定混光距离下，通过在带有封装的印刷线路板的模组件上方设置带金属镀层的玻璃板，解决了印刷电路板的灯板黄化现象、背光显示效果低、封装胶层磨损刮伤等问题。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施提供的背光模组第一种剖面结构图。
图2为现有技术背光模组的剖面结构图。
图3为本申请实施例所提供第二种剖面结构图。
图4a-图4d为申请实施例所提供的背光模组制备方法流程图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
如图1所示，该图为本申请实施例所提供的背光模组第一种剖面结构图，在该图1中，本申请提供一种背光模组，所述背光模组包括：印刷线路板101以及设置于所述印刷线路板101上的漆层102；
多个驱动芯片103，所述驱动芯片103间隔设置于所述漆层102上；
封装胶层104，设置于所述S漆层102上并包裹所述驱动芯片103；该封装胶层104覆盖所述印刷线路板101及驱动芯片103，用于对所述印刷线路板101及驱动芯片103进行保护，防止驱动芯片103在后续的生产、运输和使用过程中受到外力和外部环境损坏。
多个金属镀块105，间隔设置于所述封装胶层104上，且所述金属镀块105在所述漆层102上的投影位置与所述驱动芯片103在所述漆层102上的投影位置相互交错；
玻璃板106，铺设于所述多个金属镀块105上。
进一步的，所述封装胶层104的材料为透明材料，所述透明材料包括均苯型聚酰亚胺（Kapton）或者联苯型聚酰亚胺（Upilex S）。该金属镀块105为高反射率高的金属，所述金属镀块105的材料包括银（Ag）、铝（Al）或者铬（Cr）；可选的，该金属镀块105可为铝箔、抛光铝、抛光银或者纯铬。
进一步的，该玻璃板106采用高透光材料，该玻璃板可为新型隔热浮法玻璃，并采用了独特的本体添加配方和工艺，通过在玻璃熔制过程中添加氧化物复配配方的复合材料，其具有高透光高隔热的性能，隔热效果较传统隔热玻璃提升了40%。该玻璃板106在把90%以上产生热量的近红外线阻隔的同时，可见光透过率能保持在70%以上，光热比大于1.36。
进一步的，在该图1中，当所述背光模组在使用过程中，光线由所述驱动芯片103发出，经由所述封装胶层104发射至所述玻璃板106，在所述玻璃板106内部发生折射并进行整个背光模组的显示；与此同时，部分光线经由金属镀块105时，由于金属具有反射性，该光线在该金属镀块105下表面发生反射，光线折回至漆层102，在所述漆层102上发生反射，直至光线发射至玻璃板106发射出该背光模组。
在现有技术的背光模组中，参见图2，现有技术的背光模组仅包括印刷线路板201、漆层202、驱动芯片203以及封装胶层204。光线由驱动芯片203发出，会在封装胶层204内部发生反射，由于该光线在该封装胶层204内多次发生全反射，发生全反射的光线多次照射于漆层202，使得该漆层202黄化，且对于整个背光模组而言，影响该背光模组的混光距离，该光线能量损失严重，从而影响整个背光模组的背光亮度。
需要指出，本申请所提供的背光模组与现有技术的背光模组不同的是：在背光模组中，通过在带有封装的印刷线路板的模组件上方设置具有金属镀块的玻璃板，一定程度上防止光线发生全反射，从而降低漆层发生黄化的速度，并提升该背光模组的亮度。与此同时，由于增加了玻璃板，使得该背光模组表面更加坚韧，提高了该背光模组的抗压耐磨性能，对该背光模组在大尺寸产品上具有极大的意义。
请参见图3，该图为本申请实施例所提供细节结构图。
在该图3中，该背光模组包括：印刷线路板301以及设置于所述印刷线路板301上的漆层302、多个驱动芯片303、封装胶层304、多个金属镀块305以及铺设于所述多个金属镀块305上的玻璃板306。
在该图3中，L2为所述金属镀块305在所述漆层302上的投影位置与所述驱动芯片303在所述漆层302上的投影位置之间的间距，θ等于所述背光模组的发光角度的1/2倍，h1为所述封装胶层304的高度，h2为所述金属镀块305的高度，h0为所述驱动芯片303的高度，L1为所述金属镀块305的宽度，p为所述驱动芯片303的间距，a为所述驱动芯片303的宽度。
需要指出的是，所述金属镀块305的宽度L1与所述驱动芯片303的宽度a为该背光模组纵截面上的宽度。
其中，所述金属镀块305在所述漆层302上的投影位置与所述驱动芯片303在所述漆层302上的投影位置之间的间距L2=tanθ×（h1+h2-h0）。
进一步的，根据金属镀块305在所述漆层302上的投影位置与所述驱动芯片303在所述漆层302上的投影位置之间的间距L2，所述金属镀块的宽度L1=p-2×L2；所述金属镀块的间距x=a+2×L2。
进一步的，为保证所述背光模组显示效果好，所述背光模组的发光角度范围为120度至180度；可选的，所述背光模组的发光角度为120度，即θ为120度的1/2倍，即60度。
进一步的，所述封装胶层的高度h1、所述金属镀块的高度h2与所述驱动芯片的高度h0，满足关系h1>h0>h2。
进一步的，所述驱动芯片的高度h0与所述驱动芯片的宽度a，满足关系a>h0。
请参加图4a-图4d，该图为本申请实施例所提供的背光模组制备方法，该制备方法包括：
如图4a所示，提供一印刷线路板401，所述印刷线路板401上涂覆有漆层402，所述漆层402上间隔设置有多个驱动芯片403，所述多个驱动芯片403上设有封装胶层404，且所述封装胶层404包裹所述驱动芯片404。
如图4b所示，提供玻璃板406，并通过磁控溅射在所述玻璃板406上形成金属镀层4051；
如图4c所示，对所述金属镀层4051光刻，形成多个金属镀块405；
如图4d所示，将形成有所述多个金属镀块405的玻璃板406与形成有所述封装胶层404的印刷线路板401对位贴合，其中所述金属镀块405在所述漆层402上的投影位置与所述驱动芯片403在所述漆层402上的投影位置相互交错。
进一步的，所述对所述金属镀层4051光刻，形成多个金属镀块405，具体包括：
根据所述封装胶层的高度、所述金属镀块的高度与所述驱动芯片的高度、所述驱动芯片的宽度、所述驱动芯片的间距与所述背光模组的发光角度，确定所述金属镀块的宽度与所述金属镀块的间距；
根据所述金属镀块的宽度与所述金属镀块的间距，设计掩模板；
将所述掩模板置于所述金属镀层上方，对所述金属镀层光刻，形成多个金属镀块。
有益效果为：在保证背光模组在一定混光距离下，通过在带有封装的印刷线路板的模组件上方设置带金属镀层的玻璃板，解决了印刷电路板的灯板黄化现象、背光显示效果低、封装胶层磨损刮伤等问题。
除上述实施例外，本申请还可以有其他实施方式。凡采用等同替换或等效替换形成的技术方案，均落在本申请要求的保护范围。
综上所述，虽然本申请已将优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (17)

  1. 一种背光模组，其包括：印刷线路板以及设置于所述印刷线路板上的漆层；
    多个驱动芯片，所述驱动芯片间隔设置于所述漆层上；
    封装胶层，设置于所述漆层上并包裹所述驱动芯片，所述封装胶层的材料为透明材料；
    多个金属镀块，间隔设置于所述封装胶层上，且所述金属镀块在所述漆层上的投影位置与所述驱动芯片在所述漆层上的投影位置相互交错，其中，所述金属镀块的材料包括银、铝或者铬；
    玻璃板，铺设于所述多个金属镀块上。
  2. 根据权利要求1所述的背光模组，其中，所述透明材料包括均苯型聚酰亚胺或者联苯型聚酰亚胺。
  3. 根据权利要求1所述的背光模组，其中，所述金属镀块在所述漆层上的投影位置与所述驱动芯片在所述漆层上的投影位置之间的间距L2=tanθ×（h1+h2-h0）；
    其中，θ等于所述背光模组的发光角度的1/2倍，h1为所述封装胶层的高度，h2为所述金属镀块的高度，h0为所述驱动芯片的高度。
  4. 根据权利要求3所述的背光模组，其中，所述背光模组的发光角度的范围为120度至180度。
  5. 根据权利要求3所述的背光模组，其中，所述封装胶层的高度、所述金属镀块的高度与所述驱动芯片的高度，满足关系h1>h0>h2。
  6. 根据权利要求3所述的背光模组，其中，所述金属镀块的宽度L1=p-2×L2；
    所述金属镀块的间距x=a+2×L2；
    其中，p为所述驱动芯片的间距，a为所述驱动芯片的宽度。
  7. 根据权利要求6所述的背光模组，其中，所述驱动芯片的高度与所述驱动芯片的宽度，满足关系a>h0。
  8. 一种背光模组，其中，所述背光模组包括：印刷线路板以及设置于所述印刷线路板上的漆层；
    多个驱动芯片，所述驱动芯片间隔设置于所述漆层上；
    封装胶层，设置于所述漆层上并包裹所述驱动芯片；
    多个金属镀块，间隔设置于所述封装胶层上，且所述金属镀块在所述漆层上的投影位置与所述驱动芯片在所述漆层上的投影位置相互交错；
    玻璃板，铺设于所述多个金属镀块上。
  9. 根据权利要求8所述的背光模组，其中，所述金属镀块在所述漆层上的投影位置与所述驱动芯片在所述漆层上的投影位置之间的间距L2=tanθ×（h1+h2-h0）；
    其中，θ等于所述背光模组的发光角度的1/2倍，h1为所述封装胶层的高度，h2为所述金属镀块的高度，h0为所述驱动芯片的高度。
  10. 根据权利要求9所述的背光模组，其中，所述背光模组的发光角度的范围为120度至180度。
  11. 根据权利要求9所述的背光模组，其中，所述封装胶层的高度、所述金属镀块的高度与所述驱动芯片的高度，满足关系h1>h0>h2。
  12. 根据权利要求9所述的背光模组，其中，所述金属镀块的宽度L1=p-2×L2；
    所述金属镀块的间距x=a+2×L2；
    其中，p为所述驱动芯片的间距，a为所述驱动芯片的宽度。
  13. 根据权利要求12所述的背光模组，其中，所述驱动芯片的高度与所述驱动芯片的宽度，满足关系a>h0。
  14. 根据权利要求8所述的背光模组，其中，所述金属镀块的材料包括银、铝或者铬。
  15. 根据权利要求8所述的背光模组，其中，所述封装胶层的材料为透明材料，所述透明材料包括均苯型聚酰亚胺或者联苯型聚酰亚胺。
  16. 一种背光模组制备方法，其中，所述制备方法包括：
    提供一印刷线路板，所述印刷线路板上涂覆有漆层，所述漆层上间隔设置有多个驱动芯片，所述多个驱动芯片上设有封装胶层，且所述封装胶层包裹所述驱动芯片；
    提供一玻璃板，并通过磁控溅射在所述玻璃板上形成金属镀层；
    对所述金属镀层光刻，形成多个金属镀块；
    将形成有所述多个金属镀块的玻璃板与形成有所述封装胶层的印刷线路板对位贴合，其中所述金属镀块在所述漆层上的投影位置与所述驱动芯片在所述漆层上的投影位置相互交错。
  17. 根据权利要求16所述背光模组制备方法，其中，所述对所述金属镀层光刻，形成多个金属镀块，具体包括：
    根据所述封装胶层的高度、所述金属镀块的高度与所述驱动芯片的高度、所述驱动芯片的宽度、所述驱动芯片的间距与所述背光模组的发光角度，确定所述金属镀块的宽度与所述金属镀块的间距；
    根据所述金属镀块的宽度与所述金属镀块的间距，设计掩模板；
    将所述掩模板置于所述金属镀层上方，对所述金属镀层光刻，形成多个金属镀块。
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