WO2020168724A1 - 基板清洗机 - Google Patents

基板清洗机 Download PDF

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Publication number
WO2020168724A1
WO2020168724A1 PCT/CN2019/109863 CN2019109863W WO2020168724A1 WO 2020168724 A1 WO2020168724 A1 WO 2020168724A1 CN 2019109863 W CN2019109863 W CN 2019109863W WO 2020168724 A1 WO2020168724 A1 WO 2020168724A1
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WO
WIPO (PCT)
Prior art keywords
cleaning
substrate
unit
cover
nozzle
Prior art date
Application number
PCT/CN2019/109863
Other languages
English (en)
French (fr)
Inventor
陈国梁
Original Assignee
深圳市华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Publication of WO2020168724A1 publication Critical patent/WO2020168724A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/04—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto specially adapted for plate glass, e.g. prior to manufacture of windshields
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays

Definitions

  • This application relates to the field of display panel processing, and in particular to a substrate cleaning machine.
  • Indium tin oxide cleaning and other substrate cleaning machines are used to clean ITO before and after coating. After being tested by the testing machine, it is put into the post process.
  • the waterjet cover 102 of the substrate cleaning machine is easily affected by water vapor, etc.
  • the waterjet cover 102 is prone to stagnant water and a large amount of bacteria remain in the stagnant water.
  • the dead water on the waterjet cover falls When the surface of the substrate S cannot be cleaned, the substrate is not clean and the quality is affected.
  • the existing substrate cleaning machine has a technical problem that the substrate is not clean.
  • the present application provides a substrate cleaning machine to solve the technical problem that the dead water on the waterjet cover plate of the existing substrate cleaning machine falls on the substrate and causes the substrate to be clean.
  • An embodiment of the present application provides a substrate cleaning machine, which includes a water washing unit, and the water washing unit includes:
  • the waterjet unit includes a waterjet nozzle and a waterjet cover for cleaning the surface of the substrate;
  • the cover cleaning unit is used for cleaning the surface of the waterjet cover using a cleaning solution.
  • the cover plate cleaning unit includes a cleaning nozzle, and the cleaning nozzle is used to spray a cleaning solution to clean the surface of the waterjet cover plate.
  • the cleaning nozzle is a nozzle.
  • the cross-sectional shape of the nozzle is circular.
  • the cross-sectional shape of the nozzle is an ellipse.
  • the cross-sectional shape of the nozzle is an irregular quadrilateral.
  • the cross-sectional shape of the nozzle is rectangular.
  • the cross-sectional shape of the nozzle is a trapezoid.
  • the cross-sectional shape of the nozzle is triangular.
  • the cleaning nozzles are arranged in an array.
  • the nozzles arranged in the array are sequentially arranged in a direction away from the substrate.
  • the nozzles arranged in the array are sequentially arranged on a plane parallel to the substrate.
  • the cleaning nozzle is arranged in a direction in which the water jet nozzle is away from the substrate.
  • the substrate cleaning machine further includes a cleaning pipe connected to a cleaning nozzle, and a check valve is provided on the cleaning pipe.
  • the cleaning pipe is integrally formed.
  • the cover plate cleaning unit includes a first cover plate cleaning unit and a second cover plate cleaning unit, the first cover plate cleaning unit is arranged in the water jet unit, and the The two cover plate cleaning unit is arranged in the brush unit.
  • the first cover cleaning unit and the second cover cleaning unit are arranged opposite to each other.
  • the first cover cleaning unit is arranged in a direction away from the substrate from the second cover cleaning unit.
  • the second cover cleaning unit is arranged in a direction away from the substrate from the first cover cleaning unit.
  • the cleaning solvent used by the first cover cleaning unit is pure water
  • the cleaning solvent used by the second cover cleaning unit is circulating water.
  • the present application provides a substrate cleaning machine, which includes a water washing unit, the water washing unit includes: a water jet unit, including a water jet nozzle and a water jet cover for cleaning the surface of the substrate, and a brush unit for removing the The particles on the substrate surface, the cover plate cleaning unit, are used to clean the surface of the waterjet cover plate with a cleaning solution; the cover plate cleaning unit is used to rinse off the dead water of the waterjet cover plate, so that when the waterjet unit cleans the substrate, There will be no dead water droplets on the waterjet cover plate falling on the substrate, which solves the technical problem of the existing substrate cleaning machine that the dead water droplets on the waterjet cover plate fall onto the substrate and cause the substrate to be unclean.
  • Figure 1 is a schematic cross-sectional view of a substrate cleaning machine in the prior art
  • Fig. 2 is a first cross-sectional schematic diagram of the substrate cleaning machine provided by this application;
  • Fig. 3 is a second cross-sectional schematic diagram of the substrate cleaning machine provided by this application.
  • FIG. 4 is a third cross-sectional schematic diagram of the substrate cleaning machine provided by this application.
  • FIG. 5 is a fourth cross-sectional schematic diagram of the substrate cleaning machine provided by this application.
  • the present application addresses the technical problem that the dead water on the waterjet cover plate of the existing substrate cleaning machine falls on the substrate and causes the substrate to be unclean; the embodiment of the present application can solve this defect.
  • the substrate cleaning machine provided by the present application includes a water washing unit, and the water washing unit includes:
  • the waterjet unit includes a waterjet nozzle 103 and a waterjet cover 102 for cleaning the surface of the substrate;
  • the brush unit 101 is used to remove particles on the surface of the substrate
  • the cover cleaning unit 104 (including 104a and 104b in FIG. 2) is used to clean the surface of the waterjet cover using a cleaning solution.
  • This embodiment provides a substrate cleaning machine, which includes a water washing unit, the water washing unit includes: a water jet unit, including a water jet nozzle and a water jet cover for cleaning the surface of the substrate, and a brush unit for removing the The particles on the substrate surface, the cover plate cleaning unit, is used to clean the surface of the waterjet cover plate with a cleaning solution; the cover plate cleaning unit is used to rinse off the dead water of the waterjet cover plate, so that when the waterjet unit cleans the substrate substrate , There will be no dead water droplets on the waterjet cover plate falling on the substrate, which solves the technical problem of the existing substrate cleaning machine that the dead water droplets on the waterjet cover plate fall onto the substrate and cause the substrate to be clean.
  • the cover cleaning unit 104 includes a cleaning nozzle 1041, which is used to spray a cleaning solution to clean the surface of the waterjet cover 102, and the nozzle is set at an angle The purpose of cleaning the surface of the water jet cover 102 is achieved.
  • the cleaning nozzle is a nozzle
  • the cross-sectional shape of the nozzle is circular.
  • a circular nozzle may be better when the flow rate is preset. Cleaning the waterjet cover can effectively alleviate the dead water dripping on the waterjet cover.
  • the cleaning nozzle is a nozzle
  • the cross-sectional shape of the nozzle is elliptical
  • the nozzle design can realize the entire surface cleaning of the waterjet cover
  • the elliptical design of the nozzle cross-sectional shape can realize
  • the volume of the cleaning solvent sprayed has the characteristic of increasing sequentially from both sides of the ellipse to the middle, which can achieve the purpose of focusing on cleaning a certain part of the cover plate.
  • the cleaning nozzle is a nozzle, and the cross-sectional shape of the nozzle is an irregular quadrilateral.
  • the cleaning nozzle is a nozzle
  • the cross-sectional shape of the nozzle is rectangular, trapezoidal or triangular
  • the cross-sectional shape of the nozzle is designed to be rectangular, trapezoidal or triangular, which is convenient for processing and does not require high molds.
  • the cleaning nozzles are arranged in an array
  • the nozzles arranged in the array may be arranged in a direction away from the substrate, and the arrangement of the nozzles in the array can effectively enhance the waterjet cover The surface cleaning effect of the plate.
  • this design can pass multiple nozzles Cleaning at the same time, effectively alleviating the impact of some nozzles not working, this design can effectively alleviate the situation that the waterjet cover is not clean.
  • the cleaning nozzles are arranged in an array, and the nozzles arranged in the array can be arranged in sequence on the plane parallel to the substrate, because some areas of the waterjet cover may be easier To deposit stagnant water, we use nozzles with multiple cover cleaning units arranged in parallel at the same height. This embodiment can focus on cleaning the area of a certain height of the waterjet cover that is easy to deposit stagnant water.
  • the cleaning nozzle is arranged in a direction away from the substrate by the waterjet nozzle 103, which can better clean the waterjet cover 102.
  • the cover plate cleaning unit 104 further includes a cleaning pipe 1042 connected to a cleaning nozzle 1041.
  • the cleaning pipe 1042 is provided with a check valve 1043, and the cleaning pipe is used for carrying cleaning Solution, the check valve is used to prevent the backflow of the cleaning solution and affect the purity of the cleaning solution.
  • the cover plate cleaning unit includes a first cover plate cleaning unit 104a and a second cover plate cleaning unit 104b, and the first cover plate cleaning unit 104a is set in the water In the knife unit, the second cover cleaning unit 104b is arranged in the brush unit 101.
  • the cover plate cleaning unit includes a first cover plate cleaning unit 104a and a second cover plate cleaning unit 104b, and the first cover plate cleaning unit 104a is set in the water In the knife unit, the second cover cleaning unit 104b is disposed in the brush unit 101, and the first cover cleaning unit 104a and the second cover cleaning unit 104b are disposed oppositely.
  • the first cover cleaning unit 104a is arranged in a direction away from the substrate by the second cover cleaning unit 104b, and the second cover cleaning unit 104b Below the first cover plate cleaning unit 104a, the first cover plate cleaning unit 104a is used to rinse the waterjet cover plate 102 twice.
  • the second cover cleaning unit 104b is arranged in a direction away from the substrate of the first cover cleaning unit 104a, and the first cover cleaning unit 104a Below the second cover plate cleaning unit 104b, the second cover plate cleaning unit 104b is used to rinse the waterjet cover plate 102 twice.
  • the cleaning solvent used by the first cover cleaning unit 104a is pure water
  • the cleaning solvent used by the second cover cleaning unit 104b is circulating water.
  • the first cover The plate cleaning unit 104a is arranged in a direction away from the substrate from the second cover plate cleaning unit 104b to ensure that the first cover plate is cleaned with pure water for secondary cleaning.
  • the cover plate cleaning unit is provided in the waterjet unit, and the cover plate cleaning unit includes only one spray head.
  • the cover plate cleaning unit provided in this embodiment Compared with the general multi-nozzle cover cleaning unit, the production cost is more economical.
  • the cover plate cleaning unit is arranged in the waterjet unit, the nozzle of the cover plate cleaning unit is a nozzle, and the design of the nozzle can realize the alignment of the waterjet cover plate.
  • the cover plate cleaning unit is arranged in the waterjet unit, which can effectively alleviate the stagnant water deposition phenomenon caused by the waterjet unit.
  • the cover plate cleaning unit needs to be arranged in the waterjet unit away from the cover The direction of the plate, so that the stagnant water deposited by the water jet nozzle can be better cleaned.
  • the cover plate cleaning unit is arranged in the waterjet unit, the cross-sectional shape of the nozzle of the cover plate cleaning unit is circular, and the cross-sectional shape of the nozzle is designed to be circular , It is easy to process and does not have high requirements on the mold.
  • the cross-sectional shape of the nozzle is round, the round nozzle can better clean the waterjet cover plate under the preset flow rate, which effectively relieves the waterjet cover The dead drops from the board.
  • the cover plate cleaning unit is arranged in the waterjet unit, the cross-sectional shape of the nozzle of the cover plate cleaning unit is an ellipse, and the cross-sectional shape of the nozzle has an elliptical design. It can be realized that when the nozzle sprays the cleaning solvent, the volume of the cleaning solvent sprayed has the characteristic of increasing from the two sides of the ellipse to the middle one by one, which can realize the purpose of focusing on cleaning a certain part of the cover plate.
  • the cover plate cleaning unit is arranged in the waterjet unit, the cross-sectional shape of the nozzle of the cover plate cleaning unit is rectangular, trapezoidal or triangular, and the cross-sectional shape of the nozzle is designed It is rectangular, trapezoidal or triangular, which is convenient for processing and does not require high molds.
  • the cover cleaning unit is arranged in the waterjet unit, and the cross-sectional shape of the nozzle of the cover cleaning unit is an irregular quadrilateral.
  • the cover plate cleaning unit is arranged in the brush unit 101, and the cover plate cleaning unit may be a separate spray head or may be arranged in an array.
  • the flow rate of the pipeline is reasonable, and the flow rate of each position of the pipeline needs to be consistent.
  • the first cover cleaning unit 104a, the second cover cleaning unit 104b and the waterjet nozzle The flow rate needs to be controlled at a preset value, so that the cleaning solvent is sprayed evenly without affecting the balance of the cleaning solvent in normal production.
  • the cleaning pipe is fixed by welding, etc., and the pipe joints are sealed and fixed firmly with tape.
  • the tape needs to be sealed with waterproof tape, so that no leakage occurs.
  • the cleaning pipe can be formed in one piece. The process avoids too many joints, and the joints cause water leakage due to sealing and excessive pressure, which effectively alleviates the leakage phenomenon, reduces subsequent maintenance and other work, saves manpower and material resources, and saves costs.
  • the present application provides a substrate cleaning machine, which includes a water washing unit, the water washing unit includes: a water jet unit, including a water jet nozzle and a water jet cover for cleaning the surface of the substrate, and a brush unit for removing the The particles on the substrate surface, the cover plate cleaning unit, are used to clean the surface of the waterjet cover plate with a cleaning solution; the cover plate cleaning unit is used to rinse off the dead water of the waterjet cover plate, so that when the waterjet unit cleans the substrate, There will be no dead water droplets on the waterjet cover plate falling on the substrate, which solves the technical problem of the existing substrate cleaning machine that the dead water droplets on the waterjet cover plate fall onto the substrate and cause the substrate to be unclean.

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  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

一种基板清洗机，其包括水洗单元，水洗单元包括盖板清洗单元（104），用于使用清洗溶液清洗水刀盖板（102）表面；这样，在水刀单元清洗基板时，水刀盖板（102）上不会存在死水滴落到基板上的情况，解决了现有基板清洗机存在水刀盖板（102）上的死水滴落到基板上导致基板清洁不净的技术问题。

Description

基板清洗机 技术领域
本申请涉及显示面板加工领域，尤其涉及一种基板清洗机。
 背景技术
氧化铟锡清洗等基板清洗机，用于对ITO镀膜前、镀膜后清洗，经测试机台检测合格后投入后制程。
如图1所示，基板清洗机的水刀盖板102容易受到水汽等影响，水刀盖板102容易残留死水，死水残留大量细菌，在基板传送过程中，水刀盖板上的死水滴落到基板S表面，无法清洗干净，导致基板清洁不净，影响品质。
即现有基板清洗机存在基板清洁不净的技术问题。
 技术问题
本申请提供一种基板清洗机，以解决现有基板清洗机存在水刀盖板上的死水滴落到基板上导致基板清洁不净的技术问题。
 技术解决方案
为解决上述问题，本申请提供的技术方案如下：
本申请实施例提供了一种基板清洗机，其包括水洗单元，所述水洗单元包括：
水刀单元，包括水刀喷头以及水刀盖板，用于清洗基板表面；
毛刷单元，用于去除所述基板表面的颗粒；
盖板清洗单元，用于使用清洗溶液清洗所述水刀盖板表面。
在本申请的基板清洗机中，所述盖板清洗单元包括清洗喷头,所述清洗喷头用于喷洒清洗溶液清洗所述水刀盖板表面。
在本申请的基板清洗机中，所述清洗喷头为喷嘴。
在本申请的基板清洗机中，所述喷嘴的截面形状为圆形。
在本申请的基板清洗机中，所述喷嘴的截面形状为椭圆形。
在本申请的基板清洗机中，所述喷嘴的截面形状为不规则四边形。
在本申请的基板清洗机中，所述喷嘴的截面形状为矩形。
在本申请的基板清洗机中，所述喷嘴的截面形状为梯形。
在本申请的基板清洗机中，所述喷嘴的截面形状为三角形。
在本申请的基板清洗机中，所述清洗喷头为阵列设置。
在本申请的基板清洗机中，所述阵列设置的喷嘴在远离所述基板的方向上依次设置。
在本申请的基板清洗机中，所述阵列设置的喷嘴在平行基板的平面上依次设置。
在本申请的基板清洗机中，所述清洗喷头设置在所述水刀喷头远离所述基板的方向上。
在本申请的基板清洗机中，所述基板清洗机还包括连接清洗喷头的清洗管道，所述清洗管道上设置有逆止阀。
在本申请的基板清洗机中，所述清洗管道一体成型。
在本申请的基板清洗机中，所述盖板清洗单元包括第一盖板清洗单元和第二盖板清洗单元，所述第一盖板清洗单元设置在所述水刀单元内，所述第二盖板清洗单元设置在毛刷单元内。
在本申请的基板清洗机中，所述第一盖板清洗单元和所述第二盖板清洗单元相对设置。
在本申请的基板清洗机中，所述第一盖板清洗单元设置在所述第二盖板清洗单元远离所述基板的方向上。
在本申请的基板清洗机中，所述第二盖板清洗单元设置在所述第一盖板清洗单元远离所述基板的方向上。
在本申请的基板清洗机中，所述第一盖板清洗单元所使用的清洗溶剂为纯水，所述第二盖板清洗单元所使用的清洗溶剂为循环水。
 有益效果
本申请通过提供一种基板清洗机，其包括水洗单元，所述水洗单元包括：水刀单元，包括水刀喷头以及水刀盖板，用于清洗基板表面，毛刷单元，用于去除所述基板表面的颗粒，盖板清洗单元，用于使用清洗溶液清洗所述水刀盖板表面；盖板清洗单元用于将水刀盖板的死水冲洗掉，这样，在水刀单元清洗基板时，水刀盖板上不会存在死水滴落到基板上的情况，解决了现有基板清洗机存在水刀盖板上的死水滴落到基板上导致基板清洁不净的技术问题。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为现有技术中基板清洗机的截面示意图；
图2为本申请提供的基板清洗机的第一种截面示意图；
图3为本申请提供的基板清洗机的第二种截面示意图；
图4为本申请提供的基板清洗机的第三种截面示意图；
图5为本申请提供的基板清洗机的第四种截面示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
本申请针对现有基板清洗机存在水刀盖板上的死水滴落到基板上导致基板清洁不净的技术问题；本申请实施例能够解决该缺陷。
在一种实施例中，如图5所示，本申请提供的基板清洗机包括水洗单元，所述水洗单元包括：
水刀单元，包括水刀喷头103以及水刀盖板102，用于清洗基板表面；
毛刷单元101，用于去除所述基板表面的颗粒；
盖板清洗单元104（包括图2中的104a和104b），用于使用清洗溶液清洗所述水刀盖板表面。
本实施例提供一种基板清洗机，其包括水洗单元，所述水洗单元包括：水刀单元，包括水刀喷头以及水刀盖板，用于清洗基板表面，毛刷单元，用于去除所述基板表面的颗粒，盖板清洗单元，用于使用清洗溶液清洗所述水刀盖板表面；盖板清洗单元用于将水刀盖板的死水冲洗掉，这样，在水刀单元清洗基板基板时，水刀盖板上不会存在死水滴落到基板上的情况，解决了现有基板清洗机存在水刀盖板上的死水滴落到基板上导致基板清洁不净的技术问题。
在一种实施例中，如图2所示，所述盖板清洗单元104包括清洗喷头1041,所述清洗喷头用于喷洒清洗溶液清洗所述水刀盖板102表面，喷头的设置的角度以达到能清洗水刀盖板102表面为目的。
在一种实施例中，所述清洗喷头为喷嘴，所述喷嘴的截面形状为圆形，所述喷嘴的截面形状为圆形的时候，在预设流量的情况下，圆形喷嘴可以更好清洗水刀盖板，有效的缓解了水刀盖板的死水滴落。
在一种实施例中，所述清洗喷头为喷嘴，所述喷嘴的截面形状为椭圆形，喷嘴的设计可以实现对水刀盖板的整面清洗，喷嘴的截面形状的椭圆形设计，可以实现喷嘴在喷所述清洗溶剂时，喷出的清洗溶剂的体积具有从椭圆两边依次往中间增加的特性，可以实现对某一部分盖板着重清洗的目的。
在一种实施例中，所述清洗喷头为喷嘴，所述喷嘴的截面形状为不规则四边形。
在一种实施例中，所述清洗喷头为喷嘴，所述喷嘴的截面形状为矩形、梯形或三角形，喷嘴的截面形状设计为矩形、梯形或三角形，方便加工，对模具的要求不高。
在一种实施例中，如图3所示，所述清洗喷头为阵列设置，所述阵列设置的喷嘴可以在远离所述基板的方向上依次设置，喷嘴的阵列设置可以有效增强对水刀盖板的表面清洗效果，当所述阵列设置的喷嘴远离所述基板的方向上依次设置时，如果盖板清洗单元的部分喷嘴没有工作或者清洁不干净的情况下，这种设计可以通过多个喷嘴的同时清洗，有效的缓解了部分喷嘴不工作的所带来的影响，这种设计可以有效的缓解水刀盖板清洗不干净的情况。
在一种实施例中，如图3所示，所述清洗喷头为阵列设置，所述阵列设置的喷嘴可以在平行基板的平面上依次设置，由于水刀盖板的某些区域可能会更容易沉积死水，我们采用在同一高度平行设置多个盖板清洗单元的喷嘴，本实施例可以对水刀盖板的某一高度的部分容易沉积死水的区域进行着重清洗
在一种实施例中，如图2所示，所述清洗喷头设置在所述水刀喷头103远离所述基板的方向上，能更好地清洗所述水刀盖板102。
在一种实施例中，如图2所示，盖板清洗单元104还包括连接清洗喷头1041的清洗管道1042，所述清洗管道1042上设置有逆止阀1043，所述清洗管道用于承载清洗溶液，所述逆止阀用于防止清洗溶液的回流，影响清洁溶液的纯净。
在一种实施例中，如图2所示，所述盖板清洗单元包括第一盖板清洗单元104a和第二盖板清洗单元104b，所述第一盖板清洗单元104a设置在所述水刀单元内，所述第二盖板清洗单元104b设置在毛刷单元101内。
在一种实施例中，如图2所示，所述盖板清洗单元包括第一盖板清洗单元104a和第二盖板清洗单元104b，所述第一盖板清洗单元104a设置在所述水刀单元内，所述第二盖板清洗单元104b设置在毛刷单元101内，所述第一盖板清洗单元104a和所述第二盖板清洗单元104b相对设置。
在一种实施例中，如图4所示，所述第一盖板清洗单元104a设置在所述第二盖板清洗单元104b远离所述基板的方向上，所述第二盖板清洗单元104b在所述第一盖板清洗单元104a下方，所述第一盖板清洗单元104a用于二次冲洗所述水刀盖板102。
在一种实施例中，如图4所示，所述第二盖板清洗单元104b设置在所述第一盖板清洗单元104a远离所述基板的方向上，所述第一盖板清洗单元104a在所述第二盖板清洗单元104b下方，所述第二盖板清洗单元104b用于二次冲洗所述水刀盖板102。
在一种实施例中，所述第一盖板清洗单元104a所使用的清洗溶剂为纯水，所述第二盖板清洗单元104b所使用的清洗溶剂为循环水，此时所述第一盖板清洗单元104a设置在所述第二盖板清洗单元104b远离所述基板的方向上，保证第一盖板清洗用纯水进行二次清洗。
在一种实施例中，如图5所示，所述盖板清洗单元设置在所述水刀单元内，所述盖板清洗单元仅包括一个喷头，本实施例所提供的盖板清洗单元，在生产的成本上较一般的多喷嘴盖板清洗单元更加节省。
在一种实施例中，如图5所示，所述盖板清洗单元设置在所述水刀单元内，所述盖板清洗单元的喷头是喷嘴，喷嘴的设计可以实现对水刀盖板的整面清洗，盖板清洗单元设置在所述水刀单元内，可以有效的缓解水刀单元造成的死水沉积现象，所述盖板清洗单元需要设置在所述水刀单元的水刀喷头远离盖板的方向，这样可以更好地清洗因水刀喷头工作所沉积的死水。
在一种实施例中，如图5所示，所述盖板清洗单元设置在所述水刀单元内，所述盖板清洗单元喷嘴的截面形状为圆形，喷嘴的截面形状设计为圆形，方便加工，对模具的要求不高，所述喷嘴的截面形状为圆形的时候，在预设流量的情况下，圆形喷嘴可以更好清洗水刀盖板，有效的缓解了水刀盖板的死水滴落。
在一种实施例中，如图5所示，所述盖板清洗单元设置在所述水刀单元内，所述盖板清洗单元喷嘴的截面形状为椭圆形，喷嘴的截面形状的椭圆形设计，可以实现喷嘴在喷所述清洗溶剂时，喷出的清洗溶剂的体积具有从椭圆两边依次往中间增加的特性，可以实现对某一部分盖板着重清洗的目的。
在一种实施例中，如图5所示，所述盖板清洗单元设置在所述水刀单元内，所述盖板清洗单元喷嘴的截面形状为矩形、梯形或三角形，喷嘴的截面形状设计为矩形、梯形或三角形，方便加工，对模具的要求不高。
在一种实施例中，如图5所示，所述盖板清洗单元设置在所述水刀单元内，所述盖板清洗单元喷嘴的截面形状为不规则四边形。
在一种实施例中，如图5所示，所述盖板清洗单元设置在所述毛刷单元101内，所述盖板清洗单元可以为一个单独设置的喷头，也可以呈阵列设置。
在一种实施例中，管道流量设计合理，管道的各个位置的流量需要保持一致，在喷清洗溶剂的时候，第一盖板清洗单元104a和第二盖板清洗单元104b以及所述水刀喷头流量需要控制在一个预设值，这样在不影响正常生产清洗溶剂的平衡的前提下，清洗溶剂均匀喷出。
在一种实施例中，使用焊接等方式固定所述清洗管道，管道连接处利用胶带封装固定牢固，胶带需要选用防水的密封胶带，这样不会产生泄露的现象，同时清洗管道多可以采用一体成型的工艺，避免太多的连接处，在连接处因密封、压强过大等原因，导致漏水，有效的缓解了泄露的现象，减少后续的检修等工作，节约了人力物力，节省成本。
根据上述实施例可知：
本申请通过提供一种基板清洗机，其包括水洗单元，所述水洗单元包括：水刀单元，包括水刀喷头以及水刀盖板，用于清洗基板表面，毛刷单元，用于去除所述基板表面的颗粒，盖板清洗单元，用于使用清洗溶液清洗所述水刀盖板表面；盖板清洗单元用于将水刀盖板的死水冲洗掉，这样，在水刀单元清洗基板时，水刀盖板上不会存在死水滴落到基板上的情况，解决了现有基板清洗机存在水刀盖板上的死水滴落到基板上导致基板清洁不净的技术问题。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种基板清洗机，其包括水洗单元，所述水洗单元包括：
    水刀单元，包括水刀喷头以及水刀盖板，用于清洗基板表面；
    毛刷单元，用于去除所述基板表面的颗粒；
    盖板清洗单元，用于使用清洗溶液清洗所述水刀盖板表面。
  2. 根据权利要求1所述的基板清洗机，其中，所述盖板清洗单元包括清洗喷头,所述清洗喷头用于喷洒清洗溶液清洗所述水刀盖板表面。
  3. 根据权利要求2所述的基板清洗机，其中，所述清洗喷头为喷嘴。
  4. 根据权利要求3所述的基板清洗机，其中，所述喷嘴的截面形状为圆形。
  5. 根据权利要求3所述的基板清洗机，其中，所述喷嘴的截面形状为椭圆形。
  6. 根据权利要求3所述的基板清洗机，其中，所述喷嘴的截面形状为不规则四边形。
  7. 根据权利要求3所述的基板清洗机，其中，所述喷嘴的截面形状为矩形。
  8. 根据权利要求3所述的基板清洗机，其中，所述喷嘴的截面形状为梯形。
  9. 根据权利要求3所述的基板清洗机，其中，所述喷嘴的截面形状为三角形。
  10. 根据权利要求2所述的基板清洗机，其中，所述清洗喷头为阵列设置。
  11. 根据权利要求10所述的基板清洗机，其中，所述阵列设置的喷嘴在远离所述基板的方向上依次设置。
  12. 根据权利要求10所述的基板清洗机，其中，所述阵列设置的喷嘴在平行基板的平面上依次设置。
  13. 根据权利要求2所述的基板清洗机，其中，所述清洗喷头设置在所述水刀喷头远离所述基板的方向上。
  14. 根据权利要求2所述的基板清洗机，其中，所述基板清洗机还包括连接清洗喷头的清洗管道，所述清洗管道上设置有逆止阀。
  15. 根据权利要求14所述的基板清洗机，其中，所述清洗管道一体成型。
  16. 根据权利要求1所述的基板清洗机，其中，所述盖板清洗单元包括第一盖板清洗单元和第二盖板清洗单元，所述第一盖板清洗单元设置在所述水刀单元内，所述第二盖板清洗单元设置在毛刷单元内。
  17. 根据权利要求16所述的基板清洗机，其中，所述第一盖板清洗单元和所述第二盖板清洗单元相对设置。
  18. 根据权利要求16所述的基板清洗机，其中，所述第一盖板清洗单元设置在所述第二盖板清洗单元远离所述基板的方向上。
  19. 根据权利要求16所述的基板清洗机，其中，所述第二盖板清洗单元设置在所述第一盖板清洗单元远离所述基板的方向上。
  20. 根据权利要求16所述的基板清洗机，其中，所述第一盖板清洗单元所使用的清洗溶剂为纯水，所述第二盖板清洗单元所使用的清洗溶剂为循环水。
PCT/CN2019/109863 2019-02-20 2019-10-08 基板清洗机 WO2020168724A1 (zh)

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