WO2020133443A1 - 一种柔性触控传感器及其制作方法、触控装置 - Google Patents

一种柔性触控传感器及其制作方法、触控装置 Download PDF

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Publication number
WO2020133443A1
WO2020133443A1 PCT/CN2018/125717 CN2018125717W WO2020133443A1 WO 2020133443 A1 WO2020133443 A1 WO 2020133443A1 CN 2018125717 W CN2018125717 W CN 2018125717W WO 2020133443 A1 WO2020133443 A1 WO 2020133443A1
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WIPO (PCT)
Prior art keywords
protective layer
film
layer film
conductive film
cover plate
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Ceased
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PCT/CN2018/125717
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English (en)
French (fr)
Inventor
包春贵
陈靖
李贺
曾露
雷晓华
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Shenzhen Royole Technologies Co Ltd
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Shenzhen Royole Technologies Co Ltd
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Priority to PCT/CN2018/125717 priority Critical patent/WO2020133443A1/zh
Priority to CN201880097588.3A priority patent/CN113168247A/zh
Publication of WO2020133443A1 publication Critical patent/WO2020133443A1/zh
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

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  • the present application relates to the field of sensor technology, and in particular to a flexible touch sensor, a manufacturing method thereof, and a touch device.
  • touch sensor As a data input device, touch sensor has been widely used in electronic devices such as smart phones and tablet computers. With the demand for lighter, thinner and bendable performance of electronic products, touch sensors are more and more replaced by flexible touch sensors.
  • Flexible touch sensors are usually formed by stacking multiple layers of structures and have a certain deformability. In some application scenarios, flexible touch sensors need to be bent in order to meet assembly requirements. During the bending process of the existing flexible touch sensor, the flexible touch sensor may delaminate due to excessive bending.
  • the present application aims to provide a flexible touch sensor, a manufacturing method thereof, and a touch device, to solve the technical problem that the traditional flexible touch sensor is easy to delaminate during the bending process.
  • a technical solution adopted by the embodiments of the present application is: to provide a method for manufacturing a flexible touch sensor.
  • the method includes: providing a protective layer film on a conductive film; At least one opening is formed in the protective layer film; at the opening, the conductive film and the protective layer film are bent in a direction away from the cover plate, and the bent The opening.
  • the opening at least one opening in the protective layer film specifically includes: opening at least one opening in the protective layer film along the edge of the cover plate.
  • the number of the openings is at least 2, and the distance between adjacent openings is greater than a preset distance.
  • the sealing the bent opening specifically includes: sealing the bent opening by dispensing.
  • the conductive film includes a connection portion and a flexible protrusion portion, the flexible protrusion portion extends from the connection portion; the protective layer film covers at least a portion of the connection portion and the flexible protrusion portion ; The flexible protrusion protrudes from the edge of the cover plate.
  • the bending the conductive film and the protective layer film in a direction away from the protective layer film specifically includes: covering the portion of the flexible protrusion with the protective layer film and the The flexible protrusion is bent in a direction away from the protective layer film.
  • the conductive film and the protective layer film are bonded by a first optical glue.
  • the cover plate is bonded to the protective layer film through a second optical glue.
  • the method further includes: manufacturing a base substrate on a side of the conductive film away from the protective layer film, the base substrate being connected to the connection portion.
  • the base substrate is bonded to the connection part by a third optical glue.
  • the base substrate is a transparent substrate.
  • a flexible touch sensor including: a conductive film; a protective layer film, the protective layer film is disposed on the conductive film; a cover plate , The cover plate cover is provided on the protective layer film, the conductive film and the protective layer film are bent in a direction away from the cover plate, and the bending position of the protective layer film is different from that of the cover plate
  • a sealing portion is provided for each of the openings to close each of the openings.
  • the flexible touch sensor includes a first adhesive layer, the first adhesive layer is disposed between the conductive film and the protective layer film, and the first adhesive layer converts the conductive The film and the protective layer film are bonded and fixed.
  • the flexible touch sensor includes a second adhesive layer, the second adhesive layer is disposed between the protective layer film and the cover plate, and the second adhesive layer protects the The layer film and the cover plate are bonded and fixed.
  • the conductive film includes a connection portion and a flexible protrusion portion, the flexible protrusion portion extends from the connection portion, and the conductive film is located along the connection between the connection portion and the flexible protrusion portion bending;
  • the flexible touch sensor includes a base substrate, and the connection portion is stacked on the base substrate, and the base substrate is used to provide a supporting force to the connection between the connection portion and the flexible protrusion.
  • the flexible touch sensor includes a third adhesive layer, the third adhesive layer is disposed between the connection portion and the base substrate, and the third adhesive layer connects the connection The portion and the base substrate are bonded and fixed.
  • another technical solution adopted by the embodiments of the present application is to provide a touch device, the touch device including the above-mentioned flexible touch sensor.
  • FIG. 1 is a schematic flow chart of a method for manufacturing a flexible touch sensor provided by an embodiment of the present application
  • FIG. 2 is a schematic flowchart of a method for manufacturing a flexible touch sensor provided by another embodiment of the present application
  • 3a to 3c are schematic structural diagrams of the manufacturing method of the flexible touch sensor shown in FIG. 2 at different manufacturing stages;
  • FIG. 4 is a schematic diagram of the force of the flexible touch sensor obtained by the method for manufacturing the flexible touch sensor shown in FIG.
  • FIG. 5 is a schematic structural diagram of a flexible touch sensor provided by another embodiment of the present application.
  • the flexible touch sensor refers to a sensor formed by laminating a multi-layer structure and having a certain deformability.
  • the portion of the flexible touch sensor that extends beyond the frame needs to be bent to meet the assembly requirements of the narrow frame.
  • the portion of the flexible touch sensor extending beyond the frame will generate internal stress.
  • the internal stress is greater than the adhesive force of the optical glue, it is easy to cause the frame of the flexible touch sensor and the optical glue
  • the formed adhesive layer is delaminated.
  • a manufacturing method of a flexible touch sensor is first provided.
  • the flexible touch sensor obtained by applying the manufacturing method of the embodiment of the present application can avoid delamination of optical glue in a curved state.
  • FIG. 1 is a schematic flowchart of a method for manufacturing a flexible touch sensor provided by an embodiment of the present application. As shown in FIG. 1, the method includes the following steps:
  • Step 11 Set a protective layer film on the conductive film.
  • the conductive film is used to form a touch unit to realize a response to a touch operation generated by a user.
  • the function of the sensor can be realized by setting corresponding functional circuits on the substrate.
  • the functional circuit provided on the conductive film has bending resistance and conductivity, and is formed by depositing a conductive material that can transport and transfer current on the substrate, such as tin-doped indium oxide or graphene.
  • the base material of the conductive film can be made from raw materials such as polyvinyl chloride resin and polybutylene terephthalate.
  • the protective layer film is disposed on the conductive film, and is used to protect the conductive film, to isolate the conductive film from moisture, and to prevent the conductive film from being scratched.
  • the protective layer film can be formed from thermosetting resin and resin composition.
  • the thermosetting resin may be epoxy resin, phenol resin, amino resin, unsaturated polyester resin, polyurethane resin, thermosetting polyimide resin, etc.
  • the resin composition may be a thermoplastic resin.
  • the protective layer film may be disposed on the conductive film in any suitable manner, for example, printing, coating, deposition, adhesive, etc.
  • optical glue can be used as an adhesive to bond the protective layer film to the conductive film.
  • Step 12 Cover the cover film on the protective film.
  • the cover plate is a hard structure covering the protective layer film, and plays a role in protecting the entire flexible touch sensor.
  • the cover plate may be a FRP cover plate, a metal cover plate or a plastic cover plate, etc.
  • a FRP cover plate may be selected from silicate glass .
  • the rigid FRP cover has better anti-corrosion performance and bearing capacity.
  • the cover plate may be covered on the conductive film in any suitable manner, for example, printing, coating, deposition, adhesive, etc.
  • optical glue can be used as an adhesive to bond the cover plate to the conductive film.
  • Step 13 Open at least one opening in the protective layer film.
  • the position of the opening corresponds to a position where the protective layer film needs to be bent later, and it is determined by a person skilled in the art according to the relative position of the protective layer film and the cover plate.
  • the opening can be obtained by forming micro grooves in the protective layer film by punching, laser, etc.
  • the openings may be of any suitable shape, and the number may be one or more.
  • the distance between adjacent openings needs to be greater than a preset distance.
  • the preset distance is an empirical value. It can be determined by the technician according to the actual situation of the sensor (such as size, shape of the opening, number of openings and material of the protective film layer, etc.) through multiple experiments.
  • Step 14 At the opening, bend the conductive film and the protective layer film in a direction away from the cover plate, and seal the bent opening.
  • the conductive film and the protective layer film may generate internal stress at the opening.
  • the protective layer film may be delaminated from the cover plate due to excessive internal stress, and the opening is used to disperse the internal stress of the protective layer film and the conductive film when bending, so as to reduce the internal stress The effect effectively prevents delamination between the cover plate and the protective film.
  • the above-mentioned openings can be obtained by forming micro-grooves in the protective layer film by punching, laser, etc.
  • the protective layer film and the cover plate are bonded by optical glue to form an adhesive layer, and the opening is used to prevent the cover plate and the adhesive layer from delaminating.
  • the protective layer film has an opening, the protection of the conductive film is lost. Therefore, after bending the conductive film and the protective layer film, the opening needs to be sealed to perform protection.
  • FIG. 2 is a flowchart of a method for manufacturing a flexible touch sensor according to another embodiment of the present application. As shown in FIG. 2, the method includes the following steps:
  • Step 21 Set a protective layer film on the conductive film.
  • FIG. 3a illustrates the structure after the protective film is provided on the conductive film.
  • the conductive film 31 includes a connecting portion 311 and a flexible protrusion 312 extending outward from the connecting portion 311.
  • the conductive film 31 is divided into two parts, namely a connecting portion 311 and a flexible protrusion 312, the flexible protrusion 312 may be along the connection of the connecting portion 311 and the flexible protrusion 312, Bent.
  • the protective layer film 32 is disposed on the conductive film 31 and fixedly connected to the conductive film 31 through the first optical glue.
  • the first optical glue can form the first adhesive layer 34 shown in FIG. 3a.
  • the protective layer film 32 covers at least a part of the connection portion 311 and the flexible protrusion portion 312 to cover the surface of the conductive film 31 to prevent the conductive film 31 from being directly exposed to the air, affecting its electrical performance .
  • the portion of the flexible protrusion 312 that is not covered by the protective layer film 32 may be a connection terminal for establishing an electrical connection with other functional modules.
  • Step 22 Place the cover plate on the protective layer film.
  • FIG. 3b illustrates the cover plate 33 covered on the protective film 32.
  • the cover plate 33 is laminated on the protective layer film 32, and is specifically fixed on the protective layer film 32 by a second optical glue.
  • the second optical glue can form the second adhesive layer 35 shown in FIG. 3b.
  • the cover plate 33 is disposed at the top of the flexible touch sensor, and plays a role in protecting the entire flexible touch sensor.
  • the connecting portion 311 of the conductive film 31 is located under the cover plate 33 and protected by the cover plate 33; the flexible protrusion 312 protrudes outward from the edge 331 of the cover plate 33, that is, the The position of the edge 331 of the cover plate 33 corresponds to the connection of the connecting portion 311 and the flexible protrusion 312.
  • Step 23 Open at least one opening along the edge of the cover plate in the protective layer film.
  • a plurality of openings 321 are formed in the protective layer film 32 along the edge 331 of the cover plate 33. Please refer to FIG. 3c. FIG. Structural drawing.
  • Step 24 At the opening, the portion of the protective layer film covering the flexible protrusion and the flexible protrusion are bent in a direction away from the cover plate.
  • the position of the opening 321 corresponds to the position of the edge 331 of the cover plate 33, and bending is performed at the opening 321, that is, the flexible protrusion 312 is correspondingly bent, because the protective layer film 32 partially covers the The connecting portion 311, the other portion of the protective layer film 32 covering the flexible protrusion 312, will bend along with the flexible protrusion 312.
  • FIG. 4 illustrates a structure in which the protective film 32 covers the flexible protrusion 312 and the flexible protrusion 312 is bent in a direction away from the cover plate 33.
  • the protective layer film 32 is bonded to the conductive film 31 by the first optical glue, and will follow the flexible protrusion The bending of 312 causes partial bending together.
  • the first optical glue and the protective layer film 32 due to the change of the material morphology, the protective layer film 32 corresponds to the connection between the connection part 311 and the flexible protrusion 312 The position of the generated internal stress F 1 shown in FIG. 4.
  • the second optical glue is affected by the inner stress F 1 , and a tensile force F 3 facing the bending direction of the protective film 32 is generated.
  • a tensile force F 3 facing the bending direction of the protective film 32 is generated.
  • the opening 321 reduces the inner stress F 1 .
  • the tensile force F 3 is not easily greater than the adhesive force F 2 provided by the second optical glue, thereby slowing the pulling of the second optical glue during bending and avoiding the phenomenon of delamination of the optical glue .
  • Step 25 Seal the bent opening by dispensing.
  • the openings 321 can be sealed by dispensing to finally produce a flexible touch sensor.
  • the colloid penetrates into the opening 321, because of the colloid tension, it is easier to gather to form a solidified state, and it is easy to package without overflowing.
  • the flexible touch sensor includes: a conductive film 31, a protective film 32 and a cover 33.
  • the protective layer film 32 is disposed on the conductive film 31, the cover plate 33 is disposed on the protective layer film 32, the conductive film 31 and the protective layer film 32 face away from the cover plate 33 direction curved.
  • the bending portion of the protective layer film 32 corresponds to the position of the edge 331 of the cover plate 33, and the bending portion of the protective layer film 32 is provided with at least one opening 321, and at least one opening 321 is provided with a suitable size
  • the sealing portion closes the at least one opening 321.
  • the sealing part may be sealed by a sealing material such as optical glue.
  • an opening 321 is opened in the protective layer film 32 in advance, so that the conductive film 31 is bent At this time, the stress in the protective film 32 is dispersed to avoid delamination between the conductive film 32 and the cover plate 33.
  • the opening 321 is sealed again to form a sealing portion of a corresponding size to avoid the conductive film 32 The opening 321 is exposed in the air, affecting its electrical performance.
  • the flexible touch sensor includes a first adhesive layer 34, the first adhesive layer 34 is disposed between the conductive film 31 and the protective film 32, the first adhesive layer 34 will The conductive film 31 and the protective layer film 32 are bonded and fixed.
  • the flexible touch sensor includes a second adhesive layer 35, the second adhesive layer 35 is disposed between the protective layer film 32 and the cover plate 33, the second adhesive layer 35 will The protective layer film 32 and the cover plate 33 are bonded and fixed.
  • the technical problem that the flexible touch sensor is easily delaminated during the bending process can also be solved by providing a corresponding supporting structure on the conductive film 31. Therefore, the method further includes: placing a base substrate on a side of the conductive film 31 away from the protective layer film 32, the base substrate being connected to the connection portion 311.
  • FIG. 5 provides a schematic structural diagram of a flexible touch sensor.
  • the difference between the flexible touch sensor and the flexible touch sensor in the above embodiment is that it further includes a base substrate 36.
  • the base substrate 36 is disposed at the bottom of the flexible touch sensor, and is used to provide support for the flexible touch sensor.
  • the base substrate 36 is a hard substrate, which can be obtained by using any suitable type of hard material, such as hard plastic.
  • the base substrate 36 may use a transparent substrate that meets a preset light transmittance standard.
  • connection portion 311 is stacked on the base substrate 36 and fixedly connected to the base substrate 36.
  • the connecting portion 311 can be fixed to the base substrate 36 by any suitable process or structure.
  • the connection portion 311 may be fixed to the base substrate 36 by a third optical glue, and the third optical glue may form the third adhesive layer 37 shown in FIG. 5.
  • the second optical glue is affected by the inner stress F 1 and may generate a pulling force facing the bending direction of the base substrate 36 F 3 , when the adhesion force F 2 between the second optical glue and the cover plate 33 is less than the pulling force F 3 , the flexible touch sensor will have insufficient adhesion between the second optical glue, resulting in the cover plate 33 and the protective film 32 and the conductive film 31 are delaminated.
  • the base substrate 36 may generate an internal stress F 1 at the connection between the connection portion 311 of the conductive film 31 and the flexible protrusion 312
  • the pulling force F 3 is opposite to the supporting force F 4 shown in FIG. 5.
  • the supporting force F 4 provided by the base substrate 36 can offset and reduce the internal stress F 1 caused by the change in material morphology, thereby reducing the tensile force F 3 that the second optical glue will generate. After the pulling force F 3 is reduced or reduced, it is less likely to be greater than the adhesive force F 2 provided by the second optical glue, thereby slowing the pulling of the second optical glue during bending and avoiding the phenomenon of delamination of the optical glue.
  • the first optical adhesive, the second optical adhesive, and the third optical adhesive are used to describe the first adhesive layer 34, the second adhesive layer 35 shown in FIG. Three adhesive layers 37, but it should be noted that the "first optical glue”, “second optical glue” and “third optical glue” are only used to indicate their positions in FIG. 4 and FIG. 5. Those skilled in the art can choose to use the same optical glue as the first optical glue, the second optical glue and the third optical glue, or can choose to use different optical glues as the first optical glue and the second optical glue respectively Glue and third optical glue.
  • the optical adhesive is a special adhesive for cementing transparent devices and has a certain light transmittance. It can be determined by those skilled in the art according to the needs of the actual situation through experiments and other methods. In other embodiments, a similar transparent fixing process may also be selected to fixedly connect each structural layer to form the flexible touch sensor.
  • An embodiment of the present application also provides a touch device.
  • the touch device includes a flexible touch sensor.
  • the flexible touch sensor is the same as the manufacturing method and structure of the flexible touch sensor in the foregoing embodiment, and is not repeated here.
  • the touch control device may be applied to some electronic devices.
  • the electronic device may be a smart wearable device, such as a smart watch or a smart bracelet.
  • the frame area of the touch device is also narrow.
  • the flexible touch sensor is applied to these electronic devices, the flexible touch sensor is not exposed to the frame, which affects the aesthetics. In the process of the touch sensor, it is necessary to bend the flexible sensor so that it is not exposed to the frame. Applying the preparation method of the flexible touch sensor provided in the above embodiment, the flexible touch sensor can be left unexposed It can also overcome the delamination phenomenon of the flexible touch sensor during the bending process.
  • the touch device when the conductive film and the protective layer film are bent in a direction facing away from the cover plate, an opening is opened in the protective layer film in advance, so that when the conductive film is bent, the protective layer film The stress is dispersed to avoid delamination between the conductive film and the cover plate.

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Abstract

一种柔性触控传感器及其制作方法、触控装置，该制作方法包括：在导电薄膜（31）上设置保护层薄膜（32）；将盖板（33）盖设于保护层薄膜（32）上；在保护层薄膜（32）上开设至少一个开口（321）；在开口（321）处，将导电薄膜（31）和保护层薄膜（32）沿背向盖板（33）的方向弯曲，并密封弯曲后的开口（321）。该制作方法在将导电薄膜（31）和保护层薄膜（32）沿背向盖板（33）的方向弯曲时，事先在保护层薄膜（32）上开设开口（321），这样导电薄膜（31）在弯曲时，其保护层薄膜（32）内应力分散，可避免导电薄膜（31）与盖板（33）间的分层。

Description

一种柔性触控传感器及其制作方法、触控装置 技术领域
本申请涉及传感器技术领域，特别是涉及一种柔性触控传感器及其制作方法、触控装置。
背景技术
触控传感器作为一种数据输入装置，目前在智能手机、平板电脑等电子设备中获得了广泛的应用。随着对电子产品更轻、更薄、可弯曲的性能要求，触控传感器越来越多的被柔性触控传感器代替。
柔性触控传感器通常由多层结构层叠形成的，且具有一定的形变能力。在一些应用场景中，柔性触控传感器为了满足装配需求，需要进行弯折。现有的柔性触控传感器在弯曲过程中，会因为过度弯曲而出现柔性触控传感器出现分层的情况。
发明内容
本申请旨在提供一种柔性触控传感器及其制作方法、触控装置，以解决传统柔性触控传感器在弯曲过程中，容易分层的技术问题。
为解决上述技术问题，本申请实施例采用的一个技术方案是：提供一种柔性触控传感器的制作方法，所述方法包括：在导电薄膜上设置保护层薄膜；将盖板盖设于所述保护层薄膜上；在所述保护层薄膜上开设至少一个开口；在所述开口处，将所述导电薄膜和所述保护层薄膜沿背向所述盖板的方向弯曲，并密封弯曲后的所述开口。
可选地，所述在所述保护层薄膜上开设至少一个开口，具体包括：沿所述盖板的边缘，在所述保护层薄膜开设至少一个开口。
可选地，所述开口的数量至少为2个，相邻所述开口之间的距离大于预设距离。
可选地，所述密封弯曲后的所述开口，具体包括：通过点胶的方式密封弯曲后的所述开口。
可选地，所述导电薄膜包括连接部和柔性凸出部，所述柔性凸出部延伸于所述连接部；所述保护层薄膜覆盖所述连接部和所述柔性凸出部的至少一部分；所述柔性凸出部凸出于所述盖板的边缘。
可选地，所述将所述导电薄膜和所述保护层薄膜沿背向所述保护层薄膜的方向弯曲，具体包括：将所述保护层薄膜覆盖所述柔性凸出部的部分和所述柔性凸出部沿背向所述保护层薄膜的方向弯曲。
可选地，所述导电薄膜和所述保护层薄膜通过第一光学胶粘结。
可选地，所述盖板通过第二光学胶与所述保护层薄膜粘结。
可选地，所述方法还包括：在所述导电薄膜远离所述保护层薄膜的一面制作衬底基板，所述衬底基板与所述连接部连接。
可选地，所述衬底基板通过第三光学胶于所述连接部粘结。
可选地，所述衬底基板为透明基板。
为解决上述技术问题，本申请实施例采用的另一个技术方案是：提供一种柔性触控传感器，包括：导电薄膜；保护层薄膜，所述保护层薄膜设置于所述导电薄膜上；盖板，所述盖板盖设于所述保护层薄膜上，所述导电薄膜和所述保护层薄膜沿背向所述盖板的方向弯曲，所述保护层薄膜的弯曲处与所述盖板的边缘位置对应，所述保护层薄膜的弯曲处开设有至少一个开口，每个所述开口设置密封部，以封闭每个所述开口。
可选地，所述柔性触控传感器包括第一粘接层，所述第一粘接层设置于所述导电薄膜和所述保护层薄膜之间，所述第一粘接层将所述导电薄膜和所述保护层薄膜粘结固定。
可选地，所述柔性触控传感器包括第二粘接层，所述第二粘接层设置于所述保护层薄膜和所述盖板之间，所述第二粘接层将所述保护层薄膜和所述盖板粘结固定。
可选地，所述导电薄膜包括连接部和柔性凸出部，所述柔性凸出部延伸于所述连接部，所述导电薄膜在沿所述连接部和所述柔性凸出部的连接处弯曲；
所述柔性触控传感器包括衬底基板，所述连接部层叠于所述衬底基板，所述衬底基板用于向所述连接部和所述柔性凸出部的连接处提供支撑力。
可选地，所述柔性触控传感器包括第三粘接层，所述第三粘接层设置于所述连接部和所述衬底基板之间，所述第三粘接层将所述连接部和所述衬底基板 粘结固定。
为解决上述技术问题，本申请实施例采用的另一个技术方案是：提供一种触控装置，所述触控装置包括以上所述的柔性触控传感器。
本申请实施例提供的柔性触控传感器的制备方法，其在将导电薄膜和保护层薄膜沿背向盖板的方向弯曲时，事先在保护层薄膜上开设开口，这样导电薄膜在弯曲时，其保护层薄膜内应力分散，可避免导电薄膜与盖板间的分层。
附图说明
图1是本申请一个实施例提供的一种柔性触控传感器的制作方法流程示意图；
图2是本申请另一个实施例提供的一种柔性触控传感器的制作方法流程示意图；
图3a至图3c是图2示出的柔性触控传感器制作方法在不同制作阶段的结构示意图；
图4是图2示出的柔性触控传感器制作方法得到的柔性触控传感器在弯曲时的受力示意图；
图5是本申请又一个实施例提供的一种柔性触控传感器的结构示意图。
具体实施方式
为了使本申请的目的、方案及优点更加清楚明白，以下结合实施例，对本申请进行进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本申请，并不用于限定本申请。此外，下面所描述的本申请不同实施例中所涉及的技术特征只要彼此之间未构成冲突就可以相互结合。
柔性触控传感器是指由多层结构层叠形成的，具有一定形变能力的传感器。在柔性触控传感器应用于一些边框较为狭窄的电子设备中时，需要将柔性触控传感器超出边框向外延伸的部分进行弯曲以满足窄边框的装配要求。
在柔性触控传感器弯曲过程中，柔性触控传感器超出边框向外延伸的部分会产生内应力，当该内应力大于光学胶的粘合力时，则容易造成柔性触控传感器的边框与光学胶形成的粘接层发生分层现象。
基于此本申请实施例首先提供一种柔性触控传感器的制作方法，应用本申请实施例的制作方法得到的柔性触控传感器，可以在弯曲状态下，避免光学胶分层。
请参阅图1，图1为本申请实施例提供的一种柔性触控传感器的制作方法流程示意图，如图1所示，所述方法包括如下步骤：
步骤11、在导电薄膜上设置保护层薄膜。
所述导电薄膜用于形成触控单元，实现对用户产生的触控操作的响应。其根据实际情况的需要，可以通过在基材上设置对应的功能电路以实现传感器的功能。其中，设置在导电薄膜上的功能电路具有耐弯折性和导电性，其由可以运输和传送电流的导电材料在基材上沉积形成，例如掺锡氧化铟或者石墨烯等。导电薄膜的基材则可以通过聚氯乙烯树脂和聚对苯二甲酸丁二醇酯等原料中制成。
所述保护层薄膜设置于所述导电薄膜上，用于保护所述导电薄膜，以将所述导电薄膜隔绝水汽，并防止所述导电薄膜被刮伤。所述保护层薄膜可以由热固性树脂和树脂组合物成型得到。所述热固性树脂可以为环氧树脂、酚醛树脂、氨基树脂、不饱和聚酯树脂、聚氨酯树脂、热固性聚酰亚胺树脂等，该树脂组合物可以为热塑性树脂。
所述保护层薄膜可以通过任何合适的方式设置于所述导电薄膜，例如，印刷、涂布、沉积、胶黏等。较佳地，可以使用光学胶作为胶黏剂将所述保护层薄膜粘结于所述导电薄膜上。
步骤12、将盖板盖设于所述保护层薄膜上。
盖板是盖设于所述保护层薄膜上的硬质结构，起到保护整个柔性触控传感器的作用。在本实施例中，作为柔性触控传感器表面的保护层，所述盖板可以是玻璃钢盖板、金属盖板或者塑料盖板等，较佳地，可以选用硅酸盐玻璃制得玻璃钢盖板。刚性的玻璃钢盖板具有更好的防腐蚀的性能及承载能力。
所述盖板可以通过任何合适的方式盖设于所述导电薄膜上，例如，印刷、涂布、沉积、胶黏等。较佳地，可以使用光学胶作为胶黏剂将所述盖板粘结于所述导电薄膜上。
步骤13、在所述保护层薄膜上开设至少一个开口。
所述开口的位置与后续所述保护层薄膜需要弯曲的位置相对应，其由本领 域技术人员根据所述保护层薄膜和所述盖板的相对位置进行确定。开口可以以冲切、镭射等方式在所述保护层薄膜上开设微型槽得到。
所述开口可以是任何合适的形状，其数量可以为一个或多个，较佳地，在所述开口数量为2个以上时，为了避免2个以上的所述开口在保护层薄膜弯曲时断裂，在一些实施例中，相邻所述开口之间的距离需要大于预设距离。该预设距离是一个经验性数值。其可以由技术人员根据传感器的实际情况(如尺寸、开口形状、开口数量以及保护膜层的材质等)，通过多次实验等方式所确定。
步骤14、在所述开口处，将所述导电薄膜和所述保护层薄膜沿背向所述盖板的方向弯曲，并密封弯曲后的所述开口。
在导电薄膜和保护层薄膜沿背向所述盖板的方向弯曲过程中，由于材料形态发生变化，在所述开口处，所述导电薄膜和所述保护层薄膜会产生内侧应力。则所述保护层薄膜则可能因为内应力过大与所述盖板分层，所述开口用于在将保护层薄膜和导电薄膜弯曲时，将其内应力分散，以达到减小其内应力的效果，有效防止了所述盖板与所述保护层薄膜之间的分层。
上述开口可以以冲切、镭射等方式在所述保护层薄膜上开设微型槽得到。
在一些实施例中，所述保护层薄膜和所述盖板通过光学胶粘结，形成粘结层，所述开口则用于防止所述盖板与所述粘结层分层。
另外，由于保护层薄膜上具有开口则失去对导电薄膜的保护作用，因此，在将所述导电薄膜和所述保护层薄膜弯曲之后，还需要将所述开口密封，以对所述导电薄膜进行保护。
本申请实施例提供的柔性触控传感器的制作方法，其在将导电薄膜和保护层薄膜沿背向盖板的方向弯曲时，事先在保护层薄膜上开设开口，这样导电薄膜在弯曲时，其保护层薄膜内应力分散，可避免导电薄膜与盖板间的分层。
为了详细说明本申请的技术方案，以下结合一具体实施例来对本申请做进一步介绍。请参阅图2，图2是本申请另一实施例提供的一种柔性触控传感器制作方法的流程图，如图2所示，所述方法包括如下步骤：
步骤21、在导电薄膜上设置保护层薄膜。
请参阅图3a，图3a以在导电薄膜上设置保护层薄膜之后的结构进行示意。如图3a所示，所述导电薄膜31包括连接部311以及从所述连接部311向外延伸的柔性凸出部312。
所述导电薄膜31被划分为两个部分，分别为连接部311和柔性凸出部312，所述柔性凸出部312可以沿所述连接部311和所述柔性凸出部312的连接处，发生弯曲。
所述保护层薄膜32设置在所述导电薄膜31上，通过第一光学胶与所述导电薄膜31固定连接。所述第一光学胶可形成图3a所示的第一粘接层34。
所述保护层薄膜32覆盖所述连接部311和所述柔性凸出部312的至少一部分，以遮盖在所述导电薄膜31的表面防止所述导电薄膜31直接裸露在空气中，影响其电气性能。
具体的，所述柔性凸出部312未被所述保护层薄膜32覆盖的部分可以是连接端子，用于与其他的功能模组建立电性连接。
步骤22、将盖板盖设于所述保护层薄膜上。
请参阅图3b，图3b以将盖板33盖设于保护层薄膜32上的进行示意。所述盖板33层叠于所述保护层薄膜32上，具体通过第二光学胶固定在所述保护层薄膜32上。所述第二光学胶可形成图3b所示的第二粘接层35。
如图3b所示，所述盖板33设置在所述柔性触控传感器的最上方，起到保护整个柔性触控传感器的作用。所述导电薄膜31的连接部311位于所述盖板33下，受盖板33的保护；所述柔性凸出部312则凸出于所述盖板33的边缘331向外延伸，即所述盖板33的边缘331位置对应所述连接部311和所述柔性凸出部312的连接处。
步骤23、在所述保护层薄膜，沿所述盖板的边缘，开设至少一个开口。
沿所述盖板33的边缘331，在所述保护层薄膜32开设若干个开口321，请参阅图3c，图3c在另一视角示意了将所述保护层薄膜32的开口321进行放大后的结构图。
步骤24、在所述开口处，将所述保护层薄膜覆盖所述柔性凸出部的部分和所述柔性凸出部沿背向所述盖板的方向弯曲。
所述开口321的位置与所述盖板33的边缘331的位置对应，在所述开口321处实现弯曲，即对应将所述柔性凸出部312进行弯曲，由于保护层薄膜32部分覆盖所述连接部311，则保护层薄膜32的另一覆盖所述柔性凸出部312的部分，会随着所述柔性凸出部312一起弯曲。请参阅图4，图4示意了将所述保护层薄膜32覆盖所述柔性凸出部312的部分和所述柔性凸出部312沿背向所述盖板33 的方向弯曲后的结构。
为了方便本领域技术人员的理解，以下以图4中，保护层薄膜32弯曲时的受力示意图来详细解释。
如图4所示，在柔性凸出部312沿背向所述盖板33的方向弯曲的过程中，保护层薄膜32通过第一光学胶与导电薄膜31粘结，会随着柔性凸出部312的弯曲，一起发生部分弯曲。在柔性凸出部312、第一光学胶和保护层薄膜32在弯曲过程中，由于材料形态发生变化，会在所述保护层薄膜32对应所述连接部311与柔性凸出部312的连接处的位置产生图4所示的内侧应力F 1。
而第二光学胶受内侧应力F 1的影响，会产生面向保护层薄膜32弯曲方向的拉力F 3，当第二光学胶与盖板33的粘合力F 2小于该拉力F 3时，则会由于第二光学胶的粘合力不够，导致盖板33与保护层薄膜32发生分层。
在本申请实施例中，由于保护层薄膜32沿所述盖板33的边缘331，开设至少有若干个开口321，该开口321使得内侧应力F 1减小。在内应力F 1降低或者减少以后，会使得拉力F 3不容易大于第二光学胶提供的粘合力F 2，从而减缓弯曲时对第二光学胶的拉扯，避免出现光学胶分层的现象。
步骤25、通过点胶的方式密封弯曲后的所述开口。
在所述柔性凸出部311弯曲之后，可以通过点胶的方式密封所述若干个开口321，以最终制得柔性触控传感器。其中，胶体渗入该开口321内，因为胶体张力原因，其更容易聚拢形成凝固状态，且易于封装而不外溢。
本申请实施例还提供一种柔性触控传感器，所述柔性触控传感器由图1或图2所示的制作方法制得。请复参阅图4，具体地，所述柔性触控传感器包括：导电薄膜31、保护层薄膜32和盖板33。所述保护层薄膜32设置于所述导电薄膜31上，所述盖板33盖设于所述保护层薄膜32上，所述导电薄膜31和所述保护层薄膜32沿背向所述盖板33的方向弯曲。所述保护层薄膜32的弯曲处与所述盖板33的边缘331位置对应，所述保护层薄膜32的弯曲处开设有至少一个开口321，所述至少一个开口321处设置有相适应尺寸的密封部以封闭所述至少一个开口321。所述密封部可以由光学胶等密封材料实现密封。
本申请实施例提供的柔性触控传感器，其在将导电薄膜31和保护层薄膜32沿背向盖板33的方向弯曲之前，事先在保护层薄膜32上开设开口321，这样导电薄膜31在弯曲时，保护层薄膜32内应力分散，可避免导电薄膜32与盖板33 间的分层，在导电薄膜32弯曲之后，又将上述开口321密封，形成有相应尺寸的密封部，避免导电薄膜32的开口321处裸露在空气中，影响其电学性能。
在一些实施例中，所述柔性触控传感器包括第一粘接层34，所述第一粘接层34设置于导电薄膜31和保护层薄膜32之间，所述第一粘接层34将导电薄膜31和保护层薄膜32粘结固定。
在一些实施例中，所述柔性触控传感器包括第二粘接层35，所述第二粘接层35设置于保护层薄膜32和盖板33之间，所述第二粘接层35将保护层薄膜32和盖板33粘结固定。
在一些实施例中，还可以通过在所述导电薄膜31上设置相应的支撑结构来解决柔性触控传感器在弯曲过程中容易分层的技术问题。因此，所述方法还包括：在所述导电薄膜31远离所述保护层薄膜32的一面放置衬底基板，所述衬底基板与所述连接部311连接。
请参阅图5，图5提供了一种柔性触控传感器的结构示意图，所述柔性触控传感器与上述实施例中柔性触控传感器的区别在于，还包括一衬底基板36。
所述衬底基板36设置在所述柔性触控传感器的最底部，用于为所述柔性触控传感器提供支撑。在本实施例中，所述衬底基板36为硬质基板，其具体可以采用任何合适类型的硬质材料制备获得，例如硬质塑料。为了避免衬底基板36对于柔性触控传感器造成影响，在一些实施例中，所述衬底基板36可以选用符合预设透光率标准的透明基板。
所述连接部311层叠于所述衬底基板36上，与所述衬底基板36固定连接。
所述连接部311可以通过任何合适的工艺或者结构，与所述衬底基板36固定。在一些实施例中，所述连接部311可以通过第三光学胶与所述衬底基板36粘接固定，所述第三光学胶可形成图5所示的第三粘接层37。
请继续参阅图5，在柔性凸出部312沿背向所述盖板33的方向弯曲的过程中，第二光学胶受内侧应力F 1的影响，会产生面向衬底基板36弯曲方向的拉力F 3，当第二光学胶与盖板33的粘合力F 2小于该拉力F 3时，柔性触控传感器则会由于第二光学胶的粘合力不够，导致盖板33与保护层薄膜32和导电薄膜31发生分层。
由于导电薄膜的31的底层设置有衬底基板36，所述衬底基板36可以在所述导电薄膜的31的连接部311与所述柔性凸出部312的连接处产生与内侧应力 F 1产生的拉力F 3方向相反的图5所示的支撑力F 4。通过衬底基板36提供的支撑力F 4，可以抵消和减少材料形态变化导致的内侧应力F 1，从而降低第二光学胶将产生的拉力F 3。在拉力F 3降低或者减少以后，其就更不容易大于第二光学胶提供的粘合力F 2，从而减缓弯曲时对第二光学胶的拉扯，避免出现光学胶分层的现象。
需要理解的是，通过在柔性触控传感器的最底部设置一衬底基板36是一种新的结构形式，其与上述通过在保护层薄膜上设置相应的开口来减小弯曲损失并不冲突。因此，本领域技术人员可以理解的是，本申请实施例提供的柔性触控传感器是与上述在制备过程中将柔性触控传感器的保护层薄膜上设置开口，并对弯曲的后开进行密封的方式结合使用，以获得更好的技术效果。其具体执行步骤的先后顺序，在此处也不做限制。
另外，上述制备步骤中，分别采用第一光学胶、第二光学胶以及第三光学胶来描述位于图4所示的第一粘接层34、第二粘接层35和图5中的第三粘结层37，但应当说明的是，该“第一光学胶”、“第二光学胶”以及“第三光学胶”仅用于表示其在图4和图5中所处的位置。本领域技术人员即可以选择使用相同的光学胶作为所述第一光学胶、第二光学胶以及第三光学胶，也可以选择使用不同的光学胶分别作为所述第一光学胶、第二光学胶以及第三光学胶。
该光学胶为胶结透明器件的特种胶粘剂，具有一定的透光率。其可以由本领域技术人员根据实际情况的需要，通过实验等方式确定。在另一些实施例中，还可以选择类似的透明固定工艺固定连接各个结构层形成所述柔性触控传感器。
本申请实施例还提供一种触控装置，所述触控装置包括柔性触控传感器，该柔性触控传感器与上述实施例中的柔性触控传感器的制作方法和结构相同，在此不再赘述。该触控装置可以应用于一些电子设备中，在一些实施例中，该电子设备可以是智能可穿戴设备，例如，智能手表、智能手环等。
当电子设备整体体积较小时，则其触控装置的边框区也较为狭窄，在柔性触控传感器应用于这些电子设备中时，为了柔性触控传感器不暴露于边框外，影响美观，在制备柔性触控传感器的过程中，需要将柔性传感进行弯折以让其不暴露于边框外，应用上述实施例提供的柔性触控传感器的制备方法，即可以让柔性触控传感器不暴露于边外，还可以同时克服柔性触控传感器在弯曲过程 中的分层现象。
本申请实施例提供的触控装置，其在将导电薄膜和保护层薄膜沿背向盖板的方向弯曲时，事先在保护层薄膜上开设开口，这样导电薄膜在弯曲时，其保护层薄膜内应力分散，可避免导电薄膜与盖板间的分层。
以上所述仅为本申请的实施例，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (17)

  1. 一种柔性触控传感器的制作方法，其特征在于，包括：
    在导电薄膜上设置保护层薄膜；
    将盖板盖设于所述保护层薄膜上；
    在所述保护层薄膜上开设至少一个开口；
    在所述开口处，将所述导电薄膜和所述保护层薄膜沿背向所述盖板的方向弯曲，并密封弯曲后的所述开口。
  2. 根据权利要求1所述的制作方法，其特征在于，所述在所述保护层薄膜上开设至少一个开口，具体包括：
    沿所述盖板的边缘，在所述保护层薄膜开设至少一个开口。
  3. 根据权利要求1所述的制作方法，其特征在于，所述开口的数量至少为2个，相邻所述开口之间的距离大于预设距离。
  4. 根据权利要求1所述的制作方法，其特征在于，所述密封弯曲后的所述开口，具体包括：
    通过点胶的方式密封弯曲后的所述开口。
  5. 根据权利要求1所述的制作方法，其特征在于，所述导电薄膜包括连接部和柔性凸出部，所述柔性凸出部延伸于所述连接部；
    所述保护层薄膜覆盖所述连接部和所述柔性凸出部的至少一部分；
    所述柔性凸出部凸出于所述盖板的边缘。
  6. 根据权利要求5所述的制作方法，其特征在于，所述将所述导电薄膜和所述保护层薄膜沿背向所述保护层薄膜的方向弯曲，具体包括：
    将所述保护层薄膜覆盖所述柔性凸出部的部分和所述柔性凸出部沿背向所述保护层薄膜的方向弯曲。
  7. 根据权利要求1所述的制作方法，其特征在于，所述导电薄膜和所述保护层薄膜通过第一光学胶粘结。
  8. 根据权利要求1所述的制作方法，其特征在于，所述盖板通过第二光学胶与所述保护层薄膜粘结。
  9. 根据权利要求1-8任一项所述的制作方法，其特征在于，所述方法还包括：
    在所述导电薄膜远离所述保护层薄膜的一面放置衬底基板，所述衬底基板 与所述连接部连接。
  10. 根据权利要求9所述的制作方法，其特征在于，所述衬底基板通过第三光学胶于所述连接部粘结。
  11. 根据权利要求9所述的制作方法，其特征在于，所述衬底基板为透明基板。
  12. 一种柔性触控传感器，其特征在于，包括：
    导电薄膜；
    保护层薄膜，所述保护层薄膜设置于所述导电薄膜上；
    盖板，所述盖板盖设于所述保护层薄膜上，所述导电薄膜和所述保护层薄膜沿背向所述盖板的方向弯曲，所述保护层薄膜的弯曲处与所述盖板的边缘位置对应，所述保护层薄膜的弯曲处开设有至少一个开口，每个所述开口设置密封部，以封闭每个所述开口。
  13. 根据权利要求12所述的柔性触控传感器，其特征在于，包括第一粘接层，所述第一粘接层设置于所述导电薄膜和所述保护层薄膜之间，所述第一粘接层将所述导电薄膜和所述保护层薄膜粘结固定。
  14. 根据权利要求12所述的柔性触控传感器，其特征在于，包括第二粘接层，所述第二粘接层设置于所述保护层薄膜和所述盖板之间，所述第二粘接层将所述保护层薄膜和所述盖板粘结固定。
  15. 根据权利要求12所述的柔性触控传感器，其特征在于，所述导电薄膜包括连接部和柔性凸出部，所述柔性凸出部延伸于所述连接部，所述导电薄膜在沿所述连接部和所述柔性凸出部的连接处弯曲；
    所述柔性触控传感器包括衬底基板，所述衬底基板层叠于所述导电薄膜的连接部下方，所述衬底基板用于向所述连接部和所述柔性凸出部的连接处提供支撑力。
  16. 根据权利要求15所述的柔性触控传感器，其特征在于，包括第三粘接层，所述第三粘接层设置于所述连接部和所述衬底基板之间，所述第三粘接层将所述连接部和所述衬底基板粘结固定。
  17. 一种触控装置，其特征在于，所述触控装置包括权利要求12-16任一项所述的柔性触控传感器。
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