WO2020198994A1 - 柔性电子装置的制作方法及柔性电子装置 - Google Patents
柔性电子装置的制作方法及柔性电子装置 Download PDFInfo
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- WO2020198994A1 WO2020198994A1 PCT/CN2019/080572 CN2019080572W WO2020198994A1 WO 2020198994 A1 WO2020198994 A1 WO 2020198994A1 CN 2019080572 W CN2019080572 W CN 2019080572W WO 2020198994 A1 WO2020198994 A1 WO 2020198994A1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
Definitions
- This application relates to the field of flexible equipment, and in particular to a method for manufacturing a flexible electronic device and a flexible electronic device.
- This application provides a method for manufacturing a flexible electronic device and a flexible electronic device.
- the present application provides a manufacturing method of a flexible electronic device, wherein a manufacturing method of a flexible electronic device is characterized in that the manufacturing method of the flexible electronic device includes the steps:
- the first stretched base film is hardened to form a stretchable or bendable first flexible film.
- the first flexible film has a first elastic part and a second elastic part.
- the hardness or tension of the first elastic part is The elongation is different from the hardness or the elongation of the second elastic part;
- An electronic device layer is formed on the first flexible film.
- the present application provides a flexible electronic device, wherein the flexible electronic device is manufactured by the above-mentioned manufacturing method of the flexible electronic device.
- the present application provides a flexible electronic device, wherein the flexible electronic device includes a flexible film and an electronic device layer formed on the flexible film, and the flexible film is provided with a first elastic portion and a second elastic portion.
- the first stretchable base film is cured to form a stretchable or bendable first flexible film
- the first flexible film has a first elastic part and a second elastic film
- Forming an electronic device layer on the first flexible film so that the flexible electronic device has at least two elastic parts with different stretch rates or hardness, so that the flexible electronic device can be stretched and deformed in a uniform range when the flexible electronic device is deformed by force.
- FIG. 1 is a schematic flowchart of a manufacturing method of a flexible electronic device provided by an embodiment of the present application.
- FIG. 2 is a schematic cross-sectional view of a flexible electronic device provided by an embodiment of the present application.
- FIG. 3 is a schematic diagram of a process of a manufacturing method of a flexible electronic device provided by an embodiment of the present application.
- FIG. 4 is a schematic diagram of a process of a manufacturing method of a flexible electronic device provided by an embodiment of the present application.
- FIG. 5 is a schematic process diagram of a method for manufacturing a flexible electronic device provided by an embodiment of the present application.
- FIG. 6 is a schematic process diagram of a method for manufacturing a flexible electronic device provided by an embodiment of the present application.
- FIG. 7 is a schematic process diagram of a method for manufacturing a flexible electronic device provided by an embodiment of the present application.
- FIG. 8 is a schematic process diagram of a manufacturing method of a flexible electronic device according to another embodiment of the present application.
- FIG. 9 is a schematic process diagram of a method for manufacturing a flexible electronic device provided by an embodiment of the present application.
- FIG. 10 is a schematic cross-sectional structure diagram of a flexible electronic device provided by an embodiment of the present application.
- FIG. 11 is a schematic diagram of a manufacturing method of a flexible electronic device according to another embodiment of the present application.
- FIG. 12 is a schematic process diagram of a method for manufacturing a flexible electronic device according to another embodiment of the present application.
- FIG. 13 is an exploded schematic diagram of a flexible electronic device provided by another embodiment of the present application.
- FIG. 14 is a schematic process diagram of a method for manufacturing a flexible electronic device according to another embodiment of the present application.
- FIG. 15 is a schematic process diagram of a manufacturing method of a flexible electronic device according to another embodiment of the present application.
- FIG. 16 is a schematic process diagram of a manufacturing method of a flexible electronic device according to another embodiment of the present application.
- FIG. 17 is a schematic cross-sectional view of a flexible electronic device provided by another embodiment of the present application.
- FIG. 18 is a schematic cross-sectional view of a flexible electronic device provided by another embodiment of the present application.
- a component when a component is said to be “fixed to” another component, it can be directly on the other component or a central component may also exist. When a component is considered to be “connected” to another component, it can be directly connected to another component or there may be a centered component at the same time.
- the present application provides a method for manufacturing a flexible electronic device, and the method for manufacturing a flexible electronic device is used for manufacturing the flexible electronic device 1000.
- the flexible electronic device 1000 includes a first flexible film 100 and an electronic device layer 200 formed on the first flexible film 100.
- the first flexible film 100 carries the electronic device layer 200 and can protect the electronic device layer 200.
- the first flexible film 100 has elastic, bendable, and stretchable deformation properties, so that the flexible electronic device 1000 can be bent, stretched and deformed.
- the first flexible film 100 has a first elastic portion 110 and a second elastic portion 120, so that the flexible electronic device 1000 has at least two elastic portions with different stretch rates or hardness, so that the flexible electronic device 1000 can be deformed by force. Stretch deformation evenly.
- the flexible electronic device 1000 can be a flexible or stretchable device such as a flexible sensor, or a flexible display screen, or a flexible electronic wristband, or a smart electronic watch, or a flexible mobile phone.
- the flexible electronic device 1000 can also be used to detect and monitor, or entertainment interaction, or smart wearable and other fields of bendable or stretchable electronic equipment.
- the manufacturing method of the flexible electronic device includes the steps:
- the first stretched base film 10 is in a semi-solid and semi-liquid state to facilitate subsequent hardenable treatment to form the first flexible film 100.
- the main material of the first stretched base film 10 may be silicone rubber.
- the first stretched base film 10 may be formed by forming a liquid silicone rubber on a base layer, or on a supporting layer similar to the base layer that can realize a supporting function. After the first stretched base film 10 is formed into the first flexible film 100, the first flexible film 100 can be separated from the base layer or the supporting layer that can realize the supporting function.
- the forming process of providing the first stretched base film 10 is: first provide the base layer 11; form the release layer 12 on the base layer 11; and form the first stretched base film 10 on the release layer 12.
- the base layer 11 is made of a material with flexible and bendable properties.
- the material of the base layer 11 can be PET (Polyethylene terephthalat, polyethylene terephthalate) plastic, or can be PBT (polybutylene terephthalate, polybutylene terephthalate) plastic, or can be TPU (Thermoplastic Polyurethanes, thermoplastic polyurethane elastomer rubber) materials, etc.
- the base layer 11 can be formed by hot pressing, or rolling, or stretching, or curtain coating, or extrusion process to form a larger area of film, and then through cutting, or punching, or cutting process to form a predetermined area of film. .
- the thickness of the base layer 11 may be greater than that of the first stretched base film 10 to prevent the first stretched base film 10 from being heated.
- the glue layer 10 forms an effective reinforcement.
- the thickness of the base layer 11 may be smaller than the thickness of the first stretched base film 10 or equal to the thickness of the first stretched base film 10.
- the material of the release layer 12 is peelable glue or surfactant.
- the release layer 12 can be formed on one side of the base layer 11 by spraying, coating, curtain coating, or printing.
- the release layer 12 completely covers the base layer 11.
- the thickness of the release layer 12 is smaller than the thickness of the base layer 11 to reduce the manufacturing cost of the flexible electronic device 1000.
- the first gel layer 10 can also be formed on the base layer 11 by means of vacuum negative pressure, or formed on the base layer 11 by means of electrostatic adsorption, so as to facilitate the subsequent first flexible film 100 and the base layer. 11 is separated to simplify the forming steps of the first flexible film 100 and reduce the manufacturing cost.
- the step of forming the first stretched base film 10 on the release layer 12 includes: providing a mixed liquid.
- the mixed liquid may be a mixture of a hardenable liquid material and an inactive diluent.
- the inactive diluent is used to change the viscosity of the mixed liquid, so that the mixed liquid is uniformly dispersed and formed on the release layer 12.
- the mixed liquid may also contain other materials that change the viscosity.
- the formation process of the mixed liquid is:
- the hardenable liquid can be a silicone rubber liquid that can harden under certain conditions, has a high hardening efficiency, and can harden multiple times.
- the hardenable liquid is a light-curable silicone rubber liquid.
- the hardenable liquid can also be other plastic liquids or rubber liquids, and the hardenable liquid can be a liquid that can be cured by heating or a liquid that can be vulcanized.
- the hardening initiator added to the hardenable liquid may be a light curing agent.
- various hardening initiators may be added to the hardenable liquid.
- a conventional photocuring agent, a first photocuring agent that can absorb light of a first preset wavelength, and a second photocuring agent that can absorb light of a second preset wavelength are added to the hardenable liquid.
- the first photocuring agent can absorb ultraviolet light having a curing interval of 300 nm or less
- the second photocuring agent can absorb ultraviolet light having a curing interval of 350 nm or more.
- a heating curing agent or a vulcanizing agent is added to the liquid in the hardenable liquid, or a mixture of a heating curing agent and a vulcanizing agent is added.
- the inactive diluent can be a low boiling point organic solvent or a low boiling point silane material.
- the hardenable liquid, hardening initiator and inactive diluent are mixed, and the mixed liquid is subjected to defoaming treatment to form a hardenable, high-fluidity mixed liquid with suitable viscosity, no bubbles, and high fluidity.
- the hardening initiator and the inactive diluent may be mixed first, and then mixed with the hardenable liquid.
- the step of forming the first stretchable base film 10 on the release layer 12 includes forming a mixed liquid on the release layer 12.
- the mixed liquid is formed on the release layer 12 through processes such as spraying, coating, curtain coating, printing, pouring, or injection.
- the mixed liquid is uniformly dispersed on the release layer 12.
- the thickness of the mixed liquid on the release layer 12 is uniformly distributed.
- the thickness of the mixed liquid may be greater than the thickness of the release layer 12 to meet the molding requirements of the first stretched base film 10, so that the first stretched base film 10 has a certain strength, so that the first stretched base film 10 can be easily processed. Further hardening treatment.
- the step of forming the first stretched base film 10 on the release layer 12 includes forming the first stretched base film 10 from the mixed liquid.
- the process of mixing the liquid to form the first stretched base film 10 is: first, the release layer 12 coated with the mixed liquid and the base layer 11 are baked together at a first preset temperature, so that the mixed liquid The non-reactive diluent inside is volatilized; then the mixed liquid is subjected to light curing treatment at the second preset temperature and within the preset time to form the mixed liquid into a silicone rubber film that can be light-cured again, that is, on the release layer A first stretched base film 10 is formed thereon.
- the first preset temperature, the second preset temperature, and the preset time can be preset as needed.
- the first stretched base film 10 has a certain strength and hardness.
- the first stretched base film 10 contains a first photocuring agent and a second photocuring agent, and the first stretched base film 10 can be subjected to two photocuring treatments.
- the first stretched base film 10 may also undergo multiple curing treatments.
- the mixed liquid contains a heating curing agent or a vulcanizing agent, after the inactive diluent of the mixed liquid is volatilized, the mixed liquid can also be heated and cured or vulcanized to form the first stretched base film 10.
- the manufacturing method of the flexible electronic device includes the steps:
- the first flexible film 100 has a first elastic portion 110 and a second elastic portion 120.
- the stretch rate, hardness, and elongation at break of an elastic portion 110 are different from the stretch rate, hardness, and elongation at break of the second elastic portion 120.
- the first stretched base film 10 may undergo two photocuring treatments to form the first flexible film 100.
- the first stretched base film 10 may also be subjected to different illumination in different areas, so as to form the first flexible film 100 through a single photocuring process.
- step 102 includes:
- the first stretched base film 10 is subjected to a first hardening treatment to obtain a first elastic film 30 having a first elastic portion 110.
- the first stretched base film 10 is irradiated with ultraviolet light with a wave length of 300 nm or less, and a first photocuring agent is selected for photocuring treatment to obtain the first elastic film 30.
- Ultraviolet light with a wavelength of 300 nm or less irradiates the entire area of the first stretched base film 10 to further harden the entire area of the first stretched base film 10 to form the first elastic film 30, and the first elastic portion 110 is formed on the A partial area of the elastic membrane 30.
- the first stretched base film 10 may also be heated and cured or vulcanized, so that the first stretched base film 10 The entire area of the stretched base film 10 is further hardened to form the first elastic film 30.
- Step 102 also includes:
- the first elastic part 110 of the first elastic film 30 is protected, and the first elastic film 30 is subjected to a second hardening process to obtain a second elastic film 40.
- the second elastic film 40 has The second elastic portion 120.
- the second elastic film 40 is cleaned to form the first flexible film 100.
- a first mask 50 is used to shield the first elastic portion 110 of the first elastic film 30, and the first elastic film 30 is subjected to a second hardening treatment.
- the first mask 50 includes a plurality of first shielding portions 51 arranged at intervals and a first hollow portion 52 formed between two adjacent first shielding portions 51. The arrangement area of the first shielding portion 51 and the arrangement area of the first hollow portion 51 can be accurately set as needed, so that the first shielding portion 51 shields the area of the first elastic film 30 to avoid being protected by the second hardening treatment.
- the region of the first hollow portion 52 facing the first elastic membrane 30 is hardened and further hardened to form the second elastic portion 120.
- a heat insulation pad may be used to heat the first elastic portion 110, or an anti-vulcanization film layer may be laminated to prevent vulcanization of the first elastic portion 110, and the first elastic Part of the area of the film 30 is exposed, and the first elastic film 30 is cured by heating or vulcanization, so that the first elastic portion 110 is retained, and the exposed area of the first elastic film 30 is heated and cured or vulcanized under heated conditions to form the first elastic film 30 Two elastic parts 120.
- the first mask 50 covers the first elastic film 30, and the first shielding portion 51 blocks ultraviolet light with a wavelength of 350 nm or more from irradiating the first elastic portion 110,
- the area of the first elastic film 30 facing the first hollow portion 52 is further hardened by ultraviolet light with a wavelength of 350 nm or more to form the second elastic portion 120. Since the first shielding portion 51 and the first hollow portion 52 are arranged alternately, the first elastic portion 110 and the second elastic portion 120 are arranged alternately.
- the first elastic portion 110 and the second elastic portion 120 may be staggered along the length direction of the first flexible film 100.
- the stretching rate of the second elastic part 120 may be less than the stretching rate of the first elastic part 110.
- the different stretch rates of the first elastic portion 110 and the second elastic portion 120 can be used to make the first flexible film 100 uniformly disperse the stretch deformation.
- the plurality of first elastic portions 110 and the plurality of second elastic portions 120 may also be staggered along the width direction of the first flexible film 100.
- the manufacturing method of the flexible electronic device includes the steps:
- the electronic device layer 200 includes a plurality of electronic devices 210 and a stretchable wire 220 connecting the electronic devices 210.
- the electronic device 210 may be any electronic device such as a sensing device, a touch device, a display device, or a light emitting device.
- the stretchable wire 220 can transmit electrical signals with the electronic device 210.
- the stretchable wire 220 can be bent, stretched and deformed with the first flexible film 100.
- the electronic device layer 200 may be formed on the first flexible film 100 in a pasting manner, or may be bonded to the first flexible film 100 by forming a film layer in advance.
- the electronic device layer 200 is formed on the side of the first flexible film 100 away from the base layer 11.
- the first flexible film 100 can carry and protect the electronic device layer 200, and the first flexible film 100 can achieve uniformly dispersed stretching deformation, so that the flexible electronic device 1000 has a stable structure and can uniformly disperse the stretching deformation.
- the manufacturing method of the flexible electronic device includes the steps:
- the base layer 11 and the release layer 12 are peeled from the first flexible film 100 together, so that the release layer 12 is separated from the first flexible film 100, so that the base layer 11 is removed.
- the molecular adhesion force on the side where the release layer 12 is attached to the base layer 11 is greater than the molecular adhesion force on the side of the release layer 12 facing away from the base layer 11, so as to achieve the release of the base layer 11
- the release layer 12 and the base layer 11 are separated from the first flexible film 100 together.
- the molecular adhesion force of the release layer 12 to the base layer 11 can also be set to be lower than the molecular adhesion force of the release layer 12 on the side facing away from the base layer 11, so that after the base layer 11 is separated from the release layer 13, The release layer 13 is further separated from the encapsulation layer 200.
- the base layer 11 and the release layer 12 are separated from the first flexible film 100 under a pulling force, that is, the base layer 11 and the first flexible film 100 are separated by a physical force.
- the base layer 11 and the release layer 12 can also be separated from the first flexible film 100 through a chemical etching process, that is, the electronic device layer 200, the first flexible film 100 and the base layer 11 are placed in a chemical etchant.
- the release layer 12 is decomposed and corroded under the action of chemical etchant, while the base layer 11, the first flexible film 100 and the electronic device layer 200 are not corroded by the chemical etchant; the base layer 11 is corroded and decomposed with the first
- the flexible film 100 is separated to realize the removal of the base layer 11.
- the release layer 12 may also be subjected to light treatment or heat treatment, and the release layer 12 generates a decomposition reaction or causes molecular adhesion failure to achieve separation from the first flexible film 100.
- first stretched base film 10 can be formed by vulcanization, and the hardness of the first elastic part 110 is different from that of the second elastic part 120. .
- the mixed liquid contains a hardenable liquid, a vulcanizing agent, a first light curing agent, a second light curing agent, and an inactive diluent.
- the mixed liquid is subjected to a vulcanization treatment at a preset vulcanization heating temperature and a preset vulcanization time to form the mixed liquid into a photocurable silicone rubber film, that is, The release layer 12 is vulcanized to form the first stretched base film 10.
- the hardness of the first elastic part 110 is different from the hardness of the second elastic part 120.
- FIG. 11, FIG. 12 and FIG. 13, are substantially the same as the embodiment shown in FIG. 10, except that the first flexible film 100 is provided with a plurality of first elastic portions 110 arranged in an array. And a second elastic portion 120 that bridges two adjacent first elastic portions 110 is provided.
- the first mask 50 is provided with a plurality of first shielding portions 51 arranged in an array and a first hollow portion 52 bridged between two adjacent first shielding portions 51.
- the arrangement area of the first shielding portion 51 may correspond to the arrangement area of the electronic device 210 of the electronic device layer 200, so that the arrangement area of the first elastic portion 110 after the first flexible film 100 is bonded to the electronic device layer 200 It corresponds to the arrangement area of the electronic device 210.
- the arrangement area of the first hollow portion 52 may correspond to the arrangement area of the stretched wires 220 of the electronic device layer 200, so that the arrangement area of the second elastic portion 120 after the first flexible film 100 is bonded to the electronic device layer 200 It corresponds to the arrangement area of the stretched wire 220.
- the stretch rate of the first elastic portion 110 may be less than the stretch rate of the second elastic portion 120, that is, the elasticity of the first elastic portion 110 is lower than the elasticity of the second elastic portion 120.
- the first elastic portion 110 can effectively carry the electronic device 210 to prevent the electronic device 210 from being subjected to tensile stress, and the second elastic portion 120 carries the tensile stress.
- Extension wire 220
- FIG. 14, FIG. 15, FIG. 16 and FIG. 17, are substantially the same as the embodiment shown in FIG. 10, except that the first flexible film 100 further has a third elastic portion 130.
- the mixed liquid contains a silicone rubber liquid that can be cured multiple times, an inactive diluent, a vulcanizing agent, a first light curing agent that can absorb light of a first preset wavelength, and a second pre-curing agent that can absorb light.
- the second light curing agent of wavelength light.
- the first photocuring agent can absorb ultraviolet light having a curing interval of 300 nm or less
- the second photocuring agent can absorb ultraviolet light having a curing interval of 350 nm or more.
- the first stretched base film 10 contains a vulcanizer, a first photocuring agent, and a second photocuring agent.
- step 102 first, the first stretched base film 10 is vulcanized, so that the silicone rubber inside the first stretched base film 10 reacts with the vulcanizer, so that the entire area of the first stretched base film 10 is hardened and formed
- the first elastic film 30 has a first elastic portion 110 with a first hardness.
- a first mask 50 is used to cover the first elastic film 30, the first shielding portion 51 of the first mask 50 shields the first elastic portion 110, and the first hollow portion 52 corresponds to a partial area of the first elastic film 30.
- the first elastic film 30 is irradiated with ultraviolet light with a wavelength of less than 300nm through the first mask 50, and the area between the first elastic film 30 and the first hollow portion 52 is cured by photocuring under the irradiation of ultraviolet light with a wavelength of less than 300nm.
- the second elastic portion 120 of the second hardness enables the first elastic film 30 to form the second elastic film 40.
- the third elastic film 60 has a third elastic film.
- a second mask 70 is used to cover the second elastic film 40.
- the second mask 70 is provided with a plurality of second shielding portions 71 and a plurality of second hollow portions 72.
- the plurality of second shielding portions 71 and the plurality of second hollow portions 72 are arranged alternately.
- the second shielding portion 71 shields the first elastic portion 110 and the second elastic portion 120.
- the second hollow portion 72 is directly opposite to a partial area of the second elastic membrane 40.
- the second elastic film 40 is irradiated with ultraviolet light with a wavelength of 350 nm or more through the second mask 70 so that the area where the second elastic film 40 and the second hollow portion 72 are directly opposed to form a third elastic portion 130 with a third hardness.
- the third elastic film 60 By subjecting the third elastic film 60 to a cleaning process, the first flexible film 100 is formed. It can be understood that the formation conditions of the first elastic portion 110, the second elastic portion 120, and the third elastic portion 130 can be set according to needs, so that the first hardness is less than the second hardness and the third hardness.
- the second elastic part 120 By arranging the second elastic part 120 between the first elastic part 110 and the third elastic part 130, it can be used to alleviate the large difference in hardness between the first elastic part 110 and the third elastic part 130, resulting in the first flexible film 100.
- the interface between the first elastic part 110 and the third elastic part 130 is broken during stretching.
- the first elastic part 110 can be used to carry the stretchable wire 220
- the third elastic part 130 is used to carry the electronic device 210
- the second elastic part 120 is used to carry the Stretching the connecting part of the wire 220 and the electronic device 210
- the second elastic portion 120 can buffer the connection stress between the stretchable wire 220 and the electronic device 210.
- the second elastic film 40 can also be heated and cured or cured to form the third elastic film 60.
- the formation process of the first flexible film 100 of the present application is not limited to the above situation. That is, the number of hardening times of the first stretched base film 10 to form the first flexible film 100 is not limited; the first flexible film 100 is provided with a plurality of elastic parts with different hardness, different stretch rate, and different elongation rate, and the number of elastic parts is not limited; The arrangement structure of the plurality of elastic parts of a flexible film 100 is also not limited; during the formation of the first flexible film 100, the way of protecting different areas is also not limited.
- the manufacturing method of the flexible electronic device further includes the steps:
- a second flexible film 300 is formed on the electronic device layer 200.
- the second flexible film 300 adopts substantially the same manufacturing process as the first flexible film 100.
- the formation process of the second flexible film 300 includes: providing a second stretched base film; curing the second stretched base film to form a stretchable or bendable second flexible film 300, the second flexible
- the film 300 has a fourth elastic part 310 and a fifth elastic part 320.
- the second flexible film 300 is bonded to the electronic device layer 200.
- the process of providing the second stretched base film 310 may be the same as the process of providing the first stretched base film 10, and will not be repeated here.
- the formation process of the fourth elastic part 310 and the fifth elastic part 320 of the second flexible film 300 is the same as the formation process of the first elastic part 110 and the second elastic part 120, and will not be repeated here.
- the fourth elastic portion 310 is directly opposite to the first elastic portion 110, and the hardness of the fourth elastic portion 310 may be the same as the hardness of the first elastic portion 110.
- the fifth elastic part 320 is directly opposite to the second elastic part 120, and the hardness of the fifth elastic part 320 may be the same as the hardness of the second elastic part 120.
- the second flexible film 300 and the first flexible film 100 are used to sandwich the electronic device layer 200 so that both sides of the electronic device layer 200 are protected.
- the first flexible film 100 and the second flexible film 300 encapsulate the electronic device layer 200 .
- the flexible electronic device 1000 may also be an encapsulation film with other structures arranged on the side of the electronic device layer 200 away from the first flexible film 100, that is, the electronic device layer 200 and the first flexible film 100
- the packaging film of other structures can be formed on the electronic device layer 200 by other methods such as hot pressing, injection molding, and casting, so as to simplify the manufacturing process and manufacturing cost of the flexible electronic device manufacturing method.
- the present application also provides a flexible electronic device 1000 which includes a first flexible film 100 and an electronic device layer 200.
- the first flexible film 100 includes a plurality of first elastic parts 110 and a plurality of second elastic parts 120.
- the plurality of first elastic parts 110 and the plurality of second elastic parts 120 are arranged alternately.
- the electronic device layer 200 includes a plurality of electronic devices 210 and a plurality of stretchable wires 220.
- the stretchable wire is connected to two adjacent electronic devices 210.
- the first elastic part 110 and the second elastic part 120 may be arranged along the length direction of the first flexible film 100.
- FIG. 13 it is substantially the same as the embodiment shown in FIG. 10, except that the multiple electronic devices 210 of the electronic device layer 200 are arranged in an array.
- Each first elastic portion 110 of the first flexible film 100 is corresponding to each electronic device 210.
- the second elastic portion 120 corresponds to the stretchable wire 220.
- FIG. 17 it is substantially the same as the embodiment shown in FIG. 10.
- the difference is that the first flexible film 100 is further provided with a plurality of third elastic parts 130.
- the first elastic portion 110, the second elastic portion 120, and the third elastic portion 130 are arranged in sequence.
- the flexible electronic device 1000 further includes a second flexible film 300, and the second flexible film 300 is attached to the electronic device.
- the device layer 200 faces away from the first flexible film 100, and the second flexible film 300 includes a fourth elastic portion 310 facing the first elastic portion 110 and a fifth elastic portion 320 facing the second elastic portion 120.
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Abstract
本申请提供一种柔性电子装置的制作方法及柔性电子装置，所述柔性电子装置制作包括步骤：提供第一拉伸基膜；将所述第一拉伸基膜硬化处理形成可拉伸或弯曲的第一柔性膜，所述第一柔性膜具有第一弹性部和第二弹性部，所述第一弹性部的硬度或拉伸率不同于所述第二弹性部的硬度或拉伸率；在所述第一柔性膜上形成电子器件层。通过将第一拉伸基膜硬化处理形成可拉伸或弯曲的第一柔性膜，第一柔性膜具有第一弹性部和第二弹性膜，在第一柔性膜上形成电子器件层，从而使得柔性电子装置至少具有两个不同拉伸率或硬度的弹性部，以满足柔性电子装置在受力形变时，可以均匀幅度拉伸形变。
Description
本申请涉及柔性设备领域，具体涉及一种柔性电子装置制作方法及柔性电子装置。
目前柔性电子装置的拉伸率或硬度存在一致性。柔性电子装置在拉伸或折弯形变时，柔性电子装置受力较小的区域形变程度与受力较大的区域形变程度不一致，导致柔性电子装置难以均匀幅度拉伸形变。
发明内容
本申请提供一种柔性电子装置的制作方法及柔性电子装置。
本申请提供一种柔性电子装置的制作方法，其中，一种柔性电子装置的制作方法，其特征在于，所述柔性电子装置制作方法包括步骤：
提供第一拉伸基膜；
将所述第一拉伸基膜硬化处理形成可拉伸或弯曲的第一柔性膜，所述第一柔性膜具有第一弹性部和第二弹性部，所述第一弹性部的硬度或拉伸率不同于所述第二弹性部的硬度或拉伸率；
在所述第一柔性膜上形成电子器件层。
本申请提供一种柔性电子装置，其中，所述柔性电子装置由上述的柔性电子装置的制作方法所制作。
本申请提供一种柔性电子装置，其中，所述柔性电子装置包括柔性膜和形成于所述柔性膜的电子器件层，所述柔性膜设有第一弹性部和第二弹性部。
本申请的柔性电子装置的制作方法及柔性电子装置，通过将第一拉伸基膜硬化处理形成可拉伸或弯曲的第一柔性膜，第一柔性膜具有第一弹性部和第二弹性膜，在第一柔性膜上形成电子器件层，从而使得柔性电子装置至少具有两个不同拉伸率或硬度的弹性部，以满足柔性电子装置在受力形变时，可以均匀幅度拉伸形变。
图1是本申请实施例提供的柔性电子装置的制作方法的流程示意图。
图2是本申请实施例提供的柔性电子装置的截面示意图。
图3是本申请实施例提供的柔性电子装置的制作方法的过程示意图。
图4是本申请实施例提供的柔性电子装置的制作方法的过程示意图。
图5是本申请实施例提供的柔性电子装置的制作方法的过程示意图。
图6是本申请实施例提供的柔性电子装置的制作方法的过程示意图。
图7是本申请实施例提供的柔性电子装置的制作方法的过程示意图。
图8是本申请另一实施例提供的柔性电子装置的制作方法的过程示意图。
图9是本申请实施例提供的柔性电子装置的制作方法的过程示意图。
图10是本申请实施例提供的柔性电子装置的截面结构示意图。
图11是本申请另一实施例提供的柔性电子装置的制作方法的过程示意图。
图12是本申请另一实施例提供的柔性电子装置的制作方法的过程示意图。
图13是本申请另一实施例提供的柔性电子装置的分解示意图。
图14是本申请另一实施例提供的柔性电子装置的制作方法的过程示意图。
图15是本申请另一实施例提供的柔性电子装置的制作方法的过程示意图。
图16是本申请另一实施例提供的柔性电子装置的制作方法的过程示意图。
图17是本申请另一实施例提供的柔性电子装置的截面示意图。
图18是本申请另一实施例提供的柔性电子装置的截面示意图。
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明的是，当组件被称为“固定于”另一个组件，它可以直接在另一个组件上或者也可以存在居中的组件。当一个组件被认为是“连接”另一个组件，它可以是直接连接到另一个组件或者可能同时存在居中组件。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
下面结合附图，对本发明的一些实施方式作详细说明。在不冲突的情况下，下述的实施例及实施例中的特征可以相互组合。
请参阅图1和图2，本申请提供一种柔性电子装置的制作方法，柔性电子装置的制作方法用于制作柔性电子装置1000。柔性电子装置1000包括第一柔性膜100和形成于第一柔性膜100的电子器件层200。第一柔性膜100承载电子器件层200，并可对电子器件层200防护。第一柔性膜100具有弹性、可弯曲、可拉伸形变性能，以使得柔性电子装置1000可弯曲拉伸形变。第一柔性膜100具有第一弹性部110和第二弹性部120，使得柔性电子装置1000至少具有两个不同拉伸率或硬度的弹性部，以满足柔性电子装置1000在受力形变时，可以均匀幅度拉伸形变。可以理解的是，柔性电子装置1000可以是柔性传感器、或柔性显示屏、或柔性电子护腕、或智能电子手表、或可弯曲手机等可弯曲或拉伸装置。柔性电子装置1000还可以用于检测监测、或娱乐交互、或智能穿戴等领域的可弯曲或可拉伸电子设备。
请一并参阅图1、图2和图3，柔性电子装置的制作方法包括步骤：
101：提供第一拉伸基膜10。
本实施方式中，第一拉伸基膜10呈半固半液状态，以方便后续可硬化处理形成第一柔性膜100。第一拉伸基膜10的主要材质可以是有机硅橡胶。第一拉伸基膜10可以是将液态的有机硅橡胶形成于基层上，或者形成于与基层类似可实现承载功能的承载层上。待第一拉伸基膜10形成第一柔性膜100后，将第一柔性膜100与基层或与可实现承载功能的承载层分 离即可。
具体的，提供第一拉伸基膜10的形成过程是：先提供基层11；在基层11上形成离型层12；在离型层12上形成第一拉伸基膜10。
本实施方式中，基层11采用具有柔性可弯曲性能的材质制成。例如，基层11的材质可以是PET(Polyethylene terephthalat，聚对苯二甲酸乙二酯)塑料，或者可以是PBT(polybutylene terephthalate，聚对苯二甲酸丁二酯)塑料，或者是可以是TPU(Thermoplastic polyurethanes，热塑性聚氨酯弹性体橡胶)材料等。基层11可以是经热压、或辊压、或拉伸、或淋涂、或挤压工艺形成较大面积的薄膜后，再经过裁剪、或冲裁、或切割工艺形成预设面积大小的薄膜。为了方便基层11可以有效承载第一拉伸基膜10，以及防止第一拉伸基膜10在硬化处理过程中受热变形，基层11厚度可以大于第一拉伸基膜10，以对第一凝胶层10形成有效补强。当然，在其他实施方式中，为了减小柔性电子装置1000的制作成本，基层11的厚度可以小于第一拉伸基膜10的厚度、或者等于第一拉伸基膜10的厚度。
本实施方式中，离型层12的材质为可剥离胶或表面活性剂。离型层12可以是经喷涂、或涂布、或淋涂、或印刷工艺成型于基层11的一侧上。离型层12完全覆盖基层11。离型层12的厚度小于基层11的厚度，以减少柔性电子装置1000的制作成本。当然，在其他实施方式中，第一凝胶层10也可以是通过真空负压的方式形成于基层11上，或者通过静电吸附的方式形成于基层11上，方便后续第一柔性膜100与基层11分离，简化第一柔性膜100的形成步骤，减少制作成本。
更为具体的，在离型层12上形成第一拉伸基膜10的步骤包括：提供混合液体。
本实施方式中，混合液体可以是将可硬化的液体材料和非活性稀释剂混合。利用非活性稀释剂改变混合液体的粘稠度，方便混合液体均匀分散形成于离型层12上。当然，其他实施方式中，混合液体中也可以是含有其他改变粘稠度的材料。
具体的，混合液体的形成过程是：
首先，提供可硬化的液体，可硬化的液体可以是在特定条件下可硬化、硬化效率高、并可多次硬化的有机硅橡胶液体。作为一种较优实施方式，可硬化的液体为可光固化的有机硅橡胶液体。当然，在其他实施方式中，可硬化的液体也可以采用其他塑胶液体或橡胶液体，可硬化的液体可以是可加热固化的液体，以及可硫化的液体。
然后，向可硬化液体中添加硬化引发剂，利用硬化引发剂在特定条件下与可硬化液体中的高分子发生聚合反应或交联反应，使得可硬化液体形成具有一定硬度和一定强度的可拉伸或弯曲形变的第一拉伸基膜10。作为一种较优实施方式，向可硬化液体中添加的硬化引发剂可以是光固化剂。为了使得第一拉伸基膜10可进行多次硬化处理，可以向可硬化液体中添加多种硬化引发剂。本实施方式中，向可硬化液体中添加常规光固化剂、可吸收第一预设波长光的第一光固化剂和可吸收第二预设波长光的第二光固化剂。第一光固化剂可以吸收固化区间为300nm以下的紫外线光，第二光固化剂可以吸收固化区间为350nm以上的紫外线光。当然，在其他实施方式中，也向可硬化液体中的液体中添加加热固化剂、或硫化剂，或者是添加加热固化剂和硫化剂的混合物。
再然后，提供非活性稀释剂。非活性稀释剂可以是低沸点有机溶剂或低沸点硅烷等材料。
最后，可硬化液体、硬化引发剂和非活性稀释剂混合，并将混合后的液体进行脱泡处理后形成粘稠度合适、无气泡的、可硬化处理、高流动性的混合液体。当然，在其他实施方式中，也可以是先将硬化引发剂和非活性稀释剂混合，然后再与可硬化液体混合。
在离型层12上形成第一可拉伸基膜10的步骤包括：将混合液体形成于离型层12上。
本实施方式中，将混合液体通过喷涂、或涂布、或淋涂、或印刷、或浇注、或注射等工艺形成于离型层12上。混合液体均匀分散于离型层12上。混合液体在离型层12上的厚度均匀分布。混合液体的厚度可以大于离型层12的厚度，以满足第一拉伸基膜10的成型要求，使得第一拉伸基膜10具有一定的强度，以方便对第一拉伸基膜10进行再进一步地硬化处理。
在离型层12上形成第一拉伸基膜10的步骤包括：将混合液体形成第一拉伸基膜10。
本实施方式中，混合液体形成第一拉伸基膜10的过程是：先将涂有混合液体的离型层12和基层11一并在第一预设温度下进行烘烤，以将混合液体内的非活性稀释剂挥发掉；再将混合液体在第二预设温度和预设时间内进行光固化处理，以将混合液体形成可进行再次光固化的有机硅橡胶膜，即在离型层12上形成第一拉伸基膜10。其中，第一预设温度、第二预设温度和预设时间可以根据需要进行预先设定。第一拉伸基膜10具有一定强度和硬度。第一拉伸基膜10含有第一光固化剂和第二光固化剂，第一拉伸基膜10可进行两次光固化处理。当然，若第一拉伸基膜10含有多种硬化引发剂，第一拉伸基膜10也可以进行多次硬化处理。当然，在其他实施方式中，若混合液体中含有加热固化剂或硫化剂，则混合液体的非活性稀释剂挥发掉后，也可以对混合液体进行加热固化或硫化处理形成第一拉伸基膜10。
请一并参阅图1、图4、图5和图6，柔性电子装置的制作方法包括步骤：
102：将所述第一拉伸基膜10硬化处理形成可拉伸或弯曲的第一柔性膜100，所述第一柔性膜100具有第一弹性部110和第二弹性部120，所述第一弹性部110的拉伸率、硬度、断裂延展率不同于所述第二弹性部120的拉伸率、硬度、断裂延展率。
本实施方式中，第一拉伸基膜10可进行两次光固化处理形成所述第一柔性膜100。当然，在其他实施方式中，第一拉伸基膜10也可以通过在不同区域进行不同光照，实现经一次光固化处理形成第一柔性膜100。
具体的，步骤102包括：
将所述第一拉伸基膜10进行第一次硬化处理，以获得第一弹性膜30，所述第一弹性膜30具有第一弹性部110。
本实施方式中，将第一拉伸基膜10在波光为300nm以下的紫外线光光照，选择第一光固化剂进行光固化处理，以获得第一弹性膜30。波长为300nm以下的紫外线光对第一拉伸基膜10的全区域进行光照，以使得第一拉伸基膜10全区域进一步硬化形成第一弹性膜30，而第一弹性部110形成于第一弹性膜30的部分区域。当然，在其他实施方式中，若第一拉伸基膜10中还含有加热固化剂、或硫化剂，也可以是将第一拉伸基膜10进行加热固化或进行硫化处理，以使得第一拉伸基膜10全区域再进一步硬化形成第一弹性膜30。
步骤102还包括：
对所述第一弹性膜30的第一弹性部110进行防护处理，并对所述第一弹性膜30进行第二次硬化处理，以获得第二弹性膜40，所述第二弹性膜40具有第二弹性部120。
本实施方式中，对所述第二弹性膜40进行清洁处理后形成第一柔性膜100。采用第一掩 膜版50对所述第一弹性膜30的第一弹性部110遮蔽，并对所述第一弹性膜30进行第二次硬化处理。具体的，第一掩膜版50包括多个间隔排布的第一遮蔽部51和形成于相邻两个第一遮蔽部51之间的第一镂空部52。第一遮蔽部51的排布区域和第一镂空部51的排布区域可以根据需要进行精确设置，以使得第一遮蔽部51遮蔽第一弹性膜30的区域避免受第二硬化处理而保利下来，以精确形成第一弹性部110，第一镂空部52正对第一弹性膜30的区域受硬化处理而进一步硬化处理形成第二弹性部120。当然，在其他实施方式中，也可以是采用隔热垫对第一弹性部110进行隔热处理，或者采用防硫化膜层贴合对第一弹性部110进行防硫化处理，并将第一弹性膜30的部分区域暴露，采用加热固化处理或硫化处理第一弹性膜30，以使得第一弹性部110得以保留，而第一弹性膜30所暴露的区域在受热条件下加热固化或硫化形成第二弹性部120。
更为具体的，如图6和图7所示，将第一掩膜版50对第一弹性膜30进行掩盖，第一遮蔽部51遮挡波长为350nm以上的紫外线光照射第一弹性部110，防止第一弹性部110进一步硬化，第一弹性膜30正对第一镂空部52的区域受波长350nm以上的紫外线光照射进一步硬化形成第二弹性部120。由于第一遮蔽部51和第一镂空部52相互交错排列，所述第一弹性部110和所述第二弹性部120相互交错排列。所述第一弹性部110和所述第二弹性部120可以是沿第一柔性膜100的长度方向交错排列。由于第二弹性部120是在第一弹性膜30的基础上进一步硬化形成，使得第二弹性部120的拉伸率可以小于第一弹性部110的拉伸率。第一柔性膜100在拉伸形变时，利用第一弹性部110和第二弹性部120的拉伸率不同，可以使得第一柔性膜100均匀分散拉伸形变。
在另一个实施例中，如图8所示，多个第一弹性部110和多个第二弹性部120也可以是沿第一柔性膜100的宽度方向交错排列。
请一并参阅图1、图9和图10，柔性电子装置的制作方法包括步骤：
103：在所述第一柔性膜100上形成电子器件层200。
本实施方式中，电子器件层200包括多个电子器件210和连接电子器件210的可拉伸导线220。电子器件210可以是感应器件、或触控器件、或显示器件、或发光器件等任意电子器件。可拉伸导线220可与电子器件210传输电信号。可拉伸导线220可随第一柔性膜100弯曲、拉伸形变。电子器件层200可以通过贴片的方式形成于第一柔性膜100上，也可以是通过预先形成膜层后与第一柔性膜100相贴合。电子器件层200形成于第一柔性膜100背离基层11一侧。第一柔性膜100可以对电子器件层200进行承载以及防护，第一柔性膜100可实现均匀分散拉伸形变，使得柔性电子装置1000结构稳固，可以均匀分散拉伸形变。
柔性电子装置的制作方法包括步骤：
104：去除基层11。
本实施方式中，通过将基层11和离型层12一同与第一柔性膜100相剥离，使得离型层12与第一柔性膜100分离，从而去除掉基层11。具体的，通过在形成离型层12的步骤中，设置离型层12粘贴基层11一侧的分子粘合力大于离型层12背离基层11一侧分子粘合力，以实现在剥离基层11的过程中，离型层12与基层11一同与第一柔性膜100分离。当然在其他实施方式中，也可以设置离型层12粘合基层11的分子粘合力小于离型层12背离基层11一侧分子粘合力，以实现基层11与离型层13分离后，再进一步将离型层13与封装层200分离。
本实施方式中，基层11和离型层12受撕拉作用力的方式下与第一柔性膜100分离，即采用物理受力方式使基层11与第一柔性膜100分离。当然，在其他实施方式中，基层11和离型层12也可以是经化学腐蚀工艺与第一柔性膜100分离，即通过电子器件层200、第一柔性膜100和基层11放置于化学腐蚀剂中；离型层12在化学腐蚀剂的作用下分解腐蚀，而基层11、第一柔性膜100和电子器件层200不受化学腐蚀剂的腐蚀作用；基层11在离型层12腐蚀分解后，与第一柔性膜100分离，实现去除基层11。当然，在其他实施方式中，离型层12也可以是经光照处理或经加热处理，离型层12产生分解反应或产生分子粘合力失效，以实现与第一柔性膜100分离。
在另一个实施例中，与图10所示实施例大致相同，不同的是，第一拉伸基膜10可以经硫化处理形成，第一弹性部110的硬度不同于第二弹性部120的硬度。
具体的，在提供第一拉伸基10的步骤中，混合液体中含有可硬化液体、硫化剂、第一光固化剂、第二光固化剂和非活性稀释剂。在混合液体形成第一拉伸基膜10的过程中，将混合液体在预设硫化加热温度和预设硫化时间内进行硫化处理，以将混合液体形成可光固化的有机硅橡胶膜，即在离型层12上硫化形成第一拉伸基膜10。在将所述第一拉伸基膜10硬化处理形成可拉伸或弯曲的第一柔性膜100的步骤中，第一弹性部110的硬度不同于第二弹性部120的硬度。
在另一个实施例中，请参阅图11、图12和图13，与图10所示实施例大致相同，不同的是，第一柔性膜100设置阵列排布的多个第一弹性部110，以及设置桥接相邻两个第一弹性部110的第二弹性部120。
具体的，在步骤102中，第一掩膜版50设置阵列排布的多个第一遮蔽部51和桥接于相邻两第一遮蔽部51之间的第一镂空部52。第一遮蔽部51的排布区域可以对应到电子器件层200的电子器件210的排布区域，以使得第一柔性膜100与电子器件层200贴合后第一弹性部110的排布区域可以对应到电子器件210的排布区域。第一镂空部52的排布区域可以对应电子器件层200的拉伸导线220的排布区域，以使得第一柔性膜100与电子器件层200贴合后第二弹性部120的排布区域可以对应到拉伸导线220的排布区域。可以理解的是，第一弹性部110的拉伸率可以小于所述第二弹性部120的拉伸率，即所述第一弹性部110的弹性低于所述第二弹性部120的弹性。在所述第一柔性膜100与所述电子器件层200贴合后，所述第一弹性部110可以有效承载电子器件210，防止电子器件210受拉伸应力作用，第二弹性部120承载拉伸导线220
在另一个实施例中，请参阅图14、图15、图16和图17，与图10所示实施例大致相同，不同的是，第一柔性膜100还具有第三弹性部130。
具体的，在步骤101中，混合液体中含有可多次硬化的有机硅橡胶液体、非活性稀释剂、硫化剂、可吸收第一预设波长光的第一光固化剂和可吸收第二预设波长光的第二光固化剂。第一光固化剂可以吸收固化区间为300nm以下的紫外线光，第二光固化剂可以吸收固化区间为350nm以上的紫外线光。混合液体形成第一拉伸基膜10后，第一拉伸基膜10含有硫化机、第一光固化剂和第二光固化剂。
在步骤102中，首先，对第一拉伸基膜10进行硫化处理，以使第一拉伸基膜10内部的有机硅橡胶与硫化机反应，使得第一拉伸基膜10全部区域硬化形成第一弹性膜30，第一弹性 膜30具有第一硬度的第一弹性部110。
然后，采用第一掩膜版50掩盖第一弹性膜30，第一掩膜版50的第一遮蔽部51遮蔽第一弹性部110，第一镂空部52对应第一弹性膜30的部分区域。采用波长为300nm以下的紫外线光经第一掩膜版50照射第一弹性膜30，第一弹性膜30与第一镂空部52正对的区域在波长为300nm以下的紫外线照射下光固化形成具有第二硬度的第二弹性部120，以使第一弹性膜30形成第二弹性膜40。
再然后，对所述第一弹性部110和第二弹性部120防护处理，并对所述第二弹性膜40硬化处理，以获得第三弹性膜60，所述第三弹性膜60具有第三弹性部130。具体的，采用第二掩膜版70压盖第二弹性膜40。第二掩膜版70设有多个第二遮蔽部71和多个第二镂空部72。多个第二遮蔽部71和多个第二镂空部72相互交错排布。第二遮蔽部71遮蔽第一弹性部110和第二弹性部120。第二镂空部72与第二弹性膜40的部分区域正对。采用波长350nm以上的紫外线光经第二掩膜版70照射第二弹性膜40，以使第二弹性膜40与第二镂空部72正对的区域形成具有第三硬度的第三弹性部130。通过将第三弹性膜60进行清洁处理，以形成第一柔性膜100。可以理解的是，可以根据需要设置第一弹性部110、第二弹性部120和第三弹性部130的形成条件，以使第一硬度小于第二硬度小于第三硬度。通过在第一弹性部110和第三弹性部130之间设置第二弹性部120，可以用于缓解第一弹性部110和第三弹性部130之间硬度差异较大而导致第一柔性膜100在拉伸时第一弹性部110与第三弹性部130的界面断裂。在第一柔性膜100与电子器件层200贴合后，第一弹性部110可用于承载可拉伸导线220，第三弹性部130用于承载电子器件210，第二弹性部120用于承载可拉伸导线220与电子器件210连接部分，第二弹性部120可缓冲可拉伸导线220与电子器件210之间的连接应力。当然，在其他实施方式中，第二弹性膜40也可以经加热固化处理或硫化处理形成第三弹性膜60。
可以理解的是，本申请的第一柔性膜100的形成过程不局限于上述情形。即第一拉伸基膜10形成第一柔性膜100的硬化次数并不限定；第一柔性膜100设置多个不同硬度、不同拉伸率、不同延展率的弹性部的数目并不限定；第一柔性膜100的多个弹性部的排布结构形式也并不限定；第一柔性膜100形成过程中，对不同区域的防护方式也并不限定。
进一步地，在另一个实施例中，请参阅图18，为了增加柔性电子装置1000的结构稳固性，柔性电子装置的制作方法还包括步骤：
在所述电子器件层200上形成第二柔性膜300。
本实施方式中，第二柔性膜300采用与第一柔性膜100大致相同的制作过程。具体的，第二柔性膜300的形成过程为：提供第二拉伸基膜；将所述第二拉伸基膜硬化处理形成可拉伸或弯曲的第二柔性膜300，所述第二柔性膜300具有第四弹性部310和第五弹性部320。将第二柔性膜300与电子器件层200贴合。
可以理解的是，提供第二拉伸基膜310的过程可以与提供第一拉伸基膜10的过程相同，在此不再赘述。第二柔性膜300的第四弹性部310和第五弹性部320的形成过程与第一弹性部110和第二弹性部120的形成过程相同，在此不再赘述。将第二柔性膜300与电子器件层200贴合后，第四弹性部310与第一弹性部110正对，第四弹性部310的硬度可以与第一弹性部110的硬度一致。第五弹性部320与第二弹性部120正对，第五弹性部320的硬度可以与第二弹性部120的硬度一致。利用第二柔性膜300和第一柔性膜100夹持电子器件层200，以使得电子 器件层200的两侧都得到防护，第一柔性膜100和第二柔性膜300对电子器件层200实现封装。当然，在其他实施方式中，柔性电子装置1000也可以是在所述电子器件层200背离所述第一柔性膜100一侧设置其他结构的封装膜，即将电子器件层200与第一柔性膜100贴合后，可以在电子器件层200通过热压、注塑、浇注的其他方式形成其他结构的封装膜，以简化柔性电子装置的制作方法的制作过程及制作成本。
如图10所示，本申请还提供一种柔性电子装置1000，所述柔性电子装置1000包括第一柔性膜100和电子器件层200。第一柔性膜100包括多个第一弹性部110和多个第二弹性部120。多个第一弹性部110和多个第二弹性部120相互交错排列。电子器件层200包括多个电子器件210和多个可拉伸导线220。可拉伸导线连接于相邻两个电子器件210中。第一弹性部110和第二弹性部120可以沿第一柔性膜100的长度方向排列。
在另一个实施例中，如图13所示，与图10所示实施例大致相同，不同的是，电子器件层200的多个电子器件210阵列排布。第一柔性膜100的每一第一弹性部110与每一电子器件210对应设置。第二弹性部120与可拉伸导线220对应。
在另一个实施例中，如图17所示，与图10所示实施例大致相同，不同的是，所述第一柔性膜100还设有多个第三弹性部130。第一弹性部110、第二弹性部120和第三弹性部130依次排列。
在另一个实施例中，如图18所示，与图10所示实施例大致相同，不同的是，所述柔性电子装置1000还包括第二柔性膜300，第二柔性膜300贴合于电子器件层200背离第一柔性膜100一侧，第二柔性膜300包括与第一弹性部110正对第四弹性部310和与第二弹性部120正对的第五弹性部320。
以上对本申请实施例所提供的一种柔性电子装置的制作方法及柔性电子装置进行了详细介绍，本文中应用了具体个例对本申请的原理及实施例进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的一般技术人员，依据本申请的思想，在具体实施例及应用范围上均会有改变之处，综上，本说明书内容不应理解为对本申请的限制。
Claims (20)
- 一种柔性电子装置的制作方法，其特征在于，所述柔性电子装置制作方法包括步骤：提供第一拉伸基膜；将所述第一拉伸基膜硬化处理形成可拉伸或弯曲的第一柔性膜，所述第一柔性膜具有第一弹性部和第二弹性部，所述第一弹性部的硬度或拉伸率不同于所述第二弹性部的硬度或拉伸率；在所述第一柔性膜上形成电子器件层。
- 如权利要求1所述的柔性电子装置的制作方法，其特征在于，提供第一拉伸基膜的步骤包括：提供基层；在所述基层上形成离型层；在所述离型层上形成第一拉伸基膜。
- 如权利要求2所述的柔性电子装置的制作方法，其特征在于，形成所述第一柔性膜后并在形成电子器件层之前去除所述基层，或在形成电子器件层后去除所述基层。
- 如权利要求2所述的柔性电子装置的制作方法，其特征在于，在所述离型层上形成第一拉伸基膜的步骤包括：提供混合液体；将混合液体形成于所述基层上；将混合液体硬化处理形成第一拉伸基膜。
- 如权利要求4所述的柔性电子装置的制作方法，其特征在于，所述混合液体经光固化处理、或热固化处理、或硫化处理形成第一拉伸基膜。
- 如权利要求1所述的柔性电子装置的制作方法，其特征在于，将所述第一拉伸基膜硬化处理形成可拉伸或弯曲的第一柔性膜的步骤包括：将所述第一拉伸基膜进行第一次硬化处理，以获得第一弹性膜，所述第一弹性膜具有第一弹性部；对所述第一弹性膜的第一弹性部进行防护处理，并对所述第一弹性膜进行第二次硬化处理，以获得第二弹性膜，所述第二弹性膜具有第二弹性部。
- 如权利要求6所述的柔性电子装置的制作方法，其特征在于，采用第一掩膜版对所述第一弹性膜的第一弹性部遮蔽，并对所述第一弹性膜进行第二次硬化处理。
- 如权利要求6所述的柔性电子装置的制作方法，其特征在于，所述第一次硬化处理为光固化处理、或热固化处理、或硫化处理的任意一种硬化处理，所述第二次硬化处理为光固化处理、或热固化处理、或硫化处理的任意一种硬化加工。
- 如权利要求6所述的柔性电子装置的制作方法，其特征在于，将所述第一拉伸基膜硬化处理形成可拉伸或弯曲的第一柔性膜的步骤还包括：对所述第一弹性部和第二弹性部防护处理，并对所述第二弹性膜第三次硬化处理，以获得第三弹性膜，所述第三弹性膜具有第三弹性部。
- 如权利要求9所述的柔性电子装置的制作方法，其特征在于，所述第三次硬化处理为光固化处理、或热固化处理、或硫化处理的任意一种固化加工。
- 如权利要求9所述的柔性电子装置的制作方法，其特征在于，对所述第一弹性部和第二弹性部防护处理的步骤中，采用第二掩膜版对所述第一弹性部和第二弹性部遮蔽，并对所述第二弹性膜进行第三次硬化处理。
- 如权利要求1所述的柔性电子装置的制作方法，其特征在于，所述柔性电子装置的制作方法还包括步骤：在所述电子器件层上形成第二柔性膜。
- 如权利要求11所述的柔性电子装置的制作方法，其特征在于，形成第二柔性膜的步骤包括：提供第二拉伸基膜；将所述第二拉伸基膜硬化处理形成可拉伸或弯曲的第二柔性膜，所述第二柔性膜具有第四弹性部和第五弹性部；将所述第二柔性膜与所述电子器件层相贴合。
- 如权利要求12所述的柔性电子装置的制作方法，其特征在于，所述第四弹性部与所述第一弹性部正对，所述第五弹性部所述第二弹性部正对。
- 一种柔性电子装置，其特征在于，所述柔性电子装置由权利要求1～14任意一项所述的柔性电子装置的制作方法所制作。
- 一种柔性电子装置，其特征在于，所述柔性电子装置包括柔性膜和形成于所述柔性膜的电子器件层，所述柔性膜设有第一弹性部和第二弹性部。
- 如权利要求16所述的柔性电子装置，其特征在于，所述柔性膜设有多个所述第一弹性部和多个所述第二弹性部，多个所述第一弹性部和多个所述第二弹性部沿所述第一柔性膜长度方向交错排列。
- 如权利要求16所述的柔性电子装置，其特征在于，所述第一柔性膜设有多个所述第一弹性部，多个所述第一弹性部阵列排布，所述第二弹性部设置于所述第一弹性部周侧。
- 如权利要求18所述的柔性电子装置，其特征在于，所述电子器件层包括电子器件和连接所述电子器件的可拉伸导线。
- 如权利要求19所述的柔性电子装置，其特征在于，所述柔性膜还设有第三弹性部，所述第三弹性部连接于所述第一弹性部或/和所述第二弹性部。
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