WO2020133780A1 - 一种柔性oled显示面板及其制备方法 - Google Patents

一种柔性oled显示面板及其制备方法 Download PDF

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Publication number
WO2020133780A1
WO2020133780A1 PCT/CN2019/080884 CN2019080884W WO2020133780A1 WO 2020133780 A1 WO2020133780 A1 WO 2020133780A1 CN 2019080884 W CN2019080884 W CN 2019080884W WO 2020133780 A1 WO2020133780 A1 WO 2020133780A1
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Prior art keywords
layer
bending
light
emitting area
water blocking
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French (fr)
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杨中国
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to the technical field of light-emitting display, in particular, a flexible OLED display panel and a preparation method thereof.
  • small-sized flexible OLED panels are gradually mature and mass-produced, but they cannot be repeatedly folded many times with a small radius of curvature. Moreover, for the folded OLED, the radius of curvature at the folded place is very small, therefore, this puts forward higher requirements for the packaging of small-sized flexible OLED panels.
  • the packaging technology of small-sized flexible OLED panels that have been mass-produced is mainly thin film packaging + surface sealing (TFE+Face Seal).
  • TFE+Face Seal thin film packaging + surface sealing
  • low temperature PECVD or PEALD is used to deposit SiN x , SiON, SiO x and Al 2 O 3 etc. act as a water vapor barrier layer.
  • the thickness of the water vapor barrier layer deposited in the PECVD process is more than 500nm. Due to its thick thickness and many pinholes in the film layer, it is repeated 100000 times and the radius of curvature is less than 1mm. When folded, the water vapor barrier at the folded place is prone to cracks, thereby allowing water vapor to invade.
  • the folded area is located in the light-emitting area, that is, the substrate in the folded area is provided with a TFT layer and an OLED device layer, then when the barrier layer of the folded area is When the folding area is bent multiple times to generate cracks, external water vapor can quickly invade the inside of the panel through the encapsulation layer through these cracks, and then invade the TFT layer and the OLED device layer, which will make the TFT and OLED devices face Severe tests, even in severe cases, can even invalidate device functions.
  • One aspect of the present invention is to provide a new type of flexible OLED display panel, which adopts a new structure of a light-emitting area and a folding area, and the folding area does not appear cracks and defects after multiple bendings, thereby avoiding external moisture due to the Crack flaws invade the light-emitting area.
  • a flexible OLED display panel includes a PI layer, and a light-emitting area and a bending area are provided on the PI layer.
  • the light-emitting area includes a first light-emitting area and a second light-emitting area, and the bending area is disposed between the first light-emitting area and the second light-emitting area.
  • the first light-emitting area and the second light-emitting area both include a TFT layer disposed on the PI layer, each TFT layer is provided with an OLED device layer and a thin film encapsulation layer disposed thereon, and the bending area It includes a bending layer provided on the PI layer.
  • the bending area is only provided with a bending layer for bending, and no water blocking layer in the thin film encapsulation layer is provided, so that there are no multiple bendings caused by itself.
  • the water blocking layer has cracks and defects.
  • the bending layer provided in the bending region is flush with the surface of the thin film encapsulation layer, and the thin film encapsulation layer includes a buffer layer and a water blocking layer.
  • the material used for the bending layer includes a resin material. It may be one of epoxy resin, acrylic resin, polyurethane resin, polypropylene resin, etc., and it may be determined according to need without limitation.
  • the material used for the bending layer is coated on the PI layer by ink jet printing (Ink Jet Printing).
  • the material of the water blocking layer of the thin-film encapsulation layer includes one of SiN x , SiO x , SiON, Al 2 O 3 and the like, and the preparation method includes low-temperature PECVD and/or Or PEALD deposition process.
  • the material used for the buffer layer of the thin film encapsulation layer includes a polymer material, which may be one of polymer materials such as epoxy resin, acrylic resin, acrylic, etc. However, there is no limit.
  • the buffer layer is prepared by inkjet printing (Ink Jet Printing).
  • the water blocking layer includes a first water blocking layer, a second water blocking layer and a third water blocking layer, wherein the buffer layer is located between the second water blocking layer and the third Between water blocking layers.
  • the first water blocking layer wraps the OLED device layer inside
  • the second water blocking layer wraps the first water blocking layer inside
  • the third water blocking layer wraps the buffer layer inside, and is connected to the second water blocking layer outside the side of the buffer layer.
  • a flexible barrier film is further provided on the surface of the flexible OLED display panel, wherein the flexible barrier film includes a PEN or COP substrate and a layer of SiN x and SiO x disposed thereon , SiON, Al 2 O 3 and other materials composed of water blocking layer.
  • the flexible barrier film includes a PEN or COP substrate and a layer of SiN x and SiO x disposed thereon , SiON, Al 2 O 3 and other materials composed of water blocking layer.
  • the flexible barrier film includes a PEN or COP substrate and a layer of SiN x and SiO x disposed thereon , SiON, Al 2 O 3 and other materials composed of water blocking layer.
  • Another aspect of the present invention is to provide a manufacturing method for manufacturing the flexible OLED display panel according to the present invention, including the following steps:
  • a glass substrate is provided, and a PI liquid is coated thereon to form a PI layer, and a first TFT layer and a second TFT layer are formed on the PI layer at intervals, wherein the first TFT layer region and the second TFT layer
  • the area is a first light-emitting area and a second light-emitting area, and the area between the first light-emitting area and the second light-emitting area is a bending area;
  • a resin material is coated on the PI layer in the bending zone, and cured by UV or heating to form a bending layer.
  • the preparation of the thin-film encapsulation layer includes the following steps:
  • a first water blocking layer is made by low temperature PEALD or PECVD partitioning
  • a second layer of water blocking layer is made by low temperature PEALD or PECVD partitioning;
  • a third water blocking layer is formed on the buffer layer by low temperature PECVD or PEALD partitioning.
  • the invention relates to a flexible OLED display panel.
  • it divides the light into a plurality of spaced sub light emitting areas.
  • the bending area connects two adjacent sub-light-emitting areas, wherein the portion of the bending area is not provided with TFT and OLED devices and corresponding thin-film encapsulation layers, instead of a bending layer dedicated to folding; meanwhile, the light-emitting area A barrier layer and a buffer layer for preventing the intrusion of external water vapor are deposited for the reference zone, that is, the bending area is not provided with a thin film packaging structure, so that when the bending area is folded, there is no problem that the thin film packaging structure is damaged At the same time, the thin film packaging structure of the light-emitting area is intact, so there is no problem of being invaded by external water vapor.
  • the bending layer in the bending area is composed of a folding-resistant resin material, which can well release the stress during bending, thereby ensuring the folding durability of the bending area.
  • FIG. 1 is a schematic structural diagram of a flexible OLED display panel according to an embodiment of the present invention.
  • FIG. 2 is a flow chart of steps involved in preparing the flexible OLED display panel according to another embodiment of the present invention.
  • FIG. 3 is a schematic structural view after step 1 in the process shown in FIG. 2;
  • FIG. 4 is a schematic diagram of the structure after step 2 in the process shown in FIG. 2;
  • FIG. 5 is a schematic structural view after step 3 in the process shown in FIG. 2;
  • FIG. 6 is a schematic structural diagram after step 4 in the process shown in FIG. 2;
  • FIG. 7 is a schematic structural diagram after step 5 in the process shown in FIG. 2;
  • FIG. 8 is a schematic diagram of the structure after step 6 in the process shown in FIG. 2;
  • step 8 is a schematic structural diagram after step 8 in the process shown in FIG. 2;
  • FIG. 10 is a schematic diagram of the structure after step 9 in the process shown in FIG. 2;
  • FIG. 11 is a schematic structural diagram after step 10 in the process shown in FIG. 2.
  • an embodiment of the present invention provides a flexible OLED display panel, including a PI layer 2.
  • the PI layer 2 is provided with a light emitting area and a bending area.
  • the light-emitting area includes a first light-emitting area and a second light-emitting area, and the bending area is disposed between the first light-emitting area and the second light-emitting area.
  • the first light-emitting area and the second light-emitting area both include a TFT layer 3 provided on the PI layer, and each TFT layer 3 is provided with an OLED device layer 4 and a thin film encapsulation layer provided thereon.
  • the thin film encapsulation layer includes a first water blocking layer 5, a second water blocking layer 6, a buffer layer 7 and a third water blocking layer 8, wherein the buffer layer 7 is located on the second water blocking layer 6 and the third Between the water blocking layer 8.
  • the bending layer 9 provided in the bending area is flush with the surface of the thin film encapsulation layer.
  • the first water blocking layer 5 wraps the OLED device layer 4 inside, and the second water blocking layer 6 wraps the first water blocking layer 5 inside.
  • the third water blocking layer 8 wraps the buffer layer 7 inside, and is connected to the second water blocking layer 6 outside the side of the buffer layer 7.
  • the material used for the bending layer 9 includes a resin material. It may be one of epoxy resin, acrylic resin, polyurethane resin, polypropylene resin, etc., and it may be determined according to need without limitation.
  • the material used for the water blocking layer of the thin-film encapsulation layer includes one of SiN x , SiO x , SiON, Al 2 O 3 and the like.
  • the material used for the buffer layer of the thin-film encapsulation layer includes a polymer material, which may be one of polymer materials such as epoxy resin, acrylic resin, acrylic, etc. The specifics may be determined according to needs and are not limited.
  • the upper and lower surfaces of the flexible OLED display panel are respectively provided with flexible barrier films 10 and 11, wherein the flexible barrier film includes a PEN or COP substrate and a layer of SiN x , SiO x and SiON , Al 2 O 3 and other materials composed of water blocking layer.
  • the area of the flexible barrier film 10 located on the upper surface of the flexible OLED display panel is larger than that of the second water barrier layer 6, and the entirety of the first light-emitting area and the second light-emitting area are encapsulated therein.
  • FIG. 2 Another embodiment of the present invention provides a method for manufacturing the flexible OLED display panel according to the present invention, which includes the process steps, please refer to FIG. 2.
  • the step 1 coating a PI liquid on a provided glass substrate 1 to form a PI layer 2 and forming a spaced TFT layer 3 in a panel of the PI layer 2 to provide a flexible TFT substrate, which Please refer to Figure 3 for structure diagram;
  • Step 2 Manufacture the OLED device layer 4 of the first light-emitting area and the second light-emitting area on the corresponding TFT area on the flexible TFT substrate, wherein a bending area is formed between the first light-emitting area and the second light-emitting area, Please refer to Figure 4 for the structure diagram;
  • Step 3 On top of the OLED device layer 4, use a low temperature PEALD or PECVD partition to make the first water blocking layer 5, the structure of which is shown in FIG. 5;
  • Step 4 On the first water-blocking layer 5, a second layer of water-blocking layer 6 is made by low-temperature PEALD or PECVD partitioning.
  • PEALD low-temperature PEALD or PECVD partitioning.
  • Step 5 Make a buffer layer 7 with TFE IJP above the second water-blocking layer 6, the buffer layer 7 is also coated in sections, and the TFE Ink is cured by UV.
  • the structure diagram please refer to FIG. 7 ;
  • Step 6 Use a low-temperature PECVD or PEALD partition on the buffer layer 7 to fabricate the third water-blocking layer 8.
  • FIG. 8 For the structure diagram, please refer to FIG. 8;
  • Step 7 Steps 3-6 can be repeated as many times as needed, the specifics can be determined according to the needs, and there is no limit;
  • Step 8 Apply the folding-resistant material to the bending area by IJP, and cure it into a layered bending layer 9 by UV or heating.
  • FIG. 9 For the structure diagram, please refer to FIG. 9;
  • Step 9 Provide a flexible barrier film (Cover Barrier Flim) 10, attach it to the upper side of the first light-emitting area, the bending area and the second light-emitting area, the bonding method adopts roller-to-roller bonding or vacuum bonding. 10 shown;
  • Step 10 Cutting the Panel to separate the PI layer 2 from the glass substrate 1, please refer to FIG. 11 for the structure diagram;
  • Step 11 Finally, another flexible barrier film (Bottom Barrier) is attached to the lower side of the PI layer 2 flim) 11.
  • the laminating method adopts roller-to-roller lamination or vacuum lamination. After curing, the packaging of the display panel is completed.
  • FIG. 1 For the structure diagram, please refer to FIG. 1.
  • the invention relates to a flexible OLED display panel.
  • it divides the light into a plurality of spaced sub light emitting areas.
  • the bending area connects two adjacent sub-light-emitting areas, wherein the portion of the bending area is not provided with TFT and OLED devices and corresponding thin-film encapsulation layers, instead of a bending layer dedicated to folding; meanwhile, the light-emitting area A barrier layer and a buffer layer for preventing the intrusion of external water vapor are deposited for the reference zone, that is, the bending area is not provided with a thin film packaging structure, so that when the bending area is folded, there is no problem that the thin film packaging structure is damaged At the same time, the thin film packaging structure of the light-emitting area is intact, so there is no problem of being invaded by external water vapor.
  • the bending layer in the bending area is composed of a folding-resistant resin material, which can well release the stress during bending, thereby ensuring the folding durability of the bending area.

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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
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Abstract

本发明提供了一种柔性OLED显示面板，包括PI层，所述PI层上设置有发光区和弯折区。其中所述发光区包括第一发光区和第二发光区，所述弯折区设置在所述第一发光区和第二发光区之间。其中所述第一发光区、第二发光区均包括设置在所述PI层上的TFT层，每一TFT层上设置有OLED器件层和其上设置的薄膜封装层，而所述弯折区包括设置在所述PI层上的弯折层。其中所述弯折区只设置用于弯折的弯折层，而不设置所述薄膜封装层中的阻水层，从而也就不存在因其自身的多次弯折而导致其内设置的所述阻水层出现裂缝瑕疵的问题。

Description

一种柔性OLED显示面板及其制备方法 技术领域
本发明涉及发光显示技术领域，尤其是，其中的一种柔性OLED显示面板及其制备方法。
 背景技术
已知，随着柔性OLED显示面板技术的不断向前发展，柔性可折叠产品已开始逐渐慢慢进入市场，并且因其可折叠性能，使得其显示面板能够调节大小，需要时展开显示，显示区域大；不需要时，折叠放置，收容空间小，从而使得其有成为市场主流的趋势。
目前，小尺寸柔性OLED面板逐步成熟并量产，但其不能以较小的曲率半径进行重复多次的折叠。而且，对于折叠式OLED来说，其折叠处的曲率半径非常小，因此，这对小尺寸柔性OLED面板的封装提出了更高的要求。
进一步的，已量产的小尺寸柔性OLED面板的封装技术主要是薄膜封装+面贴合封装(TFE+Face Seal)，其薄膜封装中会用低温PECVD或PEALD沉积SiN x、SiON、SiO x和Al 2O 3等作为水汽阻挡层。为了获得较好的封装效果，其中PECVD制程沉积的水汽阻挡层的厚度都在500nm以上，由于其厚度较厚，且膜层中有较多针孔，在进行重复100000次、曲率半径小于1mm的折叠时，折叠处的所述水汽阻挡层容易产生裂纹，从而使水汽侵入。
而且，对于曲率半径小于1mm的折叠式OLED，如果折叠区位于发光区内，即所述折叠区内的基板上设置有TFT层和OLED器件层，那么当所述折叠区的阻挡层因所述折叠区多次弯折而产生裂纹时，外界的水汽能通过这些裂纹很快的通过封装层侵入到面板内部，进而侵入到TFT层和OLED器件层中，这会使得其中的TFT和OLED器件面临严峻的考验，严重时，甚至会使器件功能失效。
因此，确有必要来开发一种新型的柔性OLED显示面板，来克服现有技术中的缺陷。
 技术问题
本发明的一个方面是提供一种新型的柔性OLED显示面板，其采用新型的发光区和折叠区结构设置，其折叠区在多次弯折后不会出现裂缝瑕疵，从而避免外界水汽因所述裂缝瑕疵而侵入到所述发光区内。
 技术解决方案
本发明采用的技术方案如下：
一种柔性OLED显示面板，包括PI层，所述PI层上设置有发光区和弯折区。其中所述发光区包括第一发光区和第二发光区，所述弯折区设置在所述第一发光区和第二发光区之间。其中所述第一发光区、第二发光区均包括设置在所述PI层上的TFT层，每一TFT层上设置有OLED器件层和其上设置的薄膜封装层，而所述弯折区包括设置在所述PI层上的弯折层。其中所述弯折区只设置用于弯折的弯折层，而不设置所述薄膜封装层中的阻水层，从而也就不存在因其自身的多次弯折而导致其内设置的所述阻水层出现裂缝瑕疵的问题。
进一步的，在不同实施方式中，其中所述弯折区设置的弯折层与所述薄膜封装层的表面平齐，所述薄膜封装层包括缓冲层和阻水层。
进一步的，在不同实施方式中，其中所述弯折层采用的材料包括树脂材料。其可以是环氧树脂、丙烯酸树脂、聚氨脂树脂、聚丙烯树脂等等中的一种，具体可随需要而定，并无限定。
进一步的，在不同实施方式中，其中所述弯折层采用的材料是通过喷墨打印(Ink Jet Printing)的方式涂布在所述PI层上。
进一步的，在不同实施方式中，其中所述薄膜封装层的阻水层采用的材料包括SiN x、SiO x、SiON、Al 2O 3等材料中的一种，其制备方式包括低温PECVD和/或PEALD沉积制程。
进一步的，在不同实施方式中，其中所述薄膜封装层的缓冲层采用的材料包括高分子材料，其可以是环氧树脂、丙烯酸树脂、亚克力等高分子材料中的一种，具体可随需要而定，并无限定。其中所述缓冲层的制备方式是通过喷墨打印(Ink Jet Printing)的方式涂布形成。
进一步的，在不同实施方式中，其中所述阻水层包括第一阻水层、第二阻水层和第三阻水层，其中所述缓冲层位于所述第二阻水层和第三阻水层之间。
进一步的，在不同实施方式中，其中所述第一阻水层将所述OLED器件层包裹于内，所述第二阻水层将所述第一阻水层包裹于内。
进一步的，在不同实施方式中，其中所述第三阻水层将所述缓冲层包裹于内，并在所述缓冲层的侧部外与所述第二阻水层相接。
进一步的，在不同实施方式中，其中所述柔性OLED显示面板的表面还设置有柔性阻隔膜，其中所述柔性阻隔膜包括PEN或COP基材以及其上设置的一层由SiN x、SiO x、SiON、Al 2O 3等材料构成的阻水层。具体的，其中所述柔性阻隔膜包括2个，分别设置在所述显示面板的上下表面上。
进一步的，本发明的又一个方面是提供一种用于制备本发明涉及的所述柔性OLED显示面板的制备方法，包括以下步骤：
提供一玻璃基板，在其上涂布PI液形成PI层，并在所述PI层上制作间隔设置的第一TFT层和第二TFT层，其中所述第一TFT层区域和第二TFT层区域为第一发光区和第二发光区，所述第一发光区和第二发光区之间的区域为弯折区；
分别在所述第一TFT层、第二TFT层上制备OLED器件层，在所述OLED器件层上制备薄膜封装层；
在所述弯折区的PI层上涂布树脂材料，通过UV方式或加热方式使其固化形成弯折层。
进一步的，在不同实施方式中，其中所述薄膜封装层的制备包括以下步骤：
在所述第一、第二TFT层上的所述OLED器件层的上方，通过低温PEALD或PECVD分区制作第一层阻水层；
在所述第一层阻水层的上方，通过低温PEALD或PECVD分区制作第二层阻水层；
在所述第二阻水层上方用喷墨打印的方式制作缓冲层；
在所述缓冲层上方通过低温PECVD或PEALD分区制作第三层阻水层。
 有益效果
本发明涉及的一种柔性OLED显示面板，为了避免外界水汽通过因折叠而出现的裂缝瑕疵对其发光区的TFT和OLED器件的伤害，其将发光区分成多个间隔设置的子发光区，用弯折区连接两个相邻的子发光区，其中所述弯折区的部分不设置TFT和OLED器件以及相应的薄膜封装层，取代的是专用于折叠的弯折层；同时，以发光区为基准分区沉积用于防止外界水汽侵入的阻挡层和缓冲层，即所述弯折区不设置薄膜封装结构，如此，当所述弯折区折叠时也就不存在薄膜封装结构被破坏的问题，同时所述发光区的所述薄膜封装结构完好，也就不会存在被外界水汽侵入的问题。
进一步的，所述弯折区内的弯折层采用耐折叠的树脂材料构成，能够很好的释放其弯折时的应力，从而保证所述弯折区的折叠耐久性能。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明的一个实施方式涉及的一种柔性OLED显示面板的结构示意图；
图2为本发明又一个实施方式涉及的制备本发明涉及的所述柔性OLED显示面板的步骤流程图；
图3是图2所示流程中，所述步骤1后的结构示意图；
图4是图2所示流程中，所述步骤2后的结构示意图；
图5是图2所示流程中，所述步骤3后的结构示意图；
图6是图2所示流程中，所述步骤4后的结构示意图；
图7是图2所示流程中，所述步骤5后的结构示意图；
图8是图2所示流程中，所述步骤6后的结构示意图；
图9是图2所示流程中，所述步骤8后的结构示意图；
图10是图2所示流程中，所述步骤9后的结构示意图；
图11是图2所示流程中，所述步骤10后的结构示意图。
 本发明的实施方式
以下将结合附图和实施例，对本发明涉及的一种柔性OLED显示面板及其制备方法的技术方案作进一步的详细描述。
请参阅图1所示，本发明的一个实施方式提供了一种柔性OLED显示面板，包括PI层2。所述PI层2上设置有发光区和弯折区。其中所述发光区包括第一发光区和第二发光区，所述弯折区设置在所述第一发光区和第二发光区之间。
其中所述第一发光区、第二发光区均包括设置在所述PI层上的TFT层3，每一TFT层3上设置有OLED器件层4和其上设置的薄膜封装层。其中所述薄膜封装层包括第一阻水层5、第二阻水层6、缓冲层7和第三阻水层8，其中所述缓冲层7位于所述第二阻水层6和第三阻水层8之间。所述弯折区设置的弯折层9与所述薄膜封装层的表面平齐。
其中所述第一阻水层5将所述OLED器件层4包裹于内，所述第二阻水层6将所述第一阻水层5包裹于内。其中所述第三阻水层8将所述缓冲层7包裹于内，并在所述缓冲层7的侧部外与所述第二阻水层6相接。
其中所述弯折层9采用的材料包括树脂材料。其可以是环氧树脂、丙烯酸树脂、聚氨脂树脂、聚丙烯树脂等等中的一种，具体可随需要而定，并无限定。其中所述薄膜封装层的阻水层采用的材料包括SiN x、SiO x、SiON、Al 2O 3等材料中的一种。其中所述薄膜封装层的缓冲层采用的材料包括高分子材料，其可以是环氧树脂、丙烯酸树脂、亚克力等高分子材料中的一种，具体可随需要而定，并无限定。
其中所述柔性OLED显示面板的上、下表面还分别设置有柔性阻隔膜10、11，其中所述柔性阻隔膜包括PEN或COP基材以及其上设置的一层由SiN x、SiO x、SiON、Al 2O 3等材料构成的阻水层。具体的，其中位于所述柔性OLED显示面板上表面的柔性阻隔膜10的区域大于所述第二阻水层6，并将所述第一发光区和第二发光区整个包覆其中。
进一步的，本发明的又一实施方式提供了一种制备本发明涉及的所述柔性OLED显示面板的制备方法，其包括的流程步骤，请参阅图2所示。
其中，所述步骤1：在提供的一玻璃基板1上涂布PI液形成PI层2，在所述PI层2的一个Panel里面分区制作间隔设置的TFT层3，从而提供柔性TFT基板，其结构图示请参阅图3所示；
步骤2：在所述柔性TFT基板上对应的TFT区域分区制作第一发光区和第二发光区的OLED器件层4，其中所述第一发光区和第二发光区之间为弯折区，其结构图示请参阅图4所示；
步骤3：在所述OLED器件层4的上方，用低温PEALD或PECVD分区制作第一层阻水层5，其结构图示请参阅图5所示；
步骤4：在所述第一层阻水层5的上方，用低温PEALD或PECVD分区制作第二层阻水层6，其结构图示请参阅图6所示；
步骤5：在所述第二阻水层6上方用TFE IJP制作缓冲层7，所述缓冲层7也是分区涂布，并通过UV方式使TFE Ink固化，其结构图示请参阅图7所示；
步骤6：在所述缓冲层7上方用低温PECVD或PEALD分区制作第三阻水层8，其结构图示请参阅图8所示；
步骤7：可根据实际需要重复步骤3-6多次，具体可随需要而定，并无限定；
步骤8：通过IJP方式在所述弯折区涂布耐折叠材料，并通过UV或加热使其固化成层状弯折层9，其结构图示请参阅图9所示；
步骤9：提供柔性阻隔膜(Cover Barrier Flim)10，将其贴合在所述第一发光区、弯折区和第二发光区的上侧，贴合方式采用滚轮对滚轮方式贴合或真空贴合，其结构图示请参阅图10所示；
步骤10：切割Panel，将所述PI层2与所述玻璃基板1分离，其结构图示请参阅图11所示；
步骤11：最后在所述PI层2下侧贴合又一柔性阻隔膜（Bottom Barrier flim）11，贴合方式采用滚轮对滚轮方式贴合或真空贴合，固化后完成所述显示面板的封装，其结构图示请参阅图1所示。
本发明涉及的一种柔性OLED显示面板，为了避免外界水汽通过因折叠而出现的裂缝瑕疵对其发光区的TFT和OLED器件的伤害，其将发光区分成多个间隔设置的子发光区，用弯折区连接两个相邻的子发光区，其中所述弯折区的部分不设置TFT和OLED器件以及相应的薄膜封装层，取代的是专用于折叠的弯折层；同时，以发光区为基准分区沉积用于防止外界水汽侵入的阻挡层和缓冲层，即所述弯折区不设置薄膜封装结构，如此，当所述弯折区折叠时也就不存在薄膜封装结构被破坏的问题，同时所述发光区的所述薄膜封装结构完好，也就不会存在被外界水汽侵入的问题。
进一步的，所述弯折区内的弯折层采用耐折叠的树脂材料构成，能够很好的释放其弯折时的应力，从而保证所述弯折区的折叠耐久性能。
本发明的技术范围不仅仅局限于上述说明中的内容，本领域技术人员可以在不脱离本发明技术思想的前提下，对上述实施例进行多种变形和修改，而这些变形和修改均应当属于本发明的范围内。

Claims (10)

  1. 一种柔性OLED显示面板，包括PI层；所述PI层上设置有发光区和弯折区；
    其中所述发光区包括第一发光区和第二发光区，所述弯折区设置在所述第一发光区和第二发光区之间；
    其中所述第一发光区、第二发光区均包括设置在所述PI层上的TFT层，每一TFT层上设置有OLED器件层和其上设置的薄膜封装层，而所述弯折区包括设置在所述PI层上的弯折层。
  2. 根据权利要求1所述的柔性OLED显示面板；其中所述弯折区设置的弯折层表面与所述薄膜封装层的表面平齐，所述薄膜封装层包括缓冲层和阻水层。
  3. 根据权利要求1所述的柔性OLED显示面板；其中所述弯折层采用的材料包括树脂材料。
  4. 根据权利要求3所述的柔性OLED显示面板；其中所述弯折层采用的材料是通过喷墨打印的方式涂布在所述PI层上。
  5. 根据权利要求2所述的柔性OLED显示面板；其中所述薄膜封装层的阻水层采用的材料包括SiN x、SiO x、SiON、Al 2O 3等材料中的一种；其中所述薄膜封装层的缓冲层采用的材料包括高分子材料。
  6. 根据权利要求2所述的柔性OLED显示面板；其中所述阻水层包括第一阻水层、第二阻水层和第三阻水层，其中所述缓冲层位于所述第二阻水层和第三阻水层之间。
  7. 根据权利要求6所述的柔性OLED显示面板；其中所述第一阻水层将所述OLED器件层包裹于内，所述第二阻水层将所述第一阻水层包裹于内。
  8. 根据权利要求7所述的柔性OLED显示面板；其中所述第三阻水层将所述缓冲层包裹于内，并在所述缓冲层的侧部外与所述第二阻水层相接。
  9. 根据权利要求1所述的柔性OLED显示面板；其中所述柔性OLED显示面板的表面还设置有柔性阻隔膜，其中所述柔性阻隔膜包括PEN或COP基材以及其上设置的一层阻水层。
  10. 一种制备根据权利要求1所述的柔性OLED显示面板的制备方法，包括以下步骤：
    提供一玻璃基板，在其上涂布PI液形成PI层，并在所述PI层上制作间隔设置的第一TFT层和第二TFT层，其中所述第一TFT层区域和第二TFT层区域为第一发光区和第二发光区，所述第一发光区和第二发光区之间的区域为弯折区；
    分别在所述第一TFT层、第二TFT层上制备OLED器件层，在所述OLED器件层上制备薄膜封装层；
    在所述弯折区的PI层上涂布树脂材料，通过UV方式或加热方式使其固化形成弯折层。
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