WO2020195819A1 - 光学フィルムの製造方法及び光学フィルム - Google Patents
光学フィルムの製造方法及び光学フィルム Download PDFInfo
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- WO2020195819A1 WO2020195819A1 PCT/JP2020/010488 JP2020010488W WO2020195819A1 WO 2020195819 A1 WO2020195819 A1 WO 2020195819A1 JP 2020010488 W JP2020010488 W JP 2020010488W WO 2020195819 A1 WO2020195819 A1 WO 2020195819A1
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- Prior art keywords
- film
- optical film
- polyimide
- bis
- ring
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- 239000012788 optical film Substances 0.000 title claims abstract description 63
- 238000000034 method Methods 0.000 title claims abstract description 52
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 40
- 229920001721 polyimide Polymers 0.000 claims abstract description 210
- 239000010408 film Substances 0.000 claims abstract description 170
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 139
- 125000000129 anionic group Chemical group 0.000 claims abstract description 80
- 239000009719 polyimide resin Substances 0.000 claims abstract description 45
- 238000009826 distribution Methods 0.000 claims abstract description 42
- 239000003960 organic solvent Substances 0.000 claims abstract description 14
- 239000007864 aqueous solution Substances 0.000 claims description 17
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 claims description 10
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 claims description 10
- 125000002015 acyclic group Chemical group 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 abstract description 13
- 238000005011 time of flight secondary ion mass spectroscopy Methods 0.000 abstract 2
- 238000002042 time-of-flight secondary ion mass spectrometry Methods 0.000 abstract 2
- -1 azadibenzofuran ring Chemical group 0.000 description 84
- 239000004642 Polyimide Substances 0.000 description 57
- 239000002904 solvent Substances 0.000 description 46
- 238000002360 preparation method Methods 0.000 description 39
- 229910052751 metal Inorganic materials 0.000 description 36
- 239000002184 metal Substances 0.000 description 36
- 150000002500 ions Chemical group 0.000 description 35
- 238000001035 drying Methods 0.000 description 27
- 238000005266 casting Methods 0.000 description 24
- 238000005259 measurement Methods 0.000 description 23
- 125000004432 carbon atom Chemical group C* 0.000 description 22
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 21
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 18
- 150000004985 diamines Chemical class 0.000 description 18
- 125000001931 aliphatic group Chemical group 0.000 description 17
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 16
- 239000000203 mixture Substances 0.000 description 16
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 239000013557 residual solvent Substances 0.000 description 15
- 238000009835 boiling Methods 0.000 description 13
- 150000001875 compounds Chemical class 0.000 description 13
- 239000011347 resin Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 11
- 125000003118 aryl group Chemical group 0.000 description 10
- 229920006254 polymer film Polymers 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- 238000004804 winding Methods 0.000 description 10
- 239000006096 absorbing agent Substances 0.000 description 9
- 150000008065 acid anhydrides Chemical class 0.000 description 9
- 125000002723 alicyclic group Chemical group 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- 239000002245 particle Substances 0.000 description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 150000002148 esters Chemical class 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 7
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 230000003993 interaction Effects 0.000 description 7
- 238000000935 solvent evaporation Methods 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 6
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- 239000003963 antioxidant agent Substances 0.000 description 6
- 150000004984 aromatic diamines Chemical class 0.000 description 6
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- 239000010935 stainless steel Substances 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 5
- TXCDCPKCNAJMEE-UHFFFAOYSA-N dibenzofuran Chemical class C1=CC=C2C3=CC=CC=C3OC2=C1 TXCDCPKCNAJMEE-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000010419 fine particle Substances 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 125000005647 linker group Chemical group 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 229920005575 poly(amic acid) Polymers 0.000 description 5
- 239000002243 precursor Substances 0.000 description 5
- 159000000000 sodium salts Chemical class 0.000 description 5
- 125000001424 substituent group Chemical group 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- WNXJIVFYUVYPPR-UHFFFAOYSA-N 1,3-dioxolane Chemical compound C1COCO1 WNXJIVFYUVYPPR-UHFFFAOYSA-N 0.000 description 4
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 4
- 125000000609 carbazolyl group Chemical class C1(=CC=CC=2C3=CC=CC=C3NC12)* 0.000 description 4
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 4
- 238000004040 coloring Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 238000004090 dissolution Methods 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- RMBPEFMHABBEKP-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2C3=C[CH]C=CC3=CC2=C1 RMBPEFMHABBEKP-UHFFFAOYSA-N 0.000 description 4
- 125000005843 halogen group Chemical group 0.000 description 4
- 125000001624 naphthyl group Chemical group 0.000 description 4
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 4
- 239000002966 varnish Substances 0.000 description 4
- BPMFPOGUJAAYHL-UHFFFAOYSA-N 9H-Pyrido[2,3-b]indole Chemical group C1=CC=C2C3=CC=CC=C3NC2=N1 BPMFPOGUJAAYHL-UHFFFAOYSA-N 0.000 description 3
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical group C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- 150000001491 aromatic compounds Chemical class 0.000 description 3
- 150000004945 aromatic hydrocarbons Chemical group 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 3
- 239000004305 biphenyl Substances 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000012046 mixed solvent Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000010452 phosphate Substances 0.000 description 3
- 229920002959 polymer blend Polymers 0.000 description 3
- 239000001294 propane Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 3
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 3
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 3
- 230000003313 weakening effect Effects 0.000 description 3
- NSGXIBWMJZWTPY-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropane Chemical compound FC(F)(F)CC(F)(F)F NSGXIBWMJZWTPY-UHFFFAOYSA-N 0.000 description 2
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 2
- 125000003363 1,3,5-triazinyl group Chemical group N1=C(N=CN=C1)* 0.000 description 2
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 2
- YKOLZVXSPGIIBJ-UHFFFAOYSA-N 2-Isopropylaniline Chemical compound CC(C)C1=CC=CC=C1N YKOLZVXSPGIIBJ-UHFFFAOYSA-N 0.000 description 2
- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 2
- KRPRVQWGKLEFKN-UHFFFAOYSA-N 3-(3-aminopropoxy)propan-1-amine Chemical compound NCCCOCCCN KRPRVQWGKLEFKN-UHFFFAOYSA-N 0.000 description 2
- LJMPOXUWPWEILS-UHFFFAOYSA-N 3a,4,4a,7a,8,8a-hexahydrofuro[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1C2C(=O)OC(=O)C2CC2C(=O)OC(=O)C21 LJMPOXUWPWEILS-UHFFFAOYSA-N 0.000 description 2
- IGSBHTZEJMPDSZ-UHFFFAOYSA-N 4-[(4-amino-3-methylcyclohexyl)methyl]-2-methylcyclohexan-1-amine Chemical compound C1CC(N)C(C)CC1CC1CC(C)C(N)CC1 IGSBHTZEJMPDSZ-UHFFFAOYSA-N 0.000 description 2
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 2
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical group C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- XLJMAIOERFSOGZ-UHFFFAOYSA-N anhydrous cyanic acid Natural products OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 description 2
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 2
- 239000000378 calcium silicate Substances 0.000 description 2
- 229910052918 calcium silicate Inorganic materials 0.000 description 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- WOSVXXBNNCUXMT-UHFFFAOYSA-N cyclopentane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1CC(C(O)=O)C(C(O)=O)C1C(O)=O WOSVXXBNNCUXMT-UHFFFAOYSA-N 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229920006015 heat resistant resin Polymers 0.000 description 2
- 150000002391 heterocyclic compounds Chemical class 0.000 description 2
- BXWNKGSJHAJOGX-UHFFFAOYSA-N hexadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCO BXWNKGSJHAJOGX-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 150000003949 imides Chemical group 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- LFSXCDWNBUNEEM-UHFFFAOYSA-N phthalazine Chemical group C1=NN=CC2=CC=CC=C21 LFSXCDWNBUNEEM-UHFFFAOYSA-N 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 125000003373 pyrazinyl group Chemical group 0.000 description 2
- 125000005581 pyrene group Chemical group 0.000 description 2
- PBMFSQRYOILNGV-UHFFFAOYSA-N pyridazine Chemical group C1=CC=NN=C1 PBMFSQRYOILNGV-UHFFFAOYSA-N 0.000 description 2
- 125000000714 pyrimidinyl group Chemical group 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 125000002294 quinazolinyl group Chemical group N1=C(N=CC2=CC=CC=C12)* 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000002040 relaxant effect Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000001073 sample cooling Methods 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 150000003871 sulfonates Chemical class 0.000 description 2
- 150000003457 sulfones Chemical class 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- SXJSETSRWNDWPP-UHFFFAOYSA-N (2-hydroxy-4-phenylmethoxyphenyl)-phenylmethanone Chemical compound C=1C=C(C(=O)C=2C=CC=CC=2)C(O)=CC=1OCC1=CC=CC=C1 SXJSETSRWNDWPP-UHFFFAOYSA-N 0.000 description 1
- OLQWMCSSZKNOLQ-ZXZARUISSA-N (3s)-3-[(3r)-2,5-dioxooxolan-3-yl]oxolane-2,5-dione Chemical compound O=C1OC(=O)C[C@H]1[C@@H]1C(=O)OC(=O)C1 OLQWMCSSZKNOLQ-ZXZARUISSA-N 0.000 description 1
- FQDXJYBXPOMIBX-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoro-2-methylpropan-2-ol Chemical compound FC(F)(F)C(O)(C)C(F)(F)F FQDXJYBXPOMIBX-UHFFFAOYSA-N 0.000 description 1
- BYEAHWXPCBROCE-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropan-2-ol Chemical compound FC(F)(F)C(O)C(F)(F)F BYEAHWXPCBROCE-UHFFFAOYSA-N 0.000 description 1
- NSZYKXMFFCRNJB-UHFFFAOYSA-N 1,2,3,4-tetramethylcyclobutane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1(C)C(C)(C(O)=O)C(C)(C(O)=O)C1(C)C(O)=O NSZYKXMFFCRNJB-UHFFFAOYSA-N 0.000 description 1
- KCZIUKYAJJEIQG-UHFFFAOYSA-N 1,3,5-triazin-2-amine Chemical compound NC1=NC=NC=N1 KCZIUKYAJJEIQG-UHFFFAOYSA-N 0.000 description 1
- 125000000355 1,3-benzoxazolyl group Chemical group O1C(=NC2=C1C=CC=C2)* 0.000 description 1
- PVDLUGWWIOGCNH-UHFFFAOYSA-N 1,3-difluoro-2-propanol Chemical compound FCC(O)CF PVDLUGWWIOGCNH-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CUOSYYRDANYHTL-UHFFFAOYSA-N 1,4-dioctoxy-1,4-dioxobutane-2-sulfonic acid;sodium Chemical compound [Na].CCCCCCCCOC(=O)CC(S(O)(=O)=O)C(=O)OCCCCCCCC CUOSYYRDANYHTL-UHFFFAOYSA-N 0.000 description 1
- XJKSTNDFUHDPQJ-UHFFFAOYSA-N 1,4-diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=C(C=2C=CC=CC=2)C=C1 XJKSTNDFUHDPQJ-UHFFFAOYSA-N 0.000 description 1
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 1
- FCEHBMOGCRZNNI-UHFFFAOYSA-N 1-benzothiophene Chemical group C1=CC=C2SC=CC2=C1 FCEHBMOGCRZNNI-UHFFFAOYSA-N 0.000 description 1
- CYRDONYNCYQNAL-UHFFFAOYSA-N 1-methylheptane-1,2,4,5-tetracarboxylic acid Chemical compound CCC(C(O)=O)C(C(O)=O)CC(C(O)=O)C(C)C(O)=O CYRDONYNCYQNAL-UHFFFAOYSA-N 0.000 description 1
- PSQZJKGXDGNDFP-UHFFFAOYSA-N 2,2,3,3,3-pentafluoropropan-1-ol Chemical compound OCC(F)(F)C(F)(F)F PSQZJKGXDGNDFP-UHFFFAOYSA-N 0.000 description 1
- NBUKAOOFKZFCGD-UHFFFAOYSA-N 2,2,3,3-tetrafluoropropan-1-ol Chemical compound OCC(F)(F)C(F)F NBUKAOOFKZFCGD-UHFFFAOYSA-N 0.000 description 1
- PWBIWYXOMBGIRF-UHFFFAOYSA-N 2,4-di(butan-2-yl)-6-(5-chlorobenzotriazol-2-yl)phenol Chemical compound CCC(C)C1=CC(C(C)CC)=C(O)C(N2N=C3C=C(Cl)C=CC3=N2)=C1 PWBIWYXOMBGIRF-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- RLYCRLGLCUXUPO-UHFFFAOYSA-N 2,6-diaminotoluene Chemical compound CC1=C(N)C=CC=C1N RLYCRLGLCUXUPO-UHFFFAOYSA-N 0.000 description 1
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 1
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- ZYHQGITXIJDDKC-UHFFFAOYSA-N 2-[2-(2-aminophenyl)ethyl]aniline Chemical group NC1=CC=CC=C1CCC1=CC=CC=C1N ZYHQGITXIJDDKC-UHFFFAOYSA-N 0.000 description 1
- ZGDMDBHLKNQPSD-UHFFFAOYSA-N 2-amino-5-(4-amino-3-hydroxyphenyl)phenol Chemical group C1=C(O)C(N)=CC=C1C1=CC=C(N)C(O)=C1 ZGDMDBHLKNQPSD-UHFFFAOYSA-N 0.000 description 1
- RLHGFJMGWQXPBW-UHFFFAOYSA-N 2-hydroxy-3-(1h-imidazol-5-ylmethyl)benzamide Chemical compound NC(=O)C1=CC=CC(CC=2NC=NC=2)=C1O RLHGFJMGWQXPBW-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- JBFWXEVUBFXPQV-UHFFFAOYSA-N 2-n,4-n-bis(3-aminophenyl)-1,3,5-triazine-2,4,6-triamine Chemical compound NC1=CC=CC(NC=2N=C(NC=3C=C(N)C=CC=3)N=C(N)N=2)=C1 JBFWXEVUBFXPQV-UHFFFAOYSA-N 0.000 description 1
- KVXMNWZGLKFISI-UHFFFAOYSA-N 2-n,4-n-bis(3-aminophenyl)-6-n-benzyl-1,3,5-triazine-2,4,6-triamine Chemical compound NC1=CC=CC(NC=2N=C(NC=3C=C(N)C=CC=3)N=C(NCC=3C=CC=CC=3)N=2)=C1 KVXMNWZGLKFISI-UHFFFAOYSA-N 0.000 description 1
- JAJBWMUFHFJECE-UHFFFAOYSA-N 2-n,4-n-bis(3-aminophenyl)-6-n-ethyl-1,3,5-triazine-2,4,6-triamine Chemical compound N=1C(NC=2C=C(N)C=CC=2)=NC(NCC)=NC=1NC1=CC=CC(N)=C1 JAJBWMUFHFJECE-UHFFFAOYSA-N 0.000 description 1
- FTYSULAJAVFRBZ-UHFFFAOYSA-N 2-n,4-n-bis(4-aminophenyl)-1,3,5-triazine-2,4,6-triamine Chemical compound C1=CC(N)=CC=C1NC1=NC(N)=NC(NC=2C=CC(N)=CC=2)=N1 FTYSULAJAVFRBZ-UHFFFAOYSA-N 0.000 description 1
- XLZZOCTUEGPGLN-UHFFFAOYSA-N 2-n,4-n-bis(4-aminophenyl)-6-n-benzyl-1,3,5-triazine-2,4,6-triamine Chemical compound C1=CC(N)=CC=C1NC1=NC(NCC=2C=CC=CC=2)=NC(NC=2C=CC(N)=CC=2)=N1 XLZZOCTUEGPGLN-UHFFFAOYSA-N 0.000 description 1
- PBSXNMHNUFQDKL-UHFFFAOYSA-N 2-n,4-n-bis(4-aminophenyl)-6-n-ethyl-1,3,5-triazine-2,4,6-triamine Chemical compound N=1C(NC=2C=CC(N)=CC=2)=NC(NCC)=NC=1NC1=CC=C(N)C=C1 PBSXNMHNUFQDKL-UHFFFAOYSA-N 0.000 description 1
- VVFMZHWAQNSESG-UHFFFAOYSA-N 2-n,4-n-bis(4-aminophenyl)-6-n-methyl-1,3,5-triazine-2,4,6-triamine Chemical compound N=1C(NC=2C=CC(N)=CC=2)=NC(NC)=NC=1NC1=CC=C(N)C=C1 VVFMZHWAQNSESG-UHFFFAOYSA-N 0.000 description 1
- NJHOBWAEBBSZLP-UHFFFAOYSA-N 2-n,4-n-bis(4-aminophenyl)-6-n-phenyl-1,3,5-triazine-2,4,6-triamine Chemical compound C1=CC(N)=CC=C1NC1=NC(NC=2C=CC=CC=2)=NC(NC=2C=CC(N)=CC=2)=N1 NJHOBWAEBBSZLP-UHFFFAOYSA-N 0.000 description 1
- HUWXDEQWWKGHRV-UHFFFAOYSA-N 3,3'-Dichlorobenzidine Chemical group C1=C(Cl)C(N)=CC=C1C1=CC=C(N)C(Cl)=C1 HUWXDEQWWKGHRV-UHFFFAOYSA-N 0.000 description 1
- JRBJSXQPQWSCCF-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine Chemical group C1=C(N)C(OC)=CC(C=2C=C(OC)C(N)=CC=2)=C1 JRBJSXQPQWSCCF-UHFFFAOYSA-N 0.000 description 1
- SMDGQEQWSSYZKX-UHFFFAOYSA-N 3-(2,3-dicarboxyphenoxy)phthalic acid Chemical compound OC(=O)C1=CC=CC(OC=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O SMDGQEQWSSYZKX-UHFFFAOYSA-N 0.000 description 1
- NBAUUNCGSMAPFM-UHFFFAOYSA-N 3-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=CC(C(O)=O)=C1C(O)=O NBAUUNCGSMAPFM-UHFFFAOYSA-N 0.000 description 1
- HCILJBJJZALOAL-UHFFFAOYSA-N 3-(3,5-ditert-butyl-4-hydroxyphenyl)-n'-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyl]propanehydrazide Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)NNC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 HCILJBJJZALOAL-UHFFFAOYSA-N 0.000 description 1
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 1
- ZMPZWXKBGSQATE-UHFFFAOYSA-N 3-(4-aminophenyl)sulfonylaniline Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=CC(N)=C1 ZMPZWXKBGSQATE-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- ZDBWYUOUYNQZBM-UHFFFAOYSA-N 3-(aminomethyl)aniline Chemical compound NCC1=CC=CC(N)=C1 ZDBWYUOUYNQZBM-UHFFFAOYSA-N 0.000 description 1
- TYKLCAKICHXQNE-UHFFFAOYSA-N 3-[(2,3-dicarboxyphenyl)methyl]phthalic acid Chemical compound OC(=O)C1=CC=CC(CC=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O TYKLCAKICHXQNE-UHFFFAOYSA-N 0.000 description 1
- CKOFBUUFHALZGK-UHFFFAOYSA-N 3-[(3-aminophenyl)methyl]aniline Chemical compound NC1=CC=CC(CC=2C=C(N)C=CC=2)=C1 CKOFBUUFHALZGK-UHFFFAOYSA-N 0.000 description 1
- BXWSFKFIZQTMIG-UHFFFAOYSA-N 3-[2,5-di(propan-2-yl)phenyl]aniline Chemical compound NC=1C=C(C=CC=1)C1=C(C=CC(=C1)C(C)C)C(C)C BXWSFKFIZQTMIG-UHFFFAOYSA-N 0.000 description 1
- DFSUKONUQMHUKQ-UHFFFAOYSA-N 3-[2-(2,3-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phthalic acid Chemical compound OC(=O)C1=CC=CC(C(C=2C(=C(C(O)=O)C=CC=2)C(O)=O)(C(F)(F)F)C(F)(F)F)=C1C(O)=O DFSUKONUQMHUKQ-UHFFFAOYSA-N 0.000 description 1
- PAHZZOIHRHCHTH-UHFFFAOYSA-N 3-[2-(2,3-dicarboxyphenyl)propan-2-yl]phthalic acid Chemical compound C=1C=CC(C(O)=O)=C(C(O)=O)C=1C(C)(C)C1=CC=CC(C(O)=O)=C1C(O)=O PAHZZOIHRHCHTH-UHFFFAOYSA-N 0.000 description 1
- UVUCUHVQYAPMEU-UHFFFAOYSA-N 3-[2-(3-aminophenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]aniline Chemical compound NC1=CC=CC(C(C=2C=C(N)C=CC=2)(C(F)(F)F)C(F)(F)F)=C1 UVUCUHVQYAPMEU-UHFFFAOYSA-N 0.000 description 1
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 description 1
- UCQABCHSIIXVOY-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]phenoxy]aniline Chemical group NC1=CC=CC(OC=2C=CC(=CC=2)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 UCQABCHSIIXVOY-UHFFFAOYSA-N 0.000 description 1
- WCXGOVYROJJXHA-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)S(=O)(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 WCXGOVYROJJXHA-UHFFFAOYSA-N 0.000 description 1
- GPXCORHXFPYJEH-UHFFFAOYSA-N 3-[[3-aminopropyl(dimethyl)silyl]oxy-dimethylsilyl]propan-1-amine Chemical compound NCCC[Si](C)(C)O[Si](C)(C)CCCN GPXCORHXFPYJEH-UHFFFAOYSA-N 0.000 description 1
- VQZRLBWPEHFGCD-UHFFFAOYSA-N 3-chloro-4-methylphenol Chemical compound CC1=CC=C(O)C=C1Cl VQZRLBWPEHFGCD-UHFFFAOYSA-N 0.000 description 1
- WECDUOXQLAIPQW-UHFFFAOYSA-N 4,4'-Methylene bis(2-methylaniline) Chemical compound C1=C(N)C(C)=CC(CC=2C=C(C)C(N)=CC=2)=C1 WECDUOXQLAIPQW-UHFFFAOYSA-N 0.000 description 1
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- FYYYKXFEKMGYLZ-UHFFFAOYSA-N 4-(1,3-dioxo-2-benzofuran-5-yl)-2-benzofuran-1,3-dione Chemical compound C=1C=C2C(=O)OC(=O)C2=CC=1C1=CC=CC2=C1C(=O)OC2=O FYYYKXFEKMGYLZ-UHFFFAOYSA-N 0.000 description 1
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 1
- AIVVXPSKEVWKMY-UHFFFAOYSA-N 4-(3,4-dicarboxyphenoxy)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C(C(O)=O)=C1 AIVVXPSKEVWKMY-UHFFFAOYSA-N 0.000 description 1
- LFBALUPVVFCEPA-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C(C(O)=O)=C1 LFBALUPVVFCEPA-UHFFFAOYSA-N 0.000 description 1
- FWOLORXQTIGHFX-UHFFFAOYSA-N 4-(4-amino-2,3,5,6-tetrafluorophenyl)-2,3,5,6-tetrafluoroaniline Chemical compound FC1=C(F)C(N)=C(F)C(F)=C1C1=C(F)C(F)=C(N)C(F)=C1F FWOLORXQTIGHFX-UHFFFAOYSA-N 0.000 description 1
- LVNPGQZSPDFZNC-UHFFFAOYSA-N 4-(4-amino-3-fluorophenyl)-2-fluoroaniline Chemical group C1=C(F)C(N)=CC=C1C1=CC=C(N)C(F)=C1 LVNPGQZSPDFZNC-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- OPVHOFITDJSMOD-UHFFFAOYSA-N 4-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C=1C=C2C(=O)OC(=O)C2=CC=1OC1=CC=CC2=C1C(=O)OC2=O OPVHOFITDJSMOD-UHFFFAOYSA-N 0.000 description 1
- IWXCYYWDGDDPAC-UHFFFAOYSA-N 4-[(3,4-dicarboxyphenyl)methyl]phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1CC1=CC=C(C(O)=O)C(C(O)=O)=C1 IWXCYYWDGDDPAC-UHFFFAOYSA-N 0.000 description 1
- NWIVYGKSHSJHEF-UHFFFAOYSA-N 4-[(4-amino-3,5-diethylphenyl)methyl]-2,6-diethylaniline Chemical compound CCC1=C(N)C(CC)=CC(CC=2C=C(CC)C(N)=C(CC)C=2)=C1 NWIVYGKSHSJHEF-UHFFFAOYSA-N 0.000 description 1
- JHCBFGGESJQAIQ-UHFFFAOYSA-N 4-[(4-amino-3,5-dimethylcyclohexyl)methyl]-2,6-dimethylcyclohexan-1-amine Chemical compound C1C(C)C(N)C(C)CC1CC1CC(C)C(N)C(C)C1 JHCBFGGESJQAIQ-UHFFFAOYSA-N 0.000 description 1
- WRHWAMDMJJKFGE-UHFFFAOYSA-N 4-[1-(4-amino-2,6-dimethylphenyl)cyclohexyl]-3,5-dimethylaniline Chemical compound CC1=CC(N)=CC(C)=C1C1(C=2C(=CC(N)=CC=2C)C)CCCCC1 WRHWAMDMJJKFGE-UHFFFAOYSA-N 0.000 description 1
- PEYSAGKJPINAKO-UHFFFAOYSA-N 4-[1-(4-amino-2,6-dimethylphenyl)cyclopentyl]-3,5-dimethylaniline Chemical compound CC1=CC(N)=CC(C)=C1C1(C=2C(=CC(N)=CC=2C)C)CCCC1 PEYSAGKJPINAKO-UHFFFAOYSA-N 0.000 description 1
- RWUGELXRQKAJBW-UHFFFAOYSA-N 4-[1-(4-aminophenyl)-4-methylcyclohexyl]aniline Chemical compound C1CC(C)CCC1(C=1C=CC(N)=CC=1)C1=CC=C(N)C=C1 RWUGELXRQKAJBW-UHFFFAOYSA-N 0.000 description 1
- ZSQIQUAKDNTQOI-UHFFFAOYSA-N 4-[1-(4-aminophenyl)cyclohexyl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)CCCCC1 ZSQIQUAKDNTQOI-UHFFFAOYSA-N 0.000 description 1
- BCTLWCGIKWKCHT-UHFFFAOYSA-N 4-[1-(4-aminophenyl)cyclopentyl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)CCCC1 BCTLWCGIKWKCHT-UHFFFAOYSA-N 0.000 description 1
- LFPSXZKZDTWTLQ-UHFFFAOYSA-N 4-[2,5-di(propan-2-yl)phenyl]-3,5-dimethylaniline Chemical compound CC1=C(C(=CC(=C1)N)C)C1=C(C=CC(=C1)C(C)C)C(C)C LFPSXZKZDTWTLQ-UHFFFAOYSA-N 0.000 description 1
- ZYBXDYLDYAUMMZ-UHFFFAOYSA-N 4-[2,5-di(propan-2-yl)phenyl]-3-methylaniline Chemical compound CC1=C(C=CC(=C1)N)C1=C(C=CC(=C1)C(C)C)C(C)C ZYBXDYLDYAUMMZ-UHFFFAOYSA-N 0.000 description 1
- YRQAZBUGCAVQSM-UHFFFAOYSA-N 4-[2,6-di(propan-2-yl)phenyl]-3-methylaniline Chemical compound CC1=C(C=CC(=C1)N)C1=C(C=CC=C1C(C)C)C(C)C YRQAZBUGCAVQSM-UHFFFAOYSA-N 0.000 description 1
- APXJLYIVOFARRM-UHFFFAOYSA-N 4-[2-(3,4-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(C(O)=O)C(C(O)=O)=C1 APXJLYIVOFARRM-UHFFFAOYSA-N 0.000 description 1
- GEYAGBVEAJGCFB-UHFFFAOYSA-N 4-[2-(3,4-dicarboxyphenyl)propan-2-yl]phthalic acid Chemical compound C=1C=C(C(O)=O)C(C(O)=O)=CC=1C(C)(C)C1=CC=C(C(O)=O)C(C(O)=O)=C1 GEYAGBVEAJGCFB-UHFFFAOYSA-N 0.000 description 1
- KJWOTXALLNAXDI-UHFFFAOYSA-N 4-[2-(4,4-diaminocyclohexyl)propan-2-yl]cyclohexane-1,1-diamine Chemical compound C1CC(N)(N)CCC1C(C)(C)C1CCC(N)(N)CC1 KJWOTXALLNAXDI-UHFFFAOYSA-N 0.000 description 1
- RANGGKKHMBKOET-UHFFFAOYSA-N 4-[2-(4-amino-2,6-dimethylphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-3,5-dimethylaniline Chemical compound CC1=CC(N)=CC(C)=C1C(C(F)(F)F)(C(F)(F)F)C1=C(C)C=C(N)C=C1C RANGGKKHMBKOET-UHFFFAOYSA-N 0.000 description 1
- HBMBBSULJHNQND-UHFFFAOYSA-N 4-[2-(4-amino-2,6-dimethylphenyl)propan-2-yl]-3,5-dimethylaniline Chemical compound CC1=CC(N)=CC(C)=C1C(C)(C)C1=C(C)C=C(N)C=C1C HBMBBSULJHNQND-UHFFFAOYSA-N 0.000 description 1
- OFJKURCIVAXGLM-UHFFFAOYSA-N 4-[2-(4-amino-2-methylphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-3-methylaniline Chemical compound CC1=CC(N)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(N)C=C1C OFJKURCIVAXGLM-UHFFFAOYSA-N 0.000 description 1
- ACTDVAZSNGEBDK-UHFFFAOYSA-N 4-[2-(4-amino-2-methylphenyl)propan-2-yl]-3-methylaniline Chemical compound CC1=CC(N)=CC=C1C(C)(C)C1=CC=C(N)C=C1C ACTDVAZSNGEBDK-UHFFFAOYSA-N 0.000 description 1
- FDTGYANHAMAOCF-UHFFFAOYSA-N 4-[2-(4-amino-3,5-dimethylphenyl)propan-2-yl]-2,6-dimethylaniline Chemical compound CC1=C(N)C(C)=CC(C(C)(C)C=2C=C(C)C(N)=C(C)C=2)=C1 FDTGYANHAMAOCF-UHFFFAOYSA-N 0.000 description 1
- UBKRDXUXTYBRHS-UHFFFAOYSA-N 4-[2-(4-amino-3-methylphenyl)propan-2-yl]-2-methylaniline Chemical compound C1=C(N)C(C)=CC(C(C)(C)C=2C=C(C)C(N)=CC=2)=C1 UBKRDXUXTYBRHS-UHFFFAOYSA-N 0.000 description 1
- UHNUHZHQLCGZDA-UHFFFAOYSA-N 4-[2-(4-aminophenyl)ethyl]aniline Chemical compound C1=CC(N)=CC=C1CCC1=CC=C(N)C=C1 UHNUHZHQLCGZDA-UHFFFAOYSA-N 0.000 description 1
- KWOIWTRRPFHBSI-UHFFFAOYSA-N 4-[2-[3-[2-(4-aminophenyl)propan-2-yl]phenyl]propan-2-yl]aniline Chemical compound C=1C=CC(C(C)(C)C=2C=CC(N)=CC=2)=CC=1C(C)(C)C1=CC=C(N)C=C1 KWOIWTRRPFHBSI-UHFFFAOYSA-N 0.000 description 1
- HESXPOICBNWMPI-UHFFFAOYSA-N 4-[2-[4-[2-(4-aminophenyl)propan-2-yl]phenyl]propan-2-yl]aniline Chemical compound C=1C=C(C(C)(C)C=2C=CC(N)=CC=2)C=CC=1C(C)(C)C1=CC=C(N)C=C1 HESXPOICBNWMPI-UHFFFAOYSA-N 0.000 description 1
- KZMTYFMJCSYKHH-UHFFFAOYSA-N 4-[3-(4-amino-2,6-dimethylphenoxy)phenoxy]-3,5-dimethylaniline Chemical compound CC1=CC(N)=CC(C)=C1OC1=CC=CC(OC=2C(=CC(N)=CC=2C)C)=C1 KZMTYFMJCSYKHH-UHFFFAOYSA-N 0.000 description 1
- FOIWBFYRXOQRGB-UHFFFAOYSA-N 4-[3-(4-amino-2-methylphenoxy)phenoxy]-3-methylaniline Chemical compound CC1=CC(N)=CC=C1OC1=CC=CC(OC=2C(=CC(N)=CC=2)C)=C1 FOIWBFYRXOQRGB-UHFFFAOYSA-N 0.000 description 1
- POHSBAWMFKOXAO-UHFFFAOYSA-N 4-[4-(4-amino-2,6-dimethylphenoxy)phenoxy]-3,5-dimethylaniline Chemical compound CC1=CC(N)=CC(C)=C1OC(C=C1)=CC=C1OC1=C(C)C=C(N)C=C1C POHSBAWMFKOXAO-UHFFFAOYSA-N 0.000 description 1
- DDSQHEVPXHYXQA-UHFFFAOYSA-N 4-[4-(4-amino-2-methylphenoxy)phenoxy]-3-methylaniline Chemical compound CC1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1C DDSQHEVPXHYXQA-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- ZOSGUGPCHQCZLQ-UHFFFAOYSA-N 4-[4-[2-[4-(4-amino-2,6-dimethylphenoxy)phenyl]propan-2-yl]phenoxy]-3,5-dimethylaniline Chemical compound CC1=CC(N)=CC(C)=C1OC1=CC=C(C(C)(C)C=2C=CC(OC=3C(=CC(N)=CC=3C)C)=CC=2)C=C1 ZOSGUGPCHQCZLQ-UHFFFAOYSA-N 0.000 description 1
- LWBRZNUKEWNVFK-UHFFFAOYSA-N 4-[4-[2-[4-(4-amino-2-methylphenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]-3-methylaniline Chemical compound CC1=CC(N)=CC=C1OC1=CC=C(C(C=2C=CC(OC=3C(=CC(N)=CC=3)C)=CC=2)(C(F)(F)F)C(F)(F)F)C=C1 LWBRZNUKEWNVFK-UHFFFAOYSA-N 0.000 description 1
- QYUVGKUUESYJAC-UHFFFAOYSA-N 4-[4-[2-[4-(4-amino-2-methylphenoxy)phenyl]propan-2-yl]phenoxy]-3-methylaniline Chemical compound CC1=CC(N)=CC=C1OC1=CC=C(C(C)(C)C=2C=CC(OC=3C(=CC(N)=CC=3)C)=CC=2)C=C1 QYUVGKUUESYJAC-UHFFFAOYSA-N 0.000 description 1
- HHLMWQDRYZAENA-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)(C(F)(F)F)C(F)(F)F)C=C1 HHLMWQDRYZAENA-UHFFFAOYSA-N 0.000 description 1
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 1
- RXDGBDXBSFRISF-UHFFFAOYSA-N 4-[4-[4-(4-amino-2,6-dimethylphenoxy)phenoxy]phenoxy]-3,5-dimethylaniline Chemical compound CC1=CC(N)=CC(C)=C1OC(C=C1)=CC=C1OC(C=C1)=CC=C1OC1=C(C)C=C(N)C=C1C RXDGBDXBSFRISF-UHFFFAOYSA-N 0.000 description 1
- XPHHINYYCVOLSQ-UHFFFAOYSA-N 4-[4-[4-(4-amino-2,6-dimethylphenoxy)phenyl]phenoxy]-3,5-dimethylaniline Chemical group CC1=CC(N)=CC(C)=C1OC1=CC=C(C=2C=CC(OC=3C(=CC(N)=CC=3C)C)=CC=2)C=C1 XPHHINYYCVOLSQ-UHFFFAOYSA-N 0.000 description 1
- PCIPVSALKHKUJH-UHFFFAOYSA-N 4-[4-[4-(4-amino-2,6-dimethylphenoxy)phenyl]sulfonylphenoxy]-3,5-dimethylaniline Chemical compound CC1=CC(N)=CC(C)=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C(=CC(N)=CC=3C)C)=CC=2)C=C1 PCIPVSALKHKUJH-UHFFFAOYSA-N 0.000 description 1
- TVEKTXAGPGQDDB-UHFFFAOYSA-N 4-[4-[4-(4-amino-2-methylphenoxy)phenyl]phenoxy]-3-methylaniline Chemical group CC1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C(=CC(N)=CC=3)C)=CC=2)C=C1 TVEKTXAGPGQDDB-UHFFFAOYSA-N 0.000 description 1
- LDFYRFKAYFZVNH-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenoxy]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 LDFYRFKAYFZVNH-UHFFFAOYSA-N 0.000 description 1
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 description 1
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 1
- AUPIFOPXTAGGSW-UHFFFAOYSA-N 4-[4-[9-[4-(4-aminophenoxy)phenyl]fluoren-9-yl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 AUPIFOPXTAGGSW-UHFFFAOYSA-N 0.000 description 1
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 description 1
- VSAWBBYYMBQKIK-UHFFFAOYSA-N 4-[[3,5-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-2,4,6-trimethylphenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC1=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 VSAWBBYYMBQKIK-UHFFFAOYSA-N 0.000 description 1
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 1
- KLJIZZMOILSDAU-UHFFFAOYSA-N 4-n,6-n-bis(3-aminophenyl)-2-n,2-n-dimethyl-1,3,5-triazine-2,4,6-triamine Chemical compound N=1C(NC=2C=C(N)C=CC=2)=NC(N(C)C)=NC=1NC1=CC=CC(N)=C1 KLJIZZMOILSDAU-UHFFFAOYSA-N 0.000 description 1
- VVFOYXKVDBHIFK-UHFFFAOYSA-N 4-n,6-n-bis(4-aminophenyl)-2-n,2-n-dibenzyl-1,3,5-triazine-2,4,6-triamine Chemical compound C1=CC(N)=CC=C1NC1=NC(NC=2C=CC(N)=CC=2)=NC(N(CC=2C=CC=CC=2)CC=2C=CC=CC=2)=N1 VVFOYXKVDBHIFK-UHFFFAOYSA-N 0.000 description 1
- YKJPECCEOMWBPO-UHFFFAOYSA-N 4-n,6-n-bis(4-aminophenyl)-2-n,2-n-dibutyl-1,3,5-triazine-2,4,6-triamine Chemical compound N=1C(NC=2C=CC(N)=CC=2)=NC(N(CCCC)CCCC)=NC=1NC1=CC=C(N)C=C1 YKJPECCEOMWBPO-UHFFFAOYSA-N 0.000 description 1
- UWVXHTPIZDLJFV-UHFFFAOYSA-N 4-n,6-n-bis(4-aminophenyl)-2-n,2-n-diethyl-1,3,5-triazine-2,4,6-triamine Chemical compound N=1C(NC=2C=CC(N)=CC=2)=NC(N(CC)CC)=NC=1NC1=CC=C(N)C=C1 UWVXHTPIZDLJFV-UHFFFAOYSA-N 0.000 description 1
- XYNWBGOVBMXUKZ-UHFFFAOYSA-N 4-n,6-n-bis(4-aminophenyl)-2-n,2-n-dimethyl-1,3,5-triazine-2,4,6-triamine Chemical compound N=1C(NC=2C=CC(N)=CC=2)=NC(N(C)C)=NC=1NC1=CC=C(N)C=C1 XYNWBGOVBMXUKZ-UHFFFAOYSA-N 0.000 description 1
- UFRVEHTYMVBEMA-UHFFFAOYSA-N 4-n,6-n-bis(4-aminophenyl)-2-n,2-n-diphenyl-1,3,5-triazine-2,4,6-triamine Chemical compound C1=CC(N)=CC=C1NC1=NC(NC=2C=CC(N)=CC=2)=NC(N(C=2C=CC=CC=2)C=2C=CC=CC=2)=N1 UFRVEHTYMVBEMA-UHFFFAOYSA-N 0.000 description 1
- KGSLNEDEXIVDEK-UHFFFAOYSA-N 4-n,6-n-bis(4-aminophenyl)-2-n-naphthalen-1-yl-1,3,5-triazine-2,4,6-triamine Chemical compound C1=CC(N)=CC=C1NC1=NC(NC=2C=CC(N)=CC=2)=NC(NC=2C3=CC=CC=C3C=CC=2)=N1 KGSLNEDEXIVDEK-UHFFFAOYSA-N 0.000 description 1
- YGYCECQIOXZODZ-UHFFFAOYSA-N 4415-87-6 Chemical compound O=C1OC(=O)C2C1C1C(=O)OC(=O)C12 YGYCECQIOXZODZ-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- DMXHDELFBVERIB-UHFFFAOYSA-N 5-(2,5-dioxooxolan-3-yl)-3-methylcyclohex-3-ene-1,2-dicarbaldehyde Chemical compound C1C(C=O)C(C=O)C(C)=CC1C1C(=O)OC(=O)C1 DMXHDELFBVERIB-UHFFFAOYSA-N 0.000 description 1
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 1
- QHHKLPCQTTWFSS-UHFFFAOYSA-N 5-[2-(1,3-dioxo-2-benzofuran-5-yl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)(C(F)(F)F)C(F)(F)F)=C1 QHHKLPCQTTWFSS-UHFFFAOYSA-N 0.000 description 1
- HJSYPLCSZPEDCQ-UHFFFAOYSA-N 5-[2-(3-amino-4-methylphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-methylaniline Chemical compound C1=C(N)C(C)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(C)C(N)=C1 HJSYPLCSZPEDCQ-UHFFFAOYSA-N 0.000 description 1
- ZVVFVKJZNVSANF-UHFFFAOYSA-N 6-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]hexyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCCCCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 ZVVFVKJZNVSANF-UHFFFAOYSA-N 0.000 description 1
- BGEVROQFKHXUQA-UHFFFAOYSA-N 71012-25-4 Chemical group C12=CC=CC=C2C2=CC=CC=C2C2=C1C1=CC=CC=C1N2 BGEVROQFKHXUQA-UHFFFAOYSA-N 0.000 description 1
- BZHCVCNZIJZMRN-UHFFFAOYSA-N 9h-pyridazino[3,4-b]indole Chemical group N1=CC=C2C3=CC=CC=C3NC2=N1 BZHCVCNZIJZMRN-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 238000012935 Averaging Methods 0.000 description 1
- TYHNSHLZZJYENC-UHFFFAOYSA-N CC(C)N(C(c1ccc(C(C(F)(F)F)(C(F)(F)F)c(cc2C(N3c(cc4C(F)(F)F)ccc4-c4ccc(C(C)(C)C)cc4C(F)(F)F)=O)ccc2C3=O)cc11)=O)C1=O Chemical compound CC(C)N(C(c1ccc(C(C(F)(F)F)(C(F)(F)F)c(cc2C(N3c(cc4C(F)(F)F)ccc4-c4ccc(C(C)(C)C)cc4C(F)(F)F)=O)ccc2C3=O)cc11)=O)C1=O TYHNSHLZZJYENC-UHFFFAOYSA-N 0.000 description 1
- XADGRYXJUADPCC-UHFFFAOYSA-N CC(C)c1ccc(C2(c3ccccc3-c3c2cccc3)c(cc2)ccc2N(C(c(c2c3)ccc3Oc(cc3)cc(C(N4C(C)(C)C)=O)c3C4=O)=O)C2=O)cc1 Chemical compound CC(C)c1ccc(C2(c3ccccc3-c3c2cccc3)c(cc2)ccc2N(C(c(c2c3)ccc3Oc(cc3)cc(C(N4C(C)(C)C)=O)c3C4=O)=O)C2=O)cc1 XADGRYXJUADPCC-UHFFFAOYSA-N 0.000 description 1
- FOYSPKZBBGNZHL-UHFFFAOYSA-N CC(C)c1cccc(C(C)C)c1-c1cccc(N)c1 Chemical compound CC(C)c1cccc(C(C)C)c1-c1cccc(N)c1 FOYSPKZBBGNZHL-UHFFFAOYSA-N 0.000 description 1
- VITPRZWSTPZGHF-UHFFFAOYSA-N CCC(C)(C)CC(C1)C2CC1C(CN(C(c(c1c3)cc(C(N4C(C)C)=O)c3C4=O)=O)C1=O)C2 Chemical compound CCC(C)(C)CC(C1)C2CC1C(CN(C(c(c1c3)cc(C(N4C(C)C)=O)c3C4=O)=O)C1=O)C2 VITPRZWSTPZGHF-UHFFFAOYSA-N 0.000 description 1
- HLXCOCPVFXTTDU-UHFFFAOYSA-N CCC(C)(C)c1cccc(S(c2cc(N(C(C(CC3C(N4C(C)(C)CC[IH]#CC)=O)C5CC3C4=O)=O)C5=O)ccc2)(=O)=O)c1 Chemical compound CCC(C)(C)c1cccc(S(c2cc(N(C(C(CC3C(N4C(C)(C)CC[IH]#CC)=O)C5CC3C4=O)=O)C5=O)ccc2)(=O)=O)c1 HLXCOCPVFXTTDU-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- ZPAKUZKMGJJMAA-UHFFFAOYSA-N Cyclohexane-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)C1CC(C(O)=O)C(C(O)=O)CC1C(O)=O ZPAKUZKMGJJMAA-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- SUAKHGWARZSWIH-UHFFFAOYSA-N N,N‐diethylformamide Chemical compound CCN(CC)C=O SUAKHGWARZSWIH-UHFFFAOYSA-N 0.000 description 1
- ZWXPDGCFMMFNRW-UHFFFAOYSA-N N-methylcaprolactam Chemical compound CN1CCCCCC1=O ZWXPDGCFMMFNRW-UHFFFAOYSA-N 0.000 description 1
- RYDHNUSLLLLJMV-UHFFFAOYSA-N NC=1C=C(NC2N(C(=NC(=N2)NC2=CC(=CC=C2)N)C)N)C=CC=1 Chemical compound NC=1C=C(NC2N(C(=NC(=N2)NC2=CC(=CC=C2)N)C)N)C=CC=1 RYDHNUSLLLLJMV-UHFFFAOYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical group C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical group C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical group C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- RHQDFWAXVIIEBN-UHFFFAOYSA-N Trifluoroethanol Chemical compound OCC(F)(F)F RHQDFWAXVIIEBN-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical group C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 description 1
- AHWXCYJGJOLNFA-UHFFFAOYSA-N [1,4]benzoxazino[2,3-b]phenoxazine Chemical group O1C2=CC=CC=C2N=C2C1=CC1=NC3=CC=CC=C3OC1=C2 AHWXCYJGJOLNFA-UHFFFAOYSA-N 0.000 description 1
- GKCJKWZPLMKVIF-UHFFFAOYSA-N [1-(aminomethyl)-4-[2-[4,4-bis(aminomethyl)cyclohexyl]propan-2-yl]cyclohexyl]methanamine Chemical compound C1CC(CN)(CN)CCC1C(C)(C)C1CCC(CN)(CN)CC1 GKCJKWZPLMKVIF-UHFFFAOYSA-N 0.000 description 1
- NHMCVXVQQCMMMN-UHFFFAOYSA-N [1]benzofuro[3,2-c]pyridazine Chemical group C1=NN=C2C3=CC=CC=C3OC2=C1 NHMCVXVQQCMMMN-UHFFFAOYSA-N 0.000 description 1
- KEUCYUPOICDBOG-UHFFFAOYSA-N [2-(aminomethyl)-5-bicyclo[2.2.1]heptanyl]methanamine Chemical compound C1C2C(CN)CC1C(CN)C2 KEUCYUPOICDBOG-UHFFFAOYSA-N 0.000 description 1
- RPYFJVIASOJLJS-UHFFFAOYSA-N [3-(aminomethyl)-2-bicyclo[2.2.1]heptanyl]methanamine Chemical compound C1CC2C(CN)C(CN)C1C2 RPYFJVIASOJLJS-UHFFFAOYSA-N 0.000 description 1
- OTKFKCIRTBTDKK-UHFFFAOYSA-N [3-(aminomethyl)-5-bicyclo[2.2.1]heptanyl]methanamine Chemical compound C1C(CN)C2C(CN)CC1C2 OTKFKCIRTBTDKK-UHFFFAOYSA-N 0.000 description 1
- QLBRROYTTDFLDX-UHFFFAOYSA-N [3-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCCC(CN)C1 QLBRROYTTDFLDX-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 125000004062 acenaphthenyl group Chemical group C1(CC2=CC=CC3=CC=CC1=C23)* 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 150000003855 acyl compounds Chemical class 0.000 description 1
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000008055 alkyl aryl sulfonates Chemical class 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 229940072049 amyl acetate Drugs 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- PGMYKACGEOXYJE-UHFFFAOYSA-N anhydrous amyl acetate Natural products CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 description 1
- 125000005577 anthracene group Chemical group 0.000 description 1
- 125000003828 azulenyl group Chemical group 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 150000001555 benzenes Chemical class 0.000 description 1
- 125000003785 benzimidazolyl group Chemical group N1=C(NC2=C1C=CC=C2)* 0.000 description 1
- MFMVRILBADIIJO-UHFFFAOYSA-N benzo[e][1]benzofuran Chemical group C1=CC=C2C(C=CO3)=C3C=CC2=C1 MFMVRILBADIIJO-UHFFFAOYSA-N 0.000 description 1
- LJOLGGXHRVADAA-UHFFFAOYSA-N benzo[e][1]benzothiole Chemical group C1=CC=C2C(C=CS3)=C3C=CC2=C1 LJOLGGXHRVADAA-UHFFFAOYSA-N 0.000 description 1
- WZJYKHNJTSNBHV-UHFFFAOYSA-N benzo[h]quinoline Chemical group C1=CN=C2C3=CC=CC=C3C=CC2=C1 WZJYKHNJTSNBHV-UHFFFAOYSA-N 0.000 description 1
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical group C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- BKDVBBSUAGJUBA-UHFFFAOYSA-N bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic acid Chemical compound C1=CC2C(C(O)=O)C(C(=O)O)C1C(C(O)=O)C2C(O)=O BKDVBBSUAGJUBA-UHFFFAOYSA-N 0.000 description 1
- XQBSPQLKNWMPMG-UHFFFAOYSA-N bicyclo[2.2.2]octane-2,3,5,6-tetracarboxylic acid Chemical compound C1CC2C(C(O)=O)C(C(=O)O)C1C(C(O)=O)C2C(O)=O XQBSPQLKNWMPMG-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- TUQQUUXMCKXGDI-UHFFFAOYSA-N bis(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(N)C=CC=2)=C1 TUQQUUXMCKXGDI-UHFFFAOYSA-N 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 125000000707 boryl group Chemical group B* 0.000 description 1
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001734 carboxylic acid salts Chemical class 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 229960000541 cetyl alcohol Drugs 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 125000005578 chrysene group Chemical group 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- PQRHREUWMOAJOW-UHFFFAOYSA-N ctk1a6096 Chemical class N[SiH](N)[SiH3] PQRHREUWMOAJOW-UHFFFAOYSA-N 0.000 description 1
- NXYLTUWDTBZQGX-UHFFFAOYSA-N ctk8h6630 Chemical group C1=CC=C2C=C3C(N=C4C=CC=5C(C4=N4)=CC6=CC=CC=C6C=5)=C4C=CC3=CC2=C1 NXYLTUWDTBZQGX-UHFFFAOYSA-N 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- CURBACXRQKTCKZ-UHFFFAOYSA-N cyclobutane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1C(C(O)=O)C(C(O)=O)C1C(O)=O CURBACXRQKTCKZ-UHFFFAOYSA-N 0.000 description 1
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000000582 cycloheptyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000000640 cyclooctyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- CGLMUPXSUKWUSQ-UHFFFAOYSA-N cyclopentane-1,2,3,4-tetracarbaldehyde Chemical compound O=CC1CC(C=O)C(C=O)C1C=O CGLMUPXSUKWUSQ-UHFFFAOYSA-N 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- IYYZUPMFVPLQIF-ALWQSETLSA-N dibenzothiophene Chemical group C1=CC=CC=2[34S]C3=C(C=21)C=CC=C3 IYYZUPMFVPLQIF-ALWQSETLSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- JMGZBMRVDHKMKB-UHFFFAOYSA-L disodium;2-sulfobutanedioate Chemical compound [Na+].[Na+].OS(=O)(=O)C(C([O-])=O)CC([O-])=O JMGZBMRVDHKMKB-UHFFFAOYSA-L 0.000 description 1
- 238000011978 dissolution method Methods 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 125000006575 electron-withdrawing group Chemical group 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- AIJZIRPGCQPZSL-UHFFFAOYSA-N ethylenetetracarboxylic acid Chemical compound OC(=O)C(C(O)=O)=C(C(O)=O)C(O)=O AIJZIRPGCQPZSL-UHFFFAOYSA-N 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- WBJINCZRORDGAQ-UHFFFAOYSA-N formic acid ethyl ester Natural products CCOC=O WBJINCZRORDGAQ-UHFFFAOYSA-N 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- MNWFXJYAOYHMED-UHFFFAOYSA-M heptanoate Chemical compound CCCCCCC([O-])=O MNWFXJYAOYHMED-UHFFFAOYSA-M 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- VPUGDVKSAQVFFS-UHFFFAOYSA-N hexabenzobenzene Chemical group C1=C(C2=C34)C=CC3=CC=C(C=C3)C4=C4C3=CC=C(C=C3)C4=C2C3=C1 VPUGDVKSAQVFFS-UHFFFAOYSA-N 0.000 description 1
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 1
- 230000036571 hydration Effects 0.000 description 1
- 238000006703 hydration reaction Methods 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000000415 inactivating effect Effects 0.000 description 1
- VVVPGLRKXQSQSZ-UHFFFAOYSA-N indolo[3,2-c]carbazole Chemical group C1=CC=CC2=NC3=C4C5=CC=CC=C5N=C4C=CC3=C21 VVVPGLRKXQSQSZ-UHFFFAOYSA-N 0.000 description 1
- 125000001041 indolyl group Chemical group 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 229960004592 isopropanol Drugs 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000002183 isoquinolinyl group Chemical group C1(=NC=CC2=CC=CC=C12)* 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000006224 matting agent Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000010534 mechanism of action Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- AJFDBNQQDYLMJN-UHFFFAOYSA-N n,n-diethylacetamide Chemical compound CCN(CC)C(C)=O AJFDBNQQDYLMJN-UHFFFAOYSA-N 0.000 description 1
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 1
- GOGZBMRXLADNEV-UHFFFAOYSA-N naphthalene-2,6-diamine Chemical compound C1=C(N)C=CC2=CC(N)=CC=C21 GOGZBMRXLADNEV-UHFFFAOYSA-N 0.000 description 1
- PAYSBLPSJQBEJR-UHFFFAOYSA-N naphtho[2,3-e][1]benzothiole Chemical group C1=CC=C2C=C3C(C=CS4)=C4C=CC3=CC2=C1 PAYSBLPSJQBEJR-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- MCSAJNNLRCFZED-UHFFFAOYSA-N nitroethane Chemical compound CC[N+]([O-])=O MCSAJNNLRCFZED-UHFFFAOYSA-N 0.000 description 1
- 125000002868 norbornyl group Chemical group C12(CCC(CC1)C2)* 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- KZAUOCCYDRDERY-UHFFFAOYSA-N oxamyl Chemical compound CNC(=O)ON=C(SC)C(=O)N(C)C KZAUOCCYDRDERY-UHFFFAOYSA-N 0.000 description 1
- 125000002971 oxazolyl group Chemical group 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 125000005582 pentacene group Chemical group 0.000 description 1
- JQQSUOJIMKJQHS-UHFFFAOYSA-N pentaphenyl group Chemical group C1=CC=CC2=CC3=CC=C4C=C5C=CC=CC5=CC4=C3C=C12 JQQSUOJIMKJQHS-UHFFFAOYSA-N 0.000 description 1
- 125000005327 perimidinyl group Chemical group N1C(=NC2=CC=CC3=CC=CC1=C23)* 0.000 description 1
- FVDOBFPYBSDRKH-UHFFFAOYSA-N perylene-3,4,9,10-tetracarboxylic acid Chemical compound C=12C3=CC=C(C(O)=O)C2=C(C(O)=O)C=CC=1C1=CC=C(C(O)=O)C2=C1C3=CC=C2C(=O)O FVDOBFPYBSDRKH-UHFFFAOYSA-N 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- 150000005107 phenanthrazines Chemical group 0.000 description 1
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical group C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 1
- RDOWQLZANAYVLL-UHFFFAOYSA-N phenanthridine Chemical group C1=CC=C2C3=CC=CC=C3C=NC2=C1 RDOWQLZANAYVLL-UHFFFAOYSA-N 0.000 description 1
- 125000001791 phenazinyl group Chemical group C1(=CC=CC2=NC3=CC=CC=C3N=C12)* 0.000 description 1
- NMPNTBQOLRXPGK-UHFFFAOYSA-N phenyl-(4-phenylmethoxyphenyl)methanone Chemical compound C=1C=C(OCC=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 NMPNTBQOLRXPGK-UHFFFAOYSA-N 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 125000001388 picenyl group Chemical group C1(=CC=CC2=CC=C3C4=CC=C5C=CC=CC5=C4C=CC3=C21)* 0.000 description 1
- CLYVDMAATCIVBF-UHFFFAOYSA-N pigment red 224 Chemical compound C=12C3=CC=C(C(OC4=O)=O)C2=C4C=CC=1C1=CC=C2C(=O)OC(=O)C4=CC=C3C1=C42 CLYVDMAATCIVBF-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- CPNGPNLZQNNVQM-UHFFFAOYSA-N pteridine Chemical group N1=CN=CC2=NC=CN=C21 CPNGPNLZQNNVQM-UHFFFAOYSA-N 0.000 description 1
- LNKHTYQPVMAJSF-UHFFFAOYSA-N pyranthrene Chemical group C1=C2C3=CC=CC=C3C=C(C=C3)C2=C2C3=CC3=C(C=CC=C4)C4=CC4=CC=C1C2=C34 LNKHTYQPVMAJSF-UHFFFAOYSA-N 0.000 description 1
- 125000003226 pyrazolyl group Chemical group 0.000 description 1
- DTPOQEUUHFQKSS-UHFFFAOYSA-N pyrrolo[2,1,5-cd]indolizine Chemical group C1=CC(N23)=CC=C3C=CC2=C1 DTPOQEUUHFQKSS-UHFFFAOYSA-N 0.000 description 1
- 125000000168 pyrrolyl group Chemical group 0.000 description 1
- 125000002943 quinolinyl group Chemical group N1=C(C=CC2=CC=CC=C12)* 0.000 description 1
- 125000001567 quinoxalinyl group Chemical group N1=C(C=NC2=CC=CC=C12)* 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011163 secondary particle Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- RLWYOEZLEULOLU-UHFFFAOYSA-M sodium;2,3,4-tri(propan-2-yl)naphthalene-1-sulfonate Chemical compound [Na+].C1=CC=CC2=C(C(C)C)C(C(C)C)=C(C(C)C)C(S([O-])(=O)=O)=C21 RLWYOEZLEULOLU-UHFFFAOYSA-M 0.000 description 1
- NQQAEGMIHXKSHR-UHFFFAOYSA-M sodium;2,3,4-tritert-butylnaphthalene-1-sulfonate Chemical compound [Na+].C1=CC=CC2=C(C(C)(C)C)C(C(C)(C)C)=C(C(C)(C)C)C(S([O-])(=O)=O)=C21 NQQAEGMIHXKSHR-UHFFFAOYSA-M 0.000 description 1
- HFQQZARZPUDIFP-UHFFFAOYSA-M sodium;2-dodecylbenzenesulfonate Chemical compound [Na+].CCCCCCCCCCCCC1=CC=CC=C1S([O-])(=O)=O HFQQZARZPUDIFP-UHFFFAOYSA-M 0.000 description 1
- AZXQLMRILCCVDW-UHFFFAOYSA-M sodium;5-propan-2-ylnaphthalene-1-sulfonate Chemical compound [Na+].C1=CC=C2C(C(C)C)=CC=CC2=C1S([O-])(=O)=O AZXQLMRILCCVDW-UHFFFAOYSA-M 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- LZOZLBFZGFLFBV-UHFFFAOYSA-N sulfene Chemical compound C=S(=O)=O LZOZLBFZGFLFBV-UHFFFAOYSA-N 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- OAXARSVKYJPDPA-UHFFFAOYSA-N tert-butyl 4-prop-2-ynylpiperazine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CCN(CC#C)CC1 OAXARSVKYJPDPA-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- VJYJJHQEVLEOFL-UHFFFAOYSA-N thieno[3,2-b]thiophene Chemical group S1C=CC2=C1C=CS2 VJYJJHQEVLEOFL-UHFFFAOYSA-N 0.000 description 1
- CRUIOQJBPNKOJG-UHFFFAOYSA-N thieno[3,2-e][1]benzothiole Chemical group C1=C2SC=CC2=C2C=CSC2=C1 CRUIOQJBPNKOJG-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 125000001425 triazolyl group Chemical group 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 125000005580 triphenylene group Chemical group 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- PXXNTAGJWPJAGM-UHFFFAOYSA-N vertaline Natural products C1C2C=3C=C(OC)C(OC)=CC=3OC(C=C3)=CC=C3CCC(=O)OC1CC1N2CCCC1 PXXNTAGJWPJAGM-UHFFFAOYSA-N 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
Definitions
- the present invention relates to an optical film manufacturing method and an optical film. More specifically, the present invention relates to a method for producing an optical film having excellent transparency and peelability during film formation, and an optical film.
- glass has been used as a base material constituting various display members such as solar cells and displays.
- glass has drawbacks such as being fragile and heavy, and does not have sufficient characteristics in response to recent demands for thinner, lighter, and more flexible displays. Therefore, in recent years, a method of applying a polyimide film using a polyimide resin as a transparent member of a flexible device instead of glass has been disclosed in, for example, US Pat. No. 8,207,256 and Japanese Patent Application Laid-Open No. 2008-163309. ..
- a polyimide precursor solution is applied onto a support, for example, a metal support, the solvent in the polyimide precursor solution is removed, and then the film is peeled off from the support as an autonomous film. Then, the obtained autonomous film is heated to imidize and produced, or a polyimide precursor solution is applied to a support and then heated to remove the solvent in the solution, and the polyimide precursor is imide.
- a method of obtaining the film as an autonomous film by peeling it from the support a method of applying a polyimide solution to the support, removing the solvent in the solution, and then peeling it from the support as an autonomous film. ing.
- the polyimide film obtained from the polyimide composition having the constitution disclosed in Patent Document 1 has a problem that the compatibility between the polyimide resin and the heterocyclic compound is poor and the formed film becomes cloudy. ..
- Patent Document 2 a method for producing a polyimide film using a polyimide-based varnish containing a polyimide-based polymer, an organic solvent, and water is disclosed (see, for example, Patent Document 2).
- a film having a good appearance and flexibility can be obtained by containing water in the range of 0.60 to 4.5% by mass in a polyimide varnish. ing.
- Patent Document 2 has a high water content in the polyimide varnish and causes cloudiness.
- the present invention has been made in view of the above problems and situations, and a solution thereof is to provide a method for producing an optical film and an optical film having excellent transparency and peelability during film formation.
- the present inventor has prepared a dope containing at least a polyimide resin, an organic solvent, water and an anionic water orientation accelerator as a method for producing an optical film.
- a dope containing at least a polyimide resin, an organic solvent, water and an anionic water orientation accelerator as a method for producing an optical film.
- a method for producing an optical film containing at least a polyimide resin It is a method of producing by controlling the distribution state of the anionic water orientation accelerator by using a dope containing at least a polyimide resin, an organic solvent, water and an anionic water orientation accelerator.
- a secondary ionic strength distribution curve derived from the anionic water orientation accelerator detected using a time-of-flight secondary ion mass spectrometer (TOF-SIMS) is created in the thickness direction of the optical film.
- the region S (%) in the film thickness direction in which the secondary ion intensity is 50% or more of the maximum value M with respect to the maximum value M of the secondary ion intensity distribution curve is in the range of 50 to 90% of the total film thickness.
- a method for producing an optical film which comprises producing under the conditions inside.
- it contains an anionic water orientation accelerator
- a secondary ionic strength distribution curve derived from the anionic water orientation accelerator detected using a time-of-flight secondary ion mass spectrometer (TOF-SIMS) is created in the thickness direction of the optical film
- the region S (%) in the film thickness direction in which the secondary ion intensity is 50% or more of the maximum value M with respect to the maximum value M of the secondary ion intensity distribution curve is in the range of 50 to 90% of the total film thickness.
- the polyimide resin has an acyclic group having an electron-withdrawing property in the side chain, or a cyclo ring, -CO-, -SO 2- , or -CR- (R represents a fluorene skeleton) in the main chain.
- the water is oriented to the surface of the polyimide film during peeling to promote the peeling, but the water remaining on the surface of the polyimide film is dried. Since it volatilizes, it does not contribute to the white turbidity of the finally produced polyimide film, and it is considered that the formation of the uneven structure on the surface of the polyimide film due to the volatilization of water also contributes to the improvement of transportability.
- the present inventor paid attention to the interaction between the polyimide resins and the interaction between the support used during film formation, for example, the metal support and the polyimide resin.
- the anionic group which is a hydrophilic group of the anionic water alignment accelerator, forms a network with highly polar water. Therefore, it is considered that the dissolution energy is supplemented.
- the formed network can weaken the interaction between the polyimide resins and, as a result, increase the probability of water presence in the entire polyimide film.
- At least a dope containing a polyimide resin, an organic solvent, water and an anionic water orientation accelerator is used to control the distribution state of the anionic water orientation accelerator.
- TOF-SIMS time-of-flight secondary ion mass spectrometer
- the use of an aqueous solution of an anionic water orientation accelerator having a concentration in the range of 5 to 50% by mass can control the water content in the dope within a desired range.
- the concentration is in the range of 10 to 40% by mass, and even more preferably, the concentration is in the range of 10 to 30% by mass.
- the water content in the dope is in the range of 0.05 to 0.5% by mass with respect to 100% by mass of the polyimide resin. It is preferable in that a secondary ionic strength distribution curve can be obtained. It is more preferably in the range of 0.1 to 0.5% by mass, and even more preferably in the range of 0.3 to 0.5% by mass.
- the optical film containing the polyimide resin of the present invention further contains an anionic water orientation accelerator, and a time-of-flight secondary ion mass spectrometer (TOF-SIMS) is used in the thickness direction of the optical film.
- TOF-SIMS time-of-flight secondary ion mass spectrometer
- the polyimide resin has an acyclic group having an electron-withdrawing property in the side chain, or a cyclo ring, -CO-, -SO 2- , or -CR- (R) in the main chain. Represents a fluorene skeleton.) It is preferable to have at least one of them in terms of excellent colorless transparency.
- Optical film In the method for producing an optical film of the present invention, at least a dope containing a polyimide resin, an organic solvent, water and an anionic water alignment accelerator is used, and the distribution state of the anionic water alignment accelerator is controlled to produce an optical film. It is characterized by being manufactured.
- an anionic water orientation accelerator detected using a time-of-flight secondary ion mass spectrometer (TOF-SIMS) as a composition profile in the layer of the optical film to be produced.
- TOF-SIMS time-of-flight secondary ion mass spectrometer
- the region S in the film thickness direction in which the secondary ionic strength is 50% or more of the maximum value M with respect to the maximum value M of the secondary ionic strength distribution curve is characterized in that it is produced under the condition that (%) is in the range of 50 to 90% of the total film thickness.
- a dope containing at least a polyimide resin, an organic solvent, water and an anionic water orientation accelerator (hereinafter, also referred to as "resin-based varnish") is used in the film forming step.
- a polyimide film (also referred to as a web) is formed by casting on a body, for example, an endless metal belt, and in a drying step, an organic solvent or an organic solvent is used so as to have a predetermined residual solvent amount in the polyimide film. After removing water, it is peeled off from a metal belt to prepare a polyimide film which is an optical film.
- the present invention by adding an anionic water orientation accelerator to the dope containing the polyimide resin, more water is oriented to the surface using the anionic water orientation accelerator as a medium.
- the amount of the anionic water alignment accelerator oriented to the film surface by the anionic water alignment accelerator and the water associated therewith increases, and the peelability between the metal belt and the polyimide film is improved.
- the present invention as a method for confirming the above characteristics, it is derived from an anionic water orientation accelerator in the thickness direction of an optical film detected by using a time-of-flight secondary ion mass spectrometer (TOF-SIMS).
- TOF-SIMS time-of-flight secondary ion mass spectrometer
- the region S defined in the present invention is in the film thickness direction in which the secondary ionic strength is 50% or more of the maximum value M with respect to the maximum value M of the secondary ionic strength distribution curve measured by the following method for the polyimide film. In the area (film thickness) of, it is displayed as a ratio when the total thickness is 100%.
- FIG. 1A and 1B are graphs showing an example of the range of the region S (%) with respect to the maximum value M in the secondary ion concentration distribution curve
- FIG. 1A is the polyimide film of the present invention in which water is present at the time of film formation. It is a distribution curve of the secondary ion intensity of the resin component (broken line) and the water orientation accelerator (solid line) in the film thickness direction
- FIG. 1B shows the distribution curve in the film thickness direction of the polyimide film in the comparative example in which water does not exist at the time of film formation. It is a distribution curve of the secondary ion strength of the resin component and the water orientation accelerator.
- the region S (%) is the secondary ionic strength that is 50% of the maximum value M (secondary ionic strength: 0.26) in the distribution curve of the secondary ionic strength of the water orientation accelerator shown by the solid line in FIG. 1A.
- the value of the ratio of the film thickness when the total layer thickness is 100% is defined as the region S (%).
- the region S shown in FIG. 1A is a water orientation in which the secondary ionic strength is 50% or more of the maximum value M up to the vicinity of the film surface with respect to FIG. 1B of the comparative example in which the film is formed under the condition of not containing water, which is a comparative example. It can be seen that the region where the accelerator and water are present is formed.
- the surface composition is measured while etching in the depth direction from the surface.
- examples thereof include a method of cutting out a cross section of a polyimide film and measuring the secondary ion intensity distribution while scanning the thickness direction of the cross section. In the present invention, the latter method is preferably used.
- the produced polyimide film is cut to a predetermined size, then embedded in an epoxy-embedded resin for pretreatment, the resin is cured, and then the thickness for measurement is measured by an ultramicrotome equipped with a diamond knife. An ultrathin section of about 100 nm is made.
- the secondary ion intensity of each component was measured with respect to the film cross section of the prepared ultrathin section using a time-of-flight secondary ion mass spectrometer (TOF-SIMS), and the horizontal axis is the depth direction of the polyimide film.
- the measurement position ( ⁇ m) in the (thickness direction) is plotted on the vertical axis by plotting the secondary ion intensity derived from the polyimide resin and the anionic water orientation accelerator to create a secondary ion intensity distribution curve.
- region S (%) when the total film thickness of the polyimide film is 100%, a region (film thickness) of 50% or more of the maximum value M of the secondary ionic strength derived from the anionic water orientation accelerator. Range) is obtained, and this is defined as region S (%).
- ionic strength in the film thickness direction from the viewpoint of ensuring smoothing of the measurement data, eliminating noise of the data that appears specifically, and improving the accuracy of the measurement data, it is 1 ⁇ m in the thickness direction.
- the secondary ionic strength was measured at 5 points within the range, the average value was obtained, and this was taken as the ionic strength at the thickness position (center film thickness position).
- TFS-2100 TRIFT2 manufactured by Physical Electricals, USA Measurement condition; Primary ion species: Ga (+) ion Primary ion energy: 25 kV Primary ion current (DC): 1 nA Pulse width: ⁇ 10ns Hunting: Uncharged neutralization: Time resolution: 0.138ns / ch Secondary ion polarity: Negative mass range (M / z): 0.5 to 2000 Raster size: 100 ⁇ m Measurement time: 20 minutes Energy filter: No contrast diaphragm: # 0 Position detector: Raster Post-stage acceleration: 5kV Sample cooling temperature: -100 ° C
- a method for controlling a region S (%) in the film thickness direction in which the secondary ionic strength defined in the present invention is 50% or more of the maximum value M within a range of 50 to 90% of the total film thickness Specifically, a method of applying a water-soluble anionic water orientation accelerator, and adjusting the concentration of the applied anionic water orientation accelerator aqueous solution, that is, the content of water in the dope to a predetermined condition. It can be achieved by such means.
- the more preferable range of the region S (%) defined in the present invention is in the range of 55 to 80%, and more preferably in the range of 60 to 75%.
- the method for producing a polyimide film which is an optical film of the present invention, is characterized by using a dope containing at least a polyimide resin, an organic solvent, water, and an anionic water orientation accelerator.
- polyimide resin The polyimide used in the optical film of the present invention (hereinafter, also referred to as "polyimide film of the present invention") is a transparent heat-resistant resin having an imide structure (hereinafter, also referred to as a polyimide resin), and has an imide bond in a repeating unit. It is a transparent heat-resistant resin containing.
- the polyimide film of the present invention contains polyamic acid or polyimide.
- the polyamic acid or polyimide is preferably formed from a diamine or a derivative thereof and an acid anhydride or a derivative thereof.
- the polyimide resin according to the present invention includes an acyclic group having an electron-withdrawing property in the side chain, or a cyclo ring in the main chain, -CO-, -SO 2- , or -CR- (R is fluorene). It is characterized by having at least one of (representing a skeleton).
- the "main chain” means the longest linearly bonded molecular chain portion.
- the “side chain” is a molecular chain branched from the main chain and refers to a portion other than the main chain.
- Examples of the electron-withdrawing acyclic group include a cyano group, a trifluoromethyl group, a halogen atom, a carbonyl group which may be substituted, a sulfonyl group which may be substituted, and a boryl which may be substituted.
- Examples thereof include a whole oxide ring and a carbolin ring.
- cyclo ring examples include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, norbornyl, decalin, adamantyl, cyclohexenyl and the like.
- polyimide having an electron-withdrawing property in the side chain, or at least one of a cyclo ring, -CO-, -SO 2- , or -CR- (R represents a fluorene skeleton) in the main chain.
- polyimide according to the present invention include the following polyimides A to K.
- a polyimide having a repeating unit represented by the following general formula (1.1) is particularly preferable.
- R is an aromatic hydrocarbon ring or an aromatic heterocycle, or a tetravalent aliphatic hydrocarbon group having 4 to 39 carbon atoms or an alicyclic hydrocarbon group (cyclo ring).
- ⁇ is a divalent aliphatic hydrocarbon group having 2 to 39 carbon atoms, an alicyclic hydrocarbon group (cyclo ring), an aromatic hydrocarbon group, or a group consisting of a combination thereof, and as a bonding group, Group consisting of -O-, -SO 2- , -CO-, -CH 2- , -C (CH 3 ) 2- , -OSi (CH 3 ) 2- , -C 2 H 4 O- and -S- It may contain at least one group selected from.
- Examples of the aromatic hydrocarbon ring represented by R include a fluorene ring, a benzene ring, a biphenyl ring, a naphthalene ring, an azulene ring, an anthracene ring, a phenanthrene ring, a pyrene ring, a chrysene ring, a naphthalene ring, a triphenylene ring, o-.
- Terphenyl ring m-terphenyl ring, p-terphenyl ring, acenaphthene ring, coronen ring, fluorantrene ring, naphthalene ring, pentacene ring, perylene ring, pentaphene ring, picene ring, pyrene ring, pyranthrene ring, anthra entre Benzene ring and the like.
- examples of the aromatic heterocycle represented by R include a silol ring, a furan ring, a thiophene ring, an oxazole ring, a pyrrole ring, a pyridine ring, a pyridazine ring, a pyrimidine ring, a pyrazine ring, a triazine ring, and an oxadi ring.
- Azol ring triazole ring, imidazole ring, pyrazole ring, thiazole ring, indole ring, benzimidazole ring, benzthiazole ring, benzoxazole ring, quinoxaline ring, quinazoline ring, phthalazine ring, thienothiophene ring, carbazole ring, azacarbazole ring (carbazole ring, azacarbazole ring) Any one or more of the carbon atoms constituting the carbazole ring are replaced with nitrogen atoms.), Dibenzosilol ring, dibenzofuran ring, dibenzothiophene ring, benzothiophene ring or any carbon atom constituting the dibenzofuran ring.
- Examples of the tetravalent aliphatic hydrocarbon group having 4 to 39 carbon atoms represented by R include butane-1,1,4,4-triyl group and octane-1,1,8,8-triyl group. Examples include groups such as decan-1,1,10,10-triyl groups.
- Examples of the tetravalent alicyclic hydrocarbon group having 4 to 39 carbon atoms represented by R include cyclobutane-1,2,3,4-tetrayl group and cyclopentane-1,2,4,5. -Tetrayl group, cyclohexane-1,2,4,5-tetrayl group, bicyclo [2.2.2] octo-7-en-2,3,5,6-tetrayl group, bicyclo [2.2.2] Octane-2,3,5,6-tetrayl group, 3,3', 4,4'-dicyclohexyltetrayl group, 3,6-dimethylcyclohexane-1,2,4,5-tetrayl group, 3,6- Examples thereof include groups such as diphenylcyclohexane-1,2,4,5-tetrayl groups.
- Examples of the divalent aliphatic hydrocarbon group having 2 to 39 carbon atoms having or not having the above-mentioned bonding group represented by ⁇ include a group represented by the following structural formula.
- n represents the number of repeating units, preferably 1 to 5, and more preferably 1 to 3.
- X is an alkanediyl group having 1 to 3 carbon atoms, that is, a methylene group, an ethylene group, a trimethylene group and a propane-1,2-diyl group, and among them, a methylene group is preferable.
- Examples of the divalent alicyclic hydrocarbon group having 2 to 39 carbon atoms having or not having the above-mentioned bonding group represented by ⁇ include a group represented by the following structural formula.
- Examples of the divalent aromatic hydrocarbon group having 2 to 39 carbon atoms having or not having the above-mentioned bonding group represented by ⁇ include a group represented by the following structural formula.
- Examples of the group composed of a combination of an aliphatic hydrocarbon group represented by ⁇ , an alicyclic hydrocarbon group and an aromatic hydrocarbon group include a group represented by the following structural formula.
- the group represented by ⁇ is preferably a divalent aromatic hydrocarbon group having 2 to 39 carbon atoms having a bonding group, or a combination of the aromatic hydrocarbon group and an aliphatic hydrocarbon group, particularly.
- a group represented by the following structural formula is preferable.
- the acid anhydride used in the present invention is a carboxylic acid anhydride, preferably a derivative of an aliphatic or alicyclic tetracarboxylic acid, for example, an aliphatic or alicyclic tetracarboxylic acid ester, an aliphatic or an alicyclic tetracarboxylic acid ester.
- Aliphatic tetracarboxylic dianhydride and the like can be mentioned.
- an alicyclic tetracarboxylic dianhydride is preferable.
- the derivative is a compound that can be changed to an aliphatic or alicyclic tetracarboxylic acid.
- an aliphatic tetracarboxylic acid dianhydride a compound having two carboxy groups instead of the anhydride.
- a compound in which one or both of these two carboxy groups are esterified, or an acid chloride in which one or both of these two carboxy groups are chlorinated is preferably used.
- Examples of the aliphatic tetracarboxylic acid include 1,2,3,4-butanetetracarboxylic acid.
- Examples of the alicyclic tetracarboxylic acid include 1,2,3,4-cyclobutanetetracarboxylic acid, 1,2,4,5-cyclopentanetetracarboxylic acid, and 1,2,4,5-cyclohexanetetracarboxylic acid.
- Bicyclo [2.2.2] Oct-7-ene-2,3,5,6-tetracarboxylic acid Bicyclo [2.2.2] octane-2,3,5,6-tetracarboxylic acid, etc. Can be mentioned.
- Examples of the aliphatic tetracarboxylic acid esters include monoalkyl esters, dialkyl esters, trialkyl esters, and tetraalkyl esters of the above aliphatic tetracarboxylic acids.
- Examples of the alicyclic tetracarboxylic acid esters include monoalkyl esters, dialkyl esters, trialkyl esters, and tetraalkyl esters of the alicyclic tetracarboxylic acids.
- the alkyl group moiety is preferably an alkyl group having 1 to 5 carbon atoms, and more preferably an alkyl group having 1 to 3 carbon atoms.
- Examples of the aliphatic tetracarboxylic dianhydride include 1,2,3,4-butanetetracarboxylic dianhydride.
- Examples of the alicyclic tetracarboxylic dianhydride include 1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,2,4,5-cyclopentanetetracarboxylic dianhydride, 1,2. , 4,5-Cyclohexanetetracarboxylic dianhydride, Bicyclo [2.2.2] Oct-7-ene-2,3,5,6-tetracarboxylic dianhydride, Bicyclo [2.2.2] Examples thereof include octane-2,3,5,6-tetracarboxylic dianhydride.
- 1,2,4,5-cyclohexanetetracarboxylic dianhydride is particularly preferred.
- polyimide containing an aliphatic diamine as a constituent component polyamic acid and diamine, which are intermediate products, form a strong salt. Therefore, in order to increase the molecular weight, a solvent having a relatively high salt solubility, for example, It is preferable to use cresol, N, N-dimethylacetamide, ⁇ -butyrolactone, N-methyl-2-pyrrolidone and the like.
- 4,4'-biphthalic anhydride 4,4'-(hexafluoroisopropylidene) diphthalic anhydride, 2,3,3', 4'-biphenyltetracarboxylic dianhydride, 4,4'-oxydiphthalic anhydride, 3,3', 4,4'-benzophenone tetracarboxylic dianhydride, 1,2,3,4-cyclopentanetetracarboxylic hydride, 4- (2,2) 5-Dioxo tetrahydrofuran-3-yl) -1,2,3,4-tetrahydronaphthalene-1,2-dicarboxylic acid anhydride, 5- (2,5-dioxotetrahydrofuryl) -3-methyl-3- Cyclohexene-1,2-dicarboxylic hydride, 3,3', 4,4'-diphenylsulfonetetracarboxylic hydride, 3,4'-oxydiphthal
- an acid anhydride having a fluorene skeleton or a derivative thereof may be used. It has the effect of improving the coloring peculiar to polyimide.
- the acid anhydride having a fluorene skeleton include 9,9-bis (3,4-dicarboxyphenyl) fluorenic dianhydride and 9,9-bis [4- (3,4-dicarboxyphenoxy) phenyl. ] Fluorenic dianhydride, 9,9-bis [4- (3,4-dicarboxyphenoxy) -3-phenylphenyl] fluorenic dianhydride and the like can be used.
- Aromatic, aliphatic or alicyclic tetracarboxylic acid or a derivative thereof may be used alone or in combination of two or more. Further, another tetracarboxylic acid or a derivative thereof (particularly, dianhydride) may be used in combination as long as the solvent solubility of the polyimide, the flexibility of the film, the thermocompression bonding property, and the transparency are not impaired.
- tetracarboxylic acids or derivatives thereof include pyromellitic acid, 3,3', 4,4'-biphenyltetracarboxylic acid, 2,3,3', 4'-biphenyltetracarboxylic acid, 2, 2-bis (3,4-dicarboxyphenyl) propane, 2,2-bis (2,3-dicarboxyphenyl) propane, 2,2-bis (3,4-dicarboxyphenyl) -1,1,1 , 3,3,3-hexafluoropropane, 2,2-bis (2,3-dicarboxyphenyl) -1,1,1,3,3,3-hexafluoropropane, bis (3,4-dicarboxyphenyl) Phenyl) sulfone, bis (3,4-dicarboxyphenyl) ether, bis (2,3-dicarboxyphenyl) ether, 3,3', 4,4'-benzophenone tetracarboxylic acid, 2,2'
- the repeating unit represented by the general formula (1.1) is preferably in the range of 10 to 100 mol%, more preferably in the range of 50 to 100 mol%, with respect to all the repeating units. It is more preferably in the range of 80 to 100 mol%, and particularly preferably in the range of 90 to 100 mol%.
- the number of repeating units of the general formula (1.1) in one molecule of polyimide is in the range of 10 to 2000, preferably in the range of 20 to 200, and in this range, the glass transition temperature is further increased.
- the temperature is preferably in the range of 230 to 350 ° C, more preferably in the range of 250 to 330 ° C.
- ⁇ 1.1.2 Structure on the diamine side>
- aromatic diamine or isocyanic acid ester is preferable, and aromatic diamine is preferable.
- the diamine or a derivative thereof used in the present invention may be any of aromatic diamines, aliphatic diamines or mixtures thereof, and aromatic diamines are preferable from the viewpoint of suppressing whitening of the film.
- the "aromatic diamine” represents a diamine in which an amino group is directly bonded to an aromatic ring, and an aliphatic hydrocarbon group, an alicyclic hydrocarbon group, or the like is part of the structure thereof. It may contain a substituent (for example, a halogen atom, a sulfonyl group, a carbonyl group, an oxygen atom, etc.).
- the "aliphatic diamine” represents a diamine in which an amino group is directly bonded to an aliphatic hydrocarbon group or an alicyclic hydrocarbon group, and an aromatic hydrocarbon group or other substituent (a part of the structure thereof) is used. For example, it may contain a halogen atom, a sulfonyl group, a carbonyl group, an oxygen atom, etc.).
- aromatic diamines include, for example, p-phenylenediamine, m-phenylenediamine, 2,4-diaminotoluene, 2,6-diaminotoluene, benzidine, o-trizine, m-trizine, bis (trifluoromethyl).
- aliphatic diamine examples include ethylenediamine, hexamethylenediamine, polyethylene glycol bis (3-aminopropyl) ether, polypropylene glycol bis (3-aminopropyl) ether, 1,3-bis (aminomethyl) cyclohexane, and 1,4.
- a diamine having a fluorene skeleton or a derivative thereof may be used for the purpose of improving the coloring peculiar to polyimide.
- a diamine compound having a triazine mother nucleus represented by the following structural formula can be preferably used.
- R 1 represents a hydrogen atom and an alkyl group or an aryl group having 1 to 12 carbon atoms (preferably 1 to 10 carbon atoms, more preferably 1 to 6 carbon atoms).
- R 2 represents an alkyl group or an aryl group having 1 to 12 carbon atoms (preferably 1 to 10 carbon atoms, more preferably 1 to 6 carbon atoms), and R 1 and R 2 may be different and are the same. There may be.
- alkyl or aryl group having 1 to 12 carbon atoms of R 1 and R 2 include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, t-butyl, phenyl, benzyl, naphthyl, methylphenyl, and biphenyl. And so on.
- the aminoanilino group connected to the two NH groups of triazine is 4-aminoanilino or 3-aminoanilino, which may be the same or different, but 4-aminoanilino is preferable.
- diamine compound having a triazine matrix and represented by the above formula examples include 2,4-bis (4-aminoanilino) -6-anilino-1,3,5-triazine and 2,4-bis (3).
- -Aminoanilino) -6-anilino-1,3,5-triazine 2,4-bis (4-aminoanilino) -6-benzylamino-1,3,5-triazine
- 2,4-bis (4-aminoanilino) -6 -Biphenylamino-1,3,5-triazine 2,4-bis (4-aminoanilino) -6-diphenylamino-1,3,5-triazine
- Examples of the isocyanic acid ester which is a diamine derivative include diisocyanate obtained by reacting the above aromatic or aliphatic diamine with phosgene.
- Examples of other diamine derivatives include diaminodisilanes, and examples thereof include trimethylsilylated aromatic or aliphatic diamines obtained by reacting the above aromatic or aliphatic diamines with chlorotrimethylsilane.
- the above diamines and their derivatives may be arbitrarily mixed and used, but the amount of diamines in them is preferably 50 to 100 mol%, more preferably 80 to 100 mol%.
- the polyimide contained in the polymer blend composition has an acyclic group having an electron-withdrawing property in the side chain, or a cyclo ring, -CO-, -SO 2- , or a main chain in the main chain.
- -CR- R represents a fluorene skeleton
- the difference between the maximum weight average molecular weight and the minimum weight average molecular weight of the two or more types of polyimides is 20000 to 200,000. It is preferably within the range, and is appropriately selected from the above-mentioned diamine or a derivative thereof and an acid anhydride or a derivative thereof so as to form the polyimide according to the present invention.
- anionic water orientation accelerator examples include the following compounds, for example, higher alcohol (8 to 22 carbon atoms) sulfate ester salts (for example, sodium salt of lauryl alcohol sulfate, etc.).
- Alkylamide sulfonates eg, C 17 H 33 CON (CH 3 ) CH 2 SO 3 Na, etc.
- dibasic fatty acid ester sulfonates eg, sodium sulfosuccinate dioctyl ester, sodium sulfosuccinate) Acid dihexyl ester, etc.
- sulfates and sulfonates are particularly preferably used.
- a phosphate ester-based water orientation promoter a carboxylic acid or carboxylic acid salt-based water orientation promoter, a sulfonic acid or sulfonate-based water orientation promoter, and a sulfate ester-based water.
- Orientation promoters are effective.
- a fluorine-based water orientation accelerator in which a part of hydrogen atoms bonded to the hydrocarbon chain of the anionic water orientation accelerator is replaced with a fluorine atom is also effective. Specific compounds RZ-1 to RZ-18 of the anionic water orientation accelerator are shown below.
- the optical film of the present invention is a polymer film containing the polymer blend composition, and preferably has a yellow index value of 5.0 or less.
- the yellow index (YI) value of the polymer film of the present invention is preferably in the range of 0.2 to 2.0. The smaller the yellow index value, the less the coloring, which is preferable.
- the yellow index value can be adjusted by selecting the composition of polyimide, and in order to reduce the yellow index value to 5.0 or less, it is preferable to use a monomer having an electron-withdrawing group.
- the yellow index value can be obtained according to the YI (yellow index: yellowish index) of the film defined in JIS K7103.
- a sample of a polymer film is prepared, and it is defined in JIS Z8701 using a spectrophotometer U-3300 of Hitachi High-Technologies Corporation and an attached saturation calculation program.
- the tristimulus values X, Y, and Z of the light source color are obtained, and the yellow index value is obtained according to the definition of the following equation.
- the polymer film of the present invention preferably has a haze of 1% or less, more preferably 0.5% or less.
- Haze (all haze) can be measured using a haze meter, for example, NDH-2000 (manufactured by Nippon Denshoku Industries Co., Ltd.) in accordance with JIS K-7136.
- the polymer film of the present invention is preferably long, specifically, preferably in the range of about 100 to 10000 m, and is in the form of a roll. It is taken up by.
- the width of the polymer film of the present invention is preferably 1 m or more, more preferably 1.4 m or more, and particularly preferably in the range of 1.4 to 4 m.
- the film thickness is preferably in the range of 1 to 200 ⁇ m from the viewpoint of strength and transparency as a flexible printed circuit board.
- the film thickness is 1 ⁇ m or more, the film strength required for an optical film can be exhibited.
- the film substrate can be provided with flexibility. In particular, it is preferably in the range of 1 to 100 ⁇ m.
- Total light transmittance For the polymer film of the present invention, a sample having a thickness of 55 ⁇ m is prepared, and the total light transmittance is preferably 80% or more, more preferably 85% or more, 90. It is more preferably% or more. By setting the total light transmittance to 80% or more, there is an advantage that the range of application to various electronic devices as a film for optical applications is widened.
- the total light transmittance of the film sample can be measured according to JIS K-7375 for the sample whose humidity has been adjusted for 24 hours in an air-conditioned room at 23 ° C. and 55 RH.
- the polymer film of the present invention preferably contains the following additives in addition to the polymer blend composition.
- the polyimide film of the present invention has, for example, silicon dioxide, titanium dioxide, aluminum oxide, zirconium oxide, calcium carbonate, kaolin, talc, calcined calcium silicate, and hydration. It is preferable to contain inorganic fine particles such as calcium silicate, aluminum silicate, magnesium silicate, and calcium phosphate, and a matting agent such as a crosslinked polymer. Above all, silicon dioxide is preferable in that the haze of the film can be reduced.
- the primary average particle size of the fine particles is preferably 20 nm or less, more preferably in the range of 5 to 16 nm, and particularly preferably in the range of 5 to 12 nm.
- These fine particles preferably form secondary particles having a particle size in the range of 0.1 to 5 ⁇ m and are contained in the polyimide, and the average particle size is preferably in the range of 0.1 to 2 ⁇ m, more preferably. Is in the range of 0.2 to 0.6 ⁇ m. As a result, unevenness having a height of about 0.1 to 1.0 ⁇ m is formed on the film surface, whereby appropriate slipperiness can be imparted to the film surface.
- the primary average particle size of the fine particles used in the present invention is measured by observing the particles with a transmission electron microscope (magnification: 500,000 to 2,000,000 times), observing 100 particles, measuring the particle size, and averaging the particles. The value is taken as the primary average particle size.
- the polyimide film of the present invention contains an ultraviolet absorber from the viewpoint of improving light resistance.
- the ultraviolet absorber is intended to improve the light resistance by absorbing ultraviolet rays of 400 nm or less, and in particular, the transmittance at a wavelength of 370 nm is preferably in the range of 0.1 to 30%. It is more preferably in the range of 1 to 20%, still more preferably in the range of 2 to 10%.
- the UV absorbers preferably used in the present invention are benzotriazole-based UV absorbers, benzophenone-based UV absorbers, and triazine-based UV absorbers, and particularly preferably benzotriazole-based UV absorbers and benzophenone-based UV absorbers.
- chinubins such as chinubin 928, all of which are commercially available products manufactured by BASF Japan Co., Ltd. and can be preferably used. Of these, halogen-free ones are preferable.
- a disk-shaped compound such as a compound having a 1,3,5-triazine ring is also preferably used as an ultraviolet absorber.
- the polyimide film of the present invention preferably contains two or more types of ultraviolet absorbers.
- a polymer ultraviolet absorber can also be preferably used, and in particular, the polymer type ultraviolet absorber described in JP-A-6-148430 is preferably used. Moreover, it is preferable that the ultraviolet absorber does not have a halogen group.
- the method of adding the ultraviolet absorber is to dissolve the ultraviolet absorber in an alcohol such as methanol, ethanol or butanol, an organic solvent such as dichloromethane, methyl acetate, acetone or dioxolane, or a mixed solvent thereof, and then add the ultraviolet absorber to the dope. It may be added directly into the dope composition.
- an alcohol such as methanol, ethanol or butanol
- an organic solvent such as dichloromethane, methyl acetate, acetone or dioxolane, or a mixed solvent thereof
- inorganic powders that do not dissolve in organic solvents use a dissolver or sandmill in the organic solvent and polyimide film to disperse them before adding them to the dope.
- the amount of the UV absorber used is not uniform depending on the type of UV absorber, usage conditions, etc., but when the dry film thickness of the polyimide film is 15 to 50 ⁇ m, it is 0.5 to 10% by mass with respect to the polyimide film. Is preferable, and the range of 0.6 to 4% by mass is more preferable.
- Antioxidants are also called antioxidants. When an electronic device or the like is placed in a high humidity and high temperature state, the polyimide film may deteriorate, and an antioxidant is used to prevent these.
- the function of the antioxidant is, for example, to delay or prevent the decomposition of the polyimide film due to the residual solvent amount of halogen in the polyimide film, phosphoric acid of the phosphoric acid-based plasticizer, or the like.
- a hindered phenol-based compound is preferably used, and for example, 2,6-di-t-butyl-p-cresol, pentaerythrityl-tetrakis [3- (3, 3,).
- 2,6-di-t-butyl-p-cresol, pentaerythrityl-tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate], triethylene glycol-bis [3 -(3-T-Butyl-5-methyl-4-hydroxyphenyl) propionate] is preferable.
- a hydrazine-based metal inactivating agent such as N, N'-bis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionyl] hydrazine or tris (2,4-di-).
- a phosphorus-based processing stabilizer such as t-butylphenyl) phosphite may be used in combination.
- the amount of these compounds added is preferably in the range of 1 ppm to 1.0% by mass with respect to the polyimide film, and more preferably in the range of 10 to 1000 ppm.
- Phase difference control agent In order to improve the display quality of an image display device such as a liquid crystal display device, a retardation control agent is added to the polyimide film or an alignment film is formed to provide a liquid crystal layer for polarization. By combining the phase difference derived from the plate protective film and the liquid crystal layer, it is possible to impart optical compensation ability to the polyimide film.
- phase difference control agent examples include aromatic compounds having two or more aromatic rings as described in European Patent No. 911656A2, rod-shaped compounds described in JP-A-2006-2025, and the like. Further, two or more kinds of aromatic compounds may be used in combination.
- the aromatic ring of this aromatic compound is preferably an aromatic heterocycle containing an aromatic heterocycle in addition to the aromatic hydrocarbon ring.
- Aromatic heterocycles are generally unsaturated heterocycles. Of these, the 1,3,5-triazine ring described in JP-A-2006-2026 is preferable.
- the amount of these retardation control agents added is preferably in the range of 0.5 to 20% by mass and preferably in the range of 1 to 10% by mass with respect to 100% by mass of the polyimide film-based resin. More preferred.
- the additive contained in the polyimide film of the present invention is not limited to the compounds described above.
- Step of preparing an aqueous solution of anionic water orientation accelerator 2) A step of dissolving the above-mentioned polyamic acid or polyimide in a solvent to prepare a dope (dope preparation step). 3) A step of casting the dope onto a support to form a casting film (casting step).
- the water content in the dope is preferably in the range of 0.05 to 0.5% by mass with respect to 100% by mass of the polyimide resin, and the water supply.
- One of the sources is water contained in an aqueous solution of an anionic water orientation accelerator, but if necessary, if the water content in the above-mentioned dope is insufficient by itself, water is separately subjected to a dope preparation step. Is also preferably added to obtain the water content specified above.
- the preferable range of the addition amount of the anionic water orientation accelerator aqueous solution is in the range of 0.1 to 1.0% by mass, and more preferably in the range of 0.3 to 0.7% by mass with respect to the polyimide resin. Is inside.
- the low boiling point solvent it is preferable to use a low boiling point solvent having a boiling point of 80 ° C. or lower as the main solvent.
- “used as the main solvent” means that 55% by mass or more is used with respect to the total amount of the solvent in the case of a mixed solvent, preferably 70% by mass or more, more preferably 80% by mass or more, and particularly preferably. Is to be used in an amount of 90% by mass or more. Of course, if used alone, it will be 100% by mass.
- the low boiling point solvent may be any one that simultaneously dissolves polyimide, an anionic water orientation accelerator and other additives.
- the chlorine-based solvent is dichloromethane
- the non-chlorine-based solvent is methyl acetate or ethyl acetate.
- examples of low boiling point solvents having a boiling point of 80 ° C. or lower include dichloromethane (40 ° C.), ethyl acetate (77 ° C.), methyl ethyl ketone (79 ° C.), tetrahydrofuran (66 ° C.), and acetone (56.5 ° C.).
- at least one selected from 1,3-dioxolane (75 ° C.) is preferably contained as the main solvent.
- the numerical values in parentheses represent the boiling points.
- the solvent contained in the case of the mixed solvent as long as it can dissolve the polyimide according to the present invention, it can be used as long as the effect of the present invention is not impaired, and as a solvent other than those described above,
- a solvent other than those described above For example, N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-diethylacetamide, N, N-dimethylformamide, N, N-diethylformamide, N-methylcaprolactam, hexamethylphosphoramide, tetra.
- an alcohol solvent can be used. It is preferable that the alcohol solvent is selected from methanol, ethanol and butanol from the viewpoint of improving the peelability and enabling high-speed casting. Of these, it is preferable to use methanol or ethanol. Higher proportions of alcohol in the dope gels the web, facilitating delamination from the metal support.
- a method performed at normal pressure a method performed below the boiling point of the main solvent, a method performed by pressurizing above the boiling point of the main solvent, JP-A-9-955544, JP-A-9-
- Various melting methods can be used, such as the method performed by the cooling dissolution method described in JP-A-95557 or JP-A-9-95538, the method performed at high pressure described in JP-A-11-21379, and the like.
- the prepared dope is guided to a filter by a liquid feed pump or the like and filtered.
- the main solvent of the dope is dichloromethane
- the gel-like foreign matter in the dope can be removed by filtering the dope at a temperature of + 5 ° C. or higher at a boiling point of the dichloromethane at 1 atm.
- the preferred temperature range is 45 to 120 ° C, more preferably 45 to 70 ° C, and even more preferably within the range of 45 to 55 ° C.
- the main dope may contain a return material in the range of 10 to 50% by mass.
- the return material is a part that is reused as a raw material for some reason. For example, it is a finely crushed polyimide film, and both side parts of the film are cut off, which is generated when the polyimide film is formed. Or, a polyimide film raw fabric that exceeds the specified value of the film due to scratches or the like is used.
- the raw material of the resin used for the dope preparation those in which polyimide and other compounds are pelletized in advance can also be preferably used.
- Casting film forming step The prepared dope is pumped onto a die through a liquid feed pump (eg, a pressurized metering gear pump) and transferred indefinitely on an endless support, such as a stainless steel belt or a metal support such as a rotating metal drum. Spread the dope from the die to the position.
- a liquid feed pump eg, a pressurized metering gear pump
- an endless support such as a stainless steel belt or a metal support such as a rotating metal drum.
- the metal support in casting is preferably a mirror-finished surface, and the support is a stainless steel belt or a drum whose surface is plated with a casting, or a metal support such as a stainless steel belt or a stainless steel belt. Is preferably used.
- the width of the cast can be in the range of 1 to 4 m, preferably in the range of 1.5 to 3 m, and more preferably in the range of 2 to 2.8 m.
- the support does not have to be made of metal, for example, polyethylene terephthalate (PET) film, polyethylene naphthalate (PEN) film, polybutylene terephthalate (PBT) film, nylon 6 film, nylon 6,6 film, polypropylene film.
- a belt such as polytetrafluoroethylene can be used.
- the polyimide may be wound together with the metal support in which the polyimide is cast.
- the transport speed of the metal support is not particularly limited, but is usually 5 m / min or more, preferably in the range of 10 to 180 m / min, and particularly preferably in the range of 80 to 150 m / min.
- the higher the transport speed of the metal support the easier it is for companion gas to be generated, and the more remarkable the occurrence of film thickness unevenness due to disturbance.
- the transport speed of the metal support is the moving speed of the outer surface of the metal support.
- the surface temperature of the metal support is preferably higher because the drying rate of the casting film can be increased, but if it is too high, the casting film may foam or the flatness may deteriorate. , It is preferable to carry out at a temperature within the range of ⁇ 50 to ⁇ 10 ° C. with respect to the boiling point of the solvent used.
- the die has a shape that gradually becomes thinner toward the discharge port in a cross section perpendicular to the width direction.
- the die usually has tapered surfaces on the downstream side and the upstream side in the traveling direction of the lower portion, and a discharge port is formed in a slit shape between the tapered surfaces.
- a metal die is preferably used, and specific examples thereof include stainless steel and titanium. In the present invention, when producing films having different thicknesses, it is not necessary to change to dies having different slit gaps.
- the pressure die includes a coat hanger die, a T die, and the like, and any of them is preferably used. Even when films of different thicknesses are continuously produced, the discharge rate of the die is maintained at a substantially constant value. Therefore, when a pressure die is used, conditions such as extrusion pressure and shear rate are also omitted. It is maintained at a constant value. Further, in order to increase the film forming speed, two or more pressure dies may be provided on the metal support, and the doping amount may be divided and laminated.
- the solvent evaporation step is a pre-drying step performed on a metal support, heating the cast film on the metal support, and evaporating the solvent.
- a method of blowing heating air from the casting film side and the back side of the metal support with a dryer for example, a method of blowing heating air from the casting film side and the back side of the metal support with a dryer, a method of transferring heat from the back surface of the metal support with a heating liquid, and a method of transferring heat from the front and back by radiant heat. And so on. A method of appropriately selecting and combining them is also preferable.
- the surface temperature of the metal support may be the same as a whole or may differ depending on the position.
- the temperature of the heating air is preferably in the range of 10 to 220 ° C.
- the solvent evaporation step it is preferable to dry the casting film until the residual solvent amount is in the range of 10 to 150% by mass from the viewpoint of the peelability of the casting film and the transportability after peeling.
- the amount of residual solvent can be expressed by the following formula.
- Residual solvent amount (mass%) ⁇ (MN) / N ⁇ x 100
- M is the mass of the casting film (film) at a predetermined time point
- N is the mass of M when it is dried at 200 ° C. for 3 hours.
- M when calculating the residual solvent amount achieved in the solvent evaporation step is the mass of the cast film immediately before the peeling step.
- the peeling tension when peeling the metal support and the casting film is usually in the range of 60 to 400 N / m, but if wrinkles are likely to occur during peeling, the metal support is peeled at a tension of 190 N / m or less. Is preferable.
- the temperature at the peeling position on the metal support is preferably in the range of ⁇ 50 to 60 ° C., more preferably in the range of 10 to 40 ° C., and in the range of 15 to 40 ° C. Is the most preferable.
- the peeled film may be sent directly to the stretching step, or may be sent to the stretching step after being sent to the first drying step so as to achieve a desired residual solvent amount.
- the film is sequentially fed to the first drying step and the stretching step after the peeling step.
- the first drying step is a drying step of heating the film and further evaporating the solvent.
- the drying means is not particularly limited, and for example, hot air, infrared rays, a heating roller, microwaves, or the like can be used. From the viewpoint of convenience, it is preferable to dry the film with hot air or the like while transporting the film with rollers arranged in a staggered pattern.
- the drying temperature is preferably in the range of 30 to 200 ° C. in consideration of the amount of residual solvent, the expansion / contraction rate during transportation, and the like.
- the casting step is a step of stretching a film peeled from a metal support, and the film thickness, flatness, orientation, etc. of the film can be controlled.
- the stretching operation in the casting process may be carried out in multiple stages. Further, when biaxial stretching is performed, simultaneous biaxial stretching may be performed, or biaxial stretching may be performed step by step.
- stepwise means, for example, that stretching in different stretching directions can be sequentially performed, stretching in the same direction is divided into multiple stages, and stretching in different directions is added to any of the steps. Is also possible.
- stretching steps are also possible: ⁇ Stretching in the longitudinal direction ⁇ Stretching in the width direction ⁇ Stretching in the longitudinal direction ⁇ Stretching in the longitudinal direction ⁇ Stretching in the width direction ⁇ Stretching in the width direction ⁇ Stretching in the longitudinal direction ⁇ Stretching in the longitudinal direction ⁇ Stretching in the longitudinal direction ⁇ Stretching in the longitudinal direction ⁇ Stretching in the longitudinal direction ⁇ Stretching in the longitudinal direction ⁇ Stretching in the longitudinal direction
- Stretching in the longitudinal direction also, for simultaneous biaxial stretching Also includes the case of stretching in one direction and contracting the other with relaxation of tension.
- the amount of residual solvent at the start of stretching is preferably in the range of 0.1 to 200% by mass.
- the amount of residual solvent at the start of stretching is 0.1% by mass or more, the effect of improving flatness by stretching can be obtained, and if it is 200% by mass or less, the film strength becomes high and stretching becomes easy.
- the film may be stretched at least in the longitudinal direction or the width direction, preferably in the width direction so that the film thickness after stretching is within a desired range. It is preferable to stretch the film in a temperature range of (Tg-200) to (Tg + 100) ° C. with respect to the glass transition temperature (Tg) of the film. When stretched in the above temperature range, the stretching stress can be reduced, so that the haze of the obtained film is lowered. In addition, a polyimide film that suppresses the occurrence of breakage and is excellent in flatness and colorability of the film itself can be obtained.
- the stretching temperature is more preferably in the range of (TgL-150) to (TgH + 50) ° C.
- a self-supporting film peeled from a support can be stretched in the longitudinal direction by regulating the transport speed with a stretching roller.
- the entire width of the film or a part of the drying treatment as shown in JP-A-62-46625 is performed in the width direction, and both ends of the width of the film are held by clips or pins.
- a method of drying while doing so (called a tenter method), in particular, a tenter method using a clip is preferable.
- the film stretched in the longitudinal direction or the unstretched film is introduced into the tenter with both ends in the width direction gripped by the clip, and is stretched in the width direction while traveling together with the tenter clip.
- the film When stretching in the width direction, it is preferable to stretch the film at a stretching speed in the range of 50 to 1000% / min in the width direction from the viewpoint of improving the flatness of the film.
- the stretching speed is 50% / min or more, the flatness is improved and the film can be processed at high speed, which is preferable from the viewpoint of production suitability.
- the stretching speed is 1000% / min or less, the film breaks. It can be processed without any problem, which is preferable.
- a more preferred stretching rate is in the range of 100-500% / min.
- d 1 is the width dimension in the stretching direction of the resin film after stretching
- d 2 is the width dimension in the stretching direction of the resin film before stretching
- t is the time (min) required for stretching.
- holding and relaxation are usually performed after stretching. That is, in the stretching step, it is preferable to perform a stretching step of stretching the film, a holding step of holding the film in a stretched state, and a relaxing step of relaxing the film in the stretching direction in these orders.
- the stretching at the stretching ratio achieved in the stretching step is held at the stretching temperature in the stretching step.
- the relaxation step the stretching in the stretching step is held in the holding step, and then the tension for stretching is released to relax the stretching.
- the relaxation step may be performed under the conditions below the stretching temperature in the stretching step.
- the stretched film is heated and dried.
- a means for preventing the mixing of used hot air by installing a nozzle capable of exhausting used hot air is also preferably used.
- the hot air temperature is preferably in the range of 40 to 220 ° C.
- the drying time is preferably in the range of 5 seconds to 30 minutes, more preferably in the range of 10 seconds to 15 minutes.
- the heating and drying means in the second drying step is not limited to hot air, and for example, infrared rays, heating rollers, microwaves, and the like can be used. From the viewpoint of convenience, it is preferable to dry the film with hot air or the like while transporting the film with rollers arranged in a staggered pattern.
- the drying temperature is preferably in the range of 40 to 220 ° C. in consideration of the amount of residual solvent, the expansion / contraction rate during transportation, and the like.
- the second drying step it is preferable to dry the film until the residual solvent amount becomes 0.5% by mass or less.
- the winding process is a step of winding a film-formed film into a roll and cooling it to room temperature.
- the winder may be one that is generally used, and can be wound by a winding method such as a constant tension method, a constant torque method, a taper tension method, or a program tension control method with a constant internal stress.
- the thickness of the film is not limited to, for example, preferably in the range of 1 to 200 ⁇ m, and particularly preferably in the range of 1 to 100 ⁇ m.
- both ends of the film sandwiched between the tenter clips and the like when stretched and conveyed may be slit and removed. It is preferable that the slit end of the film is finely cut within a width of 1 to 30 mm, then dissolved in a solvent and reused as a return material.
- the ratio of the portion of the molded film that is reused as the return material is preferably in the range of 10 to 90% by mass, more preferably 20 to 80% by mass, and further preferably 30 to 70% by mass.
- the input amount varies slightly depending on the amount of the return material generated during or finally in the film forming process, but usually, the mixing ratio of the return material with respect to the total solid content in the dope is about 10 to 50% by mass, preferably about 10 to 50% by mass. , It is in the range of about 15 to 40% by mass. It is preferable that the mixing ratio of the return material is as constant as possible in terms of production stability.
- Each step from the solvent evaporation step to the winding step described above may be carried out in an air atmosphere or an inert gas atmosphere such as nitrogen gas. Further, each step, particularly the drying step and the stretching step, is carried out in consideration of the explosive limit concentration of the solvent in the atmosphere.
- a step of slitting the widthwise end portion of the polyimide film, a step of removing static electricity from the polyimide film when it is charged, and the like may be further provided.
- the polyimide film of the present invention can suppress warpage due to temperature and humidity environment fluctuations when laminated with an electronic device.
- the applicable electronic device is not particularly limited, and examples thereof include an organic EL device, a liquid crystal display device (LCD), an organic photoelectric conversion device, a printed circuit board, a thin film transistor, a touch panel, a polarizing plate, and a retardation film. From the viewpoint that the effects of the present invention can be obtained more efficiently, it is preferably used for flexible printed circuit boards, LED lighting devices, and front members for flexible displays.
- the flexible printed circuit board according to the present invention can be obtained by using the polyimide film of the present invention as a base film and pressure-bonding a metal foil to the base film with an adhesive.
- the adhesive used here include acrylic adhesives, polyimide adhesives and epoxy adhesives.
- the metal foil that is thermocompression-bonded to the polyimide film via an adhesive is preferably a copper foil from the viewpoint of cost reduction, but other metal foils such as aluminum, gold, silver, nickel, and tin may also be used.
- the LED lighting device according to the present invention is not particularly limited as long as the LED substrate using the polyimide film of the present invention is used, and examples thereof include a double-sided substrate and a composite substrate with an aluminum plate. When higher heat dissipation is required due to the increase in brightness of the LED, it is possible to improve the heat dissipation by combining it with an aluminum plate. It can also be applied to an organic electroluminescence illuminator using an organic material.
- the front member for a flexible display according to the present invention is not particularly limited as long as it is made of the polyimide film of the present invention.
- the flexible display on which the front member for a flexible display according to the present invention is mounted includes, for example, an organic EL device in which an organic functional layer such as a light emitting layer is laminated on a substrate, a gas barrier film, a film color filter, one side or both sides.
- a polarizing plate provided with a polarizing plate protective film, a film-type touch sensor, and the like are laminated in this order.
- the front member for a flexible display of the present invention is laminated on, for example, a film-type touch sensor of a flexible display configured as described above.
- the polyimide film of the present invention may be used as a substrate for an organic EL device constituting the flexible display, or may be used as a polarizing plate protective film for a polarizing plate constituting the flexible display.
- Dope 1 having the following composition was prepared. First, dichloromethane (boiling point 40 ° C.) was added as solvent 2 to the pressure dissolution tank. Next, the polyimide AI1 and the remaining components prepared above were charged into the pressure dissolution tank containing the solvent 2 with stirring. This is heated and completely dissolved while stirring, and this is Azumi Filter Paper No. 1 manufactured by Azumi Filter Paper Co., Ltd. Filtration was performed using 244 to prepare Dope 1.
- the amount of the anionic water orientation accelerator A1 aqueous solution (concentration: 10% by mass, anionic A1) added to the polyimide PI1 was 0.55% by mass, and the solvent was added to 100 parts by mass of the polyimide PI1.
- the water content ratio of 1 is 0.495% by mass.
- the peeled polyimide film was stretched 1.50 times in the width direction using a clip-type tenter while applying heat at 200 ° C.
- the amount of residual solvent at the start of stretching was 20% by mass.
- polyimide film 4 In the preparation of the polyimide film 2, the polyimide film 4 was prepared in the same manner except that the water orientation accelerator used in the preparation of the dope was changed to the nonionic water orientation accelerator N1 aqueous solution.
- polyimide film 6 In the preparation of the polyimide film 2, the polyimide film 6 was prepared in the same manner except that the anionic water alignment accelerator A1 used in the preparation of the dope was used and the anionic water orientation accelerator A2 (anionic A2) was used. did.
- polyimide film 7 In the preparation of the polyimide film 2, the polyimide film 7 was prepared in the same manner except that the polyimide PI2 prepared by the following method was used instead of the polyimide PI1 used in the preparation of the dope.
- the content ratio of water as solvent 1 to 100 parts by mass of polyimide PI1 in the dope used for producing the polyimide film 8 is 0.08% by mass, and 100% by mass of polyimide PI1 in the dope used for producing the polyimide film 9.
- the content ratio of water as solvent 1 to the portion is 0.24% by mass.
- the secondary ion strength of each component was measured with respect to the film cross section of the prepared ultrathin section using a time-of-flight secondary ion mass spectrometer (TOF-SIMS), and the horizontal axis is the depth direction of the polyimide film.
- TOF-SIMS time-of-flight secondary ion mass spectrometer
- a secondary ionic strength distribution curve was created by plotting the secondary ionic strength derived from the polyimide resin and the anionic water orientation accelerator on the measurement position ( ⁇ m) and the vertical axis.
- the range of 1 ⁇ m in the thickness direction is used from the viewpoint of ensuring smoothing of the measurement data, eliminating noise of the data that appears specifically, and improving the accuracy of the measurement data.
- the secondary ionic strength was measured at 5 points in the room, the average value was obtained, and this was taken as the ionic strength at the thickness position (center film thickness position).
- the specific measurement conditions are as follows.
- ⁇ measuring device TFS-2100 TRIFT2 manufactured by Physical Electricals, USA ⁇ Measurement condition; Primary ion species: Ga (+) ion Primary ion energy: 25 kV Primary ion current (DC): 1 nA Pulse width: ⁇ 10ns Hunting: Uncharged neutralization: Time resolution: 0.138ns / ch Secondary ion polarity: Negative mass range (M / z): 0.5 to 2000 Raster size: 100 ⁇ m Measurement time: 20 minutes Energy filter: No contrast diaphragm: # 0 Position detector: Raster Post-stage acceleration: 5kV Sample cooling temperature: -100 ° C
- peelability In the manufacturing process of each polyimide film by the solution casting method, the peelability in the peeling step and the presence or absence of horizontal steps on the surface of the polyimide film immediately before the winding step are visually observed, and the peelability is evaluated according to the following criteria. It was. ⁇ : Peeling is good and no horizontal steps are observed. ⁇ : Peeling is good, but slight horizontal steps are observed, but the quality is good. ⁇ : Catch is generated during peeling. Although some horizontal rows are generated, the quality is practically acceptable. ⁇ : There is a strong catch at the time of peeling, and many strong horizontal rows are generated, which is a quality that poses a problem in practical use.
- the haze of each polyimide film was measured using a haze meter NDH-2000 (manufactured by Nippon Denshoku Industries Co., Ltd.) in accordance with JIS K-7136, and evaluated according to the following criteria.
- the light source of the haze meter was a 5V9W halogen bulb, and the light receiving part was a silicon photocell (with a luminosity filter).
- the haze was measured under the conditions of 23 ° C. and 55% RH.
- Haze Haze is 0.3% or more and less than 0.5%
- Results obtained by haze of 0.5% or more are shown in Table I.
- the polyimide films of the present invention in which the region S (%) with respect to the maximum value M of the moving average graph in the thickness direction of the polyimide film is in the range of 50 to 90% are compared.
- the peelability from the support during film formation is excellent, the haze is low, and the transparency is excellent.
- an optical film having excellent transparency and peelability during film formation can be obtained, and an organic EL device, a liquid crystal display device (LCD), and an organic photoelectric conversion device can be obtained.
- Organic EL device a liquid crystal display device (LCD)
- LCD liquid crystal display
- organic photoelectric conversion device a photoelectric conversion device
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WO2016027825A1 (ja) * | 2014-08-20 | 2016-02-25 | 東京応化工業株式会社 | 多孔質ポリイミド膜製造用ワニス及びそれを用いた多孔質ポリイミド膜の製造方法 |
JP2016075894A (ja) * | 2014-10-02 | 2016-05-12 | コニカミノルタ株式会社 | 光学フィルム、その製造方法、フレキシブルプリント基板及びled照明 |
WO2017051827A1 (ja) * | 2015-09-24 | 2017-03-30 | 旭化成株式会社 | ポリイミド前駆体、樹脂組成物および樹脂フィルムの製造方法 |
JP2019023249A (ja) * | 2015-12-11 | 2019-02-14 | コニカミノルタ株式会社 | ポリイミドフィルム、フレキシブルプリント基板、led照明装置及びフレキシブルディスプレイ用前面部材 |
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JP2015165491A (ja) * | 2014-02-06 | 2015-09-17 | 三菱化学株式会社 | 有機電界発光素子及びその製造方法 |
JP2015178541A (ja) * | 2014-03-18 | 2015-10-08 | 富士ゼロックス株式会社 | ポリイミド前駆体組成物、ポリイミド成形体の製造方法、及びポリイミド成形体 |
WO2016027825A1 (ja) * | 2014-08-20 | 2016-02-25 | 東京応化工業株式会社 | 多孔質ポリイミド膜製造用ワニス及びそれを用いた多孔質ポリイミド膜の製造方法 |
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WO2017051827A1 (ja) * | 2015-09-24 | 2017-03-30 | 旭化成株式会社 | ポリイミド前駆体、樹脂組成物および樹脂フィルムの製造方法 |
JP2019023249A (ja) * | 2015-12-11 | 2019-02-14 | コニカミノルタ株式会社 | ポリイミドフィルム、フレキシブルプリント基板、led照明装置及びフレキシブルディスプレイ用前面部材 |
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