WO2020177315A1 - 一种显示面板的制备方法 - Google Patents

一种显示面板的制备方法 Download PDF

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Publication number
WO2020177315A1
WO2020177315A1 PCT/CN2019/108558 CN2019108558W WO2020177315A1 WO 2020177315 A1 WO2020177315 A1 WO 2020177315A1 CN 2019108558 W CN2019108558 W CN 2019108558W WO 2020177315 A1 WO2020177315 A1 WO 2020177315A1
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WIPO (PCT)
Prior art keywords
layer
insulating layer
display panel
touch
inorganic
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PCT/CN2019/108558
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English (en)
French (fr)
Inventor
季朋飞
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昆山国显光电有限公司
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Application filed by 昆山国显光电有限公司 filed Critical 昆山国显光电有限公司
Publication of WO2020177315A1 publication Critical patent/WO2020177315A1/zh
Priority to US17/314,301 priority Critical patent/US20210265604A1/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate

Definitions

  • This application relates to the field of display technology, and in particular to a method for manufacturing a display panel.
  • Organic Light Emitting Diode (OLED) displays are one of the current research hotspots in the field of flat panel displays. Compared with liquid crystal displays, OLEDs have the advantages of low energy consumption, low production costs, self-luminescence, wide viewing angles and fast response speed. At present, there are many applications in the field of flat panel displays such as mobile phones, PDAs, and digital cameras.
  • the existing organic light emitting diode display panel structure usually includes a substrate, a display device layer, and a thin film packaging layer.
  • the thin film encapsulation layer usually includes an inorganic encapsulation layer and an organic encapsulation layer.
  • the inorganic encapsulation layer is used to block water and oxygen, and the organic encapsulation layer is used to improve the flexibility of the thin film encapsulation layer.
  • the main technical problem solved by this application is to provide a method for manufacturing a display panel, which can improve the packaging performance of the display panel and prolong the service life of the display panel.
  • a technical solution adopted by the present application is to provide a method for manufacturing a display panel.
  • the manufacturing method includes: providing a substrate motherboard on which multiple display panel regions are defined and divided into multiple regions. The cutting area of the display panel area; the display panel area is defined with a display area and a non-display area, a plurality of light-emitting devices are arranged in the display area, and the multiple light-emitting devices are packaged to form an encapsulation layer.
  • the encapsulation layer includes at least one inorganic encapsulation layer ;
  • An insulating layer is formed on the encapsulation layer, and the insulating layer is patterned, wherein the inorganic encapsulation layer material in the cutting area is etched and removed while the insulating layer is patterned; the substrate mother board is cut to separate multiple display panel areas , Forming multiple display panels.
  • the manufacturing method of the display panel provided by the present application can protect the encapsulation layer from damage in the subsequent manufacturing process by etching and removing the inorganic encapsulation layer material sputtered into the cutting area while patterning the insulating layer, thereby improving the encapsulation performance and extending Display device life.
  • FIG. 1 is a schematic flowchart of a first embodiment of a method for manufacturing a display panel according to the present application
  • FIG. 2 is a top perspective view of a substrate mother board in the first embodiment of the display panel manufacturing method of the present application
  • FIG. 3 is a schematic diagram of a cross-sectional structure of a display panel area in the first embodiment of the method for manufacturing a display panel of the present application;
  • FIG. 4 is a schematic diagram of a substrate mother board provided in the second embodiment of the manufacturing method of the display panel of the present application.
  • FIG. 5 is a schematic diagram of forming a first inorganic encapsulation layer in the second embodiment of the manufacturing method of the display panel of the present application;
  • FIG. 6 is a schematic diagram of forming an organic encapsulation layer in the second embodiment of the method for manufacturing a display panel of the present application
  • FIG. 7 is a schematic diagram of forming a second inorganic encapsulation layer in the second embodiment of the manufacturing method of the display panel of the present application.
  • FIG. 8 is a schematic diagram of forming a touch bottom layer in the second embodiment of the manufacturing method of the display panel of the present application.
  • FIG. 9 is a schematic diagram of forming the first touch metal layer in the second embodiment of the manufacturing method of the display panel of the present application.
  • FIG. 10 is a schematic diagram of forming an insulating layer in the second embodiment of the manufacturing method of the display panel of the present application.
  • FIG. 11 is a schematic diagram of forming a second touch metal layer in the second embodiment of the manufacturing method of the display panel of the present application.
  • FIG. 12 is a schematic diagram of forming a protective layer in the second embodiment of the manufacturing method of the display panel of the present application.
  • a large base substrate is generally used to simultaneously prepare multiple display panel structures, and then cut to form small display panels.
  • thin-film encapsulation is used.
  • the thin-film encapsulation layer includes at least one inorganic encapsulation layer for blocking water and oxygen.
  • a mask is used to form the inorganic encapsulation layer by deposition.
  • some inorganic encapsulation layer materials may overflow and sputter to places outside the encapsulation area.
  • the outer space of the packaging area is small, and the overflowing inorganic packaging layer material will be sputtered to the cutting area.
  • these inorganic packaging layer materials will be cut.
  • These inorganic encapsulation layer materials are connected to the inorganic encapsulation layer in the effective area of the encapsulation, and external force cutting will damage the film and produce cracks. If the cracks spread to the effective area of the encapsulation, it will cause poor packaging and device failure. Based on the above situation, the present application provides a method for manufacturing a display panel.
  • At least one insulating layer is formed on the packaging layer of the resulting display panel, and the insulating layer is prepared at the same time .
  • Etching removes the inorganic packaging layer material spattered and deposited in the cutting area, which can prevent damage to the inorganic packaging layer in the effective area of the packaging during subsequent cutting.
  • the packaging performance is improved and the life of the display panel is prolonged.
  • FIG. 1 is a schematic flowchart of the first embodiment of the display panel manufacturing method of the present application.
  • FIG. 2 is a top perspective view of the substrate mother board in the first embodiment of the display panel manufacturing method of the present application.
  • FIG. 3 is The cross-sectional structure diagram of the display panel area in the first embodiment of the display panel manufacturing method of the present application.
  • the manufacturing method of the display panel includes the following steps:
  • a substrate mother board is provided.
  • a plurality of display panel areas and a cutting area dividing the multiple display panel areas are defined on the substrate mother board.
  • the substrate mother board 10 is a full-surface display substrate that has not been packaged and cut.
  • the base substrate 10 is an organic light-emitting display substrate.
  • the base substrate 10 includes at least an array substrate 101 and a light emitting device 102.
  • the array substrate 101 includes a base substrate and a pixel circuit array.
  • the light emitting device 102 is arranged in the display panel area 200.
  • the display area includes at least an anode layer, an organic light-emitting layer, and a cathode layer.
  • 102 indicates all the multiple light-emitting devices in a display panel area.
  • the cutting area 100 refers to the area that the cutter passes when cutting the substrate mother board 10, and it may be a cutting line or an area with a certain width. On the substrate mother board 10, clearly marked marking lines may be used to mark the dividing cutting area 100, or there may be no marking line markings.
  • the display panel area 200 is an area where a single small display panel is formed after cutting.
  • the light-emitting device includes a light-emitting layer.
  • the material of the light-emitting layer is generally sensitive to water vapor and oxygen.
  • the light-emitting device needs to be encapsulated to form an encapsulation layer, and the encapsulation layer should completely cover the display area.
  • the encapsulation layer includes at least one inorganic encapsulation layer 2021 for blocking water and oxygen.
  • a mask is used to form an inorganic encapsulation layer by deposition.
  • S103 An insulating layer is formed on the side of the packaging layer away from the mother board of the substrate, and patterning is performed on the insulating layer, wherein the inorganic packaging layer material in the cutting area is etched away while the insulating layer is patterned.
  • At least one insulating layer 2031 is provided on the side of the encapsulation layer away from the substrate mother board 10.
  • the insulating layer 2031 may be a protective layer to enhance the protection of the display device, or may be other functional film layers to expand the function of the display panel.
  • the insulating layer 2031 can be patterned by photolithography to form a plurality of mutually independent insulating regions 203 corresponding to the plurality of packaging regions 202, so that when the excess insulating layer material is etched and removed, the sputtering is simultaneously etched and removed.
  • the insulating layer 2031 may be an inorganic layer formed of an inorganic material, or an organic layer formed of an organic material, and is preferably made of the same material as the inorganic encapsulation layer.
  • the substrate mother board 10 is cut into a plurality of small substrates along the cutting line or in the cutting area according to preset rules, and then the subsequent manufacturing process is performed to obtain a display panel.
  • the inorganic encapsulation layer material sputtered into the cutting area is etched and removed while the insulating layer is patterned, which can protect the encapsulation layer from damage in the subsequent manufacturing process, thereby improving the packaging performance and prolonging the life of the display device. , And there is no need to add a separate process.
  • the edge of the insulating region 203 exceeds or is aligned with the edge of the packaging region 202, that is, the insulating layer 2031 completely covers the inorganic packaging layer 2021.
  • the etching depth corresponding to the etching area outside the encapsulation area can extend and penetrate the inorganic encapsulation layer to etch and remove the inorganic encapsulation layer material sputtered to the cutting area. In this embodiment, there is no need to change the photomask, which reduces the process cost.
  • the edge of the encapsulation region 202 extends beyond the edge of the insulating region 203, that is, the insulating layer 2031 cannot completely cover the inorganic encapsulation layer 2021.
  • the excess insulating layer material is removed by etching, it is necessary to use a photomask with multiple regions of different light transmittance, so that only the etching depth of the corresponding cutting region extends and penetrates the inorganic packaging layer. To prevent damage to the package layer in the effective area of the package.
  • the insulating layer can have one, two or more layers.
  • any insulating layer can be patterned, and the inorganic package sputtered into the cutting area can be etched and removed. Layer material.
  • only the first insulating layer is provided on the side of the encapsulation layer away from the mother board of the substrate.
  • the inorganic encapsulation layer material sputtered into the cutting area is simultaneously etched and removed.
  • a first insulating layer is provided on the side of the packaging layer away from the substrate mother board, a touch film layer is provided on the side of the first insulating layer away from the packaging layer, and a second insulating layer is provided in the touch film layer .
  • the first insulating layer is patterned, the inorganic encapsulation layer material sputtered into the cutting area can be etched and removed; or when the first insulating layer is patterned, the etching depth only penetrates the first insulating layer; then When the second insulating layer is patterned, the inorganic encapsulation layer material sputtered into the cutting area is etched away.
  • a first insulating layer is provided on the side of the packaging layer away from the mother board of the substrate, a touch film layer is provided on the side of the first insulating layer away from the packaging layer, and the touch film layer includes at least a second insulating layer, A third insulating layer is provided on the side of the touch film layer away from the first insulating layer.
  • the inorganic encapsulation layer material sputtered into the cutting area can be etched and removed; or when the first insulating layer is patterned, the etching depth only penetrates the first insulating layer; then When the second insulating layer is patterned, the inorganic encapsulation layer material sputtered into the cutting area is etched away; or when the first insulating layer is patterned, the etching depth only penetrates the first insulating layer; When the second insulating layer is patterned, the etching depth only penetrates the second insulating layer, and then when the third insulating layer is patterned, the inorganic encapsulation layer material sputtered into the cutting area is etched away.
  • the insulating layer is taken as the insulating layer in the touch film layer, and when the insulating layer in the touch film layer is patterned, the inorganic encapsulation layer material sputtered into the cutting area is etched and removed as an example. The method is described in detail, but is not limited to this.
  • FIG. 4 is a schematic diagram of a substrate mother board provided in the second embodiment of the method for manufacturing a display panel of the present application.
  • a substrate mother board 10 is provided, and the substrate mother board 10 is a full-surface display substrate that has not been packaged and cut.
  • the substrate mother board 10 includes at least an array substrate 101 and a light emitting device 102.
  • the array substrate 101 includes a base substrate and a pixel circuit array.
  • the light emitting device 102 includes an anode layer, an organic light emitting layer, a cathode layer, and the like.
  • the base substrate can be a flexible substrate or a conventional substrate.
  • the conventional substrate material can be quartz, glass, metal, resin, etc., among which the resin substrate can be polymethylmethacrylate (PMMA), polyethylene terephthalate Glycol ester (PET), polyethylene naphthalate (PBN), polycarbonate resin, etc.
  • PMMA polymethylmethacrylate
  • PET polyethylene terephthalate Glycol ester
  • PBN polyethylene naphthalate
  • polycarbonate resin etc.
  • flexible substrates such as polyimide (PI) substrates are used.
  • the base substrate is preferably a material with good water and gas barrier properties.
  • the base substrate should also have good transparency, that is, light in the visible light wavelength range can pass through the substrate. .
  • the thin-film encapsulation is formed on the side of the light-emitting layer away from the flexible substrate to protect the light-emitting material.
  • the thin-film encapsulation layer generally includes an organic encapsulation layer and an inorganic encapsulation layer.
  • the inorganic encapsulation layer 4011 When depositing inorganic encapsulation layer materials, due to the existence of the mask, only the inorganic encapsulation layer is formed in the opening area (display area). The resulting first inorganic encapsulation layer 4011 completely covers the light emitting device 102, that is, the edge of the first inorganic encapsulation layer 4011 exceeds The edge of the display area.
  • FIG. 6 is a schematic diagram of forming an organic encapsulation layer in the second embodiment of the manufacturing method of the display panel of the present application.
  • An inkjet printing method is used to prepare a first organic encapsulation layer 4012 covering the display area on the first inorganic encapsulation layer 4011.
  • the flatness can be improved, which facilitates the formation of the subsequent inorganic encapsulation layer, and the organic encapsulation layer can improve the bending resistance of the encapsulation layer.
  • the first organic encapsulation layer 4012 covers the display area, and the edge of the first organic encapsulation layer 4012 does not exceed the edge of the first inorganic encapsulation layer 4011.
  • FIG. 7 is a schematic diagram of forming the second inorganic encapsulation layer in the second embodiment of the manufacturing method of the display panel of the present application. Then, a chemical vapor deposition method is used to form a second inorganic encapsulation layer 4013 covering the first organic encapsulation layer 4012 on the first organic encapsulation layer 4012.
  • the materials of the two inorganic encapsulation layers can be the same or different.
  • the edge of the second inorganic encapsulation layer 4013 is flush with the edge of the first inorganic encapsulation layer 4011 or exceeds the edge of the first inorganic encapsulation layer 4011.
  • a first insulating layer is formed on the thin film encapsulation layer.
  • the first insulating layer can be used as a protective layer of the display device or as a touch base layer, and then a touch film layer is formed on the first insulating layer.
  • the touch film layer includes a first touch metal layer, a second insulating layer, and a second touch metal layer.
  • FIG. 8 is a schematic diagram of forming the first insulating layer in the second embodiment of the manufacturing method of the display panel of the present application.
  • a second mask is provided, and the first insulating layer 5011 is formed by chemical or physical deposition.
  • the material of the first insulating layer 5011 is inorganic materials such as silicon oxide and silicon nitride.
  • the edge of the first insulating layer 5011 exceeds the edge of the encapsulation layer.
  • FIG. 9 is a schematic diagram of forming the first touch metal layer in the second embodiment of the manufacturing method of the display panel of the present application.
  • a first touch metal layer 5012 is formed on the first insulating layer 5011.
  • the material of the first touch metal layer 5012 may be aluminum-titanium alloy or the like, for example, TiAlTi.
  • the first touch metal layer 5012 is controlled to completely cover the touch area, where the touch area is an area that can sense touch.
  • the first touch metal layer 5012 is patterned to form touch traces and related touch circuit patterns.
  • FIG. 10 is a schematic diagram of forming the second insulating layer in the second embodiment of the method for manufacturing the display panel of the present application.
  • a second insulating layer 5013 is formed on the first touch metal layer 5012.
  • an inorganic insulating material is deposited on the entire surface.
  • the inorganic insulating material can be silicon nitride, silicon oxide, or the like.
  • a photomask is provided to etch the second insulating layer 5013 to pattern the second insulating layer 5013.
  • the edge of the obtained second insulating layer 5013 is between the edge of the encapsulation layer and the cutting line of the substrate, and the etching depth of the corresponding cutting area is controlled to extend to the inorganic encapsulation layer and penetrate the inorganic encapsulation layer.
  • the etching depth of the corresponding cutting area is controlled to extend to the inorganic encapsulation layer and penetrate the inorganic encapsulation layer.
  • etching the insulating layer if excess encapsulation layer material is sputtered to the area outside the effective area of the package, especially on the substrate cutting line, it can be sputtered to the encapsulation material outside the encapsulation layer and the first insulation. Layer materials, etc., are etched and removed together.
  • FIG. 11 is a schematic diagram of forming the second touch metal layer in the second embodiment of the manufacturing method of the display panel of the present application.
  • a second touch metal layer 5014 is formed on the second insulating layer 5013.
  • the material of the second touch metal layer 5014 may be aluminum-titanium alloy or the like, such as TiAlTi.
  • the second touch metal layer 5014 is controlled to completely cover the touch area.
  • the second touch metal layer 5014 is patterned to form touch traces and related touch circuit patterns.
  • FIG. 12 is a schematic diagram of forming a protective layer in the second embodiment of the manufacturing method of the display panel of the present application.
  • a protective layer 5015 is formed on the second touch metal layer 5014 to protect the touch film layer.
  • the material of the protective layer is an organic polymer material, and the specific material structure type is not limited.
  • the edge of the touch protection layer 5015 is aligned with the edge of the insulating layer, or slightly beyond the edge of the insulating layer, but not beyond the cutting line of the substrate.
  • the substrate mother board 10 is cut along the substrate cutting line or in the cutting area, and divided into a plurality of small display substrates for subsequent manufacturing processes.
  • the present application provides a method for manufacturing a display panel, which can protect the packaging layer from damage in the subsequent manufacturing process by etching and removing the inorganic packaging layer material in the cutting area while patterning the insulating layer, thereby improving packaging performance , Extend the life of the display device.

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  • Microelectronics & Electronic Packaging (AREA)
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Abstract

一种显示面板的制备方法，所述制备方法包括：提供基板母板（10），基板母板（10）上定义有多个显示面板区（200）以及划分多个显示面板区（200）的切割区（100）；显示面板区（200）内定义有显示区和非显示区，显示区内设置有多个发光器件（102），对多个发光器件（102）进行封装形成封装层，封装层包括至少一层无机封装层（2021）；在封装层上形成绝缘层（2031），对绝缘层（2031）进行图案化处理，其中，在图案化绝缘层（2031）的同时蚀刻去除切割区（100）内的无机封装层材料；对基板母板（10）进行切割，分离多个显示面板区（200），形成多个显示面板。通过上述方式，能够提高显示面板的封装性能，延长显示面板的使用寿命。

Description

一种显示面板的制备方法 【技术领域】
本申请涉及显示技术领域，特别是涉及一种显示面板的制备方法。
【背景技术】
有机发光二极管(Organic Light Emitting Diode，OLED)显示器是当今平板显示器领域的研究热点之一，与液晶显示器相比，OLED具有低能耗、生产成本低、自发光、宽视角及响应速度快等优点，目前，在手机、PDA、数码相机等平板显示领域已有较多应用。现有的有机发光二极管显示面板结构中，通常包括基板、显示器件层、以及薄膜封装层。薄膜封装层通常包括无机封装层和有机封装层，无机封装层用于阻隔水氧，有机封装层用于提高薄膜封装层的柔韧性。
【发明内容】
本申请主要解决的技术问题是提供一种显示面板的制备方法，能够提高显示面板的封装性能，延长显示面板的使用寿命。
为解决上述技术问题，本申请采用的一个技术方案是：提供一种显示面板的制备方法，所述制备方法包括：提供基板母板，基板母板上定义有多个显示面板区以及划分多个显示面板区的切割区；显示面板区内定义有显示区和非显示区，显示区内设置有多个发光器件，对多个发光器件进行封装形成封装层，封装层包括至少一层无机封装层；在封装层上形成绝缘层，对绝缘层进行图案化处理，其中，在图案化绝缘层的同时蚀刻去除切割区内的无机封装层材料；对基板母板进行切割，分离多个显示面板区，形成多个显示面板。
本申请提供的显示面板制备方法，通过在图案化绝缘层的同时蚀刻去除溅射到切割区内的无机封装层材料，能够保护封装层在后续的制程中不受损坏，进而提高封装性能，延长显示器件寿命。
【附图说明】
图1是本申请显示面板制备方法第一实施方式的流程示意图；
图2是本申请显示面板制备方法第一实施方式中基板母板的俯视透视图；
图3是本申请显示面板制备方法第一实施方式中显示面板区的剖面结构示意图；
图4是本申请显示面板的制备方法第二实施方式中提供基板母板的示意图；
图5是本申请显示面板的制备方法第二实施方式中形成第一无机封装层的示意图；
图6是本申请显示面板的制备方法第二实施方式中形成有机封装层的示意图；
图7是本申请显示面板的制备方法第二实施方式中形成第二无机封装层的示意图；
图8是本申请显示面板的制备方法第二实施方式中形成触控打底层的示意图；
图9是本申请显示面板的制备方法第二实施方式中形成第一触控金属层的示意图；
图10是本申请显示面板的制备方法第二实施方式中形成绝缘层的示意图；
图11是本申请显示面板的制备方法第二实施方式中形成第二触控金属层的示意图；
图12是本申请显示面板的制备方法第二实施方式中形成保护层的示意图。
【具体实施方式】
为使本申请的目的、技术方案及效果更加清楚、明确，以下参照附图并举实施例对本申请进一步详细说明。
在显示面板制备过程中，一般是利用一个大的基板母板同时制备多个显示面板结构，然后再切割形成小的显示面板。在制备显示面板时， 需要对发光器件进行封装，如选用薄膜封装，薄膜封装层至少包括一层用于阻隔水氧的无机封装层，通常是利用掩膜板采用沉积的方式形成无机封装层，但是在沉积时，有可能会有部分无机封装层材料溢出溅射到封装区以外的地方。特别是制备窄边框的显示面板时，封装区的外侧空间较小，溢出的无机封装层材料会溅射到切割区，在对基板母板进行切割时，就会切到这些无机封装层材料，而这些无机封装层材料与封装有效区的无机封装层是相连的，外力切割会破坏膜层产生裂纹，若裂纹蔓延至封装有效区时，会导致封装不良，器件失效。基于上述情况，本申请提供一种显示面板的制备方法，通过使用本申请所提供的显示面板的制备方法，所得显示面板的封装层上形成有至少一层绝缘层，且在制备绝缘层的同时，蚀刻去除溅出沉积到切割区内的无机封装层材料，能够防止后续切割时，对封装有效区的无机封装层造成损伤。进而提高封装性能，延长显示面板的寿命。
请结合参阅图1-3，图1是本申请显示面板制备方法第一实施方式的流程示意图，图2是本申请显示面板制备方法第一实施方式中基板母板的俯视透视图，图3是本申请显示面板制备方法第一实施方式中显示面板区的剖面结构示意图。在该实施方式中，显示面板的制备方法包括如下步骤：
S101：提供基板母板，基板母板上定义有多个显示面板区以及划分多个显示面板区的切割区。
基板母板10是还未进行封装和切割的整面显示基板。可选的，基板母板10为有机发光显示基板，基板母板10至少包括阵列基板101和发光器件102，阵列基板101包括衬底基板和像素电路阵列，发光器件102设置在显示面板区200的显示区内，至少包括阳极层、有机发光层和阴极层等。附图中102所示意的是一个显示面板区内的所有多个发光器件。
切割区100是指裁切基板母板10时裁刀所经过的区域，可以是一条切割线，也可以是具有一定宽度的区域。基板母板10上可以使用明显标识的标记线来标明划分切割区100，也可以没有标记线标识。
显示面板区200是切割后形成单个小的显示面板的区域。
S102：显示面板区内定义有显示区和非显示区，显示区内设置有多个发光器件，对多个发光器件进行封装形成封装层，封装层包括至少一层无机封装层。
其中，发光器件包括发光层，发光层材料一般对水汽、氧气比较敏感，为了保护发光层材料，需要对发光器件进行封装形成封装层，且封装层应完全覆盖显示区，封装后形成多个相互独立的封装区202。封装层至少包括一层用于阻隔水氧的无机封装层2021。一般利用掩膜板采用沉积的方式形成无机封装层。
S103：在封装层远离基板母板的一侧形成绝缘层，对绝缘层进行图案化处理，其中，在图案化绝缘层的同时蚀刻去除切割区内的无机封装层材料。
本申请制得的显示面板中，封装层远离基板母板10的一侧设置有至少一层绝缘层2031。绝缘层2031可以是一层保护层，用于增强对显示器件的保护，也可以是其他功能膜层，拓展显示面板的功能。
可以利用光刻蚀的方法对绝缘层2031进行图案化处理，形成多个相互独立的分别对应多个封装区202的绝缘区203，以在蚀刻去除多余的绝缘层材料时，同时蚀刻去除溅射到切割区内的无机封装层材料。具体地，蚀刻去除多余的绝缘层材料时，控制对应切割区的蚀刻深度延伸至无机封装层，并贯穿无机封装层，以同时蚀刻去除溅射到切割区内的无机封装层材料。
绝缘层2031可以是无机材料形成的无机层，也可以是有机材料形成的有机层，优选用与无机封装层材料相同的材料制成。
S104：对基板母板进行切割，分离多个显示面板区，形成多个显示面板。
其中，在基板母板10上完成各个膜层的制备后，沿切割线或在切割区内按照预设规则将基板母板10切割成多个小的基板，再进行后续制程，得到显示面板。
在该实施方式中，通过在图案化绝缘层的同时蚀刻去除溅射到切割 区内的无机封装层材料，能够保护封装层在后续的制程中不受损坏，进而提高封装性能，延长显示器件寿命，且不需要单独增加工艺制程。
其中，在一实施方式中，绝缘区203的边缘超出或对齐封装区202的边缘，即绝缘层2031完全覆盖无机封装层2021。在该实施方式中，蚀刻去除多余的绝缘层材料时，对应封装区以外的蚀刻区域的蚀刻深度都可延伸并贯穿无机封装层，以蚀刻去除溅射到切割区的无机封装层材料。在该实施方式中，可以不用更改光罩，减少工艺成本。
其中，在一实施方式中，封装区202的边缘超出绝缘区203的边缘，即绝缘层2031并不能完全覆盖无机封装层2021。此时，蚀刻去除多余的绝缘层材料时，需要使用具有多个不同透光率区域的光罩，仅使对应切割区的蚀刻深度延伸并贯穿无机封装层。以防破坏封装有效区的封装层。
其中，在一实施方式中，绝缘层可以有一层、两层或多层，当绝缘层为多层时，可以选择图形化任意一层绝缘层时，蚀刻去除溅射到切割区内的无机封装层材料。
在一实施方式中，封装层远离基板母板的一侧仅设置有第一绝缘层，那么在对第一绝缘层进行图案化处理时，同时蚀刻去除溅射到切割区内的无机封装层材料。
在一实施方式中，封装层远离基板母板的一侧设置有第一绝缘层，第一绝缘层远离封装层的一侧设置有触控膜层，触控膜层中设置有第二绝缘层。可以在对第一绝缘层进行图案化处理时，蚀刻去除溅射到切割区内的无机封装层材料；或者在对第一绝缘层进行图案化处理时，蚀刻深度仅贯穿第一绝缘层；然后在对第二绝缘层进行图案化处理时，蚀刻去除溅射到切割区内的无机封装层材料。
在一实施方式中，封装层远离基板母板的一侧设置有第一绝缘层，第一绝缘层远离封装层的一侧设置有触控膜层，触控膜层至少包括第二绝缘层，触控膜层远离第一绝缘层的一侧设置有第三绝缘层。可以在对第一绝缘层进行图案化处理时，蚀刻去除溅射到切割区内的无机封装层材料；或者在对第一绝缘层进行图案化处理时，蚀刻深度仅贯穿第一绝 缘层；然后在对第二绝缘层进行图案化处理时，蚀刻去除溅射到切割区内的无机封装层材料；再或者在对第一绝缘层进行图案化处理时，蚀刻深度仅贯穿第一绝缘层；在对第二绝缘层进行图案化处理时，蚀刻深度仅贯穿第二绝缘层，然后在对第三绝缘层进行图案化处理时，蚀刻去除溅射到切割区内的无机封装层材料。
下面，以绝缘层为触控膜层中的绝缘层，且在对触控膜层中的绝缘层进行图案化时，蚀刻去除溅射到切割区内的无机封装层材料为例对本申请所提供的方法进行详细描述，但不限于此。
请结合参阅图4-图12，对显示面板的制备方法进行详细描述，具体步骤如下：
请参阅图4，图4是本申请显示面板的制备方法第二实施方式中提供基板母板的示意图。提供基板母板10，基板母板10是还未进行封装和切割的整面显示基板。基板母板10至少包括阵列基板101和发光器件102，阵列基板101包括衬底基板和像素电路阵列，发光器件102包括阳极层、有机发光层和阴极层等。
其中，衬底基板可以是柔性基板或常规基板，常规的基板材质可以是石英、玻璃、金属、树脂等，其中，树脂基板可以是聚甲基丙烯酸甲酯(PMMA)、聚对苯二甲酸乙二醇酯(PET)、聚萘二甲酸乙二醇酯(PBN)、聚碳酸酯树脂等。对于柔性显示设备而言则采用柔性基板，如聚酰亚胺(PI)基板。另外，衬底基板优选具备良好的水和气体阻隔性能的材料，同时对于底端发射型的器件而言，衬底基板应该还具备良好的透明性，即可见光波长范围内的光线可透过基板。
其中，为阻隔水汽、氧气，保护发光材料，需要对发光器件进行薄膜封装。薄膜封装形成在发光层远离柔性基板的一侧以对发光材料进行保护，薄膜封装层一般包括有机封装层和无机封装层。无机封装层对水汽、氧气有很好的阻隔性能；无机封装材料可以是以下材料中的一种或多种：Al 2O 3、TiO 2、ZrO 2、MgO、Si 3N 4、AlN、SiN、SiNO、SiO、SiO 2、SiC、SiCN x等。有机封装层的存在可以使器件表面平整度更好，有利于后续无机封装层的形成，同时有机封装层的抗弯折性能比较好。有机封 装材料可以选用聚甲基丙烯酸甲酯(PMMA)等。
请参阅图5，图5是本申请显示面板的制备方法第二实施方式中形成第一无机封装层的示意图。具体地，提供掩膜板301，掩膜板301具有多个开口3011，多个开口3011分别对应多个发光器件102，以掩膜板301为掩膜，利用化学气相沉积法或物理气相沉积法在基板母板10上制备形成第一无机封装层4011。沉积无机封装层材料时，因掩膜板的存在，只在开口区(显示区)形成无机封装层，所得第一无机封装层4011完全覆盖发光器件102，即第一无机封装层4011的边缘超出显示区边缘。
请参阅图6，图6是本申请显示面板的制备方法第二实施方式中形成有机封装层的示意图。采用喷墨打印的方法在第一无机封装层4011上制备覆盖显示区的第一有机封装层4012。通过设置第一有机封装层4012，能够提高平坦性，利于后续无机封装层的形成，同时有机封装层能够提高封装层的抗弯折能力。第一有机封装层4012覆盖显示区，且第一有机封装层4012的边缘不超过第一无机封装层4011的边缘。
请参阅图7，图7是本申请显示面板的制备方法第二实施方式中形成第二无机封装层的示意图。再采用化学气相沉积法在第一有机封装层4012上形成覆盖第一有机封装层的第二无机封装层4013。两层无机封装层的材料可以相同，也可以不同。第二无机封装层4013的边缘与第一无机封装层4011的边缘平齐，或超出第一无机封装层4011的边缘。
形成薄膜封装层之后，在薄膜封装层之上形成第一绝缘层，第一绝缘层可以作为显示器件的保护层，或者作为触控打底层，然后在第一绝缘层上形成触控膜层，触控膜层包括第一触控金属层、第二绝缘层和第二触控金属层。
请参阅图8，图8是本申请显示面板的制备方法第二实施方式中形成第一绝缘层的示意图。提供第二掩膜板，利用化学或物理沉积法形成第一绝缘层5011，第一绝缘层5011的材料为氧化硅、氮化硅等无机材料。第一绝缘层5011的边缘超过封装层的边缘。
请参阅图9，图9是本申请显示面板的制备方法第二实施方式中形成第一触控金属层的示意图。在第一绝缘层5011上形成第一触控金属 层5012，第一触控金属层5012的材料可以是铝钛合金等，如可以是TiAlTi。控制第一触控金属层5012完全覆盖触控区域，其中触控区域为可以感应触控的区域。图形化第一触控金属层5012，形成触控走线及相关触控电路图形。
请参阅图10，图10是本申请显示面板的制备方法第二实施方式中形成第二绝缘层的示意图。在第一触控金属层5012上形成第二绝缘层5013。先整面沉积无机绝缘材料，无机绝缘材料可以是氮化硅、氧化硅等。再提供光罩，对第二绝缘层5013进行刻蚀，图形化第二绝缘层5013。所得第二绝缘层5013的边缘在封装层边缘与基板切割线之间，且控制对应切割区的蚀刻深度延伸至无机封装层，并贯穿无机封装层，具体实施过程请参阅上述实施方式的描述，在此不再赘述。在蚀刻绝缘层时，如果有多余的封装层材料溅射到封装有效区以外的区域，特别是溅射到基板切割线上，可以一并将溅射到封装层以外的封装材料、第一绝缘层材料等，一并蚀刻去除。因为溅射到封装有效区以外的区域的封装材料与原有封装层有连接，如果切割时被切到，容易引起封装层裂开，裂纹蔓延至封装有效区，导致封装不良。通过这种方式，不需要额外增加制程工艺，就能够去除多余的封装材料，进而保护封装层不被破坏，提高封装性能，延长显示面板的使用寿命。
请参阅图11，图11是本申请显示面板的制备方法第二实施方式中形成第二触控金属层的示意图。在第二绝缘层5013上形成第二触控金属层5014。第二触控金属层5014的材料可以为铝钛合金等，如可以是TiAlTi。控制第二触控金属层5014完全覆盖触控区域。图形化第二触控金属层5014，形成触控走线及相关触控电路图形。
请参阅图12，图12是本申请显示面板的制备方法第二实施方式中形成保护层的示意图。在第二触控金属层5014上形成保护层5015，对触控膜层进行保护，保护层材料为有机聚合物材料，具体材料结构类型不做限定。触控保护层5015的边缘与绝缘层的边缘对齐，或略超出绝缘层的边缘，但不超出基板切割线。
各膜层制备完成后，沿基板切割线或在切割区内对基板母板10进 行切割，分成多个小的显示基板，进行后续制程。
以上方案，本申请提供一种显示面板的制备方法，通过在图案化绝缘层的同时蚀刻去除切割区内的无机封装层材料，能够保护封装层在后续的制程中不受损坏，进而提高封装性能，延长显示器件寿命。
以上所述仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (17)

  1. 一种显示面板的制备方法，包括：
    提供基板母板，所述基板母板上定义有多个显示面板区以及划分所述多个显示面板区的切割区；
    所述显示面板区内定义有显示区和非显示区，所述显示区内设置有多个发光器件，对所述多个发光器件进行封装形成封装层，所述封装层包括至少一层无机封装层；
    在所述封装层远离所述基板母板的一侧形成绝缘层，对所述绝缘层进行图案化处理，其中，在图案化所述绝缘层的同时蚀刻去除所述切割区内的无机封装层材料；
    对所述基板母板进行切割，分离所述多个显示面板区，形成多个所述显示面板。
  2. 根据权利要求1所述的显示面板的制备方法，其中，所述在图案化所述绝缘层的同时蚀刻去除所述切割区内的所述无机封装层材料包括：
    蚀刻去除多余的绝缘层材料时，控制对应所述切割区的蚀刻深度延伸至所述无机封装层，并贯穿所述无机封装层，以同时蚀刻去除所述切割区内的所述无机封装层材料。
  3. 根据权利要求1所述的显示面板的制备方法，其中，对所述多个发光器件进行封装后形成多个相互独立的封装区，所述对绝缘层进行图案化处理包括：
    蚀刻去除多余的绝缘层材料，形成多个相互独立的分别对应所述多个封装区的绝缘区，并使所述绝缘区的边缘超出或对齐所述封装区的边缘。
  4. 根据权利要求3所述的显示面板的制备方法，其中，所述对绝缘层进行图案化处理包括：
    使用具有均一透光率区域的光罩，蚀刻去除多余的绝缘层材料，对应所述封装区以外的蚀刻区域的蚀刻深度相同，且都可延伸并贯穿无机 封装层，以蚀刻去除溅射到所述切割区的无机封装层材料。
  5. 根据权利要求1所述的显示面板的制备方法，其中，对所述多个发光器件进行封装后形成多个相互独立的封装区，所述对绝缘层进行图案化处理包括：
    蚀刻去除多余的绝缘层材料，形成多个相互独立的分别对应所述多个封装区的绝缘区，并使所述封装区的边缘超出所述绝缘区的边缘。
  6. 根据权利要求5所述的显示面板的制备方法，其中，所述对绝缘层进行图案化处理包括：
    使用具有多个不同透光率区域的光罩，对应所述切割区的蚀刻深度延伸至所述无机封装层，并贯穿所述无机封装层；对应所述切割区以外的蚀刻深度仅贯穿所述绝缘层。
  7. 根据权利要求1所述的显示面板的制备方法，其中，所述封装层远离所述基板母板的一侧设置有一层或多层所述绝缘层，所述在图案化所述绝缘层的同时蚀刻去除所述切割区内的所述无机封装层材料包括：
    图形化任意一层绝缘层时，蚀刻去除所述切割区内的所述无机封装层材料。
  8. 根据权利要求7所述的显示面板的制备方法，其中，所述封装层远离所述基板母板的一侧仅设置有第一绝缘层，所述在图案化所述绝缘层的同时蚀刻去除所述切割区内的所述无机封装层材料包括：
    对所述第一绝缘层进行图案化处理时，蚀刻去除所述切割区内的所述无机封装层材料。
  9. 根据权利要求7所述的显示面板的制备方法，其中，所述封装层远离所述基板母板的一侧至少设置有第一绝缘层和第二绝缘层，所述在图案化所述绝缘层的同时蚀刻去除所述切割区内的所述无机封装层材料包括：
    对所述第一绝缘层进行图案化处理时，蚀刻去除所述切割区内的所述无机封装层材料。
  10. 根据权利要求7所述的显示面板的制备方法，其中，所述封装层远离所述基板母板的一侧至少设置有第一绝缘层和第二绝缘层，所述在 图案化所述绝缘层的同时蚀刻去除所述切割区内的所述无机封装层材料包括：
    对所述第一绝缘层进行图案化处理时，蚀刻深度仅贯穿所述第一绝缘层；
    对所述第二绝缘层进行图案化处理时，蚀刻去除所述切割区内的所述无机封装层材料。
  11. 根据权利要求10所述的显示面板的制备方法，其中，所述第一绝缘层远离所述封装层的一侧设置有触控膜层，所述第一绝缘层为触控打底层，所述第二绝缘层为所述触控膜层中的绝缘层。
  12. 根据权利要求11所述的显示面板的制备方法，其中，所述方法包括：
    在所述封装层远离所述基板母板的一侧形成所述触控打底层；
    在所述触控打底层远离所述基本母板的一侧形成第一触控金属层，控制所述第一触控金属层完全覆盖触控区域；
    图形化所述第一触控金属层，形成触控走线及相关触控电路图形；
    在所述第一触控金属层远离所述基板母板的一侧形成所述第二绝缘层。
  13. 根据权利要求7所述的显示面板的制备方法，其中，所述封装层远离所述基板母板的一侧至少设置有第一绝缘层、第二绝缘层和第三绝缘层，所述在图案化所述绝缘层的同时蚀刻去除所述切割区内的所述无机封装层材料包括：
    对所述第一绝缘层进行图案化处理时，蚀刻深度仅贯穿所述第一绝缘层；
    对所述第二绝缘层进行图案化处理时，蚀刻深度仅贯穿所述第二绝缘层；
    对所述第三绝缘层进行图案化处理时，蚀刻去除所述切割区内的所述无机封装层材料。
  14. 根据权利要求13所述的显示面板的制备方法，其中，所述第一绝缘层远离所述封装层的一侧设置有触控膜层，所述第一绝缘层为触控 打底层，所述第二绝缘层为所述触控膜层中的绝缘层，所述第三绝缘层为触控保护层。
  15. 根据权利要求14所述的显示面板的制备方法，其中，所述方法包括：
    在所述封装层远离所述基板母板的一侧形成所述触控打底层；
    在所述触控打底层远离所述基本母板的一侧形成第一触控金属层，控制所述第一触控金属层完全覆盖触控区域；
    图形化所述第一触控金属层，形成触控走线及相关触控电路图形；
    在所述第一触控金属层远离所述基板母板的一侧形成所述第二绝缘层；
    在所述第二绝缘层远离所述基本母板的一侧形成第二触控金属层，控制所述第二触控金属层完全覆盖触控区域；
    图形化所述第二触控金属层，形成触控走线及相关触控电路图形；
    在所述第二触控金属层远离所述基板母板的一侧形成所述触控保护层。
  16. 根据权利要求1所述的显示面板的制备方法，其中，所述对多个发光器件进行封装包括：
    提供掩膜板，所述掩膜板具有多个开口，所述多个开口分别对应所述多个显示区；
    以所述掩膜板为掩膜，沉积无机封装材料，在所述显示区形成第一无机封装层；
    在所述第一无机封装层上形成有机封装层；
    在所述有机封装层上形成第二无机封装层。
  17. 根据权利要求16所述的显示面板的制备方法，其中，所述对绝缘层进行图案化处理包括：
    蚀刻去除多余的所述绝缘层时，控制所述切割区内的蚀刻深度延伸至所述第一无机封装层，并贯穿所述第一无机封装层和所述第二无机封装层，以蚀刻去除所述切割区内的所述第一无机封装层和所述第二无机封装层。
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