WO2021017240A1 - 背光模组及显示装置 - Google Patents

背光模组及显示装置 Download PDF

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Publication number
WO2021017240A1
WO2021017240A1 PCT/CN2019/115482 CN2019115482W WO2021017240A1 WO 2021017240 A1 WO2021017240 A1 WO 2021017240A1 CN 2019115482 W CN2019115482 W CN 2019115482W WO 2021017240 A1 WO2021017240 A1 WO 2021017240A1
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WO
WIPO (PCT)
Prior art keywords
ellipse
light
encapsulation layer
circuit board
backlight module
Prior art date
Application number
PCT/CN2019/115482
Other languages
English (en)
French (fr)
Inventor
林悦霞
丘永元
Original Assignee
惠州市华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 惠州市华星光电技术有限公司 filed Critical 惠州市华星光电技术有限公司
Priority to US16/615,137 priority Critical patent/US11316083B2/en
Publication of WO2021017240A1 publication Critical patent/WO2021017240A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133614—Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other

Definitions

  • This application relates to the field of display technology, in particular to a backlight module and a display device.
  • OLED Organic Light-Emitting Diode
  • Mini-LED Mini Light Emitting Diode, miniature light-emitting diode
  • OLED Organic Light-Emitting Diode
  • Mini-LEDs on the market are used as backlights, flip-chips are usually die-bonded to the circuit board. At this time, the Mini-LED is in the chip state. In order to protect the chip from external force and external environment damage during subsequent production, transportation and use, it is usually necessary to cover a layer of encapsulant on the circuit board for protection.
  • the white paint reflectivity of the circuit board is only 85%, which is far inferior to the reflector (reflective sheet). Rate above 95%), so the large-angle light energy loss is serious.
  • the light is likely to be totally reflected on the light-emitting surface of the encapsulation layer, resulting in loss of light energy and low light-emitting rate.
  • the light is likely to be totally reflected on the light-emitting surface of the encapsulation layer, resulting in loss of light energy and low light-emitting rate.
  • the embodiments of the present application provide a backlight module and a display device, which can destroy the total reflection of light on the light emitting surface of the encapsulation layer, avoid the loss of light energy, and improve the light output rate.
  • the present application provides a backlight module, wherein the backlight module includes a circuit board, and one side surface of the circuit board is provided with a plurality of light-emitting elements arranged at intervals.
  • the light-emitting surface of at least one of the light-emitting elements is covered with a first encapsulation layer, and a surface of the first encapsulation layer away from the at least one light-emitting element is a curved surface;
  • the outer contour of the first cross section of the first encapsulation layer is located on a first ellipse, the first cross section is perpendicular to the surface of the circuit board, and the thickness of the first encapsulation layer is the length of the first ellipse Half of the axis length, the long axis of the first ellipse is perpendicular to the surface of the circuit board;
  • the refractive index of the first encapsulation layer is less than 1.2.
  • the backlight module further includes a second encapsulation layer, the second encapsulation layer covers a side surface of the first encapsulation layer away from the light-emitting element, and the second encapsulation layer is away from the first encapsulation One side surface of the layer is curved.
  • the present application provides a backlight module.
  • the backlight module includes a circuit board.
  • One side surface of the circuit board is provided with a plurality of light-emitting elements arranged at intervals.
  • the light-emitting surface of at least one light-emitting element in the elements is covered with a first encapsulation layer, and a surface of the first encapsulation layer away from the at least one light-emitting element is a curved surface.
  • the outer contour of the first cross section of the first encapsulation layer is located on the first ellipse, the first cross section is perpendicular to the surface of the circuit board, and the thickness of the first encapsulation layer is the first ellipse
  • the long axis of the first ellipse is half the length, and the long axis of the first ellipse is perpendicular to the surface of the circuit board.
  • the refractive index of the first encapsulation layer is less than 1.2.
  • the backlight module further includes a second encapsulation layer, the second encapsulation layer covers a side surface of the first encapsulation layer away from the light-emitting element, and the second encapsulation layer is away from the first encapsulation One side surface of the layer is curved.
  • the second cross-sectional outline of the second packaging layer includes a first curve and a second curve
  • the second cross-section is perpendicular to the surface of the circuit board
  • the first curve is located on the second ellipse
  • the second curve is located on the third ellipse
  • the second ellipse and the third ellipse do not overlap
  • the major axis of the second ellipse is perpendicular to the surface of the circuit board
  • the major axis of the third ellipse Perpendicular to the surface of the circuit board.
  • the second ellipse and the third ellipse are symmetrical about the long axis of the first ellipse, and the thickness of the outer contour of the second cross section is less than half of the width of the outer contour of the second cross section.
  • intersection of the first curve and the second curve is located on the side of the outer contour vertex of the first cross-section away from the circuit board; the intersection of the first curve and the second curve to the first horizontal
  • the distance between the vertices of the outer contour of the section is less than half of the length of the major axis of the first ellipse.
  • the refractive index of the second encapsulation layer is greater than 1.5.
  • the material of the first encapsulation layer is any one of silica gel or photoresist
  • the material of the second encapsulation layer is any one of silica gel or photoresist
  • the light-emitting element is an LED chip.
  • the present application provides a display device, the display device includes a backlight module, the backlight module includes a circuit board, one side surface of the circuit board is provided with a plurality of spaced apart For a light-emitting element, the light-emitting surface of at least one light-emitting element among the plurality of light-emitting elements is covered with a first encapsulation layer, and a surface of the first encapsulation layer away from the at least one light-emitting element is a curved surface.
  • the outer contour of the first cross section of the first encapsulation layer is located on the first ellipse, the first cross section is perpendicular to the surface of the circuit board, and the thickness of the first encapsulation layer is the first ellipse
  • the long axis of the first ellipse is half the length, and the long axis of the first ellipse is perpendicular to the surface of the circuit board.
  • the refractive index of the first encapsulation layer is less than 1.2.
  • the backlight module further includes a second encapsulation layer, the second encapsulation layer covers a side surface of the first encapsulation layer away from the light-emitting element, and the second encapsulation layer is away from the first encapsulation One side surface of the layer is curved.
  • the second cross-sectional outline of the second packaging layer includes a first curve and a second curve
  • the second cross-section is perpendicular to the surface of the circuit board
  • the first curve is located on the second ellipse
  • the second curve is located on the third ellipse
  • the second ellipse and the third ellipse do not overlap
  • the major axis of the second ellipse is perpendicular to the surface of the circuit board
  • the major axis of the third ellipse Perpendicular to the surface of the circuit board.
  • the second ellipse and the third ellipse are symmetrical about the long axis of the first ellipse, and the thickness of the outer contour of the second cross section is less than half of the width of the outer contour of the second cross section.
  • intersection of the first curve and the second curve is located on the side of the outer contour vertex of the first cross-section away from the circuit board; the intersection of the first curve and the second curve to the first horizontal
  • the distance between the vertices of the outer contour of the section is less than half of the length of the major axis of the first ellipse.
  • the refractive index of the second encapsulation layer is greater than 1.5.
  • the material of the first encapsulation layer is any one of silica gel or photoresist
  • the material of the second encapsulation layer is any one of silica gel or photoresist
  • the light-emitting element is an LED chip.
  • the embodiments of the present application provide a backlight module, the backlight module includes a circuit board, one side surface of the circuit board is provided with a plurality of light-emitting elements arranged at intervals, and the light-emitting surface of at least one of the plurality of light-emitting elements
  • the first encapsulation layer is wrapped, and a surface of the first encapsulation layer away from the at least one light-emitting element is a curved surface.
  • the surface of the first encapsulation layer away from the light-emitting element is a curved surface. Compared with the flat encapsulation layer, it can destroy the total reflection of light on the light-emitting surface, improve the light-emitting rate, and avoid light energy loss.
  • FIG. 1 is a schematic structural diagram of an embodiment of a backlight module provided by an embodiment of the present application
  • FIG. 2 is a schematic structural diagram of a specific embodiment of the first packaging layer and the second packaging layer in the backlight module in FIG. 1;
  • FIG. 3 is a schematic diagram of the light emitted by the light emitting element in the backlight module of FIG. 1.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of the features. In the description of this application, “multiple” means two or more than two, unless otherwise specifically defined.
  • An embodiment of the present application provides a backlight module, the backlight module includes a circuit board, one side surface of the circuit board is provided with a plurality of light-emitting elements arranged at intervals, and at least one of the light-emitting elements is The light-emitting surface is covered with a first packaging layer, and a surface of the first packaging layer away from the at least one light-emitting element is a curved surface.
  • the backlight module of the embodiment of the present application can be applied to various display devices. Detailed descriptions are given below.
  • FIG. 1 is a schematic structural diagram of an embodiment of a backlight module provided by an embodiment of the present application.
  • the backlight module 10 includes a circuit board 11, and a plurality of light-emitting elements 12 are arranged at intervals on one side surface of the circuit board 11.
  • the light-emitting surface of at least one light-emitting element 12 of the plurality of light-emitting elements 12 is covered with a first encapsulation layer 13, and a surface of the first encapsulation layer 13 away from the at least one light-emitting element 12 is curved.
  • the light-emitting surface of each light-emitting element 12 is covered with a first encapsulation layer 13.
  • the curved surface of the first encapsulation layer 13 may be a spherical surface, an ellipsoidal surface, a cross-sectional curved surface, or a curved surface composed of multiple curved surfaces, etc., which is not limited in this application. Since the surface of the first encapsulation layer 13 away from the at least one light-emitting element 12 is curved, when the light-emitting element 12 emits light through the surface of the first encapsulation layer 13, total reflection will not occur, which is compared with the flat package in the prior art. The layer destroys the total reflection structure of the planar packaging layer in the prior art, thereby improving the light output rate of the light emitting element 12.
  • the circuit board 11 is a flexible circuit board (Flexible Printed Circuit, FPC for short).
  • the flexible circuit board is made of polyimide or polyester film as a substrate with high reliability and excellent flexibility. It has high wiring density, light weight, thin thickness, and bending Good sex characteristics.
  • the circuit board 11 controls the light emitting element 12 to provide backlight for the display panel.
  • the circuit board 11 may be another type of circuit board 11, which is not limited in this application.
  • the light-emitting element 12 is an LED chip.
  • the LED chip is a mini LED.
  • the multiple light-emitting elements 12 are arranged on the circuit board 11 in a matrix manner to achieve uniform light emission.
  • the LED chip may be a red LED chip, a blue LED chip, a green LED chip and other colors of LED chips, which are not limited in this application.
  • the refractive index of the first encapsulation layer 13 is less than 1.2.
  • the material of the first encapsulation layer 13 is any one of silica gel or photoresist. Further, the first encapsulation layer 13 is a silica gel layer containing phosphors or a silica gel layer containing quantum dots.
  • the backlight module 10 further includes a second encapsulation layer 14, and the second encapsulation layer 14 covers the surface of the first encapsulation layer 13 away from the light-emitting element 12.
  • the surface of the second packaging layer 14 away from the first packaging layer 13 is curved.
  • the curved surface of the second encapsulation layer 14 may be a spherical surface, an ellipsoidal surface, a cross-sectional curved surface, or a curved surface composed of multiple curved surfaces, etc., which is not limited in this application.
  • the material of the second encapsulation layer 14 is any one of silica gel or photoresist.
  • the second encapsulation layer 14 is a silica gel layer containing phosphor powder or a silica gel layer containing quantum dots.
  • the first encapsulation layer 13 is covered on the light-emitting elements 12 distributed in an array by heating molding and cooling curing; the second encapsulation layer 14 is covered on the first package by heating molding and cooling curing On layer 13.
  • the first encapsulation layer 13 and the second encapsulation layer 14 can also be prepared in other ways, which is not limited in this application.
  • the refractive index of the second encapsulation layer 14 is greater than 1.5.
  • the refractive index of the second encapsulation layer 14 is greater than the refractive index of air, and the second encapsulation layer 14 can diffuse light.
  • the light mixing height is constant, the light diffusion range of a single light-emitting element 12 is larger than that of the prior art, which can reduce the circuit
  • the number of light-emitting elements 12 per unit area of the board 11 reduces the manufacturing cost of the backlight module 10.
  • FIG. 2 is a schematic structural diagram of a specific embodiment of the first encapsulation layer and the second encapsulation layer in the backlight module in FIG.
  • the first cross-sectional outer contour 131 of the first packaging layer 13 is located on the first ellipse 151, and the first cross-section is perpendicular to the surface of the circuit board 11.
  • the thickness H1 of the first encapsulation layer 13 is half the length of the major axis of the first ellipse 151, and the major axis of the first ellipse 151 is perpendicular to the surface of the circuit board 11.
  • the thickness H1 of the first encapsulation layer 13 is half the length of the major axis of the first ellipse 151, and the major axis of the first ellipse 151 is perpendicular to the surface of the circuit board 11, and the light emitting element 12 is equivalent to being located at the center of the first ellipse 151
  • the light-emitting element 12 emits light from the center of the ellipse, and the light-emitting surface has an elliptical contour, which can further improve the light-emitting efficiency.
  • the second cross-sectional outline 141 of the second packaging layer 14 includes a first curve 142 and a second curve 143, and the second cross-section is perpendicular to the surface of the circuit board 11.
  • the first curve 142 is located on the second ellipse 152
  • the second curve 143 is located on the third ellipse 153
  • the second ellipse 152 and the third ellipse 153 do not overlap
  • the long axis of the second ellipse 152 is perpendicular to the surface of the circuit board 11.
  • the major axis of the three ellipses 153 is perpendicular to the surface of the circuit board 11.
  • the surface profile of the second encapsulation layer 14 is a curve composed of two elliptical arcs, and the surface of the second encapsulation layer 14 in contact with the air has an elliptical contour, which can further improve the light diffusion effect and the light extraction rate.
  • the second ellipse 152 and the third ellipse 153 are symmetrical about the long axis of the first ellipse 151, and the thickness H3 of the second cross-sectional outer contour 141 is less than half of the width L1 of the second cross-sectional outer contour 141.
  • the relative position of the light-emitting element 12 and the first curve 142 is the same as the relative position of the light-emitting element 12 and the second curve 143.
  • the light emitted by the light emitting element 12 from the first curve 142 and the second curve 143 are completely the same, so that the light emitted by the light emitting element 12 is uniform.
  • the astigmatism effect of the second encapsulation layer 14 can be ensured, and the thickness of the second encapsulation layer 14 can be reduced, thereby reducing the manufacturing cost.
  • the intersection of the first curve 142 and the second curve 143 is located at a side of the first cross-sectional outer contour 131 that is away from the circuit board 11.
  • the distance H2 from the intersection of the first curve 142 and the second curve 143 to the vertex of the first cross-sectional outer contour 131 is less than half of the length of the major axis of the first ellipse 151.
  • half of the length of the major axis of the first ellipse 151 is the thickness H1 of the first encapsulation layer 13, that is, H2 is smaller than H1.
  • FIG. 3 is a schematic diagram of the light emitted from the light emitting element in the backlight module of FIG.
  • light is emitted from the light-emitting element 12 and undergoes a first refraction at the interface between the first encapsulation layer 13 and the second encapsulation layer 14. Since the interface between the first encapsulation layer 13 and the second encapsulation layer 14 is curved, the total reflection of light is avoided, and light can be more injected into the second encapsulation layer 14 from the interface between the first encapsulation layer 13 and the second encapsulation layer 14 . The light undergoes a second refraction at the interface between the second encapsulation layer 14 and air.
  • the diffusion range of the light can be significantly increased In the case of a certain light mixing height, the distance between two adjacent light-emitting elements 12 can be greater, so that the number of light-emitting elements 12 on the circuit board 11 can be reduced, thereby reducing the manufacturing cost of the backlight module 10.
  • the embodiment of the application provides a backlight module
  • the backlight module includes a circuit board, one side surface of the circuit board is provided with a plurality of light-emitting elements 12 spaced apart, the light-emitting surface of at least one of the light-emitting elements 12
  • the first encapsulation layer is wrapped, and a surface of the first encapsulation layer away from the at least one light-emitting element 12 is curved.
  • the surface of the first encapsulation layer away from the light-emitting element 12 is a curved surface. Compared with the flat encapsulation layer, it can destroy the total reflection of light on the light-emitting surface, improve the light-emitting rate, and avoid light energy loss.
  • the backlight module of the embodiment of the present application may also include any other necessary structures as required. There is no limitation here.
  • each of the above units or structures can be implemented as independent entities, or can be combined arbitrarily, and implemented as the same or several entities.
  • each of the above units or structures please refer to the previous method embodiments. No longer.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)

Abstract

本申请实施例公开了一种背光模组及显示装置，该背光模组包括电路板，电路板的一侧表面设有间隔设置的多个发光元件，多个发光元件中至少一个发光元件的出光面包覆有第一封装层，第一封装层远离至少一个发光元件的一侧表面为曲面。

Description

背光模组及显示装置 技术领域
本申请涉及显示技术领域，具体涉及一种背光模组及显示装置。
 背景技术
现阶段显示技术的发展日新月异，各种屏幕技术的出现为电子终端提供的无限可能。特别是以有机发光二极管（Organic Light-Emitting Diode, OLED）为代表的显示技术的快速应用。
目前Mini-LED（Mini Light Emitting Diode，微型发光二极管）因其可实现超薄，多分区同时又是利用小尺寸芯片产品，能够在现实效果上媲美OLED（Organic Light-Emitting Diode,有机发光二极管）产品，且在材料成本上又能够较OLED更有竞争优势而备受背光显示行业青睐。
市面上Mini-LED在作为背光使用时，通常是将倒装芯片固晶于电路板。此时的Mini-LED为芯片状态，为保护芯片不在后续的生产、运输和使用过程中受到外力和外部环境损坏，通常会需要在电路板上覆盖一层封装胶用于保护。但是在Mini-LED灯板结构中，大角度光线在胶层内于空气界面容易因发生内全发射，而回到电路板上，电路板白漆反射率只有85%，远不如反射片（反射率95%以上），从而大角度光线能量损失严重。
也即，现有技术中光线容易在封装层出光面发生全反射，造成光线能量损失，出光率较低。
 技术问题
也即，现有技术中光线容易在封装层出光面发生全反射，造成光线能量损失，出光率较低。
 技术解决方案
本申请实施例提供一种背光模组及显示装置，能够破坏光线在封装层出光面上发生的全反射，避免光线能量损失，提高出光率。
为解决上述问题，第一方面，本申请提供一种背光模组，其中，所述背光模组包括电路板，所述电路板的一侧表面设有间隔设置的多个发光元件，所述多个发光元件中至少一个发光元件的出光面包覆有第一封装层，所述第一封装层远离所述至少一个发光元件的一侧表面为曲面;
所述第一封装层的第一横截面外轮廓位于第一椭圆上，所述第一横截面垂直于所述电路板的表面，所述第一封装层的厚度为所述第一椭圆的长轴长度的一半，所述第一椭圆的长轴垂直于所述电路板的表面;
所述第一封装层的折射率小于1.2。
其中，所述背光模组还包括第二封装层，所述第二封装层包覆所述第一封装层远离所述发光元件的一侧表面，所述第二封装层远离所述第一封装层的一侧表面为曲面。
为解决上述问题，第二方面，本申请提供一种背光模组，所述背光模组包括电路板，所述电路板的一侧表面设有间隔设置的多个发光元件，所述多个发光元件中至少一个发光元件的出光面包覆有第一封装层，所述第一封装层远离所述至少一个发光元件的一侧表面为曲面。
其中，所述第一封装层的第一横截面外轮廓位于第一椭圆上，所述第一横截面垂直于所述电路板的表面，所述第一封装层的厚度为所述第一椭圆的长轴长度的一半，所述第一椭圆的长轴垂直于所述电路板的表面。
其中，所述第一封装层的折射率小于1.2。
其中，所述背光模组还包括第二封装层，所述第二封装层包覆所述第一封装层远离所述发光元件的一侧表面，所述第二封装层远离所述第一封装层的一侧表面为曲面。
其中，所述第二封装层的第二横截面外轮廓包括第一曲线和第二曲线，所述第二横截面垂直于所述电路板的表面，所述第一曲线位于第二椭圆上，所述第二曲线位于第三椭圆上，所述第二椭圆和所述第三椭圆不重合，所述第二椭圆的长轴垂直于所述电路板的表面，所述第三椭圆的长轴垂直于所述电路板的表面。
其中，所述第二椭圆和所述第三椭圆关于所述第一椭圆的长轴对称，所述第二横截面外轮廓的厚度小于，所述第二横截面外轮廓宽度的一半。
其中，所述第一曲线和第二曲线的交点位于，所述第一横截面外轮廓顶点远离所述电路板的一侧；所述第一曲线和第二曲线的交点至所述第一横截面外轮廓顶点的距离，小于所述第一椭圆的长轴长度的一半。
其中，所述第二封装层的折射率大于1.5。
其中，所述第一封装层的材料为硅胶或光刻胶中的任一种，所述第二封装层的材料为硅胶或光刻胶中的任一种，所述发光元件为LED芯片。
为解决上述问题，第三方面，本申请提供一种显示装置，所述显示装置包括背光模组，所述背光模组包括电路板，所述电路板的一侧表面设有间隔设置的多个发光元件，所述多个发光元件中至少一个发光元件的出光面包覆有第一封装层，所述第一封装层远离所述至少一个发光元件的一侧表面为曲面。
其中，所述第一封装层的第一横截面外轮廓位于第一椭圆上，所述第一横截面垂直于所述电路板的表面，所述第一封装层的厚度为所述第一椭圆的长轴长度的一半，所述第一椭圆的长轴垂直于所述电路板的表面。
其中，所述第一封装层的折射率小于1.2。
其中，所述背光模组还包括第二封装层，所述第二封装层包覆所述第一封装层远离所述发光元件的一侧表面，所述第二封装层远离所述第一封装层的一侧表面为曲面。
其中，所述第二封装层的第二横截面外轮廓包括第一曲线和第二曲线，所述第二横截面垂直于所述电路板的表面，所述第一曲线位于第二椭圆上，所述第二曲线位于第三椭圆上，所述第二椭圆和所述第三椭圆不重合，所述第二椭圆的长轴垂直于所述电路板的表面，所述第三椭圆的长轴垂直于所述电路板的表面。
其中，所述第二椭圆和所述第三椭圆关于所述第一椭圆的长轴对称，所述第二横截面外轮廓的厚度小于，所述第二横截面外轮廓宽度的一半。
其中，所述第一曲线和第二曲线的交点位于，所述第一横截面外轮廓顶点远离所述电路板的一侧；所述第一曲线和第二曲线的交点至所述第一横截面外轮廓顶点的距离，小于所述第一椭圆的长轴长度的一半。
其中，所述第二封装层的折射率大于1.5。
其中，所述第一封装层的材料为硅胶或光刻胶中的任一种，所述第二封装层的材料为硅胶或光刻胶中的任一种，所述发光元件为LED芯片。
 有益效果
有益效果：本申请实施例提供一种背光模组，该背光模组包括电路板，电路板的一侧表面设有间隔设置的多个发光元件，多个发光元件中至少一个发光元件的出光面包覆有第一封装层，第一封装层远离至少一个发光元件的一侧表面为曲面。本申请第一封装层远离发光元件的一侧表面为曲面，相对于平面封装层，能够破坏光线在出光面发生的全反射，提高出光率，避免光线能量损失。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供一种背光模组的一个实施例结构示意图；
图2是图1中背光模组中第一封装层和第二封装层一具体实施例的结构示意图；
图3是图1背光模组中发光元件射出光线的出光示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请中，“示例性”一词用来表示“用作例子、例证或说明”。本申请中被描述为“示例性”的任何实施例不一定被解释为比其它实施例更优选或更具优势。为了使本领域任何技术人员能够实现和使用本申请，给出了以下描述。在以下描述中，为了解释的目的而列出了细节。应当明白的是，本领域普通技术人员可以认识到，在不使用这些特定细节的情况下也可以实现本申请。在其它实例中，不会对公知的结构和过程进行详细阐述，以避免不必要的细节使本申请的描述变得晦涩。因此，本申请并非旨在限于所示的实施例，而是与符合本申请所公开的原理和特征的最广范围相一致。
本申请实施例提供一种背光模组，所述背光模组包括电路板，所述电路板的一侧表面设有间隔设置的多个发光元件，所述多个发光元件中至少一个发光元件的出光面包覆有第一封装层，所述第一封装层远离所述至少一个发光元件的一侧表面为曲面。本申请实施例的背光模组可以应用于各各种显示装置。以下分别进行详细说明。
参阅图1，图1是本申请实施例提供一种背光模组的一个实施例结构示意图。
如图1所示，本申请实施例中，背光模组10包括电路板11，电路板11的一侧表面设有间隔设置的多个发光元件12。多个发光元件12中至少一个发光元件12的出光面包覆有第一封装层13，第一封装层13远离至少一个发光元件12的一侧表面为曲面。优选的，每个发光元件12的出光面均包覆有第一封装层13。其中，第一封装层13的曲面可以为球面、椭球面、剖物线曲面或者由多个曲面组成的曲面等，本申请对此不作限定。由于第一封装层13远离至少一个发光元件12的一侧表面为曲面，当发光元件12发光通过第一封装层13的表面射出时，不会发生全反射，相对于现有技术中的平面封装层，破坏了现有技术平面封装层的全反射结构，从而提高了发光元件12的出光率。
本申请实施例中，电路板11为柔性电路板(Flexible Printed Circuit，简称FPC)。柔性电路板是以聚酰亚胺或聚酯薄膜为基材制成的一种具有高度可靠性，绝佳的可挠性印刷电路板，具有配线密度高、重量轻、厚度薄、弯折性好的特点。电路板11控制发光元件12为显示面板提供背光。在其他实施方式中，电路板11以可以为其他类型的电路板11，本申请对此不作限定。
本申请实施例中，发光元件12为LED芯片。优选的，LED芯片为mini LED。多个发光元件12按矩阵方式排布在电路板11上，以实现均匀出光。LED芯片可以为红光LED芯片、蓝光LED芯片以及绿光LED芯片等各种颜色的LED 芯片，本申请对此不作限定。
本申请实施例中，第一封装层13的折射率小于1.2。第一封装层13的材料为硅胶或光刻胶中的任一种。进一步的，第一封装层13为含有荧光粉的硅胶层或含有量子点的硅胶层。
本申请实施例中，背光模组10还包括第二封装层14，第二封装层14包覆第一封装层13远离发光元件12的一侧表面。第二封装层14远离第一封装层13的一侧表面为曲面。其中，第二封装层14的曲面可以为球面、椭球面、剖物线曲面或者由多个曲面组成的曲面等，本申请对此不作限定。第二封装层14的材料为硅胶或光刻胶中的任一种。进一步的，第二封装层14为含有荧光粉的硅胶层或含有量子点的硅胶层。
本申请实施例中，通过加热塑型和降温固化将第一封装层13包覆在呈阵列分布的发光元件12上；通过加热塑型和降温固化将第二封装层14包覆在第一封装层13上。在其他实施例中，也可以通过其他方式将制备第一封装层13和第二封装层14，本申请对此不作限定。
本申请实施例中，第二封装层14的折射率大于1.5。第二封装层14的折射率大于空气折射率，第二封装层14能够对光线进行扩散，当混光高度一定时，单个发光元件12光线的扩散范围较现有技术更大，从而能够减少电路板11单位面积上的发光元件12数量，降低背光模组10的制作成本。
为了进一步说明本申请第一封装层和第二封装层的具体结构，参阅图2，图2是图1中背光模组中第一封装层和第二封装层一具体实施例的结构示意图。
结合图1和图2，本申请实施例中，第一封装层13的第一横截面外轮廓131位于第一椭圆151上，第一横截面垂直于电路板11的表面。第一封装层13的厚度H1为第一椭圆151的长轴长度的一半，第一椭圆151的长轴垂直于电路板11的表面。显然，第一封装层13的厚度H1为第一椭圆151的长轴长度的一半，第一椭圆151的长轴垂直于电路板11的表面，则发光元件12相当于位于第一椭圆151的中心处，发光元件12从椭圆中心发光，出光面为椭圆轮廓，能够进一步提高出光率。
本申请实施例中，第二封装层14的第二横截面外轮廓141包括第一曲线142和第二曲线143，第二横截面垂直于电路板11的表面。第一曲线142位于第二椭圆152上，第二曲线143位于第三椭圆153上，第二椭圆152和第三椭圆153不重合，第二椭圆152的长轴垂直于电路板11的表面，第三椭圆153的长轴垂直于电路板11的表面。也即，第二封装层14的表面轮廓为两段椭圆弧组成的曲线，第二封装层14与空气接触的表面为椭圆轮廓，能够进一步提高光线的扩散效果，进一步提高出光率。
进一步的，第二椭圆152和第三椭圆153关于第一椭圆151的长轴对称，第二横截面外轮廓141的厚度H3小于，第二横截面外轮廓141宽度L1的一半。发光元件12与第一曲线142的相对位置，与发光元件12与第二曲线143的相对位置相同。发光元件12从第一曲线142和第二曲线143射出的光线完全相同，从而使得发光元件12出光均匀。并且，通过限制第二横截面外轮廓141的厚度，可以保证第二封装层14的散光效果，且减小第二封装层14的厚度，降低制作成本。
进一步的，第一曲线142和第二曲线143的交点位于，第一横截面外轮廓131顶点远离电路板11的一侧。第一曲线142和第二曲线143的交点至第一横截面外轮廓131顶点的距离H2，小于第一椭圆151的长轴长度的一半。其中，第一椭圆151的长轴长度的一半为第一封装层13的厚度H1，即H2小于H1。
参阅图3，图3是图1背光模组中发光元件射出光线的出光示意图。
如图3所示，光线从发光元件12中射出，在第一封装层13和第二封装层14的界面经过第一次折射。由于第一封装层13和第二封装层14的界面为曲面，避免了光线的全反射，光线能够更多的从第一封装层13和第二封装层14的界面射入第二封装层14。光线在第二封装层14和空气的界面经过第二次折射，由于第二封装层14和空气的界面为曲面，且第二封装层14的折射率远大于空气，能够显著增加光线的扩散范围，在混光高度一定的情况下，相邻两个发光元件12的距离可以更大，从而能够减少电路板11上发光元件12的数量，从而降低背光模组10的制备成本。
本申请实施例提供一种背光模组，该背光模组包括电路板，电路板的一侧表面设有间隔设置的多个发光元件12，多个发光元件12中至少一个发光元件12的出光面包覆有第一封装层，第一封装层远离至少一个发光元件12的一侧表面为曲面。本申请第一封装层远离发光元件12的一侧表面为曲面，相对于平面封装层，能够破坏光线在出光面发生的全反射，提高出光率，避免光线能量损失。
需要说明的是，上述背光模组实施例中仅描述了上述结构，可以理解的是，除了上述结构之外，本申请实施例背光模组中，还可以根据需要包括任何其他的必要结构，具体此处不作限定。
具体实施时，以上各个单元或结构可以作为独立的实体来实现，也可以进行任意组合，作为同一或若干个实体来实现，以上各个单元或结构的具体实施可参见前面的方法实施例，在此不再赘述。
以上对本申请实施例所提供的一种背光模组和显示装置进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种背光模组，其中，所述背光模组包括电路板，所述电路板的一侧表面设有间隔设置的多个发光元件，所述多个发光元件中至少一个发光元件的出光面包覆有第一封装层，所述第一封装层远离所述至少一个发光元件的一侧表面为曲面;
    所述第一封装层的第一横截面外轮廓位于第一椭圆上，所述第一横截面垂直于所述电路板的表面，所述第一封装层的厚度为所述第一椭圆的长轴长度的一半，所述第一椭圆的长轴垂直于所述电路板的表面;
    所述第一封装层的折射率小于1.2。
  2. 根据权利要求1所述的背光模组，其中，所述背光模组还包括第二封装层，所述第二封装层包覆所述第一封装层远离所述发光元件的一侧表面，所述第二封装层远离所述第一封装层的一侧表面为曲面。
  3. 一种背光模组，其中，所述背光模组包括电路板，所述电路板的一侧表面设有间隔设置的多个发光元件，所述多个发光元件中至少一个发光元件的出光面包覆有第一封装层，所述第一封装层远离所述至少一个发光元件的一侧表面为曲面。
  4. 根据权利要求3所述的背光模组，其中，所述第一封装层的第一横截面外轮廓位于第一椭圆上，所述第一横截面垂直于所述电路板的表面，所述第一封装层的厚度为所述第一椭圆的长轴长度的一半，所述第一椭圆的长轴垂直于所述电路板的表面。
  5. 根据权利要求3所述的背光模组，其中，所述第一封装层的折射率小于1.2。
  6. 根据权利要求4所述的背光模组，其中，所述背光模组还包括第二封装层，所述第二封装层包覆所述第一封装层远离所述发光元件的一侧表面，所述第二封装层远离所述第一封装层的一侧表面为曲面。
  7. 根据权利要求6所述的背光模组，其中，所述第二封装层的第二横截面外轮廓包括第一曲线和第二曲线，所述第二横截面垂直于所述电路板的表面，所述第一曲线位于第二椭圆上，所述第二曲线位于第三椭圆上，所述第二椭圆和所述第三椭圆不重合，所述第二椭圆的长轴垂直于所述电路板的表面，所述第三椭圆的长轴垂直于所述电路板的表面。
  8. 根据权利要求7所述的背光模组，其中，所述第二椭圆和所述第三椭圆关于所述第一椭圆的长轴对称，所述第二横截面外轮廓的厚度小于，所述第二横截面外轮廓宽度的一半。
  9. 根据权利要求8所述的背光模组，其中，所述第一曲线和第二曲线的交点位于，所述第一横截面外轮廓顶点远离所述电路板的一侧；所述第一曲线和第二曲线的交点至所述第一横截面外轮廓顶点的距离，小于所述第一椭圆的长轴长度的一半。
  10. 根据权利要求6所述的背光模组，其中，所述第二封装层的折射率大于1.5。
  11. 根据权利要求10所述的背光模组，其中，所述第一封装层的材料为硅胶或光刻胶中的任一种，所述第二封装层的材料为硅胶或光刻胶中的任一种，所述发光元件为LED芯片。
  12. 一种显示装置，其中，所述显示装置包括背光模组；所述背光模组包括电路板，所述电路板的一侧表面设有间隔设置的多个发光元件，所述多个发光元件中至少一个发光元件的出光面包覆有第一封装层，所述第一封装层远离所述至少一个发光元件的一侧表面为曲面。
  13. 根据权利要求12所述的显示装置，其中，所述第一封装层的第一横截面外轮廓位于第一椭圆上，所述第一横截面垂直于所述电路板的表面，所述第一封装层的厚度为所述第一椭圆的长轴长度的一半，所述第一椭圆的长轴垂直于所述电路板的表面。
  14. 根据权利要求12所述的显示装置，其中，所述第一封装层的折射率小于1.2。
  15. 根据权利要求13所述的显示装置，其中，所述背光模组还包括第二封装层，所述第二封装层包覆所述第一封装层远离所述发光元件的一侧表面，所述第二封装层远离所述第一封装层的一侧表面为曲面。
  16. 根据权利要求15所述的显示装置，其中，所述第二封装层的第二横截面外轮廓包括第一曲线和第二曲线，所述第二横截面垂直于所述电路板的表面，所述第一曲线位于第二椭圆上，所述第二曲线位于第三椭圆上，所述第二椭圆和所述第三椭圆不重合，所述第二椭圆的长轴垂直于所述电路板的表面，所述第三椭圆的长轴垂直于所述电路板的表面。
  17. 根据权利要求16所述的显示装置，其中，所述第二椭圆和所述第三椭圆关于所述第一椭圆的长轴对称，所述第二横截面外轮廓的厚度小于，所述第二横截面外轮廓宽度的一半。
  18. 根据权利要求17所述的显示装置，其中，所述第一曲线和第二曲线的交点位于，所述第一横截面外轮廓顶点远离所述电路板的一侧；所述第一曲线和第二曲线的交点至所述第一横截面外轮廓顶点的距离，小于所述第一椭圆的长轴长度的一半。
  19. 根据权利要求15所述的显示装置，其中，所述第二封装层的折射率大于1.5。
  20. 根据权利要求19所述的显示装置，其中，所述第一封装层的材料为硅胶或光刻胶中的任一种，所述第二封装层的材料为硅胶或光刻胶中的任一种，所述发光元件为LED芯片。
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Families Citing this family (4)

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Publication number Priority date Publication date Assignee Title
CN113113552A (zh) * 2021-03-24 2021-07-13 武汉华星光电半导体显示技术有限公司 显示面板及显示装置
CN113176686A (zh) * 2021-04-21 2021-07-27 Tcl华星光电技术有限公司 背光模组及显示装置
CN114464604B (zh) * 2021-07-16 2023-04-11 荣耀终端有限公司 显示装置、电子设备及背光模组的封装方法
CN114628559A (zh) * 2022-03-21 2022-06-14 惠州华星光电显示有限公司 发光二极管、发光基板以及显示装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000223751A (ja) * 1998-11-25 2000-08-11 Nichia Chem Ind Ltd Ｌｅｄランプ及びそれを用いた表示装置
CN1971131A (zh) * 2005-09-14 2007-05-30 C.R.F.阿西安尼顾问公司 用于投影光束的模块
CN101425557A (zh) * 2008-12-17 2009-05-06 友达光电股份有限公司 背光模块及其发光二极管
CN102760819A (zh) * 2011-04-27 2012-10-31 松下电器产业株式会社 发光装置及包括这种发光装置的照明设备
US8421957B2 (en) * 2005-11-11 2013-04-16 Hitachi Displays, Ltd. Illuminating device and liquid-crystal display device using the same
CN109324442A (zh) * 2018-11-09 2019-02-12 惠州市华星光电技术有限公司 光源组件以及背光模组
CN110707078A (zh) * 2019-09-12 2020-01-17 武汉华星光电技术有限公司 一种背光模组及其制备方法、显示装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101556023A (zh) * 2009-05-14 2009-10-14 上海广电光电子有限公司 带广角透镜的led光源
CN101639181A (zh) * 2009-08-07 2010-02-03 广东昭信光电科技有限公司 直下式背光系统
CN201749867U (zh) * 2010-04-28 2011-02-16 红蝶科技(深圳)有限公司 高出光率的单色led封装结构及使用其的投影光学引擎
CN102110750B (zh) * 2010-11-19 2012-04-25 东南大学 发光二极管的圆片级玻璃微腔封装方法
CN102130236A (zh) * 2010-12-31 2011-07-20 北京大学深圳研究生院 一种led芯片的封装方法及封装器件
TW201238086A (en) * 2011-03-03 2012-09-16 Lextar Electronics Corp Chip package structure
WO2014117466A1 (zh) * 2013-02-01 2014-08-07 邓雅琴 可降低蓝光危害的白光led灯二次封装结构
CN105444045A (zh) * 2014-09-24 2016-03-30 青岛海信电器股份有限公司 一种发光二极管led发光器件、背光模组及显示面板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000223751A (ja) * 1998-11-25 2000-08-11 Nichia Chem Ind Ltd Ｌｅｄランプ及びそれを用いた表示装置
CN1971131A (zh) * 2005-09-14 2007-05-30 C.R.F.阿西安尼顾问公司 用于投影光束的模块
US8421957B2 (en) * 2005-11-11 2013-04-16 Hitachi Displays, Ltd. Illuminating device and liquid-crystal display device using the same
CN101425557A (zh) * 2008-12-17 2009-05-06 友达光电股份有限公司 背光模块及其发光二极管
CN102760819A (zh) * 2011-04-27 2012-10-31 松下电器产业株式会社 发光装置及包括这种发光装置的照明设备
CN109324442A (zh) * 2018-11-09 2019-02-12 惠州市华星光电技术有限公司 光源组件以及背光模组
CN110707078A (zh) * 2019-09-12 2020-01-17 武汉华星光电技术有限公司 一种背光模组及其制备方法、显示装置

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