WO2020124738A1 - 显示面板的蒸镀结构 - Google Patents

显示面板的蒸镀结构 Download PDF

Info

Publication number
WO2020124738A1
WO2020124738A1 PCT/CN2019/072868 CN2019072868W WO2020124738A1 WO 2020124738 A1 WO2020124738 A1 WO 2020124738A1 CN 2019072868 W CN2019072868 W CN 2019072868W WO 2020124738 A1 WO2020124738 A1 WO 2020124738A1
Authority
WO
WIPO (PCT)
Prior art keywords
display panel
emitting layer
vapor deposition
layer structure
hole
Prior art date
Application number
PCT/CN2019/072868
Other languages
English (en)
French (fr)
Inventor
赵凯祥
刘开欣
Original Assignee
武汉华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US16/472,888 priority Critical patent/US20200239998A1/en
Publication of WO2020124738A1 publication Critical patent/WO2020124738A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the invention relates to the field of display panel vapor deposition equipment and the like, in particular to a vapor deposition structure of a display panel.
  • the corresponding functional film layer needs to be formed by an evaporation process.
  • the evaporation process generally uses current heating, electron beam bombardment heating and laser heating in a vacuum to evaporate the vaporized material into atoms or molecules. They then move in a linear motion with a larger free path and collide with the surface of the substrate to condense. To form a thin film.
  • a mask plate is required to cover the non-film-forming area, so that each functional film layer can be formed at a designated position.
  • the magnets in the vapor deposition equipment will generate an attractive force on the mask plate to attract the mask plate.
  • the magnets in the existing vapor deposition equipment can only be made into long strips. When the magnet is energized, the magnetic field strength near the magnet is strong, and the magnetic field strength away from the magnet is weak, so it will cause a mask in the vapor deposition equipment. In the case of uneven distribution of the adsorption force when the board is attracted by the magnet, the mask plate is easily deformed due to the uneven adsorption force, which ultimately affects the uniformity of the thickness of the functional film layer after vapor deposition, resulting in poor display of the display panel.
  • the present invention provides a vapor deposition structure of a display panel, by adding a support column between the mask plate and the display panel, to prevent the mask plate from being deformed due to the uneven distribution of the adsorption force generated by the magnet The phenomenon.
  • the present invention provides a vapor deposition structure of a display panel, including a display panel; a plurality of magnets, distributed on one side of the display panel; and a mask plate, provided on the other side of the display panel One side; a number of support posts, supported between the mask plate and the display panel, and each support post corresponds to one of the magnets; a vapor deposition source, having a vapor deposition side, facing the mask plate.
  • the vapor deposition structure of the display panel further includes a bottom plate, the magnet is disposed on one side of the bottom plate, and the display panel is disposed on the other side of the bottom plate;
  • the display panel includes a glass substrate, which is provided on the bottom plate; a thin film transistor structure layer, which is provided on the glass substrate; a pixel defining layer, which is provided on the thin film transistor structure layer, and the pixel defining layer is provided with openings;
  • a spacing column is arranged on the pixel defining layer; the mask plate is arranged on the spacing column, and the supporting column is arranged on the same layer as the spacing column.
  • the mask plate has a plurality of through-hole areas and non-through-hole areas, and each through-hole area corresponds to one of the openings.
  • the through-hole regions are arranged in an array to form a plurality of rows and columns of the through-hole regions; the support pillars are also arranged in an array and are located in the non-through-hole region to form a
  • the rows and columns of the support columns, the rows of the support columns are parallel to the rows of the through-hole region, and the columns of the support columns are parallel to the columns of the through-hole region.
  • the support column and the through-hole area are arranged alternately.
  • the magnet is elongated, and each row or column of support columns corresponds to a magnet.
  • a light-emitting layer structure is formed in each opening, and the light-emitting layer structure is one of a red light-emitting layer structure, a green light-emitting layer structure, and a blue light-emitting layer structure.
  • each through-hole region corresponds to each red light-emitting layer structure, and the non-through-hole region corresponds to the green light-emitting layer structure and the blue light-emitting layer structure; or each through-hole The area corresponds to each blue light emitting layer structure, the non-through hole area corresponds to the green light emitting layer structure and the red light emitting layer structure; or each through hole area corresponds to each green light emitting layer structure, the The non-through hole region corresponds to the red light emitting layer structure and the blue light emitting layer structure.
  • the shape and size of the through hole area match the shape and size of the corresponding opening.
  • the support column is a columnar columnar structure.
  • the vapor deposition structure of the display panel of the present invention by adding a number of support posts in the corresponding areas of the mask plate and the magnet, the deformation problem caused by the uneven distribution of the adsorption force generated by the magnet is effectively prevented, and each light emission after vapor deposition is ensured
  • the thickness of the layer structure is uniform, which reduces the defect rate of the display panel.
  • FIG. 1 is a structural diagram of a correspondence relationship between a mask plate and a magnet according to an embodiment of the present invention, which mainly embodies the correspondence relationship between a support column and a magnet on the mask plate.
  • FIG. 2 is a schematic diagram of a vapor deposition structure of a display panel when a red light emitting structure is vapor deposited according to an embodiment of the present invention.
  • FIG. 3 is a schematic diagram of a vapor deposition structure of a display panel when a blue light emitting structure is vapor deposited according to an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of a vapor deposition structure of a display panel when a green light emitting structure is vapor deposited according to an embodiment of the present invention.
  • 125 light emitting layer structure 125a red light emitting layer structure; 125b blue light emitting layer structure; 125c green light emitting layer structure; 126 openings;
  • the vapor deposition structure 1 of the display panel of the present invention includes a bottom plate 11, a display panel 12, a plurality of magnets 13, a mask plate 14, a plurality of support columns 15 and vapor deposition Source 16.
  • the display panel 12 is disposed on one side of the bottom plate 11, and a plurality of magnets 13 are distributed on the other side of the bottom plate 11.
  • the magnets 13 are elongated, and the elongated magnets 13 are parallel to each other.
  • the display panel 12 includes a glass substrate 121, a thin film transistor structure layer 122, a pixel defining layer 123, and a spacer 124.
  • the glass substrate 121 is provided on the bottom plate 11
  • the thin film transistor structure layer 122 is provided on the glass substrate 121
  • the thin film transistor structure layer 122 has a number of thin film transistors (not shown);
  • the pixel defining layer 123 is provided on the thin film transistor structure layer 122
  • the pixel defining layer 123 is provided with an opening 126 corresponding to the thin film transistor
  • the spacer 124 is provided on the pixel defining layer 123.
  • the mask plate 14 is provided on the other side of the display panel 12, that is, the side of the display panel 12 having the spacer 124.
  • the mask plate 14 has a plurality of through-hole regions 141 and a non-through-hole region 142, the through-hole regions 141 are arranged in an array to form a row of the through-hole regions 141 and
  • the support columns 15 are disposed in the non-perforated area 142, the support columns 15 are also arranged in an array, forming rows and columns of the support columns 15, the rows of the support columns 15 are parallel to the In the rows of the through-hole regions 141, the columns of the support columns 15 are parallel to the columns of the through-hole regions 141.
  • the support column 15 and the through hole area 141 are alternately arranged.
  • the plurality of support pillars 15 are supported between the mask plate 14 and the display panel 12, and the support pillars 15 and the spacer pillars 124 are arranged in the same layer, that is, the A plurality of supporting columns 15 are supported between the mask plate 14 and the pixel defining layer 123.
  • the support column 15 is a prismatic column structure, and of course other structures, such as a cylindrical structure, in order to prevent the support column 15 from interfering with the spacing column 124, therefore, in this embodiment, the support column 15 is designed as a prism-shaped columnar structure, that is, has a plurality of first sides, and the spacing column 124 has a number of second sides, when the support column 15 is adjacent to the spacing column 124, the first sides are parallel On the second side, this is advantageous for saving space and avoiding interference between the support column 15 and the spacing column 124.
  • each row or column of support columns 15 corresponds to a magnet 13. If the width of the magnet 13 is large, two rows or columns of support columns 15 can be used Corresponding to a magnet 13.
  • each through-hole region 141 in this embodiment corresponds to one of the openings 126.
  • the light-emitting layer structure 125 is one of a red light-emitting layer structure 125a, a green light-emitting layer structure 125c, and a blue light-emitting layer structure 125b.
  • each through-hole region 141 corresponds to each red light-emitting layer structure 125a
  • the non-through-hole region 142 corresponds to the green light-emitting layer structure 125c and the blue light-emitting layer structure 125b;
  • the opening 126 corresponding to the through-hole region 141 forms a red light-emitting layer structure 125a, and the opening 126 corresponding to the non-through-hole region 142 is blocked.
  • each through-hole region 141 may also correspond to each blue light-emitting layer structure 125b, and the non-through-hole region 142 corresponds to the green light-emitting layer structure 125c and the red light-emitting layer structure 125a;
  • the opening 126 corresponding to the through-hole region 141 will form a blue light-emitting layer structure 125b, and the opening 126 corresponding to the non-through-hole region 142 will be blocked.
  • each through-hole region 141 may also correspond to each green light-emitting layer structure 125c, and the non-through-hole region 142 corresponds to the red light-emitting layer structure 125a and the blue light-emitting layer structure 125b.
  • the opening 126 corresponding to the through-hole region 141 will form a green light-emitting layer structure 125, and the opening 126 corresponding to the non-through-hole region 142 will be blocked.
  • the shape and size of the through-hole region 141 match the shape and size of the corresponding opening 126, so that the shape and size of the light-emitting layer structure 125 formed meet the design requirements.
  • the vapor deposition source 16 has a vapor deposition side 161 facing the mask plate 14.
  • the vapor deposition source 16 provides vapor deposition material for forming the light-emitting layer structure 125.
  • the vapor deposition material from the vapor deposition side 161 The light-emitting layer structure 125 is formed in the corresponding opening 126 through the through-hole region 141.
  • the vapor deposition structure 1 of the display panel of the present invention will be further described below in conjunction with the vapor deposition method of the light emitting layer structure of the display panel.
  • the evaporation method of the display panel light-emitting layer structure 125 of the present invention includes the following steps,
  • the display panel 12 is placed on one side of the bottom plate 11, and the other side of the bottom plate 11 has a plurality of magnets 13 arranged parallel to each other.
  • the display panel 12 is provided with a glass substrate 121, a thin film transistor structure layer 122, a pixel defining layer 123 and a spacer 124 on the bottom plate 11 in this order.
  • the pixel defining layer 123 is provided with an opening 126 corresponding to the thin film transistor, and the spacer 124 is provided on the pixel defining layer 123.
  • a first mask plate 14a is provided.
  • the first mask plate 14a has a plurality of first through-hole areas 141a and a first non-through-hole area 142a.
  • the first through-hole areas 141a are arranged in an array to form a number of The rows and columns of the first through-hole regions 141a; the support columns 15 are disposed in the first non-through-hole region 142a, and the support columns 15 are also arranged in an array to form the rows and columns of the support columns 15
  • the row of the support columns 15 is parallel to the row of the first through-hole regions 141a, and the row of the support columns 15 is parallel to the row of the first through-hole regions 141a. In the direction of the row or column of the support column 15, the support column 15 and the first through-hole region 141 a are staggered.
  • Each row or column of support columns 15 corresponds to a magnet 13.
  • a first mask plate 14a with supporting columns 15 is placed on the display panel 12, the plurality of supporting columns 15 are supported between the mask panel 14 and the display panel 12, the supporting columns 15 It is arranged in the same layer as the spacer 124, that is, the support columns 15 are supported between the first mask plate 14a and the pixel defining layer 123.
  • a vapor deposition source 16 is provided for vapor deposition of the display panel 12, the vapor deposition source 16 has a vapor deposition side 161 facing the first mask plate 14a, and the vapor deposition source 16 forms the red light emitting layer
  • the structure 125a provides a vapor deposition material, the opening 126 corresponding to the through-hole region will form a red light-emitting layer structure 125a, and the opening 126 corresponding to the non-through-hole region will be blocked.
  • the second mask plate 14b is replaced, and the second mask plate 14b has a plurality of second through-hole regions 141b and second non-through-hole regions 142b ,
  • the second through-hole regions 141b are arranged in an array to form a number of rows and columns of the second through-hole regions 141b;
  • the support columns 15 are disposed in the second non-through-hole regions 142b, and the support columns 15 are also arranged in an array to form rows and columns of the support pillars 15, the rows of the support pillars 15 are parallel to the rows of the second through-hole regions 141b, and the rows of the support pillars 15 are parallel to the first The column of the second through hole area 141b.
  • the support column 15 and the second through-hole region 141 b are alternately arranged.
  • Each row or column of support columns 15 corresponds to a magnet 13.
  • the second mask plate 14b with supporting columns 15 is placed on the display panel 12, and the plurality of supporting columns 15 are supported between the second mask plate 14b and the display panel 12, the support The pillar 15 and the spacer 124 are disposed in the same layer, that is, the plurality of support pillars 15 are supported between the mask plate 14 and the pixel defining layer 123.
  • the display panel 12 is vapor-deposited by a vapor-deposition source 16, the vapor-deposition source 16 has a vapor-deposition side 161 facing the second mask plate 14b, and the vapor-deposition source 16 forms the blue light-emitting layer
  • the structure 125b provides a vapor deposition material, the opening 126 corresponding to the through-hole area will form a blue light-emitting layer structure 125b, and the opening 126 corresponding to the non-through-hole area will be blocked.
  • the third mask plate 14c is replaced, and the third mask plate 14c has a plurality of third through-hole regions 141c and third non-through-hole regions 142c, the third through-hole regions 141c are arranged in an array to form a number of rows and columns of the third through-hole regions 141c; the support pillar 15 is disposed in the third non-through-hole region 142c, the support The pillars 15 are also arranged in an array to form rows and columns of the support pillars 15, the rows of the support pillars 15 are parallel to the rows of the third through-hole region 141c, and the rows of the support pillars 15 are parallel to the The column of the third through hole area 141c. In the direction of the row or column of the support column 15, the support column 15 and the third through-hole region 141 c are alternately arranged. Each row or column of support columns 15 corresponds to a magnet 13.
  • a third mask plate 14c with supporting columns 15 is placed on the display panel 12, the plurality of supporting columns 15 are supported between the third mask plate 14c and the display panel 12, the support The pillar 15 and the spacer 124 are disposed in the same layer, that is, the plurality of support pillars 15 are supported between the mask plate 14 and the pixel defining layer 123.
  • the display panel 12 is vapor-deposited by a vapor-deposition source 16, the vapor-deposition source 16 has a vapor-deposition side 161 facing the third mask plate 14c, and the vapor-deposition source 16 is formed to form the green light-emitting layer structure 125c provides a vapor deposition material, the opening 126 corresponding to the through-hole area will form a green light-emitting layer structure 125c, and the opening 126 corresponding to the non-through-hole area will be blocked.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本发明公开了一种显示面板的蒸镀结构，包括显示面板；若干磁铁，分布于所述显示面板的一侧；一掩膜板，设于所述显示面板的另一侧；若干支撑柱，支撑于所述掩膜板与所述显示面板之间，且每一支撑柱对应于其中一磁铁；蒸镀源，具有一蒸镀侧，朝向所述掩膜板。本发明的显示面板的蒸镀结构，通过在掩膜板与磁铁的对应区域增加若干支撑柱，有效防止了因磁铁产生的吸附力分布不均带来的形变问题，确保了蒸镀后各发光层结构的厚度均一，降低了显示面板显示的不良率。

Description

显示面板的蒸镀结构 技术领域
本发明涉及显示面板蒸镀设备等领域，具体为一种显示面板的蒸镀结构。
 背景技术
在显示面板的制程中，需要采用蒸镀工艺形成对应的功能膜层。而蒸镀工艺一般在真空中通过电流加热，电子束轰击加热和激光加热等方法，使被蒸材料蒸发成原子或分子，它们随即以较大的自由程作直线运动，碰撞基片表面而凝结，形成薄膜。而在蒸镀时，需要用到掩膜板对非成膜区进行遮掩，以能够在指定的位置形成各个功能膜层。
现有的蒸镀设备，在蒸镀显示面板时，蒸镀设备中的磁铁会对掩膜板产生吸附力从而吸附掩膜板。而现有蒸镀设备中的磁铁只能做成长条状，当磁铁通电后，靠近磁铁附近位置的磁场强度较强，远离磁铁位置的磁场强度较弱，因此会造成蒸镀设备中的掩膜板被磁铁吸附时的吸附力分布不均的情况，掩膜板因吸附力不均容易形变，最终影响蒸镀后功能膜层的膜厚的均一性，造成显示面板的显示不良。
 技术问题
为了解决上述技术问题：本发明提供一种显示面板的蒸镀结构，通过在掩膜板与显示面板之间增加支撑柱，以防止因磁铁产生的吸附力分布不均带来的掩膜板形变的现象。
 技术解决方案
解决上述问题的技术方案是：本发明提供一种显示面板的蒸镀结构，包括显示面板；若干磁铁，分布于所述显示面板的一侧；一掩膜板，设于所述显示面板的另一侧；若干支撑柱，支撑于所述掩膜板与所述显示面板之间，且每一支撑柱对应于其中一磁铁；蒸镀源，具有一蒸镀侧，朝向所述掩膜板。
在本发明一实施例中，所述的显示面板的蒸镀结构还包括一底板，所述磁铁设于所述底板的一侧，所述显示面板设于所述底板的另一侧；所述显示面板包括玻璃基板，设于所述底板上；薄膜晶体管结构层，设于所述玻璃基板上；像素限定层，设于所述薄膜晶体管结构层上，所述像素限定层设有开孔；间隔柱，设于所述像素限定层上；所述掩膜板设于所述间隔柱上，所述支撑柱与所述间隔柱同层设置。
在本发明一实施例中，所述掩膜板具有若干透孔区和非透孔区，每一透孔区对应其中一开孔。
在本发明一实施例中，所述透孔区成阵列排布，形成若干所述透孔区的行和列；所述支撑柱也成阵列排布且位于所述非透孔区，形成所述支撑柱的行和列，所述支撑柱的行平行于所述透孔区的行，所述支撑柱的列平行于所述透孔区的列。
在本发明一实施例中，在所述支撑柱的行所在方向或列所在方向，所述支撑柱与所述透孔区交错设置。
在本发明一实施例中，所述磁铁为长条形，每一行或者每一列的支撑柱对应于一条磁铁。
在本发明一实施例中，每一开孔内形成有发光层结构，所述发光层结构为红色发光层结构、绿色发光层结构和蓝色发光层结构中的一种。
在本发明一实施例中，每一透孔区对应于每一红色发光层结构，所述非透孔区对应于所述绿色发光层结构和所述蓝色发光层结构；或者每一透孔区对应于每一蓝色发光层结构，所述非透孔区对应于所述绿色发光层结构和所述红色发光层结构；或者每一透孔区对应于每一绿色发光层结构，所述非透孔区对应于所述红色发光层结构和所述蓝色发光层结构。
在本发明一实施例中，所述透孔区的形状、尺寸匹配于其所对应的所述开孔的形状、尺寸。
在本发明一实施例中，所述支撑柱为棱台形的柱状结构。
 有益效果
本发明的显示面板的蒸镀结构，通过在掩膜板与磁铁的对应区域增加若干支撑柱，有效防止了因磁铁产生的吸附力分布不均带来的形变问题，确保了蒸镀后各发光层结构的厚度均一，降低了显示面板显示的不良率。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
下面结合附图和实施例对本发明作进一步解释。
图1是本发明实施例的掩膜板与磁铁的一种对应关系结构图，主要体现掩膜板上支撑柱与磁铁的对应关系。
图2是本发明实施例的蒸镀红色发光结构时的显示面板蒸镀结构示意图。
图3是本发明实施例的蒸镀蓝色发光结构时的显示面板蒸镀结构示意图。
图4是本发明实施例的蒸镀绿色发光结构时的显示面板蒸镀结构示意图。
附图标记：
1蒸镀结构；
11底板；12显示面板；
121玻璃基板；122薄膜晶体管结构层；123像素限定层；124间隔柱；
125发光层结构；125a红色发光层结构；125b蓝色发光层结构；125c绿色发光层结构；126开孔；
13磁铁；
14掩膜板、141透孔区；142非透孔区；
14a第一掩膜板；14b第二掩膜板；14c第三掩膜板；
141a第一透孔区；141b第二透孔区；141c第三透孔区；
142a第一非透孔区；142b第二非透孔区；142c第三非透孔区；
15支撑柱；
16蒸镀源；161蒸镀侧。
 本发明的实施方式
下面详细描述本发明的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
以下实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「顶」、「底」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
如图2至图4所示，在一实施例中，本发明的显示面板的蒸镀结构1，包括底板11、显示面板12、若干磁铁13、掩膜板14、若干支撑柱15以及蒸镀源16。
所述显示面板12设于所述底板11的一侧面，若干磁铁13分布于所述底板11的另一侧面。本实施例中，所述磁铁13为长条形，长条形的若干磁铁13相互平行。
所述显示面板12包括玻璃基板121、薄膜晶体管结构层122、像素限定层123以及间隔柱124。其中所述玻璃基板121设于所述底板11上，所述薄膜晶体管结构层122设于所述玻璃基板121上，所述薄膜晶体管结构层122中具有若干薄膜晶体管（图未示）；所述像素限定层123设于所述薄膜晶体管结构层122上，所述像素限定层123设有与所述薄膜晶体管对应的开孔126，所述间隔柱124设于所述像素限定层123上。
所述掩膜板14设于所述显示面板12的另一侧，即所述显示面板12的具有所述间隔柱124的一侧。
如图1所示，具体的，所述掩膜板14具有若干透孔区141和非透孔区142，所述透孔区141成阵列排布，形成若干所述透孔区141的行和列；所述支撑柱15设置在所述非透孔区142，所述支撑柱15也成阵列排布，形成所述支撑柱15的行和列，所述支撑柱15的行平行于所述透孔区141的行，所述支撑柱15的列平行于所述透孔区141的列。在所述支撑柱15的行所在方向或列所在方向，所述支撑柱15与所述透孔区141交错设置。
参见图2至图4所示，所述若干支撑柱15支撑于所述掩膜板14与所述显示面板12之间，所述支撑柱15与所述间隔柱124同层设置，即所述若干支撑柱15支撑于所述掩膜板14与所述像素限定层123之间。所述支撑柱15为棱台形的柱状结构，当然还可以为其他结构，如圆柱形结构，为了防止所述支撑柱15与所述间隔柱124干扰，因此，本实施例中，所述支撑柱15设计成棱台形的柱状结构，即具有若干第一侧面，而所述间隔柱124具有若干第二侧面，当所述支撑柱15与所述间隔柱124相邻时，所述第一侧面平行于第二侧面，这样有利于节省空间，避免所述支撑柱15与所述间隔柱124干扰。
由于所述磁铁13为长条形，因此，本实施例中，每一行或者每一列的支撑柱15对应于一条磁铁13，若磁铁13的宽度较大，则可以两行或两列支撑柱15对应一条磁铁13。
由于蒸镀时，需要在开孔126中形成发光层结构125，因此，本实施例中的每一透孔区141对应其中一开孔126。所述发光层结构125为红色发光层结构125a、绿色发光层结构125c和蓝色发光层结构125b中的一种。在一个显示面板12中，具有若干红色发光层结构125a、绿色发光层结构125c和蓝色发光层结构125b。
在本实施例中，每一透孔区141对应于每一红色发光层结构125a，所述非透孔区142对应于所述绿色发光层结构125c和所述蓝色发光层结构125b； 在实际蒸镀过程中，对应所述透孔区141的开孔126会形成红色发光层结构125a，而对应所述非透孔区142的所述开孔126则会被遮挡。
当然，每一透孔区141还可以对应于每一蓝色发光层结构125b，所述非透孔区142对应于所述绿色发光层结构125c和所述红色发光层结构125a；在实际蒸镀过程中，对应所述透孔区141的开孔126会形成蓝色发光层结构125b，而对应所述非透孔区142的所述开孔126则会被遮挡。
此外，每一透孔区141还可以对应于每一绿色发光层结构125c，所述非透孔区142对应于所述红色发光层结构125a和所述蓝色发光层结构125b。在实际蒸镀过程中，对应所述透孔区141的开孔126会形成绿色发光层结构125，而对应所述非透孔区142的所述开孔126则会被遮挡。
本实施例中，所述透孔区141的形状、尺寸匹配于其所对应的所述开孔126的形状、尺寸，以使得形成的所述发光层结构125的形状、尺寸复合设计要求。
所述蒸镀源16具有一蒸镀侧161，朝向所述掩膜板14，所述蒸镀源16为形成所述发光层结构125提供蒸镀材料，蒸镀材料从所述蒸镀侧161通过所述透孔区141在对应的所述开孔126中形成所述发光层结构125。
为了更加清楚的解释本发明，下面结合显示面板发光层结构蒸镀方法对本发明的显示面板的蒸镀结构1进行进一步说明。
本发明的显示面板发光层结构125蒸镀方法，包括以下步骤，
如图2所示，将显示面板12放置于底板11的一侧面，在所述底板11另一侧面具有若干相互平行排列的磁铁13。所述显示面板12在所述底板11上依次设有玻璃基板121、薄膜晶体管结构层122、像素限定层123以及间隔柱124。所述像素限定层123设有与所述薄膜晶体管对应的开孔126，所述间隔柱124设于所述像素限定层123上。
提供一第一掩膜板14a，所述第一掩膜板14a具有若干第一透孔区141a和第一非透孔区142a，所述第一透孔区141a成阵列排布，形成若干所述第一透孔区141a的行和列；所述支撑柱15设置在所述第一非透孔区142a，所述支撑柱15也成阵列排布，形成所述支撑柱15的行和列，所述支撑柱15的行平行于所述第一透孔区141a的行，所述支撑柱15的列平行于所述第一透孔区141a的列。在所述支撑柱15的行所在方向或列所在方向，所述支撑柱15与所述第一透孔区141a交错设置。每一行或者每一列的支撑柱15对应于一条磁铁13。
将带有支撑柱15的第一掩膜板14a置于所述显示面板12上，所述若干支撑柱15支撑于所述掩膜板14与所述显示面板12之间，所述支撑柱15与所述间隔柱124同层设置，即所述若干支撑柱15支撑于所述第一掩膜板14a与所述像素限定层123之间。
提供一蒸镀源16对显示面板12进行蒸镀，所述蒸镀源16具有一蒸镀侧161，朝向所述第一掩膜板14a，所述蒸镀源16为形成所述红色发光层结构125a提供蒸镀材料，对应所述透孔区的开孔126会形成红色发光层结构125a，而对应所述非透孔区的所述开孔126则会被遮挡。
如图3所示，当所述红色发光层结构125a制备完成后，更换第二掩膜板14b，所述第二掩膜板14b具有若干第二透孔区141b和第二非透孔区142b，所述第二透孔区141b成阵列排布，形成若干所述第二透孔区141b的行和列；所述支撑柱15设置在所述第二非透孔区142b，所述支撑柱15也成阵列排布，形成所述支撑柱15的行和列，所述支撑柱15的行平行于所述第二透孔区141b的行，所述支撑柱15的列平行于所述第二透孔区141b的列。在所述支撑柱15的行所在方向或列所在方向，所述支撑柱15与所述第二透孔区141b交错设置。每一行或者每一列的支撑柱15对应于一条磁铁13。
将带有支撑柱15的第二掩膜板14b置于所述显示面板12上，所述若干支撑柱15支撑于所述第二掩膜板14b与所述显示面板12之间，所述支撑柱15与所述间隔柱124同层设置，即所述若干支撑柱15支撑于所述掩膜板14与所述像素限定层123之间。
利用蒸镀源16对显示面板12进行蒸镀，所述蒸镀源16具有一蒸镀侧161，朝向所述第二掩膜板14b，所述蒸镀源16为形成所述蓝色发光层结构125b提供蒸镀材料，对应所述透孔区的开孔126会形成蓝色发光层结构125b，而对应所述非透孔区的所述开孔126则会被遮挡。
如图4所示，当所述蓝色发光层结构125b制备完成后，更换第三掩膜板14c，所述第三掩膜板14c具有若干第三透孔区141c和第三非透孔区142c，所述第三透孔区141c成阵列排布，形成若干所述第三透孔区141c的行和列；所述支撑柱15设置在所述第三非透孔区142c，所述支撑柱15也成阵列排布，形成所述支撑柱15的行和列，所述支撑柱15的行平行于所述第三透孔区141c的行，所述支撑柱15的列平行于所述第三透孔区141c的列。在所述支撑柱15的行所在方向或列所在方向，所述支撑柱15与所述第三透孔区141c交错设置。每一行或者每一列的支撑柱15对应于一条磁铁13。
将带有支撑柱15的第三掩膜板14c置于所述显示面板12上，所述若干支撑柱15支撑于所述第三掩膜板14c与所述显示面板12之间，所述支撑柱15与所述间隔柱124同层设置，即所述若干支撑柱15支撑于所述掩膜板14与所述像素限定层123之间。
利用蒸镀源16对显示面板12进行蒸镀，所述蒸镀源16具有一蒸镀侧161，朝向所述第三掩膜板14c，所述蒸镀源16为形成所述绿色发光层结构125c提供蒸镀材料，对应所述透孔区的开孔126会形成绿色发光层结构125c，而对应所述非透孔区的所述开孔126则会被遮挡。
这样就形成了整个显示面板12的发光层结构125的蒸镀。
以上仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种显示面板的蒸镀结构，其包括
    显示面板；
    若干磁铁，分布于所述显示面板的一侧；
    一掩膜板，设于所述显示面板的另一侧；
    若干支撑柱，支撑于所述掩膜板与所述显示面板之间，且每一支撑柱对应于其中一磁铁；以及
    蒸镀源，具有一蒸镀侧，朝向所述掩膜板。
  2. 根据权利要求1所述的显示面板的蒸镀结构，其还包括
    一底板，所述磁铁设于所述底板的一侧，所述显示面板设于所述底板的另一侧；
    所述显示面板包括
    玻璃基板，设于所述底板上；
    薄膜晶体管结构层，设于所述玻璃基板上；
    像素限定层，设于所述薄膜晶体管结构层上，所述像素限定层设有开孔；
    间隔柱，设于所述像素限定层上；
    所述掩膜板设于所述间隔柱上，所述支撑柱与所述间隔柱同层设置。
  3. 根据权利要求2所述的显示面板的蒸镀结构，其中，所述掩膜板具有若干透孔区和非透孔区，每一透孔区对应其中一开孔。
  4. 根据权利要求3所述的显示面板的蒸镀结构，其中，所述透孔区成阵列排布，形成若干所述透孔区的行和列；所述支撑柱也成阵列排布且位于所述非透孔区，形成所述支撑柱的行和列，所述支撑柱的行平行于所述透孔区的行，所述支撑柱的列平行于所述透孔区的列。
  5. 根据权利要求4所述的显示面板的蒸镀结构，其中，在所述支撑柱的行所在方向或列所在方向，所述支撑柱与所述透孔区交错设置。
  6. 根据权利要求4所述的显示面板的蒸镀结构，其中，所述磁铁为长条形，每一行或者每一列的支撑柱对应于一条磁铁。
  7. 根据权利要求3所述的显示面板的蒸镀结构，其中，每一开孔内形成有发光层结构，所述发光层结构为红色发光层结构、绿色发光层结构和蓝色发光层结构中的一种。
  8. 根据权利要求7所述的显示面板的蒸镀结构，其中，每一透孔区对应于每一红色发光层结构，所述非透孔区对应于所述绿色发光层结构和所述蓝色发光层结构；或者每一透孔区对应于每一蓝色发光层结构，所述非透孔区对应于所述绿色发光层结构和所述红色发光层结构；或者每一透孔区对应于每一绿色发光层结构，所述非透孔区对应于所述红色发光层结构和所述蓝色发光层结构。
  9. 根据权利要求8所述的显示面板的蒸镀结构，其中，所述透孔区的形状、尺寸匹配于其所对应的所述开孔的形状、尺寸。
  10. 根据权利要求1所述的显示面板的蒸镀结构，其中，所述支撑柱为棱台形的柱状结构。
PCT/CN2019/072868 2018-12-18 2019-01-23 显示面板的蒸镀结构 WO2020124738A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/472,888 US20200239998A1 (en) 2018-12-18 2019-01-23 Vapor deposition structure of display panel

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201811550408.0A CN109468585A (zh) 2018-12-18 2018-12-18 显示面板的蒸镀结构
CN201811550408.0 2018-12-18

Publications (1)

Publication Number Publication Date
WO2020124738A1 true WO2020124738A1 (zh) 2020-06-25

Family

ID=65676689

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/072868 WO2020124738A1 (zh) 2018-12-18 2019-01-23 显示面板的蒸镀结构

Country Status (3)

Country Link
US (1) US20200239998A1 (zh)
CN (1) CN109468585A (zh)
WO (1) WO2020124738A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11613802B2 (en) * 2020-04-17 2023-03-28 Rockwell Collins, Inc. Additively manufactured shadow masks for material deposition control

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6265324B1 (en) * 1998-05-21 2001-07-24 Rohm Co., Ltd. Method of manufacturing semiconductor device and mask for forming thin film pattern
CN1443026A (zh) * 2002-03-05 2003-09-17 三洋电机株式会社 有机电致发光屏、有机电致发光器件、和掩膜的制造方法
CN103000819A (zh) * 2013-01-04 2013-03-27 四川虹视显示技术有限公司 Oled玻璃基板
CN105102668A (zh) * 2013-03-26 2015-11-25 大日本印刷株式会社 蒸镀掩模、蒸镀掩模准备体、蒸镀掩模的制造方法、及有机半导体元件的制造方法
CN107699852A (zh) * 2017-09-12 2018-02-16 深圳市华星光电半导体显示技术有限公司 掩膜板及其制造方法、蒸镀方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6265324B1 (en) * 1998-05-21 2001-07-24 Rohm Co., Ltd. Method of manufacturing semiconductor device and mask for forming thin film pattern
CN1443026A (zh) * 2002-03-05 2003-09-17 三洋电机株式会社 有机电致发光屏、有机电致发光器件、和掩膜的制造方法
CN103000819A (zh) * 2013-01-04 2013-03-27 四川虹视显示技术有限公司 Oled玻璃基板
CN105102668A (zh) * 2013-03-26 2015-11-25 大日本印刷株式会社 蒸镀掩模、蒸镀掩模准备体、蒸镀掩模的制造方法、及有机半导体元件的制造方法
CN107699852A (zh) * 2017-09-12 2018-02-16 深圳市华星光电半导体显示技术有限公司 掩膜板及其制造方法、蒸镀方法

Also Published As

Publication number Publication date
US20200239998A1 (en) 2020-07-30
CN109468585A (zh) 2019-03-15

Similar Documents

Publication Publication Date Title
US11414739B2 (en) Mask frame assembly and evaporation device
TWI690107B (zh) 掩膜板及掩膜元件
KR100837475B1 (ko) 증착장치 및 유기발광소자의 제조방법
WO2017215286A1 (zh) 掩膜板以及掩膜板的组装方法
CN103484817B (zh) 用于沉积的掩模和用其制造有机发光二极管显示器的方法
US20140147949A1 (en) Mask strips and method for manufacturing organic light emitting diode display using the same
US9238276B2 (en) Method of manufacturing mask assembly for thin film deposition
WO2016060216A1 (ja) 蒸着マスク、蒸着装置、蒸着方法、および蒸着マスクの製造方法
CN109487206B (zh) 掩膜版及采用该掩膜版的掩膜装置
KR20100000129A (ko) 유기 발광 표시장치용 증착 마스크 유닛
WO2020113751A1 (zh) 一种掩膜板
US10131982B2 (en) Mask, motherboard, device and method for manufacturing mask, and system for evaporating display substrate
US20180119268A1 (en) Vapor deposition device and vapor deposition method
KR100853544B1 (ko) 평판 표시장치 박막 증착용 마스크 프레임 조립체 및 이를이용한 증착장비
US20210408181A1 (en) Array substrate and manufacturing method thereof, display device
WO2021047610A1 (zh) 掩膜装置及其制造方法、蒸镀方法、显示装置
WO2021073191A1 (zh) 一种掩膜版
WO2014023041A1 (zh) 有机电致发光二极管有机材料蒸镀用掩模装置
WO2020124738A1 (zh) 显示面板的蒸镀结构
WO2020147164A1 (zh) Oled显示面板
KR101319320B1 (ko) 섀도우 마스크
JP2024505938A (ja) マスクプレート及びマスクアセンブリ
KR100603400B1 (ko) 평판표시장치의 박막 증착용 마스크
KR20080059857A (ko) 쉐도우 마스크 장치 및 이를 이용한 유기 전계발광표시장치의 제조 방법
KR100751355B1 (ko) 증착 장치

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19901298

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19901298

Country of ref document: EP

Kind code of ref document: A1