WO2020192768A1 - Pcb板贴片方法及结构 - Google Patents

Pcb板贴片方法及结构 Download PDF

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Publication number
WO2020192768A1
WO2020192768A1 PCT/CN2020/081754 CN2020081754W WO2020192768A1 WO 2020192768 A1 WO2020192768 A1 WO 2020192768A1 CN 2020081754 W CN2020081754 W CN 2020081754W WO 2020192768 A1 WO2020192768 A1 WO 2020192768A1
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WIPO (PCT)
Prior art keywords
pcb board
patch
component
pcb
soldering
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PCT/CN2020/081754
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English (en)
French (fr)
Inventor
丁柏平
杨锋
蔡增智
黄阳彪
庄瑞霞
Original Assignee
深圳市中孚能电气设备有限公司
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Application filed by 深圳市中孚能电气设备有限公司 filed Critical 深圳市中孚能电气设备有限公司
Publication of WO2020192768A1 publication Critical patent/WO2020192768A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • the embodiments of the present application relate to the mounting technology of components on a PCB board, for example, to a method and structure for mounting on a PCB board.
  • PCB printed Circuit Board
  • the Chinese name is printed circuit board, also known as printed circuit board. It is an important electronic component, a support for electronic components, a carrier for electrical connection of patch components, and a patch in electronic equipment The components need to be soldered in the circuit of the PCB board to achieve electrical functions.
  • the PCB board welded with the electronic components needs to be fixed in the electronic equipment, and the electronic equipment needs to be light and thin, and also needs to be resistant to fall and shock during transportation or use.
  • Figure 1 (a) is a cross-sectional view of the related art PCB board patch structure.
  • the related art PCB patch method is to set the patch component on the first side of the PCB board away from the protruding body 11 of the pin 12, and then lead the patch component Pin 12 is soldered to PCB board 2.
  • the related technology first arranges two SMD components on the first and second sides of the PCB board, and then attaches The pin 12 of the component is soldered to the PCB board 2.
  • the total thickness of the PCB board patch structure after bidirectional soldering of the patch components is the sum of the thickness of the two electronic components and the thickness of the PCB board itself; and the patch components are exposed outside the PCB board, which is very easy to damage during transportation or installation SMD components.
  • the present application provides a method and structure for attaching a PCB board, so as to reduce the height of the PCB board after welding the components, and embed the components in the PCB board to protect the components.
  • the embodiment of the application provides a method for mounting a PCB board, including:
  • At least one patch component setting hole is formed on the PCB board
  • the embodiment of the present application also provides a patch structure of a PCB board, including:
  • PCB board and at least one first first patch component
  • the PCB board is provided with at least one first patch component setting hole; the first patch component is located in the first patch component setting hole with respect to the protruding body of the pin surface; The pin of a patch component is soldered on the soldering point on the first side of the PCB board.
  • the SMD component is soldered to the protruding body relative to the pin surface and placed in the SMD component setting hole of the PCB board, which solves the problem that the SMD component is exposed outside the PCB board and is very easy to damage the sticker during transportation or installation.
  • the problem of chip components achieves the effects of protecting chip components and reducing the thickness of the PCB after soldering components.
  • Figure 1 (a) is a cross-sectional view of the patch structure of the related technology PCB board
  • Figure 1(b) is a cross-sectional view of the patch structure of the PCB board with bidirectional patch components in the related art
  • FIG. 2 is a flowchart of a method for mounting a PCB board in Embodiment 1 of the present application;
  • Figure 3(a) is a top view of the PCB board before the first patch component is placed on the PCB in the first embodiment of the present application;
  • Figure 3(b) is a cross-sectional view of the PCB board in the first embodiment of the application after the first patch component is attached;
  • Figure 3(c) is a schematic diagram of the height of the body of the first placement component of the PCB board being greater than the thickness of the PCB board in the first embodiment of the application;
  • FIG. 4 is a flowchart of a method for mounting a PCB board in the second embodiment of the present application
  • Fig. 5(a) is a top view of the PCB board in the second embodiment of the application before the first patch component and the second patch component are placed;
  • Figure 5(b) is a cross-sectional view of the PCB board in the second embodiment of the application after the first patch component and the second patch component are attached;
  • Fig. 6 is a top view of the patch structure of the PCB board in the third embodiment of the present application.
  • first”, “second”, etc. may be used herein to describe various directions, actions, steps or elements, etc., but these directions, actions, steps or elements are not limited by these terms. These terms are only used to distinguish a first direction, action, step or element from another direction, action, step or element.
  • first speed difference may be referred to as the second speed difference
  • second speed difference may be referred to as the first speed difference.
  • the first speed difference and the second speed difference are both speed differences, but not the same speed difference.
  • the terms “first”, “second”, etc. cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features.
  • first and second may explicitly or implicitly include one or more of these features.
  • a plurality of means at least two, such as two, three, etc., unless specifically defined otherwise.
  • a part is called “fixed” to another part, it can be directly on the other part or there may be a central part.
  • a part is considered “connected” to another part, it can be directly connected to the other part or there may be a central part at the same time.
  • the terms “vertical”, “horizontal”, “left”, “right” and similar expressions used in this application are for illustrative purposes only and do not mean that they are the only implementation.
  • Fig. 2 is a flowchart of a method for mounting a PCB board according to the first embodiment of the application, including the following steps:
  • Step 202 Form at least one patch component setting hole on the PCB board.
  • Fig. 3(a) is a top view of the PCB board before the first patch component is attached to the first embodiment of the application.
  • at least one patch element setting hole 31 may be formed on the PCB board 3 by stamping.
  • a plurality of soldering points 32 are provided around the patch component installation hole 31.
  • Step 204 Place the protruding body of the first SMD component relative to the pin surface in the SMD component setting hole, and attach the pin of the first SMD component to the soldering point on the first surface of the PCB board .
  • FIG. 3(b) is a cross-sectional view of the first patch component attached to the PCB board in the first embodiment of the present application.
  • the body 11 of the first SMD component raised with respect to the pin 12 is placed in the SMD component setting hole 31, and the pin 12 of the first SMD component is attached to the soldering point on the first surface of the PCB 3 32 on.
  • the shape of the patch element setting hole 31 is the same as the outer peripheral shape of the body 11 of the first patch element protruding with respect to the pin 12.
  • the shape of the patch element setting hole 31 is also rectangular; if the outer peripheral shape of the body 11 of the first patch element is circular, the patch The shape of the chip element setting hole 31 is also circular.
  • the inner diameter of the patch element setting hole 31 is greater than or equal to the outer diameter of the body 11 of the first patch element, so that the body 11 of the first patch element can be placed in the patch element setting hole 31.
  • Step 206 Weld the pins of the first patch component with the soldering points of the PCB board.
  • the method of soldering the pins of the first SMD component to the PCB board can be soldered with an electric soldering iron; it can also be pre-applied with solder paste on the soldering points, and after placing the first SMD component, pass the whole Heat to solder. That is, before step 206, it further includes: applying solder on the soldering points on the first side of the PCB board.
  • Fig. 3(b) exemplifies the height of the body 11 where the first patch element is provided is less than the thickness of the PCB board 3.
  • the body 11 of the first patch element may be provided as shown in Figure 3(c).
  • the height is greater than the thickness of the PCB board 3. This application does not limit this.
  • the technical solution of the first embodiment of the present application because the body 11 of the first patch element protruding with respect to the pin 12 is placed in the patch element setting hole 31, if the thickness of the PCB board is H1 , The thickness of the pins of the first SMD component is H2, and the height of the pins removed by the first SMD component is H3.
  • the total height of the PCB board after attaching the first patch component is the sum of the pin height of the first patch component and the thickness of the PCB board, that is, H1+H2, while the PCB board is attached in the related art
  • the total height after attaching the patch component is H1+H2+H3.
  • the solution of the first embodiment of the present application reduces the total height of the PCB board after attaching the patch component by H3; remove the lead from the body of the first patch component
  • the total height of the PCB board after attaching the patch components in the technical solution of the first embodiment of the present application is the sum of the pin height of the first patch component and the thickness of the PCB board. H2+H3, therefore, the solution of the first embodiment of the present application reduces the total height of the PCB board after attaching the first patch component by H1.
  • the PCB board also serves as a protective patch.
  • the function of the component reduces the problem of damage to the patch component due to bumps during transportation or installation.
  • Fig. 4 is a flowchart of a method for mounting a PCB board according to the second embodiment of the application, including the following steps:
  • Step 402 forming at least one patch component setting hole on the PCB board.
  • Step 404 Apply solder on the solder joints on the first side of the PCB board.
  • the application of solder on the solder joints may be by injection drip coating or printing coating.
  • the soldering point 42 is not only provided around the placement hole 41 of the patch component, but also at the preset soldering position of the pins of other patch components.
  • Step 406 Place the protruding body of the first patch component relative to the pin surface in the first patch component setting hole, and attach the pin of the first patch component to the first surface of the PCB board On the solder joints.
  • Step 408 Place the second SMD component on the first surface of the PCB board, where the second SMD component faces away from the first surface of the PCB board with respect to the protruding body of the pin surface, and the lead of the second SMD component The feet are attached to the solder joints on the first side of the PCB.
  • first patch element and the second patch element are only to distinguish the patch elements.
  • the first patch element and the second patch element may be the same type of patch element, or different types of patch elements.
  • the mounting can be performed on the same side of the PCB board, avoiding the bidirectional mounting as described in Figure 1(b) in the related art.
  • the embodiment of the present application exemplarily attaches two patch components to the first surface of the PCB board 4.
  • the number of patch components can be flexibly set when patching on the same side of the PCB board according to the actual design requirements of the PCB board.
  • the embodiments of the present application do not limit the order of attaching SMD components on the same surface of the PCB board. Multiple SMD components can be attached to the same surface of the PCB board in turn, or multiple SMD components can be attached to the same surface of the PCB board at the same time. SMD components are attached to the same side of the PCB board. That is, the embodiment of the present application does not limit the order of step 406 and step 408.
  • Step 410 Weld the pins of the first patch component and the pins of the second patch component to the soldering points of the PCB board respectively.
  • the first patch component in the embodiment of the present application may be a light-emitting component, such as an LED component.
  • the light-emitting components need to be directly attached to the second side of the PCB board to achieve the effect of emitting light on the second side of the PCB board.
  • the body of the light-emitting component is built into the placement hole of the patch component, and it can be transported and used first.
  • the light-emitting components are protected during the process, and then the total thickness of the PCB board after attaching the patch components can be reduced, and the light-emitting components can also be prevented from leaking during use.
  • the technical solution of the second embodiment of the present application places the first SMD component relative to the protruding body of the pin 12 11 is placed in the patch component setting hole 41, and the pin 12 of the first patch component is attached to the soldering point 42 on the first side of the PCB board; the second patch component is attached to the PCB board
  • the body 11 of the second SMD component raised with respect to the pin 12 faces away from the first surface of the PCB board, and the pin 12 of the second SMD component is attached to the first surface of the PCB board Welding point 42 on.
  • the total height after attaching two-way SMD components on the PCB board is the same as that of the body of the SMD component The sum of the thickness and the thickness of the PCB board.
  • the total height of the PCB board after two-way attached SMD components is the sum of the thickness of the two SMD component bodies and the thickness of the PCB board.
  • the second embodiment of the present application avoids the problem that the overall thickness of the PCB board in the related art is large after the chip components are attached to the bidirectionally, and achieves the saving of solder during the chip placement, reducing the difficulty of attaching the chip components, and reducing The effect of the total thickness of the small PCB board after attaching the chip components in both directions.
  • Fig. 6 is a top view of the patch structure of the PCB board in the third embodiment of the present application.
  • a plurality of first patch components can be placed in one patch component setting hole 51.
  • multiple first patch components are placed in one patch component setting hole 51, which solves the problem that multiple patch components need to be provided with multiple patch component setting holes, and reduces the PCB board. The effect of the process difficulty of the opening.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

一种PCB板（3）贴片方法及结构。所述方法包括：在PCB板（3）上形成至少一个贴片元件设置孔（31）（202）；将第一贴片元件相对于所述第一贴片元件的引脚（12）面凸起的本体（11）放置于所述贴片元件设置孔（31）中，并将所述第一贴片元件的引脚（12）贴附在所述PCB板（3）的第一面的焊接点（32）上（202）；将所述第一贴片元件的引脚（12）与所述PCB板（3）的焊接点（32）焊接（206）。

Description

PCB板贴片方法及结构
本申请要求在2019年03月27日提交中国专利局、申请号为201910239323.9的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及PCB板上元件的贴片技术，例如涉及一种PCB板贴片方法及结构。
背景技术
PCB(Printed Circuit Board)，中文名称为印制电路板，又称印刷线路板，是重要的电子部件，是电子元器件的支撑体，是贴片元件电气连接的载体，电子设备中的贴片元件需要焊接在PCB板的电路中来实现电器功能。焊接了电子元器件的PCB板又需要固定在电子设备中，而电子设备需要轻薄化，在运输或者使用过程中也需要耐摔抗震。
图1(a)为相关技术PCB板贴片结构的剖面图。如图1(a)所示，相关技术的PCB板贴片方法为先将贴片元件相对于引脚12凸起的本体11背离设置在PCB板的第一面，再将贴片元件的引脚12和PCB板2焊接。在需要贴附多个贴片元件的情况下，如图1(b)所示，相关技术先将两个贴片元件分别设置在PCB板的第一面和第二面，再分别将贴片元件的引脚12与PCB板2焊接。双向焊接贴片元件后的PCB板贴片结构的总厚度为两个电子元器件的厚度与PCB板自身厚度之和；并且贴片元件暴露在PCB板外，在运输或者安装过程中非常容易损坏贴片元件。
发明内容
本申请提供一种PCB板贴片方法及结构，以实现降低PCB板焊接元器件之后的高度，将元件内嵌于PCB板中，保护元件。
本申请实施例提供了一种PCB板贴片方法，包括：
在PCB板上形成至少一个贴片元件设置孔；
将第一贴片元件相对于所述第一贴片元件引脚面凸起的本体放置于所述贴 片元件设置孔中，并将所述第一贴片元件的引脚贴附在所述PCB板的第一面的焊接点上；
将所述第一贴片元件的引脚与所述PCB板的焊接点焊接。
本申请实施例还提供了一种PCB板的贴片结构，包括：
PCB板和至少一个第一第一贴片元件；
其中，所述PCB板上设置有至少一个第一贴片元件设置孔；所述第一贴片元件相对于引脚面凸起的本体位于所述第一贴片元件设置孔中；所述第一贴片元件的引脚焊接在所述PCB板的第一面的焊接点上。
本申请通过将贴片元件焊接于相对于引脚面凸起的本体放置于PCB板的贴片元件设置孔中，解决贴片元件暴露在PCB板外，在运输或者安装过程中非常容易损坏贴片元件的问题，实现保护贴片元件和降低了焊接元件后的PCB的厚度的效果。
附图说明
图1(a)为相关技术PCB板的贴片结构的剖面图；
图1(b)为相关技术中双向贴附贴片元件的PCB板的贴片结构的剖面图；
图2是本申请实施例一中PCB板贴片方法的流程图；
图3(a)是本申请实施例一中PCB板贴放第一贴片元件前的俯视图；
图3(b)是本申请实施例一中PCB板贴放第一贴片元件后的剖面图；
图3(c)是本申请实施例一中PCB板的第一贴放元件本体高度大于PCB板厚度示意图；
图4是本申请实施例二中PCB板贴片方法的流程图；
图5(a)是本申请实施例二中PCB板贴放第一贴片元件和第二贴片元件前的俯视图；
图5(b)是本申请实施例二中PCB板贴放第一贴片元件和第二贴片元件后的剖面图；
图6是本申请实施例三中PCB板的贴片结构的俯视图。
具体实施方式
下面结合附图并通过具体实施方式来说明本申请的技术方案。此处所描述的具体实施例仅仅用于解释本申请，而非对申请的限定。另外，为了便于描述，附图中仅示出了与本申请相关的部分而非全部结构；所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。
除非另有定义，本文所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。本文中在本申请的说明书中使用的术语只是为了描述具体的实施方式的目的，不是在于限制本申请。本文所使用的术语“和/或”包括一个或多个相关的所列项目的任意的和所有的组合。
此外，术语“第一”、“第二”等可在本文中用于描述多种方向、动作、步骤或元件等，但这些方向、动作、步骤或元件不受这些术语限制。这些术语仅用于将第一个方向、动作、步骤或元件与另一个方向、动作、步骤或元件区分。举例来说，在不脱离本申请的范围的情况下，可以将第一速度差值称为第二速度差值，且类似地，可将第二速度差值称为第一速度差值。第一速度差值和第二速度差值两者都是速度差值，但不是同一速度差值。术语“第一”、“第二”等不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。当部被称为“固定于”另一个部，它可以直接在另一个部上也可以存在居中的部。当一个部被认为是“连接”到另一个部，它可以是直接连接到另一个部或者可能同时存在居中部。本申请所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述，只是为了说明的目的，并不表示是唯一的实施方式。
实施例一
图2为本申请实施例一提供的一种PCB板贴片方法的流程图，包括如下步骤：
步骤202、在PCB板上形成至少一个贴片元件设置孔。
图3(a)是本申请实施例一中PCB板贴放第一贴片元件前的俯视图。在一实施例中，可以通过冲压的方式在PCB板3上形成至少一个贴片元件设置孔31。贴片元件设置孔31的周围设有多个焊接点32。
步骤204、将第一贴片元件相对于引脚面凸起的本体放置于贴片元件设置孔中，并将第一贴片元件的引脚贴附在PCB板的第一面的焊接点上。
图3(b)是本申请实施例一中PCB板上贴附第一贴片元件后的剖面图。第一贴片元件相对于引脚12面凸起的本体11放置于贴片元件设置孔31中，并将第一贴片元件的引脚12贴附在PCB板3的第一面的焊接点32上。
在一实施例中，贴片元件设置孔31的形状与第一贴片元件相对于引脚12面凸起的本体11的外周形状相同。示例性的，若第一贴片元件的本体11的外周形状为矩形，则贴片元件设置孔31的形状也为矩形；若第一贴片元件的本体11的外周形状为圆形，则贴片元件设置孔31的形状也为圆形。且贴片元件设置孔31的内径大于等于第一贴片元件的本体11的外径，以方便第一贴片元件的本体11可以放置于贴片元件设置孔31中。
步骤206、将第一贴片元件的引脚与PCB板的焊接点焊接。
在一实施例中，焊接第一贴片元件的引脚与PCB板的方法，可以采用电烙铁焊接；也可以采用在焊接点上预涂锡膏，在放置好第一贴片元件后通过整体加热来焊接。即，在步骤206之前还包括：在PCB板的第一面的焊接点上涂抹焊接料。
图3(b)示例性的设置第一贴片元件的本体11的高度小于PCB板3的厚度，在其他实施方式中还可以如图示3(c)，设置第一贴片元件的本体11的高度大于PCB板3的厚度。本申请对此不做限定。
相对于相关技术，本申请实施例一的技术方案，由于将第一贴片元件相对于引脚12面凸起的本体11放置于贴片元件设置孔31中，若设PCB板的厚度为H1，第一贴片元件的引脚的厚度为H2，第一贴片元件除去引脚的高度为H3，在第一贴片元件的本体除去引脚的高度的小于PCB板的厚度的情况下，本申请实施例一的技术方案中PCB板贴附第一贴片元件后的总高度为第一贴片元件引脚高度和PCB板的厚度之和即H1+H2，而相关技术中PCB板贴附贴片元件后的总高度为H1+H2+H3，因此，本申请实施例一的方案将PCB板贴附贴片元件后的总高度降低了H3；在第一贴片元件的本体除去引脚的高度大于PCB板的厚度的情况下，本申请实施例一的技术方案中PCB板贴附贴片元件后的总高度为第一贴片元件的引脚高度和PCB板的厚度之和即H2+H3，因此，本申请实施例 一的方案将PCB板贴附第一贴片元件后的总高度降低了H1。
此外，由于第一贴片元件的本体11放置于贴片元件设置孔31中，贴片元件并没有暴露在PCB板外，因此在本申请实施例的技术方案中PCB板还起到了保护贴片元件的作用，减少在运输或安装时贴片元件因磕碰导致的损坏的问题。
实施例二
图4为本申请实施例二提供的一种PCB板贴片方法的流程图，包括如下步骤：
步骤402、在PCB板上形成至少一个贴片元件设置孔。
步骤404、在PCB板的第一面的焊接点上涂抹焊接料。
在一实施例中，在焊接点上涂抹焊接料可以采用注射滴涂法或印刷涂敷法。如图5(a)所示，焊接点42除了设在贴片元件设置孔41周围，还设在其他贴片元件引脚预设的焊接位置。
步骤406、将第一贴片元件相对于引脚面凸起的本体放置于所述第一贴片元件设置孔中，并将第一贴片元件的引脚贴附在PCB板的第一面的焊接点上。
步骤408、将第二贴片元件贴放于PCB板的第一面，其中第二贴片元件相对于引脚面凸起的本体背离PCB板的第一面，且第二贴片元件的引脚贴附在PCB板的第一面的焊接点上。
在一实施例中，第一贴片元件以及第二贴片元件仅为了将贴片元件进行区分。第一贴片元件和第二贴片元件可以是同种类型的贴片元件，也可以是不同种类型的贴片元件。
本申请实施例中，可以在PCB板的同一面进行贴片，避免如相关技术中图1(b)所述的双向贴片。如图5(b)所示，本申请实施例示例性的在PCB板4的第一面贴附了两个贴片元件。在其他实施方式中，可以根据PCB板的实际设计需要，在PCB板的同一面进行贴片时，灵活设置贴片元件的数量。
此外，本申请实施例对在PCB板的同一面上的贴片元件贴附的顺序不做限定，可以依次将多个贴片元件贴附在PCB板的同一面上，也可以同时将多个贴片元件贴附在PCB板的同一面上。即本申请实施例对步骤406和步骤408的顺序不做限定。
步骤410、将第一贴片元件的引脚和第二贴片元件的引脚分别与PCB板的焊接点焊接。
在一实施例中，本申请实施例中的第一贴片元件可以是发光元器件，例如LED元件。相关技术中，发光元器件需要直接贴附在PCB板的第二面，才可以实现在PCB板第二面发光的效果。本申请中只需要在PCB板的第一面进行贴片，即可实现在PCB板第二面发光的效果，且发光元器件的本体内置于贴片元件设置孔中，首先可以在运输和使用过程中保护发光元器件，然后可以降低贴附贴片元件后PCB板的总厚度，还可以防止发光元器件在使用过程中漏光。
相对于相关技术中PCB板双向贴附贴片元件的方法，本申请实施例二的技术方案，如图5(b)所示，将第一贴片元件相对于引脚12面凸起的本体11放置于所述贴片元件设置孔41中，并将第一贴片元件的引脚12贴附在PCB板的第一面的焊接点42上；将第二贴片元件贴放于PCB板的第一面，且第二贴片元件相对于引脚12面凸起的本体11背离PCB板的第一面，且第二贴片元件的引脚12贴附在PCB板的第一面的焊接点42上。由于所有贴片元件的引脚均焊接在第一面，所以只需在第一面涂敷焊接料，并且贴片元件只需在第一面进行贴放，因此，可以解决PCB板在双向贴附贴片元件的情况下，需要在PCB板的两面均涂抹焊接料的问题；本申请实施例二的技术方案，在PCB板贴双向附贴片元件后的总高度为一个贴片元件本体的厚度和PCB板的厚度之和，而相关技术中PCB板贴双向附贴片元件后的总高度为两个贴片元件本体的厚度与PCB板的厚度之和，因此，相对于相关技术，本申请实施例二的技术方案中PCB板贴双向附贴片元件后的总厚度降低了一个贴片元件本体的厚度。所以，本申请实施例二避免了相关技术PCB板双向贴附贴片元件后整体厚度较大的问题，达到了在贴片时，节约焊接料，降低了贴附贴片元件的难度，同时减小PCB板双向贴附贴片元件后的总厚度的效果。
实施例三
图6是本申请实施例三中PCB板的贴片结构的俯视图。如图6所示，一个贴片元件设置孔51中可放置多个第一贴片元件。本申请实施例三通过在一个贴片元件设置孔51中放置多个第一贴片元件，解决了贴放多个贴片元件需要设置多个贴片元件设置孔的问题，达到了降低PCB板开孔的工艺难度的效果。

Claims (10)

  1. 一种印制电路板PCB板贴片方法，包括：
    在PCB板上形成至少一个贴片元件设置孔；
    将第一贴片元件相对于所述第一贴片元件的引脚面凸起的本体放置于所述贴片元件设置孔中，并将所述第一贴片元件的引脚贴附在所述PCB板的第一面的焊接点上；
    将所述第一贴片元件的引脚与所述PCB板的焊接点焊接。
  2. 根据权利要求1所述的PCB板贴片方法，其中，所述贴片元件设置孔的内径大于或等于所述第一贴片元件的本体的外径。
  3. 根据权利要求1或2所述的PCB板贴片方法，在PCB板上形成至少一个贴片元件设置孔之后，还包括：
    在所述PCB板的第一面的焊接点上涂抹焊接料。
  4. 根据权利要求1、2或3所述的PCB板贴片方法，其中，所述第一贴片元件包括发光元器件。
  5. 根据权利要求1-4任一项所述的PCB板贴片方法，在将所述第一贴片元件的引脚与所述PCB板的焊接点焊接之前，还包括：
    在所述PCB板的第一面贴放至少一个第二贴片元件；其中，所述第二贴片元件相对于所述第二贴片元件的引脚面凸起的本体背离所述PCB板的第一面，且所述第二贴片元件的引脚贴附在所述PCB板的第一面的焊接点上。
  6. 根据权利要求5所述的PCB板贴片方法，将所述第一贴片元件的引脚与所述PCB板的焊接点焊接的同时，还包括：
    将所述第二贴片元件的引脚与所述PCB板的焊接点焊接。
  7. 一种印制电路板PCB板的贴片结构，包括：
    PCB板和至少一个第一贴片元件；
    其中，所述PCB板上设置有至少一个贴片元件设置孔；所述第一贴片元件相对于所述第一贴片元件的引脚面凸起的本体位于所述贴片元件设置孔中；所述第一贴片元件的引脚焊接在所述PCB板的第一面的焊接点上。
  8. 根据权利要求7所述PCB板的贴片结构，还包括：至少一个第二贴片元 件；
    所述第二贴片元件相对于所述第二贴片元件的引脚面凸起的本体背离所述PCB板的第一面，且所述第二贴片元件的引脚焊接在所述PCB板的第一面的焊接点上。
  9. 根据权利要求7或8所述PCB板的贴片结构，其中，一个所述贴片元件设置孔中放置至少一个所述第一贴片元件。
  10. 根据权利要求7、8或9所述PCB板的贴片结构，其中，所述贴片元件设置孔贯穿所述PCB板，所述第一贴片元件为发光元器件。
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CN109842998A (zh) * 2019-03-27 2019-06-04 深圳市中孚能电气设备有限公司 Pcb板贴片方法及结构
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