WO2020198995A1 - 柔性电子装置的制作方法及柔性电子装置 - Google Patents

柔性电子装置的制作方法及柔性电子装置 Download PDF

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Publication number
WO2020198995A1
WO2020198995A1 PCT/CN2019/080574 CN2019080574W WO2020198995A1 WO 2020198995 A1 WO2020198995 A1 WO 2020198995A1 CN 2019080574 W CN2019080574 W CN 2019080574W WO 2020198995 A1 WO2020198995 A1 WO 2020198995A1
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WIPO (PCT)
Prior art keywords
layer
flexible electronic
electronic device
manufacturing
gel layer
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Ceased
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PCT/CN2019/080574
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English (en)
French (fr)
Inventor
雷晓华
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Shenzhen Royole Technologies Co Ltd
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Shenzhen Royole Technologies Co Ltd
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Application filed by Shenzhen Royole Technologies Co Ltd filed Critical Shenzhen Royole Technologies Co Ltd
Priority to CN201980073121.XA priority Critical patent/CN113261108A/zh
Priority to PCT/CN2019/080574 priority patent/WO2020198995A1/zh
Publication of WO2020198995A1 publication Critical patent/WO2020198995A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Definitions

  • This application relates to the field of flexible equipment, and in particular to a method for manufacturing a flexible electronic device and a flexible electronic device.
  • the packaging of flexible electronic devices needs to be injection-molded and packaged in a mold, while the use of molds for injection-molding and packaging needs to be performed under high temperature and high pressure conditions, resulting in the electronic devices of the electronic device in a high temperature and high pressure environment, which is likely to cause damage to the electronic devices, and the packaging efficiency is low. high.
  • This application provides a flexible electronic device and a manufacturing method of the flexible electronic device.
  • the present application provides a flexible electronic device, wherein the manufacturing of the flexible electronic device includes the steps:
  • the encapsulation film has a base layer and a gel layer formed on the base layer;
  • the present application also provides a flexible electronic device, wherein the flexible electronic device is manufactured by the above-mentioned manufacturing method of the flexible electronic device.
  • the present application also provides a flexible electronic device, wherein the flexible electronic device includes a flexible electronic panel and an encapsulation layer formed on the flexible electronic panel.
  • an encapsulation film provided with a gel layer is provided in advance, the encapsulation film is attached to the flexible electronic panel, and then the gel layer of the encapsulation film is cured, and then the encapsulation film is removed.
  • the base layer of the flexible electronic panel can be packaged to avoid damage to the flexible electronic panel, and the packaging efficiency can be improved.
  • Fig. 1 is a schematic structural diagram of a flexible electronic device provided by an embodiment of the present application.
  • FIG. 2 is a schematic flowchart of a manufacturing method of a flexible electronic device provided by an embodiment of the present application.
  • FIG. 3 is a schematic diagram of a process of a manufacturing method of a flexible electronic device provided by an embodiment of the present application.
  • FIG. 4 is a schematic diagram of a process of a manufacturing method of a flexible electronic device provided by an embodiment of the present application.
  • FIG. 5 is a schematic process diagram of a method for manufacturing a flexible electronic device provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a flexible electronic device manufactured by the manufacturing method of a flexible electronic device provided by an embodiment of the present application.
  • FIG. 7 is a schematic flowchart of a manufacturing method of a flexible electronic device according to another embodiment of the present application.
  • FIG. 8 is a schematic process diagram of a manufacturing method of a flexible electronic device according to another embodiment of the present application.
  • FIG. 9 is a schematic process diagram of a manufacturing method of a flexible electronic device according to another embodiment of the present application.
  • FIG. 10 is a schematic process diagram of a manufacturing method of a flexible electronic device according to another embodiment of the present application.
  • FIG. 11 is a schematic diagram of a manufacturing method of a flexible electronic device according to another embodiment of the present application.
  • Fig. 12 is a schematic structural diagram of a flexible electronic device manufactured by a manufacturing method of a flexible electronic device according to another embodiment of the present application.
  • a component when a component is said to be “fixed to” another component, it can be directly on the other component or a central component may also exist. When a component is considered to be “connected” to another component, it can be directly connected to another component or there may be a centered component at the same time.
  • the manufacturing method of the flexible electronic device is used to manufacture the flexible electronic device 1000.
  • the flexible electronic device 1000 includes a flexible electronic panel 100 and an encapsulation layer 200 formed on the flexible electronic panel 100.
  • the encapsulation layer 200 encapsulates and protects the flexible electronic panel 100.
  • the flexible electronic device 1000 can be a flexible or stretchable device such as a flexible sensor, or a flexible display screen, or a flexible electronic wristband, or a smart electronic watch, or a flexible mobile phone.
  • the flexible electronic device 1000 can also be used to detect and monitor, or entertainment interaction, or smart wearable and other fields of bendable or stretchable electronic equipment.
  • the manufacturing method of the flexible electronic device includes the steps:
  • the encapsulation film 10 has a base layer 11 and a gel layer 12 formed on the base layer 11.
  • the base layer 11 is a bearing film layer of the gel layer 12 to facilitate uniform dispersion and molding of the gel layer 12.
  • the gel layer 12 is in a semi-solid and semi-liquid state to facilitate subsequent curing processing to form the encapsulation layer 200.
  • the base layer 11 has a bendable deformation performance, so that the packaging film 10 has a bending deformation performance, and the packaging film 10 can be attached to a flexible electronic panel 100 having a bending deformation performance.
  • the packaging film 10 can package the flexible electronic panel 100 in two dimensions.
  • the packaging film 10 can package the flexible electronic panel 100 in the shape of a bendable flat plate.
  • the packaging film 10 may also perform three-dimensional packaging of the flexible electronic panel 100.
  • the packaging film 10 may perform a closed loop packaging of the flexible electronic device 1000 in a closed loop.
  • the process of providing the encapsulation film 10 is: first provide the base layer 11; then, form the release layer 13 on the base layer 11; finally, form the gel layer 12 on the release layer 13.
  • the base layer 11 is made of a material with flexible and bendable properties.
  • the material of the base layer 11 can be PET (Polyethylene terephthalat, polyethylene terephthalate) plastic, or can be PBT (polybutylene terephthalate, polybutylene terephthalate) plastic, or can be TPU (Thermoplastic Polyurethanes, thermoplastic polyurethane elastomer rubber) materials, etc.
  • the base layer 11 can be formed by hot pressing, or rolling, or stretching, or curtain coating, or extrusion process to form a larger area of film, and then through cutting, or punching, or cutting process to form a predetermined area of film. .
  • the thickness of the base layer 11 is small, and the flexibility of the base layer 11 is high, which facilitates the bending of the packaging film 10 to increase the gap between the packaging film 10 and the flexible electronic panel 100.
  • the degree of adhesion can reduce the manufacturing cost of the packaging film 10.
  • the thickness of the base layer 11 may also be increased, and the base layer 11 may have a certain strength to prevent the packaging film 10 from failing. The bending is in a closed loop, so as to ensure that the packaging film 10 provides load bearing stress to the flexible electronic panel 100.
  • the material of the release layer 13 is peelable glue or surfactant.
  • the release layer 13 may be formed on one side of the base layer 11 by spraying, coating, or printing.
  • the release layer 13 completely covers the base layer 11.
  • the thickness of the release layer 13 is smaller than the thickness of the base layer 11 to reduce the influence on the bending performance of the packaging film 10.
  • the main material of the gel layer 12 may be a silicone rubber material.
  • a liquid material is used to form the release layer 13 and then cured to form a semi-solid and semi-liquid gel layer 12.
  • the step of forming the gel layer 12 on the release layer 13 includes: providing a mixed liquid.
  • the mixed liquid may be a mixture of a curable liquid material and an inactive diluent.
  • the inactive diluent is used to change the viscosity of the mixed liquid, so that the mixed liquid is uniformly dispersed and formed on the peelable layer 13.
  • the mixed liquid may also contain other materials that change the viscosity.
  • the formation process of the mixed liquid is:
  • the liquid of the first component may be an organosilicon rubber liquid that has stable performance, is convenient for storage, and is not easy to solidify, age, and vulcanize in a normal greenhouse environment, that is, the liquid of the first component is a liquid that is hard to harden.
  • the liquid of the first component can also be a plastic or rubber liquid that provides other stable properties that are not easy to cure, age, or vulcanize.
  • the second component of the liquid contains a silicone rubber liquid that can be hardened under certain conditions and has a high curing efficiency, that is, the second component of the liquid provides the hardening component.
  • the liquid of the second component can be a conventional silicone rubber liquid with a heating curing agent, or a light curing agent, or a vulcanizing agent, or a mixture of a curing agent and a vulcanizing agent.
  • the second component can also be other plastic liquids or rubber liquids mixed with curing agents or vulcanizing agents.
  • the inactive diluent can be a low boiling point organic solvent or a low boiling point silane material.
  • the liquid of the first component, the liquid of the second component and the inactive diluent are mixed, and the mixed liquid is subjected to defoaming treatment to form a suitable viscosity, no bubbles, hardenable treatment, and high flow Sexual mixed liquid.
  • the liquid of the first component may be provided first, and then the liquid of the second component and the inactive diluent are added to the liquid of the first component in sequence.
  • the step of forming the gel layer 12 on the release layer 13 includes forming a mixed liquid on the release layer 13.
  • the mixed liquid is formed on the release layer 13 by spraying, coating, printing, pouring, or injection.
  • the mixed liquid is uniformly dispersed on the release layer 13.
  • the thickness of the mixed liquid on the release layer 13 is uniformly distributed.
  • the thickness of the mixed liquid can be greater than the thickness of the release layer 13 to meet the molding requirements of the gel layer 12 so that the gel layer 12 has a certain strength to facilitate the adhesion of the gel layer 12 to the flexible electronic panel 100.
  • the step of forming the gel layer 12 on the release layer 13 includes forming the gel layer 12 with the mixed liquid.
  • the process of mixing the liquid to form the gel layer 12 is: first, the release layer 13 coated with the mixed liquid and the base layer 11 are baked together at a first preset temperature to remove the non-volatile content in the mixed liquid.
  • the active diluent volatilizes; then the mixed liquid containing the vulcanizing agent is vulcanized at the second preset temperature and within the preset time to form the mixed liquid into a semi-solid and semi-liquid silicone rubber, that is, on the release layer 13
  • the gel layer 12 is formed.
  • the first preset temperature, the second preset temperature, and the preset time can be preset as needed.
  • the mixed liquid contains a photocuring agent
  • the mixed liquid is subjected to a photocuring treatment to form the gel layer 12.
  • the heating and curing agent is contained in the mixed liquid, after the inert diluent of the mixed liquid is volatilized, the mixed liquid is subjected to heating and curing treatment to form the gel layer 12.
  • the manufacturing method of the flexible electronic device includes the steps:
  • the flexible electronic panel 100 includes an elastic base layer 110 and an electronic device layer 120 formed on the elastic base layer 110.
  • the elastic base layer 110 has elastic, stretchable, and bendable flexible deformation properties, so as to meet the use requirements of the flexible electronic panel 100 to be bendable and foldable or stretchable.
  • the material of the elastic base layer 110 may be the same as that of the gel layer 12, that is, the elastic base layer 110 may be a silicone rubber layer.
  • the elastic base layer 110 can also be PET (Polyethylene terephthalat, polyethylene terephthalate) plastic, or can be PBT (polybutylene terephthalate, polybutylene terephthalate) plastic, or can be TPU (Thermoplastic Polyurethanes).
  • the elastic base layer 110 may be formed by a hot pressing process, an extrusion process, an injection molding process, a pouring process, or a spraying process.
  • the electronic device layer 120 can be formed together with the elastic base layer 110, that is, in the process of forming the elastic base layer 110, the electronic device layer 120 is formed on the elastic base layer 110.
  • the electronic device layer 120 may also be formed on the elastic base layer 110 after the elastic base layer 110 is formed.
  • the electronic device layer 120 includes a plurality of electronic devices and stretchable wires connecting the electronic devices.
  • the electronic device may be any electronic device such as a sensing device, a touch device, a display device, or a light emitting device.
  • Stretchable wires can transmit electrical signals with electronic devices.
  • the stretchable wire can be bent, stretched and deformed with the elastic base layer 110.
  • the gel layer 12 is attached to the side of the electronic device layer 120 away from the elastic base layer 110.
  • the packaging film 10 completely covers the side of the electronic device layer 120 away from the elastic base layer 110, and the packaging film 10 protects the electronic device layer 120.
  • the manufacturing method of the flexible electronic device includes the steps:
  • the packaging film 10 and the flexible electronic panel 100 bonded to the packaging film 10 are subjected to vacuum negative pressure degassing or low pressure degassing to remove condensation.
  • the air bubbles generated between the adhesive layer 12 and the electronic device layer 120 during the bonding process make the gel layer 12 and the electronic device layer 120 more tightly bonded, preventing package failure.
  • the gel layer 12 and the electronic device layer 120 may be defoamed in the process of bonding the gel layer 12 and the electronic device layer 120, that is, the gel layer 12 and the electronic device layer 120 are defoamed.
  • the defoaming process can be performed and the unbonded part can be continuously bonded until the gel layer 12 is completely bonded to the electronic device layer 120 and there is no bubble gap.
  • the manufacturing method of the flexible electronic device includes the steps:
  • the gel layer 12 is hardened.
  • the gel layer 12 is hardened to increase the hardness of the gel layer 12 in a semi-solid and semi-liquid state to form a solid encapsulation layer 200.
  • the encapsulation layer 200 is a solid silicone rubber layer.
  • the encapsulation layer 200 has elastic, stretchable, and bendable deformation properties, and the encapsulation layer 200 has a certain degree of hardness, which can effectively protect the electronic device layer 120.
  • the gel layer 12 and the electronic device layer 120 are effectively pasted and then hardened to form the encapsulation layer 200, so that the molecular attraction between the molecules of the encapsulation layer 200 and the electronic device layer 120 is enhanced, and the encapsulation layer 200 and the electronic device layer 120 are more stable in structure and difficult to separate. .
  • the gel layer 12 is a silicone rubber containing a vulcanizing agent, and the gel layer 12 is vulcanized to form the encapsulation layer 200.
  • the vulcanization temperature and vulcanization duration of the vulcanization treatment of the gel layer 12 can be set according to the thermal performance, or corrosion resistance, or pressure resistance of the electronic device layer 120.
  • the gel layer 12 may be quickly vulcanized at room temperature, or quickly vulcanized under heating conditions, or vulcanized for a long time at room temperature.
  • the gel layer 12 contains a photocuring agent or a heating curing agent, the gel layer 12 can be cured to form a solid encapsulation layer 200, or heat cured to form a solid encapsulation layer 200. .
  • the manufacturing method of the flexible electronic device includes the steps:
  • the base layer 11 and the release layer 13 are separated from the encapsulation layer 200 together, so that the release layer 13 is separated from the encapsulation layer 200, so that the base layer 11 is removed.
  • the molecular adhesion force on the side where the release layer 13 is attached to the base layer 11 is greater than the molecular adhesion force on the side of the release layer 13 away from the base layer 11, so as to achieve the release of the base layer 11.
  • the release layer 13 and the base layer 11 are separated from the encapsulation layer 200 together.
  • the molecular adhesion force of the release layer 13 to the base layer 11 may be lower than the molecular adhesion force of the release layer 13 on the side facing away from the base layer 11, so that after the base layer 11 is separated from the release layer 13, The release layer 13 is further separated from the encapsulation layer 200.
  • the base layer 11 and the release layer 13 are separated from the encapsulation layer 200 under the pulling force, that is, the base layer 11 and the encapsulation layer 200 are separated by physical force.
  • the base layer 11 and the release layer 13 can also be separated from the encapsulation layer 200 through a chemical etching process, that is, the flexible electronic panel 100, the encapsulation layer 200 and the base layer 11 are placed in a chemical etchant; the release layer 13 is decomposed and corroded under the action of chemical corrosives, while the base layer 11, encapsulation layer 200 and flexible electronic panel 100 are not corroded by chemical corrosives; the base layer 11 is separated from the encapsulation layer 200 after the release layer 13 is corroded and decomposed to realize the removal of the base layer 11.
  • the release layer 13 may also be subjected to light treatment or heat treatment, and the release layer 13 generates a decomposition reaction or causes molecular adhesion failure
  • the base layer 11 and the release layer 13 are separated from the encapsulation layer 200, only the encapsulation layer 200 and the flexible electronic panel 100 remain, so that the flexible electronic device 1000 can be effectively encapsulated, and the electronic device layer 120 is formed on the elastic base layer 110 and the encapsulation layer 200 In between, get effective protection.
  • the manufacturing method of the flexible electronic device includes the steps:
  • the encapsulation film 10 has a base layer 11 and a gel layer 12 formed on the base layer 11.
  • step 201 is roughly the same as that of step 101, except that the base layer 11 is provided with a reinforcement layer 111 and a substrate layer 112 provided on the reinforcement layer 111, and a release layer 13 is provided on the substrate layer 112.
  • the gel layer 12 is formed on the release layer 13.
  • the process of forming the gel layer 12 on the base layer 112 is substantially the same as the process of forming the gel layer 12 on the base layer 11 in step 101, and will not be repeated here.
  • the hardness of the reinforcement layer 111 is greater than that of the substrate layer 112.
  • the reinforcement layer 111 reinforces the substrate layer 112 to increase the load-bearing stress of the base layer 11, so that the base layer 11 can be bent and deformed into a preset shape, and it can effectively carry the flexible electronic panel 200.
  • the reinforcement layer 111 may be a tape reinforcement layer, a steel sheet reinforcement layer, or a resin plastic reinforcement layer.
  • the base layer 11 may only be provided with a reinforcement layer 111, a release layer 13 is formed on the reinforcement layer 111, and a gel layer 12 is formed on the release layer 13.
  • the reinforcing layer 111 can also be made of a deformable memory material to stabilize the curved and deformed shape of the packaging film 10.
  • the manufacturing method of the flexible electronic device includes the steps:
  • step 202 is substantially the same as the process of step 102, and will not be repeated here.
  • the manufacturing method of the flexible electronic device includes the steps:
  • the reinforcing layer 111 has a first closed side 1111 and a second closed side 1112 opposite to the first closed side 1111.
  • the flexible electronic panel 100 has a first edge 1001 aligned with the first closed edge 1111 and a second edge 1002 aligned with the second closed edge 1112.
  • the gel layer 121 has a first fusion edge 1211 aligned with the first closed edge 1111 and a second fusion edge 1212 aligned with the second closed edge 1112.
  • the reinforcement layer 111 forms a closed ring structure with a stable structure, such as the connection, rivet connection, or screw connection.
  • the first fusion edge 1211 and the second fusion edge 1212 are connected to each other as the reinforcing layer 111 is closed, and contact each other to form a closed structure after subsequent fusion.
  • the first edge 1001 and the second edge 1002 may be in contact with the reinforcement layer 111 being closed, so that the flexible electronic panel 100 forms a disconnected ring structure.
  • the gel layer 12 is formed on the inner side of the closed ring-shaped base layer 10, and the flexible electronic panel 100 is formed on the inner side of the closed ring-shaped gel layer 12.
  • the base layer 10 By forming the base layer 10 on the outside of the flexible electronic panel 100, it is convenient to remove the base layer 10 later.
  • the base layer 10 can also be disposed inside the flexible electronic panel 100.
  • the manufacturing method of the flexible electronic device includes the steps:
  • step 204 is substantially the same as the process of step 103, and will not be repeated here.
  • the manufacturing method of the flexible electronic device includes the steps:
  • step 205 is substantially the same as the process of step 104.
  • the difference is that during the curing process of the gel layer 12, the first fusion edge 1211 and the second fusion edge 1212 are under pressure and heat. Mutual fusion, so that the packaging layer 200 finally forms a closed ring-shaped packaging structure.
  • the manufacturing method of the flexible electronic device includes the steps:
  • step 206 is roughly the same as the process of step 105, and will not be repeated here.
  • the present application also provides a flexible electronic device 1000.
  • the flexible electronic device 1000 includes a flexible electronic panel 100 and an encapsulation layer 200 formed on the flexible electronic panel 100.
  • the flexible electronic panel 100 includes an elastic base layer 110 and an electronic device layer 120 formed on the elastic base layer 110.
  • the electronic device layer 120 includes a plurality of electronic devices and stretchable wires connecting the plurality of electronic devices. Stretchable wires transmit electrical signals with electronic devices.
  • the encapsulation layer 200 is encapsulated on the side of the electronic device layer 120 away from the elastic base layer 110 to protect the electronic devices and stretchable wires.
  • the flexible electronic device 1000 is substantially in a flat stretchable and bendable structure.
  • the packaging layer 200 encapsulates the flexible electronic panel 100 in two dimensions.
  • the encapsulation layer 200 can deform as the flexible electronic panel 100 is bent and stretched.
  • the flexible electronic device 1000 is substantially in a closed circular ring-shaped stretchable and curved structure.
  • the flexible electronic panel 100 is bent into a broken ring structure, and the encapsulation layer 200 is formed on the outer peripheral side of the flexible electronic panel 100 in a closed ring structure.

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Abstract

本申请提供一种柔性电子装置的制作方法及柔性电子装置，所述柔性电子装置制作包括步骤：提供封装膜，封装膜具有基层和形成于基层上的凝胶层；将柔性电子面板与封装膜的凝胶层贴合；将凝胶层硬化处理；去除基层。通过预先提供设置有凝胶层的封装膜，将封装膜与柔性电子面板贴合，然后将封装膜的凝胶层硬化处理后，去除封装膜的基层，实现对柔性电子面板封装，避免对柔性电子面板造成损毁，可提高封装效率。

Description

柔性电子装置的制作方法及柔性电子装置 技术领域
本申请涉及柔性设备领域，具体涉及一种柔性电子装置制作方法及柔性电子装置。
背景技术
目前柔性电子装置的封装需要在模具中进行注塑封装，而利用模具进行注塑封装需要在高温高压条件下进行，导致电子装置的电子器件处于高温高压环境下，容易造成电子器件损毁事故，封装效率不高。
发明内容
本申请提供一种柔性电子装置及柔性电子装置制作方法。
本申请提供一种柔性电子装置，其中，所述柔性电子装置制作包括步骤：
提供封装膜，封装膜具有基层和形成于基层上的凝胶层；
将柔性电子面板与封装膜的凝胶层贴合；
将凝胶层硬化处理；
去除基层。
本申请还提供一种柔性电子装置，其中，所述柔性电子装置由上述的柔性电子装置的制作方法所制作。
本申请还提供一种柔性电子装置，其中，所述柔性电子装置包括柔性电子面板和形成于所述柔性电子面板的封装层。
本申请的柔性电子装置及柔性电子装置制作方法，通过预先提供设置有凝胶层的封装膜，将封装膜与柔性电子面板贴合，然后将封装膜的凝胶层硬化处理后，去除封装膜的基层，实现对柔性电子面板封装，避免对柔性电子面板造成损毁，可提高封装效率。
附图说明
图1是本申请实施例提供的柔性电子装置的结构示意图。
图2是本申请实施例提供的柔性电子装置的制作方法的流程示意图。
图3是本申请实施例提供的柔性电子装置的制作方法的过程示意图。
图4是本申请实施例提供的柔性电子装置的制作方法的过程示意图。
图5是本申请实施例提供的柔性电子装置的制作方法的过程示意图。
图6是本申请实施例提供的柔性电子装置的制作方法所制作的柔性电子装置的结构示意图。
图7是本申请另一实施例提供的柔性电子装置的制作方法的流程示意图。
图8是本申请另一实施例提供的柔性电子装置的制作方法的过程示意图。
图9是本申请另一实施例提供的柔性电子装置的制作方法的过程示意图。
图10是本申请另一实施例提供的柔性电子装置的制作方法的过程示意图。
图11是本申请另一实施例提供的柔性电子装置的制作方法的过程示意图。
图12是本申请另一实施例提供的柔性电子装置的制作方法所制作的柔性电子装置的 结构示意图。
具体实施例
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明的是，当组件被称为“固定于”另一个组件，它可以直接在另一个组件上或者也可以存在居中的组件。当一个组件被认为是“连接”另一个组件，它可以是直接连接到另一个组件或者可能同时存在居中组件。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
下面结合附图，对本发明的一些实施方式作详细说明。在不冲突的情况下，下述的实施例及实施例中的特征可以相互组合。
请参阅图1和图2，本申请提供一种柔性电子装置的制作方法。柔性电子装置的制作方法用于制作柔性电子装置1000。柔性电子装置1000包括柔性电子面板100和形成于柔性电子面板100的封装层200。封装层200对柔性电子面板100进行封装防护。可以理解的是，柔性电子装置1000可以是柔性传感器、或柔性显示屏、或柔性电子护腕、或智能电子手表、或可弯曲手机等可弯曲或拉伸装置。柔性电子装置1000还可以用于检测监测、或娱乐交互、或智能穿戴等领域的可弯曲或可拉伸电子设备。
请一并参阅图2和图3，柔性电子装置的制作方法包括步骤：
101：提供封装膜10，封装膜10具有基层11和形成于基层11上的凝胶层12。
本实施方式中，基层11为凝胶层12的承载膜层，以方便凝胶层12均匀分散成型。凝胶层12呈半固体半液体的状态，以方便后续固化加工形成封装层200。基层11具有可弯曲形变性能，使得封装膜10具有弯曲形变性能，封装膜10可与具有弯曲形变性能柔性电子面板100贴合。封装膜10可对柔性电子面板100进行二维封装，例如封装膜10可对呈可弯曲平板状的柔性电子面板100进行平面封装。封装膜10也可以对柔性电子面板100进行三维封装，例如封装膜10可对呈闭合环状的柔性电子装置1000进行环式闭合封装。
具体的，在一个实施例中，提供封装膜10的过程是：先提供基层11；然后，在基层11上形成离型层13；最后，在离型层13上形成凝胶层12。
本实施方式中，基层11采用具有柔性可弯曲性能的材质制成。例如，基层11的材质可以是PET(Polyethylene terephthalat，聚对苯二甲酸乙二酯)塑料，或者可以是PBT(polybutylene terephthalate，聚对苯二甲酸丁二酯)塑料，或者是可以是TPU(Thermoplastic polyurethanes，热塑性聚氨酯弹性体橡胶)材料等。基层11可以是经热压、或辊压、或拉伸、或淋涂、或挤压工艺形成较大面积的薄膜后，再经过裁剪、或冲裁、或切割工艺形成预设面积大小的薄膜。为了满足封装膜10对可弯曲平板状的柔性电子面板100进行平面封装，基 层11的厚度较小，基层11的柔性较高，方便封装膜10弯曲，以增加封装膜10与柔性电子面板100的贴合度，并且可以减小封装膜10的制作成本。当然，在其他实施方式中，为了满足封装膜10对呈闭合环状的柔性电子面板100进行闭合式封装，基层11的厚度也可以增大，基层11可以具有一定强度，以防止封装膜10无法弯曲呈闭合环状，从而可以保证封装膜10对柔性电子面板100提供承载应力。
本实施方式中，离型层13的材质为可剥离胶或表面活性剂。离型层13可以是经喷涂、或涂布、或印刷工艺成型于基层11的一侧上。离型层13完全覆盖基层11。离型层13的厚度小于基层11的厚度，以减小对封装膜10的弯曲性能影响。
本实施方式中，凝胶层12的主要材质可以是有机硅橡胶材质。为方便凝胶层12形成于离型层13上，通过采用液体材料形成于离型层13后，经固化形成半固半液的凝胶层12。具体的，在离型层13上形成凝胶层12的步骤包括：提供混合液体。
本实施方式中，混合液体可以是将可固化的液体材料和非活性稀释剂混合。利用非活性稀释剂改变混合液体的粘稠度，方便混合液体均匀分散形成于可剥离层13上。当然，其他实施方式中，混合液体中也可以是含有其他改变粘稠度的材料。
具体的，混合液体的形成过程是：
首先，提供第一组分的液体。第一组分的液体可以是性能稳定的、方便存储的、在常温室内环境下不易固化、老化、硫化的有机硅橡胶液体，即第一组分的液体为不易硬化液体。当然，在其他实施方式中，第一组分的液体也可以是提供其他性能稳定不易固化、老化、硫化的塑胶或橡胶液体。
然后，提供第二组分的液体，第二组分的液体是含有在特定条件下可硬化、硬化效率高的有机硅橡胶液体，即第二组分的液体提供硬化成分。第二组分的液体可以是在常规的有机硅橡胶液体中添加加热固化剂、或光固化剂、或硫化剂，或者是添加固化剂和硫化剂的混合物。当然，若第一组分液体采用其他塑胶液体或橡胶液体，则第二组分也可以是采用混入有固化剂或硫化剂的其他塑胶液体或橡胶液体。
再然后，提供非活性稀释剂。非活性稀释剂可以是低沸点有机溶剂或低沸点硅烷等材料。
最后，将第一组分的液体、第二组分的液体和非活性稀释剂混合，并将混合后的液体进行脱泡处理后形成粘稠度合适、无气泡的、可硬化处理、高流动性的混合液体。当然，在其他实施方式中，也可以是先提供第一组分的液体、然后依次相第一组分液体中添加第二组分的液体和非活性稀释剂。
在离型层13上形成凝胶层12的步骤包括：将混合液体形成于离型层13上。
本实施方式中，将混合液体通过喷涂、或涂布、或印刷、或浇注、或注射等工艺形成于离型层13上。混合液体均匀分散于离型层13上。混合液体在离型层13上的厚度均匀分布。混合液体的厚度可以大于离型层13的厚度，以满足凝胶层12的成型要求，使得凝胶层12具有一定的强度，以方便凝胶层12与柔性电子面板100贴合。
在离型层13上形成凝胶层12的步骤包括：将混合液体形成凝胶层12。
本实施方式中，混合液体形成凝胶层12的过程是：先将涂有混合液体的离型层13和基层11一并在第一预设温度下进行烘烤，以将混合液体内的非活性稀释剂挥发掉；再将含有 硫化剂的混合液体在第二预设温度和预设时间内进行硫化处理，以将混合液体形成半固半液态的有机硅橡胶，即在离型层13上形成凝胶层12。其中，第一预设温度、第二预设温度和预设时间可以根据需要进行预先设定。当然，在其他实施方式中，若混合液体中含有光固化剂，则混合液体的非活性稀释剂挥发掉后，对混合液体进行光固化处理形成凝胶层12。若混合液体中含有加热固化剂，则混合液体的非活性稀释剂挥发掉后，对混合液体进行加热固化处理形成凝胶层12。
请一并参阅图2和图4，柔性电子装置的制作方法包括步骤：
102：将柔性电子面板100与封装膜10的凝胶层12贴合。
本实施方式中，柔性电子面板100包括弹性基底层110和形成于弹性基底层110上的电子器件层120。弹性基底层110具有弹性、可拉伸、可弯曲的柔性形变性能，以满足柔性电子面板100具有可弯曲折叠或可拉伸的使用要求。弹性基底层110的材质可以与凝胶层12材质相同，即弹性基底层110可以是有机硅橡胶层。弹性基底层110也可以是PET(Polyethylene terephthalat，聚对苯二甲酸乙二酯)塑料，或者可以是PBT(polybutylene terephthalate，聚对苯二甲酸丁二酯)塑料，或者是可以是TPU(Thermoplastic polyurethanes，热塑性聚氨酯弹性体橡胶)材料。弹性基底层110可以是热压工艺、或挤压工艺、或注塑工艺、或浇注工艺、或喷涂工艺成型。电子器件层120可以与弹性基底层110一并成型，即在形成弹性基底层110的过程中，将电子器件层120形成于弹性基层110上。电子器件层120也可以是在形成弹性基底层110后，将电子器件层120形成与弹性基底层110上。电子器件层120包括多个电子器件和连接电子器件的可拉伸导线。电子器件可以是感应器件、或触控器件、或显示器件、或发光器件等任意电子器件。可拉伸导线可与电子器件传输电信号。可拉伸导线可随弹性基底层110弯曲、拉伸形变。凝胶层12贴合于电子器件层120背离弹性基底层110一侧。封装膜10完全覆盖电子器件层120背离弹性基底层110一侧，封装膜10对电子器件层120防护。
柔性电子装置的制作方法包括步骤：
103：对封装膜10和与封装膜10贴合的柔性电子面板100进行脱泡处理。
本实施方式中，待封装膜10与柔性电子面板100完全贴合后，将封装膜10和与封装膜10贴合的柔性电子面板100进行真空负压脱泡或者进行低压脱泡，以去除凝胶层12与电子器件层120之间在贴合过程中产生的气泡，使得凝胶层12与电子器件层120贴合更密闭，防止封装失效。当然，在其他实施方式中，也可以是在凝胶层12与电子器件层120贴合的处理步骤中，对凝胶层12与电子器件层120进行脱泡处理，即在凝胶层12与电子器件层120部分贴合后可以进行脱泡处理以及继续对未贴合的部分进行贴合处理，直至凝胶层12与电子器件层120完全贴合，且不存在气泡间隙。
请一并参阅图2和图5，柔性电子装置的制作方法包括步骤：
104：将凝胶层12硬化处理。
本实施方式中，将凝胶层12硬化处理，以使得半固半液状态的凝胶层12硬度加强形成固态的封装层200。即封装层200为固态的有机硅橡胶层。封装层200具有弹性、可拉伸、可弯曲形变性能，封装层200具有一定硬度，可以对电子器件层120有效防护。利用凝胶层12与电子器件层120有效贴后进行硬化形成封装层200，使得封装层200的分子与电子器件层 120的分子引力增强，封装层200与电子器件层120结构更加稳固，不易分离。
凝胶层12为含有硫化剂的有机硅橡胶，凝胶层12硫化处理形成封装层200。在凝胶层12经硫化处理的硫化温度和硫化时长可以根据电子器件层120的受热性能、或耐腐蚀性能、或耐压性能设定。例如，凝胶层12可以在室温下快速硫化、或者在加热条件下快速硫化处理、或者在室温下长时间硫化处理。当然，在其他实施方式中，若凝胶层12含有光固化剂或加热固化剂，则凝胶层12可以经光固化处理形成固态的封装层200，或者经热固化处理形成固态的封装层200。
请一并参阅图2和图6，柔性电子装置的制作方法包括步骤：
105：去除基层11。
本实施方式中，通过将基层11和离型层13一同与封装层200相剥离，使得离型层13与封装层200分离，从而去除掉基层11。具体的，通过在形成离型层13的步骤中，设置离型层13粘贴基层11一侧的分子粘合力大于离型层13背离基层11一侧分子粘合力，以实现在剥离基层11的过程中，离型层13与基层11一同与封装层200分离。当然在其他实施方式中，也可以设置离型层13粘合基层11的分子粘合力小于离型层13背离基层11一侧分子粘合力，以实现基层11与离型层13分离后，再进一步将离型层13与封装层200分离。
本实施方式中，基层11和离型层13受撕拉作用力的方式下与封装层200分离，即采用物理受力方式是基层11与封装层200分离。当然，在其他实施方式中，基层11和离型层13也可以是经化学腐蚀工艺与封装层200分离，即通过柔性电子面板100、封装层200和基层11放置于化学腐蚀剂中；离型层13在化学腐蚀剂的作用下分解腐蚀，而基层11、封装层200和柔性电子面板100不受化学腐蚀剂的腐蚀作用；基层11在离型层13腐蚀分解后，与封装层200分离，实现去除基层11。当然，在其他实施方式中，离型层13也可以是经光照处理或经加热处理，离型层13产生分解反应或产生分子粘合力失效，以实现与封装层200分离。
在基层11和离型层13与封装层200分离后，仅保留封装层200封装与柔性电子面板100，使得柔性电子装置1000实现有效封装，电子器件层120形成于弹性基底层110和封装层200之间，得到有效防护。
在另一实施例中，与图2所示实施例大致相同，不同的是，柔性电子装置的制作方法用于对呈闭合环状的柔性电子面板100进行闭合式封装。
具体的，请一并参阅图7和图8，柔性电子装置的制作方法包括步骤：
201：提供封装膜10，封装膜10具有基层11和形成于基层11上的凝胶层12。
本实施方式中，步骤201与步骤101的过程大致相同，不同的是，基层11设有补强层111和设置于补强层111上的衬底层112，衬底层112上设置离型层13，凝胶层12形成于离型层13上。凝胶层12形成于衬底层112的过程与步骤101中凝胶层12形成于基层11的过程大致相同，在此不再赘述。补强层111的硬度大于衬底层112的硬度，补强层111对衬底层112补强，以增加基层11的承载应力，方便基层11可以弯曲形变预设形状，并对柔性电子面板200有效承载。补强层111可以为胶带补强层，也可以是钢片补强层，也可以是树脂塑胶补强层。当然，在其他实施方式中，基层11可以仅设置补强层111，在补强层111上形成离型层13，并在离型层13上形成凝胶层12。补强层111还可以是可形变记忆材质，以稳定封装膜10的弯曲形变形状。
请一并参阅图7和图9，柔性电子装置的制作方法包括步骤：
202：将柔性电子面板100与封装膜10的凝胶层12贴合。
本实施方式中，步骤202的过程与步骤102的过程大致相同，在此不再赘述。
请一并参阅图7和图10，柔性电子装置的制作方法包括步骤：
203：将相贴合的柔性电子面板100与封装膜10进行弯曲闭合处理，形成闭合环状结构。
本实施方式中，补强层111具有第一闭合边1111和与第一闭合边1111相对的第二闭合边1112。柔性电子面板100具有与第一闭合边1111对齐的第一边缘1001和与第二闭合边1112对齐的第二边缘1002。凝胶层121具有与第一闭合边1111对齐的第一融合边1211和与第二闭合边1112对齐的第二融合边1212。将柔性电子面板100与封装膜10弯曲呈闭合圆环状结构后，第一闭合边1111与第二闭合边1112闭合连接在一起，并可以通过胶带绑定、或胶水粘接、或者卡扣扣合、或铆钉连接、或螺钉连接等方式稳固连接，以使得补强层111形成结构稳固的闭合环状结构。第一融合边1211与第二融合边1212随补强层111闭合而相对接，并相接触，以待后续融合形成闭合结构。第一边缘1001与第二边缘1002可随补强层111闭合而相接触，使得柔性电子面板100形成断开的环状结构。凝胶层12形成于闭合环状基层10的内侧，柔性电子面板100形成于闭合环状凝胶层12的内侧。通过将基层10形成于柔性电子面板100的外侧，方便后续去除基层10。当然，在其他实施方式中，也可以将基层10设置于柔性电子面板100的内侧。
柔性电子装置的制作方法包括步骤：
204：对封装膜10和与封装膜10贴合的柔性电子面板100进行脱泡处理。
本实施方式中，步骤204的过程与步骤103的过程大致相同，在此不再赘述。
请一并参阅图7和图11，柔性电子装置的制作方法包括步骤：
205：将凝胶层12硬化处理。
本实施方式中，步骤205的过程与步骤104的过程大致相同，不同的是，凝胶层12在硬化处理的过程中，第一融合边1211和第二融合边1212在受压、受热条件下相互融合，使得封装层200最终形成闭合的环状封装结构。
请一并参阅图7和图12，柔性电子装置的制作方法包括步骤：
206：去除基层11。
本实施方式中，步骤206的过程大致与步骤105的过程相同，在此不再赘述。
请参阅图6和图12，本申请还提供一种柔性电子装置1000，柔性电子装置1000包括柔性电子面板100和形成于柔性电子面板100的封装层200。柔性电子面板100包括弹性基底层110和形成于弹性基底层110上的电子器件层120。电子器件层120包括多个电子器件和连接多个电子器件的可拉伸导线。可拉伸导线与电子器件传输电信号。封装层200封装于电子器件层120背离弹性基底层110一侧，对电子器件和可拉伸导线防护。
在一个实施例中，如图6所示，柔性电子装置1000大致呈平板可拉伸弯曲结构。封装层200对柔性电子面板100进行二维封装。封装层200可随柔性电子面板100弯曲拉伸形变。
在另一个实施例中，如图12所示，柔性电子装置1000大致呈闭合圆环状可拉伸弯曲结构。柔性电子面板100弯曲呈断开的环状结构，封装层200形成于柔性电子面板100外周侧呈闭合环状结构。
以上对本申请实施例所提供的一种柔性电子装置的制作方法及柔性电子装置进行了详细介绍，本文中应用了具体个例对本申请的原理及实施例进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的一般技术人员，依据本申请的思想，在具体实施例及应用范围上均会有改变之处，综上，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种柔性电子装置的制作方法，其特征在于，所述柔性电子装置制作包括步骤：
    提供封装膜，封装膜具有基层和形成于基层上的凝胶层；
    将柔性电子面板与封装膜的凝胶层贴合；
    将凝胶层硬化处理；
    去除基层。
  2. 如权利要求1所述的柔性电子装置的制作方法，其特征在于，提供封装膜的步骤包括：
    提供基层；
    在基层上形成离型层；
    在离型层上形成凝胶层。
  3. 如权利要求2所述的柔性电子装置的制作方法，其特征在于，在离型层上形成凝胶层的步骤包括：
    提供混合液体；
    将混合液体形成于离型层上；
    将混合液体形成凝胶层。
  4. 如权利要求3所述的柔性电子装置的制作方法，其特征在于，去除基层的步骤中，将所述基层和离型层剥离。
  5. 如权利要求3所述的柔性电子装置的制作方法，其特征在于，提供混合液体的步骤中，将不易硬化液体和易硬化液体均匀混合后进行脱泡形成混合液体。
  6. 如权利要求5所述的柔性电子装置的制作方法，其特征在于，所述易硬化液体含硫化剂或/和固化剂。
  7. 如权利要求5所述的柔性电子装置的制作方法，其特征在于，所述混合液体中还含有非活性稀释剂。
  8. 如权利要求7所述的柔性电子装置的制作方法，其特征在于，将混合液体形成凝胶层的步骤中，将混合液体中的非活性稀释剂挥发，并形成凝胶层。
  9. 如权利要求3所述的柔性电子装置的制作方法，其特征在于，将混合液体形成于离型层上的步骤中，所述混合液体经浇注、或涂布、或印刷、或喷涂形成于所述离型层上。
  10. 如权利要求3所述的柔性电子装置的制作方法，其特征在于，将混合液体形成凝胶层的步骤中，所述混合液体可以经硫化、或光固化、或热固化形成凝胶层。
  11. 如权利要求1～10任意一项所述的柔性电子装置的制作方法，其特征在于，将凝胶层硬化处理的步骤中，所述凝胶层经硫化、或光固化、或热固化形成。
  12. 如权利要求1～10任意一项所述的柔性电子装置的制作方法，其特征在于，将凝胶层硬化处理的步骤之前，对封装膜和与封装膜贴合的柔性电子面板进行脱泡处理。
  13. 如权利要求1～10任意一项所述的柔性电子装置的制作方法，其特征在于，将凝胶层硬化处理的步骤之前，将相贴合的柔性电子面板与封装膜进行弯曲闭合处理，形成闭合环状结构。
  14. 如权利要求13所述的柔性电子装置的制作方法，其特征在于，将凝胶层硬化处理 的步骤中，所述封装膜的闭合接口端经硬化处理相融合。
  15. 如权利要求1～10任意一项所述的柔性电子装置的制作方法，其特征在于，所述基层设有补强层和设置于补强层上的衬底层，所述凝胶层设置于所述衬底层上。
  16. 一种柔性电子装置，其特征在于，所述柔性电子装置由权利要求1～15任意一项所述的柔性电子装置的制作方法所制作。
  17. 一种柔性电子装置，其特征在于，所述柔性电子装置包括柔性电子面板和形成于所述柔性电子面板的封装层。
  18. 如权利要求17所述的柔性电子装置，其特征在于，所述柔性电子面板弯曲呈断开的环状结构，所述封装层形成于所述柔性电子面板外周侧呈闭合环状结构。
  19. 如权利要求18所述的柔性电子装置，其特征在于，所述柔性电子面板包括弹性基底层和形成于所述弹性基底层上的电子器件层，所述封装层形成于所述电子器件层上。
  20. 如权利要求19所述的柔性电子装置，其特征在于，所述电子器件层设置多个电子器件以及设置连接电子器件的可拉伸导线。
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