WO2020135524A1 - 高频辐射体、多频阵列天线和基站 - Google Patents

高频辐射体、多频阵列天线和基站 Download PDF

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Publication number
WO2020135524A1
WO2020135524A1 PCT/CN2019/128374 CN2019128374W WO2020135524A1 WO 2020135524 A1 WO2020135524 A1 WO 2020135524A1 CN 2019128374 W CN2019128374 W CN 2019128374W WO 2020135524 A1 WO2020135524 A1 WO 2020135524A1
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Prior art keywords
frequency
branch
radiator
balun
frequency radiator
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PCT/CN2019/128374
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English (en)
French (fr)
Inventor
章秀银
廖志强
薛成戴
张跃江
徐一骊
陈志涵
Original Assignee
华为技术有限公司
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP19905821.5A priority Critical patent/EP3886257B1/en
Publication of WO2020135524A1 publication Critical patent/WO2020135524A1/zh
Priority to US17/360,107 priority patent/US11837792B2/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
    • H01Q1/523—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas between antennas of an array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/24—Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/246—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for base stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/10—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0006—Particular feeding systems
    • H01Q21/0075—Stripline fed arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/065—Patch antenna array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/24—Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
    • H01Q21/26—Turnstile or like antennas comprising arrangements of three or more elongated elements disposed radially and symmetrically in a horizontal plane about a common centre
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/30—Combinations of separate antenna units operating in different wavebands and connected to a common feeder system
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/40—Imbricated or interleaved structures; Combined or electromagnetically coupled arrangements, e.g. comprising two or more non-connected fed radiating elements
    • H01Q5/48—Combinations of two or more dipole type antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises

Definitions

  • the present application relates to antenna technology, in particular to a high-frequency radiator, multi-frequency array antenna and base station.
  • base station antennas need to be multi-frequency and multi-polarized to meet the common needs of multiple operators.
  • the width of the antenna must be very large to meet the requirements of the index. Once the width is reduced, the electromagnetic wave will cause common mode resonance in the high-frequency radiator when it is coupled from the low-frequency radiator to the high-frequency radiator. , Leading to a significant deterioration of low frequency indicators.
  • the method of suppressing the common mode resonance of the high-frequency radiator in the multi-frequency antenna in the low-frequency working frequency band is to load a capacitor-inductor-capacitor circuit on the balun of the high-frequency radiator and the vibrator arm of the high-frequency radiator to achieve the high-frequency band Match and move the common-mode resonance of the high-frequency radiator outside the low-frequency band in the low-frequency band.
  • the present application provides a high-frequency radiator, a multi-frequency array antenna and a base station to solve the problem of common-mode resonance of the high-frequency radiator without affecting the bandwidth of the antenna, and the processing cost is low.
  • the present application provides a high-frequency radiator, which is a dual-polarized radiator, and the dual-polarized radiator includes two single-polarized radiators at plus and minus 45 degrees;
  • the single-polarized radiator includes: a radiation arm, a balun, a feeder circuit, a filter, and a ground layer; wherein, the radiation arm and the balun are electrically connected; the feeder circuit and the balun are respectively provided on the vertically placed first dielectric plate Two surfaces; the ground layer is arranged on the downward surface of the horizontally placed second dielectric plate; the first dielectric plate is vertically arranged on the second dielectric plate; the filter includes a capacitor branch and an inductor branch, and the inductor branch It is arranged on the same side of the first dielectric board as the balun, and the inductance branch is electrically connected to the balun and the formation respectively, and the capacitive branch is coupled to the formation;
  • the feeding circuit is used to feed the high-frequency radiator
  • the filter is used to reduce the influence of the high-frequency radiator on the low-frequency radiator.
  • the highest frequency of the low-frequency radiator's working frequency band is smaller than the lowest frequency of the high-frequency radiator's working frequency band.
  • a filter is added between the balun and the stratum to reduce the impact of the high-frequency radiator on the low-frequency radiator, while achieving high-frequency radiation
  • the normal transmission of the body signal not only solves the problem of high-frequency radiator common mode resonance, but also does not affect the bandwidth of the antenna, and the processing cost is low.
  • the capacitor branch is disposed on the upward surface of the second dielectric plate, and the capacitor branch is electrically connected to the balun.
  • the capacitive branch is disposed on the same side of the first dielectric plate as the balun, and the capacitive branch is electrically connected to the balun.
  • the capacitor branch includes a first capacitor branch and a second capacitor branch, the first capacitor branch is disposed on an upward surface of the second dielectric plate, and the second capacitor branch is disposed on the second On the same side of the dielectric board as the balun, the second capacitor branch is electrically connected to the balun, and the first capacitor branch is electrically connected to the second capacitor branch.
  • the capacitor branch includes a first capacitor branch and a second capacitor branch, the first capacitor branch is disposed on an upward surface of the second dielectric plate, and the second capacitor branch is disposed on the second On the same side of the dielectric board as the balun, the inductance branch is electrically connected to the second capacitor branch, and the first capacitor branch is electrically connected to the second capacitor branch.
  • the inductance branch is used as a ground layer, and a microstrip line structure is formed by the feeder circuit and the inductance branch; a coaxial line is provided on the downward surface of the second dielectric plate.
  • the outer conductor of is connected to the ground layer, and the inner conductor of the coaxial line is electrically connected to the feed circuit.
  • This application uses a microstrip line structure, the high-frequency current signal transmitted from the coaxial line flows through the inner conductor to the feeder circuit and the balun without loss, and the outer conductor and the ground layer are directly electrically connected by welding, so that the entire high-frequency radiator The feed system is very complete, and the standing wave bandwidth is larger, there will be no signal discontinuities.
  • both the inductor branch and the capacitor branch are metal branch lines, and the metal branch line used as the inductor branch forms a narrower and longer profile than the metal branch line used as the capacitor branch .
  • the present application provides a multi-frequency array antenna, including: an antenna radiator and an antenna reflector, the antenna radiator is disposed on the antenna reflector; wherein, the antenna radiator includes at least one high frequency radiator and at least one low frequency
  • the antenna radiator, the high-frequency radiator and the low-frequency radiator are arranged horizontally, and the highest frequency of the low-frequency radiator's working frequency band is less than the lowest frequency of the high-frequency radiator's working frequency band; A high-frequency radiator.
  • the multi-frequency array antenna of the present application adds a filter between the balun and the ground layer to reduce the influence of the high-frequency radiator on the low-frequency radiator without affecting the structure of the radiation arm and the balun of the high-frequency radiator.
  • the normal transmission of the signal of the high-frequency radiator is realized, which not only solves the problem of common-mode resonance of the high-frequency radiator, but also does not affect the bandwidth of the antenna, and the processing cost is low.
  • the distance between the high-frequency radiator and the low-frequency radiator is less than or equal to 0.4 ⁇ , and ⁇ is the wavelength corresponding to the center frequency of the operating frequency band of the low-frequency radiator.
  • the present application provides a base station, the base station includes a multi-frequency array antenna, and the multi-frequency array antenna uses the antenna of any one of the above-mentioned second aspects.
  • the antenna used in the base station of this application does not affect the structure of the radiating arm and balun of the high-frequency radiator, and a filter is added between the balun and the formation to reduce the impact of the high-frequency radiator on the low-frequency radiator At the same time, the normal transmission of the signal of the high-frequency radiator is realized, which not only solves the problem of common-mode resonance of the high-frequency radiator, but also does not affect the bandwidth of the antenna, and the processing cost is low.
  • FIG. 1 is a schematic structural plan view of a first embodiment of a high-frequency radiator of this application
  • FIG. 2 is a schematic diagram of a side view of the first embodiment of the high-frequency radiator of the present application
  • FIG. 3 is a schematic diagram of a bottom view of the first embodiment of the high-frequency radiator of the present application.
  • Embodiment 4 is a logic schematic diagram of Embodiment 1 of a high-frequency radiator of this application;
  • FIG. 5 is a schematic diagram of a side view of a second embodiment of a high-frequency radiator of this application.
  • FIG. 6 is a schematic diagram of a side view of a third embodiment of a high-frequency radiator of the present application.
  • Embodiment 7 is a logic schematic diagram of Embodiment 3 of a high-frequency radiator of this application.
  • FIG. 8 is a schematic diagram of a side view of the fourth embodiment of the high-frequency radiator of the present application.
  • Embodiment 9 is a logic schematic diagram of Embodiment 4 of a high-frequency radiator of the present application.
  • FIG. 10 is a schematic diagram of a side view of the fifth embodiment of the high-frequency radiator of the present application.
  • FIG. 11 is a schematic diagram of the microstrip line structure of the fifth embodiment of the high-frequency radiator of the present application.
  • FIG. 12 is a schematic structural diagram of an embodiment of a multi-frequency array antenna of the present application.
  • FIG. 1 is a schematic view of the top structure of the first embodiment of the high-frequency radiator of the present application.
  • the high-frequency radiator of this embodiment is a dual-polarized radiator, and the dual-polarized radiator includes a single unit of positive 45 degrees Polarized radiator 10 and single-polarized radiator 20 at minus 45 degrees.
  • Single-polarized radiator 10 and single-polarized radiator 20 are in a cross shape. The structure of these two single-polarized radiators is the same.
  • the polarizing radiator 10 will be described as an example.
  • FIG. 2 is a schematic diagram of a side view of the first embodiment of the high-frequency radiator of the present application.
  • the single-polarized radiator 10 includes: a radiation arm 11, a balun 12, a feeding circuit 13, a filter, and a ground layer 15 , Where the radiating arm 11 and the balun 12 are electrically connected, the feeder circuit 13 (indicated by a dotted line) and the balun 12 are respectively disposed on both surfaces of the first dielectric plate 16 placed vertically, and the ground layer 15 is disposed on a horizontally placed
  • the first dielectric plate 16 is vertically arranged on the second dielectric plate 17
  • the filter includes a capacitor branch 141 and an inductor branch 142, and the inductor branch 142 is disposed on the first dielectric
  • the inductance branch 142 is electrically connected to the balun 12 and the ground layer 15, respectively, the capacitive branch 141 is disposed on the upward surface of the second
  • the feeding circuit 13 is used to feed high-frequency radiators.
  • the filter is used to reduce the influence of the high-frequency radiator on the low-frequency radiator.
  • the highest frequency of the low-frequency radiator's working frequency band is smaller than the lowest frequency of the high-frequency radiator's working frequency band.
  • the dielectric board of the present application may be a printed circuit board (Printed Circuit Board, abbreviated as: PCB), or a dielectric board plated by a new process plastic, which is not limited.
  • FIG. 3 is a schematic diagram of a bottom view of the first embodiment of the high-frequency radiator of the present application.
  • the capacitor branch 141 (shown by a dotted line) and the ground layer 15 are respectively disposed on both surfaces of the second dielectric plate 17, and the ground layer 15 is on the downward surface of the second dielectric plate 17, and the capacitance branch 141 is on the upward surface of the second dielectric plate 17.
  • the position of the balun 12 corresponding to the capacitor branch 141 is welded to the second dielectric plate 17, and the welding point of the two is within the coverage of the capacitor branch 141.
  • FIG. 4 is a logic schematic diagram of the first embodiment of the high-frequency radiator of the present application.
  • a filter is added between the balun and the formation of the high-frequency radiator, and the filter can reduce the pair of high-frequency radiators.
  • the filter can adopt a parallel or hybrid structure, in which one branch includes a capacitor that plays a major role, and the other branch includes an inductor that plays a major role.
  • Such a filter structure can be used in low-frequency radiators.
  • a thin and long metal branch line is equivalent to an inductance (ie, inductance branch), and a wide and short metal branch line is equivalent to a capacitance (ie, capacitance branch).
  • the inductance branch is directly electrically connected to the balun. It can be considered that the inductance branch is integrated on the high-frequency radiator (single-polarized radiator).
  • the capacitance branch is a metal branch line provided on the upward surface of the second dielectric plate, which is close to the ground and has a coupling area, so that there is a capacitance effect between the two to realize the coupling connection, and the signal is when the capacitance value is appropriate It can be transferred between the capacitor branch and the ground.
  • a filter is added between the balun and the stratum to reduce the impact of the high-frequency radiator on the low-frequency radiator, while achieving high-frequency radiation
  • the normal transmission of the body signal not only solves the problem of high-frequency radiator common mode resonance, but also does not affect the bandwidth of the antenna, and the processing cost is low.
  • FIG. 5 is a schematic diagram of a side view of the second embodiment of the high-frequency radiator of the present application.
  • the capacitor branch 141 is disposed at the first The dielectric plate 16 is on the same side as the balun 12, and the capacitor branch 141 is electrically connected to the balun 12. That is, the capacitor branch 141 of the filter is composed of two layers of metal sheets under the balun 12, and the capacitor branch 141 is welded to the upward surface of the second dielectric plate 17, which can be close to the ground layer 15 and has a coupling area, thereby There is a capacitive effect between the two to achieve a coupling connection.
  • a filter is added between the balun and the stratum to reduce the impact of the high-frequency radiator on the low-frequency radiator, while achieving high-frequency radiation
  • the normal transmission of the body signal not only solves the problem of high-frequency radiator common mode resonance, but also does not affect the bandwidth of the antenna, and the processing cost is low.
  • the capacitor branch in this embodiment includes a first capacitor branch 141a and a second capacitor branch 141b, and the first capacitor branch
  • the path 141a is provided on the upward surface of the second dielectric plate 17
  • the second capacitive branch 141b is provided on the same surface of the first dielectric plate 16 as the balun 12
  • the second capacitive branch 141b is electrically connected to the balun 12
  • the first capacitor branch 141a and the second capacitor branch 141b are electrically connected.
  • FIG. 7 is a logic schematic diagram of Embodiment 3 of a high-frequency radiator of the present application.
  • the filter added between the balun and the stratum of the high-frequency radiator of the present application, where a branch includes two main
  • the other branch includes an inductance that plays a major role.
  • This filter can reduce the impact of high-frequency radiators on low-frequency radiators. When the low-frequency radiators emit signals, they can suppress low-frequency bands on high-frequency radiators. Common-mode resonance caused by the signal.
  • the second capacitor branch is formed by two layers of metal sheets under the balun.
  • the first capacitor branch is a metal branch line provided on the upward surface of the second dielectric plate.
  • a filter is added between the balun and the stratum to reduce the impact of the high-frequency radiator on the low-frequency radiator, while achieving high-frequency radiation
  • the normal transmission of the body signal not only solves the problem of high-frequency radiator common mode resonance, but also does not affect the bandwidth of the antenna, and the processing cost is low.
  • the capacitor branch 141 in this embodiment includes a first capacitor branch 141a and a second capacitor branch 141b, the first capacitor The branch 141a is disposed on the upward surface of the second dielectric plate 17, the second capacitive branch 141b is disposed on the same surface of the first dielectric plate 16 as the balun 12, and the inductive branch 142 and the second capacitive branch 141b The first capacitor branch 141a and the second capacitor branch 141b are electrically connected.
  • FIG. 9 is a logic diagram of Embodiment 4 of the high-frequency radiator of the present application.
  • the filter added between the balun and the stratum of the high-frequency radiator of this application one of the branches includes a main function
  • the other branch includes an inductance that plays a major role.
  • the two branches are connected in series with a capacitor.
  • This filter can reduce the impact of high-frequency radiators on low-frequency radiators. When the low-frequency radiators emit signals, Suppress common-mode resonance caused by low-frequency signals on high-frequency radiators.
  • the inductor branch 142 is directly electrically connected to the second capacitor branch 141b.
  • the second capacitor branch 141b is composed of two layers of metal sheets under the balun 12, and the first capacitor branch 141a is disposed on the second dielectric plate 17 metal branch line on the upward face.
  • a filter is added between the balun and the stratum to reduce the impact of the high-frequency radiator on the low-frequency radiator, while achieving high-frequency radiation
  • the normal transmission of the body signal not only solves the problem of high-frequency radiator common mode resonance, but also does not affect the bandwidth of the antenna, and the processing cost is low.
  • FIG. 10 is a schematic diagram of a side view of a fifth embodiment of a high-frequency radiator of the present application.
  • the circuit 13 and the inductance branch 142 form a microstrip line structure.
  • a coaxial line 18 is provided on the downward surface of the second dielectric plate 17.
  • the outer conductor 181 of the coaxial line 18 is electrically connected to the ground layer 15 and the coaxial line 18
  • the inner conductor 182 is electrically connected to the feed circuit 13.
  • FIG. 11 is a schematic diagram of the microstrip line structure of the fifth embodiment of the high-frequency radiator of the present application.
  • the microstrip line structure 30 includes a conductor strip 32 and a ground layer 33 on both sides of the dielectric substrate 31.
  • This application uses a feeder circuit 13 (equivalent to a conductor strip) and an inductance branch 142 (equivalent to a ground layer) and the first dielectric plate 16 therebetween to form a microstrip line structure, so that it is transmitted from the coaxial line 18
  • the high-frequency current signal can flow from the inner conductor 182 to the feed circuit 13 and the balun 12 without loss.
  • the outer conductor 181 and the ground layer 15 are directly electrically connected by welding, so that the entire high-frequency radiator feed system is very complete, and the standing wave The bandwidth is larger and there will be no signal discontinuities.
  • FIG. 12 is a schematic structural diagram of an embodiment of a multi-frequency array antenna of the present application.
  • the multi-frequency array antenna includes: an antenna radiator 41 and an antenna reflector 42.
  • the antenna radiator 41 is disposed on the antenna reflector 42, wherein
  • the antenna radiator 41 includes at least one high-frequency radiator 43 and at least one low-frequency radiator 44, the high-frequency radiator 43 forms three high-frequency arrays, the low-frequency radiator 44 forms a low-frequency array, and the high-frequency array and the low-frequency array are horizontal They are arranged in a cross direction.
  • the highest frequency of the operating frequency band of the low-frequency radiator 44 is smaller than the lowest frequency of the operating frequency band of the high-frequency radiator 43.
  • the high-frequency radiator 43 adopts the high-frequency radiator of any of the embodiments in FIGS. 1 to 11.
  • the distance between the high-frequency radiator 43 and the low-frequency radiator 44 is less than or equal to 0.4 ⁇ (for example, 0.3 ⁇ ), and ⁇ is the wavelength corresponding to the center frequency of the operating frequency band of the low-frequency radiator 44.
  • the multi-frequency array antenna of the present application adds a filter between the balun and the ground layer to reduce the influence of the high-frequency radiator on the low-frequency radiator without affecting the structure of the radiation arm and the balun of the high-frequency radiator.
  • the normal transmission of the signal of the high-frequency radiator is realized, which not only solves the problem of the common-mode resonance of the high-frequency radiator, but also does not affect the bandwidth of the antenna, and the processing cost is low.
  • the present application provides a base station, the base station includes a multi-frequency array antenna, and the multi-frequency array antenna uses the multi-frequency array antenna of the embodiment shown in FIG. 12.
  • the wireless network structure where the base station is located includes the mobile terminal, the base station, the network conversion access port and the operation management center.
  • the base station includes a multi-frequency array antenna, a radio frequency front-end module and a baseband signal processing module.
  • the multi-frequency array antenna is between the mobile user terminal and the radio frequency front-end module
  • the connection equipment is mainly used for cell coverage of wireless signals.
  • a multi-frequency array antenna includes several arrays composed of radiators of different frequencies, and each array receives or transmits a radio frequency signal through its own feeding network.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)

Abstract

本申请提供一种高频辐射体、多频阵列天线和基站。本申请高频辐射体包括正负45度的两个单极化辐射体；单极化辐射体包括：辐射臂、巴伦、馈电电路、滤波器和地层；其中，辐射臂和巴伦电连接；馈电电路和巴伦分别设置于竖直放置的第一介质板的两个面上；地层设置于水平放置的第二介质板的向下的面上；第一介质板垂直设置于第二介质板之上；滤波器包括电容支路和电感支路，电感支路设置于第一介质板上与巴伦相同的一面上，且电感支路分别与巴伦和地层电连接，电容支路与地层耦合连接；馈电电路用于给高频辐射体馈电；滤波器用于减弱高频辐射体对低频辐射体的影响。本申请解决了高频辐射体共模谐振的问题，且不影响天线的带宽，加工成本低。

Description

高频辐射体、多频阵列天线和基站
本申请要求于2018年12月29日提交中国专利局、申请号为201811640716.2、申请名称为“高频辐射体、多频阵列天线和基站”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及天线技术，尤其涉及一种高频辐射体、多频阵列天线和基站。
背景技术
随着移动通信系统的发展，基站天线需要实现多频多极化，以满足多个运营商的共同需求。然而，常规多频天线在实现中，其宽度尺寸要非常大才能满足指标要求，一旦宽度尺寸降低，电磁波在由低频辐射体耦合至高频辐射体时会在高频辐射体中产生共模谐振，导致低频指标明显恶化。
目前抑制多频天线中高频辐射体在低频工作频段的共模谐振的方法是在高频辐射体的巴伦和高频辐射体的振子臂上加载电容-电感-电容电路，实现在高频频段匹配，并在低频频段将高频辐射体的共模谐振移至低频频段外。
但是，上述多频天线的带宽受到限制，且加工成本较高。
发明内容
本申请提供一种高频辐射体、多频阵列天线和基站，以解决高频辐射体共模谐振的问题，且不影响天线的带宽，加工成本低。
第一方面，本申请提供一种高频辐射体，该高频辐射体为双极化辐射体，双极化辐射体包括正负45度的两个单极化辐射体；
单极化辐射体包括：辐射臂、巴伦、馈电电路、滤波器和地层；其中，辐射臂和巴伦电连接；馈电电路和巴伦分别设置于竖直放置的第一介质板的两个面上；地层设置于水平放置的第二介质板的向下的面上；第一介质板垂直设置于第二介质板之上；滤波器包括电容支路和电感支路，电感支路设置于第一介质板上与巴伦相同的一面上，且电感支路分别与巴伦和地层电连接，电容支路与地层耦合连接；
馈电电路用于给高频辐射体馈电；
滤波器用于减弱高频辐射体对低频辐射体的影响，低频辐射体的工作频段的最高频率小于高频辐射体的工作频段的最低频率。
本申请，在不影响高频辐射体的辐射臂和巴伦的结构的前提下，在巴伦和地层之间增加滤波器，减弱高频辐射体对低频辐射体的影响，同时实现高频辐射体的信号的正常传输，既解决了高频辐射体共模谐振的问题，也不影响天线的带宽，且加工成本低。
在一种可能的实现方式中，电容支路设置于第二介质板的向上的面上，且电容支路与巴伦电连接。
在一种可能的实现方式中，电容支路设置于第一介质板上与巴伦相同的一面上，且电容支路与巴伦电连接。
在一种可能的实现方式中，电容支路包括第一电容支路和第二电容支路，第一电容支路设置于第二介质板的向上的面上，第二电容支路设置于第一介质板上与巴伦相同的一面上，第二电容支路与巴伦电连接，第一电容支路与第二电容支路电连接。
在一种可能的实现方式中，电容支路包括第一电容支路和第二电容支路，第一电容支路设置于第二介质板的向上的面上，第二电容支路设置于第一介质板上与巴伦相同的一面上，电感支路与第二电容支路电连接，第一电容支路与第二电容支路电连接。
在一种可能的实现方式中，以电感支路作为地层，由馈电电路和电感支路形成微带线结构；在第二介质板的向下的面上设置有同轴线，同轴线的外导体与地层电连接，同轴线的内导体与馈电电路电连接。
本申请采用微带线结构，将从同轴线发射过来的高频电流信号通过内导体无损失的流向馈电电路和巴伦，外导体与地层通过焊接直接电连接，使得整个高频辐射体的馈电系统很完整，且驻波带宽更大，不会有信号不连续的地方。
在一种可能的实现方式中，电感支路和电容支路均为金属枝节线，用作电感支路的金属枝节线形成的轮廓比用作电容支路的金属枝节线形成的轮廓窄且长。
第二方面，本申请提供一种多频阵列天线，包括：天线辐射体和天线反射板，天线辐射体设置于天线反射板上；其中，天线辐射体包括至少一个高频辐射体和至少一个低频辐射体，高频辐射体和低频辐射体在水平方向上交叉排列，低频辐射体的工作频段的最高频率小于高频辐射体的工作频段的最低频率；高频辐射体采用上述第一方面中任一项的高频辐射体。
本申请的多频阵列天线，在不影响高频辐射体的辐射臂和巴伦的结构的前提下，在巴伦和地层之间增加滤波器，减弱高频辐射体对低频辐射体的影响，同时实现高频辐射体的信号的正常传输，既解决了高频辐射体共模谐振的问题，也不影响天线的带宽，且加工成本低。
在一种可能的实现方式中，高频辐射体和低频辐射体之间的距离小于或等于0.4λ，λ为低频辐射体的工作频段的中心频率对应的波长。
第三方面，本申请提供一种基站，该基站包括多频阵列天线，多频阵列天线采用上述第二方面中任一项的天线。
本申请的基站所采用的天线，在不影响高频辐射体的辐射臂和巴伦的结构的前提下，在巴伦和地层之间增加滤波器，减弱高频辐射体对低频辐射体的影响，同时实现高频辐射体的信号的正常传输，既解决了高频辐射体共模谐振的问题，也不影响天线的带宽，且加工成本低。
附图说明
图1为本申请高频辐射体实施例一的俯视结构示意图；
图2为本申请高频辐射体实施例一的侧视结构示意图；
图3为本申请高频辐射体实施例一的仰视结构示意图；
图4为本申请高频辐射体实施例一的逻辑示意图；
图5为本申请高频辐射体实施例二的侧视结构示意图；
图6为本申请高频辐射体实施例三的侧视结构示意图；
图7为本申请高频辐射体实施例三的逻辑示意图；
图8为本申请高频辐射体实施例四的侧视结构示意图；
图9为本申请高频辐射体实施例四的逻辑示意图；
图10为本申请高频辐射体实施例五的侧视结构示意图；
图11为本申请高频辐射体实施例五的微带线结构示意图；
图12为本申请多频阵列天线实施例的结构示意图。
具体实施方式
为使本申请的目的、技术方案和优点更加清楚，下面将结合本申请中的附图，对本申请中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
图1为本申请高频辐射体实施例一的俯视结构示意图，如图1所示，本实施例的高频辐射体为双极化辐射体，该双极化辐射体包括正45度的单极化辐射体10和负45度的单极化辐射体20，单极化辐射体10和单极化辐射体20呈十字交叉形状，这两个单极化辐射体的结构相同，此处以单极化辐射体10为例进行说明。
图2为本申请高频辐射体实施例一的侧视结构示意图，如图2所示，单极化辐射体10包括：辐射臂11、巴伦12、馈电电路13、滤波器和地层15，其中，辐射臂11和巴伦12电连接，馈电电路13(虚线表示)和巴伦12分别设置于竖直放置的第一介质板16的两个面上，地层15设置于水平放置的第二介质板17的向下的面上，第一介质板16垂直设置于第二介质板17之上，滤波器包括电容支路141和电感支路142，电感支路142设置于第一介质板16上与巴伦12相同的一面上，且电感支路142分别与巴伦12和地层15电连接，电容支路141设置于第二介质板17的向上的面上，电容支路141与巴伦12电连接，与地层15耦合连接。馈电电路13用于给高频辐射体馈电。滤波器用于减弱高频辐射体对低频辐射体的影响，低频辐射体的工作频段的最高频率小于高频辐射体的工作频段的最低频率。本申请的介质板可以是印刷电路板(Printed Circuit Board，简称：PCB)，也可以是新工艺塑料电镀的介质板，对此不做限定。
图3为本申请高频辐射体实施例一的仰视结构示意图，如图3所示，电容支路141(虚线所示)和地层15分别设置于第二介质板17的两个面上，地层15在第二介质板17的向下的面上，电容支路141在第二介质板17的向上的面上。为了实现电感支路142与地层15的电连接，在第二介质板17上有一个对应于电感支路142的孔19，以便于电感支路142可以垂直穿过该孔后焊接于地层15上。为了实现电容支路141与巴伦12的电连接，将巴伦12对应于电容支路141的位置焊接于第二介质板17上，二者的焊接点处于电容支路141的覆盖范围内。
图4为本申请高频辐射体实施例一的逻辑示意图，如图4所示，本申请在高频辐射体的巴伦和地层之间增加滤波器，该滤波器可以减弱高频辐射体对低频辐射体的影响，滤波器可以采用并联或混联结构，其中一条支路包括一个起主要作用的电容，另一条支路包括一个起主要作用的电感，这样的滤波器结构可以在低频辐射体发射信号时，在高频辐射体上抑制低频段的信号引起的共模谐振，只要调节电容与电感的组合，就可以实现低频段 (690-960MHz)内良好的改善效果。基于该原理，本申请中将一段细且长的金属枝节线等效为电感(即电感支路)，将一段宽且短的金属枝节线等效为电容(即电容支路)。本实施例中电感支路直接与巴伦电连接，可以认为电感支路是集成在高频辐射体(单极化辐射体)上的。电容支路是设置于第二介质板的向上的面上的金属枝节线，其与地层距离相近且存在耦合面积，从而在二者之间存在电容效应，实现耦合连接，当电容值合适时信号可以在电容支路和地层之间进行传递。
本申请，在不影响高频辐射体的辐射臂和巴伦的结构的前提下，在巴伦和地层之间增加滤波器，减弱高频辐射体对低频辐射体的影响，同时实现高频辐射体的信号的正常传输，既解决了高频辐射体共模谐振的问题，也不影响天线的带宽，且加工成本低。
在图2-图4所示实施例的基础上，图5为本申请高频辐射体实施例二的侧视结构示意图，如图5所示，本实施例中电容支路141设置于第一介质板16上与巴伦12相同的一面上，且电容支路141与巴伦12电连接。即由巴伦12下方的两层金属片构成滤波器的电容支路141，将电容支路141焊接于第二介质板17的向上的面上，可以与地层15距离相近且存在耦合面积，从而在二者之间存在电容效应，实现耦合连接。
本申请，在不影响高频辐射体的辐射臂和巴伦的结构的前提下，在巴伦和地层之间增加滤波器，减弱高频辐射体对低频辐射体的影响，同时实现高频辐射体的信号的正常传输，既解决了高频辐射体共模谐振的问题，也不影响天线的带宽，且加工成本低。
图6为本申请高频辐射体实施例三的侧视结构示意图，如图6所示，本实施例中电容支路包括第一电容支路141a和第二电容支路141b，第一电容支路141a设置于第二介质板17的向上的面上，第二电容支路141b设置于第一介质板16上与巴伦12相同的一面上，第二电容支路141b与巴伦12电连接，第一电容支路141a与第二电容支路141b电连接。
图7为本申请高频辐射体实施例三的逻辑示意图，如图7所示，本申请在高频辐射体的巴伦和地层之间增加的滤波器，其中一条支路包括两个起主要作用的电容，另一条支路包括一个起主要作用的电感，该滤波器可以减弱高频辐射体对低频辐射体的影响，可以在低频辐射体发射信号时，在高频辐射体上抑制低频段的信号引起的共模谐振。本实施例中第二电容支路由巴伦下方的两层金属片构成，第一电容支路是设置于第二介质板的向上的面上的金属枝节线。
本申请，在不影响高频辐射体的辐射臂和巴伦的结构的前提下，在巴伦和地层之间增加滤波器，减弱高频辐射体对低频辐射体的影响，同时实现高频辐射体的信号的正常传输，既解决了高频辐射体共模谐振的问题，也不影响天线的带宽，且加工成本低。
图8为本申请高频辐射体实施例四的侧视结构示意图，如图8所示，本实施例中电容支路141包括第一电容支路141a和第二电容支路141b，第一电容支路141a设置于第二介质板17的向上的面上，第二电容支路141b设置于第一介质板16上与巴伦12相同的一面上，电感支路142与第二电容支路141b电连接，第一电容支路141a与第二电容支路141b电连接。
图9为本申请高频辐射体实施例四的逻辑示意图，如图9所示，本申请在高频辐射体的巴伦和地层之间增加的滤波器，其中一条支路包括一个起主要作用的电容，另一条支路包括一个起主要作用的电感，这两条支路再串联一个电容，该滤波器可以减弱高频辐射体对低频辐射体的影响，可以在低频辐射体发射信号时，在高频辐射体上抑制低频段的信号 引起的共模谐振。本实施例中电感支路142与第二电容支路141b直接电连接，第二电容支路141b由巴伦12下方的两层金属片构成，第一电容支路141a是设置于第二介质板17的向上的面上的金属枝节线。
本申请，在不影响高频辐射体的辐射臂和巴伦的结构的前提下，在巴伦和地层之间增加滤波器，减弱高频辐射体对低频辐射体的影响，同时实现高频辐射体的信号的正常传输，既解决了高频辐射体共模谐振的问题，也不影响天线的带宽，且加工成本低。
图10为本申请高频辐射体实施例五的侧视结构示意图，如图10所示，在图1-图9中任一实施例的基础上，以电感支路142作为地层，由馈电电路13和电感支路142形成微带线结构，在第二介质板17的向下的面上设置有同轴线18，同轴线18的外导体181与地层15电连接，同轴线18的内导体182与馈电电路13电连接。
图11为本申请高频辐射体实施例五的微带线结构示意图，如图11所示，微带线结构30包括位于介质基片31两侧的导体带32和接地层33。本申请利用馈电电路13(相当于导体带)和电感支路142(相当于接地层)以及二者之间的第一介质板16形成微带线结构，这样从同轴线18发射过来的高频电流信号可以从内导体182无损失的流向馈电电路13和巴伦12，外导体181与地层15通过焊接直接电连接，使得整个高频辐射体的馈电系统很完整，且驻波带宽更大，不会有信号不连续的地方。
图12为本申请多频阵列天线实施例的结构示意图，如图12所示，多频阵列天线包括：天线辐射体41和天线反射板42，天线辐射体41设置于天线反射板42上，其中，天线辐射体41包括至少一个高频辐射体43和至少一个低频辐射体44，高频辐射体43组成三个高频阵列，低频辐射体44组成一个低频阵列，高频阵列和低频阵列在水平方向上交叉排列，低频辐射体44的工作频段的最高频率小于高频辐射体43的工作频段的最低频率，高频辐射体43采用图1-图11中任一实施例的高频辐射体。高频辐射体43和低频辐射体44之间的距离小于或等于0.4λ(例如0.3λ)，λ为低频辐射体44的工作频段的中心频率对应的波长。
本申请的多频阵列天线，在不影响高频辐射体的辐射臂和巴伦的结构的前提下，在巴伦和地层之间增加滤波器，减弱高频辐射体对低频辐射体的影响，同时实现高频辐射体的信号的正常传输，既解决了高频辐射体共模谐振的问题，也不影响天线的带宽，且加工成本低。
在一种可能的实现方式中，本申请提供一种基站，该基站包括多频阵列天线，该多频阵列天线采用图12所示实施例的多频阵列天线。基站所在的无线网络结构包括移动终端、基站、网络转换接入口和运营管理中心，基站包括多频阵列天线、射频前端模块和基带信号处理模块，多频阵列天线是移动用户终端与射频前端模块间的衔接设备，主要用于进行无线信号的小区覆盖。多频阵列天线包括由不同频率的辐射体组成的若干阵列，各阵列通过各自的馈电网络接收或发射射频信号。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (10)

  1. 一种高频辐射体，其特征在于，所述高频辐射体为双极化辐射体，所述双极化辐射体包括正负45度的两个单极化辐射体；
    所述单极化辐射体包括：辐射臂、巴伦、馈电电路、滤波器和地层；其中，所述辐射臂和所述巴伦电连接；所述馈电电路和所述巴伦分别设置于竖直放置的第一介质板的两个面上；所述地层设置于水平放置的第二介质板的向下的面上；所述第一介质板垂直设置于所述第二介质板之上；所述滤波器包括电容支路和电感支路，所述电感支路设置于所述第一介质板上与所述巴伦相同的一面上，且所述电感支路分别与所述巴伦和所述地层电连接，所述电容支路与所述地层耦合连接；
    所述馈电电路用于给所述高频辐射体馈电；
    所述滤波器用于减弱所述高频辐射体对低频辐射体的影响，所述低频辐射体的工作频段的最高频率小于所述高频辐射体的工作频段的最低频率。
  2. 根据权利要求1所述的高频辐射体，其特征在于，所述电容支路设置于所述第二介质板的向上的面上，且所述电容支路与所述巴伦电连接。
  3. 根据权利要求1所述的高频辐射体，其特征在于，所述电容支路设置于所述第一介质板上与所述巴伦相同的一面上，且所述电容支路与所述巴伦电连接。
  4. 根据权利要求1所述的高频辐射体，其特征在于，所述电容支路包括第一电容支路和第二电容支路，所述第一电容支路设置于所述第二介质板的向上的面上，所述第二电容支路设置于所述第一介质板上与所述巴伦相同的一面上，所述第二电容支路与所述巴伦电连接，所述第一电容支路与所述第二电容支路电连接。
  5. 根据权利要求1所述的高频辐射体，其特征在于，所述电容支路包括第一电容支路和第二电容支路，所述第一电容支路设置于所述第二介质板的向上的面上，所述第二电容支路设置于所述第一介质板上与所述巴伦相同的一面上，所述电感支路与所述第二电容支路电连接，所述第一电容支路与所述第二电容支路电连接。
  6. 根据权利要求1-5中任一项所述的高频辐射体，其特征在于，以所述电感支路作为地层，由所述馈电电路和所述电感支路形成微带线结构；在所述第二介质板的向下的面上设置有同轴线，所述同轴线的外导体与所述地层电连接，所述同轴线的内导体与所述馈电电路电连接。
  7. 根据权利要求1-6中任一项所述的高频辐射体，其特征在于，所述电感支路和所述电容支路均为金属枝节线，用作所述电感支路的金属枝节线形成的轮廓比用作所述电容支路的金属枝节线形成的轮廓窄且长。
  8. 一种多频阵列天线，其特征在于，包括：天线辐射体和天线反射板，所述天线辐射体设置于所述天线反射板上；其中，所述天线辐射体包括至少一个高频辐射体和至少一个低频辐射体，所述高频辐射体和所述低频辐射体在水平方向上交叉排列，所述低频辐射体的工作频段的最高频率小于所述高频辐射体的工作频段的最低频率；
    所述高频辐射体采用权利要求1-7中任一项所述的高频辐射体。
  9. 根据权利要求8所述的天线，其特征在于，所述高频辐射体和所述低频辐射体之间的距离小于或等于0.4λ，λ为所述低频辐射体的工作频段的中心频率对应的波长。
  10. 一种基站，其特征在于，所述基站包括多频阵列天线，所述多频阵列天线采用权利要求8或9所述的天线。
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113794043A (zh) * 2021-08-27 2021-12-14 南京信息工程大学 一种双频双极化滤波基站天线
GB2601810A (en) * 2020-12-11 2022-06-15 Alpha Wireless Ltd High band antenna elements and a multi-band antenna

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111313155B (zh) * 2018-12-11 2021-11-19 华为技术有限公司 天线和通信设备
WO2022053156A1 (en) * 2020-09-14 2022-03-17 Huawei Technologies Co., Ltd. Antenna device, array of antenna devices, and base station with antenna device
EP4246721A4 (en) * 2020-12-24 2024-02-21 Huawei Tech Co Ltd MULTI-FREQUENCY ANTENNA AND COMMUNICATION DEVICE
CN113036432A (zh) * 2021-03-10 2021-06-25 广东富宇鸿通讯有限公司 一种异频滤波天线、异频滤波天线的制作方法、应用
CN113904102B (zh) * 2021-08-31 2023-07-07 华为技术有限公司 一种天线及通信设备
WO2023160804A1 (en) * 2022-02-25 2023-08-31 Telefonaktiebolaget Lm Ericsson (Publ) Antenna and antenna array

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180323513A1 (en) * 2017-05-03 2018-11-08 Commscope Technologies Llc Multi-band base station antennas having crossed-dipole radiating elements with generally oval or rectangularly shaped dipole arms and/or common mode resonance reduction filters
CN108963454A (zh) * 2017-05-24 2018-12-07 康普技术有限责任公司 天线组件、非屏蔽电路组件和辐射单元组件
WO2018231670A2 (en) * 2017-06-15 2018-12-20 Commscope Technologies Llc Cloaking antenna elements and related multi-band antennas

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5532708A (en) * 1995-03-03 1996-07-02 Motorola, Inc. Single compact dual mode antenna
US9711871B2 (en) 2013-09-11 2017-07-18 Commscope Technologies Llc High-band radiators with extended-length feed stalks suitable for basestation antennas
CN203521615U (zh) * 2013-10-28 2014-04-02 华为技术有限公司 基站天线
CN103730728B (zh) 2013-12-31 2016-09-07 上海贝尔股份有限公司 多频天线
US9698486B2 (en) * 2015-01-15 2017-07-04 Commscope Technologies Llc Low common mode resonance multiband radiating array
US10128579B2 (en) * 2015-02-13 2018-11-13 Commscope Technologies Llc Dipole antenna element with open-end traces
WO2017035726A1 (zh) * 2015-08-31 2017-03-09 华为技术有限公司 一种用于多频天线双极化的天线振子
KR102063622B1 (ko) * 2015-10-30 2020-01-08 후아웨이 테크놀러지 컴퍼니 리미티드 안테나 시스템
CN105281031B (zh) * 2015-11-16 2018-02-27 广东博纬通信科技有限公司 一种超宽频双极化低频振子单元及其多频段阵列天线
WO2017091993A1 (zh) * 2015-12-03 2017-06-08 华为技术有限公司 一种多频通信天线以及基站
CN107134639B (zh) 2017-05-26 2019-08-20 华南理工大学 高异频隔离宽带双频基站天线阵列
CN107359418B (zh) * 2017-05-31 2019-11-29 上海华为技术有限公司 一种多频天线系统及控制多频天线系统内异频干扰的方法
CN108493602B (zh) * 2018-05-22 2023-06-20 华南理工大学 一种双极化双工天线及其构成的双频基站天线阵列
CN110474155B (zh) * 2019-08-19 2024-02-13 华南理工大学 一种毫米波滤波天线及无线通信设备
CN113809556A (zh) * 2021-08-05 2021-12-17 华南理工大学 共口径双频双极化天线阵列及通信设备

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180323513A1 (en) * 2017-05-03 2018-11-08 Commscope Technologies Llc Multi-band base station antennas having crossed-dipole radiating elements with generally oval or rectangularly shaped dipole arms and/or common mode resonance reduction filters
CN108963454A (zh) * 2017-05-24 2018-12-07 康普技术有限责任公司 天线组件、非屏蔽电路组件和辐射单元组件
WO2018231670A2 (en) * 2017-06-15 2018-12-20 Commscope Technologies Llc Cloaking antenna elements and related multi-band antennas

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3886257A4

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2601810A (en) * 2020-12-11 2022-06-15 Alpha Wireless Ltd High band antenna elements and a multi-band antenna
WO2022123056A1 (en) * 2020-12-11 2022-06-16 Alpha Wireless Ltd High band antenna elements and a multi-band antenna
GB2601810B (en) * 2020-12-11 2023-07-05 Alpha Wireless Ltd High band antenna elements and a multi-band antenna
CN113794043A (zh) * 2021-08-27 2021-12-14 南京信息工程大学 一种双频双极化滤波基站天线

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