WO2020135311A1 - 散热装置及方法 - Google Patents

散热装置及方法 Download PDF

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Publication number
WO2020135311A1
WO2020135311A1 PCT/CN2019/127340 CN2019127340W WO2020135311A1 WO 2020135311 A1 WO2020135311 A1 WO 2020135311A1 CN 2019127340 W CN2019127340 W CN 2019127340W WO 2020135311 A1 WO2020135311 A1 WO 2020135311A1
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Prior art keywords
heat dissipation
heat
working fluid
evaporation
working medium
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PCT/CN2019/127340
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English (en)
French (fr)
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肖攀
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中兴通讯股份有限公司
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Publication of WO2020135311A1 publication Critical patent/WO2020135311A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes

Definitions

  • This application relates to, but not limited to, the field of electronic equipment, and in particular, to a heat dissipation device and method.
  • Chip heat dissipation is one of the bottlenecks that limits the progress of electronic technology.
  • the chip heats up through the shell Conducted to the metal shell of the whole machine, the shell acts as a radiator to conduct heat to the environment through natural heat dissipation.
  • the development trend of the fifth-generation mobile communication (5G communication) system with multiple antennas, high integration, large capacity, and high speed has made the form of communication base station from the original remote radio frequency module (Remote Radio Unit, referred to as RRU) to large size.
  • AAU The source antenna processing unit
  • 5G AAU products use natural heat dissipation.
  • the thermal cascading problem of the upper and lower airflow is very serious, greatly reducing the natural heat dissipation efficiency .
  • the heat dissipation teeth In order to effectively solve the thermal cascade problem, the heat dissipation teeth usually adopt a specific V-shaped layout.
  • the embodiments of the present application provide a heat dissipation device and method, so as to at least solve the problem that the heating device of the electronic device in the related art cannot efficiently dissipate heat.
  • a heat dissipation device including: a first heat sink connected to a device to be dissipated for conducting heat generated by the device to be dissipated, wherein the device to be dissipated includes at least Heating elements; a second heat sink fixed to the first heat sink, the second heat sink including at least one heat dissipation structure, each of the heat dissipation structures being in contact with at least one of the heat generating elements; and, each The heat dissipation structure is provided with a heat dissipation channel, and the working area is stored in the evaporation area of the heat dissipation channel; the heat dissipation channel is configured to conduct the gaseous working medium formed after the working medium absorbs the heat generated by the heating device to The condensation area of the heat dissipation channel and the liquid working medium formed by condensing the gaseous working medium in the condensation area are returned to the evaporation area.
  • a heat dissipation method is also provided.
  • the above heat dissipation device provided in an embodiment of the present application is used to conduct heat generated by a device to be dissipated.
  • the device to be dissipated includes one or more heat generating devices ;
  • the heat dissipation method includes:
  • an independent second heat sink is provided on the first heat sink, and the second heat sink is directly connected to a heating device such as a chip that generates a large amount of heat, and each of the second heat sink
  • the heat dissipation structure is in contact with at least one heating device, and the liquid working fluid in the evaporation area of the heat dissipation channel can absorb the heat generated by the heating device, and is converted into a gaseous working fluid to diffuse into the condensation area, and the gaseous working fluid is converted into a liquid after condensation The working fluid falls back into the evaporation area of the heat dissipation channel, thereby achieving a circulating heat dissipation process.
  • the heat dissipation efficiency can be improved, and the heat dissipation device in the electronic device can be efficiently dissipated; on the other hand, on the basis of ensuring efficient heat dissipation, There is no need to increase the volume of the first radiator excessively, thereby solving the problems of bulky products, difficulty in production and high cost.
  • FIG. 1a is a schematic structural diagram of a heat dissipation device according to an embodiment of the present application
  • FIG. 1b is a schematic structural diagram of a heat dissipation device according to another embodiment of the present application.
  • FIG. 2 is a structural diagram of a heat dissipation device according to another embodiment of the present application.
  • FIG. 3 is a flowchart of a heat dissipation method according to an embodiment of the present application.
  • the solution of this application document can be applied to electronic devices in the related art, such as 5G AAU products, or other chips and other electronic devices with high heat generation, but it is not limited to this.
  • FIG. 1a is a schematic structural diagram of a heat dissipation device provided according to an embodiment of the present application.
  • the heat dissipation device includes: a first heat sink 11 and a second Radiator 14.
  • the first heat sink 11 is connected to the device to be dissipated 12 for conducting heat generated by the device to be dissipated 12.
  • the device to be dissipated 12 includes at least one heat-generating device 13.
  • the second heat sink 14 is fixed on the first heat sink 11.
  • the second heat sink 14 includes at least one heat dissipation structure, and each heat dissipation structure is in contact with at least one heat generating device 13.
  • each heat dissipation structure is provided with a heat dissipation channel, and the working area is stored in the evaporation area of the heat dissipation channel.
  • the heat dissipation channel is configured to conduct the gaseous working medium formed after the working medium absorbs the heat generated by the heating device to the condensation area of the heat dissipation channel, and to return the liquid working medium formed after condensing the gaseous working medium in the condensation area to the evaporation area.
  • an independent second heat sink 14 is provided on the first heat sink 11, the second heat sink 14 is directly connected to a heat generating device such as a chip that generates a large amount of heat, and the second heat sink 14
  • a heat generating device such as a chip that generates a large amount of heat
  • Each heat dissipation structure is in contact with at least one heating device 13, and the liquid working fluid in the evaporation area of the heat dissipation channel can absorb the heat generated by the heating device 13 and is converted into a gaseous working fluid to diffuse into the condensation area, and the gaseous working fluid is condensing It is converted into liquid working medium and then falls back to the evaporation area of the heat dissipation channel, thereby achieving a circulating heat dissipation process.
  • the second heat sink 14 on the basis of the first heat sink 11, on the one hand, the heat dissipation efficiency can be improved, and the heat dissipation device 13 in the electronic device can be efficiently dissipated; on the other hand, the On the basis, there is no need to increase the volume of the first radiator 11 excessively, thereby solving the problems of bulky products, difficulty in production, and high cost.
  • each heat dissipation structure includes an evaporation chamber 141 and a pipeline 142 that constitute the above heat dissipation channel.
  • the evaporation chamber 141 is in contact with at least one heating element 13, and a working medium is stored in the evaporation chamber 141, and the working medium may be acetone, deionized water, or the like.
  • the inner space of the evaporation chamber 141 serves as an evaporation area of the above heat dissipation channel.
  • the pipeline 142 communicates with the evaporation chamber 141 for conducting the gaseous working fluid formed after the working fluid stored in the evaporation chamber 141 is heated and the liquid working fluid formed after the gaseous working fluid is condensed.
  • the portion of the pipeline 142 capable of condensing the gaseous working medium is used as the condensation area of the heat dissipation channel.
  • the liquid working fluid in the evaporation chamber 141 can absorb the heat generated by the heating device 13 and is converted into a gaseous working fluid to diffuse into the pipeline 142, and the gaseous state in the pipeline 142 After being condensed, the working fluid is converted into a liquid working fluid and then falls back into the evaporation chamber 141, thereby achieving a circulating heat dissipation process.
  • the pipeline 142 may be at an angle to the ground and not parallel to the ground, for example, the pipeline 142 is perpendicular to the ground, so that the gaseous working fluid formed after the working fluid stored in the evaporation chamber 141 is heated It is easy to rise along the pipeline 142, and it can also make the gaseous working fluid in the pipeline 142 fall back into the evaporation chamber 141 by gravity after being converted into a liquid working fluid. The liquid working fluid can follow the inner wall of the pipeline 142 Shed.
  • each heat dissipation structure of the second heat sink 14 that is in contact with at least one heat-generating device 13 is located outside the first heat sink 11, and the rest of each heat dissipation structure except the contact portion is built in The first radiator 11.
  • the second heat sink 14 does not occupy additional space, so that the total volume of the first heat sink 11 and the second heat sink 14 can be equal to the volume of the first heat sink 11, and on the basis of ensuring efficient heat dissipation, without excessive The volume of the first radiator 11 is increased, thereby solving the problems of bulky products, difficulty in production and high cost.
  • the second radiator 14 may also be disposed outside the first radiator 11.
  • the structure of the first heat sink 11 may be a metal body, and each heat dissipation structure of the second heat sink 14 is a metal heat dissipation pipe provided in the metal body, and the fixing method of the pipe may include welding and the like .
  • the heating device 13 may be an electronic device such as a chip that generates a large amount of heat, and for multiple heating devices 13, one heat dissipation structure of the second heat sink 14 may correspond to one heating device 13 for heat dissipation, or one The heat dissipation structure may also dissipate heat to a plurality of heat-generating devices 13 at the same time, or the foregoing two cases may also exist at the same time.
  • the first heat sink 11 may be a heat sink provided for electronic devices in the related art.
  • the first heat sink 11 may be a heat sink commonly used in the related art, or may be specially designed according to specific circumstances, and this application has no particular limitation on this.
  • a plurality of first heat dissipation teeth are distributed outside the first heat sink 11 to increase the surface area of the heat sink, thereby increasing the heat dissipation area and further improving heat dissipation efficiency.
  • second heat dissipation teeth are distributed on the outside of the pipeline 142
  • the structure of the second heat dissipation teeth and the layout such as the distribution density may be the same as the structure and distribution of the first heat dissipation teeth distributed outside the first radiator 11
  • the manner is adapted so that the second heat dissipation teeth outside the pipeline 142 will not affect the heat dissipation layout formed by the first radiator 11 but be integrated into the heat dissipation layout of the first radiator 11 as much as possible.
  • the inner surface of the pipeline 142 is a surface formed by smoothing treatment to reduce the conduction resistance of the gaseous working fluid or the liquid working fluid.
  • a through hole is provided in the cavity wall of the evaporation chamber 141 at a position corresponding to the pipeline 142 to communicate the evaporation chamber 141 with the pipeline 142, and the inner diameter of the through hole is the same as that of the pipeline 142 The inner diameter is the same, so that it does not form any barrier to the flow of working fluid.
  • a boss is provided on the evaporation chamber 141 on the side opposite to the heat-generating device 13, and the boss is in contact with at least one heat-generating device 13, and the contact area of the boss is not less than the surface area of the heat-generating device 13.
  • a layer of thermally conductive interface material is attached to the surface of the heat-generating device 13, and a heat-conductive material is filled between the surfaces of the heat-generating device 13 and the boss.
  • the evaporation cavity 141 is a rectangular parallelepiped or a hemisphere, or a cavity of other shapes.
  • Another embodiment of the present application relates to a device for heat dissipation of electronic equipment, in particular to the large size of the active antenna processing unit (Active Antenna Unit, AAU for short) in the fifth-generation mobile communication system in the communication field.
  • AAU Active Antenna Unit
  • the heat dissipation method without moving parts and natural heat dissipation is generally selected.
  • the chip conducts heat to the heat sink of the whole machine through the shell, and the heat sink then conducts heat to the environment through natural heat dissipation.
  • This application is a heat dissipation device independent of the radiator of the whole machine, which can export the heat of the bottleneck device with high heat consumption to avoid the local hotspot caused by the bottleneck device; the structural form of the device and the system have good fusion, not with the equipment The heat dissipation path of the radiator interferes; the device has a simple overall structure and low production cost.
  • the use of this device effectively eliminates the heat dissipation bottleneck and significantly improves the heat dissipation efficiency of 5G AAU large-size equipment.
  • the high-density tooth shape can be adjusted according to the AAU radiator tooth shape, which does not interfere with the flow path of the equipment radiator;
  • FIG. 1b is a schematic structural diagram of a heat dissipation device according to another embodiment of the present application.
  • the heat dissipation device includes an independent radiator A.
  • the specific structure of the independent radiator A is shown in FIG. 1a (a) ,
  • the independent radiator A has a row of "V"-shaped heat dissipation teeth, and the independent radiator A is fixed to the radiator B with "V"-shaped heat dissipation teeth, the fixing method includes Figure 1b (b) and (c) Two modes are shown. Specifically, the first mode is shown in figure (b) of Figure 1b, and the independent radiator A is provided outside the radiator B; the second mode is shown in figure (c) of Figure 1b. ,
  • the independent radiator A is provided inside the radiator B.
  • the connection method of the independent radiator A and the radiator B may include, but not limited to, screw fastening, pasting, and welding processes.
  • the cold end of the independent radiator A is provided with an evaporation chamber filled with working fluid.
  • the evaporation chamber is in full contact with the housing of the heating element through the wall surface. Heat is transferred to the liquid working fluid in the evaporation chamber through the wall surface.
  • the working fluid absorbs heat and vaporizes. Under the driving of the heat, it carries heat into the vertical pipeline communicating with the evaporation chamber, and the heat is led out of the equipment.
  • the petrochemicals flow in the vertical pipeline from the bottom to the top, gradually release heat to condense, and return to the evaporation chamber under the action of gravity.
  • the high-density heat dissipation teeth nested in the pipeline ensure that the radiator has sufficient contact area with the environment, so that the heat is fully dissipated into the environment through natural convection.
  • the size parameters of the vertical pipeline are matched with the heat consumption of the heat-generating device to ensure that the flow of the petrochemical is smooth and the heat is fully released. Moreover, by arranging the axis of the vertical pipeline in the vertical direction, it can be ensured that the condensed working fluid can flow back along the pipe wall by gravity.
  • the high-density heat dissipation teeth on the independent radiator A can increase the heat exchange area of the radiator.
  • the parameters of the number and shape of the heat dissipation teeth match the corresponding parameters of the heat dissipation teeth of the radiator B, thus matching
  • the V-shaped channels merge and do not interfere with the heat dissipation channels to ensure smooth airflow for the radiator B.
  • multiple heating devices can share an independent radiator A, or multiple independent radiators A can be used according to the number of heating devices.
  • High-density teeth are embedded on the working fluid circulation pipeline to increase the heat dissipation area and strengthen heat dissipation;
  • the tooth shape of the high-density tooth matches the tooth shape of the radiator of the whole machine, and does not interfere with the heat dissipation flow path.
  • the axis of the working fluid circulation pipeline can have a certain angle with the vertical direction;
  • the application scenario of the device is not limited to the heat dissipation tooth "V" type radiator, but can also be used on straight teeth, Bevel gears or other forms of radiators are applied; the number and shape of high-density heat dissipation teeth should match the application scenario, and the specific form is not specifically limited; independent radiators can have no heat dissipation teeth, and the working fluid circulation pipeline is embedded in the whole machine for heat dissipation The heat dissipation teeth of the device are integrated with the radiator of the whole machine;
  • reference numeral 1 is a chip
  • reference numeral 2 is an evaporation chamber
  • reference numeral 3 is a pipeline
  • reference numeral 4 is a heat dissipation tooth
  • reference numeral 5 is Boss.
  • the heat dissipation device provided in this embodiment is composed of an evaporation chamber 2, a pipeline 3, heat dissipation teeth 4, and a boss 5.
  • the evaporation chamber 2 is a rectangular parallelepiped cavity, which serves as an evaporation section; one side of the evaporation chamber is in contact with the surface of the chip 1 through the boss 5, and the area of the contact surface of the boss 5 is slightly larger than the surface area of the chip 1, ensuring sufficient contact;
  • the wall surface of the evaporation chamber 2 absorbs the heat generated by the chip 1 and vaporizes.
  • the upper end surface of the evaporation chamber 2 has a through hole with a diameter equal to the inner diameter of the pipeline 3, and communicates with the pipeline 3 by welding.
  • the steam enters the pipeline 3 along the through hole at the upper end of the evaporation chamber 2, and the pipeline 3 gives the gasoline chemical a sufficiently long ascending channel.
  • the heat dissipation teeth 4 are provided on the pipeline 3, and the heat dissipation teeth 4 have the effect of increasing the heat dissipation area; the pipeline 3 and the heat dissipation teeth 4 together form a condensation section, and the vaporized working medium is fully flowed from the bottom to the top of the condensation section Exothermic condensation.
  • the condensed liquid working fluid flows back to the evaporation section under the force of gravity; the hot and cold working fluid circulates in the same piping.
  • the chip 1 is in contact with the evaporation chamber 2 through a boss 5 on one side of the evaporation chamber 2.
  • Each of the four corners of the boss 5 has a threaded hole.
  • the screw and the threaded hole are used to fix the chip 1 on the surface of the boss 5 to ensure sufficient contact and the heat can be smoothly guided to the evaporation chamber 2.
  • a layer of thermal interface material is attached to the surface of the chip 1.
  • the shape and size of the heat dissipation tooth 4 are not limited to the illustrated form, and can be determined according to actual application requirements;
  • the cross-sectional shape of the pipeline 3 is not limited to a circle, but can also be rectangular or other available shapes;
  • the shape of the evaporation chamber 2 is not limited to a rectangular parallelepiped, also However, it is in the form of a hemisphere;
  • the fixing method between the chip 1 and the evaporation chamber 2 is not limited to screw fixing, but may also be other forms that can ensure good contact between the surface of the chip and the surface of the evaporation chamber.
  • This application can effectively solve the heat dissipation of large heat-consuming devices and improve the unit volume power density of 5G AAU large-size products;
  • the solution of the present application effectively solves the heat dissipation of large heat-consuming devices and improves the natural heat dissipation efficiency of large-size equipment. Effectively eliminate the local hot spots caused by large heat-consuming devices in the equipment, avoid introducing uniform temperature materials; effectively improve the heat dissipation efficiency of 5G AAU large-scale natural heat dissipation equipment, save product volume, improve product competitiveness; able to support larger power Realization of natural heat dissipation equipment.
  • the method according to the above embodiments can be implemented by means of software plus a necessary general hardware platform, and of course, it can also be implemented by hardware, but in many cases the former is Better implementation.
  • the technical solution of the present application can essentially be embodied in the form of software products, and the computer software product is stored in a storage medium (such as ROM/RAM, magnetic disk,
  • the CD-ROM includes several instructions to enable a terminal device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the embodiments of the present application.
  • FIG. 3 is a flowchart of a heat dissipation method according to an embodiment of the present application. As shown in FIG. 3, the heat dissipation method uses the heat dissipation device provided by the above embodiments of the present invention to conduct heat dissipation. The heat generated by the heat dissipation equipment.
  • the heat dissipation method includes the following steps:
  • Step S301 using the working fluid stored in the evaporation area of the heat dissipation channel to absorb the heat generated by at least one heating element;
  • step S302 the gaseous working medium formed after the working medium absorbs heat is conducted to the condensation area of the heat dissipation channel, and the liquid working medium formed after condensing the gaseous working medium in the condensation area is returned to the evaporation area.
  • the heat dissipation method provided by the embodiments of the present application can improve the heat dissipation efficiency and realize the efficient heat dissipation of the heating device 13 in the electronic equipment; on the other hand, on the basis of ensuring efficient heat dissipation, there is no need to excessively increase the first radiator
  • the volume of 11 thus solves the problems of bulky products, difficulty in production and high cost.
  • the liquid working fluid in the evaporation chamber 141 can absorb the heat generated by the heating device 13; in step S302, the working fluid is converted into a gaseous working fluid after absorbing heat and diffuses to In the pipeline 142, the gaseous working fluid in the piping 142 is converted into a liquid working fluid after being condensed and then falls back into the evaporation chamber 141, thereby achieving a circulating heat dissipation process.
  • the second heat sink may be fixed on the first heat sink, and the first heat sink may be a heat sink of a heat generating device in the related art.
  • the environment is the external space of the heating element.
  • An independent second heat sink is provided on the first heat sink.
  • the second heat sink is directly connected to a heating device such as a chip that generates a large amount of heat.
  • the evaporation cavity of the second heat sink is in contact with the heating device, and the heating device conducts heat to
  • the liquid working fluid in the evaporation chamber is converted into a gaseous working fluid and the heat is brought into the pipeline to dissipate heat.
  • the gaseous working fluid is converted into a liquid working fluid and then falls back to the evaporation chamber, thereby achieving a circulating heat dissipation process.
  • the heat dissipation efficiency can be improved to achieve efficient heat dissipation of the heating device 13 in the electronic equipment; on the other hand, on the basis of ensuring efficient heat dissipation, there is no need to excessively increase the volume of the first heat sink 11, thereby It solves the problems of bulky products, difficult production and high cost.
  • the gaseous working fluid in the pipeline can be returned to the evaporation chamber along the pipeline.
  • the above modules can be implemented by software or hardware, and the latter can be implemented by the following methods, but not limited to this: the above modules are all located in the same processor; or, the above modules can be combined in any combination The forms are located in different processors.
  • modules or steps of the present application can be implemented by a general-purpose computing device, they can be concentrated on a single computing device, or distributed in a network composed of multiple computing devices Above, optionally, they can be implemented with program code executable by the computing device, so that they can be stored in the storage device to be executed by the computing device, and in some cases, can be in a different order than here
  • the steps shown or described are performed, or they are made into individual integrated circuit modules respectively, or multiple modules or steps among them are made into a single integrated circuit module to achieve. In this way, this application is not limited to any specific combination of hardware and software.

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Abstract

本申请提供了一种散热装置及方法，该装置包括：第一散热器，连接至待散热设备，用于传导待散热设备产生的热量，待散热设备中包括至少一个发热器件；第二散热器，固定于第一散热器上，该第二散热器包括至少一个散热结构，各散热结构与至少一个发热器件相接触；各散热结构中设置有散热通道，该散热通道的蒸发区域存储有工质；散热通道被设置为将工质吸收发热器件产生的热量之后形成的气态工质传导至散热通道的冷凝区域，以及将冷凝区域中的气态工质冷凝后形成的液态工质回传至蒸发区域，采用上述方案，可以实现对发热器件高效散热；在保证高效散热的基础上，无需过度增大第一散热器的体积，从而解决了产品笨重，生产难度和成本高等的问题。

Description

散热装置及方法 技术领域
本申请涉及但不限于电子设备领域，具体而言，涉及一种散热装置及方法。
背景技术
在相关技术中，电子产品中芯片温度过高会影响其性能和寿命，芯片散热是限制电子技术水平进步的瓶颈之一；在通讯基站产品中，为了确保芯片散热通畅，芯片通过贴壳将热量传导至整机金属外壳，外壳作为散热器通过自然散热方式将热量传导至环境。
第五代移动通信(5G通信)系统多天线、高集成、大容量、高速率的发展趋势，使得通讯基站形态从原来的远端射频模块(Remote Radio Unit，简称为RRU)向大尺寸的有源天线处理单元(Active Antenna Unit，简称为AAU)产品方向发展。但是，5G AAU产品采用的是自然散热的方式，当5G AAU产品的高度尺寸从原来的300-400mm增大到800-1000mm后，上下气流的热级联问题非常严重，大大削弱了自然散热效率。为了有效解决热级联问题，散热齿通常采用特定的V形布局。
5G AAU产品中，现场可编程门阵列(Field-Programmable Gate Array，简称为FPGA)、调制与编码策略(Modulation and Coding Scheme，简称为MCS)等高热耗、高功率密度的芯片，是整机的散热瓶颈，往往由于散热不畅，容易在印制电路板(Printed Circuit Board，简称为PCB)板和散热器上形成局部热点，该局部热点会导致分布在其周围的芯片工作温度较高，从而造成整机的散热能力下降。目前，解决这种局部热点问题的常用的一种方式是：引入均温材料将局部热点的热量传导至低温区，但是这种方式不仅效果有限且成本较高。另一种方式是：通过提高散热器体积，来增加散热面积，但是这种方式会造成产品笨重，生产难度和成本显著增加。
发明内容
本申请实施例提供了一种散热装置及方法，以至少解决相关技术中电子设备的发热器件不能高效散热的问题。
根据本申请的一个实施例，提供了一种散热装置，包括：第一散热器，连接至待散热设备，用于传导所述待散热设备产生的热量，其中，所述待散热设备中包括至少一个个发热器件；第二散热器，固定于所述第一散热器上，所述第二散热器包括至少一个散热结构，各所述散热结构与至少一个所述发热器件相接触；并且，各所述散热结构中设置有散热通道，所述散热通道的蒸发区域存储有工质；所述散热通道被设置为将所述工质吸收所述发热器件产生的热量之后形成的气态工质传导至所述散热通道的冷凝区域，以及将所述冷凝区域中的所述气态工质冷凝后形成的液态工质回传至所述蒸发区域。
根据本申请的另一个实施例，还提供了一种散热方法，采用本申请的一个实施例提供的上述散热装置传导待散热设备产生的热量，所述待散热设备中包括一个或多个发热器件；所述散热方法包括：
利用所述散热通道的蒸发区域中存储的工质吸收至少一个所述被发热器件产生的热量；
将所述工质吸收所述热量之后形成的气态工质传导至所述散热通道的冷凝区域，以及将所述冷凝区域中的所述气态工质冷凝后形成的液态工质回传至所述蒸发区域。
本申请提供的散热装置及方法的技术方案，第一散热器上设置有独立的第二散热器，该第二散热器直接与芯片等发热量大的发热器件连接，且第二散热器的各散热结构与至少一个发热器件相接触，散热通道的蒸发区域中的液态工质可以吸收发热器件产生的热量，并转换为气态工质扩散至冷凝区域中，该气态工质在冷凝后转换为液体工质又回落至散热通道的蒸发区域中，从而实现了循环散热过程。由此，通过在第一散热器的基础上增设第二散热器，一方面，可以提高散热效率，实现对电子设备中的发热器件进行高效散热；另一方面，在保证高效散热的基础上，无需过度增大第一散热器的体积，从而解决了产品笨重，生产难度和成本高等的问题。
附图说明
此处所说明的附图用来提供对本申请的进一步理解，构成本申请的一部分，本申请的示意性实施例及其说明用于解释本申请，并不构成对本申请的不当限定。在附图中：
图1a是根据本申请实施例提供的散热装置的结构示意图；
图1b是根据本申请另一个实施例提供的散热装置的结构示意图；
图2是根据本申请另一个实施例提供的散热装置的结构图；
图3是根据本申请实施例提供的散热方法流程图。
具体实施方式
下文中将参考附图并结合实施例来详细说明本申请。需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。
需要说明的是，本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。
本申请文件的方案可以应用于相关技术中的电子设备，例如5G AAU产品中，或者其他芯片等发热量大的电子设备，但是不局限于此。
实施例一
根据本申请的一个实施例，提供了一种散热装置，图1a是根据本申请实施例提供的散热装置的结构示意图，如图1a所示，该散热装置包括：第一散热器11和第二散热器14。其中，第一散热器11连接至待散热设备12，用于传导该待散热设备12产生的热量。待散热设备12中包括至少一个发热器件13。
第二散热器14固定于第一散热器11上，该第二散热器14包括至少一个散热结构，各散热结构与至少一个发热器件13相接触。并且，各散热结构中设置有散热通道，该散热通道的蒸发区域存储有工质。散热通道被设置为将工质吸收发热器件产生的热量之后形成的气态工质传导至散热通道的冷凝区域，以及将冷凝区域中的气态工质冷 凝后形成的液态工质回传至蒸发区域。
本申请实施例提供的散热装置，其第一散热器11上设置有独立的第二散热器14，该第二散热器14直接与芯片等发热量大的发热器件连接，且第二散热器14的各散热结构与至少一个发热器件13相接触，散热通道的蒸发区域中的液态工质可以吸收发热器件13产生的热量，并转换为气态工质扩散至冷凝区域中，该气态工质在冷凝后转换为液体工质又回落至散热通道的蒸发区域中，从而实现了循环散热过程。由此，通过在第一散热器11的基础上增设第二散热器14，一方面，可以提高散热效率，实现对电子设备中的发热器件13进行高效散热；另一方面，在保证高效散热的基础上，无需过度增大第一散热器11的体积，从而解决了产品笨重，生产难度和成本高等的问题。
在本实施例中，各散热结构均包括构成上述散热通道的蒸发腔141和管路142。其中，蒸发腔141与至少一个发热器件13相接触，且蒸发腔141中存储有工质，该工质可以丙酮、去离子水等。蒸发腔141的内部空间即用作上述散热通道的蒸发区域。
管路142与蒸发腔141相连通，用于传导蒸发腔141中存储的工质被加热之后形成的气态工质，和该气态工质被冷凝后形成的液态工质。管路142的能够冷凝气态工质的部分即用作上述散热通道的冷凝区域。
由于蒸发腔141与至少一个发热器件13相接触，蒸发腔141中的液态工质可以吸收发热器件13产生的热量，并转换为气态工质扩散至管路142中，而管路142中的气态工质在冷凝后转换为液体工质又回落至蒸发腔141中，从而实现了循环散热过程。
可选的，管路142可以与地面呈一定角度，而不与地面平行，例如，管路142与地面垂直，这样，可以使蒸发腔141中存储的工质被加热之后形成的气态工质更容易沿管路142上升，还可以使管路142中的气态工质在转换为液态工质后能够在重力作用下自行回落至蒸发腔141中，该液态工质可以顺着管路142的内壁流下。
可选的，第二散热器14的各散热结构的与至少一个发热器件13相接触的接触部分位于第一散热器11之外，而各散热结构的除该接 触部分之外的其余部分内置于第一散热器11中。这样，第二散热器14不会额外占用空间，从而可以使第一散热器11和第二散热器14的总体积等于第一散热器11的体积，进而在保证高效散热的基础上，无需过度增大第一散热器11的体积，从而解决了产品笨重，生产难度和成本高等的问题。
当然，在实际应用中，第二散热器14也可以设置在第一散热器11的外部。
可选的，第一散热器11的结构可以为一金属体，而第二散热器14的各散热结构为设置在该金属体中的一金属散热管道，该管道的固定方式可以包括焊接等方式。
在实际应用中，发热器件13可以是芯片等发热量大的电子器件，而且对于发热器件13为多个的情况，第二散热器14的一个散热结构可以对应一个发热器件13进行散热，或者一个散热结构也可以同时对多个发热器件13进行散热，或者前述两种情况还可以同时存在。
在实际应用中，第一散热器11可以是相关技术中为电子设备设置的散热器。该第一散热器11可以是相关技术中常用的散热器，或者也可以根据具体情况专门设计，本申请对此没有特别的限制。
可选地，第一散热器11的外部分布有多个第一散热齿，用以增大散热器的表面积，从而加大散热面积，进一步提高散热效率。
可选地，管路142的外部分布有第二散热齿，该第二散热齿的结构和诸如分布密度等的布局方式可以与分布在第一散热器11外部的第一散热齿的结构和分布方式相适配，以使得管路142外部的第二散热齿不会影响第一散热器11形成的散热布局，而是尽可能的融入第一散热器11的散热布局。
可选的，管路142的内表面为采用光滑处理形成的表面，以减少气态工质或液态工质的传导阻力。
可选地，在蒸发腔141的腔壁中，且与管路142相对应的位置处设置有通孔，用以将蒸发腔141与管路142连通，该通孔的内径与管路142的内径相同，从而对工质的流动不形成任何阻挡。
可选地，在蒸发腔141上，且与发热器件13相对的一侧设置有 凸台，该凸台与至少一个发热器件13相接触，该凸台的接触面积不小于发热器件13的表面积。为了减小接触热阻，在发热器件13的表面附着一层导热界面材料，并且在发热器件13与凸台相接触的表面之间填充有导热材料。
可选地，蒸发腔141为长方体或者半球体，或者是其他形状的空腔体。
下面结合本申请另一个实施例进行说明。
本申请另一个实施例中涉及一种用于电子设备散热的装置，尤其涉及通讯领域的第5代移动通信系统中的有源天线处理单元(Active Antenna Unit，简称为AAU)等的大尺寸自然散热产品中大热耗、高功率密度器件的散热。
为确保基站在室外恶劣气候条件下稳定可靠工作，一般都选择无运动部件、自然散热等的散热方式。AAU产品中，芯片通过贴壳将热量传导至整机散热器，该散热器再通过自然散热方式将热量传导至环境。
5G通讯高集成、大容量的发展趋势，使得通讯基站形态从RRU向大尺寸的AAU产品方向发展。AAU系统中，存在多颗大热耗、高功率密度的芯片，这些芯片通常是散热瓶颈器件，容易在PCB板和散热器上形成局部热点，该局部热点会导致分布在其周围的芯片工作温度较高；对于竖立安装的设备，还会导致严重的热级联效应，从而造成整机的散热能力下降。
本申请作为一种独立于整机散热器的散热装置，能够将高热耗的瓶颈器件的热量导出，避免瓶颈器件造成局部热点；本装置的结构形式与系统具有较好的融合性，不与设备散热器的散热通路产生干涉；该装置由于整体结构形式简单，生产成本较低。同时，使用本装置，有效消除了散热瓶颈，显著提升了5G AAU大尺寸设备的散热效率。
本申请另一个实施例提供的散热装置解决的技术问题包括但不限于：
1)解决大热耗、高功率密度芯片的散热问题；
2)消除系统中的局部热点。
本申请另一个实施例提供的散热装置采用的核心技术手段包括但不限于：
1)对大热耗、高功率密度芯片独立散热；
2)利用热管原理将热量导出设备，消除局部热点；
3)热管上嵌套高密齿，强化散热；
4)高密齿型可根据AAU散热器齿型调整，不对设备的散热器的流道产生干涉；
5)冷凝工质依靠重力驱动回流，冷、热工质在同一管路中流动形成循环，整体结构形式简单。
图1b是根据本申请另一个实施例提供的散热装置的结构示意图，如图1b所示，散热装置包括独立散热器A，该独立散热器A的具体结构如图1b中图(a)所示，独立散热器A具有一列“V”型散热齿，该独立散热器A固定到具有“V”型散热齿的散热器B上，固定方式包括图1b中图(b)和图(c)所示意的两种方式，具体地，第一种方式如图1b中图(b)所示，独立散热器A设置在散热器B的外部；第二种方式如图1b中图(c)所示，独立散热器A设置在散热器B的内部。独立散热器A与散热器B的连接方式可以包括但不限于螺钉紧固、粘贴、焊接的工艺。
独立的散热器A的冷端设置有充满工质的蒸发腔，该蒸发腔通过壁面与发热器件外壳充分接触，热量通过壁面传递给蒸发腔内的液态工质，工质吸热汽化，在压力的驱动下携带热量进入与蒸发腔连通的竖直管路，热量被导出设备外部。
汽化工质在竖直管路内自底部向顶部流动，逐渐释放热量凝结，并在重力作用下回流至蒸发腔。
嵌套在管路上的高密散热齿，确保散热器与环境有足够的接触面积，从而使热量通过自然对流充分散失到环境中。
竖直管路的诸如长度、管径等的尺寸参数与发热器件的热耗匹配，以确保汽化工质流动顺畅，放热充分。而且，通过使竖直管路的轴线沿竖直方向设置，可以保证冷凝后的工质能够依靠重力沿管壁回 流。
独立的散热器A上的高密散热齿能够加大散热器的换热面积，该散热齿的数量、形状等的参数与散热器B的散热齿的相应参数相匹配，从而与散热器B的“V”型通道融合，不干涉散热通道，确保散热器B气流通畅。
同一设备上，可以多个发热器件共用一个独立散热器A，也可以根据发热器件数量使用多个独立散热器A。
本申请另一个实施例提供的散热装置记载了以下技术方案：
1)利用独立散热器将大热耗器件热量导出整机外部；
2)独立散热器工质流通管路内没有毛细结构，内表面充分光滑，通过竖直安装，利用重力驱动冷凝工质回流，气液两相在同一管路中流动形成循环；
3)工质流通管路的管径、长度与器件发热量相匹配，确保工质流动顺畅，热交换充分；
4)工质流通管路上嵌接有高密齿，增大散热面积，强化散热；
5)高密齿的齿型与整机散热器齿型相匹配，不干涉散热流道。
需要补充的是，因应用场景不同，工质流通管路的轴线可以与竖直方向有一定夹角；该装置的应用场景不限于散热齿“V’型布局散热器，也可以在直齿、斜齿或其他形式的散热器上应用；高密散热齿的数量、形状应该与应用场景相匹配，具体形式不做具体限制；独立散热器可以没有散热齿，工质流通管路镶嵌在整机散热器的散热齿上，与整机散热器融为一体；
图2是根据本申请另一个实施例提供的散热装置的结构图，如图2所示，标号1为芯片，标号2为蒸发腔，标号3为管路，标号4为散热齿，标号5为凸台。
本实施例提供的散热装置由蒸发腔2、管路3、散热齿4和凸台5组成。蒸发腔2是一个长方体空腔，作为蒸发段；蒸发腔一侧面通过凸台5与芯片1表面接触，且凸台5的接触面的面积略大于芯片1的表面积，确保接触充分；工质通过蒸发腔2壁面吸收芯片1产生的热量而汽化。蒸发腔2上端面开有一个直径与管路3内径相等的通孔， 通过焊接的方式与管路3连通。蒸汽沿蒸发腔2上端的通孔进入管路3，该管路3给汽化工质一个足够长的上升通道。在管路3上设置有散热齿4，该散热齿4有加大散热面积的作用；管路3与散热齿4共同组成冷凝段，汽化的工质在冷凝段自下而上流动过程中充分放热冷凝。管路3内没有毛细结构，是内表面充分光滑的管体，凝结后的液态工质在重力驱动下流回蒸发段；冷热工质在同一管路中实现循环。
芯片1通过蒸发腔2一侧凸台5与蒸发腔2接触。凸台5的四角各有一个螺纹孔，使用螺钉与螺纹孔配合将芯片1固定在凸台5表面，确保充分接触，热量能够顺畅导给蒸发腔2。为了减小接触热阻，在芯片1表面附着一层导热界面材料。
散热齿4的形状、尺寸不限于图示形式，可根据实际应用需求确定；管路3的截面形状不限于圆形，也可是矩形或其它可用的形状；蒸发腔2的外形不限于长方体，也可是半球体等形式；芯片1与蒸发腔2间的固定方式不限于螺钉固定，也可是粘贴等其它能够确保芯片表面与蒸发腔表面良好接触的形式。
采用上述方案，与相关技术相比，
1)本申请可有效解决大热耗器件的散热，提升5G AAU大尺寸产品单位体积功率密度；
2)对大热耗器件独立散热，消除了设备中的局部热点，避免大量均温材料的引入，降低整机散热器的生产难度和成本。
本申请的方案，有效解决了大热耗器件的散热，提升了大尺寸设备自然散热效率。有效消除大热耗器件在设备中造成的局部热点，避免引入均温材料；有效提升5G AAU类大尺寸自然散热设备散热效率，节省了产品体积，提高了产品竞争力；能够支持更大功率的自然散热设备实现。
通过以上的实施方式的描述，本领域的技术人员可以清楚地了解到根据上述实施例的方法可借助软件加必需的通用硬件平台的方式来实现，当然也可以通过硬件，但很多情况下前者是更佳的实施方式。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分可以以软件产品的形式体现出来，该计算机软件产品存 储在一个存储介质(如ROM/RAM、磁碟、光盘)中，包括若干指令用以使得一台终端设备(可以是手机，计算机，服务器，或者网络设备等)执行本申请各个实施例所述的方法。
实施例二
根据本申请的实施例还提供了一种散热方法，图3是根据本申请实施例的散热方法流程图，如图3所示，该散热方法采用本发明上述各个实施例提供的散热装置传导待散热设备产生的热量，该散热方法包括以下步骤：
步骤S301，利用散热通道的蒸发区域中存储的工质吸收至少一个被发热器件产生的热量；
步骤S302，将工质吸收热量之后形成的气态工质传导至散热通道的冷凝区域，以及将冷凝区域中的气态工质冷凝后形成的液态工质回传至蒸发区域。
本申请实施例提供的散热方法，一方面，可以提高散热效率，实现对电子设备中的发热器件13进行高效散热；另一方面，在保证高效散热的基础上，无需过度增大第一散热器11的体积，从而解决了产品笨重，生产难度和成本高等的问题。
以图1示出的散热装置为例，在步骤S301中，蒸发腔141中的液态工质可以吸收发热器件13产生的热量；在步骤S302中，工质吸收热量之后转换为气态工质扩散至管路142中；管路142中的气态工质在冷凝后转换为液体工质又回落至蒸发腔141中，从而实现了循环散热过程。
第二散热器可以固定于第一散热器上，第一散热器可以是相关技术中发热设备的散热器。
环境即是发热器件的外部空间。
在第一散热器上设置独立的第二散热器，该第二散热器直接与芯片等发热量大的发热器件连接，该第二散热器的蒸发腔与发热器件接触，发热器件将热量传导至蒸发腔中的液态工质，液态工质转换为气态工质并将热量带入管路中散热，散热后气态工质转换为液体工质又回落至蒸发腔，从而实现了循环散热过程。采用上述方案，一方面， 可以提高散热效率，实现对电子设备中的发热器件13进行高效散热；另一方面，在保证高效散热的基础上，无需过度增大第一散热器11的体积，从而解决了产品笨重，生产难度和成本高等的问题。
可选地，当管路中的气态工质冷凝为液态工质后，可沿管路回流至蒸发腔。
需要说明的是，上述各个模块是可以通过软件或硬件来实现的，对于后者，可以通过以下方式实现，但不限于此：上述模块均位于同一处理器中；或者，上述各个模块以任意组合的形式分别位于不同的处理器中。
显然，本领域的技术人员应该明白，上述的本申请的各模块或各步骤可以用通用的计算装置来实现，它们可以集中在单个的计算装置上，或者分布在多个计算装置所组成的网络上，可选地，它们可以用计算装置可执行的程序代码来实现，从而，可以将它们存储在存储装置中由计算装置来执行，并且在某些情况下，可以以不同于此处的顺序执行所示出或描述的步骤，或者将它们分别制作成各个集成电路模块，或者将它们中的多个模块或步骤制作成单个集成电路模块来实现。这样，本申请不限制于任何特定的硬件和软件结合。
以上所述仅为本申请的优选实施例而已，并不用于限制本申请，对于本领域的技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (10)

  1. 一种散热装置，其特征在于，包括：
    第一散热器，连接至待散热设备，用于传导所述待散热设备产生的热量，其中，所述待散热设备中包括至少一个发热器件；
    第二散热器，固定于所述第一散热器上，所述第二散热器包括至少一个散热结构，各所述散热结构与至少一个所述发热器件相接触；并且，各所述散热结构中设置有散热通道，所述散热通道的蒸发区域存储有工质；所述散热通道被设置为将所述工质吸收所述发热器件产生的热量之后形成的气态工质传导至所述散热通道的冷凝区域，以及将所述冷凝区域中的所述气态工质冷凝后形成的液态工质回传至所述蒸发区域。
  2. 根据权利要求1所述的散热装置，其特征在于，各所述散热结构的与至少一个所述发热器件相接触的接触部分位于所述第一散热器之外，而各所述散热结构的除所述接触部分之外的其余部分内置于所述第一散热器中。
  3. 根据权利要求1或2所述的散热装置，其特征在于，各所述散热结构均包括：构成所述散热通道的蒸发腔和管路，其中，
    所述蒸发腔与至少一个所述发热器件相接触，且所述蒸发腔中存储有所述工质；
    所述管路与所述蒸发腔连通，用于传导所述工质吸收热量之后形成的气态工质，以及所述气态工质冷凝后形成的液态工质。
  4. 根据权利要求3所述的散热装置，其特征在于，所述蒸发腔的腔壁中设置有用于将所述蒸发腔与所述管路连通的通孔，所述通孔的内径与所述管路的内径相同。
  5. 根据权利要求3所述的散热装置，其特征在于，所述管路的 外部分布有多个第二散热齿。
  6. 根据权利要求3所述的散热装置，其特征在于，所述管路的内表面为采用光滑处理形成的表面。
  7. 根据权利要求3所述的散热装置，其特征在于，在所述蒸发腔上，且与所述发热器件相对的一侧设置有凸台，所述凸台与至少一个所述发热器件相接触，且在所述凸台与至少一个所述发热器件相接触的表面之间填充有导热材料。
  8. 根据权利要求3所述的散热装置，其特征在于，所述蒸发腔为长方体或者半球体。
  9. 根据权利要求5所述的散热装置，其特征在于，所述第一散热器的外部分布有多个第一散热齿，所述第一散热齿的结构和分布密度与所述第二散热齿的结构和分布密度相适配。
  10. 一种散热方法，其特征在于，采用权利要求1-9任意一项所述的散热装置传导待散热设备产生的热量，所述待散热设备中包括一个或多个发热器件；所述散热方法包括：
    利用所述散热通道的蒸发区域中存储的工质吸收至少一个所述被发热器件产生的热量；
    将所述工质吸收所述热量之后形成的气态工质传导至所述散热通道的冷凝区域，以及将所述冷凝区域中的所述气态工质冷凝后形成的液态工质回传至所述蒸发区域。
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