WO2020170349A1 - Procédé d'inspection d'apparence, dispositif de montage - Google Patents

Procédé d'inspection d'apparence, dispositif de montage Download PDF

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Publication number
WO2020170349A1
WO2020170349A1 PCT/JP2019/006239 JP2019006239W WO2020170349A1 WO 2020170349 A1 WO2020170349 A1 WO 2020170349A1 JP 2019006239 W JP2019006239 W JP 2019006239W WO 2020170349 A1 WO2020170349 A1 WO 2020170349A1
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WO
WIPO (PCT)
Prior art keywords
slider
mounting
circuit board
visual inspection
component
Prior art date
Application number
PCT/JP2019/006239
Other languages
English (en)
Japanese (ja)
Inventor
貴紘 小林
一也 小谷
芳行 深谷
杉山　健二
雅史 天野
Original Assignee
株式会社Ｆｕｊｉ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to PCT/JP2019/006239 priority Critical patent/WO2020170349A1/fr
Priority to JP2021501192A priority patent/JP7232894B2/ja
Publication of WO2020170349A1 publication Critical patent/WO2020170349A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • the present disclosure relates to an appearance inspection method for inspecting the surface of a circuit board, the appearance of components mounted on the circuit board, and a mounting machine that implements the appearance inspection method.
  • Patent Document 1 in a mounting machine in which a slider is integrally provided with a component mounting head and a reference mark camera, the appearance of components mounted on a circuit board is determined based on a captured image obtained by the reference mark camera.
  • the appearance inspection method to be inspected is described.
  • the slider is moved to the image capturing position, and at the image capturing position, the reference mark camera captures an image of the component A or the like mounted by the component mounting head. To do. Then, the appearance inspection of the part A is performed based on the part image representing the part A included in the captured image.
  • the problem of the present disclosure is to efficiently perform a visual inspection of the surface of a circuit board, components mounted on the circuit board, and the like.
  • an image is taken by the image pickup device at the work position of the slider, and based on the picked-up image, that is, the image showing the surface of the circuit board included in the picked-up image or mounted on the circuit board.
  • Visual inspection of the surface of the circuit board, the parts mounted on the circuit board, and the like is performed based on the images representing the parts.
  • the mounting system includes a mounting machine according to an embodiment of the present disclosure. It is a top view of the said mounting machine. It is a side view of the said mounting machine. It is a top view of the circuit board in the said mounting machine. (5A), (5B) It is a figure which shows notionally the production program used in the said mounting machine. It is a flow chart showing a work control program memorized by a storage part of a control device of the above-mentioned mounting machine.
  • this mounting system includes a plurality of units 4A to 4F, a host computer (hereinafter abbreviated as host PC) 8, a bus 10, and the like.
  • Each of the plurality of units 4A to 4F includes control devices 12A to 12F mainly including a computer, and these control devices 12A, 12B,... And the host PC 8 are communicatively coupled to each other via a bus 10.
  • the unit 4 or a plurality of units 4 the control device 12 or It is referred to as a plurality of control devices 12.
  • reference numeral 4A indicates a solder printing machine
  • reference numeral 4B indicates a printing inspection machine
  • reference numerals 4C and 4D indicate mounting machines.
  • Reference numeral 4E indicates a substrate visual inspection machine
  • reference numeral 4F indicates a reflow furnace.
  • the solder printing machine 4A performs solder printing on the circuit board
  • the print inspection machine 4B performs inspection for solder printing.
  • components are mounted on the circuit board by the mounters 4C and 4D
  • appearance inspection of the surface of the circuit board and components mounted on the circuit board is performed by the board appearance inspection machine 4E, and the circuit is reassembled in the reflow furnace 4F. Heat treatment is performed on the substrate.
  • the mounting machine 4C includes a base 12, a substrate transfer device 16 that transfers a circuit board (hereinafter, abbreviated as a board) 14 in the X direction, a board holding device 18 that holds the board 14, and a board. 14, a component mounting device 22 for mounting an electronic circuit component (see FIG. 3, hereinafter abbreviated as a component) P, a component supply device 24 for supplying the component P to the component mounting device 22, and the like are provided.
  • a reference mark M is provided on the substrate 14. Note that the width direction of the board 14 is the Y direction, and the vertical direction of the mounting machine 4C is the Z direction.
  • the X direction, the Y direction, and the Z direction are orthogonal to each other.
  • the component supply device 24 can include, for example, a plurality of tape feeders 30.
  • the component mounting device 22 carries the component P by the mounting head 40 and mounts it on the upper surface of the substrate 14, and is provided above the substrate transfer device 16 and the substrate holding device 18.
  • the component mounting device 22 includes an X slider 42, an X slider moving device 44 that moves the X slider 42 in the X direction, a Y slider 46, a Y slider moving device 48, and the like.
  • the Y slider 46 is provided on the X slider 42, and the Y slider moving device 48 relatively moves the Y slider 46 in the Y direction in the X slider 42.
  • the mounting head 40 is held by the Y slider 46 so as to be movable integrally.
  • the X slider 42, the X slider moving device 44, the Y slider moving device 48, etc. constitute the slider moving device 41.
  • the Y-slider 46 which is a slider, also holds the fiducial mark camera 54 so as to be movable integrally.
  • the mounting head 40 includes a head main body 52 and a suction nozzle 50 that is held so as to be movable up and down with respect to the head main body 52.
  • the component P is suctioned by the negative pressure, and is mounted on the substrate 14 by releasing the negative pressure.
  • the fiducial mark camera 54 is an imaging device that mainly takes an image of the fiducial mark M and the like formed on the substrate 14, and is hereinafter simply referred to as the mark camera 54.
  • the mark camera 54 is composed of a CCD camera and images the substrate 14 from above.
  • the mark camera 54 is not limited to the reference mark M formed on the substrate 14, and can also capture an image of the portion of the substrate 14 where the reference mark M is not formed. Then, based on the picked-up images connected by the mark camera 54, the external appearance of the components mounted on the upper surface which is the surface of the substrate 14 and the upper surface of the reference 14 can be known.
  • an input/output unit (not shown) of the control device 12C is provided with an image processing device mainly including an X slider moving device 44, a Y slider moving device 48, a mark camera 54, and a computer via a driving circuit (not shown). 58 and the like are connected.
  • the host PC 8 includes an execution unit (CPU) 60, a storage unit 62, an input/output unit not shown, and the like, and an input device 64, a display 66, and the like are connected to the input/output unit.
  • the storage unit 62 stores work to be executed in this mounting system, information about parts used in the work, and the like, and a production program that defines the order and contents of mounting and inspection based on the information and the like is executed by the execution unit 60. And is supplied to the plurality of units 4.
  • the component P is mounted on the board 14 in the mounting machines 4C and 4D, and the appearance of the upper surface of the board 14 and the component P mounted on the board 14 in the board appearance inspection machine 4E.
  • An inspection (hereinafter sometimes simply referred to as a visual inspection of a substrate or the like) is usually performed.
  • the mounting machines 4C and 4D are provided with the mark cameras 54, respectively, but were not used when the component P is mounted. Further, since the mark camera 54 is provided on the Y slider 46, it can be moved integrally with the mounting head 40.
  • the mark camera 54 captures an image of the substrate 14 from above, and the captured image is supplied to the image processing device 58. Then, in the image processing device 58, the appearance inspection of the substrate or the like is performed based on the captured image.
  • the imaging region R which is the portion of the substrate 14 that is imaged by the mark camera 54 when the component P is mounted, is determined by the field of view of the mark camera 54.
  • the position of the imaging region R (for example, the position of the center point) is determined by the relative positional relationship between the mark camera 54 and the suction nozzle 50 or the mounting head 40.
  • the entire substrate 14 (including all components mounted on the substrate 14 and the like is included. ) Is difficult to image. Therefore, in the mounting machines 4C and 4D, it is difficult to perform a visual inspection of the board 14 or the like for the entire board 14.
  • a part of the visual inspection of the board and the like performed by the board visual inspection machine 4E is performed by the mounting machines 4C and 4D. As a result, it is possible to shorten the time required for the visual inspection of the board and the like in the board visual inspection machine 4E, improve the working efficiency of the entire mounting system, and shorten the working time.
  • FIG. 5A shows an example of a production program created when it is not planned to perform image pickup by the mark camera 54 in parallel with component mounting
  • FIG. 5B shows in parallel with component mounting. An example of a production program created to capture an image by the mark camera 54 is shown.
  • the mark camera 54 is mounted when the component Pa is mounted.
  • the components Pa, Pb, and Pc are mounted in this order, the component Pa is mounted before the components Pb and Pc, which is inconvenient for the image pickup by the mark camera 54.
  • the mounting order is the order of the parts Pb, Pc, Pa, and
  • the production program is created so that the mark camera 54 takes an image in parallel with the mounting of the component Pa.
  • an instruction to mount a component may be referred to as a mounting instruction
  • an instruction to perform component mounting and imaging in parallel may be referred to as a mounting/imaging instruction (also referred to as a mounting parallel imaging instruction).
  • the image captured by the mark camera 54 usually does not include the component mounted by the mounting head 40. Therefore, the inspection target component, which is the component represented by the component image included in the captured image, and the mounting target component, which is the component to be mounted, are usually different from each other.
  • the component to be inspected may include the component to be mounted.
  • the mounting and the imaging are performed in parallel, it is not essential that the mounting and the imaging are performed in parallel during the entire period of the mounting, and at least one period of the mounting and at least one period of the imaging are performed in parallel. I'm sorry.
  • the part Pf is a part to be mounted in the mounting machine 4D. Therefore, in the mounting machine 4C, when the component Pe is mounted, the mark camera 54 can image the component Pd, but cannot image the component Pf. Therefore, in the host PC 8, as a result of the optimization of the work in the mounting system, as shown in FIG. 5B, the mounting machine 4C mounts the component Pf, and concurrently with the mounting work of the component Pe. In some cases, a production program is created so that the mark camera 54 captures an image.
  • the reference mark M is imaged before the mounting work of the component P is started, and the position error of the substrate 14 is acquired based on the position of the reference mark M on the XY coordinates. Is normal.
  • the Y-slider 46 is moved to the work position where the reference mark M is located substantially in the center of the image pickup area R of the mark camera 54, and the reference mark M and the like are picked up by the mark camera 54. ..
  • the Y slider 46 is moved to the work position where the reference mark M is located at the end of the imaging region R, and the mark camera 54 images the reference mark M and the like.
  • the image processing device 58 the appearance inspection of the substrate or the like is performed on the portion of the substrate 14 near the reference mark M based on the captured image.
  • the mounting machines 4C and 4D perform the visual inspection of the board and the like on the portion near the reference mark M of the board 14 based on the captured image including the reference mark M.
  • the reference mark M is usually provided at the end of the substrate 14, the reference mark M is not located at the center, but the reference mark M is located at the end.
  • the captured image is acquired as described above. As a result, the imaging portion of the substrate 14 can be widened and the inspection target portion can be widened.
  • each of the mounting machines 4C and 4D mounting work is performed according to the production program.
  • the work control program shown in the flowchart of FIG. 6 is executed, and along with that, the X slider moving device 44, the Y slider moving device 48, the mark camera 54, etc. are controlled.
  • step 1 (hereinafter, simply referred to as S1; the same applies to other steps), a work instruction is read in accordance with the production program, and whether the work instruction is a mounting/imaging instruction in S2, in S3. Then, it is determined whether or not it is a mounting instruction, and whether or not it is a fiducial mark imaging instruction in S4.
  • the Y slider 46 moves to the image capturing position which is the work position where the reference mark M is located at the end of the image capturing region R in S5 and S6. It is made to be stopped. An image is picked up by the mark camera 54 at the image pickup position.
  • the captured image is supplied to the image processing device 58.
  • the position of the reference mark M is acquired, and the appearance of the substrate and the like in the vicinity of the reference mark M of the substrate 14 is inspected.
  • Information indicating the result of the visual inspection of the board and the like is supplied to the host PC 8.
  • the slider moving device 41 moves the Y slider 46 to the mounting position, which is the working position, and stops it in S8 and S9.
  • the suction nozzle 50 is lowered relative to the head main body 52 to mount the component.
  • the slider moving device 41 moves the Y slider 46 to the mounting position, which is the working position, and stops it.
  • the suction nozzle 50 is moved down relative to the head body 52 to mount the component.
  • the mark camera 54 images the substrate 14 from above. Since the suction nozzle 50 is moved in the vertical direction relative to the head body 52, the Y slider 46 is not moved in the vertical direction. Further, the image pickup time of the mark camera 54 may be longer than the mounting time of the component by the suction nozzle 50. In that case, the brightness of the light source is adjusted so as not to be longer than the mounting time.
  • the captured image is supplied to the image processing device 58.
  • the image processing device 58 the appearance inspection of the substrate or the like is performed based on the captured image. Specifically, whether there is a foreign substance on the upper surface of the substrate 14, whether the component P is mounted on the upper surface of the substrate 14 that is to be mounted, and whether the component P is scheduled to be mounted, The inspection is performed accurately and in a correct direction. Then, the result of the visual inspection of the substrate and the like is supplied to the host PC 8.
  • the image pickup of the substrate 14 by the mark camera 54 is performed in parallel with the mounting of the component by the mounting head 40.
  • the imaged image acquired by the mark camera 54 is processed by the image processing device 58, and the appearance inspection of the substrate or the like is performed based on the imaged image. Therefore, it is possible to perform a visual inspection of the substrate and the like while avoiding a long working time required for the mounting work in the mounting machines 4C and 4D.
  • the mark camera 54 has not been conventionally used when mounting components, but in the present embodiment, the mark camera 54 is used to image the inspection target. As a result, it is possible to effectively use the mark camera 54.
  • the appearance inspection of the board or the like may be performed on a portion other than the area where the appearance inspection of the board or the like has already been performed by the mounting machines 4C and 4D. Therefore, the working time in the board appearance inspection machine 4E can be shortened, the working time of the entire mounting system can be shortened, and the working efficiency can be improved.
  • the board appearance inspecting machine 4E based on the result of the appearance inspection of the board or the like supplied from the host PC 8 to the board appearance inspecting machine 4E (including information on the portion of the board 14 to be inspected, the inspection target part, etc.)
  • the appearance inspection of the substrate or the like can be performed on the region of the substrate 14 excluding the region where the appearance inspection of the substrate or the like has already been performed.
  • the host PC 8 when the inspection program executed in the board appearance inspection machine 4E is created based on the production program executed in the mounting machines 4C and 4D, the board appearance inspection machine 4E executes the board according to the inspection program.
  • the appearance inspection of the substrate and the like is performed on the region of the substrate 14 other than the region where the appearance inspection of the substrate and the like is performed in the mounting machines 4C and 4D.
  • S5, 8 and 10 correspond to the slider moving process
  • S9 and 11 correspond to the mounting process
  • S6 and 11 correspond to the imaging process.
  • S6 of them is also a mark imaging step.
  • the slider movement control unit is configured by the portions that store and execute S5, 8, and 10 of the control devices 12C and 12D
  • the imaging control unit is configured by the portion that stores and executes S6, 11.
  • the image processing device 58 and the like form a visual inspection unit.
  • the image processing device 58 of the mounting machines 4C and 4D was designed to perform the visual inspection of the substrate and the like, but the host PC 8 is configured to perform the visual inspection of the substrate and the like. You can also
  • the mounting of the component by the mounting head 40 and the image capturing of the mark camera 54 are performed in parallel, and the image capturing by the mark camera 54 is performed after the mounting of the component by the mounting head 40. You can also do it.
  • the mark camera 54 may image the component B mounted by the mounting head 40, and in that case, the appearance inspection of the component B is also performed.
  • the working time in the mounters 4C and 4D can be shortened as compared with the case where the Y slider 46 is moved for imaging.
  • the movement of the Y slider 46 can be stopped and the board 14 can be imaged while the mounting head 40 is moving between the component receiving position (component supplying device 24) and the component mounting position.
  • the Y slider 46 is not moved in order to capture an image of a visual inspection of a substrate or the like.
  • results of the visual inspection of the boards and the like in the mounting machines 4C and 4D are supplied to a personal computer other than the host PC 8 included in the mounting system, or are supplied to the controller 12E of the board visual inspection machine 4E. You can do so.
  • the upper surface of the substrate 14 and the component P mounted on the substrate 14 are performed. Even if the visual inspection is performed on either one of the above, and at least one of the upper surface of the substrate 14 and the component P mounted on the substrate 14, another visual inspection may be performed. ..
  • the appearance inspection may be performed based on a captured image obtained by capturing a 2D code.
  • the present disclosure has various modifications and improvements based on the knowledge of those skilled in the art. Can be implemented in.
  • Units 4C, 4D Mounting machine 8: Host computer 10: Bus 41: Slider moving device 46: Y slider 48: Y slider moving device 54: Mark camera 58: Appearance inspection device 60: CPU

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

Le but de la présente invention est d'inspecter efficacement l'apparence de la surface supérieure d'une carte de circuit imprimé ou d'un composant, etc, monté sur une carte de circuit imprimé.　Dans ce procédé d'inspection d'apparence, une imagerie est effectuée dans la position de fonctionnement d'un curseur par un dispositif d'imagerie, et sur la base de l'image capturée, l'apparence de la surface supérieure d'une carte de circuit imprimé ou d'un composant, etc. monté sur une carte de circuit imprimé est inspectée. De cette manière, il n'est pas nécessaire de déplacer le curseur afin d'acquérir une image capturée pour une inspection d'apparence. Ainsi, il est possible d'inspecter efficacement l'apparence.
PCT/JP2019/006239 2019-02-20 2019-02-20 Procédé d'inspection d'apparence, dispositif de montage WO2020170349A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2019/006239 WO2020170349A1 (fr) 2019-02-20 2019-02-20 Procédé d'inspection d'apparence, dispositif de montage
JP2021501192A JP7232894B2 (ja) 2019-02-20 2019-02-20 実装システム

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Application Number Priority Date Filing Date Title
PCT/JP2019/006239 WO2020170349A1 (fr) 2019-02-20 2019-02-20 Procédé d'inspection d'apparence, dispositif de montage

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008142864A1 (fr) * 2007-05-24 2008-11-27 Panasonic Corporation Procédé de montage de composant, appareil de montage de composant, procédé de détermination de conditions de montage, et appareil et programme de détermination de conditions de montage
JP2014049574A (ja) * 2012-08-30 2014-03-17 Hitachi High-Tech Instruments Co Ltd 部品装着方法、部品装着装置、及びプログラム
JP2015144167A (ja) * 2014-01-31 2015-08-06 パナソニックＩｐマネジメント株式会社 部品認識データ検査システム及び部品認識データの検査方法
JP2016157898A (ja) * 2015-02-26 2016-09-01 パナソニックＩｐマネジメント株式会社 部品実装方法および部品実装装置
JP2018006510A (ja) * 2016-06-30 2018-01-11 ヤマハ発動機株式会社 部品実装装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4852516B2 (ja) 2007-11-22 2012-01-11 パナソニック株式会社 基板の検査方法及び基板の検査装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008142864A1 (fr) * 2007-05-24 2008-11-27 Panasonic Corporation Procédé de montage de composant, appareil de montage de composant, procédé de détermination de conditions de montage, et appareil et programme de détermination de conditions de montage
JP2014049574A (ja) * 2012-08-30 2014-03-17 Hitachi High-Tech Instruments Co Ltd 部品装着方法、部品装着装置、及びプログラム
JP2015144167A (ja) * 2014-01-31 2015-08-06 パナソニックＩｐマネジメント株式会社 部品認識データ検査システム及び部品認識データの検査方法
JP2016157898A (ja) * 2015-02-26 2016-09-01 パナソニックＩｐマネジメント株式会社 部品実装方法および部品実装装置
JP2018006510A (ja) * 2016-06-30 2018-01-11 ヤマハ発動機株式会社 部品実装装置

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JPWO2020170349A1 (ja) 2021-12-02

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