WO2020147194A1 - Appareil de découpe au laser - Google Patents

Appareil de découpe au laser Download PDF

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Publication number
WO2020147194A1
WO2020147194A1 PCT/CN2019/079439 CN2019079439W WO2020147194A1 WO 2020147194 A1 WO2020147194 A1 WO 2020147194A1 CN 2019079439 W CN2019079439 W CN 2019079439W WO 2020147194 A1 WO2020147194 A1 WO 2020147194A1
Authority
WO
WIPO (PCT)
Prior art keywords
detector
laser cutting
laser
liquid crystal
crystal panel
Prior art date
Application number
PCT/CN2019/079439
Other languages
English (en)
Chinese (zh)
Inventor
张天义
Original Assignee
深圳市华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Publication of WO2020147194A1 publication Critical patent/WO2020147194A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting

Definitions

  • the invention relates to a laser cutting device, in particular to a laser cutting device for cutting a line terminal short-circuit ring of a liquid crystal panel.
  • the size of the panel is getting bigger and bigger, the quality requirement and cost are getting higher, and the number of detectors is increasing.
  • the more wiring in the inspection area the chance of wiring frictional damage will increase, which will affect the use and maintenance of the equipment. .
  • the present invention provides a laser cutting device to solve the problems existing in the prior art.
  • the main purpose of the present invention is to provide a laser cutting device, which can improve the flexibility of detectors and reduce the number of detectors, thereby reducing the chance of wiring friction damage, and achieving strict quality supervision in the process of producing liquid crystal panels. To ensure the quality of the LCD panel.
  • the present invention provides a laser cutting device, which is used for cutting a wire terminal short-circuit ring of a liquid crystal panel.
  • the laser cutting device includes a base, a laser emission source for providing laser light, a drive motor, a laser cutting head for applying laser light to the display device, a positioning module arranged on the outside of the laser cutting head, a first detector, and a second detector. Detector.
  • the laser emitting source, the driving motor, the laser cutting head, the positioning module and the first detector are arranged in the base.
  • the first detector and the second detector are disposed opposite to each other on the rotation shaft of the driving motor, and the first detector and the second detector rotate 360 degrees around the rotation shaft of the driving motor.
  • the display device is a liquid crystal panel and the laser cutting head is used to cut the wire terminal short-circuit ring of the liquid crystal panel.
  • the display device is a liquid crystal panel and the first detector detects damage at the edge of the liquid crystal panel.
  • the second detector detects the disconnection of the wire terminal short-circuit ring of the liquid crystal panel.
  • the first detector and the second detector include image sensors.
  • the image sensor is a charge coupled device.
  • the first detector and the second detector move with the laser cutting head.
  • the first detector and the second detector are located behind the laser cutting head.
  • the present invention provides a laser cutting device, which is used for cutting a wire terminal short-circuit ring of a liquid crystal panel.
  • the laser cutting device includes a base, a laser emission source for providing laser light, a drive motor, a laser cutting head for applying laser light to the display device, a positioning module arranged on the outside of the laser cutting head, a first detector, and a second detector. Detector.
  • the laser emitting source, the driving motor, the laser cutting head, the positioning module and the first detector are arranged in the base.
  • the first detector and the second detector are arranged opposite to each other on the rotating shaft of the driving motor.
  • the first detector and the second detector rotate 360 degrees around the rotating shaft of the driving motor.
  • the display device is a liquid crystal panel and is used for a laser cutting head. For cutting the wire terminal short-circuit ring of the liquid crystal panel, and the first detector detects the damage at the edge of the liquid crystal panel.
  • the second detector detects the disconnection of the wire terminal short-circuit ring of the liquid crystal panel.
  • the first detector and the second detector include image sensors.
  • the image sensor is a charge coupled device.
  • the first detector and the second detector move with the laser cutting head.
  • the first detector and the second detector are located behind the laser cutting head.
  • the laser cutting device of the present invention improves the flexibility of the detector and reduces the number of installations of the detector. This not only improves the rubbing and damage of the wiring, but also prevents the generation of defective liquid crystal panels, thereby strictly Monitor the quality.
  • Fig. 1 is a schematic diagram of a laser cutting device according to an embodiment of the present invention.
  • an embodiment of the present invention provides a laser cutting device 10.
  • the laser cutting device 10 is used for repairing defects on a display device, such as detecting and cutting the wire terminal short-circuit ring of a liquid crystal panel.
  • the liquid crystal panel may be a liquid crystal panel of a thin film transistor liquid crystal display.
  • the laser cutting device 10 includes a base 20, a laser emitting source 30, a driving motor 40, a laser cutting head 50, a positioning module 60, a first detector 70 and a second detector 80.
  • the laser emitting source 30, the driving motor 40, the laser cutting head 50, the positioning module 60, the first detector 70 and the second detector 80 are arranged in the machine base 20.
  • the laser emitting source 30 provides laser energy, so that the laser cutting head 50 emits pulsed laser light.
  • the driving motor 40 provides driving power to the laser cutting head 50, the positioning module 60, the first detector 70 and the second detector 80 of the laser cutting device 10.
  • the positioning module 60 is arranged on the outside of the laser cutting head 50 and is used to position the position to be cut of the liquid crystal panel.
  • the first detector 70 and the second detector 80 are arranged opposite to each other on the rotating shaft of the driving motor, and the first detector 70 and the second detector 80 are driven by the driving motor 30 to rotate 360 degrees around the rotating shaft of the driving motor .
  • the first detector 70 detects the damage at the edge of the liquid crystal panel
  • the second detector 80 detects the disconnection of the wire terminal short-circuit ring of the liquid crystal panel.
  • the first detector 70 and the second detector 80 include image sensors, where the image sensors are charge-coupled devices.
  • the image sensor may include, but is not limited to, a displacement sensor or an infrared sensor.
  • the first detector 70 and the second detector 80 rotate 360 degrees around the rotation axis of the driving motor to perform defect detection on the liquid crystal panel.
  • the detection of defects at the edge of the LCD panel includes protrusions, depressions, corrosion parts, short-circuit parts, whether there are burrs or jaggedness, etc.
  • the first detector 70 and the second detector 80 can move with the laser cutting head 50, and the first detector 70 and the second detector 80 are located in the laser Behind the cutting head 50, the first detector 70 and the second detector 80 rotate 360 degrees around the rotation axis of the drive motor to detect the wire terminal short-circuit ring of the liquid crystal panel and the defects of all edges to ensure that there are defects The LCD panel is not left out.
  • the image sensors of the first detector 70 and the second detector 80 will transmit the information to the processor connected to the image sensor, and the processor will Judge the defective part of the liquid crystal panel.
  • the positioning module 60 When the processor judges that the liquid crystal panel is unqualified, the positioning module 60 will mark the defective part of the liquid crystal panel. At this time, the laser cutting head 50 immediately cuts the defective part of the liquid crystal panel.
  • the defective part of the liquid crystal panel may be a liquid crystal panel.
  • the wire terminals short-circuit the ring or the edge of the LCD panel.
  • the laser cutting device 10 provided by the present invention has a first detector 70 and a second detector 80 disposed on the rotating shaft of the driving motor opposite to each other, and the first detector 70 and the second detector 80 can rotate 360 degrees To perform defect detection on the LCD panel, it can solve the problem of wiring friction damage caused by the excessive number of detectors in the past, so it can reduce equipment damage.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Liquid Crystal (AREA)
  • Robotics (AREA)

Abstract

L'invention concerne un appareil de découpe au laser (10), comprenant une source de transmission de laser (30), un moteur d'entraînement (40), une tête de découpe au laser (50), un module de positionnement (60), un premier détecteur (70) et un deuxième détecteur (80). La tête de découpe au laser est utilisée pour appliquer un faisceau laser à un dispositif d'affichage. Le module de positionnement est disposé sur l'extérieur de la tête de découpe au laser et est utilisé pour positionner le dispositif d'affichage. La source de transmission de laser, le moteur d'entraînement, la tête de découpe au laser, le module de positionnement, le premier détecteur et le deuxième détecteur sont disposés à l'intérieur d'une base ; de plus, le premier détecteur et le deuxième détecteur sont disposés face à face sur un arbre rotatif du moteur d'entraînement ; et le premier détecteur et le deuxième détecteur effectuent des rotations à 360 degrés autour de l'arbre rotatif du moteur d'entraînement. L'appareil de coupe, avec le premier détecteur et le deuxième détecteur, effectuant des rotations à 360 degrés autour de l'arbre rotatif du moteur d'entraînement, réalise la détection de dommages aux bords d'un panneau à cristaux liquides et la détection d'une déconnexion dans une barre de court-circuit de borne de ligne d'un panneau à cristaux liquides, ce qui réduit la densité de câblage pour une zone de détection et le nombre de détecteurs.
PCT/CN2019/079439 2019-01-16 2019-03-25 Appareil de découpe au laser WO2020147194A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910039459.5A CN109604840A (zh) 2019-01-16 2019-01-16 激光切割装置
CN201910039459.5 2019-01-16

Publications (1)

Publication Number Publication Date
WO2020147194A1 true WO2020147194A1 (fr) 2020-07-23

Family

ID=66017615

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/079439 WO2020147194A1 (fr) 2019-01-16 2019-03-25 Appareil de découpe au laser

Country Status (2)

Country Link
CN (1) CN109604840A (fr)
WO (1) WO2020147194A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110927998A (zh) * 2019-11-26 2020-03-27 深圳市华星光电半导体显示技术有限公司 一种切割检测装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005099980A1 (fr) * 2004-04-14 2005-10-27 Top Engineering Co., Ltd Procede de decoupe de materiaux non metalliques
CN1895831A (zh) * 2005-11-09 2007-01-17 中国科学院长春光学精密机械与物理研究所 一种对液晶屏短路环的激光切割设备
WO2007049668A1 (fr) * 2005-10-28 2007-05-03 Mitsuboshi Diamond Industrial Co., Ltd. Procede de formation d’une ligne de decoupe sur un substrat en materiau fragile et dispositif de formation de ligne de decoupe
CN103353681A (zh) * 2013-06-20 2013-10-16 深圳市华星光电技术有限公司 一种液晶面板的切割装置及切割方法
CN104607802A (zh) * 2014-12-10 2015-05-13 深圳市华星光电技术有限公司 激光切割装置
CN204975721U (zh) * 2015-08-18 2016-01-20 大族激光科技产业集团股份有限公司 激光切割装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59150688A (ja) * 1983-02-10 1984-08-28 Toshiba Corp 加工高さ制御装置
JPS59192908A (ja) * 1983-04-15 1984-11-01 Akuson Data Mach Kk 切断ヘツドの高さ検出方法
JPS6137392A (ja) * 1984-07-30 1986-02-22 Mitsubishi Electric Corp レ−ザ加工機
JP2002331383A (ja) * 2001-05-08 2002-11-19 Koike Sanso Kogyo Co Ltd 切断監視装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005099980A1 (fr) * 2004-04-14 2005-10-27 Top Engineering Co., Ltd Procede de decoupe de materiaux non metalliques
WO2007049668A1 (fr) * 2005-10-28 2007-05-03 Mitsuboshi Diamond Industrial Co., Ltd. Procede de formation d’une ligne de decoupe sur un substrat en materiau fragile et dispositif de formation de ligne de decoupe
CN1895831A (zh) * 2005-11-09 2007-01-17 中国科学院长春光学精密机械与物理研究所 一种对液晶屏短路环的激光切割设备
CN103353681A (zh) * 2013-06-20 2013-10-16 深圳市华星光电技术有限公司 一种液晶面板的切割装置及切割方法
CN104607802A (zh) * 2014-12-10 2015-05-13 深圳市华星光电技术有限公司 激光切割装置
CN204975721U (zh) * 2015-08-18 2016-01-20 大族激光科技产业集团股份有限公司 激光切割装置

Also Published As

Publication number Publication date
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