WO2020186850A1 - 网板阶梯的设计方法、系统、计算机可读存储介质及设备 - Google Patents

网板阶梯的设计方法、系统、计算机可读存储介质及设备 Download PDF

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Publication number
WO2020186850A1
WO2020186850A1 PCT/CN2019/126332 CN2019126332W WO2020186850A1 WO 2020186850 A1 WO2020186850 A1 WO 2020186850A1 CN 2019126332 W CN2019126332 W CN 2019126332W WO 2020186850 A1 WO2020186850 A1 WO 2020186850A1
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Prior art keywords
stencil
opening
screen
ladder
design
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PCT/CN2019/126332
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English (en)
French (fr)
Inventor
刘继硕
刘久轩
宋勇强
瞿永建
钱胜杰
Original Assignee
上海望友信息科技有限公司
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Application filed by 上海望友信息科技有限公司 filed Critical 上海望友信息科技有限公司
Priority to US17/438,895 priority Critical patent/US20220147684A1/en
Priority to EP19920274.8A priority patent/EP3923153A4/en
Priority to JP2021555522A priority patent/JP7202557B2/ja
Publication of WO2020186850A1 publication Critical patent/WO2020186850A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/392—Floor-planning or layout, e.g. partitioning or placement
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/18—Manufacturability analysis or optimisation for manufacturability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Definitions

  • the present invention belongs to the field of electronic manufacturing technology, and relates to a design method and system, and in particular to a design method, system, computer-readable storage medium and equipment of a net plate ladder.
  • Step 1 Import the Gerber pad layer with CircuitCAM
  • Step 2 use the naked eye to find out which pad screen openings need to be stepped, and then manually select it, and use the graphics tool in the software to manually draw the stepped area;
  • Step 3 Repeat step 2 until all ladder designs on the PCB are completed;
  • the purpose of the present invention is to provide a method, system, computer-readable storage medium and equipment for designing stencil ladders, which are used to solve the problem of manual calculation of ladders in the operation process of the prior art. Scope, the problem that requires repeated modification and confirmation by the operator, and relatively high requirements for the personal ability of the operator.
  • one aspect of the present invention provides a method for designing a stencil ladder, which includes: acquiring the stencil opening data of an electronic device in a circuit board, and identifying the stencil openings of the electronic device one by one. Determine whether it needs to be stepped; if so, perform step design on the opening of the screen to be stepped according to the preset step rule corresponding to the screen opening of the electronic device to form a stepped screen step design file. And output the stencil ladder design file; if not, end the ladder stencil design and output the opening design file.
  • the method for designing the screen ladder before the step of obtaining the screen opening data of the electronic device in a circuit board, the method for designing the screen ladder further includes: reading the CAD file of the circuit board, and converting the CAD file of the circuit board Convert and save the file as CAD graphic data, and load the package information and related opening attribute information in the CAD file to the corresponding CAD component layer;
  • the method for designing the screen ladder further includes: searching whether a screen for storing the screen opening data is created in advance. Plate opening database; if yes, automatically match the step thickness attribute of the stencil opening of the electronic device in the stencil opening database; if not, add step thickness attribute to the stencil opening that needs to be stepped in the stencil opening data.
  • the step of identifying the screen openings of the electronic device one by one to determine whether it needs to be stepped includes: searching the preset of the screen opening of the electronic device according to the step thickness attribute Basic thickness of the stencil; according to the preset basic thickness of the stencil, determine whether the step thickness of the stencil opening of the electronic device is equal to the preset basic thickness of the stencil; if so, it is recognized that the stencil opening of the electronic device does not need to be stepped; If not, it is recognized that the screen opening of the electronic device needs to be stepped.
  • the preset step rule corresponding to the screen opening of the electronic device one-to-one includes: the step thickness difference of the screen opening of the electronic device is a preset thickness difference threshold; the step frame of the electronic device The distance between the distance and the opening of the inner screen is within the first preset distance range; and/or the distance between the step frame distance of the electronic device and the opening of the outer screen is within the second preset distance.
  • the step of performing step design on the opening of the screen plate to be stepped according to a preset step rule includes: according to the first preset distance range and/or the second preset distance Range, calculate the step area of the screen opening of the electronic device; add step text at the step center of the step area; the step text includes the step thickness and step surface information of the screen opening of the electronic device.
  • the stencil step design method further includes: real-time detection of whether the formed stencil step design file is qualified, and if so, output If not, the stencil ladder design file will output a modification instruction for the stencil ladder design file.
  • a screen ladder design system including: an acquisition module for acquiring screen opening data of electronic devices in a circuit board, and a processing module for identifying screen openings of electronic devices one by one , In order to judge whether it needs to be stepped; if so, according to the preset step rule corresponding to the screen opening of the electronic device, a step design is performed on the screen opening that needs to be stepped to form a stepped screen step design File, and output the stencil ladder design file through an output module; if not, end the ladder stencil design, and output the opening design file through the output module.
  • Another aspect of the present invention provides a computer-readable storage medium on which a computer program is stored, and when the program is executed by a processor, the method for designing the screen ladder is realized.
  • the last aspect of the present invention provides a device including: a processor and a memory; the memory is used to store a computer program, and the processor is used to execute the computer program stored in the memory, so that the device executes the screen Ladder design method.
  • the design method, system, computer-readable storage medium and equipment of the screen ladder of the present invention have the following beneficial effects:
  • the design method, system, computer readable storage medium and equipment of the stencil ladder of the present invention can automatically complete the design of more than 90% of the ladders and the design meets the processing requirements.
  • the manual intervention process is omitted, and a few simple steps can be completed, saving more than 60%-80% of the time and reducing the error probability of the stencil ladder design.
  • the present invention does not have high requirements for designers to master the skills and knowledge, which can be completed by ordinary operators, which greatly reduces the risk caused by the flow of personnel in this position to the enterprise, and in a sense also helps the enterprise to save labor costs. .
  • FIG. 1 shows a schematic flow diagram of a method for designing a stencil ladder of the present invention in an embodiment.
  • FIG. 2 is a schematic diagram of an example of a ladder automatically designed according to a preset ladder rule according to the present invention.
  • FIG. 3 is a schematic diagram of the principle structure of the design system of the screen ladder of the present invention in an embodiment.
  • FIG. 4 shows a schematic diagram of the principle structure of the device of the present invention in an embodiment.
  • the corresponding opening thickness can be obtained by matching the library; if no stencil opening library is created, the input CAD data can be sorted into a device package list according to the device package name, and then send to the needs Add the thickness attribute to the mesh opening corresponding to the stepped device package.
  • the thickness value is the step thickness value.
  • the step area is automatically calculated and designed automatically through the corresponding step rules generated by the screen design step specification. If all the rules are not met, the important rules are selected for the step design.
  • This module can not only complete the design of conventional steps such as circular and rectangular steps, but also complete operations such as contraction, expansion, rotation, and merging of existing steps.
  • step screen After the step screen is automatically opened, it will automatically use the step rule (consistent with the step rule used for automatic opening of the screen) to check the opening of the screen and list the items that do not conform to the step. It is supported to select the list step and highlight it on the drawing. The qualified part.
  • Output screen processing data such as: DXF, Gerber, etc.
  • This embodiment provides a method for designing a stencil ladder, including:
  • step design on the screen opening that needs to be stepped to form a step design file of the screen step design and output the screen step design File; if not, end the ladder screen design and output the opening design file.
  • FIG. 1 shows a schematic flow diagram of a design method of a stencil ladder in an embodiment.
  • the design method of the stencil ladder specifically includes the following steps:
  • S11 Read a CAD file of a circuit board, convert and save the CAD file of the circuit board into CAD graphic data, and load the package information and related opening attribute information in the CAD file to the corresponding CAD component layer.
  • the package information and related opening attribute information in the CAD file it is possible to clearly know which openings belong to a package when the steps are automatically opened.
  • S12 Determine whether there is stencil opening Gerber data corresponding to the CAD graphic data; if so, execute S13, which is to perform coordinate position calibration on the stencil opening Gerber data and the CAD graphic data (in the embodiment, the stencil opening Gerber data Performing coordinate position calibration with the CAD graphic data refers to aligning the stencil opening Gerber data with the CAD graphic data) and then adding the relevant opening attribute information on the CAD component layer to the corresponding stencil opening on the stencil opening Gerber data.
  • S15 execute S14, that is, extract the stencil opening pad layer to be converted from the CAD graphics data, and generate the stencil opening layer, and go to S15.
  • the screen opening data of the electronic device in the circuit board includes the coordinates of the electronic device, the packaging of the electronic device, and the material code of the electronic device.
  • S16 find out whether a stencil opening database for storing stencil opening data is created in advance; if yes, execute S16', that is, search for the step thickness attribute of the stencil opening of the electronic device in the stencil opening database; if not, execute S16 ", that is, add the step thickness attribute to the stencil opening that needs to be stepped in the stencil opening data.
  • S17 Identify the screen openings of the electronic device one by one to determine whether they need to be stepped; if yes, execute S18, if not, execute S10, that is, end the stepped screen design and output the original opening design file.
  • the S17 includes:
  • the preset basic thickness of the stencil it is judged whether the step thickness value of the stencil opening of the electronic device is equal to the preset stencil basic thickness; if so, it is recognized that the stencil opening of the electronic device does not need to be stepped; if not, it is identified The screen opening of the electronic device needs to be stepped.
  • the stencil opening of the electronic device does not need to be stepped; if the step thickness of the stencil opening of the electronic device is not equal to a, then the screen opening of the electronic device needs to be stepped.
  • the preset base thickness is g
  • the step thickness of the screen opening of the electronic device is h
  • the screen opening in h that is greater than g needs to be thickened and the step thickness difference is hg
  • h is less than
  • the screen opening of g needs to be thinned and the step thickness difference is gh;
  • the preset step rule corresponding to the screen opening of the electronic device one-to-one includes: the step thickness difference of the screen opening of the electronic device is the preset thickness difference threshold; The distance of the screen opening is within the first preset distance range; and/or the distance between the step frame distance of the electronic device and the outer screen opening is within the second preset distance range.
  • Figure 2 shows a schematic diagram of an example of a ladder automatically designed according to a preset ladder rule.
  • the preset step rule for the screen openings of electronic devices one-to-one requires that when the step thickness difference is 0.3, the distance c between the step frame of the electronic device and the screen opening in the step is greater than e, and the step of the electronic device
  • the distance d between the frame and the outer screen opening of the ladder is greater than f (e and f refer to the size value required in the corresponding preset ladder rule)
  • the automatically opened ladder must meet c>e, d>f(c and d represents the actual distance between the ladder frame and the inner and outer openings of the ladder). If the two conditions cannot be met at the same time, c>e will be satisfied first.
  • a step text is added at the center of the step in the step area; the step text includes the step thickness and step surface information of the screen opening of the electronic device.
  • This embodiment provides a computer-readable storage medium on which a computer program is stored, and when the program is executed by a processor, the design method of the above-mentioned screen ladder is realized.
  • a person of ordinary skill in the art can understand that all or part of the steps in the foregoing method embodiments can be implemented by hardware related to a computer program.
  • the aforementioned computer program can be stored in a computer-readable storage medium.
  • the steps including the foregoing method embodiments are executed; and the foregoing storage medium includes: ROM, RAM, magnetic disk, or optical disk and other media that can store program codes.
  • the design method of the stencil ladder described in this embodiment can automatically complete the design of more than 90% of the ladders and the design meets the processing requirements.
  • the manual intervention process is omitted, and it can be completed in a few simple steps, saving more than 60%-80% of time, and reducing the error probability of the stencil ladder design.
  • this method does not require high skill knowledge for designers, and can be completed by ordinary operators, which greatly reduces the risks caused by the movement of personnel in this position to the enterprise, and in a sense, it also helps the enterprise to save labor costs. .
  • This embodiment provides a design system for a stencil ladder, including:
  • the acquisition module is used to acquire the mesh opening data of the electronic device in a circuit board
  • the processing module is used to identify the screen openings of the electronic device one by one to determine whether it needs to be stepped; if so, according to the preset step rule corresponding to the screen opening of the electronic device one by one, the screen that needs to be stepped
  • the opening is designed with steps to form a step design file of the screen with a step design, and the screen step design file is output through an output module; if not, the step screen design is ended, and the opening design file is output through the output module.
  • FIG. 3 shows a schematic diagram of the principle structure of a design system for a stencil ladder in an embodiment.
  • the design system 3 of the stencil ladder includes: a reading module 31, a processing module 32, an acquisition module 33 and an output module 34.
  • the reading module 31 is used to read a CAD file of a circuit board, convert and save the CAD file of the circuit board into CAD graphic data, and load the package information and related opening attribute information in the CAD file to the corresponding CAD component Floor.
  • the package information and related opening attribute information in the CAD file to the corresponding CAD component layer, it is possible to clearly know which openings belong to a package when the steps are automatically opened.
  • the processing module 32 coupled with the reading module 31 is used to determine whether there is stencil opening Gerber data corresponding to the CAD graphic data; if so, perform coordinate position calibration on the stencil opening Gerber data and the CAD graphic data (in implementation In an example, the processing module 32 performs coordinate position calibration refers to aligning the stencil opening Gerber data with the CAD graphic data), and then adding the relevant opening attribute information on the CAD component layer to the corresponding stencil opening on the stencil opening Gerber data , To generate the stencil opening layer, and call the acquisition module 33; if not, extract the stencil opening pad layer to be converted from the CAD graphic data, and generate the stencil opening layer, and call the acquisition module 33 .
  • the acquiring module 33 coupled with the reading module 31 and the processing module 32 is used for acquiring the screen opening data of the electronic device in the circuit board.
  • the screen opening data of the electronic device in the circuit board includes the coordinates of the electronic device, the packaging of the electronic device, and the material code of the electronic device.
  • the processing module 32 searches whether to create a screen opening database for storing screen opening data in advance; if so, it automatically matches the step thickness attribute of the screen opening of the electronic device in the screen opening database; if not, it checks the screen opening database. In the plate opening data, you need to add the step thickness attribute to the stepped screen opening.
  • the processing module 32 is also used to identify the screen openings of the electronic device one by one to determine whether it needs to be stepped; if so, according to the preset step rule corresponding to the screen opening of the electronic device, the steps need to be made.
  • Step design is performed on the opening of the stencil, and a stencil step design file with step design is formed. If not, a stencil step design file with step design is formed, and the formed stencil step design file is checked in real time. , If yes, call the output module 34 to output the stencil ladder design file, if not, instruct to manually modify the stencil ladder design file, and return to real-time check whether the stencil ladder design file is qualified, until the inspection report is qualified, call The output module 34 outputs qualified stencil ladder design files.
  • the processing module 32 is specifically configured to find the preset basic thickness of the screen opening of the electronic device according to the step thickness attribute, that is, according to the preset basic thickness of the screen. According to the preset basic thickness of the stencil, it is judged whether the step thickness value of the stencil opening of the electronic device is equal to the preset stencil basic thickness; if so, it is recognized that the stencil opening of the electronic device does not need to be stepped; if not, it is identified The screen opening of the electronic device needs to be stepped.
  • the preset step rule corresponding to the screen opening of the electronic device one-to-one includes: the step thickness difference of the screen opening of the electronic device is the preset thickness difference threshold; The distance of the screen opening is within the first preset distance range; and/or the distance between the step frame distance of the electronic device and the outer screen opening is within the second preset distance range.
  • the division of the various modules of the above design system is only a division of logical functions, and can be fully or partially integrated into a physical entity during actual implementation, or can be physically separated.
  • these modules can all be implemented in the form of software called by processing elements, or all can be implemented in the form of hardware, some modules can be implemented in the form of calling software by processing elements, and some modules can be implemented in the form of hardware.
  • the x module can be a separately established processing element, or it can be integrated into a certain chip of the above design system.
  • the x module may also be stored in the memory of the above design system in the form of program code, and a certain processing element of the above design system can call and execute the function of the above x module.
  • the implementation of other modules is similar. All or part of these modules can be integrated together or implemented independently.
  • the processing element described here may be an integrated circuit with signal processing capability.
  • each step of the above method or each of the above modules can be completed by hardware integrated logic circuits in the processor element or instructions in the form of software.
  • the above modules may be one or more integrated circuits configured to implement the above methods, for example: one or more specific integrated circuits (Application Specific Integrated Circuit, ASIC for short), one or more microprocessors (Digital Singnal Processor, DSP for short), one or more Field Programmable Gate Array (FPGA for short), etc.
  • the processing element may be a general-purpose processor, such as a central processing unit (Central Processing Unit, CPU for short) or other processors that can call program codes.
  • CPU Central Processing Unit
  • These modules can be integrated together and implemented in the form of System-on-a-chip (SOC for short).
  • FIG. 4 shows a schematic diagram of the principle structure of the device in an embodiment.
  • the device 4 includes: a processor 41, a memory 42, a transceiver 43, a communication interface 44 or/and a communication bus 45; the memory 42 and the communication interface 44 communicate with the processor 41 and the transceiver through the communication bus 45 43 connect and complete the communication between each other, the memory 42 is used to store computer programs, the communication interface 44 is used to communicate with other devices, and the processor 43 and the transceiver 43 are used to run computer programs to make the device 4 execute the above-mentioned network board. The steps of the ladder design method.
  • the aforementioned communication bus may be a Peripheral Component Interconnect (PCI for short) bus or an Extended Industry Standard Architecture (EISA) bus, etc.
  • PCI Peripheral Component Interconnect
  • EISA Extended Industry Standard Architecture
  • the communication bus can be divided into address bus, data bus, control bus and so on. For ease of representation, only one thick line is used in the figure, but it does not mean that there is only one bus or one type of bus.
  • the communication interface is used to realize the communication between the database access device and other devices (such as client, read-write library and read-only library).
  • the memory may include random access memory (Random Access Memory, RAM for short), and may also include non-volatile memory (non-volatile memory), such as at least one disk memory.
  • the aforementioned processor may be a general-purpose processor, including a central processing unit (Central Processing Unit, CPU for short), a network processor (Network Processor, NP), etc.; it may also be a digital signal processor (Digital Signal Processing, DSP for short) , Application Specific Integrated Circuit (ASIC), Field Programmable Gate Array (FPGA), or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components.
  • CPU Central Processing Unit
  • NP Network Processor
  • DSP Digital Signal Processing
  • ASIC Application Specific Integrated Circuit
  • FPGA Field Programmable Gate Array
  • protection scope of the design method of the stencil ladder of the present invention is not limited to the order of execution of the steps listed in this embodiment, and all the steps implemented in the prior art based on the principles of the present invention include Within the protection scope of the present invention.
  • the present invention also provides a screen ladder design system, which can realize the screen ladder design method of the present invention, but the implementation device of the screen ladder design method of the present invention Including but not limited to the structure of the screen ladder design system listed in this embodiment, any structural modification and replacement of the prior art made according to the principles of the present invention are included in the protection scope of the present invention.
  • the design method, system, computer-readable storage medium and equipment of the stencil ladder of the present invention are compared with the current industry solutions.
  • the present invention can achieve more than 90% of the ladder design automatically completed and the design is Meet the processing requirements.
  • the manual intervention process is omitted, and a few simple steps can be completed, saving more than 60%-80% of the time and reducing the error probability of the stencil ladder design.
  • the present invention does not have high requirements for designers to master the skills and knowledge, which can be completed by ordinary operators, which greatly reduces the risk caused by the flow of personnel in this position to the enterprise, and in a sense also helps the enterprise to save labor costs. .
  • the invention effectively overcomes various shortcomings in the prior art and has high industrial value.

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Abstract

本发明提供一种网板阶梯的设计方法、系统、计算机可读存储介质及设备，设计方法包括：获取一电路板中电子器件的网板开口数据，对电子器件的网板开口一一识别，以判断其是否需做阶梯；若是，根据与电子器件的网板开口一一对应的预设阶梯规则对需做阶梯的网板开口进行阶梯设计，形成一经过阶梯设计的网板阶梯设计文件，并输出该网板阶梯设计文件。通过本发明可做到90％以上的阶梯自动完成设计并且该网板阶梯设计符合加工要求。省略了人工干预工序，几个简单步骤即可完成，节省60％-80％以上时间，降低了网板阶梯设计的出错概率。同时，本发明对设计人员掌握技能知识程度要求不高，大大降低了该岗位人员的流动给企业造成的风险。

Description

网板阶梯的设计方法、系统、计算机可读存储介质及设备 技术领域
本发明属于电子制造技术领域，涉及一种设计方法和系统，特别是涉及一种网板阶梯的设计方法、系统、计算机可读存储介质及设备。
背景技术
目前，电子制造行业都是利用Gerber文件进行网板阶梯设计，且几乎都是手动设计，具体的制作过程如下：
步骤1.用CircuitCAM导入Gerber焊盘层；
步骤2.根据备注资料，通过人工肉眼查找确认哪些焊盘网板开口是需要做阶梯的，然后手工选中，使用软件内的图形工具手动绘制阶梯区域；
步骤3.重复步骤2直到完成PCB上的所有阶梯设计；
可以看出，采用现有的手动网板阶梯设计方法操作过程特别繁琐，如果有N个阶梯就需要操作N次，若用肉眼查找不仔细，就会出现遗漏/出错；同时，上述方法在操作过程中需要手动计算阶梯的范围，需操作人员进行反复修改和确认，对操作人员个人能力的要求比较高。(具体流程见图2)。
随着行业内电子产品的发展，智能制造的步伐已经开始，工业4.0，互联网+，智能工厂这些理念已经进入整个制造业。加工精度和设计效率越来越被大家所重视。因此，行业内开始寻找是否有一种方法能让网版阶梯制作实现一键完成的功能。
因此，如何提供一种网板阶梯的设计方法、系统、计算机可读存储介质及设备，以解决现有技术在操作过程中需要手动计算阶梯的范围，产生需操作人员进行反复修改和确认，对操作人员个人能力的要求比较高等缺陷，实已成为本领域技术人员亟待解决的技术问题。
发明内容
鉴于以上所述现有技术的缺点，本发明的目的在于提供一种网板阶梯的设计方法、系统、计算机可读存储介质及设备，用于解决现有技术在操作过程中需要手动计算阶梯的范围，产生需操作人员进行反复修改和确认，对操作人员个人能力的要求比较高的问题。
为实现上述目的及其他相关目的，本发明一方面提供一种网板阶梯的设计方法，包括：获取一电路板中电子器件的网板开口数据，对电子器件的网板开口一一识别，以判断其是否需做阶梯；若是，则根据与电子器件的网板开口一一对应的预设阶梯规则对需做阶梯的网板 开口进行阶梯设计，形成一经过阶梯设计的网板阶梯设计文件，并输出该网板阶梯设计文件；若否，结束阶梯网板设计，输出开口设计文件。
于本发明的一实施例中，在获取一电路板中电子器件的网板开口数据的步骤之前，所述网板阶梯的设计方法还包括：读取电路板的CAD文件，将电路板的CAD文件转换及保存为CAD图形数据，并将CAD文件中的封装信息和相关开口属性信息加载到对应的CAD元件层；
判断是否存在与CAD图形数据对应的钢网开口Gerber数据；若是，将钢网开口Gerber数据与所述CAD图形数据进行坐标位置校准，再将CAD元件层上的相关开口属性信息添加至钢网开口Gerber数据上对应网板开口，以生成网板开口层；若否，从CAD图形数据中提取出待转换的网板开口焊盘层，并生成对应的网板开口层。
于本发明的一实施例中，在获取一电路板中电子器件的网板开口数据的步骤之后，所述网板阶梯的设计方法还包括：查找预先是否创建用于存储网板开口数据的网板开口数据库；若是，则在网板开口数据库中自动匹配电子器件的网板开口的阶梯厚度属性；若否，对网板开口数据中需做阶梯的网板开口添加阶梯厚度属性。
于本发明的一实施例中，所述对电子器件的网板开口一一识别，以判断其是否需做阶梯的步骤包括：根据所述阶梯厚度属性，查找电子器件的网板开口的预设网板基础厚度；根据预设网板基础厚度，判断电子器件的网板开口的阶梯厚度值是否等于所述预设网板基础厚度；若是，则识别出电子器件的网板开口无需做阶梯；若否，则识别出电子器件的网板开口需做阶梯。
于本发明的一实施例中，所述与电子器件的网板开口一一对应的预设阶梯规则包括：电子器件的网板开口的阶梯厚度差为预设厚度差阈值；电子器件的阶梯边框距离与内网板开口的距离位于第一预设距离范围内；和/或电子器件的阶梯边框距离与外网板开口的距离位于第二预设距离范围内。
于本发明的一实施例中，所述根据预设阶梯规则对需做阶梯的网板开口进行阶梯设计的步骤包括：根据所述第一预设距离范围和/或所述第二预设距离范围，计算出该电子器件的网板开口的阶梯区域；在所述阶梯区域的阶梯中心处添加阶梯文字；所述阶梯文字包括该电子器件的网板开口的阶梯厚度和阶梯面信息。
于本发明的一实施例中，在形成经过阶梯设计的网板阶梯设计文件后，所述网板阶梯的设计方法还包括：实时检测所形成的网板阶梯设计文件是否合格，若是，则输出所述网板阶梯设计文件，若否，则输出针对该网板阶梯设计文件的修改指令。
本发明另一方面提供一种网板阶梯的设计系统，包括：获取模块，用于获取一电路板中电子器件的网板开口数据，处理模块，用于对电子器件的网板开口一一识别，以判断其是否需做阶梯；若是，则根据与电子器件的网板开口一一对应的预设阶梯规则对需做阶梯的网板开口进行阶梯设计，形成一经过阶梯设计的网板阶梯设计文件，并通过一输出模块输出该网板阶梯设计文件；若否，结束阶梯网板设计，并通过所述输出模块输出开口设计文件。
本发明又一方面提供一种计算机可读存储介质，其上存储有计算机程序，该程序被处理器执行时实现所述网板阶梯的设计方法。
本发明最后一方面提供一种设备，包括：处理器及存储器；所述存储器用于存储计算机程序，所述处理器用于执行所述存储器存储的计算机程序，以使所述设备执行所述网板阶梯的设计方法。
如上所述，本发明所述的网板阶梯的设计方法、系统、计算机可读存储介质及设备，具有以下有益效果：
本发明所述网板阶梯的设计方法、系统、计算机可读存储介质及设备相比于目前行业方案，通过本发明可以做到90％以上的阶梯自动完成设计并且该设计符合加工要求。省略了人工干预工序，几个简单步骤即可完成，节省60％-80％以上时间，降低了网板阶梯设计的出错概率。同时，本发明对设计人员掌握技能知识程度要求不高，一般的操作人员即可完成，大大降低了该岗位人员的流动给企业造成的风险，从某种意义上说也帮助企业节省了用工成本。
附图说明
图1显示为本发明的网板阶梯的设计方法于一实施例中的流程示意图。
图2显示为本发明的根据预设阶梯规则自动设计的一阶梯实例示意图。
图3显示为本发明的网板阶梯的设计系统于一实施例中的原理结构示意图。
图4显示为本发明的设备于一实施例中的原理结构示意图。
元件标号说明
3 网板阶梯的设计系统
31 读取模块
32 处理模块
33 获取模块
34 输出模块
4 设备
41 处理器
42 存储器
43 收发器
44 通信接口
45 通信总线
S11～S10 步骤
具体实施方式
以下通过特定的具体实例说明本发明的实施方式，本领域技术人员可由本说明书所揭露的内容轻易地了解本发明的其他优点与功效。本发明还可以通过另外不同的具体实施方式加以实施或应用，本说明书中的各项细节也可以基于不同观点与应用，在没有背离本发明的精神下进行各种修饰或改变。需说明的是，在不冲突的情况下，以下实施例及实施例中的特征可以相互组合。
需要说明的是，以下实施例中所提供的图示仅以示意方式说明本发明的基本构想，遂图式中仅显示与本发明中有关的组件而非按照实际实施时的组件数目、形状及尺寸绘制，其实际实施时各组件的型态、数量及比例可为一种随意的改变，且其组件布局型态也可能更为复杂。
本发明所提供的网板阶梯的设计方法、系统、计算机可读存储介质及设备技术原理如
下：输入PCB CAD，Gerber文件可选，BOM文件可选。
存储不同封装对应的网板开口和开口厚度等数据。
如果建有网板开口数据库的话，可以通过匹配库的方式获取对应开口厚度；如果没有创建网板开口库的话，可以先将输入的CAD数据按器件封装名称区分整理成器件封装列表，再向需做阶梯的器件封装对应的网板开口添加厚度属性。
设置网板基础厚度，通过设置的网板基础厚度来识别那些是需要做阶梯的开口；如：假设基础厚度为a，那么厚度值不等于a的所有开口都需要做阶梯的网板开口，对应厚度值为阶梯厚度值。
1.通过网板设计阶梯规范生成的对应阶梯规则来自动算出阶梯区域并自动设计，如果满足不了所有的规则就优选其中重要的规则来进行阶梯设计。
2.完成设计后在阶梯中心添加阶梯文字，一般包含阶梯厚度和阶梯面信息。
当软件自动开的阶梯无法满足要求时，用户可以自行设计网板阶梯。该模块不仅可以完成圆形和矩形等常规阶梯的设计而且还可以完成现有阶梯的内缩、外扩、旋转、合并等等操作。
阶梯网板自动开完之后，会自动用阶梯规则(与自动开网板用的阶梯规则一致)对网板开口进行检查并列出阶梯不符合的项目，支持选中列表阶梯在图纸上高亮不合格的部分。
输出网板加工数据，如：DXF，Gerber等。
实施例一
本实施例提供一种网板阶梯的设计方法，包括：
获取一电路板中电子器件的网板开口数据，对电子器件的网板开口一一识别，以判断其是否需做阶梯；
若是，则根据与电子器件的网板开口一一对应的预设阶梯规则对需做阶梯的网板开口进行阶梯设计，形成一经过阶梯设计的网板阶梯设计文件，并输出该网板阶梯设计文件；若否，结束阶梯网板设计，输出开口设计文件。
以下将结合图示对本实施例所提供的网板阶梯的设计方法进行详细描述。请参阅图1，显示为网板阶梯的设计方法于一实施例中的流程示意图。如图1所示，所述网板阶梯的设计方法具体包括以下几个步骤：
S11，读取一电路板的CAD文件，将电路板的CAD文件转换及保存为CAD图形数据，并将CAD文件中的封装信息和相关开口属性信息加载到对应的CAD元件层。在本实施例中，将CAD文件中的封装信息和相关开口属性信息加载到对应的CAD元件层在自动开阶梯时可以清楚的知晓哪几个开口属于一个封装。
S12，判断是否存在与CAD图形数据对应的钢网开口Gerber数据；若是，执行S13，即将钢网开口Gerber数据与所述CAD图形数据进行坐标位置校准(于实施例中，对钢网开口Gerber数据与所述CAD图形数据进行坐标位置校准是指将钢网开口Gerber数据与所述CAD图形数据对齐)再将CAD元件层上的相关开口属性信息添加至钢网开口Gerber数据上对应网板开口，以生成网板开口层，并转入S15；若否，执行S14，即从CAD图形数据中提取出待转换的网板开口焊盘层，并生成网板开口层，并转入S15。
S15，获取所述电路板中电子器件的网板开口数据。在本实施例中，电路板中电子器件的网板开口数据包括电子器件的坐标、电子器件的封装、电子器件的物料编码等。
S16，查找预先是否创建用于存储网板开口数据的网板开口数据库；若是，则执行S16’即在网板开口数据库中查找电子器件的网板开口的阶梯厚度属性；若否，则执行S16”，即对网板开口数据中需做阶梯的网板开口添加阶梯厚度属性。
S17，对电子器件的网板开口一一识别，以判断其是否需做阶梯；若是，则执行S18，若否，则执行S10，即结束阶梯网板设计，输出原始的开口设计文件。
具体地，所述S17包括：
在网板开口数据库中自动匹配电子器件的网板开口的预设网板基础厚度。
根据预设网板基础厚度，判断电子器件的网板开口的阶梯厚度值是否等于所述预设网板基础厚度；若是，则识别出电子器件的网板开口无需做阶梯；若否，则识别出电子器件的网板开口需做阶梯。
例如，预设网板基础厚度为a，电子器件的网板开口的阶梯厚度值等于a，那么该电子器件的网板开口不需要做阶梯；若电子器件的网板开口的阶梯厚度值不等于a，那么该电子器件的网板开口需要做阶梯。
例如，预设设定基础厚度为g，电子器件的网板开口的阶梯厚度值为h，那么h中大于g的网板开口就需要做加厚阶梯且阶梯厚度差为h-g，那么h中小于g的网板开口就需要做减薄阶梯且阶梯厚度差为g-h；
S18，根据与电子器件的网板开口一一对应的预设阶梯规则对需做阶梯的网板开口进行阶梯设计，并形成一经过阶梯设计的网板阶梯设计文件。在本实施例中，所述与电子器件的网板开口一一对应的预设阶梯规则包括：电子器件的网板开口的阶梯厚度差为预设厚度差阈值；电子器件的阶梯边框距离与内网板开口的距离位于第一预设距离范围内；和/或电子器件的阶梯边框距离与外网板开口的距离位于第二预设距离范围内。
请参阅图2，显示为根据预设阶梯规则自动设计的一阶梯实例示意图。如图2所示，电子器件的网板开口一一对应的预设阶梯规则要求当阶梯厚度差为0.3时，电子器件的阶梯边框距离阶梯内网板开口的距离c大于e，电子器件的阶梯边框距离阶梯外网板开口的距离d大于f(e和f指对应的预设阶梯规则中要求的尺寸值)，那此时自动开的阶梯就需要满足c>e，d>f(c和d代表阶梯边框实际距阶梯内外开口距离)，如果无法同时满足两个条件的话，就优先满足c>e。
在所述阶梯区域的阶梯中心处添加阶梯文字；所述阶梯文字包括该电子器件的网板开口的阶梯厚度和阶梯面信息。
例如，完成阶梯设计后，再自动添加文字ST＝0.15(代表阶梯面为刮刀面，阶梯厚度为0.15)。
S19，形成一经过阶梯设计的网板阶梯设计文件，并实时检测所形成的网板阶梯设计文件是否合格，若是，则执行S10，结束阶梯网板设计，输出开口设计文件，若否，则执行S10’，指示手动修改网板阶梯设计文件，并返回实时检测网板阶梯设计文件是否合格，直至检查报告合格。在本实施例中，在输出修改指令后，操作人员手动采用外扩、内缩或者重新手动设计的方式对网板阶梯设计文件重新修改，直至网板阶梯设计文件合格。在本实施例中，所述合格的网板阶梯设计文件包括DXF，Gerber等格式的设计文件。
本实施例提供一种计算机可读存储介质，其上存储有计算机程序，该程序被处理器执行时实现上述网板阶梯的设计方法。
本领域普通技术人员可以理解：实现上述各方法实施例的全部或部分步骤可以通过计算机程序相关的硬件来完成。前述的计算机程序可以存储于一计算机可读存储介质中。该程序在执行时，执行包括上述各方法实施例的步骤；而前述的存储介质包括：ROM、RAM、磁碟或者光盘等各种可以存储程序代码的介质。
本实施例所述网板阶梯的设计方法相比于目前行业方案，通过本实施例可以做到90％以上的阶梯自动完成设计并且该设计是符合加工要求的。省略了人工干预工序，通过几个简单步骤即可完成，节省60％-80％以上时间，降低了网板阶梯设计的出错概率。同时，本方法对设计人员掌握技能知识程度要求不高，一般的操作人员即可完成，大大降低了该岗位人员的流动给企业造成的风险，从某种意义上说也帮助企业节省了用工成本。
实施例二
本实施例提供一种网板阶梯的设计系统，包括：
获取模块，用于获取一电路板中电子器件的网板开口数据，
处理模块，用于对电子器件的网板开口一一识别，以判断其是否需做阶梯；若是，则根据与电子器件的网板开口一一对应的预设阶梯规则对需做阶梯的网板开口进行阶梯设计，形成一经过阶梯设计的网板阶梯设计文件，并通过一输出模块输出该网板阶梯设计文件；若否，结束阶梯网板设计，并通过所述输出模块输出开口设计文件。
以下将结合图示对本实施例所提供的网板阶梯的设计系统进行详细描述。请参阅图3，显示为网板阶梯的设计系统于一实施例中的原理结构示意图。如图3所示，所述网板阶梯的设计系统3包括：读取模块31、处理模块32、获取模块33及输出模块34。
所述读取模块31用于读取一电路板的CAD文件，将电路板的CAD文件转换及保存为CAD图形数据，并将CAD文件中的封装信息和相关开口属性信息加载到对应的CAD元件层。在本实施例中，将CAD文件中的封装信息和相关开口属性信息加载到对应的CAD元件层在自动开阶梯时可以清楚的知晓哪几个开口属于一个封装。
与所述读取模块31耦合的处理模块32用于判断是否存在与CAD图形数据对应的钢网开口Gerber数据；若是，将钢网开口Gerber数据与所述CAD图形数据进行坐标位置校准(于实施例中，处理模块32进行坐标位置校准是指将钢网开口Gerber数据与所述CAD图形数据对齐)，再将CAD元件层上的相关开口属性信息添加至钢网开口Gerber数据上对应网板开口，以生成网板开口层，并调用所述获取模块33；若否，从CAD图形数据中提取出待转换的网板开口焊盘层，并生成网板开口层，并调用所述获取模块33。
与所述读取模块31和处理模块32耦合的获取模块33用于获取所述电路板中电子器件的网板开口数据。在本实施例中，电路板中电子器件的网板开口数据包括电子器件的坐标、电子器件的封装、电子器件的物料编码等。
所述处理模块32查找预先是否创建用于存储网板开口数据的网板开口数据库；若是，则在网板开口数据库中自动匹配电子器件的网板开口的阶梯厚度属性；若否，则对网板开口数据中需做阶梯的网板开口添加阶梯厚度属性。
所述处理模块32还用于对电子器件的网板开口一一识别，以判断其是否需做阶梯；若是，则根据与电子器件的网板开口一一对应的预设阶梯规则对需做阶梯的网板开口进行阶梯设计，并形成一经过阶梯设计的网板阶梯设计文件，若否，则形成一经过阶梯设计的网板阶梯设计文件，并实时检测所形成的网板阶梯设计文件是否合格，若是，则调用所述输出模块34输出所述网板阶梯设计文件，若否，则指示手动修改网板阶梯设计文件，并返回实时检测网板阶梯设计文件是否合格，直至检查报告合格，调用所述输出模块34输出合格的网板阶梯设计文件。
所述处理模块32具体用于根据所述阶梯厚度属性，即根据所述预设网板基础厚度，查找电子器件的网板开口的预设网板基础厚度。根据预设网板基础厚度，判断电子器件的网板开口的阶梯厚度值是否等于所述预设网板基础厚度；若是，则识别出电子器件的网板开口无需做阶梯；若否，则识别出电子器件的网板开口需做阶梯。
在本实施例中，所述与电子器件的网板开口一一对应的预设阶梯规则包括：电子器件的网板开口的阶梯厚度差为预设厚度差阈值；电子器件的阶梯边框距离与内网板开口的距离位 于第一预设距离范围内；和/或电子器件的阶梯边框距离与外网板开口的距离位于第二预设距离范围内。
需要说明的是，应理解以上设计系统的各个模块的划分仅仅是一种逻辑功能的划分，实际实现时可以全部或部分集成到一个物理实体上，也可以物理上分开。且这些模块可以全部以软件通过处理元件调用的形式实现，也可以全部以硬件的形式实现，还可以部分模块通过处理元件调用软件的形式实现，部分模块通过硬件的形式实现。例如：x模块可以为单独设立的处理元件，也可以集成在上述设计系统的某一个芯片中实现。此外，x模块也可以以程序代码的形式存储于上述设计系统的存储器中，由上述设计系统的某一个处理元件调用并执行以上x模块的功能。其它模块的实现与之类似。这些模块全部或部分可以集成在一起，也可以独立实现。这里所述的处理元件可以是一种集成电路，具有信号的处理能力。在实现过程中，上述方法的各步骤或以上各个模块可以通过处理器元件中的硬件的集成逻辑电路或者软件形式的指令完成。以上这些模块可以是被配置成实施以上方法的一个或多个集成电路，例如：一个或多个特定集成电路(Application Specific Integrated Circuit，简称ASIC)，一个或多个微处理器(Digital Singnal Processor，简称DSP)，一个或者多个现场可编程门阵列(Field Programmable Gate Array，简称FPGA)等。当以上某个模块通过处理元件调度程序代码的形式实现时，该处理元件可以是通用处理器，如中央处理器(Central Processing Unit，简称CPU)或其它可以调用程序代码的处理器。这些模块可以集成在一起，以片上系统(System-on-a-chip，简称SOC)的形式实现。
实施例三
本实施例提供一种设备，请参阅图4，显示为设备于一实施例中的原理结构示意图。如图4所示，所述设备4包括：处理器41、存储器42、收发器43、通信接口44或/和通信总线45；存储器42和通信接口44通过通信总线45与处理器41和收发器43连接并完成相互间的通信，存储器42用于存储计算机程序，通信接口44用于和其他设备进行通信，处理器43和收发器43用于运行计算机程序，使设备4执行如上所述网板阶梯的设计方法的各个步骤。
上述提到的通信总线可以是外设部件互连标准(Peripheral Component Interconnect，简称PCI)总线或扩展工业标准结构(Extended Industry Standard Architecture，简称EISA)总线等。该通信总线可以分为地址总线、数据总线、控制总线等。为便于表示，图中仅用一条粗线表示，但并不表示仅有一根总线或一种类型的总线。通信接口用于实现数据库访问装置与其他设备(如客户端、读写库和只读库)之间的通信。存储器可能包含随机存取存储器 (Random Access Memory，简称RAM)，也可能还包括非易失性存储器(non-volatile memory)，例如至少一个磁盘存储器。
上述的处理器可以是通用处理器，包括中央处理器(Central Processing Unit，简称CPU)、网络处理器(Network Processor，简称NP)等；还可以是数字信号处理器(Digital Signal Processing，简称DSP)、专用集成电路(Application Specific Integrated Circuit，简称ASIC)、现场可编程门阵列(Field Programmable Gate Array，简称FPGA)或者其他可编程逻辑器件、分立门或者晶体管逻辑器件、分立硬件组件。
本发明所述的网板阶梯的设计方法的保护范围不限于本实施例列举的步骤执行顺序，凡是根据本发明的原理所做的现有技术的步骤增减、步骤替换所实现的方案都包括在本发明的保护范围内。
本发明还提供一种网板阶梯的设计系统，所述网板阶梯的设计系统可以实现本发明所述的网板阶梯的设计方法，但本发明所述的网板阶梯的设计方法的实现装置包括但不限于本实施例列举的网板阶梯的设计系统的结构，凡是根据本发明的原理所做的现有技术的结构变形和替换，都包括在本发明的保护范围内。
综上所述，本发明所述网板阶梯的设计方法、系统、计算机可读存储介质及设备相比于目前行业方案，通过本发明可以做到90％以上的阶梯自动完成设计并且该设计是符合加工要求的。省略了人工干预工序，几个简单步骤即可完成，节省60％-80％以上时间，降低了网板阶梯设计的出错概率。同时，本发明对设计人员掌握技能知识程度要求不高，一般的操作人员即可完成，大大降低了该岗位人员的流动给企业造成的风险，从某种意义上说也帮助企业节省了用工成本。本发明有效克服了现有技术中的种种缺点而具高度产业利用价值。
上述实施例仅例示性说明本发明的原理及其功效，而非用于限制本发明。任何熟悉此技术的人士皆可在不违背本发明的精神及范畴下，对上述实施例进行修饰或改变。因此，举凡所属技术领域中具有通常知识者在未脱离本发明所揭示的精神与技术思想下所完成的一切等效修饰或改变，仍应由本发明的权利要求所涵盖。

Claims (10)

  1. 一种网板阶梯的设计方法，其特征在于，包括：
    获取一电路板中电子器件的网板开口数据，对电子器件的网板开口一一识别，以判断其是否需做阶梯；
    若是，则根据与电子器件的网板开口一一对应的预设阶梯规则对需做阶梯的网板开口进行阶梯设计，形成一经过阶梯设计的网板阶梯设计文件，并输出该网板阶梯设计文件；若否，结束阶梯网板设计，输出开口设计文件。
  2. 根据权利要求所述的网板阶梯的设计方法，其特征在于，在获取一电路板中电子器件的网板开口数据的步骤之前，所述网板阶梯的设计方法还包括：
    读取电路板的CAD文件，将电路板的CAD文件转换及保存为CAD图形数据，并将CAD文件中的封装信息和相关开口属性信息加载到对应的CAD元件层；
    判断是否存在与CAD图形数据对应的钢网开口Gerber数据；若是，将钢网开口Gerber数据与所述CAD图形数据进行坐标位置校准，再将CAD元件层上的相关开口属性信息添加至钢网开口Gerber数据上对应网板开口，以生成网板开口层；若否，从CAD图形数据中提取出待转换的网板开口焊盘层，并生成对应的网板开口层。
  3. 根据权利要求2所述的网板阶梯的设计方法，其特征在于，在获取一电路板中电子器件的网板开口数据的步骤之后，所述网板阶梯的设计方法还包括：
    查找预先是否创建用于存储网板开口数据的网板开口数据库；若是，则在网板开口数据库中自动匹配电子器件的网板开口的阶梯厚度属性；若否，对网板开口数据中需做阶梯的网板开口添加阶梯厚度属性。
  4. 根据权利要求3所述的网板阶梯的设计方法，其特征在于，所述对电子器件的网板开口一一识别，以判断其是否需做阶梯的步骤包括：
    根据所述阶梯厚度属性，查找电子器件的网板开口的预设网板基础厚度；
    根据预设网板基础厚度，判断电子器件的网板开口的阶梯厚度值是否等于所述预设网板基础厚度；若是，则识别出电子器件的网板开口无需做阶梯；若否，则识别出电子器件的网板开口需做阶梯。
  5. 根据权利要求4所述的网板阶梯的设计方法，其特征在于，所述与电子器件的网板开口一一对应的预设阶梯规则包括：
    电子器件的网板开口的阶梯厚度差为预设厚度差阈值；
    电子器件的阶梯边框距离与内网板开口的距离位于第一预设距离范围内；和/或
    电子器件的阶梯边框距离与外网板开口的距离位于第二预设距离范围内。
  6. 根据权利要求5所述的网板阶梯的设计方法，其特征在于，所述根据预设阶梯规则对需做阶梯的网板开口进行阶梯设计的步骤包括：
    根据所述第一预设距离范围和/或所述第二预设距离范围，计算出该电子器件的网板开口的阶梯区域；
    在所述阶梯区域的阶梯中心处添加阶梯文字；所述阶梯文字包括该电子器件的网板开口的阶梯厚度和阶梯面信息。
  7. 根据权利要求6所述的网板阶梯的设计方法，其特征在于，在形成经过阶梯设计的网板阶梯设计文件后，所述网板阶梯的设计方法还包括：
    实时检测所形成的网板阶梯设计文件是否合格，若是，则输出所述网板阶梯设计文件，若否，则输出针对该网板阶梯设计文件的修改指令。
  8. 一种网板阶梯的设计系统，其特征在于，包括：
    获取模块，用于获取一电路板中电子器件的网板开口数据，
    处理模块，用于对电子器件的网板开口一一识别，以判断其是否需做阶梯；若是，则根据与电子器件的网板开口一一对应的预设阶梯规则对需做阶梯的网板开口进行阶梯设计，形成一经过阶梯设计的网板阶梯设计文件，并通过一输出模块输出该网板阶梯设计文件；若否，结束阶梯网板设计，并通过所述输出模块输出开口设计文件。
  9. 一种计算机可读存储介质，其上存储有计算机程序，其特征在于，该程序被处理器执行时实现权利要求1至7中任一项所述网板阶梯的设计方法。
  10. 一种设备，其特征在于，包括：处理器及存储器；
    所述存储器用于存储计算机程序，所述处理器用于执行所述存储器存储的计算机程序，以使所述设备执行如权利要求1至7中任一项所述网板阶梯的设计方法。
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