WO2020198915A1 - 显示面板及显示装置 - Google Patents

显示面板及显示装置 Download PDF

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Publication number
WO2020198915A1
WO2020198915A1 PCT/CN2019/080370 CN2019080370W WO2020198915A1 WO 2020198915 A1 WO2020198915 A1 WO 2020198915A1 CN 2019080370 W CN2019080370 W CN 2019080370W WO 2020198915 A1 WO2020198915 A1 WO 2020198915A1
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WO
WIPO (PCT)
Prior art keywords
signal line
layer
display panel
conductive
conductive layer
Prior art date
Application number
PCT/CN2019/080370
Other languages
English (en)
French (fr)
Inventor
谭桂财
张祖强
邱昌明
Original Assignee
深圳市柔宇科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to CN201980073107.XA priority Critical patent/CN113272965A/zh
Priority to PCT/CN2019/080370 priority patent/WO2020198915A1/zh
Publication of WO2020198915A1 publication Critical patent/WO2020198915A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Definitions

  • This application relates to the technical field of electronic equipment, and in particular to a display panel and a display device.
  • Display devices such as mobile phones are common electronic devices in life, and people's lives are increasingly inseparable from display devices.
  • the size of the display area of mobile phones is getting larger and larger, and the size of the non-display area is getting smaller and smaller.
  • the resistance of the lead in the non-display area is reduced due to the reduced cross-sectional area. If the signal is increased, the loss in the process of signal transmission in the lead is increased, resulting in poor brightness of the display panel on the side far from the signal end, and the display brightness of the overall display panel is inconsistent.
  • the technical problem to be solved by the present application is to provide a display panel and a display device to solve the problem of poor brightness of the display panel on the side far from the signal terminal in the prior art and inconsistent display brightness of the overall display panel.
  • the present application provides a display panel.
  • the display panel includes a driving chip, a signal line, an organic light emitting diode, and a touch panel.
  • the signal line is electrically connected to the driving chip and the touch panel.
  • the touch panel includes a conductive layer, the conductive layer is located on the signal line, the conductive layer is electrically connected to the signal line, and the conductive layer is connected in parallel with the signal line .
  • a display device including a driving device and a display panel, the driving device is electrically connected to the display panel to drive the display panel to display.
  • the signal line is connected in parallel with the conductive layer of the touch panel, the signal from the driving chip is transmitted to the organic light-emitting diode with less loss, and the brightness of the organic light-emitting diode at each position of the display panel tends to Similarly, the display brightness of the display panel tends to be uniform.
  • FIG. 1 is a schematic diagram of the layer structure of a display panel provided by an embodiment of the application.
  • FIG. 2 is a schematic diagram of a display panel provided by Embodiment 1 of the application.
  • FIG. 3 is a schematic diagram of a part of the structure of the display panel.
  • Fig. 4 is a schematic circuit diagram of a display panel.
  • Fig. 5 is a schematic diagram of a touch panel.
  • FIG. 6 is a schematic diagram of the stacking of the display panel.
  • FIG. 7 is a schematic circuit diagram of the display panel provided in the second embodiment of the application.
  • FIG. 8 is a schematic diagram of the structure of the display panel provided in the second embodiment of the application.
  • FIG. 9 is a schematic diagram of the layer structure of the display panel provided in the second embodiment of the application.
  • FIG. 10 is a schematic circuit diagram of a display panel provided in the third embodiment of the application.
  • FIG. 11 is a schematic diagram of the layer structure of the display panel provided in the third embodiment of the application.
  • the display panel provided by the embodiments of the present application is used to display images.
  • the display panel includes but is not limited to Organic Light-Emitting Diode (OLED), such as passively driven organic light-emitting diode display panel (PMOLED) or active driving An organic light emitting diode display panel (AMOLED).
  • OLED Organic Light-Emitting Diode
  • PMOLED passively driven organic light-emitting diode display panel
  • AMOLED active driving An organic light emitting diode display panel
  • the display panel can be integrated with a touch panel to realize the function of touch operation.
  • FIG. 1 is a schematic diagram of the layer structure of the display panel 100 provided by an embodiment of the application
  • FIG. 4 is a schematic diagram of the circuit of the display panel 100.
  • the display panel 100 shown in FIG. The light emitting diode 14 display panel.
  • the display panel 100 includes an array substrate 12, an organic light emitting diode 14, an encapsulation layer 16, and a touch panel 18 stacked in sequence.
  • Each thin film transistor 40 (TFT) on the array substrate 12 and One pixel is connected, and the thin film transistor 40 acts as a switch to individually control each pixel to emit light independently.
  • TFT thin film transistor
  • the encapsulation layer 16 is used to encapsulate the organic light emitting diode 14 to prevent external water vapor from entering the organic light emitting diode 14.
  • the touch panel 18 is fabricated on the encapsulation layer 16 to reduce the material of the intermediate layer required in the fabrication process, thereby effectively reducing the thickness of the display panel 100 with touch function, which is beneficial to fabricating the flexible display panel 100.
  • the display panel 100 further includes a polarizer 19 and a transparent cover plate 17.
  • the polarizer 19 and the transparent cover plate 17 are sequentially laminated on the touch panel 18, the polarizer 19 improves the display effect, and the transparent cover plate 17 protects the inside of the display panel 100 Structure, when the user touches the display panel 100, the finger touches the transparent cover plate 17 to prevent damage to the internal structure of the display panel 100.
  • the transparent cover plate 17 and the polarizer 19, and the polarizer 19 and the touch panel 18 are pasted through optical glue, which has a high light transmittance and a good bonding effect.
  • FIG. 2 is a schematic diagram of the display panel 100 provided in the first embodiment of the application.
  • the display panel 100 further includes a driving chip 22 and a signal line 24, and the signal line 24 is electrically connected to the driving chip
  • the driving chip 22 transmits data to the organic light emitting diode 14 through the signal line 24 to control the organic light emitting diode 14 to emit light.
  • the touch panel 18 includes a conductive layer 180, the conductive layer 180 is located on the signal line 24, the conductive layer 180 is electrically connected to the signal line 24, and the conductive layer 180 is connected in parallel with the signal line 24.
  • the conductive layer 180 may be a patterned metal layer, or may be a transparent conductive layer 180 formed of indium tin oxide (ITO) material.
  • ITO indium tin oxide
  • the signal line 24 is connected in parallel with the conductive layer 180, the total resistance of the signal line 24 is reduced, the signal loss during transmission to the organic light emitting diode 14 is small, the brightness difference of the organic light emitting diode 14 at each position of the display panel 100 is reduced, and the display The display brightness of the panel 100 tends to be uniform.
  • FIG. 3 is a partial structural diagram of the display panel 100.
  • the organic light emitting diode 14 includes an anode layer 142, a cathode layer 144, and an organic layer 146 between the anode layer 142 and the cathode layer 144.
  • the signal line 24 includes a first signal line 242 and a second signal line 244.
  • the first signal line 242 is electrically connected to the cathode layer 144 to transmit the VSS signal to the cathode layer 144, and the second signal line 244 is electrically connected to the anode layer 142 to The VDD signal is transmitted to the anode layer 142, thereby controlling the organic layer 146 to emit light.
  • Figure 5 is a schematic diagram of the touch panel 18, the display panel includes a display area and a non-display area, the conductive layer 180 of the touch panel 18 includes touch electrodes 182 corresponding to the display area, and corresponding Conductive leads 184 and edge conductive parts 185 in the non-display area.
  • the non-display area is located on the peripheral side of the display area, the touch electrode 182 is used to sense the touch position, the conductive wire 184 is connected to the touch electrode 182 from the edge of the touch electrode 182, and the touch electrode 182 is connected to the touch Chip 23.
  • the touch chip 23 can be an independent chip that integrates touch functions, and the touch chip 23 can also be integrated in the driver chip 22, that is, the driver chip 22 can drive display and touch functions at the same time .
  • the signal line 24 is connected in parallel with the conductive layer 180, and the signal passes through the signal line 24 and the conductive layer 180 at the same time during transmission, so that the signal loss is reduced without affecting the touch function of the touch panel 18.
  • the touch electrode 182 may be one conductive layer or two conductive layers.
  • the touch electrode 182 is two conductive layers 180, the touch electrode 182 includes a first electrode 182a and a second electrode 182b that are arranged oppositely.
  • a capacitor is formed between the first electrode 182a and the second electrode 182b, so as to realize the touch function.
  • Part of the conductive lead wire electrically connects the first electrode 182 a and the touch chip 23, and part of the conductive lead wire electrically connects the second electrode 182 b and the touch chip 23.
  • the signal line 24 is connected in parallel with the edge conductive portion 185, and the edge conductive portion 185 is a patterned metal or ITO layer.
  • the metal or ITO is first laid, and then the The metal or ITO is patterned by etching or other methods. By controlling the patterning method, the metal or ITO is made to form conductive leads 184 and edge conductive parts 185 at positions corresponding to the non-display area.
  • the conductive leads 184 are used to connect the touch electrodes 182 With the touch chip 23, the edge conductive portion 185 is used to connect the signal line 24, and the conductive lead 184 is electrically isolated from the edge conductive portion 185, so that the parallel connection of the signal line 24 and the conductive layer 180 does not affect the touch of the touch panel 18.
  • the fabrication of the edge conductive portion 185 does not add additional processes and does not occupy additional space for other devices.
  • the edge conductive portion 185 retains the part that needs to be removed during the process of forming the conductive lead 184, that is, to form Edge conductive part 185.
  • the method of electrically isolating the conductive lead 184 and the edge conductive portion 185 can be to fabricate an insulating structure between the conductive lead 184 and the edge conductive portion 185, or it can be patterned between the conductive lead 184 and the edge conductive portion 185.
  • a gap is designed to avoid contact between the conductive lead 184 and the edge conductive portion 185.
  • FIG. 6 shows a schematic diagram of the stacking of the display panel 100.
  • the conductive layer 180 of the display panel 100 is connected to the first signal line 242.
  • the first signal line 242 and the cathode layer 144 are located on the same layer, that is, the first signal line 242 and the cathode layer 144 are different parts of the same conductive material layer after patterning.
  • the conductive material layer may be transparent such as ITO.
  • the ITO material can make the light emitted by the organic layer 146 of the organic light emitting diode 14 lose less during the outward propagation.
  • the conductive material layer can also be formed of a conductive material such as metal, and the resistance of the metal material is smaller.
  • an insulating layer 52 is provided between the conductive material layer and the conductive layer 180, that is, an insulating layer 52 is provided between the first signal line 242 and the conductive layer 180, and the insulating layer 52 is made of insulating material.
  • the isolation layer 52 is used to isolate the organic light emitting diode 14 and the conductive layer 180 to prevent mutual functional interference.
  • the insulating layer 52 is provided with a through hole 53, and the conductive layer 180 passes through the through hole 53 to contact the first signal line 242. Specifically, the through hole 53 penetrates through the insulating layer 52, and the conductive layer 180 passes through the insulating layer 52.
  • the conductive layer 180 laid on the organic light emitting diode 14 is partially located in the through hole 53 to contact the first signal line 242, and a touch electrode 182 or conductive lead 184 is formed on the patterned conductive layer 180 After that, the part of the conductive layer 180 located in the through hole 53 is retained, so that the conductive material layer on the lower side of the insulating layer 52 can be connected to the conductive layer 180.
  • the number of through holes 53 is multiple, and the multiple through holes 53 are arranged at equal intervals, so that the resistance is uniform.
  • the first signal line 242 is connected in parallel with the conductive layer 180.
  • the loss of the VSS signal during transmission to the organic light emitting diode 14 is small.
  • the brightness of the organic light emitting diode 14 at each position of the display panel 100 tends to be the same, and the display brightness of the display panel 100 tends to Yu uniform.
  • FIG. 7 is a schematic circuit diagram of the display panel 100 provided in the second embodiment of the application
  • FIG. 8 is a schematic structural diagram of the display panel 100 provided in the second embodiment of the application
  • 9 is a schematic diagram of the layer structure of the display panel 100 provided in the second embodiment of the application.
  • the conductive layer 180 of the touch panel 18 is electrically connected to the second signal line 244, and the second signal line 244 is connected in parallel with the conductive layer 180.
  • the VDD signal output from the driver chip is connected to the second signal line 244 and the conductive layer 180.
  • the VDD signal has less loss during the transmission process.
  • the second signal line 244 is the data line 32
  • the second signal line 244 is electrically connected to the first end 122 of the thin film transistor 40
  • the anode layer 142 of the organic light emitting diode 14 is electrically connected to the second end of the thin film transistor 40 124, wherein the first terminal 122 is a source and the second terminal 124 is a drain, or the first terminal 122 is a drain, and the second terminal 124 is a source.
  • the gate 126 of the thin film transistor 40 is electrically connected to the scan line 34,
  • the scan line 34 transmits scan signals to the gate 126 and controls the connection state of the first terminal 122 and the second terminal 124 so that the VDD signal can be transmitted to the organic light emitting diode 14.
  • the second signal line 244 is located on the same layer as the first terminal 122 or the second terminal 124, that is, the second signal line 244 and the first terminal 122 or the second terminal 124 are the same layer of metal material after patterning.
  • the insulating layer 52 is made of insulating material.
  • the number of isolation layers 52 can be multiple, which are used to separate the organic light emitting diode 14 from the conductive layer 180, the cathode layer 144 and the first end 122, the second end 124, etc., to prevent mutual functional interference, and further
  • the cathode layer 144 is also located between the second signal line 244 and the conductive layer 180.
  • the insulating layer 52 is provided with a through hole 53, and the conductive layer 180 passes through the through hole 53 to contact the second signal line 244. Specifically, the through hole 53 penetrates the insulating layer 52 and the cathode layer. 144.
  • the conductive layer 180 When the conductive layer 180 is fabricated on the organic light emitting diode 14, the conductive layer 180 laid on the organic light emitting diode 14 is partially located in the through hole 53 and contacts the second signal line 244, and a touch control is formed on the patterned conductive layer 180 After the electrode 182 or the conductive lead 184, the part of the conductive layer 180 located in the through hole 53 is retained, so that the conductive material layer on the lower side of the insulating layer 52 can be connected to the conductive layer 180.
  • the number of through holes 53 is multiple, and the multiple through holes 53 are arranged at equal intervals, so that the resistance is uniform.
  • a sleeve 530 is provided in the through hole 53, and the conductive layer 180 passes through the sleeve 530 to contact the second signal line 244.
  • the sleeve 530 is made of an insulating material. The sleeve 530 prevents the part of the conductive layer 180 located in the through hole 53 from contacting the cathode layer 144 and causing short circuits.
  • the second signal line 244 is connected in parallel with the conductive layer 180.
  • the loss of the VDD signal during transmission to the organic light emitting diode 14 is small.
  • the brightness of the organic light emitting diode 14 at each position of the display panel 100 is the same, and the display brightness of the display panel 100 is uniform.
  • FIG. 5 is a schematic diagram of the touch panel 18.
  • the display panel includes a display area and a non-display area.
  • the conductive layer 180 of the touch panel 18 includes a touch screen corresponding to the display area.
  • the non-display area is located on the peripheral side of the display area, the touch electrode 182 is used to sense the touch position, the conductive wire 184 is connected to the touch electrode 182 from the edge of the touch electrode 182, and the touch electrode 182 is connected to the touch
  • the touch chip 23 can be an independent chip that integrates the touch function, and the touch chip 23 can also be integrated in the driver chip 22, that is, the driver chip 22 can simultaneously drive display and touch functions.
  • the signal line 24 is connected in parallel with the conductive layer 180, and the signal passes through the signal line 24 and the conductive layer 180 at the same time during transmission, so that the signal loss is reduced without affecting the touch function of the touch panel 18.
  • the touch electrode 182 may be one conductive layer or two conductive layers.
  • the touch electrode 182 is two conductive layers 180, the touch electrode 182 includes a first electrode 182a and a second electrode 182b that are arranged oppositely.
  • a capacitor is formed between the first electrode 182a and the second electrode 182b, so as to realize the touch function.
  • Part of the conductive lead wire electrically connects the first electrode 182a and the touch chip 23, and part of the conductive lead wire electrically connects the second electrode 182b and the touch chip 23.
  • the signal line 24 is connected in parallel with the edge conductive portion 185, and the edge conductive portion 185 is a patterned metal or ITO layer.
  • the metal or ITO is first laid, and then the The metal or ITO is patterned by etching or other methods. By controlling the patterning method, the metal or ITO is made to form conductive leads 184 and edge conductive parts 185 at positions corresponding to the non-display area.
  • the conductive leads 184 are used to connect the touch electrodes 182 With the touch chip 23, the edge conductive portion 185 is used to connect the signal line 24, and the conductive lead 184 is electrically isolated from the edge conductive portion 185, so that the parallel connection of the signal line 24 and the conductive layer 180 does not affect the touch of the touch panel 18.
  • the fabrication of the edge conductive portion 185 does not add additional processes and does not occupy additional space for other devices.
  • the edge conductive portion 185 is a part that needs to be removed in the process of forming the conductive lead 184. In this embodiment, the pattern is changed. The modified pattern retains the part that needs to be removed, that is, the edge conductive portion 185 is formed.
  • the method of electrically isolating the conductive lead 184 and the edge conductive portion 185 can be to fabricate an insulating structure between the conductive lead 184 and the edge conductive portion 185, or it can be patterned between the conductive lead 184 and the edge conductive portion 185.
  • a gap is designed to avoid contact between the conductive lead 184 and the edge conductive portion 185.
  • FIG. 10 is a schematic circuit diagram of the display panel 100 provided in the third embodiment of the application
  • FIG. 11 is a schematic diagram of the layer structure of the display panel 100 provided in the third embodiment of the application.
  • the display panel 100 provided in the third embodiment of the present application is substantially the same as the second embodiment, except that the second signal line 244 and the data line 32 are different wires.
  • the array substrate 12 includes two thin film transistors 40, namely a first thin film transistor T1 and a second thin film transistor T2.
  • the first end 122 of the first thin film transistor T1 is electrically connected to the data line 32, and the first thin film transistor T1
  • the second terminal 124 is electrically connected to the gate 126 of the second thin film transistor T2, wherein the first terminal 122 is the source and the second terminal 124 is the drain, or the first terminal 122 is the drain and the second terminal 124 is the source
  • the gate 126 of the first thin film transistor T1 is electrically connected to the scan line 34.
  • the scan signal transmitted by the scan line 34 controls the connection between the first terminal 122 and the second terminal 124 of the first thin film transistor T1.
  • the data signal is transmitted to the gate 126 of the second thin film transistor T2, thereby controlling the connection between the first terminal 122 and the second terminal 124 of the second thin film transistor T2.
  • the first terminal 122 of the second thin film transistor T2 is electrically connected to the second signal line 244, and the second terminal 124 of the second thin film transistor T2 is electrically connected to the organic light emitting diode 14, specifically to the anode layer 142 of the organic light emitting diode 14.
  • the conductive layer 180 of the touch panel 18 is electrically connected to the second signal line 244, and the second signal line 244 is connected in parallel with the conductive layer 180.
  • the loss of the VDD signal in the process of transmitting to the organic light emitting diode 14 is small.
  • the brightness of the organic light emitting diode 14 at each position of the panel 100 tends to be the same, and the display brightness of the display panel 100 tends to be uniform.
  • the thin film transistor 40 shown in FIG. 11 is a second thin film transistor T2, and the second signal line 244 is located on the same layer as the first terminal 122 or the second terminal 124, that is, the second signal line 244 and the first terminal 122 Or the second end 124 is a different part formed by patterning the same metal material layer.
  • an isolation layer 52 is provided between the metal material layer and the conductive layer 180, that is, the second signal line 244 and An insulating layer 52 is provided between the conductive layers 180.
  • the insulating layer 52 is made of insulating material.
  • the number of the insulating layers 52 can be multiple, which are used to separate the organic light emitting diode 14 from the conductive layer 180, and the cathode layer 144 from the first terminal. 122, the second end 124, etc., to prevent mutual functional interference.
  • the cathode layer 144 is also located between the second signal line 244 and the conductive layer 180.
  • the insulating layer 52 is provided with a through hole 53, and the conductive layer 180 passes through the through hole 53 to contact the second signal line 244. Specifically, the through hole 53 penetrates the insulating layer 52 and the cathode layer. 144.
  • the conductive layer 180 When the conductive layer 180 is fabricated on the organic light emitting diode 14, the conductive layer 180 laid on the organic light emitting diode 14 is partially located in the through hole 53 and contacts the second signal line 244, and a touch control is formed on the patterned conductive layer 180 After the electrode 182 or the conductive lead 184, the part of the conductive layer 180 located in the through hole 53 is retained, so that the conductive material layer on the lower side of the insulating layer 52 can be connected to the conductive layer 180.
  • the number of through holes 53 is multiple, and the multiple through holes 53 are arranged at equal intervals, so that the resistance is uniform.
  • a sleeve 530 is provided in the through hole 53, and the conductive layer 180 passes through the sleeve 530 to contact the second signal line 244.
  • the sleeve 530 is made of an insulating material. The sleeve 530 prevents the part of the conductive layer 180 located in the through hole 53 from contacting the cathode layer 144 and causing short circuits.
  • the second signal line 244 is connected in parallel with the conductive layer 180, the total resistance of the second signal line 244 is reduced, the loss of the VDD signal in the process of transmitting to the organic light emitting diode 14 is small, and the brightness of the organic light emitting diode 14 at each position of the display panel 100 Tend to be the same, and the display brightness of the display panel 100 tends to be uniform.
  • FIG. 5 is a schematic diagram of the touch panel 18.
  • the display panel includes a display area and a non-display area.
  • the conductive layer 180 of the touch panel 18 includes a touch screen corresponding to the display area.
  • the non-display area is located on the peripheral side of the display area, the touch electrode 182 is used to sense the touch position, the conductive wire 184 is connected to the touch electrode 182 from the edge of the touch electrode 182, and the touch electrode 182 is connected to the touch
  • the touch chip 23 can be an independent chip that integrates the touch function, and the touch chip 23 can also be integrated in the driver chip 22, that is, the driver chip 22 can simultaneously drive display and touch functions.
  • the signal line 24 is connected in parallel with the conductive layer 180, and the signal passes through the signal line 24 and the conductive layer 180 at the same time during transmission, so that the signal loss is reduced without affecting the touch function of the touch panel 18.
  • the touch electrode 182 may be one conductive layer or two conductive layers.
  • the touch electrode 182 is two conductive layers 180, the touch electrode 182 includes a first electrode 182a and a second electrode 182b that are arranged oppositely.
  • a capacitor is formed between the first electrode 182a and the second electrode 182b, so as to realize the touch function.
  • Part of the conductive lead wire electrically connects the first electrode 182 a and the touch chip 23, and part of the conductive lead wire electrically connects the second electrode 182 b and the touch chip 23.
  • the signal line 24 is connected in parallel with the edge conductive portion 185, and the edge conductive portion 185 is a patterned metal or ITO layer.
  • the metal or ITO is first laid, and then the The metal or ITO is patterned by etching or other methods. By controlling the patterning method, the metal or ITO is made to form conductive leads 184 and edge conductive parts 185 at positions corresponding to the non-display area.
  • the conductive leads 184 are used to connect the touch electrodes 182 With the touch chip 23, the edge conductive portion 185 is used to connect the signal line 24, and the conductive lead 184 is electrically isolated from the edge conductive portion 185, so that the parallel connection of the signal line 24 and the conductive layer 180 does not affect the touch of the touch panel 18.
  • the fabrication of the edge conductive portion 185 does not add additional processes and does not occupy additional space for other devices.
  • the edge conductive portion 185 is a part that needs to be removed in the process of forming the conductive lead 184. In this embodiment, the pattern is changed. The modified pattern retains the part that needs to be removed, that is, the edge conductive portion 185 is formed.
  • the method of electrically isolating the conductive lead 184 and the edge conductive portion 185 can be to fabricate an insulating structure between the conductive lead 184 and the edge conductive portion 185, or it can be patterned between the conductive lead 184 and the edge conductive portion 185.
  • a gap is designed to avoid contact between the conductive lead 184 and the edge conductive portion 185.
  • the embodiment of the present application also provides a display device, including a driving device and the display panel 100 provided in the embodiment of the present application, and the driving device is electrically connected to the display panel 100 to drive the display panel 100 to display.
  • the signal line 24 is connected in parallel with the conductive layer 180, and the signal loss during transmission to the organic light emitting diode 14 is small.
  • the brightness of the organic light emitting diode 14 at each position of the display panel 100 is the same, and the display brightness of the display panel 100 is uniform.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, “plurality” means two or more, unless otherwise clearly defined.
  • connection should be understood in a broad sense, for example, it may be a fixed connection or It is a detachable connection or an integral connection; it can be a mechanical connection, or it can be an electrical connection or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal communication of two components or two components The interaction relationship.
  • connection should be understood in a broad sense, for example, it may be a fixed connection or It is a detachable connection or an integral connection; it can be a mechanical connection, or it can be an electrical connection or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal communication of two components or two components The interaction relationship.
  • connection should be understood in a broad sense, for example, it may be a fixed connection or It is a detachable connection or an integral connection; it can be a mechanical connection, or it can be an electrical connection or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal
  • the "on” or “under” of the first feature of the second feature may include direct contact between the first and second features, or include the first and The second feature is not in direct contact but through another feature between them.
  • the "above”, “above” and “above” the first feature on the second feature includes the first feature directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature.
  • the “below”, “below” and “below” of the first feature of the second feature include the first feature directly above and diagonally above the second feature, or it simply means that the level of the first feature is smaller than the second feature.

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Abstract

一种显示面板（100），包括驱动芯片（22）、信号线（24）、有机发光二极管（14）及触控面板（18），信号线（24）电连接于驱动芯片（22）与有机发光二极管（14）之间，触控面板（18）包括导电层（180），导电层（180）位于信号线（24）之上，导电层（180）与信号线（24）电连接，并且导电层（180）与信号线（24）并联。还提供一种显示设备。

Description

显示面板及显示装置 技术领域
本申请涉及电子设备技术领域，尤其是涉及一种显示面板及显示装置。
背景技术
手机等显示装置是生活中常见的电子设备，人们的生活已越来越离不开显示设备。随着技术的进步，以及用户对高屏占比的追求，手机的显示区域尺寸越来越大，非显示区的尺寸越来越小，位于非显示区的引线由于横截面积减小后电阻增大，信号在引线内传递的过程中的损耗增大，导致显示面板于远离信号端的一侧亮度较差，整体显示面板的显示亮度不一致。
发明内容
本申请要解决的技术问题是提供一种显示面板及显示装置，用以解决现有技术中显示面板于远离信号端的一侧亮度较差，整体显示面板的显示亮度不一致的问题。
为解决上述技术问题，一方面，本申请提供一种显示面板，所述显示面板包括驱动芯片、信号线、有机发光二极管及触控面板，所述信号线电连接于所述驱动芯片与所述有机发光二极管之间，所述触控面板包括导电层，所述导电层位于所述信号线之上，所述导电层与所述信号线电连接，并且所述导电层与所述信号线并联。
另一方面，还提供一种显示装置，包括驱动装置及显示面板，所述驱动装置电连接所述显示面板以驱动所述显示面板显示。
上述技术方案的有益效果如下：信号线与触控面板的导电层并联，从驱动芯片发出的信号在传递至有机发光二极管过程中的损耗较小，显示面板各位置的有机发光二极管的亮度趋于相同，显示面板的显示亮度趋于均匀。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例中所需要 使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的显示面板的层结构示意图。
图2为本申请实施例一提供的显示面板的示意图。
图3为显示面板的部分结构示意图。
图4为显示面板的电路示意图。
图5为触控面板的示意图。
图6为显示面板的层叠示意图。
图7为本申请实施例二提供的显示面板的电路示意图。
图8为本申请实施例二提供的显示面板的结构示意图。
图9为本申请实施例二提供的显示面板的层结构示意图。
图10为本申请实施例三提供的显示面板的电路示意图。
图11为本申请实施例三提供的显示面板的层结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请实施例提供的显示面板用于显示图像，显示面板包括但不限于有机发光二极管显示面板(Organic Light-Emitting Diode，OLED)，例如无源驱动有机发光二极管显示面板(PMOLED)或有源驱动有机发光二极管显示面板(AMOLED)，进一步的，显示面板可以集成触控面板，从而实现触控操作的功能。
请参阅图1及4，图1为本申请实施例提供的显示面板100的层结构示意图，图4为显示面板100的电路示意图，进一步的，图1所示的显示面板100为有源驱动有机发光二极管14显示面板，显示面板100包括依次层叠设置的阵列基板12、有机发光二极管14、封装层16及触控面板18，阵列基板12上 的每一个薄膜晶体管40(Thin Film Transistor，TFT)与一个像素相连，薄膜晶体管40作为开关单独控制每一个像素独立发光。本实施例中，封装层16用于封装有机发光二极管14，以防止外部水汽等进入有机发光二极管14。触控面板18制作于封装层16上，减少制作过程中所需中间层材料，从而使得有触摸功能的显示面板100的厚度有效降低，有利于制作柔性显示面板100。进一步的，显示面板100还包括偏光片19和透明盖板17，偏光片19和透明盖板17依次层叠于触控面板18上，偏光片19提高显示效果，透明盖板17保护显示面板100内部结构，用户触摸显示面板100时手指接触于透明盖板17上，防止伤害显示面板100内部结构。本实施例中，透明盖板17与偏光片19、偏光片19与触控面板18之间透过光学胶粘贴，光学胶透光率高，粘贴效果好。
请结合图1和图2，图2为本申请实施例一提供的显示面板100的示意图，本实施例中，显示面板100还包括驱动芯片22和信号线24，信号线24电连接于驱动芯片22与有机发光二极管14之间，驱动芯片22通过信号线24传输数据至有机发光二极管14，从而控制有机发光二极管14发光。触控面板18包括导电层180，导电层180位于信号线24之上，导电层180与信号线24电连接，并且导电层180与信号线24并联。具体的，导电层180可以为图案化的金属层，也可以为氧化铟锡(ITO)材料形成的透明导电层180。信号线24与导电层180并联，信号线24的总电阻减小，信号在传递至有机发光二极管14过程中的损耗较小，显示面板100各位置的有机发光二极管14的亮度差异减小，显示面板100的显示亮度趋于均匀。
进一步的，信号线24可以位于阵列基板12上，也可以位于有机发光二极管14上。具体的，请结合图3和图4，图3为显示面板100的部分结构示意图，有机发光二极管14包括阳极层142、阴极层144及位于阳极层142和阴极层144之间的有机层146，信号线24包括第一信号线242和第二信号线244，第一信号线242电连接至阴极层144，以向阴极层144传输VSS信号，第二信号线244电连接至阳极层142，以向阳极层142传输VDD信号，从而控制有机层146发光。
请结合图2和图5，图5为触控面板18的示意图，所述显示面板包括显示区和非显示区，触控面板18的导电层180包括对应显示区的触控电极182， 以及对应非显示区的导电引线184和边缘导电部185。具体的，非显示区位于显示区的周侧，触控电极182用于感应触控位置，导电引线184从触控电极182的边缘连接触控电极182，并将触控电极182连接至触控芯片23，需要注意的是，触控芯片23可以为独立的、集成了触控功能的芯片，触控芯片23也可以集成于驱动芯片22中，即驱动芯片22可以同时驱动显示与触控功能。本实施例中，信号线24与导电层180并联，信号在传输过程中同时经过信号线24与导电层180，在不影响触控面板18的触控功能的情况下，降低信号的损耗。
触控电极182可以为一层导电层，也可以为两层导电层，当触控电极182为两层导电层180时，触控电极182包括相对设置的第一电极182a和第二电极182b，第一电极182a与第二电极182b之间形成电容，从而实现触控功能。部分导电引线电连接第一电极182a与触控芯片，部分导电引线电连接第二电极182b与触控芯片23。
本实施例中，信号线24与边缘导电部185并联，边缘导电部185为图案化形成的金属或ITO层，具体的，在制作边缘导电部185的过程中，首先铺设金属或ITO，然后对金属或ITO通过蚀刻等方式进行图案化，通过控制图案化的方式，使该金属或ITO在对应非显示区的位置形成导电引线184和边缘导电部185，导电引线184用于连接触控电极182与触控芯片23，边缘导电部185用于连接信号线24，并且导电引线184与边缘导电部185电性隔离，从而使信号线24与导电层180的并联不影响触控面板18的触控功能。进一步的，边缘导电部185的制作不会增加额外的工序，且不会额外占用其他器件的空间，边缘导电部185为形成导电引线184的过程中，将该原本需要去除的部分保留，即形成边缘导电部185。本实施例中，电性隔离导电引线184和边缘导电部185的方式可以为制作绝缘结构于导电引线184与边缘导电部185之间，也可以为图案化时在导电引线184与边缘导电部185之间设计间隙，避免导电引线184与边缘导电部185接触。
请一并参阅图4和图6，图6所示为显示面板100的层叠示意图，本实施例中，显示面板100的导电层180连接至第一信号线242。具体的，第一信号线242与阴极层144位于同一层，即第一信号线242和阴极层144为同一层导 电材料层经过图案化后形成的不同部分，该导电材料层可以为ITO等透明导电材料形成，ITO材料可以使有机发光二极管14的有机层146发出的光在向外传播的过程中损耗更少，该导电材料层也可以为金属等导电材料形成，金属材料电阻更小。本实施例中，该导电材料层与所述导电层180之间设有隔绝层52，即第一信号线242与导电层180之间设有隔绝层52，隔绝层52为绝缘材料制成，隔绝层52用于隔绝有机发光二极管14与导电层180，防止相互之间在功能上的干扰。进一步的，所述隔绝层52设有通孔53，所述导电层180穿过所述通孔53接触所述第一信号线242，具体的，通孔53贯穿隔绝层52，在有机发光二极管14上制作导电层180时，铺设于有机发光二极管14上的导电层180部分位于通孔53内而接触到第一信号线242，并且在图案化导电层180形成触控电极182或导电引线184后，保留导电层180位于通孔53内的部分，从而使隔绝层52下侧的导电材料层与所述导电层180可以连接。一种实施方式中，通孔53的数量为多个，且多个通孔53之间等间距排列，从而使电阻均匀。
第一信号线242与导电层180并联，VSS信号在传递至有机发光二极管14过程中的损耗较小，显示面板100各位置的有机发光二极管14的亮度趋于相同，显示面板100的显示亮度趋于均匀。
请一并参阅图7、图8及图9，图7所示为本申请实施例二提供的显示面板100的电路示意图，图8所示为本申请实施例二提供的显示面板100的结构示意图，图9所示为本申请实施例二提供的显示面板100的层结构示意图。本实施例中，触控面板18的导电层180电连接至第二信号线244，第二信号线244与导电层180并联，从驱动芯片输出的VDD信号在第二信号线244和导电层180上传输，并传递至有机发光二极管14，VDD信号在传递过程中的损耗较小，显示面板100各位置的有机发光二极管14的亮度趋于相同，显示面板100的显示亮度趋于均匀。本实施例中，第二信号线244为数据线32，第二信号线244电连接至薄膜晶体管40的第一端122，有机发光二极管14的阳极层142电连接至薄膜晶体管40的第二端124，其中，第一端122为源极，第二端124为漏极，或者第一端122为漏极，第二端124为源极，薄膜晶体管40的栅极126电连接扫描线34，扫描线34传输扫描信号至栅极126，控制第 一端122和第二端124的连通状态，从而使VDD信号可以传输至有机发光二极管14。本实施例中，第二信号线244与第一端122或第二端124位于同一层，即第二信号线244和第一端122或第二端124为同一层金属材料层经过图案化后形成的不同部分，本实施例中，该金属材料层与所述导电层180之间设有多个层结构，例如隔绝层52和阴极层144，具体的，隔绝层52为绝缘材料制成，隔绝层52的数量可以为多个，分别用于隔绝有机发光二极管14与导电层180、阴极层144与第一端122、第二端124等，防止相互之间在功能上的干扰，进一步的，阴极层144也位于第二信号线244与导电层180之间。本实施例中，所述隔绝层52设有通孔53，所述导电层180穿过所述通孔53接触所述第二信号线244，具体的，通孔53贯穿隔绝层52和阴极层144，在有机发光二极管14上制作导电层180时，铺设于有机发光二极管14上的导电层180部分位于通孔53内而接触到第二信号线244，并且在图案化导电层180形成触控电极182或导电引线184后，保留导电层180位于通孔53内的部分，从而使隔绝层52下侧的导电材料层与所述导电层180可以连接。一种实施方式中，通孔53的数量为多个，且多个通孔53之间等间距排列，从而使电阻均匀。一种实施方式中，所述通孔53内设有套筒530，所述导电层180穿过所述套筒530接触所述第二信号线244，具体的，套筒530为绝缘材料制成，套筒530防止导电层180位于通孔53内的部分与阴极层144接触而出现短路等现象。
第二信号线244与导电层180并联，VDD信号在传递至有机发光二极管14过程中的损耗较小，显示面板100各位置的有机发光二极管14的亮度相同，显示面板100的显示亮度均匀。
本实施例中，请结合图2和图5，图5为触控面板18的示意图，所述显示面板包括显示区和非显示区，触控面板18的导电层180包括对应显示区的触控电极182，以及对应非显示区的导电引线184和边缘导电部185。具体的，非显示区位于显示区的周侧，触控电极182用于感应触控位置，导电引线184从触控电极182的边缘连接触控电极182，并将触控电极182连接至触控芯片23，需要注意的是，触控芯片23可以独立的、集成了触控功能的芯片，触控芯片23也可以集成于驱动芯片22中，即驱动芯片22可以同时驱动显示与触 控功能。本实施例中，信号线24与导电层180并联，信号在传输过程中同时经过信号线24与导电层180，在不影响触控面板18的触控功能的情况下，降低信号的损耗。
触控电极182可以为一层导电层，也可以为两层导电层，当触控电极182为两层导电层180时，触控电极182包括相对设置的第一电极182a和第二电极182b，第一电极182a与第二电极182b之间形成电容，从而实现触控功能。部分导电引线电连接第一电极182a与触控芯片，部分导电引线电连接第二电极182b与触控芯片23。
本实施例中，信号线24与边缘导电部185并联，边缘导电部185为图案化形成的金属或ITO层，具体的，在制作边缘导电部185的过程中，首先铺设金属或ITO，然后对金属或ITO通过蚀刻等方式进行图案化，通过控制图案化的方式，使该金属或ITO在对应非显示区的位置形成导电引线184和边缘导电部185，导电引线184用于连接触控电极182与触控芯片23，边缘导电部185用于连接信号线24，并且导电引线184与边缘导电部185电性隔离，从而使信号线24与导电层180的并联不影响触控面板18的触控功能。进一步的，边缘导电部185的制作不会增加额外的工序，且不会额外占用其他器件的空间，边缘导电部185为形成导电引线184的过程中原本需要去除的部分，本实施例中改变图案化的图形，将该原本需要去除的部分保留，即形成边缘导电部185。本实施例中，电性隔离导电引线184和边缘导电部185的方式可以为制作绝缘结构于导电引线184与边缘导电部185之间，也可以为图案化时在导电引线184与边缘导电部185之间设计间隙，避免导电引线184与边缘导电部185接触。
请参阅图10和图11，图10所示为本申请实施例三提供的显示面板100的电路示意图，图11所示为本申请实施例三提供的显示面板100的层结构示意图。本申请实施例三提供的显示面板100与实施例二大致相同，不同点在于，第二信号线244与数据线32为不同的导线。具体到图10，阵列基板12上包括两个薄膜晶体管40，即第一薄膜晶体管T1和第二薄膜晶体管T2，第一薄膜晶体管T1的第一端122电连接数据线32，第一薄膜晶体管T1的第二端124电连接第二薄膜晶体管T2的栅极126，其中，第一端122为源极，第二端124 为漏极，或者第一端122为漏极，第二端124为源极，第一薄膜晶体管T1的栅极126电连接扫描线34，扫描线34传递的扫描信号控制第一薄膜晶体管T1的第一端122和第二端124的连通情况，当第一薄膜晶体管T1的第一端122和第二端124连通时，数据信号传递至第二薄膜晶体管T2的栅极126，从而控制第二薄膜晶体管T2的第一端122和第二端124的连通情况。进一步的，第二薄膜晶体管T2的第一端122电连接第二信号线244，第二薄膜晶体管T2的第二端124电连接有机发光二极管14，具体连接至有机发光二极管14的阳极层142。本实施例中，触控面板18的导电层180电连接至第二信号线244，第二信号线244与导电层180并联，VDD信号在传递至有机发光二极管14过程中的损耗较小，显示面板100各位置的有机发光二极管14的亮度趋于相同，显示面板100的显示亮度趋于均匀。
本实施例中，图11所示的薄膜晶体管40为第二薄膜晶体管T2，第二信号线244与第一端122或第二端124位于同一层，即第二信号线244和第一端122或第二端124为同一层金属材料层经过图案化后形成的不同部分，本实施例中，该金属材料层与所述导电层180之间设有隔绝层52，即第二信号线244与导电层180之间设有隔绝层52，隔绝层52为绝缘材料制成，隔绝层52的数量可以为多个，分别用于隔绝有机发光二极管14与导电层180、阴极层144与第一端122、第二端124等，防止相互之间在功能上的干扰，进一步的，阴极层144也位于第二信号线244与导电层180之间。本实施例中，所述隔绝层52设有通孔53，所述导电层180穿过所述通孔53接触所述第二信号线244，具体的，通孔53贯穿隔绝层52和阴极层144，在有机发光二极管14上制作导电层180时，铺设于有机发光二极管14上的导电层180部分位于通孔53内而接触到第二信号线244，并且在图案化导电层180形成触控电极182或导电引线184后，保留导电层180位于通孔53内的部分，从而使隔绝层52下侧的导电材料层与所述导电层180可以连接。一种实施方式中，通孔53的数量为多个，且多个通孔53之间等间距排列，从而使电阻均匀。一种实施方式中，所述通孔53内设有套筒530，所述导电层180穿过所述套筒530接触所述第二信号线244，具体的，套筒530为绝缘材料制成，套筒530防止导电层180位于通孔53内的部分与阴极层144接触而出现短路等现象。
第二信号线244与导电层180并联，第二信号线244的总电阻减小，VDD信号在传递至有机发光二极管14过程中的损耗较小，显示面板100各位置的有机发光二极管14的亮度趋于相同，显示面板100的显示亮度趋于均匀。
本实施例中，请结合图2和图5，图5为触控面板18的示意图，所述显示面板包括显示区和非显示区，触控面板18的导电层180包括对应显示区的触控电极182，以及对应非显示区的导电引线184和边缘导电部185。具体的，非显示区位于显示区的周侧，触控电极182用于感应触控位置，导电引线184从触控电极182的边缘连接触控电极182，并将触控电极182连接至触控芯片23，需要注意的是，触控芯片23可以独立的、集成了触控功能的芯片，触控芯片23也可以集成于驱动芯片22中，即驱动芯片22可以同时驱动显示与触控功能。本实施例中，信号线24与导电层180并联，信号在传输过程中同时经过信号线24与导电层180，在不影响触控面板18的触控功能的情况下，降低信号的损耗。
触控电极182可以为一层导电层，也可以为两层导电层，当触控电极182为两层导电层180时，触控电极182包括相对设置的第一电极182a和第二电极182b，第一电极182a与第二电极182b之间形成电容，从而实现触控功能。部分导电引线电连接第一电极182a与触控芯片，部分导电引线电连接第二电极182b与触控芯片23。
本实施例中，信号线24与边缘导电部185并联，边缘导电部185为图案化形成的金属或ITO层，具体的，在制作边缘导电部185的过程中，首先铺设金属或ITO，然后对金属或ITO通过蚀刻等方式进行图案化，通过控制图案化的方式，使该金属或ITO在对应非显示区的位置形成导电引线184和边缘导电部185，导电引线184用于连接触控电极182与触控芯片23，边缘导电部185用于连接信号线24，并且导电引线184与边缘导电部185电性隔离，从而使信号线24与导电层180的并联不影响触控面板18的触控功能。进一步的，边缘导电部185的制作不会增加额外的工序，且不会额外占用其他器件的空间，边缘导电部185为形成导电引线184的过程中原本需要去除的部分，本实施例中改变图案化的图形，将该原本需要去除的部分保留，即形成边缘导电部185。本实施例中，电性隔离导电引线184和边缘导电部185的方式可以为制作绝缘 结构于导电引线184与边缘导电部185之间，也可以为图案化时在导电引线184与边缘导电部185之间设计间隙，避免导电引线184与边缘导电部185接触。
本申请实施例还提供一种显示设备，包括驱动装置及本申请实施例提供的显示面板100，所述驱动装置电连接所述显示面板100以驱动所述显示面板100显示。
信号线24与导电层180并联，信号在传递至有机发光二极管14过程中的损耗较小，显示面板100各位置的有机发光二极管14的亮度相同，显示面板100的显示亮度均匀。
需要理解的是，在本申请的实施方式的描述中，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请的实施方式和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的实施方式的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的实施方式的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请的实施方式的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请的实施方式中的具体含义。
在本申请的实施方式中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜 上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度小于第二特征。
上文的公开提供了许多不同的实施方式或例子用来实现本申请的实施方式的不同结构。为了简化本申请的实施方式的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请的实施方式可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请的实施方式提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
在本说明书的描述中，参考术语“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”或“一些示例”等的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易的想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (12)

  1. 一种显示面板，其特征在于，所述显示面板包括驱动芯片、信号线、有机发光二极管及触控面板，所述信号线电连接于所述驱动芯片与所述有机发光二极管之间，所述触控面板包括导电层，所述导电层位于所述信号线之上，所述导电层与所述信号线电连接，并且所述导电层与所述信号线并联。
  2. 根据权利要求1所述的显示面板，其特征在于，所述显示面板包括显示区和非显示区，所述非显示区位于所述显示区的周侧，所述导电层包括对应所述非显示区的边缘导电部，所述边缘导电部与所述信号线并联。
  3. 根据权利要求2所述的显示面板，其特征在于，所述边缘导电部为金属材质。
  4. 根据权利要求2所述的显示面板，其特征在于，所述导电层还包括触控电极和导电引线，所述导电引线电连接于所述触控电极与触控芯片之间，所述导电引线对应所述非显示区，所述导电引线与所述边缘导电部相互电性隔离。
  5. 根据权利要求1至4任意一项所述的显示面板，其特征在于，所述有机发光二极管包括阳极层、阴极层及位于所述阳极层与所述阴极层之间的有机层，所述阳极层和所述阴极层用于驱动所述有机层发光，所述信号线包括第一信号线和第二信号线，所述第一信号线电连接至所述阴极层，所述第二信号线电连接至所述阳极层。
  6. 根据权利要求5所述的显示面板，其特征在于，所述导电层与所述第一信号线并联。
  7. 根据权利要求6所述的显示面板，其特征在于，所述第一信号线与所述导电层之间设有隔绝层，所述隔绝层设有通孔，所述导电层穿过所述通孔并联至所述第一信号线。
  8. 根据权利要求5所述的显示面板，其特征在于，所述显示面板还包括阵列基板，所述有机发光二极管位于所述阵列基板上，所述阵列基板上设有薄膜晶体管，所述薄膜晶体管包括栅极、第一端及第二端，所述第一端电连接所述第二信号线，所述第二端电连接所述阳极层，所述栅极用于控制所述第一端与所述第二端连通，所述导电层电与所述第二信号线并联。
  9. 根据权利要求8所述的显示面板，其特征在于，所述第二信号线与所述导电层之间设有多个层结构，所述层结构设有通孔，所述导电层穿过所述通孔并联至所述第二信号线。
  10. 根据权利要求9所述的显示面板，其特征在于，所述通孔内设有套筒，所述导电层穿过所述套筒并联至所述第二信号线。
  11. 根据权利要求8至10任意一项所述的显示面板，其特征在于，所述第二信号线为数据线。
  12. 一种显示设备，其特征在于，包括驱动装置及权利要求1至11任意一项所述的显示面板，所述驱动装置电连接所述显示面板以驱动所述显示面板显示。
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CN114371795B (zh) * 2021-12-31 2023-07-28 厦门天马微电子有限公司 触控显示面板及触控显示装置

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